Vehicle-mounted imaging device

Abstract

To improve noise resistance.SOLUTION: An imaging apparatus includes a front case 103, a rear case 107, and a shield member 112. The front case 103 supports an imaging optical unit 120. The rear case 107 has a conductive output mechanism 107A for outputting a signal outputted from the imaging optical unit 120. The shield member 112 electrically connects the front case 103 and the output mechanism 107A.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present disclosure relates to an in-vehicle imaging device. [Background technology]

[0002] In recent years, with the spread of driving assistance systems for vehicles, surroundings monitoring systems using in-vehicle cameras and mirror replacement systems using in-vehicle cameras are increasingly being installed in vehicles. The imaging device installed in a vehicle is generally surrounded by electronic devices, etc. In such cases, the imaging device may be affected by electromagnetic waves emitted from the electronic devices, etc., surrounding the imaging device. This may cause a disturbance in the video signal or a malfunction of the imaging device, making it impossible to provide a reliable image required for driving assistance.

[0003] For this reason, a configuration has been adopted in which an electromagnetic shield structure is provided in the case of the imaging device itself or inside the case. For example, Patent Document 1 discloses an imaging device in which a shield case made of a conductive material is provided to surround a sensor board. Also, for example, Patent Documents 2 and 3 disclose imaging devices equipped with a metal plate having a shielding portion that covers a part or the entire periphery of the side of the board. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2011-259101 A [Patent Document 2] JP 2020-155984 A [Patent Document 3] JP 2020-155985 A Summary of the Invention [Problem to be solved by the invention]

[0005] However, the above-mentioned conventional technology still has the following problems. Specifically, in the conventional technology, the contact pressure between the member in contact with the shielding member and the shielding member is insufficient, and the contact resistance between the member in contact with the shielding member and the shielding member increases, which may cause the shielding member to not function adequately as an electromagnetic wave shield. Therefore, in the conventional technology, noise resistance may be reduced.

[0006] The present disclosure has been made in consideration of the above-mentioned problems, and has a main object to provide an in-vehicle imaging device that is capable of improving noise resistance. [Means for solving the problem]

[0007] The in-vehicle imaging device according to the present disclosure includes a lens barrel, a circuit board having a first surface and a second surface opposite to the first surface, an imaging element disposed on the first surface of the circuit board, a conductive first case having a support portion supporting the lens barrel, a first side wall portion extending from the support portion and having a first inner surface and a first end, a second side wall portion extending from the support portion and having a second inner surface and a second end, a third side wall portion extending from the support portion and having a third inner surface and a third end, and a fourth side wall portion extending from the support portion and having a fourth inner surface and a fourth end. a fifth end portion at least a portion of which faces the first case, a sixth end portion opposite the fifth end portion, an end surface connecting the fifth end portion and the sixth end portion, a fifth side wall portion extending from the fifth end portion toward the support portion of the first case and having a fifth inner surface and a first outer surface, a sixth side wall portion extending from the fifth end portion toward the support portion of the first case and having a sixth inner surface and a second outer surface, a seventh side wall portion extending from the fifth end portion toward the support portion of the first case and having a seventh inner surface and a third outer surface, the imaging device further comprising: a second case having an eighth side wall portion extending toward the support portion of the first case and having an eighth inner side surface and a fourth outer side surface; an output mechanism disposed in the second case and outputting a signal output from the imaging element; and a shielding member electrically connected to the first case and the output mechanism and disposed between the circuit board and the second case, wherein at least a portion of the circuit board is disposed between the first inner side surface of the first side wall portion of the first case and the third inner side surface of the third side wall portion of the first case, and in front of the second side wall portion. the fifth side wall portion of the second case is disposed between the second inner surface and the fourth inner surface of the fourth side wall portion, the fifth side wall portion of the second case is disposed more inward than the end surface of the second case and the first inner surface of the first side wall portion of the first case, the sixth side wall portion of the second case is disposed more inward than the end surface of the second case and the second inner surface of the second side wall portion of the first case, and the seventh side wall portion of the second case is disposed more inward than the end surface of the second case and the third inner surface of the third side wall portion of the first case;The eighth side wall portion of the second case is disposed on the inside of the end face of the second case and the fourth inner surface of the fourth side wall portion of the first case, and the shielding member includes a planar portion having at least a first side, a second side opposite to the first side, a third side, and a fourth side opposite to the third side, a first connecting portion extending from a first portion of the first side of the planar portion toward the support portion of the first case and having elasticity, and a second connecting portion extending from a second portion of the second side of the planar portion toward the support portion of the first case and having elasticity. and a first connection portion of the shielding member, the first connection portion including a first surface portion extending from the first portion of the first side of the planar portion toward the second surface of the circuit board and disposed along the fifth inner surface of the fifth side wall portion of the second case, a first curved surface portion connected to the first surface portion, a second surface portion connected to the first curved surface portion and extending from the first curved surface portion toward the first inner surface of the first side wall portion of the first case, and a second surface portion connected to the second surface portion and having at least a portion located outside the fifth inner surface of the fifth side wall portion of the second case. the second connection portion of the shielding member has a third surface portion extending from the second portion of the second side of the planar portion toward the second surface of the circuit board and disposed along the sixth inner surface of the sixth side wall portion of the second case, a third curved surface portion connected to the third surface portion, a fourth surface portion connected to the third curved surface portion and extending from the third curved surface portion toward the second inner surface of the second side wall portion of the first case, and a fourth curved surface portion connected to a first surface portion of the shielding member, at least a portion of which is located outside the sixth inner surface of the sixth side wall portion of the second case and is disposed at a position closer to the second surface of the circuit board than the third curved surface portion, wherein a first connection point on the second curved surface portion of the first connection portion of the shielding member contacts the first inner surface of the first side wall portion of the first case, and a second connection point on the fourth curved surface portion of the second connection portion of the shielding member contacts the second inner surface of the second side wall portion of the first case. Effect of the Invention

