Exposure apparatus, article manufacturing method, and stage apparatus

Abstract

To provide an exposure apparatus advantageous for achieving both exposure accuracy and productivity.SOLUTION: An exposure apparatus that exposes a substrate while scanning an original plate and the substrate includes a substrate stage that holds and moves the substrate, and a control unit that controls movement of the substrate stage according to a drive profile that defines movement of the substrate stage. and the driving profile includes a first profile that is a driving profile in a non-exposure section and a second profile that is a driving profile in an exposure section next to the non-exposure section, in which the first profile is defined such that a maximum acceleration higher than the maximum acceleration of the substrate stage controlled according to a reference drive profile having a sinusoidal shape in a total section containing the non-exposure section and the exposure section appears the non-exposure section.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to an exposure apparatus. ,thing Product manufacturing method , and stage equipment Regarding. [Background technology]

[0002] Currently, in exposure apparatuses, which are semiconductor device manufacturing apparatuses, scanning exposure apparatuses that expose a mask and a wafer while scanning them with respect to an optical system are mainstream. In exposure apparatuses, there is a demand for improving productivity as well as exposure accuracy and overlay accuracy. Until now, the exposure time has been shortened and productivity has been improved by improving the acceleration and speed during stage driving. However, since improving the acceleration and speed reduces the accuracy of stage control, there is a limit to the improvement of productivity with conventional constant speed exposure. In response to this problem, Patent Document 1 discloses a technology for performing exposure even in an acceleration / deceleration section. When performing exposure during acceleration / deceleration, it has also been proposed to change the amount of energy of illumination in proportion to the stage speed in order to maintain a constant amount of exposure per unit area irradiated on the wafer (hereinafter also referred to as "DOSE amount"), as in Patent Document 2. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2012-142463 A [Patent Document 2] JP 2002-373839 A Summary of the Invention [Problem to be solved by the invention]

[0004] When changing the stage speed within the exposure area, in order to keep the DOSE amount constant, it is necessary to change the amount of energy of the illumination according to the speed, but there is a limit to the amount of change that can be made. If a sine wave profile is determined within a range that can accommodate speed changes, the values ​​of the amplitude and angular velocity of the profile become small, so the stage drive section (hereinafter referred to as the "non-exposure section") connecting adjacent exposure areas becomes long, which may reduce productivity. In order to improve productivity, it is desirable to increase the values ​​of the amplitude and angular velocity of the profile to shorten the non-exposure section, but at that time the change in the amount of energy of the illumination within the exposure area becomes large, so the DOSE amount cannot be kept constant and the exposure accuracy may decrease.

[0005] The present invention provides, for example, an exposure apparatus that is advantageous in achieving both exposure accuracy and productivity. [Means for solving the problem]

[0006] According to one aspect of the present invention, there is provided an exposure apparatus that exposes a substrate while scanning an original and a substrate, the exposure apparatus comprising: a substrate stage that holds and moves the substrate; Drive a control unit that controls the movement of the substrate stage in accordance with a driving profile, the driving profile including a first profile that is a driving profile in a non-exposure section and a second profile that is a driving profile in an exposure section following the non-exposure section, The profile of the acceleration included in the second profile is a profile including a sine wave, and the profile of the acceleration included in the first profile includes a second acceleration that is greater than a first acceleration that is the acceleration of the maximum amplitude of the sine wave. An exposure apparatus is provided, comprising: Effect of the Invention

[0007] According to the present invention, for example, it is possible to provide an exposure apparatus that is advantageous in achieving both exposure accuracy and productivity. [Brief description of the drawings]

