Method for manufacturing an assembly forming part of an electronic device, an electronic device and a cover structure assembly for an electronic device - Patents.com

Abstract

The present invention provides an assembly forming part of an electronic device, an electronic device, and a method for manufacturing a cover structure assembly for an electronic device. [Solution] An assembly forming part of an electronic device includes a substantially opaque cover member that obscures one or more other components of the electronic device, one or more indicator structures within the cover member, an optical matrix layer attached to an inner surface of the cover member, and a plurality of lighting devices embedded in the optical matrix layer.

Description

[Technical field]

[0001] The present disclosure relates generally to electronic devices, and more particularly to illuminated indicator structures for electronic devices, including illuminated cover structures, indicator panels, and / or control panels for electronic devices. Additionally, the present disclosure relates to methods of making cover assemblies for electronic devices, and methods of operating electronic devices. [Background technology]

[0002] Cover assemblies for electronic devices that provide indicator or control panels for the electronic device often include integral lighting devices, such as LEDs, to provide information about particular indicators that form part of the cover assembly. Control panels for electronic devices often require differentiated bi-directional rejection of multiple indicators in response to user control of the electronic device.

[0003] However, such integrated backlighting arrangements add bulk to the cover assembly, which is often undesirable, and the inclusion of such electronic components in the cover assembly can further reduce the robustness and durability of the electronic device. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] US Patent Application Publication No. 2008 / 0253140 Summary of the Invention [Problem to be solved by the invention]

[0005] The present invention has been made in consideration of the above-mentioned problems. [Means for solving the problem]

[0006] One aspect of the present disclosure is an assembly forming part of an electronic device, comprising: a substantially opaque cover member adapted for incorporation into an electronic device to obscure one or more other components of the electronic device, the cover member having an outer surface and an opposing inner surface, the cover member having a thickness dimension extending laterally between the outer surface and the inner surface; one or more indicator structures within the cover member, each having a periphery defining a corresponding indicator shape of the cover member, the indicator structures being substantially translucent to allow backlight illumination to pass through the entire thickness dimension of the cover member; a light source disposed on an inner surface of the cover member and coextensive with at least a portion of the cover member including the one or more indicator structures; Transmission an optical matrix layer made of a photosensitive material; a plurality of lighting devices embedded in the optical matrix layer arranged such that two or more peripheral lighting devices are provided for each indicator structure, each peripheral lighting device being disposed at or adjacent to a periphery of a corresponding indicator structure and configured to provide backlighting to the corresponding indicator structure, each peripheral lighting device being laterally displaced from the periphery of the corresponding indicator structure such that an outer surface of the cover member is obscured by the cover member when the outer surface of the cover member is viewed in a direction generally parallel to a thickness dimension of the cover member at each indicator structure.

[0007] The indicator structure may be at least partially translucent, for example by an opening in the cover member. Transmission By transparent material, it is meant that the optical matrix layer is at least translucent. In some embodiments, the optical matrix layer is transparent. Transparent means a material that has optical properties that allow light to pass through to the extent that objects behind it can be clearly seen, but not necessarily as if there were no intervening material. Foils or sheets that filter out only some wavelengths of the light spectrum, coloring the light that passes through without significant diffusion, are also understood to be transparent.

[0008] The above-mentioned assemblies include composite laminate structures or laminates that provide integrated backlighting for one or more indicator shapes and serve as a cover panel for an electronic device. Thus, the assemblies include an indicator panel, or, in embodiments including integrated controls such as capacitive buttons, the assemblies provide a control panel for the electronic device. As used herein, the term "panel" refers to a sheet-like cover element, but is not necessarily flat, rectangular, or rigid. Thus, the control panel provided by the assembly may, for example, have a non-rectangular contour in some embodiments, may be non-rigid, e.g., flexible, and may, in some embodiments, have a contoured exterior surface. As used herein, the "outer" side, "outer" surface, or "outer" side of each component refers to the side, surface, or side of each laminate component or laminate that, when assembled, is further from the device it is intended to cover than the opposite "inner" side, "inner" surface, or "inner" side.

[0009] The assembly further comprises an electronic circuit embedded in the optical matrix layer and electronically connected to the plurality of lighting devices. The electronic circuit comprises a printed circuit deposited on the inner surface of the cover member, for example consisting of conductive traces printed on the inner surface of the cover member. The plurality of lighting devices are mounted on the inner surface of the cover member.

[0010] The cover member may be a composite laminate structure comprising a translucent substrate and a generally opaque masking layer carried by the translucent substrate, each indicator structure being defined by one or more corresponding apertures in the masking layer. The masking layer comprises a printed material deposited on an inner surface of the translucent substrate. The translucent substrate may be made of a flexible polymeric plastic material, such as clear polycarbonate.

