Judgment method and writing method

Abstract

To determine whether a grinding stone tool and a processing condition are suitable for processing an object to be processed on the basis of processing information.SOLUTION: A determination method for determining the suitability of a grinding stone tool or a processing condition executes processing according to the processing condition using the grinding stone tool, writes the processing information including information on an object to be processed, the processing condition, and the consumption of the grinding stone tool in processing the object to be processed into an IC tag disposed in the grinding stone tool or a case for housing the grinding stone tool, reads the processing information written in the IC tag, specifies a consumption tendency of the grinding stone tool from a relation between a cumulative processing amount of the object to be processed obtained from the processing information and a cumulative consumption of the grinding stone tool corresponding to the cumulative processing amount and creates consumption tendency information, and determines the suitability of the grinding stone tool or the processing condition to the object to be processed on the basis of the consumption tendency information.SELECTED DRAWING: Figure 8

Description

[Technical field]

[0001] The present invention relates to a method for writing processing information about processing performed with a grinding tool such as a cutting blade or a grinding wheel into an IC tag, and a method for determining the suitability of the grinding tool or processing conditions based on the processing information. [Background technology]

[0002] In the manufacturing process of device chips to be incorporated into electronic devices, a plate-shaped workpiece, such as a semiconductor wafer or a resin package substrate, is cut and divided into individual pieces by a cutting device equipped with an annular cutting blade (see Patent Document 1). The cutting device is equipped with a cutting blade called a hub type, which includes an annular base made of aluminum or the like and a grinding wheel portion fixed to the outer periphery of the base, and is used to cut the workpiece. In addition, in order to obtain thin device chips, the workpiece before being divided into individual pieces is ground by a grinding device equipped with a grinding wheel. A grinding wheel with grinding wheels arranged in a ring shape on one side is attached to the grinding device.

[0003] In processing devices such as cutting devices and grinding devices, various types of workpieces are processed. There are various types of grinding tools such as cutting blades and grinding wheels corresponding to various types of workpieces, and an appropriate type of grinding tool that matches the type of workpiece is pre-mounted on the processing device. In the processing device, the workpiece is processed with the grinding tool under predetermined processing conditions corresponding to the type of workpiece. When switching the type of workpiece or when a problem occurs with the processing device, the old grinding tool is removed from the processing device and a new grinding tool is mounted on the processing device.

[0004] The old grinding tool removed from the processing device is stored in a case. At this time, it is desirable to manage the usage history of the grinding tool in preparation for reuse or verification. For example, a cutting blade or a blade case incorporating an IC tag capable of registering the usage history information of the cutting blade is used (see Patent Documents 2 and 3). When the cutting blade is reused in the cutting device, the usage history information is read from the IC tag, and the height of the cutting blade is adjusted according to the usage status of the cutting blade.

[0005] When processing a new type of workpiece that has not been processed before with a processing device, it is necessary to find the optimal type of grinding tool and processing conditions that can process the workpiece with high quality. For this reason, test processing is performed with the processing device while changing the type of grinding tool and the processing conditions in various ways, and the processing results are evaluated. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Japanese Unexamined Patent Publication No. 62-53804 [Patent Document 2] JP 2006-51596 A [Patent Document 3] JP 2016-64476 A Summary of the Invention [Problem to be solved by the invention]

[0007] In recent years, the uses of device chips have become more diverse, and a wide variety of device chips for each use are being manufactured one after another. Therefore, test processing is repeated every day to find the optimal processing conditions, etc., but there are cases where it is not possible to secure a sufficient number of dummy items that can be used as workpieces during test processing, or where sufficient time cannot be spent on test processing. In such cases, mass production of device chips will begin without sufficient verification of the type of grinding tool and processing conditions.

[0008] If device chips are manufactured by processing workpieces using grinding tools and processing conditions selected without sufficient verification, and these device chips are released to the market, there is a risk that they will cause large-scale quality defects. Moreover, in recent years, there has been a remarkable trend toward higher functionality in devices, and the quality required for device chips has also tended to be higher, making it increasingly difficult to optimize processing conditions.

[0009] The present invention has been made in consideration of such problems, and its object is to provide a determination method that can determine whether a grinding tool and processing conditions are appropriate for processing a workpiece based on processing information, and a writing method that writes the processing information into an IC tag. [Means for solving the problem]

[0010] According to one aspect of the present invention, there is provided a method for determining whether a grinding tool or processing conditions are appropriate, the method comprising the steps of: performing processing using the grinding tool in accordance with the processing conditions; and storing information on a workpiece processed by the grinding tool and information on the processing result of the workpiece processed by the grinding tool in an IC tag disposed on the grinding tool or a case housing the grinding tool. was referred to a writing step of writing a plurality of pieces of processing information of the grinding tool, each of which includes the processing conditions and the wear amount of the grinding tool when the workpiece is processed; reading out the processing information written in the IC tag in the writing step, and specifying a wear tendency of the grinding tool from a relationship between an accumulated processing amount of the workpiece obtained from the processing information and an accumulated wear amount of the grinding tool corresponding to the accumulated processing amount, thereby outputting wear tendency information. Using an information processing terminal a wear tendency information creating step of creating a wear tendency information, and a determination of suitability of the grinding tool or the processing conditions for the workpiece based on the wear tendency information created in the wear tendency information creating step. Using the information processing terminal A determination method is provided, comprising the steps of:

[0011] According to another aspect of the present invention, there is provided a method for writing processing information of a grinding tool to an IC tag, the method comprising: performing processing using the grinding tool according to processing conditions; and storing information on a workpiece processed by the grinding tool and information on a processing result of the workpiece being processed by the grinding tool in an IC tag disposed on the grinding tool or a case for housing the grinding tool. was referred to There is provided a writing method for writing processing information of the grinding tool, the information including the processing conditions and the wear amount of the grinding tool when the workpiece is processed.

