Multilayer Electronic Components

Abstract

To provide a laminated electronic component with improved flexural strength and moisture resistance reliability as well as low ESR.SOLUTION: A laminated electronic component includes a Si organic compound layer including a body cover portion that is placed on an outer surface of a body in an area where an electrode layer and a conductive resin layer are not placed and an extension portion that extends from the body cover portion to an area between the conductive resin layer and a plating layer of the external electrode. Thereby, bending strength and moisture resistance reliability can be improved.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a multilayer electronic component. [Background technology]

[0002] Multi-layered ceramic capacitors (MLCCs), which are one type of multi-layered electronic components, are chip-type capacitors that are mounted on printed circuit boards of various electronic products such as visual devices such as liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, smartphones, and mobile phones to charge and discharge electricity.

[0003] Such multilayer ceramic capacitors have the advantages of being small yet high capacitance and easy to mount, and can be used as components in various electronic devices. As various electronic devices such as computers and mobile devices become smaller and have higher output, there is an increasing demand for multilayer ceramic capacitors that are smaller and have higher capacitance.

[0004] Furthermore, with the recent increase in the industry's interest in electrical components for automobiles, multilayer ceramic capacitors are being required to have high reliability and high strength properties so that they can be used in automobiles and infotainment systems.

[0005] Therefore, in order to ensure reliability and high strength characteristics, a method has been proposed to change the external electrodes, which are conventionally constructed of an electrode layer, to a two-layer structure of an electrode layer and a conductive resin layer.

[0006] The above-mentioned two-layer structure of the electrode layer and the conductive resin layer can improve reliability by absorbing external impacts and preventing penetration of the plating solution by applying a resin composition containing a conductive substance onto the electrode layer.

[0007] However, as the development of electric vehicles and autonomous vehicles progresses in the automotive industry, a greater number of multilayer ceramic capacitors are required, and multilayer ceramic capacitors used in automobiles and the like are required to ensure stricter moisture resistance reliability conditions and bending strength characteristics. Summary of the Invention [Problem to be solved by the invention]

[0008] One of several objects of the present invention is to provide a multilayer electronic component having improved bending strength characteristics.

[0009] Another object of the present invention is to provide a multilayer electronic component having excellent moisture resistance reliability.

[0010] Yet another of several objects of the present invention is to provide a multilayer electronic component having a low ESR (equivalent series resistance).

[0011] However, the object of the present invention is not limited to the above-mentioned contents, and can be more easily understood in the course of describing specific embodiments of the present invention. [Means for solving the problem]

[0012] A multilayer electronic component according to an embodiment of the present invention includes a main body including a dielectric layer and first and second internal electrodes alternately stacked with the dielectric layer sandwiched therebetween, the main body including first and second surfaces opposing each other in the stacking direction, third and fourth surfaces connected to the first and second surfaces and opposing each other, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other, a first external electrode including a first electrode layer connected to the first internal electrode, a first conductive resin layer disposed on the first electrode layer, and a first plating layer disposed on the first conductive resin layer, the first external electrode including a first connection portion disposed on the third surface of the main body and a first band portion extending from the first connection portion to a portion on the first, second, fifth and sixth surfaces, and a second external electrode connected to the second internal electrode. a second external electrode including a second connection portion arranged on a fourth surface of the main body and a second band portion extending from the second connection portion to parts of the first, second, fifth and sixth surfaces; a main body cover portion arranged in an area of ​​the outer surface of the main body where the first and second electrode layers and the first and second conductive resin layers are not arranged, a first extension portion extending from the main body cover portion to between the first conductive resin layer and the first plating layer of the first band portion, and a Si organic compound layer including a second extension portion extending from the main body cover portion to between the second conductive resin layer and the second plating layer of the second band portion.

[0013] A multilayer electronic component according to another embodiment of the present invention includes a main body including a dielectric layer and first and second internal electrodes alternately stacked with the dielectric layer sandwiched therebetween, the main body including first and second surfaces opposing each other in the stacking direction, third and fourth surfaces connected to the first and second surfaces and opposing each other, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other, a first electrode layer connected to the first internal electrode, a first conductive resin layer disposed on the first electrode layer, and a first plating layer disposed on the first conductive resin layer, a first external electrode including a first connection portion disposed on the third surface of the main body and a first band portion extending from the first connection portion to a portion on the first, second, fifth and sixth surfaces, a second electrode layer connected to the second internal electrode, a second external electrode including a second conductive resin layer arranged on the electrode layer and a second plating layer arranged on the second conductive resin layer, the second external electrode including a second connection portion arranged on a fourth surface of the main body and a second band portion extending from the second connection portion to a portion on the first, second, fifth and sixth surfaces; a main body cover portion arranged in an area of ​​the outer surface of the main body where the first and second electrode layers and the first and second conductive resin layers are not arranged, a first extension portion extending from the main body cover portion to between the first conductive resin layer and the first plating layer, and a second extension portion extending from the main body cover portion to between the second conductive resin layer and the second plating layer, the first and second extension portions including first and second openings, respectively. Effect of the Invention

[0014] One of the advantages of the present invention is that the bending strength is improved by including a body cover portion that is arranged in an area of ​​the outer surface of the body where the electrode layer and the conductive resin layer are not arranged, and a Si organic compound layer that includes an extension portion that extends from the body cover portion to between the conductive resin layer and the plating layer of the external electrode.

