Manufacturing method for ceramic electronic components

Abstract

The present invention suppresses variation in the quality of a plurality of ceramic electronic components manufactured at the same time.　This method for manufacturing ceramic electronic components comprises: a chip-like ceramic element fabrication step for fabricating a plurality of chip-like ceramic elements 21; a jig preparation step for preparing a jig 1000 having a plurality of chip storage sections 8 formed therein, the chip storage sections each having a bottom part 8b supporting the chip-like ceramic elements 21 from below, and a sidewall part 8c that opens upwards; a chip-like ceramic element storage step for storing the chip-like ceramic elements 21 one-by-one in one each of the chip storage sections 8 of the jig 1000; a chip-like ceramic element processing step for processing the chip-like ceramic elements 21 stored in the chip storage sections 8 of the jig 1000; and a chip-like ceramic element take-out step for taking out the chip-like ceramic elements 21 from the chip storage sections 8 of the jig 1000.

Description

[Technical field]

[0001] The present invention relates to a method for producing a ceramic electronic component.

[0002] Ceramic electronic components to be manufactured by the present invention include multilayer ceramic electronic components such as multilayer ceramic capacitors, multilayer ceramic inductors, multilayer ceramic thermistors, multilayer ceramic LC components, multilayer ceramic substrates, etc. Ceramic electronic components to be manufactured by the present invention also include non-multilayer ceramic electronic components such as ceramic resonators, ceramic filters, ceramic resistors, ceramic thermistors, ceramic substrates, etc. [Background technology]

[0003] Patent Document 1 (JP Patent Publication No. 11-233364) discloses a method for manufacturing a multilayer ceramic capacitor (ceramic electronic component).

[0004] The method for producing a multilayer ceramic capacitor disclosed in Patent Document 1 includes a step of producing a compact in which ceramic green sheets and internal electrode layers are laminated, and a step of firing the compact to obtain a sintered body.

[0005] Among these steps, the step of firing the molded bodies generally employs a method in which a plurality of molded bodies are placed on a ceramic sagger and fired in a firing furnace. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Japanese Patent Application Publication No. 11-233364 Summary of the Invention [Problem to be solved by the invention]

[0007] In the above-mentioned conventional method for manufacturing ceramic electronic components, the step of firing a green body (not limited to a laminated green body, but including a so-called bulk green body) has a problem in that the characteristics (electrical characteristics, etc.) and shape of each obtained sintered body vary. That is, depending on the position on the sagger and the state in which the sintered body is placed, the characteristics and shape of each obtained sintered body vary, and this causes a problem in that the characteristics and shape of the manufactured ceramic electronic components vary.

[0008] Furthermore, there is a problem in that a plurality of sintered bodies that have been subjected to the firing process tend to adhere to each other, resulting in the production of defective products, which in turn reduces the productivity of ceramic electronic components.

[0009] Furthermore, not only in the firing process but also in other processing steps, variations in the characteristics and shapes of the manufactured ceramic electronic components may occur due to the structure of the jig used. [Means for solving the problem]

[0010] The present invention has been made to solve the above-mentioned problems in the conventional art, and as a means for achieving this, a method for manufacturing a ceramic electronic component in one embodiment of the present invention comprises a chip-shaped ceramic element fabrication step of fabricating a plurality of chip-shaped ceramic elements; a jig preparation step of preparing a jig formed with a plurality of chip storage sections, the jig having a bottom portion supporting the chip-shaped ceramic elements from below and a sidewall portion that is open at the top; a chip-shaped ceramic element storage step of storing chip-shaped ceramic elements one by one in each of the chip storage sections of the jig; a chip-shaped ceramic element processing step of processing the chip-shaped ceramic elements stored in the chip storage sections of the jig; and a chip-shaped ceramic element removal step of removing the chip-shaped ceramic elements from the chip storage sections of the jig. Effect of the Invention

[0011] According to the method for producing a ceramic electronic component of the present invention, it is possible to suppress the occurrence of variations in the quality (characteristics, shape, etc.) of the ceramic electronic components.

[0012] Furthermore, according to the method for producing a ceramic electronic component of the present invention, the chip-shaped ceramic bodies that have been subjected to the chip-shaped ceramic body processing step are prevented from adhering to each other, thereby improving the productivity of ceramic electronic components. [Brief description of the drawings]

[0013] [Figure 1] FIG. 1 is a cross-sectional view of a multilayer ceramic capacitor 100. [Diagram 2] 2(A) and 2(B) are explanatory views each showing one step in an example of a method for manufacturing the multilayer ceramic capacitor 100. As shown in FIG. [Diagram 3] 3(C) to 3(F) are continuations of FIG. 2(B), and are each an explanatory diagram showing a step in an example of a method for manufacturing the multilayer ceramic capacitor 100, or a multilayer ceramic capacitor in the process of being manufactured. [Figure 4] 4(G) and (H) are continuations of FIG. 3(F), and each is an explanatory diagram showing one step in an example of a method for manufacturing the multilayer ceramic capacitor 100. [Diagram 5] 5(I) and (J) are continuations of FIG. 4(H), and are each an explanatory diagram showing a multilayer ceramic capacitor in the process of being manufactured in an example of a method for manufacturing the multilayer ceramic capacitor 100. [Figure 6] FIG. 6 is a top view of the jig 1000. [Figure 7] 7(A) to (D) are cross-sectional views of the jig 1000. [Figure 8] Fig. 8(A) is a plan view of the main part of the jig 1000. Figs. 8(B) and 8(C) are cross-sectional views of the main part of the jig 1000. [Figure 9]9(A) is an explanatory diagram showing a diameter dimension P of an inscribed circle of a side wall portion 8c of a chip storage portion 8 in a jig 1000. FIG. 9(B) is an explanatory diagram showing a depth dimension Q of the chip storage portion 8 in the jig 1000. [Figure 10] 10(A) and (B) are explanatory diagrams showing a jig 1000 according to the second modified example. [Figure 11] FIG. 11 is an explanatory diagram showing a jig 1000 according to the third modification. [Figure 12] 12(A) and (B) are cross-sectional views of a jig 1000 according to the fourth modification. [Figure 13] Fig. 13(A) is a plan view of the jig 2000. Fig. 13(B) is a cross-sectional view of the jig 2000. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

[0015] Note that each embodiment is an illustrative example of an embodiment of the present invention, and the present invention is not limited to the contents of the embodiment. In addition, it is possible to combine the contents described in different embodiments and implement them, and the implementation contents in such cases are also included in the present invention. In addition, the drawings are intended to aid in understanding the specification, and may be drawn diagrammatically, and the dimensional ratios of the drawn components or between the components may not match the dimensional ratios of those components described in the specification. In addition, components described in the specification may be omitted in the drawings, or may be drawn with the number of components omitted.

[0016] [First embodiment] In the first embodiment, the multilayer ceramic capacitor 100 is manufactured using a jig 1000 described later. However, the ceramic electronic component to be manufactured is not limited to a multilayer ceramic capacitor, and may be other multilayer ceramic electronic components such as a multilayer ceramic inductor, a multilayer ceramic thermistor, a multilayer ceramic LC component, or a multilayer ceramic substrate, or a non-multilayer ceramic electronic component such as a ceramic resonator, a ceramic filter, a ceramic resistor, a ceramic thermistor, or a ceramic substrate. Furthermore, the jig used in the manufacturing is not limited to the jig 1000, and other jigs may be used.

[0017] (Multilayer ceramic capacitors 100) 1 shows a multilayer ceramic capacitor 100 manufactured in accordance with the first embodiment. Note that FIG. 1 is a cross-sectional view of the multilayer ceramic capacitor 100.

