Alkylphosphinate composition, its preparation method and application

Abstract

The present invention provides an alkyl phosphinate composition containing 99.5-99.9999wt% alkyl phosphinate and 0.0001-0.5wt% long-chain phosphate having 16-24 carbon atoms, with a particle size D95 of less than 20 microns. The alkyl phosphinate powder composition provided by the present invention can avoid the occurrence of aggregation phenomenon during the use of ultrafine powder flame retardant, improve the dispersion effect of ultrafine alkyl phosphinate powder in epoxy resin and polyurethane, and avoid the occurrence of granular white spots when used in printed circuit boards and film materials. In addition, the composition provided by the present invention can meet the requirements for processing and use of alkyl phosphinate flame retardant without reducing the flame retardant efficiency of the alkyl phosphinate flame retardant. In addition, the present invention provides a method for producing an alkyl phosphinate composition and its application.

Description

cross reference

[0001] This application claims priority to a Chinese patent application filed with the China Patent Office on May 10, 2022, application number 202210503927.1, entitled "Alkyl phosphinic acid salt composition and its preparation method and application," the entire contents of which are incorporated herein by reference. [Technical field]

[0002] The present invention relates to the technical field of flame retardancy, in particular to an alkyl phosphinate composition and its preparation method and application, more particularly to a highly dispersible ultrafine alkyl phosphinate composition and its preparation method and application. [Background technology]

[0003] Flame retardants are commonly used auxiliary agents in industries such as electronic potting adhesives and printed circuit boards, and play an important role in the fire safety of electronic and electrical components. In recent years, electronic products have become smaller, lighter, and more functional, and fillers and flame retardants used in potting adhesives and printed circuit boards are required to be ultra-fine and have high heat resistance.

[0004] Alkyl phosphinate is a new halogen-free, environmentally friendly flame retardant that has recently appeared. It has a high phosphorus content and high flame retardant efficiency, and even a small amount of alkyl phosphinate can provide excellent flame retardant effect. It has good heat resistance and stability, and its thermal decomposition temperature exceeds 400℃, making it suitable for processing materials such as nylon, high-temperature nylon, and polyester. In addition, the molecular structure of alkyl phosphinate contains alkyl, which has good compatibility with organic resins. When added, it does not affect the mechanical and electrical properties of the resin, so it is increasingly used in engineering plastics with high processing temperatures, high shear strength, and high CTI value.

[0005] In recent years, with the development of electronics and electrical industries, alkyl phosphinate has been used in electronic materials such as printed circuit boards, electronic potting adhesives, and polyester films, and has been manufactured into corresponding flame retardant products with good flame retardant effect. The alkyl phosphinate used in the above fields usually needs to be further pulverized into finer particle size (D95<20 microns) and processed into finer particle size (D95<200 microns) before use, in order to obtain a finer particle size (D95<200 microns) and a suitable particle size distribution range. Specifically, alkyl phosphinate is mixed with epoxy resin, polyurethane resin, acrylic resin, etc., and the mixture is applied to the surface of polyimide, polyester, etc. films, and then baked, heat pressed, or bonded to be used in the process of manufacturing corresponding products and parts. However, during actual use, the following problems have been found. As the particle size of alkyl phosphinate becomes finer, the alkyl phosphinate after pulverization is more likely to aggregate, and when it is mixed with epoxy resin, polyurethane resin, acrylic resin, etc. and applied to the surface of printed circuit boards or polyester film materials, granular white spots may occur on the surface of printed circuit boards or polyester film materials. During the subsequent hot pressing and bonding processes, abnormalities such as swelling and spots may occur on the surface of the printed circuit board or film material, which will adversely affect the normal use of the printed circuit board or polyester film material, reduce the production efficiency of the factory, and cause a large amount of non-standard products.

[0006] Therefore, in order to prevent secondary aggregation of the alkyl phosphinate powder after grinding and improve the dispersibility in epoxy resin, polyurethane resin, and acrylic resin, it is considered very important to modify the ultrafine alkyl phosphinate powder. The modified ultrafine alkyl phosphinate powder not only improves the quality of itself, but also greatly expands the application to electronic products such as printed circuit boards and polyester films.

[0007] In recent years, researchers have been studying the dispersibility of ultrafine powders by using the method of surface modification, that is, adding silicone coupling agent or long-chain fatty acid metal salt dispersant during the production process or post-treatment of ultrafine powders to improve the dispersibility of ultrafine powders.How to make ultrafine alkyl phosphinate powders better disperse has become the focus of research in this field. Summary of the Invention

[0008] The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an alkylphosphinate composition having good dispersibility and flame retardant effect, and a production method and application thereof.

[0009] The present invention provides an alkylphosphinate composition comprising 99.5-99.9999 wt% alkylphosphinate and 0.0001-0.5 wt% long chain phosphate having 16-24 carbon atoms, the composition having a particle size D95 of less than 20 microns.

[0010] The long chain phosphate salt is preferably selected from the group consisting of sodium long chain phosphate salts, potassium long chain phosphate salts, and combinations thereof.

[0011] The long-chain phosphate is preferably one or more compounds selected from the compounds represented by the structures of the following formulae I to III.

[0012] [ka]

[0013] In formula I, R 1 and R 2 is independently selected from the group consisting of H, a C8-C16 alkyl group, and an aryl group; M is sodium or potassium; and x is 1 or 2.

[0014] [ka]

[0015] In formula II, R 3 and R 4 is independently selected from the group consisting of H, a C8-C16 alkyl group, and an aryl group; M is sodium or potassium; and y is 1 or 2.

[0016] [ka]

[0017] In formula III, R 5 and R 6 is independently selected from the group consisting of C7 to C16 alkyl groups and aryl groups, M is sodium or potassium, and z is 1.

