PARTICLE DISPERSION AND PRODUCTION METHOD THEREOF, PARTICLE-CONTAINING PLATING SOLUTION, PARTICLE-CONTAINING PLATING COATING, AND PARTICLE-CONTAINING PLATING METHOD

Abstract

The present invention provides a particle dispersion and a particle-containing plating solution having excellent particle dispersibility. The present invention relates to a particle and The following general formula (1) TIFF0007688955000026.tif31128 (in the formula, R 1-1 and R 1-2 are the same or different and each represents an oxyalkylene group; R 1-3 and R 1-4 are the same or different and represent a hydrocarbon group having 1 to 10 carbon atoms. m and n are the same or different and represent an integer, where m+n=0 to 30. The present invention provides a particle dispersion liquid containing a nonionic surfactant A represented by the following formula:

Description

[Technical field]

[0001] The present invention relates to a particle dispersion and a method for producing the same, a particle-containing plating solution, a particle-containing plating film, and a particle-containing plating method. [Background technology]

[0002] In recent years, plating films containing various particles have been used to impart various properties to the plating films.

[0003] For example, electroless nickel-phosphorus / polytetrafluoroethylene (Ni-P / PTFE) composite plating is a plating film that combines the low friction and non-stickiness of PTFE with the uniform deposition properties of electroless plating, and has begun to be applied in various fields in recent years.

[0004] It is very difficult to uniformly disperse highly water-repellent PTFE particles in electroless plating solutions. Conventionally, a method of using a fluorosurfactant as a dispersant has been used to uniformly disperse PTFE particles in electroless plating solutions.

[0005] However, in recent years, due to restrictions on the use of fluorine-based materials in Europe, the use of fluorine-based surfactants has gradually become prohibited, and there is a demand for a method of dispersing PTFE particles without using fluorine-based surfactants.

[0006] An electroless composite plating bath containing PTFE fine particles and not using a fluorosurfactant has been proposed (see Patent Document 1). In Patent Document 1, an amphoteric surfactant with a specific structure is used as a surfactant for dispersing PTFE particles (Claim 1 of Patent Document 1).

[0007] However, the amphoteric surfactant used in Patent Document 1 is not suitable as a dispersant for fluorine particles, and there is a problem in that the dispersibility is insufficient.

[0008] In addition, not only in the plating solution using fluorine-containing particles as described above, but also in the plating solution using fluorine-free particles, the dispersibility of the particles affects the properties of the plating solution and the plating film. Therefore, a particle dispersion liquid having excellent particle dispersibility is required, which can produce a particle-containing plating solution having excellent dispersibility.

[0009] Therefore, there is a demand for the development of a particle dispersion having excellent particle dispersibility, and a particle-containing plating solution having excellent particle dispersibility using the particle dispersion. [Prior art documents] [Patent documents]

[0010] [Patent Document 1] JP 2004-60050 A Summary of the Invention [Problem to be solved by the invention]

[0011] An object of the present invention is to provide a particle dispersion and a particle-containing plating solution that have excellent particle dispersibility. [Means for solving the problem]

[0012] As a result of extensive research, the present inventors have found that the above-mentioned object can be achieved by a particle dispersion containing particles and a nonionic surfactant A exhibiting a specific structure, and a particle-containing plating solution containing the particle dispersion, and have thus completed the present invention.

[0013] That is, the present invention relates to the following particle dispersion and its production method, particle-containing plating solution, particle-containing plating film, and particle-containing plating method. 1. Particles, and The following general formula (1) [ka] (In the formula, R 1-1 and R 1-2are the same or different and each represents an oxyalkylene group; R 1-3 and R 1-4 are the same or different and represent a hydrocarbon group having 1 to 10 carbon atoms. m and n are the same or different and represent an integer, where m+n=0 to 30. A particle dispersion liquid containing a nonionic surfactant A represented by the formula: 2. The particle dispersion according to item 1, wherein the oxyalkylene group has 1 or more and 5 or less carbon atoms. 3. The particle dispersion liquid according to item 1 or 2, wherein the content of the nonionic surfactant A is 1 g / L or more and 100 g / L or less. 4. The particle dispersion liquid according to any one of items 1 to 3, wherein the particles are fluorine-containing particles and / or fluorine-free particles. Item 5. The particle dispersion according to Item 4, wherein the fluorine-containing particles include at least one selected from the group consisting of polytetrafluoroethylene (PTFE), polyvinylidene fluoride (PVDF), perfluoroalkoxyalkane (PFA), perfluoroethylenepropene copolymer (FEP), ethylene tetrafluoroethylene copolymer (ETFE), polychlorotrifluoroethylene (PCTFE), ethylene chlorotrifluoroethylene copolymer (ECTFE), and polytetrafluoroethylene oxide (PTFEO). 6. The fluorine-free particles are polyethylene (PE), polyethersulfone (PES), polyetherimide (PEI), polyarylate (PAR), polyamideimide (PAI), polyphenylene ether (PPE), polylactic acid (PLA), polyamide (PA), ester-based thermoplastic elastomer (TPC), polyurethane (PU), aromatic polyether ketone, silicon carbide (SiC), diamond, boron nitride (BN), aluminum oxide (Al 2 O 3 ), graphite fluoride, tungsten carbide (WC), molybdenum disulfide (MoS 2 ), boron carbide (B 4 Item 6. The particle dispersion according to item 4 or 5, further comprising at least one selected from the group consisting of C), graphene, and graphite. 7. The particle dispersion liquid according to any one of items 1 to 6, wherein the content of the particles is 10 g / L or more and 1000 g / L or less. 8. The particle dispersion liquid according to any one of items 1 to 7, further comprising an amphoteric surfactant. 9. The particle dispersion according to item 8, wherein the content of the amphoteric surfactant is 1 g / L or more and 100 g / L or less. 10. The particle dispersion liquid according to any one of items 1 to 9, further comprising a cationic surfactant. 11. The particle dispersion according to item 10, wherein the content of the cationic surfactant is 1 g / L or more and 100 g / L or less. 12. Furthermore, the following general formula (4) [ka] (In the formula, R 4-1 R represents a hydrocarbon group having 5 to 30 carbon atoms. 4-2 and R 4-3 are the same or different and each represents an oxyalkylene group. p and q are the same or different and each represents an integer of 0 to 30. Item 12. The particle dispersion liquid according to any one of items 1 to 11, comprising a nonionic surfactant B represented by the following formula: 13. The particle dispersion liquid according to item 12, wherein the content of the nonionic surfactant B is 0.1 g / L or more and 100 g / L or less. 14. A method for producing a particle dispersion, comprising the steps of: The following general formula (1) [ka] (In the formula, R 1-1 and R 1-2 are the same or different and each represents an oxyalkylene group; R 1-3 and R 1-4 are the same or different and represent a hydrocarbon group having 1 to 10 carbon atoms. m and n are the same or different and represent an integer, where m+n=0 to 30. The production method according to claim 1, further comprising a step of dispersing particles in a solvent containing a nonionic surfactant A represented by the formula: 15. A particle-containing plating solution comprising the particle dispersion according to any one of items 1 to 14 and a plating solution. 16. The particle-containing plating solution according to Item 15, wherein the particle-containing plating solution is an electroless particle-containing nickel-phosphorus plating solution or an electrolytic particle-containing nickel plating solution. 17. The particle-containing plating solution according to item 15 or 16, wherein the content of the particle dispersion is 1 ml / L or more and 100 ml / L or less. 18. A particle-containing plating film formed by using the particle-containing plating solution according to any one of items 15 to 17. 19. A particle-containing plating method, comprising the step of immersing an object to be plated in the particle-containing plating solution according to any one of items 15 to 17. Effect of the Invention