[0018] The multilayer ceramic capacitor 100 includes a rectangular parallelepiped chip-shaped ceramic body 11. The chip-shaped ceramic body 11 includes a plurality of non-conductive layers 11a, a plurality of first internal electrode layers 12, and a plurality of second internal electrode layers 13 that are laminated together.

[0019] The material of the chip-shaped ceramic body 11 (non-conductive layer 11a) is arbitrary. For example, BaTiO 3 However, BaTiO 3 Instead, CaTiO 3 , SrTiO 3 , CaZrO 3 Alternatively, a dielectric ceramic containing other materials as a main component may be used.

[0020] The non-conductive layer 11a may have any thickness, but may have a thickness of, for example, about 0.3 μm to 2.0 μm in the effective capacitance formation region where the first internal electrode layer 12 and the second internal electrode layer 13 are formed.

[0021] The number of non-conductive layers 11a is arbitrary, but may be, for example, about 1 to 6000 layers in an effective region for forming capacitance where the first internal electrode layers 12 and the second internal electrode layers 13 are formed.

[0022] At both ends in the stacking direction of the chip-shaped ceramic element body 11, there is provided an outer layer (protective layer) constituted only by the non-conductor layer 11a, without the first internal electrode layer 12 and the second internal electrode layer 13. The thickness of the non-conductor layer 11a in the outer layer region may be different from the thickness of the non-conductor layer 11a in the effective region for capacitance formation where the first internal electrode layer 12 and the second internal electrode layer 13 are formed. In addition, the material of the non-conductor layer 11a in the outer layer region may be different from the material of the non-conductor layer 11a in the effective region.

[0023] The first internal electrode layer 12 is extended to one end face (any outer surface perpendicular to the lamination direction) of the chip-shaped ceramic element body 11. The second internal electrode layer 13 is extended to the other end face (an outer surface facing back to back with the one end face) of the chip-shaped ceramic element body 11. The first internal electrode layer 12 and the second internal electrode layer 13 are laminated alternately in principle.

[0024] The material of the main component (metal component) of the first internal electrode layer 12 and the second internal electrode layer 13 is arbitrary, and for example, Ni, Cu, Ag, Pd, Au, etc. can be used. Ni, Cu, Ag, Pd, Au, etc. may be alloyed with other metals. The first internal electrode layer 12 and the second internal electrode layer 13 may contain other components such as ceramics in addition to the metal component.

[0025] The thickness of the first internal electrode layer 12 and the second internal electrode layer 13 is arbitrary, but can be, for example, about 0.3 μm to 1.5 μm.

[0026] A first external electrode 14 is formed on one end face of the outer surface of the chip-shaped ceramic element body 11. A second external electrode 15 is formed on the other end face of the outer surface of the chip-shaped ceramic element body 11. The first internal electrode layer 12 is electrically connected to the first external electrode 14. The second internal electrode layer 13 is electrically connected to the second external electrode 15.

[0027] The first external electrode 14 and the second external electrode 15 may have any structure. It is also preferable to form one or more plated electrode layers on the outer surfaces of the first external electrode 14 and the second external electrode 15. However, the plated electrode layers are not shown in FIG.

[0028] The material of the main component (metal component) of the first external electrode 14 and the second external electrode 15 is arbitrary, and for example, Ni, Cu, Ag, Pd, Au, etc. can be used. Ni, Cu, Ag, Pd, Au, etc. may be alloyed with other metals. The base electrode layer may contain other components such as ceramics in addition to the metal component.

[0029] The type and number of plated electrode layers are also arbitrary. For example, a Cu-plated electrode layer, a Ni-plated electrode layer, a Sn-plated electrode layer, etc. can be formed.

[0030] (One Example of a Manufacturing Method for the Multilayer Ceramic Capacitor 100) 2(A) to 5(J), a method for manufacturing the multilayer ceramic capacitor 100 according to this embodiment will be described below. In the method for manufacturing the multilayer ceramic capacitor 100 according to this embodiment, a jig 1000, which will be described later, is used.

[0031] (1) Preparation of ceramic slurry Although not shown in the figure, a dielectric ceramic powder, a binder resin, a solvent, etc. are prepared and wet-mixed to produce a ceramic slurry.

[0032] (2) Preparation of ceramic green sheets A ceramic green sheet 21a for producing a non-conductive layer 11a shown in Fig. 2(A) is prepared. The ceramic green sheet 21a is preferably prepared as a mother ceramic green sheet 31a including a plurality of ceramic green sheets 21a in order to collectively produce a plurality of ceramic electronic components. Fig. 2(A) shows the mother ceramic green sheet 31a, with the ceramic green sheet 21a that will become one ceramic electronic component separated by a dashed line.

[0033] First, a carrier film (not shown) is prepared. Next, the ceramic slurry is applied in a sheet shape onto the carrier film using, for example, a die coater, a gravure coater, or a microgravure coater, and then dried to produce a ceramic green sheet 21a. The produced ceramic green sheet 21a is appropriately peeled off and removed from the carrier film in a later process.

[0034] (3) Preparation of internal electrode paste / external electrode paste Although not shown in the figure, metal powder, binder resin, solvent, etc. are prepared and wet-mixed to produce the internal electrode paste and the external electrode paste. The internal electrode paste and the external electrode paste may differ from each other in terms of materials, material ratios, viscosity, etc.

[0035] (4) Application of internal electrode paste As shown in Fig. 2(B), the internal electrode paste 22 for forming the first internal electrode layer 12 and the internal electrode paste 23 for forming the second internal electrode layer 13 are applied to the main surface of a predetermined ceramic green sheet 21a in a desired pattern shape. The internal electrode paste is not applied to the ceramic green sheet 21a that will become the outer layer. The internal electrode paste can be applied by, for example, screen printing, inkjet printing, intaglio printing, letterpress printing, etc. After the internal electrode pastes 22 and 23 are applied, a drying process is performed.

[0036] (5) Preparation of mother ceramic green sheet laminate First, the mother ceramic green sheets 31a shown in Fig. 2(B) are laminated in a predetermined order. The mother ceramic green sheets 31a include ceramic green sheets 21a coated with the internal electrode paste 22, ceramic green sheets 21a coated with the internal electrode paste 23, and ceramic green sheets 21a not coated with the internal electrode paste. At this point, the ceramic green sheets 21a have been peeled and removed from the carrier film.

[0037] 3(C), the stacked mother ceramic green sheets 31a are pressure-bonded to be integrated to produce a mother ceramic green sheet laminate 31. The mother ceramic green sheet laminate 31 includes a plurality of unsintered chip-shaped ceramic bodies 21.

[0038] (6) Cutting the mother ceramic green sheet laminate As shown in FIG. 3(D), the mother ceramic green sheet laminate 31 is cut, for example, by a cutting blade 50 to obtain a plurality of individual unsintered chip-shaped ceramic bodies 21 as shown in FIG. 3(E).

[0039] (7) Barrel polishing If necessary, the unsintered chip-shaped ceramic body 21 is subjected to barrel polishing to form roundness R at the corners and ridges of the unsintered chip-shaped ceramic body 21, as shown in FIG. 3(F).

[0040] (8) Jig preparation process A jig 1000 is prepared. More specifically, the jig 1000 is prepared in which a plurality of chip storage sections 8 are formed, the jig 1000 having a bottom section that supports the unsintered chip-shaped ceramic body 21 from below and a sidewall section that is open at the top. The jig 1000 will be described later, and therefore will not be described here.

