Thermal Conductive Component and Electronic Device

Abstract

To improve cooling performance while suppressing noise of electronic equipment including highly heat-generating electric parts with a simple configuration. [Solution] In an electronic device (100), a heat conduction component (170) includes a shield section (160) that covers an electrical component (110) mounted on a circuit board (120) and shields against noise, and a heat transfer elastomer (150) that is arranged on the upper surface of the shield section (160) and transfers heat from the electrical component (110) to a heat dissipation component (140). The shield section (160) is electrically connected to a ground connection section (130) provided on the circuit board (120) and contacts the electrical component (110) with a predetermined pressure.

Description

Technical Field

[0001] The present invention relates to a heat conduction component and an electronic device.

Background Art

[0002] There is an electronic device in which a circuit board on which a heat-generating electric component is mounted is disposed inside a housing. In such an electronic device, while the amount of heat generated by the electric component increases due to the sophistication of functions, the miniaturization of the electric component is progressing due to market requirements. For this reason, for example, a metal heat dissipation component is provided, and a device is devised to transfer heat from the electric component and keep the electric component within a guaranteed temperature.

[0003] There is a shield structure of an LSI case including a wiring board having a ground pad connected to a power supply layer of a reference potential, an LSI case that stores a semiconductor element mounted on this wiring board and has a heat sink attachment structure detachable by a screw, and a box-shaped one that covers this LSI case and is fixed by being pinched between the LSI case and the heat sink, and a part of which is fixed at a position in contact with the ground pad of the wiring board (see, for example, Patent Document 1).

[0004] FIG. 5 is a diagram schematically showing the shield structure disclosed in Patent Document 1 with the LSI case omitted. In the technique disclosed in Patent Document 1, further, a heat dissipation sheet (heat transfer sheet) is sandwiched and fixed between the shield fence and the mounting plate of the LSI case and between the shield fence and the heat sink.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] The following analysis was made by the inventor of the present invention.

[0007] According to the technique disclosed in Patent Document 1, in order not to propagate the noise of a semiconductor element, which is a heat-generating electrical component, to a heat sink, which is a heat radiating component, the semiconductor element mounted on a wiring board is covered with a shield fence. Then, by bringing this shield fence into contact with and fixing it to the ground pad of the wiring board, the noise from the semiconductor element is confined within the shield fence, and the heat of the semiconductor element is transferred to the heat sink. In order to conduct heat in this state, heat transfer sheets are mounted above and below the shield fence.

[0008] In such a configuration, a contact thermal resistance is generated between the heat transfer sheet and the contact surface of each component. And in order to reduce this contact thermal resistance, it is necessary to apply an appropriate pressure to the contact surface. For this reason, the heat transfer sheet is made of an elastic body and is pressed and mounted to apply pressure to the contact surface.

[0009] For example, if this pressure is small, the contact thermal resistance becomes large, and if it is large, the circuit board is deformed, leading to damage to peripheral electrical components. Therefore, it is necessary to apply an appropriate pressure. Considering that there are thickness variations in both the heat transfer sheet and the electrical component, in order to obtain an appropriate pressure, a certain thickness is required for the heat transfer sheet. However, the material used for the heat transfer sheet has a thermal conductivity about 1 / 10 to 1 / 100 of that of metal. Therefore, if this thickness is increased, the resistance increases in transferring heat from the electrical component to the heat radiating component.

[0010] Also, inserting a plurality of heat transfer sheets means that the locations where contact thermal resistance occurs increase, the total thermal resistance between the electrical component and the heat radiating component increases, and the amount of heat transfer is suppressed. Therefore, it is also difficult to improve the cooling performance.

[0011] The present invention has been made in view of the above circumstances, and an object thereof is to provide a technique that contributes to improving the cooling performance while suppressing the noise of an electronic device including a high-heat-generating electrical component with a simple configuration.