[0012] According to yet another aspect of the present invention, there is provided a method for determining whether a grinding tool or processing conditions are appropriate, the method comprising the steps of: was referred to The grinding tool includes processing conditions and a wear amount of the grinding tool when the workpiece is processed. The processing information is written on an IC tag disposed on the grinding tool or on a case for accommodating the grinding tool. The processing information is read out, and a wear tendency of the grinding tool is specified based on a relationship between an accumulated processing amount of the workpiece obtained from the processing information and an accumulated wear amount of the grinding tool corresponding to the accumulated processing amount, thereby obtaining wear tendency information. Using an information processing terminal a wear tendency information creating step of creating a wear tendency information, and a determination of suitability of the grinding tool or the processing conditions for the workpiece based on the wear tendency information created in the wear tendency information creating step. Using the information processing terminal A determination method is provided, comprising the steps of:

[0013] Preferably, in the wear tendency information creating step, a graph showing the wear tendency of the grinding tool is created.

[0014] Preferably, in the determining step, the determination is made by comparing the wear tendency information with reference wear tendency information regarding a reference wear tendency of the grinding tool.

[0015] And more preferably, in the consumption trend information creation step, a graph that functions as the consumption trend information is created, and in the judgment step, the judgment is made by comparing the graph with a reference graph that functions as the reference consumption trend information.

[0016] Also preferably, the abrasive tool is a cutting blade. Effect of the Invention

[0017] In the judgment method and writing method according to one aspect of the present invention, a grinding tool with an IC tag or a case with an IC tag is used. Processing information including information on the processed workpiece and the wear amount of the grinding tool as well as the processing conditions performed is written and stored in the IC tag. Then, by reading out the stored processing information from the IC tag, the appropriateness of the grinding tool and the processing conditions can be evaluated.

[0018] Therefore, even if mass production of device chips is started without sufficient test processing, the grinding tool and processing conditions can be evaluated and improved while the production of device chips is proceeding, thereby reducing the risk of quality defects in the device chips.

[0019] Therefore, according to one aspect of the present invention, a determination method is provided that can determine whether a grinding tool and processing conditions are appropriate for processing a workpiece based on processing information, and a writing method is provided that writes the processing information to an IC tag. [Brief description of the drawings]

[0020] [Figure 1] FIG. 2 is a diagram illustrating a configuration example of a cutting device. [Diagram 2] FIG. 2 is an exploded perspective view showing a schematic configuration example of a cutting unit. [Diagram 3] FIG. 2 is a perspective view showing a schematic configuration example of a blade case. [Figure 4] FIG. 2 is a plan view illustrating a schematic configuration example of a blade case. [Diagram 5]FIG. 2 is a perspective view showing a schematic configuration example of a blade case holder. [Figure 6] FIG. 6(A) is a perspective view that shows a schematic diagram of the blade edge position detection unit, and FIG. 6(B) is a side view that shows a schematic diagram of the blade edge detection unit. [Figure 7] FIG. 7(A) is a graph showing a schematic example of the relationship between the machining distance of a cutting blade and the remaining amount of the cutting edge, and FIG. 7(B) is a graph showing a schematic example of another relationship between the machining distance of a cutting blade and the remaining amount of the cutting edge. [Figure 8] 11 is a graph showing a schematic trend of a decrease in the remaining amount of the cutting edge. [Figure 9] 4 is a flowchart showing the flow of each step of a determination method according to the embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0021] An embodiment of the present invention will be described with reference to the accompanying drawings. First, a cutting device, which is a processing device to which a cutting blade is attached and used as a grinding tool, will be described. Fig. 1 is a perspective view showing a schematic configuration example of a cutting device (processing device) 2.

[0022] The workpiece processed by the cutting device 2 is, for example, a substantially disk-shaped wafer made of Si (silicon), SiC (silicon carbide), GaN (gallium nitride), GaAs (gallium arsenide), or other semiconductor material. Alternatively, the workpiece is a plate-shaped substrate made of a material such as sapphire, quartz, glass, or ceramics. The glass is, for example, alkali glass, non-alkali glass, soda-lime glass, lead glass, borosilicate glass, quartz glass, or the like.

[0023] For example, a plurality of devices such as ICs (Integrated Circuits) and LSIs (Large Scale Integrations) are formed on the surface of the workpiece. Planned division lines are set between the devices on the workpiece. Then, the workpiece is cut along the planned division lines by a cutting device 2 to divide the workpiece, thereby forming individual device chips. Note that, by using a grinding device equipped with a grinding wheel having grinding stones (grinding tools) arranged in a ring shape, the workpiece before being divided is thinned, and thin device chips are finally obtained.

[0024] The workpiece is, for example, attached onto a tape attached to the annular frame, and is handled as a part of a frame unit 11 integrated with the annular frame. FIG. 1 includes a perspective view showing a schematic of the frame unit 11. When the workpiece is handled using the annular frame and tape, the workpiece can be protected from shocks that occur during transportation. Furthermore, when the tape is expanded, the intervals between each chip formed by dividing the workpiece can be increased, making it easier to pick up the chips.

[0025] In the following, a cutting device 2 is a processing device equipped with a grinding tool for processing a workpiece, and a cutting blade 8 is used as a grinding tool to process the workpiece, but the processing device and grinding tool are not limited to this. The cutting device (processing device) 2 is equipped with a base 4 that supports each component. A cover 6 that covers the base 4 is provided above the base 4. A space is formed inside the cover 6, and a cutting unit 10 including a cutting blade (grinding tool) 8 is housed therein. The cutting unit 10 moves in the front-rear direction (Y-axis direction, indexing feed direction) by a cutting unit moving mechanism (not shown).

[0026] A chuck table 12 that suction-holds a workpiece is provided below the cutting unit 10. The chuck table 12 moves in the left-right direction (X-axis direction, processing feed direction) by a chuck table moving mechanism (not shown) and rotates around a vertical axis (Z-axis) by a rotation mechanism (not shown).

[0027] A cassette elevator 14 is disposed at a corner of the base 4. A cassette 16 capable of accommodating a plurality of workpieces is placed on the upper surface of the cassette elevator 14. The cassette elevator 14 is configured to be capable of ascending and descending, and adjusts the position of the cassette 16 in the height direction (Z-axis direction) so that the workpieces can be carried in and out.

[0028] A touch panel monitor 18 serving as a user interface is provided on the front surface 6a of the cover 6. A blade case holder 20 is disposed on the side surface 6b of the cover 6. The blade case holder 20 will be described in detail later.