[0015] Another of the effects of the present invention is that the moisture resistance reliability is improved by including the above-mentioned Si organic compound layer.

[0016] However, the various yet significant advantages and effects of the present invention are not limited to the above, and can be more easily understood in the course of describing specific embodiments of the present invention. [Brief description of the drawings]

[0017] [Figure 1] 1 is a perspective view showing a multilayer electronic component according to an embodiment of the present invention; [Diagram 2] 2 is a cross-sectional view taken along line II' in FIG. [Diagram 3] 2 is an exploded perspective view showing a schematic exploded view of a main body in which dielectric layers and internal electrodes are stacked according to an embodiment of the present invention; FIG. [Figure 4] FIG. 3 is an enlarged view of region P in FIG. 2. [Diagram 5] FIG. 11 is a perspective view illustrating a multilayer electronic component according to another embodiment of the present invention. [Figure 6] 6 is a cross-sectional view taken along line II-II' in FIG. 5. [Figure 7] FIG. 11 is a perspective view illustrating a modified example of a multilayer electronic component according to another embodiment of the present invention. [Figure 8] FIG. 8 is a cross-sectional view taken along line III-III' in FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0018] Hereinafter, an embodiment of the present invention will be described with reference to a specific embodiment and the attached drawings. However, the embodiment of the present invention may be modified into several other forms, and the scope of the present invention is not limited to the embodiment described below. Furthermore, the embodiment of the present invention is provided to more completely explain the present invention to those having average knowledge in the art. Therefore, the shape and size of elements in the drawings may be enlarged or reduced (or highlighted or simplified) for clearer explanation, and elements indicated by the same reference numerals in the drawings are the same elements.

[0019] In the drawings, parts not related to the description are omitted in order to clearly explain the present invention, thicknesses are enlarged in order to clearly express a plurality of layers and regions, and components having the same function within the same concept may be described using the same reference numerals. Furthermore, throughout the specification, "comprising" a certain component does not mean excluding other components, but may further include other components, unless otherwise specified to the contrary.

[0020] In the drawings, the X direction can be defined as the second direction, the L direction or the length direction, the Y direction can be defined as the third direction, the W direction or the width direction, and the Z direction can be defined as the first direction, the stacking direction, the T direction or the thickness direction.

[0021] Multilayer Electronic Components FIG. 1 is a schematic perspective view of a multilayer electronic component according to one embodiment of the present invention, FIG. 2 is a cross-sectional view taken along line I-I' in FIG. 1, FIG. 3 is an exploded perspective view of a main body in which dielectric layers and internal electrodes are laminated according to one embodiment of the present invention, and FIG. 4 is an enlarged view of area P in FIG. 2.

[0022] A multilayer electronic component 100 according to one embodiment of the present invention will now be described in detail with reference to FIGS.

[0023] A multilayer electronic component 100 according to an embodiment of the present invention includes a main body 110 including a dielectric layer 111 and first and second internal electrodes 121, 122 stacked alternately with the dielectric layer sandwiched therebetween, the main body 110 including first and second faces 1, 2 facing each other in the stacking direction, third and fourth faces 3, 4 connected to the first and second faces and facing each other, and fifth and sixth faces 5, 6 connected to the first to fourth faces and facing each other, a first external electrode 131 including a first electrode layer 131a connected to the first internal electrode, a first conductive resin layer 131b disposed on the first electrode layer, and a first plating layer 131c disposed on the first conductive resin layer, the first external electrode 131 including a first connection portion A1 disposed on a third face of the main body and a first band portion B1 extending from the first connection portion to parts on the first, second, fifth and sixth faces, and the second internal electrode. a second external electrode including a second connection portion A2 arranged on a fourth surface of the main body and a second band portion B2 extending from the second connection portion to a portion on the first, second, fifth and sixth surfaces; a body cover portion 143 arranged in an area of ​​the outer surface of the main body where the first and second electrode layers and the first and second conductive resin layers are not arranged; a first extension portion 141 extending from the body cover portion to between the first conductive resin layer and the first plating layer of the first band portion; and a second extension portion 142 extending from the body cover portion to between the second conductive resin layer and the second plating layer of the second band portion.