Means for Solving the Problem

[0012] According to a first aspect of the present disclosure, a shield portion that covers an electrical component mounted on a circuit board and shields noise, and a heat transfer elastic body disposed on the upper surface of the shield portion and transferring heat of the electrical component to a heat dissipation component, are provided. The shield portion is electrically connected to a ground grounding portion provided on the circuit board and contacts the electrical component and the ground grounding part with a predetermined pressure and the heat transfer elastic body is further arranged so as to contact the entire side surface of the shield part on the side surface of the shield part A heat conduction component is provided.

[0013] According to a second aspect of the present disclosure, the above-described heat conduction component, the circuit board, the electrical component mounted on the circuit board, the heat dissipation component that dissipates heat of the electrical component, and the ground grounding portion provided on the circuit board, are provided with an electronic device.

Effect of the Invention

[0014] According to the present invention, with a simple configuration, it is possible to improve the cooling performance while suppressing noise of an electronic device including a high heat generating electrical component.

Brief Description of the Drawings

[0015]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Mode for Carrying Out the Invention

[0016] <<First Embodiment>> A first embodiment of a heat conduction component of an electronic device to which the present disclosure is applied will be described with reference to the drawings. Note that the present disclosure is not limited to the following embodiments, and various modifications can be made without departing from the gist of the present disclosure. Also, the drawings are schematic, and the ratios of the dimensions may be different from the actual ones. Specific dimensions and the like should be determined with reference to the following description. Also, there are portions where the relationships and ratios of the dimensions are different between the drawings. The reference numerals in the drawings are for convenience of reference and are not intended to limit the present invention to the illustrated embodiments.

[0017] Also, regardless of the orientation of use of the electronic device, in this specification, the vertical and horizontal directions in the drawings are directly referred to as up, down, left, and right and used in the description.

[0018] FIG. 1(a) is a schematic cross-sectional view of an electronic device 100 including a heat conduction component 170 of the present disclosure. As shown in this figure, the electronic device 100 further includes an electrical component 110, a circuit board 120, a ground grounding portion 130, and a heat dissipation component 140.

[0019] The electrical component 110 is, for example, a semiconductor element or the like, receives power supply, and generates heat. It is also a source of noise such as electromagnetic noise.

[0020] The circuit board 120 is a board on which the electrical component 110 is mounted. The circuit board 120 is provided with a ground grounding portion 130 thereon. The ground grounding portion 130 is provided so as to surround the electrical component 110, for example, as shown in FIG. 1(c).

[0021] The heat radiating component 140 reduces the temperature of the electrical component 110 by receiving heat from the electrical component 110 and radiating the heat.

[0022] As shown in FIG. 1(a), the heat conduction component 170 of the present embodiment is clamped and fixed between the circuit board 120 and the heat radiating component 140. Further, the heat conduction component 170 covers the electrical component 110 mounted on the circuit board 120 and shields noise from the electrical component 110. Further, the heat conduction component 170 transfers the heat generated by the electrical component 110 to the heat radiating component 140 by contacting the electrical component 110 and the heat radiating component 140 with a predetermined pressure.

[0023] Therefore, as shown in FIG. 1(b), the heat conduction component 170 includes a shield portion 160 that shields noise and a heat transfer elastic body 150 that transfers the heat of the electrical component 110 to the heat radiating component 140.

[0024] As shown in FIGS. 1(a) and 1(c), the shield portion 160 is arranged to cover the electrical component 110 mounted on the circuit board 120. At this time, it is electrically connected to the ground grounding portion 130 provided on the circuit board 120 by contacting it with a predetermined pressure, for example. Further, the shield portion 160 of the present embodiment contacts the electrical component 110 with a predetermined pressure.

[0025] The heat transfer elastic body 150 is disposed on the side surface and the upper surface of the shield portion 160. The heat transfer elastic body 150 contacts the heat radiating component 140 with a predetermined pressure and transfers the heat of the electrical component 110 received through the shield portion 160 to the heat radiating component 140.

