Circuit board fixing structure, light irradiation device

Abstract

To provide a circuit board fixing structure which enables a circuit board on a base to be easily replaced and is compact in a size.SOLUTION: A circuit board fixing structure which fixes a circuit board to a surface of a base comprises: a positive electrode pattern and a negative electrode pattern formed on a surface of a circuit board to supply electric power to the circuit board; a pair of first through-holes which respectively penetrates the circuit board from the positive and negative electrode patterns; a pair of second through-holes which vertically penetrates the base so as to be communicated with the respective first through-holes; a pair of electrode members which is inserted into the respective second through-holes; and a pair of fixing members which is engaged with the respective electrode members and fixes the circuit board to the base. Each electrode member has: an electrode terminal extending along the second through-hole; and an insulation member which is arranged so as to cover an outer periphery of the electrode terminal to insulate between the electrode terminal and the base and regulates rotation of each electrode member with respect to the second through-hole. When the fixing members are respectively engaged with the electrode members, the positive electrode pattern and the negative electrode pattern are electrically connected to the respective electrode terminals through the respective fixing members.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a circuit board fixing structure for fixing a circuit board on a base (for example, a heat sink, a base plate), and particularly to a circuit board fixing structure having an electrode that serves both for fixing the circuit board and for power supply, and an optical irradiation device including the same.

Background Art

[0002] Conventionally, an ultraviolet curable ink that cures by irradiation with ultraviolet light has been used as an ink for offset sheet-fed printing. Also, an ultraviolet curable resin has been used as a sealant for flat panel displays (FPDs) such as liquid crystal panels and organic EL (Electro Luminescence) panels. For curing such ultraviolet curable inks and ultraviolet curable resins, an optical irradiation device that irradiates ultraviolet light is generally used (for example, Patent Document 1).

[0003] The optical irradiation device described in Patent Document 1 includes a heat sink, a plurality of light source modules fixed on the heat sink, and a terminal block fixed to the side surface of the heat sink. Each light source module has an electrode plate arranged to protrude toward the terminal block, and power is supplied to each light source module by fixing each electrode plate to the terminal block. Further, a fixing plate that presses the substrate of the light source module is arranged to cover each electrode plate, and each light source module is fixed on the heat sink by co-fastening each fixing plate and each electrode plate to the terminal block.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] In the light irradiation device described in Patent Document 1, an electrode plate and a fixing plate are provided separately to supply stable power to the light source module and fix the light source module without applying excessive stress. However, since the electrode plate and the fixing plate protrude toward the terminal block (that is, protrude toward the outside of the light source module), there is a problem that the size in the direction orthogonal to the arrangement direction of the light source modules becomes large (that is, it cannot be made thin). Further, when it becomes necessary to replace the light source module, such as when the light source module fails, it is also necessary to perform the attachment / detachment work of the fixing plate, so a configuration that enables easier replacement work of the light source module has been demanded.

[0006] The present invention has been made in view of such circumstances, and an object thereof is to provide a circuit board fixing structure that can easily replace a circuit board (such as a light source module) on a base (heat sink, etc.) and is small in size. Further, it is to provide a light irradiation device including such a circuit board fixing structure.

Means for Solving the Problems

[0007] To achieve the above object, the circuit board fixing structure of the present invention is a circuit board fixing structure for fixing a circuit board on the surface of a metal base. To supply power to the circuit board, a positive electrode pattern and a negative electrode pattern formed on the surface of the circuit board, a pair of first through holes vertically penetrating the circuit board from each of the positive electrode pattern and the negative electrode pattern, a pair of second through holes vertically penetrating the base from the surface of the base so as to communicate with each of the first through holes, a pair of electrode members inserted into each of the second through holes, and a pair of fixing members attached to the surface side of the circuit board and engaged with each electrode member to fix the circuit board to the base. Each electrode member has an electrode terminal extending along the second through hole, and an insulating member disposed so as to cover the outer periphery of the electrode terminal to insulate the electrode terminal from the base and restrict rotation of each electrode member with respect to the second through hole. When each fixing member and each electrode member are engaged, each of the positive electrode pattern and the negative electrode pattern is electrically connected to each electrode terminal via each fixing member.

[0008] According to such a configuration, since the electrode member and the fixing member serve both to fix the circuit board and supply power, there is no need to provide a dedicated member for supplying power to the circuit board, and it is possible to miniaturize the circuit board fixing structure. Further, even when it becomes necessary to replace the circuit board, since the operation only requires removing the fixing member and replacing the circuit board (that is, there is no need to connect a dedicated member for supplying power to the circuit board or perform wiring, etc.), it is possible to replace the circuit board with a simple operation. Further, since the rotation of the electrode member is restricted, the attachment and detachment operation of the fixing member can also be easily performed.

[0009] Further, it is desirable that a flat portion parallel to the central axis of the second through hole is formed on at least a part of the outer shape of the insulating member, and the flat portion engages with the second through hole.

[0010] Further, it is desirable that at least a part of the outer shape of the insulating member has a protruding portion that protrudes in a direction perpendicular to the central axis of the second through hole, and the second through hole has a housing portion that houses the protruding portion.

[0011] Further, it is desirable to further include a fixing plate that is disposed on the back surface side of the base, has an opening through which the electrode terminal passes, and abuts against one end surface of the insulating member.

[0012] Further, it is desirable to further include a fixing plate that is disposed on the back surface side of the base, through which the electrode terminal passes, and has an opening that fits with a part of the insulating member.

[0013] Further, it is desirable that each electrode member has a biasing member that biases the electrode member away from the circuit board.