[0029] The monitor 18 is connected to a control unit 22 that controls each part of the cutting device 2. The control unit 22 controls the operations of the cutting unit 10, the cutting unit moving mechanism, the chuck table 12, the chuck table moving mechanism, etc., based on the processing conditions, etc., set via the monitor 18.

[0030] The control unit 22 is composed of a computer including, for example, a processing device such as a processor represented by a CPU (Central Processing Unit), a main memory device such as a DRAM (Dynamic Random Access Memory), an SRAM (Static Random Access Memory), or a ROM (Read Only Memory), and an auxiliary memory device such as a flash memory, a hard disk drive, or a solid state drive.

[0031] The auxiliary storage device stores software including a predetermined program. By operating the processing device according to this software, the control unit 22 functions as a concrete means in which the software and the processing device (hardware resource) work together. The auxiliary storage device functions as a storage unit 22a that stores software and various information.

[0032] Fig. 2 is an exploded perspective view showing a schematic configuration example of the cutting unit 10. Note that some of the components of the cutting unit 10 are omitted in Fig. 2. As shown in Fig. 2, the cutting unit 10 includes a spindle 26 rotatably supported in a spindle housing 24.

[0033] A flange mechanism 28 for fixing the cutting blade 8 is attached to the tip of the spindle 26. The flange mechanism 28 is composed of a flange portion 30 extending radially outward and a boss portion 32 protruding from the surface (front surface) of the flange portion 30.

[0034] A fitting portion (not shown) that fits with the tip of the spindle 26 is formed on the back surface (rear surface) of the flange portion 30. When the tip of the spindle 26 is fitted into this fitting portion and the bolt 34 is tightened, the flange mechanism 28 is fixed to the spindle 26.

[0035] The cutting blade 8 is a so-called hub blade, and a ring-shaped grindstone portion (cutting blade) 38 is fixed to the outer periphery of a disk-shaped support base 36. An opening 36a through which the boss portion 32 of the flange mechanism 28 is inserted is formed in the center of the support base 36. The cutting blade 8 is attached to the flange mechanism 28 by inserting the boss portion 32 into this opening 36a.

[0036] The support base 36 is formed of a metal material such as aluminum or stainless steel. The grindstone unit 38 is formed on the outer periphery of the support base 36 by a method such as electrolytic plating. The grindstone unit 38 may be provided with an IC tag 52a that stores processing information received in a non-contact (wireless) manner and transmits the stored processing information in a non-contact (wireless) manner. The IC tag 52a may also be referred to as a wireless IC tag, an RFID tag, or the like.

[0037] The grindstone portion 38 is formed in an annular shape by mixing abrasive grains such as diamond or CBN with a binding material such as vitrified, resinoid, or metal (typically nickel). Note that, in this embodiment, a hub blade is described as the cutting blade 8, but a so-called washer blade consisting of only the grindstone portion may also be used.

[0038] With the cutting blade 8 attached to the flange mechanism 28, an annular fixing ring 40 is attached to the tip of the boss portion 32. As a result, the cutting blade 8 is clamped between the flange mechanism 28 and the fixing ring 40.

[0039] The cutting unit 10 is provided with a reader / writer (not shown) for reading out processing information from the IC tag 52a provided on the cutting blade 8 and for writing the processing information to the IC tag 52a. This reader / writer is disposed at a position corresponding to the IC tag 52a of the cutting blade 8 attached to the flange mechanism 28, and is connected to the control unit 22.

[0040] Next, a blade case for housing a cutting blade 8 will be described as a case for housing a grinding tool, but the case is not limited to a blade case and may be configured to accommodate a grinding tool to be housed. Fig. 3 is a perspective view showing a typical configuration example of a blade case for housing a cutting blade 8, and Fig. 4 is a plan view showing a typical configuration example of a blade case. As shown in Fig. 3, a blade case 42 includes a housing section 44 for housing the cutting blade 8 and a lid section 46 for preventing the cutting blade 8 housed in the housing section 44 from falling off.

[0041] The storage section 44 and the lid section 46 are semi-rectangular plate-like members with two adjacent corners cut out in an arc shape, and are connected to each other by a connecting section 48 (FIG. 4) provided on the outer periphery on the side not cut out. The connecting section 48 functions as a hinge that opens and closes the lid section 46 with respect to the storage section 44. A claw section 50 is formed on the outer periphery on the side opposite the connecting section 48.

[0042] A cylindrical protrusion 44a is formed on the inner surface of the storage section 44 facing the lid section 46. The cutting blade 8 can be stored in the blade case 42 by inserting this protrusion 44a into the opening 36a of the cutting blade 8 and closing the lid section 46.

[0043] 4, an IC tag 52b that stores processing information received in a non-contact (wireless) manner and transmits the stored processing information in a non-contact (wireless) manner may be provided on the connecting portion 48 side of the lid portion 46. The IC tag 52b may be provided in the storage portion 44.

[0044] 5 is a perspective view that shows a schematic configuration example of the blade case holder 20. The blade case holder 20 is used, for example, to hold the blade case 42 that has become empty after the cutting blade 8 has been attached.

[0045] 5, the blade case holder 20 includes a holding portion 20b with a slit-shaped opening through which the blade case 42 is inserted. A support portion 20c is disposed below the holding portion 20b, which supports from below the claw portion 50 side of the blade case 42 inserted into the holding portion 20b. A cutout portion 20d that is cut out to correspond to the claw portion 50 is formed in the support portion 20c.

[0046] Moreover, the blade case holder 20 has a groove 20a that corresponds to a protrusion 46a (FIG. 4) formed on the outer surface of the lid portion 46. The blade case 42 is inserted into the holding portion 20b with the claw portion 50 facing downward so that the protrusion 46a slides along the groove 20a.

[0047] A reader / writer (read / write means) 54 is provided in the groove 20a for reading out processing information from an IC tag 52b provided on the blade case 42 and for writing the processing information to the IC tag 52b. The reader / writer 54 is disposed at a position corresponding to the IC tag 52b of the blade case 42 held by the blade case holder 20, and is connected to the control unit 22. The reader / writer 54 includes an antenna for transmitting and receiving processing information.