[0014] The particle dispersion of the present invention has excellent particle dispersibility. In addition, the particle-containing plating solution of the present invention contains the particle dispersion and has excellent particle dispersibility. Furthermore, according to the method for producing the particle dispersion of the present invention, the particle dispersion of the present invention can be easily produced. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0015] 1.Particle dispersion The particle dispersion of the present invention is a particle dispersion containing particles and a nonionic surfactant A represented by general formula (1) described below. The particle dispersion of the present invention having the above characteristics contains the nonionic surfactant A represented by general formula (1), so that the particles can be uniformly dispersed in the particle dispersion, and in particular, fluorine-containing particles having strong water repellency can be uniformly dispersed in the particle dispersion. The particle dispersion of the present invention will be described in detail below.

[0016] In addition, in this specification, "room temperature" means 23°C.

[0017] (particle) The particles are not particularly limited, and known particles can be used. As such particles, fluorine-containing particles and fluorine-free particles can be used. These particles can be used alone or in combination of two or more kinds.

[0018] The fluorine-containing particles are not particularly limited as long as they are fluorine-containing particles that contain fluorine, and known fluorine-containing particles can be used. Examples of such fluorine-containing particles include fluorine-containing particles containing fluorine resins such as polytetrafluoroethylene (PTFE), polyvinylidene fluoride (PVDF), perfluoroalkoxyalkane (PFA), perfluoroethylene propene copolymer (FEP), ethylene tetrafluoroethylene copolymer (ETFE), polychlorotrifluoroethylene (PCTFE), ethylene chlorotrifluoroethylene copolymer (ECTFE), and polytetrafluoroethylene oxide (PTFEO); and fluorine-containing particles containing metal fluorides. Among these, fluorine-containing particles containing polytetrafluoroethylene (PTFE) are preferred because the dispersibility of the fluorine-containing particles in the particle dispersion is further improved and the surface potential of the particles can be well controlled.

[0019] The above fluorine-containing particles can be used alone or in combination of two or more kinds.

[0020] The average particle size of the fluorine-containing particles is preferably 0.01 μm or more, more preferably 0.05 μm or more, even more preferably 0.1 μm or more, and particularly preferably 0.15 μm or more. The average particle size of the fluorine-containing particles is preferably 100 μm or less, more preferably 10 μm or less, even more preferably 5 μm or less, and particularly preferably 1 μm or less. By having the average particle size of the fluorine-containing particles in the above range, the fluorine-containing particles can be more dispersed in the particle dispersion liquid, and the surface potential of the fluorine-containing particles can be more suitably controlled.

[0021] The content of the fluorine-containing particles in the particle dispersion is preferably 10 g / L or more, more preferably 60 g / L or more, even more preferably 70 g / L or more, and particularly preferably 80 g / L or more. The content of the fluorine-containing particles in the particle dispersion is preferably 1000 g / L or less, more preferably 800 g / L or less, even more preferably 750 g / L or less, and particularly preferably 600 g / L or less.

[0022] As the particles that do not contain fluorine, known particles other than fluorine-containing particles can be used. Examples of such particles that do not contain fluorine include particles of synthetic resin, ceramics, glass, talc, plastic, diamond, graphite, oxide, silicide, carbonate, carbide, sulfide, phosphate, boride, silicate, nitride, metal, etc.

[0023] Among the above-mentioned fluorine-free particles, more specific examples of synthetic resin particles include particles of polyethylene (PE), polyethersulfone (PES), polyetherimide (PEI), polyarylate (PAR), polyamideimide (PAI), polyphenylene ether (PPE), polylactic acid (PLA), polyamide (PA), ester-based thermoplastic elastomer (TPC), polyurethane (PU), and aromatic polyetherketone, etc. Examples of the aromatic polyetherketone include polyetherketone (PEK), polyetheretherketone (PEEK), polyetherketoneketone (PEKK), and polyetheretherketoneketone (PEEKK).

[0024] Among the above-mentioned fluorine-free particles, particles other than synthetic resins are specifically silicon carbide (SiC), diamond, boron nitride (BN), aluminum oxide (Al 2 O 3 ), graphite fluoride, tungsten carbide (WC), molybdenum disulfide (MoS 2 ), boron carbide (B 4 C), graphene, graphite, etc.

[0025] The above fluorine-free particles may be used alone or in combination of two or more kinds.

[0026] The content of the fluorine-free particles in the particle dispersion is preferably 10 g / L or more, more preferably 60 g / L or more, even more preferably 70 g / L or more, and particularly preferably 80 g / L or more. The content of the fluorine-free particles in the particle dispersion is preferably 1000 g / L or less, more preferably 800 g / L or less, even more preferably 750 g / L or less, and particularly preferably 600 g / L or less.

[0027] The average particle size of the fluorine-free particles in the particle dispersion is preferably 1 nm or more, more preferably 100 nm or more, even more preferably 1 μm or more, and particularly preferably 5 μm or more. The average particle size of the fluorine-free particles in the particle dispersion is preferably 200 μm or less, more preferably 100 μm or less, even more preferably 50 μm or less, and particularly preferably 30 μm or less. By having the average particle size of the fluorine-free particles in the above range, the particles can be more dispersed in the particle dispersion, and the surface potential of the particles can be more suitably controlled.

[0028] The particle content in the particle dispersion is preferably 10 g / L or more, more preferably 60 g / L or more, even more preferably 70 g / L or more, and particularly preferably 80 g / L or more. The particle content in the particle dispersion is preferably 1500 g / L or less, more preferably 1000 g / L or less, even more preferably 800 g / L or less, and particularly preferably 600 g / L or less.

[0029] (Nonionic surfactant A) As the nonionic surfactant A (hereinafter also referred to as "component (A)"), a nonionic surfactant represented by the following general formula (1) is used.

