Planar optical device coated with a transition metal dichalcogenide having a silicon-containing optical device structure

Abstract

The embodiments described herein relate to a planar optical device having a coating layer including one or more monolayers selected from the group consisting of molybdenum disulfide (MoS2), tungsten disulfide (WS2), tungsten diselenide (WSe2), molybdenum diselenide (MoSe2), molybdenum ditelluride (MoTe2), titanium disulfide (TiS2), zirconium disulfide (ZrS2), zirconium diselenide (ZrSe2), hafnium disulfide (HfS2), platinum disulfide (PtS2), tin disulfide (SnS2), or combinations thereof. The coating layer is disposed over a plurality of optical device structures of the optical device. The monolayers may alternate between materials forming the coating layer or may be a uniform coating layer of a single material. The coating layer is disposed over each optical device structure of the plurality of optical device structures.

Description

[Technical field]

[0001]

[0001] The embodiments of the present disclosure generally relate to flat optical devices. In particular, the embodiments described herein relate to flat optical devices having a coating layer comprising one or more monolayers selected from the group consisting of molybdenum disulfide (MoS2), tungsten disulfide (WS2), tungsten diselenide (WSe2), molybdenum diselenide (MoSe2), molybdenum ditelluride (MoTe2), titanium disulfide (TiS2), zirconium disulfide (ZrS2), zirconium diselenide (ZrSe2), hafnium disulfide (HfS2), platinum disulfide (PtS2), tin disulfide (SnS2), or combinations thereof. [Background technology]

[0002]

[0002] Planar optical devices include arrangements of optical device structures with in-plane dimensions smaller than half the design wavelength of light and out-of-plane dimensions on the order of the design wavelength or larger. For example, the optical device structures may have submicron dimensions, e.g., nano-sized dimensions. Planar optical devices, such as metasurfaces, may be composed of a single layer or multiple layers of optical device structures.

[0003]

[0003] Coatings on optical device structures enable light absorption and refraction. For example, semiconductor materials such as germanium (Ge) can absorb and refract light. However, these materials are difficult to integrate with optical device structures in planar optical devices due to poor etch selectivity and cross contamination. Also, other materials such as graphene do not have a band gap and light absorption capabilities are affected by changes in the Fermi energy level. Therefore, there is a need in the art for improved optical device structures and coatings therefor. Summary of the Invention

[0004] In one embodiment, a device is provided. The device includes a planar optical device. The planar optical device is operable to focus light incident on the planar optical device. The planar optical device includes a plurality of optical device structures disposed in or on a top surface of a substrate. The planar optical device further includes a coating layer disposed on each optical device structure of the plurality of optical device structures. The coating layer includes one or more monolayers. Each monolayer of the one or more monolayers has a composition selected from the group consisting of molybdenum disulfide (MoS2), tungsten disulfide (WS2), tungsten diselenide (WSe2), molybdenum diselenide (MoSe2), molybdenum ditelluride (MoTe2), titanium disulfide (TiS2), zirconium disulfide (ZrS2), zirconium diselenide (ZrSe2), hafnium disulfide (HfS2), platinum disulfide (PtS2), tin disulfide (SnS2), or combinations thereof.

[0005] In another embodiment, a device is provided. The device includes a planar optical device. The planar optical device is operable to focus light incident on the planar optical device. The planar optical device is a metasurface. The planar optical device includes a plurality of optical device structures disposed in or on a top surface of a substrate. The plurality of optical device structures have a critical dimension of less than 1 micron. The planar optical device further includes a coating layer disposed on each optical device structure of the plurality of optical device structures. The coating layer includes one or more monolayers. Each monolayer of the one or more monolayers has a composition selected from the group consisting of molybdenum disulfide (MoS2), tungsten disulfide (WS2), tungsten diselenide (WSe2), molybdenum diselenide (MoSe2), molybdenum ditelluride (MoTe2), titanium disulfide (TiS2), zirconium disulfide (ZrS2), zirconium diselenide (ZrSe2), hafnium disulfide (HfS2), platinum disulfide (PtS2), tin disulfide (SnS2), or combinations thereof.

