Sensors with multiple circuit boards

Abstract

To provide a sensor capable of housing a plurality of circuit boards in compact.SOLUTION: A sensor comprises: a rigid-flexible substrate 3 that contains a first rigid substrate 31 and a second rigid substrate 32, onto which an electron component 39 used for sensing is mounted, and folds the second rigid substrate 32 to the first rigid substrate 31 so as to be opposite at 180 degrees; a flat-shaped bottom wall 22; a column-like first projection part 44 that is projected from the bottom wall 22; and a base member 4 that contains a second projection part 45 and a third projection part 46. The first rigid substrate 31 is fixed to a first installation surface S1 formed to the bottom wall 22, and the second rigid substrate 32 is fixed to a second installation surface S2 formed over a tip end part of the first projection part 44, the second projection part 45, and the third projection part 46.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to a sensor having multiple circuit boards. [Background technology]

[0002] The housing of a sensor such as an optical sensor contains optical components such as lenses as well as a circuit board on which electronic circuits that realize the functions of the sensor are mounted. When configuring a highly functional sensor that can detect various workpieces, the size of the circuit board becomes large in order to perform complex processing. Instead of increasing the size of the housing to fit the circuit board, the circuit board may be divided into smaller pieces that can be accommodated in the housing and placed in the housing in smaller pieces.

[0003] However, arranging multiple circuit boards in parallel increases the thickness of the mounting space for the circuit boards. For a given housing size, the thinner the mounting space for the circuit boards, the larger the lens that can be mounted, improving optical performance. To miniaturize sensors and improve their performance, there is a demand to make the mounting space for the circuit boards as thin as possible.

[0004] Patent Document 1 discloses a photoelectric sensor in which two circuit boards are arranged perpendicular to each other instead of parallel to each other. The first circuit board, a wiring board, is arranged along the cover that constitutes the right side. The second circuit board, an input / output mounting board, is arranged along the upper surface that is perpendicular to the cover. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2007-73417 A Summary of the Invention [Problem to be solved by the invention]

[0006] However, since the top surface is narrower than the right side surface, the size of the circuit board that can be placed is limited. Therefore, an object of the present invention is to provide a sensor that can accommodate multiple circuit boards in a compact manner. [Means for solving the problem]

[0007] A sensor according to an embodiment of the present disclosure includes a base member having a first mounting surface and a second mounting surface parallel to the first mounting surface, a first rigid board fixed to the first mounting surface, and a second rigid board fixed to the second mounting surface. An electronic component used for sensing is mounted across the first rigid board and the second rigid board. The base member includes a columnar first protrusion, a second protrusion, and a third protrusion protruding from the first mounting surface. The second mounting surface is formed at the tip of the first protrusion, the second protrusion, and the third protrusion. The first protrusion includes a fourth pin protruding from the second mounting surface and inserted into the second rigid board, and the second protrusion includes a fifth pin protruding from the second mounting surface and inserted into the second rigid board. Three ribs are formed on the periphery of the fourth pin, and are arranged so that the positions of the fourth pin and the fourth pin form an angle of less than 180 degrees. Two ribs are formed on the peripheral surface of the fifth pin, protruding along a fourth straight line that is perpendicular to a third straight line connecting the fourth pin and the fifth pin.

[0008] According to this embodiment, the second rigid board can be precisely positioned by the positioning pin having ribs formed on its circumferential surface. More specifically, the second installation surface is defined by at least three support parts. On the second installation surface, all movements of the second rigid board are restricted by a fourth pin having three ribs formed thereon with a cross angle of less than 180 degrees, except for rotational movement about the fourth pin. Furthermore, the second rigid board is also restricted from rotational movement about the fourth pin by a fifth pin having two ribs protruding in the tangential direction of the rotation. Since the first rigid board and the second rigid board can be precisely positioned via the base member so that the boards do not interfere with each other, multiple boards can be arranged as close as possible. Since the mounting space for the boards can be minimized, the housing can be made smaller. By increasing the size of the optical components, the optical performance can be improved. Cut.

