Adhesive tape
The adhesive tape, featuring an SIS copolymer-based adhesive layer with specific tackifier and plasticizer ratios, achieves high releasability and adhesive strength even after high-temperature drying, overcoming the challenges faced by existing adhesive tapes in such applications.
Patent Information
- Application Number
- JP2021065364
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2021-04-07
- Publication Date
- 2025-04-28
- Estimated Expiration
- 2041-04-07
AI Technical Summary
Adhesive tapes with hot melt adhesives coated using a styrene-isoprene-styrene block copolymer (SIS copolymer) face challenges with high adhesive strength after exposure to high temperatures, making it difficult to peel off, especially in applications requiring high-temperature drying such as painting.
An adhesive tape comprising a base material with an adhesive layer made of a styrene-isoprene-styrene block copolymer (SIS copolymer) and a tackifier, where the styrene content is 20 to 30% by mass, the mass ratio of the tackifier to the copolymer is 0.2 or more and less than 0.6, and the plasticizer content is 0.1 or less in terms of mass ratio, ensuring high releasability even after high-temperature drying.
The adhesive tape maintains high releasability and adhesive strength even after high-temperature drying, effectively addressing the issue of increased adhesive strength post-heating in existing adhesive tapes.
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Abstract
Description
[Technical field]
[0001] The present invention relates to an adhesive tape. [Background technology]
[0002] Adhesive tapes coated with a hot melt adhesive that uses a styrene-isoprene-styrene block copolymer (hereinafter also referred to as SIS copolymer) as the base polymer are widely used for applications such as cardboard packaging because they are prone to exhibiting strong adhesive properties. Hot melt adhesives cannot be processed unless they are softened at high temperatures, so compared to adhesives such as acrylic adhesives that are cross-linked after coating, they have low cohesive strength at room temperature and are not suitable for re-peel applications such as curing.
[0003] For example, Patent Document 1 discloses an adhesive tape with improved removability by using an adhesive containing a SIS copolymer with a high styrene content. The adhesive tape can be used for curing purposes at around room temperature. Meanwhile, Patent Documents 2 to 6 disclose tapes using an adhesive containing a styrene-based polymer. [Prior art documents] [Patent documents]
[0004] [Patent Document 1] Patent No. 5916786 [Patent Document 2] JP 2019-218417 A [Patent Document 3] JP 2019-99757 A [Patent Document 4] JP 2019-203115 A [Patent Document 5] JP 2017-149938 A [Patent Document 6] JP 2019-119842 A Summary of the Invention [Problem to be solved by the invention]
[0005] However, in the case of the adhesive tape disclosed in Patent Document 1, in applications such as paint masking tape that require drying at high temperatures (for example, drying at 110°C for 30 minutes) after coating with paint, the adhesive tape is once exposed to high temperatures, so the adhesive semi-melts and becomes compatible with the adherend, increasing the adhesive strength, which may make it difficult to remove again. Therefore, there is a demand for the development of an adhesive tape that can be used in applications that require drying, such as painting.
[0006] An object of the present invention is to provide an adhesive tape that exhibits high removability even when dried at high temperatures. [Means for solving the problem]
[0007] The present invention includes the following embodiments.
[0008] [1] An adhesive tape comprising a substrate and an adhesive layer provided on the substrate, the pressure-sensitive adhesive layer is made of a pressure-sensitive adhesive containing a styrene-isoprene-styrene block copolymer and a tackifier, The styrene content of the copolymer is 20 to 30% by mass, a mass ratio of the tackifier to the copolymer is 0.2 or more and less than 0.6; An adhesive tape, wherein the amount of a plasticizer contained in the adhesive is 0.1 or less in terms of a mass ratio of the plasticizer to the copolymer.
