Resin composition and use thereof

Abstract

To provide a resin composition and use thereof.MEANS: A resin composition includes a component (A) which is an unsaturated bond-containing resin, a component (B) which is an initiator, and a component (C) which is an inorganic filler surface-treated with a silane coupling agent, wherein the silane coupling agent includes structure represented by formula (I). The inorganic filler is obtained by surface treatment using the silane coupling agent having the structure represented by the formula (I), and enables improvement of bonding strength at an interface between the inorganic filler and an unsaturated resin matrix, and the obtained insulation adhesive film has excellent dielectric performance and good dielectric stability, has a small change width of ▵Df(10GHz) after HAST, and is applicable to a high frequency high speed printed wiring board manufactured by a semi-additive method or an additive method.SELECTED DRAWING: None

Description

[Technical field]

[0001] The present invention belongs to the technical field of packaging adhesive films and relates to a resin composition and its use. [Background technology]

[0002] In recent years, electronic devices have been gradually developed to be smaller and more powerful, and printed wiring boards are expected to have more layers, finer wiring, higher density, and higher reliability. As a manufacturing technique for printed wiring boards, a build-up method is known in which insulating layers and conductor layers are alternately stacked on an inner layer board, and the insulating layer is usually formed by curing a resin composition. In the build-up process, in order to meet the manufacturing process requirements of ultra-fine circuits, it is required that the insulating adhesive film has a low arithmetic mean value of roughness profile (Ra) and a high chemical copper binding strength after being desmeared.

[0003] In order to achieve the low dielectric performance of the insulating layer, it is necessary to select a resin with low dielectric performance for the resin composition, as well as an inorganic filler with low dielectric loss. In order to satisfy the low CTE, low warpage, and other performance requirements of the insulating adhesive film, it is necessary to use a highly loaded inorganic filler of 30 wt% or more in the resin composition. However, a highly loaded inorganic filler reduces the HAST resistance of the resin system, and the surface treatment of the inorganic filler also has a significant impact on the final low dielectric performance and dielectric stability reliability of the resin composition.

[0004] CN107022169A discloses a resin composition which uses a fluorine-containing alkoxysilane compound to surface-treat a filler, reduces the surface roughness of an insulating layer, and forms a conductor layer with sufficient peel strength, and has good penetration depth of a plating layer, embeddability of parts, and flame retardancy. However, the dielectric performance and dielectric stability reliability of the resin composition according to the invention need to be further improved.

[0005] Therefore, in this field, it has excellent dielectric performance, good dielectric stability, and △D after HAST. f It is desirable to develop an insulating adhesive film with a small change range (10 GHz) that can be applied to high-frequency, high-speed printed wiring boards manufactured by semi-additive or additive processes. Summary of the Invention [Problem to be solved by the invention]

[0006] In view of the deficiencies of the prior art, it is an object of the present invention to provide a resin composition and uses thereof. [Means for solving the problem]

[0007] To achieve this objective, the present invention adopts the following technical solutions.

[0008] In an aspect 1, the present invention provides a method for producing a composition comprising: The composition comprises component (A) which is an unsaturated bond-containing resin, component (B) which is an initiator, and component (C) which is an inorganic filler that has been surface-treated with a silane coupling agent, The silane coupling agent comprises a structure represented by formula (I), [ka] In the formula (I), R1 and R2 are each independently selected from methyl or ethyl, m and n are each independently selected from integers of 1 to 4 (e.g., 1, 2, 3, or 4), and K and L are each independently selected from integers of 1 to 30 (e.g., 1, 3, 5, 8, 10, 12, 15, 18, 20, 22, 25, 28, or 30, etc.), with the proviso that the order of each repeating unit is arbitrary. In the present invention, the silane coupling agent is a segment in the formula (I), JPEG0007676527000002.jpg3124 and segments As long as it includes JPEG0007676527000003.jpg3527, it is within the scope of the present invention. Of course, the silane coupling agent may contain other segments, provided that the order of each repeat unit is arbitrary.