[0024] The body 110 may be formed by alternately stacking dielectric layers 111 and internal electrodes 121 and 122 .

[0025] Although there is no particular limitation on the specific shape of the body 110, as shown in the drawings, the body 110 may be hexahedral or a similar shape. In addition, the body 110 may have a substantially hexahedral shape, although not a hexahedral shape having perfect straight lines, due to shrinkage of the ceramic powder contained in the body 110 during the firing process.

[0026] The main body 110 may have first and second surfaces 1, 2 facing each other in the thickness direction (Z direction), third and fourth surfaces 3, 4 connected to the first and second surfaces 1, 2 and facing each other in the length direction (X direction), and fifth and sixth surfaces 5, 6 connected to the first and second surfaces 1, 2 and connected to the third and fourth surfaces 3, 4, and facing each other in the width direction (Y direction).

[0027] The multiple dielectric layers 111 forming the body 110 are in a fired state, and the boundaries between adjacent dielectric layers 111 can be integrated to such an extent that they are difficult to see without the use of a scanning electron microscope (SEM).

[0028] According to an embodiment of the present invention, the raw material for forming the dielectric layer 111 is not particularly limited as long as it can obtain a sufficient capacitance. For example, a barium titanate-based material, a lead complex perovskite-based material, or a strontium titanate-based material can be used.

[0029] The material forming the dielectric layer 111 may be a powder of barium titanate (BaTiO3) or the like to which various ceramic additives, organic solvents, plasticizers, binders, dispersants, etc. may be added according to the purpose of the present invention.

[0030] The main body 110 may include a capacitance forming portion in which capacitance is formed, the capacitance forming portion including a first internal electrode 121 and a second internal electrode 122 arranged inside the main body 110 and facing each other with the dielectric layer 111 therebetween, and protective layers 112 and 113 formed on the upper and lower parts of the capacitance forming portion.

[0031] The capacitance forming portion is a portion that contributes to forming the capacitance of the capacitor, and can be formed by repeatedly laminating a plurality of first and second internal electrodes 121, 122 with a dielectric layer 111 sandwiched therebetween.

[0032] The upper protective layer 112 and the lower protective layer 113 may be formed by stacking a single dielectric layer or two or more dielectric layers in the vertical direction on the upper and lower surfaces of the capacitance forming portion, respectively, and may basically serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0033] The upper protective layer 112 and the lower protective layer 113 do not include an internal electrode and may include the same material as the dielectric layer 111 .

[0034] The internal electrodes 121, 122 are arranged to face each other with the dielectric layer 111 interposed therebetween.

[0035] The internal electrodes 121 and 122 may include first and second internal electrodes 121 and 122 that are alternately arranged to face each other with a dielectric layer interposed therebetween.

[0036] The first and second internal electrodes 121 and 122 may be exposed to the third and fourth surfaces 3 and 4 of the body 110, respectively.

[0037] 2, the first internal electrode 121 may be spaced apart from the fourth surface 4 and exposed to the third surface 3, and the second internal electrode 122 may be spaced apart from the third surface 3 and exposed to the fourth surface 4. A first external electrode 131 may be disposed on the third surface 3 of the body and connected to the first internal electrode 121, and a second external electrode 132 may be disposed on the fourth surface 4 of the body and connected to the second internal electrode 122.

[0038] That is, the first internal electrode 121 is not connected to the second external electrode 132 but is connected to the first external electrode 131, and the second internal electrode 122 is not connected to the first external electrode 131 but is connected to the second external electrode 132. As a result, the first internal electrode 121 is formed at a certain distance from the fourth surface 4, and the second internal electrode 122 is formed at a certain distance from the third surface 3.

[0039] The first and second internal electrodes 121 and 122 may be electrically isolated from each other by a dielectric layer 111 disposed therebetween.

[0040] Referring to FIG. 3, the body 110 can be formed by alternately stacking dielectric layers 111 on which the first internal electrodes 121 are printed and dielectric layers 111 on which the second internal electrodes 122 are printed in the thickness direction (Z direction) and then firing the stacked dielectric layers.

[0041] The material for forming the first and second internal electrodes 121, 122 is not particularly limited, and may be formed using, for example, a conductive paste containing one or more of precious metal materials such as palladium (Pd) and palladium-silver (Pd-Ag) alloy, and nickel (Ni) and copper (Cu).

[0042] The conductive paste may be printed by screen printing, gravure printing, or the like, but the present invention is not limited to this method.

[0043] The external electrodes 131, 132 are disposed on the main body 110, and include first and second electrode layers 131a, 132a, first and second conductive resin layers 131b, 132b, and first and second plating layers 131c, 132c.

[0044] The external electrodes 131 and 132 include first and second external electrodes 131 and 132 connected to the first and second internal electrodes 121 and 122, respectively.