[0006]

[0006] In another embodiment, a device is provided. The device includes a camera. The device includes a planar optical device. The planar optical device is operable to focus light incident on the planar optical device onto the camera. The planar optical device is a metasurface. The planar optical device includes a plurality of optical device structures disposed in or on a top surface of a substrate. The planar optical device further includes a coating layer disposed on each optical device structure of the plurality of optical device structures. The coating layer includes one or more monolayers. Each monolayer of the one or more monolayers has a composition selected from the group consisting of molybdenum disulfide (MoS2), tungsten disulfide (WS2), tungsten diselenide (WSe2), molybdenum diselenide (MoSe2), molybdenum ditelluride (MoTe2), titanium disulfide (TiS2), zirconium disulfide (ZrS2), zirconium diselenide (ZrSe2), hafnium disulfide (HfS2), platinum disulfide (PtS2), tin disulfide (SnS2), or combinations thereof.

[0007]

[0007] In order to allow the above-mentioned features of the present disclosure to be understood in detail, the present disclosure briefly summarized above will now be more particularly described with reference to embodiments, some of which are illustrated in the accompanying drawings. It should be noted, however, that the accompanying drawings only show exemplary embodiments, and therefore should not be considered as limiting the scope of the present disclosure, and other equally effective embodiments may be acceptable. [Brief description of the drawings]

[0008] [Figure 1A]

[0008] FIG. 1 is a schematic front view of a device according to several embodiments. [Figure 1B]

[0009] 1 is a schematic top view of a planar optical device having one or more optical device structures according to several embodiments. [Figure 1C]

[0010] 1 is a schematic cross-sectional view of a planar optical device having one or more optical device structures according to several embodiments. [Figure 2A]

[0011] 2A-2E are schematic perspective views of unit cells of a planar optical device having coating layers disposed thereon, according to several embodiments. [Figure 2B] 2A-2E are schematic perspective views of unit cells of a planar optical device having coating layers disposed thereon, according to several embodiments. [Figure 2C] 2A-2E are schematic perspective views of unit cells of a planar optical device having coating layers disposed thereon, according to several embodiments. [Figure 2D] 2A-2E are schematic perspective views of unit cells of a planar optical device having coating layers disposed thereon, according to several embodiments. [Figure 2E] 2A-2E are schematic perspective views of unit cells of a planar optical device having coating layers disposed thereon, according to several embodiments. [Diagram 3]

[0012] 1 is a schematic cross-sectional view of a coating layer according to several embodiments. [Figure 4]

[0013] FIG. 2B is a flow diagram of a method for forming a planar optical device having one or more unit cells, such as those shown in FIGS. 2A-2E, according to several embodiments. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009]

[0014] For ease of understanding, the same reference numbers have been used, where possible, to designate identical elements common to the figures. It is believed that elements and features of one embodiment may be beneficially incorporated in other embodiments without additional recitation.

[0010]

[0015] SUMMARY OF THE DISCLOSURE Embodiments of the present disclosure generally relate to planar optical devices. In particular, embodiments described herein relate to planar optical devices having a coating layer comprising one or more monolayers selected from the group consisting of molybdenum disulfide (MoS2), tungsten disulfide (WS2), tungsten diselenide (WSe2), molybdenum diselenide (MoSe2), molybdenum ditelluride (MoTe2), titanium disulfide (TiS2), zirconium disulfide (ZrS2), zirconium diselenide (ZrSe2), hafnium disulfide (HfS2), platinum disulfide (PtS2), tin disulfide (SnS2), or combinations thereof. In one embodiment, a planar optical device is provided. The planar optical device comprises a plurality of optical device structures disposed in or on a top surface of a substrate. The planar optical device further comprises a coating layer disposed on each optical device structure of the plurality of optical device structures. The coating layer comprises one or more monolayers.

[0011]

[0016] FIG. 1A is a schematic front view of a device 105 according to several embodiments. The device 105 may be a mobile phone (e.g., a smartphone). In this embodiment, the device 105 includes a front camera 101, a speaker 109, and a display 107. The front camera 101 includes a planar optical device 100. In one embodiment, which may be combined with other embodiments described herein, the optical device 100 is a metasurface. The planar optical device 100 of the front camera 101 is configured to operate as a biometric or facial recognition sensor. The planar optical device 100 includes a number of optical device structures (shown in FIG. 1B and FIG. 1C) operable to focus light incident on the planar optical device 100 to the front camera 101.

