Electronic Components

Abstract

To reduce the warpage of a lid.SOLUTION: An acoustic wave device 100 comprises: a support substrate 10; an acoustic wave element 50 provided above the support substrate 10; a frame body 18 which is provided on the support substrate 10 in a manner surrounding the acoustic wave element 50 in plan view; a lid 30 which is provided on the frame body 18 in a manner sandwiching a gap 22 together with the support substrate 10 so as to seal the acoustic wave element 50 inside the gap 22; a columnar body 26 which is provided between the support substrate 10 and the lid 30 inside the gap 22; and a slender reinforcement part 32 which is provided on a surface on the gap 22 side of the lid 30, and which has a length longer than the width of the columnar body 26.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to electronic components. [Background technology]

[0002] It is known to seal a functional element in a gap (for example, Patent Documents 1 to 3). An electronic component is known in which a lid is provided on a frame that surrounds the functional element, and the functional element is sealed in a gap between the lid and a substrate (for example, Patent Document 4). It is known to provide a columnar body between the substrate and the lid in the gap to prevent the lid from bending even when pressure is applied to the lid (for example, Patent Document 5). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2001-102894 A [Patent Document 2] JP 2006-196799 A [Patent Document 3] JP 2018-160829 A [Patent Document 4] JP 2016-152612 A [Patent Document 5] Patent Publication No. 2021-52359 Summary of the Invention [Problem to be solved by the invention]

[0004] However, even when pillars are provided between the substrate and the lid as described in Patent Document 5, there is still room for improvement in terms of reducing the deflection of the lid.

[0005] The present invention has been made in consideration of the above-mentioned problems, and has an object to reduce the deflection of the lid. [Means for solving the problem]

[0006] The present invention relates to a semiconductor device comprising: a substrate; a functional element provided on the substrate; a frame provided on the substrate and surrounding the functional element in a planar view; a lid provided on the frame with a gap between the substrate and the lid, sealing the functional element within the gap; a pillar-shaped body provided within the gap between the substrate and the lid, supporting the lid relative to the substrate; and a pillar-shaped body provided on a surface of the lid facing the gap, the pillar-shaped body having an elongated shape in a planar view, Longitudinal in plan view The length is longer than the length of the columnar body. and a first column having a height shorter than that of the columnar body. A reinforcement portion; a second reinforcing portion provided on the cavity side surface of the lid so as to intersect with the first reinforcing portion, the second reinforcing portion having an elongated shape in a plan view, the length in a longitudinal direction in a plan view being longer than the length of the columnar body, and the height being shorter than the height of the columnar body; It is an electronic component comprising:

[0007] In the above configuration, No. 1 Reinforcement and at least one of the second reinforcing parts is provided so as to overlap the columnar body in a plan view, and the columnar body is No. 1 Reinforcement and at least one of the second reinforcing parts The lid can be supported via a support member.

[0008] In the above configuration, the lid has a substantially rectangular shape in a plan view, No. 1 Reinforcement and the second reinforcing portion The length in the longitudinal direction of the container may be at least half the length of the lid in the same direction as the longitudinal direction.

[0009] In the above configuration, the frame is annular and has a substantially rectangular shape having four sides, No. 1 The reinforcing portion is provided on the opposite sides of the frame. Two Touching both sides The second reinforcing portion is in contact with both of the other two opposing sides of the frame body. It can be configured as follows.

[0010] In the above configuration, No. 1 Reinforcement and the second reinforcing portion may be configured to pass through the center of the lid in a plan view.

[0011] In the above configuration, No. 1 Reinforcement and the second reinforcing portion The width of the columnar body may be 0.5 to 3 times the length of the columnar body.

[0012] In the above configuration, The columnar body is provided between the substrate and a portion where the first reinforcing portion and the second reinforcing portion intersect. It can be configured as follows.

[0013] In the above configuration, the functional element may be an acoustic wave element.

[0014] In the above configuration, a filter may be formed by the acoustic wave element.

[0015] In the above configuration, a multiplexer may be formed by the filter. Effect of the Invention

[0016] According to the present invention, the deflection of the lid can be reduced. [Brief description of the drawings]

[0017] [Figure 1] FIG. 1A is a plan view of an acoustic wave device in accordance with a first embodiment, and FIG. 1B is a plan view of a lid in the first embodiment. [Diagram 2] 2(a) is a cross-sectional view taken along line AA in FIG. 1(a), and FIG. 2(b) is a cross-sectional view taken along line BB in FIG. 1(a). [Diagram 3] FIG. 3 is a plan view of the acoustic wave device in accordance with the first embodiment. [Figure 4] FIG. 4(a) is a circuit diagram of the filter, and FIG. 4(b) is a block diagram of the diplexer. [Diagram 5] 5(a) to 5(c) are cross-sectional views (part 1) illustrating a method for manufacturing the acoustic wave device in accordance with the first embodiment. [Figure 6] 6(a) and 6(b) are cross-sectional views (part 2) illustrating a method for manufacturing the acoustic wave device in accordance with the first embodiment. [Figure 7] 7A to 7C are cross-sectional views of acoustic wave devices according to first to third modifications of the first embodiment. [Figure 8] 8(a) to 8(c) are cross-sectional views of acoustic wave devices according to Comparative Examples 1 to 3. FIG. [Figure 9] FIG. 9 is a plan view of the model used in the simulation. [Figure 10] 10(a) to 10(g) are cross-sectional views of models A to G taken along line AA in FIG. [Figure 11] 11(a) to 11(c) are plan views of simulated lid models H, I, and J. [Figure 12] 12(a) to 12(h) are plan views showing other examples of the columns and reinforcing portions. [Figure 13] FIG. 13A is a cross-sectional view of an acoustic wave device in accordance with a second embodiment, and FIG. 13B is a cross-sectional view of an acoustic wave element in the second embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0018] Hereinafter, with reference to the drawings, an embodiment of the present invention will be described taking an acoustic wave device as an example of an electronic component. EXAMPLES