[0026] Generally, the thermal conductivity of the material used for the heat-conductive elastomer 150 is as low as 1 / 10 to 1 / 100 of that of a metal. Therefore, the heat-conductive elastomer 150 is made as thin as possible, and by bringing the electrical component 110 and the heat-radiating component 140 closer together, the amount of heat transfer increases. That is, the amount of heat transfer is inversely proportional to the thickness of the heat-conductive elastomer 150. On the other hand, the closer the electrical component 110 and the heat-radiating component 140 are, the more noise from the electrical component 110 propagates to the heat-radiating component 140 and spreads to the entire electronic device 100 by the heat-radiating component 140.

[0027] However, the heat-conductive component 170 of the present embodiment includes a shield portion 160 that covers the electrical component 110, and the shield portion 160 is electrically connected to the ground grounding portion 130. Then, the heat-conductive component 170 is sandwiched and fixed between the circuit board 120 having the ground grounding portion 130 and the heat-radiating component 140. For this reason, stable ground grounding becomes possible, and noise from the electrical component 110 can be effectively confined within the shield portion 160. Therefore, since the noise is sufficiently suppressed by the shield portion 160, the thickness of the heat-conductive elastomer 150 is not required.

[0028] For this reason, according to the heat-conductive component 170 of the present embodiment, the heat-conductive elastomer 150 can be made into a single layer. As described above, contact thermal resistance occurs between the heat-conductive elastomer 150 and the contact surface of other components, which hinders heat transfer from the electrical component 110 to the heat-radiating component 140. However, according to the present embodiment, since the heat-conductive elastomer 150 is a single layer, the generation of contact thermal resistance can be suppressed as compared with the conventional configuration in which the heat-conductive elastomer 150 has a plurality of layers. Furthermore, the heat-conductive component 170 of the present embodiment contacts the electrical component 110 and the heat-radiating component 140 with a predetermined pressure. Accordingly, the contact thermal resistance between the heat-conductive elastomer 150 and the electrical component 110 becomes even smaller, thereby increasing the amount of heat transfer from the electrical component 110 to the heat-radiating component 140 and improving the cooling performance. Also, by setting the predetermined pressure to such an extent that the circuit board does not deform, damage to peripheral electrical components can be prevented.

[0029] Therefore, according to the present embodiment, with a simple configuration, it is possible to improve the cooling performance while suppressing the noise of the electronic device 100 including the highly heat-generating electrical component 110.

[0030] <<Second Embodiment>> Next, a second embodiment to which the present invention is applied will be described. In the present embodiment, the electronic device 100 including the heat conduction component 170 of the first embodiment will be described as an example. In the present embodiment, the components having the same names as those in the first embodiment basically have the same functions as those in the first embodiment. Hereinafter, the present embodiment will be described focusing on the points different from the first embodiment.

[0031] As shown in FIG. 1(a), the electronic device 100 of the present embodiment includes an electrical component 110, a circuit board 120, a ground grounding portion 130, a heat conduction component 170, and a heat dissipation component 140.

[0032] Similar to the first embodiment, the electrical component 110 is, for example, a semiconductor element or the like, receives power supply, and generates heat. It is also a noise source such as electromagnetic noise. For example, it may be an integrated circuit such as an IC (Integrated Circuit) or an LSI (Large Scale Integration), a CPU (Central Processing Unit), an MPU (Microprocessing Unit), a graphic operation element, an image sensor, or the like.

[0033] The circuit board 120 is a board on which the electrical component 110 is mounted. The circuit board 120 includes a ground grounding portion 130 thereon. The ground grounding portion 130 is provided, for example, on the circuit board 120 so as to surround the electrical component 110 as shown in FIG. 1(c).

[0034] The heat dissipation component 140 receives heat from the electrical component 110 and releases it to the outside. Thereby, the temperature of the electrical component 110 is lowered. The type is not particularly limited, and for example, it may be a radiator, a cooler, a heat sink, a heat spreader, a die pad, a cooling fan, a heat pipe, a metal cover, an electronic device housing, or the like.

