Packaging material, package, and article with package

Abstract

To provide a packaging material, a packaging body, and an article with the packaging body, capable of arranging an antenna in a wide region while suppressing deterioration of a function as an IC tag.SOLUTION: A packaging body 10 covering at least a part of an article 600 includes a base material 110 and an antenna 30 formed on at least one surface side of the base material 110. In the antenna 30, widths of first end parts 41a and 42a forming a first region thereof and an extended region 31p are locally wider than widths of other parts of the antenna 30.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a packaging material, a package, and an article with a package that can cover at least a part of an article and be used for non-contact communication.

Background Art

[0002] In recent years, as non-contact short-range communication using radio waves or the like, an IC tag using RFID technology has been used. For example, various articles and packaging members of articles are provided with IC tags and are used in distribution such as transportation and sales. In this case, if necessary, by holding the article in front of an external device (reader / writer), article information recorded on the IC chip of the IC tag can be read out by non-contact communication or various information can be written into the IC chip. This enables efficient logistics management.

[0003] An IC tag attached to an article mainly includes an IC chip and an antenna electrically connected to the IC chip. Predetermined information generated by the IC chip is transmitted to the antenna as a pattern of voltage changes, and the pattern is converted into radio waves or a magnetic field of a predetermined frequency by the antenna and transmitted to an external device. Also, radio waves or a magnetic field of a predetermined frequency transmitted from an external device are received by the antenna, converted into a pattern of voltage changes, and then input to the IC chip as predetermined information. Thereby, the IC tag attached to the article can directly perform non-contact communication with an external device.

[0004] As a method of attaching an IC tag to an article, for example, there is a method of forming an antenna on a base material, further mounting an IC chip on the antenna to form a label-shaped IC tag, and then attaching this to the article or container. Alternatively, there is a method of pre-printing only the antenna portion on the container of the article before assembly and mounting an IC chip at a predetermined position of the antenna after assembly. Patent Document 1 describes a case where an IC tag is fixed to the outer surface of a bottle container via an adhesive layer, and a shrink film is wound around the outside thereof. The IC tag is composed of a base material, an antenna formed on the base material, an inlet portion including an IC chip connected to the antenna, and a protective material disposed on the upper and lower surfaces of the inlet portion to protect the inlet portion.

[0005] Further, Patent Document 2 describes a package with an IC tag that is assembled with a plurality of bending portions and houses an article. That is, the package is composed of package cardboard having at least two layers, one layer includes a printed antenna pattern, the other layer includes an adhered RFIC element, and has a laminate in which one layer and the other layer are bonded together. This laminate has an RFIC device in which an RFIC element and an antenna pattern are sandwiched between one layer and the other layer, and the RFIC element and the antenna pattern are electrically connected.

Prior Art Documents

Patent Documents

[0006]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0007] When the article contains metal or contains moisture with low radio wave permeability, depending on the arrangement of the antenna with respect to the article, non-contact communication with an external device may not be achieved well. Therefore, by forming an antenna on the packaging material itself that covers the article, the arrangement area of the antenna can be expanded, which may be advantageous for non-contact communication with an external device.

[0008] The present disclosure has been made in view of such a situation, and an object thereof is to provide a packaging material, a package, and an article with a package that can function as an IC tag and have a high degree of freedom in the placement location of the antenna.

Means for Solving the Problems

[0009] The package according to the present embodiment that covers at least a part of the article includes a base material and an antenna formed on at least one surface side of the base material, the antenna includes a first region, and the width of the first region is wider than the width of the antenna excluding the first region.

[0010] Further, in the package according to another form of the present embodiment, the first region includes the first portion and the second portion, and the end of the first portion and the end of the second portion may overlap each other.

[0011] Further, in the package according to another form of the present embodiment, the antenna may further include a first opposing portion and a second opposing portion that are opposed to each other with a gap therebetween without overlapping.

[0012] Further, the package according to another form of the present embodiment may further include an IC chip, and a first pad and a second pad that are electrical connection terminals of the IC chip are electrically connected to the first opposing portion and the second opposing portion, respectively, and the IC chip and the antenna may constitute a communication circuit that enables wireless communication with an external device.

[0013] Also, in another form of this embodiment, the end of the first part and the end of the second part may be spaced apart from each other by at least the thickness of the base material.

[0014] Also, in the package according to another form of this embodiment, the first region may include a region including a corner where the base material is bent.

[0015] Also, in the package according to another form of this embodiment, the antenna including the corner may be covered with a resin protective layer.

[0016] Also, in the package according to another form of this embodiment, the base material may include a first antenna formation surface and a second antenna formation surface that intersect each other with a bent corner as a boundary and on which the antenna is formed.

[0017] Also, in the package according to another form of this embodiment, the antenna may be arranged in a spiral shape.

[0018] Also, in the package according to another form of this embodiment, the antenna may be arranged on the base materials facing each other with the article sandwiched therebetween.

[0019] Also, in the article with the package according to another form of this embodiment, the article may shield or absorb electromagnetic waves having a wavelength used for wireless communication.

[0020] Also, in the article with the package according to another form of this embodiment, the above-described package may cover at least a part of the article.

[0021] A packaging material capable of assembling a package provided with an antenna covering at least a part of an article according to another embodiment of the present invention includes a base material and a conductive pattern formed on at least one surface side of the base material and constituting the antenna. The conductive pattern includes a first portion and a second portion spaced apart from each other. An end portion of the first portion is disposed at a first outer edge of the base material, and an end portion of the second portion is disposed at a second outer edge of the base material. The widths of the end portions of the first portion and the end portion of the second portion are wider than the width of other portions of the conductive pattern.

[0022] Further, in the packaging material according to another embodiment of the present invention, the width of the first outer edge and the width of the second outer edge may be the same.

[0023] Further, in the packaging material according to another embodiment of the present invention, the arrangement of the end portion of the first portion in the width direction of the first outer edge and the arrangement of the end portion of the second portion in the width direction of the second outer edge may correspond to each other.

Advantages of the Invention

[0024] According to the present embodiment, it is possible to provide a packaging material, a package, and an article with a package that can function as an IC tag and have a high degree of freedom in the arrangement location of the antenna.

Brief Description of the Drawings

[0025]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Mode for Carrying Out the Invention

[0026] Hereinafter, with reference to the drawings and the like, an example of the packaging material, the package, and the article with the package of the present disclosure will be described. However, the packaging material and the like of the present disclosure are not limited to the embodiments and examples described below.

[0027] In addition, each of the drawings shown below is shown schematically. Therefore, the size and shape of each part are appropriately exaggerated for easy understanding. In each drawing, the hatching showing the cross section of the member is appropriately omitted. The numerical values and material names of the dimensions and the like of each member described in this specification are examples as embodiments, and are not limited thereto, and can be appropriately selected and used. In this specification, terms specifying shapes and geometric conditions, such as terms such as parallel, orthogonal, and perpendicular, include not only the strictly meant state but also substantially the same state.

[0028] 1. First Embodiment The first embodiment of the packaging material, the package, and the article with the package of the present disclosure will be described. FIG. 1(a) is a schematic perspective view showing a package 10 having a substantially rectangular parallelepiped shape. FIG. 1(b) is a developed view showing a packaging material 100 obtained by developing the package of FIG. 1(a) on a plane. The package is a member for protecting an article or improving the design of an article, which is assembled so as to cover at least a part of the article and on which an antenna for functioning as an IC tag is formed, and refers to both a state without including an IC chip and a state including an IC chip. The packaging material refers to a member obtained by developing the package on a plane.

[0029] In the present disclosure, "assembling" not only refers to folding the packaging material 100 like the package 10 to assemble it into a box shape, but also includes winding a strip-shaped film around a bottle of beverage or the like as described later. The package refers to both a package with an article inside and a package without an article inside. In particular, in order to emphasize that the package contains an article, it may also be referred to as an article with a package.

[0030] Here, for the sake of convenience of explanation, an XYZ orthogonal coordinate system is set for the package 10. As shown in FIG. 1(a), the Z-axis is taken in the vertical direction of the paper along the arrangement direction of the antennas arranged on the package 10, and the Y-axis is taken in the direction connecting the front side and the back side. Also, the X-axis is taken in the left-right direction orthogonal to the arrangement direction of the antennas. The upper side along the Z-axis is the +Z direction, and the opposite direction is the -Z direction. The direction along the Z-axis is also simply referred to as the vertical direction. Also, the direction from the front side to the back side along the Y-axis is the +Y direction, and the opposite direction is the -Y direction. The direction along the Y-axis is also simply referred to as the depth direction. Further, the direction from the left side to the right side along the X-axis is the +X direction, and the opposite direction is the -X direction. The direction along the X-axis is also simply referred to as the left-right direction. Hereinafter, with reference to FIGS. 1 to 3, the configurations of the packaging material 100, the package 10, and the article with a package according to the first embodiment will be described.

[0031] (a) Configuration of the package First, the package 10 will be described. The package 10 of the present embodiment is a substantially rectangular parallelepiped cardboard packaging box that packages the entire article 600 such as food, which is a solid, and the article with a package constitutes a product as a whole. Here, FIG. 1(b) is a development view of the packaging material 100 with the second surface 12 in contact with the floor surface (not shown) of the package 10 fixed on the XY plane and the periphery developed on the XY plane, viewed from the floor surface side, that is, from the -Z direction side. FIG. 2(a) is a cross-sectional view of the surface obtained by cutting the packaging material 100 along the line A-A in FIG. 1(b), viewed from the -X direction side. FIGS. 2(b) to 2(e) are diagrams for explaining the folding of the packaging material 100 regarding the B part in FIG. 2(a). Also, FIG. 3 is a diagram for explaining the connection method of the IC chip and the antenna.

[0032] As shown in FIG. 1(a), the package 10 is a box-shaped container for storing the article 600. The package 10 has a first surface 11 that serves as the front surface on the -Y direction side, and a third surface 13 that serves as the back surface on the +Y direction side opposite to the first surface 11, as surfaces corresponding to the respective faces of a rectangular parallelepiped. Further, the package 10 has a fifth surface 15 that serves as the left side surface adjacent to the first surface 11 on the -X direction side, and a sixth surface 16 that serves as the right side surface on the +X direction side opposite to the fifth surface 15. Furthermore, the package 10 has a fourth surface 14 that serves as the top surface adjacent to the first surface 11 on the +Z direction side, and a second surface 12 that serves as the bottom surface on the -Z direction side opposite to the fourth surface 14. However, the arrangement of the package 10 is for convenience, and it may be arranged such that the first surface 11 serves as the back surface, the left side surface, the right side surface, the top surface, or the bottom surface.

[0033] Antennas 30 that constitute the IC tag 20 are respectively formed on the surfaces facing the outside of the third surface 13, the fourth surface 14, and the first surface 11 of the package 10. The antenna 30 is composed of a third portion 31 arranged along the Z-axis of the third surface 13, a first portion 41 adjacent to the third portion 31 and arranged along the Y-axis of the fourth surface 14, and a second portion 42 adjacent to the first portion 41 and arranged along the Z-axis of the first surface 11. The third portion 31 extends from approximately the center along the Y-axis direction of the fourth surface 14 to below the third surface 13 through a +Y direction and a 90-degree bend. The first portion 41 extends from approximately the center along the Y-axis direction of the fourth surface 14 to the end of the fourth surface 14 in the -Y direction. The second portion extends from the +Z direction end along the Z-axis direction of the fourth surface 14 to approximately the center downward.

[0034] Here, at the adjacent portion between the first surface 11 and the fourth surface 14, the paste margin 11b extending from the first surface 11 overlaps below the fourth surface 14, and the first end portion 41a of the first portion 41 arranged on the fourth surface 14 and the first end portion 42a of the second portion 42 arranged on the first surface 11 overlap. Also, at the fourth surface 14, the ends of the first portion 41 and the third portion 31 are spaced apart and face each other. This point will be described later.

[0035] On the fourth side 14, a third portion 31 and a first portion 41 are formed so as to face in the +Y direction and the -Y direction respectively from approximately the center along the Y-axis direction. Also, an IC module 500 is disposed in the gap between the opposing ends of the third portion 31 and the first portion 41 so as to span both of them. As a result, an antenna 30 including the third portion 31 and the first portion 41 that are disposed opposite to each other, and an IC chip that is electrically connected to both antennas constitute an IC tag 20, enabling non-contact communication with an external device by radio waves or electromagnetic induction.

[0036] Note that since the package 10 has a design as a product, a printed layer 210 is provided on the outer surface, but its description is omitted in each figure except for some regions. The antenna 30 constituting the above-described IC tag 20 is concealed by the printed layer 210 and is made difficult to visually recognize, thereby improving the design. However, the printed layer 210 is not necessarily required, and the antenna 30 may be formed on the outer surface further outside the printed layer 210. Also, in the present embodiment, the antenna 30 is formed on the outer surface side of the package 10. However, considering design and the like, the antenna 30 may be formed on the inner surface side of the package 10, or may be formed on both the outer surface side and the inner surface side of the package 10.

[0037] (b) Configuration of the packaging material Next, to further understand the configuration of the above-described package 10, the configuration of a packaging material 100, which is a member obtained by unfolding the package 10 on a plane, will be described. As shown in FIGS. 1(b) and 2(a), on the -Z direction side surface, which is one surface of the base material 110, a conductive pattern 30 is formed, and a printed layer 210 that covers the entire one surface including these conductive patterns is further formed. The conductive pattern 30 has a function of becoming the antenna 30 in the assembled package 10 and constituting the IC tag 20 together with the IC chip. However, as will also be described in another embodiment to be described later, the present disclosure does not prevent other conductive patterns that satisfy the same relationship as the conductive pattern 30 from being additionally arranged.