[0008] According to the vehicle-mounted imaging device according to the present disclosure, it is possible to improve noise resistance. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a layout diagram of an example of an imaging device according to the first embodiment. [Diagram 2] FIG. 2 is an exploded view of the imaging device according to the first embodiment. [Figure 3A] FIG. 3A is a perspective view of the rear case according to the first embodiment as viewed from the output mechanism side. FIG. [Figure 3B] FIG. 3B is a perspective view of the rear case according to the first embodiment as viewed from the lens barrel side. [Figure 4] FIG. 4 is a perspective view of the shielding member according to the first embodiment. [Diagram 5] FIG. 5 is an enlarged cross-sectional view of the housing according to the first embodiment. [Figure 6] FIG. 6 is a schematic diagram showing an example of an enlarged view of a substrate portion of an imaging device according to a second embodiment. [Figure 7] FIG. 7 is a perspective view of an example of a sensor side board and a camera interface side board according to the second embodiment. [Figure 8] FIG. 8 is a schematic view of an enlarged example of a shielding member according to the second embodiment. [Figure 9] FIG. 9 is a schematic diagram of an example of a substrate provided in the imaging device according to the third embodiment. [Figure 10] FIG. 10 is a schematic view of an enlarged example of a shielding member according to a third embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, an imaging device that is an in-vehicle imaging device according to the present disclosure will be described with reference to the drawings.

[0011] (First embodiment) The configuration of an imaging device 100 according to the first embodiment will be described with reference to FIGS.

[0012] FIG. 1 is a layout diagram of an example of the imaging device 100 according to the present embodiment. The imaging device 100 is mounted on a moving body 200, for example. The moving body 200 is, for example, a vehicle, a ship, an aircraft, a drone, etc. In the present embodiment, a form in which the moving body 200 is a vehicle will be described as an example. Note that the position at which the imaging device 100 is mounted is not limited to FIG. 1, and the imaging device 100 may be mounted on, for example, the front, rear, or side mirror of a vehicle. In the present embodiment, an example in which the imaging device 100 is mounted on a vehicle will be described as an example, but the imaging device 100 is not limited to a form in which it is mounted on a vehicle. Furthermore, the imaging device 100 may be installed on something other than a moving body.

[0013] 2 is an exploded view of an example of an imaging device according to this embodiment. The imaging device 100 includes a lens barrel 101, a front case 103, a sensor board 104, a sensor board fixing screw 105, a waterproof packing 106, a rear case 107, a case fixing screw 108, an air hole screw 109, and a shield member 112.

[0014] The lens barrel 101 and the sensor substrate 104 are an example of an imaging optical unit 120. The imaging optical unit 120 includes a lens and an imaging element, and obtains an image signal by capturing an image. The lens is provided in the lens barrel 101, for example. The imaging element is provided in the sensor substrate 104, for example.

[0015] The lens barrel 101 is attached to the outside of the front case 103. The sensor board 104 is attached to the inside of the front case 103 with screws 105 for fixing the sensor board.

[0016] Front case 103 is an example of a first case. Front case 103 supports lens barrel 101, which is imaging optical unit 120, and sensor board 104. Front case 103 is a conductive member.

[0017] The rear case 107 is an example of a second case. The rear case 107 has an output mechanism 107A that outputs a signal output from the imaging optical unit 120. The output mechanism 107A is a conductive connection section for connecting an electric cable or the like that outputs an image signal, which is a signal output from the imaging optical unit 120, to the outside.

[0018] The rear case 107 is attached to the front case 103 by case fixing screws 108. As described above, the sensor board 104 is attached to the front case 103. Therefore, the sensor board 104 is sandwiched and supported between the front case 103 and the rear case 107. It is preferable to provide a rubber waterproof packing 106 between the front case 103 and the rear case 107 in order to improve waterproofing. In the following, the structure formed by attaching the rear case 107 to the front case 103 may be referred to as a housing 110.

[0019] The shielding member 112 electrically connects the front case 103 and the output mechanism 107 A. In this embodiment, the shielding member 112 is provided between the rear case 107 and the front case 103.

[0020] Next, the main components constituting the imaging device 100 will be described in more detail.

[0021] (Telescope tube 101) Lens barrel 101 is a cylindrical member with a lens built in, and is attached to front case 103 via adhesive 102. Lens barrel 101 can be made of, for example, a resin material.

[0022] The lens incorporated in the lens barrel 101 is made of plastic, glass, etc. The lens is arranged along the optical axis inside the lens barrel 101, and forms an image of light from a subject on the imaging element of the sensor board 104.

