Photosensitive resin composition, cured product, partition wall, organic electroluminescent device, color filter, and image display device

The photosensitive resin composition, featuring an ethylenically unsaturated compound, photopolymerization initiator, specific alkali-soluble resin, and liquid repellent agent, addresses the challenge of ensuring ink repellency at low exposure amounts, improving the performance of partition walls in display devices.

JP7658276B2Active Publication Date: 2025-04-08MITSUBISHI CHEM CORP
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Patent Information

Application Number
JP2021554952
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Priority Date
2019-11-06
Filing Date
2020-11-04
Publication Date
2025-04-08
Estimated Expiration
2040-11-04

AI Technical Summary

Technical Problem

Existing photosensitive resin compositions struggle to ensure sufficient ink repellency, especially at low exposure amounts, and lack description of liquid repellent agents in previous documents.

Method used

A photosensitive resin composition containing an ethylenically unsaturated compound, a photopolymerization initiator, an alkali-soluble resin with a specific partial structure, and a liquid repellent agent with a fluorine atom and crosslinking group.

Benefits of technology

The composition achieves sufficient ink repellency even at low exposure amounts, enhancing the performance of partition walls in color filters and organic electroluminescent devices.

✦ Generated by Eureka AI based on patent content.

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Abstract

Provided is a photosensitive resin composition capable of providing a satisfactory ink repellency even at low exposure levels. The photosensitive resin composition according to the present invention is characterized by comprising (A) an ethylenically-unsaturated compound, (B) a photopolymerization initiator, (C) an alkali-soluble resin, and (D) a liquid-repellent agent, wherein the alkali-soluble resin (C) comprises an alkali-soluble resin (C-1) having a substructure represented by general formula (c1) and the liquid-repellent agent (D) comprises a fluorine atom-containing resin that contains a crosslinking group. (In formula (c1), Rc11 represents a hydrogen atom or methyl group; Rc12 represents a possibly substituted divalent hydrocarbon group; n represents the integer 2 or 3; the benzene ring in formula (c1) may additionally be substituted by an arbitrary substituent; and each * represents a bond.)
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Description

[Technical field]

[0001] The present invention relates to a photosensitive resin composition, and further to a cured product obtained by curing the photosensitive resin composition; a partition wall formed from the cured product; and an organic electroluminescent device, a color filter, and an image display device that are provided with the partition wall. This application claims priority based on Japanese Patent Application No. 2019-201108, filed on November 6, 2019, the contents of which are incorporated herein by reference. [Background technology]

[0002] In recent years, in order to reduce the power consumption and expand the color gamut of displays, color filters in which pixels are formed using luminescent nanocrystalline particles such as quantum dots have been considered. There are two methods for manufacturing color filters: photolithography and inkjet printing, and it is known that the latter method can reduce the loss of ink material (see, for example, Patent Document 1). When a color filter containing luminescent nanocrystal particles is manufactured by the inkjet method, pixels are formed by ejecting ink containing luminescent nanocrystal particles into a region (pixel portion) surrounded by a partition wall prepared in advance. Organic electroluminescent elements used in organic electroluminescence displays are manufactured by forming partitions (banks) on a substrate and laminating various functional layers within the area surrounded by the partitions. The inkjet method is known as a method for laminating functional layers within the partitions. Both the partition walls for color filters containing luminescent nanocrystalline particles and the partition walls for organic electroluminescent devices need to prevent the inks from mixing with each other between adjacent pixel portions when the inks are ejected by inkjet, and therefore require high ink repellency. Patent Document 2 describes that a colored photosensitive resin composition having high ink repellency and good linearity can be obtained by using two specific alkali-soluble resins in combination as a material for forming ink-repellent partition walls by a photolithography method. Furthermore, Patent Documents 3 and 4 describe photosensitive resin compositions containing specific resins. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2019-086745 [Patent Document 2] International Publication No. 2019 / 146685 [Patent Document 3] Japanese Patent Publication No. 2016-047919 [Patent Document 4] Japanese Patent Application Publication No. 2017-190403 Summary of the Invention [Problem to be solved by the invention]

[0004] As a result of investigations conducted by the present inventors, it was found that with the photosensitive resin composition described in Patent Document 2, it is difficult to ensure sufficient ink repellency when the exposure dose is low. On the other hand, Patent Documents 3 and 4 make no mention of a liquid repellent agent, and it is unclear what ink repellency would be achieved if a liquid repellent agent is used.

[0005] Therefore, an object of the present invention is to provide a photosensitive resin composition that can ensure sufficient ink repellency even with a low exposure dose. Another object of the present invention is to provide a cured product obtained by curing the photosensitive resin composition, a partition wall formed from the cured product, and an image display device including the partition wall. [Means for solving the problem]

[0006] As a result of extensive investigations, the present inventors have found that the above problems can be solved by using a specific alkali-soluble resin in a photosensitive resin composition containing a liquid repellent agent, and have thus completed the present invention. That is, the gist of the present invention is as follows.

[0007] [1] A photosensitive resin composition comprising (A) an ethylenically unsaturated compound, (B) a photopolymerization initiator, (C) an alkali-soluble resin, and (D) a liquid repellent agent, The (C) alkali-soluble resin contains an alkali-soluble resin (C-1) having a partial structure represented by the following general formula (c1): A photosensitive resin composition, wherein the liquid repellent (D) contains a fluorine atom-containing resin having a crosslinking group.

[0008] [ka]

[0009] (In formula (c1), R c11 represents a hydrogen atom or a methyl group. R c12 represents a divalent hydrocarbon group which may have a substituent. n represents an integer of 2 or 3. The benzene ring in formula (c1) may be further substituted with any substituent. * represents a bond.)

[0010] [2] In the general formula (c1), R c12 is a group represented by the following general formula (c1-1):

[0011] [ka]

[0012] [3] The photosensitive resin composition according to [1] or [2], wherein the content of the alkali-soluble resin (C-1) in the alkali-soluble resin (C) is 60 mass% or more. [4] The photosensitive resin composition according to any one of [1] to [3], further comprising (E) a colorant. [5] The photosensitive resin composition according to [4], wherein the content of the colorant (E) is 50 mass % or less based on the total solid content of the photosensitive resin composition. [6] The photosensitive resin composition according to [4] or [5], wherein the (E) colorant contains at least one selected from the group consisting of a red pigment and an orange pigment, and at least one selected from the group consisting of a blue pigment and a purple pigment. [7] The photosensitive resin composition according to any one of [4] to [6], wherein the (E) colorant contains a purple pigment. [8] A cured product obtained by curing the photosensitive resin composition according to any one of [1] to [7]. [9] A partition wall comprising the cured product described in [8].

[10] An organic electroluminescent device comprising the partition wall according to [9].

[11] A color filter comprising luminescent nanocrystalline particles and the partition wall according to [9].

[12] An image display device comprising the partition wall described in [9]. Effect of the Invention

[0013] According to the present invention, it is possible to provide a photosensitive resin composition that can ensure sufficient ink repellency even at a low exposure dose. [Brief description of the drawings]

[0014] [Figure 1] FIG. 1 is a schematic cross-sectional view of an example of a color filter having partition walls of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0015] The present invention will be described in detail below. Note that the following description is an example of an embodiment of the present invention, and the present invention is not limited to these unless it goes beyond the gist of the present invention. In the present invention, "(meth)acrylic" means "either one or both of acrylic and methacrylic", and "total solid content" means all components other than the solvent in the photosensitive resin composition. Furthermore, in the present invention, a numerical range expressed using "to" means a range including the numerical values ​​before and after "to" as the lower and upper limits. In the present invention, the term "(co)polymer" means to include both a homopolymer and a copolymer, and the terms "(acid) anhydride" and "(anhydride)...acid" mean to include both an acid and its anhydride. In the present invention, the partition material refers to a bank material, a wall material, and a wall material, and similarly, the partition refers to a bank, a wall, and a wall. In the present invention, the weight average molecular weight means the weight average molecular weight (Mw) calculated in terms of polystyrene by GPC (gel permeation chromatography). In the present invention, the acid value means an acid value calculated based on the effective solid content, unless otherwise specified, and is calculated by neutralization titration.

[0016] In the present invention, the partition wall can be used, for example, to partition a functional layer (organic layer, light-emitting portion) in an active-drive organic electroluminescent device, and can be used to form pixels including the functional layer and the partition wall by discharging and drying ink, which is a material for forming the functional layer, into the partitioned region (pixel region).The partition wall can also be used to partition a pixel portion in a color filter including luminescent nanocrystalline particles, and can be used to form pixels by discharging and drying ink into the partitioned region.

[0017] [1] Photosensitive resin composition The photosensitive resin composition of the present invention contains, as essential components, (A) an ethylenically unsaturated compound, (B) a photopolymerization initiator, (C) an alkali-soluble resin, and (D) a liquid repellent, and may further contain other components as necessary, such as (E) a colorant, (F) a dispersant, etc.

[0018] [1-1] Components and composition of photosensitive resin composition The components constituting the photosensitive resin composition of the present invention and their composition will be described in order.

[0019] [1-1-1] Component (A): Ethylenically unsaturated compound The photosensitive resin composition of the present invention contains (A) an ethylenically unsaturated compound. It is believed that the inclusion of (A) an ethylenically unsaturated compound increases the curability of the coating film and improves the ink repellency. The ethylenically unsaturated compound used herein means a compound having one or more ethylenically unsaturated bonds in the molecule, but from the viewpoints of polymerizability, crosslinkability, and the associated ability to increase the difference in developer solubility between exposed and unexposed areas, a compound having two or more ethylenically unsaturated bonds in the molecule is preferred, and the unsaturated bond is more preferably derived from a (meth)acryloyloxy group, i.e., a (meth)acrylate compound. In the present invention, it is particularly desirable to use a polyfunctional ethylenic monomer having two or more ethylenically unsaturated bonds in one molecule. The number of ethylenically unsaturated groups in the polyfunctional ethylenic monomer is not particularly limited, but is preferably 2 or more, more preferably 3 or more, even more preferably 5 or more, and is preferably 15 or less, more preferably 10 or less, even more preferably 8 or less, and particularly preferably 7 or less. For example, 2 to 15 is preferable, 2 to 10 is more preferable, 3 to 8 is even more preferable, and 5 to 7 is particularly preferable. By making it equal to or more than the lower limit, the polymerizability tends to be improved and the ink repellency tends to be high. By making it equal to or less than the upper limit, the developability tends to be better. Specific examples of the ethylenically unsaturated compound include esters of an aliphatic polyhydroxy compound and an unsaturated carboxylic acid; esters of an aromatic polyhydroxy compound and an unsaturated carboxylic acid; and esters obtained by an esterification reaction between a polyhydric hydroxy compound, such as an aliphatic polyhydroxy compound or an aromatic polyhydroxy compound, and an unsaturated carboxylic acid or a polybasic carboxylic acid.

[0020] Examples of the esters of aliphatic polyhydroxy compounds and unsaturated carboxylic acids include acrylic acid esters of aliphatic polyhydroxy compounds such as ethylene glycol diacrylate, triethylene glycol diacrylate, trimethylolpropane triacrylate, trimethylolethane triacrylate, pentaerythritol diacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol tetraacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, and glycerol acrylate; methacrylic acid esters in which the acrylate of these exemplary compounds is replaced with methacrylate; and similarly, itaconic acid esters in which itaconate is replaced with itaconate, crotonic acid esters in which cronate is replaced with cronate, and maleic acid esters in which maleate is replaced with crotonic acid esters.

[0021] Examples of esters of aromatic polyhydroxy compounds and unsaturated carboxylic acids include acrylic acid esters and methacrylic acid esters of aromatic polyhydroxy compounds such as hydroquinone diacrylate, hydroquinone dimethacrylate, resorcinol diacrylate, resorcinol dimethacrylate, and pyrogallol triacrylate. The ester obtained by the esterification reaction of a polyhydric hydroxy compound, such as an aliphatic polyhydroxy compound or an aromatic polyhydroxy compound, with an unsaturated carboxylic acid and a polybasic carboxylic acid is not necessarily a single compound, but representative specific examples include a condensation product of acrylic acid, phthalic acid, and ethylene glycol, a condensation product of acrylic acid, maleic acid, and diethylene glycol, a condensation product of methacrylic acid, terephthalic acid, and pentaerythritol, and a condensation product of acrylic acid, adipic acid, butanediol, and glycerin.

[0022] Other useful examples of the polyfunctional ethylenic monomer that can be used in the present invention include urethane (meth)acrylates obtained by reacting a polyisocyanate compound with a hydroxyl group-containing (meth)acrylic acid ester or a polyisocyanate compound with a polyol and a hydroxyl group-containing (meth)acrylic acid ester; epoxy acrylates such as the addition reaction product of a polyfunctional epoxy compound with a hydroxyl (meth)acrylate or (meth)acrylic acid; acrylamides such as ethylene bisacrylamide; allyl esters such as diallyl phthalate; and vinyl group-containing compounds such as divinyl phthalate. Examples of the urethane (meth)acrylates include DPHA-40H, UX-5000, UX-5002D-P20, UX-5003D, and UX-5005 (manufactured by Nippon Kayaku Co., Ltd.), U-2PPA, U-6LPA, U-10PA, U-33H, UA-53H, UA-32P, and UA-1100H (manufactured by Shin-Nakamura Chemical Co., Ltd.), UA-306H, UA-510H, and UF-8001G (manufactured by Kyoeisha Chemical Co., Ltd.), UV-1700B, UV-7600B, UV-7605B, UV-7630B, and UV7640B (manufactured by Mitsubishi Chemical Corporation).

[0023] Among these, from the viewpoint of adhesion of the partition wall to the substrate and ink repellency, it is preferable to use an ester of an aliphatic polyhydroxy compound and an unsaturated carboxylic acid or a urethane (meth)acrylate as the (A) ethylenically unsaturated compound, and it is more preferable to use dipentaerythritol hexa(meth)acrylate, dipentaerythritol penta(meth)acrylate, 2-tris(meth)acryloyloxymethylethyl phthalate, pentaerythritol tetra(meth)acrylate, pentaerythritol tri(meth)acrylate, a dibasic acid anhydride adduct of dipentaerythritol penta(meth)acrylate, or a dibasic acid anhydride adduct of pentaerythritol tri(meth)acrylate. These may be used alone or in combination of two or more.

[0024] In the present invention, the molecular weight of the ethylenically unsaturated compound (A) is not particularly limited, but from the viewpoint of ink repellency and forming highly precise partition walls with a narrow line width, it is preferably 100 or more, more preferably 150 or more, even more preferably 200 or more, still more preferably 300 or more, particularly preferably 400 or more, and most preferably 500 or more, and is preferably 1000 or less, more preferably 700 or less. For example, it is preferably 100 to 1000, more preferably 150 to 1000, even more preferably 200 to 1000, even more preferably 300 to 700, particularly preferably 400 to 700, and particularly preferably 500 to 700. The number of carbon atoms in the (A) ethylenically unsaturated compound is not particularly limited, but from the viewpoint of ink repellency and residue suppression, it is preferably 7 or more, more preferably 10 or more, even more preferably 15 or more, still more preferably 20 or more, particularly preferably 25 or more, and is preferably 50 or less, more preferably 40 or less, even more preferably 35 or less, particularly preferably 30 or less. For example, 7 to 50 is preferred, 10 to 50 is more preferred, 15 to 40 is even more preferred, 20 to 35 is even more preferred, and 25 to 30 is particularly preferred. From the viewpoint of ink repellency and the ability to form highly precise partition walls with narrow line widths, ester (meth)acrylates, epoxy (meth)acrylates, and urethane (meth)acrylates are preferred, and among these, trifunctional or higher ester (meth)acrylates such as pentaerythritol tetra(meth)acrylate, pentaerythritol tri(meth)acrylate dipentaerythritol hexa(meth)acrylate, dipentaerythritol penta(meth)acrylate, and acid anhydride adducts of trifunctional or higher ester (meth)acrylates such as 2,2,2-tris(meth)acryloyloxymethylethylphthalate and dibasic acid anhydride adducts of dipentaerythritol penta(meth)acrylate are even more preferred in terms of ink repellency and the ability to form highly precise partition walls with narrow line widths.

[0025] The content ratio of the (A) ethylenically unsaturated compound in the photosensitive resin composition of the present invention is not particularly limited, but is preferably 1% by mass or more, more preferably 5% by mass or more, even more preferably 10% by mass or more, even more preferably 15% by mass or more, and particularly preferably 20% by mass or more, and is also preferably 80% by mass or less, more preferably 60% by mass or less, even more preferably 40% by mass or less, and even more preferably 30% by mass or less, based on the total solid content of the photosensitive resin composition. For example, 1 to 80% by mass is preferred, 5 to 80% by mass is more preferred, 10 to 60% by mass is even more preferred, 15 to 40% by mass is even more preferred, and 20 to 30% by mass is particularly preferred. By making it equal to or more than the lower limit, the ink repellency tends to be improved. By making it equal to or less than the upper limit, it tends to be possible to form a highly precise partition wall with a narrow line width.

[0026] The content ratio of the ethylenically unsaturated compound (A) relative to 100 parts by mass of the alkali-soluble resin (C) is not particularly limited, but is preferably 1 part by mass or more, more preferably 5 parts by mass or more, even more preferably 10 parts by mass or more, even more preferably 15 parts by mass or more, particularly preferably 20 parts by mass or more, even more particularly preferably 25 parts by mass or more, and most preferably 30 parts by mass or more, and is preferably 150 parts by mass or less, more preferably 100 parts by mass or less, even more preferably 70 parts by mass or less, even more preferably 50 parts by mass or less, and especially preferably 40 parts by mass or less. For example, 1 to 150 parts by mass is preferred, 5 to 150 parts by mass is more preferred, 10 to 100 parts by mass is even more preferred, 15 to 100 parts by mass is even more preferred, 20 to 70 parts by mass is particularly preferred, 25 to 50 parts by mass is particularly preferred, and 30 to 40 parts by mass is most preferred. By making it equal to or more than the lower limit, the ink repellency tends to be improved. By making it equal to or less than the upper limit, it tends to be possible to form a highly precise partition wall with a narrow line width.

[0027] [1-1-2] Component (B): Photopolymerization initiator The photosensitive resin composition of the present invention contains a photopolymerization initiator (B). The photopolymerization initiator (B) is not particularly limited as long as it is a compound that polymerizes the ethylenically unsaturated compound (A) by actinic rays, for example, polymerizes the ethylenically unsaturated bond contained in the ethylenically unsaturated compound (A).

[0028] The photosensitive resin composition of the present invention can use photopolymerization initiator (B) that is generally used in this field. Examples of such photopolymerization initiators include metallocene compounds including titanocene compounds described in JP-A-59-152396 and JP-A-61-151197; hexaarylbiimidazole derivatives described in JP-A-2000-56118; halomethylated oxadiazole derivatives, halomethyl-s-triazine derivatives, N-aryl-α-amino acids such as N-phenylglycine, N-aryl-α-amino acid salts, radical activators such as N-aryl-α-amino acid esters, α-aminoalkylphenone derivatives; and oxime ester compounds described in JP-A-2000-80068 and JP-A-2006-36750.

[0029] Specifically, for example, the metallocene compound may be dicyclopentadienyltitanium dichloride, dicyclopentadienyltitanium bisphenyl, dicyclopentadienyltitanium bis(2,3,4,5,6-pentafluorophenyl), dicyclopentadienyltitanium bis(2,3,5,6-tetrafluorophenyl), dicyclopentadienyltitanium bis(2,4,6-trifluorophenyl), dicyclopentadiene dicyclopentadienyltitanium di(2,6-difluorophenyl), dicyclopentadienyltitanium di(2,4-difluorophenyl), di(methylcyclopentadienyl)titanium bis(2,3,4,5,6-pentafluorophenyl), di(methylcyclopentadienyl)titanium bis(2,6-difluorophenyl), dicyclopentadienyltitanium [2,6-difluoro-3-(pyrro-1-yl)-phenyl].

[0030] Examples of biimidazole derivatives include 2-(2'-chlorophenyl)-4,5-diphenylimidazole dimer, 2-(2'-chlorophenyl)-4,5-bis(3'-methoxyphenyl)imidazole dimer, 2-(2'-fluorophenyl)-4,5-diphenylimidazole dimer, 2-(2'-methoxyphenyl)-4,5-diphenylimidazole dimer, and (4'-methoxyphenyl)-4,5-diphenylimidazole dimer.

[0031] Examples of halomethylated oxadiazole derivatives include 2-trichloromethyl-5-(2'-benzofuryl)-1,3,4-oxadiazole, 2-trichloromethyl-5-[β-(2'-benzofuryl)vinyl]-1,3,4-oxadiazole, 2-trichloromethyl-5-[β-(2'-(6''-benzofuryl)vinyl)]-1,3,4-oxadiazole, and 2-trichloromethyl-5-furyl-1,3,4-oxadiazole.

[0032] Examples of halomethyl-s-triazine derivatives include 2-(4-methoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4-methoxynaphthyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4-ethoxynaphthyl)-4,6-bis(trichloromethyl)-s-triazine, and 2-(4-ethoxycarbonylnaphthyl)-4,6-bis(trichloromethyl)-s-triazine.

[0033] Examples of α-aminoalkylphenone derivatives include 2-methyl-1[4-(methylthio)phenyl]-2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)butan-1-one, 4-dimethylaminoethyl benzoate, 4-dimethylaminoisoamyl benzoate, 4-diethylaminoacetophenone, 4-dimethylaminopropiophenone, 2-ethylhexyl-1,4-dimethylaminobenzoate, 2,5-bis(4-diethylaminobenzal)cyclohexanone, 7-diethylamino-3-(4-diethylaminobenzoyl)coumarin, and 4-(diethylamino)chalcone.

[0034] As the photopolymerization initiator, an oxime ester compound is particularly effective in terms of sensitivity and plate making properties, and when an alkali-soluble resin containing a phenolic hydroxyl group is used, for example, it is disadvantageous in terms of sensitivity, so that an oxime ester compound having such excellent sensitivity is particularly useful. Since an oxime ester compound has a structure that absorbs ultraviolet light, a structure that transmits light energy, and a structure that generates radicals, it has high sensitivity even in a small amount and is stable against thermal reactions, making it possible to obtain a highly sensitive photosensitive resin composition with a small amount.

[0035] An example of the oxime ester compound is a compound represented by the following general formula (IV).

[0036] [ka]

[0037] In formula (IV), R 21a represents a hydrogen atom, an alkyl group which may have a substituent, or an aromatic ring group which may have a substituent. R 21b represents an optional substituent containing an aromatic ring. R 22a represents an alkanoyl group which may have a substituent, or an aryloyl group which may have a substituent. n represents an integer of 0 or 1.

[0038] R 21a In the formula, the number of carbon atoms in the alkyl group is not particularly limited, but from the viewpoint of solubility in a solvent and sensitivity, the number is preferably 1 or more, more preferably 2 or more, and is preferably 20 or less, more preferably 15 or less, and further preferably 10 or less. Specific examples of the alkyl group include a methyl group, an ethyl group, a propyl group, a cyclopentylethyl group, and a propyl group. Examples of the substituent that the alkyl group may have include an aromatic ring group, a hydroxyl group, a carboxyl group, a halogen atom, an amino group, an amide group, a 4-(2-methoxy-1-methyl)ethoxy-2-methylphenyl group, and an N-acetyl-N-acetoxyamino group. From the viewpoint of ease of synthesis, the alkyl group is preferably unsubstituted.

[0039] R 21a Examples of the aromatic ring group in include an aromatic hydrocarbon ring group and an aromatic heterocyclic group. The number of carbon atoms in the aromatic ring group is not particularly limited, but is preferably 5 or more from the viewpoint of solubility in the photosensitive resin composition. Also, from the viewpoint of developability, it is preferably 30 or less, more preferably 20 or less, and even more preferably 12 or less. For example, it is preferably 5 to 30, more preferably 5 to 20, and even more preferably 5 to 12.

[0040] Specific examples of the aromatic ring group include a phenyl group, a naphthyl group, a pyridyl group, and a furyl group. Among these, from the viewpoint of developability, a phenyl group or a naphthyl group is preferred, and a phenyl group is more preferred. Examples of the substituent that the aromatic ring group may have include a hydroxyl group, a carboxy group, a halogen atom, an amino group, an amide group, an alkyl group, an alkoxy group, and a group formed by linking these substituents. From the viewpoint of developability, an alkyl group, an alkoxy group, and a group formed by linking these are preferred, and a linked alkoxy group is more preferred. Among these, from the viewpoint of sensitivity, R 21ais preferably an alkyl group which may have a substituent, or an aromatic ring group which may have a substituent.

[0041] R 21b As the alkyl group, preferably, an optionally substituted carbazolyl group, an optionally substituted thioxanthonyl group, or an optionally substituted diphenyl sulfide group is mentioned. Among these, an optionally substituted carbazolyl group is preferred from the viewpoint of sensitivity.

[0042] R 22a The number of carbon atoms in the alkanoyl group in is not particularly limited, but from the viewpoint of solubility in a solvent and sensitivity, it is preferably 2 or more, more preferably 3 or more, and preferably 20 or less, more preferably 15 or less, even more preferably 10 or less, and still more preferably 5 or less. Specific examples of the alkanoyl group include an acetyl group, an ethyloyl group, a propanoyl group, and a butanoyl group. Examples of the substituent that the alkanoyl group may have include an aromatic ring group, a hydroxyl group, a carboxyl group, a halogen atom, an amino group, and an amide group. From the viewpoint of ease of synthesis, the alkanoyl group is preferably unsubstituted.

[0043] R 22a The number of carbon atoms in the aryloyl group in is not particularly limited, but from the viewpoint of solubility in a solvent and sensitivity, it is preferably 7 or more, more preferably 8 or more, and preferably 20 or less, more preferably 15 or less, and further preferably 10 or less. Specific examples of the aryloyl group include a benzoyl group and a naphthoyl group. Examples of the substituent that the aryloyl group may have include a hydroxyl group, a carboxyl group, a halogen atom, an amino group, an amide group, and an alkyl group. From the viewpoint of ease of synthesis, the aryloyl group is preferably unsubstituted. Among these, from the viewpoint of sensitivity, R 22a is preferably an alkanoyl group which may have a substituent, more preferably an unsubstituted alkanoyl group, and further preferably an acetyl group.

[0044] The photopolymerization initiator may be used alone or in combination of two or more. The photopolymerization initiator may be blended with a sensitizing dye and a polymerization promoter according to the wavelength of the image exposure light source for the purpose of increasing the sensitivity, if necessary. Examples of the sensitizing dye include xanthene dyes described in JP-A-4-221958 and JP-A-4-219756, coumarin dyes having a heterocycle described in JP-A-3-239703 and JP-A-5-289335, 3-ketocoumarin compounds described in JP-A-3-239703 and JP-A-5-289335, pyrromethene dyes described in JP-A-6-19240, JP-A-47-2528, JP-A-54-155292, and JP-A-54-155293. Examples of dyes having a dialkylaminobenzene skeleton include those described in JP-B-37377, JP-A-48-84183, JP-A-52-112681, JP-A-58-15503, JP-A-60-88005, JP-A-59-56403, JP-A-2-69, JP-A-57-168088, JP-A-5-107761, JP-A-5-210240, and JP-A-4-288818.

[0045] Among these sensitizing dyes, preferred are sensitizing dyes containing an amino group, and more preferred are compounds having an amino group and a phenyl group in the same molecule. For example, benzophenone compounds such as 4,4'-dimethylaminobenzophenone, 4,4'-diethylaminobenzophenone, 2-aminobenzophenone, 4-aminobenzophenone, 4,4'-diaminobenzophenone, 3,3'-diaminobenzophenone, and 3,4-diaminobenzophenone; 2-(p-dimethylaminophenyl)benzoxazole, 2-(p-diethylaminophenyl)benzoxazole, 2-(p-dimethylaminophenyl)benzo[4,5]benzoxazole, 2-(p-dimethylaminophenyl)benzo[6,7]benzoxazole, 2,5-bis(p-diethylaminophenyl)-1,3,4-oxazole, 2 More preferred are p-dialkylaminophenyl group-containing compounds such as -(p-dimethylaminophenyl)benzothiazole, 2-(p-diethylaminophenyl)benzothiazole, 2-(p-dimethylaminophenyl)benzimidazole, 2-(p-diethylaminophenyl)benzimidazole, 2,5-bis(p-diethylaminophenyl)-1,3,4-thiadiazole, (p-dimethylaminophenyl)pyridine, (p-diethylaminophenyl)pyridine, (p-dimethylaminophenyl)quinoline, (p-diethylaminophenyl)quinoline, (p-dimethylaminophenyl)pyrimidine, and (p-diethylaminophenyl)pyrimidine. Among these, 4,4'-dialkylaminobenzophenone is particularly preferred. The sensitizing dyes may be used alone or in combination of two or more kinds.

[0046] As the polymerization accelerator, for example, aromatic amines such as ethyl p-dimethylaminobenzoate and 2-dimethylaminoethyl benzoate, and aliphatic amines such as n-butylamine and N-methyldiethanolamine can be used. The polymerization accelerator may be used alone or in combination of two or more kinds.

[0047] The content of the (B) photopolymerization initiator in the photosensitive resin composition of the present invention is not particularly limited, but is preferably 0.01% by mass or more, more preferably 0.1% by mass or more, even more preferably 1% by mass or more, even more preferably 2% by mass or more, particularly preferably 3% by mass or more, and is preferably 25% by mass or less, more preferably 20% by mass or less, even more preferably 15% by mass or less, even more preferably 10% by mass or less, particularly preferably 7% by mass or less, and most preferably 5% by mass or less. For example, 0.01 to 25% by mass is preferred, 0.01 to 20% by mass is more preferred, 0.1 to 15% by mass is even more preferred, 1 to 10% by mass is even more preferred, 2 to 7% by mass is particularly preferred, and 3 to 5% by mass is particularly preferred. By making it equal to or more than the lower limit, the ink repellency tends to be improved. By making it equal to or less than the upper limit, the residue tends to be reduced.