[0038] Here, when explaining the packaging material, the part that constitutes the antenna in the package is referred to as the conductive pattern. This is because, at the time of the packaging material, the antenna that functions as the IC tag 20 by mounting the IC chip has not yet been formed. However, it goes without saying that the antenna and the conductive pattern refer to substantially the same thing. For the sake of simplicity of explanation, the conductive pattern of the packaging material 100 corresponding to the antenna 30 of the package 10 is given the same reference numeral, such as the conductive pattern 30.

[0039] The packaging material 100 is a cardboard or plastic material composed of paper materials such as high-quality paper, coated paper, art paper, or a member in which these are mixed or laminated. Also, depending on the article, for imparting gas barrier properties, the inner surface of the above member can be resin-coated, or an aluminum foil or aluminum vapor-deposited film can be further laminated.

[0040] The packaging material 100 is arranged such that the first surface 11 is adjacent to the -Y direction side of the second surface 12 and the third surface 13 is adjacent to the +Y direction side so that a substantially rectangular parallelepiped package 10 can be formed by assembly. Also, the fifth surface 15 is adjacent to the -X direction side of the second surface 12 and the sixth surface 16 is adjacent to the +X direction side. Further, the fourth surface 14 is adjacent to the +Y direction side of the third surface 13.

[0041] At the boundary between the second surface 12 and the first surface 11, there is a folding line 12q that is folded into a valley in a later process. Similarly, at the boundaries between the second surface 12 and the third surface 13, between the second surface 12 and the fifth surface 15, between the second surface 12 and the sixth surface 16, and between the third surface 13 and the fourth surface 14, there are folding lines 12s, 12p, 12r, and 13r, respectively. Also, on the -Y direction side, -X direction side, and +X direction side of the first surface 11, there are provided substantially trapezoidal adhesive margins 11b, 11a, and 11c that extend with the folding lines 11q, 11p, and 11r as boundaries.

[0042] On one side, on the -X direction side and the +X direction side of the third surface 13, there are provided, extending, substantially trapezoidal adhesive margins 13a and 13b respectively bounded by bending lines 13p and 13q. Also, on the -X direction side of the fifth surface 15 and the +X direction side of the sixth surface 16, there are provided, extending, substantially trapezoidal adhesive margins 15a and 16a respectively bounded by bending lines 15p and 16p. As shown in Fig. 1(a), the adhesive margin 11b is assembled so as to overlap with the end portion on the +Y direction side of the fourth surface 14 shown in Fig. 1(b).

[0043] Also, the adhesive margins 11a, 11c, 13a and 13b are respectively assembled so as to overlap with the end portion on the -Y direction side of the fifth surface 15, the end portion on the -Y direction side of the sixth surface 16, the end portion on the +Y direction side of the fifth surface 15, and the end portion on the +Y direction side of the sixth surface 16, shown in Fig. 1(b). Further, the adhesive margins 15a and 16a are respectively assembled so as to overlap with the end portion on the -X direction side of the fourth surface 14 and the end portion on the +X direction side of the fourth surface 14 shown in Fig. 1(b).

[0044] Here, the folding line portion only indicates a line that is planned to be bent in a subsequent process, and it is not necessary to specifically perform printing of some kind of marking line or creasing process in advance. However, for ease of bending, the base material 110 may be subjected to perforation processing having intermittent through-slits, or half-cut processing in which continuous cuts are formed to a certain depth on one surface. Alternatively, measures such as displaying a marking line by printing or the like so that the folding line can be visually recognized, or forming creases in advance may be taken. Also, an adhesive or the like may actually be applied to the adhesive margin to bond the two overlapping portions, or the adhesive margin may not have any adhesive or the like applied thereto.

[0045] On the first surface 11, the third surface 13, and the fourth surface 14 of the packaging material 100, linear conductive patterns 30 are intermittently arranged along the Y-axis, respectively. Specifically, on the first surface 11, a second portion 42 of the conductive pattern 30 is arranged, with a first end 42a that is the end on the -Y direction side and a second end 42b that is the end on the +Y direction side serving as both ends of the second portion 42. However, other conductive patterns satisfying the same relationship as the conductive pattern 30 may be additionally arranged.

[0046] Similarly, a third portion 31 of the conductive pattern 30 is arranged so as to span the third surface 13 and the fourth surface 14, with a first end 31a that is the end on the -Y direction side and a second end 31b that is the end on the +Y direction side serving as both ends thereof. An extended region 31p with a larger width of the conductive pattern than other parts is provided at the boundary between the third surface 13 and the fourth surface 14. Also, on the +Y direction side spaced apart from the conductive pattern 30 on the fourth surface 14, a first portion 41 of the conductive pattern 30 is arranged, with a second end 41b that is the end on the -Y direction side and a first end 41a that is the end on the +Y direction side serving as both ends of the first portion 41. In the case where the above-mentioned other conductive patterns are additionally arranged, it is preferable that the other conductive patterns also satisfy these requirements.

[0047] The conductive pattern 30 is formed on the surface on the -Z direction side of the base material 110. However, the conductive pattern may be formed on the surface on the +Z direction side of the base material 110, or may be formed on both the -Z direction side and the +Z direction side surfaces of the base material 110. Furthermore, the above-mentioned other conductive patterns may be additionally arranged.

[0048] The conductive pattern 30 is a part where a predetermined pattern for transmitting and receiving radio waves and the like is formed of a conductive member as the antenna 30 of the IC tag 20. In the present embodiment, the third portion 31 and the first portion 41 and the second portion 42 constitute a pair of dipole antennas so that radio waves can be transmitted and received in the UHF band such as 920 MHz. However, the antenna form is not limited to the dipole antenna, and for example, it may be a monopole antenna, or a loop antenna or the like depending on the communication specification. Further, the shapes of the dipole antenna and the monopole antenna are not limited to linear shapes, and may be arbitrary shapes such as spiral shapes and meander shapes. The same applies to the other conductive patterns described above.

[0049] The conductive pattern constituting such an antenna can be formed, for example, by printing a conductive ink or a conductive paste on one surface of the base material 110. The conductive ink or the conductive paste can be obtained, for example, by dispersing silver-based conductive particles in a binder resin or a solvent. The conductive particles are preferably silver-based, but are not limited thereto, and metal powders such as nickel, gold, copper, and platinum, conductive carbon, or composites or alloys thereof may be used. Further, for printing the conductive ink or the conductive paste, screen printing, flexographic printing, gravure printing, offset printing, etc. using a mesh plate can be used, and inkjet printing may be possible depending on the viscosity. When forming an antenna by a printing method, the film thickness depends on the type of printing, the viscosity of the ink, the printing speed, etc. For example, when forming by gravure printing, it is about 0.1 μm or more and 20 μm or less, and when forming by screen printing, it is about 10 μm or more and 500 μm or less.

[0050] In addition, as other methods for the conductive pattern constituting the antenna, a method of attaching a punched metal foil to the base material 110 via an adhesive, or a method of applying an adhesive to a thin metal foil and then pressing a hot stamp of a predetermined shape against the base material 110 for thermal transfer can also be adopted. However, since the base material 110 as a packaging material is often printed at high speed by a gravure printing machine or the like and wound up, it is more preferable to form the conductive pattern by a printing method capable of forming the conductive pattern at high speed and low cost.

[0051] When forming the dipole antenna, the electrical length of the third portion 31, or the electrical length of the combined portion of the first portion 41 and the second portion 42, is desirably at least about 75 mm, which is 1 / 4 of the wavelength of the electromagnetic wave to be communicated. This is because, as a whole, the antenna 30 can form a half-wavelength dipole antenna suitable for non-contact communication. Also, the antenna 30 may be arranged in a straight line, but in this case, although the communication sensitivity regarding a specific direction becomes stronger, the directivity tends to become narrower. Therefore, in order to suppress fluctuations in communication sensitivity due to the influence of the positional relationship with an external device when assembled in the package 10 or the electromagnetic wave shielding property or electromagnetic wave absorptivity of the article to be stored, it is desirable that the antenna be arranged along multiple directions as much as possible.

[0052] Here, after assembling the packaging material 100 to form the package 10, the IC module 500 is mounted on the second end 31b of the third portion 31 and the second end 41b of the first portion 41, which are the antenna formed on one surface side of the base material 110 and the conductive pattern constituting the same.

[0053] As a result, the first pad and the second pad, which are the electrical connection terminals of the IC chip, are electrically connected to the opposing portions facing each other provided at the second end 31b and the second end 41b, respectively. Thereby, the IC tag 20 can perform predetermined non-contact communication with an external device. Incidentally, the open ends of the dipole antenna at this time are the second end 31b of the third portion 31 and the second end 42b of the second portion 42.

[0054] By the way, as methods of mounting the IC module 500 across the third part 31 and the first part 41 and the configuration around the IC module 500 at that time, mainly the following four patterns can be considered. FIGS. 3(a) to 3(d) are schematic explanatory diagrams schematically illustrating this. The IC tag 20j shown in FIG. 3(a) simplifies the configuration of the IC tag 20 of the present embodiment for ease of explanation, and details such as the configuration of both ends of the antenna are different from those of the IC tag 20. The same applies to the IC tags 20m, 20k, and 20n shown in FIGS. 3(b) and later.

[0055] The IC tag 20j is provided with a loop circuit 520 such that the antenna 30j formed on the base material 110 branches from two locations of the antenna 30j, and the respective tips are electrically connected to the IC chip 510 to form a closed circuit as a whole. This is intended for the closed circuit to function as a matching circuit for conjugate matching of the impedance of the antenna structure composed of the IC chip 510, the antenna 30j, and the loop circuit 520.

[0056] The IC module 500, which is the IC chip 510 itself, is mounted so as to span both ends of the loop circuit 520 that are spaced apart and opposed to each other. In this case, the first pad 510a and the second pad 510b, which are electrical connection terminals of the IC chip 510, are directly electrically joined to the opposing portions 520a and 520b, which are both ends of the loop circuit 520 that are spaced apart and opposed to each other. As an electrical joining method, for example, gold or lead bumps are previously formed on the first pad and the second pad of the IC chip 510. Then, it is conceivable to join the IC chip 510 to the antenna by applying thermal pressure via an ACF (anisotropic conductive film) or an ACP (anisotropic conductive paste).

[0057] On the one hand, the IC tag 20m directly mounts an IC module 500, which is the IC chip 510 itself, across the first portion 30m formed on the substrate 110 and the second portion 40m disposed opposite thereto with a gap therebetween. In this case, the first pad 510a and the second pad 510b, which are the electrical connection terminals of the IC chip 510, are electrically joined directly to the opposing portion 30ma, which is the end of the first portion 30m, and the opposing portion 40ma, which is the end of the second portion 40m, respectively. Similar to the IC tag 20j, the IC tag 20m is provided with a loop circuit 520 that branches from each of the first portion 30m and the second portion 40m to form a closed circuit. Its purpose is also the same as that of the loop circuit 520 of the IC tag 20j.

[0058] Also, the IC tag 20k is arranged such that the first element 30k, which is an antenna continuously formed on the substrate 110, and a part of the loop circuit 520 formed on the substrate 120 and on which the IC module 500, which is the IC chip 510 itself, is mounted, overlap each other. The IC chip 510 is mounted so as to span the opposing portions 520a and 520b, which are the two opposing ends of the loop circuit 520 spaced apart from each other. A linear second element 30l, which is a part of the loop circuit 520, overlaps the first element 30k in plan view. Thereby, in the IC tag 20k, the first element 30k and the second element 30l are capacitively coupled, and similar to the IC tag 20j, the IC tag can operate as an IC tag.

[0059] In addition, in Fig. 3(c), with respect to the substrate 110 having the first element 30k, the substrate 120 having the loop circuit 520 on which the IC module 500 is mounted is arranged to overlap with each other on the front side of the paper surface. However, the substrate 120 may be arranged on the back side of the paper surface with respect to the substrate 110. Also, the front and back of the substrate 120 may be reversed, and the two substrates may be arranged such that the IC module 500 and the loop circuit 520 face the first element 30k and the substrates 110 and 120 overlap each other.

[0060] Furthermore, the IC tag 20n preliminarily prepares an IC module 500 directly mounting an IC chip 510 across a second element 30o which is a part of a first portion 30m formed on a base material 120 and a second element 40o which is a part of a second portion 40m. At this time, a first pad 510a and a second pad 510b which are electrical connection terminals of the IC chip 510 are electrically joined directly to an end of the second element 30o of the first portion 30m and an end of the second element 40o of the second portion 40m, respectively. Mount such an IC module 500 so as to span a facing portion 30oa which is an end of a first element 30n that is a part of the first portion 30m formed on the base material 110 and is spaced apart from each other by a certain distance and a first element 40n which is a part of the second portion 40m. The role of the loop circuit 520 is the same as that of other IC tags.

[0061] Here, the ends of the second element 30o of the first portion 30m and the first element 30n of the IC module 500 overlap each other, and similarly, the ends of the second element 40o of the second portion 40m and the first element 40n of the IC module 500 overlap each other. For this reason, the second element 30o and the first element 30n are capacitively coupled, and the second element 40o and the first element 40n are also capacitively coupled, and the whole functions well as the IC tag 20n.