[0009] In the present invention, the silane coupling agent containing the structure represented by formula (I) has low dielectric loss performance, and contains multiple unsaturated bonds in its side chain, which increases the crosslink density between the inorganic filler and the unsaturated bond-containing resin at the interface between the inorganic filler and the resin, and can effectively prevent water molecules from penetrating the insulating layer through the interface between the inorganic filler and the resin during the HAST process and affecting the dielectric stability. In addition, the fluorine-containing group on the side chain has good hydrophobicity, which can prevent further bonding between the water molecules and the resin after penetration, and also contributes to dielectric stability. The insulating adhesive film produced by combining the inorganic filler surface-treated with the silane coupling agent containing the structure represented by formula (I) and the unsaturated bond-containing resin has excellent dielectric performance and good electrical stability, and has a low ΔD after HAST. f The change range of (10 GHz) is small, and it can be applied to high-frequency, high-speed printed wiring boards manufactured by the semi-additive method or the additive method.

[0010] Preferably, the number of fluorine atoms in one molecule of the silane coupling agent containing the structure represented by formula (I) is 3 to 30, for example, 3, 6, 9, 12, 15, 18, 21, 24, 27 or 30, and specific point values ​​between the above point values, and for the sake of space and simplicity, the present invention does not comprehensively exemplify specific point values ​​included in the above range.

[0011] Preferably, the number of acryloyloxy groups in one molecule of the silane coupling agent containing the structure represented by formula (I) is 2 to 10, for example, 2, 3, 4, 5, 6, 7, 8, 9 or 10, and specific point values ​​between the above point values, and for the sake of space and simplicity, the present invention does not comprehensively exemplify specific point values ​​included in the above range.

[0012] The inorganic filler may be surface-treated with a silane coupling agent containing the structure represented by formula (I) by a conventional method.

[0013] Illustratively, a method for preparing an inorganic filler surface-treated with a silane coupling agent having a structure represented by formula (I) includes the following steps:

[0014] An inorganic filler is placed in a stirrer, and while being stirred, a silane coupling agent having a structure represented by formula (I) is blown into the mixture to react with the mixture, thereby obtaining an inorganic filler that has been surface-treated with the silane coupling agent having a structure represented by formula (I).

[0015] The weight of the inorganic filler in the (C) component is 100%, and the content of the silane coupling agent is 0.1% to 5%, for example, 0.1%, 0.2%, 0.3%, 0.5%, 0.8%, 1%, 1.5%, 2%, 2.5%, 3%, 3.5%, 4%, 4.5% or 5%, and specific points between the above points. For the sake of space and simplicity, the present invention does not comprehensively exemplify specific points included in the above range. If the content of the silane coupling agent containing the structure represented by formula (I) is too small, the surface treatment of the inorganic filler is insufficient and cannot be well coated, so that the crosslinking action between the inorganic filler and the unsaturated resin matrix is ​​weak. If the content of the silane coupling agent containing the structure represented by formula (I) is too high, the excess silane coupling agent is liberated and migrates, affecting the chemical copper bonding force of the insulating adhesive film surface and reducing the dielectric performance of the insulating adhesive film.

[0016] Preferably, the sum of the (A) and (C) components is 100% by weight, and the content of the (C) component is 30% to 80% by weight, such as 30%, 35%, 40%, 45%, 50%, 55%, 60%, 65%, 70%, 75% or 80%, and specific values ​​between the above points, and for the sake of space and clarity, the present invention does not comprehensively exemplify specific points included in the above range. The present invention uses a high loading of the (C) component of 30wt% or more to meet the performance requirements of the insulating adhesive film, such as low CTE and low warpage, and if the content of the (C) component is too low, its CTE and anti-warpage performance are poor, making it difficult to use in build-up insulating adhesive films, and if the content of the (C) component is too high, the chemical copper bonding strength of the insulating adhesive film is reduced.