[0014] Further, the base has a mounting surface for the circuit board on the surface, a plate-shaped base portion substantially parallel to the circuit board, and a plurality of heat dissipation fins that stand substantially vertically from the back surface of the base portion and extend parallel to each other. Each second through hole is preferably composed of a third through hole that penetrates the base portion and a fourth through hole formed by notching a part of the plurality of heat dissipation fins in a direction perpendicular to the base portion so as to communicate with the third through hole.

[0015] Further, it is desirable that the base has a flow path inside which the refrigerant flows.

[0016] From another perspective, the light irradiation device of the present invention is characterized by including any one of the above circuit board fixing structures and a plurality of light emitting elements arranged on the circuit board and supplied with power from a positive electrode pattern and a negative electrode pattern.

[0017] Further, it is desirable to further include a pair of functional members respectively arranged on the positive electrode pattern and the negative electrode pattern and clamped together with the circuit board by each fixing member. In this case, it is desirable that the pair of functional members has a mirror surface that reflects a part of the light emitted from the plurality of light emitting elements.

[0018] Further, it is desirable that the light emitted from the light emitting element is light having a wavelength in the ultraviolet region.

Advantages of the Invention

[0019] As described above, according to the present invention, a circuit board on the base can be easily replaced, and a small-sized circuit board fixing structure is realized. Further, a light irradiation device having such a circuit board fixing structure is realized.

Brief Description of the Drawings

[0020]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Embodiments for Carrying Out the Invention

[0021] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the drawings, the same or corresponding parts are denoted by the same reference numerals and their descriptions will not be repeated.

[0022] (First Embodiment) FIG. 1 is a diagram for explaining a schematic configuration of an optical irradiation device 1 including a circuit board fixing structure 10 according to a first embodiment of the present invention. FIG. 1(a) is a perspective view, FIG. 1(b) is a front view, FIG. 1(c) is a rear view, and FIG. 1(d) is a cross-sectional view taken along line A-A of FIG. 1(b). Further, FIG. 2 is an exploded perspective view of the optical irradiation device 1 of FIG. 1, FIG. 2(a) is a view seen from obliquely forward, and FIG. 2(b) is a view seen from obliquely backward.

[0023] The light irradiation device 1 of this embodiment is a light source device that is mounted on a printing device or the like and cures ultraviolet curable ink or ultraviolet curable resin. For example, it is arranged above the irradiation object so that the front surface (the surface where the LED module 100 is arranged) faces the irradiation object, and emits ultraviolet light downward toward the irradiation object. In this specification, as shown in FIG. 1, the direction in which the LED (Light Emitting Diode) element 110 described later emits ultraviolet light is defined as the Z-axis direction, the longitudinal direction of the light irradiation device 1 is defined as the X-axis direction, and the direction orthogonal to the Z-axis direction and the X-axis direction (the short side direction of the light irradiation device 1) is defined as the Y-axis direction for explanation. Also, generally, ultraviolet light is defined as light with a wavelength of 400 nm or less. However, in this specification, ultraviolet light means light with a wavelength (for example, a wavelength of 250 to 420 nm) that can cure ultraviolet curable ink.

[0024] As shown in FIGS. 1 and 2, the light irradiation device 1 of this embodiment includes two LED modules 100, a heat sink 200 (base), an anode terminal 300a, a cathode terminal 300b, etc. that supply power to each LED module 100, and a metal box-shaped case (not shown) that houses these. In this specification, the anode terminal 300a and the cathode terminal 300b are also collectively referred to as the electrode member 300.

[0025] The LED module 100 includes a rectangular substrate 105 (circuit board) defined by the X-axis direction and the Y-axis direction, and a plurality of LED elements 110 (light-emitting elements) on the substrate 105. Two LED modules 100 are arranged and fixed on one end surface of the heat sink 200 (see FIGS. 1(a), (b), and 2). The substrate 105 is, for example, a ceramic substrate formed of aluminum nitride with high thermal conductivity. A pair of through-holes 120 (first through-holes) are formed in each substrate 105 at positions corresponding to the electrode members 300 (see FIGS. 1(d) and 2). In this embodiment, after applying heat dissipation grease (not shown) to the surface (substrate mounting surface) of the heat sink 200, the substrate 105 is placed on the heat sink 200, so that the heat dissipation grease is sandwiched between the back surface of the substrate 105 and the heat sink 200, enhancing the adhesion between the substrate 105 and the heat sink 200.

[0026] As shown in FIG. 1(a), the LED module 100 includes 70 LED elements 110 arranged in a 7-column (Y-axis direction) × 10-element (X-axis direction) pattern on a substrate 105. The 70 LED elements 110 are arranged on the surface of the substrate 105 with their optical axes aligned in the Z-axis direction. On the surface of the substrate 105, an anode pattern AP (positive electrode pattern) and a cathode pattern KP (negative electrode pattern) for supplying power to each LED element 110 are formed, and each LED element 110 is electrically connected to one end of the anode pattern AP and the cathode pattern KP by soldering or the like (for example, a conductive adhesive (silver paste), brazing material, welding / welding, diffusion bonding, etc.). Further, the anode pattern AP of the present embodiment is electrically connected to the electrode bar 310 of the anode terminal 300a, and the cathode pattern KP is electrically connected to the electrode bar 310 of the cathode terminal 300b (details will be described later). The electrode bars 310 of the anode terminal 300a and the cathode terminal 300b are electrically connected to a driver circuit (not shown), and a drive current is supplied to each LED element 110 from the driver circuit via the anode terminal 300a and the cathode terminal 300b, the anode pattern AP, and the cathode pattern KP. When a drive current is supplied to each LED element 110, ultraviolet light (for example, wavelength 385 nm) having a light amount corresponding to the drive current is emitted from each LED element 110. In addition, the drive current supplied to each LED element 110 of the present embodiment is adjusted so that ultraviolet light having a substantially uniform light amount is emitted, and the ultraviolet light emitted from the light irradiation device 1 has a substantially uniform light intensity distribution in the X-axis direction and the Y-axis direction.