[0048] The compounding ratio of the (B) photopolymerization initiator to the (A) ethylenically unsaturated compound in the photosensitive resin composition is preferably 1 part by mass or more, more preferably 5 parts by mass or more, even more preferably 10 parts by mass or more, even more preferably 15 parts by mass or more, particularly preferably 20 parts by mass or more, and also preferably 200 parts by mass or less, more preferably 100 parts by mass or less, even more preferably 50 parts by mass or less, and particularly preferably 30 parts by mass or less, relative to 100 parts by mass of the (A) ethylenically unsaturated compound. For example, 1 to 200 parts by mass is preferred, more preferably 5 to 200 parts by mass, more preferably 10 to 100 parts by mass, even more preferably 15 to 50 parts by mass, and particularly preferably 20 to 30 parts by mass. By making it equal to or more than the lower limit, the ink repellency tends to be improved. By making it equal to or less than the upper limit, the residue tends to be reduced.

[0049] A chain transfer agent may be used in combination with the photopolymerization initiator. Examples of the chain transfer agent include mercapto group-containing compounds and carbon tetrachloride. Among these, it is more preferable to use a mercapto group-containing compound because it tends to have a high chain transfer effect. This is thought to be because the SH bond energy is small, which makes it easy for bond cleavage to occur, and hydrogen abstraction reactions and chain transfer reactions to occur. The use of a chain transfer agent is effective in improving sensitivity and surface hardening properties.

[0050] The mercapto group-containing compound may have a plurality of mercapto groups in the molecule, and examples thereof include mercapto group-containing compounds having an aromatic ring, such as 2-mercaptobenzothiazole, 2-mercaptobenzimidazole, 2-mercaptobenzoxazole, 3-mercapto-1,2,4-triazole, 2-mercapto-4(3H)-quinazoline, β-mercaptonaphthalene, and 1,4-dimethylmercaptobenzene; Hexanedithiol, decanedithiol, butanediol bis(3-mercaptopropionate), butanediol bisthioglycolate, ethylene glycol bis(3-mercaptopropionate), ethylene glycol bisthioglycolate, trimethylolpropane tris(3-mercaptopropionate), trimethylolpropane tristhioglycolate, trishydroxyethyl tristhiopropionate, pentaerythritol tetrakis(3-mercaptopropionate), pentaerythritol tris(3 -mercaptopropionate), butanediol bis(3-mercaptobutyrate), ethylene glycol bis(3-mercaptobutyrate), trimethylolpropane tris(3-mercaptobutyrate), pentaerythritol tetrakis(3-mercaptobutyrate), pentaerythritol tris(3-mercaptobutyrate), 1,3,5-tris(3-mercaptobutyloxyethyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, and other aliphatic mercapto group-containing compounds.

[0051] Among the mercapto group-containing compounds having an aromatic ring, 2-mercaptobenzothiazole and 2-mercaptobenzimidazole are preferred, and among the aliphatic mercapto group-containing compounds, trimethylolpropane tris(3-mercaptopropionate), pentaerythritol tetrakis(3-mercaptopropionate), pentaerythritol tris(3-mercaptopropionate), trimethylolpropane tris(3-mercaptobutyrate), pentaerythritol tetrakis(3-mercaptobutyrate), pentaerythritol tris(3-mercaptobutyrate), and 1,3,5-tris(3-mercaptobutyloxyethyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione are preferred.

[0052] From the viewpoint of sensitivity, aliphatic mercapto group-containing compounds are preferred, specifically, trimethylolpropane tris(3-mercaptopropionate), pentaerythritol tetrakis(3-mercaptopropionate), pentaerythritol tris(3-mercaptopropionate), trimethylolpropane tris(3-mercaptobutyrate), pentaerythritol tetrakis(3-mercaptobutyrate), pentaerythritol tris(3-mercaptobutyrate), 1,3,5-tris(3-mercaptobutyloxyethyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione is preferred, and pentaerythritol tetrakis(3-mercaptopropionate) and pentaerythritol tetrakis(3-mercaptobutyrate) are more preferred. These may be used alone or in combination of two or more.

[0053] Among these, from the viewpoint of increasing the taper angle, it is preferable to use one or more selected from the group consisting of 2-mercaptobenzothiazole, 2-mercaptobenzimidazole, and 2-mercaptobenzoxazole in combination with a photopolymerization initiator as a photopolymerization initiator system. For example, 2-mercaptobenzothiazole may be used, 2-mercaptobenzimidazole may be used, or 2-mercaptobenzothiazole and 2-mercaptobenzimidazole may be used in combination. From the viewpoint of sensitivity, it is preferable to use one or more selected from the group consisting of pentaerythritol tetrakis(3-mercaptopropionate) and pentaerythritol tetrakis(3-mercaptobutyrate). Furthermore, from the viewpoint of sensitivity, it is preferable to use a combination of one or more selected from the group consisting of 2-mercaptobenzothiazole, 2-mercaptobenzimidazole, and 2-mercaptobenzoxazole, one or more selected from the group consisting of pentaerythritol tetrakis(3-mercaptopropionate) and pentaerythritol tetrakis(3-mercaptobutyrate), and a photopolymerization initiator.

[0054] The content of the chain transfer agent in the photosensitive resin composition of the present invention is not particularly limited, but is preferably 0.01% by mass or more, more preferably 0.1% by mass or more, even more preferably 0.5% by mass or more, even more preferably 0.8% by mass or more, and is preferably 5% by mass or less, more preferably 4% by mass or less, even more preferably 3% by mass or less, and even more preferably 2% by mass or less, based on the total solid content of the photosensitive resin composition. For example, 0.01 to 5% by mass is preferred, 0.1 to 4% by mass is more preferred, 0.5 to 3% by mass is even more preferred, and 0.8 to 2% by mass is particularly preferred. By making it equal to or more than the lower limit, the ink repellency tends to be improved. By making it equal to or less than the upper limit, it tends to be possible to form a highly precise partition wall with a narrow line width.

[0055] The content ratio of the chain transfer agent relative to the (B) photopolymerization initiator in the photosensitive resin composition is preferably 5 parts by mass or more, more preferably 10 parts by mass or more, even more preferably 15 parts by mass or more, and particularly preferably 20 parts by mass or more, and is preferably 500 parts by mass or less, more preferably 300 parts by mass or less, even more preferably 100 parts by mass or less, and particularly preferably 50 parts by mass or less, for example, 5 to 500 parts by mass is preferred, more preferably 10 to 300 parts by mass, even more preferably 15 to 100 parts by mass, and particularly preferably 20 to 50 parts by mass. By making it equal to or more than the lower limit, the ink repellency tends to be improved. By making it equal to or less than the upper limit, it tends to be possible to form a highly precise partition wall with a narrow line width.

[0056] [1-1-3] Component (C): Alkali-soluble resin The photosensitive resin composition of the present invention contains an alkali-soluble resin (C). In the present invention, the alkali-soluble resin (C) is not particularly limited as long as it can be developed with an alkali developer.

[0057] The alkali-soluble resin (C) in the photosensitive resin composition of the present invention contains an alkali-soluble resin (C-1) having a partial structure represented by the following general formula (c1).

[0058] [ka]

[0059] (In formula (c1), R c11 represents a hydrogen atom or a methyl group. R c12 represents a divalent hydrocarbon group which may have a substituent. n represents an integer of 2 or 3. The benzene ring in formula (c1) may be further substituted with any substituent. * represents a bond.)

[0060] The alkali-soluble resin (C-1) has a partial structure represented by formula (c1). The presence of a benzene ring in the main chain tends to increase the hydrophobicity of the film. In particular, the presence of two or more crosslinking groups in the side chain increases the crosslink density even with a low exposure dose, and the liquid repellent agent tends to remain on the film surface even after development, resulting in good ink repellency.

[0061] (R c12 ) In formula (c1), R c12 represents a divalent hydrocarbon group which may have a substituent. Examples of the divalent hydrocarbon group include a divalent aliphatic group, a divalent aromatic ring group, and a group in which one or more divalent aliphatic groups are linked with one or more divalent aromatic ring groups.

[0062] The divalent aliphatic group may be linear, branched, or cyclic. Among these, linear groups are preferred from the viewpoint of development solubility, while cyclic groups are preferred from the viewpoint of heat resistance. The number of carbon atoms is preferably 1 or more, more preferably 3 or more, and even more preferably 6 or more, and is preferably 20 or less, more preferably 15 or less, and even more preferably 10 or less. For example, 1 to 20 is preferred, more preferably 3 to 15, and even more preferably 6 to 10. By making the number equal to or more than the lower limit, developability tends to be improved. By making the number equal to or less than the upper limit, ink repellency tends to be improved.

[0063] Specific examples of the divalent linear aliphatic group include a methylene group, an ethylene group, an n-propylene group, an n-butylene group, an n-hexylene group, and an n-heptylene group. Among these, a methylene group is preferred from the viewpoint of heat resistance. Specific examples of the divalent branched aliphatic group include structures having, as a side chain, a methyl group, an ethyl group, an n-propyl group, an iso-propyl group, an n-butyl group, an iso-butyl group, a sec-butyl group, or a tert-butyl group in the above-mentioned divalent linear aliphatic group. The number of rings in the divalent cyclic aliphatic group is not particularly limited, but is preferably 1 or more, more preferably 2 or more, and is preferably 10 or less, more preferably 5 or less. For example, 1 to 10 is preferred, 1 to 5 is more preferred, and 2 to 5 is even more preferred. By making the number equal to or greater than the lower limit, the ink repellency tends to be good. By making the number equal to or less than the upper limit, the developability tends to be improved. Specific examples of the divalent cyclic aliphatic group include groups in which two hydrogen atoms have been removed from a ring such as a cyclohexane ring, a cycloheptane ring, a cyclodecane ring, a cyclododecane ring, a norbornane ring, an isobornane ring, an adamantane ring, a cyclododecane ring, a dicyclopentane ring, etc. Among these, from the viewpoint of heat resistance, groups in which two hydrogen atoms have been removed from a dicyclopentane ring or an adamantane ring are preferred.

[0064] Examples of the substituent that the divalent aliphatic group may have include an alkoxy group having 1 to 5 carbon atoms, such as a methoxy group or an ethoxy group; a hydroxyl group; a nitro group; a cyano group; and a carboxy group. From the viewpoint of ease of synthesis, the divalent aliphatic group is preferably unsubstituted.

[0065] Examples of the divalent aromatic ring group include a divalent aromatic hydrocarbon ring group and a divalent aromatic heterocyclic group. The number of carbon atoms is preferably 4 or more, more preferably 5 or more, and even more preferably 6 or more, and is preferably 20 or less, more preferably 15 or less, and even more preferably 10 or less. For example, 4 to 20 is preferable, more preferably 5 to 15, and even more preferably 6 to 10. By making the number equal to or more than the lower limit, the ink repellency tends to be improved. By making the number equal to or less than the upper limit, the developability tends to be improved.

[0066] The aromatic hydrocarbon ring in the divalent aromatic hydrocarbon ring group may be a single ring or a condensed ring. Examples of the divalent aromatic hydrocarbon ring group include a benzene ring, a naphthalene ring, an anthracene ring, a phenanthrene ring, a perylene ring, a tetracene ring, a pyrene ring, a benzpyrene ring, a chrysene ring, a triphenylene ring, an acenaphthene ring, a fluoranthene ring, and a fluorene ring, each of which has two free valences.

[0067] The aromatic heterocycle in the aromatic heterocycle group may be a single ring or a condensed ring. Examples of the divalent aromatic heterocycle group include furan ring, benzofuran ring, thiophene ring, benzothiophene ring, pyrrole ring, pyrazole ring, imidazole ring, oxadiazole ring, indole ring, carbazole ring, pyrroloimidazole ring, pyrrolopyrazole ring, pyrrolopyrrole ring, thienopyrrole ring, thienothiophene ring, furopyrrole ring, furofuran ring, thienofuran ring, benzisoxazole ring, benzisothiazole ring, benzimidazole ring, pyridine ring, pyrazine ring, pyridazine ring, pyrimidine ring, triazine ring, quinoline ring, isoquinoline ring, cinnoline ring, quinoxaline ring, phenanthridine ring, perimidine ring, quinazoline ring, quinazolinone ring, and azulene ring, each of which has two free valences. Among these, from the viewpoint of production costs, a benzene ring or a naphthalene ring having two free valences is preferred, and a benzene ring having two free valences is more preferred.

[0068] Examples of the substituent that the divalent aromatic ring group may have include a hydroxyl group, a methyl group, a methoxy group, an ethyl group, an ethoxy group, a propyl group, and a propoxy group. From the viewpoint of curability, the divalent aromatic ring group is preferably unsubstituted.

[0069] Examples of the group in which one or more divalent aliphatic groups are linked to one or more divalent aromatic ring groups include groups in which one or more of the above-mentioned divalent aliphatic groups are linked to one or more of the above-mentioned divalent aromatic ring groups. The number of divalent aliphatic groups is not particularly limited, but is preferably 1 or more, more preferably 2 or more, and is preferably 10 or less, more preferably 5 or less, and even more preferably 3 or less. For example, 1 to 10 is preferred, 1 to 5 is more preferred, 1 to 3 is even more preferred, and 2 to 3 is particularly preferred. By making the number equal to or greater than the lower limit, the developability tends to be improved. By making the number equal to or less than the upper limit, the ink repellency tends to be improved. The number of divalent aromatic ring groups is not particularly limited, but is preferably 1 or more, more preferably 2 or more, and is preferably 10 or less, more preferably 5 or less, and even more preferably 3 or less. For example, 1 to 10 is preferred, 1 to 5 is more preferred, 1 to 3 is even more preferred, and 2 to 3 is particularly preferred. By making the number equal to or greater than the lower limit, developability tends to be improved. By making the number equal to or less than the upper limit, ink repellency tends to be improved.

[0070] Specific examples of the group formed by linking one or more divalent aliphatic groups with one or more divalent aromatic ring groups include groups represented by the following formulas (c1-1) to (c1-6). Among these, from the viewpoint of developability and ink repellency, the group represented by formula (c1-1) is preferred. In the formula, * represents a bond.

[0071] [ka]

[0072] As described above, the benzene ring in formula (c1) may be further substituted with any substituent. Examples of the substituent include a hydroxyl group, a methyl group, a methoxy group, an ethyl group, an ethoxy group, a propyl group, and a propoxy group. The number of the substituents is not particularly limited, and may be one or two or more. From the viewpoint of curability, the benzene ring in formula (c1) is preferably unsubstituted.

[0073] (n) In formula (c1), n ​​represents an integer of 2 or 3. From the viewpoint of adhesion to a substrate, n is preferably 2.

[0074] From the viewpoint of development solubility, the partial structure represented by formula (c1) is preferably a partial structure represented by the following formula (c2).

[0075] [ka]

[0076] (In formula (c2), R c11 , R c12 and n have the same meaning as in formula (c1). R c13 represents a hydrogen atom or a polybasic acid residue. The benzene ring in formula (c2) may be further substituted with any substituent. * represents a bond.)

[0077] The polybasic acid residue refers to a monovalent group obtained by removing one OH group from a polybasic acid or an anhydride thereof. Examples of the polybasic acid include maleic acid, succinic acid, itaconic acid, phthalic acid, tetrahydrophthalic acid, hexahydrophthalic acid, pyromellitic acid, trimellitic acid, benzophenonetetracarboxylic acid, methylhexahydrophthalic acid, endomethylenetetrahydrophthalic acid, chlorendic acid, methyltetrahydrophthalic acid, and biphenyltetracarboxylic acid. Among these, from the viewpoint of patterning characteristics, maleic acid, succinic acid, itaconic acid, phthalic acid, tetrahydrophthalic acid, hexahydrophthalic acid, pyromellitic acid, trimellitic acid, and biphenyltetracarboxylic acid are preferred, and tetrahydrophthalic acid and biphenyltetracarboxylic acid are more preferred.

[0078] The alkali-soluble resin (C-1) may have a partial structure represented by the following general formula (c3) in addition to the partial structure represented by formula (c1): When the alkali-soluble resin (C-1) further has the partial structure represented by formula (c3), the number of crosslinking sites can be easily adjusted, and developability tends to be improved.

[0079] [ka]

[0080] (In formula (c3), R c14 represents a hydrogen atom or a methyl group. R c15 represents a divalent hydrocarbon group which may have a substituent. The benzene ring in formula (c3) may be further substituted with any substituent. * represents a bond.)

[0081] R in formula (c3) c15 As for R in formula (c1), c12 As the substituent that the benzene ring in formula (c3) may have, those exemplified as the substituent that the benzene ring in formula (c1) may have can be preferably used.

[0082] From the viewpoint of development solubility, the partial structure represented by formula (c3) is preferably a partial structure represented by the following formula (c4).

[0083] [ka]

[0084] (In formula (c4), R c14 and R c15 has the same meaning as that in formula (c3) above. R c16 represents a hydrogen atom or a polybasic acid residue. The benzene ring in formula (c4) may be further substituted with any substituent. * represents a bond.)

[0085] R in formula (c4) c16 As for R in formula (c2), c13 can be preferably used.

[0086] From the viewpoints of developability and ink repellency, the alkali-soluble resin (C-1) preferably contains both the partial structure represented by formula (c1) and the partial structure represented by formula (c3). The ratio of formula (c1) to the total number of moles of the partial structure represented by formula (c1) and the partial structure represented by formula (c3) is not particularly limited, but is preferably 20 mol% or more, more preferably 40 mol% or more, even more preferably 50 mol% or more, and usually 100 mol% or less, preferably 90 mol% or less, and even more preferably 80 mol% or less. For example, 20 to 100 mol% is preferable, more preferably 40 to 90 mol%, and even more preferably 50 to 80 mol%. By making it equal to or more than the lower limit, the ink repellency tends to be improved. By making it equal to or less than the upper limit, the developability tends to be improved.

[0087] From the viewpoints of developability and ink repellency, the alkali-soluble resin (C-1) preferably contains both the partial structure represented by formula (c2) and the partial structure represented by formula (c4). The ratio of formula (c2) to the total number of moles of the partial structure represented by formula (c2) and the partial structure represented by formula (c4) is not particularly limited, but is preferably 20 mol% or more, more preferably 40 mol% or more, even more preferably 50 mol% or more, and usually 100 mol% or less, preferably 90 mol% or less, and even more preferably 80 mol% or less. For example, 20 to 100 mol% is preferable, more preferably 40 to 90 mol%, and even more preferably 50 to 80 mol%. By making it equal to or more than the lower limit, the ink repellency tends to be improved. By making it equal to or less than the upper limit, the developability tends to be improved.

[0088] The partial structures represented by the formulae (c1), (c2), (c3) and (c4) contained in one molecule of the alkali-soluble resin (C-1) may each be of one type or two or more types.

[0089] The number of partial structures represented by formula (c1) contained in one molecule of the alkali-soluble resin (C-1) is not particularly limited, but is preferably 1 or more, more preferably 2 or more, even more preferably 3 or more, and is preferably 10 or less, even more preferably 8 or less. For example, 1 to 10 is preferable, more preferably 2 to 10, even more preferably 3 to 8. By making the number equal to or more than the lower limit, the ink repellency tends to be improved. By making the number equal to or less than the upper limit, the developability tends to be improved.

[0090] The number of partial structures represented by formula (c2) contained in one molecule of the alkali-soluble resin (C-1) is not particularly limited, but is preferably 1 or more, more preferably 2 or more, and even more preferably 3 or more, and is preferably 15 or less, more preferably 10 or less, and even more preferably 5 or less. For example, 1 to 15 is preferable, more preferably 2 to 10, and even more preferably 3 to 5. By making the number equal to or more than the lower limit, the ink repellency tends to be improved. By making the number equal to or less than the upper limit, the developability tends to be improved.

[0091] Specific examples of the alkali-soluble resin (C-1) are given below.

[0092] [ka]

[0093] [ka]

[0094] [ka]

[0095] Among these, the alkali-soluble resin of the above formula (C-1-1) is more preferred from the viewpoint of ink repellency.

[0096] The method for producing the alkali-soluble resin (C-1) is not particularly limited, but for example, an ethylenically unsaturated monocarboxylic acid or ester compound is added to an epoxy resin having a partial structure represented by the following formula (c5), and then an isocyanate group-containing compound is optionally reacted, followed by further reaction with a polybasic acid or its anhydride. For example, the carboxy group of an unsaturated monocarboxylic acid is ring-opened and added to the epoxy group of the epoxy resin, thereby adding an ethylenically unsaturated bond to the epoxy compound via an ester bond (-COO-), and one of the carboxy groups of the polybasic acid anhydride can be added to the hydroxyl group generated at that time. A method of adding a polyhydric alcohol at the same time as adding a polybasic acid anhydride can also be mentioned.

[0097] [ka]

[0098] (In formula (c5), R c12 and n have the same meaning as in formula (c1). The benzene ring in formula (c5) may be further substituted with any substituent. * represents a bond.)

[0099] The alkali-soluble resin (C-1) can also be produced by the methods described in JP-A-2016-47919 and JP-A-2017-190403.

[0100] The acid value of the alkali-soluble resin (C-1) is not particularly limited, but is preferably 20 mgKOH / g or more, more preferably 30 mgKOH / g or more, even more preferably 40 mgKOH / g or more, even more preferably 50 mgKOH / g or more, and is preferably 150 mgKOH / g or less, more preferably 140 mgKOH / g or less, even more preferably 130 mgKOH / g or less, and even more preferably 120 mgKOH / g or less. For example, 20 to 150 mgKOH / g is preferred, 30 to 140 mgKOH / g is more preferred, 40 to 130 mgKOH / g is more preferred, and 50 to 120 mgKOH / g is particularly preferred. By making it equal to or more than the lower limit, the developability tends to be improved. By making it equal to or less than the upper limit, the ink repellency tends to be improved.

[0101] The weight average molecular weight (Mw) of the alkali-soluble resin (C-1) is not particularly limited, but is preferably 1000 or more, more preferably 2000 or more, even more preferably 3000 or more, and is preferably 20000 or less, more preferably 15000 or less, even more preferably 10000 or less, and particularly preferably 8000 or less. For example, 1000 to 20000 is preferable, 1000 to 15000 is more preferable, 2000 to 10000 is even more preferable, and 3000 to 8000 is particularly preferable. By making it equal to or more than the lower limit, the development adhesion tends to be improved. By making it equal to or less than the upper limit, the developability tends to be improved.

[0102] The double bond equivalent of the alkali-soluble resin (C-1) is not particularly limited, but is preferably 600 or less, more preferably 500 or less, even more preferably 450 or less, particularly preferably 400 or less, and is preferably 100 or more, more preferably 150 or more, even more preferably 200 or more, and particularly preferably 300 or more. By making it equal to or less than the upper limit, the ink repellency tends to improve. For example, it is preferably 100 to 600, more preferably 150 to 500, even more preferably 200 to 450, and particularly preferably 300 to 400. By making it equal to or more than the lower limit, the developability tends to improve.

[0103] The double bond equivalent of the alkali-soluble resin (C-1) can be calculated from the following formula. (Double bond equivalent of alkali-soluble resin (C-1)) = (molecular weight of alkali-soluble resin (C-1)) / (number of ethylenically unsaturated double bonds per molecule of alkali-soluble resin (C-1))

[0104] The (C) alkali-soluble resin in the photosensitive resin composition of the present invention may further contain an alkali-soluble resin other than the alkali-soluble resin (C-1) (hereinafter, may be referred to as "other alkali-soluble resin"). By containing the other alkali-soluble resin, the developability tends to be improved, which is preferable.

[0105] From the viewpoint of development solubility, the other alkali-soluble resin preferably contains an epoxy (meth)acrylate resin (C-2) other than (C-1) (hereinafter, may be referred to as "epoxy (meth)acrylate resin (C-2)"). On the other hand, from the viewpoint of ink repellency, it preferably contains an acrylic copolymer resin (C-3) having an ethylenically unsaturated group in a side chain (hereinafter, may be referred to as "acrylic copolymer resin (C-3)").

[0106] First, the epoxy (meth)acrylate resin (C-2) will be described in detail.

[0107] [Epoxy (meth)acrylate resin (C-2)] The epoxy (meth)acrylate resin (C-2) is a resin obtained by adding an ethylenically unsaturated monocarboxylic acid or ester compound to an epoxy resin that does not have a partial structure represented by formula (c5), optionally reacting with an isocyanate group-containing compound, and then further reacting with a polybasic acid or its anhydride. For example, the carboxy group of an unsaturated monocarboxylic acid is ring-opened and added to the epoxy group of the epoxy resin, thereby adding an ethylenically unsaturated group to the epoxy resin via an ester bond (-COO-), and one of the carboxy groups of the polybasic acid anhydride is added to the hydroxyl group generated at that time. When the polybasic acid anhydride is added, a polyhydric alcohol is also added at the same time.

[0108] The epoxy (meth)acrylate resin (C-2) also includes a resin obtained by reacting the carboxy group of the resin obtained by the above reaction with a compound having a functional group that can further react.

[0109] Here, the epoxy resin specifically includes, for example, bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol S epoxy resin, phenol novolac epoxy resin, cresol novolac epoxy resin, biphenyl novolac epoxy resin, trisphenol epoxy resin, polymerized epoxy resin of phenol and dicyclopentadiene, dihydroxylfluorene type epoxy resin, dihydroxylalkyleneoxylfluorene type epoxy resin, diglycidyl ether of 9,9-bis(4'-hydroxyphenyl)fluorene, and diglycidyl ether of 1,1-bis(4'-hydroxyphenyl)adamantane. As the epoxy resin, the epoxy resin having an aromatic ring in the main chain as described above can be suitably used.

[0110] Among these, from the viewpoint of heat resistance, bisphenol A epoxy resin, phenol novolac epoxy resin, cresol novolac epoxy resin, polymerized epoxy resin of phenol and dicyclopentadiene, and diglycidyl ether of 9,9-bis(4'-hydroxyphenyl)fluorene are preferred, and bisphenol A epoxy resin is more preferred. Examples of epoxy resins include bisphenol A type epoxy resins (e.g., Mitsubishi Chemical Corporation's "jER (registered trademark, the same applies below) 828," "jER1001," "jER1002," and "jER1004," Nippon Kayaku Co., Ltd.'s "NER-1302" (epoxy equivalent: 323, softening point: 76°C), etc.), bisphenol F type resins (e.g., Mitsubishi Chemical Corporation's "jER807," "jER4004P," "jER4005P," and "jER4007P," Nippon Kayaku Co., Ltd.'s "NER-1302" (epoxy equivalent: 323, softening point: 76°C), etc.), Nippon Kayaku's "NER-7406" (epoxy equivalent: 350, softening point: 66°C), etc.), bisphenol S type epoxy resin, biphenyl glycidyl ether (e.g., Mitsubishi Chemical's "jERYX-4000"), phenol novolac type epoxy resin (e.g., Nippon Kayaku's "EPPN-201", Mitsubishi Chemical's "jER152", "jER154", Dow Chemical's "DEN-438"), (o,m,p-)cresol novolac type Epoxy resins (e.g., Nippon Kayaku's "EOCN (registered trademark, the same applies below)-102S", "EOCN-1020", and "EOCN-104S"), triglycidyl isocyanurate (e.g., Nissan Chemical's "TEPIC (registered trademark)"), trisphenolmethane type epoxy resins (e.g., Nippon Kayaku's "EPPN (registered trademark, the same applies below)-501", "EPPN-502", and "EPPN-503"), alicyclic epoxy resins (Daicel's "Celloxide (registered trademark, the same applies below) 2021P", "Celloxide EHPE"), epoxy resins obtained by glycidylating phenolic resins obtained by reacting dicyclopentadiene with phenol (for example, "EXA-7200" manufactured by DIC Corporation, "NC-7300" and "XD-1000" manufactured by Nippon Kayaku Co., Ltd.), biphenyl-type epoxy resins (for example, "NC-7000" manufactured by Nippon Kayaku Co., Ltd.), and "E-201" manufactured by Osaka Organic Chemical Industry Co., Ltd. can be suitably used. Among these, "XD-1000" manufactured by Nippon Kayaku Co., Ltd., "NC-3000" manufactured by Nippon Kayaku Co., Ltd., "ESF-300" manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., and "E-201" manufactured by Osaka Organic Chemical Industry Co., Ltd. are preferred.

[0111] Examples of ethylenically unsaturated monocarboxylic acids include (meth)acrylic acid, crotonic acid, maleic acid, fumaric acid, itaconic acid, citraconic acid, and pentaerythritol tri(meth)acrylate succinic anhydride adduct, pentaerythritol tri(meth)acrylate tetrahydrophthalic anhydride adduct, dipentaerythritol penta(meth)acrylate succinic anhydride adduct, dipentaerythritol penta(meth)acrylate phthalic anhydride adduct, dipentaerythritol penta(meth)acrylate tetrahydrophthalic anhydride adduct, and the reaction product of (meth)acrylic acid and ε-caprolactone. Among these, from the viewpoint of sensitivity, (meth)acrylic acid is preferred.

[0112] Examples of polybasic acids (anhydrides) include succinic acid, maleic acid, itaconic acid, phthalic acid, tetrahydrophthalic acid, 3-methyltetrahydrophthalic acid, 4-methyltetrahydrophthalic acid, 3-ethyltetrahydrophthalic acid, 4-ethyltetrahydrophthalic acid, hexahydrophthalic acid, 3-methylhexahydrophthalic acid, 4-methylhexahydrophthalic acid, 3-ethylhexahydrophthalic acid, 4-ethylhexahydrophthalic acid, trimellitic acid, pyromellitic acid, benzophenonetetracarboxylic acid, biphenyltetracarboxylic acid, and anhydrides thereof. Among these, from the viewpoint of suppressing outgassing from the cured product and ensuring long-term reliability, succinic anhydride, maleic anhydride, tetrahydrophthalic anhydride, and hexahydrophthalic anhydride are preferred, and succinic anhydride and tetrahydrophthalic anhydride are more preferred.

