Electroplating tank and electroplating production line having side walls for guiding plating solution

Abstract

The present invention relates to an electroplating tank and an electroplating production line having a function of guiding a plating solution by a side wall, comprising a bottom plate, and a first side wall and a second side wall disposed on the bottom plate so as to face each other, the first side wall is provided with a first guide area including a first side plate having a first overflow hole formed therein, the second side wall is provided with a second guide area including a second side plate having a second overflow hole formed therein, the second side wall is further provided with a plurality of drain holes communicating with the second guide area and formed with a height lower than the first and second overflow holes, and the bottom plate is provided with a third guide area communicating with the first and second guide areas respectively to guide the plating solution in the first guide area to the second guide area. According to the present invention, the drain holes are formed in the side walls, which makes it easy to inspect and replace the plating solution.

Description

[Technical field]

[0001] The present invention relates to the technical field of water electroplating, and in particular to an electroplating tank and an electroplating production line having a side wall for guiding a plating solution. [Background technology]

[0002] With the development of technology, the demand for surface plating of flexible film substrates becomes greater and greater. In industrial production, aqueous electroplating equipment is usually used to electroplate flexible film substrates, that is, aqueous plating solutions are arranged according to the needs of various bodies and plating layers, and the electroplating of flexible film substrates can be completed in a relatively short time with aqueous plating solutions.

[0003] In the prior art electroplating equipment, a plurality of electroplating tanks are generally installed to supply electroplating solution. The electroplating tank is a device for electroplating the object to be plated, and the purpose of electroplating is achieved by depositing metal on the surface of the object to be plated according to the principle of electroplating. However, in the prior art, in order to ensure the concentration of the plating solution during electroplating, it is necessary to install drainage holes and liquid supply holes. Currently, the drainage holes for the plating solution of the electroplating tank are located at the bottom of the tank. For example, in the patent with patent number CN114164478A and the patent name of horizontal electroplating equipment, the drainage holes for the plating solution of this electroplating equipment are all located at the bottom of the tank, which makes inspection very inconvenient. Summary of the Invention [Problem to be solved by the invention]

[0004] In view of the above-mentioned shortcomings and deficiencies of the prior art, the present invention provides an electroplating tank having a side wall that guides plating solution, which solves the technical problem of the prior art that the drain hole of the electroplating tank is formed at the bottom of the electroplating tank, making inspection inconvenient. [Means for solving the problem]

[0005] To achieve the above objectives, the present invention mainly adopts the following technical solutions: According to one aspect, the present invention provides an electroplating tank having a function of guiding a plating solution by means of side walls, the electroplating tank including a bottom plate, and first and second side walls disposed on the bottom plate so as to face each other, the first side wall is provided with a first guide area including a first side plate having a first overflow hole formed therein, the second side wall is provided with a second guide area including a second side plate having a second overflow hole formed therein, the second side wall is further provided with a plurality of drainage holes communicating with the second guide area and formed with a height lower than that of the first overflow hole and the second overflow hole, and the bottom plate is provided with a third guide area communicating with the first guide area and the second guide area, respectively, to guide the plating solution in the first guide area to the second guide area.

[0006] Optionally, the cover may further include a third side wall and a fourth side wall, the third guide area is located on the third side wall, and the third guide area, the first guide area and the second guide area are installed on the bottom plate to form a U-shape.

[0007] Optionally, the drain hole is adjacent to the fourth side wall.

[0008] Alternatively, the third guide area, the first guide area and the second guide area are disposed on the bottom plate in an "H" shape.

[0009] Optionally, the drain hole is located at either one or both ends of the second side wall remote from the third guide region.

[0010] Optionally, the first overflow hole and the second overflow hole are both elongated holes extending in a horizontal direction and are symmetrically disposed on the first side plate and the second side plate, respectively.

[0011] Optionally, a plurality of liquid delivery holes are formed at both ends of the second side wall.

[0012] Optionally, the bottom plate is provided with one or more liquid delivery conduits located on both sides of the plating area, the liquid delivery conduits communicating with the second guide area and having a plurality of holes formed on their side surfaces.

[0013] Optionally, each of the drain holes is provided with a drain valve, and each of the feed holes is provided with a feed valve.