[0017] Preferably, the content of the (A) component is 20% to 70% by weight, with the sum of the (A) component and the (C) component being 100% by weight, for example, 20%, 25%, 30%, 35%, 40%, 45%, 50%, 55%, 60%, 65% or 70%, and specific points between the above points, and for the sake of space and clarity, the present invention does not comprehensively exemplify specific points included in the above ranges.

[0018] Preferably, the (B) component accounts for 0.1% to 5% by weight of the sum of the (A) component and the (C) component, for example, 0.1%, 0.2%, 0.3%, 0.5%, 0.8%, 1%, 1.5%, 2%, 2.5%, 3%, 3.5%, 4%, 4.5% or 5%, and specific points between the above points, and for the sake of space and clarity, the present invention does not comprehensively exemplify specific points included in the above ranges.

[0019] Preferably, the inorganic filler in component (C) includes any one or a combination of at least two of silica, titanium dioxide, zinc oxide, aluminum hydroxide, aluminum oxide, magnesium oxide, magnesium hydroxide, calcium carbonate, aluminum nitride, boron nitride, aluminum silicon carbide, silicon carbide, zirconium oxide, mica, boehmite, calcined talc, talc, silicon nitride, strontium titanate, barium titanate, and calcined kaolin.

[0020] Preferably, the silica may be any one or a combination of at least two of fused silica, crystalline silica, porous silica, or hollow silica.

[0021] Preferably, the unsaturated bond-containing resin includes any one or a combination of at least two of polyphenylene ether, polyfunctional vinyl aromatic polymer, styrene-butadiene-styrene polymer, styrene-butadiene polymer, styrene-isoprene polymer, polybutadiene, polyisoprene, cyanate resin, unsaturated cyclic olefin copolymer, allyl-modified benzoxazine, triallyl isocyanurate, triallyl cyanurate, or maleimide, each of which contains an unsaturated bond.

[0022] Preferably, the initiator comprises a peroxide and / or an azo compound.

[0023] In aspect 2, the present invention provides a method for producing a pharmaceutical composition comprising: A resin composition according to embodiment 1 and a solvent, A resin adhesive liquid is provided.

[0024] Preferably, the solvent comprises any one or a combination of at least two of acetone, butanone, methyl ethyl ketone, cyclohexanone, toluene, or xylene.

[0025] In a third aspect, the present invention provides an insulating adhesive film, the material of which comprises the resin composition according to the first aspect.

[0026] The present invention does not specifically limit the preparation method of the insulating adhesive film. Illustratively, the preparation method of the insulating adhesive film includes the following steps:

[0027] A resin composition and a solvent are mixed to obtain a resin adhesive liquid, the resin adhesive liquid is applied to a substrate, baked, and the substrate is removed to obtain the insulating adhesive film.

[0028] Preferably, the substrate comprises any of polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polymethyl methacrylate, cyclic polyolefin, triacetyl cellulose, polyether sulfide, polyether ketone, polyimide, polytetrafluoroethylene, polybenzimidazole, polyether ether ketone, or polyphenylene sulfide.

[0029] Preferably, the thickness of the substrate is 10 to 150 μm, for example, 10 μm, 20 μm, 30 μm, 50 μm, 80 μm, 100 μm, 110 μm, 120 μm, 130 μm, 140 μm or 150 μm, and specific values ​​between the above values, and for the sake of space and clarity, the present invention does not comprehensively exemplify specific values ​​included in the above range. More preferably, the thickness is 20 to 60 μm.

[0030] Preferably, the baking temperature is 80 to 120°C, for example, 80°C, 90°C, 100°C, 110°C or 120°C, and specific points between the above points, and for the sake of space and clarity, the present invention does not comprehensively exemplify specific points included in the above range.

[0031] Preferably, the baking time is 1 to 10 min, for example, 1 min, 3 min, 5 min, 8 min or 10 min, and specific points between the above points, and for the sake of space and clarity, the present invention does not comprehensively exemplify specific points included in the above range.

