TFT-LCD float glass substrate processing line

The TFT-LCD float glass substrate processing line addresses the challenges of efficiency, accuracy, and surface quality by integrating advanced polishing and grinding technologies, enabling high-volume production of large substrates with precise and defect-free surfaces.

JP7656703B2Active Publication Date: 2025-04-03BENGBU CHINA OPTOELECTRONIC TECH CO LTD +2
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Patent Information

Application Number
JP2023533284
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Priority Date
2022-07-13
Filing Date
2023-05-19
Publication Date
2025-04-03
Estimated Expiration
2043-05-19

AI Technical Summary

Technical Problem

Current TFT-LCD float glass substrate processing lines face challenges in achieving high efficiency, accuracy, and production volume, particularly for large glass substrates like 8.5 and 10.5 generations, due to limitations in defect removal and surface flattening.

Method used

The proposed TFT-LCD float glass substrate processing line incorporates a finishing cut-edge polishing work area, a surface grinding work area, and an inspection packing work area, equipped with advanced devices such as cold end cutting devices, multi-axis edge polishing devices, and surface grinding machines, allowing for automated switching to accommodate different substrate sizes and ensuring high precision and cleanliness.

Benefits of technology

This processing line enables efficient production of large TFT-LCD float glass substrates with high accuracy and excellent surface quality, meeting the stringent requirements for downstream liquid crystal panel manufacturing, while also increasing production capacity and efficiency.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

A TFT-LCD float method glass substrate processing line having, in the order mentioned, a finish cutting / edge polishing work area, a surface grinding work area, and an inspection / packing work area. In the finish cutting / edge polishing work area, a cold edge cutting device, a finish cutting / breaking device, a multi-axis edge polishing device, a post-edge polishing cleaning device, a first edge inspection machine device, a first size measuring device, a grinding width measuring device, a lift-up conveyor, and a loading rack are installed in the order mentioned. In the surface grinding work area, a bonding machine inlet conveyor, a first vacuum transfer suction cup, a bonding machine device, a surface grinding device, a peeling machine device, a second vacuum transfer suction cup, a post-surface grinding cleaning machine, a first surface inspection machine device, a final cleaning machine, a third surface inspection machine device, a second edge inspection machine device, a second size measuring device, and a thickness measuring device are installed in the order mentioned.
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Description

[Technical field]

[0001] [CROSS REFERENCE TO RELATED APPLICATIONS] The present invention claims priority to a Chinese patent application, entitled "High Generation TFT-LCD Float Method Glass Substrate Processing Line," filed with the State Intellectual Property Office of the People's Republic of China on July 13, 2022, with application number 202210827254.5, the entire contents of which are incorporated herein by reference. The present invention relates to the field of TFT-LCD float glass substrate processing, in particular to a TFT-LCD float glass substrate processing line. [Background technology]

[0002] TFT-LCD glass substrate is an important strategic material in the electronic information display industry, and currently, the core technology in the production of TFT-LCD glass substrate has been restricted by others for a long time, especially for 8.5 generation, 10.5 generation and above large glass substrates, the product market is completely monopolized by a few enterprises such as Corning, Asahi Glass, etc. At present, the production of TFT-LCD glass substrate is divided into two methods: overflow downdraw method and float method.

[0003] With the completion of float method TFT-LCD glass substrates, the finishing processing technology of glass substrates was also born. Different from the forming process produced by overflow downdraw, the forming process produced by float method mainly involves glass liquid flowing on the surface of a metal tin liquid tank, which is then controlled by related processes, and then cooled and formed to form a glass substrate. The glass surface in contact with the tin liquid surface is the processing surface of the downstream liquid crystal manufacturer, and due to the characteristics of the glass manufacturing process, microscopic defects such as tin spots and scratches may occur on the processed surface. However, downstream liquid crystal panel manufacturers require that the surface of the processed product glass substrate is free of defects such as tin spots and scratches, and the surface is extremely flat microscopically. Therefore, unlike the processing line of overflow downdraw method, the processing line of float glass substrates is required to have its own combination of processing production processes to process glass substrates that meet the needs of customers. Summary of the Invention [Problem to be solved by the invention]

