Multilayer ceramic capacitor and paste for bump manufacturing

Abstract

Provided are a laminated ceramic capacitor and a paste for bump manufacturing with which the adhesive force between a capacitor body and a bump is improved. A laminated ceramic capacitor 1 according to the present invention is provided with: a laminate 2 in which a dielectric layer 14 and an internal electrode layer 15 are alternatingly laminated; an external electrode layer 3 that is disposed on each of two end surfaces of the laminate 2 provided at both ends in the length direction, covers end surface sides of two main surfaces provided at both ends in the lamination direction of the laminate and end surface sides of two side surfaces provided at both ends in the width direction, and is connected to the internal electrode layer; and, bumps 4 disposed sandwiching the external electrode layer 3 for covering a main surface side on each of two end surface sides of one of the two main surfaces of the laminate 2. The bumps 4 include a tin Sn region, a metal region M containing copper Cu, and a silver Ag region containing silver Ag.

Description

Technical Field

[0001] The present invention relates to a multilayer ceramic capacitor and a paste for manufacturing bumps.

Background Art

[0002] A multilayer ceramic capacitor has an inner layer portion in which dielectric layers and internal electrodes are alternately stacked. Then, dielectric layers as outer layer portions are disposed above and below the inner layer portion to form a rectangular parallelepiped laminate, and external electrodes are provided on both end faces in the longitudinal direction of the laminate to form a capacitor body. Furthermore, in order to suppress the occurrence of so-called "whining", a multilayer ceramic capacitor provided with bumps formed so as to cover a part of the external electrode on the side of the capacitor body mounted on the substrate is known (see Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, conventionally, the adhesive force between the capacitor body and the bumps was weak, and the bumps might peel off from the capacitor body.

[0005] An object of the present invention is to provide a multilayer ceramic capacitor and a paste for manufacturing bumps in which the adhesive force between the capacitor body and the bumps is improved.

Means for Solving the Problems

[0006] In order to solve the above problems, the present invention provides a multilayer ceramic capacitor including a laminate in which a dielectric layer and an internal electrode layer are alternately laminated, and external electrode layers disposed on respective two end faces provided at both ends in the length direction intersecting the lamination direction in the laminate, covering end face sides of two main faces provided at both ends in the lamination direction of the laminate, and end face sides of two side faces provided at both ends in the width direction intersecting the lamination direction and the length direction, and connected to the internal electrode layer, and bumps disposed on respective two end face sides on one of the two main faces of the laminate with the external electrode layer covering the main face side interposed therebetween, wherein the bumps include a tin region, a resin region, a metal region containing copper, and a silver region containing silver.

[0007] Provided is a paste for manufacturing a bump, which is used for manufacturing a bump of the above multilayer ceramic capacitor, includes tin, copper coated with silver or a metal containing copper coated with silver, a resin made of an epoxy resin, and a solvent, and does not include a curing agent.

Advantages of the Invention

[0008] According to the present invention, it is possible to provide a multilayer ceramic capacitor and a paste for manufacturing a bump in which the adhesive force between a capacitor body and a bump is improved.

Brief Description of the Drawings

[0009]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Mode for Carrying Out the Invention

[0010] The multilayer ceramic capacitor 1 according to the embodiment of the present invention will be described. FIG. 1 is a schematic perspective view of the multilayer ceramic capacitor 1 of the embodiment. FIG. 2 is a cross-sectional view of the multilayer ceramic capacitor 1 of the embodiment taken along line II-II in FIG. 1. FIG. 3 is a cross-sectional view of the multilayer ceramic capacitor 1 of the embodiment taken along line III-III in FIG. 1.

[0011] The multilayer ceramic capacitor 1 includes a capacitor body 1A having a substantially rectangular parallelepiped shape and including a laminate 2 and a pair of external electrode layers 3 provided at both ends of the laminate 2, and bumps 4 attached to the capacitor body 1A. Further, the laminate 2 includes an inner layer portion 11 including a plurality of sets of dielectric layers 14 and internal electrode layers 15.

