Water-soluble adhesive composition for capturing components, water-soluble adhesive sheet for capturing components, and method for producing electronic components

Abstract

The present invention addresses the problem of providing a water-soluble adhesive composition for component capture and a water-soluble adhesive sheet for component capture that have exceptional shock-absorbing properties and tackiness / adhesiveness and are suited to capture of components, and providing a method for producing an electronic component that enables highly precise and efficient production using this composition and sheet.　In order to solve this problem, provided are: a composition that contains (A) a water-soluble adhesive agent and (B) a water-soluble plasticizer (excluding the component (A)), the (B) water-soluble plasticizer having a viscosity of 50,000 mPa∙s or lower at normal temperature (25°C), and the ratio ((B) / (A)) of the content value for the (B) water-soluble plasticizer to the content value for the (A) water-soluble adhesive agent being greater than 0.5 and not greater than 3.0; and a sheet including this composition.　According to the present invention: the shock-absorbing properties and tackiness / adhesiveness improve; the occurrence of damage or misalignment of components (elements), especially during, inter alia, production of semiconductor elements, is suppressed; and the sheet of the present invention in particular is easy to handle during attachment and detachment.

Description

[Technical field]

[0001] The present invention relates to a water-soluble adhesive composition for capturing components, a water-soluble adhesive sheet for capturing components, and a method for manufacturing electronic components. In particular, the present invention relates to a water-soluble adhesive composition for capturing components and a water-soluble adhesive sheet for capturing components, which are used to capture elements on a substrate in the manufacture of electronic components, and a method for manufacturing electronic components using the water-soluble adhesive composition for capturing components and the water-soluble adhesive sheet for capturing components. [Background technology]

[0002] 2. Description of the Related Art In the manufacture of electronic components such as semiconductor elements and display elements, materials having a pressure-sensitive adhesive layer (pressure-sensitive adhesive layer) are used for the purpose of preventing adhesion of foreign matter or for efficient manufacture of semiconductor chips or image display devices.

[0003] For example, Patent Document 1 proposes a method for manufacturing a display device using light-emitting diodes (LEDs). The method describes a process in which a large number of LED elements that become pixels are formed on a single wafer, and then dicing and enlargement transfer are performed using a temporary holding member having an adhesive layer (pressure-sensitive adhesive layer). Moreover, Patent Document 2 proposes a method of using laser light during enlargement transfer to separate an LED element from a substrate. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2002-261335 A [Patent Document 2] JP 2010-161221 A Summary of the Invention [Problem to be solved by the invention]

[0005] However, when transferring LED elements from a source substrate to a destination substrate by transfer, the LED elements may shift from their designated positions on the destination substrate.Also, the LED elements may collide with the destination substrate and bounce back, making it impossible to position the LED elements in the desired positions.

[0006] In view of the above, an object of the present invention is to provide a water-soluble adhesive composition for component capture and a water-soluble adhesive sheet for component capture which have excellent impact absorption properties and adhesiveness / bonding properties and are suitable for capturing components, and to provide a method for producing electronic components that uses the water-soluble adhesive composition for component capture and the water-soluble adhesive sheet for component capture to enable efficient production with high precision. [Means for solving the problem]

[0007] According to one aspect of the present invention, there is provided a water-soluble adhesive composition for capturing parts, comprising (A) a water-soluble adhesive and (B) a water-soluble plasticizer (excluding the component (A)), wherein the viscosity of the water-soluble plasticizer (B) is 50,000 mPa s or less at room temperature (25°C), and the ratio of the content of the water-soluble plasticizer (B) to the content of the water-soluble adhesive (A) ((B) / (A)) is greater than 0.5 and less than 3.0. According to the water-soluble adhesive composition for capturing components of the present invention, a water-soluble plasticizer having a viscosity of 50,000 mPa s or less at room temperature (25°C) is contained in a specified ratio relative to the content of the water-soluble adhesive. This improves the impact absorption and adhesiveness / bonding properties of the water-soluble adhesive composition for capturing components, and can suppress the occurrence of damage or displacement of components (elements) during the manufacture of electronic components, etc.

[0008] According to one aspect of the present invention, there is provided a water-soluble adhesive composition for capturing parts, comprising (A) a water-soluble adhesive and (B) a water-soluble plasticizer (excluding the component (A)), wherein the water-soluble plasticizer (B) is liquid at room temperature (25°C) and has a molecular weight of 5,000 or less, and the ratio of the content of the water-soluble plasticizer (B) to the content of the water-soluble adhesive (A) ((B) / (A)) is greater than 0.5 and less than 3.0. According to the water-soluble adhesive composition for capturing components of the present invention, a water-soluble plasticizer which is liquid and has a molecular weight of 5,000 or less is contained in a predetermined ratio relative to the content of the water-soluble adhesive. This improves the impact absorption and adhesiveness / bonding properties of the water-soluble adhesive composition for capturing components, and can suppress the occurrence of damage or displacement of components (elements) during the manufacture of electronic components, etc.

[0009] According to one aspect of the present invention, in a water-soluble adhesive composition for capturing parts, comprising (A) a water-soluble adhesive and (B) a water-soluble plasticizer (excluding the component (A)), the weight average molecular weight of the water-soluble adhesive (A) is 1.0 × 10 4 That's it, 1.0 x 10 6 The water-soluble adhesive composition for capturing parts is characterized in that the ratio ((B) / (A)) of the content of the water-soluble plasticizer (B) to the content of the water-soluble adhesive (A) is greater than 0.5 and is not greater than 3.0. According to the water-soluble adhesive composition for capturing parts of the present invention, the weight molecular weight is 1.0×10 4 That's it, 1.0 x 10 6 Because the water-soluble adhesive composition for capturing components contains the following water-soluble adhesives in specified proportions, the shock absorption, tackiness, and adhesion of the composition are improved, and damage or displacement of components (elements) can be suppressed during the manufacture of electronic components.

[0010] In the water-soluble adhesive composition for capturing parts according to one embodiment of the present invention, it is preferable that the (A) water-soluble adhesive contains at least one water-soluble adhesive selected from the group consisting of vinyl alcohol polymers, vinylpyrrolidone polymers, acrylic polymers, and saccharides. According to the above embodiment, it is possible to provide a water-soluble adhesive composition for capturing parts that is excellent in tackiness and adhesiveness as well as in water washability.

[0011] In the water-soluble adhesive composition for capturing parts according to one embodiment of the present invention, the water-soluble plasticizer (B) is preferably a monohydric or polyhydric alcohol that is liquid at room temperature (25° C.). According to the above embodiment, it is possible to provide a water-soluble adhesive composition for capturing parts, which has excellent compatibility with water-soluble adhesives, excellent tackiness and adhesiveness, and also has excellent water washability.

[0012] In the water-soluble adhesive composition for capturing parts according to one aspect of the present invention, the water-soluble plasticizer (B) preferably has a boiling point of 120° C. or higher. According to the above embodiment, it is possible to provide a water-soluble adhesive composition for capturing parts that is resistant to evaporation and changes in physical properties when a bonding process involving heating and / or pressure is performed after capturing the parts.

[0013] In the water-soluble adhesive composition for capturing parts according to one aspect of the present invention, the (B) water-soluble plasticizer preferably contains at least one selected from glycerin, diglycerin, polyethylene glycol, ethylene glycol, propylene glycol, and polypropylene glycol. According to the above embodiment, glycerin, diglycerin, polyethylene glycol, ethylene glycol, propylene glycol and polypropylene glycol all have a high boiling point, and therefore are unlikely to evaporate during the bonding process involving heating and / or pressure, so that the formation of vapor bubbles (so-called "voids") in the composition can be suppressed. In addition, the composition has an effect of excellent water washability.

[0014] According to one aspect of the present invention, there is provided a water-soluble adhesive sheet for capturing components, characterized by having a layer formed in a sheet shape from the above-mentioned water-soluble adhesive composition for capturing components. According to the water-soluble adhesive sheet for capturing parts of the present invention, by forming the water-soluble adhesive composition for capturing parts into a sheet, the water-soluble adhesive composition for capturing parts is excellent in shock absorption and adhesiveness, and is also excellent in handling during application and removal, thereby improving the efficiency of work related to capturing parts. In addition, the water-soluble adhesive sheet for capturing parts can significantly reduce the amount of liquid components, which also improves transportation efficiency and storage stability.

[0015] According to one aspect of the present invention, there is provided a method for producing an electronic component, comprising the step of capturing a component using the above-mentioned water-soluble adhesive composition for capturing a component. According to the method for producing electronic components of the present invention, the water-soluble adhesive composition for capturing components, which has excellent shock absorption and adhesion properties, is used, and therefore, damage or rebound caused by collision of the component (element) with the member to which the component is to be transferred during the transfer process can be suppressed, and the effect of preventing the occurrence of poor capture (mounting) of the component (element) at the desired position can be exhibited. This enables efficient production of electronic components with high accuracy.