[0004] The objective of the present invention is to provide a TFT-LCD float glass substrate processing line with high efficiency, high precision and high production capacity. [Means for solving the problem]

[0005] The TFT-LCD float method glass substrate processing line proposed in the embodiment of the present invention is a TFT-LCD float method glass substrate processing line which, according to the process features and areas, sequentially has a finish cutting / edge polishing work area, a surface grinding work area, and an inspection and packing work area, in which the edges of the glass substrates are finished and cleaned in the finish cutting / edge polishing work area, the surfaces of the glass substrates are finished and cleaned in the surface grinding work area, and the finished glass substrates are inspected and packed in the inspection and packing work area.

[0006] In some embodiments of the present invention, the finish cutting / edge grinding work area includes a cold edge cutting device, a finish cutting / breaking device, a multi-axis edge grinding device, a post-edge grinding cleaning device, a first edge inspection device, a first size measuring device, a grinding width measuring device, a lift-up conveyor, and a loading rack, which are installed in this order; the surface grinding work area includes a bonding machine inlet conveyor, a first vacuum transfer suction cup, a bonding machine device, a surface grinding device, a peeling machine device, a second vacuum transfer suction cup, a post-surface grinding cleaning machine, a first surface inspection device, a final cleaning machine, a third surface inspection device, a second edge inspection device, a second size measuring device, and a thickness measuring device, which are installed in this order; and the inspection and packaging work area includes a temporary placement inspection table device, a product inspection device, an automatic transfer device, an manual random inspection table, an unloading means, and a product packaging means, which are installed in this order.

[0007] In some embodiments of the present invention, the cold end cutting device includes a second side inspector device, a thickness inspector device, a longitudinal cutter device, a mechanical arm, an automatic weight weighing device, and a waste area.

[0008] In some embodiments of the present invention, the second surface inspection device and the thickness inspection device are equipped with fully automatic inspection systems, and after the glass substrate is cooled, the second surface inspection device and the thickness inspection device inspect and screen the glass substrate for thickness defects, and mark areas that meet the inspection criteria and areas that do not meet the inspection criteria.

[0009] In some embodiments of the present invention, a glass substrate is fed into the vertical cutting machine device by an automatic transfer device, and the vertical cutting machine device partially cuts areas of the glass substrate that meet the inspection standards and areas that do not meet the inspection standards, and the areas of the glass substrate that meet the inspection standards are cut by the vertical cutting machine device into desired 8.5 generation / 10.5 generation / 11 generation standard glass substrate semi-finished products.

[0010] In some embodiments of the present invention, the automatic weight measuring device measures the weight of the glass substrate semi-finished products flowing from the vertical cutting machine device by an automatic transfer device, and the glass substrate semi-finished products that pass the test automatically flow into the finishing cut and break device.

[0011] In some embodiments of the present invention, the finish cutting / breaking device and the multi-axis edge polishing device identify the size based on the glass substrate information passed from the previous process, and the finish cutting / breaking device and the multi-axis edge polishing device are automatically switched to processing positions corresponding to multiple types of sizes such as 8.5 generation / 10.5 generation / 11 generation, etc.

[0012] In some embodiments of the present invention, the surface grinding apparatus includes a grinding machine table, which includes an upper grinding machine, a lower pallet fixing platform, and an automatic transfer device, and the grinding machine table is installed in three sets, which are a rough grinding machine, a fine grinding machine, and a precision grinding machine respectively.

[0013] In some embodiments of the present invention, the coarse grinding machine performs primary grinding on the glass surface to remove large particle defects on the glass substrate surface, the fine grinding machine performs secondary grinding on the glass surface to remove small particle defects on the glass substrate surface, and the precision grinding machine performs tertiary grinding on the glass surface to repair the glass substrate surface.