[0030] [ka]

[0031] In the above general formula (1), R1-1 and R 1-2 are the same or different and represent an oxyalkylene group. The carbon number of the oxyalkylene group is preferably 1 or more, and more preferably 2 or more. The carbon number of the oxyalkylene group is preferably 5 or less, more preferably 4 or less, and even more preferably 3 or less. When the carbon number of the oxyalkylene group is within the above range, the dispersibility of the particles is further improved.

[0032] In the above general formula (1), m and n are the same or different and each represents an integer. m and n are preferably 0 or more, and more preferably 2 or more. Moreover, m and n are preferably 30 or less, more preferably 20 or less, even more preferably 10 or less, and particularly preferably 5 or less. When m and n are within the above range, the dispersibility of the particles is further improved.

[0033] In the above general formula (1), m+n is 0 to 30. If m+n exceeds 30, the dispersibility of the particles is poor. m+n is preferably 20 or less, and more preferably 10 or less.

[0034] In the above general formula (1), R 1-3 and R 1-4 R may be the same or different and represents a hydrocarbon group having 1 to 10 carbon atoms. If the number of carbon atoms is less than 1 or is 11 or more, the dispersibility of the particles is poor. 1-3 and R 1-4 The number of carbon atoms in R may be the same or different, and is preferably 2 or more. 1-3 and R 1-4 The number of carbon atoms of R may be the same or different and is preferably 5 or less, more preferably 4 or less. 1-3 and R 1-4 is preferably an alkyl group.

[0035] The component (A) is preferably a nonionic surfactant represented by the following general formula (1-2).

[0036] [ka]

[0037] In the above general formula (1-2), m, n, and m+n are the same as those explained in the above general formula (1).

[0038] More specifically, examples of component (A) include polyoxyethylene (C0) acetylenic glycol ether, polyoxyethylene (C1.3) acetylenic glycol ether (a mixture of a compound where m+n=2 and a compound where m+n=0 are mixed in a mixing ratio of 65%:35%), polyoxyethylene (C4) acetylenic glycol ether, polyoxyethylene (C6) acetylenic glycol ether, polyoxyethylene (C10) acetylenic glycol ether, polyoxyethylene (C20) acetylenic glycol ether, and the like.

[0039] The component (A) may use either a single compound or a combination of two or more different compounds.

[0040] The content of the (A) component in the particle dispersion is preferably 1 g / L or more, more preferably 5 g / L or more, even more preferably 10 g / L or more, and particularly preferably 15 g / L or more. The content of the (A) component in the particle dispersion is preferably 100 g / L or less, more preferably 80 g / L or less, even more preferably 60 g / L or less, and particularly preferably 50 g / L or less. By setting the lower limit of the content of the (A) component within the above range, the dispersibility of the particles is further improved. By setting the upper limit of the content of the (A) component within the above range, the dispersibility of the particles in a nickel plating solution such as a nickel-phosphorus plating solution is further improved.

[0041] ((B) Amphoteric surfactant) The particle dispersion of the present invention may further contain (B) an amphoteric surfactant (hereinafter also referred to as "component (B)". When the particle dispersion contains component (B), the particles can be more uniformly dispersed in the particle-containing plating film formed with the particle-containing plating solution containing the particle dispersion of the present invention.

[0042] The amphoteric surfactant (B) is not particularly limited, and any known amphoteric surfactant can be used. As such an amphoteric surfactant, an amphoteric surfactant represented by the following general formula (2) is preferable.

[0043] [ka]

[0044] In the above general formula (2), R 2-1 is preferably a hydrocarbon group, more preferably an alkyl group. 2-1 The number of carbon atoms in R is preferably 5 or more, more preferably 8 or more, and even more preferably 10 or more. 2-1 The number of carbon atoms is preferably 30 or less, more preferably 20 or less, and even more preferably 18 or less.

[0045] In the above general formula (2), R 2-2 , and R 2-3 are the same or different and are preferably a hydrocarbon group having 1 to 10 carbon atoms, more preferably an alkyl group having 1 to 10 carbon atoms. 2-2 , and R 2-3 Each of the carbon atoms may be the same or different and is preferably 5 or less, more preferably 3 or less, and further preferably 1.

[0046] In the above general formula (2), R 2-4 is preferably a hydrocarbon group having 1 to 10 carbon atoms, more preferably an alkylene group having 1 to 10 carbon atoms. 2-4 The number of carbon atoms is preferably 5 or less, more preferably 3 or less, and even more preferably 1.

[0047] More specifically, the above-mentioned component (B) includes coconut oil dimethylaminoacetic acid betaine, lauryl dimethylaminoacetic acid betaine, stearyl dimethylaminoacetic acid betaine, etc. Among these, coconut oil dimethylaminoacetic acid betaine is preferred in that it can disperse particles more uniformly in the particle-containing plating film formed with the particle-containing plating solution containing the particle dispersion of the present invention.

[0048] The component (B) may use either a single compound or a combination of two or more different compounds.

[0049] The content of the (B) component in the particle dispersion is preferably 1 g / L or more, more preferably 2 g / L or more, even more preferably 5 g / L or more, and particularly preferably 7 g / L or more. The content of the (B) component in the particle dispersion is preferably 100 g / L or less, more preferably 80 g / L or less, even more preferably 70 g / L or less, and particularly preferably 60 g / L or less. When the lower limit of the content of the (B) component is in the above range, the particle-containing plating solution containing the particle dispersion of the present invention can more easily form a particle-containing plating film. When the upper limit of the content of the (B) component is in the above range, the particles can be more uniformly dispersed in the particle-containing plating film formed by the particle-containing plating solution containing the particle dispersion of the present invention.

[0050] ((C) Cationic Surfactant) The particle dispersion of the present invention may further contain (C) a cationic surfactant (hereinafter, also referred to as "component (C)". When the particle dispersion contains component (C), the particle-containing plating solution containing the particle dispersion of the present invention becomes more likely to form a particle-containing plating film.

[0051] The cationic surfactant (C) is not particularly limited, and any known cationic surfactant can be used. As such a cationic surfactant, cationic surfactants represented by the following general formulas (3-1) and (3-2) are preferred.

[0052] [ka]

[0053] [ka]

[0054] In the above general formula (3-1), R 3-1-1is preferably a hydrocarbon group, more preferably an alkyl group. 3-1-1 The number of carbon atoms in R is preferably 5 or more, more preferably 8 or more, and even more preferably 10 or more. 3-1-1 The number of carbon atoms is preferably 30 or less, more preferably 20 or less, and even more preferably 18 or less.

[0055] In the above general formula (3-1), R 3-1-2 , R 3-1-3 , and R 3-1-4 R may be the same or different and represents a hydrocarbon group having 1 to 20 carbon atoms. 3-1-2 , R 3-1-3 , and R 3-1-4 may be the same or different and each has preferably 7 or less, more preferably 3 or less, and further preferably 1 carbon atom.