[0019] FIG. 1(a) is a plan view of an acoustic wave device 100 according to a first embodiment, and FIG. 1(b) is a plan view of a lid 30 in the first embodiment. FIG. 2(a) is a cross-sectional view taken along line AA in FIG. 1(a), and FIG. 2(b) is a cross-sectional view taken along line BB in FIG. 1(a). FIG. 1(a) mainly shows a support substrate 10, a piezoelectric layer 12, a via wiring 16, a frame body 18, wiring 20, a columnar body 26, a reinforcing portion 32, and an acoustic wave element 50, as seen through the lid 30. FIG. 1(b) shows the reinforcing portion 32, as seen through the lid 30. In FIG. 1(a), the frame body 18, wiring 20, reinforcing portion 32, and acoustic wave element 50 are hatched for clarity. As shown in FIGS. 1(a), 1(b), 2(a) and 2(b), an acoustic wave device 100 according to the first embodiment has a piezoelectric layer 12 bonded to the upper surface of a support substrate .

[0020] The support substrate 10 is, for example, a sapphire substrate, an alumina substrate, a spinel substrate, a quartz substrate, a crystal substrate, a silicon carbide substrate, or a silicon substrate, and has a thickness of 50 μm to 300 μm. The sapphire substrate is a single crystal Al2O3 substrate, the alumina substrate is a polycrystalline Al2O3 substrate, and the spinel substrate is a single crystal or polycrystalline MgAl2O4 substrate. The quartz substrate is an amorphous SiO2 substrate, and the crystal substrate is a single crystal SiO2 substrate. The silicon carbide substrate is a polycrystalline or single crystal SiC substrate, and the silicon substrate is a single crystal or polycrystalline Si substrate. The linear expansion coefficient of the support substrate 10 is smaller than that of the piezoelectric layer 12. This can reduce the frequency temperature dependency of the acoustic wave element 50.

[0021] The piezoelectric layer 12 is, for example, a single crystal lithium tantalate layer or a single crystal lithium niobate layer, and has a thickness of 0.5 μm to 30 μm. The thickness of the piezoelectric layer 12 is, for example, smaller than the wavelength of the main mode acoustic wave (for example, surface acoustic wave) excited by the acoustic wave element 50. An insulating layer such as silicon oxide, aluminum oxide, and / or aluminum nitride may be provided between the support substrate 10 and the piezoelectric layer 12. In this manner, the piezoelectric layer 12 is directly or indirectly bonded to the support substrate 10.

[0022] One or more acoustic wave elements 50 are provided on the upper surface of the piezoelectric layer 12. A terminal 14 is provided on the lower surface of the support substrate 10. The terminal 14 is a foot pad for electrically connecting the acoustic wave element 50 to the outside. A via wiring 16 is provided penetrating the support substrate 10. One end of the via wiring 16 is connected to the terminal 14. The other end of the via wiring 16 is connected to a wiring 20 extending from the upper surface of the piezoelectric layer 12 to the upper surface of the support substrate 10. As a result, the acoustic wave element 50 is electrically connected to the terminal 14 through the wiring 20 and the via wiring 16. The terminal 14, the via wiring 16, and the wiring 20 are metal layers containing, for example, titanium, copper, aluminum, platinum, nickel, and / or gold. The terminal 14, the via wiring 16, and the wiring 20 may be a single metal layer or a laminated metal layer in which multiple layers are laminated.

[0023] The piezoelectric layer 12 is not provided in the peripheral region of the support substrate 10. In a plan view, a frame 18 is provided on the support substrate 10 so as to surround the piezoelectric layer 12 and the acoustic wave element 50. The frame 18 is provided on the support substrate 10 away from the piezoelectric layer 12. The frame 18 is, for example, a metal layer containing copper, kovar, gold, aluminum, and / or tungsten, or a silicon layer, or a resin layer. Kovar is an alloy of iron, nickel, and cobalt. The frame 18 may be a single layer, or may be a laminate of multiple layers. The height of the frame 18 is, for example, about 15 μm to 30 μm, and the width is, for example, about 10 μm to 40 μm.

[0024] The lid 30 is provided on the frame 18 such that a gap 22 is formed between the frame 18 and the support substrate 10. The frame 18 and the lid 30 are joined by a bonding layer such as solder. The acoustic wave element 50 is sealed in the gap 22 by the frame 18 and the lid 30. The lid 30 is made of a metal such as kovar, copper, gold, aluminum, and / or tungsten, or silicon. As described above, kovar is an alloy of iron, nickel, and cobalt. The lid 30 may be a single layer, or may be a laminate of multiple layers. The thickness of the lid 30 is, for example, about 20 μm to 50 μm.