[0009] In the above aspect, the base member may include a first fixing portion, a second fixing portion, and a third fixing portion for fixing the first rigid substrate, the first fixing portion including a first pin protruding from the first mounting surface and inserted into the first rigid substrate, the second fixing portion including a second pin protruding from the first mounting surface and inserted into the first rigid substrate, and the third fixing portion including a third pin protruding from the first mounting surface and inserted into the first rigid substrate, and three ribs are formed on the circumferential surface of the first pin and are arranged so that their positions form an angle of less than 180 degrees when viewed from the center of the first pin, and two ribs are formed on the circumferential surface of the second pin and protrude along a second straight line perpendicular to a first straight line connecting the first pin and the second pin.

[0010] According to this embodiment, the first rigid board can be positioned more precisely by the positioning pin having a rib formed on the peripheral surface. The multiple boards can be arranged as close as possible.

[0011] In the above embodiment, the first rigid substrate and the second rigid substrate may be part of the same rigid-flexible substrate, and the first rigid substrate and the second rigid substrate may be fixed to the base member by folding the rigid-flexible substrate 180 degrees so that the second rigid substrate faces the first rigid substrate.

[0012] According to this aspect, the first rigid board and the second rigid board can be connected by a flexible board that is configured as an integral structure with the first rigid board and the second rigid board. Compared to a case in which a connector is provided on each of the first rigid board and the second rigid board and the connectors are connected by a separate flexible board, the area of ​​the first rigid board and the second rigid board can be reduced by the amount of the connector.

[0013] In the above aspect, the device may further include a light projecting section and / or a light receiving section, and the light projecting section and / or the light receiving section may be fixed to the base member.

[0014] According to this aspect, the resin bracket that fixes the light projecting unit and / or the light receiving unit can be used as a base member for positioning the first rigid board and the second rigid board, allowing the first rigid board and the second rigid board to be precisely positioned without increasing the number of parts.

[0015] In the above embodiment, the second rigid board may be provided with a light receiving unit, and may be located farther from the light receiving unit than the first rigid board, the first rigid board may be implemented with a signal circuit for processing a signal from the light receiving unit, and the second rigid board may be implemented with a power supply circuit for supplying power to the electronic components.

[0016] According to this embodiment, the power circuit, through which a large current flows, and the delicate signal circuit are arranged in separate blocks. The second rigid board, which generates a large amount of heat, is arranged on the outer periphery of the housing, which is far from the light receiving unit and where heat can be easily dissipated, so the circuit board can be cooled efficiently.

[0017] In the above aspect, a recess that is recessed below the second installation surface may be formed around the fourth pin and the fifth pin.

[0018] According to this embodiment, when the pin is inserted into the second rigid board while compressing the rib to position it, the scraped-off resin debris from the rib is stored in the pocket of the recess formed around the pin, not between the second installation surface and the second rigid board, and the height of the second rigid board can be precisely positioned on the second installation surface.

[0019] A sensor according to an embodiment of the present disclosure includes a rigid-flexible substrate including a first rigid substrate and a second rigid substrate, and is folded 180 degrees so that the second rigid substrate faces the first rigid substrate, and a base member including a flat bottom wall and a columnar first protrusion, a second protrusion, and a third protrusion protruding from the bottom wall. The first rigid substrate is fixed to a first installation surface formed on the bottom wall, and the second rigid substrate is fixed to a second installation surface formed across the tips of the first protrusion, the second protrusion, and the third protrusion.