[0056] In the above general formula (3-1), X represents a halogen element, a sulfate group, or the like. Examples of the halogen element include chlorine and bromine, and chlorine is preferred. Furthermore, the sulfate group is preferably an alkyl sulfate group, and more preferably a methyl sulfate group. By making X the above group, the particle-containing plating solution containing the particle dispersion of the present invention can more easily form a particle-containing plating film.

[0057] In the above general formula (3-2), R 3-2-1 is preferably a hydrocarbon group, more preferably an alkyl group. 3-2-1 The number of carbon atoms in R is preferably 5 or more, more preferably 8 or more, and even more preferably 10 or more. 3-2-1 The number of carbon atoms is preferably 30 or less, more preferably 20 or less, and even more preferably 18 or less.

[0058] In the above general formula (3-2), R 3-2-2 , and R 3-2-3 R may be the same or different and represents a hydrocarbon group having 1 to 20 carbon atoms. 3-2-2 , and R 3-2-3 R may be the same or different and has a carbon number of preferably 1 to 5, more preferably 1 to 3. 3-2-2 , and R 3-2-3 may have a hydroxyl group at its terminal.

[0059] In the above general formula (3-2), X represents a halogen element, a sulfate group, or the like. Examples of the halogen element include chlorine and bromine, and chlorine is preferred. Furthermore, the sulfate group is preferably an alkyl sulfate group, and more preferably a methyl sulfate group. By making X the above group, the particle-containing plating solution containing the particle dispersion of the present invention can more easily form a particle-containing plating film.

[0060] More specifically, the component (C) may be hexadecyltrimethylammonium chloride, lauryltrimethylammonium chloride, stearyltrimethylammonium chloride, behenyltrimethylammonium chloride, coconut alkyltrimethylammonium chloride, methylhexadecyltrimethylammonium sulfate, didecyldimethylammonium chloride, dilauryldimethylammonium chloride, distearyldimethylammonium chloride, dioleyldimethylammonium chloride, dihydrogenated tallow alkyldimethylammonium chloride, stearyldimethylbenzylammonium chloride, benzalkonium chloride, methyldidecyldimethylammonium sulfate, 1-methyl-1-hydroxyethyl-2-tallow alkyl - Imidazo R Among these, hexadecyltrimethylammonium chloride is preferred in that the particle-containing plating solution containing the particle dispersion of the present invention makes it easier to form a particle-containing plating film.

[0061] The component (C) may use either a single compound or a combination of two or more different compounds.

[0062] The content of the (C) component in the particle dispersion is preferably 1 g / L or more, more preferably 2 g / L or more, even more preferably 5 g / L or more, and particularly preferably 10 g / L or more. The content of the (C) component in the particle dispersion is preferably 100 g / L or less, more preferably 80 g / L or less, even more preferably 70 g / L or less, and particularly preferably 60 g / L or less. When the lower limit of the content of the (C) component is in the above range, the particle-containing plating solution containing the particle dispersion of the present invention is more likely to form a particle-containing plating film. When the upper limit of the content of the (C) component is in the above range, the dispersibility of the particles is further improved.

[0063] ((D) Nonionic surfactant B) The particle dispersion of the present invention may further contain a nonionic surfactant B (hereinafter, also referred to as "component (D)"). When the particle dispersion contains component (D), the particles can be more uniformly dispersed in the particle-containing plating film formed with the particle-containing plating solution containing the particle dispersion of the present invention.

[0064] The (D) nonionic surfactant B is not particularly limited as long as it is a surfactant other than the above-mentioned nonionic surfactant A, and any known nonionic surfactant can be used. As such a nonionic surfactant, a nonionic surfactant represented by the following general formula (4) is preferable.

[0065] [ka]

[0066] In the above general formula (4), R 4-1 is preferably a hydrocarbon group, more preferably an alkyl group. 4-1 The number of carbon atoms in R is preferably 5 or more, more preferably 8 or more, and even more preferably 10 or more. 4-1 The number of carbon atoms is preferably 30 or less, more preferably 20 or less, and even more preferably 18 or less.

[0067] In the above general formula (4), R 4-2 , and R 4-3are the same or different and represent an oxyalkylene group. The carbon number of the oxyalkylene group is preferably 1 or more, more preferably 2 or more. The carbon number of the oxyalkylene group is preferably 5 or less, more preferably 4 or less, and even more preferably 3 or less. When the carbon number of the oxyalkylene group is within the above range, the particles can be more uniformly dispersed in the particle-containing plating film formed with the particle-containing plating solution containing the particle dispersion of the present invention.

[0068] In the above general formula (4), p and q are the same or different and each represents an integer. p and q are preferably 0 or more, and more preferably 2 or more. Furthermore, p and q are preferably 30 or less, more preferably 20 or less, even more preferably 10 or less, and particularly preferably 5 or less. When p and q are within the above ranges, particles can be more uniformly dispersed in the particle-containing plating film formed with the particle-containing plating solution containing the particle dispersion of the present invention.

[0069] In the above general formula (4), p+q is preferably 0 or more. Moreover, p+q is preferably 30 or less, more preferably 20 or less, and even more preferably 10 or less. Since p and q are integers, p+q is also an integer.

[0070] More specifically, the above-mentioned component (D) includes polyoxyethylene stearylamine, polyoxyethylene laurylamine, polyoxyethylene oleylamine, polyoxyethylene alkyl (coconut)amine, polyoxyethylene tallow alkylamine, etc. Among these, polyoxyethylene stearylamine is preferred in that it can disperse particles more uniformly in the particle-containing plating film formed with the particle-containing plating solution containing the particle dispersion of the present invention.

[0071] The component (D) may use either a single compound or a combination of two or more different compounds.

[0072] The content of the (D) component in the particle dispersion is preferably 0.1 g / L or more, more preferably 5 g / L or more, and even more preferably 10 g / L or more. The content of the (D) component in the particle dispersion is preferably 100 g / L or less, more preferably 70 g / L or less, even more preferably 50 g / L or less, and particularly preferably 40 g / L or less. When the lower limit of the content of the (D) component is in the above range, the particle-containing plating solution containing the particle dispersion of the present invention can more easily form a particle-containing plating film. When the upper limit of the content of the (D) component is in the above range, the particles can be more uniformly dispersed in the particle-containing plating film formed by the particle-containing plating solution containing the particle dispersion of the present invention.

[0073] (Other Ingredients) The particle dispersion of the present invention may contain an acid or a salt thereof used as a component of a plating solution other than the above components (A) to (D). Suitable examples of such acids or salts include complexing agents such as malic acid and succinic acid, or salts thereof (e.g., sodium salt, potassium salt, ammonium salt, etc.); hypophosphorous acid or salts thereof (e.g., sodium salt, potassium salt, ammonium salt, etc.); sulfuric acid, phosphorous acid, or salts thereof (e.g., sodium salt, potassium salt, ammonium salt, etc.).