[0035] The heat conduction component 170 of this embodiment covers the electrical component 110 mounted on the circuit board 120, shields the noise from the electrical component 110, and transfers the heat generated by the electrical component 110 to the heat dissipation component 140.

[0036] As shown in FIGS. 1(b) and 1(c), the heat conduction component 170 of this embodiment has an upper and lower part and has a box shape without a bottom part. Similar to the first embodiment, the heat conduction component 170 of this embodiment is also arranged on the ground grounding part 130 on the circuit board 120 so as to cover the electrical component 110 mounted on the circuit board 120.

[0037] Further, the heat conduction component 170 has flexibility as a whole and is clamped and fixed between the heat dissipation component 140 and the circuit board 120.

[0038] Similar to the first embodiment, the heat conduction component 170 of this embodiment includes a heat transfer elastic body 150 and a shield part 160.

[0039] The shield part 160 has a shielding function and shields the noise from the electrical component 110. As shown in FIGS. 1(b) and 1(c), the shield part 160 is formed in a box shape and is arranged so as to cover the electrical component 110 mounted on the circuit board 120 as shown in FIGS. 1(a) and 1(c).

[0040] As shown in FIG. 1(b), the shield part 160 of this embodiment includes a side surface part 160s, an upper surface part 160u, and a bottom part 160b. The bottom part 160b is provided at the bottom of the side surface part of the box-shaped heat conduction component 170. In this embodiment, the shield part 160 is grounded by the bottom part 160b being electrically connected to the ground grounding part 130.

[0041] The shield part 160 may be, for example, a metal sheet formed of a metal such as aluminum. Further, the shield part 160 has flexibility and is formed to have a strength and thickness such that it can follow the shape of the heat transfer elastic body 150.

[0042] The material of the shield part 160 is not particularly limited as long as it has a high conductivity and a high electromagnetic wave shielding effect. For example, metals with high conductivity such as aluminum, copper, and stainless steel, or highly conductive magnetic materials can be used. Examples of highly conductive magnetic materials include permalloy, sendust, Fe-based or Co-based amorphous materials, and microcrystalline materials. When using the above-mentioned magnetic materials as the constituent materials, in addition to the electrical shielding effect, magnetic shielding effects and magnetic absorption effects can also be expected.

[0043] The heat transfer elastomer 150 transfers the heat of the electrical component 110 to the heat dissipation component 140. The heat transfer elastomer 150 of the present embodiment is arranged to cover the upper part and the side periphery of the shield part 160.

[0044] For the heat transfer elastomer 150, an elastomer that deforms with a relatively small force and has a reaction force is used. Also, an insulating one is used. For example, a material mixed with acrylic rubber or silicone rubber is desirable. Additionally, for example, a heat transfer sheet which is a sheet-like resin material filled with a filler having heat conductivity may be used. The heat transfer sheet has a heat conductivity about 1 / 10 to 1 / 100 that of metal.

[0045] Also, as shown in Fig. 2(a), the dimension in the height direction (height dimension) Da of the heat conduction component 170 is equal to or greater than the dimension of the distance (distance dimension) Sa from the upper surface of the circuit board 120 of the electronic device 100 to the lower surface of the heat dissipation component 140. At this time, it is desirable that Da > Sa. Thereby, when the heat conduction component 170 is clamped and fixed between the heat dissipation component 140 and the circuit board 120, the bottom part 160b of the shield part 160 is pressed against the ground grounding part 130 by the reaction force of the heat transfer elastomer 150, and stable conduction is ensured.