[0012] In the following description, as terms representing the orientation of the multilayer ceramic capacitor 1, in the multilayer ceramic capacitor 1, the direction in which the pair of external electrode layers 3 are provided is defined as the length direction L. The direction in which the dielectric layer 14 and the internal electrode layer 15 are laminated is defined as the lamination direction T. The direction intersecting both the length direction L and the lamination direction T is defined as the width direction W. In the embodiment, the width direction W is orthogonal to both the length direction L and the lamination direction T. FIG. 2 is a cross-section passing through the center in the width direction W of the multilayer ceramic capacitor 1 and extending in the length direction L and the lamination direction T.

[0013] (Outer surface of the laminate 2) Of the six outer surfaces of the laminate 2, a pair of outer surfaces facing each other in the stacking direction T are defined as the first main surface A1 and the second main surface A2, a pair of outer surfaces facing each other in the width direction W are defined as the first side surface B1 and the second side surface B2, and a pair of outer surfaces facing each other in the length direction L are defined as the first end surface C1 and the second end surface C2. When there is no need to particularly distinguish between the first main surface A1 and the second main surface A2 for description, they are collectively referred to as the main surface A. When there is no need to particularly distinguish between the first side surface B1 and the second side surface B2 for description, they are collectively referred to as the side surface B. When there is no need to particularly distinguish between the first end surface C1 and the second end surface C2 for description, they are collectively referred to as the end surface C for description.

[0014] The laminate 2 preferably has rounded edges at the ridge line portions R1 including the corners. The ridge line portions R1 are the portions where two surfaces of the laminate 2, that is, the main surface A and the side surface B, the main surface A and the end surface C, or the side surface B and the end surface C intersect.

[0015] (Laminate 2) The laminate 2 includes a laminate body 10 having an inner layer portion 11 and outer layer portions 12 respectively disposed on both sides of the inner layer portion 11 in the stacking direction T, and side gap portions 16 provided on both sides of the laminate body 10 in the width direction W.

[0016] (Inner layer portion 11) The inner layer portion 11 includes a plurality of sets of dielectric layers 14 and internal electrode layers 15 alternately stacked along the stacking direction T.

[0017] The dielectric layer 14 is made of a ceramic material. As the ceramic material, for example, a dielectric ceramic mainly composed of BaTiO 3 is used.

[0018] The internal electrode layer 15 includes a plurality of first internal electrode layers 15a and a plurality of second internal electrode layers 15b. The first internal electrode layers 15a and the second internal electrode layers 15b are arranged alternately. The first internal electrode layer 15a includes a first facing portion 152a facing the second internal electrode layer 15b and a first lead-out portion 151a drawn from the first facing portion 152a toward the first end face C1. The end of the first lead-out portion 151a is exposed on the first end face C1 and is electrically connected to a first external electrode layer 3a described later. The second internal electrode layer 15b includes a second facing portion 152b facing the first internal electrode layer 15a and a second lead-out portion 151b drawn from the second facing portion 152b toward the second end face C2. The end of the second lead-out portion 151b is electrically connected to a second external electrode layer 3b described later. Electric charges are accumulated in the first facing portion 152a of the first internal electrode layer 15a and the second facing portion 152b of the second internal electrode layer 15b.

[0019] The internal electrode layer 15 is preferably formed of a metal material typified by, for example, nickel (Ni), copper (Cu), silver (Ag), palladium (Pd), a silver-palladium (Ag-Pd) alloy, gold (Au), or the like.

[0020] (Outer layer portion 12) The outer layer portion 12 is manufactured from the same material as the dielectric layer 14 of the inner layer portion 11.