[0023] (Front case 103) Lens barrel 101 is attached to front case 103 from the outside of front case 103, i.e., from the side opposite to the side where rear case 107 is attached. It is preferable that a hole having the same shape as the shape of the end face of lens barrel 101 is formed on the surface of front case 103 where lens barrel 101 is attached. Lens barrel 101 is attached to front case 103 by fitting one end of lens barrel 101 into the hole in front case 103.

[0024] Adhesive 102 for fixing lens barrel 101 is applied to the periphery of the hole in front case 103 and to the surface that comes into contact with the end face of lens barrel 101. Housing 110 is fixed to lens barrel 101 by adhesive 102 with the relative positional relationship between the imaging element and lens barrel 101 adjusted.

[0025] The adhesive 102 has a property of being hardened at least by heat treatment. In order to attach the front case 103 and the lens barrel 101 with higher accuracy, it is preferable that the adhesive 102 has a property of being temporarily hardened, for example, by ultraviolet (UV) irradiation, prior to full hardening by heat treatment. An example of the adhesive 102 that is hardened through such a two-stage process is an adhesive 102 containing an epoxy resin. By hardening the adhesive 102 by UV irradiation, it is possible to prevent the position of the lens barrel 101 attached to the housing 110 from shifting until it is hardened by heat treatment.

[0026] The material of front case 103 may be any conductive material, and may be, for example, a metal such as aluminum, a conductive resin, or the like.

[0027] (sensor board 104) The sensor board 104 is a board on which an image sensor is mounted. The image sensor is, for example, a complementary metal-oxide semiconductor (CMOS) or a charge-coupled device (CCD). The image sensor receives light that has passed through a lens in the lens barrel 101 and converts it into an image signal.

[0028] A hole through which a sensor board fixing screw 105 passes is formed at an edge of the sensor board 104. The sensor board 104 is fixed to the front case 103 by the sensor board fixing screw 105 through the hole. The sensor board fixing screw 105 may be made of a metal such as stainless steel. By being fixed to the front case 103 by the sensor board fixing screw 105, the sensor board 104 is electrically connected to the front case 103 via the sensor board fixing screw 105.

[0029] (Waterproof packing 106) The waterproof packing 106 is a sealing member for maintaining the airtightness of the internal space of the housing 110. The waterproof packing 106 is sandwiched between the front case 103 and the rear case 107 and pressed from both sides. As a result, the mating surfaces of the front case 103 and the rear case 107 are sealed by the waterproof packing 106, and the imaging device 100 has a waterproof function. The material of the waterproof packing 106 can be any elastic material, such as rubber.

[0030] (Rear case 107) Rear case 107 will be described with reference to Fig. 2, Fig. 3A, and Fig. 3B. Fig. 3A is a perspective view of an example of rear case 107 as viewed from the output mechanism 107A side. Fig. 3B is a perspective view of an example of rear case 107 as viewed from the lens barrel 101 side.

[0031] The rear case 107 includes an output mechanism 107A for outputting an image signal. As described above, the output mechanism 107A is a conductive connection portion for connecting an electric cable that outputs to the outside an image signal that is a signal output from the imaging optical unit 120. Examples of the output mechanism 107A include a coaxial (two-wire type) connector, an STQ (shielded twisted quad cable) (four-wire type) connector, or a CAN-incorporated STQ (six-wire type) connector.

[0032] An air hole 111 is formed in rear case 107. Air hole 111 is a hole that connects the internal space of housing 110 to the space outside housing 110. Air hole 111 is sealed by air hole screw 109.

[0033] The rear case 107 may be made of any material so long as the output mechanism 107A of the rear case 107 is conductive. The parts of the rear case 107 other than the output mechanism 107A may or may not be conductive. For example, the parts of the rear case 107 other than the output mechanism 107A may be made of a resin or a metal. From the viewpoint of moldability, it is preferable that the parts are made of a resin, and from the viewpoint of heat dissipation, it is preferable that the parts are made of a metal. The front case 103 and the rear case 107 may be made of the same material, or may be made of different materials.

[0034] (Shield member 112) Next, the configuration and function of the shielding member 112 will be described with reference to Figures 2, 4, and 5. Figure 4 is a perspective view of an example of the shielding member 112. Figure 5 is an enlarged cross-sectional view of the housing 110.

[0035] The shielding member 112 is conductive and electrically connects the front case 103 and the output mechanism 107A provided in the rear case 107.

[0036] 2 and 4, shield member 112 has a convex shape with a central portion protruding in a direction away from lens barrel 101, and is formed so as to cover sensor substrate 104. In addition, shield member 112 has an opening for installing output mechanism 107A.

[0037] In this embodiment, protrusions 113 are provided at the ends of shielding member 112. Fig. 4 shows an example of a configuration in which two protrusions 113 are provided on each of the four sides of rectangular shielding member 112. That is, Fig. 4 shows an example of a configuration in which eight protrusions 113 are provided on shielding member 112.

[0038] The protruding portion 113 is an example of a first protruding portion. As shown in Fig. 4 and Fig. 5, the protruding portion 113 is a member that protrudes in a direction toward the front case 103. The shielding member 112 is disposed in contact with the front case 103 via the protruding portion 113.

