Automated TFM Grid Resolution Setting Tool

Abstract

Examples of the present subject matter provide techniques for calculating amplitude fidelity (AF) for various grid resolutions using a single TFM image of a specified defect. Thus, the grid resolution can be set to obtain a desired AF using a computational process without performing blind iterative processing. Furthermore, examples of the present subject matter can measure AF in more than one axis to improve accuracy.

Description

[Technical field]

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS This application claims the benefit of priority to U.S. Patent Application No. 17 / 066,798, filed October 9, 2020, the contents of which are incorporated herein by reference in their entirety.

[0002] The present disclosure relates generally to non-destructive testing using a total-focusing method (TFM). [Background technology]

[0003] Ultrasonic inspection can be a useful inspection technique for a variety of structures. Inhomogeneities on or within the structure under test can generate scattered or reflected acoustic signals in response to a transmitted acoustic pulse. Such acoustic "echoes" can be received and processed. Processing can include reconstruction of an image corresponding to an area of ​​the structure under test for review by an inspector or for recording. Internal features of the structure that can be detected and thereby imaged include interfaces between materials with different acoustic propagation characteristics, such as voids, cracks, or other defects, and the structure, such as welds, joints, cladding layers, or surfaces. Summary of the Invention [Problem to be solved by the invention]

[0004] Processing the received acoustic echo signals to form an image may involve a variety of techniques. In one approach, a technique called the "total focusing method" (TFM) may be used, which may involve a full matrix capture (FMC) acquisition scheme that can achieve focus over a large spatial region on or within the structure under test. TFM has been integrated into various inspection codes and standards, such as ASME Section V (2019 ASME Boiler and Pressure Vessel Code, Section V: Nondestructive Testing), and ISO 23865 (Nondestructive Testing - Ultrasonic Testing - General Use of Full Matrix Capture / Total Focusing Technique (FMC / TFM)). These codes may require an operator to ensure that the TFM grid resolution allows for amplitude fidelity (AF) at a certain level (e.g., 2 dB or less). AF corresponds to the maximum amplitude variation of a particular defect caused by the resolution (e.g., the distance between two grid points of the TFM grid). Generally, a coarser grid resolution will produce a higher AF value. [Means for solving the problem]

[0005] As a result, an engineer can use an iterative trial and error process to set the grid resolution to produce a particular AF value. That is, the engineer can set the grid resolution to a first value, acquire a TFM image of a specified defect, measure the amplitude variation by moving the TFM grid in one direction (e.g., horizontally), and calculate the AF value. Then, if the calculated AF value is not the desired value, the engineer can adjust the grid value accordingly and repeat the process until the desired AF value is obtained. [Brief description of the drawings]

[0006] Various figures of the accompanying drawings merely illustrate example implementations of the present disclosure and should not be considered as limiting its scope.