[0045] The first external electrode 131 may include a first electrode layer 131a, a first conductive resin layer 131b, and a first plating layer 131c, and the second external electrode 132 may include a second electrode layer 132a, a second conductive resin layer 132b, and a second plating layer 132c.

[0046] The first external electrode 131 will be described by dividing it into regions according to its arrangement position. The first external electrode 131 includes a first connection portion A1 arranged on the third surface 3 of the main body, and a band portion B1 extending from the first connection portion A1 to portions of the first, second, fifth and sixth surfaces 1, 2, 5 and 6.

[0047] Similarly, if the second external electrode 132 is divided into regions according to its arrangement position, the second external electrode 132 includes a second connection portion A2 arranged on the fourth surface 4 of the main body, and a band portion B2 extending from the second connection portion A2 to portions of the first, second, fifth and sixth surfaces 1, 2, 5, 6.

[0048] Meanwhile, the first and second electrode layers 131a and 132a may be formed using any material that has electrical conductivity, such as a metal, etc. Here, the specific material may be determined in consideration of electrical characteristics, structural stability, etc.

[0049] For example, the first and second electrode layers 131a, 132a may include a conductive metal and glass.

[0050] The conductive metal used for the first and second electrode layers 131a and 132a is not particularly limited as long as it is a material that can be electrically connected to the internal electrodes to form capacitance, and may be, for example, one or more selected from the group consisting of copper (Cu), silver (Ag), nickel (Ni), and alloys thereof.

[0051] The first and second electrode layers 131a and 132a can be formed by applying a conductive paste prepared by adding glass frit to the conductive metal powder, and then firing the paste.

[0052] When the first and second electrode layers 131a, 132a contain conductive metal and glass, the thickness of the corners where the connection parts A1, A2 and the band parts B1, B2 contact each other may be thin, or a floating phenomenon may occur between the tips of the band parts B1, B2 and the body 110, which may cause a problem in terms of moisture resistance reliability. Therefore, when the first and second electrode layers 131a, 132a contain conductive metal and glass, the effect of improving moisture resistance reliability according to the present invention may be more effective.

[0053] In addition, the first and second electrode layers 131a and 132a may be formed using an atomic layer deposition (ALD) method, a molecular layer deposition (MLD) method, a chemical vapor deposition (CVD) method, a sputtering method, or the like.

[0054] The first and second electrode layers 131a and 132a can also be formed on the main body 110 by transferring a sheet containing a conductive metal onto the main body 110.

[0055] The first and second conductive resin layers 131b and 132b may contain a conductive metal and a base resin.

[0056] The conductive metal contained in the first and second conductive resin layers 131b and 132b serves to electrically connect the first and second electrode layers 131a and 132a.

[0057] The conductive metal contained in the first and second conductive resin layers 131b, 132b is not particularly limited as long as it is a material that can be electrically connected to the first and second electrode layers 131a, 132a, and may include, for example, one or more selected from the group consisting of copper (Cu), silver (Ag), nickel (Ni), and alloys thereof.

[0058] The conductive metal contained in the first and second conductive resin layers 131b and 132b may include one or more of spherical powder and flake powder. That is, the conductive metal may not be composed of only flake powder or may not be composed of only spherical powder. Alternatively, the conductive metal may be a mixture of flake powder and spherical powder.

[0059] Here, the spherical powder may include a shape that is not a perfect sphere. For example, it may include a shape in which the ratio of the length of the major axis to the length of the minor axis (major axis / minor axis) is 1.45 or less.

[0060] The flake-like powder means a powder having a long and flat shape, and is not particularly limited, and may have, for example, a ratio of the length of the major axis to the length of the minor axis (major axis / minor axis) of 1.95 or more.

[0061] The lengths of the major and minor axes of the spherical powder and the flaky powder can be measured from an image obtained by scanning a cross section (LT cross section) in the X and Z directions cut at the center of the width Y direction of the multilayer electronic component with a scanning electron microscope (SEM).

[0062] The base resin contained in the first and second conductive resin layers 131b and 132b ensures bonding properties and plays a role in shock absorption.

[0063] The base resin contained in the first and second conductive resin layers 131b and 132b is not particularly limited as long as it has bonding and shock absorbing properties and can be mixed with the conductive metal powder to produce a paste. The base resin can include, for example, an epoxy resin.

[0064] The first and second plating layers 131c and 132c serve to improve mounting characteristics and also serve to prevent bending cracks by peeling off when bending stress occurs.

[0065] The first plating layer 131c may be a Ni plating layer or a Sn plating layer, and the second plating layer 132c may also be a Ni plating layer or a Sn plating layer.

[0066] In addition, first and second additional plating layers 131d and 132d may be further disposed on the first and second plating layers 131c and 132c, respectively. In this case, the first and second plating layers 131c and 132c may be Ni plating layers, and the first and second additional plating layers 131d and 132d may be Sn plating layers.

