Processing device and positioning method

Abstract

To provide a technology capable of positioning a rectangular substrate.SOLUTION: A processing device according to the present disclosure includes a transport mechanism that transports a rectangular substrate, a positioning table for placing the substrate and positioning the substrate, and a turntable that rotates the positioned substrate, and the transport mechanism includes a block portion that presses an end portion of the substrate placed on the positioning table to position the substrate.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The present disclosure relates to a processing apparatus and a positioning method.

Background Art

[0002] There is known a technique for positioning a substrate by movably supporting the substrate on a support member and sandwiching the substrate between a pressing member and a positioning member (see, for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The present disclosure provides a technique capable of positioning a rectangular substrate.

Means for Solving the Problems

[0005] A processing apparatus according to an aspect of the present disclosure includes a transport mechanism that transports a rectangular substrate, Conveyed by the conveying mechanism a positioning table on which the substrate is placed for positioning the substrate, In the first direction by the positioning table positioning is performed the positioned substrate In order to perform positioning in the second direction orthogonal to the first direction a rotating table that rotates the substrate, and The positioning table includes a plurality of holding pins that slidably hold the substrate at the upper end, the transport mechanism includes a block portion that presses an end portion of the substrate placed on the positioning table to position the substrate. On the plurality of holding pins of

Advantages of the Invention

[0006] According to the present disclosure, a rectangular substrate can be positioned.

Brief Description of the Drawings

[0007] ​

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Figure 12

Figure 13

Mode for Carrying Out the Invention

[0008] Hereinafter, non-limiting exemplary embodiments of the present disclosure will be described with reference to the accompanying drawings. In all the accompanying drawings, the same or corresponding members or components are denoted by the same or corresponding reference numerals, and redundant descriptions are omitted.

[0009] 〔Inspection Apparatus〕 With reference to FIGS. 1 to 3, an example of the inspection apparatus of the embodiment will be described. FIG. 1 is a front view showing an example of the inspection apparatus of the embodiment. FIG. 2 is a top view showing an example of the inspection apparatus of the embodiment. FIG. 3 is a diagram showing an example of the loader section.

[0010] The inspection apparatus 1 includes a loader unit 10, an inspection unit 20, a device controller 30, etc. Under the control of the device controller 30, the inspection apparatus 1 transports a substrate W to be inspected from the loader unit 10 to the inspection unit 20, applies an electrical signal to a device under test (DUT) formed on the substrate W, and inspects various electrical characteristics. The substrate W may be, for example, a rectangular substrate. Examples of the rectangular substrate include a panel level package (PLP).

[0011] The loader unit 10 includes a load port 11, a positioning table 12, a turntable 13, a back table 14, a substrate transfer mechanism 15, a position detection sensor 16, etc.

[0012] The load port 11 is provided on the front (-Y direction) side of the inspection apparatus 1. The load port 11 mounts a cassette C containing the substrate W.

[0013] The positioning table 12 is provided on the back (+Y direction) side of the inspection apparatus 1. The positioning table 12 is a table for mounting the substrate W and positioning the substrate W. Details of the positioning table 12 will be described later.

[0014] The turntable 13 is on the back side of the inspection apparatus 1 and is provided below (-Z direction) the positioning table 12. However, the turntable 13 may be provided above (+Z direction) the positioning table 12. The turntable 13 is a table for adsorbing and holding the substrate W and rotating the substrate W. Details of the turntable 13 will be described later.

[0015] The back table 14 is on the back side of the inspection apparatus 1 and is provided above the positioning table 12. However, the back table 14 may be provided below the positioning table 12. The back table 14 is a table for installing a tray (not shown) for mounting the substrate W. The tray is removable from the back side of the inspection apparatus 1.

[0016] The substrate transfer mechanism 15 transfers the substrate W among the cassette C placed on the load port 11, the positioning table 12, the turntable 13, the trays of the back table 14, and the placement table 21 described later. The substrate transfer mechanism 15 includes pickers 151, 152, a rotation drive mechanism 153, a vertical drive mechanism 154, and the like.