[0039] The contact resistance between the protrusion 113 and the front case 103 may be a predetermined resistance value that allows the potential of the output mechanism 107A to be dropped to ground (GND) via the shield member 112, the protrusion 113, and the front case 103. The imaging device 100 of this embodiment is mounted on the moving body 200 and is connected to a conductive part such as the housing of the moving body 200. Therefore, the output mechanism 107A is grounded via the shield member 112, the protrusion 113, and the front case 103. The predetermined resistance value may be referred to as a predetermined value of contact resistance in the following description. The predetermined value of the contact resistance between the protrusion 113 and the front case 103 is, for example, 1Ω or less, and preferably 0.5Ω or less.

[0040] The protruding portion 113 is an elastic member. The shape of the protruding portion 113 may be any shape that can realize the amount of deflection, maximum stress, and minimum contact pressure with respect to the front case 103, so that the contact resistance between the front case 103 and the protruding portion 113 is equal to or less than the above-mentioned predetermined value.

[0041] The material of the shield member 112 and the protrusion 113 may be any material having electrical conductivity. For example, the material of the shield member 112 and the protrusion 113 may be a metal such as aluminum, a conductive resin, or the like. The material of the shield member 112 and the protrusion 113 may be any material having electrical conductivity and satisfying Young's modulus, Poisson's ratio, and yield strength that can realize the above-mentioned predetermined value of the contact resistance between the protrusion 113 and the front case 103.

[0042] For example, assume that two types of materials, SUS304-CSP 3 / 4H and SUS301-CSP H, are used as the materials for the shielding member 112 and the protruding portion 113. For example, SUS304-CSP 3 / 4H is used for the protruding portion 113 with a long spring length, and SUS301-CSP H is used for the protruding portion 113 with a short spring length. Also assume that the Young's modulus of the shielding member 112 and the protruding portion 113 is 193,000 MPa and the Poisson's ratio is 0.3. Also assume that the yield strength of the shielding member 112 and the protruding portion 113 is 665 MPa when SUS304-CSP 3 / 4H is used, and 1,030 MPa when SUS301-CSP H is used. Under these conditions, a displacement of 0.1 mm was applied to protrusion 113, and the contact resistance between protrusion 113 and front case 103 was measured. A stable contact resistance of 1 Ω or less was achieved at a contact pressure of 0.3 N or more, which is the minimum contact pressure for SUS301-CSP H.

[0043] 4 shows an example in which eight protrusions 113 are provided on shield member 112. However, the number and positions of protrusions 113 are not limited to the example shown in FIG. 4. For example, protrusions 113 may be provided one on each of the four sides of rectangular shield member 112. Specifically, for example, shield member 112 may be provided with four protrusions 113.

[0044] Furthermore, the shape, material, composition, number, position, etc. of the shielding member 112 and the protrusion 113 need only be such that the electric potential of the output mechanism 107A can be dropped to ground via the shielding member 112, the protrusion 113, and the front case 103, and are not limited to the above-mentioned form.

[0045] FIG. 4 shows an example in which a plurality of protrusions 113 of the same shape are provided on the shield member 112. However, the shapes of the plurality of protrusions 113 provided on the shield member 112 may be the same, or at least one of the protrusions 113 may have a different shape from the other protrusions 113. For example, a configuration may be used in which a protrusion 113 having a long spring length and a protrusion 113 having a short spring length are provided in combination on each of the four sides of the rectangular shield member 112. Also, a configuration may be used in which a plurality of protrusions 113 having the same spring length but different widths are provided on each side of the shield member 112. Also, all of the shapes of the plurality of protrusions 113 provided on the shield member 112 may be different from each other depending on the shape of the area that contacts the front case 103.

[0046] Next, the operation of the imaging device 100 of this embodiment will be described.

[0047] In this embodiment, the shield member 112 is conductive and electrically connects the conductive front case 103 and the conductive output mechanism 107A. In detail, the shield member 112 has a protrusion 113 and is disposed in contact with the front case 103 via the protrusion 113.

[0048] Therefore, the front case 103, the output mechanism 107A of the rear case 107, the shield member 112, and the protrusion 113 are electrically connected. Therefore, the front case 103 has approximately the same potential as the output mechanism 107A of the rear case 107, that is, approximately the same potential as the GND (ground) potential of the output mechanism 107A. In other words, the output mechanism 107A of the rear case 107, the shield member 112, the protrusion 113, and the front case 103 are electrically connected, and the imaging device 100 can have a GND reinforced structure.

[0049] As described above, the imaging device 100 of this embodiment includes the front case 103, the rear case 107, and the shield member 112. The front case 103 supports the imaging optical unit 120. The rear case 107 has a conductive output mechanism 107A that outputs a signal output from the imaging optical unit 120. The shield member 112 electrically connects the front case 103 and the output mechanism 107A.

[0050] Therefore, the front case 103, the output mechanism 107A of the rear case 107, and the shield member 112 are electrically connected, and the imaging device 100 can have a GND reinforced structure. That is, in the imaging device 100 of this embodiment, the shield member 112 can fully function as an electromagnetic wave shield. Therefore, in the imaging device 100 of this embodiment, it is possible to improve noise resistance against noise, which is EMI (Electro Magnetic Interference), generated by signals in the external environment of the imaging device 100, such as a radio or a television.