[0008] [Figure 1] FIG. 1 is a schematic diagram showing a configuration of an exposure apparatus. [Diagram 2] 6 is a diagram showing the relationship between a non-exposure driving profile and an exposure driving profile. [Diagram 3]5A and 5B are diagrams for explaining a connection between a non-exposure driving profile and an exposure driving profile. [Figure 4] 13A and 13B are diagrams for explaining a modified example of the connection between the non-exposure driving profile and the exposure driving profile. [Diagram 5] 13 is a diagram showing an example in which the jerk does not match at the connection point between the non-exposure drive profile and the exposure drive profile, resulting in a large positioning error. [Figure 6] 13A and 13B are diagrams for explaining an example of matching the jerk at a connection point between a non-exposure driving profile and an exposure driving profile. [Figure 7] 6 is a diagram showing the relationship between a non-exposure driving profile and an exposure driving profile. [Figure 8] 13A and 13B are diagrams for explaining adjustment of the acceleration profile so that the acceleration profile immediately before the start of exposure becomes gentle. [Figure 9] 4A and 4B are diagrams showing examples of a shot layout of a substrate and a trajectory of movement of a substrate stage. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] Hereinafter, the embodiments will be described in detail with reference to the attached drawings. Note that the following embodiments do not limit the invention according to the claims. Although the embodiments describe a number of features, not all of these features are essential to the invention, and the features may be combined in any manner. Furthermore, in the attached drawings, the same reference numbers are used for the same or similar configurations, and duplicated descriptions are omitted.

[0010] First Embodiment FIG. 1 is a schematic diagram of an exposure apparatus 100 in an embodiment. In this specification and the drawings, directions are shown in an XYZ coordinate system with a horizontal plane as the XY plane. In general, a substrate 104, which is a substrate to be exposed, is placed on a substrate stage 105 so that its surface is parallel to the horizontal plane (XY plane). Therefore, in the following, the X-axis and Y-axis are taken as directions perpendicular to each other in a plane along the surface of the substrate 104, and the Z-axis is taken as a direction perpendicular to the X-axis and Y-axis. In the following, the directions parallel to the X-axis, Y-axis, and Z-axis in the XYZ coordinate system are respectively referred to as the X-direction, the Y-direction, and the Z-direction, and the rotation direction around the X-axis, the rotation direction around the Y-axis, and the rotation direction around the Z-axis are respectively referred to as the θx-direction, the θy-direction, and the θz-direction.

[0011] The exposure apparatus 100 transfers a pattern of a mask 102, which is an original, onto the substrate 104 while scanning the mask 102 and the substrate 104. In one example, the exposure apparatus 100 is a step-and-scan type exposure apparatus (scanner) that has an exposure region in the shape of a rectangular or arc slit and relatively scans the mask 102 and the substrate 104 to expose a large angle of view with high precision. As shown in FIG. 1, the exposure apparatus 100 may have a projection optical system 101, a mask stage 103 and a substrate stage 105 as positioning devices, an illumination optical system 106, and a main controller 111.

[0012] 1, the optical axis AX of the projection optical system 101 extends in the Z direction, and the image plane of the projection optical system 101 exists on a plane perpendicular to the Z direction (i.e., the XY plane). The mask 102 is held on a mask stage 103. The pattern of the mask 102 is projected at a magnification of the projection optical system 101 (for example, 1 / 4, 1 / 2, 1 / 5), and an image is formed on the image plane of the projection optical system 101.

[0013] The substrate 104 is, for example, a wafer coated with a resist (photosensitive agent) on its surface. A plurality of shot areas having the same pattern structure formed in a previous exposure process are arranged on the substrate 104. The substrate stage 105 is a stage that holds and moves the substrate 104, and may have a chuck that fixes the substrate 104 by adsorbing it. The substrate stage 105 may also include an XY stage that can move in the X direction and the Y direction, and a Z stage that can move in the Z direction (height direction of the substrate 104) parallel to the optical axis AX of the projection optical system 101. The substrate stage 105 may also include a leveling stage that can rotate (tilt) in the θx direction and the θy direction, and a rotation stage that can rotate in the θz direction. In this way, the substrate stage 105 may constitute a six-axis drive system for matching the image of the pattern of the mask 102 with the shot area of ​​the substrate 104. The positions of the substrate stage 105 in the X direction, the Y direction, and the Z direction are constantly measured by a bar mirror 108 and an interferometer 110 arranged on the substrate stage 105.