[0009] [2] The pressure-sensitive adhesive tape according to [1], wherein the tackifier is at least one selected from the group consisting of C5 petroleum resin, C5C9 petroleum resin, C9 petroleum resin, hydrogenated C9 petroleum resin, alicyclic petroleum resin, alicyclic / aromatic petroleum resin, terpene resin, rosin resin, rosin ester resin, terpene phenol resin, and alkylphenol resin.
[0010] [3] The pressure-sensitive adhesive tape according to [1] or [2], wherein the plasticizer is diisononyl adipate.
[0011] [4] The pressure-sensitive adhesive tape according to any one of [1] to [3], wherein the substrate is a laminate of a biaxially oriented polypropylene film and a transversely uniaxially oriented polyethylene film, or a transversely uniaxially oriented polypropylene film.
[0012] [5] The pressure-sensitive adhesive tape according to [4], wherein the substrate is a laminate of a biaxially oriented polypropylene film having a thickness of 10 to 20 μm and a transverse uniaxially oriented polyethylene film having a thickness of 16 to 25 μm.
[0013] [6] The adhesive tape according to any one of [1] to [5], wherein the adhesive strength of the adhesive tape measured in accordance with JIS Z 0237 (2009) is A (N / cm) and the adhesive strength of the adhesive tape after heating at 110°C for 30 minutes is B (N / cm), the adhesive strength increase rate after heating, as represented by the following formula, is 150% or less. Increase in adhesive strength after heating (%) = (B / A)*100 Effect of the Invention
[0014] According to the present invention, it is possible to provide a pressure-sensitive adhesive tape that exhibits high removability even when dried at high temperatures. [Brief description of the drawings]
[0015] [Figure 1] 1 is a cross-sectional view illustrating an example of a pressure-sensitive adhesive tape according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0016] The adhesive tape according to the present embodiment includes a substrate and an adhesive layer provided on the substrate. The adhesive layer is made of an adhesive containing a SIS copolymer and a tackifier. The SIS copolymer has a styrene content of 20 to 30% by mass. The mass ratio of the tackifier to the SIS copolymer is 0.2 or more and less than 0.6. The amount of plasticizer contained in the adhesive is 0.1 or less in terms of the mass ratio of the plasticizer to the SIS copolymer.
[0017] In the adhesive tape according to the present embodiment, the styrene content of the SIS copolymer is 20% by mass or more, so that the adhesive layer becomes slightly hard, which is advantageous for removability after high-temperature drying. In addition, the styrene content is 30% by mass or less, so that the adhesive can be given an appropriate tack, making it easier to attach the adhesive tape to the adherend. In addition, in the process of preparing and applying the adhesive, it can be dissolved in a solvent such as toluene and applied in a solution state, or it can be heated to about 180°C, kneaded, and made into a hot-melt adhesive, which can be discharged from a T-die or the like and applied. In addition, the mass ratio of the tackifier to the SIS copolymer is 0.2 or more, so that sufficient adhesive strength as an adhesive tape can be obtained. In addition, the mass ratio is less than 0.6, so that the adhesive strength can be prevented from becoming too strong, and therefore the removability after high-temperature drying is improved. In addition, the mass ratio of the plasticizer to the SIS copolymer is 0.1 or less, so that the cohesive strength of the adhesive can be improved, and therefore the removability after high-temperature drying is improved. Therefore, the pressure-sensitive adhesive tape according to the present embodiment exhibits high removability even when dried at high temperatures, while maintaining the adhesiveness of the pressure-sensitive adhesive tape, where drying at high temperatures means drying at, for example, 80° C. or higher.
[0018] An example of the adhesive tape according to this embodiment is shown in Fig. 1. The adhesive tape shown in Fig. 1 comprises a substrate 1 and an adhesive layer 2 provided on the substrate 1. An anchor coat layer 3 is provided between the substrate 1 and the adhesive layer 2. In addition, a release agent layer 4 is provided on the surface of the substrate 1 opposite to the adhesive layer 2. Note that the adhesive tape according to this embodiment does not necessarily have to comprise an anchor coat layer and a release agent layer.