[0048] Continuing with the explanation of the cutting device 2. When cutting a workpiece, the cutting blade 8 is removed from the blade case 42, and the cutting blade 8 is fixed to the tip of the spindle 26 by the flange mechanism 28. At this time, it is preferable that the blade case 42 is housed in the blade case holder 20 and stored.

[0049] Then, the frame unit 11 is held by the chuck table 12. After that, the cutting blade 8 is rotated by rotating the spindle 26, and the cutting unit 10 is lowered to a predetermined height position. Then, the chuck table 12 is moved along the processing feed direction, and the grinding wheel portion 38 of the rotating cutting blade 8 is caused to cut into the workpiece, thereby cutting the workpiece.

[0050] When the cutting blade 8 is repeatedly used to cut a workpiece, the grindstone portion 38 of the cutting blade 8 is worn away, and the diameter of the cutting blade 8 gradually decreases. At this time, the height position of the lower end of the grindstone portion 38 of the cutting blade 8 gradually rises.

[0051] Therefore, a setup process is periodically performed after cutting the workpiece with the cutting blade 8 so that the lower end of the grindstone part 38 of the cutting blade 8 can be positioned at a height suitable for cutting. In the setup process, a reference height of the cutting unit 10 is detected, which is the height position of the cutting unit 10 when the height of the lower end of the grindstone part 38 of the cutting blade 8 is positioned at a predetermined position suitable for cutting the workpiece. The setup process is also performed when the cutting blade 8 is attached to the cutting unit 10.

[0052] Fig. 6(A) is a perspective view showing a cutting edge position detection unit 56 used when performing the setup process. Fig. 6(B) is a conceptual diagram showing the cutting unit 10, the cutting edge position detection unit 56, and the control unit 22. The cutting edge position detection unit 56 is disposed near the cutting unit 10.

[0053] A groove-shaped blade entry portion 60 that opens upward is provided on the main body 58 of the cutting edge position detection unit 56. When using the cutting edge position detection unit 56, the cutting blade 8 is positioned above the blade entry portion 60, and the cutting blade 8 is lowered to enter the blade entry portion 60.

[0054] A light-emitting unit 62 is provided on one side wall of the blade entry portion 60, and a light-receiving unit 64 is provided on the other side wall of the blade entry portion 60 at a position facing the light-emitting unit 62. In other words, the light-emitting unit 62 and the light-receiving unit 64 face each other across the blade entry portion 60. The light-emitting unit 62 includes a light-emitting window 62b and a light source 62a connected to the light-emitting window 62b via an optical fiber or the like, and when the light source 62a is activated, light is emitted from the light-emitting window 62b.

[0055] The light receiving section 64 includes a light receiving window 64b and a photoelectric conversion section 64a connected to the light receiving window 64b via an optical fiber or the like. The light reaching the light receiving window 64b is received by the photoelectric conversion section 64a, and an electrical signal having a voltage value according to the amount of received light is output from the photoelectric conversion section 64a. The photoelectric conversion section 64a is electrically connected to the control unit 22 and sends the electrical signal to the control unit 22.

[0056] The light-emitting window 62b and the light-receiving window 64b are provided at approximately the same height position. This height position is the height position near the lower end of the grinding wheel portion 38 of the cutting blade 8 when the cutting unit 10 is positioned at a reference position suitable for cutting. The cutting edge position detection unit 56 is provided with an openable cover 58a that protects the light-emitting portion 62 and the light-receiving portion 64 when the cutting edge position detection unit 56 is not in use. When using the cutting edge position detection unit 56, the cover 58a is opened in advance to expose the main body 58.

[0057] When the cutting edge position detection unit 56 detects the height position of the lower end of the grinding wheel portion 38 of the cutting blade 8, the light source 62a is operated to emit light from the light emitting window 62b, the light is irradiated onto the light receiving window 64b of the light receiving unit 64, and the light is received by the photoelectric conversion unit 64a connected to the light receiving window 64b. The photoelectric conversion unit 64a includes a light receiving element such as a CMOS sensor or a CCD sensor, converts the light into an electrical signal with a voltage value according to the amount of received light, and sends the electrical signal to the control unit 22.

[0058] When the cutting blade 8 is lowered toward the blade entry portion 60, the light emitted from the light emitting window 62b is gradually blocked by the cutting blade 8, and the amount of light received by the photoelectric conversion unit 64a after reaching the light receiving window 64b gradually decreases. Therefore, by analyzing the electrical signal output from the photoelectric conversion unit 64a by the control unit 22, the height position of the lower end of the grinding wheel portion 38 of the cutting blade 8 can be detected.

[0059] When it can be confirmed that the lower end of the grindstone portion 38 has reached a height position suitable for cutting based on the amount of light received by the photoelectric conversion portion 64a, it is confirmed that the cutting unit 10 has reached a predetermined height position to be positioned at during cutting, i.e., a reference height. The control unit 22 controls the lifting unit 10a that raises and lowers the cutting unit 10 and the cutting edge position detection unit 56 to detect the reference height position of the cutting unit 10.

[0060] When the workpiece is cut by the cutting blade 8, the grindstone portion 38 wears down and its diameter becomes smaller. Therefore, if a setup process is performed before and after cutting the workpiece, it is possible to measure the change in the reference height of the cutting unit 10 according to the amount of wear of the grindstone portion 38. Conversely, if the setup process is performed before and after cutting the workpiece using the cutting edge position detection unit 56, it is possible to measure the amount of wear of the grindstone portion 38.

[0061] In the cutting device 2, various types of workpieces are cut under suitable processing conditions. Also, there are various types of cutting blades 8 to accommodate various types of workpieces. In the cutting device 2, an appropriate type of cutting blade that matches the type of workpiece is selected and pre-attached, and processing is performed under suitable processing conditions.

[0062] When switching the type of workpiece or when a problem occurs with the cutting device 2, the old cutting blade 8 is removed from the cutting device 2 and a new cutting blade 8 is attached to the cutting device 2. The old cutting blade 8 removed from the cutting device 2 is stored in the blade case 42. At this time, it is desirable to manage the usage history of this cutting blade 8 in preparation for reuse or verification. For example, the total wear amount of the grinding wheel unit 38 at that time is written to the IC tags 52a and 52b.