[0007] [Figure 1]1 illustrates an inspection system according to one example of the present subject matter. [Diagram 2] FIG. 1 is a flow diagram of a process for calculating grid resolution, according to an example of the present subject matter. [Figure 3A] 1 illustrates a graphical representation of certain steps in a process for calculating grid resolution, according to an example of the present subject matter. [Figure 3B] 1 illustrates a graphical representation of certain steps in a process for calculating grid resolution, according to an example of the present subject matter. [Figure 3C] 1 illustrates a graphical representation of certain steps in a process for calculating grid resolution, according to an example of the present subject matter. [Figure 3D] 1 illustrates a graphical representation of certain steps in a process for calculating grid resolution, according to an example of the present subject matter. [Figure 3E] 1 illustrates a graphical representation of certain steps in a process for calculating grid resolution, according to an example of the present subject matter. [Figure 3F] 1 illustrates a graphical representation of certain steps in a process for calculating grid resolution, according to an example of the present subject matter. [Figure 4A] 13 shows another example of a graphical representation of certain steps of a process for calculating grid resolution, according to an example of the present subject matter. [Figure 4B] 13 shows another example of a graphical representation of certain steps of a process for calculating grid resolution, according to an example of the present subject matter. [Figure 4C] 13 shows another example of a graphical representation of certain steps of a process for calculating grid resolution, according to an example of the present subject matter. [Figure 5A] 13 shows another example of a graphical representation of certain steps of a process for calculating grid resolution, according to an example of the present subject matter. [Figure 5B] 13 shows another example of a graphical representation of certain steps of a process for calculating grid resolution, according to an example of the present subject matter. [Figure 5C] 13 shows another example of a graphical representation of certain steps of a process for calculating grid resolution, according to an example of the present subject matter. [Figure 6A]1 illustrates a portion of an AF verification process, according to an example of the present subject matter. [Figure 6B] 1 illustrates a portion of an AF verification process, according to an example of the present subject matter. [Figure 6C] 1 illustrates a portion of an AF verification process, according to an example of the present subject matter. [Figure 6D] 1 illustrates a portion of an AF verification process, according to an example of the present subject matter. [Figure 7] 1 illustrates an example block diagram comprising a machine upon which any one or more of the techniques (eg, methodologies) discussed herein may be performed. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] The present inventors have recognized that there is a need in the art for an inspection system that overcomes, among other things, the challenges discussed above. Examples of the present subject matter provide techniques for calculating AF for various grid resolutions using a single TFM image of a specified defect. Thus, the grid resolution can be set to obtain a desired AF using a calculation process without performing the blind iterative process described above. Additionally, examples of the present subject matter can measure AF in more than one axis to improve accuracy.

[0009] The present specification describes a method that includes constructing a TFM image of a representation of a defect in an object at a first grid resolution, determining a center of mass of the representation of the defect from the TFM image, identifying a major axis and a minor axis of the representation of the defect, determining a plurality of pixel or voxel values ​​from the TFM image along the major axis and the minor axis, and determining a second grid resolution that corresponds to a specified amplitude fidelity based on the plurality of pixel or voxel values ​​along the major axis and the minor axis.

[0010] The present specification also describes a machine storage medium having instructions embodied therein that, when executed by the machine, cause the machine to perform operations including constructing a TFM image of a representation of a defect in an object at a first grid resolution; determining a center of mass of the representation of the defect from the TFM image; identifying a major axis and a minor axis of the representation of the defect; determining a plurality of pixel or voxel values ​​from the TFM image along the major axis and the minor axis; and determining a second grid resolution corresponding to a specified amplitude fidelity based on the plurality of pixel or voxel values ​​along the major axis and the minor axis.

[0011] The present specification further describes a system having one or more processors of a machine. The system also includes a memory storing instructions that, when executed by the one or more processors, cause the machine to perform operations including constructing a TFM image of a representation of a defect in an object at a first grid resolution, determining from the TFM image a center of mass of the representation of the defect, identifying major and minor axes of the representation of the defect, determining a plurality of pixel or voxel values ​​from the TFM image along the major and minor axes, and determining a second grid resolution corresponding to a specified amplitude fidelity based on the plurality of pixel or voxel values ​​along the major and minor axes.

[0012] FIG. 1 generally illustrates an example comprising an acoustic inspection system 100, as may be used to perform one or more of the techniques shown and described herein. The inspection system 100 may include a test instrument 140, such as a handheld or portable assembly. The test instrument 140 may be electrically coupled, such as using a multi-conductor interconnect 130, to a probe assembly. The probe assembly 150 may include one or more electroacoustic transducers, such as a transducer array 152 including respective transducers 154A-154N. The transducer array may follow a linear or curved contour, or may include an array of elements extending in two axes, such as providing a matrix of transducer elements. The elements need not be square in footprint, nor be arranged along a linear axis. The size and pitch of the elements may be varied depending on the inspection application.

[0013] A modular probe assembly 150 configuration may be used, allowing the test instrument 140 to be used with different probe assemblies 150. Generally, the transducer array 152 includes, for example, a piezoelectric transducer that can be acoustically coupled to a target 158 ​​(e.g., an object under test) through a coupling medium 156. The coupling medium can include a fluid or gel, or a solid membrane (e.g., an elastomer or other polymeric material), or a combination of fluids, gels, or solid structures. For example, an acoustic transducer assembly can include a transducer array coupled to a wedge structure that includes a rigid thermosetting polymer with known acoustic propagation properties (e.g., Rexolite® available from C-Lec Plastics Inc.), and water can be injected between the wedge and the structure under test as the coupling medium 156 during testing.