[0021] (Side gap portion 16) The side gap portion 16 includes a first side gap portion 16a provided on the side B side of the laminate body 10 and a second side gap portion 16b provided on the second side B2 side of the laminate body 10. The side gap portion 16 is manufactured from the same material as the dielectric layer 14.

[0022] (External electrode layer 3) The external electrode layer 3 includes a first external electrode layer 3a provided on the first end face C1 and a second external electrode layer 3b provided on the second end face C2. The external electrode layer 3 covers not only the end face C but also a part of the main face A and the end face C side of the side face B.

[0023] As described above, the end of the first lead-out portion 151a of the first internal electrode layer 15a is exposed on the first end face C1 and is electrically connected to the first external electrode layer 3a. Further, the end of the second lead-out portion 151b of the second internal electrode layer 15b is exposed on the second end face C2 and is electrically connected to the second external electrode layer 3b. As a result, between the first external electrode layer 3a and the second external electrode layer 3b, a structure is formed in which a plurality of capacitor elements are electrically connected in parallel.

[0024] Further, the external electrode layer 3 includes, for example, an underlayer electrode layer 30, a first plating layer 31, and a second plating layer 32.

[0025] The underlayer electrode layer 30 is formed, for example, by applying and baking a conductive paste containing copper. Further, the underlayer electrode layer 30 of the embodiment contains glass.

[0026] The first plating layer 31 includes a first nickel plating layer 31a disposed on the outer periphery of the underlayer electrode layer 30 and a first tin plating layer 31b disposed on the outer periphery of the first nickel plating layer 31a. The second plating layer 32 includes a second nickel plating layer 32a disposed on the outer periphery of the first tin plating layer 31b and a second tin plating layer 32b disposed on the outer periphery of the second nickel plating layer 32a. However, the second plating layer 32 is disposed on the outer periphery of the bump 4 in the portion where the next extending bump 4 is disposed.

[0027] (Bump 4) The bump 4 includes a pair of first bumps 4a and second bumps 4b. The first bump 4a is disposed on one end face C1 side in the length direction L on the second main face A2 side which is the board mounting face of the capacitor body 1A, and the second bump 4b is disposed on the other end face C2 side. As shown in FIG. 2, the first bump 4a and the second bump 4b are disposed at a certain distance apart in the length direction L at positions that are substantially line-symmetric with respect to a center line extending in the width direction W passing through the center in the length direction L.

[0028] The bump 4 is disposed outside the capacitor body 1A, sandwiching the base electrode layer 30 of the external electrode layer 3 that extends to the second main surface A2 side, the first nickel plating layer 31a, and the first tin plating layer 31b. Further, the bump 4 has not only a portion where the base electrode layer 30, the first nickel plating layer 31a, and the first tin plating layer 31b extend on the second main surface A2, but also a portion that is in direct contact with a portion of the outer layer portion 12 of the laminate 2.

[0029] The second nickel plating layer 32a and the second tin plating layer 32b are disposed on the outer periphery of the first tin plating layer 31b in a portion where the bump 4 is not disposed in the laminate 2, but are disposed on the outer periphery of the bump 4 in a portion where the bump 4 is disposed.

[0030] In each bump 4, the central portion 42 in the length direction L is recessed. That is, in the length direction L of the bump 4, an end face side portion 41 closer to the end face C on the side where the bump 4 is disposed protrudes outside in the lamination direction T that is downward in the drawing from the central portion 42 of the bump 4. Also, in the length direction L of the bump 4, an end portion 45 on the side opposite to the end face C on the side where the bump 4 is disposed also protrudes outside in the lamination direction T that is downward in the drawing from the central portion 42.

[0031] Regarding the bump 4a, the central portion 42a in the length direction L of the bump 4a is recessed. In the length direction L of the bump 4a, an end face side portion 41a closer to the end face C1 on the side where the bump 4a is disposed protrudes outside in the lamination direction T that is downward in the drawing from the central portion 42a of the bump 4a. In the length direction L of the bump 4a, an end portion 45a on the side opposite to the end face C on the side where the bump 4a is disposed also protrudes outside in the lamination direction T that is downward in the drawing from the central portion 42.