[0011] The assembly further comprises one or more control means for manual user operation, embedded in the optical matrix layer and connected to the electronic circuitry. The control means comprises a touch sensitive area, e.g. a capacitive button, providing user control of the electronic device. Thus, the assembly comprises one or more capacitive buttons mounted on the inner surface of the cover member. In some embodiments, the one or more control means comprises at least one piezoelectric button mounted on the inner surface of the cover member. Alternatively, or in addition, the assembly comprises one or more actuator devices for user mechanical feedback. The one or more actuator devices are embedded in the optical matrix layer and connected to the electronic circuitry. The one or more actuator devices comprise at least one piezoelectric actuator mounted on the inner surface of the cover member.

[0012] The optical matrix layer may be made of a substantially transparent molded plastic material, including, for example, layers of molded polycarbonate, polyurethane, or the like. The cover member has a substantially constant thickness and a contoured shape, with the inner and outer surfaces of the cover member having a contoured shape, e.g., a compound curvature or a complex three-dimensional topography. Similarly, the optical matrix layer has a substantially constant thickness and a contoured shape that matches the cover member. In some embodiments, the combined thickness of the cover member and the optical matrix layer is less than 2 mm. The plurality of illumination devices includes a plurality of light emitting diodes (LEDs).

[0013] The assembly further comprises a non-reflective surface on a major surface of the optical matrix layer furthest from the cover member, sandwiching the optical matrix layer between the cover member and the non-reflective surface. Providing such a non-reflective surface limits internal reflection of illumination provided by the illumination device within the optical matrix layer. The non-reflective surface is interrupted by at least one optical effect area that generally coincides with a corresponding indicator structure of the one or more indicator structures in the cover member. The optical effect area may, for example, comprise a reflective area that facilitates reflection of illumination back to the corresponding indicator structure.

[0014] Another aspect of the present disclosure is an assembly forming part of an electronic device, comprising: a substantially opaque cover member adapted for incorporation into an electronic device to obscure one or more other components of the electronic device, the cover member having an outer surface and an opposing inner surface, the cover member having a thickness dimension extending laterally between the outer surface and the inner surface; a plurality of indicator structures within the cover member, each having a periphery defining a corresponding indicator shape of the cover member, the indicator structures being substantially translucent to allow backlight illumination to pass through the entire thickness of the cover member; a light source mounted on an inner surface of the cover member and coextensive with at least a portion of the cover member including the one or more indicator structures; Transmission an optical matrix layer made of a photosensitive material; a plurality of lighting devices embedded in the optical matrix layer arranged such that one or more peripheral lighting devices are provided for each indicator structure, each peripheral lighting device being positioned at or adjacent to a periphery of a corresponding indicator structure and configured to provide backlighting to the corresponding indicator structure, each peripheral lighting device being laterally displaced from the periphery of the corresponding indicator structure such that an outer surface of the cover member is obscured by the cover member when the outer surface of the cover member is viewed in a direction generally parallel to a thickness dimension of the cover member at each indicator structure.

[0015] Another aspect of the present disclosure comprises an electronic device including an indicator panel assembly (which may optionally include a control panel assembly) as described above. Yet another aspect of the present disclosure is a method of manufacturing a cover structure assembly for an electronic device, comprising the steps of: providing a substantially opaque cover member for incorporation into an electronic device to obscure one or more other components of the electronic device, the cover member having an outer surface and an opposing inner surface, a thickness dimension of the cover member extending laterally between the outer surface and the inner surface, the cover member having one or more indicator structures, each indicator structure being substantially translucent to permit backlight illumination to pass through the indicator structure and throughout the thickness dimension of the cover member, each indicator structure having a periphery defining a corresponding indicator shape in the cover member; The method includes positioning a plurality of lighting devices relative to the cover member such that two or more peripheral lighting devices are provided for each indicator structure, each peripheral lighting device being positioned at or adjacent to a periphery of a corresponding indicator structure to provide backlight illumination for the corresponding indicator structure, and each peripheral lighting device being laterally displaced from the periphery of the corresponding indicator structure so as to be obscured by the cover member when an outer surface of the cover member is viewed in a direction generally parallel to a thickness dimension of the cover member at each indicator structure.

[0016] and molding a translucent optical matrix layer on an inner surface of the cover member and embedding a plurality of lighting devices in the optical matrix layer, the optical matrix layer extending coextensively with at least a portion of the cover member including the one or more indicator structures.

[0017] The method further includes providing electronic circuitry for the plurality of lighting devices, where arranging the plurality of lighting devices includes connecting the plurality of lighting devices to the electronic circuitry, and molding the optical matrix layer includes embedding the plurality of lighting devices and the electronic circuitry in the optical matrix layer.

[0018] Providing the electronic circuitry includes printing the electronic circuitry on an inner surface of the cover member. Providing the cover member includes forming a composite laminate structure including a translucent substrate and a generally opaque masking layer carried by the translucent substrate, with each indicator structure defined by one or more corresponding openings in the masking layer.

[0019] The method further includes connecting the electronic circuitry to one or more controls for manual selection by a user, and molding the optical matrix layer includes embedding the one or more controls in the optical matrix layer.