[0017] The pickers 151, 152 are provided in upper and lower two stages. Each of the pickers 151, 152 holds the substrate W. The pickers 151, 152 are also referred to as forks or end effectors. Details of the pickers 151, 152 will be described later.

[0018] The rotation drive mechanism 153 is provided below the pickers 151, 152 and rotationally drives the pickers 151, 152. The rotation drive mechanism 153 includes, for example, a stepping motor.

[0019] The vertical drive mechanism 154 is provided below the rotation drive mechanism 153 and vertically drives the pickers 151, 152 and the rotation drive mechanism 153. The vertical drive mechanism 154 includes, for example, a stepping motor. Note that the substrate transfer mechanism 15 is not limited to the form shown in FIG. 3, and may be, for example, a form having an articulated arm and a vertical drive mechanism.

[0020] The position detection sensor 16 is provided in the conveyance path for accommodating the substrate W in the cassette C by the picks 151 and 152, and detects the position of the substrate W held by the picks 151 and 152. The position detection sensor 16 includes a light projecting unit 161 and a light receiving unit 162. Two light projecting units 161 are provided at an upper portion near the entrance of the cassette C placed on the load port 11 with a predetermined interval in the left-right direction (X direction). Two light receiving units 162 are provided at a lower portion near the entrance of the cassette C with a predetermined interval in the left-right direction. The predetermined interval is wider than the length of one side of the substrate W and narrower than the inner dimension of the cassette C. For example, when the length of one side of the substrate W is 300 mm and the inner dimension of the cassette C is 305 mm, the predetermined interval may be 301 to 304 mm, and preferably 303 mm. The light projecting unit 161 irradiates the light L toward the light receiving unit 162. The light receiving unit 162 detects the presence or absence of reception of the light L irradiated from the light projecting unit 161. Note that the positional relationship between the light projecting unit 161 and the light receiving unit 162 may be reversed. That is, the light projecting unit 161 may be provided at a lower portion near the entrance of the cassette C, and the light receiving unit 162 may be provided at an upper portion near the entrance of the cassette C.

[0021] In the position detection sensor 16, when the substrate W is positioned within a predetermined range of the picks 151 and 152 when the picks 151 and 152 holding the substrate W enter the cassette C, the light receiving unit 162 receives the light L irradiated from the light projecting unit 161. On the other hand, when the substrate W is positioned outside the predetermined range of the picks 151 and 152, the light L irradiated from the light projecting unit 161 is blocked by the substrate W, so the light receiving unit 162 does not receive the light L irradiated from the light projecting unit 161. Therefore, by preventing the picks 151 and 152 from accommodating the substrate W in the cassette C when the light receiving unit 162 does not receive the light L irradiated from the light projecting unit 161, it is possible to avoid the substrate W from coming into contact with the cassette C. Note that the position detection sensor 16 is not limited to the illustrated example and may be in another form.

[0022] The inspection unit 20 is arranged adjacent to the loader unit 10. The inspection unit 20 includes a mounting table 21, a lifting mechanism 22, an XY stage 23, a probe card 24, an alignment mechanism 25, and the like.

[0023] The placement table 21 places and holds the substrate W. The placement table 21 includes, for example, a vacuum chuck.

[0024] The lifting mechanism 22 is provided at the lower part of the placement table 21 and raises and lowers the placement table 21 with respect to the XY stage 23. The lifting mechanism 22 includes, for example, a stepping motor.

[0025] The XY stage 23 is provided at the lower part of the lifting mechanism 22 and moves the placement table 21 and the lifting mechanism 22 in two axial directions (the X direction and the Y direction in the figure). The XY stage 23 is fixed to the bottom of the inspection unit 20. The XY stage 23 includes, for example, a stepping motor.

[0026] The probe card 24 is disposed above the placement table 21. A plurality of probes 24a are formed on the side of the probe card 24 facing the placement table 21. The probe card 24 is detachably attached to the head plate 24b. A tester (not shown) is connected to the probe card 24 via the test head T.