[0027] The heat sink 200 is a so-called air-cooled heat sink that is arranged to be in close contact with the back surface of the substrate 105 of the LED module 100 and dissipates the heat generated by each LED element 110. The heat sink 200 is made of a material with good thermal conductivity such as aluminum or copper, and includes a thin plate-shaped base portion 210 parallel to the X-Y plane, and a plurality of heat dissipation fins 220 formed on the surface opposite to the surface with which the substrate 105 abuts. Each heat dissipation fin 220 has a thin plate-shaped shape parallel to the Y-Z plane and is provided at a predetermined interval in the X-axis direction. In this embodiment, the plurality of heat dissipation fins 220 are uniformly cooled by an air flow generated by a cooling fan (not shown).

[0028] Further, in the heat sink 200, a through hole 211 (second through hole) that penetrates perpendicularly (in a direction opposite to the Z-axis direction) from the surface of the heat sink 200 is formed so as to communicate with the through hole 120 of the substrate 105, and an electrode member 300 is inserted into the through hole 211 (FIGS. 1(c), (d), and 2). The through hole 211 of this embodiment is composed of a through hole 212 (third through hole) having a circular cross section that penetrates the base portion 210 so as to communicate with the through hole 120 of the substrate 105, and a through hole 222 (fourth through hole) formed so as to communicate with the through hole 212. More specifically, the heat dissipation fin 220 at the position corresponding to the through hole 212 is notched in the vertical direction (in a direction opposite to the Z-axis direction), and a through hole 222 having a rectangular cross section that penetrates the heat dissipation fin 220 in the Z-axis direction is formed in the space surrounded by this notch portion 223 and the two heat dissipation fins 220 that sandwich the notch portion 223 in the X-axis direction. Further, a recess 224 (accommodating portion) that engages with a protrusion 332 of the insulating sleeve 330 of the electrode member 300 is formed in the heat dissipation fin 220 that forms the through hole 222 (FIG. 1(d)).

[0029] As described above, the electrode member 300 of the present embodiment includes an anode terminal 300a connected to the anode pattern AP and a cathode terminal 300b connected to the cathode pattern KP. Since the specific configurations are the same, the cathode terminal 300b will be mainly described below as a representative. As shown in FIG. 2, the electrode member 300 (cathode terminal 300b) of the present embodiment is composed of an electrode rod 310 (electrode terminal), a fixing screw 320 (fixing member), and an insulating sleeve 330 (insulating member).

[0030] FIG. 3 is a perspective view for explaining the configurations of the electrode rod 310 and the insulating sleeve 330 of the present embodiment. FIG. 3(a) is a perspective view showing a state in which the electrode rod 310 and the insulating sleeve 330 are assembled, and FIG. 3(b) is an exploded perspective view. As shown in FIG. 3, the electrode rod 310 is a cylindrical metal member, and the insulating sleeve 330 is a resin member having a cylindrical tip portion 330a and a square cylindrical base portion 330b. The tip portion 330a of the insulating sleeve 330 fits into a through hole 212 formed in the base portion 210, and the base portion 330b fits into a through hole 222 of the heat sink fins 220. The electrode rod 310 is inserted and fixed in the insulating sleeve 330 (that is, the insulating sleeve 330 is attached to the outer peripheral surface of the electrode rod 310) and then inserted into the through hole 211 of the heat sink 200 (FIG. 1(d), FIG. 2). Note that protruding portions 332 protruding outward (in the Y-axis direction and the direction opposite to the Y-axis direction) are formed on both end faces of the insulating sleeve 330 of the present embodiment in the Y-axis direction. When the electrode member 300 is inserted into the through hole 211 of the heat sink 200, the protruding portions 332 engage with the recesses 224 of the heat sink fins 220 so that the movement of the electrode member 300 in the Z-axis direction is restricted. That is, the electrode member 300 is configured not to fall off from the heat sink 200. When the electrode member 300 is attached to the through hole 211, the tips of the electrode rod 310 and the insulating sleeve 330 are located on substantially the same plane as the surface (mounting surface) of the heat sink 200 or are slightly recessed from the surface of the heat sink 200 (FIG. 2(a)), and the base portion 330b of the electrode rod 310 and the insulating sleeve 330 is arranged to protrude from the back side of the heat sink 200 (FIG. 2(b)).

[0031] In this way, the light irradiation device 1 of the present embodiment is assembled with the electrode member 300 attached to the through hole 211. That is, a heat sink 200 with the electrode member 300 attached to the through hole 211 is prepared, heat dissipation grease is applied to the surface (mounting surface) of the heat sink 200, and each LED module 100 is placed thereon. Then, alignment is performed so that the through hole 120 of the substrate 105 is located above the electrode bar 310 (on the Z-axis direction side) (that is, so that the through hole 120 communicates with the through hole 211), and a fixing screw 320 is attached to the through hole 120. When the fixing screw 320 is attached to the through hole 120, the screw portion 321 of the fixing screw 320 is screwed into the screw hole portion 310a (FIG. 1(d)) formed on the inner peripheral surface of the electrode bar 310, and the LED module 100 is clamped and fixed between the head of the fixing screw 320 and the heat sink 200 (FIG. 1(d)). As described above, in the present embodiment, since the base end portion 330b of the insulating sleeve 330 of the electrode member 300 has a square cylindrical shape and fits into the through hole 222 of the heat dissipation fin 220, even if the fixing screw 320 is rotated, the electrode member 300 does not rotate, and the fixing screw 320 can be easily attached and detached. Then, when the LED module 100 is fixed by the fixing screw 320, the cathode pattern KP is electrically connected to the electrode bar 310 via the fixing screw 320. Similarly, the anode pattern AP is also electrically connected to the electrode bar 310 via the fixing screw 320. Therefore, when a drive current for the LED element 110 is supplied from the driver circuit connected to the pair of electrode bars 310, power is supplied to each LED element 110 via the anode pattern AP and the cathode pattern KP.