[0051] Therefore, the imaging device 100 of this embodiment can improve noise resistance.

[0052] Furthermore, in this embodiment, since it is possible to improve noise resistance, it is possible to provide the imaging device 100 that satisfies high performance and high resistance to noise.

[0053] Furthermore, in the imaging device 100 of this embodiment, the noise resistance of the imaging device 100 can be improved by the shield member 112. Therefore, in addition to improving the noise resistance, the imaging device 100 of this embodiment can also be made smaller.

[0054] Second embodiment An imaging device according to a second embodiment will be described.

[0055] In the imaging device of this embodiment, a substrate 104C provided inside a housing 110 has a configuration in which a plurality of layers are laminated. The substrate 104C is an example of an electronic substrate.

[0056] The imaging device of this embodiment has the same configuration as the imaging device 100 of the first embodiment, except that the substrate 104C has a configuration in which multiple layers are stacked. The same members as those in the first embodiment are given the same numbers, and detailed descriptions thereof will be omitted.

[0057] Fig. 6 is a schematic diagram showing an example of an enlarged portion of the substrate 104C of the imaging device 100B of this embodiment. Fig. 7 is a perspective view of an example of the sensor side substrate 104A and the camera interface side substrate 104B.

[0058] 6 and 7 show a sensor side board 104A and a camera interface side board 104B as the board 104C. Note that the imaging device 100B may have a configuration in which three or more boards 104C are stacked.

[0059] The sensor side board 104A is a board 104C fixed to the front case 103 via a sensor board fixing screw 105 (see FIG. 1). The camera interface side board 104B is a board 104C that has a mounting board connector that fits with the output mechanism 107A and is integrated with the sensor side board 104A via a flexible circuit.

[0060] Between the sensor side board 104A and the camera interface side board 104B, a shield member 114 is provided. The shield member 114 is an example of a second shield member. The shield member 114 is a conductive and elastic member that connects the multiple boards 104C.

[0061] The shielding member 114 may be any member that is conductive and elastic. Fig. 6 shows an example of a configuration in which the shielding member 114A and the shielding member 114B are provided between the sensor side board 104A and the camera interface side board 104B. The shielding member 114A and the shielding member 114B are examples of the shielding member 114.

[0062] 8 is a schematic diagram of an example of an enlarged shielding member 114A. The shielding member 114A is attached to the sensor side substrate 104A and is a conductive part composed of three parts: a pin, a tube, and a spring. A conductive plating layer is provided on the pin located at the tip of the shielding member 114A. The conductive plating layer is composed of, for example, gold plating.

[0063] Returning to FIG. 6, the explanation will be continued. A conductive plating layer is also provided on the camera interface side board 104B at the location (hereinafter referred to as land) where the pin of the shield member 114A comes into contact. With this configuration, the sensor side board 104A and the camera interface side board 104B are electrically connected via the pin of the shield member 114A, the conductive plating layer, and the land of the camera interface side board 104B. The land has a size of φ1.5 mm and a thickness of 0.1 mm, for example, but is not limited to this.

[0064] The pin located at the tip of shield member 114A is spring-like and has a predetermined range of motion and spring pressure, so that shield member 114A has elasticity.

[0065] The contact resistance between shield member 114A and each of sensor side board 104A and camera interface side board 104B may be a predetermined resistance value that allows the potential of output mechanism 107A to be dropped to ground via shield member 112, protrusion 113, shield member 114A, shield member 114B, and front case 103. The contact resistance between shield member 114A and each of sensor side board 104A and camera interface side board 104B is, for example, 1.5Ω or less, preferably 1Ω or less, and more preferably 0.5Ω or less.

[0066] The shape and material of the shield member 114A may be any shape and material that is conductive and can realize a contact resistance of 1.5 Ω or less with each of the sensor side board 104A and the camera interface side board 104B. For example, the movable range of the spring-like pin of the shield member 114A is 0.9 mm, and the spring pressure is 1.08 N, but is not limited to these.

[0067] The shielding member 114B is attached to the camera interface side board 104B and is a part that reduces electromagnetic noise. The shielding member 114B has a sponge core and is covered with conductive cloth. Therefore, the shielding member 114B has conductivity and elasticity.

[0068] The shield member 114B is arranged in contact with the sensor board fixing screws 105 that fix the sensor side board 104A. The sensor board fixing screws 105 are conductive screws. With this configuration, the sensor side board 104A and the camera interface side board 104B are electrically connected via the shield member 114B and the sensor board fixing screws 105.

[0069] The compressibility, compression load, shape, and material of the shielding member 114B may be any as long as it is conductive and can realize a contact resistance of 1.5Ω or less with each of the sensor side board 104A and the camera interface side board 104B. The material of the conductive cloth of the shielding member 114B is, for example, a Sn-Cu polyimide film, but is not limited to this. For example, the shielding member 114B can realize a contact resistance of 1.5Ω or less by being placed in contact with the shielding member 114B so as to have a compression ratio of about 25% and a compression load of 5N or more.

[0070] Next, the operation of the imaging device 100B of this embodiment will be described.