[0014] In some embodiments of the present invention, the first surface inspection machine device performs automatic inspection and judgment on the glass substrate surface, and divides it into three levels, namely, severely defective, slightly defective, and non-defective. The severely defective products are transferred to the scrap area by an automatic transfer device and discarded, and the slightly defective products are returned to the entrance conveyor of the bonding machine by the automatic transfer device, and are bonded and ground again. Effect of the Invention

[0015] The present invention is a TFT-LCD float glass substrate processing line, which can process large-sized TFT-LCD float glass substrates such as 8.5 generation with a size of 2200mm x 2500mm and 10.5 generation / 11 generation with a size of 3370mm x 2940mm. The cold end cutting device is improved, and the device can automatically switch to the working position corresponding to different sizes, and has the advantages of high production efficiency, large product size, high product precision, excellent product performance and large production capacity.

[0016] The drawings described herein constitute a part of the present invention in order to provide a further understanding of the present invention, and the schematic examples and their explanations in the present application are intended to interpret the present invention and are not intended to unduly limit the present invention. [Brief description of the drawings]

[0017] [Figure 1] FIG. 1 is a schematic diagram of the overall structure of a post-processing line according to an embodiment of the present invention. [Diagram 2] FIG. 2 is a schematic diagram of the structure of a finish cutting and edge grinding working area according to an embodiment of the present invention. [Diagram 3] FIG. 3 is a schematic diagram of the structure of a surface grinding work area according to an embodiment of the present invention. [Figure 4] FIG. 4 is a schematic diagram of the structure of a cold end cutting device according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0018] In order to make the objectives, technical solutions and advantages of the present invention clearer, the present invention will be described in more detail below by way of examples with reference to the drawings. Obviously, the described embodiments are only some of the embodiments of the present application, and are not all of the embodiments. Based on the embodiments of the present invention, all other embodiments that can be obtained by those skilled in the art are within the scope of protection of the present invention.

[0019] As shown in Fig. 1, an embodiment of the present invention proposes a TFT-LCD float method glass substrate processing line, which is set up in three sequential working zones according to the process characteristics and areas, namely, finishing cutting and edge polishing working zone 1, surface grinding working zone 2, and inspection and packing working zone 3. The three working zones are sequentially connected and realize unified coordinated operation by correspondingly installed electric control systems, in which the finishing cutting and edge polishing working zone 1 finishes and cleans the edges of the glass substrate, the surface grinding working zone 2 finishes and cleans the surfaces of the glass substrate, and the inspection and packing working zone 3 inspects and packs the finished glass substrate.

[0020] The present invention provides a TFT-LCD float glass substrate processing line, which can process large-sized TFT-LCD float glass substrates such as 8.5 generation with a size of 2200mm x 2500mm and 10.5 generation / 11 generation with a size of 3370mm x 2940mm, and has an improved cold end cutting device that can automatically switch to working positions corresponding to different sizes, with the advantages of high production efficiency, large product size, high product precision, excellent product performance, and large production capacity.

[0021] Compared with the overflow downdraw processing line, the technical solution of the present invention has a surface grinding work area between the finishing cutting / edge polishing work area and the inspection and packaging work area, that is, before the inspection and packaging work, the glass substrate surface is subjected to finishing such as grinding and cleaning so that the surface of the produced glass substrate can meet the microscopically extreme flatness requirements required for downstream processing.

[0022] As shown in Fig. 1, the finish cutting / edge polishing work area 1 and the surface grinding work area 2 are connected by an automatic transfer device 100, and the surface grinding work area 2 and the inspection and packing work area 3 are connected by an automatic transfer device. The automatic transfer device 100 is a transfer device that is commonly used in glass substrate production lines, and Fig. 1 shows only a part of the conveyors of the automatic transfer device 100, and does not show electrical control parts and conveyor drive parts of the automatic transfer device 100.

