Exposure apparatus and method for manufacturing article

Abstract

To provide an exposure apparatus advantageous for reducing haze of an optical element in an optical system.SOLUTION: An exposure apparatus for exposing a substrate includes: an optical system which irradiates with light for exposing the substrate; a blowout part for blowing a first gas in a blowout direction from a blowout opening; and a guide member having a first member including a first end part existing at a blowout direction to the blowout opening, and a second end part existing at an opposite direction of the blowout direction where the guide member guides a gas including the first gas, and a second gas taken in from a second end part side to an optical path space for passing the light from the optical system.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to an exposure apparatus and a method for manufacturing an article. [Background technology]

[0002] One of the devices used in the manufacturing process (lithography process) of liquid crystal panels, semiconductor devices, etc. is an exposure apparatus that projects a pattern image of an original onto a substrate by a projection optical system to expose the substrate. It is known that in an exposure apparatus, a gas (outgassing) is generated from a resist (photosensitive material) applied on a substrate by exposing the resist. This outgassing reacts with impurities such as acids, bases, and organic substances in the surrounding atmosphere or on the surface of the optical elements, causing the optical elements arranged around the substrate to become cloudy. In particular, the optical elements located at the bottom end of the projection optical system are arranged facing the substrate, so that clouding due to outgassing from the resist is likely to occur. When the optical elements become cloudy, the light transmittance of the optical elements decreases, and insufficient exposure, uneven illuminance, or flare may occur. Patent Document 1 proposes a configuration in which gas blown downward from a nozzle provided on the side of the projection optical system is guided along the curved surface of a guide element by the Coanda effect and supplied between the projection optical system and the substrate. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2005-333152 A Summary of the Invention [Problem to be solved by the invention]

[0004] In the configuration described in Patent Document 1, the gas flow direction is changed by the Coanda effect of the guide member, and since the gas has the property of drawing in ambient gas, the gas can flow between the optical elements of the projection optical system and the substrate while drawing in outgassing generated from the resist. Therefore, it may be insufficient to prevent outgassing from reaching the optical elements of the projection optical system (i.e., clouding of the optical elements).

[0005] SUMMARY OF THE PRESENT EMBODIMENTS An object of the present invention is to provide an exposure apparatus that is advantageous for reducing fogging of optical elements in an optical system. [Means for solving the problem]

[0006] In order to achieve the above object, an exposure apparatus as one aspect of the present invention is an exposure apparatus that exposes a substrate, and includes an optical system that irradiates light for exposing the substrate, a blowing section that blows out a first gas in a blowing direction from a blowing port, and a guide member having a first member that includes a first end in the blowing direction and a second end in a direction opposite to the blowing direction relative to the blowing port, and the guide member guides a gas including the first gas and a second gas taken in from the second end side, From the first end side, The present invention is characterized in that it guides the light from the optical system to an optical path space through which the light passes.

[0007] Further objects and other aspects of the present invention will become apparent from the following description of preferred embodiments with reference to the accompanying drawings. Effect of the Invention

[0008] According to the present invention, for example, an exposure apparatus that is advantageous for reducing fogging of optical elements in an optical system can be provided. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 shows the overall configuration of an exposure apparatus. [Diagram 2] FIG. 1 is a diagram illustrating an example of the configuration of a second supply unit according to a first embodiment; [Diagram 3]FIG. 13 is a diagram showing an example of the configuration when a second supply unit in the first embodiment is attached to a projection optical system; [Figure 4] FIG. 13 is a diagram showing an example of the arrangement and shape of the air outlets inside the guide member; [Diagram 5] FIG. 13 is a diagram illustrating a modification of the second supply unit of the first embodiment. [Figure 6] FIG. 13 is a diagram illustrating a modification of the second supply unit of the first embodiment. [Figure 7] FIG. 13 is a diagram illustrating a modification of the second supply unit of the first embodiment. [Figure 8] FIG. 13 is a diagram showing a configuration example of a second supply unit according to a second embodiment; [Figure 9] FIG. 13 is a diagram showing a configuration example of a second supply unit according to a third embodiment; [Figure 10] FIG. 13 is a diagram showing a configuration example of a second supply unit according to a fourth embodiment; [Figure 11] FIG. 13 is a diagram illustrating a configuration example of a second supply unit according to a fifth embodiment; [Figure 12] FIG. 23 is a diagram showing a configuration example of a second supply unit according to the sixth embodiment; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, the embodiments will be described in detail with reference to the attached drawings. Note that the following embodiments do not limit the invention according to the claims. Although the embodiments describe a number of features, not all of these features are essential to the invention, and the features may be combined in any manner. Furthermore, in the attached drawings, the same reference numbers are used for the same or similar configurations, and duplicated descriptions are omitted.

[0011] First Embodiment A first embodiment according to the present invention will be described. FIG. 1 is a diagram showing the overall configuration of an exposure apparatus 100 of this embodiment. The exposure apparatus 100 of this embodiment is a step-and-scan type exposure apparatus that transfers a pattern of the original M onto the substrate by exposing the substrate W while scanning the original M and the substrate W. Such an exposure apparatus 100 is also called a scanning exposure apparatus or a scanner. In this embodiment, the original M is, for example, a quartz mask (reticle), and a circuit pattern to be transferred is formed in each of a plurality of shot areas on the substrate W. In addition, the substrate W is a wafer coated with photoresist, and for example, a single crystal silicon substrate or the like can be used. Note that in this embodiment, a step-and-scan type exposure apparatus will be described as an example, but the present invention can also be applied to a step-and-repeat type exposure apparatus.

[0012] The exposure apparatus 100 may include an illumination optical system 1, an original stage 2 capable of moving while holding an original M, a projection optical system 3, a substrate stage 4 capable of moving while holding a substrate W, and a controller 5. The controller 5 is configured by, for example, a computer having a CPU and a memory, and is electrically connected to each part in the apparatus to centrally control the operation of the entire apparatus. In the following description, the direction parallel to the optical axis of the light emitted from the projection optical system 3 and incident on the substrate W is defined as the Z-axis direction, and two directions perpendicular to each other in a plane perpendicular to the optical axis are defined as the X-axis direction and the Y-axis direction. In the following description, when the term "X-axis direction" is used, it may be defined as including the +X direction and the -X direction. The same applies to the "Y-axis direction" and the "Z-axis direction."