[0016] According to one aspect of the present invention, there is provided a method for producing electronic components, comprising the step of capturing components using the above-mentioned water-soluble adhesive sheet for capturing components. According to the method for producing electronic components of the present invention, since a water-soluble adhesive sheet for capturing components, which has excellent shock absorption and adhesion properties, is used, it is possible to suppress damage and rebound caused by collision of the component (element) with the member to which the component (element) is transferred during the transfer process, and to prevent poor capture (mounting) of the component (element) at the desired position. In addition, since a water-soluble adhesive sheet for capturing components, which has excellent handling properties during application and peeling, is used, it is possible to easily perform operations related to capture and operations related to removing residue after capture when producing electronic components. This enables efficient production of electronic components with high accuracy. Effect of the Invention

[0017] According to the present invention, it is possible to provide a water-soluble adhesive composition for component capture and a water-soluble adhesive sheet for component capture which have excellent impact absorption properties and adhesiveness / bonding properties, as well as excellent handleability when affixed and peeled off, and are suitable for capturing components, and to provide a method for producing electronic components that uses the water-soluble adhesive composition for component capture and the water-soluble adhesive sheet for component capture, enabling efficient production with high precision. [Brief description of the drawings]

[0018] [Figure 1]FIG. 2 is a schematic diagram showing a non-contact transfer step, which is an example of a part capturing step using the water-soluble adhesive composition for capturing parts (water-soluble adhesive sheet for capturing parts) of the present invention. [Diagram 2] FIG. 2 is a schematic diagram showing a contact transfer step, which is an example of a part capturing step using the water-soluble adhesive composition for capturing parts (water-soluble adhesive sheet for capturing parts) of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0019] [Water-soluble adhesive composition for capturing parts and water-soluble adhesive sheet for capturing parts] The water-soluble adhesive composition for capturing components and the water-soluble adhesive sheet for capturing components of the present invention are used to capture components, and can be removed by washing with water after capture. The water-soluble adhesive composition for capturing components and the water-soluble adhesive sheet for capturing components of the present invention are not particularly limited to the subject to which they are applied, but for example, in the manufacture of electronic components, capturing electronic components on a substrate can be mentioned. In this case, the electronic components to be captured include elements or parts thereof selected from semiconductor elements, liquid crystal elements, photoelectric conversion elements, piezoelectric elements, thin film transistor elements, thin film diode elements, resistance elements, switching elements, micromagnetic elements, and microoptical elements, or combinations of these elements. The water-soluble adhesive composition for capturing components and the water-soluble adhesive sheet for capturing components of the present invention will be described below mainly on the premise that they are used to capture semiconductor elements on a substrate, but the present invention is not limited to this. In the following description, the water-soluble adhesive composition for capturing parts of the present invention will be simply referred to as the "capturing composition", and the water-soluble adhesive sheet for capturing parts will be simply referred to as the "capturing sheet".

[0020] The water-soluble adhesive composition for capturing components and the water-soluble adhesive sheet for capturing components of the present invention have shock absorbing properties for receiving a semiconductor element such as an LED element separated from a transfer source substrate by, for example, an energy ray (laser, etc.), and also have adhesiveness and tackiness for receiving the received semiconductor element at a desired position on the substrate, and adhesiveness and adhesion to the substrate. Furthermore, the water-soluble adhesive composition for capturing components and the water-soluble adhesive sheet for capturing components of the present invention can be removed in a water washing step as residues dissolve in water.

[0021] Although the present invention can be configured with a liquid water-soluble adhesive composition for capturing components, by forming the water-soluble adhesive composition for capturing components into a sheet-like layer to form a water-soluble adhesive sheet for capturing components, the application and drying steps to a wiring board can be omitted and handling becomes easier, so that the work efficiency can be improved, compared with the water-soluble adhesive composition for capturing components. Also, compared with the water-soluble adhesive composition for capturing components, the water-soluble adhesive sheet for capturing components can significantly reduce the amount of liquid components, so that the transportation efficiency can be improved and the storage stability can be improved.

[0022] In addition, when the sheet is applied, the capture surface (mounting surface) of the components, etc. becomes flatter than when a liquid water-soluble adhesive composition for capturing components is applied, so the water-soluble adhesive sheet for capturing components of the present invention allows the components to be placed stably.

[0023] The shape of the water-soluble adhesive sheet for capturing components of the present invention is not particularly limited. Examples of the shape of the water-soluble adhesive sheet for capturing components of the present invention include polygonal (e.g., rectangular, oblong, triangular, etc.), circular, elliptical, and amorphous shapes when viewed from above. The shape of the water-soluble adhesive sheet for capturing components of the present invention can also be a desired shape, such as a shape that matches the shape of the substrate to be attached. It may also be processed into a desired shape using a known method such as cutting. Furthermore, after being rolled, the required amount can be cut and used.

[0024] The thickness of the water-soluble adhesive sheet for capturing parts of the present invention is not particularly limited, but is, for example, preferably 1 μm or more, more preferably 3 μm or more, and even more preferably 5 μm or more. It is preferable that the thickness of the water-soluble adhesive sheet for capturing parts of the present invention is 1 μm or more, since the impact absorption properties are improved. The upper limit of the thickness of the water-soluble adhesive sheet for capturing parts of the present invention is preferably 500 μm or less, more preferably 100 μm or less, and even more preferably 50 μm or less. If the thickness of the water-soluble adhesive sheet for capturing parts of the present invention is 500 μm or less, the amount of residue is small, and therefore the time required for the water washing step for removing the sheet can be shortened, which is preferable.

[0025] The thickness of the water-soluble adhesive sheet for capturing components of the present invention is preferably selected appropriately in relation to the height of the bumps formed on the semiconductor element. When the capturing sheet is thicker than the height of the bumps, the bottom and side surfaces of the semiconductor element come into contact with the capturing sheet, thereby suppressing the rebound of the semiconductor element.

[0026] The water-soluble adhesive composition for component capture and the water-soluble adhesive sheet for component capture of the present invention contain a water-soluble plasticizer (B). When the water-soluble plasticizer (B) is a liquid component and is contained in a high proportion, the upper surface of the capture sheet is particularly prone to getting wet by the side surfaces of the semiconductor element bumps and the side surfaces of the semiconductor element in the initial stage of rebounding after the semiconductor element sinks, and the surface tension and adhesive force caused by this wetting exert an effect of suppressing the rebounding of the semiconductor element and damage to the semiconductor element.

[0027] In addition, if the semiconductor element sinks deeply into the capturing sheet, the capturing sheet covers the upper surface of the semiconductor element, further increasing the resistance to rebound, so that positional deviation is smaller even when the process of capturing the semiconductor element is carried out at high speed. In other words, in the early stages of rebound, the effect of suppressing rebound of the semiconductor element increases in the following order: "the capturing sheet is wet on the sides of the bumps of the semiconductor element (wet by the bumps of the semiconductor element)", "the capturing sheet is wet on the sides of the semiconductor element (wet by the bumps of the semiconductor element, the bottom surface of the semiconductor element, and the sides of the semiconductor element)", "the top surface of the semiconductor element is covered by the capturing sheet (wet by the bumps of the semiconductor element, the bottom surface of the semiconductor element, the sides of the semiconductor element, and the top surface of the semiconductor element)".

[0028] The ratio of the thickness of the water-soluble adhesive sheet for capturing components of the present invention to the height of the bumps on the semiconductor element (sheet thickness / bump height) is preferably 1.0 or more, more preferably 1.2 or more, and even more preferably 1.5 or more, from the viewpoint of preventing misalignment and damage to the semiconductor element when capturing the semiconductor element. When the ratio of the thickness of the water-soluble adhesive sheet for capturing components of the present invention to the height of the bumps is 1.0 or more, it is preferable because the bumps on the semiconductor element are less likely to be displaced from the desired positions of the electrodes on the substrate during the semiconductor element capturing step.

[0029] In addition, after the semiconductor element is captured without misalignment, in the bonding process involving heating and / or pressure, the semiconductor element must sink (again) due to softening of the capturing sheet, so that the bumps of the semiconductor element and the board electrodes can come into contact with each other. Therefore, if the thickness of the capturing sheet is significantly thicker than the height of the semiconductor element (the shortest distance between the bottom surface of the bumps of the semiconductor element and the top surface of the semiconductor element), the distance that the semiconductor element sinks (again) is long, and the semiconductor element may shake during the sinking, resulting in a large deviation from the board electrodes.

[0030] For these reasons, the ratio of the thickness of the water-soluble adhesive sheet for capturing components of the present invention to the height of the bumps (thickness of capturing sheet / height of bumps of semiconductor element) is preferably 5.0 or less, more preferably 3.6 or less, and even more preferably 2.3 or less, from the viewpoint of misalignment due to sinking of the semiconductor element in the bonding process after capturing the semiconductor element without misalignment. When the ratio of the thickness of the water-soluble adhesive sheet for capturing components of the present invention to the height of the bumps of the semiconductor element is 3.0 or less, misalignment between the bumps of the semiconductor element and the substrate electrodes due to sinking in the bonding process after capturing the semiconductor element in a desired position can be suppressed.

[0031] The height of the bump formed on the semiconductor element is not particularly limited, but is, for example, 1 μm or more and 50 μm or less. The lower limit of the bump height is preferably 1 μm or more, more preferably 2 μm or more, and even more preferably 3 μm or more. The upper limit of the bump height is preferably 50 μm or less, more preferably 30 μm or less, and even more preferably 20 μm or less.

[0032] The water-soluble adhesive composition for capturing a part and the water-soluble adhesive sheet for capturing a part of the present invention contain (A) a water-soluble adhesive and (B) a water-soluble plasticizer.

[0033] The content of component (A) is, for example, 10% by mass or more and 65% by mass or less based on the entire capturing sheet. When the content of component (A) is 10% by mass or more, it is preferable for the formability of the sheet. When the content of component (A) is 65% by mass or less, it is preferable for the tackiness and adhesiveness. From the viewpoint of improving the formability of the sheet, the lower limit of the content of the component (A) is preferably 20% by mass or more, more preferably 25% by mass or more, and even more preferably 30% by mass or more. The upper limit of the content of component (A) is preferably 65% ​​by mass or less, more preferably 60% by mass or less, and even more preferably 55% by mass or less, from the viewpoint of tackiness and adhesiveness.

[0034] The content of the component (B) is, for example, preferably 35% by mass or more, more preferably 40% by mass or more, and even more preferably 50% by mass or more, based on the entire capturing sheet. A content of component (B) of 35% by mass or more is preferable from the viewpoints of adhesion, bonding strength, surface tension, and rheological properties, because it improves prevention of misalignment during the transfer process of the semiconductor element. By setting the content of component (B) within the above range, the liquid properties are improved, the wettability to the semiconductor element is improved, and the rebound of the semiconductor element can be suppressed. In addition, within the above range, the polymer chain of the water-soluble adhesive becomes easier to move, and the shock absorption is excellent. This is because, as the frequency-dependent rheological properties become higher, the value of the storage modulus G' (E'), which is the elastic term, tends to be almost constant, while the loss modulus G'' (E''), which is the viscous term, tends to increase, and as a result, tan δ, which is an index of shock absorption, increases, which shows that the shock absorption is excellent. The content of component (B) is preferably 300% by mass or less, more preferably 250% by mass or less, and even more preferably 200% by mass or less, based on the content of component (A). It is preferable from the viewpoint of sheet formability that the content of component (B) is 300% by mass or less.