[0014] The test instrument 140 may include digital and analog circuits, such as a front-end circuit 122 including one or more transmit signal chains, receive signal chains, or switching circuits (e.g., transmit / receive switching circuits). The transmit signal chain may include amplifier and filter electrical circuitry to provide a transmit pulse for delivery to the probe assembly 150 via the interconnect 130 for deionization of the target 158, and to image or otherwise detect defects 160 on or within the target 158 ​​structure by receiving scattered or reflected acoustic energy elicited in response to the deionization.

[0015] 1 shows a single probe assembly 150 and a single transducer array 152, other configurations can be used, such as multiple probe assemblies connected to a single test instrument 140, or multiple transducer arrays 152 used with single or multiple probe assemblies 150 for tandem testing. Similarly, test protocols can be implemented using coordination between multiple test instruments 140, for example, in response to an overall test scheme established from a master test instrument 140, or established by another remote system such as computing facility 108 or a general purpose computing device such as a laptop 132, tablet, smartphone, desktop computer, etc. The test scheme can be established according to published standards or regulatory requirements, and can be implemented repeatedly, as illustrative examples, at initial production or for ongoing monitoring.

[0016] The receive signal chain of the front-end circuitry 122 may include one or more filter or amplifier circuits along with an analog-to-digital conversion facility to digitize echo signals received using the probe assembly 150. The digitization may be performed coherently to provide multiple channels of digitized data that are aligned or referenced to one another in time or phase. The front-end circuitry 122 may be coupled to and controlled by one or more processor circuits, such as the processor circuit 102 included as part of the test instrument 140. The processor circuit may be coupled to a memory circuit, for example, to execute instructions that cause the test instrument 140 to perform one or more of acoustic transmission, acoustic acquisition, processing, or storage of data associated with acoustic testing, or otherwise perform techniques as shown and described herein. The test instrument 140 may be communicatively coupled to other portions of the system 100, such as using a wired or wireless communication interface 120.

[0017] For example, performance of one or more techniques as shown and described herein may be achieved on the test instrument 140 or using other processing or storage facilities, such as using the computing facilities 108 or general purpose computing devices such as laptops 132, tablets, smartphones, desktop computers, etc. For example, processing tasks that would be undesirably slow if performed on the test instrument 140 or beyond the capabilities of the test instrument 140 may be performed remotely (e.g., on a separate system), for example, in response to a request from the test instrument 140. Similarly, storing imaging data or intermediate data, such as A-scan matrices of time series data, may be achieved using remote facilities communicatively coupled to the test instrument 140. The test instrument may include a display 110, such as for presentation of configuration information or results, and an input device 112, including one or more of a keyboard, trackball, function or soft keys, mouse interface, touch screen, stylus, etc., for receiving operator commands, configuration information, or responses to queries.

[0018] A technique for automatically setting the TFM grid resolution (points per wavelength) for a desired AF will now be described with reference to Figure 2 and Figures 3A-3F. Figure 2 is a flow diagram of a process 200 for calculating the grid resolution according to an example of the present subject matter. Figures 3A-3F show graphical representations of certain steps of process 200 according to an example of the present subject matter.

[0019] At 202, a TFM image of a specified defect in an object (e.g., a calibration block) may be calculated or constructed. The TFM image may be constructed using a preset grid resolution. The preset grid resolution may be relatively higher than an estimated grid resolution for a desired AF. For example, a TFM image may be calculated using a grid resolution of 10-20 points per wavelength, whereas an estimated grid resolution for a desired AF (e.g., 2 dB) may be significantly lower (e.g., 2-5 points per wavelength).

[0020] FIG. 3A shows an example of a TFM image of a specified defect (e.g., a side-drilled hole (SDH)) calculated at a preset grid resolution of about 20 points per wavelength. As shown, the echo reflection representing the SDH is depicted by an ellipse (e.g., a larger ellipse).

