FOUP transfer device

Abstract

Provided is a FOUP transfer device for transferring FOUPs between loading ports and which is capable of reducing remodeling work on a pre-installed conveyance device as much as possible.　FOUP transfer devices 1-1, 1-2 are installed in the vicinity of the loading ports of the conveyance device, comprising one or more loading ports 18-1, 18-2, and transfer FOUPs 3 between the loading ports 18-1, 18-2. The FOUP transfer devices 1-1, 1-2 have first optical I / O communication devices 31-3, 31-4 and are configured such that second optical I / O communication devices 31-1, 31-2 provided for the load ports 18-1, 18-2 are connected thereto, and so as to carry out, in place of the load ports 18-1, 18-2, the optical I / O communication carried out between the load ports 18-1, 18-2 and an OHT cart 11.

Description

[Technical field]

[0001] The present invention relates to a FOUP transfer device that is installed near a load port and transfers FOUPs between the load port and the FOUP transfer device. [Background technology]

[0002] The manufacturing process of semiconductor chips requires many surface treatment and inspection processes. In semiconductor manufacturing plants, many dedicated processing equipment are installed to perform various surface treatments and inspections on the wafer surface. Wafers are transported between each processing equipment in a sealed container called a FOUP (Front-Opening Unified Pod) by an inter-process transport device. Each processing equipment is equipped with a transport device called an EFEM (Equipment Front End Module) at the front, and after receiving a FOUP transported by an inter-process transport device called an OHT (Overhead Hoist Transport) or AGV (Automated Guided Vehicle), the EFEM takes out the wafer from inside the FOUP and transports it to the processing equipment. The EFEM is equipped with one or more opening and closing devices called load ports that place the FOUP and open and close the FOUP lid. After the processing by the processing equipment is completed, the wafer is transported to a FOUP other than the FOUP that contains the unprocessed wafer. After the processing is completed, when the number of wafers transported from the processing equipment reaches a predetermined number, the FOUP lid is closed and the FOUP is transported to the next process by the OHT.

[0003] Generally, there are many different types of processing steps performed by processing equipment and inspection equipment, and the time required to process wafers varies greatly depending on the processing step. Therefore, even if one processing step is completed, it is not always possible to transport the FOUP to the next step immediately. Therefore, semiconductor manufacturing plants temporarily store FOUPs in a stocker and use an inter-process transport device to transport the FOUP to the processing equipment at the appropriate time. A stocker is a device installed in a semiconductor manufacturing plant that stores FOUPs on shelves, of which there are tens or even a hundred or more, and is equipped with shelves that hold each FOUP and a FOUP transport robot that transports the FOUP between the shelves and the inter-process transport device.

[0004] However, the OHTs and AGVs that transport the FOUPs can only travel in one direction on the tracks installed in semiconductor manufacturing plants. As a result, when a processing device finishes processing a wafer, it has to stop processing and wait while waiting for the arrival of the OHT or AGV cart. Processing devices are expensive, and such idle time is a major drawback in terms of production efficiency.

[0005] In order to shorten such non-operating time, Patent Document 1 proposes a method in which a temporary storage device for temporarily storing FOUPs is installed near the EFEM to store multiple FOUPs containing unprocessed wafers, and when the processing process of the processing device is completed, the unprocessed FOUP is immediately replaced with the processed FOUP. However, in order to install a temporary storage device near an EFEM that is already installed and operating in the factory, the processing device must be stopped for a long time, during which time the production capacity of the semiconductor manufacturing factory decreases. Furthermore, since the temporary storage device stores and transports multiple FOUPs, it becomes relatively large and expensive, which leads to an increase in the production cost of semiconductors.

[0006] As another measure, Patent Document 2 discloses a method in which a FOUP transfer port is added to a two-port type transport device equipped with two load ports, and the unprocessed FOUP stored in the FOUP transfer port is transferred onto the stage of the load port from which the FOUP was retrieved, thereby shortening the time it takes to supply a FOUP to the load port. See Fig. 18. The FOUP transfer port has a relatively simple structure and is therefore low-cost, and its footprint can also be made small, making it more cost-effective than the temporary storage device described above. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] Patent No. 4182521 document [Patent Document 2] JP 2014-160882 A Summary of the Invention [Problem to be solved by the invention]

[0008] However, even if a FOUP transfer port is added, it is necessary to modify the load port and upgrade the software that operates the transport device and the software that communicates between the OHT and AGV, and ultimately, the problem that the installation work cannot be completed in a short time has not been solved.The present invention was devised in consideration of the above problems, and has an object to provide a FOUP transfer device that transfers FOUPs between load ports and that can minimize the modification work required for already installed transport devices. [Means for solving the problem]

[0009] In order to achieve the above object, the FOUP transfer device of the present invention is a FOUP transfer device that is installed near a load port of a transport device equipped with one or more load ports and transfers FOUPs to and from the load port, the FOUP transfer device having a first communication device, and further being connected to a second communication device equipped in the load port, and performing communication between the load port and a third communication device equipped in the OHT transport car on behalf of the load port. With the above configuration, the FOUP transfer device can be installed without making major changes to the equipment in a semiconductor manufacturing factory.

[0010] In addition, the FOUP transfer device of the present invention is further equipped with a control PC that communicates with a host computer equipped in the semiconductor manufacturing factory, allowing the FOUP transfer device and the host computer equipped in the semiconductor manufacturing factory to communicate via the control PC, thereby minimizing the need to change the transport equipment already installed in the semiconductor manufacturing factory.

[0011] Furthermore, the FOUP transfer device of the present invention has a communication means for exchanging FOUP transfer signals with the load port, which allows the OHT cart to smoothly supply and retrieve FOUPs to and from the load port, and to smoothly exchange FOUPs between the load port and the FOUP transfer device. It is preferable that the first communication device, the second communication device, and the third communication device are optical I / O communication devices. The use of optical I / O communication devices allows communication to be performed without being affected by noise generated by processing equipment, etc.

[0012] In addition, the FOUP transfer device of the present invention is characterized in that the arrangement of the load ports of the transport device matches the arrangement of the load ports, and the arrangement of the load ports and the FOUP transfer device is located directly below the OHT track. With the above configuration, FOUPs can be supplied to and retrieved from the FOUP transfer device without changing the existing OHT track installed in the semiconductor manufacturing plant.

[0013] The FOUP transfer device of the present invention is also characterized in that it is located at a position that does not coincide with the arrangement of multiple load ports located directly below the OHT track, and is located directly below a second OHT track that is different from the OHT track. With the above configuration, when the FOUP transfer device of the present invention is installed in a semiconductor manufacturing factory where a second OHT track is installed, by locating the FOUP transfer device of the present invention directly below the second OHT track, FOUPs can be supplied to and retrieved from the FOUP transfer device by an OHT track that is different from the OHT track that supplies and retrieves FOUPs between the load ports, so that FOUPs can be supplied and retrieved efficiently.