[0071] In this embodiment, the shield member 112 is conductive and electrically connects the conductive front case 103 and the conductive output mechanism 107A. In detail, the shield member 112 has a protrusion 113 and is disposed in contact with the front case 103 via the protrusion 113. Therefore, the front case 103, the output mechanism 107A of the rear case 107, and the shield member 112 are electrically connected.

[0072] In this embodiment, a shield member 114 is further provided between the multiple substrates 104C. The shield member 114 is an example of a second shield member. The shield member 114 is a conductive and elastic member that electrically connects the multiple substrates 104C.

[0073] Therefore, the front case 103, the output mechanism 107A of the rear case 107, the shield member 112, and the multiple boards 104C are electrically connected. Specifically, the camera interface side board 104B is electrically connected to the sensor side board 104A fixed to the front case 103 via the shield member 114A and the shield member 114B. Therefore, the front case 103 has approximately the same potential as the output mechanism 107A of the rear case 107, that is, approximately the same potential as the GND (ground) potential of the output mechanism 107A. In other words, the output mechanism 107A of the rear case 107, the shield member 112, the multiple boards 104C, and the front case 103 are electrically connected, and the imaging device 100B can have a GND reinforced structure.

[0074] Therefore, the imaging device 100B of this embodiment can further improve noise resistance in addition to the effects of the first embodiment.

[0075] (Third embodiment) In the second embodiment, an example has been described in which shield members 114A and 114B are used as shield members 114. However, shield member 114 may be any conductive and elastic member that electrically connects multiple substrates 104C, and is not limited to shield members 114A and 114B.

[0076] 9 is a schematic diagram of an example of a substrate 104C provided in an imaging device 100C of this embodiment. The imaging device 100C of this embodiment has the same configuration as the imaging device 100 of the first embodiment, except that the substrate 104C is configured by stacking a plurality of layers. The imaging device 100C of this embodiment has the same configuration as the imaging device 100B of the second embodiment, except that the imaging device 100C of this embodiment includes a shield member 114 different from the shield members 114A and 114B. For this reason, the same members as those in the above embodiment are denoted by the same numbers, and detailed descriptions thereof will be omitted.

[0077] In this embodiment, a configuration in which a shield member 114C is provided between a sensor side board 104A and a camera interface side board 104B will be described. The shield member 114C is an example of the shield member 114.

[0078] Fig. 10 is a schematic diagram of an example of an enlarged shield member 114C. As shown in Fig. 9 and Fig. 10, shield member 114C is a shield member 114 having a different shape from shield member 114A and shield member 114B.

[0079] The shield member 114C is attached to the camera interface side board 104B and is a component for strengthening the ground between the multiple boards 104C. The shield member 114C is formed, for example, from spring phosphor bronze, and its surface is Sn reflow plated. The parts of the sensor side board 104A that come into contact with the shield member 114C are surface treated with metal. With this configuration, the sensor side board 104A and the camera interface side board 104B are electrically connected via the shield member 114C.

[0080] The contact resistance between shield member 114C and each of sensor side board 104A and camera interface side board 104B may be a predetermined resistance value that allows the potential of output mechanism 107A to be dropped to ground via shield member 112, protrusion 113, shield member 114C, and front case 103. The contact resistance between shield member 114C and each of sensor side board 104A and camera interface side board 104B is, for example, 1.5Ω or less, preferably 1Ω or less, and more preferably 0.5Ω or less.

[0081] The shape and material of the shield member 114C may be any shape and material that is conductive and can realize a contact resistance of 1.5Ω or less with each of the sensor side board 104A and the camera interface side board 104B.

[0082] Next, the operation of the imaging device 100C of this embodiment will be described.

[0083] In this embodiment, the shield member 112 is conductive and electrically connects the conductive front case 103 and the conductive output mechanism 107A. In detail, the shield member 112 has a protrusion 113 and is disposed in contact with the front case 103 via the protrusion 113. Therefore, the front case 103, the output mechanism 107A of the rear case 107, and the shield member 112 are electrically connected.

[0084] In this embodiment, a shield member 114C is further provided between the multiple substrates 104C. The shield member 114C is an example of a second shield member. The shield member 114C is a conductive and elastic member that electrically connects the multiple substrates 104C.

[0085] Therefore, the front case 103, the output mechanism 107A of the rear case 107, the shield member 112, and the multiple boards 104C are electrically connected. Specifically, the camera interface side board 104B is electrically connected to the sensor side board 104A fixed to the front case 103 via the shield member 114C. Therefore, the front case 103 has approximately the same potential as the output mechanism 107A of the rear case 107, that is, approximately the same potential as the GND potential of the output mechanism 107A. That is, the output mechanism 107A of the rear case 107, the shield member 112, the multiple boards 104C, and the front case 103 are electrically connected, and the imaging device 100C can have a GND reinforced structure. Note that when the front case 103 and the output mechanism 107A of the rear case 107 are electrically connected directly, the shield member 112 may be omitted.

[0086] Therefore, the imaging device 100C of this embodiment can further improve noise resistance in addition to the effects of the first embodiment.

[0087] Note that shielding member 114 may be any conductive and elastic member that electrically connects multiple substrates 104C, and is not limited to shielding member 114A, shielding member 114B, and shielding member 114C.