[0021] At 204, the center of mass of the defect may be determined. The center of mass may be automatically detected by measuring pixel or voxel values ​​(e.g., the amplitude levels of the pixel or voxel values) and identifying an associated point or area. The point or area may be identified by using a statistical average of the measured amplitude levels. In another example, the point or area may be identified by using the maximum amplitude. The center of mass may also be determined by:

[0022]

number

[0023] Like, position<r>It can be calculated using a standard weighted average for

[0024] Here, the summation index n is performed over all N pixels of the image, each of which has its position r_n weighted by the amplitude |A_n|. The amplitudes may be filtered before calculating the average. For example, a threshold may be applied to the amplitudes to retain only pixels with |A_n| values ​​greater than the threshold before calculating the average position. Other spatial filters may also be designed and applied on the image before the calculation, for example to discard amplitude artifact features.

[0025] At 206, based on the detected center of mass, the major and minor axes of an ellipse representing the defect may be identified, and pixel or voxel values ​​(e.g., amplitude levels) may be measured for multiple points along the major and minor axes, respectively. The major axis may correspond to the beam waist axis, and the minor axis may correspond to the acoustic propagation direction. In FIG. 3A, the major and minor axes are identified. In FIG. 3B, cross-sections of individual measurements along both the major and minor axes are illustrated. The measurements may then be normalized, as shown in the graph. Also, as shown, measurements along the minor axis, which corresponds to the acoustic propagation direction, may vary more than measurements along the major axis, the beam waist axis.

[0026] At 208, for both cross sections, an interpolation technique may be applied to fill in the points between the individual measurements to achieve better resolution. Interpolation techniques may include linear, quadratic, quartic, or other suitable interpolation techniques. The cross sections after interpolation are illustrated in FIG. 3C.

[0027] At 210, based on a selected normalized amplitude value "A" corresponding to a desired AF (e.g., "A" may be approximately equal to 0.8 for an AF of 2 dB), a width of the curve may be calculated. "A" may be selected by an operator, or by code based on a standard, etc. The width of the curve may correspond to the length of the major (or minor) axis (a or b) of the target ellipse size.

[0028] At 212, a grid resolution can be calculated based on the target ellipse size to achieve the desired AF. For example, the calculated grid resolution may allow three grid points to be aligned with the target ellipse limit in extreme cases. FIG. 3E illustrates a calculated grid size showing three grid points aligned with the target ellipse shape. This illustrates the maximum grid size that meets the determined target minimum AF value. Any translation of the ellipse on that grid can meet the target AF value.

[0029] Steps 210-212 may be repeated for different AF values. Additionally, grid resolutions for different AF values ​​may be compiled. For example, a table may be created using the results of steps 210-212 for different AF values. These results may be inverted and interpolated to yield a grid resolution for any AF value. FIG. 3F illustrates a graph showing different AF values ​​and their corresponding grid resolution values. In this example, for an AF of 2 dB, a grid resolution of 2.8561 points per wavelength was calculated. Other grid resolutions for different AF values ​​may also be calculated.

[0030] Thus, the grid resolution corresponding to a desired AF can be calculated from a single TFM image, as opposed to a trial and error process using multiple TFM images. Also, the techniques described herein provide simpler operations that avoid the need for a technician to move a probe or grid to measure various AF values ​​for a given resolution. Additionally, the techniques described herein take into account the direction of acoustic propagation.

[0031] 4A-4C illustrate another example of calculating a grid resolution for a desired AF value using the techniques described herein. FIG. 4A shows a TFM image and identifies the center of mass and major and minor axes for a specified defect. FIG. 4B shows a cross section of the interpolated data for amplitude measurements for the major and minor axes. FIG. 4C illustrates a graph showing various AF values ​​and their corresponding grid resolution values. In this example, for an AF of 2 dB, a grid resolution of 2.0663 points per wavelength was calculated.

[0032] 5A-5C illustrate another example of calculating a grid resolution for a desired AF value using the techniques described herein. FIG. 5A shows a TFM image and identifies the center of mass and major and minor axes for a specified defect. FIG. 5B shows a cross section of the interpolated data for amplitude measurements for the major and minor axes. FIG. 5C illustrates a graph showing various AF values ​​and their corresponding grid resolution values. In this example, for an AF of 2 dB, a grid resolution of 2.0955 points per wavelength was calculated.