[0063] When the old cutting blade 8 temporarily stored in the blade case 42 is reused in the cutting device 2, the total wear amount stored in the IC tags 52a, 52b is read out. Then, when the cutting blade 8 is reused and stored again in the blade case 42, a new total wear amount calculated by adding the wear amount of the grinding wheel portion 38 during this reuse to the total wear amount stored in the IC tags 52a, 52b is overwritten in the IC tags 52a, 52b.

[0064] Incidentally, when cutting a new type of workpiece with the cutting device 2 to manufacture a new type of device chip, it is necessary to find the optimum type of cutting blade 8 and processing conditions that can divide the workpiece with high quality. For this reason, test processing is performed with the cutting device 2 while changing various types of cutting blade 8 and processing conditions, and the processing results are evaluated.

[0065] In recent years, the uses of device chips have become more diverse, and a wide variety of device chips corresponding to each use are being manufactured one after another. Therefore, test processing is repeated every day to find the optimal processing conditions, etc., but there are cases where it is not possible to secure a sufficient number of dummy items that can be used as workpieces during test processing, or where sufficient time cannot be spent on test processing. In such cases, mass production of device chips will begin without sufficient verification of the type of cutting blade 8 and the processing conditions.

[0066] If a workpiece is cut using the cutting blade 8 and processing conditions selected without sufficient verification to produce a device chip, and the device chip is released to the market, there is a risk of causing a large-scale quality defect problem. Moreover, in recent years, there has been a remarkable trend toward higher functionality in devices, and the quality required for device chips has also tended to be higher, making it increasingly difficult to optimize the processing conditions.

[0067] Therefore, it is conceivable to accumulate processing information while cutting the workpiece, and judge the suitability of the cutting blade and processing conditions based on the processing information. In this case, since the processing conditions can be optimized by actually processing the workpiece and evaluating the results, it is possible to pursue processing conditions that can process the workpiece with high quality even when it is not possible to prepare a sufficient number of dummy items that imitate the workpiece. The judgment method and writing method according to this embodiment will be described in detail below.

[0068] 9 is a flowchart showing the flow of each step of the determination method according to this embodiment. First, the cutting blade 8 is removed from the blade case 42, and the cutting blade 8 is attached to the tip of the spindle 26 by the flange mechanism 28 of the cutting unit 10. The empty blade case 42 may be stored in the blade case holder 20.

[0069] When the blade case 42 provided with the IC tag 52b is housed in the blade case holder 20, the IC tag 52b is disposed in the vicinity of the reader / writer 54, making it possible to write information to the IC tag 52b and read information from the IC tag 52b. Alternatively, when the cutting blade 8 is provided with the IC tag 52a, a reader / writer (not shown) is provided in the vicinity of the cutting blade 8 incorporated in the cutting unit 10. This makes it possible to write and read information to the IC tag 52a.

[0070] Thereafter, the cutting edge position detection unit 56 (see FIG. 6(A)) is used to measure the reference height of the cutting unit 10 when the lower end of the grinding wheel portion 38 of the cutting blade 8 reaches a predetermined height position. As described below, when the cutting edge position detection unit 56 is used to measure the reference height of the cutting unit 10 after cutting of the workpiece is completed, the amount of change in the reference height before and after cutting can be calculated as the amount of wear of the grinding wheel portion 38.

[0071] After the setup (S10) is performed, the workpiece is held on the chuck table 12, and cutting is performed according to the processing conditions using the cutting blade 8 (S20). The processing conditions to be referred to when cutting the workpiece are registered in advance in the memory section 22a of the control unit 22.

[0072] Here, the machining conditions include various items such as the rotation speed of the cutting blade 8, the relative feed speed of the cutting unit 10 and the chuck table 12, the supply amount of cutting fluid, etc. It is desirable that optimal machining conditions are registered in advance in the storage unit 22a according to the type of workpiece and the desired machining results. In the judgment method according to this embodiment, the suitability of the machining conditions can be judged while cutting the workpiece, so that the contents of the machining conditions can be appropriately changed depending on the judgment result. Alternatively, the machining conditions to be verified are registered in the storage unit 22a.

[0073] When cutting the workpiece held by the chuck table 12, the chuck table 12 is rotated so that the direction of the planned dividing line of the workpiece is aligned with the processing feed direction of the chuck table 12, etc. Then, the grindstone portion 38 of the cutting blade 8 is positioned on an extension of the planned dividing line. Then, the cutting blade 8 is rotated at a predetermined rotation speed in accordance with the processing conditions, the cutting unit 10 is positioned at a predetermined height position, and the chuck table 12, etc. are processed and fed to cause the grindstone portion 38 of the cutting blade 8 to cut into the workpiece.

[0074] After cutting the workpiece along all of the planned dividing lines, the machined workpiece is removed from the chuck table 12, a new workpiece is held by the chuck table 12, and cutting is performed in the same manner. When cutting of the workpiece is repeated, the grindstone portion 38 of the cutting blade 8 gradually wears out, and the abrasive grains fall off. However, as the binder wears out, the abrasive grains buried in the binder are exposed one after another and come into contact with the workpiece, so the cutting ability of the cutting blade 8 is maintained.

[0075] However, if the processing conditions or the type of cutting blade 8 are not suitable for the intended processing, the wear rate of the grindstone portion 38 slows down, new abrasive grains are exposed more slowly, and the cutting ability of the cutting blade 8 decreases, making it impossible to perform high-quality processing. This condition is also called the dulling of the cutting blade 8.

[0076] Alternatively, if the processing conditions or the type of cutting blade 8 are not suitable for the intended processing, the wear rate of the grindstone portion 38 will be too fast, generating a large amount of debris, which will then become clogged between the abrasive grains, reducing the cutting ability of the cutting blade 8 and making it impossible to perform high-quality processing. This condition is also called clogging of the cutting blade 8.

[0077] Conversely, by checking the wear state of the grindstone portion 38 of the cutting blade 8 after cutting has been performed, it is possible to judge the suitability of the processing conditions and the type of cutting blade 8. Therefore, after cutting of one or more workpieces is completed, the wear amount of the grindstone portion 38 is measured using the blade position detection unit 56 (S30).