[0032] Preferably, the thickness of the insulating adhesive film is 10 to 100 μm, for example, 10 μm, 15 μm, 20 μm, 25 μm, 30 μm, 35 μm, 40 μm, 45 μm, 50 μm, 55 μm, 60 μm, 65 μm, 70 μm, 75 μm, 80 μm, 85 μm, 90 μm, 95 μm or 100 μm, and specific point values ​​between the above point values, and for the sake of space and simplicity, the present invention does not comprehensively exemplify specific point values ​​included in the above range.

[0033] Preferably, the dielectric loss of the insulating adhesive film after curing is less than or equal to 0.00261, such as 0.00208, 0.00220, 0.00245 or 0.00261, and specific values ​​between the above values, and for the sake of space and clarity, the present invention does not comprehensively exemplify specific values ​​included in the above ranges.

[0034] Preferably, ΔD after HAST after curing of the insulating adhesive film f (10 GHz) is equal to or less than 0.00015, for example, 0.00010, 0.00012, 0.00014 or 0.00015, and specific point values ​​between the above point values, and for the sake of space and clarity, the present invention does not comprehensively exemplify specific point values ​​included in the above range.

[0035] Preferably, the surface roughness Ra value of the insulating adhesive film after Desmear treatment is 239 nm or less (e.g., 152 nm, 161 nm, 173 nm or 239 nm, etc.), and the chemical copper bonding strength is 4.3 N / cm or more, for example, 4.3 N / cm, 4.4 N / cm, 4.8 N / cm or 5.7 N / cm, and specific point values ​​between the above point values, and for the sake of space and simplicity, the present invention does not comprehensively exemplify specific point values ​​included in the above range. Effect of the Invention

[0036] Compared with the prior art, the present invention has at least the following beneficial effects:

[0037] (1) In the present invention, the silane coupling agent having the structure represented by formula (I) has low dielectric loss properties, and contains a plurality of unsaturated bonds in its side chain, which increases the crosslink density between the inorganic filler and the resin containing unsaturated bonds at the interface between the inorganic filler and the resin, and can effectively prevent water molecules from penetrating the insulating layer through the interface between the inorganic filler and the resin during the HAST process and affecting the dielectric stability. In addition, the fluorine-containing group on the side chain has good hydrophobicity, which can prevent further bonding between the water molecules and the resin after penetration, and also contributes to dielectric stability.

[0038] (2) An insulating adhesive film made by combining an inorganic filler surface-treated with a silane coupling agent having a structure represented by formula (I) and a resin containing an unsaturated bond has excellent dielectric performance and good dielectric stability, and has a △D f The change range of (10 GHz) is small, and it can be applied to high-frequency, high-speed printed wiring boards manufactured by the semi-additive method or the additive method. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0039] The technical solution of the present invention will be further described below by specific embodiments. Those skilled in the art should understand that the above examples are only for understanding the present invention, and should not be considered as specifically limiting the present invention.

[0040] The raw materials used in the Preparation Examples of the present invention, Comparative Preparation Examples, Examples, and Comparative Examples are as follows.

[0041] (1) Unsaturated bond-containing resin: OPE-2st 2200, polyphenylene ether containing vinylbenzyl groups at the termini, Mitsubishi Chemical Corporation; SA-9000, polyphenylene ether containing methacrylate groups at the ends, Saudi Basic Industry Corporation; B3000, polybutadiene resin, Nippon Soda Co., Ltd., Ricon 100, styrene-butadiene copolymer, Sartomer, BMI-5100, bis(3-ethyl-5-methyl-4-maleimidophenyl)methane, Daiwa Chemical Industry Co., Ltd. ODV-XET(X05), polydivinylbenzene, Nippon Steel Chemical Co., Ltd.

[0042] (2) Initiator: BPO: Dibenzoyl peroxide, Okawa Oil Co., Ltd. DCP: dicumyl peroxide, Shanghai Fangruida Chemical.

[0043] (3) Inorganic filler: SO-C2, silica, median diameter D50 is 0.5μm, Japan Admatechs Co., Ltd. AO-502, Aluminum oxide, median diameter D50 is 0.7μm, Japan admatechs Co., Ltd.