[0020] According to this embodiment, the rigid-flexible board is fixed to the base member in a compact state in which it is folded back 180 degrees, allowing multiple circuit boards to be housed in a compact space. Effect of the Invention

[0021] According to the present invention, it is possible to provide a sensor that can accommodate a plurality of circuit boards in a compact manner. [Brief description of the drawings]

[0022] [Figure 1] FIG. 1 is a perspective view showing an example of a sensor according to an embodiment of the present invention. [Diagram 2] FIG. 2 is a perspective view showing the internal structure of the sensor with the cover shown in FIG. 1 removed. [Diagram 3] FIG. 3 is a cross-sectional view taken along line III-III in FIG. [Figure 4] FIG. 4 is a perspective view showing the base member shown in FIG. 2 removed from the housing. [Diagram 5] FIG. 5 is a front view showing the light projecting section and the light receiving section shown in FIG. [Figure 6] FIG. 6 is a perspective view showing the base member from which the rigid-flexible board and the like have been removed. [Figure 7] FIG. 7 is a perspective view focusing on the first installation surface shown in FIG. [Figure 8] FIG. 8 is a perspective view focusing on the second installation surface shown in FIG. [Figure 9] 9 is an enlarged perspective view of a recess of the first pin shown in FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0023] A preferred embodiment of the present invention will be described with reference to the accompanying drawings. In each drawing, components with the same reference numerals have the same or similar configurations. Fig. 1 is a perspective view showing an example of a sensor 1 according to an embodiment of the present invention. Fig. 2 is a perspective view showing the internal structure of the sensor 1 with the cover 21 shown in Fig. 1 removed.

[0024] In the illustrated example, a photoelectric sensor equipped with at least one of a light projecting part that emits light and a light receiving part that receives light is disclosed as the sensor 1. The amount of light that reaches the light receiving part changes when the projected light is blocked or reflected by a workpiece. The photoelectric sensor detects this change, converts it into an electrical signal, and can output it to an external device.

[0025] However, the sensor 1 is not limited to a photoelectric sensor. The sensor 1 may be a displacement sensor that detects the amount of physical change in an object with an optical element and measures the distance from the sensor 1 to the object by calculating the amount of change into distance, or an image sensor that processes an image captured by a camera to calculate the area, center of gravity, length, position, etc. of the object and output data or a determination result, or a code reader that reads a barcode or two-dimensional code. The sensor 1 is not limited to an optical sensor such as a photoelectric sensor, displacement sensor, image sensor, or code reader, and may be another type of sensor.

[0026] In the illustrated example, the sensor 1 is configured as a diffuse reflection type photoelectric sensor, incorporates a light-projecting unit 11, a light-receiving unit 12, a signal processing unit, a control unit, an output unit, a power supply unit, and the like used for sensing, and is connected to an external power supply and a control device via a cable 16. Note that the sensor 1 may be configured as a transmission type or a recursive reflection type photoelectric sensor, with the light-projecting unit 11 and the light-receiving unit 12 housed in separate housings 2, 2. It may also be configured as a photoelectric sensor with a built-in power supply, in which an external power supply that supplies power to the power supply unit is built into the housing 2.

[0027] The housing 2 is made of a metal material such as stainless steel or zinc die-casting, except for a detection surface 24 on which the light-emitting unit 11 and the light-receiving unit 12 are provided, and an operation unit 15 through which the user inputs operations to the sensor 1. However, the material of the housing 2 is not limited to a metal material. For example, the housing 2 may be made of a resin material such as polybutylene terephthalate resin or ABS resin. The detection surface 24 is covered by a cover lens made of a light-transmitting material such as methacrylic resin or glass. The operation unit 15 is provided with operation buttons and a display panel.

[0028] The housing 2 includes a case body 20 formed in a substantially rectangular cup shape, and a lid body 21 that covers an opening of the case body 20. The case body 20 includes a bottom wall 22 and a peripheral wall 23 that stands from the bottom wall 22 and extends toward the lid body 21. In the housing 2, the bottom wall 22 is located on the opposite side to the lid body 21.

[0029] 3 is a cross-sectional view taken along line III-III in FIG. 2. A plurality of rigid boards 31, 32, ... arranged in parallel are housed in the housing 2. In the illustrated example, two rigid boards 31, 32 arranged in parallel are housed in the housing 2. Although not illustrated, three or more rigid boards arranged in parallel may be housed in the housing 2. The second rigid board 32 is disposed along the cover 21 of the housing 2. The first rigid board 31 is disposed in parallel to the second rigid board 32.

