Exposure apparatus, device manufacturing method, and flat panel display manufacturing method

Abstract

This light exposure apparatus comprises: a light exposure unit including a spatial light modulator that has a plurality of elements and in which the plurality of elements are controlled according to a light exposure pattern, an illumination optical system for illuminating the spatial light modulator, and a projection optical system for projecting an image of the spatial light modulator onto a substrate; a data generation unit that generates control data for controlling the plurality of elements according to a second light exposure pattern; a measurement system that measures a mark exposed to light together with a first light exposure pattern before the light exposure unit exposes the substrate to light in the second light exposure pattern; and a control unit that controls at least one of the projection optical system, the spatial light modulator, and the data generation unit according to the result of the measurement of the mark by the measurement system, and that controls the location of the projection by the projection optical system on the substrate. The light exposure apparatus is provided with a plurality of the light exposure units that respectively expose the substrate to light in a plurality of divisions of the second light exposure pattern. The control unit controls the location of the projection for each light exposure unit.

Description

[Technical field]

[0001] The present invention relates to an exposure apparatus, a device manufacturing method, and a method for manufacturing a flat panel display. This application claims priority based on Japanese Patent Application No. 2021-066818, filed on April 9, 2021, the contents of which are incorporated herein by reference. [Background technology]

[0002] Conventionally, as an exposure apparatus that irradiates illumination light onto a substrate via an optical system, there has been known an exposure apparatus that uses a spatial light modulator to modulate light, passes the modulated light through a projection optical system, and forms an image of this light on a resist applied to the substrate to perform exposure (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2007-108559 A Summary of the Invention

[0004] One aspect of the present invention is an exposure apparatus that exposes a substrate exposed with a first exposure pattern while moving the substrate in a scanning direction and overlapping the substrate with a second exposure pattern, the exposure apparatus including an exposure unit having a spatial light modulator having a plurality of elements, the plurality of elements being controlled in accordance with the exposure pattern, an illumination optical system that illuminates the spatial light modulator, and a projection optical system that projects an image of the spatial light modulator onto the substrate, a data generation unit that generates control data for controlling the plurality of elements in accordance with the second exposure pattern, a measurement system that measures a mark exposed together with the first exposure pattern before the exposure unit exposes the second exposure pattern onto the substrate, a control unit that controls at least one of the projection optical system, the spatial light modulator, and the data generation unit in accordance with a measurement result of the mark by the measurement system, and controls a projection position on the substrate by the projection optical system, and information related to an exposure machine that performs overlapping exposure on the substrate exposed with the second exposure pattern.arrangement information regarding the arrangement of an alignment microscope of the exposure machine, and a receiving unit that receives the data, arrangement Based on the information, An alignment mark is formed on the substrate at a position where the alignment microscope can observe the alignment mark. The exposure apparatus corrects the control data, the exposure units are provided in plurality, and each of the exposure units exposes the second exposure pattern, which is divided into a plurality of parts, onto the substrate, and the control unit controls the projection position for each of the exposure units.

[0005] Another aspect of the present invention is an exposure apparatus that exposes a substrate exposed with a first exposure pattern in a superimposed manner while moving the substrate in a scanning direction, the exposure apparatus including an exposure unit having a spatial light modulator having a plurality of elements, the plurality of elements being controlled in accordance with an exposure pattern, an illumination optical system that illuminates the spatial light modulator, and a projection optical system that projects an image of the spatial light modulator onto the substrate, a data generation unit that generates control data for controlling the plurality of elements in accordance with the second exposure pattern, and a projection optical system that projects an image of the spatial light modulator onto the substrate, the exposure unit having a spatial light modulator having a plurality of elements ... data generation unit generating control data for controlling the plurality of elements in accordance with the second exposure pattern, and a projection optical system that projects an image of the spatial light modulator onto the substrate in a direction in which the exposure direction of the first exposure pattern and the scanning direction intersect. The above information regarding a substrate stage for holding a substrate, a measurement system for measuring a mark exposed together with the first exposure pattern before the second exposure pattern is exposed onto the substrate by the exposure unit, a drive unit for moving the substrate stage relative to the exposure unit in the scanning direction and exposing the second exposure pattern so as to be superimposed on the first exposure pattern according to a measurement result of the mark by the measurement system, and an exposure machine for performing superimposition exposure on the substrate exposed with the second exposure pattern arrangement information regarding the arrangement of an alignment microscope of the exposure machine, and a receiving unit that receives the data, arrangement Based on the information, An alignment mark is formed on the substrate at a position where the alignment microscope can observe the alignment mark. The exposure apparatus corrects the control data.

[0006] Another aspect of the present invention includes an exposure unit having a spatial light modulator having a plurality of elements, the plurality of elements being controlled in accordance with an exposure pattern, an illumination optical system which illuminates the spatial light modulator, and a projection optical system which projects an image of the spatial light modulator onto the substrate, a data generation unit which generates control data to control the plurality of elements in accordance with the exposure pattern, and a receiving unit which receives information relating to an exposure machine which performs an overlay exposure on the substrate on which the exposure pattern has been exposed, and the data generation unit corrects the control data based on the information.

[0007] One aspect of the present invention includes exposing the substrate using the exposure apparatus described above, and developing the exposed substrate.

[0008] One aspect of the invention includes exposing a substrate for a flat panel display using the exposure apparatus described above, and developing the exposed substrate. [Brief description of the drawings]

[0009] [Figure 1] 1 is a perspective view showing a configuration of an exposure apparatus according to an embodiment. [Diagram 2] FIG. 2 is a side view showing a schematic configuration of the exposure apparatus. [Diagram 3] FIG. 2 is a side view showing a schematic configuration of an illumination / projection module of the exposure apparatus. [Figure 4] FIG. 2 is a perspective view showing the ON / OFF operation of a spatial light modulation element. [Figure 5A] FIG. 2 is a diagram showing the operation of the spatial light modulation element in a power-off state. [Figure 5B] FIG. 2 is a diagram showing the operation of the spatial light modulation element, in which the spatial light modulation element is in an ON state. [Figure 5C] FIG. 2 is a diagram showing the operation of the spatial light modulation element, in which the spatial light modulation element is in an OFF state. [Figure 6] FIG. 2 is a side view showing a schematic configuration of a first alignment system provided on the substrate stage. [Figure 7] FIG. 2 is a perspective view showing a schematic configuration of a mask exposure machine. [Figure 8] 1 shows a diagram of the scan layout of a mask exposure machine. [Figure 9A] FIG. 2 is a diagram showing a module area in the exposure apparatus. [Figure 9B] FIG. 2 is a diagram showing a module area in the exposure apparatus. [Figure 10] 2 is a plan view showing an exposure state of a substrate by a mask exposure machine and an exposure device. FIG. [Figure 11A] This is a diagram showing a layout in which the first exposure and the second exposure in FIG. 10 are overlapped and exposed in the same direction, and no rotation error occurs. [Figure 11B] FIG. 11 is a diagram showing a layout in which the first exposure and the second exposure in FIG. 10 are overlapped and exposed in the same direction, and a rotation error occurs. [Figure 12] FIG. 2 is a plan view showing an exposure state in which a substrate is rotated by the exposure apparatus. [Figure 13A] This is a diagram showing a layout in which the first exposure and the second exposure in FIG. 12 are overlapped and exposed in the same direction, and no rotation error occurs. [Figure 13B] This is a diagram showing the layout in which the first exposure and the second exposure in FIG. 12 are overlapped and exposed in the same direction, and a rotation error occurs. [Figure 14] FIG. 2 is a plan view showing the position of an alignment microscope during mask exposure according to the first embodiment. [Figure 15] FIG. 4 is a plan view showing the position of an alignment microscope during overlay exposure according to the first embodiment. [Figure 16] FIG. 11 is a plan view showing the position of an alignment microscope during overlay exposure according to the second embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, the embodiments will be described in detail with reference to the drawings. Fig. 1 is a perspective view showing an example of an exposure apparatus according to this embodiment. The exposure apparatus 1 is an apparatus that irradiates illumination light onto a substrate 10 via an optical system. The exposure apparatus 1 passes light modulated by a spatial light modulator 75 (see Fig. 2) through a projection optical system (projection module 7B described later) and forms an image of this light on a photosensitive material (resist) to perform exposure. The substrate 10 is, for example, a glass substrate for a display with a resist applied to its surface.