[0113] By using polyhydric alcohol, it is possible to increase the molecular weight of the epoxy (meth)acrylate resin (C-2), introduce branching into the molecule, and tend to balance the molecular weight and viscosity. In addition, it is possible to increase the introduction rate of acid groups into the molecule, and tend to balance the sensitivity and adhesion. The polyhydric alcohol is preferably one or more polyhydric alcohols selected from trimethylolpropane, ditrimethylolpropane, pentaerythritol, dipentaerythritol, trimethylolethane, and 1,2,3-propanetriol.

[0114] In addition to the above, examples of the epoxy (meth)acrylate resin (C-2) include those described in Korean Patent Publication No. 10-2013-0022955.

[0115] Among the epoxy (meth)acrylate resins (C-2), from the viewpoint of development solubility, it is preferable to include at least one selected from the group consisting of an epoxy (meth)acrylate resin having a partial structure represented by the following general formula (i) and not having the partial structure represented by formula (c1) (hereinafter, may be referred to as "epoxy (meth)acrylate resin (C-2-1)") and an epoxy (meth)acrylate resin having a partial structure represented by the following general formula (ii) and not having the partial structure represented by formula (c1) (hereinafter, may be referred to as "epoxy (meth)acrylate resin (C-2-2)").

[0116] [ka]

[0117] (In formula (i), R a represents a hydrogen atom or a methyl group. R b represents a divalent hydrocarbon group which may have a substituent. The benzene ring in formula (i) may be further substituted with any substituent. * represents a bond.)

[0118] [ka]

[0119] (In formula (ii), R ceach independently represents a hydrogen atom or a methyl group. R d represents a divalent hydrocarbon group having a cyclic hydrocarbon group as a side chain. R e and R f each independently represents a divalent aliphatic group which may have a substituent. l and m each independently represent an integer of 0 to 2. * represents a bond.)

[0120] The epoxy (meth)acrylate resin (C-2-1) will be described in detail.

[0121] [ka]

[0122] (In formula (i), R a represents a hydrogen atom or a methyl group. R b represents a divalent hydrocarbon group which may have a substituent. The benzene ring in formula (i) may be further substituted with any substituent. * represents a bond.)

[0123] R in formula (i) b As for R in formula (c1), c12 can be preferably used. The benzene ring in formula (i) may be further substituted with any substituent, and examples of the substituent include a hydroxyl group, a methyl group, a methoxy group, an ethyl group, an ethoxy group, a propyl group, and a propoxy group. The number of the substituents is not particularly limited, and may be one or two or more.

[0124] From the viewpoint of development solubility, the partial structure represented by formula (i) is preferably a partial structure represented by the following formula (i-1).

[0125] [ka]

[0126] (In formula (i-1), R a and R b is R in formula (i) a and R b is synonymous with. R Y represents a hydrogen atom or a polybasic acid residue. The benzene ring in formula (i-1) may be further substituted with any substituent. * represents a bond.)

[0127] R in formula (i-1) Y As for R in formula (c2), c13 can be preferably used. The benzene ring in formula (i-1) may be further substituted with any substituent. Examples of the substituent include a hydroxyl group, a methyl group, a methoxy group, an ethyl group, an ethoxy group, a propyl group, and a propoxy group. The number of the substituent is not particularly limited, and may be one or more than one.

[0128] The repeating unit structure represented by formula (i-1) contained in one molecule of the epoxy (meth)acrylate resin (C-2-1) may be of one type or of two or more types.

[0129] The number of partial structures represented by formula (i) contained in one molecule of the epoxy (meth)acrylate resin (C-2-1) is not particularly limited, but is preferably 1 or more, more preferably 2 or more, even more preferably 3 or more, and is preferably 10 or less, even more preferably 8 or less. For example, 1 to 10 is preferable, more preferably 2 to 10, even more preferably 3 to 8. By making the number equal to or more than the lower limit, the developability tends to be improved. By making the number equal to or less than the upper limit, the ink repellency tends to be improved.

[0130] The number of partial structures represented by formula (i-1) contained in one molecule of the epoxy (meth)acrylate resin (C-2-1) is not particularly limited, but is preferably 1 or more, more preferably 2 or more, even more preferably 3 or more, and is preferably 10 or less, even more preferably 8 or less. For example, 1 to 10 is preferable, more preferably 2 to 10, even more preferably 3 to 8. By making the number equal to or more than the lower limit, the developability tends to be improved. By making the number equal to or less than the upper limit, the ink repellency tends to be improved.

[0131] Specific examples of the epoxy (meth)acrylate resin (C-2-1) are shown below.

[0132] [ka]

[0133] [ka]

[0134] [ka]

[0135] [ka]

[0136] [ka]

[0137] [ka]

[0138] [ka]

[0139] Next, the epoxy (meth)acrylate resin (C-2-2) will be described in detail.

[0140] [ka]

[0141] (In formula (ii), R c each independently represents a hydrogen atom or a methyl group. R d represents a divalent hydrocarbon group having a cyclic hydrocarbon group as a side chain. R e and R f each independently represents a divalent aliphatic group which may have a substituent. l and m each independently represent an integer of 0 to 2. * represents a bond.)

[0142] (R d ) In formula (ii), R d represents a divalent hydrocarbon group having a cyclic hydrocarbon group as a side chain. The cyclic hydrocarbon group includes an aliphatic ring group or an aromatic ring group.

[0143] The number of rings in the aliphatic ring group is not particularly limited, but is usually 1 or more, preferably 2 or more, and preferably 10 or less, more preferably 5 or less, and even more preferably 3 or less. For example, 1 to 10 is preferred, 1 to 5 is more preferred, even more preferably 1 to 3, and particularly preferably 2 to 3. By making the number equal to or greater than the lower limit, the ink repellency tends to improve. By making the number equal to or less than the upper limit, the developability tends to improve. The number of carbon atoms in the aliphatic ring group is preferably 4 or more, more preferably 6 or more, and even more preferably 8 or more, and is preferably 40 or less, more preferably 30 or less, still more preferably 20 or less, and particularly preferably 15 or less. For example, 4 to 40 is preferred, more preferably 4 to 30, still more preferably 6 to 20, and particularly preferably 8 to 15. By making the number equal to or more than the lower limit, the ink repellency tends to be improved. By making the number equal to or less than the upper limit, the developability tends to be improved.

[0144] Specific examples of the aliphatic ring in the aliphatic ring group include a cyclohexane ring, a cycloheptane ring, a cyclodecane ring, a cyclododecane ring, a norbornane ring, an isobornane ring, an adamantane ring, and a cyclododecane ring. Among these, an adamantane ring is preferred from the viewpoint of heat resistance.

[0145] The number of rings in the aromatic ring group is not particularly limited, but is usually 1 or more, preferably 2 or more, more preferably 3 or more, and preferably 10 or less, more preferably 5 or less, and even more preferably 4 or less. For example, 1 to 10 is preferred, 2 to 5 is more preferred, and 3 to 4 is even more preferred. By making the number equal to or greater than the lower limit, the ink repellency tends to improve. By making the number equal to or less than the upper limit, the developability tends to improve.

[0146] Examples of the aromatic ring group include an aromatic hydrocarbon ring group and an aromatic heterocyclic group. The number of carbon atoms in the aromatic ring group is preferably 4 or more, more preferably 6 or more, even more preferably 8 or more, even more preferably 10 or more, and particularly preferably 12 or more, and is preferably 40 or less, more preferably 30 or less, even more preferably 20 or less, and particularly preferably 15 or less. For example, 4 to 40 is preferred, 6 to 40 is more preferred, 8 to 30 is more preferred, even more preferably 10 to 20, and particularly preferably 12 to 15. By making it equal to or more than the lower limit, the ink repellency tends to be improved. By making it equal to or less than the upper limit, the developability tends to be improved.

[0147] Specific examples of the aromatic ring in the aromatic ring group include a benzene ring, a naphthalene ring, an anthracene ring, a phenanthrene ring, a perylene ring, a tetracene ring, a pyrene ring, a benzpyrene ring, a chrysene ring, a triphenylene ring, an acenaphthene ring, a fluoranthene ring, and a fluorene ring. Among these, a fluorene ring is preferred from the viewpoint of heat resistance.

[0148] The divalent hydrocarbon group in the divalent hydrocarbon group having a cyclic hydrocarbon group as a side chain is not particularly limited, and examples thereof include a divalent aliphatic group, a divalent aromatic ring group, and a group in which one or more divalent aliphatic groups are linked to one or more divalent aromatic ring groups.

[0149] The divalent aliphatic group may be linear, branched, or cyclic. Among these, linear groups are preferred from the viewpoint of improving developability. Meanwhile, cyclic groups are preferred from the viewpoint of heat resistance. The number of carbon atoms is usually 1 or more, preferably 3 or more, more preferably 6 or more, and preferably 25 or less, more preferably 20 or less, and even more preferably 15 or less. For example, 1 to 25 is preferred, more preferably 3 to 20, and even more preferably 6 to 15. By making the number equal to or more than the lower limit, the ink repellency tends to be improved. By making the number equal to or less than the upper limit, the developability tends to be improved.

[0150] Specific examples of the divalent linear aliphatic group include a methylene group, an ethylene group, an n-propylene group, an n-butylene group, an n-hexylene group, and an n-heptylene group. Among these, a methylene group is preferred from the viewpoint of heat resistance. Specific examples of the divalent branched aliphatic group include structures in which the above-mentioned divalent linear aliphatic group has a methyl group, ethyl group, n-propyl group, iso-propyl group, n-butyl group, iso-butyl group, sec-butyl group, or tert-butyl group as a side chain.

[0151] The number of rings in the divalent cyclic aliphatic group is not particularly limited, but is usually 1 or more, preferably 2 or more, and preferably 10 or less, more preferably 5 or less, and even more preferably 3 or less. For example, 1 to 10 is preferred, 1 to 5 is more preferred, 1 to 3 is even more preferred, and 2 to 3 is particularly preferred. By making the number equal to or greater than the lower limit, the ink repellency tends to improve. By making the number equal to or less than the upper limit, the developability tends to improve.

[0152] Specific examples of the divalent cyclic aliphatic group include a cyclohexane ring, a cycloheptane ring, a cyclodecane ring, a cyclododecane ring, a norbornane ring, an isobornane ring, an adamantane ring, and a group in which two hydrogen atoms have been removed from a cyclododecane ring. Among these, from the viewpoint of heat resistance, a group in which two hydrogen atoms have been removed from an adamantane ring is preferred.

[0153] Examples of the substituent that the divalent aliphatic group may have include an alkoxy group having 1 to 5 carbon atoms, such as a methoxy group or an ethoxy group; a hydroxyl group; a nitro group; a cyano group; and a carboxy group. From the viewpoint of ease of synthesis, the divalent aliphatic group is preferably unsubstituted.

[0154] The divalent aromatic ring group includes a divalent aromatic hydrocarbon ring group and a divalent aromatic heterocyclic group. The number of carbon atoms is preferably 4 or more, more preferably 5 or more, and even more preferably 6 or more, and is preferably 30 or less, more preferably 20 or less, and even more preferably 15 or less. For example, 4 to 30 is preferable, more preferably 5 to 20, and even more preferably 6 to 15. By making the number equal to or more than the lower limit, the ink repellency tends to be improved. By making the number equal to or less than the upper limit, the developability tends to be improved.

[0155] The aromatic hydrocarbon ring in the divalent aromatic hydrocarbon ring group may be a single ring or a condensed ring. Examples of the divalent aromatic hydrocarbon ring group include a benzene ring, a naphthalene ring, an anthracene ring, a phenanthrene ring, a perylene ring, a tetracene ring, a pyrene ring, a benzpyrene ring, a chrysene ring, a triphenylene ring, an acenaphthene ring, a fluoranthene ring, and a fluorene ring, each of which has two free valences.

[0156] The aromatic heterocycle in the aromatic heterocycle group may be a single ring or a condensed ring. Examples of the divalent aromatic heterocycle group include furan ring, benzofuran ring, thiophene ring, benzothiophene ring, pyrrole ring, pyrazole ring, imidazole ring, oxadiazole ring, indole ring, carbazole ring, pyrroloimidazole ring, pyrrolopyrazole ring, pyrrolopyrrole ring, thienopyrrole ring, thienothiophene ring, furopyrrole ring, furofuran ring, thienofuran ring, benzisoxazole ring, benzisothiazole ring, benzimidazole ring, pyridine ring, pyrazine ring, pyridazine ring, pyrimidine ring, triazine ring, quinoline ring, isoquinoline ring, cinnoline ring, quinoxaline ring, phenanthridine ring, benzimidazole ring, perimidine ring, quinazoline ring, quinazolinone ring, and azulene ring, each of which has two free valences. Among these, from the viewpoint of production costs, a benzene ring or a naphthalene ring having two free valences is preferred, and a benzene ring having two free valences is more preferred.

[0157] Examples of the substituent that the divalent aromatic ring group may have include a hydroxy group, a methyl group, a methoxy group, an ethyl group, an ethoxy group, a propyl group, a propoxy group, etc. From the viewpoint of curability, the divalent aromatic ring group is preferably unsubstituted.

[0158] Examples of the group in which one or more divalent aliphatic groups are linked to one or more divalent aromatic ring groups include groups in which one or more of the above-mentioned divalent aliphatic groups are linked to one or more of the above-mentioned divalent aromatic ring groups. The number of divalent aliphatic groups is not particularly limited, but is usually 1 or more, preferably 2 or more, and preferably 10 or less, more preferably 5 or less, and even more preferably 3 or less. For example, 1 to 10 is preferable, 1 to 5 is more preferable, 1 to 3 is even more preferable, and 2 to 3 is particularly preferable. By making it equal to or more than the lower limit, developability tends to be improved. By making it equal to or less than the upper limit, heat resistance tends to be improved. The number of divalent aromatic ring groups is not particularly limited, but is usually 1 or more, preferably 2 or more, and preferably 10 or less, more preferably 5 or less, and even more preferably 3 or less. For example, 1 to 10 is preferred, 1 to 5 is more preferred, 1 to 3 is even more preferred, and 2 to 3 is particularly preferred. By making the number equal to or greater than the lower limit, the ink repellency tends to improve. By making the number equal to or less than the upper limit, the developability tends to improve.

[0159] Specific examples of the group formed by linking one or more divalent aliphatic groups with one or more divalent aromatic ring groups include the groups represented by the formulas (c1-1) to (c1-6) above. Among these, the group represented by the formula (c1-3) above is preferred from the viewpoint of film strength.

[0160] The bonding mode of the cyclic hydrocarbon group as a side chain to these divalent hydrocarbon groups is not particularly limited, but examples include a mode in which one hydrogen atom of an aliphatic group or an aromatic ring group is substituted with a cyclic hydrocarbon group as a side chain, and a mode in which a cyclic hydrocarbon group as a side chain is formed by including one carbon atom of an aliphatic group.

[0161] (R e , R g ) In formula (ii), R e and R g each independently represents a divalent aliphatic group which may have a substituent.

[0162] The divalent aliphatic group may be linear, branched, or cyclic. Among these, linear groups are preferred from the viewpoint of development solubility, while cyclic groups are preferred from the viewpoint of heat resistance.

[0163] The number of carbon atoms is usually 1 or more, preferably 3 or more, more preferably 6 or more, and preferably 20 or less, more preferably 15 or less, and even more preferably 10 or less. For example, 1 to 20 is preferable, more preferably 3 to 15, and even more preferably 6 to 10. By making it equal to or more than the lower limit, adhesion to the substrate and ink repellency tend to be improved. By making it equal to or less than the upper limit, deterioration of sensitivity and film loss during development are easily suppressed, and resolution tends to be improved.

[0164] Specific examples of the divalent linear aliphatic group include a methylene group, an ethylene group, an n-propylene group, an n-butylene group, an n-pentylene group, an n-hexylene group, and an n-heptylene group. Among these, a methylene group is preferred from the viewpoint of the rigidity of the skeleton.

[0165] Examples of the divalent branched aliphatic group include a structure having, as a side chain, a methyl group, an ethyl group, an n-propyl group, an iso-propyl group, an n-butyl group, an iso-butyl group, a sec-butyl group, or a tert-butyl group in the above-mentioned divalent linear aliphatic group.

[0166] The number of rings in the divalent cyclic aliphatic group is not particularly limited, but is usually 1 or more, preferably 2 or more, and preferably 12 or less, more preferably 10 or less. For example, 1 to 12 is preferable, 1 to 10 is more preferable, and 2 to 10 is even more preferable. By making the number equal to or greater than the lower limit, adhesion to the substrate and ink repellency tend to be improved. By making the number equal to or less than the upper limit, deterioration of sensitivity and film loss during development are easily suppressed, and resolution tends to be improved.

[0167] Specific examples of the divalent cyclic aliphatic group include groups in which two hydrogen atoms have been removed from a cyclohexane ring, a cycloheptane ring, a cyclodecane ring, a cyclododecane ring, a norbornane ring, an isobornane ring, an adamantane ring, a cyclododecane ring, or a dicyclopentadiene ring. Among these, from the viewpoint of heat resistance, groups in which two hydrogen atoms have been removed from a dicyclopentadiene ring or an adamantane ring are preferred.

[0168] Examples of the substituent that the divalent aliphatic group may have include an alkoxy group having 1 to 5 carbon atoms, such as a methoxy group or an ethoxy group, a hydroxyl group, a nitro group, a cyano group, a carboxy group, etc. From the viewpoint of ease of synthesis, the divalent aliphatic group is preferably unsubstituted.

[0169] (l, m) In formula (ii), l and m each independently represent an integer of 0 to 2. By making it equal to or greater than the lower limit, adhesion to the substrate tends to be improved. By making it equal to or less than the upper limit, developability tends to be good. From the viewpoint of developability, l and m are preferably 0. On the other hand, from the viewpoint of adhesion to the substrate, l and m are preferably 1 or more.

[0170] From the viewpoints of film strength and ink repellency, the partial structure represented by formula (ii) is preferably a partial structure represented by the following formula (ii-1).

[0171] [ka]

[0172] (In formula (ii-1), R c , R e , R f , l and m are defined as in formula (ii) above. R α represents an optionally substituted monovalent cyclic hydrocarbon group. n is an integer of 1 or greater. The benzene ring in formula (ii-1) may be further substituted with any substituent. * represents a bond.)

[0173] (R α ) In formula (ii-1), R α represents an optionally substituted monovalent cyclic hydrocarbon group. The cyclic hydrocarbon group includes an aliphatic ring group or an aromatic ring group.

[0174] The number of rings in the aliphatic ring group is not particularly limited, but is usually 1 or more, preferably 2 or more, and preferably 6 or less, more preferably 4 or less, and even more preferably 3 or less. For example, 1 to 6 is preferred, 1 to 4 is more preferred, 1 to 3 is even more preferred, and 2 to 3 is particularly preferred. By making the number equal to or greater than the lower limit, the ink repellency tends to improve. By making the number equal to or less than the upper limit, the developability tends to improve. The number of carbon atoms in the aliphatic ring group is preferably 4 or more, more preferably 6 or more, and even more preferably 8 or more, and is preferably 40 or less, more preferably 30 or less, still more preferably 20 or less, and particularly preferably 15 or less. For example, 4 to 40 is preferred, more preferably 4 to 30, still more preferably 6 to 20, and particularly preferably 8 to 15. By making the number equal to or more than the lower limit, the ink repellency tends to be improved. By making the number equal to or less than the upper limit, the developability tends to be improved.

[0175] Specific examples of the aliphatic ring in the aliphatic ring group include a cyclohexane ring, a cycloheptane ring, a cyclodecane ring, a cyclododecane ring, a norbornane ring, an isobornane ring, an adamantane ring, and a cyclododecane ring. Among these, an adamantane ring is preferred from the viewpoint of achieving both ink repellency and developability.

[0176] On the other hand, the number of rings in the aromatic ring group is not particularly limited, but is usually 1 or more, preferably 2 or more, more preferably 3 or more, and is preferably 10 or less, more preferably 5 or less. For example, 1 to 10 is preferred, 2 to 10 is more preferred, and 3 to 5 is even more preferred. By making the number equal to or greater than the lower limit, the ink repellency tends to improve. By making the number equal to or less than the upper limit, the developability tends to improve. Examples of the aromatic ring group include an aromatic hydrocarbon ring group and an aromatic heterocyclic group. The number of carbon atoms in the aromatic ring group is preferably 4 or more, more preferably 5 or more, and even more preferably 6 or more, and is preferably 30 or less, more preferably 20 or less, and even more preferably 15 or less. For example, 4 to 30 is preferable, more preferably 5 to 20, and even more preferably 6 to 15. By making the number equal to or more than the lower limit, the ink repellency tends to be improved. By making the number equal to or less than the upper limit, the developability tends to be improved.

[0177] Specific examples of the aromatic ring in the aromatic ring group include a benzene ring, a naphthalene ring, an anthracene ring, a phenanthrene ring, and a fluorene ring. Among these, the fluorene ring is preferred from the viewpoint of achieving both ink repellency and developability.

[0178] Examples of the substituent that the cyclic hydrocarbon group may have include an alkyl group having 1 to 5 carbon atoms, such as a hydroxy group, a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, a sec-butyl group, a tert-butyl group, an amyl group, and an isoamyl group; an alkoxy group having 1 to 5 carbon atoms, such as a methoxy group and an ethoxy group; a nitro group; a cyano group; and a carboxy group. From the viewpoint of ease of synthesis, the cyclic hydrocarbon group is preferably unsubstituted.

[0179] n represents an integer of 1 or more, preferably 2 or more, and preferably 3 or less. For example, 1 to 3 is preferable, and 2 to 3 is more preferable. By making it equal to or more than the lower limit, the ink repellency tends to be improved. By making it equal to or less than the upper limit, the developability tends to be improved.

[0180] Among these, from the viewpoint of both ink repellency and developability, R α is preferably a monovalent aliphatic cyclic group, and more preferably an adamantyl group.

[0181] As described above, the benzene ring in formula (ii-1) may be further substituted with any substituent. Examples of the substituent include a hydroxyl group, a methyl group, a methoxy group, an ethyl group, an ethoxy group, a propyl group, and a propoxy group. The number of the substituent is not particularly limited, and may be one or more than one. From the viewpoint of curability, the benzene ring in formula (ii-1) is preferably unsubstituted.

[0182] Specific examples of the partial structure represented by formula (ii-1) are given below.

[0183] [ka]

[0184] [ka]

[0185] [ka]

[0186] [ka]

[0187] [ka]

[0188] From the viewpoint of development adhesion, the partial structure represented by formula (ii) is preferably a partial structure represented by the following formula (ii-2).

[0189] [ka]

[0190] (In formula (ii-2), R c , R e , R f, l and m are defined as in formula (ii) above. R β represents a divalent cyclic hydrocarbon group which may have a substituent. The benzene ring in formula (ii-2) may be further substituted with any substituent. * represents a bond.)

[0191] (R β ) In formula (ii-2), R β represents a divalent cyclic hydrocarbon group which may have a substituent. The cyclic hydrocarbon group includes an aliphatic ring group or an aromatic ring group.

[0192] The number of rings in the aliphatic ring group is not particularly limited, but is usually 1 or more, preferably 2 or more, and is preferably 10 or less, more preferably 5 or less. For example, 1 to 10 is preferred, and 2 to 5 is more preferred. By making the number equal to or more than the lower limit, the developability tends to be improved. By making the number equal to or less than the upper limit, the ink repellency tends to be improved. The number of carbon atoms in the aliphatic ring group is preferably 4 or more, more preferably 6 or more, and even more preferably 8 or more, and is preferably 40 or less, more preferably 35 or less, and even more preferably 30 or less. For example, 4 to 40 is preferable, more preferably 6 to 35, and even more preferably 8 to 30. By making the number equal to or more than the lower limit, the ink repellency tends to be improved. By making the number equal to or less than the upper limit, the developability tends to be improved. Specific examples of the aliphatic ring in the aliphatic ring group include a cyclohexane ring, a cycloheptane ring, a cyclodecane ring, a cyclododecane ring, a norbornane ring, an isobornane ring, an adamantane ring, and a cyclododecane ring. Among these, an adamantane ring is preferred from the viewpoint of achieving both ink repellency and developability.

[0193] The number of rings in the aromatic ring group is not particularly limited, but is usually 1 or more, preferably 2 or more, more preferably 3 or more, and is preferably 10 or less, more preferably 5 or less. For example, 1 to 10 is preferred, 2 to 10 is more preferred, and 3 to 5 is even more preferred. By making the number equal to or greater than the lower limit, the ink repellency tends to improve. By making the number equal to or less than the upper limit, the developability tends to improve. Examples of the aromatic ring group include an aromatic hydrocarbon ring group and an aromatic heterocyclic group. The number of carbon atoms in the aromatic ring group is preferably 4 or more, more preferably 6 or more, even more preferably 8 or more, and particularly preferably 10 or more, and is preferably 40 or less, more preferably 30 or less, even more preferably 20 or less, and particularly preferably 15 or less. For example, 4 to 40 is preferred, 6 to 30 is more preferred, even more preferably 8 to 20, and particularly preferably 10 to 15. By making it equal to or more than the lower limit, the ink repellency tends to be improved. By making it equal to or less than the upper limit, the developability tends to be improved.

[0194] Specific examples of the aromatic ring in the aromatic ring group include a benzene ring, a naphthalene ring, an anthracene ring, a phenanthrene ring, and a fluorene ring. Among these, the fluorene ring is preferred from the viewpoints of ink repellency and developability.

[0195] Examples of the substituent that the cyclic hydrocarbon group may have include alkyl groups having 1 to 5 carbon atoms, such as a hydroxy group, a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, a sec-butyl group, a tert-butyl group, an amyl group, and an iso-amyl group; alkoxy groups having 1 to 5 carbon atoms, such as a methoxy group and an ethoxy group; a nitro group; a cyano group; and a carboxy group. From the viewpoint of ease of synthesis, it is preferable that the cyclic hydrocarbon group is unsubstituted.

[0196] Among these, from the viewpoints of both ink repellency and developability, and heat resistance, R β is preferably a divalent aliphatic ring group, and more preferably a divalent adamantane ring group. On the other hand, from the viewpoints of both ink repellency and developability and heat resistance, R βis preferably a divalent aromatic ring group, and more preferably a divalent fluorene ring group.

[0197] The benzene ring in formula (ii-2) may be further substituted with any substituent. Examples of the substituent include a hydroxyl group, a methyl group, a methoxy group, an ethyl group, an ethoxy group, a propyl group, and a propoxy group. The number of the substituent is not particularly limited, and may be one or more than one. From the viewpoint of curability, the benzene ring in formula (ii-2) is preferably unsubstituted.

[0198] Specific examples of the partial structure represented by formula (ii-2) are given below.

[0199] [ka]

[0200] [ka]

[0201] [ka]

[0202] [ka]

[0203] On the other hand, the partial structure represented by formula (ii) is preferably a partial structure represented by the following formula (ii-3) from the viewpoint of developability.

[0204] [ka]

[0205] (In formula (ii-3), R c , R d , R e , R f, l and m are defined as in formula (ii) above. R Z represents a hydrogen atom or a polybasic acid residue.

[0206] The polybasic acid residue refers to a monovalent group obtained by removing one OH group from a polybasic acid or an anhydride thereof. Examples of the polybasic acid include maleic acid, succinic acid, itaconic acid, phthalic acid, tetrahydrophthalic acid, hexahydrophthalic acid, pyromellitic acid, trimellitic acid, benzophenonetetracarboxylic acid, methylhexahydrophthalic acid, endomethylenetetrahydrophthalic acid, chlorendic acid, methyltetrahydrophthalic acid, and biphenyltetracarboxylic acid. Among these, from the viewpoint of patterning characteristics, maleic acid, succinic acid, itaconic acid, phthalic acid, tetrahydrophthalic acid, hexahydrophthalic acid, pyromellitic acid, trimellitic acid, and biphenyltetracarboxylic acid are preferred, and tetrahydrophthalic acid and biphenyltetracarboxylic acid are more preferred.

[0207] The partial structure represented by formula (ii-3) contained in one molecule of the epoxy (meth)acrylate resin (C-2-2) may be of one type or of two or more types.

[0208] The number of partial structures represented by formula (ii) contained in one molecule of the epoxy (meth)acrylate resin (C-2-2) is not particularly limited, but is preferably 1 or more, more preferably 3 or more, and is preferably 20 or less, more preferably 15 or less, and even more preferably 10 or less. For example, 1 to 20 is preferable, more preferably 1 to 15, and even more preferably 3 to 10. By making the number equal to or more than the lower limit, the ink repellency tends to be improved. By making the number equal to or less than the upper limit, the developability tends to be improved.

[0209] The number of partial structures represented by formula (ii-1) contained in one molecule of the epoxy (meth)acrylate resin (C-2-2) is not particularly limited, but is preferably 1 or more, more preferably 3 or more, and is preferably 20 or less, more preferably 15 or less, and even more preferably 10 or less. For example, 1 to 20 is preferable, more preferably 1 to 15, and even more preferably 3 to 10. By making the number equal to or greater than the lower limit, the ink repellency tends to improve. By making the number equal to or less than the upper limit, the developability tends to improve.

[0210] The number of partial structures represented by formula (ii-2) contained in one molecule of the epoxy (meth)acrylate resin (C-2-2) is not particularly limited, but is preferably 1 or more, more preferably 3 or more, and is preferably 20 or less, more preferably 15 or less, and even more preferably 10 or less. For example, 1 to 20 is preferable, 1 to 15 is more preferable, 1 to 10 is even more preferable, and 3 to 10 is particularly preferable. By making the number equal to or more than the lower limit, the ink repellency tends to be improved. By making the number equal to or less than the upper limit, the developability tends to be improved.