[0062] The configurations of the IC tags 20j and 20m are simple because the IC chip 510 is the IC module 500 itself, the manufacturing load as a packaging material or a package can be reduced, and if the yield and the like are not considered, the manufacturing costs thereof can be lowered. On the other hand, the manufacturing of the IC tags 20k and 20n becomes more complicated than the former in that an IC module 500 composed of a part of a base material, an IC chip, and an antenna is separately prepared. However, since the positional accuracy of the IC module 500 required for capacitive coupling of the antenna can be set much looser than the positional accuracy of the small pads of the IC chip 510, the yield improvement and the processing speed improvement related to mounting the IC module 500 on the base material 110 can be achieved.

[0063] On one side, the outer edge on the -Y direction side of the base material 110 is the paste margin 11b, and the outer edge on the +Y direction side is the end of the fourth surface 14. The first end 42a of the second part 42 of the conductive pattern 30 is formed on the paste margin 11b, and the first end 41a of the first part 41 is formed at the end on the +Y direction side of the fourth surface 14. Also, the width of the first end 42a along the X-axis direction, that is, the direction orthogonal to the extending direction of the conductive pattern, is locally wider compared to the width of other parts of the conductive pattern 30. Similarly, the width of the first end 41a along the X-axis direction is also locally wider compared to the width of other parts of the conductive pattern 30. That is, the first end 41a and the first end 42a each form a first region within the conductive pattern 30, and the width of these first regions is wider than the width of the conductive pattern 30 excluding the first regions. The above description of the conductive pattern 30 is also common to the description of the antenna 30.

[0064] Here, "the width of the first region is wider than the width of the antenna excluding the first region" means that the dimension of the first region in the direction orthogonal to the direction in which the antenna extends is larger than the dimension of the part of the antenna excluding the first region in the direction orthogonal to the direction in which the antenna extends. That is, in the first region, the area of the antenna per unit distance in the extending direction of the antenna is larger than that of the part of the antenna excluding the first region. For example, in the antenna 30, the dimensions in the direction along the X-axis, which is orthogonal to the Z-axis direction and the Y-axis direction of the first end 41a and the first end 42a, are larger than the dimensions of other parts of the antenna 30 along the X-axis, excluding the first end 41a, the first end 42a, and the expansion regions 42p and 31p, which are another first region to be described later. The same applies when the antenna 30 is replaced with the conductive pattern 30.

[0065] On one hand, the width along the X-axis direction of the extended region 42p, which is a part of the second portion 42 of the conductive pattern 30 formed across the first surface 11 and the paste margin 11b extending thereto across the bending line 11q of the base material 110, is locally wider than the width of other parts of the conductive pattern 30. Similarly, the width along the X-axis direction of the extended region 31p, which is a part of the conductive pattern 30 formed across the third surface 13 and the fourth surface 14 adjacent thereto across the bending line 13r of the base material 110, is locally wider than the width of other parts of the conductive pattern 30. That is, the extended regions 42p and 31p respectively form the first regions within the conductive pattern 30, and the widths of these first regions are wider than the width of the conductive pattern 30 excluding the first regions including the above-described first end portions 41a and 42a.

[0066] That is, the third portion 31 of the conductive pattern 30 constitutes a continuous shape without breaks along the Y-axis direction. Further, in the extended region 31p including the bending line 13r, the width is locally widened, and other parts of the conductive pattern 30 extending along the Y-axis direction from the extended region 31p are formed with a narrower width than this.

[0067] Also, the conductive pattern 30 constitutes the first portion 41 and the second portion 42 which are two divided conductive patterns along the Y-axis direction. Among these, the first portion 41 is formed on the fourth surface 14, and at the first end portion 41a which is the end on the side not facing the third portion 31, the width is locally widened, and other parts of the first portion 41 extending along the Y-axis direction from the first end portion 41a are formed with a narrower width than this. The above description of the conductive pattern 30 is also common to the description of the antenna 30.

[0068] Further, the second portion 42 is formed across the first surface 11 and the adhesive margin 11b extending therefrom, and is locally formed with a wide width at the first end portion 42a which is the end portion on the adhesive margin 11b side and in the extended region 42p including the folding line 11q. On the contrary, the second portion 42 sandwiched between the first end portion 42a and the extended region 42p and the other part of the second portion 42 extending from the extended region 42p along the Y-axis direction to the side opposite to the first end portion 42a are formed with a narrower width than this.

[0069] (c) Assembly of the packaging material to the package By sequentially assembling the above-described packaging material 100, a substantially rectangular parallelepiped package 10 can be obtained. First, the packaging material 100 in FIG. 1(b) is folded in a valley fold along the folding lines. It is preferable to perform a pretreatment on the folding lines in advance so that the folding process becomes easy. The pretreatment can be performed, for example, as follows.

[0070] FIGS. 2(b) to 2(e) are diagrams for explaining the folding regarding the B portion in the cross-sectional view of the packaging material 100 in FIG. 2(a). The B portion shows the cross-section of the packaging material 100 near the folding line 11q which is the boundary between the first surface 11 and the adhesive margin 11b extending therefrom, but the same applies to other folding lines. As shown in FIG. 2(b), a folding jig 300 having a concave portion 310 with a semi-circular cross-section having a predetermined curvature is disposed on the lower side, that is, the +Z direction side, of the packaging material 100 before folding. Then, as shown in FIG. 2(c), the packaging material 100 is placed on the folding jig 300 so that the folding line 11q of the packaging material 100 and the deepest part of the concave portion 310 are aligned on the Z-axis.

[0071] And a protruding member 320 having a tip sharpened so as to have a predetermined curvature is lowered from above, that is, the -Z direction side, toward the packaging material 100 so that the center of the protrusion and the deepest part of the concave portion 310 are aligned on the Z-axis. The protruding member 320 is a plate-like member substantially parallel to the XZ plane. As a result of lowering the protruding member 320, as shown in FIG. 2(d), the packaging material 100 sandwiched between the concave portion 310 of the folding jig 300 and the protruding member 320 is recessed in approximation to a predetermined curvature so that its deepest part becomes the folding line 11q. Thereby, the pretreatment for facilitating the folding process is completed.

[0072] The process of actually bending the packaging material 100 may be performed in a process separate from the formation of the recess in the above-described packaging material 100, or may be continuously performed as a subsequent process to the recess formation. As shown in FIG. 2(e), the bending process can be realized by bending a portion on the +Y direction side of the recess of the packaging material 100 in which the recess of FIG. 2(d) is formed by 90 degrees toward the +Z direction. By previously forming the recess in the packaging material 100, the bending process can be easily performed. At this time, the corner portion 330 of the cross section of the bent packaging material 100 is not a simple right-angled shape, but a shape in which both end portions form a right angle while leaving a recess with a predetermined curvature.

[0073] That is, the corner portion 330 has a partially recessed shape. Further, two bending points 42c and 42d are formed in the vicinity of the corner portion 330 in the second portion 42 of the antenna 30 formed on one surface of the base material 110. However, the bending process of the packaging material 100 is not limited to such a method, and as described above, it may be bent using other methods such as perforating or half-cutting the base material 110.

[0074] By performing a bending process on each bending line on the packaging material 100 shown in FIG. 1(b) by the above-described bending method, the package 10 can be formed. For example, valley folding is performed on the bending lines 11p, 11q, and 11r, which are the boundaries between the first surface 11 and the paste margins 11a, 11b, and 11c extending therefrom. Similarly, valley folding is performed on the bending lines 15p and 16p, which are the boundaries between the fifth surface 15 and the sixth surface 16 and the paste margins 15a and 16a extending therefrom. Further, valley folding is performed on the bending lines 13p and 13q, which are the boundaries between the third surface 13 and the paste margins 13a and 13b extending therefrom.

[0075] Thereafter, if necessary, an adhesive or the like is applied to each adhesive margin, and further, regarding the folding lines 12q, 12p, 12r, and 12s which are the boundaries between the second surface 12 and the first surface 11, the fifth surface 15, the sixth surface 16, and the third surface 13 adjacent thereto, mountain folding is performed respectively. Also, regarding the folding line 13r which is the boundary between the third surface 13 and the fourth surface 14 adjacent thereto, mountain folding is performed. As a result, the substantially rectangular parallelepiped package 10 shown in FIG. 1(a) is assembled. On the fourth surface 14 which is the top surface of this package 10, the second end portion 31b which is the end portion of the third portion 31 and the second end portion 41b of the first portion 41 are arranged so as to face each other with a space therebetween.

[0076] Here, by mounting and fixing the IC module 500 at a predetermined position by the method described above so as to straddle the opposing portions of the second end portion 31b and the second end portion 41b, the package 10 including the configuration of the IC tag 20 is completed. That is, the first pad 510a and the second pad 510b which are the electrical connection terminals of the IC chip 510 are electrically connected to the second end portion 31b and the second end portion 41b respectively. As a result, the IC chip 510 and the antenna 30 constitute a communication circuit enabling wireless communication with an external device.

[0077] Also, as an area where the base materials 110 constituting the package 10 overlap each other, for example, there is an adhesive margin 11b which overlaps with the fourth surface 14 and the lower layer side of the end portion on the -Y direction side thereof. In this way, when there is a location where a specific surface and an adhesive margin overlap, it means that the outer edge of the specific surface of the original base material 110 and the outer edge including the adhesive margin overlap. In other words, when a specific surface and an adhesive margin overlap, in the state of the packaging material 100 with the package 10 unfolded, the portion of the specific surface that overlaps with the adhesive margin and the adhesive margin constitute the outer edges of the base materials 110 arranged at positions separated from each other. By assembling the package 10 from the packaging material 100 in this way, what was originally a conductive pattern comes to constitute an antenna arranged to function as an IC tag.

[0078] Here, the first end 41a of the first portion 41 of the antenna 30 is disposed at a predetermined location on the fourth surface 14 that constitutes the outer edge of the base material 110. Similarly, the first end 42a of the second portion 42 of the antenna 30 is disposed at a predetermined location on the paste margin 11b that constitutes the outer edge of the base material 110. Also, as described above, the first end 41a and the first end 42a are locally wider in width compared to the widths of other parts of the antenna 30, and overlap each other when viewed along the overlapping direction of the fourth surface 14 and the paste margin 11b.

[0079] Also, in FIG. 1(a), the first end 41a is formed on the surface of the fourth surface 14, that is, on the +Z direction side with respect to the base material 110. On the other hand, the first end 42a is formed on the surface of the paste margin 11b that overlaps on the lower layer of the fourth surface 14, that is, on the -Z direction side, that is, on the +Z direction side with respect to the base material 110. From this, the first end 41a and the first end 42a are separated from each other by at least the thickness of the base material 110 when viewed along the overlapping direction of the fourth surface 14 and the paste margin 11b.

[0080] On the other hand, the antenna 30 that also constitutes the IC tag 20 includes a first portion 41 including a second end 41b that is an end on the IC module 500 side and a second portion 42 including a second end 42b that is an end on the side opposite to the IC module 500, as follows. That is, when the IC tag 20 has a configuration such as the IC tag 20n shown in FIG. 3(d) for example, they are separated in the middle. At this time, the second end 41b is the first opposing portion, and the second end 42b is the second opposing portion. Also, when the IC tag 20 has a configuration such as the IC tags 20j, 20m, or 20k shown in FIGS. 3(a) to 3(c) for example, although the first portion 41 and the second portion 42 are not separated, they are provided with a first opposing portion and a second opposing portion that are opposed to each other with a gap therebetween without overlapping each other.

[0081] Further, the first end portion 41a of the first part 41 and the first end portion 42a of the second part 42 are spaced apart. However, since the widths of the first end portion 41a and the first end portion 42a are locally wider than the widths of other portions of the antenna 30 and overlap each other, they can be capacitively coupled to each other. Therefore, the antenna 30 to which an AC voltage is applied can act as if the first part 41 and the second part 42 were electrically connected.

[0082] For such good capacitive coupling, the widths of the first end portion 41a and the first end portion 42a, that is, the widths along the line width of the antenna 30, can be, for example, 1.1 times or more and 10.0 times or less the line width of other portions of the antenna 30 excluding the extended region 42p. Also, the length orthogonal to the continuous width of the first end portion 41a and the first end portion 42a, that is, the length along the extending direction of the antenna 30, can be 1.1 times or more and 10.0 times or less the width. When the widths and lengths of the first end portion 41a and the first end portion 42a are within this range, even if the shape of the packaging material 100 or the position of the antenna is slightly deviated, a certain amount of overlapping area of the first end portion 41a and the first end portion 42a can be obtained, and good capacitive coupling can be obtained.

[0083] Also, considering the overlapping efficiency when overlapping, the widths of the first end portion 41a and the first end portion 42a may be the same width. Even if the widths of the first end portion 41a and the first end portion 42a are relatively narrow, if they overlap so that they completely coincide in plan view, capacitive coupling can be achieved with the maximum efficiency. Further, from the viewpoint of eliminating unnecessary gaps when assembled, the width of the fourth surface 14 that constitutes the outer edge of the base material 110 and the width of the adhesive margin 11b that also constitutes the outer edge of the base material 110 are preferably the same.

[0084] The width of the outer edge mentioned here refers to the width orthogonal to the insertion direction when the adhesive margin 11b is inserted under the fourth surface 14 during assembly. The term "the same" includes not only complete identity but also the case where one width is 95% or more and 105% or less of the other width. Note that the width of the adhesive margin 11b that is substantially trapezoidal in plan view refers to the maximum length of its two parallel sides.