[0030] The first rigid substrate 31 is formed in a hard, flat plate shape having a first surface 31A and a second surface 31B opposite the first surface 31A. Similarly, the second rigid substrate 32 is formed in a hard, flat plate shape having a first surface 32A and a second surface 32B opposite the first surface 32A. The adjacent rigid substrates 31 and 32 are disposed such that the first surfaces 31A and 32A face each other.

[0031] The first rigid substrate 31 has electronic components 39 mounted on both surfaces 31A and 31B. Similarly, the second rigid substrate 32 has electronic components 39 mounted on both surfaces 32A and 32B. Note that the electronic components 39 may be mounted on only one of the first and second surfaces 31A and 31B, or the electronic components 39 may be mounted on only one of the first and second surfaces 32A and 32B.

[0032] The electronic components 39 constitute, for example, the signal processing section and power supply section described above. More specifically, the first rigid board 31 is mounted with a signal circuit 13 that processes a signal from the light receiving section, and constitutes the signal processing section. The second rigid board 32 is mounted with, in addition to the signal circuit 13, a power supply circuit 14 that supplies power received from an external power source to the electronic circuit, and constitutes the power supply section.

[0033] In the illustrated example, the size of first rigid board 31 is smaller than that of second rigid board 32. In a portion where second rigid board 32 does not face first rigid board 31, second rigid board 32 is provided with ground member 17 (shown in FIG. 2) penetrating second rigid board 32. Ground member 17 of second rigid board 32, through which a large current flows, can be disposed so as not to interfere with first rigid board 31. Since there is no need to extend wiring to bypass first rigid board 31 and connect it to ground member 17, the mounting space for ground member 17 can be made compact.

[0034] In the illustrated example, the first rigid substrate 31 and the second rigid substrate 32 are part of the same rigid-flexible substrate 3. The rigid-flexible substrate 3 further includes a flexible substrate 33 that connects the first rigid substrate 31 and the second rigid substrate 32. The rigid-flexible substrate 3 is folded back 180 degrees with the flexible substrate 33 as a bent portion so that the first rigid substrate 31 and the second rigid substrate 32 face each other.

[0035] The rigid-flexible substrate 3 has a first surface (31A, 32A) and a second surface (31B, 32B) opposite to the first surface (31A, 32A). The first surfaces 31A, 32A of the first rigid substrate 31 and the second rigid substrate 32 are defined on the first surface (31A, 32A) of the rigid-flexible substrate 3. Similarly, the second surfaces 31B, 32B of the first rigid substrate 31 and the second rigid substrate 32 are defined on the second surface (31B, 32B) of the rigid-flexible substrate 3.

[0036] At least one of the light projecting unit 11 and the light receiving unit 12 is housed in the space between the bottom wall 22 and the first rigid board 31. The second rigid board 32 is located farther from the light receiving unit 12 than the first rigid board 31. If the size of the housing 2 is the same, the thinner the mounting space of the first rigid board 31 and the second rigid board 32, the larger the lens that can be mounted, and the better the optical performance of the light projecting unit 11 and / or the light receiving unit 12. The light projecting unit 11 and / or the light receiving unit 12 are fixed to a base member 4 formed from a resin material or the like.

[0037] Fig. 4 is a perspective view showing the base member 4 shown in Fig. 2 taken out from the housing 2. As shown in Fig. 4, the light projecting unit 11 and / or the light receiving unit 12, the first rigid board 31 and the second rigid board 32 are attached to the base member 4. The base member 4 includes a bottom wall 40 on which a first installation surface S1 (shown in Fig. 7) is formed, and a plurality of bosses 44, 45, 46 (at least three, four in the illustrated example) protruding from the first installation surface S1. The second rigid board 32 is fixed to the second installation surface S2 formed at the tip of the boss. The bosses 44, 45, 46 are examples of protruding parts.