[0014] According to another aspect, the present invention provides an electroplating production line, comprising a plurality of the above-mentioned electroplating tanks, the plurality of electroplating tanks being connected in series, an anode mechanism being installed in each of the electroplating tanks, and a liquid supply pipe at an inlet end of the electroplating tank located most upstream of the electroplating production line being adjacent to a third guide area. Effect of the Invention

[0015] The present invention can provide the following effects. The present invention provides an electroplating tank having a function of guiding a plating solution by a side wall, in which the plating solution can enter the first guide area 21 through the first overflow hole 212 in the first side plate 211 and can enter the second guide area 31 through the second overflow hole 312 in the second side plate 311, and the plating solution in the first guide area 21 is guided to the second guide area 31 through the third guide area 11 and then discharged through a plurality of drain holes 32 in the second side wall 3. In the embodiment of the present invention, the overflow plating solution in the first guide area 21 is guided to the second guide area 31 through the third guide area 11 and discharged, so that the number of drain holes 32 to be installed is reduced, and the inspection work is reduced. In addition, in the present invention, the drain holes are provided in the side wall, so that the plating solution is discharged from the side, which makes inspection and replacement of the plating solution more convenient than the prior art. [Brief description of the drawings]

[0016] [Figure 1] FIG. 2 is a schematic diagram showing the overall configuration of a first type of electroplating tank in a specific embodiment of the present invention. [Diagram 2]FIG. 2 is a schematic diagram showing the overall configuration of a second type of electroplating tank in a specific embodiment of the present invention. [Diagram 3] 3A and 3B are schematic diagrams showing the configurations of a first side plate and a second side plate in a specific embodiment of the present invention. [Figure 4] FIG. 2 is a schematic diagram showing a configuration in which a drainage valve is installed in a first type of electroplating tank in a specific embodiment of the present invention. [Diagram 5] FIG. 2 is a schematic diagram showing a configuration in which a drain valve is installed in a second type of electroplating tank in a specific embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0017] In order to better understand the above technical solution, the exemplary embodiments of the present invention will be described in more detail below with reference to the drawings. Although the exemplary embodiments of the present invention are illustrated in the drawings, it should be understood that the present invention can be realized in various ways and should not be construed as being limited to the embodiments described herein. Rather, these embodiments are provided to make the present invention more clear and thorough and to fully convey the scope of the present invention to those skilled in the art.

[0018] As shown in FIGS. 1 to 3, a specific embodiment of the present invention provides an electroplating tank having a function of guiding a plating solution by a side wall, and includes a bottom plate 1, a first side wall 2 and a second side wall 3 disposed on the bottom plate 1 so as to face each other. The first side wall 2 is provided with a first guide area 21 including a first side plate 211 having a first overflow hole 212 formed therein. The second side wall 3 is provided with a second guide area 31 including a second side plate 311 having a second overflow hole 312 formed therein. The second side wall 3 is further provided with a plurality of drain holes 32 which are connected to the second guide area 31 and have a height lower than that of the first overflow hole 212 and the second overflow hole 312. The bottom plate 1 is provided with a third guide area 11 which is connected to the first guide area 21 and the second guide area 31, respectively, to guide the plating solution in the first guide area 21 to the second guide area 31.

[0019] Specifically, the plating solution can enter the first guide area 21 through the first overflow hole 212 in the first side plate 211 and can enter the second guide area 31 through the second overflow hole 312 in the second side plate 311. The plating solution in the first guide area 21 is guided to the second guide area 31 through the third guide area 11 and then discharged through a plurality of drain holes 32 in the second side wall 3. In the embodiment of the present invention, the overflow plating solution in the first guide area 21 is guided to the second guide area 31 through the third guide area 11 and discharged, so that the number of drain holes 32 to be installed is reduced and the inspection work is reduced. In addition, since the plating solution is discharged from the side, inspection and replacement of the plating solution are convenient.

[0020] 1, in some embodiments, the electroplating tank further includes a third side wall 4 and a fourth side wall 5. Note that when an electroplating facility includes one electroplating tank, the electroplating tank has the third side wall 4 and the fourth side wall 5, and when the electroplating facility includes multiple electroplating tanks, the multiple electroplating tanks are connected in series, in which the electroplating tank located at the head end of the electroplating facility has the third side wall 4, the electroplating tank at the tail end has the fourth side wall 5, and the electroplating tanks connected in the middle have the first side wall 2 and the second side wall 3.

[0021] Specifically, when the electroplating equipment has one electroplating tank, the third guide area 11 is located on the third side wall 4, and the third guide area 11, the first guide area 21 and the second guide area 31 are installed on the bottom plate 1 to form a U-shape. At this time, the drain hole 32 is adjacent to the fourth side wall 5.

[0022] 2, in some embodiments, when the electroplating equipment has a plurality of electroplating tanks, the electroplating tanks between the electroplating tank at the head end and the electroplating tank at the tail end only have a first side wall and a second side wall, and the third guide area 11, the first guide area 21 and the second guide area 31 are arranged on the bottom plate 1 to form an "E" shape. In this case, the drain hole 32 is located at either one or both ends of the second side wall 3 away from the third guide area 11.