[0014] The FOUP transfer device of the present invention is characterized by comprising a platform for placing a FOUP in a predetermined position, a holder for holding the FOUP placed on the platform, an arm for moving the holder along a substantially arc-shaped track, and an elevation mechanism for raising and lowering the arm. With the above configuration, the FOUP can be transferred with a simple structure. Effect of the Invention

[0015] According to the FOUP transfer device of the present invention, it can be installed in a short time near an EFEM that has already been installed in a semiconductor manufacturing factory, so that the installation work does not reduce the productivity of the semiconductor manufacturing factory. [Brief description of the drawings]

[0016] [Figure 1] FIG. 1 is a front view showing a FOUP transfer device according to one embodiment of the present invention. [Diagram 2] FIG. 2 is a cross-sectional view showing a FOUP transfer device according to one embodiment of the present invention. [Diagram 3] 3A and 3B are cross-sectional views showing a holding section provided in a FOUP transfer device according to one embodiment of the present invention. [Figure 4] FIG. 4 is a schematic diagram showing a semiconductor manufacturing factory. [Diagram 5] FIG. 5 is a front view showing the FOUP transfer device of this embodiment installed near the EFEM. [Figure 6] FIG. 6 is a top view showing the FOUP transfer device of this embodiment installed near the EFEM. [Figure 7] FIG. 7 is a block diagram showing a communication system provided in a conventional EFEM. [Figure 8] FIG. 8 is a block diagram showing a communication system after the FOUP transfer device of this embodiment is added. [Figure 9] 9A and 9B are diagrams illustrating the operation of the FOUP transfer device of this embodiment. [Figure 10] 10A and 10B are diagrams illustrating the operation of the FOUP transfer device of this embodiment. [Figure 11] 11A and 11B are diagrams illustrating the operation of the FOUP transfer device of this embodiment. [Figure 12] FIG. 12 is a diagram showing a FOUP transfer device according to one embodiment of the present invention. [Figure 13] FIG. 13 is a top view of the FOUP transfer device according to one embodiment of the present invention. [Figure 14] FIG. 14 is a perspective view showing a FOUP transfer device according to one embodiment of the present invention. [Figure 15] FIG. 15 is a front view showing a FOUP transfer device according to one embodiment of the present invention. [Figure 16] FIG. 16 is a top view showing the FOUP transfer device of this embodiment installed near the EFEM. [Figure 17] FIG. 17 is a block diagram showing a communication system after the FOUP transfer device of this embodiment is added. [Figure 18] FIG. 18 is a diagram showing a conventional FOUP transfer device. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0017] Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. FIG. 1 is a front view showing a FOUP transfer device 1 according to one embodiment of the present invention, and FIG. 2 is a cross-sectional view thereof. Also, FIGS. 3A and 3B are cross-sectional views showing a holding unit 6 provided in the FOUP transfer device 1. The FOUP transfer device 1 of this embodiment includes a substantially rectangular parallelepiped housing 2, a mounting table 4 fixed to the upper surface of the housing 2 and on which a FOUP 3 is mounted, and a FOUP transfer mechanism 5. The FOUP transfer mechanism 5 is composed of at least a holding unit 6 that holds a top flange 3a of the FOUP 3, an arm unit 7 that supports the holding unit 6 and moves it in an arc-shaped orbit, an arm drive mechanism 8 that drives the arm unit 7, and a lifting mechanism 9 that lifts and lowers the arm unit 7 and the arm drive mechanism 8. Also, the holding mechanism, the arm drive mechanism 8, and the lifting mechanism 9 provided in the holding unit 6 are provided with drive sources 15 and 17, and the operations of these drive sources 15 and 17 are controlled by a control unit 10 provided in the FOUP transfer device 1. The control unit 10 controls the operation of the drive sources 15, 17 of the FOUP transfer mechanism 5, and also includes a communication means for communicating with the AGV and the transport carriage 11 of the OHT 26 shown in FIG.

[0018] Three FOUP support pins 12 are erected on the top of the placement table 4, and when the FOUP 3 is placed on the support pins 12, three grooves formed at predetermined positions on the bottom surface of the FOUP 3 come into contact with the tops of the corresponding FOUP support pins 12, so that the FOUP 3 is positioned and placed at a predetermined position on the placement table 4. The holding unit 6 includes a pair of left and right FOUP support members 13 that support the top flange 3a of the FOUP 3 from below, and an air cylinder 14 that moves the pair of FOUP support members 13 between a holding position (closed position) and a release position (open position). When compressed air is supplied to the air cylinder 14, the piston rod 14a of the air cylinder 14 protrudes from the main body of the air cylinder 14, and the pair of FOUP support members 13 moves to the holding position (closed position). When the compressed air supplied to the air cylinder 14 is exhausted, the piston rod 14a retracts into the main body of the air cylinder 14, and the pair of support members 13 moves to the release position (open position). Moreover, the upper portion of the holding portion 6 is rotatably connected to the tip of the arm portion 7 .

[0019] The base end of the arm unit 7 is connected via a reducer to the output shaft of a stepping motor 15 provided in the arm drive mechanism 8. With the above configuration, the output shaft of the stepping motor 15 of the arm drive mechanism 8 rotates forward and backward, causing the arm unit 7 to swing about the rotation axis C1. Furthermore, the rotation axis C1 of the arm unit 7 and the rotation axis C2 of the holder 6 are connected by a gear and a belt at a 1:1 rotation ratio, so that even if the arm unit 7 swings, the holder 6 is maintained in a constant position with the FOUP support member 13 facing downward.

[0020] Moreover, the arm unit 7 is fixed onto a lifting platform 16, which is configured to be movable up and down in the vertical direction by a lifting mechanism 9. The lifting mechanism 9 includes the lifting platform 16 that supports the arm unit 7 and the arm drive mechanism 8, a linear actuator 17 that guides a moving element connected to the lifting platform 16 in the vertical direction to move it up and down, and a stepping motor 15 that is the drive source of the linear actuator 17. The output shaft of the stepping motor 15 rotates forward or backward, thereby moving the lifting platform 16 and the arm unit 7 fixed to the lifting platform 16 up and down in the vertical direction. As described above, the FOUP transfer apparatus 1 has the characteristic of being able to place a FOUP 3 in a predetermined position, similar to the load ports 18-1, 18-2 shown in Figures 5 and subsequent figures, but the FOUP transfer apparatus 1 does not have a mechanism for opening and closing the lid of the FOUP 3, which the load ports 18-1, 18-2 have, or a mechanism called a mapper for detecting the placement status of the wafers contained inside the FOUP 3, and is provided with a FOUP transfer mechanism 5 that the load ports 18-1, 18-2 do not have.

[0021] The FOUP transfer device 1 of this embodiment is configured to be easily movable to a predetermined location by casters 19 attached to the four corners of the bottom surface of the housing 2. Adjusters 20 are arranged adjacent to each caster 19, allowing the horizontal inclination of the mounting table 4 to be adjusted. The FOUP transfer device 1 is also provided with a manual switch 21, which an operator can operate to individually execute the swinging operation of the arm drive mechanism 8 and the lifting operation of the lifting mechanism 9. The FOUP transfer device 1 is also provided with an emergency stop switch 22 that stops the operation of the FOUP transfer device 1 in an emergency, and an area sensor 23, allowing the operation of each drive mechanism to be stopped in an emergency.

[0022] Furthermore, the FOUP transfer device 1 of this embodiment may be configured to include an atmosphere replacement unit for replacing the internal atmosphere of the FOUP 3 with an inert gas. The atmosphere replacement unit includes an inert gas supply means (not shown) for supplying an inert gas, an exhaust means (not shown) for exhausting the internal atmosphere of the FOUP 3, a supply nozzle 35 for supplying the inert gas supplied from the inert gas supply means to the internal space of the FOUP 3 through a gas supply port provided on the bottom surface of the FOUP 3, and an exhaust nozzle 36 for exhausting the internal atmosphere of the FOUP 3 through a gas exhaust port provided on the bottom surface of the FOUP 3. See FIG. 13. With the above configuration, the FOUP transfer device 1 can maintain the inside of the FOUP 3 placed therein in an inert gas atmosphere, so that even if the FOUP 3 is waiting for processing for a long time, it is possible to prevent a natural oxide film from being generated on the surface of the wafer W accommodated in the FOUP 3.