[0074] The above acids or salts thereof may be used alone or in combination of two or more.

[0075] The content of the acid or salt thereof in the particle dispersion is preferably 1 g / L or more, more preferably 10 g / L or more, even more preferably 30 g / L or more, and particularly preferably 50 g / L or more. By setting the lower limit of the content within the above range, the dispersibility of the particle dispersion of the present invention is further improved. In addition, the content of the acid or salt thereof in the particle dispersion is preferably 500 g / L or less, more preferably 250 g / L or less, even more preferably 200 g / L or less, and particularly preferably 150 g / L or less.

[0076] (solvent) The particle dispersion of the present invention preferably has a configuration in which the above-mentioned components are contained in a solvent.

[0077] The solvent is not particularly limited as long as it can contain the above-mentioned components, and examples thereof include water, isopropyl alcohol, etc. Among these, water is preferred from the viewpoint of high safety.

[0078] The particle dispersion of the present invention may contain particles in a solvent and may also contain some of the above-mentioned components. That is, the particle dispersion of the present invention may contain the above-mentioned components (A), (B), (C), and (D) by separately adding them to a particle-containing plating solution described below, both in the case where the particle dispersion contains them and in the case where the particle dispersion does not contain them. From the above viewpoint, the particle dispersion of the present invention may be a particle dispersion containing particles and at least one selected from the group consisting of the above-mentioned components (A), (B), (C), and (D).

[0079] (Characteristics of particle dispersion) The particle dispersion of the present invention is preferably neutral or alkaline. The particle dispersion of the present invention has a pH of preferably 5 or more, more preferably 5.5 or more, and even more preferably 6 or more. The pH is preferably 12 or less, and more preferably 10 or less. By having the pH of the particle dispersion in the above range, the dispersibility of the particles is further improved, and the surface potential of the particles can be better controlled.

[0080] 2. Method for producing particle dispersion The method for producing the particle dispersion of the present invention is not particularly limited, and may be, for example, The following general formula (1) [ka] (In the formula, R 1-1 and R 1-2 are the same or different and each represents an oxyalkylene group; R 1-3 and R 1-4are the same or different and represent a hydrocarbon group having 1 to 10 carbon atoms. m and n are the same or different and represent an integer, where m+n=0 to 30. The nonionic surfactant A can be produced by a production method including a step of dispersing particles in a solvent containing the nonionic surfactant A represented by the following formula: The above production method will now be described by way of example.

[0081] The nonionic surfactant A represented by the above general formula (1) is the same as the nonionic surfactant A explained in the above-mentioned particle dispersion liquid of the present invention.

[0082] In the above step, particles are dispersed in a solvent containing the nonionic surfactant A. The particles are the same as those described above in the particle dispersion liquid of the present invention.

[0083] In the above step, the method for dispersing the particles in the solvent containing the nonionic surfactant A is not particularly limited, and the particles can be dispersed by a conventionally known method. For example, the method includes a method in which the particles are added to the solvent containing the nonionic surfactant A while stirring the solvent with a stirrer such as a homogenizer.

[0084] In the above step, the temperature of the solvent containing the nonionic surfactant A is not particularly limited. In general, it is in the range of 20° C. or more and 40° C. or less, and from the viewpoint of further improving the dispersibility of the particles, it is preferably 25° C. or more and 30° C. or less.

[0085] In the production method of the present invention, particles are dispersed in a solvent containing the nonionic surfactant A represented by the above general formula (1). That is, the nonionic surfactant A is added to the solvent first, and then the particles are added. If the particles are dispersed in the solvent first, the particles aggregate, resulting in poor dispersibility of the particles.

[0086] The particle dispersion liquid can be produced by the production method described above.

[0087] 3.Particle-containing plating solution The particle-containing plating solution of the present invention is a particle-containing plating solution containing a particle dispersion and a plating solution.

[0088] The particle-containing plating solution of the present invention may be used for either electroless plating or electrolytic plating. That is, the particle-containing plating solution of the present invention can be used as an electroless particle-containing plating solution or an electrolytic particle-containing plating solution.

[0089] In addition, the components (A), (B), (C), and (D) described in the particle dispersion of the present invention may be separately added to the particle-containing plating solution of the present invention, both in the case where the particle dispersion contains the components and in the case where the particle dispersion does not contain the components, so that the particle-containing plating solution of the present invention contains the components.

[0090] The particle dispersion is the particle dispersion of the present invention described above, and the blending, production method, etc. are the same as those of the particle dispersion of the present invention described above.

[0091] The content of the particle dispersion in the particle-containing plating solution is preferably 1 ml / L or more, more preferably 5 ml / L or more, and even more preferably 10 ml / L or more. The content of the particle dispersion in the particle-containing plating solution is preferably 100 ml / L or less, more preferably 90 ml / L or less, and even more preferably 80 ml / L or less. When the lower limit of the content of the particle dispersion is in the above range, the particles can be more uniformly dispersed in the particle-containing plating film. When the upper limit of the content of the particle dispersion is in the above range, the particle-containing plating film can be more easily formed.

[0092] The plating solution contained in the particle-containing plating solution of the present invention is not particularly limited, and a known plating solution can be used. Such plating solutions include electroless plating solution and electrolytic plating solution. When an electroless plating solution is used as the plating solution contained in the particle-containing plating solution of the present invention, the particle-containing plating solution of the present invention becomes an electroless particle-containing plating solution. In addition, when an electrolytic plating solution is used as the plating solution contained in the particle-containing plating solution of the present invention, the particle-containing plating solution of the present invention becomes an electrolytic particle-containing plating solution.

[0093] The electrolytic plating solution is not particularly limited, and examples thereof include electrolytic nickel plating solutions such as electrolytic nickel-phosphorus plating solution and electrolytic nickel-boron plating solution; electrolytic copper plating solution; electrolytic gold plating solution; and electrolytic silver plating solution. Among these, electrolytic nickel plating solution is preferably used. That is, the particle-containing plating solution of the present invention is preferably an electrolytic particle-containing nickel plating solution.

[0094] The electroless plating solution is not particularly limited, and examples thereof include electroless nickel plating solutions such as electroless nickel-phosphorus plating solution and electroless nickel-boron plating solution; electroless copper plating solution; electroless gold plating solution; and electroless silver plating solution. Among these, electroless nickel plating solutions such as electroless nickel-phosphorus plating solution and electroless nickel-boron plating solution are preferably used, and electroless nickel-phosphorus plating solution is more preferably used. That is, the particle-containing plating solution of the present invention is preferably an electroless particle-containing nickel plating solution, and more preferably an electroless particle-containing nickel-phosphorus plating solution.