[0018] The compounds represented by the structure of formula I include monohexadecyloxyphosphate disodium (potassium), monooctadecyloxyphosphate disodium (potassium), ethoxyhexadecyloxyphosphate sodium (potassium), propoxyhexadecyloxyphosphate sodium (potassium), n-butoxyhexadecyloxyphosphate sodium (potassium), isobutoxyhexadecyloxyphosphate sodium (potassium), sec-butoxyhexadecyloxyphosphate sodium (potassium), t-butoxyhexadecyloxyphosphate sodium (potassium), hexyloxyhexadecyloxyphosphate sodium (potassium), octyloxyhexadecyloxyphosphate sodium (potassium), n-butoxydodecyloxyphosphate sodium (potassium), isobutoxydodecyloxyphosphate sodium (potassium), sec-butoxyhexadecyloxyphosphate sodium (potassium), Preferably, the phosphate phosphate is selected from the group consisting of sodium t-butoxydodecyloxyphosphate, sodium t-butoxydodecyloxyphosphate, sodium hexyloxydodecyloxyphosphate, sodium n-octyloxydodecyloxyphosphate, sodium isooctyloxydodecyloxyphosphate, sodium diisooctyloxyphosphate, sodium di(dodecyloxy)phosphate, sodium di-n-octyloxyphosphate, sodium phenoxydodecyloxyphosphate, sodium phenoxyhexadecyloxyphosphate, sodium o-dimethylphenoxydodecyloxyphosphate, sodium o-dimethylphenoxyhexadecyloxyphosphate, and combinations thereof.

[0019] The compounds represented by the structure of formula II include disodium monohexadecyl phosphate (potassium), disodium monooctadecyl phosphate (potassium), sodium ethylhexadecyloxyphosphate (potassium), sodium propylhexadecyloxyphosphate (potassium), sodium n-butylhexadecyloxyphosphate (potassium), sodium isobutylhexadecyloxyphosphate (potassium), sodium s-butylhexadecyloxyphosphate (potassium), sodium t-butylhexadecyloxyphosphate (potassium), sodium hexylhexadecyloxyphosphate (potassium), sodium ethyloctadecyloxyphosphate (potassium), sodium propyloctadecyloxyphosphate (potassium), sodium n-butylocta ...hexylhexadecyloxyphosphate (potassium), sodium ethyloctadecyloxyphosphate (potassium), sodium propyloctadecyloxyphosphate (potassium), sodium n-butyloctadecyloxyphosphate (potassium), sodium isobutylhexadecyloxyphosphate (potassium), sodium hexylhexadecyloxyphosphate (potassium), sodium ethyloctadecyloxyphosphate (potass Preferably, the phosphate phosphate is selected from the group consisting of sodium butyl octadecyloxyphosphate (potassium), sodium s-butyl octadecyloxyphosphate (potassium), sodium t-butyl hexadecyloxyphosphate (potassium), sodium hexyl octadecyloxyphosphate (potassium), sodium n-octyl n-octyloxyphosphate (potassium), sodium isooctyl isooctyloxyphosphate (potassium), sodium phenyl dodecyloxyphosphate (potassium), sodium phenyl hexadecyloxyphosphate (potassium), sodium phenyl octadecyloxyphosphate (potassium), sodium o-dimethylphenyl dodecyloxyphosphate (potassium), sodium o-dimethylphenyl hexadecyloxyphosphate (potassium), and combinations thereof.

[0020] The compounds represented by the structure of formula III include sodium ethyl octadecyl phosphate (potassium), sodium propyl octadecyl phosphate (potassium), sodium n-butyl octadecyl phosphate (potassium), sodium isobutyl octadecyl phosphate (potassium), sodium s-butyl octadecyl phosphate (potassium), sodium t-butyl octadecyl phosphate (potassium), sodium hexyl octadecyl phosphate (potassium), sodium ethyl hexadecyl phosphate (potassium), sodium n-butyl hexadecyl phosphate (potassium), sodium isobutyl hexadecyl phosphate (potassium), sodium s-butyl hexadecyl phosphate (potassium), sodium t-butyl hexadecyl phosphate (potassium), sodium hexyl hexadecyl phosphate (potassium), sodium octyl hexadecyl phosphate (potassium), sodium n-butyl do ... Preferably, the phosphate salt is selected from the group consisting of sodium dodecyl phosphate (potassium), sodium isobutyldodecyl phosphate (potassium), sodium s-butyldodecyl phosphate (potassium), sodium t-butyldodecyl phosphate (potassium), sodium hexyldodecyl phosphate (potassium), sodium n-octyldodecyl phosphate (potassium), sodium isooctyldodecyl phosphate (potassium), sodium di(dodecyl)phosphate (potassium), sodium diisooctyl phosphate (potassium), sodium di-n-octyl phosphate (potassium), sodium didecyl phosphate (potassium), sodium phenyldodecyl phosphate (potassium), sodium phenylhexadecyl phosphate (potassium), sodium o-dimethylphenyldodecyl phosphate (potassium), sodium o-dimethylphenylhexadecyl phosphate (potassium), and combinations thereof.

[0021] Preferably, the content of the alkyl phosphinate is 99.8 to 99.9999 wt %, and the content of the long-chain phosphate is 0.0001 to 0.2 wt %.

[0022] The alkyl phosphinate preferably has the structure of Formula IV:

[0023] [ka]

[0024] In formula IV, R 1 and R 2 are independently selected from alkyl groups; Y is selected from the group consisting of aluminum, calcium, and magnesium; x is an integer of 2 or 3.

[0025] The present invention provides a method for producing an alkylphosphinate composition as described in the above technical solution, comprising: mixing the long chain phosphate with the alkyl phosphinate after filtering and washing in the preparation of the alkyl phosphinate is completed; or A process is provided which includes the step of combining a long chain phosphate with an alkyl phosphinate after metathesis in the preparation of the alkyl phosphinate is complete.

[0026] The present invention provides a material comprising the alkyl phosphinic acid salt composition described above, selected from the group consisting of printed circuit boards, electronic potting adhesives, polyester films, and combinations thereof.

[0027] In the present invention, unlike the surface modification of conventional flame retardants or inorganic fillers, the modification of ultrafine alkyl phosphinate powder takes into consideration both the properties of alkyl phosphinate itself and the working conditions during processing and use.Since alkyl phosphinate has a relatively high thermal decomposition temperature (over 400℃), and the processing temperature when used in engineering plastics such as high-temperature nylon or nylon is usually over 300℃, it is required to add a dispersant to lower the thermal decomposition temperature of alkyl phosphinate and to avoid the appearance, mechanical properties, and electrical properties of flame retardant substrate being changed due to the decomposition, precipitation, or deposition of alkyl phosphinate during processing and use.In addition, the addition of a dispersant is not allowed to affect the normal use of alkyl phosphinate, for example, when added to epoxy resin, it is not allowed to affect the curing time or glass transition temperature of epoxy resin, and the addition of a dispersant is not allowed to reduce the flame retardant efficiency of alkyl phosphinate.

[0028] The present invention has been made by comprehensively and systematically studying the dispersibility of ultrafine alkylphosphinate salts, taking into consideration the type of dispersant used for surface modification of alkylphosphinate salt powder, the amount of dispersant added, the addition method and mixing method, and the effects of the dispersant on the use and processing of alkylphosphinate salts and the performance of downstream products.