[0032] Thus, in this embodiment, the electrode member 300 serves both to fix the substrate 105 and supply power. Therefore, there is no need to provide a dedicated member for supplying power to the substrate 105, and the light irradiation device 1 (circuit board fixing structure 10) can be miniaturized. Also, even when it becomes necessary to replace the LED module 100, such as when the LED module 100 fails, the work only involves removing the fixing screw 320 and replacing the LED module 100 (that is, since there is no need to connect a dedicated member for supplying power to the LED module 100 or perform wiring, etc.), the LED module 100 can be replaced with a simple operation. In this embodiment, since the base end portion 330b of the insulating sleeve 330 of the electrode member 300 has a square tubular shape and fits into the through hole 222 of the heat dissipation fin 220, the electrode member 300 does not rotate in accordance with the rotation of the fixing screw 320. Also, since the protrusion 332 of the insulating sleeve 330 engages with the recess 224 of the heat dissipation fin 220 to restrict the movement of the electrode member 300 in the Z-axis direction, the attachment and detachment work of the fixing screw 320 can also be easily performed.

[0033] The above is the description of this embodiment, but the present invention is not limited to the above configuration, and various modifications are possible within the scope of the technical idea of the present invention.

[0034] For example, in this embodiment, the light irradiation device 1 has been described as including the circuit board fixing structure 10, but the use of the circuit board fixing structure 10 is not limited to this, and it can be applied to an apparatus having a configuration for supporting a circuit board on a base (for example, a heat sink, a base plate).

[0035] Also, the light irradiation device 1 of this embodiment has been described as including two LED modules 100, but it is not limited to this, and the number of LED modules 100 is appropriately set according to the specifications of the light irradiation device 1.

[0036] In addition, although the light irradiation device 1 of the present embodiment has been described as emitting ultraviolet light, it is not limited to such a configuration, and the present invention can also be applied to a light source device that emits visible light or infrared light.

[0037] (Second Embodiment) FIG. 4 is a diagram for explaining the schematic configuration of a light irradiation device 2 including a circuit board fixing structure 20 according to a second embodiment of the present invention. FIG. 4(a) is a front view, FIG. 4(b) is a cross-sectional view taken along line B-B of FIG. 4(a), and FIG. 4(c) is a cross-sectional view taken along line C-C of FIG. 4(a).

[0038] As shown in FIGS. 4(b) and 4(c), in the light irradiation device 2 of the present embodiment, the electrode member 300 is rotated by 90°, and the protruding portion 332 of the insulating sleeve 330 is arranged in a direction protruding in the X-axis direction and the direction opposite to the X-axis direction, which is different from the light irradiation device 1 of the first embodiment. Further, in the present embodiment, instead of the concave portion 224 of the heat dissipation fin 220, an opening 226 (accommodating portion) with which the protruding portion 332 engages is formed in two heat dissipation fins 220 sandwiching the notch 223 of the heat dissipation fin 220 in the X-axis direction, which is different from the light irradiation device 1 of the first embodiment.

[0039] Also in the present embodiment, since the base end portion 330b of the insulating sleeve 330 of the electrode member 300 has a square cylindrical shape and fits into the through hole 222 of the heat dissipation fin 220, the electrode member 300 does not rotate in accordance with the rotation of the fixing screw 320. Further, since the protruding portion 332 of the insulating sleeve 330 engages with the opening 226 of the heat dissipation fin 220 to restrict the movement of the electrode member 300 in the Z-axis direction, the attachment / detachment operation of the fixing screw 320 can be easily performed as in the first embodiment.

[0040] (Third Embodiment) FIG. 5 is a diagram for explaining the schematic configuration of a light irradiation device 3 including a circuit board fixing structure 30 according to a third embodiment of the present invention. FIG. 5(a) is a front view, FIG. 5(b) is a cross-sectional view taken along line D-D of FIG. 5(a), and FIG. 5(c) is an enlarged view of part E in FIG. 5(b).

[0041] As shown in FIGS. 5(b) and 5(c), in the light irradiation device 3 of the present embodiment, the tip portion 330a of the electrode member 300 is longer than that of the first embodiment, and a compression spring 340 (biasing member) is provided on the outer peripheral surface of the tip portion 330a of the insulating sleeve 330, which is different from the light irradiation device 1 of the first embodiment. More specifically, in a state where the compression spring 340 of the present embodiment is attached to the tip portion 330a of the electrode member 300 (that is, in a state where the compression spring 340 is wound around the tip portion 330a), the electrode member 300 is inserted into the through hole 211 of the heat sink 200. When the electrode member 300 is inserted into the through hole 211 of the heat sink 200, the protrusion 332 engages with the recess 224 of the heat radiation fin 220, and the movement of the electrode member 300 in the Z-axis direction is restricted. At this time, the tip side of the compression spring 340 abuts against the back surface of the base portion 210 of the heat sink 200, and the other end side abuts against the step portion 330c between the tip portion 330a and the base end portion 330b of the electrode member 300 and is compressed. Therefore, when the electrode member 300 of the present embodiment is attached to the through hole 211 of the heat sink 200, the electrode member 300 is biased in a direction opposite to the Z-axis direction by the biasing force of the compression spring 340 (that is, the electrode member 300 is biased away from the substrate 105). For this reason, even if there is a play in the Z-axis direction between the protrusion 332 and the recess 224, it is canceled. Further, when the LED module 100 is attached by the fixing screw 320, since the biasing force of the compression spring 340 also acts on the fixing screw 320, the LED module 100 is also biased in a direction opposite to the Z-axis direction (that is, toward the base portion 210 of the heat sink 200), and the LED module 100 is surely brought into close contact with the heat sink 200.