[0011] As shown in FIG. 1, the exposure apparatus 1 includes a substrate stage 4 that supports a substrate 10, an exposure apparatus main body 2 that performs scanning exposure to expose the substrate 10 with a predetermined exposure pattern, and a substrate exchange unit 3 for transporting and placing the substrate 10 on the substrate stage 4.

[0012] Here, the direction in which the substrate stage 4 moves during scanning exposure of the substrate 10 is indicated as a first direction X1. The direction perpendicular to (intersecting) the first direction is indicated as a second direction X2. Moreover, the direction perpendicular to the first direction X1 and the second direction X2 is indicated as a third direction X3.

[0013] The substrate stage 4 holds a substrate 10 that is rectangular in plan view.

[0014] 1 and 2, the exposure apparatus main body 2 has an exposure unit 20, an optical table 21, an alignment system 5, and an autofocus system 23. The exposure unit 20 has the above-mentioned spatial light modulator 75 built in, receives light from the light source 61, and irradiates the light in a preset exposure pattern.

[0015] The exposure unit 20 is supported by an optical base 21 fixed by a column 22. The optical base 21 is formed in a flat plate shape and is fixed to the upper part of the gate-shaped column 22 provided so as to straddle the base plate 11 extending in the first direction X1 on which the substrate stage 4 is placed. The optical base 21 is disposed in the center of the base plate 11 in the first direction X1.

[0016] The base plate 11 is placed on a floor surface via multiple vibration isolation stands 111. The base plate 11 is a base extending in a first direction X1, and a substrate stage 4 (described later) is mounted on an upper surface 11a of the base plate 11. A guide (not shown) that guides the substrate stage 4 along the first direction X1 is provided on the upper surface 11a of the base plate 11.

[0017] The column 22 has a pair of cross members 221 extending in the second direction X2, and legs 222 extending downward from both ends of the cross members 221 and connected to the base plate 11. Since the legs 222 are subjected to the load of the optical base 21, a vibration isolation stand (not shown) may be disposed at the connection between the base plate 11 and the legs 222. Three V-shaped grooves are formed at appropriate positions on the upper surface of the cross members 221. The optical base 21 is placed on the pair of cross members 221 in the V-shaped grooves via three balls with the upper surface 21a facing horizontally.

[0018] An illumination / projection module 7, an AF system 23, and a second alignment system 5B, which will be described later, are mounted on the optical base 21. The optical base 21 is provided with a plurality of first through-holes 21b (see FIG. 2) that penetrate in the thickness direction in order to guide the exposure light onto the substrate 10. The optical base 21 can be fixed to the column 22 by any method that can ensure rigidity.

[0019] The substrate stage 4 is for positioning the substrate 10 with high precision relative to multiple partial images of an exposure pattern projected via a projection module 7B, which will be described later. The substrate stage 4 is driven with six degrees of freedom (a first direction X1, a second direction X2, a third direction X3, and θX1, θX2, and θX3 directions rotating around the respective axes X1, X2, and X3).

[0020] As shown in FIGS. 1 and 2, the substrate stage 4 is formed in a flat plate shape, and holds the substrate 10 by suction on an upper surface 4a, for example, by vacuum suction or the like. The substrate stage 4 is guided by a guide (not shown) on the base plate 11, and the position of the substrate stage 4 is measured and controlled by an interferometer 53 and an encoder, and the substrate stage 4 is moved in the first direction X1 and the second direction X2. As a mechanism for moving the substrate stage 4 at this time, for example, a linear motor system in which the substrate stage 4 is levitated by air and moved by magnetic force can be used.

[0021] The movement path of the substrate stage 4 is set so as to pass under the exposure unit 20. That is, the substrate stage 4 is configured to be transported to a position where light is irradiated by the exposure unit 20, and to pass through that irradiation position. Then, while the substrate stage 4 passes through the exposure unit 20, the exposure pattern of the image formed by the exposure unit 20 is exposed onto the substrate 10.

[0022] As shown in FIG. 1, a plurality of exchange pins (not shown) used when exchanging the substrate 10 are provided on the upper surface 4a of the substrate stage 4 so as to be able to protrude and retract in the vertical direction (third direction X3). These exchange pins are arranged at predetermined intervals in the first direction X1 and the second direction X2 in the region of the upper surface 4a of the substrate stage 4 where the substrate 10 is placed. When the exchange pins protrude upward, the lower surface of the substrate 10 is supported by the tips of the pins. In other words, the substrate 10 can be raised and lowered by protruding and retracting the exchange pins. The protruding length of the exchange pins from the upper surface 4a is set to at least a length that allows a substrate support part 31 of an exchange arm 3A, which will be described later, to advance below the raised substrate 10.

[0023] As shown in FIG. 1, the substrate exchange unit 3 carries out the exposed substrate 10 on the substrate stage 4 to the outside of the substrate stage 4, and carries in the next substrate 10 to be exposed onto the substrate stage 4 from which the exposed substrate 10 was carried out. The substrate exchange unit 3 includes an exchange arm 3A for high-speed exchange of the substrate 10 on the substrate stage 4. The exchange arm 3A includes an import arm for carrying the substrate 10 into the substrate stage 4, and an export arm for carrying the substrate 10 out. The exchange arm 3A includes a substrate support unit 31 at the end of the arm. The exchange arm 3A is disposed on the side of the substrate stage 4 in the second direction X2, and is provided so as to be movable in the first direction X1, the second direction X2, and the third direction X3. The exchange arm 3A moves in the second direction X2 to advance the substrate support unit 31 below the substrate 10, and is further raised to support the substrate 10 from below, and further moves in the second direction X2 away from the substrate stage 4, thereby performing an operation of removing the substrate 10 from the substrate stage 4.

[0024] The substrate 10 is coated with a photosensitive resist and carried into the exposure apparatus 1, and is placed by the exchange arm 3A on the plurality of exchange pins provided on the substrate stage 4. The exchange pins are then lowered and adsorbed to and held by the substrate holder on the substrate stage 4.

[0025] FIG. 2 is a diagram showing the configuration of the exposure unit 20. As shown in FIG. As shown in FIG. 2, the exposure unit 20 includes a light source unit 6 (see FIG. 1), a light source 61 of the light source unit 6, and an illumination and projection module 7 for exposing the light from the light source 61 using a spatial light modulator 75 (described later).

[0026] 1, the light source units 6 are provided in pairs. As the light source units 6, a light source unit using a highly coherent laser as the light source 61, a light source unit using a light source 61 such as a semiconductor laser type UV-LD, and a light source unit using a lens relay type retarder can be adopted. That is, the light source 61 is a lamp or a laser diode that emits a wavelength such as 405 nm or 365 nm.

[0027] As shown in FIG. 3, the optical system of the illumination / projection module 7 includes an illumination module 7A, a projection module 7B, and a modulation section 7C.

[0028] The illumination modules 7A and the projection modules 7B have the same number in a one-to-one relationship. The illumination module 7A takes in laser light L into the illumination module 7A via an optical fiber 71, and illuminates the spatial light modulator 75 with the laser light L almost uniformly via a collimator lens 721, a fly-eye lens 723, and a main condenser lens 724.

[0029] In the illumination module 7A, a module shutter 73 is disposed which can quickly turn on / off the laser light L emitted from the optical fiber 71 for each of the illumination module 7A and the projection module 7B.

[0030] The illumination module 7A causes the laser light L output from the light source 61 of the light source unit 6 shown in FIG. 1 to enter the spatial light modulator 75 as the exposure illumination light. As described above, the illumination module 7A includes the optical fiber 71, the collimator lens 721, the illumination wedge 722, the fly-eye lens 723, and the main condenser lens 724. The optical fiber 71 is, for example, a quartz fiber. The output light (laser light L) of the light source 61 is guided by the optical fiber 71 and enters the collimator lens 721. The collimator lens 721 converts the light emitted from the optical fiber 71 and spreading into parallel light and emits it. The illumination wedge 722 adjusts the intensity (power) of the light emitted from the optical fiber 71. The light that passes through the collimator lens 721 passes through the fly-eye lens 723 and the main condenser lens 724, is reflected by the mirror 725, and enters the spatial light modulator 75 at a predetermined reflection angle. The illumination module 7A and the light source unit 6 can be considered to illuminate the spatial light modulation element 75 together, and the two may be collectively expressed as an illumination system.