[0023] The supply nozzle 35 and the exhaust nozzle 36 are disposed on the upper surface of the mounting table 4 at positions facing the gas supply port and the gas exhaust port of the FOUP 3 supported by the FOUP support pins 12. The supply nozzle 35 and the exhaust nozzle 36 are configured to be able to advance and retreat toward the gas supply port and the gas exhaust port of the FOUP 3 by a reciprocating mechanism (not shown). With the above configuration, the inside of the FOUP 3 placed on the mounting table 4 can be replaced from the air atmosphere to an inert gas atmosphere, and deterioration of the surface of the wafer W accommodated inside the FOUP 3 can be prevented. Also, a configuration may be provided with a fixing member 37 for fixing the FOUP 3 to the mounting table 4. By providing the fixing member 37, it is possible to prevent the FOUP 3 from being displaced due to the operation of the supply nozzle 35 and the exhaust nozzle 36 protruding toward the FOUP 3. Also, the mounting table 4 may be configured to be provided with an RF receiver 38 for receiving a signal of an RF (Radio Frequency) tag provided on the FOUP 3.

[0024] Next, an embodiment in which the FOUP transfer device 1 is installed near the EFEM 25 installed in the semiconductor manufacturing factory F will be described. FIG. 4 is a schematic diagram showing the arrangement of each device in the semiconductor manufacturing factory F. FIG. 5 is a front view showing the EFEM 25 and the FOUP transfer devices 1-1 and 1-2 of this embodiment installed near the EFEM 25, and FIG. 6 is a top view thereof. In the semiconductor manufacturing factory F, a large number of dedicated processing devices for performing various surface treatments and inspections on wafers are arranged, and the wafers are transported between each processing device in a state where they are accommodated in a FOUP 3 by the OHT cart 11 of the OHT 26 to the EFEM 25 equipped in each processing device. In addition, stockers 33 for temporarily storing FOUPs 3 are arranged in various places in the semiconductor manufacturing factory F, and the FOUPs 3 stored in the stockers 33 are transported to the EFEM 25 as appropriate. As shown in FIG. 6, the OHT 26 transports the FOUPs 3 by moving a plurality of OHT carts 11 on a track 26a laid so as to pass directly above each EFEM 25 installed in the semiconductor manufacturing factory F. In many semiconductor manufacturing factories F, only one system of track 26a for OHT 26 is installed, and OHT cart 11 is configured to be able to move on this track in only one direction.

[0025] As shown in Fig. 5, the OHT cart 11 that has moved directly above the stages 24-1 and 24-2 of the predetermined load ports 18-1 and 18-2 lowers the hoist mechanism 11a vertically to hold the top flange 3a of the FOUP 3, then raises the hoist mechanism 11a to store the FOUP 3 in the unmanned OHT cart 11, thereby recovering the FOUP 3. The hoist mechanism 11a holding the FOUP 3 is lowered vertically to place the FOUP 3 on the stages 24-1 and 24-2, releases the holding of the top flange 3a, and then raises the hoist mechanism 11a to supply the FOUP 3. The OHT cart 11 stores in advance the position information of the EFEM 25 and the load ports 18-1 and 18-2 and other devices arranged in the semiconductor manufacturing factory F, and automatically travels to a designated position when it receives a command from a host computer 28, which will be described later. Additionally, on the track 26a, an identification mark such as a barcode is provided directly above each of the load ports 18-1, 18-2, and the OHT cart 11 detects this identification mark to recognize the target position.

[0026] Furthermore, the OHT cart 11 is equipped with an optical I / O communication device 31-0, and when the OHT cart 11 reaches above each load port 18-1, 18-2, it is configured to be able to transmit and receive signals between the OHT cart 11 and the optical I / O communication devices 31-1, 31-2 provided on each load port 18-1, 18-2. Here, the optical I / O communication devices 31-0 to 31-2 and the optical I / O communication devices 31-3 to 31-6 used in each embodiment described below convert electrical signals generated by control means or the like provided in the equipment into optical signals such as infrared rays and transmit and receive them, and it is preferable to use one that complies with SEMI E84, a standard established by SEMI (Semiconductor Equipment and Materials International), an international industry organization for semiconductor manufacturing equipment, materials, etc. In the EFEM 25 of this embodiment, the transceivers of the optical I / O communication devices 31-1, 31-2 connected to each of the load ports 18-1, 18-2 are disposed in the ceiling portion of the EFEM 25, and are disposed in a position where optical I / O communication is possible with the transceiver of the optical I / O communication device 31-0 provided on the OHT cart 11 when the OHT cart 11 moves to a position where the FOUP 3 can be delivered to and from the load ports 18-1, 18-2. Note that the optical I / O communication devices 31-1, 31-2 connected to each of the load ports 18-1, 18-2 may be fixed to a portion other than the ceiling portion of the EFEM 25, for example, may be fixed to the track 26a.

[0027] The EFEM 25 of this embodiment includes two load ports 18-1 and 18-2. The load port 18-1 on the left side in a front view is assigned the identification number of Port1, and the load port 18-2 on the right side is assigned the identification number of Port2. In addition, two FOUP transfer devices 1-1 and 1-2 are additionally installed near the load ports 18-1 and 18-2, respectively, so that the two-port EFEM 25 has a function of placing FOUPs 3 for four ports. In this embodiment, the first FOUP transfer device 1-1 is disposed adjacent to the load port 18-1 (Port1) on the left side in a front view, and the second FOUP transfer device 1-2 is disposed adjacent to the load port 18-2 (Port2) on the right side in a front view. The first FOUP transfer device 1-1 is assigned an identification number of Port3, and the second FOUP transfer device 1-2 is assigned an identification number of Port4. The load ports 18-1, 18-2 of the EFEM 25 are arranged on a track 26a extending in the X direction. The first FOUP transfer device 1-1 and the second FOUP transfer device 1-2 installed near the load ports 18-1, 18-2 are also arranged directly below the track 26a extending in the X direction, similar to the load ports 18-1, 18-2, so as to be able to transfer the FOUP 3 between the OHT cart 11. In other words, the load ports 18-1, 18-2 and the FOUP transfer devices 1-1, 1-2 are arranged side by side in the X direction so as to coincide with the track 26a extending in the X direction. Furthermore, on the track 26a above the FOUP transfer device 1-1 and the second FOUP transfer device 1-2, at the position where the OHT cart 11 transfers the FOUP 3 between the FOUP transfer device 1-1 and the second FOUP transfer device 1-2, an identification mark (not shown) is provided to allow the OHT cart 11 to recognize its position.

[0028] The FOUP transfer mechanism 5-1 provided in the first FOUP transfer device 1-1 of this embodiment includes an arm unit 7-1 having a length dimension capable of transferring the FOUP 3 between the first FOUP transfer device 1-1 (Port 3) and Port 1, and the FOUP transfer mechanism 5-2 provided in the second FOUP transfer device 1-2 includes an arm unit 7-2 having a length dimension capable of transferring the FOUP 3 between the second FOUP transfer device 1-2 (Port 4) and Port 2. The first FOUP transfer device 1-1 and the second FOUP transfer device 1-2 are configured symmetrically to each other when viewed in the drawing. The rotation axis C1 of the FOUP transfer mechanism 5-1 provided in the first FOUP transfer device 1-1 is disposed at the right end of the first FOUP transfer device 1-1, i.e., closer to the load port 18-1, while the rotation axis C1' of the FOUP transfer mechanism 5-2 provided in the second FOUP transfer device 1-2 is disposed at the left end of the second FOUP transfer device 1-2, i.e., closer to the load port 18-2, in the drawing. This allows the first FOUP transfer device 1-1 to transfer the FOUP 3 between Port 1 located to the right, and the second FOUP transfer device 1-2 to transfer the FOUP 3 between Port 2 located to the left.