[0085] Furthermore, the arrangement of the first end portion 41a in the width direction of the fourth surface 14 constituting the outer edge of the base material 110 corresponds to the arrangement of the first end portion 42a in the width direction of the adhesive margin 11b constituting the outer edge of the base material 110. That is, when defining one end and the other end opposite to the one end in the width direction of the fourth surface 14 constituting the outer edge of the base material 110, the ratio of the distance from the one end to the first end portion 41a to the distance from the first end portion 41a to the other end is assumed to be Da1:Db1. On the other hand, when defining one end and the other end opposite to the one end in the width direction of the adhesive margin 11b constituting the outer edge of the base material 110, the ratio of the distance from the one end to the first end portion 42a to the distance from the first end portion 42a to the other end is assumed to be Da2:Db2.

[0086] At this time, the ratios of both are in a corresponding relationship, and Da1:Db1 = Da2:Db2, or Db1×Da2 = Da1×Db2 holds. Due to such a configuration, in a state where the outer edges of the base material 110 overlap each other, the first end portion 41a and the first end portion 42a can overlap at the corresponding same position, and capacitive coupling can be achieved with the maximum efficiency. It goes without saying that the requirements that the widths and widths of these first end portions 41a and first end portions 42a are the same, and the requirement that the arrangement of the first end portion 41a in the width direction of the fourth surface 14 corresponds to the arrangement of the first end portion 42a in the width direction of the adhesive margin 11b, are requirements to be satisfied in the configuration of the packaging material 100.

[0087] By providing such a capacitive coupling portion, the degree of freedom in the layout of the antenna 30 is increased. For this reason, as shown in Fig. 1(a), a dipole antenna can be arranged across the first surface 11 and the third surface 13 facing each other. At this time, even if the article 600 stored inside is made of metal or contains moisture, that is, even if it is a substance having electromagnetic wave shielding properties or electromagnetic wave absorbing properties, the influence thereof can be reduced and good non-contact communication with an external device can be performed.

[0088] Also, in the package 10, the width of the extended region 42p including the corner 330 formed by bending the pasting margin 11b with respect to the first surface 11 via the bending line 11p is locally wider than the widths of other portions excluding the first end 41a and the first end 42a of the antenna 30. In the antenna including the corner 330, bending points 42c and 42d occur as described in FIG. 2(e). Even more simply, even if the antenna is bent at a right angle, the antenna similarly bends at the right angle portion. At this time, since the base material 110 that supports the antenna itself also bends, the base material 110 is likely to crack, and as a result, the antenna may also crack, increasing the resistance value.

[0089] Here, if the width of the extended region 42p including the corner 330 is formed relatively wide as in the present embodiment, the surface area of the portion of the extended region 42p of the antenna increases. Therefore, even if the resistance value per unit area increases at the corner 330, the increase in the resistance value can be suppressed for the entire extended region 42p. Thus, good communication as the IC tag 20 can be ensured.

[0090] The width of the extended region 42p for suppressing the increase in the resistance value, that is, the width along the line width of the antenna 30, can be, for example, 1.1 times or more and 10.0 times or less the other line widths of the antenna 30 excluding the first end 41a and the first end 42a. Also, the length orthogonal to the width where the widths of the first end 41a and the first end 42a are continuous, that is, the length along the extending direction of the antenna 30, can be 1.1 times or more and 10.0 times or less the width. When the width and length of the extended region 42p are within this range, even if the material of the packaging material 100 is likely to crack due to bending, the electrical resistance generated in the entire antenna can be suppressed below a certain level, and good communication characteristics can be obtained.

[0091] The description above regarding the width and length of the extended region 42p including the corner 330 is equally applicable to the width and length of the extended region 31p including the corner formed by bending the fourth surface 14 with respect to the third surface 13 via the bending line 13r. However, the present disclosure is not limited to the provision of extended regions for all antenna regions including corners, and also includes cases where extended regions are provided only for a part of the antenna regions including corners. Even in this case, corresponding effects can be obtained by providing the extended regions.

[0092] Providing such a wide extended region including a corner also increases the degree of freedom in the layout of the antenna 30. For example, in the package 10, the base material 110 has a first antenna formation surface and a second antenna formation surface that intersect each other with the bent corner 330 as a boundary and on which the antenna is formed. Here, the first antenna formation surface and the second antenna formation surface are, for example, the fourth surface 14 and the first surface 11, or may be the fourth surface 14 and the third surface 13. Therefore, as described above, a dipole antenna can be arranged across the first surface 11 and the third surface 13 that face each other, and good non-contact communication with an external device can be achieved regardless of the material of the article.

[0093] In addition, in the present embodiment, the description has been made assuming that the package material 100 and the package 10 have both the feature that the widths of the first ends 41a and 42a of the conductive pattern 30 and the antenna 30 are locally wider than the widths of other parts of the conductive pattern 30 and the antenna 30, and the feature that the widths of the extended regions 31p and 42p including the corner 330 are locally wider than the widths of other parts. However, it goes without saying that the package material and the package of the present disclosure may have only one of these features. Even in this case, the above-described effects can be obtained by having one of these features.

[0094] (d) Package material and package of the first embodiment Summarizing the above, the packaging material 100 of the first embodiment can assemble the package 10 that covers at least a part of the article 600. The package 10 includes a base material 110 and an antenna 30 formed on at least one surface side of the base material 110. The width of the first region of the antenna 30 is locally wider than the width of other parts of the antenna 30. That is, the first end portion 41a and the first end portion 42a each form a first region in the conductive pattern 30, and the width of these first regions is wider than the width of the conductive pattern 30 excluding the first region including the extended regions 31p and 41p. Further, the extended regions 31p and 41p also each form a first region in the conductive pattern 30, and the width of these first regions is wider than the width of the conductive pattern 30 excluding the first region including the first end portion 41a and the first end portion 42a.

[0095] The antenna 30 includes a first part and a second part that are spaced apart from each other. The first part may be, for example, the first part 41, and the second part may be, for example, the second part 42, or vice versa. The first end portion 41a that is the end portion of the first part and the first end portion 42a that is the end portion of the second part overlap each other, and the width of these end portions is locally wider than the width of other parts of the antenna 30. Also, for the packaging material 100 before assembly, the width of each end portion of the first end portion 41a that is the end portion of the first part and the first end portion 42a that is the end portion of the second part is locally wider than the width of other parts of the conductive pattern 30. That is, the antenna 30 includes the first end portion 41a and the first end portion 42a as the first region, and the width of the first region is wider than the width of the antenna 30 excluding the first region.

[0096] Further, the antenna 30 further includes a third portion having opposing portions facing each other together with either the first portion or the second portion. For example, the antenna 30 includes a first portion 41 and a third portion 31 having opposing portions. This is to enable the IC module 500 to be mounted across the opposing portions of both. By mounting the IC module 500, a first pad 510a and a second pad 510b, which are electrical connection terminals of the IC chip 510, are electrically connected to the opposing portions of the second end 31b and the second end 41b, respectively. Thereby, the IC chip 510 and the antenna constitute a communication circuit enabling wireless communication with an external device.

[0097] The antenna 30 is separated into a first portion 41 disposed on the fourth surface 14 in the packaging material 100 and a second portion 42 disposed across the first surface 11 and the paste margin 11b extending therefrom. Also, at the end of the fourth surface, which is the outer edge of the base material 110, a first end 41a of the conductive pattern 30 and the first portion 41 of the antenna 30 is disposed, and a first end 42a of the second portion 42 is disposed on the paste margin 11b, which is also the outer edge of the base material. Here, the widths of the first end 41a and the first end 42a, which are the first regions, are locally wider than the widths of other parts of the antenna 30, and the first end 41a and the first end 42a overlap each other.

[0098] Also, the widths of the extended regions 31p and 42p of the antenna 30 including the corner portion 330 where the base material 110 is bent are locally wider than the widths of other parts of the antenna 30. That is, the antenna 30 includes extended regions 31p and 41p as the first regions, and the widths of the first regions are wider than the widths of the antenna 30 excluding the first regions.

[0099] Basically, a package is usually assembled based on a single sheet-like base material through folding, adhesion, etc. Therefore, in order to arrange the conductive pattern formed on the base material in the area intended to form the antenna of the IC tag after assembly and cause the IC tag to function, it is necessary to devise the shape of the conductive pattern assuming damage due to folding and the overlap of non-continuous portions of the base material.

[0100] On the other hand, the widths of the first end portions 41a and 42a of the packaging material 100 or the package 10 are configured as described above. As a result, the first end portions 41a and 42a can be capacitively coupled to each other well, and it becomes possible to arrange the antenna in a wide area while suppressing a decrease in the function as the IC tag 20.

[0101] Also, since the widths of the extended regions 31p and 41p of the packaging material 100 or the package 10 are configured in this way, even if bending occurs at the corner portion 330 and a local increase in the electrical resistance value occurs, the increase in the resistance of the entire antenna can be suppressed because the width of the portion is wide. For this reason, there is no need to limit the layout such as arranging the antenna avoiding the corner portion, and it becomes possible to arrange the antenna in a wide area while suppressing a decrease in the function as the IC tag 20. That is, it is possible to provide a packaging material, a package, and an article with a package that can function as an IC tag and has a high degree of freedom in the placement location of the antenna. As described above, other conductive patterns and antennas that satisfy the same relationship as the conductive pattern 30 and the antenna 30 may be further arranged on the packaging material 100 and the package 10.

[0102] 2. Second Embodiment Next, a second embodiment of the packaging material, the package, and the article with the package of the present disclosure will be described. FIG. 4(a) is a schematic perspective view showing a package 10a having a substantially rectangular parallelepiped shape. Further, FIG. 4(b) is a developed view showing a packaging material 101 obtained by developing the package 10a of FIG. 4(a) on a plane. The package 10a of the second embodiment includes one antenna extending along one direction on the outer surface of the package 10a and another antenna extending along another direction different from this direction, and the point where both antennas intersect each other is different from the package 10 of the first embodiment.

[0103] (a) Configuration of the package The package 10a will be described. The package 10a is a cardboard packaging box in the shape of a substantially rectangular parallelepiped that packages the entire article 600 such as food, which is a solid, and the packaged article with the article constitutes a product as a whole. Here, FIG. 4(b) is a developed view of the packaging material 101 similar to FIG. 1(b). Note that the description of the parts common to the package 10 of the first embodiment will be omitted as appropriate.

[0104] On the surfaces facing the outside, which are one of the first surface 11, the third surface 13, and the fourth surface 14 of the package 10a, antennas 30, which are one of the antennas constituting the IC tag 20a, are respectively formed. In addition to this, on the surfaces facing the outside, which are the fifth surface 15, the sixth surface 16, and the fourth surface 14 of the package 10a, antennas 50, which are the other antennas constituting the IC tag 20a, are respectively formed. In the present embodiment, for convenience, the antenna 30 may be referred to as one antenna, and the antenna 50 may be referred to as the other antenna, but it goes without saying that these together constitute one antenna constituting the IC tag 20a. Note that as described above, one antenna 30 or the other antenna 50 may be formed on the surface facing the inside, which is the other surface, instead of the surface facing the outside of each surface of the package 10a, or may be formed on both the one and the other surfaces.

[0105] The third part 31 of the antenna 30 extends from the fourth surface 14 downward to below the third surface 13 through a bend in the +Y direction and 90 degrees. Also, the first part 41 and the second part 42 extend from the fourth surface 14 downward to below the first surface 11 through a bend in the -Y direction and 90 degrees. Here, at the adjacent part of the first surface 11 and the fourth surface 14, the paste margin 11b extending from the first surface 11 overlaps below the fourth surface 14, and the first part 41 and the second part 42 of the fourth surface 14 and the first surface 11 are spaced apart from each other.

[0106] On the other hand, the first part 51 and the second part 52 of the antenna 50 extend from the fourth surface 14 downward to below the fifth surface 15 through a bend in the -X direction and 90 degrees. Also, the third part 61 and the fourth part 62 extend from the fourth surface 14 downward to below the sixth surface 16 through a bend in the +X direction and 90 degrees. Here, at the adjacent part of the fifth surface 15 and the fourth surface 14, the paste margin 15a extending from the fifth surface 15 overlaps below the fourth surface 14, and at the adjacent part of the sixth surface 16 and the fourth surface 14, the paste margin 16a extending from the sixth surface 16 overlaps below the fourth surface 14.

[0107] The antenna 30 is formed so as to face the +Y direction and the -Y direction respectively from the fourth surface 14. Similarly, the antenna 50 is formed so as to face the -X direction and the +X direction respectively from the fourth surface 14. That is, one antenna and the other antenna are arranged to intersect. Also, the IC module 500 is arranged near the intersecting region of the antenna 30 and the antenna 50.

[0108] As a result, the antennas 30 and 50 arranged to face each other and the IC chip electrically connected to these antennas constitute the IC tag 20a, enabling non-contact communication with an external device by radio waves or electromagnetic induction.

[0109] (b) Configuration of the packaging material Next, the configuration of the packaging material 101, which is a member obtained by unfolding the package 10a on a plane, will be described. As shown in FIG. 4(b), on the -Z direction side surface, which is one surface of the base material 110, the conductive pattern 30 and the conductive pattern 50 are formed on the packaging material 100, and a printing layer 210 that covers the entire one surface including these conductive patterns is formed. As the material of the packaging material 101, the same material as the packaging material 100 can be used. Note that the conductive pattern 50 has a function of constituting the IC tag 20a together with the antenna 50 and the IC chip in the assembled package 10a. That is, the conductive pattern 50 is another conductive pattern that satisfies the same relationship as the conductive pattern 30.