[0029] In response to the shortcomings of the conventional ultrafine alkyl phosphinate powder, the present invention provides an ultrafine alkyl phosphinate powder composition and the preparation method thereof.The alkyl phosphinate composition provided by the present invention can avoid the secondary aggregation of ultrafine powder flame retardant, can significantly improve the dispersion effect of ultrafine alkyl phosphinate powder in epoxy resin or polyurethane, can avoid the occurrence of granular white dots when used in printed circuit boards or film materials, and can meet the requirements of processing and use of alkyl phosphinate flame retardant without reducing the flame retardant efficiency of alkyl phosphinate flame retardant. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0030] The following describes the technology in the embodiments of the present invention more clearly and in detail, but it is clear that the described embodiments are only a part of the embodiments of the present invention, and are not all of the embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative efforts are included in the scope of protection of the present invention.

[0031] The present invention provides a highly dispersible alkyl phosphinate composition comprising an alkyl phosphinate and a long chain phosphate.

[0032] The present invention solves the dispersibility problems of ultrafine alkyl phosphinate salts used in the prior art, and has conducted intensive research into the problem that ultrafine alkyl phosphinate salt powders are prone to agglomeration in epoxy resins, polyurethane resins, and acrylic resins, causing white spots and swelling in products. It has been found that the dispersion problems of ultrafine alkyl phosphinate salts can be effectively solved by adding a small amount of C16-C24 long-chain phosphate to alkyl phosphinate salts and using an appropriate addition method.

[0033] The alkyl phosphinate salt of the present invention preferably has the structure of Formula IV.

[0034] [ka]

[0035] In formula IV, R 1 and R 2 are independently selected from alkyl groups; Y is selected from the group consisting of aluminum, calcium, and magnesium; x is an integer of 2 or 3.

[0036] In the present invention, the R 1 and R 2 are preferably independently selected from the group consisting of an ethyl group, a propyl group, and a butyl group, and more preferably are independently one selected from the group consisting of an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, and a t-butyl group. 1 and R 2 may be the same or different.

[0037] The alkyl phosphinate salt in the present invention is preferably aluminum diethyl phosphinate. Aluminum diethyl phosphinate is a halogen-free flame retardant, and is often used in engineering plastics such as glass fiber reinforced nylon, high temperature nylon, and polyester, and is sometimes used in electronic materials such as flexible printed circuit boards, electronic potting adhesives, and polyester films, and has a good flame retardant effect. However, the alkyl phosphinate flame retardants used in these fields need to have a finer particle size (D95 is less than 20 microns) and a suitable particle size distribution range, and the alkyl phosphinate flame retardants need to be further polished and crushed. As can be seen from actual use, crushed alkyl phosphinate salts are prone to secondary aggregation, and when an adhesive made of epoxy resin or polyurethane resin mixed with alkyl phosphinate salts is applied to the surface of a circuit board or polyester film material, white spots may occur on the surface of the circuit board or polyester film material, and quality problems such as swelling and white spots may occur on the surface of a flexible circuit board or film material.

[0038] Through research, the present invention has discovered that by adding a small amount of C16-C24 long-chain phosphate as a modifier to ultrafine alkyl phosphinate powder, the secondary aggregation of ultrafine alkyl phosphinate powder can be reduced and the dispersion effect of alkyl phosphinate powder in epoxy resin, polyurethane resin, and acrylic resin can be improved. The reason is considered as follows. Alkyl phosphinate itself shows weak acidity (pH of its saturated aqueous solution at room temperature is about 4), while long-chain phosphate shows weak alkalinity, and both have good adsorption properties, so that the modifier can be adsorbed on the surface of the modified solid particles, while the long-chain phosphate has an amphoteric structure and can be adsorbed on the surface of the flame retardant powder, and the surface energy of the flame retardant powder is reduced. Therefore, it is possible to reduce the secondary aggregation of ultrafine alkyl phosphinate powder.

[0039] The alkyl phosphinate salt in the present invention preferably has a particle size D95 of less than 20 microns and a bulk density of preferably 100 to 350 kg / m 3 and more preferably 150 to 300 kg / m 3 It is.

[0040] The alkyl phosphinate in the present invention preferably further contains water generated during the production process of the alkyl phosphinate. The mass content of the water in the alkyl phosphinate is preferably 0.01 to 1.0%, more preferably 0.01 to 0.5%, and most preferably 0.05 to 0.4%. If the water content in the alkyl phosphinate in the present invention is too low, the production cost increases, but if it is too high, the effect of the alkyl phosphinate used in a thermosetting resin is affected.

[0041] The alkyl phosphinate salt in the present invention is not limited to a specific source, and can be obtained commercially, or can be prepared according to methods well known to those skilled in the art. For example, aluminum diethyl phosphinate can be prepared according to the method described in the following patent CN103951699B. The raw materials are ethylene and sodium hypophosphite, and an addition reaction is carried out in a solvent to produce sodium diethyl hypophosphite.

[0042] [ka]

[0043] Sodium diethyl hypophosphite undergoes a double decomposition reaction with aluminum sulfate or aluminum chloride in water to produce aluminum diethylphosphinate.

[0044] [ka]

[0045] The resulting aluminum diethylphosphinate is filtered and washed to remove excess sodium sulfate by-product to yield the product after drying.

[0046] The long-chain phosphate in the present invention contains phosphorus element, is non-flammable, and has high thermal stability due to its suitable molecular structure.The research of the present invention has found that adding a small amount of long-chain phosphate dispersant does not affect the flame retardant efficiency of alkyl phosphinate flame retardant, but rather makes the dispersion of flame retardant powder more uniform with the improvement of alkyl phosphinate dispersibility, and can improve the flame retardant performance of the circuit board and film material produced.

[0047] The long-chain phosphate in the present invention preferably has a carbon number of 16 to 24. The long-chain phosphate in the present invention is preferably selected from the group consisting of long-chain sodium phosphate, long-chain potassium phosphate, and combinations thereof.