[0042] In the present embodiment as well, since the base end portion 330b of the insulating sleeve 330 of the electrode member 300 has a square cylindrical shape and fits into the through hole 222 of the heat radiation fin 220, the electrode member 300 does not rotate in accordance with the rotation of the fixing screw 320. Further, since the protrusion 332 of the insulating sleeve 330 engages with the recess 224 of the heat radiation fin 220 and the movement of the electrode member 300 in the Z-axis direction is restricted, the attachment and detachment operation of the fixing screw 320 can be easily performed as in the first embodiment.

[0043] (Fourth Embodiment) FIG. 6 is a diagram for explaining a schematic configuration of an optical irradiation device 4 including a circuit board fixing structure 40 according to a fourth embodiment of the present invention. FIG. 6(a) is a front view, FIG. 6(b) is a cross-sectional view taken along line F-F of FIG. 6(a), and FIG. 6(c) is an enlarged view of part G in FIG. 6(b).

[0044] As shown in FIG. 6, the optical irradiation device 4 of the present embodiment is different from the optical irradiation device 1 of the first embodiment in that a pair of substrate fixing members 400 (functional members) are arranged on the substrate 105 of each LED module 100 so as to sandwich the LED element 110 on the substrate 105 from the Y-axis direction. The substrate fixing member 400 is a metal rectangular plate-shaped member having a through hole 410 at a substantially central portion, and is arranged such that the through hole 410 communicates with the through hole 120 of the substrate 105, and is fastened together with the substrate 105 to the heat sink 200 by fixing screws 320 inserted through the through hole 410 and the through hole 120 (FIG. 6(c)). When each substrate fixing member 400 is fixed by the fixing screw 320, the substrate fixing member 400 is crimped onto the anode pattern AP, and the anode pattern AP and the electrode bar 310 of the anode terminal 300a are electrically connected via the substrate fixing member 400 and the fixing screw 320. Similarly, the substrate fixing member 400 is crimped onto the cathode pattern KP, and the cathode pattern KP and the electrode bar 310 of the cathode terminal 300b are electrically connected via the substrate fixing member 400 and the fixing screw 320. In the present embodiment, the opposing side surfaces (the side surfaces facing the LED element 110) of the pair of substrate fixing members 400 are tapered surfaces that are inclined so as to open in the Z-axis direction, and a reflection mirror 420 is formed on the surface thereof. Therefore, among the ultraviolet light emitted from the LED element 110, the component with a large divergence angle is incident on the reflection mirror 420, reflected, and guided forward (in the Z-axis direction). For this reason, the utilization efficiency of the ultraviolet light emitted from the LED element 110 is increased.

[0045] Also in this embodiment, when the LED module 100 needs to be replaced, since it only requires removing the fixing screw 320 and replacing the LED module 100, the LED module 100 can be replaced with a simple operation. In this embodiment, the substrate fixing member 400 also serves as the reflection mirror 420. However, as another embodiment, the substrate fixing member 400 may have other functions such as a lens holder function.

[0046] (Fifth Embodiment) FIG. 7 is a diagram for explaining the schematic configuration of the light irradiation device 5 including the circuit board fixing structure 50 according to the fifth embodiment of the present invention. FIG. 7(a) is a front view, FIG. 7(b) is a rear view, FIG. 7(c) is a cross-sectional view taken along the H-H line of FIG. 7(a), FIG. 7(d) is a cross-sectional view taken along the J-J line of FIG. 7(a), and FIG. 7(e) is a cross-sectional view taken along the K-K line of FIG. 7(d). Further, FIG. 8 is an exploded perspective view of the light irradiation device 5 in FIG. 7. FIG. 8(a) is a view seen from the obliquely front, and FIG. 8(b) is a view seen from the obliquely rear.

[0047] As shown in FIGS. 7 and 8, the light irradiation device 5 of this embodiment is different from the light irradiation device 1 of the first embodiment in that it includes a water-cooled heat sink 500 instead of the air-cooled heat sink 200, includes an electrode member 600 (anode terminal 600a and cathode terminal 600b) having a different shape from the electrode member 300 (anode terminal 300a and cathode terminal 300b), and includes a rear fixing plate 700.

[0048] The water-cooled heat sink 500 is a thin plate-shaped cooling device parallel to the X-Y plane that is arranged to be in close contact with the back surface of the substrate 105 of the LED module 100 and dissipates the heat generated by each LED element 110. Inside the water-cooled heat sink 500, a water channel 550 (flow path) that reciprocates in the X-axis direction is formed at a substantially central portion of the water-cooled heat sink 500 (Fig. 7(e)). A refrigerant (for example, water) is supplied from a water supply port 552 formed on the back surface of the water-cooled heat sink 500, flows through the water channel 550, and is discharged from a drain port 554. Further, a through hole 511 (second through hole) that penetrates vertically (in a direction opposite to the Z-axis direction) from the surface of the water-cooled heat sink 500 is formed in the water-cooled heat sink 500 so as to communicate with the through hole 120 of the substrate 105, and an electrode member 600 is accommodated in the through hole 511 (Figs. 7(c), (d), (e), Fig. 8). Note that the through hole 511 of the present embodiment has an elongated hole with a substantially oval cross section so as to fit with the electrode member 600.