[0032] Regarding the bump 4b, the central portion 42b in the length direction L of the bump 4b is recessed. In the length direction L, the end face side portion 41b closer to the end face C2 on the side where the bump 4b is disposed is protruded outward from the central portion 42b of the bump 4b to the outside in the stacking direction T which is downward in the figure. In the length direction L, the end portion 45b on the side opposite to the end face C on the side where the bump 4b is disposed also protrudes outward from the central portion 42 to the outside in the stacking direction T which is downward in the figure.

[0033] Also, the thickness difference T1 (distance in the stacking direction T) between the end face side portion 41 and the central portion 42 in the stacking direction T is within 5% or more and 30% or less of the thickness T2 of the bump 4 in the stacking direction T at the end face side portion 41.

[0034] FIG. 4 is an enlarged cross-sectional view of a part of the internal region of the bump 4. The bump 4 includes a tin Sn region, a resin region RE, a metal region M containing copper Cu or copper Cu and nickel Ni, and a silver Ag region. The metal region M is represented as Cu in the figure, but contains either copper Cu or a metal containing copper Cu and nickel Ni. Also, the metal region M may contain tin Sn. Note that the metal containing copper Cu and nickel Ni may have copper Cu and nickel Ni alloyed, or may further contain tin Sn and be an intermetallic compound. Note that the silver Ag region may contain tin Sn. These regions contained inside the tin Sn can be detected by analysis using WDX or EDX.

[0035] Also, the resin region RE includes those containing, inside, a metal region M containing copper Cu or copper Cu and nickel Ni surrounded by tin Sn and silver Ag. Note that when the metal region M contains copper Cu and nickel Ni, copper Cu and nickel Ni may be alloyed, or may further contain tin Sn and be an intermetallic compound. In particular, inside the resin region RE, the composition bonded as a material is detected as it is.

[0036] Furthermore, the bump 4 has a reaction part 55 between the external electrode layer 3 and the tin Sn contained in the bump 4, which is a part where various metals contained in the bump 4 and the external electrode layer 3 react. For example, the reaction part 55 may be between the nickel contained in the first nickel plating layer 31a and the tin Sn, or between the tin contained in the first tin plating layer 31b and the tin Sn. The reaction part 55 may also be between the copper Cu contained in the bump 4 and the nickel contained in the first nickel plating layer 31a and the tin contained in the first tin plating layer 31b or the tin Sn, or between the metal composed of Cu and Ni and the tin contained in the first tin plating layer 31b or the tin Sn of the bump 4.

[0037] The resin regions RE further include resin regions RE that are scattered around the bump 4, resin regions RE that are circular in shape and whose peripheries are covered with silver Ag, and resin regions RE that are disposed between the bump 4 and the laminate 2.

[0038] (Method for manufacturing the multilayer ceramic capacitor 1) FIG. 5 is a flowchart for explaining the method for manufacturing the multilayer ceramic capacitor 1. The method for manufacturing the multilayer ceramic capacitor 1 includes a laminate manufacturing step S1, a base electrode layer forming step S2, a first plating layer forming step S3, a bump arranging step S4, and a second plating layer forming step S5. FIG. 6 is a diagram for explaining the laminate manufacturing step S1, the base electrode layer forming step S2, and the first plating layer forming step S3. FIG. 7 is a diagram for explaining the bump arranging step S4 and the second plating layer forming step S5.

[0039] (Laminate manufacturing step S1) A ceramic slurry containing ceramic powder, a binder, and a solvent is formed into a sheet shape on the outer periphery of a carrier film using a die coater, a gravure coater, a microgravure coater, etc., to produce a laminated ceramic green sheet 101 that becomes a dielectric layer 14. Next, a conductive paste is printed in a strip shape on the laminated ceramic green sheet 101 by screen printing, inkjet printing, gravure printing, etc., to print a conductive pattern 102 that becomes an internal electrode layer 15 on the surface of the laminated ceramic green sheet 101, thereby producing a printed material sheet 103.