[0041] (9) Chip-shaped ceramic body packing process Next, as shown in Fig. 4(G), a plurality of unsintered chip-shaped ceramic bodies 21 are placed on the upper surface of the jig 1000 in random positions and states. Then, the jig 1000 is vibrated, and the unsintered chip-shaped ceramic bodies 21 are stored one by one in one of the chip storage sections 8 of the jig 1000, as shown in Fig. 4(H). After the storage is complete, it is also preferable to remove excess unsintered chip-shaped ceramic bodies 21 from the jig 1000 by further vibrating the jig 1000, tilting the jig 1000, or tilting the jig 1000 while vibrating it.

[0042] The unsintered chip-shaped ceramic bodies 21 may be stored in the chip storage unit 8 by tilting the jig 1000 instead of vibrating the jig 1000. The unsintered chip-shaped ceramic bodies 21 may be stored directly in the chip storage unit 8 by using an automatic machine, for example, without placing the unsintered chip-shaped ceramic bodies 21 on the upper surface of the jig 1000.

[0043] (10) Firing (one of the processes for processing ceramic chip bodies) 4(H), the unsintered chip-shaped ceramic bodies 21 are stored one by one in each chip storage section 8 of the jig 1000, and are heated and fired together with the jig 1000. If the ceramic green sheet 21a contains a resin component, a degreasing step may be performed prior to the firing step to reduce or remove the resin component by heating or the like.

[0044] The firing is performed according to a desired temperature profile. Through firing, the ceramic green sheets 21a become the non-conductive layers 11a, the internal electrode pastes 22 become the first internal electrode layers 12, and the internal electrode pastes 23 become the second internal electrode layers 13. Then, the unfired chip-shaped ceramic body 21 becomes the fired chip-shaped ceramic body 11.

[0045] (11) Removal of the ceramic chip body As shown in FIG. 5(I), the fired chip-shaped ceramic body 11 is taken out from the chip storage section 8 of the jig 1000.

[0046] (12) Formation of external electrodes As shown in FIG. 5(J), a first external electrode 14 is formed on one end of the chip-shaped ceramic body 11, and a second external electrode 15 is formed on the other end.

[0047] Specifically, the external electrode paste is applied to both ends of the outer surface of the chip-shaped ceramic element body 11. Next, the chip-shaped ceramic element body 11 with the external electrode paste applied thereto is heated to bake the external electrode paste onto the outer surface of the chip-shaped ceramic element body 11, thereby forming the first external electrode 14 and the second external electrode 15.

[0048] (13) Plating Next, the outer surfaces of the first external electrode 14 and the second external electrode 15 are subjected to, for example, electrolytic plating to form a plating layer consisting of one or more layers.

[0049] Through the above steps, the multilayer ceramic capacitor 100 is completed.

[0050] (Modification 1 of the manufacturing method of the multilayer ceramic capacitor 100) In the above-described method for manufacturing the multilayer ceramic capacitor 100, a plurality of mother ceramic green sheets 31a are laminated, pressure-bonded, and integrated to produce the mother ceramic green sheet laminate 31, and then the mother ceramic green sheet laminate 31 is cut into individual unsintered chip-shaped ceramic bodies 21. In the first modification, this method is modified.

[0051] Specifically, in Modification 1, a mother ceramic green sheet 31a including a plurality of ceramic green sheets 21a is first cut into individual ceramic green sheets 21a. Then, the cut ceramic green sheets 21a are stacked and pressure-bonded to be integrated, thereby producing an unsintered chip-shaped ceramic body 21.

[0052] In this manner, the order of the steps for producing the unsintered chip-shaped ceramic bodies 21 may be changed.

[0053] (Modification 2 of the manufacturing method of the multilayer ceramic capacitor 100) In the above-described method for manufacturing the multilayer ceramic capacitor 100, the unsintered chip-shaped ceramic body 21 is fired to obtain the fired chip-shaped ceramic body 11, and then the external electrode paste is applied to both ends of the chip-shaped ceramic body 11 and fired to form the first external electrode 14 and the second external electrode 15. In the second modification, this method is modified.

[0054] Specifically, in the second modification, first, prior to the firing step, an external electrode paste is applied to both ends of the unsintered chip-shaped ceramic element body 21. Then, in the firing step, the external electrode paste is baked to form the first external electrode 14 and the second external electrode 15 on both ends of the chip-shaped ceramic element body 11.

[0055] In this manner, the method of forming the first external electrode 14 and the second external electrode 15 may be changed.

[0056] (Jig 1000) Next, the jig 1000 used in the above-mentioned method for manufacturing the multilayer ceramic capacitor 100 will be described.

[0057] The jig 1000 is shown in Fig. 6, Fig. 7(A)-(D), and Fig. 8(A)-(C). Fig. 6 is a plan view of the jig 1000. Fig. 7(A)-(D) are cross-sectional views of the jig 1000. Fig. 7(A) shows the portion indicated by the dashed-dotted arrow SS in Fig. 6. Fig. 7(B) shows the portion indicated by the dashed-dotted arrow TT in Fig. 6. Fig. 7(C) shows the portion indicated by the dashed-dotted arrow UU in Fig. 6. Fig. 7(D) shows the portion indicated by the dashed-dotted arrow VV in Fig. 6. Fig. 8(A) is a plan view of the main part of the jig 1000. Figs. 8(B) and (C) are cross-sectional views of the main part of the jig 1000. Fig. 8(A) shows the upper right end portion of the jig 1000 in Fig. 6. Fig. 8(B) shows the portion indicated by the dashed-dotted arrow SS in Fig. 6. FIG. 8C shows the part indicated by the dashed dotted line arrow UU in FIG.

[0058] The jig 1000 has a vertical direction X, a horizontal direction Y perpendicular to the vertical direction X, and a height direction Z perpendicular to both the vertical direction X and the horizontal direction Y, and these directions may be referred to in the following description. A plane including the vertical direction X and the horizontal direction Y may be called a reference plane, and the following description may refer to the reference plane.

[0059] The jig 1000 has a first linear member group 1G, a second linear member group 2G, a third linear member group 3G, a fourth linear member group 4G, a fifth linear member group 5G, a sixth linear member group 6G, and a seventh linear member group 7G, which are stacked in this order from bottom to top in the height direction Z. However, the number of linear member groups is not limited to seven and can be increased or decreased from seven.

[0060] In this embodiment, the first linear member group 1G includes seven straight linear members 1 extending in the vertical direction X. The seven linear members 1 are arranged parallel to one another at an arrangement pitch D. The arrangement pitch refers to the distance between the centers of two adjacent linear members that are arranged at a distance from one another.

[0061] The second linear member group 2G includes seven straight linear members 2 extending in the horizontal direction Y. The seven linear members 2 are arranged parallel to one another at an arrangement pitch E. Note that the interval E may be the same as the interval D, or may be different from the interval D.

[0062] The third linear member group 3G includes eight straight linear members 3 extending in the vertical direction X. The eight linear members 3 are arranged parallel to one another with an arrangement pitch D. The linear members 3 of the third linear member group 3G are arranged relative to the linear members 1 of the first linear member group 1G such that the intervals between the linear members 1 and the linear members 3 are uniform at all points when viewed in the height direction Z. Note that in the plan view of FIG. 6, the linear members 3 of the third linear member group 3G are not visible because they are arranged directly below the linear members 7 of the seventh linear member group 7G described later.

[0063] The fourth linear member group 4G includes eight straight linear members 4 extending in the horizontal direction Y. The eight linear members 4 are arranged parallel to one another with an arrangement pitch E. The linear members 4 of the fourth linear member group 4G are arranged relative to the linear members 2 of the second linear member group 2G such that the intervals between the linear members 2 and the linear members 4 are uniform at all points when viewed in the height direction Z. Note that in the plan view of FIG. 6, the linear members 4 of the fourth linear member group 4G are not visible because they are arranged directly below the linear members 6 of the sixth linear member group 6G described later.