[0029] Next, the communication between the FOUP transfer device 1 of this embodiment and the OHT 26 will be described. FIG. 7 is a block diagram showing the communication system of the EFEM 25 before the FOUP transfer devices 1-1 and 1-2 of this embodiment are added, and FIG. 8 is a block diagram showing the communication system of the EFEM 25 and each of the FOUP transfer devices 1-1 and 1-2 after the FOUP transfer devices 1-1 and 1-2 of this embodiment are added. The EFEM 25 is equipped with a control device 27, which communicates with the load ports 18-1 and 18-2 that open and close the lid of the FOUP 3, the wafer transport robot that transports the wafer between the FOUP 3 and the processing device, and the wafer aligner that positions the wafer, to grasp the operation status of each mechanism and transmit operation commands to each of these mechanisms according to a pre-stored operation program. The control device 27 also exchanges operation information with the processing device arranged on the back side of the EFEM 25, and further exchanges information about the processing process with a host computer 28 that manages the manufacturing process of the semiconductor manufacturing factory F.

[0030] The host computer 28 includes a communication means for communicating with the communication terminals of the processing devices installed in the semiconductor manufacturing factory F, a storage means for storing the programs and records of communication with each terminal, and an arithmetic unit. The host computer 28 also includes a manufacturing execution system (MES) 29 for managing the manufacturing process of the entire factory, and a material control system (MCS) 30 for controlling the operation of the FOUP3 transport equipment and the stocker 33 in the factory, receiving signals from the MES 29 and issuing transport commands to the FOUP transport equipment such as the OHT 26, and for sending commands to the OHT 26 to supply the FOUP3 to the EFEM 25 and to collect the FOUP3 from the EFEM 25 based on the progress of the EFEM 25. The MES 29 is an integrated production information system that plays a central role in managing various information in the semiconductor manufacturing factory F, and supports and manages production such as process management, lot management, and progress management. Furthermore, the MCS 30 manages the FOUPs 3 containing wafers and the empty FOUPs 3 in accordance with the manufacturing process previously stored in the storage means, and transmits transport commands to the control means provided in the stocker 33 and the OHT 26. Position information and the like of each of the load ports 18-1, 18-2 in the semiconductor manufacturing factory F is registered in the MCS 30 by an operator in advance, and the MCS 30 issues a transport command to the OHT 26 for the FOUP 3 based on this information. Furthermore, information about FOUP transfer devices 1-1, 1-2 to be newly installed in the semiconductor manufacturing factory F is also registered in the MCS 30 by the operator at the time of installation.

[0031] When a FOUP transport command is received from the MCS 30, the stocker 33 delivers a FOUP 3 containing work-in-progress or an empty FOUP 3 to a specified OHT cart 11 of the OHT 26. When the OHT cart 11 moves to directly above the specified load port 18-1, 18-2, it checks with the load port 18-1, 18-2 whether the FOUP 3 can be placed thereon, and places the FOUP 3 when it receives a placement-ready signal from the load port 18-1, 18-2. The OHT cart 11 also moves to directly above the specified load port 18-1, 18-2 in an empty state, not holding a FOUP 3, communicates with the load port 18-1, 18-2, and then retrieves the FOUP 3 placed on the stage 24-1, 24-2 of the load port 18-1, 18-2 and transports it to the stocker 33. In addition, the optical I / O communication device 31-0 provided on the FOUP transfer devices 1-1, 1-2, the load port 18, and the OHT cart 11 in this embodiment is a communication device that complies with the SEMI standard, which is a specification established by SEMI (Semiconductor Equipment and Materials International), an international industry organization for semiconductor manufacturing equipment, and transmits and receives necessary data between them using infrared rays.

[0032] Next, the communication form between the FOUP transfer devices 1-1, 1-2 and the load port 18 of this embodiment will be described. The FOUP transfer devices 1-1, 1-2 of this embodiment are installed near the load ports 18-1, 18-2 of the EFEM 25 already installed in the semiconductor manufacturing factory F. As described above, the load ports 18-1, 18-2 of the EFEM 25 are equipped with optical I / O communication devices 31-1, 31-2, respectively, and each transmitting / receiving unit is fixed to the ceiling part of the EFEM 25 so that the OHT cart 11 of the OHT 26 is located directly above each of the FOUP transfer devices 1-1, 1-2. In addition, each of the FOUP transfer devices 1-1, 1-2 also includes optical I / O communication devices 31-3, 31-4, respectively, and each transmitting / receiving unit is fixed to the ceiling part of the EFEM 25 so that the OHT cart 11 of the OHT 26 is located directly above each of the FOUP transfer devices 1-1, 1-2. As a result, the already installed load ports 18-1, 18-2 and the newly added FOUP transfer devices 1-1, 1-2 are each configured to include optical I / O communication devices 31-1 to 31-4 that individually communicate with the OHT cart 11. However, if each of the load ports 18-1, 18-2 and each of the FOUP transfer devices 1-1, 1-2 were configured to individually communicate with the OHT cart 11, it would be necessary to temporarily turn off the power to the EFEM 25 itself in order to change the program of the control device 27 provided in the EFEM 25 or to change the communication settings, and it would take a lot of time to modify each device in order to add and install the FOUP transfer devices 1-1, 1-2.

[0033] Therefore, the FOUP transfer devices 1-1, 1-2 of this embodiment are configured to not only perform optical I / O communication with the OHT cart 11, but also perform optical I / O communication between the adjacent load ports 18-1, 18-2 and the OHT cart 11 on behalf of the load ports 18-1, 18-2. Specifically, the FOUP transfer device 1-1 (Port 3) installed to the left of the first port, load port 18-1, not only performs optical I / O communication with the OHT cart 11 as the third port, but also performs optical I / O communication with the OHT cart 11 as the first port on behalf of the load port 18-1. In addition, the FOUP transfer device 1-2 (Port 4), installed to the right of the second port, load port 18-2, not only performs optical I / O communication with the OHT cart 11 as the fourth port, but also performs optical I / O communication with the OHT cart 11 as the second port on behalf of the load port 18-2 (Port 2).

[0034] Furthermore, the FOUP transfer devices 1-1 and 1-2 are provided with a control PC 32 that communicates with the MCS 30 provided in the semiconductor manufacturing factory F, and this control PC 32 exchanges operation information of the two FOUP transfer devices 1-1 and 1-2 and the load ports 18-1 and 18-2, and operation information of the OHT 26, with the MCS 30. In this embodiment, the communication between the control PC 32 and the MCS 30 is performed over Ethernet (registered trademark). With the above configuration, it is possible to incorporate the FOUP transfer devices 1-1 and 1-2 into the network system of the semiconductor manufacturing factory F without making any significant changes to the control means provided in the EFEM 25 or the load ports 18-1 and 18-2. Since the control PC 32 is a relatively small box-shaped device, it may be stored in the internal space of the housing 2 of the FOUP transfer devices 1-1 and 1-2, or in the internal space of the EFEM 25.