[0023] As shown in Fig. 3, in some embodiments, the first overflow hole 212 and the second overflow hole 312 are both elongated holes extending in the horizontal direction and are symmetrically arranged on the first side plate 211 and the second side plate 311, respectively. During electroplating, the thin film is flush with the first overflow hole 212 and the second overflow hole 312, which makes it convenient to drain the plating solution under the thin film. In the embodiments of the present invention, the first overflow hole 212 and the second overflow hole 312 are symmetrically arranged on the first side plate 211 and the second side plate 311, respectively, so that the balance of the plating solution drained from both the left and right ends in the electroplating tank can be maintained.

[0024] 1 and 2, in some embodiments, a plurality of liquid supply holes 33 are formed at both ends of the second side wall 3. In the embodiments of the present invention, by forming a plurality of liquid supply holes 33 at both ends of the second side wall 3, it is possible to maintain a balance in the drainage of plating solution from both the front and rear ends in the electroplating tank.

[0025] As shown in Figures 4 and 5, in some embodiments, one or more liquid supply pipes 12 are provided on the bottom plate 1, located on both sides of the plating area, and the liquid supply pipes 12 communicate with the second guide area 31, and have a plurality of holes formed on the side surfaces. If the electroplating equipment has one electroplating tank, the liquid supply pipes 12 are provided at the inlet end and the outlet end of the electroplating tank, and the liquid supply pipe 12 located at the inlet end is adjacent to the third guide area 11, thereby making the structure of the electroplating tank compact and reducing the footprint of the electroplating tank. Of course, if the electroplating equipment has multiple electroplating tanks, the liquid supply pipe 12 located at the inlet end of the electroplating tank at the neck end is also adjacent to the third guide area 11.

[0026] In this way, by installing liquid supply pipes 12 on both sides of the plating area in the electroplating tank and gently supplying the liquid through multiple holes installed on the side of the liquid supply pipes 12, not only is it possible to ensure that the plating liquid density is the same in each part of the electroplating tank, but it is also possible to avoid the thin film in the plating liquid becoming unstable due to large liquid supply, which could affect the quality of the plating film.

[0027] 4 and 5, a drain valve 321 is attached to each drain hole 32, and a liquid feed valve 331 is attached to each liquid feed hole 33. In the embodiment of the present invention, the inflow and outflow of the plating solution in the electroplating equipment can be controlled at any time by the drain valve 321 and the liquid feed valve 331.

[0028] According to another aspect, the present invention further provides an electroplating production line, which includes the above-mentioned plurality of electroplating tanks, the plurality of electroplating tanks are connected in series, an anode mechanism is installed in each electroplating tank, and the liquid supply pipe 12 at the inlet end of the electroplating tank located at the most upstream side of the electroplating production line is adjacent to the third guide area 11. According to the electroplating production line provided by this practical embodiment, not only can the liquid be drained from the side, but also the number of drain holes 32 installed is reduced, and the inspection work is reduced, so that the inspection and replacement of the plating solution are convenient. In addition, the electroplating production line of the present application has a compact configuration and a rational design, and occupies a small site area.

[0029] The beneficial effects of the present invention are as follows: In the electroplating tank provided by the present invention, the overflow plating solution in the first guiding area 21 is guided and drained to the second guiding area 31 via the third guiding area 11, so the number of drain holes 32 to be installed is reduced, and inspection work is reduced. In addition, since the plating solution is drained from the side, inspection and replacement of the plating solution are convenient.

[0030] In the electroplating tank provided by the present invention, the first overflow hole 212 and the second overflow hole 312 are symmetrically installed in the first side plate 211 and the second side plate 311, respectively, thereby making it possible to maintain a balance in the drainage of plating solution from both the left and right ends of the electroplating tank.

[0031] The electroplating tank provided by the present invention has multiple liquid delivery holes 33 formed on both ends of the second side wall 3, making it possible to maintain a balance in the delivery of plating solution from both the front and rear ends of the electroplating tank.

[0032] The electroplating tank provided by the present invention has liquid supply lines 12 on both sides of the plating area in the electroplating tank, and liquid is slowly supplied through multiple holes formed on the side of the liquid supply lines 12. This not only ensures that the plating solution density is the same in each part of the electroplating tank, but also prevents the thin film in the plating solution from becoming unstable due to excessive liquid supply, which could affect the quality of the plating film.

[0033] The electroplating tank provided by the present invention allows the inflow and outflow of plating solution in the electroplating equipment to be controlled at any time by the drain valve 321 and the liquid supply valve 331 .

[0034] In the present description, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying a relative importance or number of technical features depicted. Thus, a feature qualified with "first" or "second" can explicitly or implicitly include one or more of said features. In the present description, "plurality" means two or more than two, unless otherwise expressly and specifically qualified.