[0019] (base material) The substrate according to the present embodiment is not particularly limited in its configuration as long as it serves as a support for the adhesive layer, and examples thereof include woven fabrics, nonwoven fabrics, knitted fabrics, or films of thermoplastic resins, and paper. Examples of thermoplastic resins include polyethylene (PE), polypropylene (PP), polyester, and the like. Among these, the substrate is preferably a laminate of a biaxially oriented polypropylene film and a transversely uniaxially oriented polyethylene film, or a transversely uniaxially oriented polypropylene film. By using these laminates or films as the substrate, the adhesive tape is easily cut by hand, and the workability is improved. The laminate may have an adhesive layer between the biaxially oriented polypropylene film and the transversely uniaxially oriented polyethylene film.
[0020] The thickness of the substrate is not particularly limited, but may be, for example, 10 to 200 μm, and is preferably 30 to 100 μm. When the substrate is a laminate of a biaxially oriented polypropylene film and a transversely uniaxially oriented polyethylene film, the laminate is preferably a laminate of a biaxially oriented polypropylene film having a thickness of 10 to 20 μm and a transversely uniaxially oriented polyethylene film having a thickness of 16 to 25 μm. When the thicknesses of the biaxially oriented polypropylene film and the transversely uniaxially oriented polyethylene film are within the above range, the substrate can be cut more easily by hand, and therefore, when used as an adhesive tape, it is not necessary to use tools such as scissors or a tape cutter. In addition, when the transversely uniaxially oriented polyethylene film and the biaxially oriented polypropylene film are laminated, the thickness ratio (representing the transversely uniaxially oriented polyethylene film:biaxially oriented polypropylene film, not including the thickness of the adhesive layer) is preferably 1:0.5 to 1:2. When the ratio is 1:0.5 or more, the strength as a substrate is improved. In addition, when the ratio is 1:2 or less, the hand cutting property is good.
[0021] (Adhesive layer) The adhesive layer is made of an adhesive containing a SIS copolymer as a base polymer and a tackifier. The adhesive may contain additives such as plasticizers, antioxidants, UV absorbers, fillers, and pigments as necessary.
[0022] In this embodiment, the styrene content of the SIS copolymer is 20 to 30% by mass, preferably 22 to 30% by mass, and more preferably 24 to 30% by mass. The styrene content is a value measured using a method described in JIS K6383. The method for changing the styrene content is not particularly limited, but examples thereof include a method of obtaining a SIS copolymer having a desired styrene content by living anionic polymerization by changing the styrene / isoprene ratio of the monomer, and a method of obtaining a SIS copolymer having a desired styrene content by blending two or more SIS copolymers having different styrene contents.
[0023] The SIS copolymer may contain a styrene-isoprene-styrene triblock copolymer and a styrene-isoprene diblock copolymer. The diblock ratio in the SIS copolymer is preferably 10 to 80% by mass, more preferably 20 to 70% by mass. By having the diblock ratio within the above range, the occurrence of adhesive residue can be suppressed while maintaining the stickiness of the adhesive. The diblock ratio (%) is a value calculated by 100 x (parts by mass of diblock copolymer) / (parts by mass of diblock copolymer+parts by mass of triblock copolymer). Specifically, the diblock ratio is calculated from the area ratio of the peaks attributable to the diblock copolymer and the triblock copolymer in the obtained chart by measuring the molecular weight of the SIS copolymer by gel permeation chromatography (GPC). The method for changing the diblock ratio is not particularly limited, but examples thereof include a method of changing the ratio of the amount of coupling agent / amount of initiator used during polymerization, and a method of blending two or more SIS copolymers with different diblock ratios.
[0024] The SIS copolymer preferably has a linear structure. The SIS copolymer having a linear structure is easier to adjust the adhesive strength than the SIS copolymer having a radial structure, and the thickness is easier to adjust when applying the adhesive. For example, in the case of the Quintac series manufactured by Nippon Zeon, 3421, 3190, 3280, etc. have a linear structure, and 3450 has a radial structure.