[0044] (4) A silane coupling agent having a structure represented by formula (I), the molecule of which contains a fluorine atom and an acryloyloxy group; X-40-2430C, Shin-Etsu Chemical, Japan.

[0045] (5) Other silane coupling agents: Trifluoropropanetrimethoxysilane, KBM-7103, Nippon Shin-Etsu Chemical, its structural formula is: [ka] and 3-Trimethoxysilane propyl acrylate, KBM-5103, Shin-Etsu Chemical Co., Ltd., its structural formula is: [ka] It is.

[0046] [Preparation Examples 1-6] Preparation Examples 1 to 6 each provide an inorganic filler surface-treated with a silane coupling agent having a structure represented by formula (I), and the preparation methods included the following steps:

[0047] The formulated amount of inorganic filler was placed in a stirrer, and while stirring, the gasified silane coupling agent containing the structure represented by formula (I) was blown into it and reacted for 10 minutes to obtain inorganic fillers surface-treated with the silane coupling agent containing the structure represented by formula (I). These were designated as modified inorganic fillers A to F, respectively.

[0048] The specific selection and amount (parts by weight) of each component are as shown in Table 1. Here, "parts" and "parts by weight" in the present invention are calculated based on the solid content and do not include the solvent, dispersant, etc. therein.

[0049] [Comparative Preparation Examples 1-3] The only difference between Comparative Preparation Examples 1 to 3 and Preparation Example 1 is that the silane coupling agent having the structure represented by formula (I) is replaced with the same weight part of another type of silane coupling agent. For details, see Table 1.

[0050] [Table 1]

[0051] [Examples 1-6] Examples 1 to 6 each provide an insulating adhesive film, and the preparation method included the following steps:

[0052] A blended amount of unsaturated bond-containing resin, an initiator, and an inorganic filler that had been surface-treated with a silane coupling agent having a structure represented by formula (I) obtained in the Preparation Example were mixed to obtain a resin composition, a solvent (butanone) was added and stirred for 2 hours to obtain a resin adhesive liquid with a solid content of 65%. The resin adhesive liquid was applied to a PET release film and baked in an oven at 120°C for 5 minutes to obtain the insulating adhesive film.

[0053] The specific selection of each component and the amount used (parts by weight) are as shown in Table 2.

[0054] [Table 2] Comparative Example 1

[0055] The only difference between this comparative example and Example 1 is that the modified inorganic filler A was replaced with the same weight part of the modified inorganic filler prepared in Comparative Preparation Example 1.

[0056] The only difference between this comparative example and Example 1 is that the modified inorganic filler A was replaced with the same part by weight of the modified inorganic filler prepared in Comparative Preparation Example 2.

[0057] The only difference between this comparative example and Example 1 is that the modified inorganic filler A was replaced with the same part by weight of the modified inorganic filler prepared in Comparative Preparation Example 3.

[0058] The only difference between this comparative example and Example 1 is that the modified inorganic filler A is replaced with the same weight parts of inorganic filler and silane coupling agent (the mass ratio of inorganic filler SO-C2 to silane coupling agent X-40-2430C is 100:2); that is, in this comparative example, the unsaturated bond-containing resin, the initiator, the inorganic filler and the silane coupling agent are directly mixed to obtain a resin composition, and the other steps are the same as those of Example 1.

[0059] The insulating adhesive films prepared in Examples 1 to 6 and Comparative Examples 1 to 4 were subjected to performance tests, and the test methods were as follows.

[0060] (1) HAST: A Highly Accelerated Temperature and Humidity Stress Test (HAST) was conducted with reference to JESD22-A110, with the temperature set to 130°C, humidity set to 85% RH, and hours set to 100 hours.

[0061] (2) Dielectric loss D fRefer to IPC-TM-650 2.5.5.15 and use the split dielectric column cavity SPDR (Split Post Dielectric Resonator) method to measure the dielectric loss D of the insulating adhesive film after curing at 10 GHz. f was measured.