[0013] The illumination optical system 1 shapes light emitted from a light source LS, such as a mercury lamp, an ArF excimer laser, or a KrF excimer laser, into, for example, a strip-shaped or arc-shaped slit light, and illuminates a part of the original M with the slit light. The light that has passed through a part of the original M is incident on the projection optical system 3 as a pattern light reflecting a pattern of the part of the original M. The projection optical system 3 has a predetermined projection magnification, and projects a pattern image of the original M onto a substrate (specifically, a resist on the substrate) using the pattern light. The original M and the substrate W are held by the original stage 2 and the substrate stage 4, respectively, and are disposed at optically conjugate positions (the object plane and the image plane of the projection optical system 3), respectively, via the projection optical system 3. The control unit 5 relatively scans the original stage 2 and the substrate stage 4 in a predetermined scanning direction (for example, the X direction) at a speed ratio according to the projection magnification of the projection optical system 3 while synchronizing with each other. This allows the pattern of the original M to be transferred onto the substrate. In this embodiment, the illumination optical system 1 and the projection optical system 3 are configured to emit light downward (-Z direction, first direction). Therefore, hereinafter, "downward" is used to mean the direction from which light is emitted from the illumination optical system 1 and the projection optical system 3 (-Z direction side, first direction side).

[0014] Moreover, the exposure apparatus 100 includes a first supply unit 7 that supplies a gas 41 (e.g., clean air) from a first gas supply source 31 to the inside (inside the chamber) of the chamber 6 in which the projection optical system 3 is disposed. For example, the first supply unit 7 can be configured as a circulating gas supply mechanism that generates a predetermined airflow inside the chamber 6. In this case, the first gas supply source 31 includes, for example, a fan, a filter, etc., and is configured to send out the gas in the chamber taken in from the intake unit 33 to the first supply unit 7. Then, the first supply unit 7 can generate a predetermined airflow inside the chamber 6 by blowing out the gas 41 sent out (supplied) from the first gas supply source 31 into the chamber. Here, the gas outlet in the first supply unit 7 may be provided, for example, on the inner surface (e.g., a wall portion) of the chamber 6, or may be provided (arranged) inside the chamber 6. Furthermore, first gas supply source 31 may be a component of exposure apparatus 100, but does not have to be a component of exposure apparatus 100 in cases where the exposure apparatus 100 is installed in a facility of a factory, etc. In the configuration example of exposure apparatus 100 shown in FIG. 1, a first supply unit 7 is also provided for illumination optical system 1.

[0015] It is known that in the exposure apparatus 100, a gas (outgas 50) is generated from a resist (photosensitive material) applied on a substrate by exposing the resist. The outgas 50 reacts with impurities such as acids, bases, and organic substances in the surrounding atmosphere or on the surface of the optical elements, causing the optical elements arranged around the substrate W to become cloudy. In particular, the optical elements (e.g., lenses, glass plates, and mirrors) located at the lowest end of the projection optical system 3 are arranged facing the substrate W, and therefore are prone to becoming cloudy due to the outgas 50 from the resist gas. When the optical elements become cloudy, the light transmittance of the optical elements decreases, and insufficient exposure, uneven illuminance, or flare may occur. For this reason, the exposure apparatus 100 of this embodiment includes a second supply unit 8 that supplies a gas 42 to the optical path space S through which the light (pattern light) from the projection optical system 3 passes. A specific configuration of the second supply unit 8 will be described below.

[0016] [Configuration of the second supply section] 2(a)-(b) are diagrams showing an example of the configuration of the second supply unit 8 of this embodiment. In addition to the second supply unit 8, in FIG. 2(a)-(b), a part of the projection optical system 3 around the second supply unit 8, the substrate W, and the substrate stage 4 are shown. The configuration of the exhaust unit 9 is different between FIG. 2(a) and FIG. 2(b), but other configurations (such as the configuration of the second supply unit 8) are the same. The exhaust unit 9 is a mechanism for discharging gas that has passed through the optical path space S to the outside, and can be disposed on the opposite side of the second supply unit 8 with respect to the optical path space S, below the projection optical system 3 (-Z direction side, first direction side), as shown in FIG. 2(a)-(b). The exhaust unit 9 may be configured to take in and discharge gas from an opening 9a provided on the substrate W side, as shown in FIG. 2(a), or may be configured to take in and discharge gas from an opening 9b provided on the second supply unit 8 side, as shown in FIG. 2(b).

[0017] The second supply unit 8 includes a gas blowing unit 10 and a guide member 20 (rectifying member), and is configured (arranged) to supply gas 42 to an optical path space S through which light (pattern light) from the projection optical system 3 passes. Here, the optical path space S may be defined as, for example, the space between an optical element 3a located at the lowest end of the projection optical system 3 and facing the substrate W, and the substrate W held by the substrate stage 4. The optical element 3a may be, for example, a light-transmitting element that transmits light, such as a lens or a glass plate, or a light-reflecting element that reflects light, such as a mirror.

[0018] The gas blowing unit 10 has a blowing port 11 that blows out a gas 43 (e.g., clean air, nitrogen gas) at a flow rate faster than the flow rate of the gas 41 blown out from the first supply unit 7. The gas blowing unit 10 is configured as a pipe that defines a gas flow path, and its upstream side (the end opposite to the blowing port 11) is connected to a utility. For example, as shown in FIG. 1, the gas blowing unit 10 is connected to a second gas supply source 32 different from the first gas supply source 31 for sending out the gas 41 to the first supply unit 7, and is configured to blow out the gas sent out (supplied) from the second gas supply source 32 from the blowing port 11. Here, the second gas supply source 32 may be a component of the exposure apparatus 100, but may not be a component of the exposure apparatus 100 when equipment of a factory in which the exposure apparatus 100 is installed is applied. When the second gas supply source 32 is configured as a component of the exposure apparatus 100, the second gas supply source 32 may include, for example, a fan, a compressor, an evaporator, a high-pressure cylinder, or the like, and may also be provided with a pressure regulator such as a regulator.