[0025] The weight-average molecular weight of the SIS copolymer is not particularly limited, but may be, for example, from 50,000 to 400,000, and preferably from 100,000 to 300,000. The weight-average molecular weight is a value determined by gel permeation chromatography (GPC).
[0026] As the tackifier, those having excellent compatibility with the SIS copolymer are preferred, and for example, C5 petroleum resin, C5C9 petroleum resin, C9 petroleum resin, hydrogenated C9 petroleum resin, alicyclic petroleum resin, alicyclic / aromatic petroleum resin, terpene resin, rosin resin, rosin ester resin, terpene phenol resin, alkylphenol resin, etc. are preferred. These tackifiers may be used alone or in combination of two or more. Among these, petroleum resin is preferred, and hydrogenated C9 petroleum resin is more preferred, from the viewpoint of less deterioration due to exposure to direct sunlight (ultraviolet rays).
[0027] The softening point of the tackifier is preferably 90°C to 135°C. When the softening point is 90°C or higher, the adhesive is less likely to melt when the adhesive tape is heated for drying during use, and removability is further improved. When the softening point is 135°C or lower, the tack of the adhesive at around room temperature is sufficient, and the adhesive is easily attached to the adherend. One type of tackifier may be used, or two or more types of tackifiers may be used in combination so that the softening point falls within the above temperature range.
[0028] In this embodiment, the mass ratio of the tackifier to the SIS copolymer is 0.2 or more and less than 0.6, preferably 0.25 or more and 0.55 or less, and more preferably 0.3 or more and 0.5 or less.
[0029] The adhesive according to the present embodiment may optionally contain a plasticizer from the viewpoint of improving processability. As the plasticizer, adipic acid ester-based and phthalic acid ester-based plasticizers are preferred because they have good compatibility with the SIS copolymer and can obtain a plasticizing effect with a small amount. As the adipic acid ester-based plasticizer, for example, diisononyl adipate (DINA) can be mentioned, and as the phthalic acid ester-based plasticizer, for example, bis(2-ethylhexyl) phthalate (DEHP), dibutyl phthalate (DBP), benzyl butyl phthalate (BBP), diisononyl phthalate (DINP), diisodecyl phthalate (DIDP), bis-normal octyl phthalate (DNOP) can be mentioned. These plasticizers may be used alone or in combination of two or more. Among these, DINA can be preferably used from the viewpoint that regulations such as REACH are not applied.
[0030] In this embodiment, the amount of plasticizer contained in the adhesive is 0.1 or less, and can be 0.05 or less, in terms of the mass ratio of the plasticizer to the SIS copolymer. The lower limit of the range of the mass ratio is not particularly limited, but can be, for example, 0.01 or more from the viewpoint of processability. Note that the adhesive according to this embodiment does not need to contain a plasticizer.
[0031] The adhesive according to the present embodiment may optionally contain an antioxidant from the viewpoint of preventing deterioration due to heat when drying, kneading, etc. are performed during the production of the adhesive. Examples of the antioxidant include phenol-based compounds, amine-based compounds, sulfur-based compounds, and phosphorus-based compounds. These antioxidants may be used alone or in combination of two or more. The amount of the antioxidant contained in the adhesive may be, for example, 0.1 to 5 in terms of the mass ratio of the antioxidant to the SIS copolymer.
[0032] The adhesive according to the present embodiment may optionally contain an ultraviolet absorbing agent from the viewpoint of preventing the adhesive from deteriorating due to exposure to sunlight or the like during storage in the form of an adhesive tape. Examples of ultraviolet absorbing agents include benzophenone-based, benzotriazole-based, salicylic acid ester-based, and cyanoacrylate-based agents. These ultraviolet absorbing agents may be used alone or in combination of two or more. The amount of the ultraviolet absorbing agent contained in the adhesive may be, for example, 0.1 to 3 in terms of the mass ratio of the ultraviolet absorbing agent to the SIS copolymer.