[0110] Since the arrangement and configuration of the conductive pattern 30 are common to the first embodiment, the description thereof will be omitted. On the other hand, on the fifth surface 15, the sixth surface 16, and the fourth surface 14 of the packaging material 101, the conductive pattern 50 is intermittently arranged linearly along the X axis, respectively. On the fifth surface 15, the second portion 52 of the conductive pattern 50 is arranged, and the first end 52a, which is the -X direction side end, and the second end 52b, which is the +X direction side end, are the both ends of the second portion 52. Similarly, on the sixth surface 16, the fourth portion 62 of the conductive pattern 50 is arranged, and the first end 62a, which is the +X direction side end, and the second end 62b, which is the -X direction side end, are the both ends of the fourth portion 62.

[0111] In addition, an extended region 52p having a larger conductive pattern width than other portions is provided at the boundary between the fifth surface 15 and the paste margin 15a extending therefrom. Similarly, an extended region 62p having a larger conductive pattern width than other portions is provided at the boundary between the sixth surface 16 and the paste margin 16a extending therefrom.

[0112] On the fourth surface 14, the first portion 51 and the third portion 61 of the conductive pattern 50 having opposing portions are arranged. The first end 51a, which is the -X direction side end, and the second end 51b, which is the +X direction side end, are the both ends of the first portion 51, and the first end 61a, which is the +X direction side end, and the second end 61b, which is the -X direction side end, are the both ends of the third portion 61.

[0113] The conductive pattern 50 is formed at least on one surface of the base material 110 and is configured with the same material and specifications as the conductive pattern 30 described in the first embodiment. Basically, in addition to the dipole antenna composed of the third portion 31, the first portion 41, and the second portion 42, an IC tag 20a is configured by combining a dipole antenna composed of a first portion 51, a second portion 52, a third portion 61, and a fourth portion 62 that extend in a direction substantially orthogonal to this. In this way, by combining two types of dipole antennas with different extending directions, the communication sensitivity can be improved more compared to an IC tag composed of one type of dipole antenna.

[0114] However, the antenna 30, which is one antenna formed by the conductive pattern 30, and the antenna 50, which is the other antenna formed by the conductive pattern 50, do not necessarily have to be orthogonal. However, when taking the smaller angle formed by the two antennas at the intersection portion, it is preferably intersecting at an angle of generally 30° or more and 90° or less. By the one antenna and the other antenna intersecting within this range, the directivity of the antenna as the IC tag 20a can be extended, and non-contact communication can be performed with a wide range of external devices.

[0115] By the way, as a method of mounting the IC module 500 with respect to the antennas 30 and 50 and the configuration around the IC module 500 at that time, mainly the following two methods can be considered. FIGS. 5(a) and 5(b) are schematic explanatory diagrams for schematically explaining this. The IC tag 20i shown in FIG. 5(a) is also a simplified configuration of the IC tag 20a of the present embodiment for easy explanation, similar to the above-described IC tags 20j, etc., and details such as the configuration of both ends of the antenna are different from those of the IC tag 20a. The same applies to the IC tag 20h shown in FIG. 5(b).

[0116] The IC tag 20i branches from two locations, namely the antenna 30i formed on the base material 110 and the antenna 50i that is substantially orthogonal to it, and a loop circuit 520 is provided such that the respective tips are electrically connected to the IC chip 510 to form a closed circuit as a whole. This is intended such that the closed circuit functions as a matching circuit for achieving conjugate matching of the impedance of the antenna structure composed of the IC chip 510, the antennas 30i and 50i, and the loop circuit 520.

[0117] The IC module 500, which is the IC chip 510 itself, is mounted so as to span across both ends of the loop circuit 520 that are spaced apart and face each other. In this case, the first pad 510a and the second pad 510b, which are the electrical connection terminals of the IC chip 510, are directly electrically joined to the opposing portions 520a and 520b, which are both ends of the loop circuit 520 that are spaced apart and face each other, respectively.

[0118] On the other hand, the IC tag 20h is composed of a first element 30h and a first element 50h, which are antennas continuously formed on the base material 110 so as to be orthogonal to each other, and an IC module 500 arranged such that a part of the loop circuit 520 formed on the base material 120 and on which the IC chip 510 is mounted overlaps with them. The IC chip 510 is mounted so as to span across the opposing portions 520a and 520b, which are both ends of the loop circuit 520 that are spaced apart and face each other. The linear second element 30g, which is a part of the loop circuit 520, overlaps with the first element 30h in plan view, and the linear second element 50g, which is also a part of the loop circuit 520, overlaps with the first element 50h in plan view. As a result, in the IC tag 20h, the first element 30h and the second element 30g, and the first element 50h and the second element 50g are capacitively coupled, and similar to the IC tag 20i, the IC tag can operate.

[0119] In this embodiment as well, it may be configured like the IC tag 20m in Fig. 3(b) described in the first embodiment. That is, either one of the antennas 30i or 50i may be configured to face and be separated from each other, and the IC chip 510 may be mounted so as to straddle both of them, and the loop circuit 520 may connect the antennas 30i and 50i continuously. Also, it may be configured like the IC tag 20n in Fig. 3(d). That is, either one of the antennas 30i or 50i may be configured to face and be separated from each other, and the linear portion of the loop circuit 520 may be arranged so as to overlap both of them. Also, the linear portions may be configured to face and be separated from each other, and the IC chip 510 may be mounted so as to straddle both of them.

[0120] As a result, the first pad and the second pad, which are electrical connection terminals of the IC chip, are electrically connected to the corresponding opposing portions respectively, thereby conducting with the antennas 30 and 50. Thereby, the IC tag 20a is provided with two types of dipole antennas extending in different two directions and obtains good communication sensitivity, enabling predetermined non-contact communication with an external device. Incidentally, the open ends of one of the dipole antennas at this time are the first end 31a of the third portion 31 and the second end 42b of the second portion 42, and the open ends of the other dipole antenna are the second end 52b of the second portion 52 and the second end 62b of the fourth portion 62.

[0121] On the other hand, the outer edge on the -X direction side of the base material 110 is the adhesive margin 15a, and the outer edge on the +X direction side is the adhesive margin 16a. At approximately the center in the Y-axis direction of the adhesive margin 15a, the first end 52a of the second portion 52 of the conductive pattern 50 is formed, and at approximately the center in the Y-axis direction of the adhesive margin 16a, the first end 62a of the fourth portion 62 of the conductive pattern 50 is formed. Also, the outer edge on the +Y direction side and -X direction side of the base material 110 is the end on the -X direction side of the fourth surface 14, and the outer edge on the +Y direction side and +X direction side of the base material 110 is the end on the +X direction side of the fourth surface 14. At approximately the center in the Y-axis direction of the former, the first end 51a of the first portion 51 of the conductive pattern 50 is formed, and at approximately the center in the Y-axis direction of the latter, the first end 61a of the third portion 61 of the conductive pattern 50 is formed.

[0122] Here, the width along the Y-axis direction of the first end portion 52a, that is, the direction orthogonal to the extending direction of the conductive pattern, is locally formed wider compared to the widths of other portions of the conductive pattern 50. Similarly, the width in the Y-axis direction of the first end portion 62a is locally formed wider compared to the widths of other portions of the conductive pattern 50. Also, the width in the Y-axis direction of the first end portion 51a is locally formed wider compared to the widths of other portions of the conductive pattern 50. Similarly, the width in the Y-axis direction of the first end portion 61a is locally formed wider compared to the widths of other portions of the conductive pattern 50. That is, the conductive pattern 50 (antenna 50) includes the first end portion 51a and the first end portion 61a as the first region, and the width of the first region is wider than the width of the antenna 50 excluding the first region.

[0123] On the other hand, the width along the Y-axis direction of the extended region 52p, which is a part of the second portion 52 of the conductive pattern 50 formed across the fifth surface 15 and the paste margin 15a extending therefrom with the bending line 15p of the base material 110 interposed therebetween, is locally formed wider compared to the widths of other portions of the conductive pattern 50. Similarly, the width along the Y-axis direction of the extended region 62p, which is a part of the fourth portion 62 of the conductive pattern 50 formed across the sixth surface 16 and the paste margin 16a extending therefrom with the bending line 16p of the base material 110 interposed therebetween, is locally formed wider compared to the widths of other portions of the conductive pattern 50. That is, the conductive pattern 50 (antenna 50) includes the extended regions 52p and 62p as the first region, and the width of the first region is wider than the width of the antenna 50 excluding the first region.

[0124] That is, the conductive pattern 50 is composed of the first portion 51 and the second portion 52, which are two divided conductive patterns along the X-axis direction. Among these, the first portion 51 is formed on the fourth surface 14, and at the first end portion 51a, which is the end portion on the side not facing the third portion 61, the width is locally formed wider, and the other portions of the first portion 51 extending along the X-axis direction from the first end portion 51a are formed with a narrower width than this.

[0125] Further, the second portion 52 is formed across the fifth surface 15 and the paste margin 15a extending therefrom, and is locally wider at the first end portion 52a which is the end on the paste margin 15a side and in the extended region 52p including the bending line 15p. On the contrary, the second portion 52 sandwiched between the first end portion 52a and the extended region 52p and the other part of the second portion 52 extending from the extended region 52p along the X-axis direction to the side opposite to the first end portion 52a are formed to have a narrower width. The above points similarly apply to the end portions and the extended regions of the third portion 61 and the fourth portion 62 corresponding to the first portion 51 and the second portion 52.

[0126] (c) Assembly of the packaging material to the package By sequentially assembling the above-described packaging material 101, a substantially rectangular parallelepiped package 10a can be obtained. The assembly method is the same as that of the package 10 in the first embodiment, and the description thereof is omitted. As a result of the assembly, a substantially rectangular parallelepiped package 10a shown in FIG. 4(a) is obtained. On the fourth surface 14 which is the top surface of this package 10a, the antennas 30 and 50 intersect each other.

[0127] Here, in the vicinity of the intersecting portion of the antennas 30 and 50, by mounting and fixing the IC module 500 at a predetermined position by the method described above, the package 10 including the configuration of the IC tag 20a is completed. That is, the first pad and the second pad which are the electrical connection terminals of the IC chip 510 are electrically connected to the opposing portions provided by the loop circuit 520 branched from the antennas 30 and 50, respectively, or the loop circuit 520 which is separated from the antennas 30 and 50 and partially overlaps. Thereby, the combination of the IC chip 510 and the antennas 30 and 50 constitutes a communication circuit capable of wireless communication with an external device.

[0128] In addition, as regions where the base materials 110 constituting the package 10a overlap each other, in addition to those described in the first embodiment, there are the fourth surface 14, the paste margin 15a that overlaps the lower layer side of the end portion on the -X direction side thereof, and the paste margin 16a that overlaps the lower layer side of the end portion on the +X direction side of the fourth surface 14. The first end portion 51a of the first portion 51 is disposed at a predetermined position on the fourth surface 14, and similarly, the first end portion 52a of the second portion 52 is disposed at a predetermined position on the paste margin 15a. Similarly, the first end portion 61a of the third portion 61 is disposed at a predetermined position on the fourth surface 14, and similarly, the first end portion 62a of the fourth portion 62 is disposed at a predetermined position on the paste margin 16a.

[0129] Further, the first end portion 51a and the first end portion 52a are locally wider in width than the widths of other portions of the antenna 50, and overlap each other when viewed along the overlapping direction of the fourth surface 14 and the paste margin 15a. Also, the first end portion 61a and the first end portion 62a are locally wider in width than the widths of other portions of the antenna 50, and overlap each other when viewed along the overlapping direction of the fourth surface 14 and the paste margin 16a.

[0130] Also, as described above, the first end portion 51a and the first end portion 52a are separated from each other by at least the thickness of the base material 110 when viewed along the overlapping direction of the fourth surface 14 and the paste margin 15a. The relationship between the first end portion 61a and the first end portion 62a is the same.

[0131] In the antenna 50 that constitutes the IC tag 20a, the antenna 30 and the antenna 50 cross so as to be substantially orthogonal. Also, the IC tag 20a branches from two locations of the antenna 30 and the antenna 50, or is capacitively coupled to both antennas, and a loop circuit 520 is provided such that the respective tips are electrically connected to the IC chip 510 to form a closed circuit as a whole. For example, the IC module 500 which is the IC chip 510 itself is mounted so as to span the opposing portions at both ends of the loop circuit 520 that are spaced apart from each other. Alternatively, the IC module 500 on which the IC chip 510 is mounted so as to span the opposing portions at both ends of the loop circuit 520 that are spaced apart from each other overlaps a part of each other such that the loop circuit 520 and both antennas are capacitively coupled.

[0132] Here, since the widths of the first end portion 51a and the first end portion 52a are locally wider than the widths of other portions of the antenna 50 and they overlap each other, they can be capacitively coupled to each other. The same applies to the first end portion 61a and the first end portion 62a. For this reason, the antenna 50 to which an AC voltage is applied can act as if the first portion 51 and the second portion 52, and the third portion 61 and the fourth portion 62 are conducting.

[0133] When assembled in the package 10a, the first end portion 52a and the first end portion 51a that overlap each other may have the same width in consideration of the overlapping efficiency when they overlap. The same can be said for the first end portion 62a and the first end portion 61a. Also, it is preferable that the width of the fourth surface 14 that constitutes the outer edge of the base material 110 is the same as the width of the adhesive margin 15a that also constitutes the outer edge of the base material 110, and the same applies to the width of the fourth surface 14 and the width of the adhesive margin 16a. Furthermore, the arrangement of the first end portion 51a in the width direction of the fourth surface 14 corresponds to the arrangement of the first end portion 52a in the width direction of the adhesive margin 15a, and the same applies to the relationship between the first end portion 61a and the first end portion 62a. Note that the relationship between the widths of the overlapping ends and the widths of other portions of the antenna, etc., for achieving good capacitive coupling after assembly into the package 10a conforms to the content described in the first embodiment.