[0046] Also, as shown in FIG. 2(b), the thickness dimension (thickness dimension) Db of the upper part of the heat conduction component 170 is equal to or greater than the dimension of the distance (distance dimension) Sb from the upper surface of the electrical component 110 of the electronic device 100 to the lower surface of the heat dissipation component 140. At this time, it is desirable that Db > Sb. Thereby, when the heat conduction component 170 is clamped and fixed between the heat dissipation component 140 and the circuit board 120, the heat conduction component 170 contacts the upper surface of the electrical component 110 with a predetermined pressure, and the shield portion 160 contacts the lower surface of the heat dissipation component 140 with a predetermined pressure. Also, the contact surface between the electrical component 110 and the upper surface portion 160u of the shield portion 160, the contact surface between the shield portion 160 and the heat transfer elastic body 150, and the contact surface between the heat transfer elastic body 150 and the heat dissipation component 140 are in contact due to the reaction force of a single (one layer) heat transfer elastic body 150. Therefore, fine air does not enter between each contact surface and they can be in close contact. Thereby, the contact thermal resistance can be suppressed.

[0047] As described above, the heat conduction component 170 of the present embodiment has the same configuration as that of the first embodiment. Therefore, it exhibits the same effects as the first embodiment.

[0048] Furthermore, the heat conduction component 170 of the present embodiment has the dimensions as described above, ensuring stable conduction and suppressing the contact thermal resistance. Furthermore, since the distance between the electrical component 110 and the heat dissipation component 140 can be reduced, the total thermal resistance can also be suppressed, and as a result, the heat transfer amount can be increased. Thereby, the cooling performance is improved.

[0049] According to the present embodiment, with a simple configuration, it is possible to improve the cooling performance while suppressing the noise of the electronic device 100 including the high-heat-generating electrical component 110.

[0050] Furthermore, generally, the shield part 160 is fixed to the circuit board 120 by solder or a clip or the like mounted on the circuit board 120. However, when fixed by solder, if the components inside the shield part 160 are to be replaced during maintenance or the like after assembly, it is necessary to melt and remove all the solder or to provide a shield part 160 with an openable and closable part such as a lid in advance. Also, when fixed by a clip or the like, it is possible to easily remove the shield part 160. However, when taking measures against high-frequency noise, it is necessary to mount the clips at a narrow pitch. As a result, the number of mounted components increases and the cost increases.

[0051] However, according to the heat conducting component 170 of the present embodiment, it is not necessary to use solder, a clip, or the like. Therefore, the maintainability is improved and the cost can be reduced accordingly.

[0052] <Modification Example 1> In the above embodiment, as the heat conductive elastic body 150, a heat conductive sheet made of a sheet-shaped resin material filled with a filler having heat conductivity is used. The heat conductive sheet is easy to control in shape and can be processed according to the use shape. The shield part 160 covered by the heat conductive elastic body 150 also has a thickness that can be deformed in shape following the heat conductive elastic body 150. Therefore, the heat conducting component 170 as a whole has flexibility.

[0053] For example, as shown in Fig. 3(a), during use, the shape of the heat conducting component 170 may be deformed according to the height of the electrical component 110. Specifically, according to the height of the electrical component 110, the upper bottom part (the upper surface part 160u of the shield part 160) of the heat conducting component 170 is deformed so as to contact the entire upper surface (or a part) of the electrical component 110.

[0054] For example, as shown in Fig. 3(a), it can be realized by fabricating the shape of the heat radiating component 140 according to the height of the electrical component 110.

[0055] Thereby, with the heat conducting component 170 of the same shape, it is possible to cope with various electrical components 110. It is not necessary to fabricate according to the electrical component 110, which can contribute to cost reduction.

[0056] <Modification Example 2> Also, in each of the above embodiments and modification examples, the heat conduction component 170 covers one electrical component 110. However, the number of electrical components 110 to be covered is not limited to this. For example, as shown in FIG. 3(b), one heat conduction component 170 may cover a plurality of electrical components 110.

[0057] Also in this case, according to the height of each electrical component 110, the upper bottom portion (the upper surface portion 160u of the shield portion 160) of the heat conduction component 170 is deformed so as to be in contact with the entire upper surface (or a part) of each electrical component 110. For example, as shown in FIG. 3(b), it can be realized by fabricating the shape of the heat dissipation component 140 according to the height of each electrical component 110.