[0014] The mask 102 is held by a mask stage 103. The mask stage 103 is scanned in the Y direction (the direction of arrow 103a) within a plane perpendicular to the optical axis AX of the projection optical system 101. At this time, the mask stage 103 is scanned (correctively driven) so that the position of the mask stage 103 in the Y direction is always maintained at a target position. The positions of the mask stage 103 in the X and Y directions are always measured by a bar mirror 107 and an interferometer 109 arranged on the mask stage 103.

[0015] The illumination optical system 106 may include a light source that emits light for exposing the substrate 104. The light source may be a light source that generates pulsed light such as an excimer laser. The illumination optical system 106 uses light from the light source to illuminate the mask 102. The illumination optical system 106 includes a beam shaping optical system, an optical integrator, a collimator lens, a mirror, a masking blade, and the like, and efficiently transmits or reflects pulsed light in the far ultraviolet region. The beam shaping optical system shapes the cross-sectional shape (dimensions) of the incident light into a predetermined shape. The optical integrator uniformizes the light distribution characteristics to illuminate the mask 102 with uniform illuminance. The masking blade defines a rectangular illumination area corresponding to the chip size. The pattern of the mask 102 partially illuminated by such an illumination area is projected onto the substrate 104 via the projection optical system 101.

[0016] The main controller 111 includes a CPU, a memory, and the like, and controls each part of the exposure apparatus 100 in an integrated manner. The main controller 111 controls the mask stage 103 that holds the mask 102 and the substrate stage 105 that holds the substrate 104 in order to image the light from the pattern of the mask 102 on a predetermined area of ​​the substrate 104. For example, the main controller 111 adjusts the positions (positions in the X and Y directions, and rotation in the θz direction) and the positions in the Z direction (rotations in the θx and θy directions) of the mask 102 and the substrate 104 in the XY plane via the mask stage 103 and the substrate stage 105. The main controller 111 also scans the mask stage 103 and the substrate stage 105 in synchronization with the projection optical system 101. In this way, the main controller 111 controls an exposure process in which each shot area of ​​the substrate 104 is exposed in an exposure area while the substrate stage 105 scans the substrate 104.

[0017] When the mask stage 103 is scanned in the direction of the arrow 103a, the substrate stage 105 is scanned in the direction of the arrow 105a at a speed corrected according to the magnification (reduction magnification) of the projection optical system 101.

[0018] FIG. 9 is a diagram showing an example of the trajectory of the movement of the substrate stage 105 as the relative movement of the projection optical system 101 with respect to the substrate 104. FIG. 9 shows an arrangement (shot layout) of a plurality of shot areas of the substrate 104. The substrate 104 includes 64 shot areas. The numbers in each shot area indicate the number of the shot area, and the arrows in each shot area indicate the scanning movement direction of the substrate stage 105 during exposure. The dashed lines also roughly indicate the movement direction of the substrate stage 105 between the shot areas, and the exposure sequence for each shot area is shown. For example, with regard to the exposure of the shot area 1 and the shot area 2, the scanning exposure in the -Y direction is performed in the shot area 1, and then the step operation is performed on the left side of the figure until the exposure of the shot area 2 starts. After the step operation is completed, the scanning exposure in the +Y direction is performed in the shot area 2.

[0019] When exposure is performed during acceleration and deceleration of the stage, as shown in JP 2002-373839 A (Patent Document 2), it is necessary to control the amount of energy of illumination according to the speed so that the DOSE amount is uniform over the entire shot area. A wedge-shaped prism or a vibrating mirror such as a galvanometer mirror is used for controlling the energy of illumination, and a relational expression between the number of rotations of the motor and the stage speed is obtained so that the DOSE amount is uniform. However, such an illumination energy control method using the drive of optical members has a limit to the amount of variation of the illumination energy due to the arrangement of the optical members and the constraints of the drive actuator. Therefore, in order to perform acceleration and deceleration exposure, it is necessary to set the drive profile of the stage taking into account the amount of variation of the illumination energy.