[0035] Hereinafter, each component constituting the water-soluble adhesive composition for capturing parts and the water-soluble adhesive sheet for capturing parts of the present invention will be described.

[0036] [(A) Water-soluble adhesive] The water-soluble adhesive, component (A), is the main component constituting the capturing composition and the capturing sheet, and is mainly composed of a polymer. The water-soluble adhesive, component (A), is a component that is water-soluble and exhibits adhesiveness alone or with the addition of a water-soluble plasticizer. Here, water solubility means that when it is made into a 1% by mass aqueous solution at room temperature (25° C.), it dissolves without turbidity. Also, adhesiveness means that in a sheet made by adding 30 or 50 parts by mass of the water soluble adhesive, which is component (A), or the water soluble plasticizer, which is component (B), at room temperature (25° C.), the sheet (1 cm×5 cm×10 μm) is pressed against, for example, a PET film (non-release treated surface) at room temperature (25° C.), and then the PET film with the sheet attached thereto is cut into a rectangular shape and the PET film cut into the rectangular shape is hung vertically, and the sheet and the PET film do not immediately peel off from each other. By containing component (A), the water-soluble adhesive composition for component capture and the water-soluble adhesive sheet for component capture of the present invention have improved tackiness and adhesiveness (pressure-sensitive adhesiveness) to semiconductor elements, adhesiveness and adhesion to substrates, inhibition of decomposition or melting property due to heating and / or pressure in the bonding process, and also improved water solubility.

[0037] The polymers constituting component (A) include those which have tackiness and adhesion in themselves, or those which develop tackiness and adhesion by forming a gel.

[0038] The water-soluble adhesive composition for capturing components and the water-soluble adhesive sheet for capturing components of the present invention are preferably melted in a bonding step involving heating and / or pressure to electrically connect a substrate and a semiconductor element, thereby electrically connecting the bumps of the semiconductor element and the electrodes of the substrate. In this case, it is preferable to use a polymer constituting component (A) that melts at the temperature of the bonding step. In this case, the softening point of the polymer constituting component (A) is not particularly limited as long as the capturing composition or capturing sheet melts in the bonding step. For example, in the case where the ratio (B / A) of the content of the water-soluble plasticizer (B) to the content of the water-soluble adhesive (A) in the capturing composition or capturing sheet is significantly reduced due to evaporation of the water-soluble plasticizer (B) (liquid component) during the bonding process, the softening point of the polymer constituting component (A) is preferably 200°C or less, more preferably 150°C or less, even more preferably 100°C or less, and even more preferably 80°C or less, from the viewpoint that the semiconductor element will sink into the capturing composition or capturing sheet due to the softening of the water-soluble adhesive (A) even if the water-soluble plasticizer (B) is gone during the bonding process. On the other hand, for example, from the viewpoint of being able to form a sheet even if it contains a large amount of the water-soluble plasticizer (B), the softening point of the polymer constituting component (A) is preferably 40°C or higher, more preferably 100°C or higher, even more preferably 150°C or higher, and even more preferably 200°C or higher.

[0039] The polymer constituting component (A) is soluble in water and can therefore be easily removed from the substrate by washing with water after the bonding step. The solubility of the polymer constituting component (A) is not particularly limited as long as it can be washed with water. For example, the solubility of the polymer constituting component (A) in water at 90° C. is 0.05 g / gH 2 O or more is preferable, and 0.10g / gH 2 O or more is more preferable, and 0.30g / gH 2 O or more is more preferable. In addition, 0.05g / gH 2 If the concentration is O or more, cleaning can be performed in a short time even at room temperature, and cleaning residue can be eliminated or reduced to an extremely small amount, which is preferable.

[0040] In addition, the component (A) may have a weight average molecular weight of, for example, 1.0×10 6If the amount exceeds 1000 ppm, it takes a long time to dissolve in water during cleaning, and cleaning residues are likely to be generated. Therefore, from the viewpoint of shortening the cleaning time and reducing the cleaning residues, it is preferable to improve the dissolution rate by decomposing component (A) to reduce the molecular weight. There are no particular limitations on the method of reducing the molecular weight as long as it does not damage the workpiece such as a semiconductor element or a substrate. For example, when component (A) is a natural polymer, various known hydrolases can be used. For example, when component (A) contains a polymer of α-glucose and / or its derivatives, such as starch and pullulan, hydrolases such as amylase, glucoamylase, and pullunase can be used. In addition, in the case of natural polymers containing β-glucose and / or its derivatives, such as carboxymethylcellulose (CMC), examples of hydrolases include cellulase. In the case of natural polymers derived from amino acids, such as silk, examples of hydrolases include proteases. When using the hydrolases, it is preferable to wash the hydrolases at the optimum pH and temperature range for expressing high enzyme activity. Depending on the enzyme, it may be necessary to use a pH value of 0.1 or more, such as 0.1 or more, in order to prevent the enzyme from becoming unstable. 2+ The enzyme activity can be further increased by adding additives such as the above.

[0041] The weight average molecular weight Mw of the polymer constituting the component (A) is 1.0×10 4 More than 5.0×10 is preferable. 4 More preferably, 1.0×10 5 The weight average molecular weight Mw of the polymer constituting the component (A) is preferably, for example, 1.0×10 6 If the concentration exceeds this range, it is preferable to increase the dissolution rate in water by converting component (A) into lower molecular weight compounds by hydrolysis or the like, from the viewpoints of shortening the cleaning time and reducing cleaning residues, as described above. The weight-average molecular weight Mw of the polymer constituting component (A) is preferably 1.0×10 to 5.0×10 from the viewpoints of sinking of the semiconductor element into the capturing composition (or capturing sheet) due to softening of the water-soluble adhesive and water washability. 6 Less than or equal to 8.0×10 is preferable. 5 Less than 4.0×10 is more preferable. 5The following is even more preferred:

[0042] The molecular weight distribution Mw / Mn (where Mn represents the number average molecular weight) of the polymer constituting component (A) is not particularly limited. For example, the lower limit of the molecular weight distribution Mw / Mn is preferably 1.5 or more, and more preferably 1.8 or more. The upper limit of the molecular weight distribution Mw / Mn is preferably 30 or less, more preferably 15 or less, and even more preferably 8 or less. By setting the molecular weight distribution Mw / Mn within the above range, a sheet can be favorably molded, and the variation in properties within the sheet can be suppressed, resulting in more uniform properties.

[0043] <Vinyl alcohol polymer> In the present invention, the vinyl alcohol polymer refers to a polymer having a hydroxyethylene repeating unit represented by the general formula (1). Hereinafter, the structure represented by formula (1) is also referred to as a vinyl alcohol repeating unit.

[0044] [ka]

[0045] The vinyl alcohol polymer may have a homopolymer structure in which the repeating unit is only a vinyl alcohol repeating unit, or may have a copolymer structure containing other repeating units. Hereinafter, a vinyl alcohol-based polymer having a homopolymer structure consisting of only vinyl alcohol repeating units will be simply referred to as a "homopolymer", and a vinyl alcohol-based polymer having a copolymer structure having other repeating units will be simply referred to as a "copolymer".

[0046] Vinyl alcohol polymers are generally produced by homopolymerizing or copolymerizing a monomer in which the hydroxyl group of vinyl alcohol is protected (e.g., vinyl acid salt, etc.), followed by modification (e.g., hydrolysis, etc.) to remove the protecting group. Therefore, examples of the repeating units other than the vinyl alcohol repeating unit include units that remain as repeating units before modification. Examples of the repeating units before modification include repeating units derived from vinyl formate, vinyl acetate, vinyl propionate, vinyl butyrate, vinyl isobutyrate, vinyl pivalate, vinyl versatate, vinyl caproate, vinyl caprylate, vinyl laurate, vinyl palmitate, vinyl stearate, vinyl oleate, vinyl trifluoroacetate, vinyl benzoate, butyl vinyl ether, and trimethylsilyl vinyl ether. Hereinafter, a repeating unit in a vinyl alcohol polymer that is not modified and in which the unmodified functional group remains will be referred to as an "unmodified repeating unit". In the vinyl alcohol polymer, the remaining unmodified repeating units may be of one type or two or more types. Vinyl alcohol polymers are generally produced by saponification of vinyl acetate polymers, and therefore vinyl alcohol copolymers obtained by modifying vinyl acetate polymers in which the unmodified repeating units are derived from vinyl acetate, which is easily available, are preferably used.

[0047] In a vinyl alcohol polymer consisting of vinyl alcohol repeating units and unmodified repeating units, the solubility in water and the adhesiveness (pressure-sensitive adhesiveness) are affected by the degree of saponification and the degree of polymerization. Here, the degree of saponification in a vinyl alcohol polymer consisting of vinyl alcohol repeating units and unmodified repeating units is the ratio of the number of vinyl alcohol repeating units to the total number of repeating units ([number of vinyl alcohol repeating units] / {[number of vinyl alcohol repeating units]+[number of unmodified repeating units]} ratio).

[0048] The solubility of a vinyl alcohol polymer consisting of vinyl alcohol repeating units and unmodified repeating units in water decreases when the degree of saponification is too high or too low, and also decreases when the degree of polymerization is high. For this reason, in the case of a vinyl alcohol polymer comprising unmodified repeating units, the degree of saponification and the degree of polymerization are selected depending on the type of unmodified repeating unit. For example, the lower limit of the degree of saponification is preferably 30% or more, more preferably 40% or more, and even more preferably 50% or more. Furthermore, for example, the upper limit of the degree of saponification is preferably 90% or less, more preferably 80% or less, and even more preferably 70% or less. If the content is within the above range, the compound is preferably usable because it does not crystallize and become less soluble in water, or has a small number of hydrophilic groups and becomes less soluble in water.