[0048] The long-chain phosphate modifier in the present invention is a long-chain phosphate of C16 to C24. Research has revealed that when the carbon chain is short, the long-chain phosphate has high polarity, insufficient affinity to the surface of the alkylphosphinate, and little improvement in the dispersion effect is observed, and that the phosphate with a short carbon chain has low solubility in organic solvents such as ketones and esters, poor compatibility with epoxy resins and polyurethane resins, and is prone to precipitation during subsequent processing. On the other hand, long-chain phosphates with too long carbon chains have too low a thermal decomposition temperature, which may cause the long-chain phosphate to decompose during processing and use of printed circuit boards and polyester film materials, causing problems such as yellowing and smoking during the heat pressing and bonding process of printed circuit boards and polyester film materials, resulting in abnormal product quality. In addition, the thermal stability of long-chain phosphates gradually decreases as the length of the carbon chain in the molecule increases, so it is necessary to select an appropriate dispersant structure and an appropriate carbon chain length.

[0049] The long-chain phosphate in the present invention is one or more of the compounds represented by the structures of formulae I to III.

[0050] [ka]

[0051] R of formula I in the present invention 1 and R 2 is independently selected from the group consisting of H, a C8-C16 alkyl group, and an aryl group, and R 1 and R 2 is not an aryl group at the same time. The alkyl group may be a straight chain alkyl group or a branched chain alkyl group. The aryl group is preferably selected from the group consisting of phenyl, o-methylphenyl, m-methylphenyl, p-methylphenyl, and o-dimethylphenyl. 1 and R 2 The total number of carbon atoms is preferably 16 to 24. M is sodium or potassium. x is 1 or 2.

[0052] The compounds represented by the structure of formula I in the present invention include disodium monohexadecyloxyphosphate (potassium), disodium monooctadecyloxyphosphate (potassium), sodium ethoxyhexadecyloxyphosphate (potassium), sodium propoxyhexadecyloxyphosphate (potassium), sodium n-butoxyhexadecyloxyphosphate (potassium), sodium isobutoxyhexadecyloxyphosphate (potassium), sodium sec-butoxyhexadecyloxyphosphate (potassium), sodium t-butoxyhexadecyloxyphosphate (potassium), sodium hexyloxyhexadecyloxyphosphate (potassium), sodium octoxyhexadecyloxyphosphate (potassium), sodium n-butoxydodecyloxyphosphate (potassium), and sodium isobutoxydodecyloxyphosphate (potassium). ), sodium sec-butoxydodecyloxyphosphate (potassium), sodium t-butoxydodecyloxyphosphate (potassium), sodium hexyloxydodecyloxyphosphate (potassium), sodium n-octoxydodecyloxyphosphate (potassium), sodium isooctoxydodecyloxyphosphate (potassium), sodium diisooctoxyphosphate (potassium), sodium di(dodecyloxy)phosphate (potassium), sodium di-n-octoxyphosphate (potassium), sodium phenoxydodecyloxyphosphate (potassium), sodium phenoxyhexadecyloxyphosphate (potassium), sodium o-dimethylphenoxydodecyloxyphosphate (potassium), sodium o-dimethylphenoxyhexadecyloxyphosphate (potassium), and combinations thereof.

[0053] R of formula II in the present invention 3 and R 4 is independently selected from the group consisting of H, a C8-C16 alkyl group, and an aryl group, and R 3 and R 4is not an aryl group at the same time. The alkyl group may be a straight chain alkyl group or a branched chain alkyl group. The aryl group is preferably selected from the group consisting of phenyl, o-methylphenyl, m-methylphenyl, p-methylphenyl, and o-dimethylphenyl. 3 and R 4 The total number of carbon atoms is preferably 16 to 24. M is a sodium ion or a potassium ion. y is 1 or 2.

[0054] The compounds represented by the structure of formula II in the present invention include disodium monohexadecyl phosphate (potassium), disodium monooctadecyl phosphate (potassium), sodium ethylhexadecyloxyphosphate (potassium), sodium propylhexadecyloxyphosphate (potassium), sodium n-butylhexadecyloxyphosphate (potassium), sodium isobutylhexadecyloxyphosphate (potassium), sodium s-butylhexadecyloxyphosphate (potassium), sodium t-butylhexadecyloxyphosphate (potassium), sodium hexylhexadecyloxyphosphate (potassium), sodium ethyloctadecyloxyphosphate (potassium), sodium propyloctadecyloxyphosphate (potassium), sodium n-butyloctadecyloxyphosphate The phosphate phosphate salt is selected from the group consisting of sodium isobutyl octadecyl oxyphosphate (potassium), sodium s-butyl octadecyl oxyphosphate (potassium), sodium t-butyl hexadecyl oxyphosphate (potassium), sodium hexyl octadecyl oxyphosphate (potassium), sodium n-octyl n-octoxyphosphate (potassium), sodium isooctyl isooctyl oxyphosphate (potassium), sodium phenyl dodecyl oxyphosphate (potassium), sodium phenyl hexadecyl oxyphosphate (potassium), sodium phenyl octadecyl oxyphosphate (potassium), sodium o-dimethylphenyl dodecyl oxyphosphate (potassium), sodium o-dimethylphenyl hexadecyl oxyphosphate (potassium), and combinations thereof.

[0055] R of formula III in the present invention 5 and R 6 is independently selected from the group consisting of C7 to C16 alkyl groups and aryl groups, and R 5 and R 6 is not an aryl group at the same time. The alkyl group may be a straight chain alkyl group or a branched chain alkyl group. The aryl group is preferably selected from the group consisting of phenyl, o-methylphenyl, m-methylphenyl, p-methylphenyl, and o-dimethylphenyl. 5 and R 6 The total number of carbon atoms is preferably 16 to 24. M is a sodium ion or a potassium ion. z is an integer of 1.

[0056] The compounds represented by the structure of formula III in the present invention include sodium ethyl octadecyl phosphate (potassium), sodium propyl octadecyl phosphate (potassium), sodium n-butyl octadecyl phosphate (potassium), sodium isobutyl octadecyl phosphate (potassium), sodium s-butyl octadecyl phosphate (potassium), sodium t-butyl octadecyl phosphate (potassium), sodium hexyl octadecyl phosphate (potassium), sodium ethyl hexadecyl phosphate (potassium), sodium n-butyl hexadecyl phosphate (potassium), sodium isobutyl hexadecyl phosphate (potassium), sodium s-butyl hexadecyl phosphate (potassium), sodium t-butyl hexadecyl phosphate (potassium), sodium hexyl hexadecyl phosphate (potassium), sodium octyl hexadecyl phosphate (potassium), sodium n-butyl Preferably, the phosphate is selected from the group consisting of sodium dodecyl phosphate (potassium), sodium isobutyl dodecyl phosphate (potassium), sodium s-butyl dodecyl phosphate (potassium), sodium t-butyl dodecyl phosphate (potassium), sodium hexyldodecyl phosphate (potassium), sodium n-octyl dodecyl phosphate (potassium), sodium isooctyl dodecyl phosphate (potassium), sodium di(dodecyl)phosphate (potassium), sodium diisooctyl phosphate (potassium), sodium di-n-octyl phosphate (potassium), sodium didecyl phosphate (potassium), sodium phenyldodecyl phosphate (potassium), sodium phenylhexadecyl phosphate (potassium), sodium o-dimethylphenyl dodecyl phosphate (potassium), sodium o-dimethylphenyl hexadecyl phosphate (potassium), and combinations thereof.