[0020] In the following, a driving method for shot area 2 and shot area 3 in the shot layout shown in FIG. 9 will be described.

[0021] FIG. 2 shows the position, velocity, and acceleration profiles (drive profile) of the substrate stage 105 in this embodiment. In this embodiment, the drive profile can include a first profile, which is a drive profile in a non-exposure section, and a second profile, which is a drive profile in an exposure section following the non-exposure section. In this embodiment, first, non-exposure drive 201 is performed, and acceleration drive is performed up to the exposure start speed of the shot area 2. In this non-exposure drive 201, the first profile is used. In exposure drive 202, the second profile is used. After exposure is completed, non-exposure drive 203 is performed up to the exposure start speed of the shot area 3, and then exposure drive 204 of the shot area 3 is performed. Note that in FIG. 2, the position profile is displayed with the center of the shot area set to 0.

[0022] As described above, there is a conventional technique in which a drive profile having a sine wave shape is used in the entire section including the non-exposure section and the exposure section. Such a drive profile is referred to as a "reference drive profile." In this embodiment, the first profile is defined so that a maximum acceleration equal to or greater than the maximum acceleration of the substrate stage 105 controlled according to the reference drive profile is obtained in the non-exposure section. In addition, the second profile can be defined so that the substrate stage 105 is driven at the maximum speed in the exposure section.

[0023] The first profile for the non-exposure section and the second profile for the exposure section are adjusted so that the connection between them is improved. The second profile can have a sinusoidal profile. In this case, the first profile and the second profile are connected so that the position, velocity, and acceleration of the substrate stage 105 are continuous at the connection point between the two.

[0024] A method for achieving the above-mentioned features will be described in detail below. Fig. 3 is an enlarged view of the velocity profile and acceleration profile of the non-exposure drive 203 and the exposure drive 204. The position, velocity, and acceleration of the exposure drive 204 are respectively expressed by Equation 1, Equation 2, and Equation 3.

[0025] Position: A0 / ω0 2 ×(1-cos(ω0×(t-t0)))+V min ×(t-t0) (1) Speed: A0 / ω0×sin(ω0×(t-t0))+V min (2) Acceleration: A0×cos(ω0×(t-t0))...(3) where A0 is the amplitude of acceleration, ω0 is the angular velocity, t is time, t0 is the time when the phase of the exposure drive 204 becomes 0, and V min indicates the speed of the exposure drive 204 at t=t0.

[0026] The conditions for calculation are maximum speed V max , the ratio of the maximum speed to the minimum speed in the exposure area (hereinafter referred to as the "speed change rate") V rate , exposure area (angle of view) Y d , exposure start time t s Phase (initial phase) ω0×(t s Based on the amplitude A0 and angular velocity ω0 of the profile, the amplitude A0 and angular velocity ω0 of the profile are determined.

[0027] Rate of change of speed V rate Regarding the phase a, the velocity is set within a range that can keep the DOSE amount constant, and the phase a is set to an arbitrary phase that can satisfy 0≦a<π / 2.

[0028] The average speed of the exposure drive 204 is V ave Then, Equation 4 holds true based on the relationship between distance and time. V ave =Y d / (t e -t s ) · · · (4)

[0029] The average velocity can also be calculated from the velocity profile of Equation 2, which is shown in Equation 5.

[0030]

number

[0031] Since equations 4 and 5 are equal, equations 4 and 5 can be rearranged into equation 6.