[0134] Also, in the package 10a, the width of the extended region 52p including the corner formed by folding the adhesive margin 15a with respect to the fifth surface 15 via the folding line 15p is locally wider than the width of other portions excluding the first end portion 51a and the first end portion 52a of the antenna 50. Similarly, the width of the extended region 62p including the corner formed by folding the adhesive margin 16a with respect to the sixth surface 16 via the folding line 16p is locally wider than the width of other portions excluding the first end portion 61a and the first end portion 62a of the antenna 50. This feature and the width requirement are the same as those of the aforementioned extended region 42p.

[0135] (d) Packaging material and package of the second embodiment To summarize the above, the packaging material 101 of the second embodiment further includes a conductive pattern 50 extending in a direction different from the direction in which the conductive pattern 30 extends, in addition to the configuration of the packaging material 100 of the first embodiment. Also, the conductive pattern 50 satisfies the requirements for the width of the end portion of the conductive pattern disposed on the outer edge of the base material 110 that the conductive pattern 30 has, and the requirement that the end portions overlap each other. Also, the requirement for the width of the extended region of the antenna including the corner where the base material 110 is folded is also satisfied. This is the same for the antenna 50.

[0136] Since the packaging material 101 or the package 10a has such a configuration, in addition to having the same operational effects as the packaging material 100 or the package 10 of the first embodiment, the dipole antenna constituting the IC tag 20a has the feature of extending in two different directions. As a result, the radiation range such as radio waves of the IC tag 20a can be expanded, and the allowable range of the arrangement of the IC tag 20a capable of non-contact communication and an external device is widened.

[0137] For example, as shown in Fig. 4(a), an antenna 30, which is a first dipole antenna spanning between a first surface 11 and a third surface 13 facing each other, is arranged, and an antenna 50, which is a second dipole antenna spanning between a fifth surface 15 and a sixth surface 16 facing each other, can be arranged. At this time, even if the article 600 stored inside is a substance with electromagnetic wave shielding or electromagnetic wave absorbing properties, the influence thereof can be further reduced, enabling good non-contact communication with external devices.

[0138] 3. Modifications of the First and Second Embodiments Here, modifications regarding the first and second embodiments will be described. Fig. 6(a) is a cross-sectional view corresponding to Fig. 2(a), showing a packaging material 102 obtained by unfolding a packaging body having a substantially rectangular parallelepiped shape. Fig. 6(b) is a diagram for explaining the folding regarding part D in Fig. 6(a). Further, Fig. 6(c) is a cross-sectional view corresponding to Fig. 2(e) when the packaging material 102 is subjected to a folding process.

[0139] The packaging material 102 is different from the packaging materials 100 and 101 in that the regions including the folding lines 11q, 12q, 12s, and 13r, respectively, are covered with a resin-made protective layer 220 when viewed in plan. The protective layer 220 is laminated on the upper layer side of a conductive pattern or a printing layer 210 formed on one surface of a base material 110. However, the protective layer 220 may be formed on the upper layer side of the base material 110 or the conductive pattern, and the printing layer 210 may be formed on the upper layer side thereof. As shown in Fig. 6(a), the protective layer may be discretely provided only on the portion covering the folding line, or may be provided over the entire area of the packaging material 102.

[0140] As the protective layer 220, there is no particular material limitation. However, since it is necessary to withstand deformation by bending, it preferably has a certain degree of flexibility and softness even after curing. Further, when provided on the upper layer side of the printing layer 210, it is preferable to use a transparent material so as not to impair the design. Examples of such materials include acrylic resins, urethane resins, polyvinyl resins, polyamide resins, polypropylene resins, polyethylene resins, polyester resins, polyvinyl chloride resins, and the like.

[0141] As a result of bending such a packaging material 102 by the method described above, a cross-section shown in FIG. 6(c) is obtained. At this time, bending points 42c and 42d are generated in the second portion 42 of the antenna 30. However, since the protective layer 220 is present on the outer surface that overlaps with this, it protects the base material 110 and suppresses the occurrence of cracks in the base material 110. As a result, even if the region including the corner portion of the antenna 30 is not made into an extended region with a widened width, an increase in the electrical resistance of the antenna can be suppressed, and the communication reliability as an IC tag can be improved.

[0142] 4. Third Embodiment Subsequently, a third embodiment of the packaging material, the package, and the article with the package of the present disclosure will be described. FIG. 7(a) is a schematic perspective view showing a package 10b wound around the outer peripheral surface of a bottle body 400, which is a beverage bottle with one tip of a substantially cylindrical shape being tapered. Further, FIG. 7(b) is a developed view showing a strip-shaped film packaging material 430 obtained by developing the package 10b of FIG. 7(a) on a plane. FIG. 7(b) shows the package 10b of FIG. 7(a) peeled off from the bottle body 400 and developed on the XZ plane so that the outer surface of the package 10b faces the +Y direction side. FIG. 7(c) is a cross-sectional view of the surface obtained by cutting FIG. 7(b) along the E-E line along the X axis as viewed from the -Z direction side.

[0143] The package 10b is a member that is wound, i.e., assembled, so as to cover at least a part of the bottle body 400 containing the content 610 such as a beverage, on which an antenna for functioning as an IC tag is formed, and is for the purpose of protecting the article or improving the design of the article. The package 10b refers to both a state without an IC chip and a state with an IC chip. Further, the package 10b may refer to an article with a package including the bottle body 400 containing the content 610.

[0144] Here too, for convenience of explanation, an XYZ orthogonal coordinate system is set for the package 10b. As shown in FIG. 7(a), the Z-axis is taken in the axial direction of the bottle body 400, and the Y-axis is taken in the direction connecting the front side and the back side. Further, the X-axis is taken in the left-right direction orthogonal to the Z-axis and the Y-axis. The upward direction along the Z-axis is the +Z direction, and the opposite direction is the -Z direction. The direction along the Z-axis is also simply referred to as the up-down direction. Further, the direction from the front side to the back side along the Y-axis is the +Y direction, and the opposite direction is the -Y direction. The direction along the Y-axis is also simply referred to as the depth direction. Furthermore, the direction from the left side to the right side along the X-axis is the +X direction, and the opposite direction is the -X direction. The direction along the X-axis is also simply referred to as the left-right direction. Hereinafter, with reference to FIG. 7, the configuration of the packaging material 430, the package 10b, and the article with the package according to the third embodiment will be described.

[0145] (a) Configuration of the package First, the package 10b will be described. As shown in FIG. 7(a), the package 10b is wound in a ring shape along the outer periphery of the cylindrical portion of the bottle body 400. As shown in FIGS. 7(b) and 7(c), the package 10b is provided with a printing layer 211 on the -Y direction side, which is one surface side of the film base material 440 that becomes the outer surface when wound, and further, an antenna 80 is formed as an antenna on the -Y direction side thereof. Finally, the IC module 500 is mounted across the opposing portions of the second end 81b of the first portion 81 and the second end 91b of the fourth portion 91 of the antenna 80, and these constitute the IC tag 70 and enable non-contact communication with an external device. The details of the electrical connection between the IC module 500 and the antenna 80 are as described above.

[0146] The packaging body 10b is adhered to each other at the overlapping portion 450 where the two end portions in the longitudinal direction of the packaging material 430 overlap, and is fixed to the bottle body 400. Although the antennas 80 are separated at the overlapping portion 450, if this portion is ignored, a spiral dipole antenna is formed as a whole. In FIG. 7(a), a printing layer 211 is provided between the film base material 440 which is the outer surface of the packaging body 10b and the inner antenna, but for ease of understanding, the printing layer 211 is omitted except for a part thereof.

[0147] In this way, the packaging body 10b of the present embodiment is assembled and formed so as to be wound around the bottle body 400 in a ring shape, and its outer surface is configured to be the film base material 440. Thereby, a printing layer 211 for imparting design to the packaging body 10b, an antenna for performing non-contact communication with an external device as the IC tag 70, and the like are arranged inside the film base material 440. As a result, it is possible to suppress the printing layer from being rubbed off or falling off, and the antenna and the IC chip from being damaged by an external force, and a packaging body 10b with high quality and reliability can be obtained. However, when the film base material 440 is a member having opacity such as paper, the printing layer 211 for imparting design to the packaging body 10b may be arranged on the outer surface side of the film base material 440, and the antenna and the like may be arranged inside the film base material 440.

[0148] (b) Configuration of the packaging material Next, the configuration of the packaging material 430 assembled to the above-described packaging body 10b will be described. As shown in FIG. 7(b), the packaging material 430 has a plurality of linear conductive patterns arranged intermittently in an oblique and parallel manner in the left-right direction. First, a third portion 83 of the conductive pattern 80 having a relatively short length in the left-right direction and inclined obliquely toward the +X direction is arranged near the upper end on the +Z direction side. Below that, a second portion 82 having a relatively long length in the left-right direction and the same inclination as the above-described third portion 83 is arranged.

[0149] Further below, a first portion 81 and a fourth portion 91, which are similar in shape to the second portion 82, are arranged. The first portion 81 and the fourth portion 91 have opposing portions where the IC module 500 can be arranged. Further below, a fifth portion 92, which has substantially the same shape as the second portion 82 described above, is arranged. Further below, a sixth portion 93, which has a relatively short length in the left-right direction and has the same inclination as the fifth portion 92 described above, is arranged.

[0150] The film base material 440 is a member that supports a conductive pattern formed by printing or the like, has appropriate flexibility, and preferably can suppress breakage or disconnection of the conductive pattern, that is, the antenna, due to deformation caused by an external force or the like. The film base material 440 used to cover at least a part of the bottle body 400 is required to have printability, durability, etc. for imparting discriminability and designability to the article and maintaining them over a long period. Furthermore, some are heat-shrinkable in order to fit the article shape.

[0151] Examples of the film base material 440 include polyester-based films, polystyrene-based films, polyolefin-based films, polylactic acid-based films, foamed polyolefin-based films, polyester-polystyrene co-extruded films, or foamed polystyrene-based films. Further, a laminated film of a non-woven fabric and the film may be used. Furthermore, paper materials such as high-quality paper, coated paper, and art paper, synthetic paper, cloth materials, etc. can be mentioned.

[0152] In particular, when heat shrinkage is required, one or more films selected from the group consisting of stretched polyester-based films, stretched polystyrene-based films, stretched polyolefin-based films, polylactic acid-based films, foamed polyolefin-based films, foamed polystyrene-based films, laminated films of non-woven fabrics and shrink films, and stretched polyester-polystyrene co-extruded films are preferable.

[0153] The thickness of the film substrate 440 is not particularly limited and can be appropriately selected as long as the heat resistance, rigidity, mechanical properties, appearance, etc. are not impaired. The thickness of the film substrate 440 can be, for example, 10 μm or more and 500 μm or less, preferably 20 μm or more and 200 μm or less. Being within this range can ensure appropriate rigidity, flexibility, and heat resistance, and adhesion to the bottle body 400 can be obtained.

[0154] Note that the stretched film may be uniaxially stretched or biaxially stretched. In the case of a uniaxially stretched film, it may be longitudinally uniaxially stretched or transversely uniaxially stretched. Longitudinal uniaxial stretching refers to stretching the long film, which is the original member for taking a large number of film substrates 440, in the flow direction of the long film. In this case, usually, the longitudinal direction of the film substrate 440 corresponds to the width direction of the long film, that is, the direction perpendicular to the flow direction. On the other hand, transverse uniaxial stretching refers to stretching in the width direction of the long film. Therefore, when longitudinally uniaxially stretched, the film substrate 440 thermally shrinks along the short side direction, and when transversely uniaxially stretched, it thermally shrinks along the long side direction.

[0155] When the film substrate 440 is previously formed into a cylindrical shape and attached to the bottle body 400 and then heat-shrunk, it is preferable to use a transversely uniaxially stretched film. This is because the film substrate 440 can be closely adhered to the bottle body 400 with a good appearance as the film substrate 440 shrinks along the outer peripheral direction of the bottle body 400.

[0156] Here, when the left and right ends of the packaging material 430 are respectively the ends 450b and 450a, at the end 450b, there are four ends of the fragments of each conductive pattern arranged in the Z-axis direction. That is, the -X-direction end of the uppermost third part 83 is the second end 83b, the -X-direction end of the second part 82 below it is the first end 82a, the -X-direction end of the first part 81 below it is the first end 81a, and the -X-direction end of the fifth part 92 below it is the second end 92b. The ends 450a and 450b are both outer edges in the packaging material 430 or the package 10b, and form an overlapping part by winding.

[0157] On the other hand, at the end 450a, there are also four ends of the fragments of each conductive pattern arranged in the Z-axis direction. That is, the +X-direction end of the uppermost second part 82 is the second end 82b, the +X-direction end of the fourth part 91 below it is the first end 91a, the +X-direction end of the fifth part 92 below it is the first end 92a, and the +X-direction end of the sixth part 93 below it is the second end 93b.