[0058] <Modification Example 3> Also, the heat transfer elastic body 150 may be provided only on the upper surface of the shield portion 160. In this case, for example, as shown in FIG. 4(a), the thickness of the side surface portion 160s of the shield portion 160 may be larger than the thickness of the upper surface portion 160u of the shield portion 160. At this time, the heat transfer elastic body 150 may be provided not on the entire upper part of the shield portion 160 but on a part thereof.

[0059] <Modification Example 4> In addition, in each of the above embodiments, the case where the heat conduction component 170 has a rectangular box shape is illustrated, but the shape of the heat conduction component 170 is not limited to this. Any shape that covers the electrical component 110 mounted on the circuit board 120 and can transfer the heat generated by the electrical component 110 to the heat dissipation component 140 is acceptable. For example, as shown in FIG. 4(b), it may have a cylindrical shape without a bottom and with a top, or a polygonal prism shape without a bottom and with a top.

[0060] As described above, each embodiment and modification of the present invention have been explained. However, the present invention is not limited to the above-described embodiments, and various modifications that can be understood by those skilled in the art can be made. And each embodiment and modification can be combined with other embodiments as appropriate. Further, for example, the configuration of each element shown in each drawing is an example for assisting the understanding of the present invention, and is not limited to the configuration shown in these drawings.

[0061] Finally, the preferred forms of the present invention will be summarized. Some or all of the above-described embodiments may also be described as follows, but are not limited thereto. (Appendix 1) The heat conduction component includes a shield portion that covers an electrical component mounted on a circuit board and shields noise, and a heat transfer elastic body disposed on the upper surface of the shield portion and transferring the heat of the electrical component to a heat dissipation component. The shield portion is electrically connected to a ground grounding portion provided on the circuit board and contacts the electrical component with a predetermined pressure. (Appendix 2) In the heat conduction component according to Appendix 1, the heat dissipation component is disposed above the electrical component, the heat conduction component has flexibility, and it is desirable that the height dimension of the heat conduction component is equal to or greater than the distance dimension between the upper surface of the circuit board and the lower surface of the heat dissipation component. (Appendix 3) In the heat conduction component according to Appendix 1 or 2, the heat dissipation component is disposed above the electrical component, the heat conduction component has flexibility, and it is desirable that the thickness dimension of the portion of the heat transfer elastic body disposed on the upper surface of the shield portion is equal to or greater than the distance dimension between the upper surface of the electrical component and the lower surface of the heat dissipation component. (Appendix 4) In the heat conduction component according to any one of Appendices 1 to 3, it is desirable that the heat transfer elastic body is also disposed on the side surface of the shield portion. (Appendix 5) In the heat conduction component according to any one of Supplementary Notes 1 to 4, it is desirable that the shield part is composed of a metal sheet. (Supplementary Note 6) In the heat conduction component according to any one of Supplementary Notes 1 to 5, having flexibility, it is desirable that it is arranged to contact the upper part of the electrical component. (Supplementary Note 7) In the heat conduction component according to any one of Supplementary Notes 1 to 5, covering the plurality of electrical components mounted on the circuit board, and it is desirable that it is arranged to contact the upper part of each electrical component. (Supplementary Note 8) A heat conduction component according to any one of claims 1 to 7, it is desirable that the shield part is a metal sheet containing aluminum. (Supplementary Note 9) An electronic device includes the heat conduction component according to any one of Supplementary Notes 1 to 8, the circuit board, the electrical components mounted on the circuit board, the heat dissipation component that dissipates heat of the electrical components, and the ground grounding part provided on the circuit board. (Supplementary Note 10) In the electronic device according to Supplementary Note 9, the heat dissipation component is arranged above the electrical component, and it is desirable that the heat conduction component is clamped and fixed between the heat dissipation component and the circuit board.