[0095] Hereinafter, each component contained in the electroless nickel-phosphorus (Ni-P) plating solution will be described as an example.

[0096] (Water-soluble nickel compounds) The electroless Ni-P plating solution preferably contains a water-soluble nickel compound.

[0097] The water-soluble nickel compound is not particularly limited, and any known nickel compound used in electroless Ni-P plating baths can be used. The water-soluble nickel compound is preferably, for example, water-soluble nickel inorganic salts such as nickel sulfate, nickel chloride, nickel hypophosphite, and nickel carbonate; water-soluble nickel organic salts such as nickel acetate and nickel malate, and hydrates thereof.

[0098] The water-soluble nickel compounds may be used alone or in combination of two or more.

[0099] The concentration of the water-soluble nickel compound in the electroless Ni-P plating solution is not particularly limited and can be adjusted appropriately. The concentration of the water-soluble nickel compound can be, for example, 0.01 g / L or more, more preferably 0.5 g / L or more, and even more preferably 1 g / L or more, as nickel metal. The concentration of the water-soluble nickel compound can be, for example, 100 g / L or less, more preferably 50 g / L or less, and even more preferably 10 g / L or less, as nickel metal. If the concentration of the water-soluble nickel compound is less than 0.01 g / L as nickel metal, the deposition rate may be slow, and if it exceeds 100 g / L, the bath stability may be reduced, so it is preferable to set it to the above range.

[0100] (reducing agent) The reducing agent is preferably at least one selected from the group consisting of hypophosphorous acid and hypophosphites (for example, sodium salts, potassium salts, ammonium salts, etc.).

[0101] The reducing agent may be used alone or in combination of two or more kinds.

[0102] The concentration of the reducing agent (hypophosphorous acid, hypophosphites, and hydrates thereof, etc.) in the electroless Ni-P plating solution is preferably 15 g / L or more, more preferably 20 g / L or more. The above concentration is preferably 80 g / L or less, more preferably 60 g / L or less. If the reducing agent concentration is less than 15 g / L or more than 80 g / L, the adhesion of the electroless Ni-P plating may decrease, so the above range is preferable.

[0103] (Complexing Agent) The electroless Ni-P plating solution preferably contains, as a complexing agent, glycine, gluconate, etc. The gluconate is preferably, for example, a sodium salt, a potassium salt, an ammonium salt, etc.

[0104] Preferred examples of other complexing agents include monocarboxylic acids such as formic acid and acetic acid, or their salts (e.g., sodium salts, potassium salts, ammonium salts, etc.); dicarboxylic acids such as malonic acid, succinic acid, adipic acid, maleic acid, and fumaric acid, or their salts (e.g., sodium salts, potassium salts, ammonium salts, etc.); hydroxycarboxylic acids such as malic acid, lactic acid, glycolic acid, and citric acid, or their salts (e.g., sodium salts, potassium salts, ammonium salts, etc.); ethylenediaminediacetic acid, ethylenediaminetetraacetic acid, or their salts (e.g., sodium salts, potassium salts, ammonium salts, etc.); and amino acids such as alanine and arginine.

[0105] The complexing agent may be used alone or in combination of two or more kinds.

[0106] The concentration of the complexing agent in the electroless Ni-P plating solution is not particularly limited and can be adjusted appropriately. The electroless Ni-P plating bath preferably contains 1 g / L or more of the complexing agent, more preferably 2 g / L or more, and even more preferably 5 g / L or more. The electroless Ni-P plating bath preferably contains 100 g / L or less of the complexing agent, more preferably 50 g / L or less, and even more preferably 30 g / L or less. If the concentration of the complexing agent is less than 1 g / L, the bath stability may decrease, and if it exceeds 100 g / L, the deposition rate may decrease, so it is preferable to set the concentration within the above range.

[0107] (stabilizers, pH adjusters, surfactants, etc.) In addition to the above-mentioned components, the electroless Ni-P plating solution may contain known additives used in electroless Ni-P plating solutions, such as stabilizers, pH adjusters, and surfactants, if necessary.

[0108] Examples of the stabilizer include lead compounds (e.g., lead nitrate, lead acetate, etc.), cadmium compounds (e.g., cadmium nitrate, cadmium acetate, etc.), thallium compounds (e.g., thallium sulfate, thallium nitrate, etc.), antimony compounds (e.g., antimony chloride, potassium antimonyl tartrate, etc.), tellurium compounds (e.g., telluric acid, tellurium chloride, etc.), chromium compounds (e.g., chromium oxide, chromium sulfate, etc.), iron compounds (e.g., iron sulfate, iron chloride, etc.), manganese compounds (e.g., manganese sulfate, manganese nitrate, etc.), bismuth compounds (e.g., bismuth nitrate, bismuth acetate, etc.), tin compounds (e.g., tin sulfate, tin chloride, etc.), selenium compounds (e.g., selenic acid, selenious acid, etc.), cyanides (e.g., methyl cyanide, isopropyl cyanide, etc.), and the like.

[0109] The stabilizers may be used alone or in combination of two or more.

[0110] The concentration of the stabilizer in the electroless Ni-P plating solution is not particularly limited, and can be, for example, about 0.1 mg / L or more and 500 mg / L or less. In order to improve the stability of the electroless Ni-P plating solution, it is preferable to set the concentration of the stabilizer to about 0.1 mg / L or more. If the concentration of the stabilizer exceeds 500 mg / L, there may be some places where the plating film is not formed (non-deposited places), so it is preferable to set the concentration within the above range.

[0111] As the pH adjuster, for example, an acid such as hydrochloric acid, sulfuric acid, phosphoric acid, etc.; or an alkali such as sodium hydroxide, potassium hydroxide, ammonia water, etc. is preferably used.

[0112] The pH of the electroless Ni-P plating solution is preferably 3 or more, more preferably 4 or more. The pH of the electroless Ni-P plating solution is preferably 12 or less, more preferably 9 or less. The pH of the plating bath can be adjusted using the above-mentioned pH adjuster. If the pH is less than 3, non-precipitation may occur, and if it exceeds 12, the bath stability may decrease, so it is preferable to set the pH within the above range.

[0113] As the surfactant, various surfactants such as nonionic, anionic, cationic, and amphoteric surfactants can be used. For example, aromatic or aliphatic sulfonic acid alkali salts, aromatic or aliphatic sulfonic acid alkali metal salts, etc. can be mentioned. The surfactant can be used alone or in combination of two or more. When two or more surfactants are used in combination, the mixing ratio is not particularly limited and can be appropriately determined.