[0049] The vinyl alcohol polymer may contain one or more repeating units other than the vinyl alcohol repeating unit and the unmodified repeating unit. Examples of the repeating units other than the vinyl alcohol repeating unit and the unmodified repeating unit include repeating units derived from ethylene, (meth)acrylic acid, maleic acid, vinylpyrrolidone, aminoalkyl ester of (meth)acrylic acid, and monomers represented by general formula (2) (e.g., oxyethylene monoallyl ether and ethyl carbitol (meth)acrylate, etc.). Hereinafter, the repeating units other than the vinyl alcohol repeating units and the unmodified repeating units are also referred to as "third repeating units". The degree of saponification is measured as follows: 1 When the third repeating unit is not present, H-NMR can be measured according to JIS K6726.

[0050] [ka] (In the formula, R 1 and R 3 each independently represents a hydrogen atom or an organic group; R 2 represents an ether bond, an ester bond, an amide bond, an alkylene having 1 to 6 carbon atoms or a composite group thereof, or a single bond, and A represents an alkylene group having 2 to 22 carbon atoms. n represents an integer of 1 or more.

[0051] R in general formula (2) 1 represents a hydrogen atom or an organic group having 1 to 20 carbon atoms, and the organic group may naturally contain one or more of the elements O, N, S, Si and P. R 1 Examples of the organic group include an alkyl group, an acyl group, an acyloxy group, an alkoxycarbonyl group, an alkyl ester group (an acyloxy-substituted hydrocarbyl group and an alkoxycarbonyl-substituted hydrocarbyl group), an alkylamide alkylene group, and a sulfonate group.

[0052] Examples of the alkyl group include a methyl group, an ethyl group, an n-propyl group, an i-propyl group, a butyl group, a pentyl group, and a hexyl group. Examples of the acyl group include a methylcarbonyl group, an ethylcarbonyl group, an n-propylcarbonyl group, an i-propylcarbonyl group, a butylcarbonyl group, a pentylcarbonyl group, and a hexylcarbonyl group. Examples of the alkyl ester group include a methyloxycarbonylmethylene group, a methylcarbonyloxymethylene group, an ethyloxycarbonylethylene group, and an ethylcarbonyloxyethylene group. Examples of the alkylamidoalkylene group include an N,N'-dimethylamidoalkylene group and an N,N'-diethylamidoalkylene group. R 1 is preferably a hydrogen atom or an alkyl group, acyl group, alkyl ester group or alkylamide alkylene group having 1 to 10 carbon atoms, more preferably a hydrogen atom or a methyl group, and further preferably a hydrogen atom. R 1 is preferably a hydrogen atom, since this can lower the glass transition temperature of the polymer.

[0053] R in general formula (2) 2represents an ether bond (-O-), an ester bond (-COO-, -OCO-), an amide bond (-NHCO-, -OCNH-), an alkylene having 1 to 6 carbon atoms, a composite group thereof, or a single bond.

[0054] R in general formula (2) 3 represents a hydrogen atom or an organic group having 1 to 20 carbon atoms, and the organic group may naturally contain one or more of the elements O, N, S, Si and P. R 3 Examples of the organic group include an alkyl group, an acyl group, an alkoxycarbonyl group, an alkyl ester group (an acyloxy-substituted hydrocarbyl group and an alkoxycarbonyl-substituted hydrocarbyl group), an alkylamide group, an alkylamide alkylene group, and a sulfonate group.

[0055] Examples of the alkyl group include a methyl group, an ethyl group, an n-propyl group, an i-propyl group, a butyl group, a pentyl group, and a hexyl group. Examples of the acyl group include a methylcarbonyl group, an ethylcarbonyl group, an n-propylcarbonyl group, an i-propylcarbonyl group, a butylcarbonyl group, a pentylcarbonyl group, and a hexylcarbonyl group. Examples of the alkyl ester group include a methyloxycarbonylmethylene group, a methylcarbonyloxymethylene group, an ethyloxycarbonylethylene group, and an ethylcarbonyloxyethylene group. Examples of the alkylamidoalkylene group include an N,N'-dimethylamidoalkylene group and an N,N'-diethylamidoalkylene group. R 3 is preferably a hydrogen atom or an alkyl group, acyl group, alkyl ester group or alkylamide alkylene group having 1 to 10 carbon atoms, more preferably a hydrogen atom or a methyl group.

[0056] In the general formula (2), A represents a linear or branched alkylene group having 2 to 22 carbon atoms. In general formula (2), when n is 2 or more, multiple As may be the same or different. In formula (2), A preferably has 10 or less carbon atoms, more preferably has 4 or less carbon atoms, further preferably has 3 or less carbon atoms, and particularly preferably has 2 carbon atoms.

[0057] Examples of A in the general formula (2) include dimethylene (ethylene), trimethylene, methylethylene, tetramethylene, 1-methylpropylene, 2-methylpropylene, and 1-ethylethylene. In the oxyalkylene structure, an oxyalkylene group having a smaller number of carbon atoms in the alkylene group that acts as a hydrophobic group is more hydrophilic than an oxyalkylene group having a larger number of carbon atoms. Therefore, in the general formula (2), the oxyalkylene structure represented by "AO" is most preferably an oxyethylene structure.

[0058] The repeat number n in the general formula (2) represents the number of oxyalkylene structures represented by the hydrophilic group "AO." Therefore, generally, as the number n increases, the hydrophilicity of the repeat unit represented by the general formula (2) improves. Therefore, the lower limit of the repeat number n in general formula (2) is preferably 2 or more, more preferably 5 or more, and even more preferably 6 or more. The upper limit of the repeat number n in general formula (2) is preferably 300 or less, more preferably 200 or less, even more preferably 65 or less, and particularly preferably 20 or less. By setting the number of repeating units n of the oxyalkylene group within the above range, the solubility in low-temperature water can be improved, and the adhesiveness can also be improved.

[0059] The content ratio of the third repeating unit is not particularly limited as long as the vinyl alcohol polymer exhibits tackiness and adhesiveness (pressure-sensitive adhesiveness) and is soluble in water. Therefore, depending on the type of the third repeating unit, the proportion of the third repeating unit is selected from the viewpoints of tackiness and adhesiveness (pressure-sensitive adhesiveness) and water solubility. For example, the proportion of the third repeating unit in the vinyl alcohol polymer ("third repeating unit" x 100 / "vinyl alcohol repeating unit" + "unmodified repeating unit" + "third repeating unit") is preferably 0.5 mol% or more, more preferably 3.0 mol% or more, and even more preferably 5.0 mol% or more. If it is 0.5 mol % or more, it can be preferably used because it has good solubility in water at low temperatures and good miscibility with the water-soluble plasticizer (B). The proportion of the third repeating unit in the vinyl alcohol polymer is preferably 20 mol % or less, more preferably 10 mol % or less, and even more preferably 5 mol % or less. If it is 20 mol % or less, it can be preferably used because the sheet formability is good.

[0060] In addition, the content ratio of the vinyl alcohol repeating unit in the vinyl alcohol polymer is not particularly limited as long as the vinyl alcohol polymer exhibits adhesiveness (pressure-sensitive adhesiveness) and is soluble in water. For example, the content ratio of the vinyl alcohol repeating unit in the vinyl alcohol polymer is preferably 20 mol% or more, more preferably 30 mol% or more, and even more preferably 40 mol% or more. If it is 20 mol % or more, the adhesiveness is good, so that it is preferable. The proportion of vinyl alcohol repeating units in the vinyl alcohol polymer is preferably 90 mol % or less, more preferably 80 mol % or less, and even more preferably 60 mol % or less. If it is 90 mol % or less, the adhesion is good, which is preferable.

[0061] In the vinyl alcohol polymer, a polymer containing a repeating unit derived from a monomer having a (poly)oxyalkylene structure has improved water solubility. For this reason, the third repeating unit is preferably a repeating unit derived from a monomer having a (poly)oxyalkylene structure.

[0062] In addition, when the third repeating unit is water-soluble, the water solubility of the vinyl alcohol polymer can be improved without relying on the vinyl alcohol repeating unit, and therefore, from the viewpoint of solubility in water, the degree of saponification of the vinyl alcohol polymer can be made lower than the degree of saponification of a vinyl alcohol polymer not containing the third repeating unit. Furthermore, as a result of the lowering of the proportion of crystalline vinyl alcohol repeating units, the glass transition temperature of the vinyl alcohol copolymer can be lowered, and the tackiness and adhesiveness can be improved. Therefore, the third repeating unit is more preferably a repeating unit derived from a monomer having a (poly)oxyalkylene structure, and even more preferably a repeating unit represented by general formula (2).

[0063] The vinyl alcohol homopolymer or vinyl alcohol copolymer may have a structure represented by the general formula (3) at least at one terminal of the polymer.

[0064] [ka] (In the formula, R 4 represents an ether bond, an ester bond, an amide bond, an alkylene having 1 to 6 carbon atoms, a composite group thereof, or a single bond; R 5 and R 6 each independently represents a hydrogen atom or an alkyl group having 1 to 10 carbon atoms; R 7 represents a hydrogen atom or an organic group having 1 to 20 carbon atoms. m represents an integer of 1 or more.

[0065] R in general formula (3) 4 , R 7 and m are R in general formula (2), 2 , R 3 and n are as described above. R 5 and R 6 are each independently a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, and when m is 2 or more, multiple R 5or multiple R's 6 may be the same or different. R 5 and R 6 Examples of the alkyl group in the formula (I) include a methyl group, an ethyl group, an n-propyl group, an i-propyl group, a butyl group, a pentyl group, and a hexyl group. From the viewpoint of improving the water solubility of the vinyl alcohol polymer, a hydrogen atom is preferred.

[0066] The vinyl alcohol polymer may be one selected from vinyl alcohol homopolymers, vinyl alcohol copolymers, and vinyl alcohol polymers having a structure represented by general formula (3) at at least one end, or two or more may be used. When two or more types are used, two or more types selected from vinyl alcohol copolymers or vinyl alcohol polymers having a structure represented by general formula (3) at at least one end may be used.

[0067] <Vinylpyrrolidone polymer> In the present invention, the vinylpyrrolidone polymer refers to a polymer having a structure represented by the general formula (4) as a main repeating unit.