[0067] The first and second plating layers 131c, 132c may also include multiple Ni plating layers and / or multiple Sn plating layers.

[0068] The Si organic compound layer 140 includes a body cover portion 143 arranged in an area of ​​the outer surface of the body where the first and second electrode layers 131a, 132a and the first and second conductive resin layers 131b, 132b are not arranged, a first extension portion 141 extended from the body cover portion 143 to between the first conductive resin layer 131b and the first plating layer 131c of the first band portion B1, and a second extension portion 142 extended from the body cover portion 143 to between the second conductive resin layer 132b and the second plating layer 132c of the second band portion B2.

[0069] The Si organic compound layer 140 prevents the stress generated when the substrate is deformed due to thermal / physical shock while the laminated electronic component 100 is mounted on the substrate from being transmitted to the main body 110, and also prevents cracks.

[0070] In addition, the Si organic compound layer 140 plays a role in blocking the permeation path of moisture and improving the moisture resistance reliability.

[0071] Although the base resin contained in the first and second conductive resin layers 131b, 132b also plays a part in absorbing shock, there are limitations to this role since the first conductive resin layer 131b and the second conductive resin layer 132b need to be arranged so as to be insulated from each other.

[0072] In contrast, the main body cover portion 143 does not contain conductive metal and is insulating, and is therefore arranged in an area of ​​the outer surface of the main body where the first and second electrode layers 131a, 132a are not arranged, and by being arranged over a wider area, it is also effective in absorbing shock and suppressing stress propagation.

[0073] Furthermore, the body cover part 143 can fill minute pores or cracks in the body 110, thereby preventing moisture from penetrating into the inside of the body through the outer surface of the body.

[0074] The first extension portion 141 is extended from the body cover portion 143 and positioned between the first conductive resin layer 131b and the first plating layer 131c of the first band portion B1, and serves to suppress the transmission of stress to the body 110 and prevent cracks.

[0075] In addition, the first extension portion 141 plays a role in improving moisture resistance reliability by suppressing the occurrence of a floating phenomenon between the tip of the first conductive resin layer 131b arranged in the first band portion B1 and the main body 110.

[0076] The second extension portion 142 is extended from the body cover portion 143 and positioned between the second conductive resin layer 132b and the second plating layer 132c of the second band portion B2, and serves to prevent cracks by suppressing the transmission of stress to the body 110.

[0077] In addition, the second extension portion 142 suppresses floating between the tip of the second conductive resin layer 132b arranged on the second band portion B2 and the main body 110, and also plays a role in improving moisture resistance reliability.

[0078] In addition, since the extensions 141, 142 of the Si organic compound layer 140 have a low bonding strength with the first and second plating layers 131c, 132c, when bending stress occurs, they can prevent bending cracks by inducing peel-off of the first and second plating layers 131c, 132c.

[0079] However, if the bonding strength between the extensions 141, 142 and the first and second plating layers 131c, 132c is too weak, peel-off may occur even with a weak bending stress, and bending cracks may not be effectively prevented.

[0080] Therefore, by forming openings in the first and second extension portions 141, 142 and allowing the first and second plating layers 131c, 132c to come into contact with the first and second conductive resin layers 131b, 132b through the openings, a predetermined bonding force can be secured and bending cracks can be more effectively prevented.

[0081] Meanwhile, the Si organic compound layer 140 can be formed by forming the first and second electrode layers 131a, 132a and the first and second conductive resin layers 131b, 132b on the main body 110 including the dielectric layer and the internal electrode, forming a Si organic compound layer on the exposed outer surface of the main body 110 and the first and second conductive resin layers 131b, 132b, and removing the Si organic compound layer 140 formed on the connection portions A1, A2 of the first and second conductive resin layers 131b, 132b.

[0082] The Si organic compound layer 140 may be removed by, for example, laser processing, mechanical polishing, dry etching, wet etching, shadowing deposition using a tape protective layer, or the like.

[0083] The Si organic compound layer 140 may include alkoxy silane.

[0084] As a result, the Si organic compound layer 140 has a polymer form including a plurality of silicon carbide bond structures, and has hydrophobicity.

[0085] Alkoxy silane prevents moisture penetration and contamination, penetrates into some inorganic substrates and hardens to protect products and increase their durability.Alkoxy silane also reacts with hydroxyl groups (OH) to form strong chemical bonds, improving durability.

[0086] In addition, compared to epoxy resins and inorganic compounds, epoxy resins do not have a water repellent effect, so it is difficult to effectively suppress the penetration of moisture, and a large amount of CO2 gas is generated during curing, which may cause problems with floating. In addition, inorganic compounds do not have functional groups that can react with hydroxyl groups when applied to the surface of the body, so they are difficult to adhere to the surface of the body, and no chemical bonds are formed, which may make them difficult to apply to the present invention.