[0114] The concentration of the surfactant in the electroless Ni-P plating solution is not particularly limited, and can be, for example, about 0.01 mg / L or more and 1000 mg / L or less. In order to further improve the effect of preventing pits in the electroless Ni-P plating bath, it is preferable to set the concentration of the surfactant to about 0.01 mg / L or more. In addition, when the concentration of the surfactant is 1000 mg / L or less, the decrease in deposition property due to foaming is further suppressed.

[0115] 4. Method for producing particle-containing plating solution The method for producing the particle-containing plating solution is not particularly limited, and the particle-containing plating solution can be produced, for example, by mixing and stirring the particle dispersion and the plating solution.

[0116] The mixing ratio of the particle dispersion and the plating solution may be such that the content of the particle dispersion in the particle-containing plating solution is the amount described above for the particle-containing plating solution.

[0117] The liquid temperatures of the particle dispersion and the plating liquid during mixing are not particularly limited, and they may be mixed at about room temperature.

[0118] After the particle dispersion liquid and the plating liquid are mixed, it is preferable to stir them by a known stirring method such as stirring with a stirrer.

[0119] The particle-containing plating solution is produced by the production method described above.

[0120] 5.Particle-containing plating film The particle-containing plating film of the present invention is a particle-containing plating film formed using the above-mentioned particle-containing plating solution. As the particle-containing plating solution, the above-mentioned particle-containing plating solution of the present invention can be used.

[0121] 6.Particle-containing plating method The particle-containing plating method of the present invention is a plating method including a step of immersing an object to be plated in the above-mentioned particle-containing plating solution. As the particle-containing plating solution, the above-mentioned particle-containing plating solution of the present invention can be used.

[0122] The object to be plated is not particularly limited, and examples thereof include various substances on which it is necessary to form a particle-containing plating film that exhibits the properties of the particles, such as low friction and non-adhesiveness. EXAMPLES

[0123] The present invention will be described in more detail below with reference to examples and comparative examples, but the present invention is not limited to these examples.

[0124] The raw materials used in the examples and comparative examples are as follows.

[0125] Fluorine-containing particles Polytetrafluoroethylene (PTFE) particles: average particle size 0.2 μm Fluorine-free particles Polyethylene (PE) particles: average particle size 10 μm

[0126] (A) Nonionic surfactant A A nonionic surfactant A represented by the following general formula (1) and shown in Table 1 was used. [ka]

[0127] [Table 1]

[0128] (B) Amphoteric surfactant B-1: Coconut oil dimethylaminoacetic acid betaine B-2: Lauryl dimethylaminoacetate betaine B-3: Stearyl dimethylaminoacetate betaine

[0129] (C) Cationic surfactants C-1: Hexadecyltrimethylammonium chloride C-2: Stearyl trimethyl ammonium chloride C-3: Didecyldimethylammonium chloride C-4: 1-Methyl-1-hydroxyethyl-2-tallow alkyl-imidazo R Umium chloride

[0130] (D) Amphoteric surfactant D-1: Polyoxyethylene stearylamine D-2: Polyoxyethylene laurylamine D-3: Polyoxyethylene oleylamine

[0131] Examples and Comparative Examples Production of fluorine-containing particle dispersion The above-mentioned raw materials were added in order to water as a solvent in the amounts shown in Tables 2 to 6 and 8, respectively, and stirred. Next, PTFE was added in the amount shown in Tables 2 to 6 and 8, and stirred with a homogenizer at 25°C for 60 minutes to produce a fluorine-containing particle dispersion.

[0132] Preparation of particle dispersions of fluorine-free particles The above-mentioned raw materials were added to water as a solvent in the amounts shown in Table 7 and stirred in order. Next, 100 g / L of PE was added and stirred with a homogenizer at 25° C. for 60 minutes to produce a particle dispersion liquid of fluorine-free particles.

[0133] Preparation of electroless nickel-phosphorus plating solution The following raw materials were added in order to water and stirred to prepare an electroless nickel-phosphorus plating solution. Nickel sulfate 6H2 O: 25g / L Malic acid: 15g / L Succinic acid: 5g / L Sodium hypophosphite: 25g / L Stabilizer: appropriate amount Ammonia water (pH adjuster): Adjust to pH 4.75

[0134] Preparation of electrolytic nickel plating solution The following ingredients were added to water in order and stirred to prepare an electrolytic nickel plating solution: Nickel sulfate 6H 2 O: 280g / L Nickel chloride 6H 2 O: 45g / L ·Boric acid: 40g / L

[0135] Manufacturing of particle-containing plating solution The electroless nickel-phosphorus plating solution or the electrolytic nickel plating solution was mixed with the particle dispersion and stirred to produce a particle-containing plating solution. The content of the particle dispersion in the particle-containing plating solution was 25 ml / L. In some examples, the above-mentioned components (A), (B), (C), and (D) were added to the particle-containing plating solution.

[0136] Formation of electroless particle-containing plating film Using a particle-containing plating solution, an electroless particle-containing plating film was formed under the following conditions. ·Bath temperature: 90℃ pH: 4.75 Plating time: 60 minutes -Plating film thickness (target): 10~12μm Plated object (test piece): Fe plate, 2.5 x 5 cm (0.25 dm 2 ) ·Bath load: 0.50dm 2 / L

[0137] Formation of electrolytic particle-containing plating film Using a particle-containing plating solution, an electrolytic particle-containing plating film was formed under the following conditions. ·Bath temperature: 50℃ pH: 4.20 Plating time: 50 minutes -Plating film thickness (target): 20μm -Plating object (test piece): Brass plate, 2.5 x 5 cm (0.25 dm 2 ) ·Current density: 2A / dm 2

[0138] (Evaluation method) The following evaluations were carried out for the examples and comparative examples.

[0139] Dispersibility of particle dispersion The dispersibility of the particle dispersion immediately after production was visually observed and evaluated according to the following evaluation criteria. Note that an evaluation of △ or higher is evaluated as being satisfactory for practical use. ◯: Good dispersion state △: Some aggregation and non-dispersion ×: Aggregation and severe non-dispersion

[0140] Deposition rate The weight difference between the test pieces before and after plating was measured and calculated according to the following formula. In the following formula, density is 7.0 g / cm 3 It was calculated as: Deposition rate (μm / h) = weight difference (mg) × 0.057

[0141] Dispersion of particles in particle-containing plating film The surface of the particle-containing plating film was observed using a backscattered electron composition image of a new scanning electron microscope (general-purpose FE-SEM: JEOL JSM-IT700HR), and the aggregation of PTFE or PE was confirmed and evaluated according to the following evaluation criteria. Note that an evaluation of △ or higher is considered to be satisfactory for practical use. ◯: Good dispersion state △: Some aggregation and non-dispersion ×: Aggregation and severe non-dispersion

[0142] Appearance of particle-containing plating film The gloss and pits of the particle-containing plating film were visually observed and evaluated according to the following evaluation criteria. Note that an evaluation of △ or higher is considered to be satisfactory for practical use. 〇: Good △: Appearance uneven ×: Extremely uneven appearance

[0143] Co-deposition rate of fluorine-containing particles A strike Ni plating was applied to a SUS plate, and after Ni-P / PTFE plating, the film was dissolved in 30% nitric acid and the solution was filtered. From the weights of the filtered PTFE particles and plating film, the following formula was used: PTFE The eutectoid ratio was calculated.