[0088] For example, a configuration may be used in which shield members 114A, 114B, and 114C are provided between multiple substrates 104C. Also, a configuration may be used in which shield members 114A and 114C are provided between multiple substrates 104C. In this case, it is sufficient to select the material, shape, number, position, and the like that will enable the contact resistance between substrate 104C and shield member 114 to be equal to or less than the predetermined value.

[0089] It should be noted that the above-described embodiment is presented as an example and is not intended to limit the scope of the present disclosure. The above-described embodiment can be implemented in various other forms, and various omissions, substitutions, and modifications can be made without departing from the gist of the invention. The above-described embodiment is included in the scope or gist of the present disclosure, and is included in the scope of the invention and its equivalents described in the claims. [Industrial Applicability]

[0090] The imaging device according to the present disclosure can be used, for example, in-vehicle cameras, surveillance cameras, drone cameras, and the like. [Explanation of symbols]

[0091] 100, 100B, 100C Imaging device 101 Telescope tube 102 Adhesive 103 Front Case 104 Sensor board 104A Sensor side board 104B Camera interface board 104C Board 105 Sensor board fixing screw 106 Waterproof packing 107 Rear case 108 Case fixing screw 109 Air hole screw 110 Cabinet 111 Air hole 112 Shielding material 113 Protrusion 114, 114A, 114B, 114C Shielding material 120 Imaging optical unit

Claims

1. A lens barrel including a lens; a circuit board having a first surface and a second surface opposite the first surface; an imaging element disposed on the first surface of the circuit board; a conductive first case including a support portion supporting the lens barrel, a first side wall portion extending from the support portion and having a first inner side surface and a first end, a second side wall portion extending from the support portion and having a second inner side surface and a second end, a third side wall portion extending from the support portion and having a third inner side surface and a third end, and a fourth side wall portion extending from the support portion and having a fourth inner side surface and a fourth end; a second case having a fifth end, at least a portion of which faces the first case, a sixth end opposite the fifth end, an end surface connecting the fifth end and the sixth end, a fifth side wall portion extending from the fifth end toward the support portion of the first case and having a fifth inner surface and a first outer surface, a sixth side wall portion extending from the fifth end toward the support portion of the first case and having a sixth inner surface and a second outer surface, a seventh side wall portion extending from the fifth end toward the support portion of the first case and having a seventh inner surface and a third outer surface, and an eighth side wall portion extending from the fifth end toward the support portion of the first case and having an eighth inner surface and a fourth outer surface; an output mechanism disposed in the second case and configured to output a signal output from the imaging element; a shielding member electrically connected to the first case and the output mechanism and disposed between the circuit board and the second case; Equipped with at least a portion of the circuit board is disposed between the first inner surface of the first side wall portion of the first case and the third inner surface of the third side wall portion of the first case, and between the second inner surface of the second side wall portion and the fourth inner surface of the fourth side wall portion; the fifth side wall portion of the second case is disposed on the inner side of the end surface of the second case and the first inner surface of the first side wall portion of the first case, the sixth side wall portion of the second case is disposed on the inner side of the end surface of the second case and the second inner surface of the second side wall portion of the first case, the seventh side wall portion of the second case is disposed on the inner side of the end surface of the second case and the third inner surface of the third side wall portion of the first case, the eighth side wall portion of the second case is disposed on the inner side of the end surface of the second case and the fourth inner surface of the fourth side wall portion of the first case, The shield member is a planar portion having at least a first side, a second side opposite to the first side, a third side, and a fourth side opposite to the third side; a first connection portion that extends from a first portion of the first side of the planar portion toward the support portion of the first case and has elasticity; From the second portion of the second side of the planar portion toward the support portion of the first case and a second connecting portion having an elasticity and extending property. The first connection portion of the shield member is a first surface portion extending from the first portion of the first side of the planar portion toward the second surface of the circuit board and disposed along the fifth inner surface of the fifth side wall portion of the second case; a first curved surface portion connected to the first surface portion; a second surface portion connected to the first curved surface portion and extending from the first curved surface portion toward the first inner surface of the first side wall portion of the first case; a second curved surface portion connected to the second surface portion, at least a portion of which is located outside the fifth inner surface of the fifth side wall portion of the second case, and which is disposed at a position closer to the second surface of the circuit board than the first curved surface portion, The second connection portion of the shield member is a third surface portion extending from the second portion of the second side of the planar portion toward the second surface of the circuit board and disposed along the sixth inner surface of the sixth side wall portion of the second case; a third curved surface portion connected to the third surface portion; a fourth surface portion connected to the third curved surface portion and extending from the third curved surface portion toward the second inner surface of the second side wall portion of the first case; a fourth curved surface portion connected to the fourth surface portion, at least a portion of which is located outside the sixth inner surface of the sixth side wall portion of the second case, and which is disposed at a position closer to the second surface of the circuit board than the third curved surface portion, a first connection point on the second curved surface portion of the first connection portion of the shielding member contacts the first inner surface of the first side wall portion of the first case, a second connection point on the fourth curved surface portion of the second connection portion of the shielding member contacts the second inner surface of the second side wall portion of the first case; Vehicle-mounted imaging device.