[0025] When the frame body 18 and the lid 30 are made of metal, the frame body 18 may be electrically connected to a ground terminal provided on the lower surface of the support substrate 10 through a via wiring that penetrates the support substrate 10. In this way, a ground potential can be supplied to the frame body 18, thereby providing a shielding effect to the frame body 18 and the lid 30. Furthermore, when the frame body 18 and the lid 30 are made of metal, the acoustic wave element 50 can be sealed in the gap 22 with good airtightness. Note that the frame body 18 and the lid 30 are not electrically connected to the acoustic wave element 50 on the support substrate 10.

[0026] The piezoelectric layer 12 has an opening 24 located near the center of the lid 30 and penetrating from the upper surface to the lower surface. In the opening 24, for example, the upper surface of the support substrate 10 is exposed. In the opening 24, a pillar 26 is located near the center of the lid 30 between the support substrate 10 and the lid 30, and supports the lid 30 relative to the support substrate 10. The pillar 26 is located in the gap 22, is provided away from the piezoelectric layer 12, and is in contact with the upper surface of the support substrate 10, for example. The pillar 26 is, for example, a metal layer containing copper, kovar, gold, aluminum, and / or tungsten, or a silicon layer, or a resin layer. The pillar 26 may be a single layer, or may be a laminate of multiple layers. In the first embodiment, the height of the pillar 26 is lower than the height of the frame 18, for example, about 10 μm to 25 μm, and the width of the pillar 26 is larger than the width of the frame 18, for example, about 30 μm to 60 μm. The number of pillars 26 provided between the support substrate 10 and the lid 30 is not limited to one, and two or more pillars 26 may be provided between the support substrate 10 and the lid 30.

[0027] A reinforcing part 32 having an elongated shape is provided on the lower surface of the lid 30. The reinforcing part 32 is, for example, bonded to the lower surface of the lid 30, or is formed by integral molding with the lid 30. In the first embodiment, the reinforcing part 32 extends linearly in the longitudinal and lateral directions of the lid 30, which is substantially rectangular in plan view, and is provided on a line connecting the centers of the opposing sides of the lid 30, and is in contact with both side surfaces of the opposing sides of the frame body 18, which is substantially rectangular and annular and has four sides. Therefore, the two reinforcing parts 32 pass through the center 34 of the lid 30 in plan view and intersect at the center 34. A columnar body 26 is disposed at the intersection of the two reinforcing parts 32. Therefore, the reinforcing part 32 overlaps with the columnar body 26 in plan view, and the columnar body 26 supports the lid 30 via the reinforcing part 32. The reinforcing part 32 and the columnar body 26 may be bonded by a bonding layer such as solder, or may be in contact without being bonded. The reinforcing portion 32 has a length in the longitudinal direction of its elongated shape, and a width in the lateral direction.

[0028] The reinforcing part 32 is, for example, a metal layer containing copper, kovar, gold, aluminum, and / or tungsten, or a silicon layer, or a resin layer. The reinforcing part 32 may be formed of the same material as the lid 30, or may be formed of a different material. When the lid 30 and the reinforcing part 32 are formed of the same material, they can be manufactured by integral molding. When the lid 30 and the reinforcing part 32 are formed of different materials, appropriate materials can be selected according to the usage situation and / or usage purpose. The height of the reinforcing part 32 is lower than the height of the columnar body 26, for example, about 2 μm to 5 μm. The width of the reinforcing part 32 is, for example, approximately the same as the width of the columnar body 26, for example, 30 μm to 60 μm. The term "approximately the same" as used here means that differences of the order of manufacturing error are allowed.

[0029] FIG. 3 is a plan view of an acoustic wave element 50 in the first embodiment. As shown in FIG. 3, the acoustic wave element 50 is a surface acoustic wave resonator. An IDT (Interdigital Transducer) 51 and a reflector 52 are provided on the upper surface of the piezoelectric layer 12. The IDT 51 has a pair of opposing comb electrodes 53. The comb electrode 53 has a plurality of electrode fingers 54 and a bus bar 55 to which the plurality of electrode fingers 54 are connected. The reflectors 52 are provided on both sides of the IDT 51. The IDT 51 excites a surface acoustic wave in the piezoelectric layer 12. The pitch of the electrode fingers 54 of one of the pair of comb electrodes 53 is approximately the wavelength λ of the acoustic wave. The pitch of one of the comb electrodes 53 is twice the pitch D of the plurality of electrode fingers 54. The IDT 51 and the reflector 52 are formed of a metal film such as aluminum, copper, or molybdenum. A protective film or a temperature compensation film covering the IDT 51 and the reflector 52 may be provided on the upper surface of the piezoelectric layer 12. The comb-shaped electrode 53 may have dummy electrode fingers.

[0030] A filter or a duplexer may be formed by the multiple acoustic wave elements 50 formed on the upper surface of the piezoelectric layer 12. Figure 4(a) is a circuit diagram of a filter, and Figure 4(b) is a block diagram of a diplexer.