[0033] After a TFM grid resolution is selected to obtain a desired AF, the actual AF of a TFM image generated using the selected grid resolution can be verified. FIGS. 6A-6D illustrate a portion of the AF verification process, according to an example of the present subject matter. In FIG. 6A, a TFM image is shown at two different grid resolutions. The larger grid is the grid resolution selected to obtain a desired AF value. The smaller grid resolution may be, for example, 10 times smaller than the selected grid resolution. The maximum amplitude can then be measured in the TFM image using 1 / 100th of the grid points for a uniform grid setting.

[0034] The selected grid can then be moved in different directions, as shown in Figures 6B-6D. After each move in a specified direction, the maximum amplitude can be measured using 1 / 100ths of a grid point. For example, as shown in Figure 6B, the grid can be moved horizontally (x-axis) and the maximum amplitude can be measured. As shown in Figure 6C, the grid can then be moved vertically (z-axis) and the maximum amplitude can be measured. As shown in Figure 6D, the grid can then be moved diagonally and the maximum amplitude can be measured. Amplitude fidelity can be calculated using the log of the ratio between the maximum and minimum amplitude measurements performed after moves in different directions.

[0035] The techniques shown and described herein may be implemented using a portion or the entirety of an inspection system 100 as shown in FIG. 1, or otherwise using a machine 700 as discussed below in connection with FIG. 7. FIG. 7 illustrates an example block diagram comprising a machine 700 on which any one or more of the techniques (e.g., methodologies) discussed herein may be implemented. In various examples, the machine 700 may operate as a standalone device or may be connected (e.g., networked) to other machines. In a networked deployment, the machine 700 may operate as a server machine, a client machine, or both in a server-client network environment. In one example, the machine 700 may function as a peer machine in a peer-to-peer (P2P) (or other distributed) network environment. The machine 700 may be a personal computer (PC), a tablet device, a set-top box (STB), a personal digital assistant (PDA), a mobile phone, a web appliance, a network router, a switch, or a bridge, or any machine capable of executing (sequentially or otherwise) instructions that specify actions to be taken by the machine. Additionally, although only a single machine is illustrated, the term "machine" is intended to include any collection of machines that individually or collectively execute a set (or multiple sets) of instructions to perform any one or more of the methodologies discussed herein, such as cloud computing, software as a service (SaaS), other computer cluster configurations, etc.

[0036] As described herein, examples may include or operate by logic or some components or mechanisms. Electrical circuitry is a collection of circuits implemented in tangible entities including hardware (e.g., simple circuits, gates, logic, etc.). Electrical circuitry membership may be flexible over time and with variations in the underlying hardware. Circuitry includes components that, alone or in combination, can perform a specified operation when operated. In one example, hardware of electrical circuitry may be invariably designed to perform a specific operation (e.g., hardwired). In one example, hardware comprising electrical circuitry may include variably connected physical components (e.g., execution units, transistors, simple circuits, etc.) that include computer-readable media that are physically altered (e.g., magnetically, electrically, e.g., via a change in physical state or transformation of another physical property, etc.) to encode instructions for a specific operation. In connecting the physical components, the underlying electrical properties of the hardware components may be altered, e.g., from insulating properties to conductive properties or vice versa. The instructions enable the embedded hardware (e.g., an execution unit or a load mechanism) to create elements of the electrical circuitry of the hardware through variable connections to perform a portion of a particular operation during operation. Thus, the computer-readable medium is communicatively coupled to other elements of the electrical circuitry when the device is operating. In one example, any of the physical components may be used in more than one element of two or more electrical circuitry. For example, under operation, an execution unit may be used in a first circuit of a first electrical circuitry at one time and reused by a second circuit in the first electrical circuitry or by a third circuit of the second electrical circuitry at a different time.