[0057] The long-chain alkyl phosphate salt in the present invention is not particularly limited in terms of its source, and can be obtained as a commercial product, or can be prepared from a raw material having a corresponding structure according to a synthesis method well known to those skilled in the art.

[0058] In the alkyl phosphinate composition of the present invention, the mass content of the long-chain phosphate is preferably 0.0001 to 0.5%, more preferably 0.0001 to 0.4%, more preferably 0.0001 to 0.3%, and most preferably 0.0001 to 0.2%. In the present invention, the amount of the long-chain phosphate used must be increased as the particle size of the powder becomes finer, but the total amount is controlled to be within the range of 0.0001 to 0.5 wt%, preferably 0.0001 to 0.2 wt%. The amount of the C16 to C24 long-chain phosphate added as a modifier in the present invention is 0.0001 to 0.5 wt%. If the amount used is too low, the effect of improving the dispersibility of the alkyl phosphinate is not sufficient, and if the amount used is too high, the long-chain phosphate dispersant may precipitate, which may cause an increase in the hygroscopicity of the flame-retardant substrate and a decrease in mechanical properties. For example, when the amount of sodium di-n-octoxyphosphate added to the alkylphosphinate is 0.7%, the curing reaction time of the epoxy resin becomes longer, the glass transition temperature of the cured epoxy resin decreases, and the peel strength of the epoxy resin copper-clad board decreases.

[0059] The alkylphosphinate composition of the present invention has a particle size distribution in which the particle size D95 is less than 20 μm and a bulk density of preferably 100 to 350 kg / m 3 It is.

[0060] The present invention provides a method for preparing the alkylphosphinate composition, comprising the steps of mixing a long chain phosphate with an alkylphosphinate after filtration and washing in the preparation of the alkylphosphinate are completed, or mixing a long chain phosphate with an alkylphosphinate after metathesis in the preparation of the alkylphosphinate are completed.

[0061] The method for producing the alkylphosphinate composition of the present invention preferably includes a step of mixing the long-chain phosphate with the alkylphosphinate after filtration and washing in the production process of the alkylphosphinate are completed.

[0062] The C16-C24 long-chain phosphate as a modifier in the present invention can be added during the filtration and washing process of the alkyl phosphinate (aluminum diethylphosphinate), or can be added directly to the metathesis kettle after the metathesis of the alkyl phosphinate (aluminum diethylphosphinate) is completed, and is preferably added during the filtration and washing process of the alkyl phosphinate (aluminum diethylphosphinate). In the present invention, the C16-C24 long-chain phosphate as a modifier is preferably added during the filtration and washing process of the alkyl phosphinate, specifically, after the filtration and washing operation of the alkyl phosphinate is completed, a certain amount of wet long-chain phosphate aqueous solution is added to the alkyl phosphinate, left to stand, soaked, and then dried, thereby retaining the long-chain phosphate modified dispersant in the alkyl phosphinate. In the alkyl phosphinate composition obtained by the above-mentioned addition method, the content distribution of the long-chain phosphate is relatively uniform, which makes it possible to ensure the optimal use effect during subsequent grinding, processing, and use.

[0063] The method for producing the alkylphosphinate composition in the present invention more preferably includes the steps of filtering and washing the prepared alkylphosphinate slurry to obtain a wet alkylphosphinate, and mixing a solution of a long-chain phosphate with the wet alkylphosphinate, followed by keeping the mixture warm, allowing to stand, and drying to obtain an alkylphosphinate composition.

[0064] The process of filtering (vacuum filtration) and washing the alkylphosphinate in the present invention is a process for separating the alkylphosphinate from by-products such as water and sodium sulfate, and a conventional solid-liquid separation facility may be used.

[0065] The filtration in the present invention is preferably performed using a filter selected from a belt filter, a scraper filter, a flat plate filtration / washing integrated machine, a flat plate filtration / washing / drying integrated machine, a butterfly filter, a disk filter, and a plate and frame vacuum filtration. The washing is preferably performed by adding water. By filtering and washing, by-products such as sodium sulfate in the alkylphosphinate slurry are removed.

[0066] The long-chain phosphate in the present invention is preferably diluted with water to form a long-chain phosphate solution and then added. The long-chain phosphate solution in the present invention is preferably an aqueous solution of long-chain phosphate. The mass concentration of the long-chain phosphate solution is preferably 0.01-5.0%, more preferably 0.02-2.0%. When the concentration of the long-chain phosphate solution in the present invention is low, the effect of its dispersion use may be improved, but the time of the drying process may increase, the production efficiency may decrease, and the energy consumption may increase. When the concentration of the long-chain phosphate is high, the long-chain phosphate may precipitate during storage or addition, and the effect of using the long-chain phosphate cannot be guaranteed.

[0067] In the present invention, the temperature of the warming is preferably 70 to 100° C., more preferably 80 to 90° C., and most preferably 95° C., and the warming time is preferably 2 to 4 hours, and more preferably 3 hours. The drying is preferably vacuum drying, and the drying temperature is preferably 130 to 170° C., more preferably 140 to 160° C., and most preferably 150° C.

[0068] The alkylphosphinate composition after washing and drying in the present invention preferably has a particle size distribution with a particle size D50 of 10 to 150 μm and a bulk density of 300 to 1500 kg / m 3 It is preferable to set the density to 500 to 1200 kg / m 3 More preferably, it is 700 to 1000 kg / m 3 It is most preferable to set the above.

[0069] The production method of the present invention preferably further comprises, after the drying, a step of pulverizing and / or polishing the resulting dried product to obtain an alkylphosphinate composition having a desired particle size distribution.

[0070] The pulverization in the present invention is preferably carried out using an airflow pulverizer, and the gas pressure during the pulverization is preferably 0.4 to 0.8 MPa.

[0071] The alkyl phosphinate composition of the present invention has a particle size distribution in which the particle size D95 is less than 20 μm and a bulk density of 100 to 350 kg / m 3 It is preferable that:

[0072] The present invention provides a material comprising the alkyl phosphinate composition described above.