[0078] More specifically, the height position of the cutting unit 10 when the lower end of the grinding wheel portion 38 of the cutting blade 8 after cutting is located at a predetermined height is detected as a reference height position, and the amount of change in the reference height position of the cutting unit 10 before and after cutting is calculated as the amount of wear of the grinding wheel portion 38.

[0079] Thereafter, cutting of the workpiece using the cutting blade 8 may be resumed. When the reference height position of the cutting unit 10 is detected again, the cutting blade 8 is positioned at a height position suitable for cutting according to the wear state of the grinding wheel part 38. When the wear amount of the cutting blade 8 exceeds a specified value and the cutting blade 8 has reached the end of its life, the cutting blade 8 is removed from the cutting unit 10 and replaced with a new cutting blade 8. Alternatively, the cutting blade 8 may be replaced when changing the workpiece or the cutting process.

[0080] Next, a writing step S40 is performed in which processing information is written to the IC tags 52a, 52b arranged on the cutting blade 8 or the blade case 42. The processing information is information that indicates the details of cutting of the workpiece performed using the cutting blade 8. More specifically, the processing information includes information on the workpiece cut by the cutting blade 8, the processing conditions under which the workpiece was cut by the cutting blade 8, and the amount of wear of the cutting blade 8 when the workpiece was processed.

[0081] The processing information is created, for example, every time the cutting edge position detection unit 56 detects the reference height position of the cutting unit 10. For example, the processing information is written to the IC tags 52a, 52b and accumulated every time it is created. Alternatively, the processing information is stored in the memory unit 22a of the control unit 22 every time it is created, and when the cutting blade 8 is replaced, a plurality of pieces of processing information stored in the memory unit 22a are collectively written to the IC tags 52a, 52b.

[0082] Here, if the only purpose is to manage the lifespan (remaining cutting edge) of the cutting blade 8 during use, it is sufficient to write the wear amount of the grindstone part 38 to the IC tags 52a and 52b as usage history information. In particular, what is needed to calculate the remaining cutting edge amount is the total wear amount of the grindstone part 38, and information on the transition of the remaining cutting edge amount during use of the cutting blade 8 is not needed. Therefore, if the wear amount of the grindstone part 38 has been saved in the IC tags 52a and 52b, the new wear amount of the grindstone part 38 can be added to the saved information and saved by overwriting it.

[0083] Furthermore, if processing conditions that can stably process a workpiece have been established, and it is desired to analyze the cause of a malfunction that occurs in the workpiece or the cutting device 2 when processing the workpiece under these processing conditions, it is not necessary to record these established processing conditions. For example, it is sufficient to record usage history information other than the processing conditions, such as the amount of wear of the grinding wheel portion 38 of the cutting blade 8, the date and time when the cutting blade 8 was used, the cutting device 2 to which the cutting blade 8 is attached, and the name of the operator who attached the cutting blade 8 to the cutting device 2.

[0084] In contrast, in the determination method according to the present embodiment, in addition to the wear amount and usage history information of the cutting blade 8, processing information including the processing conditions in cutting performed using the cutting blade 8 is recorded and accumulated in the IC tags 52a and 52b. Therefore, by reading and analyzing the processing information recorded in the IC tags 52a and 52b, it is possible to later determine whether the processing conditions, etc. are appropriate.

[0085] After removing the cutting blade 8 from the cutting unit 10, the blade case 42 that was housed in the blade case holder 20 is taken out, and the cutting blade 8 is housed in this blade case 42. Then, in order to verify the processing conditions of the cutting performed by the cutting blade 8, an information processing terminal such as a PC connected to a reader / writer capable of communicating with the IC tags 52a, 52b to send and receive information is prepared.

[0086] Next, a read step S50 is performed in which the processing information written in the IC tags 52a and 52b is read using this information processing terminal. In the read step S50, the processing information written in the IC tags 52a and 52b in the write step S40 is read, and preparations are made for analyzing the wear tendency of the cutting blade 8.

[0087] This information processing terminal then carries out a wear trend information creating step S60. In the wear trend information creating step S60, the wear trend of the cutting blade 8 is identified from the relationship between the cumulative machining distance (cumulative machining amount) of the workpiece obtained from the machining information and the cumulative wear amount of the cutting blade 8 corresponding to the cumulative machining distance (cumulative machining amount), and wear trend information is created.

[0088] Thereafter, this information processing terminal is further used to carry out a judgment step S70 in which the suitability of the cutting blade 8 or the processing conditions for the workpiece is judged based on the wear tendency information created in the wear tendency information creation step S60.

[0089] Hereinafter, an example of a procedure for determining the suitability of the cutting blade 8 and the processing conditions based on the processing information read from the IC tags 52a and 52b in the reading step S50 will be described. For example, in the wear tendency information creating step S60, a graph showing the wear tendency of the cutting blade 8 is created based on the processing information read from the IC tags 52a and 52b.

[0090] 7(A) and 7(B) are examples of graphs showing the wear tendency of the cutting blade 8. The horizontal axis of the graph shown in FIG. 7 shows the cumulative machining distance (cumulative machining amount) of the workpiece, and the vertical axis of this graph shows the remaining amount of the cutting edge of the grindstone portion 38 of the cutting blade 8. The remaining amount of the cutting edge can be calculated by subtracting the cumulative wear amount of the cutting blade 8 corresponding to the cumulative machining distance of the workpiece from the initial remaining amount of the cutting edge of the grindstone portion 38 of the cutting blade 8. In other words, this graph can also be said to be a graph showing the relationship between the cumulative machining distance (cumulative machining amount) and the cumulative wear amount.

[0091] Each point in the graphs shown in Figures 7(A) and 7(B) represents the cumulative wear amount of the grindstone portion 38 of the cutting blade 8 at the time when the wear amount of the grindstone portion 38 of the cutting blade 8 is measured while the cutting of the workpiece is being performed with the cutting blade 8, and the cumulative machining distance machined by the cutting blade 8 up to the time of measurement. The dashed lines in the graphs shown in Figures 7(A) and 7(B) represent straight lines approximating each point. Both graphs each represent the wear tendency of the cutting blade 8 when cutting the same type of workpiece without changing the machining conditions.