[0064] The fifth linear member group 5G includes eight straight linear members 5 extending in the vertical direction X. The eight linear members 5 are arranged parallel to each other with an arrangement pitch D. The linear members 5 of the fifth linear member group 5G are each arranged directly above the linear members 3 of the third linear member group 3G. Note that in the plan view of FIG. 6, the linear members 5 of the fifth linear member group 5G are not visible because they are arranged directly below the linear members 7 of the seventh linear member group 7G described later.

[0065] The sixth linear member group 6G includes eight straight linear members 6 extending in the horizontal direction Y. The eight linear members 6 are arranged parallel to one another at an arrangement pitch E. The linear members 6 of the sixth linear member group 6G are each arranged directly above the linear members 4 of the fourth linear member group 4G.

[0066] The seventh linear member group 7G includes eight straight linear members 7 extending in the vertical direction X. The eight linear members 7 are arranged parallel to one another at an arrangement pitch D. The linear members 7 of the seventh linear member group 7G are each arranged directly above the linear members 5 of the fifth linear member group 5G.

[0067] The number of linear members 1 to 7 is arbitrary and can be increased or decreased.

[0068] In this embodiment, the linear members 1, 3, 5, and 7 are perpendicular to the linear members 2, 4, and 6. That is, they intersect at an angle of 90°. However, the angle at which the linear members 1, 3, 5, and 7 intersect with the linear members 2, 4, and 6 is not limited to 90° and can be increased or decreased from 90°.

[0069] In this embodiment, the linear members 1 to 7 have a circular cross-sectional shape and the same area and diameter. However, the cross-sectional shape, area, diameter, etc. of the linear members 1 to 7 are arbitrary and can be freely selected. In addition, the cross-sectional shape, area, diameter, etc. of the linear members 1 to 7 may be different for each linear member.

[0070] In this embodiment, ceramics are used as the material (raw material) of the linear members 1 to 7. As the ceramics, for example, SiC, zirconia, yttria-stabilized zirconia, alumina, mullite, etc. can be used. However, the material of the linear members 1 to 7 is arbitrary, and instead of ceramics, metals such as nickel, aluminum, Inconel (registered trademark), and SUS, resin materials such as polytetrafluoroethylene (PTFE), polypropylene (PP), acrylic resin, ABS (Acrylonitrile butadiene styrene)-like resin, and other heat-resistant resins, carbon, composite materials made of metal and ceramic, etc. may be used.

[0071] The surfaces of the linear members 1 to 7 may be further coated with a ceramic such as SiC, zirconia, yttria-stabilized zirconia, alumina, or mullite, or a metal such as nickel.

[0072] The jig 1000 can be produced, for example, by molding a wet mixture of ceramic powder, binder resin, solvent, etc. to produce an unsintered ceramic linear member, using the unsintered ceramic linear member to produce an unsintered structure, and then firing the structure.

[0073] The jig 1000 having the above-mentioned structure is provided with a plurality of chip storage sections 8. Each chip storage section 8 has an opening 8a at the top. The chip storage section 8 is for storing chip-shaped ceramic bodies.

[0074] The multiple chip storage sections 8 are formed with regularity in the jig 1000. In this embodiment, the multiple chip storage sections 8 are formed in a matrix (checkerboard pattern) on the main surface of the jig 1000. However, the arrangement of the chip storage sections 8 is not limited to a matrix pattern.

[0075] Each chip storage section 8 has a bottom 8b that supports the chip-shaped ceramic body from below, and a sidewall 8c that is opened by an opening 8a. In this embodiment, each chip storage section 8 has one bottom 8b and four sidewalls 8c. However, the number of sidewalls 8c is not limited to four and can be increased or decreased from four.

[0076] The chip storage section 8 stores the chip-shaped ceramic body without restraint.

[0077] 8(A), the bottom 8b of the chip storage section 8 is formed by the top surface (ridge line) of the linear member 2. The bottom 8b has a bottom through-hole 8d that is formed by the gap between two adjacent linear members 2 and communicates with the back surface of the bottom 8b.

[0078] 8(B) and (C), side wall 8c of chip storage section 8 is formed by linear members 4 and 6, or linear members 3, 5 and 7. Side wall 8c has side wall through holes 8e that communicate with other adjacent chip storage sections 8 in the gap between linear member 4 and linear member 6, the gap between linear member 3 and linear member 5, the gap between linear member 5 and linear member 7, etc.

[0079] (Features of Jig 1000 1) By using jig 1000 having the above-described structure, the chip ceramic element processing step (e.g., firing step) can be performed while the chip ceramic elements are stored individually one by one in chip storage section 8, thereby reducing the variation in processing conditions for each chip ceramic element. Therefore, ceramic electronic components manufactured using jig 1000 have reduced variation in quality (characteristics, shape, etc.).

[0080] Furthermore, by using the jig 1000, the chip-shaped ceramic bodies do not come into contact with each other during the chip-shaped ceramic body processing step (e.g., the firing step), so that the chip-shaped ceramic bodies that have been through the chip-shaped ceramic body processing step are less likely to adhere to each other. Even if the chip-shaped ceramic bodies are brittle, they are less likely to collide with each other and be damaged. Therefore, by using the jig 1000, the defective rate of ceramic electronic components can be reduced.

[0081] Furthermore, by using the jig 1000, the ceramic chip bodies can be easily accommodated in the chip accommodation portion 8 in a short time, thereby enabling ceramic electronic components to be manufactured with high productivity.

[0082] Furthermore, when ceramics are used as the material (raw material) of the jig 1000, the heat resistance is higher than that of other materials, so that even if the processing step involves heating, such as a synthesis step or a firing step, the jig 1000 can be prevented from being damaged or deformed. Furthermore, if the material of the jig 1000 is ceramic, consideration of the synthesis atmosphere or firing atmosphere can be reduced. For example, if the material of the jig 1000 is nickel, there is a risk that the nickel will absorb oxygen in the atmosphere and change the atmosphere, but if the material of the jig 1000 is ceramic, such a problem is unlikely to occur. Furthermore, if the material of the jig 1000 is ceramic, consideration of the reaction with the chip-shaped ceramic element can be reduced. For example, if the material of the jig 1000 is iron, there is a risk that the iron will react with the chip-shaped ceramic element, but if the material of the jig 1000 is ceramic, such a problem is unlikely to occur.

[0083] In addition, the jig 1000 is resistant to physical impacts because the linear members 1 to 7 are substantially straight and have no bent parts. In addition, the jig 1000 is not easily damaged even when stress is applied due to temperature changes. Therefore, the jig 1000 is not easily damaged even when it is made of a material that is weak against impacts, such as ceramic.

[0084] (Features of Jig 1000 2) In order to manufacture ceramic electronic components with high productivity, a plurality of jigs housing chip-shaped ceramic bodies are sometimes stacked in multiple tiers during a chip-shaped ceramic body processing step such as a firing step. However, conventional jigs have a problem in that the ventilation of the housing section deteriorates when the jigs are stacked in multiple tiers.

[0085] In contrast, the jig 1000 has an opening 8a provided above the chip storage section 8, as well as a side wall through hole 8e formed in the side wall 8c and a bottom through hole 8d formed in the bottom 8b. Note that the side wall through hole 8e and the bottom through hole 8d are desirably sized and shaped to prevent the chip-shaped ceramic body from passing through.

[0086] The jig 1000 has, in addition to the opening 8a, a side wall through hole 8e and a bottom through hole 8d through which gas can pass, and therefore has good ventilation. Therefore, by using the jig 1000, it is possible to suppress processing defects caused by poor ventilation.

[0087] (Regarding the dimensions of the chip storage section 8 of the jig 1000) The jig 1000 is designed so that one chip-shaped ceramic element is stored in one chip storage section 8. In this embodiment, it is assumed that the chip storage section 8 stores a rectangular parallelepiped chip-shaped ceramic element in an upright position (with the long sides of the chip-shaped ceramic element parallel to the height direction Z).