[0020] Yet another aspect of the present disclosure is a method that includes backlighting one or more indicator shapes within an opaque cover member of an electronic device by activation of two or more peripheral lighting devices associated with each indicator shape, each indicator shape having a translucent region of the cover member and a corresponding periphery defined by the cover member, each peripheral lighting device disposed at or adjacent to the periphery of the corresponding indicator shape and laterally displaced from the periphery of the corresponding indicator shape so as to be obscured by the opaque cover member when an outer surface of the cover member is viewed in a direction generally parallel to a thickness dimension of the cover member, the two or more peripheral lighting devices associated with the one or more indicator shapes embedded in an optical matrix layer, the optical matrix layer contacting an inner surface of the cover member and extending at least coextensively with the one or more indicator shapes.

[0021] The method may further include providing dynamic backlighting for at least one of the one or more indicator structures through time-varying activation and deactivation of two or more corresponding peripheral lighting devices.

[0022] The drawings are not necessarily to scale, and like reference numbers in the drawings may refer to like parts throughout the drawings. Like reference numbers with different suffixes may refer to different instances of like parts. Several embodiments are illustrated in the accompanying drawings by way of example, and not by way of limitation. [Brief description of the drawings]

[0023] [Figure 1] 1 is a schematic cross-sectional view illustrating a portion of an integrated illuminated control panel for an electronic device, according to an exemplary embodiment. [Diagram 2] 2 is a schematic front view of an electronic device having an illuminated control panel such as that of FIG. 1 according to an exemplary embodiment. [Diagram 3] 2 is a three-dimensional rear view of a cover assembly forming part of the illuminated control panel of FIG. 1 according to an exemplary embodiment. [Figure 4] 4 is an oblique three-dimensional side view of the cover assembly of FIG. 3 according to an exemplary embodiment. [Diagram 5] FIG. 2 is a front view of an electronic device according to another exemplary embodiment. [Figure 6] FIG. 2 illustrates the inside of the cover assembly in a pre-assembled state, prior to providing an optical matrix layer and assembling the cover assembly to an electronic device. [Figure 7] FIG. 2 illustrates a laminated structure of the cover assembly. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0024] The following description and drawings sufficiently illustrate specific embodiments to enable those skilled in the art to implement and / or realize the disclosed systems, methods, and / or apparatus. Other embodiments may incorporate structural, operational, and other changes. Portions and features of some embodiments may be included in, or substituted for, portions and features of other embodiments.

[0025] In Figure 1, reference numeral 100 generally indicates a control panel assembly for an electronic device 200 (Figure 2) according to an exemplary embodiment. The control panel assembly 100 comprises a cover member 103, which is a composite laminate structure having an optical matrix layer 106 connected to its inner side. Thus, when assembled into the device 200, the optical matrix layer 106 is disposed on the device side of the cover member 103 and sandwiched between the cover member 103 and the body 139 of the device 200.

[0026] As will be described in more detail below, the electronic device has a backlighting structure that backlights one or more indicator structures defined by the cover member 103 (see, for example, the central indicator window 112 in FIG. 2). The backlighting structure of this embodiment includes a plurality of lighting devices in the exemplary shape of light emitting diodes (LEDs) 109, which in this example are mounted on the cover member 103 and embedded in the optical matrix layer 106. Each LED 109 is, in this example, an Everlight™ surface mount device (SMD) LED, part number 27-21 / BHC-AP1Q2 / 3C. Thus, the exemplary LED has a rectangular outline of approximately 1.7 mm by 0.6 mm, and a height (e.g., for a cover panel assembly that is approximately 1.1 mm thick). It is noted that FIGS. 1 and 7 are schematic diagrams that are not necessarily to scale. In an exemplary embodiment, the height of the LEDs 109 can be 0.5 times or more the thickness of the optical matrix layer 106.

[0027] The matrix layer 106 comprises a translucent plastic polymeric material. In this exemplary embodiment, the matrix layer 106 is generally transparent, including a translucent molded polycarbonate. However, in other embodiments, the matrix layer 106 may be substantially transparent, including a translucent molded polycarbonate. TransmissionA transparent material may also be used to provide the optical matrix layer 106. The optical matrix layer 106 thus provided not only provides hermetic encapsulation of the LEDs 109, but also serves as a light guide or optical medium for the indicator illumination. As will be described in more detail below, the LEDs 109 are mounted within the cover member 103 and are laterally displaced from an indicator window defined by the cover member 103.

[0028] As an illuminated structure, the exemplary cover member 103 has a pair of opposing major surfaces, with a thickness dimension of the cover member 103 extending laterally between the major surfaces. Thus, the cover member 103 has an exterior surface 118 that forms the exterior of the device 200, and an interior surface 130 that faces toward the body 139 of the device 200. The optical matrix layer 106 is bonded to the interior surface 130 of the cover member 103.