[0027] The alignment mechanism 25 includes a camera 25a, a guide rail 25b, an alignment bridge 25c, etc. The camera 25a is attached downward at the center of the alignment bridge 25c and images the placement table 21, the substrate W, etc. The camera 25a is, for example, a CCD camera or a CMOS camera. The guide rail 25b supports the alignment bridge 25c so as to be movable in the horizontal direction (the Y direction in the figure). The alignment bridge 25c is supported by a pair of left and right guide rails 25b and moves in the horizontal direction (the Y direction in the figure) along the guide rail 25b. Thereby, the camera 25a moves between the standby position and directly below the center of the probe card 24 (hereinafter referred to as the "probe center") via the alignment bridge 25c. When the placement table 21 moves in the XY directions during alignment, the camera 25a located at the probe center images the electrode pads of the substrate W on the placement table 21 from above, performs image processing, and displays the captured image on the display device 40.

[0028] The apparatus controller 30 is provided below the mounting table 21 and controls the overall operation of the inspection apparatus 1. The CPU provided in the apparatus controller 30 executes a desired inspection according to the product type parameters stored in memories such as a ROM and a RAM. Note that the product type parameters may be stored in a hard disk, a semiconductor memory other than a ROM or a RAM, or may be inserted at a predetermined position and read in a state recorded on a recording medium such as a CD-ROM or a DVD that can be read by a computer.

[0029] 〔Pick〕 With reference to FIG. 4, an example of a pick 151 of the substrate transfer mechanism 15 included in the loader unit 10 will be described. FIG. 4 is a diagram showing an example of the pick 151 and shows a state in which the pick 151 holds the substrate W. FIG. 4(a) is a view of the pick 151 seen from above, and FIG. 4(b) is a view of the pick 151 seen from the side. Note that the pick 152 may have the same configuration as the pick 151.

[0030] The pick 151 includes a base 151a, pads 151b, a block portion 151c, and the like.

[0031] The base 151a is formed of a plate-like member. The base 151a has a substantially U shape in plan view.

[0032] A plurality (for example, eight) of pads 151b are provided on the upper surface of the base 151a. The plurality of pads 151b include at least two suction pads that can be independently suctioned. Each suction pad holds the substrate W by vacuum suction. Further, the plurality of pads 151b may include holding pads that hold the substrate W without vacuum suction.

[0033] The block portion 151c is provided above the base end of the pick 151. The block portion 151c has a pressing surface 151d. The pressing surface 151d is orthogonal to the advancing and retracting direction of the pick 151. The pressing surface 151d extends from the upper surface of the pick 151 to a position higher than the upper surface of the substrate W held by the pick 151. The block portion 151c presses the end portion of the substrate W placed on the positioning base 12 with the pressing surface 151d to position the substrate W with respect to the pick 151.

[0034] 〔Positioning Base〕 Referring to FIG. 5, an example of the positioning base 12 included in the loader unit 10 will be described. FIG. 5 is a diagram showing an example of the positioning base 12, and shows a state in which the pick 151 has entered above the positioning base 12. FIG. 5(a) is a view of the positioning base 12 seen from above, and FIG. 5(b) is a view of the positioning base 12 seen from the side.

[0035] The positioning base 12 includes a base 121, holding pins 122, etc.

[0036] The base 121 is fixed to the loader unit 10. The base 121 is formed of a plate-like member. The base 121 has a rectangular shape in plan view.

[0037] A plurality (for example, six) of holding pins 122 are provided on the base 121. Each holding pin 122 is provided at a position excluding the entry path of the pick 151. Each holding pin 122 projects upward from the base 121 and slidably holds the lower surface of the substrate W at the upper end. Each holding pin 122 is formed of a material having, for example, a small frictional resistance. The number of holding pins 122 is preferably six or more. Thereby, the warped substrate W can be accurately held.

[0038] 〔Rotating Table〕 Referring to FIG. 6, an example of the rotating table 13 included in the loader unit 10 will be described. FIG. 6 is a diagram showing an example of the rotating table 13, and shows a state in which the pick 151 has entered above the rotating table 13. FIG. 6(a) is a view of the rotating table 13 seen from above, and FIG. 6(b) is a view of the rotating table 13 seen from the side.