[0062] (3) Dielectric loss after HAST (D f ): The above dielectric loss (D f After HAST processing, the dielectric loss (D) of the insulating adhesive film at 10 GHz was measured by using the SPDR method. f ) was measured. △D f : Dielectric loss after HAST (D f )-Dielectric loss before HAST (D f ).

[0063] (4)Arithmetic mean value of roughness profile (Ra): The insulating adhesive film was pressed onto the surface of the core board and cured in an oven at 180°C for 30 minutes to obtain a pre-cured insulating adhesive film. The insulating adhesive film was then immersed in an ethylene glycol ether-based sodium hydroxide solution (MV Sweller, ATOTECH) at 70°C for 10 minutes, washed in deionized water for 2 minutes, immersed in a potassium permanganate solution (MV P-Etch, ATOTECH) at 80°C for 30 minutes, washed in deionized water for 2 minutes, and immersed in an acidic aqueous solution (MV Reduction Cleaner, ATOTECH) at 50°C for 5 minutes to obtain a roughened insulating adhesive film. The surface Ra after roughening was tested using a laser confocal device (OLYMPUS).

[0064] (5) Chemical copper bonding strength (PS): The roughened insulating adhesive film was immersed in a chemical copper solution (MV TP1, ATOTECH) for 20 minutes, electroplated to a thickness of 25 μm, and cured in an oven at 200°C for 60 minutes to perform copper deposition, electroplating, and post-curing processes. The chemical copper bonding strength of the insulating adhesive film was then tested using a copper foil peel strength measuring device.

[0065] The results of the performance tests of the examples and comparative examples are shown in Table 3.

[0066] [Table 3]

[0067] As can be seen from Table 3, in Examples 1 to 4 of the present invention, the insulating adhesive film produced by combining a highly loaded inorganic filler surface-treated with a silane coupling agent having a structure represented by formula (I) and an unsaturated bond-containing resin has excellent dielectric performance and good dielectric stability, and has a ΔD value after HAST. f (10GHz) change range is small, and the dielectric loss D f (10GHz) is 0.00208~0.00261, and △D after HAST f (10 GHz) was 0.00010-0.00015, Ra (after Desmear treatment) was 152-239 nm, and the chemical copper bond strength was 4.3-5.7 N / cm.

[0068] In Example 5, the content of the silane coupling agent having the structure represented by formula (I) on the surface of the inorganic filler is low, and it cannot be well coated, so that the crosslinking effect between the inorganic filler and the unsaturated resin matrix is ​​weak, and the ΔD f (10 GHz) was 0.00044, and the surface roughness Ra after Desmear treatment was large. The content of the silane coupling agent containing the structure represented by formula (I) on the surface of the inorganic filler in Example 6 was high, and the excess silane coupling agent was liberated and migrated during the additive manufacturing process, reducing the chemical copper bonding force on the surface of the insulating adhesive film and increasing the △Df (10GHz) was 0.00053.

[0069] Compared with Example 1, the inorganic filler in Comparative Example 1 is surface-modified using a fluorine-containing silane coupling agent, so that the surface of the inorganic filler is not cross-linked with the unsaturated resin matrix, and the hydrophobic fluorine-containing group can prevent the water molecules from bonding with the resin after penetration to a certain extent, but the △D after HAST is f (10 GHz) is high at 0.00069, and the Ra after Desmear treatment is also high, making it difficult to manufacture thin circuits by the additive method. The inorganic filler in Comparative Example 2 is surface-modified using a silane coupling agent having acryloyloxy and contains unsaturated bonds, but there is little cross-linking between the inorganic filler surface and the unsaturated resin matrix, and the ΔD after HAST of the insulating adhesive film produced f (10 GHz) was 0.00052. In Comparative Example 3, the fluorine-containing silane coupling agent and the acryloyloxy-containing silane coupling agent were mixed and used to prepare an insulating adhesive film, and the ΔD value after HAST was f (10 GHz) was 0.00047. In Comparative Example 4, the silane coupling agent was directly mixed into the resin composition, and after dilution of the resin composition, only a small amount of the silane coupling agent containing the structure represented by formula (I) was coated on the surface of the inorganic filler, so that the crosslinking action between the surface of the inorganic filler and the unsaturated resin matrix was weak, and ΔD after HAST was f (10GHz) was 0.00027, and the chemical copper bonding strength also decreased.