[0038] The shape of the bosses 44, 45, 46 may be cylindrical, prismatic, substantially truncated cone, or substantially truncated pyramid. The protrusion is not limited to a boss formed in a columnar or substantially truncated cone shape, and the tip of a side wall standing up from the bottom wall 40 may be configured as the protrusion, or the side wall may be formed in a stepped shape to form a step portion as the protrusion.

[0039] Fig. 5 is a front view showing the light-projecting unit 11 and the light-receiving unit 12 shown in Fig. 4. As shown in Fig. 5, the bottom wall 40 of the base member 4 is formed in a flat plate shape extending along the light-projecting unit 11 and / or the light-receiving unit 12. The bottom wall 40 has a first surface 40A facing the light-projecting unit 11 and / or the light-receiving unit 12, and a second surface 40B opposite to the first surface 40A. The second surface 40B is formed as a first installation surface S1 to which the first rigid board 31 is fixed.

[0040] Fig. 6 is a perspective view showing the base member 4 from which the rigid-flexible substrate 3 and the like have been removed. As shown in Fig. 6, the second installation surface S2 formed across the tips of the multiple bosses 44, 45, 46 is formed parallel to the second surface 40B of the bottom wall 40 and the first installation surface S1 on the extension thereof.

[0041] FIG. 7 is a perspective view focusing on the first installation surface S1 shown in FIG. 6. A plurality of fixing portions to which the first rigid substrate 31 is fixed are provided on the second surface 40B of the bottom wall 40 constituting the first installation surface S1. In the illustrated example, three fixing portions are provided: a first fixing portion 41, a second fixing portion 42, and a third fixing portion 43. The first fixing portion 41 includes a first pin P1 that protrudes from the first installation surface S1 and is inserted into the first rigid substrate 31. Similarly, the second fixing portion 42 includes a second pin P2 that protrudes from the first installation surface S1 and is inserted into the first rigid substrate 31. The third fixing portion 43 includes a third pin P3 that protrudes from the first installation surface S1 and is inserted into the first rigid substrate 31.

[0042] Three ribs (a first rib R1, a second rib R2, and a third rib R3) are formed on the circumferential surface of the first pin P1, protruding in the radial direction of the first pin P1 and extending in the axial direction. The three ribs R1, R2, and R3 are arranged so that their positions form angles of less than 180 degrees when viewed from the center of the first pin P1.

[0043] In the illustrated example, three ribs R1, R2, R3 are formed at approximately equal intervals in the circumferential direction of the first pin P1, and when viewed from the center of the first pin P1, the first rib R1 and the second rib R2 form an angle of 120 degrees, the second rib R2 and the third rib R3 form an angle of 120 degrees, and the third rib R3 and the first rib R1 form an angle of 120 degrees.

[0044] The three ribs do not necessarily have to be spaced equally apart. If the angle between the first rib R1 and the second rib R2 is a first angle, the angle between the second rib R1 and the third rib R3 is a second angle, and the angle between the third rib R3 and the first rib R1 is a third angle, then the three ribs may be arranged such that the first angle is slightly smaller than 180 degrees and the sum of the second angle and the third angle is slightly larger than 180 degrees. Each angle is preferably 90 degrees or more.

[0045] Two ribs (fourth rib R4 and fifth rib R5) are formed on the circumferential surface of the second pin P2, protruding in the radial direction of the second pin P2 and extending in the axial direction. The fourth rib R4 protrudes along a second straight line L2 perpendicular to a first straight line L1 connecting the first pin P1 and the second pin P2. The fifth rib R5 protrudes along the second straight line L2 to the opposite side to the fourth rib R4. No ribs are formed on the circumferential surface of the third pin P3. When the number of fixing parts is four or more, the number of third pins P3 (third fixing parts 43) on which no ribs are formed increases.