[0033] The amount of adhesive applied to the substrate to form the adhesive layer is not particularly limited, but may be, for example, 10 to 100 g / m 2 The amount of adhesive can be 10 g / m 2 If the amount of adhesive is more than 100 g / m, sufficient adhesiveness can be obtained. 2 The thickness of the pressure-sensitive adhesive layer is not particularly limited, but may be, for example, 15 to 50 μm.
[0034] Methods for forming the adhesive layer include, for example, a method in which the adhesive raw materials are heated, melted, kneaded, and coated with a hot melt coater, and a method in which the adhesive raw materials are dissolved in a solvent such as toluene to make them liquid, and then coated directly onto the substrate with a coater such as a gravure coater, comma coater, bar coater, knife coater, or roll coater.
[0035] The adhesive layer may be formed on the surface of the substrate, or may be formed between the substrate and another layer. For example, as shown in FIG. 1, an anchor coat layer 3 may be provided between the substrate 1 and the adhesive layer 2 to enhance the adhesion between them. Examples of anchor coat agents constituting the anchor coat layer include urethane-based, acrylic-based, imine-based, butadiene-based, olefin-based, and ethylene acrylic acid copolymer alkanol salts. These anchor coat agents may be used alone or in combination of two or more. Among these, urethane-based anchor coat agents are preferred from the viewpoint of improving adhesion. The amount of anchor coat agent applied to form the anchor coat layer is 0.005 to 0.5 g / m in terms of solid content. 2 is preferable, and 0.01 to 0.2 g / m 2 is more preferred.
[0036] (Release agent layer) The adhesive tape according to the present embodiment may have a release agent layer on the surface of the substrate opposite to the adhesive layer. For example, as shown in FIG. 1, the release agent layer 4 is provided on the surface of the substrate 1 opposite to the adhesive layer 2. By providing the release agent layer, the adhesive tape can be easily unrolled when the adhesive tape is in a rolled state. As the release agent constituting the release agent layer, a known release agent can be appropriately selected and used. For example, silicone-based release agents such as condensation type silicone and addition type silicone, alkyl pendant-based release agents such as long-chain alkyl acrylate and long-chain alkyl modified polymer, condensation wax-based release agents, etc. may be mentioned. These release agents may be used alone or in combination of two or more. Among these, alkyl pendant-based release agents are preferred from the viewpoint of releasability. The amount of release agent applied to form the release agent layer is 0.005 to 0.2 g / m in terms of solid content. 2 is preferably 0.01 to 0.1 g / m 2 is more preferred.
[0037] (Adhesive strength increase rate after heating of adhesive tape) In the pressure-sensitive adhesive tape according to the present embodiment, where the adhesive strength of the pressure-sensitive adhesive tape measured according to JIS Z 0237 (2009) is A (N / cm) and the adhesive strength of the pressure-sensitive adhesive tape after heating at 110° C. for 30 minutes is B (N / cm), the adhesive strength increase rate after heating, as shown in the following formula, is preferably 150% or less in order to exhibit high removability even when dried at high temperatures. The adhesive strength increase rate after heating is more preferably 140% or less, even more preferably 130% or less, and particularly preferably 120% or less. Increase in adhesive strength after heating (%) = (B / A)*100 EXAMPLES
[0038] The following examples are provided to more specifically describe the embodiments of the present invention, but the present invention is not limited to these examples. The adhesive strength, adhesive strength after heating, removability, tearability by hand, and thermal shrinkage after heating of the adhesive tape were measured and evaluated by the following methods.
[0039] (1) Adhesive strength The adhesive strength of the adhesive tape was measured according to JIS Z 0237 (2009). Specifically, the adhesive tape was cut to a width of 25 mm and a length of 150 mm and attached to a PP plate, and pressed once back and forth with a roller weighing 2 kg at a speed of 5 mm / sec to prepare a sample. After the sample was prepared, it was left at room temperature for 20 minutes, and then peeled off at a 180° peel speed of 300 mm / min with a tensile tester to measure the adhesive strength. The measurement results were expressed in N / cm.