[0049] As shown in Fig. 8, the electrode member 600 of the present embodiment is composed of an electrode rod 610, a fixing screw 620, and an insulating sleeve 630. The electrode rod 610 is a cylindrical metal member, and the insulating sleeve 630 is a resin member that houses the electrode rod 610. The insulating sleeve 630 has a main body portion 630b with an X-Y cross section in the shape of an oval having two flat portions 632 formed by cutting a cylinder in two X-Z planes, and a cylindrical tip portion 630a that protrudes forward (in the Z-axis direction) from the main body portion 630b. The insulating sleeve 630 is adapted to fit into the through hole 511 formed in the water-cooled heat sink 500, and the electrode rod 610 is inserted and fixed into the insulating sleeve 630 (that is, the insulating sleeve 630 is attached to the outer peripheral surface of the electrode rod 610) and then inserted into the through hole 511 of the water-cooled heat sink 500 (Figs. 7(c), (d), Fig. 8). In the present embodiment, when the electrode member 600 is inserted until the tip portion 630a of the insulating sleeve 630 abuts against the tip of the through hole 511 formed in the water-cooled heat sink 500, the electrode member 600 is completely accommodated in the through hole 511 (Figs. 7(c), (d)).

[0050] The back fixing plate 700 is a plate-like member made of resin or metal, which is fixed to the back of the water-cooled heat sink 500 with screws (not shown) or by adhesion or the like. The back fixing plate 700 has a circular opening 710 that is slightly larger than the outer diameter of the electrode bar 610, and is fixed so that the electrode bar 610 is exposed from the opening 710. When the back fixing plate 700 is fixed to the water-cooled heat sink 500, it is configured to abut against the main body portion 630b of the insulating sleeve 630 (that is, the movement of the electrode member 600 in the Z-axis direction is restricted by the back fixing plate 700), so that the electrode member 600 does not fall off from the water-cooled heat sink 500 (FIGS. 7(c) and (d)).

[0051] As described above, the light irradiation device 5 of the present embodiment is assembled with the electrode member 600 attached to the through hole 511. That is, a water-cooled heat sink 500 with the electrode member 600 attached to the through hole 511 is prepared, heat dissipation grease is applied to the surface (mounting surface) of the water-cooled heat sink 500, and each LED module 100 is placed thereon. Then, alignment is performed so that the through hole 120 of the substrate 105 is located above the electrode rod 610 (on the Z-axis direction side), that is, so that the through hole 120 communicates with the through hole 511, and a fixing screw 620 is attached to the through hole 120. When the fixing screw 620 is attached to the through hole 120, the screw portion 621 of the fixing screw 620 is screwed into a screw hole portion (not shown) formed on the inner peripheral surface of the electrode rod 610, and the LED module 100 is clamped and fixed between the head of the fixing screw 620 and the water-cooled heat sink 500. As described above, in the present embodiment, since the main body portion 630b of the insulating sleeve 630 of the electrode member 600 has a cross-sectional oval shape and fits into the through hole 511, the electrode member 600 does not rotate even when the fixing screw 620 is rotated, and the fixing screw 620 can be easily attached and detached. When the LED module 100 is fixed by the fixing screw 620, the cathode pattern KP is electrically connected to the electrode rod 610 (cathode terminal 600b) via the fixing screw 620. Similarly, the anode pattern AP is also electrically connected to the electrode rod 610 (anode terminal 600a) via the fixing screw 620. Therefore, when a drive current for the LED element 110 is supplied from a driver circuit connected to the pair of electrode rods 610, power is supplied to each LED element 110 via the anode pattern AP and the cathode pattern KP.

[0052] Thus, also in this embodiment, the electrode member 600 serves both to fix the substrate 105 and supply power. Therefore, there is no need to provide a dedicated member for supplying power to the substrate 105, and the light irradiation device 5 (circuit board fixing structure 50) can be downsized. Also, when it becomes necessary to replace the LED module 100, such as when the LED module 100 fails, it only requires the operation of removing the fixing screw 620 and replacing the LED module 100 (that is, since there is no need to connect a dedicated member for supplying power to the LED module 100 or perform wiring, etc.), the LED module 100 can be replaced with a simple operation. In this embodiment as well, the electrode member 600 does not rotate in accordance with the rotation of the fixing screw 620, and also, the movement of the electrode member 600 in the Z-axis direction is restricted by the back surface fixing plate 700, so the attachment / detachment operation of the fixing screw 620 can also be easily performed.

[0053] (Sixth Embodiment) FIG. 9 is a diagram for explaining the schematic configuration of a light irradiation device 6 including a circuit board fixing structure 60 according to the sixth embodiment of the present invention. FIG. 9(a) is a front view, FIG. 9(b) is a rear view, FIG. 9(c) is a cross-sectional view taken along line L-L of FIG. 9(a), FIG. 9(d) is a cross-sectional view taken along line M-M of FIG. 9(a), and FIG. 9(e) is a cross-sectional view taken along line N-N of FIG. 9(d).

[0054] As shown in FIGS. 9(b), (c), (d), and (e), in the light irradiation device 6 of this embodiment, the insulating sleeve 630 has a rectangular tube-shaped rear end portion 630c that protrudes rearward (in a direction opposite to the Z-axis direction) from the base end surface (the surface opposite to the tip end portion 630a) of the main body portion 630b, the main body portion 630b of the insulating sleeve 630 has a cylindrical shape, the opening 710 of the back surface fixing plate 700 has a rectangular shape, and the rear end portion 630c is fitted into the opening 710, which is different from the light irradiation device 5 of the fifth embodiment.

[0055] Thus, in this embodiment, since the rear end portion 630c of the insulating sleeve 630 of the electrode member 600 has a square tubular shape and is fitted into the opening 710 of the rear surface fixing plate 700, the electrode member 600 does not rotate in accordance with the rotation of the fixing screw 620. Further, since a part of the base end surface of the main body portion 630b of the insulating sleeve 630 (the portion outside the rear end portion 630c) abuts against the rear surface fixing plate 700 and the movement of the electrode member 600 in the Z-axis direction is restricted (FIGS. 9(c) and (d)), similar to the fifth embodiment, the attaching and detaching operation of the fixing screw 620 can be easily performed.