[0088] To explain the requirements in this embodiment in more detail, the dimensions of the chip storage section 8 must be such that they allow ample space for the chip-shaped ceramic elements to be easily inserted. However, the dimensions of the chip storage section 8 must not allow the chip-shaped ceramic elements to be stored in a lying position. Furthermore, the dimensions of the chip storage section 8 must not allow two or more chip-shaped ceramic elements to be stored side by side in an upright position. Furthermore, the dimensions of the chip storage section 8 must not allow the chip-shaped ceramic elements once stored in the chip storage section 8 to easily fly out when vibration is applied. Furthermore, the dimensions of the chip storage section 8 must not allow two or more chip-shaped ceramic elements to be stored in an upright position, stacked one on top of the other.

[0089] In order to satisfy the above requirements, it is preferable that the dimensions of the chip storage section 8, that is, the diameter P of the inscribed circle of the side wall 8c of the chip storage section 8 when viewed from above in the height direction as shown in Figure 9(A) and the depth dimension Q defined by the dimension from the bottom 8b to the opening 8a of the chip storage section 8 when viewed in a side direction perpendicular to the height direction as shown in Figure 9(B), satisfy the following formula (1).

[0090] (P / 2) <Q<(3√2 / 2)P···(1)

[0091] The reason why it is preferable that the dimensions of chip housing section 8 satisfy formula (1) will be explained below. However, the dimensions of the chip-shaped ceramic element body to be housed in chip housing section 8 are assumed to be a shape adopted in many ceramic electronic components, in which the thickness dimension is a and the length dimension is 2a when the width dimension is a.

[0092] The dimensions of the chip storage part 8 need to have a margin so that the chip-shaped ceramic blank can easily fit in. However, if the chip-shaped ceramic blank stored in the chip storage part 8 in an upright state can rotate in the circumferential direction within the chip storage part 8, it can be said that the dimensions have a margin. For this purpose, it is necessary to satisfy the following formula (2). Formula (2) stipulates that the diagonal dimension (√2)a of the chip-shaped ceramic blank as viewed in the height direction is smaller than the diameter dimension P of the inscribed circle, and stipulates that the chip-shaped ceramic blank can rotate within the chip storage part 8.

[0093] (√2)a < P ··· (2)

[0094] The dimensions of the chip storage part 8 must not be such that one chip-shaped ceramic blank can be stored in a lying state. Also, the dimensions of the chip storage part 8 must not be such that two or more chip-shaped ceramic blanks can be arranged and stored in an upright state. For this purpose, it is sufficient that 2a, which is twice the width dimension a, twice the thickness dimension a, and also the length dimension, is larger than the diameter dimension P of the inscribed circle. That is, it is sufficient to satisfy the following formula (3).

[0095] P < 2a ··· (3)

[0096] The dimensions of the chip storage part 8 must not be such that the chip-shaped ceramic blank that has been properly stored in the chip storage part 8 will easily jump out when vibration is applied. For this purpose, it is sufficient that the depth Q of the chip storage part 8 is larger than 0.5 times (half) the length dimension 2a of the chip-shaped ceramic blank. That is, it is sufficient if 2a × 0.5 < Q, and it is sufficient to satisfy the following formula (4).

[0097] a < Q ··· (4)

[0098] In order not to accommodate two or more chip-shaped ceramic green bodies in a stacked state in the chip storage portion 8, it is sufficient that the depth Q of the chip storage portion 8 is smaller than 1.5 times the length dimension 2a of the chip-shaped ceramic green body. Even if an unnecessary chip-shaped ceramic green body is accommodated on top, by applying vibration, tilting the jig, or tilting the jig while applying vibration, the unnecessary chip-shaped ceramic green body accommodated on top can be easily removed outside the chip storage portion 8. Therefore, it is sufficient that Q < 2a × 1.5, and it is sufficient to satisfy the following formula (5).

[0099] Q < 3a ··· (5)

[0100] From formula (3) and formula (4), (P / 2) < a < Q holds, and further the following formula (6) holds.

[0101] (P / 2) < Q ··· (6)

[0102] Also, from formula (2) and formula (5), Q < 3a < (3√2 / 2)P holds, and further the following formula (7) holds.

[0103] Q < (3√2 / 2)P ··· (7)

[0104] And by combining formula (6) and formula (7), formula (1) holds.

[0105] (P / 2) < Q < (3√2 / 2)P ··· (1)

[0106] When the dimensions of the jig 1000 are such that the dimension of the inscribed circle diameter of the side wall portion 8c of the chip storage portion 8 as viewed from above in the height direction is P, and the depth dimension defined by the dimension from the bottom portion 8b to the opening 8a of the chip storage portion 8 as viewed in the side surface direction orthogonal to the height direction is Q, it is preferable to satisfy formula (1).

[0107] When the dimensions of chip storage section 8 of jig 1000 satisfy formula (1), assuming that they satisfy formulas (2) and (3), chip storage section 8 has sufficient space to store chip-shaped ceramic elements, and chip storage section 8 does not store chip-shaped ceramic elements lying down, nor does it store two or more chip-shaped ceramic elements side by side in an upright position; once a chip-shaped ceramic element is properly stored in chip storage section 8, it will not easily fly out when vibration is applied; and furthermore, chip storage section 8 does not store two or more chip-shaped ceramic elements stacked on top of each other in an upright position.

[0108] (Modification 1 of Jig 1000) In a factory that manufactures multiple types of ceramic electronic components, or in a factory that manufactures multiple products of the same type of ceramic electronic component that differ in size, etc., it may be necessary to provide and use multiple types of jigs 1000 with chip storage portions 8 that differ in size, shape, etc.

[0109] In this case, it is important that the type of jig 1000 can be easily distinguished. If it takes time to select the jig 1000, the productivity of ceramic electronic components will decrease. In addition, if the wrong type of jig 1000 is used, there is a risk that defects will occur in the characteristics and shape of the manufactured ceramic electronic components. For example, this may occur when a small chip-shaped ceramic element is processed using a jig 1000 having a large chip storage portion 8, or when a large chip-shaped ceramic element is processed using a jig 1000 having a small chip storage portion 8.

[0110] Therefore, it is preferable to provide a portion of the jig 1000 with a unique feature different from the other portions so that the type of jig 1000 can be easily distinguished. The different unique feature is, for example, color. Giving a portion of the jig 1000 a color different from the other portions is considered to be preferable because it is believed that this does not reduce the breathability, heat resistance, resistance to physical impact, etc. of the jig 1000. However, the different unique feature is not limited to color, and it is also possible to change the shape of the jig 1000 or add a marker member.

[0111] The following specific examples are conceivable. The jig 1000 described above is composed of linear members 1 to 7, and a method of making one type of linear member a different color from the other linear members is conceivable. For example, the linear member 1 for each jig 1000 is color-coded into red, blue, green, etc., depending on the size (e.g., large, medium, small) of the chip storage section 8. Note that in each jig 1000, the remaining linear members 2 to 7 are colored a different color from the linear member 1. This method makes it easy to distinguish the types of jigs 1000.

[0112] As a method for changing the color of the linear member, for example, heat-resistant ink or colored zirconia may be added to the material of the linear member 1. This method is preferable because it does not reduce the heat resistance of the jig 1000, especially when the material of the jig 1000 contains ceramic. In this case, it is more preferable to color the linear members 1 belonging to the first linear member group 1G. This is because the linear members 1 belonging to the first linear member group 1G do not come into contact with the chip-shaped ceramic element body housed in the chip storage section 8, and therefore it is considered that the effect of coloring on the chip-shaped ceramic element body can be eliminated or minimized.