[0087] Therefore, by making the Si organic compound layer 140 contain alkoxy silane, the effect of filling fine pores and cracks can be further improved, and bending stress and moisture resistance reliability can be further improved.

[0088] When the thickness of the first conductive resin layer 131b on the first electrode layer 131a of the first band portion B1 is defined as Ta, and the thickness of the first extension portion 141 is defined as Tb, Tb / Ta can be 0.5 or more and 0.9 or less.

[0089] Fig. 4 is an enlarged view of region P in Fig. 2. The thickness of the first conductive resin layer 131b on the first electrode layer 131a of the first band portion B1 and the first extension portion 141 will be described in detail with reference to Fig. 4. However, the same description can be applied to the thickness of the second conductive resin layer 132b on the second electrode layer 132a of the second band portion B2 and the second extension portion 142.

[0090] Sample chips were manufactured while changing the ratio (Tb / Ta) of the thickness tb of the first extension portion 141 to the thickness Ta of the first conductive resin layer 131b on the first electrode layer 131a of the first band portion B1, and then the bending strength and ESR (equivalent series resistance) were evaluated and the results are shown in Tables 1 and 2 below, respectively.

[0091] The bending strength was measured using a bending strength measurement method that utilizes the piezoelectric effect. After mounting a sample of a multilayer ceramic capacitor on a substrate, the difference in distance at the center before and after compression during bending was set to 6 mm, and the sample chip was observed to see if any cracks occurred. The number of sample chips that had cracks relative to the total number of sample chips was recorded.

[0092] In addition, the ESR evaluation was performed by maintaining the sample chip at -55°C for 30 minutes, heating it to 125°C and maintaining it there for 30 minutes, and then applying 500 cycles. Sample chips with an ESR exceeding 50 mΩ were judged to be defective, and the number of sample chips with defective ESR out of the total number of sample chips was recorded.

[0093] [Table 1]

[0094] Referring to Table 1 above, in test number 1 where Tb / Ta was 0.3, cracks occurred in 3 out of a total of 300 sample chips.

[0095] In contrast, in test numbers 2 to 6, in which Tb / Ta is 0.5 or more, the number of sample chips in which cracks occurred was zero, confirming that the bending strength was excellent.

[0096] [Table 2]

[0097] Referring to Table 2 above, in test number 5, where Tb / Ta was 1.1, ESR defects occurred in 5 sample chips out of a total of 1,600 chips, and in test number 6, where Tb / Ta was 1.3, ESR defects occurred in 12 sample chips out of a total of 1,600 chips.

[0098] In contrast, in test numbers 1 to 4, where Tb / Ta is 0.9 or less, the number of sample chips in which ESR defects occurred was zero, confirming that the ESR characteristics are excellent.

[0099] Therefore, in order to improve the bending strength and ensure excellent ESR characteristics, it is preferable that the ratio (Tb / Ta) of the thickness tb of the first extension portion 141 to the thickness Ta of the first conductive resin layer 131b on the first electrode layer 131a of the first band portion B1 is greater than or equal to 0.5 and less than or equal to 0.9.

[0100] FIG. 5 is a perspective view illustrating a multilayer electronic component according to another embodiment of the present invention, FIG. 6 is a cross-sectional view taken along line II-II' in FIG. 5, FIG. 7 is a perspective view illustrating a modified example of the multilayer electronic component according to the other embodiment of the present invention, and FIG. 8 is a cross-sectional view taken along line III-III' in FIG.

[0101] Hereinafter, a multilayer electronic component 100' according to another embodiment of the present invention and its modified example 100'' will be described with reference to Figs. 5 to 8. However, in order to avoid redundant explanations, explanations common to the multilayer electronic component 100 according to the embodiment of the present invention will be omitted.

[0102] A multilayer electronic component 100′ according to another embodiment of the present invention includes a dielectric layer 111, and first and second internal electrodes 121, 122 stacked alternately with the dielectric layer sandwiched therebetween, and includes a main body 110 including first and second surfaces 1, 2 facing each other in the stacking direction, third and fourth surfaces 3, 4 connected to the first and second surfaces and facing each other, and fifth and sixth surfaces 5, 6 connected to the first to fourth surfaces and facing each other, a first electrode layer 131a connected to the first internal electrode, a first conductive resin layer 131b disposed on the first electrode layer, and a first plating layer 131c disposed on the first conductive resin layer, and includes a first external electrode 131 including a first connection portion C1 disposed on a third surface of the main body and a first band portion B1 extending from the first connection portion to a portion on the first, second, fifth, and sixth surfaces, a second electrode layer 132a connected to the second internal electrode, a second external electrode including a second connecting portion C2 arranged on a fourth surface of the main body and a second band portion B2 extending from the second connecting portion to a portion on the first, second, fifth and sixth surfaces; a body cover portion 143 arranged in an area of ​​the outer surface of the main body where the first and second electrode layers and the first and second conductive resin layers are not arranged; a Si organic compound layer 140' including a first extension portion 141' extended from the body cover portion to between the first conductive resin layer and the first plating layer, and a second extension portion 142' extended from the body cover portion to between the second conductive resin layer and the second plating layer, and the first and second extension portions 141', 142' include first and second openings H1, H2, respectively.