[0211] The number of partial structures represented by formula (ii-3) contained in one molecule of the epoxy (meth)acrylate resin (C-2-2) is not particularly limited, but is preferably 1 or more, more preferably 3 or more, and is preferably 20 or less, more preferably 15 or less, and even more preferably 10 or less. For example, 1 to 20 is preferable, 1 to 15 is more preferable, 1 to 10 is even more preferable, and 3 to 10 is particularly preferable. By making the number equal to or more than the lower limit, the developability tends to be improved. By making the number equal to or less than the upper limit, the ink repellency tends to be improved.

[0212] The acid value of the epoxy (meth)acrylate resin (C-2) is not particularly limited, but is preferably 10 mgKOH / g or more, more preferably 30 mgKOH / g or more, even more preferably 50 mgKOH / g or more, even more preferably 70 mgKOH / g or more, particularly preferably 80 mgKOH / g or more, and is preferably 200 mgKOH / g or less, more preferably 180 mgKOH / g or less, even more preferably 150 mgKOH / g or less, even more preferably 120 mgKOH / g or less, and particularly preferably 110 mgKOH / g or less. For example, 10 to 200 mgKOH / g is preferred, more preferably 30 to 180 mgKOH / g, even more preferably 50 to 150 mgKOH / g, even more preferably 70 to 120 mgKOH / g, and particularly preferably 80 to 110 mgKOH / g. By making it equal to or more than the lower limit, the developability tends to be improved. By setting the content to the upper limit or less, the strength of the ink repellent film tends to be improved.

[0213] The weight average molecular weight (Mw) of the epoxy (meth)acrylate resin (C-2) is not particularly limited, but is preferably 1000 or more, more preferably 2000 or more, even more preferably 3000 or more, particularly preferably 3500 or more, and is preferably 30000 or less, more preferably 15000 or less, even more preferably 10000 or less, even more preferably 8000 or less, and particularly preferably 5000 or less. For example, 1000 to 30000 is preferable, 1000 to 15000 is more preferable, 2000 to 10000 is more preferable, 3000 to 8000 is even more preferable, and 3500 to 5000 is particularly preferable. By making it equal to or more than the lower limit, the ink repellency and film strength tend to be improved. By making it equal to or less than the upper limit, the residue tends to be reduced.

[0214] Next, the acrylic copolymer resin (C-3) will be described in detail.

[0215] [Acrylic copolymer resin (C-3)] The acrylic copolymer resin (C-3) has an ethylenically unsaturated group in the side chain. By having an ethylenically unsaturated group, the film is less likely to be reduced by the alkaline developer during development due to photocuring by exposure, and the surface smoothness is improved. In addition, the flexible main skeleton tends to improve adhesion to the substrate.

[0216] (Partial structural unit represented by general formula (1)) The partial structure containing a side chain having an ethylenically unsaturated group that the acrylic copolymer resin (C-3) has is not particularly limited. From the viewpoints of the ease of radical dissipation associated with the flexibility of the film and the adhesion to the substrate, it is preferable that the acrylic copolymer resin (C-3) has, for example, a partial structural unit represented by the following general formula (1):

[0217] [ka]

[0218] (In formula (1), R a1 and R a2 each independently represents a hydrogen atom or a methyl group. * represents a bond.)

[0219] Among the partial structural units represented by formula (1), a repeating unit represented by the following general formula (1') is preferred from the viewpoints of sensitivity and alkaline developability.

[0220] [ka]

[0221] (In formula (1'), R a1 and R a2 each independently represents a hydrogen atom or a methyl group. R x represents a hydrogen atom or a polybasic acid residue.

[0222] The polybasic acid residue refers to a monovalent group obtained by removing one OH group from a polybasic acid or an anhydride thereof. Examples of the polybasic acid include maleic acid, succinic acid, itaconic acid, phthalic acid, tetrahydrophthalic acid, hexahydrophthalic acid, pyromellitic acid, trimellitic acid, benzophenonetetracarboxylic acid, methylhexahydrophthalic acid, endomethylenetetrahydrophthalic acid, chlorendic acid, methyltetrahydrophthalic acid, and biphenyltetracarboxylic acid. Among these, from the viewpoint of patterning characteristics, maleic acid, succinic acid, itaconic acid, phthalic acid, tetrahydrophthalic acid, hexahydrophthalic acid, pyromellitic acid, trimellitic acid, and biphenyltetracarboxylic acid are preferred, and tetrahydrophthalic acid and biphenyltetracarboxylic acid are more preferred.

[0223] When the acrylic copolymer resin (C-3) contains a partial structural unit represented by general formula (1), the content ratio is not particularly limited, but is preferably 10 mol% or more, more preferably 20 mol% or more, even more preferably 30 mol% or more, even more preferably 40 mol% or more, and particularly preferably 50 mol% or more, and is preferably 90 mol% or less, more preferably 85 mol% or less, even more preferably 80 mol% or less, even more preferably 75 mol% or less, and particularly preferably 70 mol% or less. For example, 10 to 90 mol% is preferred, more preferably 20 to 85 mol%, more preferably 30 to 80 mol%, even more preferably 40 to 75 mol%, and particularly preferably 50 to 70 mol%. By making it equal to or more than the lower limit, the ink repellency tends to be improved. By making it equal to or less than the upper limit, the residue tends to be reduced.

[0224] When the acrylic copolymer resin (C-3) contains a repeating unit represented by general formula (1'), the content ratio is not particularly limited, but is preferably 10 mol% or more, more preferably 20 mol% or more, even more preferably 25 mol% or more, even more preferably 30 mol% or more, particularly preferably 35 mol% or more, and is preferably 80 mol% or less, more preferably 75 mol% or less, even more preferably 70 mol% or less, and particularly preferably 65 mol% or less. For example, 10 to 80 mol% is preferred, more preferably 20 to 80 mol%, more preferably 25 to 75 mol%, even more preferably 30 to 70 mol%, and particularly preferably 35 to 65 mol%. By making it equal to or more than the lower limit, the ink repellency tends to be improved. By making it equal to or less than the upper limit, the development adhesion tends to be easily ensured.

[0225] (Repeating unit represented by formula (2)) When the acrylic copolymer resin (C-3) contains a partial structural unit represented by general formula (1), the other repeating units contained therein are not particularly limited. From the viewpoint of development adhesion, it is also preferable that the resin has, for example, a repeating unit represented by the following general formula (2).

[0226] [ka]

[0227] (In formula (2), R a3 represents a hydrogen atom or a methyl group. R a4 represents an alkyl group which may have a substituent, an aromatic ring group which may have a substituent, or an alkenyl group which may have a substituent.

[0228] (R a4 ) In formula (2), R a4 represents an alkyl group which may have a substituent, an aromatic ring group which may have a substituent, or an alkenyl group which may have a substituent. R a4The alkyl group in may be a linear, branched or cyclic alkyl group. The number of carbon atoms is preferably 1 or more, more preferably 3 or more, even more preferably 5 or more, and particularly preferably 8 or more, and is preferably 20 or less, more preferably 18 or less, even more preferably 16 or less, even more preferably 14 or less, and particularly preferably 12 or less. For example, 1 to 20 is preferred, more preferably 1 to 18, even more preferably 3 to 16, even more preferably 5 to 14, and particularly preferably 8 to 12. By setting it to the lower limit or more, the film strength tends to be high and the development adhesion tends to be improved. By setting it to the upper limit or less, the residue tends to be reduced.

[0229] Specific examples of the alkyl group include a methyl group, an ethyl group, a cyclohexyl group, a dicyclopentanyl group, and a dodecanyl group. Among these, from the viewpoint of developability, a dicyclopentanyl group or a dodecanyl group is preferable, and a dicyclopentanyl group is more preferable. Furthermore, examples of the substituent that the alkyl group may have include a methoxy group, an ethoxy group, a chloro group, a bromo group, a fluoro group, a hydroxy group, an amino group, an epoxy group, an oligoethylene glycol group, a phenyl group, a carboxy group, an acryloyl group, and a methacryloyl group. From the viewpoint of developability, a hydroxy group and an oligoethylene glycol group are preferred.

[0230] R a4 Examples of the aromatic ring group in include a monovalent aromatic hydrocarbon ring group and a monovalent aromatic heterocyclic group. The number of carbon atoms is preferably 6 or more, and is preferably 24 or less, more preferably 22 or less, even more preferably 20 or less, and particularly preferably 18 or less. For example, it is preferably 6 to 24, more preferably 6 to 22, even more preferably 6 to 20, and particularly preferably 6 to 18. By making it equal to or more than the lower limit, the development adhesion tends to be improved. By making it equal to or less than the upper limit, the residue tends to be reduced. The aromatic hydrocarbon ring in the aromatic hydrocarbon ring group may be a single ring or a condensed ring, and examples thereof include a benzene ring, a naphthalene ring, an anthracene ring, a phenanthrene ring, a perylene ring, a tetracene ring, a pyrene ring, a benzpyrene ring, a chrysene ring, a triphenylene ring, an acenaphthene ring, a fluoranthene ring, and a fluorene ring. In addition, the aromatic heterocyclic group in the aromatic heterocyclic group may be a single ring or a condensed ring, and examples thereof include furan ring, benzofuran ring, thiophene ring, benzothiophene ring, pyrrole ring, pyrazole ring, imidazole ring, oxadiazole ring, indole ring, carbazole ring, pyrroloimidazole ring, pyrrolopyrazole ring, pyrrolopyrrole ring, thienopyrrole ring, thienothiophene ring, furopyrrole ring, furofuran ring, thienofuran ring, benzisoxazole ring, benzisothiazole ring, benzimidazole ring, pyridine ring, pyrazine ring, pyridazine ring, pyrimidine ring, triazine ring, quinoline ring, isoquinoline ring, cinnoline ring, quinoxaline ring, phenanthridine ring, benzimidazole ring, perimidine ring, quinazoline ring, quinazolinone ring, and azulene ring.Among these, from the viewpoint of development property, benzene ring or naphthalene ring is preferred, and benzene ring is more preferred. Furthermore, examples of the substituent that the aromatic ring group may have include a methyl group, an ethyl group, a propyl group, a methoxy group, an ethoxy group, a chloro group, a bromo group, a fluoro group, a hydroxy group, an amino group, an epoxy group, an oligoethylene glycol group, a phenyl group, and a carboxy group. From the viewpoint of developability, a hydroxy group and an oligoethylene glycol group are preferred.

[0231] R a4The alkenyl group in may be a linear, branched or cyclic alkenyl group. The number of carbon atoms is preferably 2 or more, and is preferably 22 or less, more preferably 20 or less, even more preferably 18 or less, even more preferably 16 or less, and particularly preferably 14 or less. For example, it is preferably 2 to 22, more preferably 2 to 20, even more preferably 2 to 18, even more preferably 2 to 16, and particularly preferably 2 to 14. By making it equal to or more than the lower limit, the development adhesion tends to be improved. By making it equal to or less than the upper limit, the residue tends to be reduced.

[0232] Furthermore, examples of the substituent that the alkenyl group may have include a methoxy group, an ethoxy group, a chloro group, a bromo group, a fluoro group, a hydroxy group, an amino group, an epoxy group, an oligoethylene glycol group, a phenyl group, and a carboxy group. From the viewpoint of developability, a hydroxy group and an oligoethylene glycol group are preferred.

[0233] R a4 Among these, from the viewpoints of developability and film strength, alkyl groups and alkenyl groups are preferred, and alkyl groups are more preferred.

[0234] When the acrylic copolymer resin (C-3) contains a repeating unit represented by general formula (2), its content is not particularly limited, but is preferably 1 mol% or more, more preferably 5 mol% or more, even more preferably 10 mol% or more, particularly preferably 20 mol% or more, and is preferably 70 mol% or less, more preferably 60 mol% or less, even more preferably 50 mol% or less, and particularly preferably 40 mol% or less in all repeating units. For example, 1 to 70 mol% is preferred, more preferably 5 to 60 mol%, even more preferably 10 to 50 mol%, and particularly preferably 20 to 40 mol%. By making it equal to or more than the lower limit, the development adhesion tends to be improved. By making it equal to or less than the upper limit, the residue tends to be reduced.

[0235] (Repeating unit represented by formula (3)) When the acrylic copolymer resin (C-3) contains a partial structural unit represented by general formula (1), it is preferable that the other repeating units contained therein contain a repeating unit represented by the following general formula (3) from the viewpoints of heat resistance and film strength.

[0236] [ka]

[0237] (In the above formula (3), R a5 represents a hydrogen atom or a methyl group. R a6 represents an alkyl group which may have a substituent, an alkenyl group which may have a substituent, an alkynyl group which may have a substituent, a hydroxy group, a carboxy group, a halogen atom, an alkoxy group which may have a substituent, a thiol group, or an alkyl sulfide group which may have a substituent. t represents an integer from 0 to 5.

[0238] (R a6 ) In formula (3), R a6 represents an alkyl group which may have a substituent, an alkenyl group which may have a substituent, an alkynyl group which may have a substituent, a hydroxy group, a carboxy group, a halogen atom, an alkoxy group which may have a substituent, a thiol group, or an alkyl sulfide group which may have a substituent. R a6 The alkyl group in may be a linear, branched or cyclic alkyl group. The number of carbon atoms is preferably 1 or more, more preferably 3 or more, and even more preferably 5 or more, and is preferably 20 or less, more preferably 18 or less, even more preferably 16 or less, even more preferably 14 or less, and particularly preferably 12 or less. For example, 1 to 20 is preferred, more preferably 1 to 18, even more preferably 3 to 16, even more preferably 3 to 14, and particularly preferably 5 to 12. By making the number of carbon atoms equal to or more than the lower limit, the development adhesion tends to be improved. By making the number of carbon atoms equal to or less than the upper limit, the residue tends to be reduced.

[0239] Specific examples of the alkyl group include a methyl group, an ethyl group, a cyclohexyl group, a dicyclopentanyl group, and a dodecanyl group. Among these, from the viewpoints of developability and film strength, the dicyclopentanyl group and the dodecanyl group are preferred, and the dicyclopentanyl group is more preferred. Examples of the substituent that the alkyl group may have include a methoxy group, an ethoxy group, a chloro group, a bromo group, a fluoro group, a hydroxy group, an amino group, an epoxy group, an oligoethylene glycol group, a phenyl group, a carboxy group, an acryloyl group, and a methacryloyl group. From the viewpoint of developability, a hydroxy group and an oligoethylene glycol group are preferred.

[0240] R a6 The alkenyl group in may be a linear, branched or cyclic alkenyl group. The number of carbon atoms is preferably 2 or more, and is preferably 22 or less, more preferably 20 or less, even more preferably 18 or less, even more preferably 16 or less, and particularly preferably 14 or less. For example, it is preferably 2 to 22, more preferably 2 to 20, even more preferably 2 to 18, even more preferably 2 to 16, and particularly preferably 2 to 14. By making it equal to or more than the lower limit, the development adhesion tends to be improved. By making it equal to or less than the upper limit, the residue tends to be reduced.

[0241] Examples of the substituent that the alkenyl group may have include a methoxy group, an ethoxy group, a chloro group, a bromo group, a fluoro group, a hydroxy group, an amino group, an epoxy group, an oligoethylene glycol group, a phenyl group, and a carboxy group. From the viewpoint of developability, a hydroxy group and an oligoethylene glycol group are preferred.

[0242] R a6The alkynyl group in may be a linear, branched or cyclic alkynyl group. The number of carbon atoms is preferably 2 or more, and is preferably 22 or less, more preferably 20 or less, even more preferably 18 or less, even more preferably 16 or less, and particularly preferably 14 or less. For example, it is preferably 2 to 22, more preferably 2 to 20, even more preferably 2 to 18, even more preferably 2 to 16, and particularly preferably 2 to 14. By making it equal to or more than the lower limit, the development adhesion tends to be improved. By making it equal to or less than the upper limit, the residue tends to be reduced.

[0243] Examples of the substituent that the alkynyl group may have include a methyl group, an ethyl group, a propyl group, a methoxy group, an ethoxy group, a chloro group, a bromo group, a fluoro group, a hydroxy group, an amino group, an epoxy group, an oligoethylene glycol group, a phenyl group, and a carboxy group. From the viewpoint of developability, a hydroxy group and an oligoethylene glycol group are preferred.

[0244] R a6 Examples of the halogen atom in include a fluorine atom, a chlorine atom, a bromine atom and an iodine atom, and among these, a fluorine atom is preferred from the viewpoint of developability.

[0245] R a6 The alkoxy group in may be a linear, branched or cyclic alkoxy group. The number of carbon atoms is preferably 1 or more, and is preferably 20 or less, more preferably 18 or less, even more preferably 16 or less, even more preferably 14 or less, and particularly preferably 12 or less. For example, it is preferably 1 to 20, more preferably 1 to 18, even more preferably 1 to 16, even more preferably 1 to 14, and particularly preferably 1 to 12. By making it equal to or more than the lower limit, the development adhesion tends to be improved. By making it equal to or less than the upper limit, the residue tends to be reduced.

[0246] Examples of the substituent that the alkoxy group may have include a methoxy group, an ethoxy group, a chloro group, a bromo group, a fluoro group, a hydroxy group, an amino group, an epoxy group, an oligoethylene glycol group, a phenyl group, a carboxy group, an acryloyl group, and a methacryloyl group. From the viewpoint of developability, a hydroxy group and an oligoethylene glycol group are preferred.

[0247] R a6 The alkyl sulfide group in may be a linear, branched or cyclic alkyl sulfide group. The number of carbon atoms is preferably 1 or more, and is preferably 20 or less, more preferably 18 or less, even more preferably 16 or less, even more preferably 14 or less, and particularly preferably 12 or less. For example, it is preferably 1 to 20, more preferably 1 to 18, even more preferably 1 to 16, even more preferably 1 to 14, and particularly preferably 1 to 12. By making it equal to or more than the lower limit, the development adhesion tends to be improved. By making it equal to or less than the upper limit, the residue tends to be reduced.

[0248] Examples of the substituent that the alkyl group in the alkyl sulfide group may have include a methoxy group, an ethoxy group, a chloro group, a bromo group, a fluoro group, a hydroxy group, an amino group, an epoxy group, an oligoethylene glycol group, a phenyl group, a carboxy group, an acryloyl group, and a methacryloyl group. From the viewpoint of developability, a hydroxy group and an oligoethylene glycol group are preferred.

[0249] R a6 Among these, from the viewpoint of developability, a hydroxy group or a carboxy group is preferable, and a carboxy group is more preferable.

[0250] In the formula (3), t represents an integer of 0 to 5, but it is preferable that t is 0 from the viewpoint of ease of production.

[0251] When the acrylic copolymer resin (C-3) contains a repeating unit represented by general formula (3), the content ratio is not particularly limited, but is preferably 0.5 mol% or more, more preferably 1 mol% or more, even more preferably 2 mol% or more, and particularly preferably 5 mol% or more in the total repeating units. Also, it is preferably 50 mol% or less, more preferably 40 mol% or less, even more preferably 30 mol% or less, even more preferably 20 mol% or less, and particularly preferably 15 mol% or less. For example, it is preferably 0.5 to 50 mol%, more preferably 0.5 to 40 mol%, even more preferably 1 to 30 mol%, even more preferably 2 to 20 mol%, and particularly preferably 5 to 15 mol%. By making it equal to or more than the lower limit, the development adhesion tends to be improved. By making it equal to or less than the upper limit, the residue tends to be reduced.

[0252] (Repeating unit represented by formula (4)) When the acrylic copolymer resin (C-3) has a partial structural unit represented by general formula (1), it also preferably has a repeating unit represented by the following general formula (4) as another repeating unit contained therein, from the viewpoint of developability.

[0253] [ka]

[0254] (In the above formula (4), R a7 represents a hydrogen atom or a methyl group.

[0255] When the acrylic copolymer resin (C-3) contains a repeating unit represented by general formula (4), its content is not particularly limited, but is preferably 5 mol% or more, more preferably 10 mol% or more, and even more preferably 20 mol% or more, and is preferably 80 mol% or less, more preferably 70 mol% or less, and even more preferably 60 mol% or less, in the total repeating units. For example, it is preferably 5 to 80 mol%, more preferably 10 to 70 mol%, and even more preferably 20 to 60 mol%. By making it equal to or more than the lower limit, the developability tends to be improved. By making it equal to or less than the upper limit, the development adhesion tends to be improved.

[0256] The acid value of the acrylic copolymer resin (C-3) is not particularly limited, but is preferably 30 mgKOH / g or more, more preferably 40 mgKOH / g or more, even more preferably 50 mgKOH / g or more, even more preferably 60 mgKOH / g or more, and is preferably 150 mgKOH / g or less, more preferably 140 mgKOH / g or less, even more preferably 130 mgKOH / g or less, and even more preferably 120 mgKOH / g or less. For example, 30 to 150 mgKOH / g is preferred, 40 to 140 mgKOH / g is more preferred, 50 to 130 mgKOH / g is more preferred, and 60 to 120 mgKOH / g is particularly preferred. By making it equal to or more than the lower limit, the developability tends to improve. By making it equal to or less than the upper limit, the development adhesion tends to improve.

[0257] The weight average molecular weight (Mw) of the acrylic copolymer resin (C-3) is not particularly limited, but is preferably 1000 or more, more preferably 2000 or more, even more preferably 4000 or more, even more preferably 6000 or more, particularly preferably 7000 or more, and most preferably 8000 or more, and is preferably 30000 or less, more preferably 20000 or less, even more preferably 15000 or less, and particularly preferably 10000 or less. For example, 1000 to 30000 is preferable, 2000 to 30000 is more preferable, 4000 to 20000 is even more preferable, 6000 to 20000 is even more preferable, 7000 to 15000 is particularly preferable, and 8000 to 10000 is particularly preferable. By making it equal to or more than the lower limit, the development adhesion tends to be improved. By making it equal to or less than the upper limit, the developability tends to be good.

[0258] Specific examples of the acrylic copolymer resin (C-3) include the resins described in JP-A-8-297366 and JP-A-2001-89533.

[0259] The alkali-soluble resin (C) in the present invention may further contain, as other alkali-soluble resins, alkali-soluble resins other than the epoxy (meth)acrylate resin (C-2) and the acrylic copolymer resin (C-3).

[0260] The acid value of the alkali-soluble resin (C) is not particularly limited, but is preferably 30 mgKOH / g or more, more preferably 50 mgKOH / g or more, and more preferably 60 mgKOH / g or more, and is preferably 300 mgKOH / g or less, more preferably 200 mgKOH / g or less, even more preferably 100 mgKOH / g or less, and particularly preferably 80 mgKOH / g or less. For example, it is preferably 30 to 300 mgKOH / g, more preferably 30 to 200 mgKOH / g, even more preferably 50 to 100 mgKOH / g, and particularly preferably 60 to 80 mgKOH / g. By making it equal to or more than the lower limit, the developability tends to be improved. By making it equal to or less than the upper limit, the development adhesion tends to be improved. When the alkali-soluble resin (C) is a mixture of two or more kinds, the acid value means a weighted average value according to the content ratio thereof.

[0261] The content of the alkali-soluble resin (C) in the photosensitive resin composition of the present invention is not particularly limited, but is preferably 5% by mass or more, more preferably 10% by mass or more, even more preferably 20% by mass or more, even more preferably 30% by mass or more, particularly preferably 40% by mass or more, even more particularly preferably 50% by mass or more, and most preferably 60% by mass or more, and is also preferably 90% by mass or less, more preferably 80% by mass or less, and even more preferably 70% by mass or less. For example, 5 to 90% by mass is preferred, 10 to 90% by mass is more preferred, 20 to 90% by mass is even more preferred, 30 to 80% by mass is even more preferred, 40 to 80% by mass is even more preferred, 50 to 70% by mass is even more preferred, and 60 to 70% by mass is even more preferred. By making it equal to or more than the lower limit, the amount of residue tends to be reduced. By making it equal to or less than the upper limit, the ink repellency tends to be improved.

[0262] The content of the alkali-soluble resin (C-1) in the photosensitive resin composition of the present invention is not particularly limited, but is preferably 20% by mass or more, more preferably 30% by mass or more, even more preferably 40% by mass or more, even more preferably 50% by mass or more, particularly preferably 60% by mass or more, and is preferably 90% by mass or less, more preferably 80% by mass or less, even more preferably 70% by mass or less, and particularly preferably 65% ​​by mass or less. For example, 20 to 90% by mass is preferred, more preferably 30 to 90% by mass, more preferably 40 to 80% by mass, even more preferably 50 to 70% by mass, and particularly preferably 60 to 65% by mass. By making it equal to or more than the lower limit, ink repellency and development adhesion tend to be improved. By making it equal to or less than the upper limit, residues tend to be reduced.

[0263] The content of the alkali-soluble resin (C-1) in the alkali-soluble resin (C) is not particularly limited, but is preferably 20% by mass or more, more preferably 40% by mass or more, even more preferably 60% by mass or more, even more preferably 70% by mass or more, particularly preferably 80% by mass or more, most preferably 90% by mass or more, and is usually 100% by mass or less. By making it equal to or more than the lower limit, the ink repellency and the development adhesion tend to be improved.

[0264] In addition, the sum of the content of the ethylenically unsaturated compound (A) and the content of the alkali-soluble resin (C) in the total solid content of the photosensitive resin composition of the present invention is not particularly limited, but is preferably 10% by mass or more, more preferably 30% by mass or more, even more preferably 60% by mass or more, particularly preferably 80% by mass or more, and is preferably 95% by mass or less, more preferably 92% by mass or less, and even more preferably 90% by mass or less. For example, it is preferably 10 to 95% by mass, more preferably 30 to 95% by mass, even more preferably 60 to 92% by mass, and particularly preferably 80 to 90% by mass. By making it equal to or more than the lower limit, the adhesion of the partition wall to the substrate tends to be improved. By making it equal to or less than the upper limit, the light-shielding property and the ink repellency tend to be improved.

[0265] [1-1-4] (D) Liquid repellent The photosensitive resin composition of the present invention contains a fluorine-containing resin having a crosslinking group as a liquid repellent (D). By containing a fluorine-containing resin having a crosslinking group, ink repellency can be imparted to the surface of the resulting partition wall, and it is believed that the resulting partition wall can prevent color mixing between pixels.

[0266] Examples of the crosslinking group include an epoxy group or an ethylenically unsaturated group, and from the viewpoint of preventing the liquid repellent from flowing out into the developer, an ethylenically unsaturated group is preferred. It is believed that by using a liquid repellent having a crosslinking group, the crosslinking reaction on the surface of the formed coating film can be accelerated when the film is exposed to light, and the liquid repellent is less likely to flow out during development treatment, resulting in a partition wall that exhibits high ink repellency.

[0267] In addition, the liquid repellent (D), which is a fluorine atom-containing resin, tends to be oriented on the surface of the partition wall and act to prevent ink bleeding and color mixing. More specifically, the group having a fluorine atom repels ink and tends to prevent ink bleeding and color mixing caused by the ink passing over the partition wall and entering an adjacent area.

[0268] The fluorine-containing resin having a crosslinking group preferably has either or both of a perfluoroalkyl group and a perfluoroalkylene ether chain. By having either or both of a perfluoroalkyl group and a perfluoroalkylene ether chain, the fluorine-containing resin is more likely to be oriented on the surface of the partition wall, exhibiting higher ink repellency and further preventing ink bleeding and color mixing.

[0269] Examples of the perfluoroalkyl group include a perfluorobutyl group, a perfluorohexyl group, and a perfluorooctyl group. Examples of the perfluoroalkylene ether chain include -CF2-O-, -(CF2)2-O-, -(CF2)3-O-, -CF2-C(CF3)O-, -C(CF3)-CF2-O-, and divalent groups having these repeating units.

[0270] Specific examples of the fluorine-containing resin having a crosslinking group include, for example, an acrylic copolymer resin having an epoxy group and a perfluoroalkyl group, an acrylic copolymer resin having an epoxy group and a perfluoroalkylene ether chain, an acrylic copolymer resin having an ethylenically unsaturated group and a perfluoroalkyl group, an acrylic copolymer resin having an ethylenically unsaturated group and a perfluoroalkylene ether chain, an epoxy (meth)acrylate resin having an epoxy group and a perfluoroalkyl group, an epoxy (meth)acrylate resin having an epoxy group and a perfluoroalkylene ether chain, an epoxy (meth)acrylate resin having an ethylenically unsaturated group and a perfluoroalkyl group, and an epoxy (meth)acrylate resin having an ethylenically unsaturated group and a perfluoroalkylene ether chain. Among these, from the viewpoint of ink repellency, an acrylic copolymer resin having an ethylenically unsaturated group and a perfluoroalkyl group, an acrylic copolymer resin having an ethylenically unsaturated group and a perfluoroalkylene ether chain are preferred, and an acrylic copolymer resin having an ethylenically unsaturated group and a perfluoroalkylene ether chain is more preferred.