[0068] [ka]

[0069] The vinylpyrrolidone polymer may be a vinylpyrrolidone homopolymer or a copolymer. Examples of the copolymerization components include ethylene, (meth)acrylic acid, maleic acid, vinylpyrrolidone, aminoalkyl esters of (meth)acrylic acid, and monomers represented by general formula (2) (e.g., oxyethylene monoallyl ether and ethyl carbitol (meth)acrylate, etc.).

[0070] The proportion of the copolymerization component in the vinylpyrrolidone polymer is not particularly limited as long as it does not impair the effects of the present invention. For example, the proportion of the copolymerization component is preferably 30 mol % or less, more preferably 10 mol % or less, and even more preferably 5 mol % or less. If the content is 30 mol % or less, it is preferable because it does not inhibit the formation of strong hydrogen bonds with water, which generates heat, and the solubility in water is good. Vinylpyrrolidone is particularly useful and preferred because of its ready availability, excellent water solubility and adhesiveness.

[0071] <Acrylic polymer> The acrylic polymer refers to a polymer having, as a main repeating unit, a structure formed by addition polymerization of a monomer having a (meth)acryloyloxy structure. The water-soluble acrylic polymer preferably has a hydroxyl group, a carboxyl group (including functional groups such as salts of a carboxyl group, e.g., sodium carboxylate, ammonium carboxylate), an oxyalkylene group (e.g., an oxyethylene structure or an oxypropylene structure), or an amino group (including functional groups such as salts of an amino group, e.g., ammonium chloride, ammonium sulfate). It is more preferable that the acrylic polymer has a hydroxyl group or an oxyalkylene group, since this improves the water solubility.

[0072] In addition, since the acrylic polymer used in the present invention has adhesiveness (pressure-sensitive adhesiveness) either alone or by containing a water-soluble plasticizer (B), the glass transition temperature is preferably 120°C or lower, more preferably 80°C or lower, and even more preferably 50°C or lower.

[0073] The glass transition temperature was measured according to JIS K6240 (DSC method).

[0074] Examples of the acrylic polymer include those obtained by copolymerizing one or more selected from hydrophilic acrylic acid monomers (such as acrylic acid, carboxyethyl acrylate, hydroxyethyl acrylate, 2-(2-ethoxyethoxy)ethyl acrylate, polyoxyethylene acrylate, polyoxypropylene acrylate, and polyoxyethylene polyoxypropylene acrylate) with one or more selected from acrylic acid alkyl esters (such as methyl acrylate, ethyl acrylate, propylene acrylate, butyl acrylate, and 2-ethylhexyl acrylate), methacrylic acid monomers (such as methacrylic acid, methacrylic acid alkyl ester, hydroxyalkyl methacrylate, and poly(oxyalkylene) methacrylate), and acrylonitrile.

[0075] Regarding the acrylic polymer, the proportion of monomers other than the hydrophilic acrylic acid monomers may be soluble in water, and the glass transition temperature may preferably be 120 °C or lower, with no particular limitation. For example, the proportion of monomers is preferably 30 mol% or less, more preferably 10 mol% or less, and even more preferably 5 mol% or less.

[0076] Examples of the acrylic polymer include those obtained by copolymerizing a hydrophilic acrylic acid monomer that induces a homopolymer with a low glass transition temperature with a (meth)acrylic acid monomer and a (meth)acrylic acid alkyl ester having a polar group (such as a carboxyl group and a hydroxyl group) that improves the adhesiveness (pressure-sensitive adhesiveness) to a metal.

[0077] <Saccharides> In the present invention, the saccharides refer to polymers having the characteristics of the above water-soluble adhesives. Examples thereof include pullulan, which is a repeating unit represented by the general formula (5), hydroxyethyl cellulose, which is a repeating unit represented by the general formula (6), carboxymethyl cellulose, which is a repeating unit represented by the general formula (7), and starch.

[0078]

Chemical formula

[0079] [ka] (In the formula, R 8 each independently represents a hydrogen atom or a mono- or polyoxyalkylene group having a hydrogen atom at the terminal.

[0080] [ka] (In the formula, R 9 are independently a hydrogen atom or CH 2 COONa or CH 2 COONH 4 Represents.)

[0081] [(B) Water-soluble plasticizer] The water-soluble plasticizer, which is the component (B), acts as a plasticizer for the component (A) and has the effect of making the component (A), which is the main component of the capturing composition and capturing sheet of the present invention, more flexible, thereby absorbing the impact when the semiconductor element separated from the original substrate comes into contact with the capturing composition and capturing sheet of the present invention, and preventing damage to the semiconductor element and displacement due to rebound. For this reason, the water-soluble plasticizer (B) is preferably in a liquid state when capturing or joining the parts in order to make the component (A) more flexible. For example, it is preferably in a liquid state at room temperature (25°C). The water-soluble plasticizer (B) in the present invention is other than the component (A). The water-soluble plasticizer (B) in the present invention contains water.

[0082] The boiling point of the (B) water-soluble plasticizer is not particularly limited, but is, for example, not less than 120° C., preferably not less than 150° C., and more preferably not less than 180° C. When the (B) water-soluble plasticizer has a boiling point of not less than 120° C., it is less likely to evaporate during capturing, which provides the effect that the properties of the water-soluble adhesive composition for component capturing and the water-soluble adhesive sheet for component capturing of the present invention are less likely to change during capturing and bonding.

[0083] Furthermore, since the water-soluble adhesive composition for capturing parts and the water-soluble adhesive sheet for capturing parts of the present invention are subjected to a bonding process involving heating and / or pressurization, the water-soluble plasticizer (B) is preferably a liquid plasticizer whose vapor pressure at the temperature during the bonding process is less than atmospheric pressure. In the case of a liquid plasticizer whose vapor pressure at the temperature during the bonding process is less than atmospheric pressure, evaporation does not occur, and therefore the formation of vapor bubbles (so-called "voids") in the capturing composition and the capturing sheet can be suppressed. The upper limit of the boiling point of the water-soluble plasticizer (B) is not particularly limited, but is, for example, 500° C. or lower.

[0084] (B) The water-soluble plasticizer is removed by washing with water after the joining process. Therefore, as long as it dissolves in water, it can be used without any restrictions. Since washing with water can be performed efficiently, the solubility of (B) the water-soluble plasticizer in water is 0.10 g / gH at room temperature (25°C). 2 O or more is preferable, and 0.30 g / gH 2 O or more is more preferable, and 0.50g / gH 2 O or more is more preferable.

[0085] In addition, it is preferable that the water-soluble plasticizer (B) does not inhibit the melting property of component (A) in the joining step, has excellent water solubility, and also provides an aqueous solution of the water-soluble plasticizer (B) with low viscosity. For this reason, the water-soluble plasticizer (B) is preferably liquid at room temperature (25°C). The upper limit of the viscosity of the water-soluble plasticizer (B) is preferably 50,000 mPa·s or less at room temperature (25°C), more preferably 40,000 mPa·s or less, even more preferably 1,000 mPa·s or less, and even more preferably 600 mPa·s or less. On the other hand, the lower limit is not particularly limited, but is preferably 0.8 mPa·s or more, and more preferably 1.0 mPa·s or more. In addition, since the viscosity of the aqueous solution depends on the molecular weight of the solute, for example, the molecular weight of the compound used as the water-soluble plasticizer (B) is preferably 5000 or less, more preferably 3000 or less, even more preferably 1000 or less, even more preferably 800 or less, and particularly preferably 600 or less. In the description of the present invention, the molecular weight of the water-soluble plasticizer having a molecular weight distribution means the weight average molecular weight.

[0086] The type of water-soluble plasticizer (B) is selected from those that do not impair the effects of the present invention due to a decrease in solvent solubility, meltability, and melting property as a result of reaction or interaction with component (A). For example, when component (A) reacts with component (B) to form a three-dimensional crosslinked structure, the solvent solubility, meltability and surface tension are impaired.

[0087] The water-soluble plasticizer, component (B) of the present invention, is preferably a monohydric or polyhydric alcohol or alkanolamine, which has multiple hydrophilic functional groups and is therefore excellent in terms of water solubility.

[0088] More specific examples of the (B) water-soluble plasticizer include glycerin, diglycerin, ethylene glycol, diethylene glycol, propane-1,2-diol, 1,3-propanediol, diethylene glycol monomethyl ether, ethanolamine, and trimethanolamine. Examples of the polymeric water-soluble plasticizer include polyethylene glycol, monoalkoxy-terminated polyethylene glycol, dialkoxy-terminated polyethylene glycol, polyglycerin, propylene glycol, and polypropylene glycol.

[0089] Here, the (B) water-soluble plasticizer is preferably glycerin, diglycerin, polyethylene glycol, polypropylene glycol, or triethanolamine. Glycerin, diglycerin, polyethylene glycol, polypropylene glycol, or triethanolamine has excellent miscibility with water and a high boiling point. This is because it provides excellent meltability and surface tension of the capturing sheet in the joining step and excellent water washability in the washing step. Glycerin, diglycerin, polyethylene glycol, or polypropylene glycol, which are easily available and easy to handle, are more preferable, and glycerin and polyethylene glycol are even more preferable.

[0090] In addition, the ratio of the content of the water-soluble plasticizer (B) to the content of the water-soluble adhesive (A) ((B) / (A)) is greater than 0.5 and equal to or less than 3.0. As shown in the examples described later, if this value is not satisfied, sufficient impact absorption, tackiness, and adhesion cannot be obtained, and further handling properties during application and removal may be poor.

[0091] [Other ingredients] The acquiring sheet of the present invention may contain water in an amount of 10% by mass or less based on the entire acquiring sheet, as long as the effect of the present invention is not impaired. The retrieving composition and retrieving sheet of the present invention may contain other components as long as they do not impair the effects of the present invention. Examples of other components include lubricants, antioxidants, antistatic agents, surfactants, heat stabilizers, rust inhibitors, and surface conditioners (leveling agents). It is preferable that the capturing composition and capturing sheet of the present invention do not contain a thermosetting resin, because the thermosetting resin may harden during the bonding process and may not be removable by washing with water or the like.