[0031] As shown in Fig. 4(a), one or more series resonators S1 to S4 are connected in series between the input terminal Tin and the output terminal Tout. One or more parallel resonators P1 and P2 are connected in parallel between the input terminal Tin and the output terminal Tout. The series resonators S1 to S4 and the parallel resonators P1 and P2 form an acoustic wave element 50. The numbers of the series resonators and parallel resonators can be set as appropriate. Although a ladder-type filter has been described as an example of the filter, the filter may be a multimode filter.

[0032] As shown in FIG. 4(b), a transmission filter 60 is connected between a common terminal Ant and a transmission terminal Tx. A reception filter 62 is connected between the common terminal Ant and a reception terminal Rx. The transmission filter 60 passes a signal in a transmission band among the high-frequency signals input from the transmission terminal Tx to the common terminal Ant as a transmission signal, and suppresses signals of other frequencies. The reception filter 62 passes a signal in a reception band among the high-frequency signals input from the common terminal Ant to the reception terminal Rx as a reception signal, and suppresses signals of other frequencies. Although a duplexer is shown as an example of the multiplexer, a triplexer or a quadplexer may also be used.

[0033] 1 shows a case where two ladder-type filters 64 are formed by a plurality of acoustic wave elements 50. One of the two ladder-type filters 64 is a transmitting filter 60, and the other is a receiving filter 62.

[0034] [Manufacturing method] 5(a) to 6(b) are cross-sectional views showing a method for manufacturing the acoustic wave device 100 according to the first embodiment. As shown in FIG. 5(a), a via hole is formed on the upper surface of the support substrate 10 by irradiating the upper surface with, for example, a laser beam, and a metal layer such as copper is formed in the via hole by, for example, electrolytic plating. Then, the upper surface of the metal layer is planarized by, for example, CMP (Chemical Mechanical Polishing) so that the upper surface of the support substrate 10 is exposed. As a result, a via wiring 16 is formed in the support substrate 10. Next, a piezoelectric substrate is bonded to the upper surface of the support substrate 10 at room temperature by, for example, a surface activation method. The support substrate 10 and the piezoelectric substrate may be directly bonded via an amorphous layer of several nm, or may be indirectly bonded via an insulating layer. Then, the upper surface of the piezoelectric substrate is polished by, for example, CMP. As a result, a piezoelectric layer 12 is formed that is directly or indirectly bonded to the upper surface of the support substrate 10.

[0035] 5(b), a portion of the piezoelectric layer 12 is removed, for example, by etching. As a result, the piezoelectric layer 12 in the peripheral region of the support substrate 10 is removed, and the via wiring 16 is exposed. An opening 24 is also formed in the piezoelectric layer 12. For example, the upper surface of the support substrate 10 is exposed in the opening 24. Next, an acoustic wave element 50 is formed on the upper surface of the piezoelectric layer 12. A wiring 20 is formed that extends from the upper surface of the piezoelectric layer 12 to the via wiring 16 and electrically connects the acoustic wave element 50 and the via wiring 16.

[0036] 5(c), a frame 18 surrounding the acoustic wave element 50 and the piezoelectric layer 12, and columns 26 in the openings 24 formed in the piezoelectric layer 12 are formed on the supporting substrate 10. The frame 18 and the columns 26 are formed by, for example, electrolytic plating.

[0037] 6(a), a lid 30 provided with a reinforcing portion 32 is prepared, and the reinforcing portion 32 is aligned so as to overlap with the columnar body 26, and the lid 30 is joined to the frame body 18 with a bonding layer such as solder. The reinforcing portion 32 and the columnar body 26 may be joined with a bonding layer such as solder, or may be in contact without being joined.

[0038] 6(b), the lower surface of the support substrate 10 is polished by, for example, CMP. This exposes the via wirings 16 from the lower surface of the support substrate 10. Next, terminals 14 connected to the via wirings 16 are formed on the lower surface of the support substrate 10. In this manner, the acoustic wave device 100 in accordance with the first embodiment is manufactured.

[0039] [Variations] 7(a) to 7(c) are cross-sectional views of acoustic wave devices 110 to 130 according to Modifications 1 to 3 of the first embodiment. FIGS. 7(a) to 7(c) are cross-sectional views of a portion corresponding to the BB section in FIG. 1(a). As shown in FIG. 7(a), in the acoustic wave device 110 according to Modification 1, the reinforcing portion 32 is inserted between the lid 30 and the frame 18, and the side surface of the reinforcing portion 32 perpendicular to the extension direction of the reinforcing portion 32 is flush with the side surface of the lid 30 and the outer surface of the frame 18. The side surface of the reinforcing portion 32 may be located between the inner surface and the outer surface of the frame 18, or may be located outside the outer surface of the frame 18. The other configurations are the same as those of the acoustic wave device 100 according to the first embodiment, and therefore will not be described.

[0040] 7(b), in the acoustic wave device 120 of the second modification, the reinforcing portion 32 is not in contact with the frame body 18, and the side surface of the reinforcing portion 32 perpendicular to the extension direction of the reinforcing portion 32 is located closer to the frame body 18 than half the distance between the columnar body 26 and the frame body 18. Therefore, the length between the opposing sides of the lid 30 of the reinforcing portion 32 is at least half the distance between the opposing sides. The rest of the configuration is the same as that of the acoustic wave device 100 of the first embodiment, and therefore a description thereof will be omitted.