[0040] (2) Adhesive strength after heating A sample prepared in the same manner as in (1) above was left in an oven at 110°C for 30 minutes, removed, and cooled to room temperature. The sample cooled to room temperature was peeled off using a tensile tester under the same conditions as in (1) above, and the adhesive strength after heating was measured. The measurement results were expressed in N / cm. Note that a post-heat adhesive strength increase rate of 150% or less, which indicates the ratio of the adhesive strength after heating to the adhesive strength in (1) above, is preferable because it provides high removability after high-temperature drying.
[0041] (3)Removability In the measurement of (2) above, the PP plate after measuring the adhesive strength after heating was visually observed. The removability was evaluated according to the following criteria. A: There was no adhesive left on the PP board. B: Adhesive remained on the PP board.
[0042] (4) Easy to cut by hand The adhesive tape was held lengthwise with both hands and torn with fingernails. The tape was torn 10 times and the hand tearability was evaluated according to the following criteria. A: I was able to tear it more than five times. B: The number of times it was possible to tear it was 1 to 4. C: I couldn't tear it even once.
[0043] (5) Thermal shrinkage after heating The thermal shrinkage after heating was evaluated by measuring the thermal shrinkage rate in the width direction of the adhesive tape. Specifically, a sample was prepared by attaching a piece of adhesive tape cut to a width of 25 mm and a length of 150 mm to a SUS plate. The sample was left in an oven at 110°C for 30 minutes, removed, and then cooled to room temperature. The width dimension of the adhesive tape cooled to room temperature was measured, and the thermal shrinkage rate was calculated using the following formula. Heat shrinkage rate (%) = (25 mm (tape width before heating) - tape width after heating (mm)) / (25 mm (tape width before heating)) x 100
[0044] [Examples 1 to 15, Comparative Examples 1 to 4] The SIS copolymer, tackifier, plasticizer, antioxidant and UV absorber shown in Tables 1 and 2 were mixed in the amounts shown in Tables 1 and 2 and kneaded at 180°C to prepare a molten pressure-sensitive adhesive. The pressure-sensitive adhesive was applied to the substrate shown in Tables 1 and 2 in an amount of 30 g / m2. 2 A solution of a long-chain alkyl pendant polymer dissolved in toluene with a solid content concentration of 1% was applied to the surface of the substrate opposite to the adhesive layer with a gravure coater until the solid content reached 0.05 g / m. 2The release agent layer was provided by applying the adhesive so that the adhesive layer was formed as follows. An adhesive tape was thus produced. The details of the materials and substrates used in the preparation of the adhesive are as follows:
[0045] (SIS copolymer) Quintac 3190: Zeon Corporation, styrene content 30% by mass, diblock ratio 60% by mass Quintac 3280: Zeon Corporation, styrene content 25% by mass, diblock ratio 17% by mass Quintac 3421: Zeon Corporation, styrene content 14% by mass, diblock ratio 26% by mass
[0046] (tackifier) Alcon P-100: Arakawa Chemical Industries, Ltd., hydrogenated C9 petroleum resin, softening point 100°C Quinton S195: Zeon Corporation, C5C9 petroleum resin, softening point 95℃ Quinton R100: Zeon Corporation, C5 petroleum resin, softening point 100℃ YS Resin PX1250: Yasuhara Chemical Co., Ltd., terpene resin, softening point 125°C SUMILITE RESIN PR-12603: Sumitomo Bakelite Co., Ltd., terpene phenol, softening point 133℃ Haritac FK125: Harima Chemicals Co., Ltd., rosin ester, softening point 125°C
[0047] (Plasticizer) Monosizer W242: Diisononyl adipate (DINA), manufactured by DIC Corporation