[0031] The modulation unit 7C modulates the illumination light to create a pattern, and includes a spatial light modulator 75 and an OFF light absorbing plate 74. A digital mirror device is adopted as the spatial light modulator 75, for example. The spatial light modulation element 75 includes a plurality of elements (mirrors in a digital mirror device). Since the spatial light modulator 75 requires driving of each mirror, it is preferable that the light source be capable of emitting pulsed light at a constant frequency, or emitting light in a pulsed manner for a predetermined period of time, rather than a continuous light.

[0032] As shown in FIG. 4, the spatial light modulator 75 is held on a stage that is movable in a first direction X1 and a second direction X2, and corrects, for example, the deviation of the substrate stage 4 from a target value.

[0033] Fig. 5A shows a state in which the spatial light modulator 75 is powered OFF. The spatial light modulator 75 shown in Fig. 5B shows an ON state in which the mirror is tilted around the x2 axis to reflect light from the illumination module 7A toward the substrate 10. The spatial light modulator 75 shown in Fig. 5C shows an OFF state in which the mirror is tilted around the x1 axis to turn the light from the illumination module 7A into OFF light L2, and to guide the light to the OFF light absorbing plate 74 instead of the substrate 10. In this way, the spatial light modulator 75 can control the ON and OFF states of each mirror on a mirror-by-mirror basis based on control data to form a pattern.

[0034] As shown in Fig. 2, the projection module 7B is supported by the optical base 21, and is disposed below the spatial light modulator 75 which is the modulation unit 7C. As shown in Fig. 3, the projection module 7B is provided with a magnification adjustment unit 76 which adjusts the magnification for projecting one pixel of the spatial light modulator 75 at a predetermined size, and a focus adjustment unit 77 which adjusts the focus by driving the lens in the third direction X3. The projection module 7B projects, exposes, and forms an image of the pattern on the substrate 10.

[0035] The magnification adjustment unit 76 can slightly correct the magnification by driving some of the lenses. The magnification adjustment unit 76 includes a magnification adjustment lens 761 that reduces the image from the spatial light modulator 75, for example, to 1 / 2 to 1 / 10, and projects it onto the focus adjustment unit 77. Note that the magnification adjustment by the magnification adjustment unit 76 is not limited to reduction and may be enlargement. The focus adjustment section 77 includes a plurality of focus lenses 771 that condense the image of the magnification adjustment section 76 into a spot shape and project it onto the substrate surface 10a, which is the focal plane.

[0036] As shown in FIG. 2, the projection modules 7B are provided in a plurality of rows on the optical base 21 along the first direction X1.

[0037] 2, autofocus systems 23 are disposed on both sides of the projection module 7B in the first direction X1 on the optical base 21 (see FIG. 7). The autofocus system 23 can measure the position of the substrate 10 in the X3 direction prior to the exposure process, regardless of the scanning direction (first direction X1) of the substrate 10. The focus adjustment unit 77 drives the focus lens 771 based on the measurement result of the autofocus system 23, and adjusts the focus of the pattern image on the spatial light modulation element 75.

[0038] 2, autofocus systems 23 are disposed on both sides of the projection module 7B in the first direction X1 on the optical base 21 (see FIG. 7). The autofocus systems 23 are designed to perform advance measurement regardless of the scanning direction of the substrate 10 (first direction X1).

[0039] As shown in FIGS. 2 and 6, the alignment system 5 includes a first alignment system 5A (see FIG. 6) provided on the substrate stage 4, and a second alignment system 5B (see FIG. 2) provided on the optical base 21.

[0040] 6, the first alignment system 5A is embedded in a predetermined position of the substrate stage 4. The first alignment system 5A measures the position of the substrate 10, which is attracted to a holder (not shown), relative to the substrate stage 4. The first alignment system 5A is disposed at least in the four corners of the substrate stage 4. The substrate stage 4 is provided with through holes 42 that penetrate in the stage thickness direction at the four corners where the first alignment system 5A is provided.

[0041] The first alignment system 5A has a lens 511 arranged in the through hole 42 of the substrate stage 4, a light source 513 such as an LED arranged below the lens 511 and irradiating measurement light toward an alignment mark 12 of a substrate 10 placed at a predetermined position on the substrate stage 4, and a measurement unit 512 that detects light reflected from the alignment mark 12.

[0042] In the first alignment system 5A, when the substrate 10 is placed on the substrate stage 4, the positions of, for example, the four corners of the substrate 10 are measured, and six parameters (position information) can be calculated by measuring the position in the X1 direction, the position in the X2 direction, the amount of rotation (θX3), the reduction / enlargement magnification in the X1 direction, the reduction / enlargement magnification in the X2 direction, and the orthogonality. The arrangement of the first alignment systems 5A on the substrate stage 4 is not limited to the four corners as described above. For example, when a nonlinear shape of the substrate 10 occurs due to a process, a considerable number of first alignment systems 5A, such as 4 locations×4 rows, are arranged.

[0043] The first alignment system 5A is an off-axis alignment system that measures the alignment mark 12 on the substrate 10 based on the pixels of a CCD or CMOS that captures the image.

[0044] 2, the substrate stage 4 has a calibration measurement system 52, an interferometer 53 that measures the position of the substrate stage 4, and an illuminance measurement device 54. The calibration measurement system 52, the interferometer 53, and the illuminance measurement device 54 are acquisition units that acquire information regarding the light of the exposure unit 2 during or before exposure of the substrate 10. The calibration measurement system 52 is used to measure and calibrate the positions of a plurality of various modules. The calibration measurement system 52 is also used to calibrate the second alignment system 5B arranged on the optical base 21.

[0045] In this manner, in the exposure apparatus 1 of this embodiment, the imaging position of the pattern generated by the spatial light modulator 75 that performs the exposure is measured by the first alignment system 5A in the substrate stage 4, and the position of the first alignment system 5A on the substrate stage 4 relative to the imaging system can be measured based on the image position of the alignment system 5 and the interferometer 53 that measures the position of the substrate stage 4.

[0046] As shown in FIG. 2, a second alignment system 5B is disposed on the optical base 21 at a position above the substrate stage 4. The second alignment system 5B measures the position of the substrate 10, which is attracted to a holder (not shown), relative to the substrate stage 4. The second alignment system 5B is disposed in a second through-hole 21c that penetrates the optical base 21 in the thickness direction.

[0047] The second alignment system 5B has a lens 551 arranged below the second through hole 21c of the optical base 21, an optical sensor 552 arranged above the lens 551 and irradiating measurement light toward the alignment mark 12 of the substrate 10 placed at a predetermined position on the substrate stage 4, and a measurement unit 553 that detects the light reflected from the alignment mark 12. Like the first alignment system 5A, the second alignment system 5B can calculate six parameters (position information) related to the substrate 10 when the substrate 10 is placed on the substrate stage 4, namely, the X1 direction position, the X2 direction position, the rotation amount (θX3), the reduction / enlargement magnification in the X1 direction, the reduction / enlargement magnification in the X2 direction, and the orthogonality.

[0048] The optical surface plate 21 is formed to extend in the first direction X1. The second alignment 5B is provided on the optical surface plate 21 away from the illumination module 7 in the first direction X1. The substrate stage 4 moves to a position where the second alignment 5B can measure the alignment mark 12 on the substrate 10. By driving the substrate stage 4, the alignment mark 12 arranged on the substrate 10 can be measured, so that measurement can be performed over almost the entire surface of the substrate 10.

[0049] The first alignment system 5A is capable of placing the substrate 10 on the substrate stage 4 and measuring position information related to the substrate 10. The first alignment system 5A may be provided on an optical base 21 away from the illumination module 7 in the first direction X1.