2. The shield member is a third connection portion extending from a third portion of the third side of the planar portion toward the support portion of the first case and having elasticity; a fourth connection portion extending from a fourth portion of the fourth side of the planar portion toward the support portion of the first case and having elasticity. The vehicle-mounted imaging device according to claim 1 .

3. The third connection portion of the shield member is a fifth surface portion extending from the third portion of the third side of the planar portion toward the second surface of the circuit board and disposed along the seventh inner surface of the seventh side wall portion of the second case; a fifth curved surface portion connected to the fifth surface portion; a sixth surface portion connected to the fifth curved surface portion and extending from the fifth curved surface portion toward the third inner surface of the third side wall portion of the first case; a sixth curved surface portion connected to the sixth surface portion, at least a portion of which is located outside the seventh inner surface of the seventh side wall portion of the second case, and which is located at a position closer to the second surface of the circuit board than the fifth curved surface portion, The fourth connection portion of the shield member is a seventh surface portion extending from the fourth portion of the fourth side of the planar portion toward the second surface of the circuit board and disposed along the eighth inner surface of the eighth side wall portion of the second case; a seventh curved surface portion connected to the seventh surface portion; an eighth surface portion connected to the seventh curved surface portion and extending from the seventh curved surface portion toward the fourth inner surface of the fourth side wall portion of the first case; an eighth curved surface portion connected to the eighth surface portion, at least a portion of which is located outside the eighth inner surface of the eighth side wall portion of the second case, and which is located at a position closer to the second surface of the circuit board than the seventh curved surface portion; a third connection point on the sixth curved surface portion of the third connection portion of the shielding member contacts the third inner surface of the third side wall portion of the first case, a fourth connection point on the eighth curved surface portion of the fourth connection portion of the shielding member contacts the fourth inner surface of the fourth side wall portion of the first case; The vehicle-mounted imaging device according to claim 2 .

4. a packing disposed between the first case and the second case around the entire periphery of the second case, the packing having at least a fifth side, a sixth side, a seventh side, and an eighth side; the fifth side of the packing contacts at least a part of the first outer surface of the fifth side wall portion of the second case, at least a part of the fifth end portion of the second case located outside the fifth side wall portion of the second case, and at least a part of the first end portion of the first side wall portion of the first case; the sixth side of the packing contacts at least a part of the second outer surface of the sixth side wall portion of the second case, at least a part of the fifth end portion of the second case located outside the sixth side wall portion of the second case, and at least a part of the second end portion of the second side wall portion of the first case; the seventh side of the packing contacts at least a part of the third outer surface of the seventh side wall portion of the second case, at least a part of the fifth end portion of the second case located outside the seventh side wall portion of the second case, and at least a part of the third end portion of the third side wall portion of the first case; the eighth side of the packing contacts at least a part of the fourth outer surface of the eighth side wall portion of the second case, at least a part of the fifth end portion of the second case located outside the eighth side wall portion of the second case, and at least a part of the fourth end portion of the fourth side wall portion of the first case; The vehicle-mounted imaging device according to claim 2 .

5. The shield member is a fifth connection portion adjacent to the first connection portion and extending from a fifth portion of the first side of the planar portion toward the support portion of the housing, a first gap is formed between the first connection portion of the shielding member and the fifth connection portion of the shielding member, and between the first portion and the fifth portion of the first side of the planar portion of the shielding member; The vehicle-mounted imaging device according to claim 1 .

6. The shield member is a sixth connection portion adjacent to the second connection portion and extending from a sixth portion of the second side of the planar portion toward the support portion of the housing, a second gap is formed between the second connection portion of the shielding member and the sixth connection portion of the shielding member, and between the second portion and the sixth portion of the second side of the planar portion of the shielding member; The vehicle-mounted imaging device according to claim 5 .

7. the first connection portion of the shielding member has a first length in a direction from the planar portion of the shielding member toward the second surface of the circuit board, the sixth connection portion of the shielding member has a second length different from the first length of the first connection portion in a direction from the planar portion of the shielding member toward the second surface of the circuit board; The vehicle-mounted imaging device according to claim 6.

8. the first length of the first connection portion of the shielding member is longer than the second length of the sixth connection portion of the shielding member; The vehicle-mounted imaging device according to claim 7 .

9. The first connection portion of the shielding member is made of SUS304-CSP3 / 4H, 9. The vehicle-mounted imaging device according to claim 8, wherein the second connection portion of the shielding member is made of SUS301-CSPH.

10. a contact resistance between the first case and the first connection portion of the shielding member is 1 Ω or less; The vehicle-mounted imaging device according to claim 1 .

11. a contact pressure between the first case and the first connection portion of the shielding member is 0.3 N or more; The vehicle-mounted imaging device according to claim 1 .

12. The first case is made of metal. The vehicle-mounted imaging device according to claim 1 .

13. the first case comprises aluminum; The vehicle-mounted imaging device according to claim 12.

14. The second case is made of resin. The vehicle-mounted imaging device according to claim 12.

15. The output mechanism is a coaxial connector or an STQ connector. The vehicle-mounted imaging device according to claim 13.

16. The shield member includes aluminum. The vehicle-mounted imaging device according to claim 15.

Images