[0062] In addition, the disclosures of each of the above patent documents and the like shall be incorporated herein by reference. Within the scope of the entire disclosure of the present invention (including the claims), changes and adjustments of the embodiments or modifications can be made based on the basic technical idea. Further, within the scope of the disclosure of the present invention, various combinations or selections of various disclosure elements (including each element of each claim, each element of each embodiment or modification, each element of each drawing, etc.) are possible. That is, the present invention naturally includes all disclosures including the claims, and various deformations and corrections that could be made by those skilled in the art according to the technical idea. In particular, regarding the numerical ranges described in this document, any numerical value or small range included within the range should be construed as specifically described even in the absence of separate description.

Explanation of Reference Signs

[0063] 100: Electronic device, 110: Electrical component, 120: Circuit board, 130: Ground grounding part, 140: Heat dissipation component, 150: Heat transfer elastic body, 160: Shield part, 160b: Bottom part, 160s: Side surface part, 160u: Upper surface part, 170: Heat conduction component

Claims

1. a shielding portion that covers electrical components mounted on the circuit board and shields them from noise; a heat transfer elastic body disposed on an upper surface of the shield portion and configured to transfer heat from the electrical component to a heat dissipation component; the shield portion is electrically connected to a ground portion provided on the circuit board and is in contact with the electrical components and the ground portion with a predetermined pressure; The heat transfer elastic body is further a heat transfer part arranged on a side surface of the shield portion so as to be in contact with the entire side surface of the shield portion.

2. 2. The heat conducting component according to claim 1, the heat conducting component is used by being sandwiched and fixed between the heat dissipation component and the circuit board of an electronic device including the circuit board, the electric component, and the heat dissipation component; the heat dissipation component is disposed above the electrical component, The heat conducting component is flexible and has dimensions that allow the heat conducting component to be deformed by an upper surface of the circuit board of the electronic device and a lower surface of the heat dissipation component when clamped and fixed.

3. 2. The heat conducting component according to claim 1, the heat conducting component is used by being sandwiched and fixed between the heat dissipation component and the circuit board of an electronic device including the circuit board, the electric component, and the heat dissipation component; the heat dissipation component is disposed above the electrical component, The heat conducting component is flexible and has dimensions that allow the heat conducting component to be deformed by an upper surface of the electrical component of the electronic device and a lower surface of the heat dissipation component when clamped and fixed.

4. A heat conduction component according to claim 1, the heat conducting component is used by being sandwiched and fixed between the heat dissipation component and the circuit board of an electronic device including the circuit board, the electric component, and the heat dissipation component; the heat dissipation component is disposed above the electrical component, The heat conducting part is flexible, A heat conduction component which satisfies at least one of the following: a height dimension of the heat conduction component before being clamped and fixed to the electronic device is equal to or greater than the distance dimension between the upper surface of the circuit board of the electronic device to be clamped and the lower surface of the heat dissipation component; and a thickness dimension of a portion of the heat transfer elastomer arranged on the upper surface of the shielding part before being clamped and fixed to the electronic device is equal to or greater than the distance dimension between the upper surface of the electrical component of the electronic device to be clamped and the lower surface of the heat dissipation component.

5. 2. The heat conducting component according to claim 1, The shield portion is a heat conductive component formed of a metal sheet.

6. 2. The heat conducting component according to claim 1, It has flexibility, A thermally conductive component disposed in contact with a top surface of the electrical component.

7. 2. The heat conducting component according to claim 1, It has flexibility, a heat-conducting component that covers the electrical components mounted on the circuit board and is disposed so as to be in contact with an upper portion of each of the electrical components;

8. A heat conduction component according to claim 1, the shield portion includes a bottom portion provided under a side portion of the heat transfer elastic body that is disposed so as to be in contact with the entire side surface of the shield portion, The bottom portion is electrically connected to the ground portion, and is pressed against the side portion to come into contact with the ground portion at the predetermined pressure.

9. The heat conducting component according to claim 1 ; The circuit board; The electrical component mounted on the circuit board; the heat dissipation component that dissipates heat from the electrical component; and the ground portion is provided on the circuit board.

10. 10. The electronic device according to claim 9, the heat dissipation component is disposed above the electrical component, The heat conducting component is sandwiched and fixed between the heat dissipation component and the circuit board.

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