[0035] The control units 10-1 and 10-2 of the FOUP transfer devices 1-1 and 1-2 of this embodiment include at least a CPU, a communication means for communicating with other devices, and a storage means for storing operation programs and various data. The communication means of the control units 10-1 and 10-2 include an LP communication means for communicating with the adjacent load ports 18-1 and 18-2, an optical I / O communication means for communicating with the OHT dolly 11 via the optical I / O communication devices 31-3 and 31-4, and a PC communication means for communicating with a control PC 32 that controls the FOUP transfer devices 1-1 and 1-2. The optical I / O communication means of the control units 10-1 and 10-2 of this embodiment are connected to the first optical I / O communication devices 31-3 and 31-4 of the FOUP transfer devices 1-1 and 1-2, as well as the second optical I / O communication devices 31-1 and 31-2 of the load ports 18-1 and 18-2. As a result, the control units 10-1, 10-2 can communicate with the OHT cart 11 via the first optical I / O communication devices 31-3, 31-4 provided on the FOUP transfer devices 1-1, 1-2, and can also communicate with the OHT cart 11 on behalf of the respective load ports 18-1, 18-2 via the second optical I / O communication devices 31-1, 31-2 that were originally provided on the load ports 18-1, 18-2.

[0036] Furthermore, for signals received via the first optical I / O communication devices 31-3, 31-4, the control units 10-1, 10-2 transmit signals corresponding to these signals, and for signals received via the second optical I / O communication devices 31-1, 31-2 originally equipped in the load ports 18-1, 18-2, the control units 10-1, 10-2 transmit signals appropriate to the states of the load ports 18-1, 18-2 acquired via LP communication means (not shown) to the OHT cart 11 via the second optical I / O communication devices 31-1, 31-2. Note that the LP communication means not only allows the FOUP transfer devices 1-1, 1-2 to recognize the states of the load ports 18-1, 18-2 as described above, but is also used to notify the load ports 18-1, 18-2 of the start of operation when the FOUP transfer devices 1-1, 1-2 transfer a FOUP 3 between the load ports 18-1, 18-2.

[0037] The control PC 32 communicates between the control units 10-1, 10-2 of the FOUP transfer devices 1-1, 1-2 and the MCS 30. The control PC 32 not only controls the two FOUP transfer devices 1-1, 1-2 of this embodiment, but can also centrally control a plurality of other FOUP transfer devices 1 within the limitations of the number of communication ports. Communication between the control PC 32 and the MCS 30 is performed over Ethernet (registered trademark), and signals transmitted from the MCS 30 are transmitted to each of the FOUP transfer devices 1-1, 1-2, and signals transmitted from each of the FOUP transfer devices 1-1, 1-2 are transmitted to the MCS 30.

[0038] It should be noted here that, while the EFEM 25 transmits device statuses to the MES 29 that manages the entire process of the semiconductor manufacturing factory F and receives control signals from the MES 29, the FOUP transfer devices 1-1 and 1-2 of this embodiment communicate with the MCS 30 via the control PC 32. The MCS 30 is connected to the transport equipment installed in the semiconductor manufacturing factory F and plays a role in controlling transport commands to each transport equipment. In addition, the MCS 30 moves the FOUP 3 stored in the stocker 33 to the FOUP transfer devices 1-1 and 1-2 at a stage before the timing when it is needed, and sends a command to transfer the FOUP 3 from the FOUP transfer devices 1-1 and 1-2 to the load ports 18-1 and 18-2 immediately when it is needed, thereby shortening the waiting time for the FOUP 3 at the load ports 18-1 and 18-2.

[0039] Next, the operation of the FOUP transfer devices 1-1 and 1-2 and the OHT cart 11 of this embodiment will be described in detail. Figures 9A and 9B, 10A and 10B, and 11A and 11B are diagrams showing the operation of transferring the FOUP 3 between the FOUP transfer device 1-1 and the load port 18-1 of the EFEM 25 having the FOUP transfer device 1-1 of this embodiment shown in Figure 5. A first FOUP 3-1 containing a wafer to be processed by a processing device is placed on the load port 18-1 (Port 1). This first FOUP 3-1 was waiting on the placement table 4-1 of the FOUP transfer device 1-1 until just before, and was transferred to the stage 24-1 of the load port 18-1 by the arm unit 7-1 of the FOUP transfer device 1-1. The cover of the first FOUP 3-1 is opened by the load port 18-1, and the unprocessed wafers in the first FOUP 3-1 are transported to the processing device one by one. The wafer that has been subjected to a predetermined process by the processing device is then transferred to a FOUP 3 that contains processed wafers placed on the load port 18-2.

[0040] At this time, the host computer 28 sends a signal to the FOUP transfer device 1-1 via the control PC 32, requesting the FOUP transfer device 1-1 to inform it of the device's status. Having received the signal from the host computer 28, the FOUP transfer device 1-1 sends a signal to the host computer 28 via the control PC 32 indicating that a new FOUP 3 can be placed on the placement table 4-1. Here, the arm unit 7-1 of the FOUP transfer device 1-1 waits in a position that does not interfere with the lifting and lowering operation of the hoist mechanism 11a provided on the OHT cart 11 and the operation of the load port 18-1.

[0041] The host computer 28, which has received the signal from the FOUP transfer device 1-1, operates the stocker 33 and the OHT carriage 11 of the OHT 26 to move the second FOUP 3-2, which contains unprocessed wafers, to a predetermined position directly above the FOUP transfer device 1-1 (Port 3). See FIG. 9A. The OHT carriage 11, which has transported the second FOUP 3-2 to the predetermined position, transmits a signal to the first optical I / O communication device 31-3 of the FOUP transfer device 1-1 via the optical I / O communication device 31-0 to request placement of the second FOUP 3-2 before lowering the second FOUP 3-2. The FOUP transfer device 1-1, which has received this signal, transmits an acknowledgement (ACK) signal if the FOUP can be placed, and transmits a non-acknowledgement (NACK) signal to the OHT carriage 11 via the first optical I / O communication device 31-3 if the FOUP cannot be placed. When the OHT cart 11 receives an acknowledgement (ACK) signal from the FOUP transfer device 1-1, it activates the hoist mechanism 11a to place the second FOUP 3-2 on the placement table 4-1 of the FOUP transfer device 1-1. See Fig. 9B. The second FOUP 3-2, like the first FOUP 3-1, contains wafers that have not yet been processed by a processing device, and waits on the placement table 4-1 until the first FOUP 3-1 is removed from the stage 24-1 of the load port 18-1.

[0042] Then, when all the wafers contained in the first FOUP 3-1 have been transported to the processing device, the host computer 28 moves the OHT cart 11 to a predetermined position directly above the load port 18-1 (Port 1) in order to collect the now emptied first FOUP 3-1 placed on the load port 18-1. The OHT cart 11 then transmits a signal to the load port 18-1 via the optical I / O communication device 31-0, requesting the collection of the first FOUP 3-1. Here, the second optical I / O communication device 31-1 equipped to the load port 18-1 has been changed to be connected to the control unit 10-1 in the FOUP transfer device 1-1 when the FOUP transfer device 1-1 is installed, so that a signal transmitted from the optical I / O communication device 31-0 of the OHT cart 11 moving directly above the load port 18-1 (Port 1) to the second optical I / O communication device 31-1 of the load port 18-1 (Port 1) is received by the FOUP transfer device 1-1 (Port 3) on behalf of the load port 18-1 (Port 1). See Figure 10A.

[0043] The FOUP transfer device 1-1 (Port 3), which receives a signal from the OHT cart 11, communicates with the load port 18-1 (Port 1) and then transmits an acknowledgement (ACK) signal or a non-acknowledgement (NACK) signal to the OHT cart 11 via the second optical I / O communication device 31-1.