[0023] As shown in FIG. 1, in the finishing cutting and edge grinding work area 1, a cold end cutting device 11 and an edge grinding area 120 are installed in sequence along the conveyor transfer direction. After the glass substrate is formed, annealed and cooled, it is first cut in the cross direction and on both sides by the cold end cutting device 11, and then the cut surface and both side cross sections are ground by the edge grinding area 120. The edge-ground glass substrate is transferred to the surface grinding work area 2 by the conveyor. In the surface grinding work area 2, a grinding area 200 and a cleaning area 220 are installed in sequence along the conveyor transfer direction. In the grinding area 200, the surface of the glass substrate is ground multiple times, and the ground glass substrate is washed in the cleaning area 220. The washed glass substrate is transferred to the inspection and packing work area 3 by the conveyor. The inspection and packing work area 3 is arranged in the order of an inspection area 31 and a packing area 32 along the conveyor transfer direction. Glass substrates that pass inspection in the inspection area 31 enter the packing area 32 and are packed, while glass substrates that do not pass the inspection are picked up by a mechanical arm 114 and placed in the scrap area 116 for disposal.

[0024] As shown in FIG. 2, in one embodiment of the present invention, after a glass substrate is formed, annealed and cooled, a cold edge cutting device 11, a finish cutting and breaking device 12, a multi-axis edge polishing device 13, a post-edge polishing cleaning device 14, a first edge inspection device 15, a first size measuring device 16, a grinding width measuring device 17, a lifting conveyor and a loading rack are sequentially installed in a finish cutting and edge polishing work area 1.

[0025] Specifically, in the finish cutting and edge grinding work area 1, a cold edge cutting device 11, a finish cutting and breaking device 12, a multi-axis edge grinding device 13, a post-edge grinding cleaning device 14, a first edge inspection machine device 15, a first size measuring device 16, and a grinding width measuring device 17 may be installed in this order along the conveyor transfer direction. Thus, after the glass substrate is formed, annealed, and cooled, it enters the finish cutting and edge grinding work area 1, where it is first cut in the lateral direction and on both sides by the cold edge cutting device 11, and then broken at the points where the glass substrate is cut in the lateral direction and on both sides by the finish cutting and breaking device 12, leaving a cut glass substrate. The cut glass substrate has its lateral edges ground by the first edge grinding device 131 in the multi-axis edge grinding device 13, and then its both edges are ground by the second edge grinding device 132. The edge-ground glass substrate enters the post-edge grinding cleaning device 14 for cleaning. The cleaned glass substrate enters the first edge inspection device 15, where the edge is inspected, and after passing the edge inspection, it enters the first size measurement device 16, where the size is inspected, and after passing the size inspection, it enters the grinding width measurement device 17, and the glass substrate that passes the inspection can be transferred to the surface grinding work area 2 and surface ground.

[0026] During the above-mentioned edge grinding and cleaning process, the glass substrate can be adjusted in position by the lifting conveyor and loading rack in the automatic transfer device 100 so that the lateral or side edge to be ground corresponds to the position of the grinding axis of the first edge polishing device 131 or the second edge polishing device 132, or can be moved into the post-edge polishing cleaning device 14.

[0027] As shown in FIG. 4, the cold end cutting device 11 includes a second surface inspection device 111, a thickness inspection device 112, a vertical cutting device 113, a mechanical arm 114, an automatic weight weighing device 115 and a waste area .

[0028] The second surface inspection device 111 inspects the surface of the formed and annealed glass substrate and marks whether there is a defect. The second surface inspection device 111 and the thickness inspection device 112 are equipped with fully automatic inspection systems, and after the glass substrate is cooled, the second surface inspection device 111 and the thickness inspection device 112 inspect and select whether there is a thickness defect in the glass substrate, and mark the areas that meet the inspection criteria and the areas that do not meet the inspection criteria.