[0056] (Seventh Embodiment) FIG. 10 is a diagram for explaining the schematic configuration of the light irradiation device 7 including the circuit board fixing structure 70 according to the seventh embodiment of the present invention. FIG. 10(a) is a front view, FIG. 10(b) is a cross-sectional view taken along the line O-O of FIG. 10(a), and FIG. 10(c) is a cross-sectional view taken along the line P-P of FIG. 10(b).

[0057] As shown in FIG. 10(c), in the light irradiation device 7 of this embodiment, the cross-sectional shape of the through hole 511 of the water-cooled heat sink 500 is substantially rectangular, which is different from the light irradiation device 5 of the fifth embodiment.

[0058] Thus, also in this embodiment, since the main body portion 630b of the insulating sleeve 630 of the electrode member 600 has a cross-sectional oval shape and is fitted into the through hole 511, the electrode member 600 does not rotate in accordance with the rotation of the fixing screw 620. Further, since the base end surface of the insulating sleeve 630 abuts against the rear surface fixing plate 700 and the movement of the electrode member 600 in the Z-axis direction is restricted (FIG. 10(b)), the attaching and detaching operation of the fixing screw 620 can also be easily performed.

[0059] (Eighth Embodiment) FIG. 11 is a diagram for explaining the schematic configuration of the light irradiation device 8 including the circuit board fixing structure 80 according to the eighth embodiment of the present invention. FIG. 11(a) is a front view, and FIG. 11(b) is a cross-sectional view taken along the line Q-Q of FIG. 11(a).

[0060] As shown in FIG. 11, the light irradiation device 8 of the present embodiment is different from the light irradiation device 5 of the fifth embodiment in that it includes a pair of substrate fixing members 400 disposed on the substrate 105 of each LED module 100 so as to sandwich the LED element 110 on the substrate 105 from the Y-axis direction. The substrate fixing member 400 is a metal rectangular plate-shaped member having a through hole 410 in a substantially central portion, and is arranged such that the through hole 410 communicates with the through hole 120 of the substrate 105, and is fastened together with the substrate 105 to the water-cooled heat sink 500 by fixing screws 620 inserted through the through hole 410 and the through hole 120 (FIG. 11(b)). When each substrate fixing member 400 is fixed by the fixing screw 620, the substrate fixing member 400 is crimped onto the anode pattern AP (not shown in FIG. 11), and the anode pattern AP and the electrode bar 610 of the anode terminal 600a are electrically connected through the substrate fixing member 400 and the fixing screw 620. Similarly, the substrate fixing member 400 is crimped onto the cathode pattern KP (not shown in FIG. 11), and the cathode pattern KP and the electrode bar 610 of the cathode terminal 600b are electrically connected through the substrate fixing member 400 and the fixing screw 620. In the present embodiment, the opposing side surfaces (the side surfaces facing the LED element 110) of the pair of substrate fixing members 400 are tapered surfaces that are inclined so as to open in the Z-axis direction, and a reflection mirror 420 is formed on the surface thereof. Therefore, among the ultraviolet light emitted from the LED element 110, the component with a large divergence angle is incident on the reflection mirror 420, reflected, and guided forward (in the Z-axis direction). For this reason, the utilization efficiency of the ultraviolet light emitted from the LED element 110 is improved.

[0061] Thus, also in the present embodiment, when it becomes necessary to replace the LED module 100, since it is only necessary to remove the fixing screw 620 and replace the LED module 100, the LED module 100 can be replaced with a simple operation.

[0062] It should be noted that the embodiments disclosed this time are illustrative in all respects and should not be considered restrictive. The scope of the present invention is shown not by the above description but by the scope of claims, and it is intended that all modifications within the meaning and scope equivalent to the scope of claims be included.

Explanation of Reference Numerals

[0063] 1: Light irradiation device 2: Light irradiation device 3: Light irradiation device 4: Light irradiation device 5: Light irradiation device 6: Light irradiation device 7: Light irradiation device 8: Light irradiation device 10: Circuit board fixing structure 20: Circuit board fixing structure 30: Circuit board fixing structure 40: Circuit board fixing structure 50: Circuit board fixing structure 60: Circuit board fixing structure 70: Circuit board fixing structure 80: Circuit board fixing structure 100: LED module 105: Substrate 110: LED element 120: Through hole 200: Heat sink 210: Base portion 211: Through hole 212: Through hole 220: Heat dissipation fin 222: Through hole 223: Notch 224: Recess 226: Opening 300: Electrode member 300a: Anode terminal 300b: Cathode terminal 310: Electrode rod 310a: Threaded hole portion 320: Fixing screw 321: Thread portion 330: Insulating Sleeve 330a: Tip 330b: Base End 330c: Step 332: Protrusion 340: Compression Spring 400: Substrate Fixing Member 410: Through-Hole 420: Reflective Mirror 500: Water-Cooled Heat Sink 511: Through-Hole 550: Water Path 552: Water Inlet 554: Drain Outlet 600: Electrode Member 600a: Anode Terminal 600b: Cathode Terminal 610: Electrode Rod 620: Fixing Screw 621: Threaded Portion 630: Insulating Sleeve 630a: Tip 630b: Body 630c: Rear End 632: Flat Surface 700: Rear Surface Fixing Plate 710: Opening