[0032] A0 / ω0 2 ×(-cos(ω0×(t e -t0))+cos(ω0×(t s -t0)))+V min ×(t e -t s )=Y d (6)

[0033] Equation 6 is made into an equation with only the angular velocity ω0 as a variable. First, the exposure start speed is V min_exp Then, V min_exp and V max and V rate The relationship is shown in Equation 7. V min_exp = V max / V rate (7)

[0034] Maximum speed V max is the velocity when the phase is ω0×(t-t0)=π / 2 according to Eq. 2, so the maximum velocity V max is shown as Equation 8. V max = V min + A0 / ω0···(8)

[0035] Also, the exposure start speed V min_exp is the speed at phase a in Equation 2, so the exposure start speed V min_exp is shown as Equation 9. V min_exp = V min +A0 / ω0×sin(a) (9)

[0036] Combining equations 7 to 9, A0 and V min is shown as Equation 10 and Equation 11.

[0037] A0=ω0×V max ×(1-1 / V rate ) / (1-sin(a)) (10) V min = V max ×(1 / V rate −sin(a)) / (1−sin(a)) (11)

[0038] Next, at time t s -t0 is the phase ω0×(t s -t0)=a, which can be expressed as Equation 12.

[0039] t s -t0 = a / ω0 (12)

[0040] Furthermore, at time t e -t0: Exposure end time t e Phase ω0×(t e If (t0)=b, the speed at the end of exposure is equal to the speed at the start of exposure, as shown in Fig. 3. Therefore, phase b is expressed as in Equation 13 using phase a. b = π-a (13)

[0041] Time t s As in the case of finding -t0, time t e −t0 can be expressed as in Equation 14. t e -t0 = b / ω0 (14)

[0042] From Equation 13 and Equation 14, time t e -t0 is expressed as in Equation 15. t e -t0 = (π-a) / ω0 (15)

[0043] From Equation 12 and Equation 15, the exposure time t e -t s is shown as Equation 16. t e -t s = (π-2a) / ω0 (16)

[0044] By substituting the above equations 10, 11, 12, 15, and 16 into equation 6, we obtain an equation for ω0 only, as shown in equation 17. 1 / ω0×(V max ×(1-1 / V rate ) / (1-sin(a)))×(-cos(π-a)+cos(a))+(V max ×(1 / V rate -sin(a)) / (1-sin(a)))×((π-2a) / ω0)=Y d (17)

[0045] By solving Equation 17 for ω0, ω0 is expressed as Equation 18. ω0 = V max / (Y d ×(1-sin(a)))×((1 / V rate -sin(a))×(π-2a)+2cos(a)×(1-1 / V rate ))···(18)

[0046] In addition, A0 can be found by substituting ω0 calculated using Equation 18 into Equation 10.

[0047] In order to prevent positioning errors from occurring during driving for exposure, it is effective to drive the substrate stage 105 at a frequency lower than the natural frequency of the substrate stage 105. Since the angular velocity and frequency are proportional to each other, if the frequency calculated from the angular velocity ω0 is higher than the natural frequency of the substrate stage 105, the velocity change rate or maximum velocity is lowered and recalculation is performed, so that the value of the angular velocity ω0 can be lowered.

[0048] 2 and 3, the velocity profile and acceleration profile of the non-exposure drive 203 must be consistent (continuous) at the profile start time t1 with those at the end of the exposure drive 202. In addition, since a trigonometric function profile is used, the velocity and acceleration can be expressed as Equation 19 and Equation 20, respectively.

[0049] Speed: A1 / ω1×(sin(ω1×(t-t1)+c)-sin(c)) + V min_exp (19) Acceleration: A1×(cos(ω1×(t-t1)+c)...(20) Here, A1 is the amplitude of the acceleration, ω1 is the angular velocity, c is the initial phase, t is time, and t1 is the start time of the non-exposure drive 203. The non-exposure drive 203 and the exposure drive 204 are driven at t=t s are connected at a connection point 210.

[0050] From time t1 to time t s During the time t s must be set after the drive time.