[0029] The exemplary cover member 103 comprises a translucent substrate in the form of a transparent thin film or substrate foil 115 that serves as a base structure for the other components of the cover member 103 and the control panel laminate provided by the assembly 100. In the example of FIG. 1, the substrate foil 115 is made of a flexible, transparent plastic material and is generally transparent. In this exemplary embodiment, the substrate foil 115 is a molded sheet of transparent polycarbonate. In the exemplary embodiment of FIG. 1, the substrate foil 115 forms the outermost component of the layered cover member 103, and therefore the outer surface 118 of the cover member 103 is provided by the outer surface of the substrate foil 115. In other embodiments, one or more components of the cover member 103 may be attached or deposited on the outer surface 118 of the substrate foil 115 (see, for example, FIG. 7).

[0030] The cover member 103 further includes a substantially opaque shielding element that obscures components of the device 200 from view. In this exemplary embodiment, the shielding element is in the form of an opaque masking layer 121. The exemplary masking layer 121 is provided on an inner surface 124 of the substrate foil 115. The masking layer 121 is substantially opaque, thereby conforming to an interior of the masking layer 121 and obscuring components of the device 200 that are disposed on the masking layer 121. In this exemplary embodiment, the masking layer 121 comprises one or more ink layers that are printed on the inner surface 124 of the substrate foil 115.

[0031] The indicator structure is defined by the masking layer 121. In this example, the cover member 103 has a single indicator structure in the form of a central circular indicator window 112 with a shaped aperture in the masking layer 121. The indicator window 112 thus has a circular perimeter 212 located approximately in the center of the masking layer 121. The shaped portion of the masking layer within the indicator window 112 defines a trademark logo 208 that is silhouetted in the indicator window 112. In other embodiments, the cover member can define several indicator structures (e.g., by apertures in an opaque shielding element such as the masking layer 121) including, for example, decorative and / or informational shapes, designs, symbols, indicia, etc. The indicator structures can be configured to indicate one or more operations of the electronic device 200 by backlighting of the respective indicator structures. Thus, assembly 100 is configured to provide at least an indicator display panel for device 200, and in some cases an integrated, interactive illuminated control panel (e.g., the exemplary embodiment of Figures 1-4), with assembly 100 also including a control structure, as described in more detail below.

[0032] 2, in addition to the indicator structures defined by the apertures in the masking layer 121, the masking layer 121 may include multi-color printing that defines additional marks and / or indicia on the cover member 103. The majority of the masking layer 121 of the exemplary device 200 is provided with black ink, with white ink printed adjacent the substrate foil 115 providing, in this example, the device's brand name 210 and an arcuate control identifier 213.

[0033] Because the ink of the masking layer 121 is deposited directly onto the inner surface 124 of the transparent substrate foil 115, the decorative and / or informational components of the masking layer 121 are clearly visible from the outside of the control panel assembly 100, which has a smooth protective outer surface provided by the substrate foil 115.

[0034] In other embodiments, the opaque shielding elements of the control panel assembly 100 may alternatively or in combination comprise one or more sheet-like elements or thin films attached to the substrate foil 115, including, for example, a perforated sheet of plastic material and / or a decal adhered to the substrate foil 115. It should be noted that although the masking layer 121 is provided on the inner surface 124 of the substrate foil 115 in this exemplary embodiment, either or both of the masking layer 121, or the corresponding shielding elements, may be carried on the outer surface 118 of the substrate foil 115 in other embodiments.

[0035] The optical matrix layer 106 is coextensive with the masking layer 121 and therefore extends continuously beneath the entire masking layer 121 including the indicator window 112. In this exemplary embodiment, the optical matrix layer 106 extends somewhat beyond the outer boundary of the masking layer 121 such that the peripheral ring 220 provided by the optical matrix layer 106 extends continuously around the outer boundary of the cover member 103. Referring again to FIG. 1 , a transparent optical element 129 forms part of the indicator window 112 and is disposed in the opening in the masking layer 121 that defines the indicator window 112 and is attached to the inner surface 124 of the substrate foil 115. The optical element 129 in this embodiment comprises a transparent blue layer printed on the inner surface 124 of the substrate foil 115 to colorize the backlight illumination passing from the optical matrix layer 106 through the indicator window 112.

[0036] The control panel assembly 100 further comprises electronic circuitry 132 carried by the cover member 103, which in this example is connected to the inner surface 130 of the masking layer 121. The electronic circuitry 132 in this exemplary embodiment comprises conductive traces 135 printed on the inner surface 130 of the masking layer 121, thereby effectively forming a printed circuit board (PCB) or portion thereof on the inner or underside of the cover member 103. The LEDs 109 are coupled to the conductive traces 135 for activating / deactivating the LEDs 109 by controlling electronic components within the device 200 via the conductive traces 135.

[0037] Additionally, the printed electronic circuit 132 may provide or be coupled to other electronic components in addition to the LEDs 109. The control panel assembly 100 includes, for example, a control structure with one or more control means configured for manual user operation, e.g., to receive user input for control of the electronic device 200. In this exemplary embodiment, the control means comprises a number of capacitive buttons 305 (see, e.g., FIG. 3 ) printed on the inner surface 130 of the masking layer 121. The combined thickness of the masking layer 121 and the substrate foil 115 is sufficiently small to capacitively sense the proximity of a user's finger when the outer surface 118 of the cover member 103 is pressed. In this example, two of the buttons 305 match the control identifiers 213 visible from the outside of the control panel assembly 100.