[0040] Subsequently, as shown in FIG. 6(a), a plurality of material sheets 103 are stacked such that the conductive patterns 102 face the same direction and are shifted by half a pitch in the width direction between adjacent material sheets 103 where the conductive patterns 102 are adjacent. Further, outer layer ceramic green sheets 112 that become outer layer portions 12 are stacked on both sides of the plurality of stacked material sheets 103, respectively.

[0041] The stacked plurality of material sheets 103 and the outer layer ceramic green sheets 112 are thermocompression bonded to create a mother block 110 shown in FIG. 6(b).

[0042] Next, the mother block 110 is cut along a cutting line X shown in FIG. 6(b) and a cutting line Y that intersects the cutting line X to produce a plurality of laminates 2 shown in FIG. 6(c).

[0043] (Base electrode layer formation step S2) Subsequently, a base electrode layer 30 is formed by applying and baking a conductive paste containing copper on the end face C of the laminate 2. The base electrode layer 30 is formed so as to extend not only to the end faces C on both sides of the laminate 2 but also to the main face A and the side face B side of the laminate 2 and cover a part of the end face C side of the main face A.

[0044] (First plating layer formation step S3) Next, a first nickel plating layer 31a is formed on the outer periphery of the base electrode layer 30, and a first tin plating layer 31b disposed on the outer periphery of the first nickel plating layer 31a is formed to manufacture the laminate body 10 shown in FIG. 6(d).

[0045] (Bump placement step S4) Prepare a paste 44 for bump manufacturing, which is used for manufacturing bumps. The paste 44 for bump manufacturing contains tin Sn, copper Cu coated with silver Ag, or a metal composed of copper and nickel coated with silver Ag instead of copper Cu, a resin made of an epoxy resin, and a solvent. The epoxy resin is a bisphenol A type epoxy resin. The solvent is, for example, diethylene glycol monobutyl ether, diethylene glycol monoethyl ether, or diethylene glycol monomethyl ether. And the paste 44 for bump manufacturing does not contain a curing agent such as a phenol resin or imidazole.

[0046] The volume ratio of tin Sn to the total volume of the metal is 70% or more and 90% or less. The volume ratio of the metal to the resin is 70% or more and 90% or less.

[0047] For forming the bumps 4, a holding substrate 40 as shown in FIG. 7 is used, for example. As shown in FIG. 7(a), in the holding substrate 40 in the embodiment, a convex portion 43 is formed at a position corresponding to the central portion 42 at the position where the paste 44 for bump manufacturing is disposed. The paste 44 for bump manufacturing is disposed on the holding substrate 40 by a screen printing method, a dispensing method, or the like. Then, since the convex portion 43 is formed as shown in FIG. 7(a), the paste 44 for bump manufacturing has a shape in which the central portion 42 in the length direction L is recessed from the end surface side portion 41 on the end surface C side. That is, the paste 44 for bump manufacturing has a shape in which the end surface side portion 41 on the end surface C side in the length direction L protrudes outward in the stacking direction T, which is downward in the figure, from the central portion 42 located on the central side in the length direction L with respect to the end surface side portion 41.

[0048] Next, as shown in FIG. 7(b), the capacitor body 1A is mounted on the outer periphery of the holding substrate 40 with the second main surface A2 side facing the holding substrate 40. At this time, the external electrode layer 3 of the capacitor body 1A and the bump manufacturing paste 44 are aligned, and the bump manufacturing paste 44 adheres to the capacitor body 1A.

[0049] In this state, a heating process is performed. As a result, at least a part of the metal in the paste generates an intermetallic compound and cures, and the bumps 4 in a state of being joined to the capacitor body 1A and the external electrode layer 3 are formed.