[0037] The machine (e.g., computer system) 700 may include a hardware processor 702 (e.g., a central processing unit (CPU), a graphics processing unit (GPU), a hardware processor core, or any combination thereof), a main memory 704, and a static memory 706, some or all of which may be in communication with each other via an interlink (e.g., a bus) 708. The machine 700 may further include a display unit 720, an alphanumeric input device 722 (e.g., a keyboard), and a user interface (UI) navigation device 724 (e.g., a mouse). In one example, the display unit 720, the input device 722, and the UI navigation device 724 may be touch screen displays. The machine 700 may further include a storage device (e.g., a drive unit) 726, a signal generating device 728 (e.g., a speaker), a network interface device 720, and one or more sensors 722, such as a global positioning system (GPS) sensor, a compass, an accelerometer, or other sensors. The machine 700 may include an output controller 728, such as a serial (e.g., Universal Serial Bus (USB), parallel, or other wired or wireless (e.g., infrared (IR), near field communication (NFC), etc.) connection, for communicating with or controlling one or more peripheral devices (e.g., a printer, card reader, etc.).

[0038] The storage device 726 may include a machine-readable medium 722 having stored thereon one or more sets of data structures or instructions 724 (e.g., software) that embody or are utilized by any one or more of the techniques or functions described herein. The instructions 724 may also reside, completely or at least partially, within the main memory 704, within the static memory 706, or within the hardware processor 702 during execution thereof by the machine 700. In one example, one or any combination of the hardware processor 702, the main memory 704, the static memory 707, or the storage device 726 may constitute a machine-readable medium.

[0039] Although the machine-readable medium 722 is illustrated as a single medium, the term “machine-readable medium” may include a single medium or multiple media (e.g., a centralized or distributed database, and / or associated caches and servers) configured to store one or more instructions 724.

[0040] The term "machine-readable medium" may include any medium capable of storing, encoding, or carrying instructions for execution by the machine 700, causing the machine 700 to perform any one or more of the techniques of this disclosure, or capable of storing, encoding, or carrying data structures used by or associated with such instructions. Non-limiting examples of machine-readable media may include solid-state memory, as well as optical and magnetic media. Thus, a machine-readable medium is not a transitory, propagating signal. Specific examples of large-scale machine-readable media may include non-volatile memory, such as semiconductor memory devices (e.g., electrically programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM)) and flash memory devices, magnetic or other phase-change or state-change memory circuits, magnetic disks, such as internal hard disks and removable disks, magneto-optical disks, and CD-ROM and DVD-ROM disks.

[0041] The instructions 724 may further be transmitted or received over a communications network 726 using a transmission medium via the network interface device 720 utilizing any one of a number of transport protocols (e.g., Frame Relay, Internet Protocol (IP), Transmission Control Protocol (TCP), User Datagram Protocol (UDP), Hypertext Transfer Protocol (HTTP), etc.). Exemplary communications networks may include local area networks (LANs), wide area networks (WANs), packet data networks (e.g., the Internet), mobile telephone networks (e.g., cellular networks), plain old telephone service (POTS) networks, and wireless data networks (e.g., the Institute of Electrical and Electronics Engineers (IEEE) 802.22 family of standards known as Wi-Fi®, the IEEE 802.26 family of standards known as WiMax®), the IEEE 802.25.4 family of standards, peer-to-peer (P2P) networks, etc. In one example, the network interface device 720 may include one or more physical jacks (e.g., Ethernet, coaxial, or telephone jacks) or one or more antennas for connecting to the communications network 726. In one example, network interface device 720 may include multiple antennas for wireless communication using at least one of single-input multiple-output (SIMO), multiple-input multiple-output (MIMO), or multiple-input single-output (MISO) technologies. The term "transmission medium" should be understood to include any intangible medium capable of storing, encoding or carrying instructions for execution by machine 700, including digital or analog communication signals or other intangible media for facilitating communication of such software.

[0042] Various notes Each of the above non-limiting aspects may stand alone or may be combined in various permutations or combinations with one or more of the other aspects or other subject matter described herein.