[0038] 3 is an isolated view showing the cover member 103 and the electronics thereon from the inside (i.e., showing the control panel assembly 100 without the optical matrix layer 106). The conductive traces 135 of the electronic circuit 132 define LED leads 310 for the four LED groups 109 evenly spaced along the periphery 212 of the indicator window 112. The motorized traces 135 also provide respective button leads 315 for the capacitive buttons 305. Each of the leads 310, 315 is connected to a corresponding electronic connector 320 for coupling with a corresponding connector that is part of the control electronics housed in the body 139 (FIG. 1) of the device 200. It should be noted that the LED leads 310 provide a four-channel control structure for the four peripheral LEDs 109 of the indicator window 112, allowing for individual control of activation of the peripheral LEDs 109.

[0039] It is noted that in this exemplary embodiment, each LED 109 that is part of the control panel assembly 109 is a peripheral lighting device for a single indicator window 112, as it is positioned at the periphery 212 of the indicator window 112 and configured to provide backlighting for the indicator window 112. Each LED 109 is laterally displaced from the periphery 212 of the indicator window 112, and is obscured by the masking layer 121 when the control panel assembly 100 is viewed externally at the indicator window 112 in a direction generally perpendicular to the cover panel laminate. Thus, the LEDs 109, which are substantially hidden behind the masking layer, provide backlighting for the indicator window 112 while being proximate to the periphery 212 of the indicator window 112, and are equivalent to the optical medium provided by the optical matrix layer 106.

[0040] 4, it can be seen that the composite laminate structure provided by the cover panel assembly 100, in this embodiment, has a contour shape with a compound curvature (e.g., not flat), such that the outer surface 118 is concavely curved. The cover member 103 (e.g., including the substrate foil 115 and the masking layer 121) has a substantially constant thickness, such that the inner surface 130 of the cover member has the same compound curvature as the outer surface 118. The optical matrix layer 106 can likewise have a constant thickness, less than 2 mm in this exemplary embodiment, and can have a curvature that matches or is the same as the curvature of the cover member 103. It should be noted that for clarity of illustration, the thicknesses of the components of the control panel assembly 100 are exaggerated in FIG. 1. The overall thickness of the control panel assembly 100 is less than 2 mm, and in some embodiments, is less than 1.5 mm.

[0041] 1 , it can be seen that the electronic components of the control panel assembly 100 (including, for example, the LEDs 109, the conductive traces 135, and the capacitive buttons 305) are embedded in the optical matrix layer 106. Thus, the optical matrix layer 106 is a molded part that is overmolded onto the inner surface 130 of the cover member 103 after the LEDs 109 are mounted to the conductive traces 135 printed on the inner surface 130 of the cover member 103. In this exemplary embodiment, when the control panel assembly 100 is assembled into the device 200, the inner surface 147 of the optical matrix layer 106 is separated from the body 139 of the device 200 by an air gap 149.

[0042] In use, the control panel assembly 100 may be mounted to an electronic device 200 to indicate an operational state or mode of the electronic device 200 and / or control functions of the electronic device 200. In a particular embodiment, the device 200 is a computer peripheral that controls the operation of a computer, although in other exemplary embodiments, control panel assemblies similar to the described control panel assembly 100 may be provided to correspond to electronic devices such as printers, electronic readers, mobile phones, lighting controls for residential or industrial facilities, control and / or display components of automotive or industrial equipment, etc.

[0043] In these cases, the peripheral LEDs 109 can be controlled by a corresponding device 200 to provide backlighting to the indicator window 112 in response to a user's control of the device 200, for example via a capacitive control button 305. Light emitted by the LEDs 109 passes at least in part through the indicator window 112, through the cover member 103, through the optical elements 129 and the transparent substrate foil 115, and is guided by the optical matrix layer 106 to make visible or highlight the indicator window 112. The passage of light from the side-mounted peripheral LEDs 109 to the indicator window 112 is aided by reflection of light from the inner surface 147 of the optical matrix layer 106, and in some cases further aided by a diffuser provided, for example, as part of the optical elements 129 of the indicator window 112.

[0044] Each peripheral LED 109 has a limited effective backlight range because the illuminance of a particular LED 109 decreases with increasing distance from the LED 109. In a device having multiple indicator structures (see, for example, FIG. 5), this structure allows individual peripheral LEDs 109 (or individual sets of peripheral LEDs 109) to provide individual backlighting to the individual indicator structures. However, in this exemplary embodiment, the device 200 includes a single indicator structure in the form of an indicator window 112, but by providing multiple peripheral LEDs 109, dynamic or animated backlighting effects can be provided for the indicator window 112. For example, the four peripheral LEDs 109 of the indicator window 112 can be controlled to provide different backlighting illumination modes on the indicator window 112 corresponding to different operating modes of the device 200. In this example, the animated illumination modes are: (a) Continuous synchronized illumination by all four peripheral LEDs 109; (b) Synchronized pulsed illumination; (c) wavy transition illumination from one side to the other or from above to below / below to above; (d) Cycling illumination by sequential activation and deactivation of LEDs 109 around the perimeter of the indicator window 112.