[0073] The alkyl phosphinate composition of the present invention has a particle size distribution in which the particle size D95 is less than 20 μm and a bulk density of 100 to 350 kg / m 3 It is preferable that:

[0074] The material in the present invention is selected from the group consisting of printed circuit boards, electronic potting adhesives, polyester films, and combinations thereof.

[0075] The alkyl phosphinate composition of the present invention can be used in printed circuit boards, electronic potting adhesives, and polyester films. The alkyl phosphinate composition can also be ground and then added to an organic resin (e.g., epoxy resin, polyurethane resin, or acrylic resin) to prepare a slurry, which can then be applied to the surface of a product to be flame retarded.

[0076] In the alkyl phosphinate composition provided by the present invention, the dispersibility of the ultrafine alkyl phosphinate is improved by adding a small amount of a C16-C24 long-chain phosphate dispersant to the alkyl phosphinate, and the problem that the ultrafine alkyl phosphinate powder is easily aggregated in epoxy resin, polyurethane resin, or acrylic resin, causing white spots or swelling in the product, is solved. The added dispersant in the present invention does not adversely affect the thermal stability of the alkyl phosphinate, and does not decompose during the processing and use of the alkyl phosphinate. In addition, the added dispersant does not reduce the flame retardant efficiency of the alkyl phosphinate, and has little effect on the use of the alkyl phosphinate in epoxy resin, polyurethane resin, or acrylic resin. EXAMPLES

[0077] The epoxy resin used in the following examples of the present invention was NPPN-438 provided by Nanya Electronic Materials Kunshan Co., Ltd. The PET film was 0.8×400×400 mm provided by Hangzhou Dahua Plastics Industry Co., Ltd. 3 The film was used. Sodium (potassium) dialkoxyphosphate was prepared with reference to the method disclosed in patent CN104109170. Sodium (potassium) alkylalkoxyphosphate was prepared with reference to the method disclosed in the literature (Synthesis of monooctyl octyl phosphate and study of the structural properties of the extracted lanthanide elements, "China Rare Earth Journal" 1985(3), 13-19). Other raw materials were commercially available products.

[0078] The gas pressure of the experimental airflow mill used for pulverization was set to 0.4-0.8 MPa.

[0079] Example 1 274.1g of sodium hypophosphite was dissolved in 1600g of water, and then the solution was transferred to a 3L pressure cooker, 3g of concentrated sulfuric acid and 36g of n-butanol were added, the temperature was raised to 95℃, ethylene was introduced, and the pressure in the reactor was maintained at 0.3MPa. Then, a 2% concentration sodium percarbonate solution was continuously injected using a peristaltic pump, and the reaction was terminated in about 2.5 hours. The reactor was depressurized and cooled to about 90℃, and 625.1g of a 46wt% concentration aluminum sulfate hydrate solution was added to the reactor within 60 minutes, and a white precipitate gradually precipitated. The mixture was filtered, washed with hot water, and suction filtered until there were no droplets in the funnel, to obtain a filter cake of aluminum diethylphosphinate.

[0080] 35.8 g of a 1.0 wt % aqueous solution of disodium monohexadecyl phosphate was added to the aluminum diethylphosphinate filter cake, and the filter cake was immersed for 3 hours. The temperature of the filter cake was kept at 78°C, and then the filter cake obtained by filtration was directly dried under vacuum at 150°C.

[0081] The dried product is added to the airflow mill, and the carrier gas pressure and the classifier speed are adjusted during milling to obtain a D95 of 14.6 μm and a bulk density of 260 kg / m 3 The resulting product was an ultrafine aluminum diethylphosphinate composition.

[0082] Example 2 A filter cake of aluminum diethylphosphinate was prepared according to the method of Example 1.

[0083] 139.0 g of an aqueous solution of sodium n-octyl n-octoxyphosphate with a concentration of 1.0 wt % was added to the aluminum diethylphosphinate filter cake, followed by immersion for 2 hours. The temperature of the filter cake was kept at 70°C, and the filter cake obtained by filtration was directly dried at 150°C under vacuum.

[0084] The dried product is added to the airflow mill, and the carrier gas pressure and the classifier speed are adjusted during milling to obtain a D95 of 4.8 μm and a bulk density of 201 kg / m 3The resulting product was an ultrafine aluminum diethylphosphinate composition.

[0085] Example 3 A filter cake of aluminum diethylphosphinate was prepared according to the method of Example 1.

[0086] 36.9 g of an aqueous solution of sodium diisooctyl phosphate with a concentration of 0.1 wt % was added to the aluminum diethylphosphinate filter cake, and the filter cake was immersed for 2.5 hours. The temperature of the filter cake was kept at 90°C, and then the filter cake obtained by filtration was directly dried at 150°C under vacuum.

[0087] The dried product is added to the airflow mill, and the carrier gas pressure and the classifier speed are adjusted during milling to obtain a D95 of 4.8μm and a bulk density of 208kg / m 3 The resulting product was an ultrafine aluminum diethylphosphinate composition.

[0088] Example 4 A filter cake of aluminum diethylphosphinate was prepared according to the method of Example 1.

[0089] 3.49 g of an aqueous solution of potassium di(dodecyloxy)phosphate with a concentration of 0.02 wt % was added to the aluminum diethylphosphinate filter cake, followed by immersion for 4 hours. The temperature of the filter cake was kept at 80°C, and the filter cake obtained by filtration was directly dried at 150°C under vacuum.

[0090] The dried product was added to the airflow mill, and the carrier gas pressure and the classifier speed were adjusted during milling to obtain a D95 of 18.9 μm and a bulk density of 291 kg / m 3 The resulting product was an ultrafine aluminum diethylphosphinate composition.

[0091] Example 5 A filter cake of aluminum diethylphosphinate was prepared according to the method of Example 1.

[0092] A mixed solution of 7.0 g of sodium phenoxydodecyloxyphosphate with a concentration of 0.5 wt % and 7.3 g of sodium di-n-octoxyphosphate with a concentration of 0.5 wt % was added to the aluminum diethylphosphinate filter cake, and the mixture was immersed for 2.5 hours. The temperature of the filter cake was kept at 100°C, and the filter cake obtained by filtration was directly dried at 150°C under vacuum.

[0093] The dried product is added to the airflow mill, and the carrier gas pressure and the classifier speed are adjusted during milling to obtain a D95 of 8.9 μm and a bulk density of 215 kg / m 3 The resulting product was an ultrafine aluminum diethylphosphinate composition.