[0019] The guide member 20 is a member that guides (rectifies) the gas 43 blown out from the blowing port 11 to the optical path space S. The guide member 20 includes a first plate member 21 (lower plate member) that is extended below (-Z direction side, first direction side) the blowing port 11 so as to follow the blowing direction (-Y direction, second direction) of the gas 43 from the blowing port 11 of the gas blowing unit 10. The first plate member 21 has a first end 21a that is closer to the exposure space S than the blowing port 11 of the gas blowing unit 10, and a second end 21b that is farther from the exposure space S than the blowing port 11. That is, the blowing port 11 of the gas blowing unit 10 is disposed between the first end 21a and the second end 21b of the first plate member 21 in the blowing direction of the gas 43. Here, the first end 21a of the first plate member 21 may be disposed below the projection optical system 3, preferably below a part of the optical element 3a of the projection optical system 3. Meanwhile, the second end 21b of the first plate member 21 may be disposed at a position as far away from the exposure space S as possible, preferably outside the movable range of the substrate W (substrate stage 4). As an example, the second end 21b of the first plate member 21 may be disposed between the blowing port 11 of the gas blowing unit 10 and the gas blowing port of the first supply unit 7. This reduces the entrainment of outgas 50 from the substrate W into the gas 43 blown out from the blowing port 11, and makes it possible to supply cleaner gas to the optical path space S.

[0020] In this embodiment, the guide member 20 is configured to further include, in addition to the first plate member 21, a second plate member 22 (upper plate member) extending above the air outlet 11 so as to face the first plate member 21. That is, the second plate member 22 is extended on the opposite side of the first plate member 21 (the +Z direction side of the air outlet 11) with respect to the air outlet 11 so as to face the first plate member 21. The guide member 20 is configured in a cylindrical shape with parts of the inner surface (lower surface, upper surface) each defined by the first plate member 21 and the second plate member 22. In this case, the cylindrical guide member 20 may be formed with a first opening 20a defined with the first end portion 21a of the first plate member 21 as one side, and a second opening 20b defined with the second end portion 21b of the first plate member 21 as one side on the opposite side to the first opening 20a.

[0021] The gas blowing unit 10 is configured such that a blowing port 11 is disposed between a first opening 20a and a second opening 20b inside a cylindrical guide member 20, and the area of ​​the blowing port 11 is smaller than the cross-sectional area (XZ cross-sectional area) of the guide member 20. As an example, the gas blowing unit 10 may include a first pipe section 12 disposed inside the guide member 20 with the blowing port 11 as one end, and a second pipe section 13 penetrating the guide member 20 (second plate member 22) and communicating with the other end (the end opposite to the blowing port 11) of the first pipe section 12. The second pipe section 13 may be connected to a second gas supply source 32.

[0022] The gas blowing section 10 (first pipe section 12, second pipe section 13) may be attached to the projection optical system 3 as shown in FIG. 3. FIG. 3 is a diagram showing an example of a configuration when the second supply section 8 (gas blowing section 10) of this embodiment is attached to the projection optical system 3. This configuration can be advantageous in terms of reducing space restrictions inside the exposure apparatus 100 and fluctuations in the positional relationship between the gas blowing section 10 and the optical element 3a. Note that an exhaust section 9 as shown in FIGS. 2(a)-(b) may also be provided in the configuration shown in FIG. 3.

[0023] In the second supply unit 8 configured in this manner, the gas 43 is blown out from the blowing port 11 of the gas blowing unit 10 in a direction (-Y direction) toward the first opening 20a of the guide member 20 at a flow rate faster than the flow rate of the gas blown out from the first supply unit 7. As a result, the gas 41 is taken in from the second opening 20b of the guide member 20, and the gas 41 taken in from the second opening 20b can be blown out from the first opening 20a of the guide member 20 together with the gas 43 from the blowing port 11 into the optical path space S. In other words, the gas 42 can be supplied to the optical path space S at a flow rate greater than the flow rate of the gas 43 blown out from the blowing port 11 by the amount of the gas 41 taken in from the second opening 20b of the guide member 20.

[0024] This principle will be described in detail. When the gas 43 is blown out from the blowing port 11 of the gas blowing unit 10 at a flow rate faster than the flow rate of the gas 41 blown out from the first supply unit 7, the gas 41 is drawn into the periphery of the blowing port 11 inside the guide member 20, and as a result, the periphery of the blowing port 11 becomes low pressure (negative pressure). Therefore, the gas 41 is taken in (sucked in) into the guide member 20 in response to the blowing out of the gas 43 from the blowing port 11. Here, since the guide member 20 surrounds the periphery of the blowing port 11, the intake port for the gas 41 is limited to the first opening 20a or the second opening 20b. However, since the flow of the gas 43 blown out from the blowing port 11 is in the -Y direction, the flow of the gas inside the guide member 20 is formed in a direction proceeding from the second opening 20b to the first opening 20a. Therefore, the gas 41 is taken in (sucked in) from the second opening 20b. On the other hand, almost no gas is taken in from the first opening 20a due to the blowing direction of the gas 43 from the blowing port 11. Therefore, the gas 42 can be blown out from the first opening 20a of the guide member 20 into the optical path space S at a flow rate equal to or greater than the flow rate of the gas 43 supplied to the blowing port 11 of the gas blowing unit 10.