[0012]

[0017] 1B is a schematic top view and FIG. 1C is a schematic cross-sectional view of a portion 115 of a planar optical device 100 having one or more optical device structures 102 according to embodiments described herein. In one embodiment, which may be combined with other embodiments described herein, the planar optical device 100 is a planar optical device such as a metasurface.

[0013]

[0018] The embodiments described herein provide a planar optical device 100 including a plurality of optical device structures 102 disposed in or on a top surface 103 of a substrate 104. The plurality of optical device structures 102 are nanostructures having submicron dimensions, e.g., nano-sized dimensions. The plurality of optical device structures 102 include sidewalls 112 and a top surface 114. The plurality of optical device structures 102 have a critical dimension 106, e.g., one of a width or a diameter of the optical device structure 102. In one embodiment that may be combined with other embodiments described herein, the critical dimension 106 is less than 1 micrometer (μm) and corresponds to a width or a diameter of the optical device structure 102 depending on a cross-section of the optical device structure 102. In another embodiment that may be combined with other embodiments described herein, the critical dimension 106 is about 100 nanometers (nm) to about 1000 (nm).

[0014]

[0019] 1B and 1C depict the optical device structure 102 as having a circular cross section, the cross section of the optical device structure 102 may have other shapes, including, but not limited to, a rectangular, triangular, elliptical, regular polygonal, irregular polygonal, or irregularly shaped cross section. In some embodiments that may be combined with other embodiments described herein, the cross sections of the optical device structure 102 of the planar optical device 100 have cross sections of different shapes. In other embodiments that may be combined with other embodiments described herein, the cross sections of the optical device structure 102 of the planar optical device 100 have cross sections of substantially the same shape. In some embodiments that may be combined with other embodiments described herein, at least one of the critical dimensions 106 of the optical device structure 102 may be different from the other critical dimensions 106 of the optical device structure 102. In other embodiments that may be combined with other embodiments described herein, the critical dimensions 106 of the optical device structure 102 are the same.

[0015]

[0020] Gaps 108 are disposed between each of the optical device structures 102. In some embodiments, which may be combined with other embodiments described herein, one or more of the gaps 108 surrounding an optical device structure 102 are equal or substantially equal to one or more other gaps 108 surrounding another optical device structure 102. In some embodiments, which may be combined with other embodiments described herein, one or more of the gaps 108 surrounding an optical device structure 102 are different from one or more other gaps 108 surrounding another optical device structure 102.

[0016]

[0021] The substrate 104 may be formed of any suitable material, provided that the substrate 104 can adequately transmit light of the desired wavelength or range of wavelengths and can act as a suitable support for the planar optical device 100 described herein. The choice of substrate may include any suitable material substrate, including, but not limited to, amorphous dielectric, non-amorphous dielectric, crystalline dielectric, silicon oxide, polymer, and combinations thereof. In some embodiments that may be combined with other embodiments described herein, the substrate 104 includes a transparent material. Suitable examples may include oxides, sulfides, phosphides, tellurides, or combinations thereof. In one example, the substrate 104 includes a high-index transparent material, such as silicon (Si), silicon dioxide (SiO2), germanium (Ge), silicon germanium (SiGe), InP, GaAs, GaN, fused silica, quartz, sapphire, and high-index glass.

[0017]

[0022] In an embodiment that may be combined with other embodiments described herein, the material of the optical device structure 102 includes a non-conductive material, such as a dielectric material. The dielectric material may include amorphous dielectrics and crystalline dielectrics. Examples of dielectric materials include, but are not limited to, silicon-containing materials, such as silicon (Si), silicon nitride (Si3N4), silicon oxynitride, and silicon dioxide (SiO2). In an embodiment that may be combined with other embodiments described herein, the optical device structure 102 may be formed by nanoimprint lithography (NIL). The optical device structure 102 including the silicon-containing material is transparent.

[0018]

[0023] A coating layer 116 is disposed over the plurality of optical device structures 102. In an embodiment, which may be combined with other embodiments described herein, the coating layer 116 is conformal to the plurality of optical device structures 102. In another embodiment, which may be combined with other embodiments described herein, the coating layer 116 is not conformal to the plurality of optical device structures 102. The coating layer 116 includes a layer thickness 118. The layer thickness 118 is between about 0.5 nm and about 75 nm. For example, the layer thickness 118 is between about 5.5 nm and about 70 nm, between about 10.5 nm and about 65 nm, between about 15.5 nm and about 60 nm, between about 20.5 nm and about 55 nm, between about 25.5 nm and about 50 nm, between about 30.5 nm and about 45 nm, and between about 35.5 nm and about 40 nm. The coating layer 116 improves the photon emission efficiency and therefore reduces the critical dimension 106 and thickness of the planar optical device 100. This helps to reduce the physical footprint of the planar optical device 100. The photon emission efficiency is improved due to the coating layer 116 having multiple high indirect band gaps. Multiple high indirect band gaps allow for light absorption capabilities that are not affected by changes in the Fermi energy level.