[0050] Thereafter, the capacitor body 1A is separated from the holding substrate 40 together with the bumps 4, and the state shown in FIG. 7(c) is obtained.

[0051] (Second plating layer formation step S5) Next, a second nickel plating layer 32a is formed on the exposed portion of the first tin plating layer 31b in the capacitor body 1A and the outer periphery of the bumps 4, and a second tin plating layer 32b is further formed on the outer periphery of the second nickel plating layer 32a. The multilayer ceramic capacitor 1 is manufactured by the above steps.

[0052] (Effects of the embodiment) In the embodiment, the bump 4 includes a tin Sn region, a resin region RE, and a metal region containing copper Cu or copper Cu and nickel Ni. Thereby, the adhesion between the bump 4 and the capacitor body 1A can be strengthened.

[0053] There is a reaction part 55 between the external electrode layer 3 and the tin Sn contained in the bump 4, which is nickel, a metal contained in the external electrode layer 3, or between the tin and the tin Sn contained in the bump 4. This reaction part 55 can improve the adhesive force between the external electrode layer 3 and the bump 4.

[0054] The resin region RE includes those disposed between the bump 4 and the laminate 2. The resin region RE serves as an adhesive between the bump 4 and the laminate 2, and can further improve the adhesion between the bump 4 and the laminate 2.

[0055] The resin region RE is made of an epoxy resin. Therefore, the adhesive force of the resin region RE can be further improved.

[0056] When mounting the multilayer ceramic capacitor on the substrate, solder is used. The solder is disposed between the substrate terminal and the bump 4. Then, in order to fix the multilayer ceramic capacitor 1 to the substrate, the solder is heated and melted. A part of the melted solder flows into the end face C. The solder that has flowed into the end face C may wet until it reaches the inner layer portion 11. If this happens, the vibration generated in the inner layer portion 11 of the multilayer ceramic capacitor 1 is transmitted from the solder to the substrate, so the anti-squeal effect of the bump 4 may be reduced.

[0057] However, in the embodiment, each of the bumps 4 has an end face side portion 41 closer to the end face C on the side where the bump 4 is disposed in the length direction L protruding outward in the stacking direction T than the central portion 42 of the bump 4.

[0058] Since the end face side portion 41 of the bump 4 protrudes outward in the stacking direction T in this way, it is possible to suppress the solder from wetting up to the region where the inner layer portion 11 exists on the end face C. As a result, the transmission of the vibration generated in the inner layer portion 11 of the multilayer ceramic capacitor 1 from the solder to the substrate is reduced, so it is possible to prevent the reduction of the anti-squeal effect by the bump 4, that is, the generation of squeal can be reduced.

[0059] The paste 44 for manufacturing the bump in the embodiment includes copper Cu coated with tin Sn and silver Ag, or a metal containing copper Cu and nickel Ni coated with silver Ag, a resin made of an epoxy resin, and a solvent, and does not contain a curing agent such as a phenol resin or imidazole. Since the paste 44 for bump manufacturing does not contain a curing agent, it is possible to react copper Cu coated with silver Ag with tin Sn or a metal containing copper Cu and nickel Ni coated with silver Ag. As a result, the strength as the bump 4 is improved.

[0060] The volume ratio of the metal to the resin is 70% or more and 90% or less. Therefore, sufficient conductivity can be obtained.

[0061] (Modified form) As described above, the embodiments of the present invention have been described. However, the present invention is not limited to this, and various modifications are possible within the scope of the invention.

[0062] FIG. 8 is a diagram showing a modified form of the multilayer ceramic capacitor 1 of the embodiment. In the description of the modified form, the same reference numerals are given to the same parts as those in the above-described embodiment. In the above-described embodiment, the bump 4 was provided so as to be in contact only with the second main surface A2 side. However, the present invention is not limited to this, and as shown in FIG. 8, the bump 4 may cover the end face C side.