[0051] A method for determining the variables A1, ω1, and c for the non-exposure drive will now be described. At the connection point 210, the position, speed, and acceleration of the non-exposure drive 203 and the exposure drive 204 must be matched (continuous). First, for the speed match, Equation 2 and Equation 19 must be satisfied at time t s Since they coincide at A1 / ω1×(sin(ω1×(t s -t1)+c)-sin(c))-V min_exp = V min_exp ···(twenty one)

[0052] For the agreement of acceleration, Equation 3 and Equation 20 are s Since they coincide at A1×(cos(ω1×(t s -t1)+c) = A0×(cos(ω0×(t s -t0)+c) ···(22)

[0053] Moreover, the acceleration of the non-exposure drive 203 at time t1 coincides with the acceleration at the end of the exposure drive 202, and the exposure drive 202 and the exposure drive 204 are the same drive, so Equation 23 is shown. A1×cos(c) = A0×cos(a) (23)

[0054] Equation 22 can be transformed into Equation 24 using addition and subtraction of trigonometric functions. A1×(cos(ω1×(t s -t1))×cos(c)-sin(ω1×(t s -t1))×sin(c)) = A0×cos(ω0×(t s -t0)) · · · (24)

[0055] By substituting Equation 23 into Equation 24, Equation 25 is obtained. A0×cos(a)×cos(ω1×(t s -t1))-A1×sin(ω1×(t s -t1))×sin(c) = A0×cos(ω0×(t s -t0))···(25)

[0056] Solving equation 25 for A1 × sin(c) gives equation 26. A1×sin(c) = A0×(cos(a)×cos(ω1×(t s -t1))-cos(ω0×(t s -t0)) / sin(ω1×(t s -t1))···(26)

[0057] Substituting equation 23 into equation 26 gives equation 27. (A0×sin(c)×cos(a)) / cos(c) = cos(a)×(cos(ω1×(t s -t1))-cos(ω0×(t s -t0))) / (cos(a)×sin(ω1×(t s -t1)))···(27)

[0058] Solving equation 27 for c gives equation 28. tan(c) = (cos(a)×cos(ω1×(t s -t1))-cos(ω0×(t s -t0))) / (cos(a)×sin(ω1×(t s -t1)))···(28)

[0059] Once the value of ω1 is known, Equation 28 can be solved using inverse trigonometric functions.

[0060] As with Equation 24, by transforming Equation 21 using addition and subtraction of trigonometric functions, we obtain Equation 29. A1 / ω1×(sin(ω1×(t s -t1))×cos(c)-cos(ω1×(t s -t1)) × sin(c) - sin(c)) - V min_exp = V min_exp (29)

[0061] Substituting equations 23 and 26 into equation 29, we obtain equation 30, which has ω1 as the only variable. 1 / ω1×(sin(ω1×(t s -t1))×A0×cos(a)-(1+cos(ω1×(t s -t1)))×A0×(cos(a)×(cos(ω1×(t s -t1)))-(cos(ω0×(t s -t0))) / sin(ω1×(t s -t1)))-2×V min_exp = 0 (30)

[0062] Since Equation 30 is a nonlinear equation, it is necessary to use a binary search method or the like to find the optimal value of ω1. Once the value of ω1 is found, the value of c can be found from Equation 28, and by finding the value of c, the value of A1 can be found from Equation 23. The time t s By determining the above, the non-exposure drive is performed at a high acceleration, so that the non-exposure time can be shortened.

[0063] According to the profile determined as described above, the substrate stage 105 can be driven at the maximum speed during exposure driving. Also, the substrate stage 105 can be driven at the maximum acceleration during non-exposure driving. The main controller 111 can control the light source or the illumination optical system based on the exposure profile having a sine wave corresponding to the sine wave of the second profile so that the substrate 104 is irradiated with light at a light amount according to the speed of the substrate stage 105 while the shot area is being exposed. However, the maximum speed of the substrate stage 105 during exposure driving, the speed change rate, and the phase at the start of the second profile are determined under the constraint of maintaining the exposure amount (DOSE amount) per unit area of ​​the substrate constant (within an allowable range). Therefore, since the exposure driving is driven at a speed change rate that allows the illumination energy amount to be changed, the DOSE amount can be kept constant. Also, since the non-exposure section is driven at a value close to the maximum acceleration of the substrate stage 105, the non-exposure time can be shortened and productivity can be improved.