[0158] Here, the four ends arranged in the Z-axis direction at the end 450b and the four ends arranged in the Z-axis direction at the end 450a are all locally wider in width along the direction substantially orthogonal to the extending direction of the conductive pattern than the width of other parts of the conductive pattern 80. In other words, the widths of these ends along the direction substantially orthogonal to the winding direction of the package 10b, that is, the Z-axis direction, which is the direction substantially orthogonal to the extending direction of the conductive pattern, are locally wider than the width of other parts of the conductive pattern 80. That is, the conductive pattern 80 (antenna 80) includes, as the first region, the four ends arranged in the Z-axis direction at the end 450b and the four ends arranged in the Z-axis direction at the end 450a, and the width of the first region is wider than the width of the antenna 80 excluding the first region.

[0159] Also, in the present embodiment, the centers of the widened end portions are arranged along the Z-axis direction. This straight line is defined as the z2-axis for the end portion 450b side and the z1-axis for the end portion 450a side. At this time, when the packaging material 430 is wound around the bottle body 400 to form the package 10b, the z1-axis and the z2-axis substantially coincide with each other at the overlapping portion 450.

[0160] Furthermore, the second end portion 83b on the end portion 450b side and the second end portion 82b on the end portion 450a side are arranged along the X-axis direction, which is the winding direction of the package 10b. Similarly, the first end portion 82a, the first end portion 81a, and the second end portion 92b on the end portion 450b side, and the first end portion 91a, the first end portion 92a, and the second end portion 93b on the end portion 450a side are arranged along the X-axis direction, respectively.

[0161] As a result, when the packaging material 430 is assembled to form the package 10b, the end portions of the antenna on the end portion 450b side and the end portions of the antenna on the end portion 450a side overlap each other in the same manner as the first end portion 41a and the first end portion 42a of the first embodiment, and good capacitive coupling can be achieved. As a result, a part of the conductive pattern 80 from the first part 81 to the third part 83 and a part of the conductive pattern 80 from the fourth part 91 to the sixth part 93 can exhibit the same function as an integrated dipole antenna that is continuously connected with the IC chip interposed therebetween.

[0162] When assembled into the package 10b, the second end portion 83b and the second end portion 82b that overlap each other may have the same width in consideration of the overlapping efficiency when they overlap. The same applies to the first end portion 82a and the first end portion 91a, the first end portion 81a and the first end portion 92a, and the first end portion 92a and the second end portion 93b. Also, it is preferable that the width of the end portion 450b that constitutes the outer edge of the film base material 440 is the same as the width of the end portion 450a that also constitutes the outer edge of the film base material 440. Furthermore, as described above, the arrangement of the second end portion 83b in the width direction which is the Z-axis direction of the end portion 450b corresponds to the arrangement of the second end portion 82b in the width direction of the end portion 450a. The same applies to the first end portion 82a and the first end portion 91a, the first end portion 81a and the first end portion 92a, and the first end portion 92a and the second end portion 93b. Note that the relationship between the widths and lengths of the overlapping end portions and the width of other parts of the antenna for achieving good capacitive coupling after assembly into the package 10b follows the content described in the first embodiment.

[0163] (c) Assembly (wrapping) of the packaging material onto the package By winding and assembling the above-described packaging material 430 around the outer periphery of the cylindrical portion of the bottle body 400, a package 10b integrated with the bottle body 400 can be obtained. First, a packaging material 430 that is a horizontally long substantially rectangular shape as shown in FIG. 7(b) is prepared. Here, different from other embodiments, the IC module 500 is first mounted at a predetermined position of the packaging material 430 before assembly.

[0164] Next, with the film base material 440 facing the outer surface, the packaging material 430 is wound around the outer periphery of the cylindrical portion of the bottle body 400 along the horizontal direction. Then, the end portions 450a and 450b which are both end portions of the packaging material 430 are overlapped, and both are joined by heat fusion or by appropriately applying an adhesive. When shrinking the packaging material 430, the entire periphery of the packaging material 430 is heated to a predetermined temperature, and the packaging material 430 is shrunk to conform to the shape of the bottle body 400.

[0165] As described above, the package 10b including the configuration of the IC tag 70 is completed. That is, the first pad 510a and the second pad 510b, which are the electrical connection terminals of the IC chip 510, are electrically connected to the second end portion 81b and the second end portion 91b, respectively. As a result, the IC chip 510 and the antenna 80 constitute a communication circuit that enables wireless communication with an external device.

[0166] (d) Packaging material and package of the third embodiment In summary, the packaging material 430 of the third embodiment can be assembled into the package 10b by winding the packaging material 430 that covers at least a part of the bottle body 400 that houses the content 610 such as a beverage. The packaging material 430 includes a film base material 440 and a conductive pattern 80 as a conductive pattern that forms an antenna on at least one surface side of the film base material 440.

[0167] At the end portion 450b, which is the outer edge of the film base material 440, the second end portion 83b of the third portion 83 of the conductive pattern 80, the first end portion 82a of the second portion 82, the first end portion 81a of the first portion 81, and the second end portion 92b of the fifth portion 92 are arranged. On the other hand, at the end portion 450a, which is the outer edge of the film base material 440, the second end portion 82b of the second portion 82 of the conductive pattern 80, the first end portion 91a of the fourth portion 91, the first end portion 92a of the fifth portion 92, and the second end portion 93b of the sixth portion 93 are arranged.

[0168] Here, the widths of the second end portion 83b and the second end portion 82b are locally wider than the widths of other portions of the conductive pattern 80, and the second end portion 83b and the second end portion 82b overlap each other. This also applies to the first end portion 82a and the first end portion 91a, the first end portion 81a and the first end portion 92a, and the second end portion 92b and the second end portion 93b. Also, the above is similarly applicable to the antenna 80 after the package 10b is assembled.

[0169] Further, at end portions 450a and 450b which are the outer edges of the packaging material 430, the plurality of end portions described above are respectively arranged, and the corresponding end portions overlap each other, and the antenna 80 is arranged in a spiral shape as a whole antenna.

[0170] Since the packaging material 430 or the package 10b has such a configuration, the corresponding end portions can be well capacitively coupled to each other, and since the antenna is spiral, the directivity such as radio waves can be expanded, and while suppressing the deterioration of the function as the IC tag 70, it becomes possible to arrange the antenna in a wide area.

[0171] 5. Fourth Embodiment Next, a fourth embodiment of the packaging material, package, and article with a package of the present disclosure will be described. FIG. 8 is a schematic perspective view showing a package 10c having a substantially frustum of a square pyramid shape in which the top surface and the bottom surface are substantially rectangular and the four side surfaces are substantially trapezoidal, respectively. FIGS. 9(a) and 9(b) are development views showing a packaging material 103 obtained by developing the package 10c of FIG. 8 on a plane.

[0172] Here too, for convenience of explanation, an XYZ orthogonal coordinate system is set for the package 10c. As shown in FIG. 8, the Z-axis is taken in the vertical direction along the direction connecting the fourth surface 114 which is the top surface of the package 10c and the second surface 112 which is the bottom surface, and the Y-axis is taken in the direction connecting the front side and the back side. Further, the X-axis is taken in the left-right direction orthogonal to the Z-axis and the Y-axis. The upward direction along the Z-axis is the +Z direction, the opposite direction is the -Z direction, the direction from the front side to the back side along the Y-axis is the +Y direction, and the opposite direction is the -Y direction. Further, the direction from the left side to the right side along the X-axis is the +X direction, and the opposite direction is the -X direction.

[0173] (a) Configuration of the Package The package 10c will be described. The package 10c in this embodiment is a cardboard packaging box in the shape of a frustum of a square pyramid that wraps the entire article 600 such as food, which is a solid, and the package with the article constitutes a product as a whole. Here, FIGS. 9(a) and 9(b) are development views of the packaging material 103 with the second surface 112 in contact with the floor surface (not shown in FIG. 8) fixed on the XY plane and the surroundings developed on the XY plane, as viewed from the floor surface side, that is, from the -Z direction side.

[0174] As shown in FIG. 8, the package 10c is a box-shaped container for storing the article 600. The package 10c has a first surface 111 that serves as the front surface on the -Y direction side as a surface corresponding to each surface of the frustum of a square pyramid, and a third surface 113 that serves as the back surface on the +Y direction side opposite to the first surface 111. Further, the package 10c has a fifth surface 115 that serves as the left side surface adjacent to the first surface 111 on the -X direction side, and a sixth surface 116 that serves as the right side surface on the +X direction side opposite to the fifth surface 115. Furthermore, the package 10c has a fourth surface 114 that serves as the top surface adjacent to the first surface 111 on the +Z direction side, and a second surface 112 that serves as the bottom surface on the -Z direction side opposite to the fourth surface 114.

[0175] On the surfaces facing the outside of the first surface 111, the second surface 112, the third surface 113, and the fourth surface 114 of the package 10c, an antenna 85 that is an antenna constituting the IC tag 71 is formed respectively. The antenna 85 extends in the +Y direction from approximately the center along the Y-axis direction of the fourth surface 114, then extends in the -Z direction along the third surface 113, extends in the -Y direction along the second surface 112, and extends in the +Z direction along the first surface 111. Further, it extends in the +Y direction along the fourth surface 114, extends in the -Z direction along the third surface 113, and then ends while extending in the -Y direction along the second surface 112.

[0176] On one hand, the antenna 85 extends in the -Y direction from the fourth surface 114, then extends in the -Z direction along the second surface 112, extends in the +Y direction along the second surface 112, and extends in the +Z direction along the third surface 113. Further, it extends in the -Y direction along the fourth surface 114, extends in the -Z direction along the first surface 111, and then ends while extending in the +Y direction along the second surface 112. On the fourth surface 114, the second end portion 86b and the second end portion 96b of the antenna 85 have opposing portions for mounting the IC module 500.

[0177] The antenna 85 extends across from one surface to another through a bend at a predetermined angle at the corner of the boundary of each surface. Here, at the portion where the antenna spans the first surface 111 and the fourth surface 114, the margin 111b extending from the first surface 111 overlaps below the fourth surface 114, and the antennas on the fourth surface 114 and the first surface 111 are separated from each other. This will be described later.

[0178] The antenna 85 is formed in a spiral shape along the outer surface of the package 10c, facing in the +Y direction and -Y direction respectively from the center along the Y-axis direction of the fourth surface 14. Further, the IC module 500 is arranged at the opposing portions provided at the portions where the first portion 86 and the fourth portion 96 of the antenna 85 face each other, and the first pad and the second pad, which are electrical connection terminals of the IC chip, are electrically connected to the ends of the first portion 86 and the fourth portion 96 respectively. Thereby, the oppositely arranged antenna 85 and the IC chip electrically connected thereto constitute the IC tag 71, enabling non-contact communication with an external device by radio waves or electromagnetic coupling.

[0179] (b) Configuration of the packaging material Next, to further understand the configuration of the above-described package 10c, the configuration of the packaging material 103, which is a member obtained by unfolding the package 10c on a plane, will be described. As shown in FIGS. 9(a) and 9(b), the packaging material 103 has a conductive pattern 85 formed on the -Z direction side surface, which is one surface of the base material 110, and a printing layer 212 is formed to cover the entire one surface including these conductive patterns 85.

[0180] The packaging material 103 is arranged such that the first surface 111 is adjacent to the -Y direction side of the second surface 112 and the third surface 113 is adjacent to the +Y direction side, so that an approximately quadrangular frustum-shaped package 10c can be formed by assembly. Also, the fifth surface 115 is adjacent to the -X direction side of the second surface 112 and the sixth surface 116 is adjacent to the +X direction side. Further, the fourth surface 114 is adjacent to the +Y direction side of the third surface 113. Note that since there is no substantial difference in content from the first embodiment except that the signs denoting the adhesive margin and the folding line, which are denoted as 11b and 11q in the first embodiment, are denoted as 111b and 111q, the description thereof is omitted.

[0181] The outer edge on the -Y direction side of the base material 110 is the adhesive margin 111b, and the outer edge on the +Y direction side is the end of the fourth surface 114. The conductive pattern 85 is divided and arranged into a first portion 86 that spans the fourth surface 114, the third surface 113, the second surface 112, and the first surface 111, and a second portion 87 that is adjacent to the +X direction side of the first portion 86 and spans the fourth surface 114, the third surface 113, and the second surface 112. Also, the conductive pattern 85 is divided and arranged into a fourth portion 96, a fifth portion 97 that is adjacent to the -X direction side of the fourth portion 96, and a sixth portion 98 that is adjacent to the -X direction side of the fifth portion 97. The fourth portion 96 is arranged on the fourth surface 114. The fifth portion 97 is arranged to span the first surface 111, the second surface 112, the third surface 113, and the fourth surface 114. Also, the sixth portion 98 is arranged to span the first surface 111 and the second surface 112.

[0182] The first end 87a on the +Y direction side of the second portion 87 of the conductive pattern 85, the first end 96a on the +Y direction side of the fourth portion 96, and the second end 97b on the +Y direction side of the fifth portion 97 are arranged side by side along the X-axis direction. Similarly, the first end 86a on the -Y direction side of the first portion 86 of the conductive pattern 85, the first end 97a on the -Y direction side of the fifth portion 97, and the first end 98a on the -Y direction side of the sixth portion 98 are arranged side by side along the X-axis direction.

[0183] Furthermore, the second end 97b on the +Y direction side of the fifth portion 97 of the conductive pattern 85 and the first end 98a on the -Y direction side of the sixth portion 98 are arranged on a straight line of the y3 axis along the Y axis. Also, the first end 96a on the +Y direction side of the fourth portion 96 of the conductive pattern 85 and the first end 97a on the -Y direction side of the fifth portion 97 are arranged on a straight line of the y2 axis along the Y axis. Similarly, the first end 87a on the +Y direction side of the second portion 87 of the conductive pattern 85 and the first end 86a on the -Y direction side of the first portion 86 are arranged on a straight line of the y1 axis along the Y axis. Note that the second end 98b at the tip of the sixth portion 98 of the conductive pattern 85 is arranged on a straight line of the y4 axis along the Y axis closer to the -X direction than the y3 axis.