[0050] Next, a method for exposing the substrate 10 will be described with reference to the drawings. First, as shown in FIG. 1, when a recipe for exposure is input to the exposure apparatus 1, mask data for exposure is selected by the mask pattern server. Then, as shown in FIG. 2, the mask data is divided according to the number of illumination modules 7A, the divided mask data is generated, and stored in the memory provided in each module. At this time, the spatial light modulator 75 updates 4M pixels at an update rate of, for example, about 10 kHz, so the memory stores a large amount of mask data at high speed. The module performs various exposure preparations in accordance with the preparation of the mask data (transmission to the memory). That is, the necessary registered patterns of the spatial light modulator 75 are loaded in advance before exposure.

[0051] First, the exposure apparatus 1 measures and calibrates the illuminance (light information) according to the recipe. For example, the illuminance measurement device 54 arranged on the substrate stage 4 measures the illuminance of light from the illuminance measurement pattern generated on the spatial light modulator 75. By measuring the illumination module 7A and the projection module 7B, the illumination wedge 722 arranged in the illumination module 7A adjusts the illuminance including the difference between the modules 7A and 7B. This allows the illumination module 7A to be corrected based on the measured illuminance (light state).

[0052] Next, as shown in FIG. 2, the exposure positions of second alignment system 5B arranged on optical base 21, illumination module 7A, and projection module 7B are measured by calibration measurement system 52. That is, the calibration measurement system 52 measures the arrangement of the illumination module 7A and the projection module 7B and the position of the microscope, and calculates the relative positional relationship between the illumination module 7A and the projection module 7B and the microscope. The position of the first alignment system 5A provided on the substrate stage 4 is calculated by measuring it using the exposure pattern of the spatial light modulator 75 projected by the projection module 7B. In this way, the exposure positions of the first alignment system 5A and each of the modules 7A and 7B are calculated.

[0053] Next, as shown in Fig. 6, the substrate 10 to be exposed is placed on the substrate stage 4. At this time, the alignment mark 12 on the substrate 10 is observed and measured by the first alignment system 5A. This makes it possible to confirm where on the substrate 10 the exposure pattern is located based on the relative positional relationship between the illumination module 7A and the projection module 7B and the microscope. Based on this measurement information, a data control unit, which will be described later, generates correction data. The position of the substrate stage 4 relative to the illumination module 7A and the projection module 7B may be corrected by moving it in the X1 direction, the X2 direction, and the θX3 direction.

[0054] This operation makes it possible to know the amount of deviation between the position to be exposed on the recipe and the position to be exposed on the substrate 10 based on the current positional relationship between the substrate 10 and the projection module 7B. In this embodiment, the exposure data is corrected in order to correct this amount of deviation. In addition to correcting with the exposure data, the substrate stage 4 itself may be moved to reduce the amount of deviation and then the correction data may be generated. In this case, the amount of correction with the data is reduced. The exposure position on the substrate 10 may be changed by moving the spatial light modulator 75. The amount of deviation may be corrected by data correction and moving the substrate stage 4, or by data correction and moving the spatial light modulator 75, or by data correction and moving the substrate stage 4 and moving the spatial light modulator 75.

[0055] Incidentally, in the exposure apparatus 1, it is also possible to calculate a correction value for each panel of the substrate 10, such as for a liquid crystal television, and obtain a correction value for the substrate stage 4. When partially correcting the substrate 10 in this way, in most cases the correction value differs for each illumination module 7A and projection module 7B, so a correction value is calculated for each illumination module 7A and projection module 7B, and the digital exposure data to be exposed is corrected.

[0056] Next, both the exposure operation and the correction data creation operation for creating correction data in the substrate stage 4 will be described. 6, the substrate stage 4 uses the exchange arm 3A (see FIG. 1) of the substrate exchange unit 3 to place the substrate 10 on the substrate stage 4. Thereafter, the alignment mark 12 on the substrate 10 is measured by the first alignment system 5A.

[0057] The exposure apparatus 1 is connected to and controlled by a data control unit having a memory. The data control unit is connected to each component of the exposure apparatus 1 (alignment system 5 (5A, 5B), substrate stage 4, optical system (illumination module 7A, projection module 7B, and modulation unit 7C)), and transmits and receives measurement values ​​and issues control operation commands from the data control unit to the exposure apparatus 1. The memory has a function of generating and correcting digital exposure data for driving the spatial light modulator 75 by measurement, and stores correction data for the digital exposure data. The data control unit is incorporated in a personal computer.

[0058] Next, the data control unit calculates a correction value (correction data) for the digital exposure data. The data control unit then stores the obtained correction data in a memory. After that, the exposure apparatus 1 performs overlapping exposure on the substrate 10 on the substrate stage 4 based on the transmitted correction data for the substrate 10 and recipe information.

[0059] In the operation of correcting data on the substrate stage 4, it is also possible to perform calibration or the like during the data correction. The data control unit can use light information, such as illuminance measured by an illuminance meter 54 or a calibration measurement system 52 provided on the substrate stage 4 during exposure, as correction data, and adjust the illuminance of the illumination and projection module 7 based on this correction data. The light information at this time is transmitted to the illumination and projection module 7 before data correction of the substrate stage 4 begins. It is also possible to transmit the above light information to the illumination and projection module 7 while data correction is being performed on the substrate stage 4.

[0060] Furthermore, in the exposure apparatus 1, measurements related to the exposure position and data correction are performed in advance in conjunction with the arrangement measurement of the multiple illumination modules 7A and projection modules 7B, and then illuminance measurement and correction of the curvature (straightness) of the movable mirror 13 provided on the substrate stage 4 are performed, thereby allowing the calculation of correction values ​​based on data and the transmission of correction data to be performed during the exposure operation. In this way, data that takes into account the alignment of the substrate 10 and the arrangement of the modules can be transmitted without affecting the takt time.

[0061] 7, the mask exposure machine 8 is an exposure apparatus that exposes a pattern formed on a mask M (see FIG. 8) onto a substrate 10. The mask exposure machine 8 includes a fiber 81 that irradiates light, an illumination optical system 82, a mask stage 83 that supports and moves the mask M, a projection optical system 84, and a substrate stage 84 that supports and moves the substrate. In this embodiment, the first exposure (hereinafter referred to as 1st exposure) is performed by a mask exposure machine 8, and the second and subsequent exposures (hereinafter referred to as 2nd exposure) are performed by an exposure apparatus 1 using a spatial light modulator 75. The exposure apparatus 1 performs overlapping exposure, which is the 2nd exposure, on the substrate 10 while supporting and moving the substrate 10, which has been subjected to the 1st exposure by the mask exposure machine 8, on a substrate stage 4.

[0062] FIG. 8 shows the scan layout of the mask exposure machine 8. Reference numeral 85 denotes a first exposure area by the projection optical system 82 (see FIG. 7). The first exposure area 85 has a trapezoidal shape when viewed from above. The mask exposure machine 8 exposes the substrate 10 by joining ends of the first exposure areas 85 adjacent to each other in the second direction X2. The area on the substrate 10 where the first exposure areas 85 are joined and exposed is called the first joint area. The scan layout of the mask exposure machine 8 may be restricted because the size of the mask is finite.

[0063] Specifically, as shown in Fig. 8, when a mask having a size of 1 / 4 of the substrate 10 is used, the mask exposure machine 8 is arranged such that, for example, seven first exposure regions 85 are joined together to form an area approximately equal to 1 / 4 of the area of ​​the substrate 10. The mask stage 83 shown in Fig. 7 is also designed to have a size capable of supporting a mask M having a size of 1 / 4 of the substrate 10. In this way, the configuration within the mask exposure machine 8 is determined according to the size of the mask M and the area on the substrate 10 exposed in one exposure operation, which means that the mask exposure machine 8 is subject to constraints. In the mask exposure machine 8, the entire surface of the substrate is exposed by repeating a scanning operation in which the substrate stage 84 and the mask stage 83 are moved in the first direction X1 relative to the projection optical system 82, and a step movement in which the substrate stage 84 is moved in the second direction X2 or the first direction X1 relative to the mask stage 83. Note that, although the mask M has been described as being 1 / 4 times the size of the substrate 10, the size is not limited to this, and the size can also be 1 / 6 or 1 / 8.

[0064] The exposure apparatus 1 according to the present embodiment exposes an exposure pattern formed by a spatial light modulator onto the substrate 10, and therefore, unlike the mask exposure machine 8, can expose the substrate 10 without using a mask M. In the following explanation, the exposure apparatus 1 may be referred to as a maskless exposure machine since it does not use a mask M.