[0045] In some embodiments, the backlight structure of a particular indicator structure may be multi-colored, in which case one or more display modes of the associated indicator structure include a color-specific static indicator mode and / or a multi-color dynamic mode. The static indicator mode may change the backlight color of the indicator window 112 to indicate the corresponding operation mode of the electronic device 200. The multi-function mode of the electronic device 200 may be indicated, for example, by backlighting the indicator window 112 with red illumination. The dynamic or dynamic multi-color indicator mode may, on the one hand, comprise the monochromatic color-specific capabilities of the dynamic illumination modes listed above (e.g., red for pulsing, blue for cycling, etc.), and, on the other hand, combine the capabilities of the dynamic illumination modes mentioned above to dynamically change the backlight color. It should be noted that a single device may be configured to perform all the above indicator modes depending on the current operation mode of the electronic device 200.

[0046] Multi-colored backlighting can be achieved by mounting multiple mono-colored peripheral LEDs around the periphery of a single indicator structure, including at least two sets of different mono-colored LEDs. Thus, for example, the indicator window 112 can include a set of red LEDs, a set of blue LEDs, and a set of green LEDs regularly spaced around the periphery 212 of the indicator window 112. Color variations can then be achieved by dynamically controlling each set of colored peripheral LEDs to vary the contribution of each mono-colored set to the resulting backlighting of the indicator window 112. Backlighting with multiple different colors can be achieved by varying the intensity of each set of colored peripheral LEDs. Alternatively or additionally, the peripheral LEDs 109 can include individual multi-colored LEDs (also known as multi-colored white LEDs or RGB LEDs), in which case providing multi-colored backlighting (static or dynamic) can be achieved by controlling the light emitted by each peripheral multi-colored LED.

[0047] Figure 5 illustrates a device 500 according to another exemplary embodiment. Similar or corresponding elements in the embodiments illustrated in Figures 1-4 and 5-7 are labeled with the same reference numerals unless otherwise indicated.

[0048] As shown in FIG. 5, the device 500 has a plurality of indicator structures configured to be backlit by an integral overmolded lighting device forming part of the laminated cover assembly 503. The exemplary device 500 has a power indicator 518 whose illumination state indicates the power state of the device 500. In this example, the power indicator 518 includes the manufacturer's trademark logo and brand name of the device 500. The device 500 further has a series of four button indicators 512 configured to indicate the selection state of a corresponding integrally formed capacitive button 305 (see FIG. 6) aligned in register with each button indicator 512. In this example, each button indicator 512 comprises an annular opening in the masking layer 121 (see FIG. 7) of the cover assembly 503. Each annular opening providing each button indicator 512 extends around the corresponding capacitive button 305. The exemplary device 500 further has a central rectangular opening providing a display window 506 for a liquid crystal display (LCD) forming part of the device 500.

[0049] 6, which shows the inside of the cover assembly 503 in a pre-assembled state prior to providing the optical matrix layer 106 to the device and installing the cover assembly, two LEDs 609 are seen to be provided around each button indicator 512. Each button indicator 512 is thus flanked by a pair of button LEDs 609 adjacent the periphery of the corresponding annular button indicator 512. A particular one of the button indicators 512 can therefore be backlit by activating the corresponding pair of peripheral button LEDs 609. However, due to the limited backlighting range of each laterally displaced LED 609, the backlight structure of each button indicator 512 is optically isolated from the backlight structure of the other button indicators 512, such that each button LED 609 is dedicated only to its corresponding indicator structure. Similarly, the power indicator 518 has a set of four dedicated LEDs 619 arranged around the periphery of the power indicator 518.

[0050] It should be noted that in this example, no backlighting is provided for the display window 506. Instead, electronic circuitry 132 provided by conductive traces 135 on the inner surface 124 of the cover assembly 503 provides a touch detection grid 629 comprising infrared LEDs and photodiodes. It should be noted that the portion of the electronic circuitry 132 shown in FIG. 6 is provided on a fold-over contact leaf that folds over the main portion of the cover assembly 503 during assembly and installation into the device 500.

[0051] 7, it can be seen that the laminate structure of the cover assembly 503 differs in several respects from the control panel assembly 100 of FIG 1. In the exemplary embodiment shown in FIG 7, the masking layer 121 and optical element 129 are attached to the outer surface 118 of the transparent substrate foil 115, such that the outer surface of the masking layer 121 provides the outer surface of the cover assembly 503 and the device 500. In the exemplary embodiment shown in FIG 7, the optical element 129 is a diffuser that diffuses light passing through the corresponding indicator 512 / 518.