[0271] Commercially available products of fluorine-containing resins having these crosslinking groups include "Megafac (registered trademark, the same applies below) F116", "Megafac F120", "Megafac F142D", "Megafac F144D", "Megafac F150", "Megafac F160", "Megafac F171", "Megafac F172", "Megafac F173", "Megafac F177", "Megafac F178A", "Megafac F178K", ​​"Megafac F179", "Megafac F183", "Megafac F184", "Megafac F191", and "Megafac F812" manufactured by DIC Corporation. "Megafac F815", "Megafac F824", "Megafac F833", "Megafac RS101", "Megafac RS102", "Megafac RS105", "Megafac RS201", "Megafac RS202", "Megafac RS301", "Megafac RS303", "Megafac RS304", "Megafac RS401", "Megafac RS402", "Megafac RS501", "Megafac RS502", "Megafac RS-72-K", "Megafac RS-78", "Megafac RS-90", "DEFENSA (registered trademark, the same applies below) Fluorine-containing organic compounds commercially available under trade names such as "MCF300", "DEFENSA MCF310", "DEFENSA MCF312", "DEFENSA MCF323", "Fluorard FC430", "Fluorard FC431", "FC-4430", and "FC4432" manufactured by 3M Japan Ltd., "Asahiguard (registered trademark) AG710", "Surflon (registered trademark, the same applies below) S-382", "Surflon SC-101", "Surflon SC-102", "Surflon SC-103", "Surflon SC-104", "Surflon SC-105", and "Surflon SC-106" manufactured by AGC Ltd. can be used. Among these, as acrylic copolymer resins having an ethylenically unsaturated group and a perfluoroalkylene group, "Megafac RS-72-K", "Megafac RS-78" and "Megafac RS-90" can be preferably used.

[0272] The fluorine atom content in the fluorine atom-containing resin having a crosslinking group is not particularly limited, but is preferably 5% by mass or more, more preferably 10% by mass or more, even more preferably 20% by mass or more, and even more preferably 25% by mass or more in the fluorine atom-containing resin having a crosslinking group. Also, it is preferably 50% by mass or less, and more preferably 35% by mass or less. For example, it is preferably 5 to 50% by mass, more preferably 10 to 50% by mass, even more preferably 20 to 35% by mass, and particularly preferably 25 to 35% by mass. By making it equal to or more than the lower limit, it tends to be possible to suppress outflow to the pixel part. By making it equal to or less than the upper limit, it tends to show a high contact angle.

[0273] The molecular weight of the fluorine-containing resin having a crosslinking group is not particularly limited, and may be a low molecular weight compound or a high molecular weight compound. A high molecular weight compound is preferable because it suppresses the fluidity caused by post-baking and can suppress outflow from the partition wall. In the case of a high molecular weight fluorine-containing resin having a crosslinking group, the number average molecular weight of the fluorine-containing resin having a crosslinking group is preferably 100 or more, more preferably 500 or more, and preferably 100,000 or less, more preferably 10,000 or less. For example, it is preferably 100 to 100,000, more preferably 500 to 10,000.

[0274] The content of the liquid repellent (D) in the photosensitive resin composition of the present invention is not particularly limited, but is preferably 0.01% by mass or more, more preferably 0.1% by mass or more, even more preferably 0.5% by mass or more, and is preferably 5% by mass or less, more preferably 3% by mass or less, and even more preferably 2% by mass or less, based on the total solid content of the photosensitive resin composition. For example, 0.01 to 5% by mass is preferred, 0.1 to 3% by mass is more preferred, and 0.5 to 2% by mass is even more preferred. By making it equal to or more than the lower limit, the ink repellency tends to be improved. By making it equal to or less than the upper limit, a uniform coating film tends to be easily obtained when applying ink to pixel parts after partition wall formation.

[0275] The content of the fluorine-containing resin having a crosslinking group in the photosensitive resin composition of the present invention is not particularly limited, but is preferably 0.01% by mass or more, more preferably 0.1% by mass or more, and even more preferably 0.5% by mass or more, and is preferably 5% by mass or less, more preferably 3% by mass or less, and even more preferably 2% by mass or less, based on the total solid content of the photosensitive resin composition. For example, 0.01 to 5% by mass is preferred, 0.1 to 3% by mass is more preferred, and 0.5 to 2% by mass is even more preferred. By making it equal to or more than the lower limit, the ink repellency tends to be improved. By making it equal to or less than the upper limit, a uniform coating film tends to be easily obtained when applying ink to pixel parts after partition wall formation.

[0276] In the photosensitive resin composition of the present invention, a surfactant may be used together with the liquid repellent (D). The surfactant can be used, for example, for the purpose of improving the coatability of the photosensitive resin composition as a coating liquid and the developability of the coating film, and among these, silicone-based surfactants and fluorine-based surfactants having no crosslinking group are preferred. In particular, silicone-based surfactants are preferred, and polyether-modified silicone-based surfactants are more preferred, since they have the effect of removing residues of the photosensitive resin composition from unexposed areas during development and also have the function of exhibiting wettability.

[0277] As the fluorosurfactant having no crosslinking group, a compound having a fluoroalkyl or fluoroalkylene group at least at any one of the terminal, main chain, and side chain is preferable. Examples of commercially available products include "BM-1000" and "BM-1100" manufactured by BM Chemie, "Megafac F142D", "Megafac F172", "Megafac F173", "Megafac F183", "Megafac F470", "Megafac F475", "Megafac F554", and "Megafac F559" manufactured by DIC Corporation, "FC430" manufactured by 3M Japan, and "DFX-18" manufactured by Neos.

[0278] Examples of silicone surfactants include commercially available products such as "DC3PA", "SH7PA", "DC11PA", "SH21PA", "SH28PA", "SH29PA", "8032Additive", and "SH8400" manufactured by Dow Corning Toray Co., Ltd., and "BYK (registered trademark, the same applies below) 323" and "BYK330" manufactured by BYK-Chemie. The surfactant may include surfactants other than fluorine-based surfactants and silicone-based surfactants, and other surfactants include nonionic, anionic, cationic and amphoteric surfactants.

[0279] Examples of nonionic surfactants include polyoxyethylene alkyl ethers, polyoxyethylene polyoxypropylene alkyl ethers, polyoxyethylene alkyl phenyl ethers, polyoxyethylene alkyl esters, polyoxyethylene fatty acid esters, glycerin fatty acid esters, polyoxyethylene glycerin fatty acid esters, pentaerythritol fatty acid esters, polyoxyethylene pentaerythritol fatty acid esters, sorbitan fatty acid esters, polyoxyethylene sorbitan fatty acid esters, sorbitol fatty acid esters, and polyoxyethylene sorbitol fatty acid esters. Examples of commercially available products include polyoxyethylene surfactants such as "EMULGEN (registered trademark, hereinafter the same) 104P" and "EMULGEN A60" manufactured by Kao Corporation.

[0280] Examples of anionic surfactants include alkyl sulfonates, alkyl benzene sulfonates, alkyl naphthalene sulfonates, polyoxyethylene alkyl ether sulfonates, alkyl sulfates, alkyl sulfate ester salts, higher alcohol sulfate ester salts, aliphatic alcohol sulfate ester salts, polyoxyethylene alkyl ether sulfates, polyoxyethylene alkyl phenyl ether sulfates, alkyl phosphate ester salts, polyoxyethylene alkyl ether phosphates, polyoxyethylene alkyl phenyl ether phosphates, and special polymer surfactants. Among these, special polymer surfactants are preferred, and special polycarboxylic acid type polymer surfactants are more preferred. Examples of commercially available alkyl sulfate salts include Kao Corporation's "EMAL (registered trademark, hereinafter the same) 10," Kao Corporation's alkyl naphthalene sulfonate salts include Kao Corporation's "Pelex (registered trademark) NB-L," and special polymer surfactants include Kao Corporation's "Homogenol (registered trademark, hereinafter the same) L-18" and "Homogenol L-100."

[0281] Examples of cationic surfactants include quaternary ammonium salts, imidazoline derivatives, and alkylamine salts, while examples of amphoteric surfactants include betaine compounds, imidazolium salts, imidazolines, and amino acids. Of these, quaternary ammonium salts are preferred, and stearyltrimethylammonium salts are more preferred. Examples of commercially available alkylamine salts include Kao Corporation's "Acetamine (registered trademark) 24," and examples of quaternary ammonium salts include Kao Corporation's "Cortamine (registered trademark, the same applies below) 24P" and "Cortamine 86W."

[0282] The surfactant may be used alone or in combination of two or more. For example, the combination of silicone surfactant and fluorine surfactant, the combination of silicone surfactant and special polymer surfactant, and the combination of fluorine surfactant and special polymer surfactant can be mentioned. Among them, the combination of silicone surfactant and fluorine surfactant is preferred. Examples of combinations of silicone surfactants and fluorine surfactants include combinations of Neos' "DFX-18," BYK-Chemie's "BYK-300" or "BYK-330" and AGC Seimi Chemical's "S-393," Shin-Etsu Silicones' "KP340" and DIC's "F-554" or "F-559," Dow Corning Toray's "SH7PA" and Daikin's "DS-401," and NUC's "L-77" and 3M Japan's "FC4430."

[0283] [1-1-5] (E) Colorant The photosensitive resin composition of the present invention may further contain a colorant (E). By containing the colorant (E), appropriate light absorption properties can be obtained, and appropriate light shielding properties can be obtained particularly when the composition is used for forming a light shielding member including a colored partition wall.

[0284] The type of colorant (E) used in the present invention is not particularly limited, and may be a pigment or a dye. Among these, it is preferable to use a pigment from the viewpoint of durability.

[0285] The pigment contained in the colorant (E) may be one type or two or more types. In particular, from the viewpoint of uniform light blocking in the visible region, it is preferable that the pigment contains two or more types. The type of pigment that can be used as the (E) colorant is not particularly limited, but examples thereof include organic pigments and inorganic pigments. Among these, it is preferable to use an organic pigment from the viewpoint of controlling the transmission wavelength of the photosensitive resin composition and efficiently curing it. Examples of the organic pigment include organic color pigments and organic black pigments. Here, the organic color pigment means an organic pigment that exhibits a color other than black, and examples of the organic color pigment include a red pigment, an orange pigment, a blue pigment, a purple pigment, a green pigment, and a yellow pigment.

[0286] Among organic pigments, it is preferable to use organic coloring pigments from the viewpoint of ultraviolet absorbing properties. The organic color pigment may be used alone or in combination of two or more. In particular, when used for light-shielding purposes, it is more preferable to use a combination of organic color pigments of different colors, and it is even more preferable to use a combination of organic color pigments that exhibit a color close to black.

[0287] The chemical structure of these organic pigments is not particularly limited, but examples include azo, phthalocyanine, quinacridone, benzimidazolone, isoindolinone, dioxazine, indanthrene, and perylene. Specific examples of pigments that can be used are shown below by pigment number. Terms such as "CI Pigment Red 2" below refer to the Color Index (CI).

[0288] Red pigments include CI Pigment Red 1, 2, 3, 4, 5, 6, 7, 8, 9, 12, 14, 15, 16, 17, 21, 22, 23, 31, 32, 37, 38, 41, 47, 48, 48:1, 48:2, 48:3, 48:4, 49, 49:1, 49:2, 50:1, 52:1, 52:2, 53, 53:1, 53:2, 53:3, 57, 57:1, 57:2, 58:4, 60, 63, 63:1, 63:2, 64, 64:1, 68, 69, 81, 81:1, 81:2, 81:3, 81:4, 83, 88, 90:1, 101, 101:1, 104, 108, 108:1, 109, 112, 113, 114, 122, 123, 144, 146, 147, 149, 15 1, 166, 168, 169, 170, 172, 173, 174, 175, 176, 177, 178, 179, 181, 184, 185, 187, 188, 190, 193, 194, 200, 202, 206, 207, 208, 209, 210, 214, 216, 220, 221, 224, 230, 231, 232, 233, 234, 235, 236, 237, 238, 239, 240, 241, 242, 243, 244, 245, 246, 247, 248, 249, 250, 251, 252, 253, 254, 255, 256, 257, 258, 259, 260, 261, 262, 263, 264, 265, 266, 267, 268, 269, 270, 271, 272, 273, 274, 275, 276, 277, 278, 279, 280, 281, 282, 283, 284, 285, 286, 287, 288, 289, 290, 291, 300, 301, 302, 303, 304, 305, 306, 30 5, 236, 237, 238, 239, 242, 243, 245, 247, 249, 250, 251, 253, 254, 255, 256, 257, 258, 259, 260, 262, 263, 264, 265, 266, 267, 268, 269, 270, 271, 272, 273, 274, 275, and 276. Among these, from the viewpoint of light blocking properties and dispersibility, preferred are CI Pigment Red 48:1, 122, 149, 168, 177, 179, 194, 202, 206, 207, 209, 224, 242, and 254, and more preferred are CI Pigment Red 177, 209, 224, and 254. From the viewpoints of dispersibility and light-shielding property, it is preferable to use CI Pigment Red 177, 254, or 272. When the photosensitive resin composition is cured by ultraviolet light, it is preferable to use a red pigment having a low ultraviolet light absorption rate. From this viewpoint, it is more preferable to use CI Pigment Red 254 or 272.

[0289] Orange pigments include CI Pigment Orange 1, 2, 5, 13, 16, 17, 19, 20, 21, 22, 23, 24, 34, 36, 38, 39, 43, 46, 48, 49, 61, 62, 64, 65, 67, 68, 69, 70, 71, 72, 73, 74, 75, 77, 78, and 79. Among these, from the viewpoints of dispersibility and light-shielding property, it is preferable to use CI Pigment Orange 13, 43, 64, and 72, and it is more preferable to use CI Pigment Orange 43, 64, and 72. When the photosensitive resin composition is cured with ultraviolet light, it is preferable to use an orange pigment having a low ultraviolet absorptance, and from this viewpoint it is more preferable to use CI Pigment Orange 64 and 72.

[0290] Blue pigments can include CI Pigment Blue 1, 1:2, 9, 14, 15, 15:1, 15:2, 15:3, 15:4, 15:6, 16, 17, 19, 25, 27, 28, 29, 33, 35, 36, 56, 56:1, 60, 61, 61:1, 62, 63, 66, 67, 68, 71, 72, 73, 74, 75, 76, 78, and 79. Among these, from the viewpoint of light-blocking properties, preferred are CI Pigment Blue 15, 15:1, 15:2, 15:3, 15:4, 15:6 and 60, and more preferred are CI Pigment Blue 15:6. From the viewpoints of dispersibility and light-shielding property, it is preferable to use CI Pigment Blue 15:6, 16, or 60, and it is more preferable to use CI Pigment Blue 15:6 or 60. When the photosensitive resin composition is cured with ultraviolet light, it is preferable to use a blue pigment having a low ultraviolet absorption rate, and from this viewpoint it is more preferable to use CI Pigment Blue 60.

[0291] Purple pigments can include CI Pigment Violet 1, 1:1, 2, 2:2, 3, 3:1, 3:3, 5, 5:1, 14, 15, 16, 19, 23, 25, 27, 29, 31, 32, 37, 39, 42, 44, 47, 49, 50. Among these, from the viewpoint of light-shielding properties, CI Pigment Violet 19 and 23 are preferable, and CI Pigment Violet 23 is more preferable. From the viewpoints of dispersibility and light-shielding property, it is preferable to use CI Pigment Violet 23 or 29. When the photosensitive resin composition is cured with ultraviolet light, it is preferable to use a purple pigment having a low ultraviolet absorptance, and from this viewpoint it is more preferable to use CI Pigment Violet 29.

[0292] Examples of organic color pigments that can be used in addition to red pigments, orange pigments, blue pigments, and purple pigments include green pigments and yellow pigments. Green pigments can include CI Pigment Green 1, 2, 4, 7, 8, 10, 13, 14, 15, 17, 18, 19, 26, 36, 45, 48, 50, 51, 54, and 55. Among these, CI Pigment Green 7 and 36 are preferable. Yellow pigments include CI Pigment Yellow 1, 1:1, 2, 3, 4, 5, 6, 9, 10, 12, 13, 14, 16, 17, 24, 31, 32, 34, 35, 35:1, 36, 36:1, 37, 37:1, 40, 41, 42, 43, 48, 53, 55, 61, 62, 62:1, 63, 65, 73, 74, 75, 81, 83, 87, 93, 94, 95, 97, 100, 101, 104, 105, 108, 109, 110, 111, 116, 117, 119, 120, 126, 127, 127:1, 128, 129, 133, 134, 1 36, 138, 139, 142, 147, 148, 150, 151, 153, 154, 155, 157, 158, 159, 160, 161, 162, 163, 164, 165, 166, 167, 168, 169, 170, 172, 173, 174, 175, 176, 180, 181, 182, 183, 184, 185, 188, 189, 190, 191, 191:1, 192, 193, 194, 195, 196, 197, 198, 199, 200, 202, 203, 204, 205, 206, 207, and 208 can be mentioned. Among these, CI Pigment Yellow 83, 117, 129, 138, 139, 150, 154, 155, 180, and 185 are preferable, and CI Pigment Yellow 83, 138, 139, 150, and 180 are more preferable.

[0293] Among these, from the viewpoint of light blocking properties and ink repellency, it is preferable to use at least one pigment selected from the group consisting of red pigments, orange pigments, blue pigments, and purple pigments.

[0294] Among these, from the viewpoint of light blocking properties and ink repellency, it is preferable to contain at least one of the following pigments. Red pigment: CI Pigment Red 177, 254, 272 Orange pigment: CI Pigment Orange 64, 72 Blue pigment: CI Pigment Blue 15:6, 16, 60 Purple pigment: CI Pigment Violet 23, 29

[0295] When two or more organic color pigments are used in combination, the combination of the organic color pigments is not particularly limited, but from the viewpoint of light-blocking properties, it is preferable that the (E) colorant contains at least one selected from the group consisting of red pigments and orange pigments, and at least one selected from the group consisting of blue pigments and purple pigments. The color combination is not particularly limited, but from the viewpoint of light blocking properties, examples of the combination include a red pigment and a blue pigment, a blue pigment and an orange pigment, and a blue pigment, an orange pigment and a purple pigment.

[0296] From the viewpoint of blocking blue light, it is preferable to contain a purple pigment as the colorant (E).

[0297] From the viewpoint of light blocking properties, it is preferable to use an organic black pigment as the colorant (E). In particular, from the viewpoint of suppressing absorption of ultraviolet rays and improving ink repellency, it is preferable to use an organic black pigment containing at least one selected from the group consisting of a compound represented by the following general formula (A) (hereinafter also referred to as "compound (A)"), a geometric isomer of compound (A), a salt of compound (A), and a salt of a geometric isomer of compound (A) (hereinafter sometimes referred to as "organic black pigment represented by general formula (A)").

[0298] [ka]

[0299] (In formula (A), R 11 and R 16 each independently represents a hydrogen atom, CH3, CF3, a fluorine atom, or a chlorine atom; R 12 , R 13 , R 14 , R 15 , R 17 , R 18 , R 19 and R 20 Each independently represents a hydrogen atom, a halogen atom, or R 21 , COOH, COOR 21 , COO - , CONH2, CONHR 21 ,CONR 21 R 22 , C.N., O.H., O.R. 21 , COCR 21 , OOCNH2, OOCNHR 21 , OOCNR 21 R 22 , NO2, NH2, NHR 21 , N.R. 21 R 22 , N.H.C.O.R. 22 , N.R. 21 COR 22 , N=CH2, N=CHR 21 , N=CR 21 R 22 , S.H., S.R. 21 , SOR 21 , SO2R 21, SO3R 21 , SO3H, SO3 - , SO2NH2, SO2NHR 21 or SO2NR 21 R 22 represents; R 12 and R 13 , R 13 and R 14 , R 14 and R 15 , R 17 and R 18 , R 18 and R 19 , and R 19 and R 20 At least one combination selected from the group consisting of may be directly bonded to each other or may be bonded to an oxygen atom, a sulfur atom, an NH or an NR 21 They can also be joined together by bridges; R 21 and R 22 each independently represents an alkyl group having 1 to 12 carbon atoms, a cycloalkyl group having 3 to 12 carbon atoms, an alkenyl group having 2 to 12 carbon atoms, a cycloalkenyl group having 3 to 12 carbon atoms, or an alkynyl group having 2 to 12 carbon atoms.

[0300] Compound (A) and the geometric isomers of compound (A) have the following core structure (wherein the substituents in the structural formula are omitted), with the trans-trans isomer being presumably the most stable.

[0301] [ka]

[0302] When compound (A) is anionic, it is preferably a salt whose charge is compensated by any known suitable cation, such as a metal, organic, inorganic or metal-organic cation, specifically an alkali metal, an alkaline earth metal, a transition metal, a primary ammonium, a secondary ammonium, a tertiary ammonium such as a trialkylammonium, a quaternary ammonium such as a tetraalkylammonium, or an organometallic complex. When a geometric isomer of compound (A) is anionic, it is preferably a similar salt.

[0303] In the substituents of general formula (A) and their definitions, the following are preferred because they tend to have a high shielding rate. This is because the following substituents have no absorption and are considered not to affect the hue of the pigment. R 12 , R 14 , R 15 , R 17 , R 19 and R 20 are each independently preferably a hydrogen atom, a fluorine atom, or a chlorine atom, and more preferably a hydrogen atom. R 13 and R 18 are each independently preferably a hydrogen atom, NO2, OCH3, OC2H5, a bromine atom, a chlorine atom, CH3, C2H5, N(CH3)2, N(CH3)(C2H5), N(C2H5)2, α-naphthyl, β-naphthyl, SO3H or SO3 - is more preferably a hydrogen atom or SO3H, and particularly preferably a hydrogen atom.

[0304] R 11 and R 16 are each independently preferably a hydrogen atom, CH3 or CF3, and more preferably a hydrogen atom. Preferably, R 11 and R 16 , R 12 and R 17 , R 13 and R 18 , R 14 and R 19 , and R 15 and R 20 At least one combination selected from the group consisting of is the same, and more preferably, R 11 is R 16 is the same as R 12 is R 17 is the same as R 13 is R 18 is the same as R 14 is R 19 is the same as and R 15 is R 20 is equivalent to.

[0305] Examples of the alkyl group having 1 to 12 carbon atoms include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, a sec-butyl group, an isobutyl group, a tert-butyl group, a 2-methylbutyl group, an n-pentyl group, a 2-pentyl group, a 3-pentyl group, a 2,2-dimethylpropyl group, an n-hexyl group, an n-heptyl group, an n-octyl group, a 1,1,3,3-tetramethylbutyl group, a 2-ethylhexyl group, a nonyl group, a decyl group, an undecyl group, and a dodecyl group.

[0306] Examples of the cycloalkyl group having 3 to 12 carbon atoms include a cyclopropyl group, a cyclopropylmethyl group, a cyclobutyl group, a cyclopentyl group, a cyclohexyl group, a cyclohexylmethyl group, a trimethylcyclohexyl group, a thujyl group, a norbornyl group, a bornyl group, a norcaryl group, a caryl group, a menthyl group, a norpinyl group, a pinyl group, an adamantan-1-yl group, and an adamantan-2-yl group.

[0307] Examples of the alkenyl group having 2 to 12 carbon atoms include a vinyl group, an allyl group, a 2-propen-2-yl group, a 2-buten-1-yl group, a 3-buten-1-yl group, a 1,3-butadiene-2-yl group, a 2-penten-1-yl group, a 3-penten-2-yl group, a 2-menthyl-1-buten-3-yl group, a 2-methyl-3-buten-2-yl group, a 3-methyl-2-buten-1-yl group, a 1,4-pentadiene-3-yl group, a hexenyl group, an octenyl group, a nonenyl group, a decenyl group, and a dodecenyl group.

[0308] Examples of the cycloalkenyl group having 3 to 12 carbon atoms include a 2-cyclobuten-1-yl group, a 2-cyclopenten-1-yl group, a 2-cyclohexen-1-yl group, a 3-cyclohexen-1-yl group, a 2,4-cyclohexadiene-1-yl group, a 1-p-menthen-8-yl group, a 4(10)-thujen-10-yl group, a 2-norbornen-1-yl group, a 2,5-norbornadiene-1-yl group, a 7,7-dimethyl-2,4-norcaradiene-3-yl group, and a camphenyl group.

[0309] Examples of the alkynyl group having 2 to 12 carbon atoms include a 1-propyn-3-yl group, a 1-butyn-4-yl group, a 1-pentyn-5-yl group, a 2-methyl-3-butyn-2-yl group, a 1,4-pentadiyn-3-yl group, a 1,3-pentadiyn-5-yl group, a 1-hexyn-6-yl group, a cis-3-methyl-2-penten-4-yn-1-yl group, a trans-3-methyl-2-penten-4-yn-1-yl group, a 1,3-hexadiyn-5-yl group, a 1-octyn-8-yl group, a 1-nonyne-9-yl group, a 1-decyn-10-yl group, and a 1-dodecyn-12-yl group.

[0310] Examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom.

[0311] The organic black pigment represented by general formula (A) is preferably an organic black pigment containing at least one selected from the group consisting of a compound represented by the following general formula (B) (hereinafter also referred to as "compound (B)") and a geometric isomer of compound (B).

[0312] [ka]

[0313] A specific example of such an organic black pigment is Irgaphor (registered trademark) Black S 0100 CF (manufactured by BASF). This organic black pigment is preferably dispersed using a dispersant, a solvent, and a method described below before use. If the sulfonic acid derivative of compound (A), particularly the sulfonic acid derivative of compound (B), is present during dispersion, dispersibility and storage stability may be improved, so it is preferable that the organic black pigment contains these sulfonic acid derivatives.

[0314] Examples of organic black pigments other than the organic black pigment represented by general formula (A) include aniline black and perylene black.

[0315] Further, as colorants other than these organic pigments, inorganic black pigments can be mentioned, and inorganic black pigments may be used in addition to the organic pigments.

[0316] Examples of inorganic black pigments include carbon black, acetylene black, lamp black, bone black, graphite, iron black, cyanine black, and titanium black. Among these, carbon black is preferably used from the viewpoint of light-shielding properties. Examples of carbon black include the following carbon blacks.

[0317] Mitsubishi Chemical: MA7, MA8, MA11, MA77, MA100, MA100R, MA100S, MA220, MA230, MA600, MCF88, #5, #10, #20, #25, #30, #32, #33, #40, #44, #45, #47, #50, #52, #55, #650, #750, #850, #900, #950, # 960, #970, #980, #990, #1000, #2200, #2300, #2350, #2400, #2600, #2650, #3030, #3050, #31 50, #3250, #3400, #3600, #3750, #3950, #4000, #4010, OIL7B, OIL9B, OIL11B, OIL30B, OIL31B Manufactured by Degussa: Printex (registered trademark, same hereinafter) 3, Printex3OP, Printex30, Printex30OP, Printex40, Printex45, Printex55, Printex60, Printex75, Printex80, Printex85, Printex90, Printex A, Printex L, Printex G, Printex P, Printex U, Printex V, PrintexG, SpecialBlack550, SpecialBlack350, SpecialBlack250, SpecialBlack100, SpecialBlack6, SpecialBlack5, SpecialBlack4, Color Black FW1, Color Black FW2, Color Black FW2V, Color Black FW18, Color Black FW18, Color Black FW200, Color Black S160, Color Black S170 Cabot Corporation: Monarch (registered trademark, the same applies below) 120, Monarch 280, Monarch 460, Monarch 800, Monarch 880, Monarch 900, Monarch 1000, Monarch 1100, Monarch 13 00, Monarch1400, Monarch4630, REGAL (registered trademark, the same applies below) 99, REGAL99R, REGAL415, REGAL415R, REGAL250, REGAL250R, REGAL330, REGAL400R, REGAL55R0, REGAL660R, BLACK PEARLS480, PEARLS130, VULCAN (registered trademark, the same applies below) XC72R, ELFTEX (registered trademark)-8 Biller: RAVEN (registered trademark, the same applies below) 11, RAVEN 14, RAVEN 15, RAVEN 16, RAVEN 22, RAVEN 30, RAVEN 35, RAVEN 40, RAVEN 410, RAVEN 420, RAVEN 450, RAVEN 500, RAVEN 780, RAVEN 850, RAVEN 890H, RAVEN 1000, RAVEN 1020, RAVEN 1040, RAVEN 1060U, RAVEN 1080U, RAVEN 1170, RAVEN 1190U, RAVEN 1250, RAVEN 1500, RAVEN 2000, RAVEN 2500U, RAVEN 3500, RAVEN 5000, RAVEN 5250, RAVEN 5750, RAVEN 7000

[0318] Carbon black coated with a resin may be used. The use of resin-coated carbon black has the effect of improving adhesion to a glass substrate and volume resistivity. As the resin-coated carbon black, for example, the carbon black described in Japanese Patent Application Laid-Open No. 09-71733 can be preferably used. In terms of volume resistivity and dielectric constant, resin-coated carbon black is preferably used.

[0319] The carbon black to be subjected to the resin coating treatment preferably has a total Na and Ca content of 100 ppm or less. Carbon black usually contains ash composed of Na, Ca, K, Mg, Al, Fe, etc., which are mixed in from raw material oil and combustion oil (or gas) during production, reaction stop water and granulation water, and further from furnace materials of a reactor. Of these, Na and Ca are generally contained in amounts of several hundred ppm or more each, but by reducing these, it tends to be possible to suppress the penetration into the transparent electrode (ITO) and other electrodes and prevent electrical short circuits.

[0320] Methods for reducing the content of ash containing Na and Ca include carefully selecting raw material oil, fuel oil (or gas) and reaction terminating water for producing carbon black that contain as little of these substances as possible, and minimizing the amount of alkaline substances added to adjust the structure. Another method includes washing the carbon black produced in the furnace with water or hydrochloric acid to dissolve and remove Na and Ca.

[0321] Specifically, after carbon black is mixed and dispersed in water, hydrochloric acid, or hydrogen peroxide, a solvent that is poorly soluble in water is added, and the carbon black migrates to the solvent side and is completely separated from the water, and most of the Na and Ca present in the carbon black are dissolved and removed in the water or acid. In order to reduce the total amount of Na and Ca to 100 ppm or less, it may be possible to do so using only the carbon black manufacturing process that uses carefully selected raw materials, or using only the water or acid dissolution method, but it is even easier to reduce the total amount of Na and Ca to 100 ppm or less by using both of these methods in combination.