[0043] The above detailed description includes references to the accompanying drawings, which form a part of the detailed description. The drawings show, by way of illustration, specific implementations in which the invention may be practiced. These implementations are also generally referred to as "examples." Such examples may include elements in addition to those shown or described. However, the inventors also contemplate examples in which only the elements shown or described are provided. Furthermore, the inventors also contemplate examples that use any combination or permutation of those elements (or one or more aspects thereof) shown or described with respect to a particular example (or one or more aspects thereof) or with respect to other examples (or one or more aspects thereof) shown or described herein.

[0044] In the event of a conflict of usage between this document and any document so incorporated by reference, the usage in this document shall control.

[0045] In this document, the terms "a" or "an" are used to include one or more, as is common in patent documents, regardless of any other instance or usage of "at least one" or "one or more." In this document, the term "or" is used to refer to a non-exclusive or, such that "A or B" includes "A but not B," "B but not A," and "A and B," unless otherwise indicated. In this document, the terms "including" and "in which" are used as the plain English equivalents of the terms "comprising" and "wherein," respectively. Also, in the following claims, the terms "including" and "comprising" are not limiting, i.e., a system, device, article, composition, formulation, or process that includes elements in addition to those recited after such terms in the claim are still considered to be within the scope of that claim. Moreover, in the following claims, the terms "first," "second," and "third," etc. are used merely as labels and are not intended to impose numerical requirements on their objects.

[0046] The method examples described herein may be at least partially implemented by a machine or computer. Some examples may include a computer-readable medium or machine-readable media encoded with instructions operable to configure an electronic device to perform the methods described in the above examples. Implementations of such methods may include code, such as microcode, assembly language code, higher level language code, etc. Such code may include computer-readable instructions for performing various methods. The code may form part of a computer program product. Further, in one example, the code may be tangibly stored on one or more volatile, non-transitory, or non-volatile tangible computer-readable media, such as during execution or at other times. Examples of these tangible computer-readable media may include, but are not limited to, hard disks, removable magnetic disks, removable optical disks (e.g., compact disks and digital video disks), magnetic cassettes, memory cards or sticks, random access memory (RAM), read-only memory (ROM), etc.

[0047] The above description is intended to be illustrative and not restrictive. For example, the examples (or one or more aspects thereof) described above may be used in combination with each other. Other implementations may be used by those of ordinary skill in the art who have reviewed the above description. The Abstract is provided to enable the reader to quickly ascertain the nature of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. Also, in the above detailed description, various features may be grouped together to streamline the disclosure. This should not be construed as intending that an unclaimed disclosed feature is essential to any claim. Rather, the subject matter of the invention may lie in less than all features of a particular disclosed implementation. For this reason, the following claims are incorporated into the detailed description as an example or implementation, and each claim stands alone as a separate implementation, and it is contemplated that such implementations can be combined with each other in various combinations or permutations. The scope of the invention should be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled. [Explanation of symbols]

[0048] 100 Acoustic Inspection System 102 Processor Circuit 110 Display 112 Input Devices 120 Wired or wireless communication interface 122 Front-end circuit 130 Interconnect 132 Another remote system or laptop 140 Test Equipment 150 Probe Assembly 152 Transducer Array 154 each transducer 156 Binding medium 158 Target 700 Machines 702 Hardware Processor 704 Main Memory 706 Static Memory 708 Interlink (e.g. bus) 720 Network Interface Device 724 Command 714 Navigation Devices 726 Communication Network 728 Output Controller< / r>

Claims

1. 1. A method comprising: constructing a total focusing method (TFM) image of a representation of a defect in the object at a first grid resolution; determining a centroid of the representation of the defect based on the constructed TFM image; identifying major and minor axes of the representation of the defect; determining a plurality of pixel or voxel values ​​from the TFM image along the major and minor axes; determining a second grid resolution corresponding to a specified amplitude fidelity (AF) based on the plurality of pixel or voxel values ​​along the major and minor axes; Including, A method, wherein the Amplitude Fidelity (AF) corresponds to a maximum amplitude variation for a defect in the object that is dependent on a grid resolution.

2. The method of claim 1 , further comprising applying an interpolation technique to the plurality of amplitude measurements along the major and minor axes.

3. The method of claim 1 or 2, further comprising normalizing the pixel or voxel values ​​along the major and minor axes.