[0092] [Method of manufacturing a water-soluble adhesive composition for capturing parts] The water-soluble adhesive composition for capturing parts of the present invention can be produced by a known production method. For example, the raw materials shown in Tables 1 and 2 described below can be used and kneaded in a mixer or the like to produce the composition.

[0093] [Method of manufacturing water-soluble adhesive sheet for capturing parts] The water-soluble adhesive sheet for capturing parts of the present invention can be produced by a known production method for producing sheets containing an adhesive. For example, the part capturing adhesive can be produced by forming a layer using the water-soluble adhesive composition for capturing parts of the present invention on a prepared release sheet. The substrate of the release sheet is not particularly limited as long as it can release the water-soluble adhesive composition for capturing parts of the present invention. Examples of the substrate of the release sheet include polyester, polyolefin, and polyamide. Examples of the polyester include polyethylene terephthalate, polytetramethylene terephthalate, polyethylene naphthalate, and polytetramethylene terephthalate. Examples of polyolefins include linear low density polyethylene, low density polyethylene, medium density polyethylene, and polypropylene. Examples of polyamides include polycaprolactam, polyhexamethylene adipamide, polytetramethylene adipamide, polyhexamethylene isophthalamide, polyhexamethylene sebacamide, polyhexamethylene dodecamide, polyhexamethylene terephthalamide, polynonamethylene terephthalamide, polydecamethylene terephthalamide, polyundecane lactam, polydodecane lactam, and polymetaxylylene adipamide. The release sheet may be subjected to a known release treatment on at least one surface. The layer using the water-soluble adhesive composition for capturing parts of the present invention may be formed on one or both sides of the release sheet.

[0094] The method for providing a layer using the scavenging composition of the present invention is not particularly limited, and any known method can be used. For example, the capturing sheet can be produced by dissolving or dispersing a composition containing all or part of the components constituting the capturing sheet in a solvent and applying the solution or dispersion to the release sheet. Examples of the solvent include water, organic solvents, and mixtures of water and organic solvents. Examples of the organic solvent include methanol, ethanol, 1-propanol, 2-propanol, 1-butanol, 2-butanol, 2-methyl 1-propanol, 2-methyl 2-propanol, 1-pentanol, 2-pentanol, 3-pentanol, 2-methyl 1-butanol, 2-methyl 2-butanol, 3-methyl 1-butanol, 3-methyl 2-butanol, and 2,2-dimethyl 1-propanol. The coating method is not particularly limited as long as the layer formed by using the capturing composition of the present invention can be formed to a uniform thickness. For example, the method for forming a layer with a uniform thickness includes spin coating, blade coating, slit coating, and slot die coating. When a composition containing some of the components constituting the acquiring sheet is used, for example, after forming a layer, a liquid component (e.g., component (B)) may be impregnated or substituted into the acquiring sheet before or after drying. At this time, the drying temperature is 60°C to 140°C, and preferably 80°C to 120°C.

[0095] [Method of using the water-soluble adhesive composition for capturing parts (water-soluble adhesive sheet for capturing parts)] The water-soluble adhesive composition for capturing components and the water-soluble adhesive sheet for capturing components of the present invention can be used, for example, in the manufacture of electronic components having the following steps. The following mainly describes the method of using the water-soluble adhesive sheet for capturing components of the present invention. Note that the following description of the method of using the water-soluble adhesive composition for capturing components (water-soluble adhesive sheet for capturing components) can be replaced with the description of the method of manufacturing electronic components of the present invention. (1) A step of placing the scavenging sheet (scavenging composition) of the present invention on the electrode surface side of a wiring board and laminating (applying) it (2) A step of capturing a semiconductor element on the capturing sheet (capturing composition) of the present invention. (3) A bonding process in which the semiconductor element is electrically bonded to the wiring board. (4) Cleaning process to remove residue (5) Drying process for wiring boards

[0096] <(1) Bonding process> In the step of placing the capturing sheet of the present invention on the electrode side of the wiring board and laminating it, the capturing sheet of the present invention formed on the release sheet is laminated to the wiring board. If the capturing sheet of the present invention has a release sheet, the release sheet is peeled off. Before laminating the capturing sheet of the present invention, the electrode surface of the wiring board may be washed using an organic solvent, an acidic aqueous solution, a basic aqueous solution, or the like. The wiring substrate is not particularly limited as long as it is a substrate equipped with wiring, and examples thereof include a TFT backplane which is a glass substrate, FR-4 which is a glass epoxy substrate, a ceramic substrate, and a silicone wafer. Instead of the lamination step using the scavenging sheet of the present invention, a step of directly coating the scavenging composition of the present invention on the electrode surface of the wiring board and drying it may be used.

[0097] <(2) Capture process> In the process of capturing a semiconductor element on the capturing sheet of the present invention, the component (element) is disposed at a desired position on the substrate. This capturing process may also serve as a transfer process in semiconductor manufacturing. The transfer step is a step of determining the position of the semiconductor element on the wiring board, and moving the semiconductor element from the substrate on which the semiconductor element is formed or the substrate on which the semiconductor element is temporarily held, onto the capturing sheet of the present invention, which is the destination of the transfer. As the transfer step, a non-contact transfer step and a contact transfer step are known, but are not particularly limited.

[0098] Non-contact transfer process As one embodiment of the transfer process, a non-contact transfer process is exemplified and described based on Fig. 1. The transfer process using the capturing sheet of the present invention is not limited to the embodiment shown in the example. Note that some parts of the drawings are enlarged or reduced in size to facilitate understanding of the description.

[0099] (i) In the destination substrate 1A shown in FIG. 1(a) manufactured in the above-mentioned (1) bonding process, the surface opposite to the surface of the water-soluble adhesive sheet 11A for capturing components of the present invention bonded to the wiring substrate 12A is arranged to face the surface of the source substrate 2A having the semiconductor element 21A with a gap therebetween. Here, an original substrate 2A shown in FIG. 1(a) has a semiconductor element 21A held by an adhesive layer 22A formed on one surface of a holding substrate 23A that temporarily holds the element.

[0100] (ii) As shown in Fig. 1(b), an energy beam (laser, etc.) 3 is irradiated onto one or more desired positions of the semiconductor elements from the surface of the original substrate 2A opposite to the surface on which the semiconductor elements 21A are formed. By irradiating the energy beam (laser, etc.) 3, the semiconductor elements 21A are separated from the original substrate 2A as shown in Fig. 1(c), and the separated semiconductor elements 21A are adhered to and transferred to the capturing sheet 11A to be transferred.

[0101] (iii) Thereafter, as shown in Fig. 1(d), the source substrate 2B, which includes a holding substrate 23B on which a semiconductor element 21B different from the semiconductor element 21A is temporarily held, is moved to a desired position relative to the destination substrate 1A. After the movement, as shown in Fig. 1(e) and Fig. 1(f), the process related to (ii) above is repeated.

[0102] (iv) The above steps (ii), (iii) and, if necessary, (i) are repeated to transfer and arrange the semiconductor elements at all of the desired positions on the destination substrate 1A (not shown).

[0103] The holding substrates 23A and 23B in the original substrates 2A and 2B may be, for example, any of a sapphire substrate, quartz glass, glass, and plastic. The separation between the holding substrate 23A and the semiconductor element 21A and the separation between the holding substrate 23B and the semiconductor element 21B are caused by, for example, decomposition (and foaming), aggregation, or softening / melting of the components constituting the adhesive layers 22A and 22B due to irradiation with an energy ray (laser, etc.) 3. Therefore, in order to allow the adhesive layers 22A and 22B to efficiently absorb the energy of the energy ray (laser or the like) 3, the holding substrates 23A and 23B are preferably ones that transmit the energy ray 3 or have low absorption.

[0104] The components constituting the adhesive layers 22A and 22B in the transfer source substrates 2A and 2B include an adhesive component. Examples of the adhesive component include silicone, acrylic polymer, polyvinyl alcohol polymer, and vinylpyrrolidone polymer. The components constituting the adhesive layers 22A and 22B may also include a component that foams or a crosslinking component that promotes aggregation by the energy ray (laser) 3.

[0105] The energy beam 3 may be, for example, a laser. The laser may be, for example, an excimer laser or a harmonic YAG laser.

[0106] Contact transfer process Next, as another form of the transfer process, a contact transfer process will be described with reference to FIG. In this embodiment, the semiconductor element on the holding substrate that temporarily holds the element is brought into contact with the capturing sheet of the present invention on the substrate to perform the transfer, which is the same as the non-contact transfer process. Therefore, the following (i) to (iv) will be described, and the description of the other contents common to the non-contact transfer process will be omitted.

[0107] (i) As shown in FIGS. 2(a) and 2(b), the semiconductor element 21C of the source substrate 2C is brought into contact with the component capturing water-soluble adhesive sheet 11B of the destination substrate 1B.

[0108] (ii) As shown in Fig. 2(c), an energy beam (laser, etc.) 3 is irradiated onto one or more desired positions of the semiconductor elements from the surface of the original substrate 2C opposite to the surface on which the semiconductor elements 21C are formed. By irradiating the energy beam (laser, etc.) 3, the semiconductor elements 21C are separated from the original substrate 2C as shown in Fig. 2(d), and the separated semiconductor elements 21C are adhered to and transferred to the capturing sheet 11B as the destination.

[0109] (iii) After the separated semiconductor element 21C is transferred, the original substrate 2D holding the semiconductor element 21D different from the semiconductor element 21C on the holding substrate 23D is moved to a desired position as shown in Fig. 2(e), and the semiconductor element 21D on the original substrate 2D is brought into contact with the capturing sheet 11B. After the contact, the process of (ii) above is repeated as shown in Fig. 2(f) to Fig. 2(h).

[0110] (iv) The above steps (ii), (iii) and, if necessary, (i) are repeated to transfer and arrange the semiconductor elements at all of the desired positions on the destination substrate 1B (not shown).

[0111] -Mold deformation during the transfer process The form of the transfer step is not limited to the above-mentioned form, and may include modifications and improvements within the scope of the present invention.