[0029] After the glass substrate is initially inspected, it is fed into the vertical cutter device 113 by an automatic transfer device, and the vertical cutter device 113 partially cuts the areas of the glass substrate that meet the inspection standard and areas that do not meet the inspection standard. The areas of the glass substrate that meet the inspection standard are cut into 8.5 generation / 10.5 generation / 11 generation glass substrate semi-finished products of the desired standard by the vertical cutter device 113, thereby reducing the waste of glass substrate.

[0030] Rejected glass substrates are picked up by a mechanical arm 114 and placed in a scrap area 116 for disposal.

[0031] The automatic weight measuring device 115 measures the weight of the glass substrate semi-finished products flowing in from the vertical cutter device 113 by the automatic transfer device, and the glass substrate semi-finished products that pass the test automatically flow into the finishing cut / breaking device 12 for finishing cut / edge polishing processes, and the glass substrate semi-finished products that do not pass the test automatically flow into the scrap area 116 for disposal. The weight of the glass substrate is one of the reference standards for the pass / fail inspection of the product, and in order to guarantee the quality of the final product, the weight is measured in this embodiment.

[0032] 2, the finish cutting and breaking device 12 performs finish cutting of large-sized glass substrates such as 8.5 generation / 10.5 generation / 11 generation, etc. After the glass substrate is initially cut by the cold end cutting device 11, it is positioned by the conveyor of the automatic transfer device 100 and transferred to the working position of the finish cutting and breaking device 12.

[0033] The multi-axis edge polishing device 13 grinds and chamfers the edges of the glass substrate after the finish cutting has been completed, and has the function of automatically switching to larger sizes such as 8.5 generation / 10.5 generation / 11 generation.

[0034] The finish cutting / breaking device 12 and the multi-axis edge polishing device 13 identify the size based on the glass substrate information passed from the previous process, and the finish cutting / breaking device 12 and the multi-axis edge polishing device 13 are automatically switched to processing positions corresponding to multiple sizes such as 8.5 generation / 10.5 generation / 11 generation, etc.

[0035] The post-edge polishing cleaning device 14 cleans the glass powder remaining after edge polishing and the glass substrate surface.

[0036] The first edge inspection device 15 automatically inspects and judges the acceptability of the four edges and chamfers of the glass substrate.

[0037] The first size measurement device 16 performs size measurement, inspection and judgment on the glass substrate.

[0038] The grinding width measuring device 17 performs automatic inspection and judgment on the grinding widths of the four edges and chamfers.

[0039] The glass substrates undergo processes such as positioning, finish cutting, breaking, edge polishing, chamfering, cleaning, edge inspection, grinding width inspection, and size inspection, after which glass substrates that do not pass the test are automatically transported to the scrap area 116 for disposal, while glass substrates that pass the test are transported by conveyor to the surface grinding work area 2 for further processing and production.

[0040] The technical solution of the present invention includes the finish cutting and breaking device 12, the multi-axis edge polishing device 13, the post-edge polishing cleaning device 14, the first edge inspection device 15, the first size measuring device 16 and the grinding width measuring device 17 in the finish cutting and edge polishing work area 1, and these devices can be appropriately combined according to the process sequence to improve the grinding accuracy of each edge of the glass substrate.

[0041] As shown in Figure 3, the glass substrate passes through the finishing cutting and edge polishing work area 1 before undergoing post-processing production. The glass substrates that pass the test are transported by a conveyor to the surface grinding work area 2. According to the size of the glass substrate transported, the equipment in the surface grinding work area 2 automatically switches to the corresponding working position.

[0042] Specifically, in the embodiment shown in FIG. 3, in the surface grinding work area 2, a bonding machine inlet conveyor 21, a first vacuum transfer suction cup 22, a bonding machine device 23, a surface grinding device, a peeling machine device 27, a second vacuum transfer suction cup 28, a post-surface grinding cleaning machine 29, a first surface inspection machine device 210, a final cleaning machine 211, a third surface inspection machine device, a second edge inspection machine device, a second size measurement device, and a thickness measurement device are installed in this order. The glass substrate is transferred onto the application machine entrance conveyor 21 by the automatic transfer device 100, and the application machine entrance conveyor 21 positions the glass substrate.