[0025] Here, the arrangement direction from the second opening 20b to the first opening 20a in the guide member 20 does not need to match the direction of the gas 41 blown out from the gas outlet of the first supply unit 7. As described above, the direction in which the gas 41 is taken in is determined by the blowing direction of the gas 43 from the outlet 11 and the direction of the guide member 20. However, from the viewpoint of taking in a cleaner gas 41 that does not contain outgas 50, the direction in which the gas 41 is blown out from the first supply unit 7 may be the same as the arrangement direction from the second opening 20b to the first opening 20a. Also, from the viewpoint of not containing outgas 50, the second opening 20b may be located away from the exposure space S, but preferably, the second opening 20b is located near the gas outlet of the first supply unit 7. This allows the clean gas 41 blown out from the gas outlet of the first supply unit 7 to be taken in from the second opening 20b and supplied to the optical path space S from the first opening 20a.

[0026] Next, the position and shape of the blowing port 11 (first pipe section 12) of the gas blowing section 10 will be described. In the second supply section 8 shown in FIG. 2, the blowing port 11 of the gas blowing section 10 is disposed inside the guide member 20 and spaced apart from the first plate member 21, and is provided in the second plate member 22, but is not limited thereto. The blowing port 11 of the gas blowing section 10 may be configured in any position inside the guide member 20 and in any shape, as long as the area of ​​the blowing port 11 is smaller than the cross-sectional area (XZ cross-sectional area) of the guide member 20. For example, the blowing port 11 of the gas blowing section 10 may be provided in the first plate member 21, or may be disposed spaced apart from both the first plate member 21 and the second plate member 22 (for example, may be disposed in the center of the guide member 20).

[0027] FIG. 4 is a view of the second supply unit 8 seen from the -Y direction side, and shows an example of the arrangement and shape of the blowing port 11 of the gas blowing unit 10 inside the guide member 20. The position and shape of the blowing port 11 can be determined according to, for example, the flow velocity distribution of the gas 42 to be supplied to the optical path space S. For example, the blowing port 11 may be rectangular (linear) as shown in FIG. 4(a) or curved (curved) as shown in FIG. 4(b). These configurations are effective when the flow velocity of the gas in the -Y direction supplied from the second supply unit 8 to the optical path space S is changed according to the optical axis direction (Z axis direction) of the light from the projection optical system 3. In the configuration example of FIGS. 4(a)-(b), the blowing port 11 is provided on the upper surface (second plate member 22) of the guide member 20, so that the flow velocity of the gas in the optical path space S can be made faster the closer it is to the optical element 3a of the projection optical system 3 (i.e., slower the closer it is to the substrate W). On the other hand, in the optical path space S, when the difference in the gas flow speed in the -Y direction in the optical axis direction is reduced (uniformized), the air outlets 11 can be arranged / formed as shown in Figures 4(c) to 4(d). In the configuration example of Figures 4(c) to 4(d), the air outlets 11 are provided not only on the upper surface (second plate member 22) of the guide member 20, but also on the side surface (X-axis direction side) and lower surface (first plate member 21) of the guide member 20.

[0028] Here, the configuration of the second supply unit 8 that can efficiently take in the gas 41 from the second opening 20b of the guide member 20 will be described. In the configuration of the second supply unit 8 of the present embodiment as described above, the area of ​​the blowout port 11 is made smaller relative to the cross-sectional area of ​​the guide member 20 so that the blowout flow speed of the gas 43 from the blowout port 11 is increased. The smaller the area of ​​the blowout port 11, the more gas can be efficiently taken in from the second opening 20b of the guide member 20 according to the blowout of the gas 43 from the blowout port 11. This is because the pressure around the blowout port 11 inside the guide member 20 can be made lower. As an example, when the blowout port 11 is configured to have a rectangular shape as shown in FIG. 4(a), the smaller the opening height h1 of the blowout port 11 is relative to the cross-sectional height h2 of the guide member 20, the more gas 41 can be efficiently taken in from the second opening 20b of the guide member 20. It is preferable that the opening height h1 of the air outlet 11 is half or less (more preferably, 1 / 3 or less, 1 / 4 or less) of the cross-sectional height h2 of the guide member 20. In terms of area, it is preferable that the cross-sectional area of ​​the air outlet 11 is 1 / 4 or less (more preferably, 1 / 9 or less, 1 / 16 or less) of the cross-sectional area of ​​the guide member 20.

[0029] As an example, as shown in FIG. 4(a), assume that the blowout port 11 of the gas blowing unit 10 is configured in a rectangular shape and the cross-sectional height h2 of the guide member 20 is 5 mm. In this case, if the ratio of the opening height h1 of the blowout port 11 to the cross-sectional height h2 of the guide member 20 is set to about 1:7, the gas 42 can be blown out from the first opening 20a of the guide member 20 at a flow rate 2.5 times the flow rate of the gas 43 blown out from the blowout port 11. The dimensions (e.g., height) of the guide member 20 and the blowout port 11 can be set arbitrarily. For example, the dimensions of the first opening 20a and the second opening 20b of the guide member 20 can be set arbitrarily according to the distance (several mm to several tens of mm) between the optical element 3a of the projection optical system 3 and the substrate W. For example, in order to efficiently take in the gas 41 from the second opening 20b into the guide member 20, the guide member 20 may be configured so that the opening area of ​​the second opening 20b is larger than that of the first opening 20a, as shown in FIG. 5. In this case, the opening height of the second opening 20b may be larger than the distance between the optical element 3a and the substrate W. As another configuration for efficiently taking in the gas 41, as shown in FIG. 6(a), the guide member 20 may be configured so that the second opening 20b is larger by changing the lengths of the first plate member 21 and the second plate member 22 of the guide member 20. Also, as shown in FIG. 6(b), the second opening 20b may be made trumpet-shaped (i.e., a shape in which the cross-sectional area increases toward the second opening 20b) to efficiently take in the gas 41.

[0030] As another method for increasing the flow rate of the gas 43 from the air outlet 11, the shape of the air outlet 11 or the shape of the pipes (first pipe 12, second pipe 13) of the gas blowing section 10 may be changed as shown in Figs. 7(a) and (b). For example, as shown in Figs. 7(a) and (b), the first pipe 12 and the second pipe 13 may be configured to have a curved shape or to be narrowed toward the air outlet 11. Furthermore, as shown in Fig. 7(b), the outlet portion of the air outlet 11 in the gas blowing section 10 may be configured to have a curved shape so that the gas 43 flows along the second plate 22, thereby increasing the flow rate of the gas 43 from the air outlet 11.