[0039] The turntable 13 includes a stage 131, a speed reducer 132, a motor 133, etc.

[0040] The stage 131 vacuum-sucks and holds the substrate W with a plurality (e.g., three) of adsorption pads 131a provided on its upper surface. The stage 131 is connected to the motor 133 via the speed reducer 132, and rotates the substrate W by the power of the motor 133.

[0041] The speed reducer 132 reduces the rotational speed of the power on the motor 133 side with gears or the like and outputs it to the stage 131.

[0042] The motor 133 outputs power to the stage 131 via the speed reducer 132 to rotate the stage 131.

[0043] 〔Operation of the inspection device〕 With reference to FIGS. 7 to 9, an example of the operation of the inspection device 1 when inspecting the substrate W in the above-described inspection device 1 will be described. FIG. 7 is a flowchart showing an example of the operation of the inspection device according to the embodiment.

[0044] In step S1, the loader unit 10 positions the substrate W before inspection. FIG. 8 is a diagram showing an example of the operation of positioning the substrate W, and is a side view of the positioning table 12. FIG. 9 is a diagram showing an example of the operation of rotating the substrate W, and is a side view of the turntable 13.

[0045] In the present embodiment, as shown in FIG. 8(a), the apparatus controller 30 controls the substrate transfer mechanism 15 to move the pick 151 above the positioning table 12, thereby transferring the substrate W accommodated in the cassette C above the positioning table 12.

[0046] Next, as shown in FIG. 8(b), the apparatus controller 30 controls the substrate transfer mechanism 15 to lower the pick 151 to the correction position, thereby placing the substrate W on the holding pins 122. The correction position is a position where the pad 151b is separated from the lower surface of the substrate W and the upper surface of the block portion 151c is higher than the upper surface of the substrate W.

[0047] Next, as shown in FIG. 8(c), the apparatus controller 30 controls the substrate transfer mechanism 15 to move the pick 151 located at the correction position by a first distance in the entering direction, thereby pressing the pressing surface 151d of the block portion 151c against the end of the substrate W. As a result, the substrate W slides on the holding pins 122, and the side of the substrate W on the block portion 151c side becomes parallel to the pressing surface 151d. The first distance may be, for example, 30 mm.

[0048] Next, as shown in FIG. 8(d), the apparatus controller 30 controls the substrate transfer mechanism 15 to move the pick 151 by a second distance in the retracting direction, thereby separating the pressing surface 151d of the block portion 151c from the end of the substrate W. As a result, the positioning of the substrate W in the first direction with respect to the pick 151 is completed. The first direction is the advancing and retracting direction of the pick 151. The second distance may be, for example, 20 mm.

[0049] Next, as shown in FIG. 8(e), the apparatus controller 30 controls the substrate transfer mechanism 15 to raise the pick 151 to the UP position, thereby holding the substrate W placed on the holding pins 122 with the pad 151b. The UP position is a position where the lower surface of the substrate W is separated from the holding pins 122.

[0050] Next, as shown in FIG. 9(a), the apparatus controller 30 controls the substrate transfer mechanism 15 to move the pick 151 above the turntable 13, thereby transferring the substrate W positioned in the first direction above the turntable 13.

[0051] Next, as shown in FIG. 9(b), the apparatus controller 30 controls the substrate transfer mechanism 15 to lower the pick 151 to the DOWN position, thereby placing the substrate W on the stage 131. The DOWN position is a position where the pad 151b is separated from the lower surface of the substrate W.

[0052] Next, as shown in FIG. 9(c), the apparatus controller 30 controls the turntable 13 to rotate the stage 131 by 90° while sucking and holding the substrate W with the suction pad 131a, thereby rotating the substrate W by 90°. Further, after rotating the substrate W by 90°, the apparatus controller 30 controls the turntable 13 to stop the suction by the suction pad 131a.