[0184] Here, the first ends 86a, 97a, and 98a arranged along the X-axis direction in the paste margin 111b have a width along their Y-axis direction, that is, the direction orthogonal to the extending direction of the conductive pattern, which is locally wider than the width of other parts of the conductive pattern 85. Similarly, the first ends 87a, 96a, and the second end 97b arranged along the X-axis direction at the +Y direction side end of the fourth surface 114 also have a width along the direction orthogonal to their Y-axis direction, which is locally wider than the width of other parts of the conductive pattern 85. The above also applies to the antenna 85 after being assembled into the package 10c. That is, the conductive pattern 85 (antenna 85) includes the first ends 86a, 97a, and 98a and the first ends 87a, 96a, and the second end 97b, and the width of the first region is wider than the width of the antenna 85 excluding the first region.

[0185] When assembled in the package 10c, the first end portions 86a and 87a that overlap each other may have the same width in consideration of the overlapping efficiency when they overlap. The same applies to the first end portion 97a and the first end portion 96a, and the first end portion 98a and the second end portion 97b. Also, the width of the fourth surface 114 that constitutes the outer edge of the base material 110 and the width of the adhesive margin 111b that also constitutes the outer edge of the base material 110 are preferably the same. Furthermore, the arrangement of the first end portion 87a in the width direction of the fourth surface 14 corresponds to the arrangement of the first end portion 86a in the width direction of the adhesive margin 111b, and the same relationship holds for the first end portion 96a and the first end portion 97a, and the second end portion 97b and the first end portion 98a. Note that the relationship between the widths and lengths of the overlapping end portions and the widths of other portions of the antenna and the conductive pattern for achieving good capacitive coupling after assembly into the package 10c conforms to the content described in the first embodiment.

[0186] On the other hand, an extended region 86s, which is a part of the first portion 86 of the conductive pattern 85, is formed across the first surface 111 and the adhesive margin 111b extending therefrom with the folding line 111q of the base material 110 interposed therebetween. Also, an extended region 97p, which is a part of the fifth portion 97 of the conductive pattern 85, and an extended region 98p, which is a part of the sixth portion 98 of the conductive pattern 85, are formed at the same positions. Here, the width along the X-axis direction of the extended regions 86s, 97p, and 98p is locally wider than the width of other portions of the conductive pattern 85 excluding the end portions formed on the outer edge described above. That is, the conductive pattern 85 (antenna 85) includes the extended regions 86s, 97p, and 98p, and the width of the first region is wider than the width of the antenna 85 excluding the first region.

[0187] Also, an extended region 86r, which is a part of the first portion 86 of the conductive pattern 85, is formed across the first surface 111 and the second surface 112 with the bending line 112q of the base material 110 in between. Further, an extended region 97q, which is a part of the fifth portion 97, and an extended region 98q, which is a part of the sixth portion 98, are formed at similar positions. Additionally, an extended region 87q, which is a part of the second portion 87 of the conductive pattern 85, is formed across the second surface 112 and the third surface 113 with the bending line 112s in between. Also, an extended region 86q, which is a part of the first portion 86, and an extended region 97r, which is a part of the fifth portion 97, are formed at similar positions.

[0188] Furthermore, an extended region 87p, which is a part of the second portion 87 of the conductive pattern 85, is formed across the third surface 113 and the fourth surface 114 with the bending line 113r in between. Also, an extended region 86p, which is a part of the first portion 86, and an extended region 97s, which is a part of the fifth portion 97, are formed at similar positions. The same applies to these extended regions as described above. Note that the relationship between the width and length of the extended regions and the width of other parts of the antenna or conductive pattern for achieving good capacitive coupling after assembly into the package 10c follows the description in the first embodiment.

[0189] (c) Assembly of the packaging material onto the package By sequentially assembling the above-described packaging material 103, a package 10c in the shape of a substantially frustum of a square pyramid can be obtained. Since the method of the bending process is common to the first embodiment, a detailed description thereof is omitted.

[0190] On the package 10c obtained by the same processing as in the first embodiment, an IC module 500 can be mounted on the opposing portion formed by the second end 86b of the first portion 86 of the antenna 85 and the second end 96b of the fourth portion 96, which are arranged on the fourth surface 114. Thereby, the package 10c including the configuration of the IC tag 71 is completed. That is, the first pad 510a and the second pad 510b, which are the electrical connection terminals of the IC chip 510, are electrically connected to the corresponding opposing portions, respectively. As a result, the IC chip 510 and the antenna 85 constitute a communication circuit enabling wireless communication with an external device.

[0191] Further, the antenna 85 is formed in a spiral shape so as to cover the outer surface of the package 10c. In this way, since the dipole antenna can be formed in a spiral shape, even if the package 10c is a small container, a sufficient electrical length of the antenna can be ensured. On the other hand, the directivity of the antenna can be expanded, and non-contact communication with external devices at various angles and positions can be improved. Furthermore, even if the article stored inside has electromagnetic wave shielding properties or electromagnetic wave absorbing properties, the antenna can be arranged so as to surround it, so that a decrease in communication sensitivity can be suppressed.

[0192] (d) Packaging material and package of the fourth embodiment In summary, the packaging material 103 of the fourth embodiment can assemble the package 10c that covers at least a part of the article 600. The packaging material 103 includes a base material 110 and a conductive pattern 85 as a conductive pattern that forms an antenna on at least one surface side of the base material 110. The second end portion 86b and the second end portion 96b of the conductive pattern have opposing portions for mounting the IC module 500.

[0193] By mounting the IC module 500, the first pad and the second pad, which are electrical connection terminals of the IC chip 510, are electrically connected to the second end portion 86b and the second end portion 96b, respectively. Thereby, the IC chip 510 and the antenna constitute a communication circuit that enables wireless communication with an external device. Further, at the end of the fourth surface, which is the outer edge of the base material 110, the first end portion 87a of the second portion 87 of the antenna 85, the first end portion 96a of the fourth portion 96, and the second end portion 97b of the fifth portion 97 are arranged. On the other hand, at the glue margin 111b, which is the outer edge of the base material 110, the first end portion 86a of the first portion 86 of the antenna 85, the first end portion 97a of the fifth portion 97, and the first end portion 98a of the sixth portion 98 are arranged.

[0194] Here, the width of each of the above-described ends is locally wider than the width of other parts of the conductive pattern 85 and the antenna 85, and when assembled to the package 10c, the first end 87a and the first end 86a overlap each other. The same applies to the first end 96a and the first end 97a, and the second end 97b and the first end 98a.

[0195] Since the packaging material 103 or the package 10c has such a configuration, the corresponding ends can be capacitively coupled to each other well, and while suppressing a decrease in the function as the IC tag 71, it becomes possible to arrange the antenna in a wide area.

[0196] Also, the widths of the extended regions 86s, 97p, 98p, 86r, 97q, 98q, 87q, 86q, 97r, 87p, 86p and 97s of the antenna 85 including the corners where the base material 110 is bent are locally wider than the width of other parts of the antenna 85.

[0197] Since the packaging material 100 or the package 10 has such a configuration, even if bending occurs at the corner and a local increase in the electrical resistance value occurs, the increase in the resistance of the entire antenna can be suppressed due to the wide width of the part. Therefore, there is no need to limit the layout such as avoiding the corners when arranging the antenna, and while suppressing a decrease in the function as the IC tag 71, it becomes possible to arrange the antenna in a wide area.

[0198] Also, in the package 10c, the antenna 85 is arranged spirally along the outer surface of the package 10c. Thereby, even in the case of a small package 10c, a sufficient electrical length of the antenna can be ensured, and good non-contact communication with an external device can be performed regardless of the electromagnetic shielding property or electromagnetic wave absorption property of the internal article. From this, while further suppressing a decrease in the function as the IC tag 71, it becomes possible to arrange the antenna in a wider area.

[0199] Regarding the above-described embodiments and modified examples, it is possible to implement all or part of them in combination as long as they do not contradict each other, and the content is of course included in the present disclosure.

Explanation of Signs

[0200] 10, 10a, 10b, 10c Package 11 First Surface 11a, 11b, 11c Paste Margin 11p, 11q, 11r Fold Line 12 Second Surface 12p, 12q, 12r, 12s Fold Line 13 Third Surface 13a, 13b Paste Margin 13p, 13q Fold Line 14 Fourth Surface 15 Fifth Surface 15a Paste Margin 15p Fold Line 16 Sixth Surface 16a Paste Margin 16p Fold Line 20, 20a, 20h, 20i, 20j, 20k, 20m, 20n, 70, 71 IC Tag 30, 80, 85 Antenna (Conductive Pattern) 30g, 30l, 30o, 40o, 50g Second Element 30h, 30k, 30n, 40n, 50h First Element 30i, 30j, 50i Antenna 30m First Part 30ma, 30oa, 40ma, 40oa Opposing Part 31 Third Part 31a First End 31b Second End 31p Expansion Region 40m Second Part 41 First Part 41a First End 41b Second End 42 Second Part 42a First End 42b Second End 42c, 42d Bending Point 42p Expansion area 50 Antenna (conductive pattern) 51 First part 51a First end 51b Second end 52 Second part 52a First end 52b Second end 52p Expansion area 61 Third part 61a First end 61b Second end 62 Fourth part 62a First end 62b Second end 62p Expansion area 81 First part 81a First end 81b Second end 82 Second part 82a First end 82b Second end 83 Third part 83a First end 83b Second end 86 First part 86a First end 86b Second end 86p, 86q, 86r, 86s Expansion areas 87 Second part 87a First end 87b Second end 87p, 87q Expansion areas 91 Fourth part 91a First end 91b Second end 92 Fifth part 92a First end 92b Second end 93 Sixth part 93a First end 93b Second end 96 Fourth part 96a First end 96b Second end 97 Fifth part 97a First end 97b Second end 97p, 97q, 97r, 97s Expansion area 98 Sixth part 98a First end 98b Second end 98p, 98q Expansion area 100, 101, 102, 103 Packaging material 110 Base material 111 First surface 111a, 111b, 111c Paste margin 111p, 111q, 111r Fold line 112 Second surface 112p, 112q, 112r, 112s Fold line 113 Third surface 113a, 113b Paste margin 113p, 113q Fold line 114 Fourth surface 115 Fifth surface 115a Paste margin 115p Fold line 116 Sixth surface 116a Paste margin 116p Fold line 120 Base material 210, 211, 212 Printing layer 220 Protective layer 300 Folding jig 310 Recess 320 Protrusion member 330, 331, 332, 333, 340 Corner 400 Bottle body 410 Barrel part 420 Lid part 430 Packaging material 440 Film base material 450 Overlap part 450a, 450b End 500 IC module 510 IC chip 510a First pad 510b Second pad 520 Loop circuit 520a, 520b Opposite part 600 article 610 contents

Claims

1. A package that covers at least a part of an article, comprising: a base material; an antenna formed on at least one surface side of the base material, the antenna includes a first region, and the width of the first region is wider than the width of the antenna excluding the first region; the antenna includes a first portion and a second portion spaced apart from each other; the first region includes the first portion and the second portion; a package, wherein an end of the first portion and an end of the second portion overlap each other.

2. The package according to claim 1, wherein the antenna further includes a first opposing portion and a second opposing portion that are arranged to face each other with a gap therebetween without overlapping each other.

3. further comprising an IC chip, a first pad and a second pad, which are electrical connection terminals of the IC chip, are electrically connected to the first opposing portion and the second opposing portion, respectively, the package according to claim 2, wherein the IC chip and the antenna constitute a communication circuit that enables wireless communication with an external device.

4. The package according to any one of claims 1 to 3, wherein an end of the first portion and an end of the second portion are spaced apart from each other by at least the thickness of the base material.

5. The package according to any one of claims 1 to 4, wherein the antenna is arranged in a spiral shape.

6. A package that covers at least a part of an article, comprising: a base material; an antenna formed on at least one surface side of the base material, the antenna includes a first region, and the width of the first region is wider than the width of the antenna excluding the first region; a package, wherein the antenna is arranged in a spiral shape.

7. The package according to any one of claims 1 to 6, wherein the antenna is arranged on the base materials that face each other with the article therebetween.

8. The package according to claim 7, wherein the article shields or absorbs electromagnetic waves having a wavelength used for wireless communication.

9. An article with a package, wherein the package according to any one of claims 1 to 8 covers at least a part of the article.

10. A packaging material capable of assembling a package provided with an antenna that covers at least a part of an article, comprising: a base material; a conductive pattern formed on at least one surface side of the base material and constituting the antenna, the conductive pattern includes a first portion and a second portion spaced apart from each other, At the first outer edge of the base material, the end of the first portion is disposed, At the second outer edge of the base material, the end of the second portion is disposed, A packaging material in which the widths of the ends of the first portion and the ends of the second portion are wider than the widths of other portions of the conductive pattern.

11. The packaging material according to claim 10, wherein the width of the first outer edge is the same as the width of the second outer edge.

12. The packaging material according to claim 11, wherein the arrangement of the end of the first portion in the width direction of the first outer edge corresponds to the arrangement of the end of the second portion in the width direction of the second outer edge.

Images