[0052] Additionally, the body 139 of the device 500 is in direct contact with the inner surface 147 of the optical matrix layer 106 without any air gap. To limit the internal reflection of light emitted by the embedded LEDs 609, 619, a non-reflective surface 707 is provided in contact with the inner major surface 147 of the optical matrix layer 106. In this exemplary embodiment, the non-reflective surface 707 comprises a black surface. The provision of the non-reflective surface 707 serves to further limit the effective backlight range of each LED 609, 619. However, an optical effect area, including a reflective area 714 in this example, is provided below or aligned with each indicator structure (e.g., below the button indicator 512 and below the power indicator 518). The reflective area 714 helps limit the range of reflection of light onto and through a corresponding opening in the masking layer 121 of the corresponding indicator structure 512, 518.

[0053] An advantage of the control or indicator panel assembly described with reference to the exemplary embodiments is that it provides significant space savings compared to existing integrated backlit control / indicator panel assemblies, where backlight LEDs are often located, for example, below the cover structure assembly, which requires vertical displacement of the LEDs.

[0054] Another advantage is that because the LEDs are located on the cover / indicator structure instead of on the main board of the electronic device, more space is available on the device for other functions. The integrated illuminated laminate provided by the disclosed assemblies can be used as part of a thin indicator or cover structure that is separate from the device controls, such as an automotive instrument panel, dashboard, or steering wheel.

[0055] Another advantage is that a separate light guide is not required for each LED. Instead, the optical matrix layer 106 serves as a common light guide for the multiple peripheral LEDs 109 of the common indicator structure, and also serves as a common light guide for the multiple indicator structures. As discussed above, to provide a dynamic or dynamic indicator mode, previous cover assembly structures require separate light guides. Such a reduction in the number of parts in a cover assembly (which, as discussed above, can form an indicator assembly or control panel assembly for an electronic device) can advantageously provide cost savings through reduced material costs and reduced manufacturing steps required.

[0056] The relatively limited effective range of backlight illumination for each LED 109 allows for illumination differentiation between different indicator structures configured for backlight illumination (e.g., button indicator 512 of FIG. 6), while at the same time allowing optical matrix layer 106 to direct light over a larger area to provide an edge lighting effect (e.g., in the exemplary embodiment of FIG. 2, the peripheral illumination is enhanced by light leaking from the circular periphery of optical matrix layer 106). edge Ring 2 207, the optical matrix layer 106 is sandwiched between a black masking layer 121 and a black non-reflector surface 707. Such a secondary light guiding function can be provided when the cover assembly laminate has a curved or otherwise complex surface shape or contour. Confinement of the backlight illumination range of each peripheral LED can be aided by providing a non-reflective surface in contact with the opposing major surface of the optical matrix layer 106, such as the black masking layer 121 and black non-reflector surface 707 in the exemplary embodiment of FIG.

[0057] Yet another advantage of the disclosed assembly is that the hermetically sealed encapsulation of the electronic components of the assembly in the molded polymeric optical matrix layer 106 makes it more robust than similar existing power structures.

[0058] While the embodiments have been described with respect to specific exemplary embodiments, it will be apparent that these can be variously modified and changed without departing from the spirit and scope of the disclosure. The specification and drawings are, therefore, to be regarded in an illustrative rather than a restrictive sense.

[0059] The Abstract is provided to allow the reader to ascertain the nature and gist of the technical disclosure. It is provided with the understanding that it will not be used to limit or interpret the scope or meaning of the claims. The following claims are incorporated into the Detailed Description, with each claim standing on its own as a separate embodiment.

Claims

1. 1. An assembly forming part of an electronic device, comprising: a substantially opaque cover member adapted for incorporation into an electronic device to obscure one or more other components of the electronic device, the substantially opaque cover member having an outer surface and an inner surface opposite the outer surface, the substantially opaque cover member having a thickness dimension extending laterally between the outer surface and the inner surface; one or more indicator structures within the cover member, each indicator structure having a periphery defining a corresponding indicator shape of the cover member and being substantially translucent to allow backlight illumination to pass through the entire thickness dimension of the cover member; an optical matrix layer of a light-transmissive material attached to an inner surface of the cover member and overlapping at least a portion of the cover member including the one or more indicator structures when viewed along a thickness dimension of the cover member; and a backlight structure corresponding to each indicator structure of the one or more indicator structures, each backlight structure having one or more peripheral lighting devices for each indicator structure of the one or more indicator structures, each peripheral lighting device at or adjacent to a periphery of a respective indicator structure and embedded in the optical matrix layer, and further configured to provide backlighting for a respective indicator structure, each peripheral lighting device being laterally displaced from a periphery of a respective indicator structure and obscured by the cover member when an outer surface of the cover member at each indicator structure is viewed in a direction generally parallel to a thickness dimension of the cover member.

2. The assembly of claim 1 , further comprising electronic circuitry embedded in the optical matrix layer and electronically connected to the backlight structure.

3. The assembly of claim 2 , wherein the electronic circuitry comprises a printed circuit deposited on an inner surface of the cover member.

4. An assembly as described in claim 3, wherein each peripheral lighting device is mounted on an inner surface of the cover member.