[0070] The present invention has been described with reference to the above examples of the resin composition of the present invention and its use, but the applicant declares that the present invention is not limited to the above examples, i.e., it does not mean that the present invention must be carried out depending on the above examples. Those skilled in the art should understand that any improvements to the present invention, equivalent replacement of raw materials of the product of the present invention, addition of auxiliary components, selection of specific forms, etc. are all within the protection scope and disclosure scope of the present invention.

Claims

1. The composition comprises: component (A) which is an unsaturated bond-containing resin; component (B) which is an initiator; and component (C) which is an inorganic filler that has been surface-treated with a silane coupling agent; The silane coupling agent comprises a structure represented by formula (I), 【Chemistry 1】 In formula (I), R １ , R ２ are each independently selected from methyl or ethyl, m and n are each independently selected from an integer of 1 to 4, and K and L are each independently selected from an integer of 1 to 30, with the proviso that the order of each repeating unit is arbitrary; The number of fluorine atoms in one molecule of the silane coupling agent containing the structure represented by formula (I) is 3 to 30, The number of acryloyloxy groups in one molecule of the silane coupling agent containing the structure represented by formula (I) is 2 to 10, The content of the silane coupling agent is 0.1% to 5% based on the weight of the inorganic filler in the component (C) being 100%. A resin composition comprising:

2. The content of the (C) component is 30% to 80% by weight, with the sum of the (A) component and the (C) component being 100% by weight. The resin composition according to claim 1 .

3. The content of the (A) component is 20% to 70% by weight, where the sum of the (A) component and the (C) component is 100% by weight. The resin composition according to claim 1 .

4. The amount of the component (B) is 0.1 to 5 parts by weight when the sum of the components (A) and (C) is 100 parts by weight. The resin composition according to claim 1 .

5. The inorganic filler in the component (C) includes any one or a combination of at least two of silica, titanium dioxide, zinc oxide, aluminum hydroxide, aluminum oxide, magnesium oxide, magnesium hydroxide, calcium carbonate, aluminum nitride, boron nitride, aluminum silicon carbide, silicon carbide, zirconium oxide, mica, boehmite, calcined talc, talc, silicon nitride, strontium titanate, barium titanate, and calcined kaolin. The resin composition according to claim 1 .

6. The unsaturated bond-containing resin includes any one or a combination of at least two of polyphenylene ether, polyfunctional vinyl aromatic polymer, styrene-butadiene-styrene polymer, styrene-butadiene polymer, styrene-isoprene polymer, polybutadiene, polyisoprene, cyanate resin, unsaturated cyclic olefin copolymer, allyl-modified benzoxazine, triallyl isocyanurate, triallyl cyanurate, or maleimide, each of which contains an unsaturated bond; The resin composition according to claim 1 .

7. The initiator comprises a peroxide and / or an azo compound. The resin composition according to claim 1 .

8. A resin composition according to any one of claims 1 to 7, comprising a solvent, The solvent includes any one or a combination of at least two of acetone, butanone, methyl ethyl ketone, cyclohexanone, toluene, or xylene; A resin adhesive liquid characterized by:

9. An insulating adhesive film, comprising: The material of the insulating adhesive film contains the resin composition according to any one of claims 1 to 7.

1. An insulating adhesive film comprising:

10. The insulating adhesive film has a thickness of 10 to 100 μm; The insulating adhesive film has a dielectric loss of 0.00261 or less after curing; ΔD after HAST after curing of the insulating adhesive film ｆ (10 GHz) is less than or equal to 0.00015, The insulating adhesive film has a surface roughness Ra value of 239 nm or less after Desmear treatment, and a chemical copper bonding strength of 4.3 N / cm or more; 10. The insulating adhesive film of claim 9.

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