[0053] Next, as shown in FIG. 9(d), the apparatus controller 30 controls the substrate transfer mechanism 15 to raise the pick 151 to the UP position, thereby holding the substrate W placed on the stage 131 with the pad 151b. The UP position is a position where the lower surface of the substrate W is separated from the stage 131.

[0054] Next, the apparatus controller 30 controls the substrate transfer mechanism 15 to transfer the substrate W rotated by 90° back to the positioning table 12. Then, as shown in FIGS. 8(a) to 8(e), the apparatus controller 30 positions the substrate W in a second direction orthogonal to the first direction with respect to the pick 151 in the same manner as the positioning of the substrate W in the first direction with respect to the pick 151.

[0055] Thus, in the loader unit 10, the positioning of the substrate W in the first direction and the second direction before inspection with respect to the pick 151 is completed.

[0056] In step S2, the substrate W before inspection positioned in step S1 is transported to the inspection unit 20. In the present embodiment, the apparatus controller 30 controls the substrate transport mechanism 15 to transport the substrate W positioned in the first direction and the second direction to the turntable 13. Next, the apparatus controller 30 controls the turntable 13 to rotate the substrate W so that the substrate W is in a predetermined orientation. In other words, the turntable 13 can rotate (turn) the substrate W to be transported to the inspection unit 20 at an arbitrary specified angle. Next, the apparatus controller 30 controls the substrate transport mechanism 15 to transport the substrate W from the turntable 13 to the inspection unit 20 and place it on the mounting table 21. Note that when the substrate W is in a predetermined orientation, the apparatus controller 30 may control the substrate transport mechanism 15 to transport the substrate W directly to the inspection unit 20 without transporting it to the turntable 13 and place it on the mounting table 21.

[0057] In step S3, the substrate W is inspected in the inspection unit 20. In the present embodiment, the apparatus controller 30 controls the alignment mechanism 25 to align the electrode pads of the device under inspection formed on the substrate W on the mounting table 21 with the plurality of probes 24a of the probe card 24. Next, the apparatus controller 30 controls the elevating mechanism 22 to raise the mounting table 21 and bring the plurality of probes 24a of the probe card 24 into contact with the corresponding electrode pads. Next, the apparatus controller 30 applies a test signal from the tester to the device under inspection formed on the substrate W via the test head T and the plurality of probes 24a of the probe card 24 to inspect the electrical characteristics of the device under inspection. After the inspection of the electrical characteristics of the device under inspection is completed, the apparatus controller 30 controls the elevating mechanism 22 to lower the mounting table 21 and separate the probes 24a from the electrode pads.

[0058] In step S4, the loader unit 10 positions the substrate W after inspection. The positioning of the substrate W after inspection can be performed in the same manner as the positioning of the substrate W before inspection in step S1.

[0059] In step S5, the inspected substrate W is accommodated in the cassette C. In the present embodiment, the apparatus controller 30 controls the substrate transfer mechanism 15 to transfer and accommodate the inspected substrate W positioned in the loader unit 10 into the cassette C. At this time, the apparatus controller 30 determines whether or not the inspected substrate W is positioned within a predetermined range of the pick 151 based on the detection value of the position detection sensor 16. Then, when the apparatus controller 30 determines that the inspected substrate W is positioned within the predetermined range of the pick 151, the apparatus controller 30 transfers and accommodates the inspected substrate W into the cassette C. On the other hand, when the apparatus controller 30 determines that the inspected substrate W is positioned outside the predetermined range of the pick 151, the apparatus controller 30 does not accommodate the inspected substrate W in the cassette C. For example, the apparatus controller 30 controls the substrate transfer mechanism 15 to stop the operation of the pick 151. Also, for example, the apparatus controller 30 controls the substrate transfer mechanism 15 to transfer the inspected substrate W to the back table 14 and place it on a tray installed on the back table 14. Also, for example, the apparatus controller 30 may cause the display device 40 to display that the inspected substrate W cannot be accommodated in the cassette C. Also, for example, the apparatus controller 30 may control each part of the loader unit 10 to re-position the inspected substrate W in the loader unit 10. Thus, in step S5, when the apparatus controller 30 determines that the inspected substrate W is positioned outside the predetermined range of the pick 151, the apparatus controller 30 does not accommodate the inspected substrate W in the cassette C. Thereby, it is possible to avoid the substrate W held by the pick 151 from coming into contact with the cassette C.