[0144]

number

[0145] The calculated PTFE co-deposition rate was evaluated according to the following evaluation criteria. A rating of △ or higher was deemed acceptable for practical use. 〇:Eutectoid rate over 20vol.% △:Eutectoid rate 5~20vol.% ×: Co-deposition rate less than 5 vol.%

[0146] Co-deposition rate of fluorine-free particles The cross section of the particle-containing plating film was observed using a backscattered electron composition image of a new scanning electron microscope (general-purpose FE-SEM: JEOL JSM-IT700HR), the PE content was confirmed, and the weight of the PE particles and plating film was From the above, the following formula By PE co-deposition rate Calculated.

[0147]

number

[0148] The calculated PE co-deposition ratio was evaluated according to the following evaluation criteria. A rating of △ or higher was deemed acceptable for practical use. 〇:Eutectoid rate over 20vol.% △:Eutectoid rate 5~20vol.% ×: Co-deposition rate less than 5 vol.%

[0149] The results are shown in Tables 2 to 8. The unit of blend amount in the tables is g / L.

[0150] [Table 2]

[0151] [Table 3]

[0152] [Table 4]

[0153] [Table 5]

[0154] [Table 6]

[0155] [Table 7]

[0156] [Table 8]

Claims

1. particle, The following general formula (1) 【Chemistry 1】 (In the formula, R １－１ and R １－２ are the same or different and each represents an oxyalkylene group; R １－３ and R １－４ are the same or different and each represents a hydrocarbon group having 1 to 10 carbon atoms; m and n are the same or different and each represents an integer, where m+n=0 to 20. A nonionic surfactant A represented by the formula: The following general formula (4) 【Chemistry 2】 (In the formula, R 4-1 represents a hydrocarbon group having 5 to 30 carbon atoms. R 4-2 and R 4-3 are the same or different and represent an oxyalkylene group. p and q are the same or different and represent an integer of 0 to 30.) A nonionic surfactant B represented by the formula: A particle dispersion for a particle-containing plating solution, comprising a solvent.

2. 2. The particle dispersion for a particle-containing plating solution according to claim 1, wherein the oxyalkylene group has 1 or more and 5 or less carbon atoms.

3. 2. The particle dispersion for particle-containing plating solution according to claim 1, wherein the content of the nonionic surfactant A in the particle dispersion for particle-containing plating solution is 1 g / L or more and 100 g / L or less.

4. The particle dispersion for a particle-containing plating solution according to claim 1 , wherein the particles are fluorine-containing particles and / or fluorine-free particles.

5. 5. The particle dispersion for a particle-containing plating solution according to claim 4, wherein the fluorine-containing particles include at least one selected from the group consisting of polytetrafluoroethylene (PTFE), polyvinylidene fluoride (PVDF), perfluoroalkoxyalkane (PFA), perfluoroethylenepropene copolymer (FEP), ethylenetetrafluoroethylene copolymer (ETFE), polychlorotrifluoroethylene (PCTFE), ethylenechlorotrifluoroethylene copolymer (ECTFE), and polytetrafluoroethylene oxide (PTFEO).

6. The fluorine-free particles include polyethylene (PE), polyethersulfone (PES), polyetherimide (PEI), polyarylate (PAR), polyamideimide (PAI), polyphenylene ether (PPE), polylactic acid (PLA), polyamide (PA), ester-based thermoplastic elastomer (TPC), polyurethane (PU), aromatic polyether ketone, silicon carbide (SiC), diamond, boron nitride (BN), aluminum oxide (Al 2 O 3 ), graphite fluoride, tungsten carbide (WC), molybdenum disulfide (MoS 2 ), boron carbide (B ４ C), graphene, and at least one selected from the group consisting of graphite.

7. 2. The particle dispersion for particle-containing plating solution according to claim 1, wherein the content of the particles in the particle dispersion for particle-containing plating solution is 10 g / L or more and 1000 g / L or less.

8. The particle dispersion for a particle-containing plating solution according to claim 1 , further comprising an amphoteric surfactant.

9. 9. The particle dispersion for particle-containing plating solution according to claim 8, wherein the content of the amphoteric surfactant in the particle dispersion for particle-containing plating solution is 1 g / L or more and 100 g / L or less.

10. The particle dispersion for a particle-containing plating solution according to claim 1 , further comprising a cationic surfactant.

11. The particle dispersion for particle-containing plating solution according to claim 10 , wherein the content of the cationic surfactant in the particle dispersion for particle-containing plating solution is 1 g / L or more and 100 g / L or less.

12. 2. The particle dispersion for particle-containing plating solution according to claim 1, wherein the content of the nonionic surfactant B in the particle dispersion for particle-containing plating solution is 0.1 g / L or more and 100 g / L or less.

13. A method for producing a particle dispersion for a particle-containing plating solution, comprising the steps of: The following general formula (1) 【Chemistry 3】 (In the formula, R １－１ and R １－２ are the same or different and each represents an oxyalkylene group; R １－３ and R １－４ are the same or different and each represents a hydrocarbon group having 1 to 10 carbon atoms; m and n are the same or different and each represents an integer, where m+n=0 to 20. A nonionic surfactant A represented by the formula: The following general formula (4) 【Chemistry 4】 (In the formula, R 4-1 represents a hydrocarbon group having 5 to 30 carbon atoms. R 4-2 and R 4-3 are the same or different and represent an oxyalkylene group. p and q are the same or different and represent an integer of 0 to 30.) Nonionic surfactant B represented by A production method comprising a step of dispersing particles in a solvent containing:

14. A particle-containing plating solution comprising the particle dispersion for particle-containing plating solution according to claim 1 and a plating solution.

15. The particle-containing plating solution according to claim 14, wherein the particle-containing plating solution is an electroless particle-containing nickel-phosphorus plating solution or an electrolytic particle-containing nickel plating solution.

16. 15. The particle-containing plating solution according to claim 14, wherein the content of the particle dispersion for particle-containing plating solution in the particle-containing plating solution is 1 ml / L or more and 100 ml / L or less.

17. A particle-containing plating film formed by using the particle-containing plating solution according to claim 14.

18. A particle-containing plating method comprising the step of immersing an object to be plated in the particle-containing plating solution according to claim 14.

19. An object to be plated, on which the particle-containing plating film according to claim 17 is formed.

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