[0046] FIG. 8 is a perspective view focusing on the second mounting surface S2 shown in FIG. 6. The base member 4 includes a first boss 44 having a fourth pin P4, a second boss 45 having a fifth pin P5, and at least one third boss 46. In the illustrated example, the base member 4 includes two third bosses 46. As described above, the tip of each of the bosses 44, 45, 46 is formed with a second mounting surface S2 to which the second rigid substrate 32 is fixed. The fourth pin P4 of the first boss 44 protrudes from the second mounting surface S2 and is inserted into the second rigid substrate 32. Similarly, the fourth pin P5 of the second boss 45 protrudes from the second mounting surface S2 and is inserted into the second rigid substrate 32.

[0047] On the circumferential surface of the fourth pin P4, three ribs (a sixth rib R6, a seventh rib R7, and an eighth rib R8) are formed, which protrude in the radial direction of the fourth pin P4 and extend in the axial direction, similar to the first pin P1. More specifically, the three ribs R6, R7, and R8 are arranged so that the positions of the three ribs R6, R7, and R8 as viewed from the center of the fourth pin P4 form an angle of less than 180 degrees. In the illustrated example, the three ribs R6, R7, and R8 are formed at approximately equal intervals in the circumferential direction of the fourth pin P4, and are arranged so that the sixth rib R6 and the seventh rib R7 form an angle of 120 degrees, the seventh rib R7 and the eighth rib R8 form an angle of 120 degrees, and the eighth rib R8 and the sixth rib R6 form an angle of 120 degrees, as viewed from the center of the fourth pin P4. The positional relationship of the three ribs does not necessarily have to be equal intervals.

[0048] Similar to the second pin P2, the fifth pin P5 has two ribs (ninth rib R9 and tenth rib R10) formed on its peripheral surface, which protrude radially from the fifth pin P5 and extend in the axial direction. More specifically, the ninth rib R9 protrudes along a fourth straight line L4 perpendicular to the third straight line L3 connecting the fourth pin P4 and the fifth pin P5. The tenth rib R10 protrudes along the fourth straight line L4 to the opposite side to the ninth rib R9. The third boss 46 has a screw hole formed therein instead of a pin.

[0049] With the second surface 31B of the first rigid substrate 31 in contact with the first installation surface S1, the pins P1, P2, and P3 are heated and pressurized, thereby fixing the first rigid substrate 31 to the first installation surface S1 by thermal caulking. With the first surface 32A of the second rigid substrate 32 in contact with the second installation surface S2, the second rigid substrate 32 is screwed to the third boss 46 and the pins P4 and P5 are thermally caulked, thereby fixing the second rigid substrate 32 to the second installation surface S2.

[0050] 9 is an enlarged perspective view of the recess 47 of the first pin P1 shown in FIG. 7. As shown in FIG. 9, the recess 47 is formed adjacent to the ribs R1, R2, and R3 around the first pin P1 and recessed from the first installation surface S1. Similarly, the recess 47 is formed adjacent to the ribs R4 and R5 around the second pin P2 and recessed from the first installation surface S1. The recess 47 is formed adjacent to the ribs R4 and R5 around the fourth pin P4 and the fifth pin P5 and recessed from the second installation surface S2. Note that the recess 47 may be adjacent to the ribs R1, R2, and R3 to an extent that the scraped-off resin debris from the ribs can be accommodated.

[0051] According to the sensor 1 of this embodiment configured as described above, the second rigid board 32 can be precisely positioned by the positioning pins P4 and P5 having ribs R6, R7, R8, R9, and R10 formed on the peripheral surface. Since the first rigid board 31 and the second rigid board 32 can be precisely positioned via the base member 4 so that the boards do not interfere with each other, multiple boards can be arranged as close as possible. Since the mounting space for the boards can be minimized, the housing can be made smaller. The optical components can be enlarged to improve optical performance.