[0103] The first plating layer 131c can be in contact with the first conductive resin layer 131b through the first opening H1, and the second plating layer 132c can be in contact with the second conductive resin layer 132b through the second opening H2. That is, the first opening H1 can be filled with the first plating layer 131c, and the second opening H2 can be filled with the second plating layer 132c.

[0104] On the other hand, the Si organic compound layer 140' can be formed by forming the first and second electrode layers 131a, 132a and the first and second conductive resin layers 131b, 132b on the main body 110 including the dielectric layer and the internal electrodes, forming a Si organic compound layer on the exposed outer surface of the main body 110 and the first and second conductive resin layers 131b, 132b, and removing a portion of the Si organic compound layer formed on the first and second conductive resin layers 131b, 132b to form the first and second openings H1, H2.

[0105] Methods for removing the areas where the openings H1 and H2 are to be formed include, for example, laser processing, mechanical polishing, dry etching, wet etching, and shadowing deposition using a tape protective layer.

[0106] In this case, the area of ​​the first opening H1 may be 20 to 90% of the area of ​​the first extension portion 141', and the area of ​​the second opening H2 may be 20 to 90% of the area of ​​the second extension portion 142'.

[0107] If the area of ​​the first opening H1 is less than 20% of the area of ​​the first extension 141', the electrical connectivity between the first electrode layer 131a and the first conductive resin layer 131b may decrease, and the ESR may increase. On the other hand, if the area of ​​the first opening H1 is more than 90% of the area of ​​the first extension 141', the effect of improving the bending strength and moisture resistance reliability of the Si organic compound layer 140' may be insufficient.

[0108] If the area of ​​the second opening H2 is less than 20% of the area of ​​the second extension 142', the electrical connectivity between the second electrode layer 132a and the second conductive resin layer 132b may decrease, and the ESR may increase. On the other hand, if the area of ​​the second opening H2 is more than 90% of the area of ​​the second extension 142', the effect of improving the bending strength and moisture resistance reliability of the Si organic compound layer 140' may be insufficient.

[0109] On the other hand, the first opening H1 can be arranged in one or more of the first band portion B1 and the first connecting portion C1 of the first electrode layer, and the second opening H2 can be arranged in one or more of the second band portion B2 and the second connecting portion C2.

[0110] As shown in FIG. 6, the first connection portion 141' may have a first opening H1 disposed only at the first connection portion C1, and the second connection portion 142' may have a second opening H2 disposed only at the second connection portion C2.

[0111] Also, as shown in FIG. 8, the first connecting portion 141'' may have a first opening H1 disposed in both the first connecting portion C1 and the first band portion B1, and the second connecting portion 142'' may have a second opening H2 disposed in both the second connecting portion C2 and the second band portion B2.

[0112] Meanwhile, the shape and number of the openings H1, H2 are not particularly limited, and may be, for example, a circle, a rectangle, an ellipse, a rectangle with rounded corners, or an irregular shape.

[0113] Although the embodiments of the present invention have been described in detail above, it will be apparent to those skilled in the art that the scope of the present invention is not limited thereto, and that various modifications and variations are possible within the scope of the technical idea of ​​the present invention described in the claims. [Explanation of symbols]

[0114] 100 Multilayer electronic components 110 Main unit 111 Dielectric layer 112, 113 protective layer 121, 122 Internal electrode 131, 132 External electrode 131a, 132a electrode layer 132b, 132b conductive resin layer 131c, 132c plating layer 131d, 132d Additional plating layer 140 Si organic compound layer 141, 142 Extension 143 Main body cover H1, H2 opening