[0041] 7(c), in an acoustic wave device 130 of the third modification, a side surface of the reinforcing portion 32 perpendicular to the extension direction of the reinforcing portion 32 is located closer to the columnar body 26 than half the distance between the columnar body 26 and the frame body 18. The other configurations are the same as those of the acoustic wave device 100 of the first embodiment, and therefore a description thereof will be omitted.

[0042] [Comparative Example] 8(a) to 8(c) are cross-sectional views of acoustic wave devices 500 to 520 according to Comparative Examples 1 to 3. FIGS. 8(a) to 8(c) are cross-sectional views of a portion corresponding to the portion between BB in FIG. 1(a). As shown in FIG. 8(a), in the acoustic wave device 500 according to Comparative Example 1, the lid 30 is not provided with a reinforcing portion 32, and the pillar-shaped body 26 is not provided between the support substrate 10 and the lid 30 within the gap 22. The other configurations are the same as those of the acoustic wave device 100 according to Example 1, and therefore will not be described.

[0043] 8(b), in the acoustic wave device 510 of Comparative Example 2, no pillars 26 are provided between the support substrate 10 and the lid 30 in the gap 22. The reinforcing portion 32 provided on the lid 30 is inserted between the lid 30 and the frame 18, similar to the acoustic wave device 110 of Modification 1. The other configurations are the same as those of the acoustic wave device 100 of Example 1, and therefore will not be described.

[0044] 8(c), in an acoustic wave device 520 of Comparative Example 3, the lid 30 is not provided with a reinforcing portion 32. The pillars 26 are approximately the same height as the frame 18 and are provided between the support substrate 10 and the lid 30 in the gap 22. The other configurations are the same as those of the acoustic wave device of Example 1, and therefore will not be described.

[0045] [Simulation 1] The deformation amount of the lid 30 when a uniform external force is applied to the upper surface of the lid 30 was simulated. FIG. 9 is a plan view of a model used in the simulation. FIGS. 10(a) to 10(g) are cross-sectional views of models A to G taken along the line AA in FIG. 9. Note that FIG. 9 illustrates model A in FIG. 10(a) as an example, but models B to G in FIGS. 10(b) to 10(g) are the same except for the presence or absence and shape of the reinforcing portion 32 and the presence or absence of the columnar body 26. The normal direction of the lid 30 is the Z direction, and the side directions of the lid 30 are the X direction and the Y direction.

[0046] As shown in FIG. 9, the simulation was performed using a 1 / 4 symmetrical model of the lid 30. That is, the frame 18 is not provided on the +X side surface and the -Y side surface of the lid 30, and the boundary conditions of these surfaces were mirror surface conditions. The lengths of the lid 30 in the X direction and the Y direction are D1 and D2. The width of the frame 18 is D3. The length of the columnar body 26 and the width of the reinforcing part 32 are D4. As shown in FIG. 10(a) to FIG. 10(g), the thickness of the lid 30 is T1, and the thickness of the reinforcing part 32 is T2. In the models A, C, D, E, and G in FIG. 10(a), FIG. 10(c), FIG. 10(d), FIG. 10(e), and FIG. 10(g), the thickness of the frame 18 is T3. In the models B and F in FIG. 10(b) and FIG. 10(f), the thickness of the frame 18 is T3'. In models A, B, C, and D of Figures 10(a), 10(b), 10(c), and 10(d), the thickness of columnar body 26 is T4. In model G of Figure 10(g), the thickness of columnar body 26 is T4'. In model C of Figure 10(c), the distance between reinforcing portion 32 and frame body 18 is W1. In model D of Figure 10(d), the distance between reinforcing portion 32 and frame body 18 is W2.

[0047] Model A in Fig. 10(a) corresponds to Example 1, model B in Fig. 10(b) corresponds to Modification 1 of Example 1, model C in Fig. 10(c) corresponds to Modification 2 of Example 1, and model D in Fig. 10(d) corresponds to Modification 3 of Example 1. Model E in Fig. 10(e) corresponds to Comparative Example 1, model F in Fig. 10(f) corresponds to Comparative Example 2, and model G in Fig. 10(g) corresponds to Comparative Example 3.

[0048] The simulation conditions are as follows. Lid 30: Kovar Frame 18: Copper (Cu) Column 26: Copper (Cu) Reinforcement part 32: Kovar D1: 442 μm D2: 542 μm D3: 23μm D4: 23μm T1: 30μm T2: 4μm T3: 20.5 μm T3´: 16.5μm T4: 16.5 μm T4´:20.5μm W1: 5μm W2: 390μm

[0049] Table 1 shows the Young's modulus, Poisson's ratio, bulk modulus, and shear modulus of the materials used in the simulation. [Table 1]

[0050] As for the amount of deformation of the lid 30, the undersides of the frame body 18 and the columnar body 26 were fixed to immovable objects, and in this state, the maximum displacement of the underside of the lid 30 when a force of 6 MPa was applied uniformly to the entire upper surface of the lid 30 was simulated.