4. calculating the grid resolution, Calculating a width of the curve corresponding to an axis length of the target ellipse based on a desired amplitude fidelity; calculating the grid resolution such that at least three grid points fall along the target ellipse; The method according to any one of claims 1 to 3, comprising:

5. constructing a second TFM image of the representation at the second grid resolution; and verifying the AF value of the second TFM image; The method of any one of claims 1 to 4, further comprising:

6. Demonstrating the AF value The method of any one of claims 1 to 5, comprising verifying the AF value by moving a grid of the second TFM image in a number of different directions.

7. The method of any one of claims 1 to 6, wherein the first grid resolution exceeds the second grid resolution.

8. A computer-readable storage medium having instructions recorded thereon, the instructions, when executed by a processor, causing a computer to: constructing a total focusing method (TFM) image of a representation of a defect in the object at a first grid resolution; determining a centroid of the representation of the defect based on the constructed TFM image; identifying major and minor axes of the representation of the defect; determining a plurality of pixel or voxel values ​​from the TFM image along the major and minor axes; determining a second grid resolution corresponding to a specified amplitude fidelity (AF) based on the plurality of pixel or voxel values ​​along the major and minor axes; performing an operation including The amplitude fidelity (AF) corresponds to a maximum amplitude variation for a defect in the object that is dependent on a grid resolution.

9. The computer-readable storage medium of claim 8 , further comprising applying an interpolation technique to the plurality of amplitude measurements along the major and minor axes.

10. The computer-readable storage medium of claim 8 or 9, further comprising normalizing the plurality of pixel or voxel values ​​along the major and minor axes.

11. calculating the grid resolution, Calculating a width of the curve corresponding to an axis length of the target ellipse based on a desired amplitude fidelity; calculating the grid resolution such that at least three grid points fall along the target ellipse; The computer-readable storage medium according to any one of claims 8 to 10, comprising:

12. constructing a second TFM image of the representation at the second grid resolution; and verifying the AF value of the second TFM image; The computer-readable storage medium of any one of claims 8 to 11, further comprising:

13. Demonstrating the AF value The computer-readable storage medium of any one of claims 8 to 12, comprising verifying the AF value by moving a grid of the second TFM image in a number of different directions.

14. The computer-readable storage medium of any one of claims 8 to 13, wherein the first grid resolution is greater than the second grid resolution.

15. 1. A system comprising: one or more processors of the machine; A memory storing instructions that, when executed by the one or more processors, cause the machine to: constructing a total focusing method (TFM) image of a representation of a defect in the object at a first grid resolution; determining a centroid of the representation of the defect from the TFM image; identifying major and minor axes of the representation of the defect; determining a plurality of pixel or voxel values ​​from the TFM image along the major and minor axes; determining a second grid resolution corresponding to a specified amplitude fidelity (AF) based on the plurality of pixel or voxel values ​​along the major and minor axes; a memory for performing operations including: Equipped with The system, wherein the Amplitude Fidelity (AF) corresponds to a maximum amplitude variation for a defect in the object, which is dependent on a grid resolution.

16. 16. The system of claim 15, wherein the action comprises: The system further includes applying an interpolation technique to the plurality of amplitude measurements along the major and minor axes.

17. 17. A system according to claim 15 or 16, wherein the operation comprises: The system further comprises normalizing the plurality of pixel or voxel values ​​along the major and minor axes.

18. Calculating the grid resolution comprises: Calculating a width of the curve corresponding to an axis length of the target ellipse based on a desired amplitude fidelity; calculating the grid resolution such that at least three grid points fall along the target ellipse; The system according to any one of claims 15 to 17, comprising:

19. A system according to any one of claims 15 to 18, wherein the operation comprises: constructing a second TFM image of the representation at the second grid resolution; and verifying the AF value of the second TFM image; The system according to any one of claims 15 to 18, further comprising:

20. Demonstrating the AF value The system of any one of claims 15 to 19, comprising verifying the AF value by moving a grid of the second TFM image in a number of different directions.

21. The system of any one of claims 15 to 20, wherein the first grid resolution exceeds the second grid resolution.

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