[0043] The first vacuum transfer suction cup 22 vacuum-sucks the surface of the positioned glass substrate, and moves it to the laminating device 23 .

[0044] The bonding device 23 bonds the glass substrate and the pallet 231 together.

[0045] The surface grinding device usually includes a grinding machine table, which includes an upper grinding machine, a lower pallet fixing platform, and an automatic transfer device. The grinding machine table uses different types of grinding machines and different grinding processes according to the process requirements, and the pallet is transferred by the automatic transfer device. Here, the automatic transfer device is a mechanism for loading the glass substrate on the pallet and transferring it into the surface grinding device, and is connected to the bonding device to transfer the pallet carrying the glass substrate between different types of grinding machines.

[0046] In this embodiment, as shown in Fig. 3, three sets of grinding machine tables are installed, which may be a rough grinding machine 24, a fine grinding machine 25, and a precision grinding machine 26, respectively. In this embodiment, the rough grinding machine 24, the fine grinding machine 25, and the precision grinding machine 26 are arranged in sequence along the direction of the conveyor. In another embodiment, as shown in Fig. 1, the rough grinding machine 24, the fine grinding machine 25, and the precision grinding machine 26 are arranged in parallel, and the glass substrate can be moved to the rough grinding machine 24, the fine grinding machine 25, or the precision grinding machine 26 by an automatic transfer device.

[0047] Where: The rough grinding machine 24 performs a primary grinding of the glass surface to remove large particle defects on the glass substrate surface. The fine grinder 25 performs secondary grinding of the glass surface to remove small particle defects on the glass substrate surface. The precision grinding machine 26 performs tertiary grinding of the glass surface to repair the glass substrate surface. The peeler device 27 separates the glass substrate from the pallet.

[0048] As shown in FIG. 3, the second vacuum transfer suction cup 28 vacuum-sucks the separated glass substrate, and moves it to a cleaning machine 29 after surface grinding.

[0049] After surface grinding, the cleaning machine 29 cleans off particles and remaining grinding fluid on the surface of the glass substrate.

[0050] The first surface inspection device 210 performs automatic inspection and judgment on the glass substrate surface, and classifies the glass substrate into three levels: severely defective, slightly defective, and non-defective. The severely defective products are transferred to the scrap area 116 by the automatic transfer device and discarded, while the slightly defective products are returned to the entrance conveyor 21 of the application machine by the automatic transfer device to be reapplied and ground. For example, as shown in FIG. 3, the slightly defective products can be returned to the entrance conveyor 21 of the application machine by the additional conveyor 212 and reapplied and ground.

[0051] In the embodiment shown in FIG. 3, the final cleaning machine 211 is equipped with several disk roll brushes and several types of chemical cleaning agents for cleaning the glass substrate.

[0052] As shown in FIG. 3, after entering the surface grinding work area 2, the glass substrate is roughly ground, finely ground, and precisely ground by the surface grinding device, and then transferred by the automatic transfer device, and passes through wet zone wetting, tray positioning, peeling, cleaning, and surface inspection in sequence, and is transferred by the automatic transfer device to the first surface inspection device 210 to automatically inspect the glass substrate surface. Based on the surface inspection result, the quality of the ground glass substrate is automatically classified, and the glass substrate with a severely defective quality is transferred by the automatic transfer device to the scrapping area 116 for disposal, the glass substrate with a slightly defective quality is transferred by the automatic transfer device to the bonding machine, where it is bonded and ground again, and the glass substrate with a good quality is transferred by the automatic transfer device to the final cleaning machine 211. The final cleaning machine 211 performs final cleaning and air drying of the glass substrate, and the glass substrate that has been cleaned and air dried is transferred by the automatic transfer device to the final inspection position for final inspection judgment.

[0053] After the glass substrate is ground and cleaned in the surface grinding work area 2, it is transferred to the inspection and packaging work area 3 by an automatic transfer device.