[0060] Note that in the operation of the inspection apparatus 1 of the above-described embodiment, the case where positioning is performed on the substrate W before inspection (step S1) and positioning is performed on the substrate W after inspection (step S4) has been described, but the present invention is not limited thereto. For example, either the positioning on the substrate W before inspection (step S1) or the positioning on the substrate W after inspection (step S4) may be omitted. Also, for example, the positioning on the substrate W after inspection (step S4) may be performed only when the apparatus controller 30 determines in step S5 that the inspected substrate W is positioned outside the predetermined range of the pick 151.

[0061] As described above, according to the embodiment, the end of the substrate W slidably held by the holding pin 122 of the positioning base 12 is pressed by the block portion 151c of the pick 151 to position the substrate W with respect to the pick 151. Thereby, the substrate W can be positioned without being sandwiched from the side. Therefore, even when positioning a substrate W that is easily damaged, such as a resin substrate or a glass substrate, it is possible to suppress damage to the substrate W. Further, the substrate W can be positioned without depending on the size of the substrate W. Therefore, even when the substrate W is warped, the substrate W can be positioned. Further, since the substrate W is positioned by the movement of the pick 151, fine adjustment of the center position of the substrate W is easy.

[0062] 〔Modification Example〕 Referring to FIG. 10, a modification example of the positioning base and the turntable included in the loader unit 10 will be described. FIG. 10 is a diagram showing another example of the positioning base and the turntable, and shows a state in which the pick 151 has entered above the positioning base and the turntable. FIG. 10(a) is a top view of the positioning base and the turntable, and FIG. 10(b) is a side view of the positioning base and the turntable.

[0063] The positioning base 17 and the turntable 18 according to the modification example are different from the aforementioned positioning base 12 and turntable 13 in that the two are provided integrally.

[0064] The positioning base 17 includes a base 171, a holding pin 172, a support plate 173, an actuator 174, and the like.

[0065] The base 171 is fixed to the support plate 173 via the actuator 174. The base 171 is formed of a plate-like member. The base 171 has a rectangular shape in plan view.

[0066] The holding pin 172 may have the same configuration as the aforementioned holding pin 122.

[0067] The support plate 173 supports the base 171 so as to be movable up and down via the actuator 174. The support plate 173 is fixed to the loader unit 10.

[0068] A plurality (for example, two) of actuators 174 are provided on the support plate 173. The actuator 174 raises and lowers the base 171 with respect to the support plate 173. As the actuator 174, for example, a motor such as a DC motor, a stepping motor, or a linear motor, an air drive mechanism such as an air cylinder, or a piezo actuator can be used.

[0069] The turntable 18 may have the same configuration as the turntable 13 described above. That is, the turntable 18 includes a stage 181, a speed reducer 182, a motor 183, and the like. The turntable 18 rotates the substrate W by outputting the power of the motor 183 to the stage 181 via the speed reducer 182 while holding the substrate W in a state of being vacuum-sucked and held by a plurality (for example, three) of suction pads 181a provided on the upper surface of the stage 181.

[0070] With reference to FIGS. 11 to 13, an example of a method for positioning the substrate W before inspection in the loader unit 10 of the inspection apparatus 1 having the positioning table 17 and the turntable 18 according to the modified example will be described. Note that the positioning of the substrate W after inspection can also be performed by the same method as the positioning of the substrate W before inspection. FIGS. 11 to 13 are views showing an example of the operation of positioning the substrate W, and are views of the positioning table 17 and the turntable 18 as viewed from the side.

[0071] In the present embodiment, as shown in FIG. 11(a), the apparatus controller 30 controls the substrate transfer mechanism 15 to cause the pick 151 to enter above the positioning table 17, thereby transferring the substrate W accommodated in the cassette C above the positioning table 17.