Claims

1. A circuit board fixing structure for fixing a circuit board to the surface of a base, a positive electrode pattern and a negative electrode pattern formed on the surface of the circuit board, a pair of first through holes vertically penetrating the circuit board from each of the positive electrode pattern and the negative electrode pattern, a pair of second through holes vertically penetrating the base from the surface of the base so as to communicate with each of the first through holes, a pair of electrode members inserted into each of the second through holes, a pair of fixing members attached to the surface side of the circuit board and engaging with each of the electrode members to fix the circuit board to the base, comprising: each of the electrode members, an electrode terminal extending along the second through hole, and a rotation restricting member for restricting rotation of each of the electrode members with respect to the second through hole, when each of the fixing members and each of the electrode members are engaged, each of the positive electrode pattern and the negative electrode pattern is electrically connected to each of the electrode terminals through each of the fixing members, the circuit board fixing structure is disposed on the back surface side of the base, has an opening through which the electrode terminal penetrates, and further includes a fixing plate that abuts against one end surface of the rotation restricting member A circuit board fixing structure characterized by the above.

2. A circuit board fixing structure for fixing a circuit board to the surface of a base, a positive electrode pattern and a negative electrode pattern formed on the surface of the circuit board, a pair of first through holes vertically penetrating the circuit board from each of the positive electrode pattern and the negative electrode pattern, a pair of second through holes vertically penetrating the base from the surface of the base so as to communicate with each of the first through holes, a pair of electrode members inserted into each of the second through holes, a pair of fixing members attached to the surface side of the circuit board and engaging with each of the electrode members to fix the circuit board to the base, comprising: each of the electrode members, an electrode terminal extending along the second through hole, and a rotation restricting member for restricting rotation of each of the electrode members with respect to the second through hole, when each of the fixing members and each of the electrode members are engaged, each of the positive electrode pattern and the negative electrode pattern is electrically connected to each of the electrode terminals through each of the fixing members, the circuit board fixing structure is disposed on the back surface side of the base, penetrates the electrode terminal, and further includes a fixing plate having an opening that fits with a part of the rotation restricting member A circuit board fixing structure characterized by the above.

3. A circuit board fixing structure for fixing a circuit board to the surface of a base, The positive electrode pattern and the negative electrode pattern formed on the surface of the circuit board, A pair of first through holes that vertically penetrate the circuit board from each of the positive electrode pattern and the negative electrode pattern, A pair of second through holes that vertically penetrate the base from the surface of the base so as to communicate with each of the first through holes, A pair of electrode members inserted into each of the second through holes, A pair of fixing members attached to the surface side of the circuit board and engaged with each of the electrode members to fix the circuit board to the base, Comprising, Each of the electrode members, An electrode terminal extending along the second through hole, A rotation restricting member that restricts rotation of each of the electrode members with respect to the second through hole, When each of the fixing members and each of the electrode members are engaged, each of the positive electrode pattern and the negative electrode pattern is electrically connected to each of the electrode terminals via each of the fixing members, Each of the electrode members has a biasing member that biases the electrode members away from the circuit board A circuit board fixing structure characterized by the above.

4. A circuit board fixing structure for fixing a circuit board to the surface of a base, The positive electrode pattern and the negative electrode pattern formed on the surface of the circuit board, A pair of first through holes that vertically penetrate the circuit board from each of the positive electrode pattern and the negative electrode pattern, A pair of second through holes that vertically penetrate the base from the surface of the base so as to communicate with each of the first through holes, A pair of electrode members inserted into each of the second through holes, A pair of fixing members attached to the surface side of the circuit board and engaged with each of the electrode members to fix the circuit board to the base, Comprising, Each of the electrode members, An electrode terminal extending along the second through hole, A rotation restricting member that restricts rotation of each of the electrode members with respect to the second through hole, When each of the fixing members and each of the electrode members are engaged, each of the positive electrode pattern and the negative electrode pattern is electrically connected to each of the electrode terminals via each of the fixing members, The base, Has a mounting surface for the circuit board on the surface, a plate-shaped base portion substantially parallel to the circuit board, A plurality of heat dissipation fins that stand substantially vertically from the back surface of the base portion and extend parallel to each other, Each of the second through holes, A third through hole that penetrates the base portion, Composed of a fourth through hole formed by notching a part of the plurality of heat dissipation fins in a direction perpendicular to the base so as to communicate with the third through hole A circuit board fixing structure characterized by the following.

5. The rotation restricting member is arranged to cover the outer periphery of the electrode terminal, At least a part of the outer shape of the rotation restricting member has a flat portion parallel to the central axis of the second through hole, and the circuit board fixing structure according to any one of Claims 1 to 4, characterized in that the flat portion engages with the second through hole.

6. The rotation restricting member is arranged to cover the outer periphery of the electrode terminal, At least a part of the outer shape of the rotation restricting member has a protruding portion protruding in a direction perpendicular to the central axis of the second through hole, The second through hole has a receiving portion for receiving the protruding portion A circuit board fixing structure according to any one of Claims 1 to 5, characterized by the above.

7. The base has a flow path inside which refrigerant flows, and the circuit board fixing structure according to any one of Claims 1 to 6, characterized by the above.

8. The circuit board fixing structure according to any one of Claims 1 to 7, A plurality of light emitting elements arranged on the circuit board and supplied with power from the positive electrode pattern and the negative electrode pattern, An optical irradiation device characterized by comprising the above.

9. The optical irradiation device according to Claim 8, further comprising a pair of functional members respectively arranged on the positive electrode pattern and the negative electrode pattern and clamped together with the circuit board by the respective fixing members.

10. The optical irradiation device according to Claim 9, characterized in that the pair of functional members has a mirror surface for reflecting a part of the light emitted from the plurality of light emitting elements.

11. The optical irradiation device according to any one of Claims 8 to 10, characterized in that the light emitted from the light emitting element is light having a wavelength in the ultraviolet region.

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