[0051] Table 2 shows the simulation results. As shown in Table 2, in model G corresponding to comparative example 3, the maximum displacement of the lid 30 was significantly reduced compared to model E corresponding to comparative example 1 due to the provision of the pillars 26. However, in models A to D corresponding to example 1 to modified example 3 of example 1 in which the reinforcing portion 32 was provided in addition to the pillars 26, the maximum displacement of the lid 30 was further reduced compared to model G. Note that in model F corresponding to comparative example 2 in which only the reinforcing portion 32 was provided without the pillars 26, the maximum displacement of the lid 30 was hardly reduced. From this, it can be seen that the maximum displacement of the lid 30 can be reduced by providing both the pillars 26 and the reinforcing portion 32. [Table 2]

[0052] [Simulation 2] 11(a) to 11(c) are plan views of simulated models H, I, and J of the lid 30. Although Fig. 11(a) to 11(c) show plan views of the entire lid 30, the simulation was performed using a 1 / 4 symmetrical model of the lid 30, as in simulation 1 in Fig. 9.

[0053] 11(a), model H is a model corresponding to a modified example of Example 1 in which three reinforcing parts 32 are provided. One of the three reinforcing parts 32 extends between opposing sides in the longitudinal direction of the lid 30, positioned on a line connecting the bisecting points of each side, and is provided so as to overlap with the columnar body 26. The remaining two of the three reinforcing parts 32 extend between opposing sides in the lateral direction of the lid 30, positioned on a line connecting the trisecting points of each side.

[0054] 11(b), model I is a model corresponding to a modified example of Example 1 in which four reinforcing parts 32 are provided. Two of the four reinforcing parts 32 extend between opposing sides in the longitudinal direction of the lid 30, positioned on a line connecting a third dividing point of each side. The remaining two of the four reinforcing parts 32 extend between opposing sides in the lateral direction of the lid 30, positioned on a line connecting a third dividing point of each side. All four reinforcing parts 32 are provided without overlapping with the columnar bodies 26.

[0055] As shown in FIG. 11(c), model J is a model corresponding to comparative example 3 in which the reinforcing portion 32 is not provided.

[0056] The simulation conditions were the same as those of Simulation 1 above, except that the length of the pillars 26 and the width D4 of the reinforcing portion 32 were 12.5 μm. The Young's modulus, Poisson's ratio, bulk modulus, and shear modulus of elasticity of the materials used in the simulation were the values ​​shown in Table 1. As with Simulation 1 above, the deformation amount of the lid 30 was simulated by assuming that the lower surfaces of the frame 18 and the pillars 26 were fixed to immovable fixed objects, and a force of 6 MPa was applied uniformly to the entire upper surface of the lid 30 in this state.

[0057] The simulation results are shown in Table 3. As shown in Table 3, in models H and I provided with reinforcing parts 32 and columns 26, the maximum displacement of the lid 30 was reduced compared to model J provided with columns 26 alone, both in the case where the columns 26 supported the lid 30 via the reinforcing parts 32 (model H) and in the case where the columns 26 supported the lid 30 without the reinforcing parts 32 (model I). From the viewpoint of reducing the maximum displacement of the lid 30, the results showed that it was preferable for the reinforcing parts 32 to be provided overlapping the columns 26, and for the columns 26 to support the lid 30 via the reinforcing parts 32. [Table 3]

[0058] According to the first embodiment and its modified example, pillars 26 that support the lid 30 relative to the support substrate 10 are provided between the support substrate 10 and the lid 30 in the cavity 22. Reinforcing parts 32 that are elongated in a plan view and have a length longer than that of the pillars 26 are provided on the surface of the lid 30 facing the cavity 22. This makes it possible to reduce the deflection of the lid 30 even when an external force is applied to the lid 30, as shown in the results of the above simulations 1 and 2.

[0059] Increasing the overall thickness of the lid 30 in an attempt to reduce the bending of the lid 30 may reduce the distance between the lid 30 and the acoustic wave element 50, which may result in electrical coupling and degradation of the characteristics. However, in the first embodiment and its modified example, the lid 30 is simply provided with the elongated reinforcing portion 32, which prevents the distance between the lid 30 and the reinforcing portion 32 and the acoustic wave element 50 from being reduced, thereby preventing degradation of the characteristics.

[0060] It is preferable that the reinforcing parts 32 overlap with the columns 26 in a plan view, and the columns 26 support the lid 30 via the reinforcing parts 32. This makes it possible to effectively reduce the deflection of the lid 30, as shown in the results of Simulation 2 above.

[0061] The reinforcing portion 32 is preferably an elongated shape in which the length between opposing sides of the lid 30, which is substantially rectangular in plan view, is at least half the distance between the opposing sides. In other words, the length of the longitudinal direction of the reinforcing portion 32 is preferably at least half the length of the lid 30 in the same direction as the longitudinal direction. This makes it possible to effectively reduce the deflection of the lid 30, as shown in the results of Simulation 1 above. In terms of reducing the deflection of the lid 30, the length of the longitudinal direction of the reinforcing portion 32 is preferably at least 2 / 3 the length of the lid 30 in the same direction as the longitudinal direction, and more preferably at least 3 / 4.

[0062] In addition, in order to reduce the deflection of the lid 30, it is preferable that the reinforcing portion 32 contacts both opposing sides of the frame body 18, which is approximately rectangular and annular, and it may also be inserted between the frame body 18 and the lid 30.