[0019]

[0024] The coating layer 116 includes a series of monolayers 306 as shown in FIG. 3. The series of monolayers 306 is a plurality of transition metal dichalcogenide (TMD) monolayers. The coating layer 116 has a composition selected from the group consisting of molybdenum disulfide (MoS2), tungsten disulfide (WS2), tungsten diselenide (WSe2), molybdenum diselenide (MoSe2), molybdenum ditelluride (MoTe2), titanium disulfide (TiS2), zirconium disulfide (ZrS2), zirconium diselenide (ZrSe2), hafnium disulfide (HfS2), platinum disulfide (PtS2), tin disulfide (SnS2), or combinations thereof. The coating layer 116 has one of a single crystal lattice, a polycrystalline lattice, or an amorphous lattice. The single crystal lattice, polycrystalline lattice, or amorphous lattice may be provided by one or more of chemical vapor deposition (CVD), flowable CVD (FCVD), physical vapor deposition (PVD), atomic layer deposition (ALD), multiple beam epitaxy (MBE), ion beam assisted deposition (IBAD), epitaxy, spin-on glass (SoG), ion beam deposition (IBD), or spin-on-coat (SoC) processes.

[0020]

[0025] 1C, a light beam 110 is incident on the planar optical device 100. The gaps 108 between each adjacent optical device structure 102 allow the light beam 110 to propagate through the substrate 104, the gaps 108, and the optical device structure 102 because the substrate 104, the gaps 108, and the optical device structure 102 are transparent. The substrate 104, the gaps 108, and the optical device structure 102 refract the light beam 110, changing the speed at which the light beam 110 travels as well as the direction in which the light beam 110 travels.

[0021]

[0026] 2A-2E are schematic perspective views of configurations 201A-201E of unit cells 201 of a planar optical device 100. In one embodiment, which may be combined with other embodiments described herein, the unit cells 201 may correspond to a portion or the entire surface of the substrate 104 of the planar optical device 100.

[0022]

[0027] Each of the configurations 201A-201E of the unit cell 201 may include a capping layer 202 disposed on the coating layer 116. The capping layer 202 includes at least one of aluminum oxide (Al2O3), titanium oxide (TiO), tantalum oxide (TaO), silicon nitride (Si3N4), silicon dioxide (SiO2), titanium nitride (TiN), titanium dioxide (TiO2), silicon oxycarbide (SiOC), silicon carbide (SiC), or a combination thereof. The capping layer 202 may also include a low-k, very low-k, and ultra-low-k dielectric material, such as SiCONH, SiCOH, or a combination thereof. The capping layer 202 has a capping layer thickness 204. The capping layer thickness 204 is between about 1 nm and about 60 nm. For example, the capping layer thickness 204 is between about 5 nm and about 55 nm, between about 10 nm and about 55 nm, between about 15 nm and about 50 nm, between about 20 nm and about 45 nm, between about 25 nm and about 40 nm, and between about 30 nm and about 35 nm. The capping layer 202 protects the coating layer 116 from corrosion or degradation during the patterning process and / or during use of the planar optical device 100. Furthermore, the capping layer 202 confines the coating layer 116 to the optical device structure 102. The capping layer 202 may act as an etch stop layer during the patterning process. Furthermore, the capping layer 202 aids in patterning endpoint detection during patterning of the optical device structure 102.

[0023]

[0028] 2A , the first configuration 201A of the unit cell 201 has a coating layer 116 disposed on the upper surface 103 of the substrate 104, the sidewalls 112 of the plurality of optical device structures 102, and the top surfaces 114 of the plurality of optical device structures 102. A capping layer 202 is disposed on the coating layer 116.