[0031] The distance (Y-axis direction) between the blowing port 11 of the gas blowing unit 10 and the first opening 20a of the guide member 20 is preferably greater than the opening height h2 of the first opening 20a, for example. That is, the blowing port 11 is preferably disposed on the inside (+Y direction side) of the guide member 20 from the first opening 20a by an amount greater than the opening height h2 of the first opening 20a. This can reduce the gas flowing from the first opening 20a into the guide member 20 (i.e., backflow of gas). In addition, the closer the position (Y-axis direction) of the blowing port 11 is to the first opening 20a of the guide member 20, the more uniform the flow velocity distribution is up to the first opening 20a, but in the optical path space S, the flow velocity on the optical element 3a side is faster and the flow velocity on the substrate W side is slower than the optical element 3a side. In this case, the strength of blowing out the outgas 50 changes in the Z direction, and the main outgas 50 is blown off on the substrate W side, and the outgas 50 that has passed through the substrate W side can be blown off at high speed on the optical element 3a side. On the other hand, the farther the position (Y-axis direction) of the blowout port 11 is from the first opening 20a of the guide member 20, the more uniform the flow velocity distribution of the gas 42 blown out from the first opening 20a can be in the optical axis direction. In this case, the effect of blowing out the outgas 50 to the same extent in any region in the Z direction can be obtained. In any case, the outgas can be reduced from reaching the optical element 3a. In addition, in order to prevent the gas 42 from entraining the surrounding gas (to more reliably maintain the above-mentioned two types of flow velocity distribution), it is more preferable to make the positional relationship between the second plate member 22 and the optical element 3a in the flow path of the gas 43 and the gas 42 as flat as possible. The flat structure is a structure in which the second plate member 22 and the optical element 3a form a continuous surface. If a flat structure is not possible, it is preferable to have a concave portion rather than a convex portion.

[0032] [Gas used in the second supply section] Next, the gas used in the second supply unit 8 will be described. The gas 42 supplied from the second supply unit 8 to the optical path space S flows near the optical element 3a, and is therefore preferably a clean gas that does not cloud the optical element 3a. A clean gas means a gas that contains less impurities such as acids, bases, and organic matter than at least the atmosphere at the location where the outgas 50 is generated. More preferably, a gas from which impurities such as acids, bases, and organic matter have been removed from air (called clean air), a gas obtained by drying clean air (called clean dry air), an inert gas such as nitrogen gas, or the like may be used.

[0033] Also, the surrounding gas 41 taken in from the second opening 20b of the guide member 20 may be contaminated by the outgas 50 depending on the location, but if it is away from the source of the outgas 50, it can be treated as a gas cleaner than the outgas 50. Preferably, the surrounding gas 41 in the space in which the substrate stage 4 is disposed is rectified along the direction from the second opening 20b to the first opening 20a of the guide member 20 (-Y direction). In this case, the surrounding gas 41 taken in from the second opening 20b is kept in a cleaner state than the atmosphere at the location where the outgas 50 is generated. In the case of this embodiment, the gas 41 is blown out from the first supply unit 7, so that a gas flow is formed inside the chamber 6 along the direction from the second opening 20b to the first opening 20a of the guide member 20 (-Y direction). Therefore, the gas taken in from the second opening 20b into the guide member 20 is a gas cleaner than the atmosphere at the location where the outgas 50 is generated.

[0034] [Effects of the second supply section] Next, the effect of the second supply unit 8 will be described. In order to prevent fogging of the optical element 3a, it is preferable to supply the gas 42 to the optical path space S through which the light (pattern light) from the projection optical system 3 passes, and to blow out the outgas 50 from the substrate W (resist) from the optical path space S. In order to efficiently blow out the outgas 50 from the optical path space S in this way, it is generally desired to supply the gas to the optical path space S at a high flow rate over a wide area. However, in a conventional gas supply mechanism provided with only the gas blowing unit 10, a gas with a high flow rate is supplied locally at a location where the gas is blown out from the blowing port 11 of the gas blowing unit 10. In this case, the surrounding gas is entrained at the location of the blowing port 11, and the outgas 50 is also entrained. For this reason, when the gas blown out from the blowing port 11 reaches the optical path space S, it may become a gas contaminated by the outgas 50. In addition, the gas entrained in the blowing port 11 may form a flow of the outgas 50 toward the optical element 3a in the optical path space S. For this reason, it may be difficult to effectively blow out the outgas from the optical path space S. Furthermore, increasing the flow rate or range of the gas blown out from the gas blowing part 10 will consume a large amount of gas, which may be disadvantageous in terms of the production costs of semiconductor devices and the like.

[0035] On the other hand, in the second supply unit 8 of this embodiment, in addition to the gas blowing unit 10, a guide member 20 is provided. As a result, the entrainment location caused by the gas blowing unit 10 is limited to the second opening 20b, and the entrainment of the outgas 50 is reduced. That is, the cleanliness of the gas 42 is improved. In addition, the gas 43 blown out from the blowing port 11 of the gas blowing unit 10 is mixed with the gas 41 taken in from the second opening 20b of the guide member 20 and is supplied to the optical path space S from the first opening 20a as the gas 42. That is, the gas 42 can be supplied to the optical path space S at a flow rate greater than the flow rate of the gas 43 blown out from the blowing port 11. In addition, the flow velocity distribution of the gas blown out from the first opening 20a of the guide member 20 is made uniform compared to the flow velocity distribution of the gas in the vicinity of the blowing port 11, so that the distribution of local high flow velocities of the gas in the optical path space S is mitigated. That is, it is possible to reduce local flow velocity distribution in the optical path space S, reduce entrainment of the outgas 50, and widely supply high-velocity gas to the optical path space S. In this way, the second supply unit 8 of the present embodiment can enhance the effect of preventing fogging of the optical element 3a compared to the conventional gas supply mechanism, and furthermore, can reduce the amount of gas consumed, which can be advantageous in terms of production costs of semiconductor devices and the like.