[0113] The jig 1000 according to the first modification makes it easy to distinguish the type of jig.

[0114] (Modification 2 of Jig 1000) It is also preferable that the jig 1000 can be separated in the height direction Z into a plurality of parts.

[0115] 10(A) and (B) show a second modification in which the jig 1000 can be separated into a lower portion 1000A and an upper portion 1000B. FIG. 10(A) shows the lower portion 1000A and the upper portion 1000B in a separated state, and FIG. 10(B) shows the lower portion 1000A and the upper portion 1000B in a combined state. The lower portion 1000A is formed by linear members 1 to 5. The upper portion 1000B is formed by linear members 6 and 7.

[0116] The lower part 1000A has a lower chip storage section 8f having a lower wall portion 8ca. The upper part 1000B has an upper chip storage section 8g having an upper wall portion 8cb. When the lower part 1000A and the upper part 1000B are combined, the chip storage section 8 is composed of the lower chip storage section 8f and the upper chip storage section 8g. The side wall portion 8c is composed of the lower wall portion 8ca and the upper wall portion 8cb.

[0117] In the jig 1000, it is sometimes better for the heads of the chip-shaped ceramic bodies 200 housed in the chip housing portion 8 to protrude from the opening 8a to the outside of the chip housing portion 8, and sometimes it is better for them not to protrude.

[0118] For example, when removing the chip-shaped ceramic body 200 from the chip storage section 8, it is generally better for the head of the chip-shaped ceramic body 200 to protrude outside the chip storage section 8. This is because the smaller the depth of the chip storage section 8, the easier it is to remove the chip-shaped ceramic body 200. In this case, the upper portion 1000B of the jig 1000 can be removed to bring the head of the chip-shaped ceramic body 200 outside the chip storage section 8. In other words, the depth of the chip storage section 8 can be reduced.

[0119] On the other hand, when storing the chip-shaped ceramic elements 200 in the chip storage section 8, it is generally preferable that the heads of the chip-shaped ceramic elements 200 do not protrude outside the chip storage section 8. If the heads of the chip-shaped ceramic elements 200 protrude outside the chip storage section 8, there is a risk that the chip-shaped ceramic elements 200 previously stored in the chip storage section 8 will prevent other chip-shaped ceramic elements that have not yet been stored from being stored in other chip storage sections 8. In this case, the lower section 1000A and the upper section 1000B can be joined together to prevent the heads of the chip-shaped ceramic elements 200 from protruding outside the chip storage section 8. In other words, the depth of the chip storage section 8 can be increased.

[0120] In addition, since the upper part 1000B is intended to be removed or not removed depending on whether or not the head of the chip-shaped ceramic body 200 contained in the chip storage section 8 is exposed to the outside, it is also preferable to make the height dimension of the lower part 1000A larger than the height dimension of the upper part 1000B.

[0121] The jig 1000 may be separable in the height direction Z into three or more parts.

[0122] Since the jig 1000 of the second modification can be separated into a plurality of parts in the height direction Z, the depth of the chip storage portion 8 can be changed.

[0123] (Modification 3 of Jig 1000) It is also preferable that the chip storage section 8 in the jig 1000 has an area surrounded by the side wall section 8c that increases from the bottom to the top, because this makes it easier to store and remove the chip-shaped ceramic bodies.

[0124] FIG. 11 shows a third modified example of the jig 1000 in which the area surrounded by the side wall portion 8c of the chip storage portion 8 increases from the bottom to the top. In the third modified example, the diameter of the linear member 1 = the diameter of the linear member 2 = the diameter of the linear member 3 < the diameter of the linear member 4 = the diameter of the linear member 5 < the diameter of the linear member 6 = the diameter of the linear member 7, so that the size of the opening of the chip storage portion 8 increases from the bottom to the top. However, the diameters of the linear members 1 to 7 may be changed as appropriate. In addition, the method of increasing the size of the opening of the chip storage portion 8 from the bottom to the top is not limited to the method of adjusting the diameters of the linear members 1 to 7, and other methods may be used.

[0125] (Modification 4 of Jig 1000) 12(A) and (B) show a jig 1000 according to Modification 4. Note that, each of Figs. 12(A) and (B) is a cross-sectional view of the jig 1000.

[0126] In the jig 1000 according to the fourth modification, the arrangement pitch of the linear members is changed. That is, in the jig 1000 described above, a plurality of linear members 3 extending in the vertical direction X are arranged in parallel in the horizontal direction Y with an arrangement pitch D. A plurality of linear members 4 extending in the horizontal direction Y are arranged in parallel in the vertical direction X with an arrangement pitch E. A plurality of linear members 5 extending in the vertical direction X are arranged in parallel in the horizontal direction Y with an arrangement pitch D. A plurality of linear members 6 extending in the horizontal direction Y are arranged in parallel in the vertical direction X with an arrangement pitch E. A plurality of linear members 7 extending in the vertical direction X are arranged in parallel in the horizontal direction Y with an arrangement pitch D. And, the chip storage section 8 is formed in a matrix shape on the entire main surface of the jig 1000.

[0127] In the fourth modification, this is modified so that the arrangement pitch, which is the distance between the centers of two adjacent linear members spaced apart, is partially varied in the linear members 3, 4, 5, 6, and 7. Specifically, for the linear members 3, 5, and 7, a large arrangement pitch DB and a small arrangement pitch DS are alternately repeated. Also, for the linear members 4 and 6, a large arrangement pitch EB and a small arrangement pitch ES are alternately repeated. Note that, in order to improve the breathability described below, the magnitude of the large arrangement pitch DB is preferably 120% or more of the small arrangement pitch DS. Also, the magnitude of the large arrangement pitch EB is preferably 120% or more of the small arrangement pitch ES.

[0128] As a result, the main surface of the jig 1000 according to the fourth modified example is formed with chip receiving sections 8 capable of receiving chip-shaped ceramic bodies, and non-chip receiving sections 38 in which chip-shaped ceramic bodies cannot be received.

[0129] If chip storage section 8 is formed over the entire main surface of the jig, the accommodated chip-shaped ceramic elements may reduce breathability. In contrast, jig 1000 according to modification 4 is provided with non-chip storage section 38 that cannot accommodate chip-shaped ceramic elements, thereby improving breathability.

[0130] (Advantages of the manufacturing method of the ceramic electronic component (multilayer ceramic capacitor 100) according to the first embodiment)

[0131] In the method for manufacturing a ceramic electronic component of this embodiment, a chip-shaped ceramic body processing step (e.g., a firing step) is performed with chip-shaped ceramic body 21 accommodated in chip storage section 8 of jig 1000, so that the quality (electrical characteristics, shape, etc.) of processed chip-shaped ceramic body 11 is reduced in variation. In other words, chip-shaped ceramic body 11 can have extremely similar quality no matter which chip storage section 8 it is accommodated in and processed in.

[0132] Therefore, according to the method for manufacturing a ceramic electronic component of the present embodiment, the occurrence of variation in quality of the manufactured ceramic electronic component (multilayer ceramic capacitor 100) is suppressed.

[0133] Furthermore, according to the method for manufacturing a ceramic electronic component of this embodiment, chip ceramic bodies 11 that have been subjected to a chip ceramic body processing step (eg, a firing step) are prevented from adhering to each other.

[0134] Furthermore, in the method for manufacturing a ceramic electronic component of this embodiment, by using the highly breathable jig 1000, it may be possible to shorten the processing time (treatment time) in reaction-related steps such as a degreasing step.

[0135] Therefore, according to the method for manufacturing a ceramic electronic component of the present embodiment, it is possible to manufacture ceramic electronic components with a low defective rate and high productivity.