[0024]

[0029] As shown in FIG. 2B, the second configuration 201B of the unit cell 201 has a coating layer 116 disposed on the sidewalls 112 of the plurality of optical device structures 102 and the top surface 114 of the plurality of optical device structures 102. A capping layer 202 is disposed on the sidewalls 112 of the plurality of optical device structures 102 and the top surface 114 of the plurality of optical device structures 102. The top surface 103 of the substrate 104 is exposed. In an embodiment that may be combined with other embodiments described herein, the coating layer 116 and the capping layer 202 may be selectively deposited on the sidewalls 112 of the plurality of optical device structures 102 and the top surface 114 of the plurality of optical device structures 102. In another embodiment that may be combined with other embodiments described herein, the coating layer 116 and the capping layer 202 disposed on the top surface 103 of the substrate 104 may be etched.

[0025]

[0030] As shown in FIG. 2C, the third configuration 201C of the unit cell 201 has a coating layer 116 disposed on the sidewalls 112 of the plurality of optical device structures 102. A capping layer 202 is disposed on the sidewalls 112 of the plurality of optical device structures 102. The upper surface 103 of the substrate 104 is exposed. The top surface 114 of each optical device structure 102 of the plurality of optical device structures 102 is exposed. In an embodiment that may be combined with other embodiments described herein, the coating layer 116 and the capping layer 202 may be selectively deposited on the sidewalls 112 of the plurality of optical device structures 102. In another embodiment that may be combined with other embodiments described herein, the coating layer 116 and the capping layer 202 disposed on the upper surface 103 of the substrate 104 and the top surface 114 of the plurality of optical device structures 102 may be etched.

[0026]

[0031] 2D, the fourth configuration 201D of the unit cell 201 has a coating layer 116 disposed on the sidewalls 112 of the plurality of optical device structures 102 and the top surface 103 of the substrate 104. A capping layer 202 is disposed on the sidewalls 112 of the plurality of optical device structures 102 and the top surface 103 of the substrate 104. A top surface 114 of each optical device structure 102 of the plurality of optical device structures 102 is exposed. In an embodiment that may be combined with other embodiments described herein, the coating layer 116 and the capping layer 202 may be selectively deposited on the sidewalls 112 of the plurality of optical device structures 102 and the top surface 103 of the substrate 104. In another embodiment that may be combined with other embodiments described herein, the coating layer 116 and the capping layer 202 disposed on the top surface 114 of the plurality of optical device structures 102 may be etched.

[0027]

[0032] As shown in FIG. 2E, the fifth configuration 201E of the unit cell 201 has a coating layer 116 disposed on the top surface 114 of each optical device structure 102 of the plurality of optical device structures 102. A capping layer 202 is disposed on the top surface 114 of each optical device structure 102 of the plurality of optical device structures 102. A sidewall 112 of each optical device structure 102 of the plurality of optical device structures 102 is exposed. A top surface 103 of the substrate 104 is exposed. In an embodiment that may be combined with other embodiments described herein, the coating layer 116 and the capping layer 202 may be selectively deposited on the top surface 114 of each optical device structure 102 of the plurality of optical device structures 102. In another embodiment that may be combined with other embodiments described herein, the coating layer 116 and the capping layer 202 disposed on the sidewall 112 of the plurality of optical device structures 102 and the top surface 103 of the substrate 104 may be etched.

[0028]

[0033] Each of the configurations 201A-201E of the unit cell 201 may include a coating layer 116 and a capping layer 202 selectively disposed on the sidewalls 112 of the plurality of optical device structures 102 and the top surfaces 114 of the plurality of optical device structures 102. To form the configurations 201A-201E, one or more conformal layers of the coating layer 116 and the capping layer 202 are deposited. One or more additional layers of the coating layer 116 and the capping layer 202 are deposited after patterning the optical device structures 102. The coating layer 116 and the capping layer 202 are then selectively etched to form the configurations 201A-201E.

[0029]

[0034] 3 is a schematic cross-sectional view of a coating layer 116. The coating 116 is disposed on the top surface 114 of the optical device structure 102. The coating layer 116 has a top surface 304 and a thickness 118. The thickness 118 of the coating layer 116 is divided into a series of monolayers 306 measured from the top surface 114 corresponding to 0% of the thickness 118 to the top surface 304 corresponding to 100% of the thickness 118. Each monolayer 302 of the series of monolayers 306 can be deposited separately. Each monolayer 302 of the series of monolayers 306 of the coating layer 116 is deposited by one or more of a CVD, FCVD, PVD, ALD, MBE, IBAD, epitaxy, SoG, IBD, or SoC process.