[0112] In the non-contact transfer step or the contact transfer step, all of the semiconductor elements formed on the holding substrate may be irradiated with an energy beam (laser) to transfer the semiconductor elements all at once. In addition, in the above non-contact transfer step or contact transfer step (iii), the destination substrates 1A and 1B may be moved instead of the holding substrates (23B and 23D) or together with the holding substrate (23B or 23D).

[0113] Furthermore, in place of the original substrates (2A, 2B, 2C, and 2D) in the non-contact transfer step or contact transfer step, or together with the original substrates (2A, 2B, 2C, and 2D), an element formation substrate can be used. For example, the element formation substrate may be a substrate in which a laminate having various layers such as a conductive layer is formed on a sapphire substrate, and a semiconductor crystal is grown on the laminate to form a light-emitting diode. When a laser is irradiated onto the crystal through the sapphire substrate, the surface of the layer at the interface with the sapphire substrate is decomposed, thereby isolating the light-emitting diode.

[0114] <(3) Joining process> In the joining step of electrically joining the element to the wiring board, the scavenging composition and the scavenging sheet of the present invention are softened or melted by applying heat and / or pressure. The scavenging composition and the scavenging sheet of the present invention between the element and the wiring board are softened or melted, and the element and the wiring board are electrically joined. The temperature in the joining step is selected depending on the properties of the resin and solder, and is, for example, 150° C. or 160° C., and heating may be performed in multiple stages. The maximum temperature in the bonding step is selected depending on the heat resistance of the semiconductor element, and is preferably 260° C. or less, more preferably 240° C. or less, and even more preferably 230° C. or less, for example.

[0115] <(4) Cleaning process> The scavenging composition and scavenging sheet of the present invention remain after the bonding process, and therefore the residue is removed by washing. For washing, only deionized water (ultrapure water, ion-exchanged water, distilled water, etc.) may be used, or a mixture of water and a water-soluble organic solvent may be used, but from the viewpoint of low environmental impact and easy availability, only deionized water is preferred. Hereinafter, deionized water and a mixture of water and a water-soluble organic solvent are also referred to as "water, etc." The water, etc. may contain an additive that hydrolyzes the water-soluble adhesive. Examples of the additive include hydrolases such as amylase, glucoamylase, pullanase, cellulase, protease, etc. When using such hydrolases, washing is preferably performed in the optimum pH and temperature range for expressing high enzymatic activity, and depending on the enzyme, it is preferable to add Ca. 2+ The enzyme activity can be further increased by adding additives such as the above. Examples of the water-soluble organic solvent include alcohols and ketones, and alcohols are preferred. When using a water-soluble organic solvent, it may be used alone or in combination of two or more. Examples of alcohols include methanol, ethanol, n-propanol, n-butanol, and examples of ketones include acetone and methyl ethyl ketone. A mixture of water with ions removed and a water-soluble organic solvent may also be used, and the mixing ratio is not particularly limited, but from the viewpoint of reducing environmental load, it is preferable that the ratio of the water-soluble organic solvent is low. A surfactant may be added as an additive to the water or the like in order to improve the penetration of the water or the like into narrow gaps. Other additives for improving the cleaning properties may also be added.

[0116] In the washing step, the temperature of the water used is selected depending on the solubility of the components (A) and (B). For example, the temperature of the water used in the washing step is preferably 10° C. or higher, more preferably 20° C. or higher, and even more preferably 30° C. or higher. A temperature of 10° C. or higher is preferable since there is a tendency for there to be no or little residue after washing. The temperature of the water used in washing is preferably 80° C. or lower, more preferably 70° C. or lower, and even more preferably 60° C. or lower. A temperature of 80° C. or lower is preferable because it consumes less energy and places less of a burden on the environment. Furthermore, when using hydrolytic enzymes, since each enzyme has an optimum temperature range at which it is highly active, washing is preferably carried out at said temperature range.

[0117] <(5) Drying process> The drying process for the wiring board may be a method of dehydrating by centrifugal force (spin dryer) or a method of washing with a highly evaporative, water-miscible organic solvent (such as isopropanol) and then drying. The drying temperature can be appropriately determined based on the boiling point of the solvent, etc. EXAMPLES

[0118] The present invention will be described in detail below with reference to examples, but the technical scope of the present invention is not limited to these examples.

[0119] The measurement and evaluation methods used in the present invention are as follows. [1]Measurement method (1) Calculation of the composition of the capture sheet The moisture content of the acquiring sheets in Tables 3 and 4 was measured by the Karl Fischer method. The compositions were calculated assuming that the water-soluble adhesive (A) and the water-soluble plasticizer (B) are not removed from the system by evaporation or the like during the drying process of the acquiring sheet production, and that all solvents other than water are removed from the system. (2) Viscosity measurement The viscosity of the samples was measured at 25° C. using a rotational viscometer (TVE-25H type viscometer, manufactured by Toki Sangyo Co., Ltd.) at the following rotation speeds: 1 rpm (polyglycerin), 50 rpm (glycerin, PEG600, PPG3000), and 100 rpm (diethylene glycol, ethylene glycol, propylene glycol, PEG400, diethylene glycol monomethyl ether).

[0120] [2] Evaluation method (1) Method for evaluating adhesive strength A glass plate (As One, product name: slide glass, thickness 1.0-1.2 mm, weight 5 g) and a water-soluble adhesive sheet for capturing parts (thickness 5 μm) were pressed together using a roller at room temperature (25°C), and then the polyethylene terephthalate film was peeled off. The bottom of a cylindrical glass tube with a diameter of 10 mm was pressed against the center of the glass plate with the capturing sheet attached, and the glass plate was lifted up by hand. The time until the bottom of the glass tube and the capturing sheet were peeled off and the glass plate fell was measured. ○: Did not fall for more than 41 seconds. △: Fall within 21 to 40 seconds. ×: Falls within 20 seconds.

[0121] (2) Method for evaluating tackiness Using a rolling ball device with a slope with an inclination angle of 10° and a horizontal surface continuing below the slope, a capture sheet (thickness 5 μm) was attached to the horizontal surface, and a test ball (made of alumina, weight 0.1 g, diameter 4 mm) was rolled from a position above the slope (height 9 mm) and the distance until the test ball came to a stop was measured. ○: Stopped within 9 mm. △: Stopped within 10 to 20 mm. ×: Did not stop within 20 mm.

[0122] The above adhesive strength and tackiness are both intended to evaluate the capturing ability of the water-soluble adhesive sheet for capturing components.

[0123] (3) Evaluation method for ease of application and removal A glass plate (AS ONE, product name: slide glass, thickness 1.0-1.2 mm, weight 5 g) and a water-soluble adhesive sheet for capturing parts (thickness 5 μm) were pressed together using a roller at room temperature (25°C), and then the release film (polyethylene terephthalate film) was peeled off. At this time, it was visually confirmed whether the capturing sheet remained on the release film and whether stringiness or tearing occurred. ○: No stringiness or tearing occurred. △: A small amount of stringiness or tearing occurred. ×: Multiple instances of stringiness or separation occurred, or application was not possible.

[0124] Tables 1 and 2 show the components and ratios of the raw materials (water-soluble adhesive compositions for capturing parts) used in the production of sheets in the examples and comparative examples. Tables 3 and 4 show the ratios based on the masses of the components of the sheets (water-soluble adhesive sheets for capturing parts) produced using the raw materials (water-soluble adhesive compositions for capturing parts) and the evaluation results.

[0125] [Example 1] (Manufacturing of Capture Sheets) 50 parts by mass of polyvinylpyrrolidone (K-30, Daiichi Kogyo Seiyaku Co., Ltd.) and 35 parts by mass of polyethylene glycol (PEG#400, NOF Corporation) were dissolved in 350 parts by mass of ion-exchanged water to obtain a polyvinylpyrrolidone solution. A polyvinylpyrrolidone solution was applied to a release-treated polyethylene terephthalate film (manufactured by Lintec Corporation, 6502) using an applicator. A capturing sheet having a thickness of 5 μm was obtained by drying at 100° C. In the following examples and comparative examples, the drying temperature is 100° C. when the solvent is ion-exchanged water or ethanol, and 120° C. when the solvent is 1-butanol.

[0126] [Example 2] (Manufacturing of Capture Sheets) A capturing sheet was obtained in the same manner, except that a polyvinylpyrrolidone solution prepared by dissolving 50 parts by weight of polyvinylpyrrolidone (Dai-ichi Kogyo Seiyaku Co., Ltd., K-50) and 45 parts by weight of diethylene glycol in 350 parts by weight of ethanol was used instead of the polyvinylpyrrolidone solution in Example 1.

[0127] [Example 3] (Manufacturing of Capture Sheets) A capturing sheet was obtained in the same manner, except that a polyvinylpyrrolidone solution prepared by dissolving 50 parts by weight of polyvinylpyrrolidone (K-85N, Nippon Shokubai Co., Ltd.) and 60 parts by weight of ethylene glycol in 350 parts by weight of 1-butanol was used instead of the polyvinylpyrrolidone solution in Example 1.

[0128] [Example 4] (Manufacturing of Capture Sheets) A capturing sheet was obtained in the same manner, except that a polyvinylpyrrolidone solution prepared by dissolving 50 parts by weight of polyvinylpyrrolidone (K-85N, manufactured by Nippon Shokubai Co., Ltd.) and 70 parts by weight of polyethylene glycol (PEG#400, manufactured by NOF Corporation) in 350 parts by weight of ethanol was used instead of the polyvinylpyrrolidone solution in Example 1.

[0129] [Example 5] (Manufacturing of Capture Sheets) A capturing sheet was obtained in the same manner, except that a polyvinylpyrrolidone solution prepared by dissolving 50 parts by weight of polyvinylpyrrolidone (K-85N, Nippon Shokubai Co., Ltd.) and 80 parts by weight of polyethylene glycol (PEG#600, Fujifilm Wako Pure Chemical Industries, Ltd.) in 350 parts by weight of 1-butanol was used instead of the polyvinylpyrrolidone solution in Example 1.