[0065] 9A and 9B show the scan layout of a maskless exposure tool (exposure tool 1). With a maskless exposure tool, there are no restrictions on mask size or equipment, as with the above-mentioned mask exposure tool 8, and it is possible to freely arrange the layout. For example, when the substrate 10 is placed on the substrate stage 4 so that the long side of the substrate 10 is parallel to the second direction X2 (vertical placement) as shown in FIG. 9B, the scan length, that is, the distance that the substrate stage 84 moves relative to the exposure module to expose the entire substrate surface, can be shortened, and the time required to expose the entire substrate can also be shortened, compared to when the substrate 10 is placed on the substrate stage 4 so that the short side of the substrate 10 is parallel to the second direction X2 (horizontal placement) as shown in FIG. 9A. For example, when the glass substrate is sixth generation glass (1850 mm×1500 mm), the exposure time when the glass substrate is placed vertically on the substrate stage 84 is 1500 / 1850 compared to the exposure time when the glass substrate is placed horizontally on the substrate stage 84, and the exposure time can be shortened by approximately 23%. Note that the reference numeral 86 denotes a second exposure area by the projection module 7B. The exposure machine 1 joins ends of adjacent second exposure regions 86 in the second direction X2 to expose the substrate 10. The region on the substrate 10 that is exposed after joining the second exposure regions 86 is referred to as a second joint region.

[0066] 10, the substrate 10 is divided into two in each of the first direction X1 and the second direction X2, and is exposed as four exposure regions in total. Layout R1 on the right half of the substrate 10 shown in FIG. 10 shows the exposure result of the 1st exposure by the mask exposure machine 8, and layout R2 on the left half of the substrate 10 shows the exposure result of the 2nd exposure by the exposure machine 1.

[0067] 11A shows the result of overlapping exposure performed in one exposure region R1, R2 of the substrate 10 by a 1st exposure performed by the mask exposure machine 8 and a 2nd exposure performed by the exposure machine 1. At this time, the mask exposure machine 8 performs exposure while moving the substrate stage 4 and the mask stage 83 in the first direction X1 relative to the projection optical system 82. The exposure machine 1 performs exposure by moving the substrate stage 4 in the first direction X1 relative to the exposure module. That is, Fig. 11A shows the result of exposing the substrate 10 with the movement direction of the substrate stage 84 during exposure by the mask exposure machine 8 in the 1st exposure coinciding (parallel) with the movement direction of the substrate stage 4 during exposure by the exposure machine 1 in the 2nd exposure. Fig. 11A shows an exposure state in which there is no misalignment (rotation error) between the movement direction of the substrate 10 during the 1st exposure and the movement direction of the substrate 10 during the 2nd exposure. Here, the module width for the 2nd exposure is set to 1 / 2 the width of the stitching region for the 1st exposure.

[0068] Next, a case where a rotation error occurs during the 2nd exposure, that is, a case where the movement direction of the substrate 10 during the 2nd exposure is rotated relative to the movement direction of the substrate 10 during the 1st exposure, will be described with reference to Fig. 11B. When a rotation error occurs between the 1st exposure and the 2nd exposure, a rotation error occurs in the direction in which the first splice region is formed and the direction in which the second splice region is formed, and an unevenness phenomenon such as moire (interference fringes) occurs. This moire phenomenon occurs significantly when the second exposure region 86 of the 2nd exposure is smaller than the first exposure region 85 of the 1st exposure, or when the width of the first splice region is narrower than the width of the second splice region.

[0069] In this embodiment, as shown in FIG. 12, the exposure machine 1 rotates the movement direction of the substrate 10 during the 2nd exposure by 90° with respect to the movement direction of the substrate 10 during the 1st exposure, and exposes the substrate 10. That is, the exposure machine 1 places the substrate 10 on the substrate stage 4 so that the scanning direction during the 2nd exposure is parallel to the second direction X2 when the direction of the joint is parallel to the first direction X1 when the scanning direction during the 1st exposure is parallel to the first direction X1. The scanning direction during the 2nd exposure is perpendicular to the scanning direction during the 1st exposure. The substrate stages 84, 4 have a size that can support the substrate 10 even if it is transported vertically or horizontally. For example, when a sixth generation glass substrate (1850 mm×1500 mm) is placed on the substrate stages 84, 4, it is preferable that the substrate stages 84, 4 have a size of 1850 mm×1850 mm (or a size larger than that). The substrate stages 84, 4 can support the substrate 10 whether it is vertically or horizontally placed.

[0070] Fig. 13A shows a layout in which the scanning direction is rotated 90° between the 1st exposure and the 2nd exposure and overlapping exposure is performed, and shows an exposure state without rotation error, that is, a state in which the substrate 10 is exposed with the scanning direction of the 1st exposure and the scanning direction of the 2nd exposure being perpendicular to each other. Fig. 13B shows a state in which the scanning direction of the 1st exposure and the 2nd exposure is slightly rotated from 90°, that is, a state in which the substrate 10 is exposed when a rotation error occurs. As shown in Fig. 13A, by rotating the scanning direction by 90° between the 1st exposure and the 2nd exposure, it is possible to reduce unevenness such as moire compared to the layout shown in Fig. 11B in which the scanning direction is made the same between the 1st exposure and the 2nd exposure as described above and a rotation error occurs. Also, as shown in Fig. 13B, even if the scanning direction is rotated by approximately 90° between the 1st exposure and the 2nd exposure, the unevenness such as moire is reduced.

[0071] In addition, at locations where inflection points occur due to misalignment, such as module joints, there are abrupt changes, and the difference in overlapping exposure of each module between the 1st exposure and the 2nd exposure that span the joint becomes large. This causes unevenness in the electrical characteristics, so in the case of scanning in which the 1st exposure and the 2nd exposure are in the same direction, an error occurs equal to the sum of the module joint errors that occur in the 1st exposure and the 2nd exposure. On the other hand, when the scanning direction of the 1st exposure and the 2nd exposure is rotated by 90°, it is only necessary to consider the errors that occur in the 1st exposure and the 2nd exposure, so the exposure unevenness can also be reduced by rotating it electrically by 90°.

[0072] In this embodiment, the substrate 10 is horizontally placed on the substrate stage 84 during the 1st exposure, that is, the substrate 10 is vertically placed on the substrate stage 4 during the 2nd exposure, but the present invention is not limited to this. For example, the substrate 10 may be vertically placed on the substrate stage 84 during the 1st exposure, that is, the substrate 10 may be horizontally placed on the substrate stage 4 during the 2nd exposure, and the substrate 10 may be exposed by the exposure apparatus 1. In this case, the number of projection modules 7B can be less than the number shown in FIG. 13A and FIG. 13B to fill the sides of the region. As shown in FIG. 3, the projection module 7B not used for exposure blocks the light emitted from the optical fiber 71 by the module shutter 73. Instead of the module shutter 73, each element of the spatial light modulator 75 may be set to the OFF state. Alternatively, a separate shutter mechanism may be provided in the projection module 7B, and a member for blocking the light from the spatial light modulator 75 toward the substrate 10 may be provided. The light source unit 6 may be configured to guide the illumination light via the optical fiber 71 only to the module required for the second exposure.

[0073] (First Example) Next, as a first embodiment, an alignment operation by the exposure apparatus 1 when the scanning direction between the 1st exposure and the 2nd exposure is rotated by 90° will be described. The alignment operation is an operation that is performed before the 2nd exposure, and is for overlapping the exposure position of the 2nd exposure with the exposure position of the 1st exposure by measuring the position of the 1st exposure via the alignment mark 12.

[0074] 14, an example is shown in which a substrate 10 used for exposure is placed horizontally on a substrate stage 84 in a mask exposure machine 8 and exposed. During the first exposure, the mask exposure machine 8 exposes a plurality of (six here) alignment marks 12 at intervals in the short direction (second direction X2) on the substrate 10 at both ends 10c in the long direction (first direction X1). The mask exposure machine 8 also exposes alignment marks 12 at both ends 10d in the second direction X2 and in the center in the first direction X1.