[0063] It is preferable that the reinforcing portion 32 is provided through the center of the lid 30 in a plan view, which can effectively reduce the deflection of the lid 30. Here, the center of the lid 30 corresponds to the center of gravity when the lid 30 is observed in a plan view.

[0064] From the viewpoint of reducing the deflection of the lid 30, the width of the reinforcement portion 32 is preferably 0.5 times or more, more preferably 1 time or more, and even more preferably 1.5 times or more, the length of the columnar body 26. The width of the reinforcement portion 32 is preferably 1 / 30 or more, more preferably 1 / 20 or more, and even more preferably 1 / 15 or more of the narrower distance between the two pairs of opposing sides of the lid 30. On the other hand, as the width of the reinforcement portion 32 increases, the distance between the reinforcement portion 32 and the acoustic wave element 50 tends to become closer, so the width of the reinforcement portion 32 is preferably 3 times or less, more preferably 2.5 times or less, and even more preferably 2 times or less, the length of the columnar body 26. The width of the reinforcement portion 32 is preferably 1 / 6 or less, more preferably 1 / 8 or less, and even more preferably 1 / 10 or less, the narrower distance between the two pairs of opposing sides of the lid 30. It is preferable that the width of the reinforcement portion 32 is approximately the same as the length of the columnar body 26. "Approximately the same" means that a difference of the order of manufacturing error is allowed. The length of the pillar 26 refers to the length in the longitudinal direction when the pillar 26 has a lateral direction and a longitudinal direction in a plan view.

[0065] In order to prevent the distance between the reinforcing portion 32 and the acoustic wave element 50 from becoming too close, the height of the reinforcing portion 32 is preferably ½ or less, more preferably ⅓ or less, and even more preferably ¼ or less, of the distance between the lid 30 and the piezoelectric layer 12. In order to reduce the deflection of the lid 30, the height of the reinforcing portion 32 is preferably 1 / 10 or more, more preferably ⅛ or more, and even more preferably ⅕ or more, of the distance between the lid 30 and the piezoelectric layer 12.

[0066] The lid 30, the columns 26, and the reinforcing portion 32 are preferably formed mainly of metal or silicon, which can prevent the lid 30 from bending. Being mainly composed of metal or silicon means that the ratio of the metal or silicon to the total of the elements contained in the lid 30, the columns 26, and the reinforcing portion 32 is 50 at% (atomic %) or more, and may be 80 at% or more.

[0067] In the first embodiment, the pillars 26 are provided at the center 34 of the lid 30, and the reinforcing parts 32 are provided between the central parts of the opposing sides of the lid 30, extending linearly in the longitudinal and lateral directions of the lid 30, but this is not limited to the above case. Figs. 12(a) to 12(h) are plan views showing other examples of the pillars 26 and the reinforcing parts 32. As shown in Fig. 12(a), the reinforcing parts 32 may be provided extending only in the longitudinal direction of the lid 30. As shown in Fig. 12(b), the reinforcing parts 32 may be provided such that one part extends in the longitudinal direction of the lid 30 and two parts extend in the lateral direction, as in model H of the above simulation 2. As shown in Fig. 12(c), the reinforcing parts 32 may be provided such that two parts extend in each of the longitudinal and lateral directions of the lid 30, as in model I of the above simulation 2.

[0068] As shown in FIG. 12(d), the reinforcing portion 32 may be provided extending only in the longitudinal direction of the lid 30, and two pillars 26 may be provided point-symmetrically with respect to the center 34 of the lid 30 on a line connecting the centers of the opposing sides in the longitudinal direction of the lid 30. Even if two pillars 26 are provided point-symmetrically with respect to the center 34 of the lid 30, as shown in FIG. 12(e), the reinforcing portion 32 may be provided extending one each in the longitudinal direction and the lateral direction of the lid 30. As shown in FIG. 12(f), the reinforcing portion 32 may be provided extending one each in the longitudinal direction and the lateral direction of the lid 30. As shown in FIG. 12(g), the reinforcing portion 32 may be provided extending two each in the longitudinal direction and the lateral direction of the lid 30. Moreover, as shown in FIG. 12(h), the reinforcing portion 32 may be provided extending on a diagonal line of the lid 30. The reinforcing portion 32 may be interrupted midway in the extending direction.

[0069] The pillars 26 are preferably located on a line connecting the centers of the opposing sides in the longitudinal direction of the lid 30, on a line connecting the centers of the opposing sides in the lateral direction, or on a diagonal line. When only one pillar 26 is provided, it is preferably provided at the center 34 of the lid 30, and when multiple pillars 26 are provided, it is preferably provided substantially point-symmetrically with respect to the center 34 of the lid 30. The reinforcing portion 32 is preferably provided linearly through the center 34 of the lid 30 in a plan view and / or substantially point-symmetrically with respect to the center 34 of the lid 30. The reinforcing portion 32 is not limited to being provided linearly, and may be provided in a curved line. The term "substantially point-symmetrical" does not necessarily mean a perfect point-symmetrical position, but allows a deviation from the point-symmetrical position to an extent that the deflection of the lid 30 can be effectively reduced.