[0072] Next, as shown in FIG. 11(b), the apparatus controller 30 controls the actuator 174 to raise the base 171 to the UP position. The UP position is a position where the upper end of the holding pin 172 is higher than the upper surface of the stage 181.

[0073] Next, as shown in FIG. 11(c), the apparatus controller 30 controls the substrate transfer mechanism 15 to lower the pick 151 to the correction position, thereby placing the substrate W on the holding pins 172. The correction position is a position where the pad 151b is separated from the lower surface of the substrate W and the upper surface of the block portion 151c is higher than the upper surface of the substrate W.

[0074] Next, as shown in FIG. 11(d), the apparatus controller 30 controls the substrate transfer mechanism 15 to move the pick 151 located at the correction position by a first distance in the entering direction, thereby pressing the pressing surface 151d of the block portion 151c against the end of the substrate W. As a result, the substrate W slides on the holding pins 172, and the side of the substrate W on the block portion 151c side becomes parallel to the pressing surface 151d. The first distance may be, for example, 30 mm.

[0075] Next, as shown in FIG. 12(a), the apparatus controller 30 controls the substrate transfer mechanism 15 to move the pick 151 by a second distance in the retracting direction, thereby separating the pressing surface 151d of the block portion 151c from the end of the substrate W. As a result, the positioning of the substrate W in the first direction with respect to the pick 151 is completed. The first direction is the advancing and retracting direction of the pick 151. The second distance may be, for example, 20 mm.

[0076] Next, as shown in FIG. 12(b), the apparatus controller 30 controls the substrate transfer mechanism 15 to raise the pick 151 to the UP position, thereby holding the substrate W placed on the holding pins 172 with the pad 151b. The UP position is a position where the lower surface of the substrate W is separated from the holding pins 172.

[0077] Next, as shown in FIG. 12(c), the apparatus controller 30 controls the actuator 174 to lower the base 171 to the DOWN position. The DOWN position is a position where the upper end of the holding pin 172 is lower than the upper surface of the stage 181.

[0078] Next, as shown in FIG. 12(d), the apparatus controller 30 controls the substrate transfer mechanism 15 to move the pick 151 in the advancing and retreating direction of the pick 151 so that the center of the pick 151 (substrate W) coincides with the center of the turntable 18.

[0079] Next, as shown in FIG. 13(a), the apparatus controller 30 controls the substrate transfer mechanism 15 to lower the pick 151 to the DOWN position, thereby placing the substrate W on the stage 181. The DOWN position is a position where the pad 151b is separated from the lower surface of the substrate W.

[0080] Next, as shown in FIG. 13(b), the apparatus controller 30 controls the turntable 18 to rotate the stage 181 by 90° while sucking and holding the substrate W with the suction pad 181a, thereby rotating the substrate W by 90°. Further, after rotating the substrate W by 90°, the apparatus controller 30 controls the turntable 18 to stop the suction by the suction pad 181a.

[0081] Next, as shown in FIG. 13(c), the apparatus controller 30 controls the substrate transfer mechanism 15 to raise the pick 151 to the UP position, thereby holding the substrate W placed on the stage 181 with the pad 151b. The UP position is a position where the lower surface of the substrate W is separated from the stage 181.

[0082] Next, the apparatus controller 30 controls the substrate transfer mechanism 15 to move the pick 151 in the advancing and retreating direction so that the center of the substrate W rotated by 90° coincides with the center of the positioning table 17. Then, as shown in FIGS. 11(a) to 11(d) and FIGS. 12(a) to 12(c), the apparatus controller 30 positions the substrate W in the second direction orthogonal to the first direction with respect to the pick 151 in the same manner as the positioning of the substrate W in the first direction with respect to the pick 151.

[0083] Thus, in the loader unit 10, the positioning of the substrate W in the first direction and the second direction before inspection with respect to the pick 151 is completed.