[0075] Furthermore, the mask exposure machine 8 may also expose a plurality of alignment marks 12 along the boundary lines of the four layouts. The alignment marks 12 are formed by exposing alignment marks provided on a mask onto the substrate 10 during the 1st exposure through a projection lens of the mask exposure machine 8. The alignment marks 12 are provided at positions where they can be observed by an alignment microscope 55 in the exposure device used in the 2nd exposure. In addition, on the substrate 10, "F" is displayed in the exposure region R to indicate the orientation. That is, "F" is displayed with the longitudinal direction of the substrate 10 oriented horizontally (first direction X1).

[0076] 14 shows the arrangement of alignment microscopes 55 provided in the mask exposure tool 8. The alignment microscopes 55 are arranged at predetermined intervals along the second direction X2, and are provided at positions for observing / measuring the alignment marks 12 on the substrate 10. This is because the substrate 10 that has been subjected to the 1st exposure by the mask exposure tool 8 is also exposed in the 2nd exposure by the same mask exposure tool 8, the same type of mask exposure tool 8, or a different type of mask exposure tool 8 in which the alignment microscope 55 is provided in the same position.

[0077] Figure 15 shows a state in which the substrate 10 that has been subjected to a first exposure by the mask exposure machine 8 as shown in Figure 14 is placed vertically (with its longitudinal direction facing the second direction X2) on the substrate stage 4 in the (maskless) exposure apparatus 1. The exposure apparatus 1 is equipped with a plurality of alignment microscopes 56 (six in this example) arranged at predetermined intervals along the scanning direction (second direction X2). The alignment microscopes 56 are provided in the exposure apparatus 1 at intervals different from the intervals at which the alignment microscopes 55 of the mask exposure machine 8 are arranged. This is because the alignment microscopes 56 may be provided at an interval different from that of the alignment microscopes 55, since the second exposure of the substrate 10 subjected to the first exposure by the exposure machine 1 is performed by the same exposure apparatus 1, the same type of exposure apparatus 1, or a different type of exposure apparatus 1 in which the alignment microscopes 56 are provided at the same position. The alignment microscopes 56 are provided at an arrangement in which the alignment marks 12 cannot be observed / measured.

[0078] The alignment microscope 56 has a first microscope 56A (third measurement system) whose position is fixed in an immovable state, and a second microscope 56B (fourth measurement system) that is provided so as to be movable in a vertical direction (second direction X2) by a predetermined movement distance. The first microscopes 56A are, for example, four of the six microscopes arranged, excluding the two on both sides. The second microscopes 56B are, for example, two of the six microscopes arranged, on both sides in the second direction X2. The positions of the second microscopes 56B arranged on both sides in the second direction X2 are controlled so as to move to positions where the alignment marks 12 of the vertically arranged substrate 10 can be observed. The second microscopes 56B are moved in the second direction X2 so as to change the distance between them and the first microscope 56A. This allows the alignment microscope 56 to observe / measure the alignment marks 12 exposed on the substrate 10 in the 1st exposure. As a result, the exposure apparatus 1 can expose a desired pattern onto the substrate 10 in the second exposure so as to overlap the exposure region exposed in the first exposure.

[0079] In this embodiment, of the six alignment microscopes 56 arranged in the vertical direction (second direction X2), only the two second microscopes 56B on both sides of the second direction X2 are movable, but this is not limited to this. For example, all six alignment microscopes 56 may be arranged to be movable in the second direction X2, and the spacing between each alignment microscope 56 in the second direction X2 may be changeable. 15 shows an example in which alignment marks 12 are formed by the 1st exposure only on both ends of the exposure region R in the second direction X2, but similar to the alignment mark 12 shown in Fig. 14, when alignment marks 12 are also formed on the first direction X1 side of the exposure region R, or when alignment marks 12 are formed in the boundary region of the exposure region R, this is useful for the alignment microscope 56 to observe / measure these alignment marks 12. The reference mark detection unit may be configured to measure the movement distance of the alignment microscope 56 in the second direction X2.

[0080] In this embodiment, the second microscope 56B of the alignment microscope 56 is movable, but is not limited to being movable in this manner. For example, the alignment microscope 56 may further include a microscope that is provided at a position where the alignment mark 12 exposed by the mask exposure machine 8 can be measured. Furthermore, the exposure apparatus 1 may move the substrate stage 4 that holds the substrate 10 in the second direction X2 so that the alignment mark 12 can be observed without moving the alignment microscope 56.

[0081] In addition, in the first embodiment, the first exposure is performed by the mask exposure machine 8, and the second exposure is performed by the exposure apparatus 1, but the present invention is not limited to this. For example, the first and second exposures may be performed by the mask exposure machine 8, and the third exposure may be performed by the maskless exposure machine (exposure apparatus 1). Furthermore, unlike the first embodiment, the first exposure is not limited to exposure by the mask exposure machine 8. The first exposure may be exposure by the exposure apparatus 1.

[0082] Furthermore, the mask exposure machine 8 may be an exposure machine that does not perform continuous exposure. Even in such a case, the alignment mark 12 exposed by the mask exposure machine 8 cannot be observed / measured by the alignment microscope 56 of the maskless exposure machine (exposure apparatus 1). For this reason, it is not limited to moving the alignment microscope 56, and for example, an alignment microscope 56 for the maskless exposure machine and an alignment microscope 55 for the mask exposure machine 8 may be provided in the maskless exposure machine (exposure apparatus 1), or the substrate stage 4 may be moved to observe / measure the alignment mark 12 by the alignment microscope 56 of the maskless exposure machine.

[0083] Furthermore, since the pattern exposed by the mask exposure machine 8 exposes the entire exposure area by sequential exposure using multiple projection lenses, if the exposure start position of each projection lens is shifted, the positions of the ends (start end, end end) of the exposure area will also be shifted. Therefore, the maskless exposure machine (exposure apparatus 1) performs overlapping exposure on the exposure area exposed with the shifted ends. The maskless exposure machine exposes the substrate 10 (on which the pattern has been exposed by the mask exposure machine 8) in a direction parallel to the scanning direction of the mask exposure machine 8, thereby making it possible to perform overlapping exposure on the exposure area exposed with the shifted ends.

[0084] The maskless exposure machine (exposure apparatus 1) uses an alignment microscope 56 to measure the amount of misalignment at the edge of the exposure area. As one of the measurement methods (first measurement method), there is a method of correcting the pattern data sent to the spatial light modulator 75 based on the measured amount of deviation. Specifically, for each spatial light modulator 75, a correction is performed to shift the pattern data to the + side or - side of the scanning direction. In addition, as another measurement method (second measurement method), a measurement method may be used in which an optical member in the projection optical system is moved for each exposure module based on the measured amount of deviation, and the (exposure start) position of the projection area on the substrate 10 is adjusted for each exposure module. As yet another measurement method (third measurement method), a measurement method may be used in which the spatial light modulator 75 is moved for each exposure module based on the measured amount of deviation, and the position of the projection area on the substrate 10 is adjusted for each exposure module. Note that by adopting at least one of the above-mentioned first measurement method, second measurement method, and third measurement method, it is possible to overlap and expose even the exposure area exposed with the edge shifted by adjusting the exposure start position for each exposure module.

[0085] When observing the alignment marks with the alignment microscopes 55 and 56, the alignment mark 12 exposed by the maskless exposure machine (exposure apparatus 1) cannot be observed because the mask exposure machine 8 and the maskless exposure machine (exposure apparatus 1) are arranged differently. Therefore, as described in the first embodiment, a part of the alignment microscope 56 is made movable for measurement. Alternatively, the alignment mark 12 may be observed by moving the substrate stage in the non-scanning direction (the direction intersecting the scanning direction).

[0086] Next, regardless of whether this is the first embodiment or the second embodiment described later, when further overlay exposure is performed on the exposure pattern exposed by the maskless exposure machine (exposure apparatus 1), the maskless exposure machine receives information on the type of exposure machine that will perform the exposure (information on the type of exposure machine, whether it is a maskless exposure machine or a mask exposure machine 8). This information may include the positioning information of the alignment microscope of the exposure machine that will perform the next exposure. In this case, the mask exposure machine 8 and exposure apparatus 1 are provided with a receiving unit that receives the above-mentioned information on the exposure machine. The maskless exposure machine (exposure apparatus 1) exposes the alignment mark 12 at a position where the alignment microscope 56 of the next exposure machine can observe the alignment mark 12 exposed by the maskless exposure machine. That is, the data generation unit corrects the pattern data based on the position information of the alignment microscope 56 so that the alignment mark 12 can be exposed at an appropriate position on the substrate 10 where it can be observed by the alignment microscope 56.