[0064] As a modified example, as shown in FIG. s Exposure is not started at time t s2 By starting exposure from this time, it is possible to start exposure after reducing the positioning error that occurs when switching from the non-exposure drive 203 to the exposure drive 204. By controlling exposure in this way, it is possible to improve the exposure accuracy compared to the exposure control according to FIG.

[0065] Up to this point, the condition has been set that the velocity and acceleration profiles are continuous at the connection point between the exposure section and the non-exposure section. However, as shown in Fig. 5, if the acceleration gradient changes suddenly, the positioning error will increase at the connection point 510, which may affect the exposure accuracy. For this reason, as shown in Fig. 6, an adjustment may be made to make the differential value of the acceleration of the exposure drive and the non-exposure drive, that is, the jerk, match (make it continuous) at the connection point 510. When the jerks match, Equation 31 holds. A1×ω1×(sin(ω1×(t s -t1))+c) = A0×ω0×(sin(ω0×(t s -t0)) ···(31)

[0066] By applying the addition and subtraction of trigonometric functions and equations 23 and 26 to equation 31, equation 32 holds true. ω1×(sin(ω1×(t s -t1))×cos(a)+cos(ω1×(t s -t1))×(cos(a)×cos(ω1×(t s -t1))-cos(ω0×(t s -t0))) / sin(ω1×(t s -t1))) = ω0×sin(ω1×(t s -t0)) · · · (32)

[0067] Equations 30 and 32 are expressed as ω1 and t s However, since the above two equations are nonlinear simultaneous equations, instead of the binary search method as mentioned above, we need to use the Newton method or similar to solve the variable ω1 and the time t s The equation is solved by successively changing the value of and finding the optimal solution. s After calculating the value of, the initial phase c is calculated, and then the acceleration A1 is calculated.

[0068] By matching the jerk as described above, it is possible to reduce the positioning error at the connection point 510 and to improve the exposure accuracy.

[0069] In this embodiment, a single trigonometric function is used for the exposure profile, and a single trigonometric function having a different amplitude and angular velocity from the exposure profile is used for the non-exposure profile, thereby shortening the non-exposure time and improving the throughput. As a non-exposure profile for improving the throughput, a uniform acceleration profile, a polynomial such as a quadratic function, or a profile obtained by combining trigonometric functions may also be used.

[0070] <Second embodiment> In the first embodiment, the non-exposure drive is shown as one profile, but it is also possible to combine a plurality of profiles as shown in FIG. 7. In the example of FIG. 7, the non-exposure drive that connects the exposure drive 703 of the shot area 2 to the exposure drive 707 of the shot area 3 includes the non-exposure drive 704, the non-exposure drive 705, and the non-exposure drive 706. Separate non-exposure profiles are applied to the non-exposure drive 704, the non-exposure drive 705, and the non-exposure drive 706, respectively. After the exposure drive 703 of the shot area 2 is completed, the substrate stage 105 is raised in a short time to the maximum acceleration A1 that can be output in the non-exposure drive 704. Thereafter, the non-exposure drive 705 performs constant acceleration drive while maintaining the maximum acceleration A1, and the acceleration is reduced to the acceleration at the start of exposure in the exposure drive 707 in the non-exposure drive 706.

[0071] By determining the above-mentioned profile, the non-exposure time can be further shortened compared to the first embodiment, leading to improved productivity.