[0030]

[0035] Although only six monolayers 302 are shown in Figure 3, the series of monolayers 306 may include between about 1 and about 100 monolayers 302. In one embodiment that may be combined with other embodiments described herein, the series of monolayers 306 may include between about 2 and about 8 monolayers 302. In one embodiment that may be combined with other embodiments described herein, each monolayer 302 is conformal to the optical device structure 102. In another embodiment that may be combined with other embodiments described herein, the coating layer 116 is not conformal to the optical device structure.

[0031]

[0036] Each monolayer 302 in the series of monolayers 306 has a composition selected from the group consisting of MoS2, WS2, WSe2, MoSe2, MoTe2, TiS2, ZrS2, ZrSe2, HfS2, PtS2, SnS2, or combinations thereof. In one embodiment, which may be combined with other embodiments described herein, the composition of each monolayer 302 in the series of monolayers 306 is the same material. In another embodiment, which may be combined with other embodiments described herein, adjacent monolayers 302 in the series of monolayers 306 alternate between a first composition and a second composition. The first composition and the second composition are different from each other. The first composition and the second composition are deposited sequentially throughout the entire thickness 118 of the coating layer 116. Thereby, the first composition and the second composition alternate within the series of monolayers 306. The monolayers 302 are deposited until the predetermined thickness 118 is reached. In yet another embodiment, which may be combined with other embodiments described herein, a third composition may alternate with the first composition and the second composition to form the coating layer 116. The first composition, the second composition, and the third composition are different from each other. The first composition, the second composition, and the third composition are selected from the group consisting of MoS2, WS2, WSe2, MoSe2, MoTe2, TiS2, ZrS2, ZrSe2, HfS2, PtS2, SnS2, or combinations thereof.

[0032]

[0037] The series of monolayers 306 have multiple high indirect bandgaps. To improve the performance of the planar optical device 100, materials having compositions with high indirect bandgaps are utilized. In one embodiment, which may be combined with other embodiments described herein, the bandgap of the coating layer 116 is between about 0.3 eV and about 2.3 eV. The bandgap of the optical device structure 102 is smaller than the bandgap of the coating layer 116. The coating layer 116 has a high indirect bandgap, thus reducing the critical dimension 106 and thickness of the planar optical device 100. This allows direct integration with small pitch and thin CNOS(Si) devices. The reduced thickness limits the scattering of surface roughness of the coating layer 116, making the coating layer 116 less susceptible to line edge roughness and line width roughness, thus improving contrast during etching.

[0033]

[0038] The series of monolayers 306 also includes a higher mobility than the mobility of the plurality of optical device structures 102. The higher mobility of the coating layer 116 improves the performance of the planar optical device 100. Since the mobility does not degrade at higher electric fields, the planar optical device 100 is operable to detect multiple colors to improve the performance of the planar optical device 100. Furthermore, the mobility of the coating layer 116 enables advanced intranode connections (e.g., complementary metal oxide semiconductor (CMOS) intranode connections). The mobility of the WSe2 monolayer is approximately 250 cm 2 / Vs. The mobility of a single layer of MoS2 is about 30 cm 2 / Vs and about 50cm 2 / Vs. The mobility of the WS2 monolayer is about 150 cm 2 / Vs and about 200cm 2 / Vs.

[0034]

[0039] The series of monolayers 306 having the composition as described above allows the multiple optical device structures 102 to guide the light beam 110 (shown in FIG. 1C) at broadband imaging wavelengths with low light loss while remaining transparent. The series of monolayers 306 is operable to absorb and refract the light beam 110 (shown in FIG. 1C). Thus, the planar optical device 100 may be used for light detection. The series of monolayers 306 improves the photon emission efficiency of the planar optical device 100. Furthermore, the series of monolayers 306 allows for the guidance of light beams at broadband communication wavelengths. Because the composition of the coating layers exhibits a high Pockels effect, the planar optical device 100 has improved light detection capabilities and improved image processing capabilities.

[0035]

[0040] The capping layer 202 may be disposed on the top surface 304 of the coating layer 116. The capping layer 202 includes at least one of Al2O3, TiO, TaO, Si3N4, SiO2, TiN, TiO2, SiOC, SiC, or combinations thereof. The capping layer 202 may also include low-k, very low-k, and ultra low-k dielectric materials, such as SiCONH, SiCOH, or combinations thereof.