[0322] The resin-coated carbon black is preferably so-called acidic carbon black having a pH of 6 or less. Since the dispersion diameter (agglomerate diameter) in water is small, it is preferable that even minute units can be coated. Furthermore, it is preferable that the average particle diameter is 40 nm or less and the dibutyl phthalate (DBP) absorption amount is 140 mL / 100 g or less. By keeping it within the above range, a coating film with good light-shielding properties tends to be obtained. The average particle diameter means the number average particle diameter, and means the circle equivalent diameter obtained by particle image analysis in which several fields of view are photographed at tens of thousands of magnifications by electron microscope observation, and about 2000 to 3000 particles in these photographs are counted by an image processing device.

[0323] There are no particular limitations on the method for preparing carbon black coated with a resin. For example, after appropriately adjusting the amounts of carbon black and resin, the following methods can be used: 1. After mixing and stirring a resin solution obtained by mixing and dissolving a resin in a solvent such as cyclohexanone, toluene, or xylene under heating, and a suspension obtained by mixing carbon black and water, the carbon black and water are separated, the water is removed, and the resulting composition is heated and kneaded to form a sheet, which is then crushed and dried; 2. After mixing and stirring a resin solution and a suspension prepared in the same manner as above to granulate the carbon black and resin, the resulting granules are separated and heated to remove the remaining solvent. and removing the agent and water; 3. a method in which a carboxylic acid such as maleic acid or fumaric acid is dissolved in the solvent exemplified above, carbon black is added, the mixture is mixed and dried, the solvent is removed to obtain carboxylic acid-impregnated carbon black, a resin is then added to this and dry-blended; 4. a method in which a reactive group-containing monomer component constituting the resin to be coated and water are stirred at high speed to prepare a suspension, which is polymerized and cooled to obtain a reactive group-containing resin from the polymer suspension, carbon black is added to this and kneaded, the carbon black is reacted with the reactive group (carbon black is grafted), and the suspension is cooled and pulverized.

[0324] The type of resin used for the coating treatment is not particularly limited, but synthetic resins are generally used. Furthermore, resins having a benzene ring in their structure are preferred from the standpoint of dispersibility and dispersion stability because they have a stronger amphoteric surfactant-like effect. Specific examples of synthetic resins that can be used include thermosetting resins such as phenol resin, melamine resin, xylene resin, diallyl phthalate resin, glyptal resin, epoxy resin, and alkylbenzene resin, and thermoplastic resins such as polystyrene, polycarbonate, polyethylene terephthalate, polybutylene terephthalate, modified polyphenylene oxide, polysulfone, polyparaphenylene terephthalamide, polyamideimide, polyimide, polyamino bismaleimide, polyether sulfo polyphenylene sulfone, polyarylate, and polyether ether ketone. The amount of coating resin is preferably 1 to 30% by mass based on the total amount of carbon black and resin. By setting the amount to the lower limit or more, there is a tendency that the coating can be made sufficient. On the other hand, by setting the amount to the upper limit or less, there is a tendency that the adhesion between the resins can be prevented and the dispersibility can be made good.

[0325] The carbon black thus coated with resin can be used as a colorant for colored partition walls in the usual manner. The use of such carbon black tends to enable the formation of colored partition walls with a high light-shielding rate and low surface reflectance at low cost. It is also presumed that the resin coating of the carbon black surface serves to confine ash, including Na and Ca, within the carbon black.

[0326] These organic and inorganic pigments are preferably dispersed and used so that the average particle size is usually 1 μm or less, preferably 0.5 μm or less, and more preferably 0.25 μm or less, where the average particle size is determined by the number of pigment particles. The average particle size of the pigment is a value calculated from the pigment particle size measured by dynamic light scattering (DLS). The particle size is measured on a sufficiently diluted photosensitive resin composition (usually diluted to a pigment concentration of about 0.005 to 0.2% by mass. However, if there is a concentration recommended by the measuring instrument, this concentration should be followed) at 25°C.

[0327] In addition to the above-mentioned organic pigments and inorganic black pigments, dyes may be used. Examples of dyes that can be used as colorants include azo dyes, anthraquinone dyes, phthalocyanine dyes, quinoneimine dyes, quinoline dyes, nitro dyes, carbonyl dyes, methine dyes, and the like. Examples of azo dyes include CI Acid Yellow 11, CI Acid Orange 7, CI Acid Red 37, CI Acid Red 180, CI Acid Blue 29, CI Direct Red 28, CI Direct Red 83, CI Direct Yellow 12, CI Direct Orange 26, CI Direct Green 28, CI Direct Green 59, CI Reactive Yellow 2, CI Reactive Red 17, CI Reactive Red 120, CI Reactive Black 5, CI Disperse Orange 5, CI Disperse Red 58, CI Disperse Blue 165, CI Basic Blue 41, CI Basic Red 18, CI Mordant Red 7, CI Mordant Yellow 5, and CI Mordant Black 7.

[0328] Examples of anthraquinone dyes include CI Vat Blue 4, CI Acid Blue 40, CI Acid Green 25, CI Reactive Blue 19, CI Reactive Blue 49, CI Disperse Red 60, CI Disperse Blue 56, and CI Disperse Blue 60. Examples of phthalocyanine dyes include CI Pad Blue 5; examples of quinoneimine dyes include CI Basic Blue 3 and CI Basic Blue 9; examples of quinoline dyes include CI Solvent Yellow 33, CI Acid Yellow 3 and CI Disperse Yellow 64; and examples of nitro dyes include CI Acid Yellow 1, CI Acid Orange 3 and CI Disperse Yellow 42.

[0329] When the photosensitive resin composition of the present invention contains a colorant (E), the content of the colorant (E) is not particularly limited, but is preferably 1% by mass or more, more preferably 2% by mass or more, even more preferably 3% by mass or more, and particularly preferably 4% by mass or more, and is preferably 50% by mass or less, more preferably 30% by mass or less, even more preferably 20% by mass or less, even more preferably 15% by mass or less, especially preferably 12% by mass or less, and most preferably 10% by mass or less. For example, 1 to 50% by mass is preferred, 1 to 30% by mass is more preferred, 2 to 20% by mass is more preferred, 2 to 15% by mass is even more preferred, 3 to 12% by mass is particularly preferred, and 4 to 10% by mass is particularly preferred. By making it equal to or more than the lower limit, light-shielding properties tend to be ensured. By making it equal to or less than the upper limit, the amount of the alkali-soluble resin and the ethylenically unsaturated compound can be relatively increased, and the curing property and ink repellency of the coating film tend to be improved.

[0330] [1-1-6] (F) Dispersant When the photosensitive resin composition of the present invention contains a colorant (E), it preferably contains a dispersant (F) in order to finely disperse the colorant (E) and stabilize the dispersed state. As the (F) dispersant, a polymer dispersant having a functional group is preferred, and furthermore, from the viewpoint of dispersion stability, a polymer dispersant having a functional group such as a carboxy group, a phosphoric acid group, a sulfonic acid group, or a base thereof, a primary, secondary or tertiary amino group, a quaternary ammonium base, or a group derived from a nitrogen-containing heterocycle such as pyridine, pyrimidine or pyrazine is preferred. Among these, a polymer dispersant having a basic functional group such as a primary, secondary or tertiary amino group, a quaternary ammonium base, or a group derived from a nitrogen-containing heterocycle such as pyridine, pyrimidine or pyrazine is particularly preferred from the viewpoint that a small amount of dispersant is needed to disperse the pigment.

[0331] Examples of polymeric dispersants include urethane-based dispersants, acrylic-based dispersants, polyethyleneimine-based dispersants, polyallylamine-based dispersants, dispersants consisting of a monomer and a macromonomer having an amino group, polyoxyethylene alkyl ether-based dispersants, polyoxyethylene diester-based dispersants, polyether phosphate-based dispersants, polyester phosphate-based dispersants, sorbitan aliphatic ester-based dispersants, and aliphatic modified polyester-based dispersants.

[0332] Specific examples of such dispersants include, for example, the trade names EFKA (registered trademark, manufactured by BASF), DISPERBYK (registered trademark, manufactured by BYK-Chemie), Disparlon (registered trademark, manufactured by Kusumoto Chemical Industries, Ltd.), SOLSPERSE (registered trademark, manufactured by Lubrizol Corporation), KP (manufactured by Shin-Etsu Chemical Co., Ltd.), Polyflow (manufactured by Kyoeisha Chemical Co., Ltd.), and AJISPER (registered trademark, manufactured by Ajinomoto Co., Ltd.). The polymer dispersing agent may be used alone or in combination of two or more kinds.

[0333] The weight average molecular weight (Mw) of the polymer dispersant is preferably 700 or more, more preferably 1000 or more, and is preferably 100000 or less, more preferably 50000 or less. For example, the weight average molecular weight (Mw) of the polymer dispersant is preferably 700 to 100000, more preferably 1000 to 50000. Of these, from the viewpoint of pigment dispersibility, it is preferable that the (F) dispersant contains either one or both of a urethane-based polymer dispersant having a functional group and an acrylic-based polymer dispersant, and it is particularly preferable that the (F) dispersant contains an acrylic-based polymer dispersant. From the standpoint of dispersibility and storage stability, polymer dispersants having a basic functional group and either or both of a polyester bond and a polyether bond are preferred.

[0334] Examples of urethane-based and acrylic-based polymer dispersants include DISPERBYK-160 to 167, 182 series (all urethane-based), DISPERBYK-2000, 2001, BYK-LPN21116 (all acrylic-based) (all manufactured by BYK-Chemie). Specific examples of chemical structures preferred for urethane-based polymer dispersants include dispersion resins having a weight average molecular weight of 1,000 to 200,000, obtained by reacting a polyisocyanate compound with a compound having one or two hydroxyl groups in the molecule and a number average molecular weight of 300 to 10,000, and a compound having active hydrogen and a tertiary amino group in the same molecule. By treating these with a quaternizing agent such as benzyl chloride, all or a part of the tertiary amino groups can be converted to quaternary ammonium salt groups.

[0335] Examples of polyisocyanate compounds include aromatic diisocyanates such as paraphenylene diisocyanate, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 4,4'-diphenylmethane diisocyanate, naphthalene-1,5-diisocyanate, and tolidine diisocyanate, aliphatic diisocyanates such as hexamethylene diisocyanate, lysine methyl ester diisocyanate, 2,4,4-trimethylhexamethylene diisocyanate, and dimer acid diisocyanate, isophorone diisocyanate, 4,4'-methylenebis(cyclohexyl isocyanate), ω,ω'-diisocyanate dimethyl silane, and the like. Examples of the polyisocyanate include alicyclic diisocyanates such as cyclohexane, aliphatic diisocyanates having an aromatic ring such as xylylene diisocyanate and α,α,α',α'-tetramethyl xylylene diisocyanate, lysine ester triisocyanate, 1,6,11-undecane triisocyanate, 1,8-diisocyanate-4-isocyanate methyl octane, 1,3,6-hexamethylene triisocyanate, bicycloheptane triisocyanate, tris(isocyanate phenyl methane), tris(isocyanate phenyl) thiophosphate, and trimers, water adducts, and polyol adducts thereof. As the polyisocyanate, trimers of organic diisocyanates are preferred, and trimers of tolylene diisocyanate and isophorone diisocyanate are particularly preferred. These may be used alone or in combination of two or more.

[0336] Examples of methods for producing an isocyanate trimer include a method in which polyisocyanates are subjected to partial trimerization of isocyanate groups using an appropriate trimerization catalyst, such as tertiary amines, phosphines, alkoxides, metal oxides, and carboxylates, and the trimerization is terminated by adding a catalyst poison, after which unreacted polyisocyanate is removed by solvent extraction and thin-film distillation to obtain the desired isocyanurate group-containing polyisocyanate.

[0337] Examples of compounds having one or two hydroxyl groups in the same molecule and a number average molecular weight of 300 to 10,000 include polyether glycol, polyester glycol, polycarbonate glycol, polyolefin glycol, etc., compounds in which one terminal hydroxyl group of these compounds is alkoxylated with an alkyl group having 1 to 25 carbon atoms, and mixtures of two or more of these. Examples of the polyether glycol include polyether diol, polyether ester diol, and mixtures of two or more of these. Examples of the polyether diol include those obtained by homopolymerizing or copolymerizing alkylene oxide, such as polyethylene glycol, polypropylene glycol, polyethylene-propylene glycol, polyoxytetramethylene glycol, polyoxyhexamethylene glycol, polyoxyoctamethylene glycol, and mixtures of two or more of these.

[0338] Examples of polyetherester diols include those obtained by reacting an ether group-containing diol or a mixture of it with other glycols with a dicarboxylic acid or an anhydride thereof, or by reacting a polyester glycol with an alkylene oxide, such as poly(polyoxytetramethylene) adipate. The most preferred polyether glycols are polyethylene glycol, polypropylene glycol, polyoxytetramethylene glycol, or compounds in which one terminal hydroxyl group of these compounds is alkoxylated with an alkyl group having 1 to 25 carbon atoms.

[0339] Polyester glycols include dicarboxylic acids (succinic acid, glutaric acid, adipic acid, sebacic acid, fumaric acid, maleic acid, phthalic acid, etc.) or their anhydrides and glycols (ethylene glycol, diethylene glycol, triethylene glycol, propylene glycol, dipropylene glycol, tripropylene glycol, 1,2-butanediol, 1,3-butanediol, 1,4-butanediol, 2,3-butanediol, 3-methyl-1,5-pentanediol, neopentyl glycol, 2-methyl-1,3-propanediol, 2-methyl-2-propyl-1,3-propanediol, 2-butyl-2-ethyl-1,3-propanediol, 1,5-pentanediol, 1,6-hexanediol, 2-methyl-2,4-pentanediol, 2,2,4-trimethyl-1,3-pentanediol, 2-ethyl-1,3-hexanediol, Examples of the polyester glycol include polycondensation of aliphatic glycols such as sandiol, 2,5-dimethyl-2,5-hexanediol, 1,8-octamethylene glycol, 2-methyl-1,8-octamethylene glycol, and 1,9-nonanediol, alicyclic glycols such as bishydroxymethylcyclohexane, aromatic glycols such as xylylene glycol and bishydroxyethoxybenzene, and N-alkyldialkanolamines such as N-methyldiethanolamine, such as polyethylene adipate, polybutylene adipate, polyhexamethylene adipate, and polyethylene / propylene adipate, or polylactone diols or polylactone monools obtained by using the above diols or monohydric alcohols having 1 to 25 carbon atoms as initiators, such as polycaprolactone glycol, polymethylvalerolactone, and mixtures of two or more of these. As the polyester glycol, polycaprolactone glycol and polycaprolactone using alcohols having 1 to 25 carbon atoms as initiators are particularly preferred.

[0340] Examples of polycarbonate glycols include poly(1,6-hexylene) carbonate and poly(3-methyl-1,5-pentylene) carbonate, and examples of polyolefin glycols include polybutadiene glycol, hydrogenated polybutadiene glycol, and hydrogenated polyisoprene glycol. These may be used alone or in combination of two or more.

[0341] The number average molecular weight of the compound having one or two hydroxyl groups in one molecule is preferably 300 to 10,000, more preferably 500 to 6,000, and further preferably 1,000 to 4,000.

[0342] This article describes a compound that has active hydrogen and a tertiary amino group in the same molecule. Examples of active hydrogen, that is, a hydrogen atom directly bonded to an oxygen atom, a nitrogen atom, or a sulfur atom, include hydrogen atoms in functional groups such as a hydroxyl group, an amino group, and a thiol group, and among these, a hydrogen atom in an amino group, particularly a primary amino group, is preferred.

[0343] The tertiary amino group is not particularly limited, but examples thereof include an amino group having an alkyl group having 1 to 4 carbon atoms, or a heterocyclic structure, more specifically, for example, an imidazole ring or a triazole ring.

[0344] Examples of compounds having active hydrogen and a tertiary amino group in the same molecule include N,N-dimethyl-1,3-propanediamine, N,N-diethyl-1,3-propanediamine, N,N-dipropyl-1,3-propanediamine, N,N-dibutyl-1,3-propanediamine, N,N-dimethylethylenediamine, N,N-diethylethylenediamine, N,N-dipropylethylenediamine, N,N-dibutylethylenediamine, N,N-dimethyl-1,4-butanediamine, N,N-diethyl-1,4-butanediamine, N,N-dipropyl-1,4-butanediamine, and N,N-dibutyl-1,4-butanediamine.

[0345] When the tertiary amino group is a nitrogen-containing heterocyclic structure, examples of the nitrogen-containing heterocyclic ring include a pyrazole ring, an imidazole ring, a triazole ring, a tetrazole ring, an indole ring, a carbazole ring, an indazole ring, a benzimidazole ring, a benzotriazole ring, a benzoxazole ring, a benzothiazole ring, a benzothiadiazole ring, and other nitrogen-containing 5-membered heterocyclic rings, and a pyridine ring, a pyridazine ring, a pyrimidine ring, a triazine ring, a quinoline ring, an acridine ring, an isoquinoline ring, and other nitrogen-containing 6-membered heterocyclic rings. Among these nitrogen-containing heterocyclic rings, an imidazole ring and a triazole ring are preferred.

[0346] Examples of compounds having an imidazole ring and an amino group include 1-(3-aminopropyl)imidazole, histidine, 2-aminoimidazole, and 1-(2-aminoethyl)imidazole. Examples of the compound having a triazole ring and an amino group include 3-amino-1,2,4-triazole, 5-(2-amino-5-chlorophenyl)-3-phenyl-1H-1,2,4-triazole, 4-amino-4H-1,2,4-triazole-3,5-diol, 3-amino-5-phenyl-1H-1,3,4-triazole, 5-amino-1,4-diphenyl-1,2,3-triazole, and 3-amino-1-benzyl-1H-2,4-triazole. Among these, N,N-dimethyl-1,3-propanediamine, N,N-diethyl-1,3-propanediamine, 1-(3-aminopropyl)imidazole, and 3-amino-1,2,4-triazole are preferable. These may be used alone or in combination of two or more.

[0347] The preferred blending ratio of raw materials when producing a urethane-based polymer dispersant is 10 to 200 parts by mass, preferably 20 to 190 parts by mass, and more preferably 30 to 180 parts by mass of a compound having one or two hydroxyl groups in the same molecule and a number average molecular weight of 300 to 10,000, and 0.2 to 25 parts by mass, preferably 0.3 to 24 parts by mass of a compound having an active hydrogen and a tertiary amino group in the same molecule, per 100 parts by mass of a polyisocyanate compound.

[0348] The urethane polymer dispersant can be produced according to a known method for producing polyurethane resin.The solvent used in the production is usually acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclopentanone, cyclohexanone, isophorone, and other ketones, ethyl acetate, butyl acetate, cellosolve acetate, and other esters, benzene, toluene, xylene, hexane, and other hydrocarbons, diacetone alcohol, isopropanol, secondary butanol, tertiary butanol, and other alcohols, methylene chloride, chloroform, and other chlorides, tetrahydrofuran, diethyl ether, and other ethers, dimethylformamide, N-methylpyrrolidone, dimethylsulfoxide, and other aprotic polar solvents. These may be used alone or in combination of two or more.

[0349] In the production of urethane-based polymer dispersants, a urethane-forming reaction catalyst is usually used. Examples of the urethane-forming reaction catalyst include tin-based catalysts such as dibutyltin dilaurate, dioctyltin dilaurate, dibutyltin dioctoate, and stannous octoate, iron-based catalysts such as iron acetylacetonate and ferric chloride, and tertiary amine-based catalysts such as triethylamine and triethylenediamine. These may be used alone or in combination of two or more.

[0350] The amount of the compound having active hydrogen and a tertiary amino group in the same molecule is preferably controlled to be in the range of 1 to 100 mgKOH / g, more preferably 5 to 95 mgKOH / g, in terms of the amine value after the reaction. The amine value is a value expressed in mg of KOH corresponding to the acid value obtained by neutralizing titration of a basic amino group with an acid. By making the amount equal to or greater than the lower limit, the dispersing ability tends to improve. By making the amount equal to or less than the upper limit, the developability tends to improve.

[0351] When isocyanate groups remain in the polymer dispersant, it is preferable to inactivate the isocyanate groups with an alcohol or an amino compound, since this increases the stability of the product over time. The weight average molecular weight (Mw) of the urethane-based polymer dispersant is preferably 1000 to 200000, more preferably 2000 to 100000, and further preferably 3000 to 50000. By making it equal to or more than the lower limit, the dispersibility and dispersion stability tend to be improved. By making it equal to or less than the upper limit, the solubility is improved and the dispersibility tends to be improved.

[0352] As the acrylic polymer dispersant, it is preferable to use a random copolymer, graft copolymer, or block copolymer of an unsaturated group-containing monomer having a functional group (the functional group here is the functional group described above as the functional group contained in the polymer dispersant) and an unsaturated group-containing monomer not having a functional group. These copolymers can be produced by known methods.

[0353] Examples of the unsaturated group-containing monomer having a functional group include unsaturated monomers having a carboxy group, such as (meth)acrylic acid, 2-(meth)acryloyloxyethyl succinic acid, 2-(meth)acryloyloxyethyl phthalic acid, 2-(meth)acryloyloxyethyl hexahydrophthalic acid, and acrylic acid dimer, and unsaturated monomers having a tertiary amino group or a quaternary ammonium salt group, such as dimethylaminoethyl (meth)acrylate, diethylaminoethyl (meth)acrylate, and quaternary derivatives thereof. These may be used alone or in combination of two or more.

[0354] Examples of the unsaturated group-containing monomer having no functional group include methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, isopropyl (meth)acrylate, n-butyl (meth)acrylate, isobutyl (meth)acrylate, t-butyl (meth)acrylate, benzyl (meth)acrylate, phenyl (meth)acrylate, cyclohexyl (meth)acrylate, phenoxyethyl (meth)acrylate, phenoxymethyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, isobornyl (meth)acrylate, tricyclodecane (meth)acrylate, and the like. p) acrylate, tetrahydrofurfuryl (meth)acrylate, N-vinylpyrrolidone, styrene and its derivatives, α-methylstyrene, N-substituted maleimides such as N-cyclohexylmaleimide, N-phenylmaleimide and N-benzylmaleimide, acrylonitrile, vinyl acetate, and macromonomers such as polymethyl (meth)acrylate macromonomer, polystyrene macromonomer, poly 2-hydroxyethyl (meth)acrylate macromonomer, polyethylene glycol macromonomer, polypropylene glycol macromonomer, and polycaprolactone macromonomer. These may be used alone or in combination of two or more.

[0355] The acrylic polymer dispersant is particularly preferably an AB or BAB block copolymer consisting of an A block having a functional group and a B block having no functional group. In this case, the A block may contain a partial structure derived from an unsaturated group-containing monomer not containing the above-mentioned functional group in addition to the partial structure derived from the unsaturated group-containing monomer having the above-mentioned functional group, and these may be contained in the A block in the form of either random copolymerization or block copolymerization. The content of the partial structure not containing a functional group in the A block is preferably 80% by mass or less, more preferably 50% by mass or less, and further preferably 30% by mass or less.

[0356] The B block is composed of a partial structure derived from an unsaturated group-containing monomer not containing the above functional group, but one B block may contain partial structures derived from two or more types of monomers, and these may be contained in the B block in the form of either random copolymerization or block copolymerization. The AB or BAB block copolymer is prepared, for example, by the living polymerization method shown below. Living polymerization methods include anionic living polymerization methods, cationic living polymerization methods, and radical living polymerization methods.

[0357] In synthesizing the acrylic polymer dispersant, for example, the following methods can be used: JP-A-9-62002; P. Lutz, P. Masson et al., Polym. Bull. 12, 79 (1984); BC Anderson, GD Andrews et al., Macromolecules, 14, 1601(1981); K. Hatada, K. Ute, et al., Polym. J. 17, 977(1985), 18, 1037(1986); Koichi Migite, Koichi Hatada, Polymer Processing, 36, 366(1987); Toshinobu Higashimura, Mitsuo Sawamoto, Polymer Research Papers, 46, 189(1989); M. Kuroki, T. Aida, J. Am. Chem. Sic, 109, 4737 (1987), Takuzo Aida, Shohei Inoue, Organic Synthesis Chemistry, 43, 300 (1985), DY Sogoh, WR Hardler et al., Macromolecules, 20, 1473 (1987) can be used.

[0358] The acrylic polymer dispersant that can be used in the present invention may be an AB block copolymer or a BAB block copolymer, and the A block / B block ratio constituting the copolymer is preferably 1 / 99 to 80 / 20 (mass ratio), and more preferably 5 / 95 to 60 / 40 (mass ratio). By keeping it within the above range, it tends to be possible to ensure a balance between dispersibility and storage stability. The amount of the quaternary ammonium salt group in 1 g of the AB block copolymer or BAB block copolymer that can be used in the present invention is preferably 0.1 to 10 mmol. By keeping it within this range, good dispersibility tends to be ensured.

[0359] In the case where such a block copolymer contains an amino group generated during the manufacturing process, the amine value is preferably 1 to 100 mgKOH / g, and from the viewpoint of dispersibility, it is preferably 10 mgKOH / g or more, more preferably 30 mgKOH / g or more, even more preferably 50 mgKOH / g or more, and also preferably 90 mgKOH / g or less, more preferably 80 mgKOH / g or less, even more preferably 75 mgKOH / g or less. For example, it is preferably 1 to 100 mgKOH / g, more preferably 10 to 90 mgKOH / g, even more preferably 30 to 80 mgKOH / g, and particularly preferably 50 to 75 mgKOH / g. The amine value of a dispersant such as a block copolymer is expressed as the mass of KOH equivalent to the amount of base per gram of solids excluding the solvent in a dispersant sample, and is measured by the following method. Weigh out 0.5-1.5g of the dispersant sample into a 100mL beaker and dissolve it in 50mL of acetic acid. Using an automatic titrator equipped with a pH electrode, neutralize this solution with 0.1mol / L HClO4 acetic acid solution. The inflection point of the titration pH curve is set as the titration end point, and the amine value is calculated using the following formula.

[0360] Amine value [mgKOH / g] = (561 x V) / (W x S) (where W is the weight of the dispersant sample [g], V is the titration amount at the end of the titration [mL], and S is the solids concentration of the dispersant sample [% by mass].) The acid value of the block copolymer depends on the presence or absence and type of acidic groups that are the source of the acid value, but is preferably low, and is preferably 10 mgKOH / g or less. The weight average molecular weight (Mw) of the block copolymer is preferably in the range of 1000 to 100000. By setting it within this range, good dispersibility tends to be ensured.

[0361] When the polymer dispersant has a quaternary ammonium base as a functional group, the specific structure of the polymer dispersant is not particularly limited. From the viewpoint of dispersibility, however, it is preferable that the polymer dispersant has a repeating unit represented by the following formula (ri) (hereinafter, sometimes referred to as "repeating unit (ri)").

[0362] [ka]

[0363] (In formula (ri), R 31 ~R 33 each independently represents a hydrogen atom, an optionally substituted alkyl group, an optionally substituted aryl group, or an optionally substituted aralkyl group; R 31 ~R 33 two or more of may be linked together to form a cyclic structure; R 34 is a hydrogen atom or a methyl group; X is a divalent linking group; Y - is the counter anion.)

[0364] R in formula (ri) 31 ~R 33 The number of carbon atoms of the alkyl group which may have a substituent in the above formula is not particularly limited, but is preferably 1 or more and 10 or less, more preferably 6 or less. Specific examples of the alkyl group include, for example, a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group, a heptyl group, and an octyl group. Among these, a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, and a hexyl group are preferred, and a methyl group, an ethyl group, a propyl group, and a butyl group are more preferred. The alkyl group may be either linear or branched. The alkyl group may also include a cyclic structure such as a cyclohexyl group or a cyclohexylmethyl group.

[0365] R in formula (ri) 31 ~R 33The number of carbon atoms of the aryl group which may have a substituent in the formula (I) is not particularly limited, but is preferably 6 or more, and is preferably 16 or less, and more preferably 12 or less. Specific examples of the aryl group include a phenyl group, a methylphenyl group, an ethylphenyl group, a dimethylphenyl group, a diethylphenyl group, a naphthyl group, and an anthracenyl group, and among these, a phenyl group, a methylphenyl group, an ethylphenyl group, a dimethylphenyl group, and a diethylphenyl group are preferred, and a phenyl group, a methylphenyl group, and an ethylphenyl group are more preferred.

[0366] R in formula (ri) 31 ~R 33 The number of carbon atoms in the aralkyl group which may have a substituent in the formula (I) is not particularly limited, but is preferably 7 or more, and is preferably 16 or less, and more preferably 12 or less. Specific examples of the aralkyl group include a phenylmethyl group (benzyl group), a phenylethyl group (phenethyl group), a phenylpropyl group, a phenylbutyl group, and a phenylisopropyl group. Among these, the phenylmethyl group, the phenylethyl group, the phenylpropyl group, and the phenylbutyl group are preferred, and the phenylmethyl group and the phenylethyl group are more preferred.

[0367] Among these, from the viewpoint of dispersion, R 31 ~R 33 are each independently preferably an alkyl group or an aralkyl group, and specifically, R 31 and R 33 are each independently a methyl group or an ethyl group, and R 32 is preferably a phenylmethyl group or a phenylethyl group, and R 31 and R 33 is a methyl group, and R 32 It is more preferable that is a phenylmethyl group.

[0368] When the polymer dispersant has a tertiary amine as a functional group, from the viewpoint of dispersibility, it preferably has a repeating unit represented by the following formula (r-ii) (hereinafter sometimes referred to as "repeating unit (r-ii)").

[0369] [ka]

[0370] (In formula (r-ii), R 35 and R 36 each independently represents a hydrogen atom, an optionally substituted alkyl group, an optionally substituted aryl group, or an optionally substituted aralkyl group; R 35 and R 36 may be linked together to form a cyclic structure; R 37 is a hydrogen atom or a methyl group; Z is a divalent linking group.