[0044] The load ports 18-1 and 18-2 are equipped with presence detection sensors that detect whether or not the FOUPs 3-1 and 3-2 are placed on the stages 24-1 and 24-2 and whether or not they are placed normally. The load port 18-1 recognizes from the detection result of the presence detection sensor that nothing is placed on the stage 24-1 and transmits a signal to the FOUP transfer device 1-1 that there is no load on the stage 24-1. After receiving the signal from the load port 18-1, the FOUP transfer device 1-1 operates the arm unit 7-1 to transfer the second FOUP 3-2 placed on the placement table 4-1 to the stage 24-1 of the adjacent load port 18-1. See FIG. 10B. Each FOUP transfer device 1-1 transmits a signal similar to the signal transmitted to the OHT cart 11 to the host computer 28 via the control PC 32 as necessary. Upon receiving the retrieval permission signal, the OHT cart 11 activates the hoist mechanism 11a and the FOUP holding mechanism to retrieve the first FOUP 3-1 placed on the load port 18-1. The OHT cart 11 then transports the first FOUP 3-1 to the destination specified by the host computer 28.

[0045] The load port 18-1 (Port1) on which the second FOUP 3-2 is placed by the FOUP transfer device 1-1 fixes the second FOUP 3-2 to the stage 24-1 by a fixing means, and then performs an operation of opening the lid of the second FOUP 3-2. Then, the unprocessed wafers in the second FOUP 3-2 are sequentially transported to the processing device, and the wafers that have been subjected to a predetermined processing by the processing device are transported to the FOUP 3 that contains the processed wafers placed on the load port 18-2. When the load port 18-1 finishes the operation of opening the lid of the second FOUP 3-2, it transmits a wafer unloading enable signal to the control device 27 of the EFEM 25. In addition, the EFEM 25 that receives the wafer transport enable signal from the load port 18-1 operates the transport robot to transmit a command to take out the wafer from the second FOUP 3-2 in the load port 18-1 and transport it to the processing device, thereby resuming the wafer processing operation. In addition, it transmits a command to transport the processed wafer from the processing device to the FOUP 3 set on the load port 18-2. Since the control device 27 of the EFEM 25 and the load port 18-1 are originally electrically connected, there is no need to add wiring or the like when installing the FOUP transfer devices 1-1 and 1-2.

[0046] Next, the FOUP transfer device 1-1, which has transferred the second FOUP 3-2 to the adjacent load port 18-1, transmits a transfer completion signal to the control PC 32. The control PC 32, which has received the signal, transmits a signal to the host computer 28 that the FOUP transfer device 1-1 is ready to place the next FOUP 3. The host computer 28, which has received the ready-to-place signal, transmits a FOUP transport signal to the FOUP transfer device 1-1 to the stocker 33 and the OHT 26 shown in FIG. 4. The stocker 33 and the OHT 26, which have received the transport signal from the host computer 28, take out the third FOUP 3-3, which contains unprocessed wafers, from the shelf of the stocker 33, and move it to a predetermined position directly above the FOUP transfer device 1-1 by the OHT carriage 11. The arm unit 7-1 of the FOUP transfer device 1-1 waits in a position that does not interfere with the lifting and lowering operation of the hoist mechanism 11a provided in the OHT carriage 11 and the operation of the load port 18-1. See Figure 11A.

[0047] The OHT cart 11, which has transported the third FOUP 3-3 to a predetermined position, transmits a signal to the first optical I / O communication device 31-3 of the FOUP transfer device 1-1 via the optical I / O communication device 31-0 to request placement of the third FOUP 3-3 before lowering the third FOUP 3-3. The FOUP transfer device 1-1, which has received this signal, transmits an acknowledgement (ACK) signal if the FOUP can be placed, and transmits a no acknowledgement (NACK) signal to the OHT cart 11 via the first optical I / O communication device 31-3 if the FOUP cannot be placed. When the OHT cart 11 receives the acknowledgement (ACK) signal from the FOUP transfer device 1-1, it operates the hoist mechanism 11a to place the third FOUP 3-3 on the placement table 4-1 of the FOUP transfer device 1-1. See FIG. 11B. The third FOUP 3-3, like the first FOUP 3-1 and the second FOUP 3-2, contains wafers that have not yet been processed by a processing device, and waits on the mounting table 4-1 until the second FOUP 3-2 is removed from the stage 24-1 of the load port 18-1.

[0048] This completes the series of FOUP transfer operations performed by the FOUP transfer device 1-1. Note that the FOUP transfer device 1-2 (Port 4) installed near the load port 18-2 (Port 2) also performs basically the same operations as the FOUP transfer device 1-1. The FOUP transfer device 1-2 (Port 4) performs optical I / O communication with the OHT cart 11 via the first optical I / O communication device 31-4 and the second I / O communication device 31-2, and supplies and retrieves FOUPs 3 to and from the load port 18-2 (Port 2).

[0049] As described above, by using the FOUP transfer device 1-1 of this embodiment, the FOUP transfer device 1-1 (Port3) can immediately supply the second FOUP 3-2 to the load port 18-1 (Port1) after the first FOUP 3-1 placed on the load port 18-1 (Port1) is retrieved by the OHT cart 11. This allows the EFEM 25 to minimize the time during which the wafer supply operation is stopped. In addition, by using the FOUP transfer devices 1-1 and 1-2 of this embodiment, it has become possible to perform an efficient FOUP 3 transfer operation by simply modifying an existing transport device.

[0050] Next, another embodiment of the present invention will be described. The FOUP transfer devices 1-1 and 1-2 according to the first embodiment of the present invention are arranged in a row of load ports 18-1 and 18-2 arranged in a row in the X direction directly below one OHT track 26a, but the FOUP transfer devices 34-1 and 34-2 according to the second embodiment are arranged so as to be shifted in the Y direction from the row of load ports 18-1 and 18-2 arranged in a row and parallel to the X direction. In the semiconductor manufacturing factory F, in addition to the track 26a of the OHT 26, a second track 26b extending parallel to the track 26a may be provided in order to quickly transport the FOUP 3, and the FOUP transfer devices 34-1 and 34-2 according to the second embodiment of the present invention are arranged in a position directly below the second track 26b.

[0051] 12 is a diagram showing the positional relationship between the FOUP transfer devices 34-1 and 34-2 and the load ports 18-1 and 18-2 of this embodiment. In addition to the first track 26a, the semiconductor manufacturing factory F in which the FOUP transfer devices 34-1 and 34-2 of this embodiment are installed has a second track 26b that is spaced apart from the first track 26a in the Y direction and extends parallel to the first track 26a. The FOUP transfer device 34-1 of this embodiment is disposed at a position spaced apart from the load port 18-1 in the Y direction and directly below the second track 26b. The FOUP transfer device 34-2 of this embodiment is disposed at a position spaced apart from the load port 18-2 in the Y direction and directly below the second track 26b. Further, the arm section 7-3 of the FOUP transfer device 34-1 has a length enabling the FOUP 3 to be transferred between the load port 18-1, and the arm section 7-4 of the FOUP transfer device 34-2 has a length enabling the FOUP 3 to be transferred between the load port 18-2. Furthermore, the rotation axis C3 of the arm section 7-3 and the rotation axis C3' of the arm section 7-4 are disposed at the front ends of the FOUP transfer devices 34-1 and 34-2, i.e., closer to the load ports 18-1 and 18-2, as viewed in the drawing. This allows the FOUP transfer device 34-1 to transfer the FOUP 3 between the load port 18-1 (Port1) located in front, and the FOUP transfer device 34-2 to transfer the FOUP 3 between the load port 18-2 (Port2) located in front.