[0054] In the inspection and packing work area 3, a temporary placement inspection table device, a product inspection device, an automatic transfer device, an manual random inspection table, an unloading means, and a product packing means are installed in this order.

[0055] For example, as shown in FIG. 1, the inspection and packing work area 3 includes an inspection area 31, a packing area 32, a scrap area 116, and a mechanical arm 114.

[0056] The product inspection device is installed on a temporary placement inspection table device 310 in the inspection area 31. The product inspection device includes a final edge inspection device 311, a surface inspection device 312, and a thickness / size inspection device 313.

[0057] A product packaging means is installed in the packaging area 32, and glass substrates that pass the product inspection are transferred to the product packaging means, and glass substrates that do not pass the inspection are moved to the scrap area 116 by the unloading means, and are grabbed in the scrap area 116 by, for example, a mechanical arm 114, as shown in FIG. 1 .

[0058] In this embodiment, the glass substrate that has passed the inspection by the first surface inspection device 210 in the surface grinding work area 2 is carried into the inspection and packing work area 3 by the automatic transfer device, and then passes through the temporary placement inspection table device, the product inspection device, and the automatic transfer device. A sampling inspection conveyor connected to the artificial sampling inspection table is installed behind the product inspection device. The product inspection device performs final edge inspection, surface inspection, thickness and size inspection on the product glass substrate, and a fully automatic inspection system is arranged in the product inspection device. Those that are judged to be defective by the inspection are transferred to the unloading means by the automatic transfer device, and the unloading means is arranged with an unloading robot, which may have the mechanical arm 114 shown in FIG. 1. Those that are judged to be non-defective by the inspection are transferred to the product packing means by the automatic transfer device, and the product packing means is arranged with a paper providing robot, a sheet taking robot, and a product packing rack. Finally, the product packing rack is sealed and packed.

[0059] This production line starts from when the glass substrate is formed and annealed, to the post-processing to produce the product, including initial inspection, finish cutting, edge polishing, cleaning after edge polishing, edge inspection, surface grinding, cleaning after surface grinding, final cleaning, final inspection and packaging.

[0060] The above description is only the preferred embodiment of the present invention, and does not limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the scope of protection of the present invention. [Explanation of symbols]

[0061] 1-Finish cutting and edge grinding work area;100-Automatic transfer device;120 Edge grinding area;11-Cold edge cutting device;111-Second surface inspection machine device;112-Thickness inspection machine device;113-Vertical cutting machine device;114-Machine arm;115-Weight measuring device;116-Scrap area;12-Finish cutting and breaking device;13-Multi-axis edge grinding device;131-First edge grinding device;132-Second edge grinding device;14-After edge grinding cleaning device;15-First edge inspection machine device;16-First size measuring device;17-Grinding width measuring device;2-Surface grinding work area area;200-grinding area;220-cleaning area;21-applier entrance conveyor;22-1st vacuum transfer suction cup;23-applier device;231-pallet;24-rough grinder;25-fine grinder;26-precision grinder;27-peeling machine device;28-2nd vacuum transfer suction cup;29-cleaning machine after surface grinding;210-1st surface inspection machine device;211-final cleaning machine;212-additional conveyor;3-inspection and packaging work area;31-inspection area;310-temporary inspection table device;311-final edge inspection device;312-surface inspection device;313-thickness and size inspection device;32-packaging area.