[0136] [Second embodiment] In the second embodiment, the jig used in the chip-shaped ceramic body processing step is changed from that in the first embodiment. That is, in the first embodiment, the above-mentioned jig 1000 is used to perform the chip-shaped ceramic body processing step (for example, the firing step), but in the second embodiment, this is changed and the chip-shaped ceramic body processing step is performed using a jig 2000 shown in Figures 13(A) and (B). However, Figure 13(A) is a plan view of the jig 2000. Figure 13(B) is a cross-sectional view of the jig 2000, showing the portion indicated by the dashed-dotted arrow RR in Figure 13(A).

[0137] The jig 2000 is rectangular in the height direction when viewed from above, and has a lower main surface and an upper main surface.

[0138] A plurality of chip storage sections 28 are formed in a matrix on the upper main surface of the jig 2000. When viewed from above in the height direction, each of the chip storage sections 28 has a rectangular shape.

[0139] Each chip storage section 28 has an opening 28a at the top in the height direction. Each chip storage section 28 has a bottom 28b that supports the chip-shaped ceramic elements from below. Each chip storage section 28 has a sidewall 28c that separates adjacent chip storage sections 28. At least one of the bottom 28b and the sidewall 28c may have a through hole of a size and shape that does not allow the chip-shaped ceramic elements to pass through.

[0140] The jig 2000 may be made of any material, but may be made primarily of ceramic, for example.

[0141] Using the jig 2000, a multilayer ceramic capacitor 100 (ceramic electronic component) was manufactured in the same manner as in the first embodiment.

[0142] In the second embodiment in which the jig 2000 is used, it is also possible to manufacture multilayer ceramic capacitors 100 (ceramic electronic components) with reduced variation in quality.

[0143] Furthermore, even if the chip-shaped ceramic bodies are subjected to a processing step such as a firing step, the chip-shaped ceramic bodies that have been subjected to the processing step are prevented from adhering to each other.

[0144] The above describes the methods for manufacturing ceramic electronic components according to the first and second embodiments. However, the present invention is not limited to the above-described content, and various modifications can be made in accordance with the spirit of the invention.

[0145] For example, in the above-described embodiment, a multilayer ceramic capacitor is manufactured as the ceramic electronic component, but the ceramic electronic component to be manufactured is not limited to a multilayer ceramic capacitor. Instead, the ceramic electronic component may be a multilayer ceramic electronic component such as a multilayer ceramic inductor, a multilayer ceramic thermistor, a multilayer ceramic LC component, or a multilayer ceramic substrate, or a non-multilayer ceramic electronic component such as a ceramic resonator, a ceramic filter, a ceramic resistor, a ceramic thermistor, or a ceramic substrate.

[0146] In the method for manufacturing a ceramic electronic component according to the embodiment, the chip-shaped ceramic body processing step is a firing step by heating, but the processing step is not limited to a synthesis step by heating. The chip-shaped ceramic body processing step may be, for example, a synthesis step, a degreasing step, a cleaning step, a drying step, an external electrode forming step (paste application, plating, vacuum film formation such as sputtering or deposition, etc.), an external shape processing step (rounding of edges, exposure of ends of internal electrodes, mechanical processing, mechanical polishing, sandblasting, chemical etching by liquid phase or gas phase, processing by laser or plasma, etc.), an annealing step, an aging step, a polarization step, a characteristic selection step, an appearance selection step, an environmental test step (which may include stress application), etc. In particular, for the step including heating, it is preferable to use a jig containing ceramic as a material because it has high heat resistance. For the step of exposing the chip-shaped ceramic body to gas or liquid, it is preferable to use a jig having a through hole in at least one of the bottom and side wall of the chip storage part because it has high air permeability and liquid permeability.

[0147] A method for producing a ceramic electronic component according to one embodiment of the present invention is as described in the section entitled "Means for Solving the Problems."

[0148] In this method for producing a ceramic electronic component, the chip-shaped ceramic body processing step is preferably a firing step, in which case the fired chip-shaped ceramic bodies are less likely to adhere to each other, thereby suppressing the occurrence of defective products.

[0149] It is also preferable that the chip-shaped ceramic element storing step involves placing a plurality of chip-shaped ceramic elements on a jig in random positions and states, and storing the plurality of chip-shaped ceramic elements placed on the jig in the chip storing unit by vibrating and / or tilting the jig. In this case, the chip-shaped ceramic elements can be stored in the chip storing unit easily and in a short time.

[0150] It is preferable that the chip-shaped ceramic element fabrication step includes a mother ceramic green sheet fabrication step of fabricating a mother ceramic green sheet including a plurality of ceramic green sheets, a mother ceramic green sheet laminate fabrication step of stacking and integrating the plurality of mother ceramic green sheets to fabricate a mother ceramic green sheet laminate, and a mother ceramic green sheet laminate cutting step of cutting the mother ceramic green sheet laminate into individual chip-shaped ceramic elements. In this case, it is possible to manufacture a multilayer ceramic electronic component with reduced variation in quality (characteristics, shape, etc.).

[0151] It is also preferable that the chip-shaped ceramic body fabrication step includes an internal electrode paste application step of applying an internal electrode paste to the main surfaces of the predetermined ceramic green sheets. In this case, the internal electrodes can be easily formed inside the multilayer ceramic electronic component.

[0152] It is also preferable to provide an external electrode paste application step of applying an external electrode paste to the outer surface of the unsintered chip-shaped ceramic body prior to the chip-shaped ceramic body processing step. Alternatively, it is also preferable to provide an external electrode paste application step of applying an external electrode paste to the outer surface of the fired chip-shaped ceramic body after the chip-shaped ceramic body processing step, and an external electrode paste baking step of baking the external electrode paste onto the outer surface of the chip-shaped ceramic body. In these cases, external electrodes can be easily formed on the outer surface of the ceramic electronic component.

[0153] It is also preferable to include a plating step of forming at least one plated electrode layer on the outer surfaces of the external electrodes formed on the outer surfaces of the chip-shaped ceramic body, in which case the plated electrode layer can protect the external electrodes and improve the solder wettability of the external electrodes.

[0154] It is also preferable that the jig contains ceramic as a material. In this case, since the heat resistance is higher than that of other materials, even if the processing step involves heating, such as a synthesis step or a firing step, the jig can be prevented from being damaged or deformed. Furthermore, if the jig is made of ceramic, considerations regarding the synthesis atmosphere and the firing atmosphere can be reduced. Furthermore, considerations regarding reactions with the chip-shaped ceramic body can be reduced.

[0155] It is also preferable that the jig is made of a plurality of linear members. In this case, since the constituent members have no bent parts, it is possible to obtain a jig that is resistant to physical impacts. In addition, it is possible to obtain a jig that is not easily damaged even when stress is applied due to temperature changes.

[0156] The jig has a vertical direction, a horizontal direction perpendicular to the vertical direction, and a height direction perpendicular to the vertical and horizontal directions, and the multiple linear members belong to one of multiple linear member groups, and the multiple linear member groups are stacked in the height direction, and the multiple linear members belonging to one linear member group are arranged parallel to each other and spaced apart, and it is also preferable that, when viewed in the height direction, the linear members belonging to the linear member group stacked in a certain layer cross each other with the linear members belonging to another linear member group stacked in an adjacent other layer. In this case, since the linear members are approximately straight and have no bends, a jig that is resistant to physical impact can be obtained. In addition, a jig that is not easily damaged even when stress is applied due to temperature changes can be obtained.