[0036] <Second embodiment> A second embodiment of the present invention will be described. In this embodiment, a modified example of the second supply unit 8 will be described. Note that this embodiment basically follows on from the first embodiment, and unless otherwise specified below, the configuration and processing of the exposure apparatus 100 are similar to those of the first embodiment.

[0037] Fig. 8 is a diagram showing an example of the configuration of the second supply unit 8 of this embodiment. In addition to the second supply unit 8, Fig. 8 shows a part of the projection optical system 3 around the second supply unit 8, the substrate W, and the substrate stage 4. Note that the configuration shown in Fig. 8 may also be provided with an exhaust unit 9 as shown in Figs. 2(a)-(b).

[0038] When the temperature and / or humidity of the gas 43 blown out from the outlet of the gas blowing unit 10 is different from the temperature and / or humidity of the gas 41 blown out from the first supply unit 7, fluctuations may occur in the gas around the optical element 3a. Such fluctuations in the gas may affect the exposure light (pattern light) for exposing the substrate W and the measurement light for measuring the position of the substrate stage 4, making it difficult to form a pattern on the substrate with high accuracy. For this reason, the second supply unit 8 of this embodiment includes an air conditioning unit 14 that adjusts the temperature and / or humidity of the gas 43 blown out from the outlet 11 of the gas blowing unit 10. The air conditioning unit 14 is provided, for example, upstream of the gas blowing unit 10 (outlet 11), adjusts the temperature and / or humidity of the gas supplied from the second gas supply source 32, and sends the adjusted gas to the gas blowing unit 10 (outlet 11).

[0039] 8, the air conditioning unit 14 may include a temperature adjustment unit 14a that adjusts the temperature of the gas 43 blown out from the air outlet 11, and / or a humidity adjustment unit 14b that adjusts the humidity of the gas 43. The temperature adjustment unit 14a adjusts the temperature of the gas 43 blown out from the air outlet 11 using a thermometer 15a that measures the temperature of the gas after the temperature adjustment, and a thermometer 15b that measures the temperature inside the chamber 6 (the temperature of the gas 41 supplied from the first supply unit 7). For example, the temperature adjustment unit 14a may adjust the temperature of the gas 43 blown out from the air outlet 11 so that the difference between the measurement result of the thermometer 15a and the measurement result of the thermometer 15b falls within an allowable range. On the other hand, humidity adjustment unit 14b adjusts the humidity of gas 43 blown out from outlet 11 using hygrometer 16a that measures the humidity of the gas after the humidity adjustment and hygrometer 16b that measures the humidity inside chamber 6 (humidity of gas 41 supplied from first supply unit 7). For example, humidity adjustment unit 14b can adjust the humidity of gas 43 blown out from outlet 11 so that the difference between the measurement result of hygrometer 16a and the measurement result of hygrometer 16b falls within an allowable range.

[0040] As described above, the second supply unit 8 of the present embodiment includes an air conditioning unit 14 (temperature adjustment unit 14a, humidity adjustment unit 14b) that adjusts the temperature and / or humidity of the gas 43 blown out from the outlet 11 of the gas blowing unit 10. This reduces gas fluctuations occurring around the optical element 3a, and improves the accuracy of forming a pattern on a substrate.

[0041] <Third embodiment> A third embodiment of the present invention will be described. In this embodiment, a modified example of the second supply unit 8 will be described. This embodiment basically follows on from the first embodiment, and unless otherwise specified below, the configuration and processing of the exposure apparatus 100 are similar to those of the first embodiment. This embodiment can also follow the configuration of the second embodiment.

[0042] In the second supply unit 8 of the first embodiment, the guide member 20 is configured in a cylindrical shape, but is not limited to this configuration. For example, since the guide member 20 is arranged to control the entrainment of the surrounding gas 41 in the gas 43 blown out from the blowing port 11 of the gas blowing unit 10, it may be configured in a curved shape (curved shape) as long as it surrounds the blowing port 11. In addition, the guide member 20 is not limited to a cylindrical configuration, and may be configured without left and right side walls as shown in FIG. 9, in order to prevent the entrainment of the outgas 50 in the gas 43 blown out from the blowing port 11. FIG. 9 is a view of the second supply unit 8 as viewed from the -Y direction side. The guide member 20 of the second supply unit 8 shown in FIG. 9 has only a first plate member 21 extended below the blowing port 11 so as to follow the blowing direction (-Y direction) of the gas 43 from the blowing port 11. In addition to the first plate member 21, the guide member 20 may further include a second plate member 22 extending above the air outlet 11. In a configuration further including the second plate member 22, it is possible to improve the controllability of entrainment of surrounding gas 41 in gas 43 blown out from the air outlet 11, compared to a configuration including only the first plate member 21.

[0043] <Fourth embodiment> A fourth embodiment of the present invention will be described. In this embodiment, a modified example of the second supply unit 8 will be described. Note that this embodiment basically follows on from the first embodiment, and unless otherwise specified below, the configuration and processing of the exposure apparatus 100 are similar to those of the first embodiment. This embodiment can also follow the configuration of the second embodiment.

[0044] Fig. 10 is a diagram showing an example of the configuration of the second supply unit 8 of this embodiment. In addition to the second supply unit 8, Fig. 10 shows a part of the projection optical system 3 around the second supply unit 8, the substrate W, and the substrate stage 4. Note that the configuration shown in Fig. 10 may also be provided with an exhaust unit 9 as shown in Figs. 2(a)-(b).