[0036]

[0041] 4 is a flow diagram of a method 400 for forming a planar optical device 100 having one or more unit cells 201. In operation 401, a coating layer 116 is deposited on a plurality of optical device structures 102. In an embodiment that may be combined with other embodiments described herein, a coating layer 116 including a series of monolayers 306 is selectively deposited on a plurality of optical device structures 102. The coating layer 116 is deposited by one or more of a CVD, FCVD, PVD, ALD, MBE, IBAD, epitaxy, SoG, IBD, or SoC process. In another embodiment that may be combined with other embodiments described herein, the coating layer 116 including a series of monolayers 306 is deposited and then etched. The coating layer 116 may be etched by one of an ion beam etch, a reactive ion etch, an electron beam (e-beam) etch, a wet etch, or a combination thereof.

[0037]

[0042] In operation 402, the capping layer 202 is deposited on the coating layer 116. In an embodiment that may be combined with other embodiments described herein, the capping layer 202 is selectively deposited on the coating layer 116. The coating layer 202 is deposited by one or more of a CVD, FCVD, PVD, ALD, MBE, IBAD, epitaxy, SoG, IBD, or SoC process. In another embodiment that may be combined with other embodiments described herein, the capping layer 202 is deposited and then etched. The capping layer 202 may be etched by one of an ion beam etch, a reactive ion etch, an electron beam (e-beam) etch, a wet etch, or a combination thereof.

[0038]

[0043] In summary, disclosed herein is an optical device having a coating layer including one or more monolayers selected from the group consisting of MoS2, WS2, WSe2, MoSe2, MoTe2, TiS2, ZrS2, ZrSe2, HfS2, PtS2, SnS2, or combinations thereof. The coating layer is disposed over a plurality of optical device structures of the optical device. A series of monolayers forms the coating layer. The monolayers may alternate between materials forming the coating layer or may be a uniform coating layer of a single material. The coating layer is disposed over each optical device structure of the plurality of optical device structures to improve the band gap of the planar optical device and enable the planar optical device to absorb and diffract light with efficient photon emission capabilities.

[0039]

[0044] While the foregoing is directed to embodiments of the present disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof, the scope of which is defined by the following claims.

Claims

1. A device, the device comprising: a planar optical device operable to focus light incident on the planar optical device, the planar optical device comprising: a plurality of optical device structures disposed in or on an upper surface of the substrate; and a coating layer disposed on each optical device structure of the plurality of optical device structures, the coating layer comprising: one or more monolayers, each monolayer of the one or more monolayers being made of molybdenum disulfide (MoS 2 ), tungsten disulfide (WS 2 ), tungsten diselenide (WSe 2 ), molybdenum diselenide (MoSe 2 ), molybdenum ditelluride (MoTe 2 ), titanium disulfide (TiS 2 ), zirconium disulfide (ZrS 2 ), zirconium diselenide (ZrSe 2 ), hafnium disulfide (HfS 2 ), platinum disulfide (PtS 2 ), tin disulfide (SnS 2 ), or a combination thereof.

2. The planar optical device further includes a capping layer disposed on the coating layer, the capping layer being made of aluminum oxide (Al 2 O 3 ), titanium oxide (TiO), tantalum oxide (TaO), silicon nitride (Si 3 N 4 ), silicon dioxide (SiO 2 ), titanium nitride (TiN), titanium dioxide (TiO 2 13. The device of claim 1 , comprising at least one of silicon oxycarbide (SiOC), silicon carbide (SiC), or a combination thereof.

3. The device of claim 1 , wherein the plurality of optical device structures have a critical dimension of less than 1 micron corresponding to a cross-sectional width or diameter of the plurality of optical device structures.