[0371] R in formula (r-ii) 35 and R 36 In the formula (ri), the alkyl group which may have a substituent is R 31 ~R 33 The following can be preferably used. R in formula (r-ii) 35 and R 36 In the formula (ri), the aryl group which may have a substituent is R 31 ~R 33 The following can be preferably used. R in formula (r-ii) 35 and R 36 In the formula (ri), the optionally substituted aralkyl group is R 31 ~R 33 The following can be preferably used.

[0372] Among these, R 35 and R 36 are each preferably an alkyl group which may have a substituent, and more preferably a methyl group or an ethyl group.

[0373] R in formula (ri) 31~R 33 and R in formula (r-ii) 35 and R 36 Examples of the substituent that the alkyl group, aralkyl group or aryl group in the formula (I) may have include a halogen atom, an alkoxy group, a benzoyl group and a hydroxyl group.

[0374] In the formula (ri) and the formula (r-ii), examples of the divalent linking groups X and Z include an alkylene group having 1 to 10 carbon atoms, an arylene group having 6 to 12 carbon atoms, -CONH-R 43 -GROUP, -COOR 44 - group (wherein R 43 and R 44 is a single bond, an alkylene group having 1 to 10 carbon atoms, or an ether group (alkyloxyalkyl group) having 2 to 10 carbon atoms. 44 -based. In formula (ri), the counter anion Y - For example, Cl - , Br - , I - , ClO4 - , BF4 - , CH3COO - , PF6 - Examples include:

[0375] The content ratio of the repeating unit represented by formula (ri) is not particularly limited, but from the viewpoint of dispersibility, it is preferably 60 mol% or less, more preferably 50 mol% or less, even more preferably 40 mol% or less, particularly preferably 35 mol% or less, and also preferably 5 mol% or more, more preferably 10 mol% or more, even more preferably 20 mol% or more, particularly preferably 30 mol% or more, based on the total content ratio of the repeating unit represented by formula (ri) and the repeating unit represented by formula (r-ii). For example, 5 to 60 mol% is preferable, 10 to 50 mol% is more preferable, 20 to 40 mol% is more preferable, and 30 to 35 mol% is particularly preferable.

[0376] The content ratio of the repeating unit represented by the formula (ri) in the total repeating units of the polymer dispersant is not particularly limited, but from the viewpoint of dispersibility, it is preferably 1 mol% or more, more preferably 5 mol% or more, even more preferably 10 mol% or more, and also preferably 50 mol% or less, more preferably 30 mol% or less, even more preferably 20 mol% or less, and particularly preferably 15 mol% or less. For example, it is preferably 1 to 50 mol%, more preferably 1 to 30 mol%, even more preferably 5 to 20 mol%, and particularly preferably 10 to 15 mol%.

[0377] The content ratio of the repeating unit represented by the formula (r-ii) in the total repeating units of the polymer dispersant is not particularly limited, but from the viewpoint of dispersibility, it is preferably 5 mol% or more, more preferably 10 mol% or more, even more preferably 15 mol% or more, particularly preferably 20 mol% or more, and preferably 60 mol% or less, more preferably 40 mol% or less, even more preferably 30 mol% or less, particularly preferably 25 mol% or less. For example, it is preferably 5 to 60 mol%, more preferably 10 to 40 mol%, even more preferably 15 to 30 mol%, particularly preferably 20 to 25 mol%.

[0378] From the viewpoint of increasing compatibility with binder components such as solvents and improving dispersion stability, it is preferable that the polymer dispersant has a repeating unit represented by the following formula (r-iii) (hereinafter sometimes referred to as "repeating unit (r-iii)"):

[0379] [ka]

[0380] (In formula (r-iii), R 40 is an ethylene group or a propylene group; R 41 represents an alkyl group which may have a substituent; R 42 is a hydrogen atom or a methyl group; n is an integer from 1 to 20.

[0381] R in formula (r-iii) 41 The number of carbon atoms of the alkyl group which may have a substituent in is not particularly limited, but is preferably 1 or more, more preferably 2 or more, and more preferably 10 or less, and more preferably 6 or less. Specific examples of the alkyl group include, for example, a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group, a heptyl group, and an octyl group. Among these, a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, or a hexyl group is preferred, and a methyl group, an ethyl group, a propyl group, or a butyl group is more preferred. The alkyl group may be either linear or branched. The alkyl group may also include a cyclic structure such as a cyclohexyl group or a cyclohexylmethyl group. For example, the number of carbon atoms of the alkyl group is preferably 1 to 10, and more preferably 2 to 6.

[0382] In the formula (r-iii), n is 1 or more, preferably 2 or more, and is preferably 10 or less, more preferably 5 or less, from the viewpoint of compatibility and dispersibility in a solvent or a binder component. For example, n is preferably 1 to 10, more preferably 1 to 5, and even more preferably 2 to 5.

[0383] The content ratio of the repeating unit represented by the formula (r-iii) in the total repeating units of the polymer dispersant is not particularly limited, but is preferably 1 mol% or more, more preferably 2 mol% or more, even more preferably 4 mol% or more, and is preferably 30 mol% or less, more preferably 20 mol% or less, and even more preferably 10 mol% or less. Within the above range, compatibility with the solvent and binder components and dispersion stability tend to be compatible. For example, the content ratio of the repeating unit represented by the formula (r-iii) in the total repeating units of the polymer dispersant is preferably 1 to 30 mol%, more preferably 2 to 20 mol%, and even more preferably 4 to 10 mol%.

[0384] In addition, from the viewpoint of increasing the compatibility of the dispersant with the solvent and binder components and improving the dispersion stability, it is preferable that the polymer dispersant has a repeating unit represented by the following formula (r-iv) (hereinafter sometimes referred to as "repeating unit (r-iv)").

[0385] [ka]

[0386] (In formula (r-iv), R 38 represents an optionally substituted alkyl group, an optionally substituted aryl group, or an optionally substituted aralkyl group; R 39 is a hydrogen atom or a methyl group.

[0387] R in formula (r-iv) 38 The number of carbon atoms of the alkyl group which may have a substituent in the above is not particularly limited, but is 1 or more, preferably 2 or more, more preferably 4 or more, and is preferably 10 or less, more preferably 8 or less. Specific examples of the alkyl group include, for example, a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group, a heptyl group, and an octyl group. Among these, a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, and a hexyl group are preferred, and a methyl group, an ethyl group, a propyl group, and a butyl group are more preferred. The alkyl group may be either linear or branched. The alkyl group may also include a cyclic structure such as a cyclohexyl group or a cyclohexylmethyl group. For example, the number of carbon atoms of the alkyl group is preferably 1 to 10, more preferably 2 to 8, and even more preferably 4 to 8.

[0388] R in formula (r-iv) 38The number of carbon atoms of the aryl group which may have a substituent in the formula (I) is not particularly limited, but is preferably 6 or more, and is preferably 16 or less, more preferably 12 or less, and even more preferably 8 or less. Specific examples of the aryl group include a phenyl group, a methylphenyl group, an ethylphenyl group, a dimethylphenyl group, a diethylphenyl group, a naphthyl group, and an anthracenyl group, and among these, a phenyl group, a methylphenyl group, an ethylphenyl group, a dimethylphenyl group, and a diethylphenyl group are preferred, and a phenyl group, a methylphenyl group, and an ethylphenyl group are more preferred. For example, the number of carbon atoms of the aryl group is preferably 6 to 16, more preferably 6 to 12, and even more preferably 8 to 12.

[0389] R in formula (r-iv) 38 The number of carbon atoms of the aralkyl group which may have a substituent in the formula (I) is not particularly limited, but is preferably 7 or more, and is preferably 16 or less, more preferably 12 or less, and even more preferably 10 or less. Specific examples of the aralkyl group include a phenylmethyl group (benzyl group), a phenylethyl group (phenethyl group), a phenylpropyl group, a phenylbutyl group, and a phenylisopropyl group, and among these, a phenylmethyl group, a phenylethyl group, a phenylpropyl group, and a phenylbutyl group are preferred, and a phenylmethyl group and a phenylethyl group are more preferred. For example, the number of carbon atoms of the aralkyl group is preferably 7 to 16, more preferably 7 to 12, and even more preferably 7 to 10.

[0390] Among these, R 38 As the alkyl group, an alkyl group or an aralkyl group is preferable, and a methyl group, an ethyl group or a phenylmethyl group is more preferable. R 38 Examples of the substituent that the alkyl group may have in R include a halogen atom and an alkoxy group. 38 In the formula (R), examples of the substituent that the aryl group or aralkyl group may have include a chain alkyl group, a halogen atom, and an alkoxy group. 38The chain alkyl group represented by the formula (I) includes both straight chain and branched chain alkyl groups.

[0391] The content ratio of the repeating unit represented by the formula (r-iv) in all repeating units of the polymer dispersant is preferably 30 mol% or more, more preferably 40 mol% or more, even more preferably 50 mol% or more, and is preferably 80 mol% or less, more preferably 70 mol% or less, from the viewpoint of dispersibility. For example, it is preferably 30 to 80 mol%, more preferably 40 to 80 mol%, even more preferably 50 to 70 mol%.

[0392] The polymer dispersant may have a repeating unit other than the repeating unit (ri), the repeating unit (r-ii), the repeating unit (r-iii) and the repeating unit (r-iv). Examples of such a repeating unit include repeating units derived from styrene-based monomers such as styrene and α-methylstyrene, (meth)acrylate-based monomers such as (meth)acrylic acid chloride, (meth)acrylamide-based monomers such as (meth)acrylamide and N-methylolacrylamide, vinyl acetate, acrylonitrile, allyl glycidyl ether, crotonic acid glycidyl ether, and N-methacryloylmorpholine.

[0393] From the viewpoint of further improving dispersibility, the polymer dispersant is preferably a block copolymer having an A block having a repeating unit (ri) and a repeating unit (r-ii) and a B block having no repeating unit (ri) and no repeating unit (r-ii). The block copolymer is preferably an AB block copolymer or a BAB block copolymer. By introducing not only a quaternary ammonium base but also a tertiary amino group into the A block, unexpectedly, the dispersing ability of the dispersant tends to be significantly improved. In addition, it is preferable that the B block has a repeating unit (r-iii), and more preferably has a repeating unit (r-iv).

[0394] In the A block, the repeating unit (ri) and the repeating unit (r-ii) may be contained in either a random copolymerization or block copolymerization manner. One or more types of the repeating unit (ri) and the repeating unit (r-ii) may be contained in one A block, and in that case, each repeating unit may be contained in the A block in either a random copolymerization or block copolymerization manner.

[0395] Repeating units other than the repeating unit (ri) and the repeating unit (r-ii) may be contained in the A block, and examples of such repeating units include the repeating units derived from the above-mentioned (meth)acrylic acid ester monomers. The content of repeating units other than the repeating unit (ri) and the repeating unit (r-ii) in the A block is preferably 0 to 50 mol%, more preferably 0 to 20 mol%, and particularly preferably 0 mol%.

[0396] Repeating units other than the repeating units (r-iii) and (r-iv) may be contained in the B block, and examples of such repeating units include styrene-based monomers such as styrene and α-methylstyrene, (meth)acrylate-based monomers such as (meth)acrylic acid chloride, (meth)acrylamide-based monomers such as (meth)acrylamide and N-methylolacrylamide, vinyl acetate, acrylonitrile, allyl glycidyl ether, crotonic acid glycidyl ether, and repeating units derived from N-methacryloylmorpholine. The content of repeating units other than the repeating units (r-iii) and (r-iv) in the B block is preferably 0 to 50 mol%, more preferably 0 to 20 mol%, and particularly preferably 0 mol%.

[0397] When the photosensitive resin composition of the present invention contains a dispersant (F), the content ratio is not particularly limited, but is preferably 0.1 mass% or more, more preferably 0.5 mass% or more, and more preferably 8 mass% or less, more preferably 5 mass% or less, even more preferably 3 mass% or less, and particularly preferably 2 mass% or less, based on the total solid content of the photosensitive resin composition. For example, 0.1 to 8 mass% is preferred, more preferably 0.1 to 5 mass%, even more preferably 0.5 to 3 mass%, and particularly preferably 0.5 to 2 mass%. By making it equal to or more than the lower limit, there is a tendency that the generation of residue due to aggregates can be suppressed. By making it equal to or less than the upper limit, there is a tendency that the ink repellency and developability are improved.

[0398] [1-1-7] UV absorbers The photosensitive resin composition of the present invention may contain an ultraviolet absorber. The ultraviolet absorber is added for the purpose of controlling the photocuring distribution by absorbing a specific wavelength of the light source used for exposure by the ultraviolet absorber. The addition of the ultraviolet absorber provides effects such as forming a highly precise partition wall with a narrow line width and eliminating residues remaining in non-exposed areas after development. As the ultraviolet absorber, for example, a compound having an absorption maximum between wavelengths of 250 nm and 400 nm can be used from the viewpoint of inhibiting the light absorption of the (B) photopolymerization initiator. The ultraviolet absorbing agent preferably contains either one or both of a benzotriazole-based compound and a triazine-based compound. It is considered that the inclusion of either one or both of a benzotriazole-based compound and a triazine-based compound reduces the light absorption rate of the initiator at the bottom of the film, and reduces the line width at the bottom of the coating film, thereby forming a highly precise partition wall with a narrow line width.

[0399] Examples of benzotriazole compounds include 2-(5-methyl-2-hydroxyphenyl)benzotriazole, 2-(2-hydroxy-5-t-butylphenyl)-2H-benzotriazole, 3-[3-tert-butyl-5-(5-chloro-2H-benzotriazol-2-yl)-4-hydroxyphenyl]octyl propionate, 3-[3-tert-butyl-5-(5-chloro-2H-benzotriazol-2-yl)-4-hydroxyphenyl]ethylhexyl propionate, 2-[2-hydroxy-3,5-bis(α,α-dimethylbenzyl)phenyl]-2H-benzotriazole, 2-(3-t-butyl-5-methyl-2-hydroxyphenyl)-5 -chlorobenzotriazole, 2-(3,5-di-t-amyl-2-hydroxyphenyl)benzotriazole, 2-(2'-hydroxy-5'-t-octylphenyl)benzotriazole, 2-(2H-benzotriazol-2-yl)-4,6-bis(1-methyl-1-phenylethyl)phenol, 2-(2H-benzotriazol-2-yl)-6-(1-methyl-1-phenylethyl)-4-(1,1,3,3-tetramethylbutyl)phenol, and ester compounds of 3-[3-tert-butyl-5-(5-chloro-2H-benzotriazol-2-yl)-4-hydroxyphenyl]propionic acid with C7-9 linear and branched alkyl alcohols.

[0400] Examples of commercially available benzotriazole compounds include Sumisorb (registered trademark, the same applies below) 200, Sumisorb 250, Sumisorb 300, Sumisorb 340, Sumisorb 350 (manufactured by Sumitomo Chemical Co., Ltd.), JF77, JF78, JF79, JF80, and JF83 (manufactured by Johoku Chemical Co., Ltd.), TINUVIN (registered trademark, the same applies below) PS, TINUVIN 99-2, TINUVIN 109, TINUVIN 384-2, and TINUVIN 326, TINUVIN 900, TINUVIN 928, TINUVIN 1130 (manufactured by BASF), EVERSORB 70, EVERSORB 71, EVERSORB 72, EVERSORB 73, EVERSORB 74, EVERSORB 75, EVERSORB 76, EVERSORB 234, EVERSORB 77, EVERSORB 78, EVERSORB 80, EVERSORB 81 (manufactured by Taiwan Yongkou Chemical Industry Co., Ltd.), Tomisorb (registered trademark, the same applies below) 100, Tomisorb 600 (manufactured by API Corporation), SEESORB (registered trademark, the same applies below) 701, SEESORB 702, SEESORB 703, SEESORB 704, SEESORB 706, SEESORB 707, SEESORB 709 (manufactured by Shipro Chemical Co., Ltd.), RUVA-93 (Otsuka Chemical Co., Ltd.).

[0401] Examples of triazine compounds include 2-[4,6-di(2,4-xylyl)-1,3,5-triazin-2-yl]-5-octyloxyphenol, 2-[4,6-bis(2,4-dimethylphenyl)-1,3,5-triazin-2-yl]-5-[3-(dodecyloxy)-2-hydroxypropoxy]phenol, a reaction product of 2-(2,4-dihydroxyphenyl)-4,6-bis(2,4-dimethylphenyl)-1,3,5-triazine and 2-ethylhexyl glycidyl ether, and 2,4-bis[2-hydroxy-4-butoxyphenyl]-6-(2,4-dibutoxyphenyl)-1,3-5-triazine. Among these, hydroxyphenyltriazine compounds are preferred from the viewpoints of ink repellency and forming high-definition partition walls with narrow line widths. Examples of commercially available triazine compounds include TINUVIN 400, TINUVIN 405, TINUVIN 460, TINUVIN 477, and TINUVIN 479 (manufactured by BASF).

[0402] Other ultraviolet absorbents include, for example, benzophenone compounds, benzoate compounds, cinnamic acid derivatives, naphthalene derivatives, anthracene and its derivatives, dinaphthalene compounds, phenanthroline compounds, and dyes. More specifically, for example, benzophenone compounds such as Sumisorb 130 (manufactured by Sumitomo Chemical), EVERSORB 10, EVERSORB 11, EVERSORB 12 (manufactured by Taiwan Yongko Chemical Industry Co., Ltd.), Tomisorb 800 (manufactured by API Corporation), SEESORB 100, SEESORB 101, SEESORB 101S, SEESORB 102, SEESORB 103, SEESORB 105, SEESORB 106, SEESORB 107, and SEESORB 151 (manufactured by Shipro Chemical Co., Ltd.); benzoate compounds such as Sumisorb 400 (manufactured by Sumitomo Chemical Co., Ltd.) and phenyl salicylate; cinnamic acid derivatives such as 2-ethylhexyl cinnamate, 2-ethylhexyl p-methoxycinnamate, isopropyl methoxycinnamate, and isoamyl methoxycinnamate; α-naphthol, β-naphthol, and the like. Naphthalene derivatives such as 1,2-dihydroxynaphthalene, 1,3-dihydroxynaphthalene, 1,4-dihydroxynaphthalene, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 1,7-dihydroxynaphthalene, 1,8-dihydroxynaphthalene, 2,3-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, and 2,7-dihydroxynaphthalene; anthracene and its derivatives such as anthracene and 9,10-dihydroxyanthracene; dyes such as azo dyes, benzophenone dyes, aminoketone dyes, quinoline dyes, anthraquinone dyes, diphenylcyanoacrylate dyes, triazine dyes, and p-aminobenzoic acid dyes; etc. Among these, from the viewpoint of ink repellency, it is preferable to use cinnamic acid derivatives and naphthalene derivatives, and it is particularly preferable to use cinnamic acid derivatives.

[0403] Among these, from the viewpoint of the tapered shape, either one or both of the benzotriazole-based compounds and the hydroxyphenyltriazine-based compounds are preferred, and the benzotriazole-based compounds are particularly preferred.

[0404] The ultraviolet absorbing agent may be used alone or in combination of two or more kinds.

[0405] When the photosensitive resin composition of the present invention contains an ultraviolet absorber, the content ratio is not particularly limited, but is preferably 0.01 mass% or more, more preferably 0.05 mass% or more, even more preferably 0.1 mass% or more, even more preferably 0.5 mass% or more, particularly preferably 1 mass% or more, and is preferably 15 mass% or less, more preferably 10 mass% or less, even more preferably 5 mass% or less, particularly preferably 3 mass% or less, in the total solid content of the photosensitive resin composition. For example, 0.01 to 15 mass% is preferable, 0.05 to 15 mass% is more preferable, 0.1 to 10 mass% is even more preferable, 0.5 to 5 mass% is even more preferable, and 1 to 3 mass% is particularly preferable. By making it equal to or more than the lower limit, it tends to be possible to form a highly precise partition wall with a narrow line width. By making it equal to or less than the upper limit, the ink repellency tends to be increased.

[0406] When the photosensitive resin composition of the present invention contains an ultraviolet absorber, the blending ratio with respect to the (B) photopolymerization initiator is preferably 1 part by mass or more, more preferably 10 parts by mass or more, even more preferably 30 parts by mass or more, even more preferably 50 parts by mass or more, particularly preferably 80 parts by mass or more, and also preferably 500 parts by mass or less, more preferably 300 parts by mass or less, even more preferably 200 parts by mass or less, particularly preferably 100 parts by mass or less. For example, 1 to 500 parts by mass is preferred, 10 to 500 parts by mass is more preferred, 30 to 300 parts by mass is even more preferred, 50 to 200 parts by mass is even more preferred, and 80 to 100 parts by mass is particularly preferred. By making the blending ratio equal to or more than the lower limit, there is a tendency that a highly precise partition wall with a narrow line width can be formed. By making the blending ratio equal to or less than the upper limit, there is a tendency that the ink repellency is increased.

[0407] [1-1-8] Polymerization inhibitor The photosensitive resin composition of the present invention may contain a polymerization inhibitor. By containing a polymerization inhibitor, it is possible to inhibit radical polymerization, and therefore the taper angle of the resulting partition wall tends to be large. Examples of the polymerization inhibitor include hydroquinone, hydroquinone monomethyl ether, methylhydroquinone, methoxyphenol, and 2,6-di-tert-butyl-4-cresol (BHT). Among these, from the viewpoint of polymerization inhibition ability, hydroquinone, methoxyphenol, and methylhydroquinone are preferred, and methylhydroquinone is more preferred.

[0408] The polymerization inhibitor may be used alone or in combination of two or more kinds. (C) Depending on the method for producing the alkali-soluble resin, the produced alkali-soluble resin may contain a polymerization inhibitor. In that case, the alkali-soluble resin may be used as it is containing the polymerization inhibitor, or a polymerization inhibitor the same as or different from the polymerization inhibitor contained in the resin may be further added during production of the photosensitive resin composition.

[0409] When the photosensitive resin composition contains a polymerization inhibitor, the content ratio is not particularly limited, but is preferably 0.0005% by mass or more, more preferably 0.001% by mass or more, and even more preferably 0.01% by mass or more, and is preferably 0.1% by mass or less, more preferably 0.08% by mass or less, and even more preferably 0.05% by mass or less, in the total solid content of the photosensitive resin composition. For example, 0.0005 to 0.1% by mass is preferred, 0.001 to 0.08% by mass is more preferred, and 0.01 to 0.05% by mass is even more preferred. By making the content equal to or greater than the lower limit, the taper angle tends to be increased. By making the content equal to or less than the upper limit, the ink repellency tends to be increased.

[0410] [1-1-9] Thermal polymerization initiator The photosensitive resin composition of the present invention may contain a thermal polymerization initiator. By containing a thermal polymerization initiator, the degree of crosslinking of the film tends to be increased. Specific examples of such a thermal polymerization initiator include azo compounds, organic peroxides, and hydrogen peroxide. These may be used alone or in combination of two or more.

[0411] When a thermal polymerization initiator is used in combination with a photopolymerization initiator in the hope of improving ink repellency or increasing the crosslinking density of the film, it is preferable that the total content ratio of these is equal to the content ratio of the photopolymerization initiator in the photosensitive resin composition described above. Also, from the viewpoint of ink repellency, the combined ratio of the photopolymerization initiator and the thermal polymerization initiator is preferably 5 to 300 parts by mass of the thermal polymerization initiator per 100 parts by mass of the photopolymerization initiator.

[0412] [1-1-10] Amino compounds The photosensitive resin composition of the present invention may contain an amino compound to promote thermal curing. When the photosensitive resin composition of the present invention contains an amino compound, the content ratio of the amino compound is preferably 40 mass% or less, more preferably 30 mass% or less, and also preferably 0.5 mass% or more, more preferably 1 mass% or more, based on the total solid content of the photosensitive resin composition. For example, 0.5 to 40 mass% is preferable, and 1 to 30 mass% is more preferable. By making it equal to or less than the upper limit, storage stability tends to be maintained. By making it equal to or more than the lower limit, sufficient thermal curing tends to be ensured.

[0413] Examples of the amino compound include an amino compound having a methylol group as a functional group and at least two alkoxymethyl groups obtained by condensing the methylol group with an alcohol having 1 to 8 carbon atoms.Specific examples include a melamine resin obtained by polycondensing melamine with formaldehyde; a benzoguanamine resin obtained by polycondensing benzoguanamine with formaldehyde; a glycoluril resin obtained by polycondensing glycoluril with formaldehyde; a urea resin obtained by polycondensing urea with formaldehyde; a resin obtained by copolycondensing two or more of melamine, benzoguanamine, glycoluril, or urea with formaldehyde; and a modified resin obtained by condensing the methylol group of the above-mentioned resin with alcohol. These may be used alone or in combination of two or more. As the amino compound, melamine resins and modified resins thereof are preferred, modified resins in which the modification ratio of methylol groups is 70% or more are more preferred, and modified resins in which the modification ratio is 80% or more are even more preferred.

[0414] Specific examples of amino compounds, such as melamine resins and modified resins thereof, include "Cymel" (registered trademark, the same applies below) 300, 301, 303, 350, 736, 738, 370, 771, 325, 327, 703, 701, 266, 267, 285, 232, 235, 238, 1141, 272, 254, 202, 1156, and 1158 manufactured by Cytec Corporation, and "Nicalac" (registered trademark, the same applies below) MW-390, MW-100LM, MX-750LM, MW-30M, MX-45, and MX-302 manufactured by Sanwa Chemical Co., Ltd. Benzoguanamine resins and modified resins thereof include, for example, Cymel 1123, 1125, and 1128 manufactured by Cytec Corporation. Examples of glycoluril resins and modified resins thereof include "Cymel" 1170, 1171, 1174, and 1172 manufactured by Cytec Corporation, and "Nicalac" MX-270 manufactured by Sanwa Chemical Co., Ltd. Examples of urea resins and modified resins thereof include "UFR" (registered trademark) 65 and 300 manufactured by Cytec Corporation, and "Nicalac" MX-290 manufactured by Sanwa Chemical Co., Ltd.

[0415] [1-1-11] Silane coupling agents The photosensitive resin composition of the present invention may contain a silane coupling agent in order to improve adhesion to a substrate. As the silane coupling agent, for example, epoxy-based, methacryl-based, amino-based, and imidazole-based silane coupling agents can be used, with epoxy-based and imidazole-based silane coupling agents being particularly preferred from the viewpoint of improving adhesion. When the photosensitive resin composition of the present invention contains a silane coupling agent, the content thereof is preferably 20 mass % or less, and more preferably 15 mass % or less, of the total solid content of the photosensitive resin composition, from the viewpoint of adhesion.

[0416] [1-1-12] Inorganic fillers The photosensitive resin composition of the present invention may contain an inorganic filler for the purposes of improving the strength of the cured product and of improving the perpendicularity and taper angle of the coating film by appropriate interaction with the alkali-soluble resin (formation of a matrix structure). Examples of the inorganic filler include talc, silica, alumina, barium sulfate, magnesium oxide, titanium oxide, and any of these that have been surface-treated with various silane coupling agents.

[0417] The average particle size of the inorganic filler is preferably 0.005 to 2 μm, more preferably 0.01 to 1 μm. The average particle size is a value measured by a laser diffraction scattering particle size distribution measuring device manufactured by Beckman Coulter, Inc., etc. Among the inorganic fillers, silica sol and modified silica sol are particularly preferred because they tend to have excellent dispersion stability and an effect of improving the taper angle. When the photosensitive resin composition of the present invention contains an inorganic filler, the content thereof is preferably 5% by mass or more, more preferably 10% by mass or more, and preferably 80% by mass or less, more preferably 70% by mass or less, based on the total solid content of the photosensitive resin composition from the viewpoint of ink repellency. For example, 5 to 80% by mass is preferred, and 10 to 70% by mass is more preferred.

[0418] [1-1-13] Adhesion improver The photosensitive resin composition of the present invention may contain an adhesion improver for the purpose of imparting adhesion to a substrate. Examples of the adhesion improver include phosphoric acid-based ethylenic monomers. As the phosphoric acid-based ethylenic monomer, (meth)acryloyloxy group-containing phosphates are preferred, and those represented by the following general formulas (g1), (g2) and (g3) are preferred.

[0419] [ka]

[0420] (In the above general formulas (g1), (g2), and (g3), R 51represents a hydrogen atom or a methyl group, l and l' are integers of 1 to 10, and m is 1, 2, or 3.

[0421] These phosphoric acid-based ethylenic monomers may be used alone or in combination of two or more kinds. When the photosensitive resin composition of the present invention contains a phosphoric acid-based ethylenic monomer as an adhesion improver, the content ratio is preferably 0.02 mass% or more, more preferably 0.05 mass% or more, even more preferably 0.1 mass% or more, particularly preferably 0.2 mass% or more, and preferably 4 mass% or less, more preferably 3 mass% or less, even more preferably 2 mass% or less, and particularly preferably 1 mass% or less, based on the total solid content of the photosensitive resin composition. For example, 0.02 to 4 mass% is preferred, 0.05 to 3 mass% is more preferred, 0.1 to 2 mass% is more preferred, and 0.2 to 1 mass% is particularly preferred. By making it equal to or more than the lower limit, the effect of improving adhesion to the substrate tends to be sufficient. By making it equal to or less than the upper limit, the deterioration of adhesion to the substrate tends to be easily suppressed.

[0422] [1-1-14] Solvent The photosensitive resin composition of the present invention usually contains a solvent, and each component contained in the photosensitive resin composition is used in a state of being dissolved or dispersed in the solvent. The solvent is not particularly limited, and examples thereof include the organic solvents described below.