[0094] Example 6 A filter cake of aluminum diethylphosphinate was prepared according to the method of Example 1.

[0095] 36.6 g of an aqueous solution of sodium di(isooctoxy)phosphate with a concentration of 0.01 wt % was added to the aluminum diethylphosphinate filter cake, followed by immersion for 3 hours. The temperature of the filter cake was kept at 80°C, and then the filter cake obtained by filtration was directly dried at 150°C under vacuum.

[0096] The dried product was added to the airflow mill, and the carrier gas pressure and the classifier rotation speed were adjusted during milling to obtain a D95 of 13.4 μm and a bulk density of 244 kg / m 3 The resulting product was an ultrafine aluminum diethylphosphinate composition.

[0097] Comparative Example 1 The same procedure as in Example 1 was used to prepare an ultrafine aluminum diethylphosphinate composition product having the same particle size distribution as in Example 1, except that the temperature of the filter cake was kept at 50°C and then filtered.

[0098] Comparative Example 2 An ultrafine aluminum diethylphosphinate composition product having the same particle size distribution as in Example 2 was prepared in the same manner as in Example 2, except that the concentration of the sodium n-octyl n-octoxyphosphate solution was 1.5 wt%.

[0099] Comparative Example 3 An ultrafine aluminum diethylphosphinate composition product having the same particle size distribution as in Example 3 was prepared in the same manner as in Example 3, except that the same amount and concentration of dihexyl sodium phosphate solution was used instead of the diisooctyl sodium phosphate solution.

[0100] Comparative Example 4 An ultrafine aluminum diethylphosphinate composition product having the same particle size distribution as in Example 4 was prepared in the same manner as in Example 4, except that the concentration of the potassium di(dodecyloxy)phosphate solution was 0.006 wt%.

[0101] Comparative Example 5 An ultrafine aluminum diethylphosphinate composition product having the same particle size distribution as in Example 5 was prepared in the same manner as in Example 5, except that the mixed solution of 7.0 g of sodium phenoxydodecyloxyphosphate having a concentration of 0.5 wt% and 7.3 g of sodium di-n-octoxyphosphate having a concentration of 0.5 wt% was replaced with 14.5 g of potassium dihexadecyloxyphosphate having a concentration of 0.5 wt%.

[0102] Comparative Example 6 An ultrafine aluminum diethylphosphinate composition product having the same particle size distribution as in Example 6 was prepared in the same manner as in Example 6, except that 36.7 g of a 0.01 wt % sodium hexadecyloxysulfonate solution was used instead of 36.6 g of a 0.01 wt % sodium diisooctoxyphosphate aqueous solution.

[0103] Comparative Example 7 Ultrafine aluminum diethylphosphinate having the same particle size distribution as in Example 6 was prepared in the same manner as in Example 6, except that the long-chain phosphate aqueous solution was not added.

[0104] Performance Detection Moisture content testing was performed using the Karl Fischer method.

[0105] The particle size distribution test was carried out by dispersing the alkylphosphinate flame retardant powders prepared in the Examples and Comparative Examples in ethanol or acetone and using a laser scattering method.

[0106] Powder Dispersibility Test 80.0g of epoxy resin and 4.0g of dicyandiamide (hardener) were taken, 150mL of butanone was added, and after stirring and dispersing, 9.0g of alkyl phosphinate flame retardant prepared in the examples or comparative examples was added, and the mixture was stirred and dispersed at high speed and dispersed on a PET film using a disperser with a scraper. The dispersion state of the alkyl phosphinate on the film was visually inspected, and the number of white spots with diameters of 0.2 to 0.5mm and 0.5mm or more was recorded.

[0107] Testing for long-chain phosphate content The anionic long-chain phosphate ions were tested using ion chromatography (IC) or ultra-performance liquid chromatography (UPLC) by dispersing the samples in water or methanol, adjusting the volume, sonicating, and collecting the top liquid for testing, and the cationic sodium or potassium ions were tested using inductively coupled plasma spectroscopy (ICP).

[0108] Flame Retardant Performance Test After the powder dispersion test, the epoxy resin adhesive liquid was poured into a tetrafluoroethylene mold and further cured to obtain strip-shaped test pieces. These strip-shaped test pieces were measured according to the UL94 V0 (1.6 mm) method and GB-T 2408-2008 standard, with 5 to 6 test pieces in each group.

[0109] The results of the above performance tests performed on the products prepared in the examples and comparative examples of the present invention are shown in the table below.

[0110] [Table 1]

[0111] As can be seen from the above test results, by adding C16-C24 long-chain phosphate to alkyl phosphinate, the powder of ultrafine alkyl phosphinate shows a better dispersion modification effect, and the coating appearance of the obtained product does not have abnormal agglomerated white spots or granular matter. The long-chain phosphate dispersant with 12 long-chain carbon atoms and the long-chain phosphate dispersant with 32 long-chain carbon atoms are insufficient in use. In particular, when the long-chain phosphate with 32 long-chain carbon atoms was added, the flame retardant sample turned yellow. In addition, when other dispersants such as sulfonates were added, the effect of improving dispersibility was not obtained, and abnormalities occurred in the alkyl phosphinate.

[0112] In the alkyl phosphinate composition provided by the present invention, the dispersibility of the ultrafine alkyl phosphinate can be improved by adding a small amount of C16-C24 long-chain alkyl phosphinate phosphate as a dispersant to the alkyl phosphinate. The composition of the present invention solves the problem that ultrafine alkyl phosphinate powder is prone to agglomeration in epoxy resin, polyurethane resin, and acrylic resin, causing white spots and swelling in the product. The added dispersant in the present invention does not adversely affect the thermal stability of the alkyl phosphinate, and does not decompose during processing and use of the alkyl phosphinate. In addition, the added dispersant does not reduce the flame retardant efficiency of the alkyl phosphinate, and has little effect on the use of the alkyl phosphinate in epoxy resin, polyurethane resin, and acrylic resin.

[0113] It should be noted that the above is only a preferred embodiment of the present invention, and those skilled in the art may make some improvements and modifications without departing from the principle of the present invention, and these improvements and modifications are also considered to fall within the protection scope of the present invention.

Claims

1. A composition comprising 99.5 to 99.9999 wt% of an alkyl phosphinate which is aluminum diethylphosphinate and 0.0001 to 0.5 wt% of a long-chain phosphate having 16 to 24 carbon atoms, An alkyl phosphinate composition having a particle size D95 of less than 20 microns.