[0052] In addition, the first optical I / O communication device provided in the FOUP transfer devices 34-1 and 34-2 of this embodiment is a second track (not shown). 26b Attached to the second track 26bWhen the OHT cart 11-1 moving on the load port 18-1 moves directly above the FOUP transfer devices 34-1, 34-2, communication between the FOUP transfer devices 34-1, 34-2 can be established. The connections of other electrical components are similar to those in the first embodiment, and the FOUP transfer device 34-1 performs communication between the second optical I / O communication device 31-1 provided on the load port 18-1 and the optical I / O communication device 31-0 provided on the OHT cart 11, and the FOUP transfer device 34-2 performs communication between the second optical I / O communication device 31-2 provided on the load port 18-2 and the optical I / O communication device 31-0 provided on the OHT cart 11. With the above-mentioned configuration, the FOUP transfer devices 34-1, 34-2 can exchange FOUPs 3 with the load ports 18-1, 18-2 in the same manner as the FOUP transfer devices 1-1, 1-2 in the first embodiment.

[0053] In the above-mentioned first and second embodiments of the present invention, the FOUP transfer apparatuses 1-1, 1-2, 34-1, and 34-2 each having one placement table 4 on which the FOUP 3 is placed have been described, but the present invention is not limited thereto, and it is also possible to provide a plurality of placement tables 4 on which the FOUP 3 is placed. FIG. 14 is a perspective view showing a FOUP transfer apparatus 39 according to a third embodiment of the present invention, and FIG. 15 is a front view thereof. Also, FIG. 16 is a view of the FOUP transfer apparatus 39 as seen from above. The FOUP transfer apparatus 39 of this embodiment includes a frame 40 assembled in a rectangular parallelepiped shape, a vertical plate 41 fixed to the frame 40, a plurality of placement tables 4-3 to 4-8 fixed to the vertical plate 41 at intervals in the vertical direction (Z direction), and a FOUP transfer mechanism 42 for transferring the FOUP 3 between each of the placement tables 4-3 to 4-8 and each of the load ports 18-1 and 18-2.

[0054] The FOUP transfer device 39 is installed in front of the EFEM 25, and six mounting tables 4-3 to 4-8 for mounting the FOUP 3 are arranged on a vertical plate 41. The mounting tables 4-3 to 4-8 are arranged in three tiers in the vertical direction at intervals greater than the height of the FOUP 3, and are arranged on both the left and right sides of the EFEM 25. The mounting tables 4-3 to 4-8 stacked in three tiers each constitute one storage unit S1, S2. The mounting tables 4-7, 4-8 arranged at the bottom of the storage units S1, S2 are preferably arranged at approximately the same height as the stages 24-1, 24-2 of the load ports 18-1, 18-2, or at a position slightly higher than the stages 24-1, 24-2.

[0055] The FOUP transfer mechanism 42 included in the FOUP transfer device 39 is composed of a holding unit 6 that holds the top flange 3a of the FOUP 3, a horizontal drive mechanism 43 that supports the holding unit 6 and moves it in the horizontal direction (X direction), and a pair of left and right vertical drive mechanisms 44 that support the horizontal drive mechanism 43 and move it in the vertical direction (Z direction). The horizontal drive mechanism 43 and the vertical drive mechanism 44 each have a motor as a drive source, and the holding unit 6 is moved to a predetermined position by rotating this motor forward or backward. The operation of each motor included in the horizontal drive mechanism 43 and the vertical drive mechanism 44 and the holding unit 6 is controlled by a control unit 10-3 included in the FOUP transfer mechanism 42.

[0056] The storage units S1 and S2 of the FOUP transfer mechanism 42 are adjacent to the stages 24-1 and 24-2, respectively, in a top view, and are disposed directly below the track 26a of the OHT 26 that is laid directly above the stages 24-1 and 24-2. See FIG. 16. By being disposed directly below the track 26a of the OHT 26, the FOUP 3 can be transferred between the OHT cart 11 and the placement tables 4-3 and 4-4 that are disposed at the top of the storage units S1 and S2 disposed on the left and right. In addition, the storage units S1 and S2 do not protrude into the space directly above the load ports 18-1 and 18-2, and therefore do not impede the transfer of the FOUP 3 between the load ports 18-1 and 18-2 and the OHT cart 11.

[0057] By installing the FOUP transfer device 39 of this embodiment above the load ports 18-1 and 18-2, the optical I / O communication devices 31-1 and 31-2 connected to the load ports 18-1 and 18-2, respectively, are fixed at predetermined positions on a frame 40 of the FOUP transfer device 39. When the OHT cart 11 transfers the FOUP 3 to and from the stage 24-1, it communicates via the optical I / O communication device 31-1, and when the OHT cart 11 transfers the FOUP 3 to and from the stage 24-2, it communicates via the optical I / O communication device 31-2. In addition, the frame 40 of the FOUP transfer device 39 has fixed at predetermined positions an optical I / O communication device 31-5 used when the OHT cart 11 transfers the FOUP 3 to and from the placement table 4-3, and an optical I / O communication device 31-6 used when the OHT cart 11 transfers the FOUP 3 to and from the placement table 4-4. In addition, these optical I / O communication devices 31-1, 31-2, 31-5, and 31-6 are connected to a control unit 10-3 provided in the FOUP transfer device 39 of this embodiment, and when exchanging a FOUP 3, this control unit 10-3 performs optical I / O communication with the OHT cart 11.

[0058] Each of the storage units S1, S2 has three mounting tables 4-3 to 4-8 arranged at intervals in the vertical direction, and the OHT cart 11 transfers FOUPs 3 between the mounting tables 4-3, 4-4 arranged on the topmost stage of each of the storage units S1, S2. The FOUPs 3 placed on the topmost mounting tables 4-3, 4-4 are transferred to a predetermined stage 24-1, 24-2 by a FOUP transfer mechanism 42 provided in a FOUP transfer device 39, or are transferred to another mounting table 4-5 to 4-8 in the storage units S1, S2. When all the processing of the wafers W is completed, the FOUP 3 accommodating the processed wafers W is transferred from the stages 24-1, 24-2 to the mounting tables 4-3 to 4-8 of the storage units S1, S2, and a new FOUP 3 accommodating an unprocessed wafer W is transferred from the mounting tables 4-3 to 4-8 to the stages 24-1, 24-2 where no FOUP 3 is placed. Each of the mounting tables 4-3 to 4-8 of the storage units S1, S2 is provided with a presence detection sensor that detects whether or not a FOUP 3 is placed and whether or not the FOUP 3 is placed normally, similar to the stages 24-1, 24-2, and the presence detection sensor of each mounting table is electrically connected to the control unit 10-3.

[0059] In the FOUP transfer device 39 of this embodiment, the placement location of the FOUP 3 can be changed as appropriate, for example, the topmost placement tables 4-3 and 4-4 are used to transfer the FOUP 3 to and from the OHT cart 11, and the remaining placement tables 4-5 to 4-8 are used to temporarily store the FOUP 3. This allows the FOUP 3 to be supplied to and removed from the load ports 18-1 and 18-2 without waiting time, even if the arrival timing of the OHT cart 11 is delayed.

[0060] The FOUP transfer device 39 of this embodiment is equipped with a control unit 10-3, which controls the supply and removal of the FOUP 3 to and from the stages 24-1, 24-2, and each of the mounting tables 4-5 to 4-8. 3In addition, in the same manner as in the first and second embodiments, the controller 11 controls the transfer of FOUPs between the load ports 24-1 and 24-2 on behalf of the load ports 18-1 and 18-2 and the OHT cart 11. 3 See Fig. 17. With the above configuration, it is possible to improve the productivity of the entire wafer processing apparatus while minimizing modification work to the already installed EFEM 25.