[0423] glycol monoalkyl ethers such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, ethylene glycol monobutyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol mono-n-butyl ether, propylene glycol-t-butyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol mono-n-butyl ether, dipropylene glycol monoethyl ether, dipropylene glycol monomethyl ether, 3-methyl-3-methoxybutanol, 3-methoxy-1-butanol, triethylene glycol monomethyl ether, triethylene glycol monoethyl ether, and tripropylene glycol methyl ether; glycol dialkyl ethers such as ethylene glycol dimethyl ether, ethylene glycol diethyl ether, diethylene glycol dimethyl ether, diethylene glycol ethyl methyl ether, diethylene glycol diethyl ether, diethylene glycol dipropyl ether, diethylene glycol dibutyl ether, and dipropylene glycol dimethyl ether; glycol alkyl ether acetates such as ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, ethylene glycol mono-n-butyl ether acetate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, propylene glycol monopropyl ether acetate, propylene glycol monobutyl ether acetate, 3-methoxy-1-butyl acetate, methoxypentyl acetate, diethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, diethylene glycol mono-n-butyl ether acetate, dipropylene glycol monomethyl ether acetate, triethylene glycol monomethyl ether acetate, triethylene glycol monoethyl ether acetate, and 3-methyl-3-methoxybutyl acetate; Glycol diacetates such as ethylene glycol diacetate, propylene glycol diacetate, 1,3-butylene glycol diacetate, 1,4-butanediol diacetate, and 1,6-hexanol diacetate; Alkyl acetates such as cyclohexanol acetate; Ethers such as amyl ether, diethyl ether, dipropyl ether, diisopropyl ether, dibutyl ether, diamyl ether, ethyl isobutyl ether, and dihexyl ether; Ketones such as acetone, methyl ethyl ketone, methyl isopropyl ketone, methyl amyl ketone, methyl isoamyl ketone, diisopropyl ketone, diisobutyl ketone, methyl isobutyl ketone, cyclohexanone, ethyl amyl ketone, methyl butyl ketone, methyl hexyl ketone, methyl nonyl ketone, and methoxymethyl pentanone; monohydric or polyhydric alcohols such as methanol, ethanol, propanol, butanol, hexanol, cyclohexanol, ethylene glycol, propylene glycol, butanediol, diethylene glycol, dipropylene glycol, triethylene glycol, methoxymethylpentanol, glycerin, and benzyl alcohol; Aliphatic hydrocarbons such as n-pentane, n-octane, diisobutylene, n-hexane, hexene, isoprene, dipentene, and dodecane; Alicyclic hydrocarbons such as cyclohexane, methylcyclohexane, methylcyclohexene, and bicyclohexyl; Aromatic hydrocarbons such as benzene, toluene, xylene, and cumene; Chain or cyclic esters such as amyl formate, ethyl formate, ethyl acetate, propyl acetate, butyl acetate, amyl acetate, methyl isobutyrate, ethyl propionate, propyl propionate, butyl butyrate, isobutyl butyrate, methyl isobutyrate, ethyl caprylate, ethyl benzoate, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, methyl 3-methoxypropionate, ethyl 3-methoxypropionate, propyl 3-methoxypropionate, butyl 3-methoxypropionate, and γ-butyrolactone; Alkoxycarboxylic acids such as 3-methoxypropionic acid, 3-ethoxypropionic acid; Halogenated hydrocarbons such as butyl chloride, amyl chloride; Ether ketones such as methoxymethylpentanone; Nitriles such as acetonitrile, benzonitrile; Tetrahydrofurans such as tetrahydrofuran, dimethyltetrahydrofuran, and dimethoxytetrahydrofuran.

[0424] Commercially available solvents include, for example, mineral spirits, Valsol #2, Apco #18 Solvent, Apco Thinner, Socal Solvent No. 1 and No. 2, Solvesso #150, Shell TS28 Solvent, Carbitol, ethyl carbitol, butyl carbitol, methyl cellosolve, ethyl cellosolve, ethyl cellosolve acetate, methyl cellosolve acetate, and diglyme (all trade names).

[0425] The solvent can dissolve or disperse each component contained in the photosensitive resin composition, and is selected according to the method of using the photosensitive resin composition of the present invention. From the viewpoint of coating property, the boiling point of the solvent under atmospheric pressure is preferably 60 to 280°C, more preferably 70 to 260°C. Among them, propylene glycol monomethyl ether, 3-methoxy-1-butanol, propylene glycol monomethyl ether acetate, and 3-methoxy-1-butyl acetate are preferred.

[0426] The solvent may be used alone or in combination of two or more kinds. The solvent is preferably used so that the content of the total solid content in the photosensitive resin composition solution is preferably 10% by mass or more, more preferably 15% by mass or more, even more preferably 20% by mass or more, particularly preferably 25% by mass or more, and also preferably 90% by mass or less, more preferably 50% by mass or less, even more preferably 40% by mass or less, and particularly preferably 35% by mass or less. For example, it is preferably used so that it is preferably 10 to 90% by mass, more preferably 15 to 50% by mass, even more preferably 20 to 40% by mass, and particularly preferably 25 to 35% by mass. By making it equal to or more than the lower limit, the occurrence of coating unevenness tends to be suppressed. By making it equal to or less than the upper limit, the occurrence of foreign matter, repelling, etc. tends to be suppressed.

[0427] [1-2] Method for preparing photosensitive resin composition The photosensitive resin composition of the present invention is prepared by mixing the components contained in the photosensitive resin composition with a stirrer. For example, when the (E) colorant contains a solvent-free component such as a pigment, it is preferable to previously carry out a dispersion treatment using a paint conditioner, a sand grinder, a ball mill, a roll mill, a stone mill, a jet mill, a homogenizer, etc. The (E) colorant is microparticulated by the dispersion treatment, thereby improving the coating properties of the photosensitive resin composition.

[0428] The dispersion treatment is usually preferably carried out in a system using a combination of (E) a colorant, a solvent, and (F) a dispersant, or in a system using these in combination with a part or all of (C) an alkali-soluble resin (hereinafter, the mixture to be subjected to the dispersion treatment and the composition obtained by the dispersion treatment may be referred to as an "ink" or a "pigment dispersion liquid.") In particular, it is preferable to use a polymer dispersant as the (F) dispersant, since the obtained ink and photosensitive resin composition have excellent dispersion stability and are prevented from thickening over time. In this manner, in the step of producing the photosensitive resin composition, it is preferable to produce a pigment dispersion liquid containing at least the (E) colorant, the solvent, and the (F) dispersant. As the (E) colorant, organic solvent, and (F) dispersant usable in the pigment dispersion, those described as those usable in the photosensitive resin composition can be preferably used. Also, as the content ratio of each of the (E) colorants in the pigment dispersion, those described as the content ratio in the photosensitive resin composition can be preferably used.

[0429] When dispersing the colorant (E) using a sand grinder, glass beads or zirconia beads with a particle size of about 0.1 to 8 mm are preferably used. The temperature of the dispersion treatment is usually in the range of 0°C to 100°C, preferably in the range of room temperature to 80°C. The dispersion time is adjusted appropriately since the appropriate time varies depending on the composition of the liquid and the size of the dispersion treatment device. The guideline for dispersion is to control the gloss of the ink so that the 20 degree specular gloss (JIS Z8741) of the photosensitive resin composition is in the range of 50 to 300.

[0430] The particle size of the pigment dispersed in the ink is usually 0.03 to 0.3 μm, and is measured by a dynamic light scattering method or the like. Next, the ink obtained by the dispersion treatment is mixed with other components contained in the photosensitive resin composition to form a uniform solution or dispersion. Since fine dust may be mixed into the liquid during the production process of the photosensitive resin composition, it is desirable to filter the obtained photosensitive resin composition using a filter or the like.

[0431] [2] Partition wall and method for forming same The photosensitive resin composition of the present invention can be cured to obtain the cured product of the present invention. The photosensitive resin composition of the present invention can be used to form a partition wall, and can be suitably used to form, for example, a partition wall for partitioning an organic layer of an organic electroluminescent device, or a partition wall for partitioning a pixel portion in a color filter containing luminescent nanocrystalline particles. The partition wall of the present invention is composed of the cured product of the present invention. The method for forming the partition wall using the photosensitive resin composition of the present invention is not particularly limited, and a conventionally known method can be adopted. For example, the method for forming the partition wall includes a method including a coating step of coating the photosensitive resin composition on a substrate to form a photosensitive resin composition layer, and an exposure step of exposing the photosensitive resin composition layer to light. Specific examples of the method for forming such partition wall include an inkjet method and a photolithography method.

[0432] In the inkjet method, a photosensitive resin composition whose viscosity has been adjusted by dilution with a solvent or the like is used as an ink, and ink droplets are ejected onto a substrate by the inkjet method along a predetermined partition wall pattern to coat the photosensitive resin composition on the substrate, thereby forming a pattern of uncured partition walls. The pattern of uncured partition walls is then exposed to light to form cured partition walls on the substrate. The exposure of the pattern of uncured partition walls is performed in the same manner as the exposure step in the photolithography method described below, except that no mask is used.

[0433] In the photolithography method, a photosensitive resin composition is applied to the entire surface of a region of a substrate where partition walls are to be formed to form a photosensitive resin composition layer. The formed photosensitive resin composition layer is exposed to light according to a predetermined partition wall pattern, and then the exposed photosensitive resin composition layer is developed to form partition walls on the substrate.

[0434] In the photolithography method, in the coating step of coating a substrate with a photosensitive resin composition, the photosensitive resin composition is coated on a substrate on which partition walls are to be formed using a contact transfer type coater such as a roll coater, a reverse coater or a bar coater, or a non-contact type coater such as a spinner (rotary coater) or a curtain flow coater, and the solvent is removed by drying as necessary to form a photosensitive resin composition layer.

[0435] Next, in the exposure step, the photosensitive resin composition is irradiated with active energy rays such as ultraviolet rays and excimer laser light using a negative mask, and the photosensitive resin composition layer is partially exposed according to the bank pattern. For exposure, a light source that emits ultraviolet rays such as a high pressure mercury lamp, an ultra-high pressure mercury lamp, a xenon lamp, or a carbon arc lamp can be used. The amount of exposure varies depending on the composition of the photosensitive resin composition, but is, for example, 10 to 400 mJ / cm. 2 degree is preferred.

[0436] Next, in the development step, the photosensitive resin composition layer exposed according to the partition wall pattern is developed with a developer to form the partition wall. The development method is not particularly limited, and a dipping method, a spray method, or the like can be used. Specific examples of the developer include organic ones such as dimethylbenzylamine, monoethanolamine, diethanolamine, and triethanolamine, and aqueous solutions of sodium hydroxide, potassium hydroxide, sodium carbonate, ammonia, and quaternary ammonium salts. In addition, a defoamer or a surfactant can be added to the developer.

[0437] Thereafter, the developed partition wall is subjected to post-baking, that is, heat curing treatment, preferably at 80 to 250° C. for 15 to 180 minutes.

[0438] The substrate used for forming the partition wall is not particularly limited, and is appropriately selected according to the type of organic electroluminescent device manufactured using the substrate on which the partition wall is formed. Suitable substrate materials include glass and various resin materials. Specific examples of resin materials include polyesters such as polyethylene terephthalate; polyolefins such as polyethylene and polypropylene; polycarbonate; poly(meth)methacrylic resin; polysulfone; and polyimide. Among these substrate materials, glass and polyimide are preferred because of their excellent heat resistance. In addition, a transparent electrode layer such as ITO or ZnO may be provided in advance on the surface of the substrate on which the partition wall is formed, depending on the type of organic electroluminescent device to be manufactured.

[0439] The thickness of the partition wall of the present invention is preferably 0.1 μm or more, more preferably 1 μm or more, even more preferably 5 μm or more, particularly preferably 10 μm or more, and also preferably 1 mm or less, more preferably 100 μm or less, even more preferably 50 μm or less, still more preferably 30 μm or less, particularly preferably 20 μm or less. By making the thickness equal to or more than the lower limit, the light blocking property tends to be improved. Also, by making the thickness equal to or less than the upper limit, the adhesion tends to be improved. The thickness of the partition wall is measured by a step / surface roughness / microshape measuring device, a scanning white light interference microscope, an ellipsometer, a reflection spectroscopic film thickness meter, or an electron microscope.

[0440] [3] Organic electroluminescent device The organic electroluminescent device of the present invention includes the partition wall of the present invention. Various organic electroluminescent devices are manufactured using a substrate having a partition pattern manufactured by the method described above. Although the method for forming an organic electroluminescent device is not particularly limited, the organic electroluminescent device is preferably manufactured by forming a partition pattern on a substrate by the method described above, and then injecting ink into an area surrounded by the partition on the substrate to form an organic layer such as a pixel. The types of organic electroluminescent devices include bottom emission types and top emission types. In the bottom emission type, for example, a partition wall is formed on a glass substrate on which a transparent electrode is laminated, and a hole transport layer, a light emitting layer, an electron transport layer, and a metal electrode layer are laminated in an opening surrounded by the partition wall, whereas in the top emission type, for example, a partition wall is formed on a glass substrate on which a metal electrode layer is laminated, and an electron transport layer, a light emitting layer, a hole transport layer, and a transparent electrode layer are laminated in an opening surrounded by the partition wall.

[0441] When the partition wall has a trailing shape, the ink for forming the organic layer is repelled by the trailing portion of the partition wall, and the area surrounded by the partition wall may not be sufficiently covered with the ink for forming the organic layer. In contrast, by forming the partition wall in a good shape without trailing, the area surrounded by the partition wall can be sufficiently covered with the ink for forming the organic layer. This can solve the problem of halation in an organic EL display element, for example.

[0442] The solvent used in forming the ink for forming the organic layer may be water, an organic solvent, or a mixture thereof. The organic solvent is not particularly limited as long as it can be removed from the film formed after the ink is injected. Specific examples of the organic solvent include toluene, xylene, anisole, mesitylene, tetralin, cyclohexylbenzene, acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, methanol, ethanol, isopropyl alcohol, ethyl acetate, butyl acetate, and 3-phenoxytoluene. In addition, a surfactant, an antioxidant, a viscosity modifier, an ultraviolet absorber, and the like may be added to the ink.

[0443] The inkjet method is preferred as a method for injecting ink into the region surrounded by the partition wall, since it allows easy injection of a small amount of ink into a predetermined location. The ink used to form the organic layer is appropriately selected depending on the type of organic electroluminescent device to be manufactured. When the ink is injected by the inkjet method, the viscosity of the ink is not particularly limited as long as the ink can be discharged well from the inkjet head, but is preferably 4 to 20 mPa·s, and more preferably 5 to 10 mPa·s. The viscosity of the ink can be adjusted by adjusting the solid content in the ink, changing the solvent, adding a viscosity modifier, or the like.

[0444] The light-emitting layer may be an organic electroluminescent layer as described in JP 2009-146691 A or JP 5734681 B. Quantum dots as described in JP 5653387 A or JP 5653101 B may also be used.

[0445] [4] Color filters containing luminescent nanocrystal particles The color filter containing the luminescent nanocrystalline particles according to the present invention is not particularly limited as long as it has the partition walls of the present invention, and examples thereof include a color filter having pixels formed in regions partitioned by the partition walls.

[0446] Fig. 1 is a schematic cross-sectional view of an example of a color filter including a partition wall of the present invention. As shown in Fig. 1, a color filter 100 includes a substrate 10, a partition wall 20 provided on the substrate, a red pixel 30, a green pixel 40, and a blue pixel 50. The red pixel 30, the green pixel 40, and the blue pixel 50 are arranged in a lattice pattern so as to be repeated in this order. The partition wall 20 is provided between these adjacent pixels. In other words, the adjacent pixels are separated from each other by the partition wall 20.

[0447] Red pixels 30 contain red-emitting nanocrystal particles 2, and green pixels 40 contain green-emitting nanocrystal particles 1. Blue pixels 50 are pixels that transmit blue light from the light source.

[0448] These nanocrystalline particles are nano-sized crystals that absorb excitation light and emit fluorescence or phosphorescence, and are, for example, crystals whose maximum particle size as measured by a transmission electron microscope or a scanning electron microscope is 100 nm or less.

[0449] Luminescent nanocrystal particles are capable of absorbing light of a specific wavelength and emitting light (fluorescence or phosphorescence) of a wavelength different from the absorbed wavelength. For example, red-luminescent nanocrystal particle 2 emits light having a peak emission wavelength in the range of 605 to 665 nm (red light), and green-luminescent nanocrystal particle 1 emits light having a peak emission wavelength in the range of 500 to 560 nm (green light).

[0450] According to the solution of the Schrodinger wave equation of the well-type potential model, the wavelength (emission color) of light emitted by a luminescent nanocrystal particle depends on the size (e.g., particle diameter) of the luminescent nanocrystal particle, but also on the energy gap of the luminescent nanocrystal particle. Therefore, the emission color can be selected by changing the constituent material and size of the luminescent nanocrystal particle used. Examples of the luminescent nanocrystal particle include quantum dots.

[0451] The method for producing a color filter containing luminescent nanocrystal particles is not particularly limited, but includes a method of preparing a substrate having partition walls made of the cured product of the present invention, and forming a layer containing luminescent nanocrystal particles in the area partitioned by the partition walls. The method for forming a layer containing luminescent nanocrystal particles is not particularly limited, but for example, the layer can be produced by a method in which an ink composition containing luminescent nanocrystal particles is selectively applied by an inkjet method, and the ink composition is cured by irradiation with active energy rays or heating.

[0452] [5] Image display device The image display device of the present invention includes the partition wall of the present invention. An example of the image display device of the present invention is an image display device containing the organic electroluminescent element of the present invention. As long as it contains an organic electroluminescent element, there is no particular restriction on the type or structure of the image display device, and it can be assembled in a conventional manner using, for example, an active-drive organic electroluminescent element. For example, the image display device of the present invention can be formed by a method such as that described in "Organic EL Display" (Ohmsha, published on August 20, 2004, by Tokito Shizuo, Adachi Chihaya, and Murata Hideyuki). For example, an organic electroluminescent element that emits white light may be combined with a color filter to display an image, or organic electroluminescent elements with different luminescent colors such as RGB may be combined to display an image.

[0453] Moreover, an example of the image display device of the present invention is an image display device equipped with a color filter including the luminescent nanocrystalline particles of the present invention. The types of image display devices include liquid crystal display devices, image display devices including organic electroluminescent devices, etc. In the case of liquid crystal display devices, there are ones including a light source including a blue LED and a liquid crystal layer including electrodes that control the blue light emitted from the light source for each pixel portion. On the other hand, in an image display device including an organic electroluminescent element, a blue-emitting organic electroluminescent element is arranged at a position corresponding to each pixel portion of the color filter. Specifically, a method described in JP 2019-87746 A can be mentioned. EXAMPLES

[0454] The photosensitive resin composition of the present invention will be described below with reference to specific examples. However, the present invention is not limited to the following examples as long as it does not depart from the gist of the present invention. The components of the photosensitive resin composition used in the following Examples and Comparative Examples are as follows.

[0455] <Alkali-soluble resin-I (alkali-soluble resin (C-1))> "ZCR-8024H" manufactured by Nippon Kayaku Co., Ltd. (weight average molecular weight Mw = 3500, acid value = 57 mgKOH / g). Has a partial structure represented by the following formula (C1).

[0456] [ka]

[0457] <Alkali-soluble resin-II> "ZCR-1642H" manufactured by Nippon Kayaku Co., Ltd. (weight average molecular weight Mw = 6500, acid value = 98 mgKOH / g). Has a partial structure represented by the following formula (C2), but does not have the partial structure represented by the above formula (C1).

[0458] [ka]

[0459] <Alkali-soluble resin-III> An alkali-soluble acrylic copolymer resin, which is made by adding an equal amount of acrylic acid to glycidyl methacrylate in a copolymer resin whose constituent monomers are dicyclopentanyl methacrylate / styrene / glycidyl methacrylate (molar ratio: 0.30 / 0.10 / 0.60), and then adding 0.39 moles of tetrahydrophthalic anhydride to each mole of the copolymer resin. The weight average molecular weight (Mw) measured by GPC in terms of polystyrene is 9000, and the acid value of the solid content is 80 mgKOH / g.

[0460] <Alkali-soluble resin-IV> An alkali-soluble acrylic copolymer resin, which is made by reacting an equal amount of acrylic acid and glycidyl methacrylate with a copolymer resin whose constituent monomers are dicyclopentanyl methacrylate / styrene / glycidyl methacrylate (molar ratio: 0.02 / 0.05 / 0.93), and then adding 0.10 moles of tetrahydrophthalic anhydride to each mole of the copolymer resin. The weight average molecular weight (Mw) measured by GPC in terms of polystyrene is 7700, and the acid value of the solid content is 28.5 mgKOH / g.

[0461] <Dispersant-I> BYK-LPN21116 (Byk-Chemie) (An acrylic AB block copolymer consisting of an A block having a quaternary ammonium base and a tertiary amino group, and a B block having no quaternary ammonium base or a tertiary amino group. The amine value is 70 mg KOH / g. The acid value is 1 mg KOH / g or less.)

[0462] <Solvent-I> PGMEA: Propylene glycol monomethyl ether acetate <Solvent-II> MB: 3-methoxy-1-butanol

[0463] <Photopolymerizable monomer> DPHA: Dipentaerythritol hexaacrylate manufactured by Nippon Kayaku Co., Ltd.

[0464] <Photopolymerization initiator-I> The compound having the following chemical structure was used:

[0465] [ka]

[0466] <Photopolymerization initiator-II> The compound having the following chemical structure was used:

[0467] [ka]

[0468] <Liquid repellent-I> DIC Megafac RS-90 (fluorine-based liquid repellent with ethylenic double bonds) <Surfactant-I> DIC Megafac F-559 (fluorosurfactant without cross-linking groups)

[0469] <Additives-I> Showa Denko Karenz MT PE1 (Pentaerythritol tetrakis (3-mercaptobutyrate) <Additives-II> Nippon Kayaku Co., Ltd. KAYAMER PM-21 (phosphate containing methacryloyl group) <Organic black pigment> BASF Irgaphor Black S 0100 CF

[0470] <Preparation of pigment dispersions 1 to 3> The pigment, dispersant, alkali-soluble resin, and solvent were mixed to obtain the mass ratio shown in Table 1. This solution was dispersed for 3 hours at a temperature range of 25 to 45°C using a paint shaker. Zirconia beads with a diameter of 0.5 mm were used, and 2.5 times the mass of the dispersion liquid was added. After dispersion was completed, the beads and the dispersion liquid were separated using a filter, and pigment dispersion liquids 1 to 3 were prepared.

[0471] [Table 1]

[0472] [Examples 1 to 9 and Comparative Examples 1 to 3] Using the above-prepared pigment dispersions 1 to 3, each component was added so that the solid content ratio of each component in the total solid content of the photosensitive resin composition was the blending ratio shown in Table 2. Further, the content ratio of the total solid content was 31% by mass, and the solvent was added so that Solvent-I / Solvent-II = 80 / 20 (mass ratio) in the total solvent, and stirred and dissolved to prepare photosensitive resin compositions 1 to 10. Using each of the obtained photosensitive resin compositions, evaluation was carried out by the method described below. Note that the blending ratios of the pigment dispersion, alkali-soluble resin, and liquid repellent in Table 2 are values in terms of solid content.

[0473]

Table 2

[0474] The method for performance evaluation will be described below.

[0475] <Measurement of PGMEA Contact Angle> Using a spinner on a glass substrate, the photosensitive resin composition was applied so as to have a thickness of 10 μm after heat curing. This coated substrate was dried in vacuo for 1 minute, and further dried by heating on a hot plate at 100 °C for 120 seconds. The obtained coating film was exposed to light over the entire surface using a high-pressure mercury lamp at 27 mJ / cm 2 At this time, the light intensity at a wavelength of 365 nm was 100 mW / cm 2 Next, this substrate was spray-developed at 24 °C for 70 seconds using an aqueous solution in which 0.04% by mass of KOH and 0.07% by mass of Emulgen A-60 (manufactured by Kao Corporation, surfactant) were dissolved as a developer, and then washed with pure water for 27 seconds. Finally, this substrate was heat-cured in an oven at the temperature shown in Table 2 for 30 minutes to obtain a substrate for contact angle measurement.

[0476] Using a Drop Master 500 (contact angle measuring device) manufactured by Kyowa Interface Science Co., Ltd., the contact angle of the contact angle measurement substrate was measured 1 second after 0.7 μL of PGMEA was dropped under conditions of 23° C. and 50% RH, and the ink repellency was evaluated according to the following criteria. The results are shown in Table 2. A larger contact angle indicates higher ink repellency.

[0477] (Ink repellency evaluation criteria) A: PGMEA contact angle is 40.0° or more B: PGMEA contact angle less than 40.0°

[0478] <Evaluation of minimum contact line width> The photosensitive resin composition was applied to a glass substrate using a spinner so that the thickness would be 10 μm after heat curing. The coated substrate was vacuum dried for 1 minute, and then heated and dried on a hot plate at 100° C. for 120 seconds. Next, the coated substrate was exposed to ultraviolet light using a photomask and a high-pressure mercury lamp, cutting out wavelengths of 330 nm or less. The exposure dose was 50 mJ / cm. 2 The exposure gap was set to 5 μm. The light intensity at a wavelength of 365 nm was 45 mW / cm. 2 The photomask used had linear openings of various widths, 5 to 50 μm (5 to 20 μm: 1 μm intervals, 25 to 50 μm: 5 μm intervals) and 2 mm opening lengths. Next, the substrate was developed under the same conditions as those used for producing the substrate for contact angle measurement, washed with pure water for 10 seconds, and then heated and cured in an oven for 30 minutes at the temperature shown in Table 2 to produce a linear pattern substrate intended for partition walls. The entire line (2 mm) on the line pattern substrate was observed with an optical microscope, and the opening width of the mask with the smallest corresponding width among the lines that were in close contact with the substrate without chipping or peeling was determined as the minimum contact line width, and the following criteria were used to evaluate the results: The smaller the minimum contact line width, the higher the adhesion.

[0479] (Evaluation criteria for minimum contact line width) A: Less than 13 μm B: 13μm or more

[0480] As is clear from a comparison of Examples 1 to 9 and Comparative Examples 1 and 2 in Table 2, by including the alkali-soluble resin (C-1), the PGMEA contact angle was good even at a low exposure dose, and in particular, by increasing the content ratio, the PGMEA contact angle increased. The alkali-soluble resin (C-1) has a benzene ring in the main chain, which tends to increase the hydrophobicity of the film, and in particular, by having two or more crosslinking groups in the side chain, the crosslinking density increases, so that the liquid repellent agent tends to remain on the film surface even after development, which is thought to have resulted in high ink repellency.

[0481] In addition, as is clear from a comparison of Examples 1 to 9 and Comparative Example 1 in Table 2, the inclusion of the alkali-soluble resin (C-1) enabled the minimum contact line width to be reduced. It is believed that the alkali-soluble resin (C-1) has two or more crosslinking groups in its side chain, which increases the crosslink density and suppresses peeling of the lines formed during exposure during development. When a fluorosurfactant without a crosslinking group was used instead of the liquid repellent as in Comparative Example 3, the ink repellency was insufficient. This is believed to be because, since it does not have a crosslinking group, the surfactant was dissolved out of the coating film during development, and the amount of surfactant remaining on the film surface after development decreased. On the other hand, when a liquid repellent having an ethylenic double bond that serves as a crosslinking group was used as in Examples 1 to 9, it is believed that a good PGMEA contact angle was shown even at a low exposure dose because dissolution during development was suppressed. As is clear from Examples 8 and 9 in Table 2, the photosensitive resin composition of the present invention was able to achieve both a good PGMEA contact angle and a small minimum contact line width even after post-baking at 150° C. or less. It is believed that these properties were achieved by using both the liquid repellent agent having a crosslinking group and the alkali-soluble resin (C-1). [Explanation of symbols]

[0482] 1. Green-emitting nanocrystalline particles 2. Red-emitting nanocrystalline particles 10 Substrate 20 Bulkhead 30 red pixels 40 green pixels 50 blue pixels 100 Color Filters

Claims

1. A photosensitive resin composition comprising (A) an ethylenically unsaturated compound, (B) a photopolymerization initiator, (C) an alkali-soluble resin, and (D) a liquid repellent agent, The (C) alkali-soluble resin contains an alkali-soluble resin (C-1) having a partial structure represented by the following general formula (c1): In the general formula (c1), R c12 is a group represented by the following general formula (c1-1): A photosensitive resin composition, wherein the liquid repellent agent (D) contains a fluorine atom-containing resin having a crosslinking group. 【Chemistry 1】 (In formula (c1), R c11 represents a hydrogen atom or a methyl group. R c12 represents a divalent hydrocarbon group which may have a substituent. n represents an integer of 2 or 3. The benzene ring in formula (c1) may be further substituted with any substituent. * represents a bond.) 【Chemistry 2】

2. 2. The photosensitive resin composition according to claim 1, wherein the content of the alkali-soluble resin (C-1) in the alkali-soluble resin (C) is 60 mass% or more.

3. The photosensitive resin composition according to claim 1 or 2, further comprising (E) a colorant.

4. The photosensitive resin composition according to claim 3 , wherein a content of the colorant (E) is 50 mass % or less based on a total solid content of the photosensitive resin composition.

5. 5. The photosensitive resin composition according to claim 3, wherein the colorant (E) contains at least one selected from the group consisting of a red pigment and an orange pigment, and at least one selected from the group consisting of a blue pigment and a purple pigment.

6. The photosensitive resin composition according to any one of claims 3 to 5, wherein the colorant (E) contains a purple pigment.

7. A cured product obtained by curing the photosensitive resin composition according to any one of claims 1 to 6.

8. A partition wall comprising the cured product according to claim 7.

9. An organic electroluminescence device comprising the partition wall according to claim 8 .

10. A color filter comprising luminescent nanocrystalline particles, the color filter comprising the partition wall according to claim 8 .

11. An image display device comprising the partition wall according to claim 8 .

Citation Information

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