[0130] [Example 6] (Manufacturing of Capture Sheets) A capturing sheet was obtained in the same manner, except that a polyvinylpyrrolidone solution prepared by dissolving 50 parts by weight of polyvinylpyrrolidone (K-85N, Nippon Shokubai Co., Ltd.) and 90 parts by weight of polypropylene glycol (PPG#3000, Fujifilm Wako Pure Chemical Industries, Ltd.) in 350 parts by weight of 1-butanol was used instead of the polyvinylpyrrolidone solution in Example 1.

[0131] [Example 7] (Manufacturing of Capture Sheets) A capturing sheet was obtained in the same manner, except that a polyvinylpyrrolidone solution prepared by dissolving 50 parts by weight of polyvinylpyrrolidone (K-85N, Nippon Shokubai Co., Ltd.) and 110 parts by weight of propylene glycol in 350 parts by weight of 1-butanol was used instead of the polyvinylpyrrolidone solution in Example 1.

[0132] [Example 8] (Manufacturing of Capture Sheets) A capturing sheet was obtained in the same manner, except that a polyvinylpyrrolidone solution prepared by dissolving 50 parts by weight of polyvinylpyrrolidone (K-90N, Nippon Shokubai Co., Ltd.) and 130 parts by weight of polyglycerin (PLG 20PW, Daicel Corporation) in 350 parts by weight of ethanol was used instead of the polyvinylpyrrolidone solution in Example 1.

[0133] [Example 9] (Manufacturing of Capture Sheets) A capturing sheet was obtained in the same manner, except that a polyvinylpyrrolidone solution prepared by dissolving 50 parts by weight of polyvinylpyrrolidone (K-90N, Nippon Shokubai Co., Ltd.) and 140 parts by weight of polyglycerin (PLG 20PW, Daicel Corporation) in 350 parts by weight of ethanol was used instead of the polyvinylpyrrolidone solution in Example 1.

[0134] [Example 10] (Manufacturing of Capture Sheets) A capturing sheet was obtained in the same manner, except that a polyvinyl alcohol solution prepared by dissolving 50 parts by weight of polyvinyl alcohol (manufactured by Nippon Synthetic Chemical Industry Co., Ltd., GOHSENOL (registered trademark) GR-14) and 40 parts by weight of diethylene glycol monomethyl ether in 350 parts by weight of ion-exchanged water was used instead of the polyvinylpyrrolidone solution in Example 1.

[0135] [Example 11] (Manufacturing of Capture Sheets) A capturing sheet was obtained in the same manner, except that a polyacrylic acid solution in which 50 parts by weight of polyacrylic acid (AS-58, manufactured by Nippon Shokubai Co., Ltd.) and 100 parts by weight of glycerin were dissolved in 350 parts by weight of ion-exchanged water was used instead of the polyvinylpyrrolidone solution in Example 1.

[0136] [Example 12] (Manufacturing of Capture Sheets) A capture sheet was obtained in the same manner, except that a pullulan solution prepared by dissolving 50 parts by weight of pullulan (manufactured by Hayashibara Co., Ltd.), 80 parts by weight of polyethylene glycol (Fujifilm Wako Pure Chemical Industries, Ltd., PEG#600), and 20 parts by weight of glycerin in 350 parts by weight of ethanol was used instead of the polyvinylpyrrolidone solution in Example 1.

[0137] [Example 13] (Manufacturing of Capture Sheets) A capturing sheet was obtained in the same manner, except that instead of the polyvinylpyrrolidone solution in Example 1, a mixed solution was used in which 30 parts by weight of polyvinylpyrrolidone (K-85N, Nippon Shokubai Co., Ltd.), 20 parts by weight of polyvinyl alcohol (GOHSENOL (registered trademark) GR-14, manufactured by Nippon Synthetic Chemical Industry Co., Ltd.), and 90 parts by weight of glycerin were dissolved in 100 parts by weight of ion-exchanged water and 250 parts by weight of 1-butanol.

[0138] [Comparative Example 1] A comparative sheet was obtained in the same manner, except that a polyvinylpyrrolidone solution prepared by dissolving 50 parts by weight of polyvinylpyrrolidone (K-30, Daiichi Kogyo Seiyaku Co., Ltd.) and 25 parts by weight of polyethylene glycol (PEG#400, NOF Corporation) in 350 parts by weight of ethanol was used instead of the polyvinylpyrrolidone solution in Example 1.

[0139] [Comparative Example 2] A comparative sheet was obtained in the same manner, except that a polyvinylpyrrolidone solution prepared by dissolving 50 parts by weight of polyvinylpyrrolidone (K-90N, Nippon Shokubai Co., Ltd.) and 160 parts by weight of polyglycerin in 350 parts by weight of ethanol was used instead of the polyvinylpyrrolidone solution in Example 1.

[0140] The weight average molecular weight Mw of the water-soluble adhesive, which is component (A), used in the examples and comparative examples is as follows. Polyvinylpyrrolidone K-30 45,000, K-50 250,000, K-85N 340,000, K-90N 360,000 Polyvinyl alcohol (GR-14) 29,000 Polyacrylic acid (AS-58) 800,000 Pullulan 200,000

[0141] [Table 1] PEG: Polyethylene glycol PPG: Polypropylene glycol

[0142] [Table 2]

[0143] [Table 3]

[0144] [Table 4]

[0145] Comparing each of the Examples (Examples 1 to 13) with Comparative Example 1, the evaluation results of tackiness show that when the ratio ((B) / (A)) of the content of the water-soluble plasticizer (B) to the content of the water-soluble adhesive (A) is 0.5 or less and the proportion of the solid component (A) is higher than a predetermined value, the tackiness is small and the momentum of the test ball cannot be stopped. In other words, since the sheet characteristics are closer to elasticity due to the small tackiness, Comparative Example 1 has a low ability to receive a colliding part, while each of the Examples shows sufficient shock absorption.

[0146] In addition, when comparing each Example (Examples 1 to 13) with Comparative Example 2, the evaluation results of adhesive strength and handleability show that the ratio of the content of the water-soluble plasticizer (B) to the content of the water-soluble adhesive (A) ((B) / (A)) is greater than 3.0, and the ratio of the liquid component (B) is higher than a predetermined value, causing the sheet to stretch. As a result, in Comparative Example 2, the adhesive strength and handleability of the sheet are reduced, making it difficult to use industrially, while each Example shows sufficient adhesive strength and good handleability. [Industrial Applicability]

[0147] The water-soluble adhesive composition for capturing components and the water-soluble adhesive sheet for capturing components of the present invention can be suitably used as a composition for capturing components and a sheet for capturing components. In particular, they are suitably used as members for disposing semiconductor elements on a substrate in the manufacture of electronic components. Furthermore, the method for manufacturing electronic components of the present invention makes it easy to capture components (such as semiconductor elements) at desired positions on a substrate, and is suitably used as a manufacturing method that enables highly accurate and efficient manufacturing. [Explanation of symbols]

[0148] 1A, 1B··· Destination substrate, 11A, 11B··· Water-soluble adhesive sheet for capturing components, 12A, 12B··· Wiring substrate, 2A, 2B, 2C, 2D··· Source substrate, 21A, 21B, 21C, 21D··· Semiconductor element, 22A, 22B, 22C, 22D··· Adhesive layer, 23A, 23B, 23C, 23D··· Holding substrate, 3··· Energy rays

Claims

1. A water-soluble adhesive composition for component capture, which comprises (A) a water-soluble adhesive and (B) a water-soluble plasticizer (excluding the same substances and solvents as those in the water-soluble adhesive (A)), and which receives and captures an electronic component separated from an original substrate on a destination substrate, comprising: The weight average molecular weight of the water-soluble adhesive (A) is 5.0×10 ４ That's it, 1.0 x 10 ６ is as follows: The water-soluble plasticizer (B) is liquid at room temperature (25° C.), A water-soluble adhesive composition for capturing parts, characterized in that the ratio ((B) / (A)) of the content of the water-soluble plasticizer (B) to the content of the water-soluble adhesive (A) is greater than 0.5 and is not greater than 3.

0.

2. A water-soluble adhesive composition for component capture, comprising (A) a water-soluble adhesive and (B) a water-soluble plasticizer (excluding the same substances and solvents as the water-soluble adhesive (A)), which receives and captures an electronic component separated from an original substrate on a destination substrate, The weight average molecular weight of the water-soluble pressure-sensitive adhesive (A) is 1.0×10 4 or more and 1.0×10 6 or less, The water-soluble plasticizer (B) is liquid at room temperature (25° C.), A water-soluble adhesive composition for capturing parts, characterized in that the ratio ((B) / (A)) of the content of the water-soluble plasticizer (B) to the content of the water-soluble adhesive (A) is 0.7 or more and 3.0 or less.

3. 3. The water-soluble adhesive composition for capturing parts according to claim 1, wherein the water-soluble adhesive (A) comprises at least one water-soluble adhesive selected from the group consisting of vinyl alcohol polymers, vinylpyrrolidone polymers, acrylic polymers, and sugars.

4. 3. The water-soluble adhesive composition for capturing parts according to claim 1 or 2, wherein the water-soluble plasticizer (B) is a monohydric or polyhydric alcohol that is liquid at room temperature (25° C.).

5. 3. The water-soluble adhesive composition for capturing parts according to claim 1, wherein the boiling point of the water-soluble plasticizer (B) is 120° C. or higher.

6. 3. The water-soluble adhesive composition for capturing parts according to claim 1, wherein the water-soluble plasticizer (B) contains at least one selected from the group consisting of glycerin, diglycerin, polyethylene glycol, ethylene glycol, propylene glycol, and polypropylene glycol.

7. The water-soluble adhesive composition for capturing components according to claim 1 or 2, characterized in that the solder and the substrate are removed from the components.

8. 3. A water-soluble adhesive sheet for capturing parts, comprising a layer formed in a sheet shape from the water-soluble adhesive composition for capturing parts according to claim 1 or 2.

9. A method for producing electronic components, comprising the step of capturing components by using the water-soluble adhesive composition for capturing components according to claim 1 or 2.

10. A method for manufacturing electronic components, comprising the step of capturing components by using the water-soluble adhesive sheet for capturing components according to claim 8.

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