[0035] In the present invention, unless otherwise expressly specified and limited, the terms "attached", "connected", "connected" and "fixed" should be understood in a broad sense, for example, may be fixedly connected, detachably connected, or integral, may be mechanically connected, may be electrically connected, may be directly or indirectly connected via an intermediate medium, may be internal communication between two elements, or may be an interactive relationship between two elements. Those skilled in the art can understand the specific meaning of the above terms in the present invention according to the specific situation.

[0036] In the present invention, unless otherwise expressly specified and limited, a first feature being "above" or "below" a second feature may mean that the first feature and the second feature are in direct contact with each other, or that the first feature and the second feature are in indirect contact with each other via an intermediate medium. And, a first feature being "above," "above," and "on the upper surface" of a second feature may mean that the first feature is directly above or diagonally above the second feature, or may simply mean that the first feature is higher in horizontal height than the second feature. A first feature being "below," "below," and "on the lower surface" of a second feature may mean that the first feature is directly below or diagonally below the second feature, or may simply mean that the first feature is lower in horizontal height than the second feature.

[0037] In the description of this specification, the terms "one embodiment", "several embodiments", "embodiments", "examples", "specific examples", or "several examples" mean that the specific features, structures, materials, or characteristics described based on the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, general expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. In addition, a person skilled in the art may combine and combine different embodiments or examples described in this specification and features of different embodiments or examples without mutual contradiction.

[0038] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are illustrative and are not limiting of the present invention, and it will be understood that those skilled in the art can change, modify, substitute, and vary the above embodiments within the scope of the present invention. [Explanation of symbols]

[0039] 1, bottom plate 11, 3rd guidance area 12. Liquid delivery pipe 13, Anode mechanism 2. First side wall 21, 1st guidance area 211, 1st side plate 212, first overflow hole 3. Second side wall 31, 2nd guidance area 311, 2nd side plate 312, second overflow hole 32. Drain hole 321, drain valve 33, liquid feeding hole 331 - Liquid delivery valve 4. Third side wall 5. 4th side wall

Claims

1. An electroplating tank having a side wall for guiding a plating solution, The device includes a bottom plate (1), and a first side wall (2) and a second side wall (3) disposed on the bottom plate (1) so as to face each other, The first side wall (2) is provided with a first guide area (21) including a first side plate (211) having a first overflow hole (212) formed therein; The second side wall (3) is provided with a second guide area (31) including a second side plate (311) having a second overflow hole (312) formed therein; The second side wall (3) is further formed with a plurality of drain holes (32) that communicate with the second guide area (31) and have a height lower than the heights of the first overflow hole (212) and the second overflow hole (312), A third guide area (11) is provided on the bottom plate (1) and communicates with the first guide area (21) and the second guide area (31) so as to guide the plating solution in the first guide area (21) to the second guide area (31). Electroplating tank comprising:

2. It further includes a third side wall (4) and a fourth side wall (5), The third guiding area (11) is located on the third side wall (4), The third guide area (11), the first guide area (21) and the second guide area (31) are installed on the bottom plate (1) to form a U-shape.

2. The electroplating tank of claim 1.

3. The drain hole (32) is adjacent to the fourth side wall (5).

3. The electroplating bath of claim 2.

4. The third guide area (11), the first guide area (21) and the second guide area (31) are installed on the bottom plate (1) to form an "E" shape.

2. The electroplating tank of claim 1.

5. The drain hole (32) is located at either one or both ends of the second side wall (3) away from the third guide area (11).

5. The electroplating tank of claim 4.

6. The first overflow hole (212) and the second overflow hole (312) are both elongated holes extending in the horizontal direction, and are symmetrically installed in the first side plate (211) and the second side plate (311), respectively.

2. The electroplating tank of claim 1.

7. A plurality of liquid delivery holes (33) are formed at both ends of the second side wall (3).

2. The electroplating tank of claim 1.

8. The bottom plate (1) is provided with one or more liquid delivery pipes (12) located on both sides of the plating area; The liquid supply pipe (12) communicates with the second guide area (31) and has a plurality of holes formed on its side surface.

8. The electroplating bath of claim 7.

9. A drain valve (321) is attached to each of the drain holes (32), A liquid supply valve (331) is attached to each of the liquid supply holes (33).

8. The electroplating bath of claim 7.

10. 1. An electroplating production line, comprising: A plurality of electroplating baths according to any one of claims 1 to 9, The plurality of electroplating tanks are connected in series, An anode mechanism (13) is installed in each of the electroplating tanks, The inlet end of the electroplating tank located at the most upstream side of the electroplating production line is adjacent to the third guide area. Electroplating production line characterized by:

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