[0092] In addition, since the scales of the vertical and horizontal axes of both graphs are not the same, it is meaningless to simply compare the apparent slopes of the two approximation lines. Comparing the two graphs on this basis, it is understood that the points of the graph shown in Figure 7(A) do not deviate significantly from the approximation line, and the variation in the wear tendency of the grindstone part 38 is relatively small. On the other hand, the points of the graph shown in Figure 7(B) deviate significantly from the approximation line, and it is understood that there is a relatively large variation in the wear tendency of the grindstone part 38.

[0093] Here, in the graph shown in Fig. 7(B), there is an area where the cutting edge remaining amount seems to increase when the cumulative machining distance of the cutting blade 8 increases. One possible cause of this is the effect of detection errors of the cutting edge position detection unit 56. Another possible cause is that the preliminary machining operation (idling) at the start of machining is insufficient, and the temperature of the cutting blade 8 changes during machining, causing the cutting blade 8 to thermally expand and contract.

[0094] When the wear tendency of the grindstone portion 38 of the cutting blade 8 is as shown in Fig. 7(A), it is considered that the workpiece can be cut stably and with high quality. In this case, it can be determined that the cutting blade 8 and the processing conditions are suitable for the workpiece. On the other hand, when the wear tendency of the grindstone portion 38 of the cutting blade 8 is as shown in Fig. 7(B), it is considered that the workpiece cannot be cut stably and with high quality. In this case, it can be determined that the cutting blade 8 or the processing conditions are not suitable for the workpiece.

[0095] Furthermore, the suitability of the cutting blade 8 and the processing conditions can be judged not only from the variation in the wear tendency of the grindstone portion 38 of the cutting blade 8 but also from the inclination. Fig. 8 is a graph that shows a straight line graph 66 that shows the ideal wear tendency of the grindstone portion 38 of the cutting blade 8, and line graphs 68, 70 that show the wear tendency of the grindstone portion 38 of the cutting blade 8 obtained when cutting of the workpiece is repeated.

[0096] The straight line graph 66 representing the ideal wear tendency represents the wear tendency of the grindstone portion 38 when the grindstone portion 38 wears moderately and maintains a high cutting ability of the cutting blade 8. If the broken line graphs 68, 70 representing the wear tendency of the grindstone portion 38 obtained when cutting the workpiece repeatedly do not deviate significantly from the straight line graph 66, it can be determined that the type of cutting blade 8 and the processing conditions are suitable for cutting the workpiece.

[0097] On the other hand, if the line graphs 68 and 70 deviate significantly from the straight line graph 66, it is possible that the cutting blade 8 has become clogged or worn, causing a decrease in the cutting ability of the cutting blade 8. In other words, it can be determined that the type of cutting blade 8 or the processing conditions are not suitable for cutting the workpiece.

[0098] Furthermore, an allowable deviation of the line graphs 68, 70 from the straight line graph 66 may be determined in advance as a condition for determining whether the cutting blade 8 or the processing conditions are suitable for the workpiece. This allowable deviation does not need to be constant, and may be determined as a ratio of the wear amount (remaining cutting edge amount) of the grinding wheel portion 38 to the cumulative processing distance of the workpiece by the cutting blade 8. If this deviation is within the allowable range, it can be determined that the cutting blade 8 etc. are suitable for the purpose of processing, and if the deviation is outside the allowable range, it can be determined that they are not suitable.

[0099] The straight line graph 66 representing the ideal wear tendency of the cutting blade 8 is one type of reference wear tendency information regarding the reference wear tendency of the cutting blade 8. The line graphs 68 and 70 representing the wear tendency of the cutting blade 8 are also one type of wear tendency information.

[0100] The above is an explanation of creating the line graphs 68 and 70, which are graphs that function as wear trend information, as an example of the wear trend information creating step S60. Also, as an example of the judging step S70, an explanation is given of judging the suitability of the cutting blade 8, etc. by comparing the line graph 68 and 70 with the straight line graph 66, which is a reference graph that functions as reference wear trend information.

[0101] However, the formats of the reference wear trend information and the wear trend information are not limited to this, and the method of comparing the reference wear trend information with the wear trend information to determine the suitability of the cutting blade 8, etc. is not limited to this either.

[0102] The storage unit of the information processing terminal may store a program for determining whether the cutting blade 8 or the processing conditions are suitable for the workpiece based on the wear tendency information. The storage unit of the information processing terminal that creates the wear tendency information may have an allowable deviation from the straight line graph 66 registered in advance as a determination condition. The program may be executed on the information processing terminal to automatically determine the suitability of the cutting blade 8, etc., based on the allowable deviation from the straight line graph 66 registered in the storage unit.

[0103] For example, the information processing terminal in which the reading step S50, the wear tendency information creating step S60, and the judgment step S70 are performed is installed inside the device chip factory in which the cutting device 2 is installed. In this case, an operator belonging to the device chip factory uses the information processing terminal to perform each step.

[0104] Alternatively, this information processing terminal may be owned by the manufacturer of the cutting device 2 or the cutting blade 8. For example, the cutting blade 8 that has reached the end of its life may be taken over by the manufacturer of the cutting device 2 or the cutting blade 8 and disposed of. At this time, the manufacturer may read the processing information written in the IC tags 52a, 52b using the information processing terminal and determine whether the cutting blade 8 or the processing conditions are suitable for the workpiece.

[0105] In this case, the manufacturer who is familiar with the characteristics of the cutting blade 8 and the structure of the cutting device 2 can judge the suitability of the processing conditions based on his / her deep knowledge. Therefore, the manufacturer can also provide feedback to the user of the cutting device 2, etc., on the processing conditions suitable for obtaining the desired processing results based on the judgment results.

[0106] In this way, in the determination method according to this embodiment, each step may be consistently performed by the user of the cutting device 2. Alternatively, each step up to the writing step S40 may be performed by the user of the cutting device 2 or the like, and each step after the reading step S50 may be performed by the manufacturer of the cutting device 2 or the like.

[0107] A method of writing processing information to the IC tags 52a and 52b so that the suitability of the processing conditions can be judged later based on the processing information can be considered as one aspect of the present invention. Also, a method of reading the processing information written in the IC tags 52a and 52b and judging the suitability of the processing conditions based on the processing information can be considered as one aspect of the present invention.