[0045] In the second supply unit 8 of this embodiment, as shown in FIG. 10, the gas blowing unit 10 (blowout port 11) is provided on the substrate side of the guide member 20 (i.e., the first plate member 21). In this case, the flow velocity distribution of the gas 42 blown out from the second supply unit 8 tends to have a higher flow velocity on the substrate side. In other words, since the outgas 50 immediately after being generated from the substrate W can be blown out, the outgas 50 can be effectively blown out of the optical path space S so as to prevent the outgas 50 from reaching the optical element 3a. In addition, in the second supply unit 8 of this embodiment, although the flow velocity on the optical element 3a side in the flow velocity distribution of the gas 42 blown out from the second supply unit 8 is slower than that on the substrate side, it is possible to ensure a flow velocity and a flow rate sufficient to blow out the outgas. Therefore, even if the outgas 50 passes through the substrate side where the gas flow velocity is relatively fast, the outgas 50 can be prevented from reaching the optical element 3a.

[0046] <Fifth embodiment> A fifth embodiment of the present invention will be described. In this embodiment, a modified example of the second supply unit 8 will be described. This embodiment basically follows on from the first embodiment, and unless otherwise specified below, the configuration and processing of the exposure apparatus 100 are similar to those of the first embodiment. This embodiment can also follow the configuration of the second embodiment.

[0047] Fig. 11 is a diagram showing an example of the configuration of the second supply unit 8 of this embodiment. In addition to the second supply unit 8, Fig. 11 shows a part of the projection optical system 3 around the second supply unit 8, the substrate W, and the substrate stage 4. Note that the configuration shown in Fig. 11 may also be provided with an exhaust unit 9 as shown in Figs. 2(a)-(b).

[0048] In the second supply unit 8 of this embodiment, the gas blowing unit 10 has a plurality of blowing ports 11. In the example shown in FIG. 11, the gas blowing unit 10 has a first blowing port 11a provided on the optical element 3a side of the guide member 20 (i.e., the second plate member 22) and a second blowing port 11a provided on the substrate W side of the guide member 20 (i.e., the first plate member 21). The supply source of the gas blown out from the first blowing port 11a and the supply source of the gas blown out from the second blowing port 11b may be a common system or may be different systems. In the configuration of the second supply unit 8 of this embodiment, the flow velocity distribution of the gas 42 blown out from the second supply unit 8 tends to be faster on both the optical element 3a side and the substrate W side, and the flow velocity tends to be uniform overall. Therefore, the outgas 50 can be effectively blown out from the optical path space S. Furthermore, since the flow rate can be increased overall in the height direction, even if the outgas 50 generated from the substrate W is widespread and leaks in the left-right direction (X-axis direction) of the second supply unit 8, the outgas 50 can be more effectively prevented from reaching the optical element 3a. Furthermore, although an example in which a plurality of gas blowing units 10 are arranged penetrating the first plate member 21 is shown in Fig. 11, a plurality of gas blowing units 10 may be arranged penetrating the second plate member 22.

[0049] Sixth embodiment A sixth embodiment of the present invention will be described. In this embodiment, a modified example of the second supply unit 8 will be described. Note that this embodiment basically follows on from the first embodiment, and unless otherwise specified below, the configuration and processing of the exposure apparatus 100 are similar to those of the first embodiment. In addition, this embodiment can also follow the configuration of the second embodiment or other embodiments.

[0050] Fig. 12 is a diagram showing an example of the configuration of the second supply unit 8 of this embodiment. In addition to the second supply unit 8, Fig. 12 shows a part of the projection optical system 3 around the second supply unit 8, the substrate W, and the substrate stage 4. Note that the configuration shown in Fig. 12 may also be provided with an exhaust unit 9 as shown in Figs. 2(a)-(b).

[0051] In the second supply unit 8 of this embodiment, the guide member 20 has a shape that is bent halfway. At least one air outlet 11 can be arranged inside the guide member 20. In the configuration shown in FIG. 12, the air outlet 11 is provided on the optical element 3a side of the guide member 20 (i.e., the second plate member 22), but the present invention is not limited thereto, and the air outlet 11 may be provided on the substrate W side of the guide member 20 (i.e., the first plate member 21), or on both sides. The configuration of the second supply unit 8 of this embodiment is advantageous in cases where the second supply unit 8 cannot be arranged due to space restrictions around the projection optical system 3 (optical element 3a).

[0052] Seventh embodiment A seventh embodiment of the present invention will be described. In this embodiment, an example of the arrangement of the second supply unit 8 will be described. Note that this embodiment basically follows on from the first embodiment, and unless otherwise specified below, the configuration and processing of the exposure apparatus 100 are similar to those of the first embodiment. In addition, this embodiment can also follow the configurations of the other embodiments described above.

[0053] In the above embodiment, an example has been described in which the second supply unit 8 is arranged to supply the gas 42 to the optical path space S through which the light (pattern light) from the projection optical system 3 passes. However, the present invention is not limited to this, and the second supply unit 8 may be arranged to supply the gas 42 to the optical path space through which the light (slit light) from the illumination optical system 1 passes. For example, the second supply unit 8 may be arranged to supply the gas 42 to a space between the illumination optical system 1 and the original M (original stage 2) through which the light from the illumination optical system 1 passes. In addition, the second supply unit 8 may be arranged to supply the gas 42 to a space between the original M (original stage 2) and the projection optical system 3 through which the light transmitted through the original M passes. This makes it possible to prevent outgassing from reaching the optical elements of the illumination optical system 1 or the original M and clouding the optical elements or the original M.

[0054] Here, a cause of clouding the optical elements of the illumination optical system 1 will be described. In general, not all parts of the original stage 2 are made of cleaned metal. For example, resin parts, adhesives, grease, and even metal parts have residual cleaning. In this case, outgassing may occur from the resin parts, adhesives, grease, and residual cleaning. When this outgas reaches the optical elements of the illumination optical system 1, it causes the optical elements to cloud. Similarly, when outgassing generated from the parts of the original stage 2 reaches the original M, it causes the original M to cloud. Furthermore, the illumination optical system 1 and / or the projection optical system 3 may use parts that generate outgassing like the original stage 2. In this case, when outgassing reaches the optical elements of the illumination optical system 1 or the original M, it causes the optical elements and the original M to cloud. In these cases, the second supply unit 8 described in the first to fourth embodiments is arranged to supply gas 42 to the optical path space of the light from the illumination optical system 1, so that the outgas can be prevented from reaching the optical elements of the illumination optical system 1 and / or the original M. In other words, clouding of the optical elements of the illumination optical system 1 and / or the original M can be reduced (suppressed).