[0070] In the first embodiment, the piezoelectric layer 12 is provided on the support substrate 10, but the piezoelectric layer 12 may be a thick piezoelectric substrate without the support substrate 10. EXAMPLES

[0071] FIG. 13(a) is a cross-sectional view of an acoustic wave device 200 according to a second embodiment, and FIG. 13(b) is a cross-sectional view of an acoustic wave element 50a in the second embodiment. As shown in FIG. 13(a) and FIG. 13(b), in the acoustic wave device 200 of the second embodiment, an acoustic wave element 50a is provided on a support substrate 10 instead of the acoustic wave element 50. The acoustic wave element 50a is a piezoelectric thin film resonator. The acoustic wave element 50a includes a piezoelectric layer 72 provided on the support substrate 10, and a lower electrode 70 and an upper electrode 74 sandwiching the piezoelectric layer 72. A gap 76 is formed between the lower electrode 70 and the support substrate 10. A region where the lower electrode 70 and the upper electrode 74 face each other with at least a part of the piezoelectric layer 72 sandwiched therebetween is a resonance region 78. In the resonance region 78, the lower electrode 70 and the upper electrode 74 excite an acoustic wave in a thickness longitudinal vibration mode in the piezoelectric layer 72. An insertion film may be inserted in the outer peripheral region of the resonance region 78 of the piezoelectric layer 72 for increasing the Q value or for temperature compensation.

[0072] The lower electrode 70 and the upper electrode 74 are, for example, metal films including a ruthenium film. The piezoelectric layer 72 is, for example, an aluminum nitride layer or a zinc oxide layer. An acoustic reflection film that reflects elastic waves may be provided instead of the gap 76. The acoustic wave element 50a is manufactured by a commonly known method.

[0073] As in the first embodiment, the functional element provided on the support substrate 10 may be an acoustic wave element 50 including a comb-shaped electrode 53 provided on a piezoelectric layer 12 which is a single crystal lithium tantalate layer or a single crystal lithium niobate layer. As in the second embodiment, the functional element may be an acoustic wave element 50a which is a piezoelectric thin film resonator in which a lower electrode 70 and an upper electrode 74 are provided with a piezoelectric layer 72 sandwiched therebetween. The functional element may be something other than an acoustic wave element, such as a piezoelectric element such as a MEMS (Micro Electro Mechanical System) element, or something else.

[0074] Although the embodiment of the present invention has been described in detail above, the present invention is not limited to such specific embodiment, and various modifications and variations are possible within the scope of the gist of the present invention described in the claims. [Explanation of symbols]

[0075] 10 Support substrate 12 Piezoelectric layer 14 Terminals 16 Via wiring 18 Frame 20 Wiring 22 void 24 Aperture 26 columnar body 30 Lid 32 Reinforcement 34 center 50, 50a Elastic wave resonator 51 IDT 52 Reflector 53 Comb-shaped electrode 54 Electrode finger 55 Busbar 60 Transmission Filter 62 Receiving Filter 64 Ladder Filter 70 Lower electrode 72 Piezoelectric layer 74 Upper electrode 76 void 78 Resonance region 100, 110, 120, 130, 200, 500, 510, 520 Acoustic Wave Devices

Claims

1. A substrate; A functional element provided on the substrate; a frame provided on the substrate so as to surround the functional element in a plan view; a lid that is provided on the frame with a gap between the substrate and the lid and seals the functional element in the gap; a pillar-shaped member provided in the gap between the substrate and the lid, the pillar-shaped member supporting the lid relative to the substrate; a first reinforcing part provided on a surface of the lid facing the gap, the first reinforcing part having an elongated shape in a plan view, the length of the first reinforcing part in a longitudinal direction in a plan view being longer than the length of the columnar body and the height of the first reinforcing part being shorter than the height of the columnar body; an electronic component comprising: a second reinforcing portion that is provided on the gap-side surface of the lid so as to intersect with the first reinforcing portion, has an elongated shape in a planar view, has a longitudinal length in a planar view that is longer than the length of the columnar body, and has a height that is shorter than the height of the columnar body.

2. At least one of the first reinforcing portion and the second reinforcing portion is provided so as to overlap with the columnar body in a plan view, The electronic component according to claim 1 , wherein the columnar body supports the lid via at least one of the first reinforcing portion and the second reinforcing portion.

3. The lid has a substantially rectangular shape in a plan view, 3 . The electronic component according to claim 1 , wherein a length in a longitudinal direction of the first reinforcing portion and the second reinforcing portion is equal to or greater than half a length of the lid in the same direction as the longitudinal direction.

4. The frame is annular and has a substantially rectangular shape having four sides, The first reinforcing portion is in contact with both of two opposing sides of the frame body, The electronic component according to claim 1 , wherein the second reinforcing portion is in contact with both of the other two opposing sides of the frame.

5. The electronic component according to claim 1 , wherein the first reinforcing portion and the second reinforcing portion are provided passing through a center of the lid in a plan view.

6. The electronic component according to claim 1 , wherein a width of the first reinforcing portion and the second reinforcing portion is 0.5 to 3 times a length of the columnar body.

7. An electronic component described in any one of claims 1 to 6, wherein the columnar body is provided between a portion where the first reinforcing portion and the second reinforcing portion intersect and the substrate.

8. The electronic component according to claim 1 , wherein the functional element is an acoustic wave element.

9. The electronic component according to claim 8 , wherein the acoustic wave element forms a filter.

10. The electronic component of claim 9 , wherein the filter forms a multiplexer.

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