Claims

1. A TFT-LCD float glass substrate processing line having a finishing and edge polishing work area (1), a surface grinding work area (2), and an inspection and packaging work area (3) in this order according to the process characteristics and areas, In the finishing and edge polishing work area (1), the edges of the glass substrates are finished and cleaned, in the surface grinding work area (2), the surfaces of the glass substrates are finished and cleaned, and in the inspection and packaging work area (3), the finished glass substrates are inspected and packaged. In the finish cutting and edge grinding work area (1), a cold end cutting device (11), a finish cutting and breaking device (12), a multi-axis edge grinding device (13), a post-edge grinding cleaning device (14), a first edge inspection device (15), a first size measuring device (16), a grinding width measuring device (17), a lifting conveyor, and a loading rack are installed in this order; In the surface grinding work area (2), a bonding machine inlet conveyor (21), a first vacuum transfer suction cup (22), a bonding machine device (23), a surface grinding device, a peeling machine device (27), a second vacuum transfer suction cup (28), a post-surface grinding cleaning machine (29), a first surface inspection machine device (210), a final cleaning machine (211), a third surface inspection machine device, a second edge inspection machine device, a second size measuring device, and a thickness measuring device are installed in this order, and in the inspection and packaging work area (3), a temporary placement inspection table device, a product inspection device, an automatic transfer device, an manual random inspection table, an unloading means, and a product packaging means are installed in this order. TFT-LCD float method glass substrate processing line.

2. The TFT-LCD float glass substrate processing line according to claim 1, wherein the cold end cutting device (11) comprises: a second side inspection device (111), a thickness inspection device (112), a vertical cutting device (113), a mechanical arm (114), an automatic weight weighing device (115), and a waste area (116).

3. The TFT-LCD float method glass substrate processing line according to claim 2, wherein the second surface inspection device (111) and the thickness inspection device (112) are provided with a fully automatic inspection system, and after the glass substrate is cooled, the second surface inspection device (111) and the thickness inspection device (112) are used to inspect and select whether the glass substrate has a thickness defect, and mark the areas that meet the inspection standard and the areas that do not meet the inspection standard.

4. The TFT-LCD float method glass substrate processing line according to claim 2, wherein the glass substrate is fed into the vertical cutter device (113) by an automatic transfer device, and the vertical cutter device (113) partially cuts the glass substrate into an area that meets the inspection standard and an area that does not meet the inspection standard, and the area that meets the inspection standard of the glass substrate is cut into a desired 8.5 generation / 10.5 generation / 11 generation standard glass substrate semi-finished product by the vertical cutter device (113).

5. The automatic weight measuring device (115) measures the weight of the glass substrate semi-finished products flowing in from the vertical cutter device (113) by the automatic transfer device, and the glass substrate semi-finished products that pass the test automatically flow into the finishing cut and breaking device (12).

6. The TFT-LCD float method glass substrate processing line according to claim 2, wherein the finish cutting / breaking device (12) and the multi-axis edge polishing device (13) identify the size based on the glass substrate information passed from the previous process, and the finish cutting / breaking device (12) and the multi-axis edge polishing device (13) are automatically switched to processing positions corresponding to a plurality of types of sizes such as 8.5 generation / 10.5 generation / 11 generation, etc.

7. 2. The TFT-LCD float method glass substrate processing line according to claim 1, wherein the surface grinding device includes a grinding machine table, the grinding machine table includes an upper grinding machine, a lower pallet fixing platform, and an automatic transfer device, and the grinding machine table is installed in three sets, which are a rough grinding machine (24), a fine grinding machine (25), and a precision grinding machine (26).

8. The TFT-LCD float method glass substrate processing line as claimed in claim 7, wherein the rough grinding machine (24) performs primary grinding on the glass surface to remove large particle defects on the glass substrate surface, the fine grinding machine (25) performs secondary grinding on the glass surface to remove small particle defects on the glass substrate surface, and the precision grinding machine (26) performs tertiary grinding on the glass surface to repair the glass substrate surface.

9. The first surface inspection device (210) performs automatic inspection and judgment on the glass substrate surface, and divides the glass substrate into three levels, namely, major defects, minor defects, and non-defective products, and the major defects are transferred to the scrapping section (116) by the automatic transfer device and discarded, and the minor defects are returned to the bonding machine entrance conveyor (21) by the automatic transfer device, and are bonded and ground again, in the TFT-LCD float method glass substrate processing line as claimed in claim 2.

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