[0048] (Antioxidants) Irganox 1076: BASF, 3-(3,5-di-tert-butyl-4-hydroxyphenyl) stearyl propionate
[0049] (UV absorber) JF-77P: Johoku Chemical Industry Co., Ltd., (2-(2'-hydroxy-5'-methylphenyl)benzotriazole)
[0050] (Removal agent) P-LOIL 1010S: Lion Specialty Chemicals Co., Ltd. (long chain alkyl pendant type)
[0051] (base material) (1) Biaxially oriented PP film + transversely uniaxially oriented PE film: Molten PE for lamination (Novatec LD LC600A, Japan Polyethylene Co., Ltd.) was poured between a biaxially oriented PP film (FOR, Futamura Chemical Co., Ltd., thickness 12 μm) and a transversely uniaxially oriented PE film (Calarian Y, Denka Co., Ltd., thickness 18 μm), and a laminate was produced by sandwich lamination. (2) Uniaxially oriented PP film: Calalyan Y, manufactured by Denka Co., Ltd., thickness 18 μm (3) Biaxially oriented PP film: Torayfan #40-2548, manufactured by Toray Industries, Inc., thickness 40 μm (4) Non-oriented PP film: SC40, manufactured by Mitsui Chemicals Tocello Co., Ltd., thickness 40 μm
[0052] [Table 1]
[0053] [Table 2]
[0054] As shown in Tables 1 and 2, the pressure-sensitive adhesive tapes of Examples 1 to 15 according to the present embodiment were all rated as "A" for removability, and it was found that they exhibited high removability even when dried at high temperatures. In particular, Examples 1 to 13, which used a laminate of a biaxially oriented polypropylene film and a transversely uniaxially oriented polyethylene film or a transversely uniaxially oriented polypropylene film as the substrate, were also rated as "A" for hand-tearability, and it was found that they were excellent not only in removability after high-temperature drying but also in workability. [Explanation of symbols]
[0055] 1 Base material 2 Adhesive layer 3 Anchor coat layer 4 Release agent layer
Claims
1. An adhesive tape comprising a substrate and an adhesive layer provided on the substrate, the pressure-sensitive adhesive layer is made of a pressure-sensitive adhesive containing a styrene-isoprene-styrene block copolymer and a tackifier; The styrene content of the copolymer is 20 to 30% by weight, a mass ratio of the tackifier to the copolymer is 0.2 or more and less than 0.6; the amount of plasticizer contained in the pressure-sensitive adhesive is 0.1 or less in terms of a mass ratio of the plasticizer to the copolymer; The substrate is a laminate of a biaxially oriented polypropylene film and a transversely uniaxially oriented polyethylene film, or a transversely uniaxially oriented polypropylene film, The tackifier is at least one selected from the group consisting of C5 petroleum resin, C5C9 petroleum resin, C9 petroleum resin, hydrogenated C9 petroleum resin, alicyclic petroleum resin, rosin resin, rosin ester resin, and alkylphenol resin; The styrene-isoprene-styrene block copolymer has a content (diblock ratio) of 60 to 80 mass % of a styrene-isoprene diblock copolymer.
2. The adhesive tape according to claim 1 , wherein the plasticizer is diisononyl adipate.
3. 3. The pressure-sensitive adhesive tape according to claim 1, wherein the substrate is a laminate of a biaxially oriented polypropylene film having a thickness of 10 to 20 μm and a transverse uniaxially oriented polyethylene film having a thickness of 16 to 25 μm.
4. 4. The pressure-sensitive adhesive tape according to claim 1, wherein the adhesive strength of the pressure-sensitive adhesive tape measured in accordance with JIS Z 0237 (2009) is A (N / cm) and the adhesive strength of the pressure-sensitive adhesive tape after heating at 110°C for 30 minutes is B (N / cm), wherein an increase rate of adhesive strength after heating, as represented by the following formula, is 150% or less. Adhesive strength increase rate after heating (%) = (B / A) * 100
Citation Information
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