Claims

1. a main body including a dielectric layer, and first and second internal electrodes alternately stacked with the dielectric layer sandwiched therebetween, the main body including a first surface and a second surface facing each other in the stacking direction, a third surface and a fourth surface connected to the first surface and the second surface and facing each other, and a fifth surface and a sixth surface connected to the first surface and the fourth surface and facing each other; a first external electrode including a first electrode layer connected to the first internal electrode, a first conductive resin layer disposed on the first electrode layer and in contact with the first electrode layer, and a first plating layer disposed on the first conductive resin layer and in at least partial contact with the first conductive resin layer, the first external electrode including a first connection portion disposed on a third surface of the body, and a first band portion extending from the first connection portion to the first surface, the second surface, the fifth surface, and a portion on the sixth surface; a second external electrode including a second electrode layer connected to the second internal electrode, a second conductive resin layer disposed on the second electrode layer and in contact with the second electrode layer, and a second plating layer disposed on the second conductive resin layer and in at least partial contact with the second conductive resin layer, the second external electrode including a second connection portion disposed on a fourth surface of the body, and a second band portion extending from the second connection portion to the first surface, the second surface, the fifth surface, and a portion on the sixth surface; a body cover portion disposed in an area of ​​an outer surface of the body where the first electrode layer, the second electrode layer, the first conductive resin layer, and the second conductive resin layer are not disposed, a first extension portion disposed extending from the body cover portion between the first conductive resin layer of the first band portion and the first plating layer, and a second extension portion disposed extending from the body cover portion between the second conductive resin layer of the second band portion and the second plating layer, a first conductive resin layer of the first connection portion being entirely in contact with the first plating layer, and a second conductive resin layer of the second connection portion being entirely in contact with the second plating layer.

2. 2. The multilayer electronic component according to claim 1, wherein the Si organic compound layer includes alkoxy silane.

3. 3. The multilayer electronic component according to claim 1, wherein when a thickness of the first conductive resin layer on the first electrode layer of the first band portion is defined as Ta and a thickness of the first extension portion is defined as Tb, Tb / Ta is 0.5 or more and 0.9 or less.

4. The multilayer electronic component according to claim 1 , wherein the first conductive resin layer and the second conductive resin layer contain a conductive metal and a base resin.

5. The multilayer electronic component according to claim 1 , wherein the first electrode layer and the second electrode layer contain a conductive metal and glass.

6. The multilayer electronic component according to claim 1 , further comprising a first additional plating layer and a second additional plating layer disposed on the first plating layer and the second plating layer, respectively.

7. The multilayer electronic component according to claim 1 , wherein the first extension portion and the second extension portion include an opening portion.

8. a main body including a dielectric layer, and first and second internal electrodes alternately stacked with the dielectric layer sandwiched therebetween, the main body including a first surface and a second surface facing each other in the stacking direction, a third surface and a fourth surface connected to the first surface and the second surface and facing each other, and a fifth surface and a sixth surface connected to the first surface and the fourth surface and facing each other; a first external electrode including a first electrode layer connected to the first internal electrode, a first conductive resin layer disposed on the first electrode layer and in contact with the first electrode layer, and a first plating layer disposed on the first conductive resin layer and in at least partial contact with the first conductive resin layer, the first external electrode including a first connection portion disposed on a third surface of the body, and a first band portion extending from the first connection portion to the first surface, the second surface, the fifth surface, and a portion on the sixth surface; a second external electrode including a second electrode layer connected to the second internal electrode, a second conductive resin layer disposed on the second electrode layer and in contact with the second electrode layer, and a second plating layer disposed on the second conductive resin layer and in at least partial contact with the second conductive resin layer, the second external electrode including a second connection portion disposed on a fourth surface of the body, and a second band portion extending from the second connection portion to portions on the first, second, fifth and sixth surfaces; a body cover portion disposed in an area of ​​an outer surface of the body where the first electrode layer, the second electrode layer, the first conductive resin layer, and the second conductive resin layer are not disposed, a first extension portion disposed extending from the body cover portion between the first conductive resin layer and the first plating layer, and a second extension portion disposed extending from the body cover portion between the second conductive resin layer and the second plating layer, a first extension portion including a first opening disposed at the first connection portion and extending across the entire first band portion, and a second extension portion including a second opening disposed at the second connection portion and extending across the entire second band portion.

9. an area of ​​the first opening is 20% to 90% of an area of ​​the first extension portion located at the first connection portion; 9. The multilayer electronic component according to claim 8, wherein an area of ​​the second opening is 20% to 90% of an area of ​​the second extension portion located at the second connection portion.

10. 10. The multilayer electronic component according to claim 8, wherein the Si organic compound layer contains alkoxy silane.

11. 11. The multilayer electronic component according to claim 8, wherein when a thickness of the first conductive resin layer on the first electrode layer of the first band portion is defined as Ta, and a thickness of the first extension portion is defined as Tb, Tb / Ta is 0.5 or more and 0.9 or less.

12. 12. The multilayer electronic component according to claim 8, wherein the first conductive resin layer and the second conductive resin layer contain a conductive metal and a base resin.

13. The multilayer electronic component according to claim 8 , wherein the first electrode layer and the second electrode layer include a conductive metal and a glass.

14. The multilayer electronic component according to claim 8 , further comprising a first additional plating layer and a second additional plating layer disposed on the first plating layer and the second plating layer, respectively.

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