[0055] <Embodiments of the method for manufacturing an article> The method for manufacturing an article according to an embodiment of the present invention is suitable for manufacturing an article such as a microdevice such as a semiconductor device or an element having a fine structure. The method for manufacturing an article according to this embodiment includes a step of forming a latent image pattern on a photosensitive agent applied to a substrate using the above-mentioned exposure apparatus (a step of exposing the substrate) and a step of developing (processing) the substrate on which the latent image pattern has been formed in this step. Furthermore, this manufacturing method includes other well-known steps (oxidation, film formation, deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, etc.). The method for manufacturing an article according to this embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article compared to conventional methods.

[0056] The invention is not limited to the above-described embodiments, and various modifications and variations are possible without departing from the spirit and scope of the invention. Accordingly, the following claims are appended to apprise the public of the scope of the invention. [Explanation of symbols]

[0057] 1: illumination optical system, 2: original stage, 3: projection optical system, 4: substrate stage, 5: control unit, 6: chamber, 7: first supply unit, 8: second supply unit, 10: gas blowing unit, 11: blowing port, 20: guide member, 21: first plate member, 22: second plate member

Claims

1. An exposure apparatus for exposing a substrate, comprising: an optical system that irradiates light for exposing the substrate; a blowing section that blows out a first gas in a blowing direction from a blowing port; a guide member having a first member including a first end portion in the blowing direction and a second end portion in a direction opposite to the blowing direction with respect to the blowing port; Equipped with An exposure apparatus characterized in that the guiding member guides a gas containing the first gas and a second gas taken in from the second end side from the first end side to an optical path space through which the light from the optical system passes.

2. 2. The exposure apparatus according to claim 1, wherein the second end is disposed at a position farther away from the optical path space than the first end.

3. 3. The exposure apparatus according to claim 1, wherein the first member is disposed on a side of the air outlet in a direction in which the light from the optical system is irradiated.

4. 4. The exposure apparatus according to claim 1, wherein a flow velocity of the first gas blown out from the blowing port is greater than a flow velocity of the second gas taken in from the second end side.

5. a first supply unit that supplies the second gas taken in from the second end side; A second supply unit that supplies the first gas blown out from the blowing port; 5. The exposure apparatus according to claim 1, further comprising:

6. 6. The exposure apparatus according to claim 5, wherein the second supply unit includes a temperature adjustment unit that adjusts a temperature of the first gas blown out from the blowing port.

7. 7. The exposure apparatus according to claim 5, wherein the second supply unit includes a humidity adjustment unit that adjusts the humidity of the first gas blown out from the blowout port.

8. The first supply unit supplies gas from a first gas supply source into a chamber in which the optical system is disposed, 8. The exposure apparatus according to claim 5, wherein the second supply unit supplies gas from a second gas supply source different from the first gas supply source to the optical path space.

9. 9. The exposure apparatus according to claim 1, wherein the first end is closer to the optical path space than the air outlet, and the second end is farther from the optical path space than the air outlet.

10. 10. The exposure apparatus according to claim 1, wherein the first end is disposed on a side of the optical system in a direction in which the light is irradiated.

11. The optical system includes an optical element that transmits or reflects light, The first end is disposed on a side of the optical element in a direction in which the light is irradiated.

11. The exposure apparatus according to claim 1,

12. 12. The exposure apparatus according to claim 1, wherein the air outlet is disposed apart from the first member.

13. the guide member includes a second member disposed on an opposite side of the first member with respect to the air outlet so as to face the first member, 13. The exposure apparatus according to claim 1, wherein the air outlet is provided in the second member.

14. 12. The exposure apparatus according to claim 1, wherein the air outlet is provided in the first member of the guide member.

15. The guide member is configured in a cylindrical shape with a part of an inner surface defined by the first member, 12. The exposure apparatus according to claim 1, wherein an area of ​​the air outlet is smaller than a cross-sectional area of ​​the guide member.

16. The guide member is cylindrical and has a first opening and a second opening disposed on the opposite side of the first opening.

16. The exposure apparatus according to claim 15, wherein the first opening is closer to the optical path space than the air outlet, and the second opening is farther from the optical path space than the air outlet.

17. The blowing section includes a first pipe section that is disposed inside the guide member and has the blowing port at one end; 17. The exposure apparatus according to claim 1, further comprising: a second pipe portion that passes through the guide member and communicates with the other end of the first pipe portion.

18. 18. The exposure apparatus according to claim 17, wherein the blowing section has a plurality of the blowing ports.

19. 19. The exposure apparatus according to claim 1, further comprising an exhaust unit that exhausts gas from the optical path space.

20. the optical system is a projection optical system that projects a pattern image onto the substrate, 20. The exposure apparatus according to claim 1, wherein the optical path space is a space between the projection optical system and the substrate through which light from the projection optical system passes.

21. a substrate stage for holding the substrate, 21. The exposure apparatus of claim 20, wherein the first end is disposed between the projection optical system and the substrate stage.

22. the optical system is an illumination optical system that illuminates an original; 22. An exposure apparatus according to claim 1, wherein the optical path space is at least one of a space between the illumination optical system and the original through which light from the illumination optical system passes, and a space through which the light that has passed through the original passes.

23. an original stage for holding an original used for exposing the substrate; 23. The exposure apparatus according to claim 22, wherein the first end is disposed between the illumination optical system and the original stage.

24. exposing a substrate using an exposure apparatus according to any one of claims 1 to 23; and developing the substrate exposed in the step. A method for manufacturing an article, comprising the steps of: manufacturing an article from the developed substrate.

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