[0087] In addition, since the exposure apparatus for performing the overlapping exposure may be either a maskless exposure apparatus or a mask exposure apparatus, the maskless exposure apparatus may expose an alignment mark for the maskless exposure apparatus and an alignment mark for the maskless exposure apparatus onto the substrate, respectively. In this case, too, the pattern data is corrected to expose the alignment mark at an appropriate position.

[0088] (Second Example) In the second embodiment, the scanning directions of the 1st exposure and the 2nd exposure are parallel to each other as the exposure pattern. That is, the mask exposure machine 8 scans in the same direction as the scanning direction (here, the first direction X1) in which the exposure is performed, and overlapping exposure is performed to form an overlapping exposed portion.

[0089] 14, an example is shown in which a substrate 10 used for exposure is placed horizontally on a substrate stage 84 in a mask exposure machine 8 and exposed. As in the first embodiment, the mask exposure machine 8 exposes a plurality of (six in this case) alignment marks 12 at intervals in the short direction (second direction X2) on the substrate 10 at both ends 10c in the longitudinal direction (first direction X1) during the 1st exposure. The alignment marks 12 are provided at positions where they can be observed by an alignment microscope 56 in the exposure tool 1 used in the 2nd exposure. In addition, on the substrate 10, "F" is displayed in the exposure region R to indicate the orientation. That is, "F" is displayed with the longitudinal direction of the substrate 10 oriented horizontally (first direction X1).

[0090] Figure 16 shows a state in which the substrate 10 that has been subjected to a first exposure by the mask exposure machine 8 as shown in Figure 14 is placed horizontally (with its longitudinal direction facing the first direction X1) on the substrate stage 4 in the (maskless) exposure apparatus 1. The exposure apparatus 1 is equipped with a plurality of (six here) alignment microscopes 56 arranged at predetermined intervals along the scanning direction (first direction X1). The alignment microscopes 56 are provided in the exposure apparatus 1 at the same intervals as the alignment microscopes 55 of the mask exposure machine 8 are arranged.

[0091] In the second embodiment, the exposure device 1 having the spatial light modulator 75 is scanned in the same direction as the scanning direction of the exposure by the mask exposure device 8 to perform the overlapping exposure to form the overlapping exposure portion. Since there is no restriction of the mask in the 2nd exposure, it is possible to expose the entire substrate 10. In addition, since the joint area when the overlapping exposure is performed can be matched with the exposure pattern by the 1st exposure that has been previously scanned and exposed, it is possible to perform the overlapping exposure by the 2nd exposure in accordance with the joint area of ​​the exposure pattern by the 1st exposure. In other words, by making the joint area by the 1st exposure the same direction as the substrate 10, the joint area by the 1st exposure can be corrected, and further, by making the patterning area by the scanning and mask during the 1st exposure the same, the overlapping by the 2nd exposure can be performed accurately.

[0092] Even if the scanning directions of the 1st exposure and the 2nd exposure are parallel, the arrangement of the alignment microscope 55 of the mask exposure machine 8 and the arrangement of the alignment microscope 56 of the maskless exposure machine (exposure apparatus 1) may differ. In that case, it is not limited to moving the alignment microscope 56, but for example, an alignment microscope 56 for the maskless exposure machine and an alignment microscope 55 for the mask exposure machine 8 may be provided in the maskless exposure machine (exposure apparatus 1), or the substrate stage 4 may be moved to observe / measure the alignment mark 12 with the alignment microscope 56 of the maskless exposure machine.

[0093] The embodiments of the present invention have been described above, but the corresponding relationship between the present invention and the above-described embodiments will now be supplemented with a description.

[0094] (1) In the above embodiment, the exposure apparatus 1 exposes the substrate 10 exposed with the first exposure pattern while moving the substrate 10 in the scanning direction, and is equipped with an exposure unit 20 having a spatial light modulator 75 having a plurality of elements, the plurality of elements being controlled according to the exposure pattern, an illumination module 7A (illumination optical system) that illuminates the spatial light modulator 75, and a projection module 7B (projection optical system) that projects an image of the spatial light modulator 75 onto the substrate 10, a data generation unit that generates control data to control the plurality of elements according to the second exposure pattern, a measurement system that measures an alignment mark 12 exposed together with the first exposure pattern before the exposure unit 20 exposes the second exposure pattern onto the substrate 10, and a control unit that controls at least one of the projection module 7B, the spatial light modulator 75, and the data generation unit according to the measurement result of the alignment mark 12 by the measurement system, and controls the projection position on the substrate 10 by the projection module 7B. A plurality of exposure units 20 are provided, and each of the exposure units 20 exposes the substrate 10 with a second exposure pattern divided into a plurality of parts.

[0095] In an exposure apparatus 1 configured as described above, the data generation unit generates control data in accordance with the second exposure pattern, the measurement system measures the alignment mark 12 exposed together with the first exposure pattern, and the control unit controls at least one of the projection module 7B, the spatial light modulator 75, and the data generation unit in accordance with the measurement results of the alignment mark 12 by the measurement system, controlling the projection position on the substrate 10 by the projection module 7B for each exposure unit 20, and exposing each of the second exposure patterns divided into multiple parts onto the substrate 10, thereby reducing unevenness phenomena such as moire.

[0096] (2) In the above embodiment, the control unit can control the data generating unit to correct the control data based on the measurement results.

[0097] (3) In the above embodiment, the control unit may move the spatial light modulator 75 relative to the illumination light from the illumination module 7A (illumination optical system) that illuminates the spatial light modulator 75.

[0098] (4) In the above embodiment, the control unit is also capable of moving some of the optical elements in the projection module 7B (projection optical system).

[0099] (5) In the above embodiment, the substrate stage 4 can be provided that is capable of holding the substrate 10 transported in an orientation in which the exposure direction of the first exposure pattern and the scanning direction are substantially parallel to each other.

[0100] (6) Also, in the above embodiment, the exposure apparatus 1 exposes the substrate 10 exposed with the first exposure pattern in a superimposed manner while moving the substrate 10 in a scanning direction, and includes an exposure unit 20 having a spatial light modulator 75 having a plurality of elements, the plurality of elements being controlled in accordance with the exposure pattern, an illumination module 7A (illumination optical system) that illuminates the spatial light modulator 75, and a projection module 7B (projection optical system) that projects an image of the spatial light modulator 75 onto the substrate, a data generation unit that generates control data to control the plurality of elements in accordance with the second exposure pattern, a substrate stage 4 that holds the substrate 10 transported in a direction in which the exposure direction of the first exposure pattern and the scanning direction intersect, a measurement system that measures an alignment mark 12 exposed together with the first exposure pattern before the exposure unit 20 exposes the second exposure pattern onto the substrate 10, and a drive unit that moves the substrate stage 4 relatively to the exposure unit 20 in the scanning direction and exposes the second exposure pattern in a superimposed manner on the first exposure pattern in accordance with a measurement result of the alignment mark 12 by the measurement system.

[0101] (7) In the above embodiment, a plurality of exposure units 20 are provided, and each of the exposure units 20 can expose the substrate 10 with a plurality of divided second exposure patterns.

[0102] With this configuration, divided exposure can be performed by the spatial light modulators 75 of the multiple exposure units 20. In this case, alignment and correction can be performed for each projection module 7B, allowing for more accurate exposure.

[0103] (8) In the above embodiment, a plurality of measurement systems are provided at intervals in a non-scanning direction intersecting with the scanning direction. The measurement systems include a first measurement system capable of measuring alignment marks 12 on substrate 10 transported with the exposure direction of the first exposure pattern parallel to the scanning direction, and a second measurement system capable of measuring alignment marks 12 on substrate 10 transported with the exposure direction of the first exposure pattern intersecting with the scanning direction.