4. The device of claim 1 , wherein the composition of each of said one or more monolayers is the same.

5. Adjacent monolayers of the one or more monolayers alternate between a first composition and a second composition, the first composition and the second composition being different from one another and being MoS 2 , W.S. 2 , WSe 2 , MoSe 2 , MoTe 2 , TiS 2 , ZrS 2 , ZrSe 2 , HfS 2 , PtS 2 , SnS 2 10. The device of claim 1, wherein the device is selected from the group consisting of:

6. Adjacent monolayers of the one or more monolayers alternate between a first composition, a second composition, and a third composition, the first composition, the second composition, and the third composition being different from one another, and being MoS 2 , W.S. 2 , WSe 2 , MoSe 2 , MoTe 2 , TiS 2 , ZrS 2 , ZrSe 2 , HfS 2 , PtS 2 , SnS 2 10. The device of claim 1, wherein the device is selected from the group consisting of:

7. The device of claim 1 , wherein the one or more monolayers have a non-crystalline lattice.

8. The device of claim 1 , wherein the coating layer is disposed on the upper surface of the substrate, on sidewalls of each optical device structure, and on a top surface of each optical device structure.

9. The device of claim 1 , wherein the coating layer is disposed on a sidewall of each optical device structure and a top surface of each optical device structure, the top surface of the substrate remaining uncoated.

10. The device of claim 1 , wherein the coating layer is disposed on a sidewall of each optical device structure, and the upper surface of the substrate and a top surface of each optical device structure remain uncoated.

11. The device of claim 1 , wherein the coating layer is disposed on the top surface of the substrate and on sidewalls of each optical device structure, with a top surface of each optical device structure remaining uncoated.

12. The device of claim 1 , wherein the coating layer is disposed on a top surface of each optical device structure, and sidewalls of each optical device structure and the top surface of the substrate remain uncoated.

13. The device of claim 1 , wherein the planar optical device is a metasurface.

14. A device, the device comprising: a planar optical device operable to focus light incident on the planar optical device, the planar optical device being a metasurface, the planar optical device comprising: a plurality of optical device structures disposed in or on an upper surface of a substrate, the plurality of optical device structures having critical dimensions less than 1 micron; and a coating layer disposed on each optical device structure of the plurality of optical device structures, the coating layer comprising: one or more monolayers, each monolayer of the one or more monolayers being made of molybdenum disulfide (MoS 2 ), tungsten disulfide (WS 2 ), tungsten diselenide (WSe 2 ), molybdenum diselenide (MoSe 2 ), molybdenum ditelluride (MoTe 2 ), titanium disulfide (TiS 2 ), zirconium disulfide (ZrS 2 ), zirconium diselenide (ZrSe 2 ), hafnium disulfide (HfS 2 ), platinum disulfide (PtS 2 ), tin disulfide (SnS 2 ), or a combination thereof.

15. 15. The device of claim 14, wherein the composition of each of the one or more monolayers is the same.

16. Adjacent monolayers of the one or more monolayers alternate between a first composition and a second composition, the first composition and the second composition being different from one another and being MoS 2 , W.S. 2 , WSe 2 , MoSe 2 , MoTe 2 , TiS 2 , ZrS 2 , ZrSe 2 , HfS 2 , PtS 2 , SnS 2 15. The device of claim 14, wherein the device is selected from the group consisting of:

17. The device of claim 14 , wherein the planar optical device is a metasurface.

18. A device, the device comprising: Camera, as well as a planar optical device operable to focus light incident on the planar optical device onto the camera, the planar optical device being a metasurface, the planar optical device comprising: a plurality of optical device structures disposed in or on an upper surface of the substrate; and a coating layer disposed on each optical device structure of the plurality of optical device structures, the coating layer comprising: one or more monolayers, each monolayer of the one or more monolayers being made of molybdenum disulfide (MoS 2 ), tungsten disulfide (WS 2 ), tungsten diselenide (WSe 2 ), molybdenum diselenide (MoSe 2 ), molybdenum ditelluride (MoTe 2 ), titanium disulfide (TiS 2 ), zirconium disulfide (ZrS 2 ), zirconium diselenide (ZrSe 2 ), hafnium disulfide (HfS 2 ), platinum disulfide (PtS 2 ), tin disulfide (SnS 2 ), or a combination thereof.

19. The planar optical device further includes a capping layer disposed on the coating layer, the capping layer being made of aluminum oxide (Al 2 O 3 ), titanium oxide (TiO), tantalum oxide (TaO), silicon nitride (Si 3 N 4 ), silicon dioxide (SiO 2 ), titanium nitride (TiN), titanium dioxide (TiO 2 20. The device of claim 18, comprising at least one of silicon oxycarbide (SiOC), silicon carbide (SiC), or a combination thereof.

20. 20. The device of claim 18, wherein the planar optical device is a metasurface.

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