[0084] In the above-described modification, the case where the holding pin 172 of the positioning base 17 is vertically movable with respect to the stage 181 of the turntable 18 has been described. However, the present disclosure is not limited thereto. For example, the stage 181 of the turntable 18 may be vertically movable with respect to the holding pin 172 of the positioning base 17. Further, both the holding pin 172 of the positioning base 17 and the stage 181 of the turntable 18 may be vertically movable.

[0085] In the above-described embodiment, the apparatus controller 30 is an example of the control unit.

[0086] The embodiments disclosed this time should be considered as illustrative in all respects and not restrictive. The above-described embodiments may be omitted, replaced, or changed in various forms without departing from the scope and spirit of the appended claims.

[0087] In the above-described embodiment, the inspection apparatus 1 has been described as an example. However, the present disclosure is not limited thereto. Instead of the inspection apparatus 1, it can also be applied to another processing apparatus such as a film forming apparatus for forming a film on the substrate W or an etching apparatus for etching the film formed on the substrate W.

Description of Reference Numerals

[0088] 1 Inspection apparatus 12, 17 Positioning base 13, 18 Turntable 15 Substrate transfer mechanism 151, 152 Pick 151c Block portion W Substrate

Claims

1. A transport mechanism for transporting a rectangular substrate, A positioning table for placing the substrate transported by the transport mechanism and positioning the substrate, A rotating table for rotating the substrate that has been positioned in the first direction to perform positioning in a second direction orthogonal to the first direction, comprising, The positioning table includes a plurality of holding pins that slidably hold the substrate at the upper end, The transport mechanism includes a block portion that presses an end portion of the substrate placed on the plurality of holding pins of the positioning table to position the substrate, A processing device.

2. A step of placing the substrate on the positioning table and pressing an end portion of the substrate with the block portion to perform positioning of the substrate in the first direction, A step of placing the substrate that has been positioned in the first direction on the rotating table and rotating it by 90°, A step of placing the substrate rotated by 90° on the positioning table and pressing an end portion of the substrate with the block portion to perform positioning of the substrate in the second direction, having a control unit configured to execute, The processing device according to Claim 1.

3. The block portion is provided at the base end of the pick of the transport mechanism, The processing device according to Claim 1 or 2.

4. The block portion is orthogonal to the advancing and retracting direction of the pick and has a pressing surface for pressing an end portion of the substrate, The processing device according to Claim 3.

5. The pick includes a plurality of pads for holding the substrate, The processing device according to Claim 3 or 4.

6. The plurality of pads include at least two suction pads that can be independently suctioned, The processing device according to Claim 5.

7. A cassette for accommodating the substrate, A position detection sensor provided in a transport path for accommodating the substrate in the cassette with the pick and detecting the position of the substrate held by the pick, comprising, The processing device according to any one of Claims 3 to 6.

8. The positioning table includes a base formed in a plate shape, The plurality of holding pins protrude upward from the base, The processing device according to any one of Claims 1 to 7.

9. The positioning table includes a lifting mechanism for lifting and lowering the base, The processing device according to Claim 8.

10. The positioning table is provided above or below the rotating table, The processing device according to any one of Claims 1 to 9.

11. The positioning table is provided integrally with the turntable. The processing apparatus according to any one of claims 1 to 9.

12. The substrate is at least one of the substrate before being processed in the processing apparatus and the substrate after being processed in the processing apparatus. The processing apparatus according to any one of claims 1 to 11.

13. The processing is a process of inspecting the substrate. The processing apparatus according to claim 12.

14. A step of a transport mechanism transporting a rectangular substrate and placing the substrate on a plurality of pins of a positioning table; A step of sliding the substrate on the plurality of holding pins by pressing an end portion of the substrate placed on the plurality of holding pins of the positioning table with a block portion provided in the transport mechanism to perform positioning of the substrate in a first direction; A step of placing the substrate after the positioning in the first direction on a turntable and rotating it by 90°; A step of the transport mechanism transporting the substrate rotated by 90°, placing it on the plurality of holding pins of the positioning table, and pressing an end portion of the substrate with the block portion to slide the substrate on the plurality of holding pins to perform positioning of the substrate in a second direction orthogonal to the first direction; A positioning method comprising the steps.

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