[0104] (9) In the above embodiment, a receiving unit is provided that receives information about an exposure machine that performs overlay exposure on the substrate 10 exposed with the second exposure pattern. The data generating unit is capable of correcting the control data based on the information.

[0105] (10) Furthermore, in the above embodiment, the data generation unit can correct the control data based on information regarding the positioning of the alignment microscope of the exposure machine, so as to form the alignment mark 12 on the substrate 10 at a position where it can be observed by the alignment microscope.

[0106] (11) In the above embodiment, the data generating unit can correct the control data so that the alignment mark 12 is formed on the substrate 10 at a position that can be observed by either the measurement system or the alignment microscope.

[0107] (12) In the above embodiment, the measurement system has a third measurement system and a fourth measurement system arranged at a predetermined interval in a non-scanning direction that intersects the scanning direction, and the third measurement system and the fourth measurement system are capable of changing the predetermined interval and moving to a position where alignment mark 12 can be measured.

[0108] (13) In the above embodiment, the exposure unit 20 includes a spatial light modulator 75 having a plurality of elements, the plurality of elements being controlled according to an exposure pattern, an illumination module 7A (illumination optical system) that illuminates the spatial light modulator 75, and a projection module (projection optical system) that projects an image of the spatial light modulator 75 onto the substrate 10, a data generation unit that generates control data to control the plurality of elements according to the exposure pattern, and a receiving unit that receives information related to an exposure machine that performs overlay exposure on the substrate 10 exposed with the exposure pattern. The data generation unit corrects the control data based on the information.

[0109] (14) In the above embodiment, the method includes exposing the substrate 10 using the exposure apparatus 1 according to any one of (1) to (13), and developing the exposed substrate 10.

[0110] With this configuration, by developing the substrate 10 exposed using the exposure apparatus 1, it is possible to manufacture a device in which unevenness phenomena such as moire are reduced.

[0111] (15) In the above embodiment, the method includes exposing a substrate 10 for a flat panel display using the exposure apparatus 1 described in any one of claims (1) to (13), and developing the exposed substrate 10.

[0112] With this configuration, by developing the substrate 10 exposed using the exposure apparatus 1, it is possible to manufacture a flat panel display in which unevenness phenomena such as moire are reduced.

[0113] Although one embodiment of the present invention has been described in detail above with reference to the drawings, the specific configuration is not limited to the above, and various design changes, etc. are possible within the scope that does not deviate from the gist of the present invention. [Explanation of symbols]

[0114] 1... exposure apparatus, 2... exposure apparatus main body, 3... substrate exchange unit, 4... substrate stage, 5... alignment system, 5A... first alignment system, 5B... second alignment system, 6... light source unit, 7... illumination and projection module, 7A... illumination module (illumination optical system), 7B... projection module (projection optical system), 8... mask exposure machine, 10... substrate, 11... base plate, 20... exposure unit, 21... optical surface plate, 22... column, 23... autofocus system, 61... light source, 75... spatial light modulator, X1... first direction, X2... second direction, X3... third direction

Claims

1. An exposure apparatus that exposes a substrate, on which a first exposure pattern has been exposed, by moving the substrate in a scanning direction and then exposing the substrate to a second exposure pattern in an overlapping manner, comprising: an exposure unit including a spatial light modulator having a plurality of elements, the plurality of elements being controlled in accordance with an exposure pattern, an illumination optical system for illuminating the spatial light modulator, and a projection optical system for projecting an image of the spatial light modulator onto the substrate; a data generating unit that generates control data for controlling the plurality of elements in accordance with the second exposure pattern; a measurement system that measures a mark exposed together with the first exposure pattern before the second exposure pattern is exposed onto the substrate by the exposure unit; a control unit that controls at least one of the projection optical system, the spatial light modulator, and the data generation unit according to a measurement result of the mark by the measurement system, and controls a projection position on the substrate by the projection optical system; a receiving unit that receives information about an exposure machine that performs overlay exposure on the substrate exposed with the second exposure pattern, the information being arrangement information about an arrangement of an alignment microscope of the exposure machine; the data generating unit corrects the control data based on the arrangement information so as to form an alignment mark on the substrate at a position where the alignment microscope can observe the alignment mark; the exposure unit is provided in plurality, and exposes the second exposure pattern, which is divided into a plurality of portions, onto the substrate, respectively; The control unit controls the projection position for each of the exposure units.

2. 2. The exposure apparatus according to claim 1, wherein the control unit controls the data generation unit and corrects the control data based on the measurement result.

3. 3. The exposure apparatus according to claim 1, wherein the control unit moves the spatial light modulator relatively with respect to illumination light of the illumination optical system that illuminates the spatial light modulator.

4. The exposure apparatus according to claim 1 , wherein the control unit moves a portion of an optical element in the projection optical system.

5. 3 . The exposure apparatus according to claim 1 , further comprising: a substrate stage capable of holding the substrate transported in an orientation in which the exposure direction of the first exposure pattern and the scanning direction are substantially parallel to each other.

6. An exposure apparatus that exposes a substrate, on which a first exposure pattern has been exposed, by moving the substrate in a scanning direction and then exposing the substrate to a second exposure pattern in an overlapping manner, comprising: an exposure unit including a spatial light modulator having a plurality of elements, the plurality of elements being controlled in accordance with an exposure pattern, an illumination optical system for illuminating the spatial light modulator, and a projection optical system for projecting an image of the spatial light modulator onto the substrate; a data generating unit that generates control data for controlling the plurality of elements in accordance with the second exposure pattern; a substrate stage that holds the substrate transported in a direction in which an exposure direction of the first exposure pattern and the scanning direction intersect; a measurement system that measures a mark exposed together with the first exposure pattern before the second exposure pattern is exposed onto the substrate by the exposure unit; a drive unit that moves the substrate stage relative to the exposure unit in the scanning direction, and exposes the second exposure pattern so as to be superimposed on the first exposure pattern in accordance with a measurement result of the mark by the measurement system; a receiving unit that receives information about an exposure machine that performs overlay exposure on the substrate exposed with the second exposure pattern, the information being arrangement information about an arrangement of an alignment microscope of the exposure machine; The data generation unit corrects the control data based on the arrangement information so as to form an alignment mark on the substrate at a position where the alignment microscope can observe.

7. The exposure apparatus according to claim 6 , wherein the exposure unit is provided in plurality, and exposes the second exposure pattern, which is divided into a plurality of parts, onto the substrate, respectively.

8. a plurality of the measurement systems are provided at intervals in a non-scanning direction intersecting the scanning direction; 8. The exposure apparatus according to claim 6, wherein the measurement system comprises: a first measurement system capable of measuring the mark on the substrate transported in a direction in which the exposure direction of the first exposure pattern is parallel to the scanning direction; and a second measurement system capable of measuring the mark on the substrate transported in a direction in which the exposure direction of the first exposure pattern intersects the scanning direction.

9. 7. The exposure apparatus according to claim 6, wherein the data generation unit corrects the control data so that an alignment mark is formed on the substrate at a position that can be observed by either the measurement system or the alignment microscope.

10. the measurement system includes a third measurement system and a fourth measurement system that are provided at a predetermined interval in a non-scanning direction that intersects with the scanning direction, 8. The exposure apparatus according to claim 1, wherein the third measurement system and the fourth measurement system are capable of changing the predetermined interval and moving to a position where the mark can be measured.

11. an exposure unit including a spatial light modulator having a plurality of elements, the plurality of elements being controlled in accordance with an exposure pattern, an illumination optical system for illuminating the spatial light modulator, and a projection optical system for projecting an image of the spatial light modulator onto a substrate; a data generating unit that generates control data for controlling the plurality of elements in accordance with the exposure pattern; a receiving unit for receiving information about an exposure machine that performs overlay exposure on the substrate on which the exposure pattern has been exposed, the information being about a position of an alignment microscope of the exposure machine; The data generation unit corrects the control data based on the placement information so as to form an alignment mark on the substrate at a position where the alignment microscope can observe the alignment mark.

12. exposing the substrate using an exposure apparatus according to any one of claims 1 to 11; and developing the exposed substrate.

13. Exposing the substrate for a flat panel display using the exposure apparatus according to any one of claims 1, 2, 6, 7 and 11; and developing the exposed substrate.

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