[0072] If there is a steep acceleration change such as non-exposure drive 706 before the start of exposure, a positioning error may occur, which may affect the exposure accuracy. Therefore, as shown in Fig. 8, the acceleration profile may be adjusted so that it becomes gentle immediately before the start of exposure. For example, by driving the substrate stage 105 from constant acceleration drive 804 with sine wave drive 805 having a frequency lower than the natural vibration of the substrate stage 105, the acceleration change from non-exposure drive to exposure drive becomes gentle, and the positioning error may be reduced.

[0073] By determining the profile as described above, the exposure accuracy can be improved compared to the example of FIG.

[0074] <Embodiment of the article manufacturing method> The article manufacturing method according to the embodiment of the present invention is suitable for manufacturing articles such as microdevices such as semiconductor devices and elements having a fine structure. The article manufacturing method of the present embodiment includes a step of forming a latent image pattern on a photosensitive agent applied to a substrate using the above-mentioned exposure apparatus (a step of exposing the substrate), and a step of developing the substrate on which the latent image pattern has been formed in the step. Furthermore, the manufacturing method includes other well-known steps (oxidation, film formation, deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, etc.). The article manufacturing method of the present embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article compared to conventional methods.

[0075] The invention is not limited to the above-described embodiments, and various modifications and variations are possible without departing from the spirit and scope of the invention. Accordingly, the following claims are appended to apprise the public of the scope of the invention. [Explanation of symbols]

[0076] 100: exposure apparatus, 101: projection optical system, 102: mask (original), 103: mask stage, 104: substrate, 105: substrate stage, 106: illumination optical system, 111: main control unit

Claims

1. 1. An exposure apparatus that exposes a substrate while scanning an original and the substrate, comprising: a substrate stage that holds and moves the substrate; A control unit that controls the movement of the substrate stage in accordance with a drive profile; having the drive profile includes a first profile which is a drive profile in a non-exposure section, and a second profile which is a drive profile in an exposure section following the non-exposure section, the second profile includes an acceleration profile that includes a sine wave, A profile of the acceleration included in the first profile includes a second acceleration that is greater than a first acceleration that is an acceleration of a maximum amplitude of the sine wave. An exposure apparatus comprising:

2. 2. The exposure apparatus according to claim 1, wherein the position, velocity, and acceleration of the substrate stage are connected so as to be continuous at a connection point that connects the first profile and the second profile.

3. a light source that emits light for exposing the substrate, the control unit controls the light source or the illumination optical system based on an exposure profile having a sine wave corresponding to the sine wave of the second profile so as to irradiate the substrate with light at a light amount corresponding to a speed of the substrate stage during exposure of the shot area.

2. The exposure apparatus according to claim 1.

4. 4. The exposure apparatus according to claim 3, wherein the maximum speed and speed change rate of the substrate stage in the exposure section and the phase at the start of the second profile are determined under the constraint of maintaining the exposure amount per unit area of ​​the substrate within an allowable range.

5. 2. The exposure apparatus according to claim 1, wherein the sine wave of the second profile has a frequency lower than a natural frequency of the substrate stage.

6. 6. The exposure apparatus according to claim 1, wherein the second profile is defined so that the substrate stage is driven at a maximum speed in the exposure section.

7. 3. The exposure apparatus according to claim 2, wherein a jerk of the substrate stage is determined to be continuous at a connection point that connects the first profile and the second profile.

8. exposing a substrate using the exposure apparatus according to any one of claims 1 to 7; developing the exposed substrate; and producing an article from the developed substrate.

9. A stage device used in an exposure apparatus that exposes a substrate while scanning an original and the substrate, comprising: A moving unit that holds and moves the substrate; A control unit that controls the movement of the moving unit in accordance with a drive profile; having the drive profile includes a first profile which is a drive profile in a non-exposure section, and a second profile which is a drive profile in an exposure section following the non-exposure section, the second profile includes an acceleration profile that includes a sine wave, A profile of the acceleration included in the first profile includes a second acceleration that is greater than a first acceleration that is an acceleration of a maximum amplitude of the sine wave. A stage apparatus comprising:

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