[0061] When the FOUP 3 carried by the OHT cart 11 is to be placed on the load port 18-1 (Port 1) of the EFEM 25, the OHT cart 11 moves to directly above the stage 24-1 of the load port 18-1, and before lowering the FOUP 3, transmits a signal to the optical I / O communication device 31-1 via the optical I / O communication device 31-0 to request the placement of a second FOUP 3-2. The FOUP transfer device 39 that receives this signal communicates with the load port 18-1, and transmits an acknowledgement (ACK) signal if the load port 18-1 is in a state where a FOUP can be placed, and transmits a no acknowledgement (NACK) signal to the OHT cart 11 via the first optical I / O communication device 31-1 if the load port 18-1 is in a state where a FOUP cannot be placed. When the OHT cart 11 receives the acknowledgement (ACK) signal from the FOUP transfer device 39, it operates the hoist mechanism 11a to place the FOUP 3 on the stage 24-1 of the load port 18-1. The above-mentioned communication operation of the FOUP transfer device 39 is performed similarly for the load port 18-2 (Port 2), and the OHT cart 11 and the control unit 10-3 communicate regarding the exchange of the FOUP 3 via the optical I / O communication device 31-2 corresponding to the load port 18-2. The above-mentioned communication operation is performed not only when the FOUP 3 is placed from the OHT cart 11 onto the load ports 18-1 and 18-2, but also when the FOUP 3 placed on the load ports 18-1 and 18-2 is transferred to the OHT cart 11.

[0062] Next, an operation will be described when the FOUP 3 carried by the OHT cart 11 is placed on each of the placement tables 4-3 to 4-8 of the FOUP transfer device 39. When the FOUP 3 is exchanged between the OHT cart 11 and the FOUP transfer device 39, the placement tables 4-3 and 4-4 arranged on the top of the storage units S1 and S2 arranged on the left and right are used among the multiple placement tables 4-3 to 4-8 equipped in the FOUP transfer device 39. When the FOUP 3 carried by the OHT cart 11 is placed on the top placement table 4-3 (Port 5) of the storage unit S1 equipped in the FOUP transfer device 39, the OHT cart 11 moves to directly above the placement table 4-3, and before lowering the FOUP 3, transmits a signal to the optical I / O communication device 31-5 via the optical I / O communication device 31-0 to request placement of the FOUP 3. The FOUP transfer device 39, which has received this signal, checks the signal of the FOUP 3 presence / absence sensor provided on the placement table 4-3, and if the placement table 4-3 is in a state where the FOUP can be placed, transmits an acknowledgement (ACK) signal, and if the placement is not possible, transmits a no acknowledgement (NACK) signal to the OHT cart 11 via the optical I / O communication device 31-5. When the OHT cart 11 receives the acknowledgement (ACK) signal from the FOUP transfer device 39, it operates the hoist mechanism 11a to place the FOUP 3 on the placement table 4-3.

[0063] When the control unit 10-3 detects that the FOUP 3 has been placed on the placement table 4-3, it operates the FOUP transfer mechanism 42, the horizontal drive mechanism 43, and the vertical drive mechanism 44 to transfer the FOUP 3 to another placement table 4-4 to 4-6, or leaves the FOUP 3 placed on the placement table 4-3 as it is. Then, when the FOUP 3 is ready to be transferred to the load ports 18-1 and 18-2, it transfers the FOUP 3 to the stage 24-1 or stage 24-2 of the load port 18-1 or the load port 18-2. The above-mentioned communication operation of the FOUP transfer device 39 is also performed for the placement table 4-4 (Port 8) located at the top of the storage unit S2, and the OHT cart 11 and the control unit 10-3 communicate with each other regarding the exchange of the FOUP 3 via the optical I / O communication device 31-6 corresponding to the placement table 4-4. The above communication operation is performed not only when the FOUP 3 is placed from the OHT cart 11 onto the placement tables 4-3, 4-4, but also when the FOUP 3 placed on the placement tables 4-3, 4-4 is transferred to the OHT cart 11.

[0064] Although the present invention has been described in detail above with reference to each embodiment, the present invention is not limited to these embodiments, and various modifications are possible within the scope of the present invention. For example, the communication devices provided in the OHT dolly 11 and the FOUP transfer devices 1-1, 1-2, 34-1, 34-2, and 39 are not limited to the optical I / O communication devices 31-0 to 31-6, and the present invention is also applicable to communication devices conforming to wireless communication standards such as wireless LAN and Bluetooth (registered trademark). In addition, instead of a form in which the FOUP 3 is moved on an arc-shaped track by the arm unit 7, a form in which the FOUP 3 is moved on various tracks is also possible. In addition, the number of mounting tables 4 provided in each storage unit S1 and S2 can be appropriately increased or decreased. [Explanation of symbols]

[0065] 1, 1-1, 1-2 First FOUP transfer device 2. Cabinet 3. FOUP 3a Top flange 4, 4-1, 4-3~4-8 Mounting table 5, 5-1, 5-2 FOUP transfer mechanism 6 Holding part 7, 7-1, 7-2, 7-3, 7-4 Arm section 8 Arm drive mechanism 9 Lifting mechanism 10, 10-1, 10-2, 10-3 Control section 11 Transport cart (OHT cart) 11a Hoist mechanism 12 FOUP support pin 13 FOUP support member 14 Air Cylinder 14a Piston rod 15 Power Source 16 Lift platform 17 Linear actuator (drive source) 18, 18-1, 18-2 Loading port 19 Caster 20 Adjuster 21 Manual Switch 22 Emergency stop switch 23 Area Sensor 24, 24-1, 24-2 Stages 25 EFEM 26 OHT 26a orbit 26b Second Orbit 27 Control Device 28 Host Computer 29 MES 30 MCS 31, 31-0~31-6 Optical I / O communication equipment 32 Control PC 33 Stocker 34, 34-1, 34-2 Second FOUP transfer device 35 Supply Nozzle 36 Exhaust nozzle 37 Fixing member 38 RF Receiver 39 Third FOUP transfer device 40 frames 41 Vertical Plate 42 FOUP transfer mechanism 43 Horizontal drive mechanism C1, C2 rotation axis W wafer F Semiconductor manufacturing plant S1, S2 storage units

Claims

1. A FOUP transfer device that is installed in the vicinity of a load port of a transport device having one or more load ports and transfers a FOUP to and from the load port, comprising: The FOUP transfer device has a first communication device, and is further connected to a second communication device equipped in the load port, and is characterized in that it performs communication between the load port and a third communication device equipped in an OHT transport cart on behalf of the load port.

2. 2. The FOUP transfer device according to claim 1, further comprising a control PC that communicates with a host computer provided in a semiconductor manufacturing factory.

3. 3. The FOUP transfer device according to claim 1, further comprising a communication means for transmitting a FOUP transfer signal to and from the load port.

4. 4. The FOUP transfer device according to claim 1, wherein the first communication device, the second communication device, and the third communication device are optical I / O communication devices.

5. 5. The FOUP transfer device according to claim 1, characterized in that the arrangement of the FOUP transfer device matches the arrangement of the multiple load ports equipped on the transport device, and the arrangement of the multiple load ports and the FOUP transfer device is located directly below the OHT track.

6. The FOUP transfer device according to claim 5, characterized in that the FOUP transfer device is located at a position that does not coincide with the arrangement of the multiple load ports located directly below the OHT track, and is located directly below a second OHT track that is different from the OHT track.

7. The FOUP transfer device according to any one of claims 1 to 6, characterized in that it comprises a loading stage for loading the FOUP at a predetermined position, a holding section for holding the FOUP loaded on the loading stage, an arm section for moving the holding section along a substantially arc-shaped trajectory, and a lifting mechanism for raising and lowering the arm section.

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