[0108] If it is determined in the determination step S70 that the cutting blade 8 or the processing conditions are not appropriate, it is desirable to change the type of the cutting blade 8 or the processing conditions. Then, it is desirable to perform the determination method according to the present embodiment again to further determine whether the changed type of the cutting blade 8 or the processing conditions are appropriate. Even if it is determined in the determination step S70 that the cutting blade 8 or the processing conditions are appropriate, the cutting blade 8 or the processing conditions may be changed so as to obtain a more preferable processing result.

[0109] As described above, the judgment method and writing method according to this embodiment make it possible to judge whether the cutting blade 8 and the processing conditions are suitable for cutting the workpiece based on the processing information obtained by processing the workpiece. In other words, even if it is not possible to carry out sufficient test processing to find the optimal processing conditions, it is possible to judge the suitability of the cutting blade 8 and the processing conditions in the process of cutting the workpiece.

[0110] In the above embodiment, the case where the wear tendency information is created in the form of a graph has been described, but the judgment method according to one aspect of the present invention is not limited to this. That is, in the wear tendency information creation step S60, the wear tendency information may be created in a form other than a graph. For example, when the information processing terminal judges the suitability of the cutting blade 8 or the like according to a program, the wear tendency information does not need to be expressed in the form of a graph, which is visual information, and may be composed of, for example, a data set of the cumulative machining distance (cumulative machining amount) and cumulative wear amount of the cutting blade 8.

[0111] Furthermore, in the above embodiment, a case where a graph showing wear trend information is created when the processing is performed under constant processing conditions has been described, but one aspect of the present invention is not limited to this. That is, a graph showing wear trend information may be created when cutting of a workpiece is progressed under various different processing conditions from when one cutting blade 8 is attached to the cutting unit 10 of the cutting device 2 until it is removed.

[0112] In this case, the graph showing the wear tendency information continuously shows a plurality of wear tendencies of the cutting blade 8 when the workpiece is cut under each processing condition. Each wear tendency shown in the graph may be evaluated individually, or each wear tendency may be compared to determine the superiority or inferiority of each processing condition. In this way, if the superiority or inferiority of various processing conditions can be determined simply by cutting the workpiece with one cutting blade 8, the search for processing conditions suitable for the workpiece can be efficiently advanced.

[0113] In addition, the structures, methods, and the like according to the above-described embodiments and modified examples can be modified as appropriate without departing from the scope of the present invention. [Explanation of symbols]

[0114] 11 Frame unit 2 Cutting equipment (processing equipment) 4 Foundation 6 Cover 6a front 6b side 8 Cutting blades (grinding tools) 10 Cutting unit 10a Lifting unit 12 Chuck table 14 Cassette Elevator 16 Cassettes 18 Monitors 20 Blade Case Holder 20a Groove 20b Holding part 20c support part 20d Cutout 22 Control Unit 22a Storage section 24 Spindle housing 26 Spindle 28 Flange mechanism 30 Flange section 32 Boss section 34 Volts 36 Support base 36a aperture 38 Grindstone Department 40 Fixing ring 42 Blade Case 44 Storage unit 44a, 46a Convex part 46 Lid 48 Connecting part 50 Claw part 52a, 52b IC tag 54 Reader / Writer 56 Blade tip position detection unit 58 Main unit 58a Cover 60 Blade Entry 62 Light emitting part 62a light source 62b Illuminating window 64 Light receiving part 64a Photoelectric conversion unit 64b Receiving window 66 straight line 68 Line 70 Line

Claims

1. A method for determining suitability of a grinding tool or processing conditions, comprising the steps of: a writing step of performing processing using the grindstone tool in accordance with processing conditions, and writing a plurality of pieces of processing information of the grindstone tool, each of which includes information on a workpiece processed with the grindstone tool, the processing conditions referred to when the workpiece was processed with the grindstone tool, and the amount of wear of the grindstone tool when the workpiece was processed, to an IC tag disposed on the grindstone tool or a case containing the grindstone tool; a wear tendency information creating step of reading out the processing information written in the IC tag in the writing step, specifying a wear tendency of the grinding tool from a relationship between an accumulated processing amount of the workpiece obtained from the processing information and an accumulated wear amount of the grinding tool corresponding to the accumulated processing amount, and creating wear tendency information by using an information processing terminal; a judging step of judging whether the grinding tool or the processing conditions are suitable for the workpiece using the information processing terminal based on the wear tendency information created in the wear tendency information creating step; A method for determining whether or not a particular

2. A method for writing processing information of a grinding tool to an IC tag, comprising the steps of: The grinding tool is used to carry out processing according to processing conditions; A writing method characterized by writing, to an IC tag arranged on the grinding tool or a case housing the grinding tool, processing information of the grinding tool, including information on a workpiece processed with the grinding tool, the processing conditions referred to when the workpiece was processed with the grinding tool, and the amount of wear of the grinding tool when the workpiece was processed.

3. A method for determining suitability of a grinding tool or processing conditions, comprising the steps of: a wear tendency information creating step of reading out the processing information written on the grinding tool or on an IC tag arranged on a case containing the grinding tool, the processing information including information on the workpiece cut by the grinding tool, the processing conditions referred to when the workpiece was processed by the grinding tool, and the wear amount of the grinding tool when the workpiece was processed, and specifying a wear tendency of the grinding tool from the relationship between the accumulated processing amount of the workpiece obtained from the processing information and the accumulated wear amount of the grinding tool corresponding to the accumulated processing amount, and creating wear tendency information using an information processing terminal; a judging step of judging whether the grinding tool or the processing conditions are suitable for the workpiece using the information processing terminal based on the wear tendency information created in the wear tendency information creating step; A method for determining whether or not a particular

4. 4. The method according to claim 1, wherein the wear tendency information creating step creates a graph showing the wear tendency of the grinding tool.

5. 4. The method according to claim 1, wherein the determination step comprises comparing the wear trend information with reference wear trend information regarding a reference wear trend of the grinding tool.

6. In the consumption trend information creation step, a graph is created to function as the consumption trend information, 6. The method according to claim 5, wherein in the determining step, the determination is made by comparing the graph with a reference graph that functions as the reference consumption tendency information.

7. 7. The method according to claim 1, wherein the grinding tool is a cutting blade.

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