[0052] If positioning pins P4 and P5 with ribs R1, R2, R3, R4, and R5 formed on the periphery are provided not only on the second installation surface S2 but also on the first installation surface S1, the first rigid board 31 can be positioned more precisely and multiple boards can be arranged as close as possible. Since the rigid-flexible board 3 is fixed to the base member 4 in a compact state folded back 180 degrees, multiple rigid boards 31 and 32 can be accommodated compactly within the housing 2. It is also possible to divide the rigid-flexible board 3 at the boundary between the first rigid board 31 and the second rigid board 32 and connect them by a connector or the like.

[0053] The above-described embodiment is intended to facilitate understanding of the present invention, and is not intended to limit the present invention. The elements of the embodiment, as well as their arrangement, materials, conditions, shapes, sizes, etc., are not limited to those exemplified, and can be changed as appropriate. In addition, configurations shown in different embodiments can be partially replaced or combined. A part or all of this embodiment can be described as follows, but is not limited to the following.

[0054] [Note] A base member (4) having a first installation surface (S1) and a second installation surface (S2) parallel to the first installation surface; A first rigid substrate (31) fixed to the first installation surface; a second rigid substrate (32) fixed to the second installation surface; The base member includes a bottom wall (40) on which the first installation surface is formed, and a columnar first protrusion (44), a second protrusion (45), and a third protrusion (46) protruding from the bottom wall, The second installation surface is formed on tip ends of the first protrusion, the second protrusion, and the third protrusion, the first protrusion includes a fourth pin (P4) protruding from the second mounting surface and inserted into the second rigid board; the second protrusion includes a fifth pin (P5) protruding from the second mounting surface and inserted into the second rigid board; Three ribs (R6, R7, R8) are formed on the circumferential surface of the fourth pin so that each rib forms an angle of less than 180 degrees when viewed from the center of the fourth pin, Two ribs (R9, R10) are formed on the peripheral surface of the fifth pin and protrude along a fourth straight line (L4) perpendicular to a third straight line (L3) connecting the fourth pin and the fifth pin. Sensor(1). [Explanation of symbols]

[0055] 1...sensor, 2...housing, 3...rigid-flexible board, 4...base member, 11...light-emitting section, 12...light-receiving section, 13...signal circuit, 14...power supply circuit, 15...operation section, 16...cable, 17...earth member, 20...case body, 21...lid, 22...bottom wall, 23...periphery, 24 detection surface, 31...first rigid board, 32...second rigid board, 31A, 32A...first surface, 31B, 32B...second surface , 33...flexible circuit board, 39...electronic component, 40...bottom wall, 41...first fixing portion, 42...second fixing portion, 43...third fixing portion, 44...first boss (an example of a first protrusion), 45...second boss (an example of a second protrusion), 46...third boss (an example of a third protrusion), L1...first straight line, L2...second straight line, L3...third straight line, L4...fourth straight line, R1-R10...rib, S1...first mounting surface, S2...second mounting surface.

Claims

1. a rigid-flexible substrate including a first rigid substrate and a second rigid substrate on which electronic components used for sensing are mounted, the rigid-flexible substrate being folded back by 180 degrees so that the second rigid substrate faces the first rigid substrate; a base member including a flat bottom wall and a columnar first protrusion, a second protrusion, and a third protrusion protruding from the bottom wall; the first rigid substrate is fixed to a first mounting surface formed on the bottom wall, the second rigid substrate is fixed to a second installation surface formed across the tip portions of the first protruding portion, the second protruding portion, and the third protruding portion; Sensor.

2. Further comprising a light projecting unit and / or a light receiving unit, The base member fixes the light projecting unit and / or the light receiving unit. The sensor of claim 1 .

3. The light receiving unit is provided, the second rigid substrate is located farther from the light receiving unit than the first rigid substrate, a signal circuit that processes a signal from the light receiving unit is mounted on the first rigid board; A power supply circuit that supplies power to electronic components is mounted on the second rigid board. The sensor of claim 2.

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