2. 2. The alkyl phosphinate composition of claim 1, wherein the long chain phosphate is selected from the group consisting of sodium long chain phosphate salts, potassium long chain phosphate salts, and combinations thereof.

3. The alkyl phosphinate composition according to claim 2, characterized in that the long-chain phosphate is one or more selected from the compounds represented by the structures of the following formulas I to III: 【Chemistry 1】 (In formula I, R 1 and R 2 are independently selected from the group consisting of H, C8-C16 alkyl groups, and aryl groups, M is sodium or potassium, and x is 1 or 2. 【Chemistry 2】 (In formula II, R 3 and R 4 are independently selected from the group consisting of H, C8-C16 alkyl groups, and aryl groups, M is sodium or potassium, and y is 1 or 2. 【Chemistry 3】 (In formula III, R 5 and R 6 are independently selected from the group consisting of C7 to C16 alkyl groups and aryl groups, M is sodium or potassium, and z is 1.

4. The compound represented by the structure of formula I is monohexadecyloxyphosphate disodium (potassium), monooctadecyloxyphosphate disodium (potassium), ethoxyhexadecyloxyphosphate sodium (potassium), propoxyhexadecyloxyphosphate sodium (potassium), n-butoxyhexadecyloxyphosphate sodium (potassium), isobutoxyhexadecyloxyphosphate sodium (potassium), sec-butoxyhexadecyloxyphosphate sodium (potassium), t-butoxyhexadecyloxyphosphate sodium (potassium), hexyloxyhexadecyloxyphosphate sodium (potassium), octyloxyhexadecyloxyphosphate sodium (potassium), n-butoxydodecyloxyphosphate sodium (potassium), isobutoxydodecyloxyphosphate sodium (potassium), sec-butoxydodecyloxyphosphate sodium (potassium), 4. The alkyl phosphinate composition of claim 3, wherein the alkyl phosphinate is selected from the group consisting of sodium phosphate (potassium), sodium t-butoxydodecyloxyphosphate (potassium), sodium hexyloxydodecyloxyphosphate (potassium), sodium n-octyloxydodecyloxyphosphate (potassium), sodium isooctyloxydodecyloxyphosphate (potassium), sodium diisooctyloxyphosphate (potassium), sodium di(dodecyloxy)phosphate (potassium), sodium di-n-octyloxyphosphate (potassium), sodium phenoxydodecyloxyphosphate (potassium), sodium phenoxyhexadecyloxyphosphate (potassium), sodium o-dimethylphenoxydodecyloxyphosphate (potassium), sodium o-dimethylphenoxyhexadecyloxyphosphate (potassium), and combinations thereof.

5. The compound represented by the structure of formula II is monohexadecyl phosphate disodium (potassium), monooctadecyl phosphate disodium (potassium), ethylhexadecyloxyphosphate sodium (potassium), propylhexadecyloxyphosphate sodium (potassium), n-butylhexadecyloxyphosphate sodium (potassium), isobutylhexadecyloxyphosphate sodium (potassium), s-butylhexadecyloxyphosphate sodium (potassium), t-butylhexadecyloxyphosphate sodium (potassium), hexylhexadecyloxyphosphate sodium (potassium), ethyloctadecyloxyphosphate sodium (potassium), propyloctadecyloxyphosphate sodium (potassium), n-butyloctadecyloxyphosphate sodium (potassium), isobutyloctadecyloxyphosphate sodium (potassium), 4. The alkyl phosphinate composition according to claim 3, wherein the alkyl phosphinate is selected from the group consisting of sodium (potassium) phosphate, sodium s-butyl octadecyloxyphosphate, sodium t-butyl hexadecyloxyphosphate, sodium hexyl octadecyloxyphosphate, sodium n-octyl n-octyloxyphosphate, sodium isooctyl isooctyloxyphosphate, sodium phenyl dodecyloxyphosphate, sodium phenyl hexadecyloxyphosphate, sodium phenyl octadecyloxyphosphate, sodium o-dimethylphenyl dodecyloxyphosphate, sodium o-dimethylphenyl hexadecyloxyphosphate, and combinations thereof.

6. The compound represented by the structure of formula III is selected from the group consisting of sodium ethyl octadecyl phosphate (potassium), sodium propyl octadecyl phosphate (potassium), sodium n-butyl octadecyl phosphate (potassium), sodium isobutyl octadecyl phosphate (potassium), sodium s-butyl octadecyl phosphate (potassium), sodium t-butyl octadecyl phosphate (potassium), sodium hexyl octadecyl phosphate (potassium), sodium ethyl hexadecyl phosphate (potassium), sodium n-butyl hexadecyl phosphate (potassium), sodium isobutyl hexadecyl phosphate (potassium), sodium s-butyl hexadecyl phosphate (potassium), sodium t-butyl hexadecyl phosphate (potassium), sodium hexyl hexadecyl phosphate (potassium), sodium octyl hexadecyl phosphate (potassium), sodium n-butyl do ...

4. The alkyl phosphinate composition of claim 3, wherein the alkyl phosphinate is selected from the group consisting of sodium (potassium), isobutyl dodecyl phosphate, sodium (potassium), s-butyl dodecyl phosphate, sodium (potassium), t-butyl dodecyl phosphate, sodium hexyldodecyl phosphate, sodium n-octyl dodecyl phosphate, sodium isooctyl dodecyl phosphate, sodium di(dodecyl)phosphate, sodium diisooctyl phosphate, sodium di-n-octyl phosphate, sodium didecyl phosphate, sodium phenyl dodecyl phosphate, sodium phenyl hexadecyl phosphate, sodium o-dimethylphenyl dodecyl phosphate, sodium o-dimethylphenyl hexadecyl phosphate, and combinations thereof.

7. The content of the alkyl phosphinate is 99.8 to 99.9999 wt %, The alkyl phosphinate composition according to claim 1, characterized in that the content of the long-chain phosphate is 0.0001 to 0.2 wt %.

8. A method for producing the alkylphosphinate composition of claim 1, comprising the steps of: mixing the long chain phosphate with the alkyl phosphinate after filtration and washing in the preparation of the alkyl phosphinate is completed; or The method includes the step of combining a long chain phosphate with an alkyl phosphinate after metathesis in the preparation of the alkyl phosphinate is complete.

9. The alkyl phosphinate composition of claim 1, The material is selected from the group consisting of printed circuit boards, electronic potting adhesives, polyester films, and combinations thereof.

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