5. 5. An assembly as claimed in claim 3 or 4, further comprising one or more controls manually operated by a user, the one or more controls being provided by printed circuitry deposited on an inner surface of the cover member.

6. 6. The assembly of claim 5, wherein the one or more controls include at least one capacitive button provided by the printed circuit.

7. The assembly of claim 1, wherein each peripheral lighting device includes a light-emitting diode (LED).

8. 8. The assembly of claim 1, further comprising a non-reflective surface on a major surface of the optical matrix layer furthest from the cover member, the optical matrix layer being sandwiched between the cover member and the non-reflective surface.

9. The assembly of claim 1 , wherein the cover member has a generally constant thickness and a constant contour such that the inner and outer surfaces of the cover member follow a contour.

10. 10. The assembly of claim 9, wherein the optical matrix layer has a substantially constant thickness and a contour that matches a contour of the cover member.

11. An electronic device including a main body and an indicator panel assembly mounted on the main body, the indicator panel assembly comprising: a substantially opaque cover member for obscuring at least a portion of an electronic device from view, the substantially opaque cover member having an outer surface and an inner surface opposite the outer surface, the substantially opaque cover member having a thickness dimension extending laterally between the outer surface and the inner surface; one or more indicator structures within the cover member, each indicator structure having a periphery defining a corresponding indicator shape of the cover member and being substantially translucent to allow backlight illumination to pass through the entire thickness dimension of the cover member; an optical matrix layer of a light-transmissive material attached to an inner surface of the cover member and overlapping at least a portion of the cover member including one or more indicator structures when viewed along a thickness dimension of the cover member; a backlight structure corresponding to each indicator structure of the one or more indicator structures, each backlight structure having one or more peripheral lighting devices for each indicator structure of the one or more indicator structures, each peripheral lighting device at or adjacent to a periphery of each indicator structure and embedded in the optical matrix layer, and further configured to provide backlighting for each indicator structure, each peripheral lighting device being laterally displaced from a periphery of each indicator structure and obscured by the cover member when an outer surface of the cover member at each indicator structure is viewed in a direction generally parallel to a thickness dimension of the cover member.

12. 12. The electronic device of claim 11, further comprising an electronic circuit embedded in the optical matrix layer and electronically connected to the backlight structure.

13. The electronic device of claim 12 , wherein the electronic circuitry comprises a printed circuit deposited on an inner surface of the cover member.

14. The electronic device described in claim 13, wherein each peripheral lighting device is mounted on an inner surface of the cover member.

15. 15. The electronic device of claim 13 or 14, wherein the indicator panel assembly includes one or more controls for manual selection by a user, the one or more controls being provided by the printed circuit such that the indicator panel assembly limits functionality of the electronic device.

16. 12. The electronic device of claim 11, further comprising a lighting control system configured to provide dynamic backlighting effects for at least one of the one or more indicator structures through time-varying activation and deactivation of one or more peripheral lighting devices corresponding to the at least one indicator structure.

17. 1. A method of manufacturing a cover structure assembly for an electronic device, comprising: providing a substantially opaque cover member for incorporation into an electronic device to obscure one or more other components of the electronic device, the cover member having an outer surface and an inner surface opposite the outer surface, a thickness dimension of the cover member extending laterally between the outer surface and the inner surface, and one or more indicator structures within the cover member, each indicator structure being substantially translucent to allow backlight illumination to pass through the entire thickness dimension of the cover member and having a periphery defining a corresponding indicator shape of the cover member; providing a backlight structure corresponding to each indicator structure of the one or more indicator structures, each backlight structure having one or more peripheral lighting devices for each indicator structure, each peripheral lighting device being at or adjacent a periphery of each indicator structure to provide backlighting illumination to each indicator structure, each peripheral lighting device being laterally displaced from the periphery of each indicator structure so as to be obscured by the cover member when an outer surface of the cover member is viewed at each indicator structure in a direction generally parallel to a thickness dimension of the cover member; and molding a translucent optical matrix layer on an inner surface of the cover member to embed each peripheral lighting device of the one or more peripheral lighting devices of each backlight structure in the translucent optical matrix layer, the optical matrix layer overlapping at least a portion of the cover member including the one or more indicator structures when viewed along a thickness dimension of the cover member.

18. The method of claim 17, further comprising providing electronic circuitry for each backlight structure, wherein providing a backlight structure corresponding to each indicator structure of the one or more indicator structures comprises connecting each peripheral lighting device of the one or more peripheral lighting devices to an electronic circuit, and wherein molding the optical matrix layer comprises embedding each peripheral lighting device and electronic circuitry of the one or more peripheral lighting devices in the optical matrix layer.

19. The method of claim 18, wherein providing the electronic circuitry includes printing the electronic circuitry on an inner surface of the cover member.

20. 20. The method of claim 19, wherein printing the electronic circuitry further comprises printing one or more controls for manual selection by a user as part of the electronic circuitry, and wherein molding the translucent optical matrix layer comprises embedding the one or more controls in the translucent optical matrix layer.

Images