[0157] It is also preferable that the bottom of the jig is made up of one or more linear members belonging to one linear member group, the sidewall is made up of one linear member belonging to one linear member group or two or more linear members each belonging to two or more linear member groups, the bottom has a bottom through hole communicating with the back surface of the bottom, the sidewall has a sidewall through hole communicating with another adjacent chip storage section, the bottom through hole is made up of a gap between two adjacent linear members in the linear member group constituting the bottom, and the sidewall through hole is made up of a gap between the linear members constituting the sidewall. In this case, a jig with good breathability can be obtained. Therefore, by using the jig, processing defects caused by poor breathability can be suppressed.

[0158] It is also preferable that in at least one group of linear members, the arrangement pitch, which is the distance between the centers of two adjacent linear members arranged at a distance from each other, is partially different. In this case, in addition to the chip accommodation section, a non-chip accommodation section in which no chip-shaped ceramic body is accommodated can be provided, thereby improving air permeability.

[0159] It is also preferable that the chip receiving sections are formed in a matrix on the main surface of the jig, in which case a large number of chip receiving sections can be provided in the jig, and ceramic electronic components can be manufactured with high productivity.

[0160] It is also preferable that the jig can be separated into a plurality of parts in the height direction, in which case it is possible to select whether or not the heads of the chip ceramic bodies are to be exposed from the chip storage section, as necessary, in the chip ceramic body storing step, the chip ceramic body processing step, the chip ceramic body removing step, etc.

[0161] It is also preferable that the opening area of ​​the chip storage section increases from the bottom to the top, which improves the efficiency of the chip ceramic body storage step and the chip ceramic body removal step.

[0162] It is also preferable that the following formula (1) is satisfied, where P is the diameter of the inscribed circle of the side wall of the chip storage section when viewed from above, and Q is the depth of the chip storage section. (P / 2) <Q<(3√2 / 2)P···(1)

[0163] In this case, the chip storage section has sufficient space to store the chip-shaped ceramic elements, so that the chip-shaped ceramic elements are not stored in the chip storage section in a lying position, nor are two or more chip-shaped ceramic elements stored in an upright position side by side, so that the chip-shaped ceramic elements that have been properly stored in the chip storage section will not easily fly out when vibrations are applied, and furthermore, two or more chip-shaped ceramic elements are not stored in the chip storage section in an upright position stacked on top of each other. [Explanation of symbols]

[0164] 1 to 7: Linear members 1G: First linear member group 2G: Second linear member group 3G: Third linear member group 4G: Fourth linear member group 5G: Fifth Linear Component Group 6G: Sixth linear member group 7G: Seventh linear member group 8. Chip storage section 8a...Aperture 8b...Bottom 8c...Side wall part 8d...Bottom hole 8e...Side wall through hole 11. Chip-shaped ceramic body 11a...Non-conductor layer 12...first internal electrode layer 13...Second internal electrode layer 14...1st external electrode 15...Second external electrode 21... Unfired chip-shaped ceramic body 21a Ceramic green sheet 22, 23: Internal electrode paste 31 Mother ceramic green sheet laminate 31a···Mother ceramic green sheet 100···Multilayer ceramic capacitor (ceramic electronic component) 1000···Jig

Claims

1. a chip-shaped ceramic body producing step of producing a plurality of chip-shaped ceramic bodies; a jig preparation step of preparing a jig having a bottom portion supporting the chip-shaped ceramic body from below and a side wall portion opening upward, the jig having a plurality of chip storage portions formed therein; a chip-shaped ceramic body storing step of storing the chip-shaped ceramic bodies one by one in one of the chip storing portions of the jig; a chip-shaped ceramic body processing step of processing the chip-shaped ceramic body stored in the chip storage section of the jig; a chip-shaped ceramic body removing step of removing the chip-shaped ceramic body from the chip storage portion of the jig, The jig includes ceramic as a material, The chip-shaped ceramic body accommodation step includes: placing a plurality of the chip-shaped ceramic bodies on the jig in random positions and states; the jig is vibrated and / or tilted to store the plurality of chip-shaped ceramic bodies placed on the jig in the chip storage section. A manufacturing method for ceramic electronic components.

2. The chip-shaped ceramic body processing step is a firing step. A method for producing the ceramic electronic component according to claim 1.

3. The chip-shaped ceramic body manufacturing step includes: a mother ceramic green sheet preparation step of preparing a mother ceramic green sheet including a plurality of ceramic green sheets; a mother ceramic green sheet laminate preparation step of stacking and integrating a plurality of the mother ceramic green sheets to prepare a mother ceramic green sheet laminate; a mother ceramic green sheet laminate cutting step of cutting the mother ceramic green sheet laminate into individual chip-shaped ceramic bodies. A method for producing a ceramic electronic component according to claim 1 or 2.

4. The chip-shaped ceramic body manufacturing step includes: An internal electrode paste applying step of applying an internal electrode paste to a main surface of a predetermined ceramic green sheet, A method for producing a ceramic electronic component according to claim 3.

5. Prior to the chip-shaped ceramic body processing step, An external electrode paste application step is provided for applying an external electrode paste to an outer surface of the unsintered chip-shaped ceramic body. A method for producing a ceramic electronic component according to any one of claims 1 to 4.

6. After the chip-shaped ceramic body processing step, an external electrode paste applying step of applying an external electrode paste to an outer surface of the fired chip-shaped ceramic body; and an external electrode paste baking step of baking the external electrode paste onto the outer surface of the chip-shaped ceramic body. A method for producing a ceramic electronic component according to any one of claims 1 to 4.

7. On the outer surface of the external electrode formed on the outer surface of the chip-shaped ceramic body, A plating process is provided for forming at least one plating electrode layer. A method for producing a ceramic electronic component according to claim 5 or 6.

8. The jig is made of a plurality of linear members. A method for producing a ceramic electronic component according to any one of claims 1 to 7.

9. The jig has a vertical direction, a horizontal direction perpendicular to the vertical direction, and a height direction perpendicular to the vertical direction and the horizontal direction, The plurality of linear members belong to any one of a plurality of linear member groups, The plurality of linear member groups are stacked in the height direction, the linear members belonging to one linear member group are arranged parallel to each other and spaced apart from each other, When viewed in the height direction, the linear members belonging to the linear member group stacked in a certain layer and the linear members belonging to another linear member group stacked in an adjacent other layer intersect with each other. A method for producing a ceramic electronic component according to claim 8.

10. The jig is the bottom portion is constituted by one or more of the linear members belonging to one of the linear member groups, the side wall portion is configured by one of the linear members belonging to one of the linear member groups, or by two or more of the linear members each belonging to two or more of the linear member groups, The bottom portion has a bottom through-hole communicating with a rear surface of the bottom portion, The side wall portion has a side wall portion through hole communicating with another adjacent chip storage portion, the bottom through-hole is formed by a gap between two adjacent linear members in the linear member group constituting the bottom, The side wall through-hole is formed by a gap between the linear members constituting the side wall. A method for producing a ceramic electronic component according to claim 9.

11. In at least one of the linear member groups, An arrangement pitch, which is a distance between the centers of two adjacent linear members arranged at a distance from each other, is partially different. A method for producing a ceramic electronic component according to claim 9 or 10.

12. The jig has the chip storage portions formed in a matrix on a main surface of the jig. A method for producing a ceramic electronic component according to any one of claims 1 to 11.

13. The jig is separable into a plurality of parts in the height direction. A method for producing a ceramic electronic component according to claim 9 or 10.

14. the area of ​​the chip storage section surrounded by the side wall section increases from the bottom to the top of the jig; A method for producing a ceramic electronic component according to any one of claims 1 to 13.

15. When the diameter of the inscribed circle of the side wall portion of the chip storage portion viewed from above is P and the depth of the chip storage portion is Q, the following formula (1) is satisfied: A method for producing a ceramic electronic component according to any one of claims 1 to 14. (P / 2)<Q<(3√2 / 2)P...(1)

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