[0063] Further, in the above-described embodiment, the bottom surface of the bump 4 has a shape in which the central portion 42 in the length direction L is recessed, and the end face side portion 41 closer to the end face C on the side where the bump 4 is disposed protrudes outward in the stacking direction T below the central portion 42 of the bump 4 in the figure. However, the present invention is not limited to this, and as shown in FIG. 8, the bottom surface of the bump 4 may be flat.

[0064] In the above-described embodiment, the external electrode layer 3 included the base electrode layer 30, the first plating layer 31, and the second plating layer 32. However, the present invention is not limited to this, and as shown in FIG. 8, both the first plating layer 31 and the second plating layer 32 may not be included, or only one of the first plating layer 31 and the second plating layer 32 may not be included.

[0065] Moreover, the method of making the end face side portion 41 of the bump 4 protrude more than the central portion 42 is not limited to the above-described method. For example, the manufacturing of the bump 4 can also be formed by applying a paste for bump manufacturing 44 on the main surface facing the upper side of the multilayer ceramic capacitor 1. In that case, by applying more paste for bump manufacturing 44 to the end face side portion 41 than to the central portion 42, the end face side portion 41 of the bump 4 can be made to protrude outward in the stacking direction T as in the embodiment.

Explanation of Signs

[0066] RE Resin region Sn Tin Cu Copper Ag Silver M Metal region 1 Multilayer ceramic capacitor 1A Capacitor body 2 Stacked body 3 External electrode layer 4 Bump 10 Stacked body main body 11 Inner layer portion 12 Outer layer portion 14 Dielectric layer 15 Internal electrode layer 30 Underlying electrode layer 31 First plating layer 32 Second plating layer 41 End face side portion 42 Central portion 44 Paste for bump manufacturing 55 Reaction portion

Claims

1. A laminate in which a dielectric layer and an internal electrode layer are alternately laminated, Two external electrode layers respectively disposed on each of two end faces provided at both ends in the length direction intersecting the lamination direction in the laminate, covering the end face sides of two main faces provided at both ends in the lamination direction of the laminate, and the end face sides of two side faces provided at both ends in the width direction intersecting the lamination direction and the length direction, and connecting to the internal electrode layer, Bumps disposed on each of the two end face sides on one of the two main faces of the laminate with the external electrode layer covering the main face side therebetween, The bump includes a tin region, a resin region, a metal region containing copper, and a silver region containing silver, A multilayer ceramic capacitor.

2. The resin region internally contains, At least one of the metal region coated with silver on the periphery and tin, The multilayer ceramic capacitor according to claim 1.

3. The external electrode layer includes, A base electrode layer containing copper connected to the internal electrode layer, A first nickel plating layer disposed on the outer periphery of the base electrode layer, A first tin plating layer disposed on the outer periphery of the first nickel plating layer, The bump is disposed on the first tin plating layer, The multilayer ceramic capacitor according to claim 1.

4. The external electrode layer includes, A base electrode layer containing copper connected to the internal electrode layer, A first nickel plating layer disposed on the outer periphery of the base electrode layer, A first tin plating layer disposed on the outer periphery of the first nickel plating layer, The bump is disposed on the first tin plating layer, The multilayer ceramic capacitor according to claim 2.

5. There is a reaction part between the metal contained in the external electrode layer and the tin contained in the bump between the external electrode layer and the tin contained in the bump, The multilayer ceramic capacitor according to any one of claims 1 to 4.

6. The resin region includes, Those that are scattered around the bump, The multilayer ceramic capacitor according to any one of claims 1 to 4.

7. The resin region includes, Those that are circular and surrounded by silver, The multilayer ceramic capacitor according to any one of claims 1 to 4.

8. The resin region includes, Those disposed between the bump and the laminate. The multilayer ceramic capacitor according to any one of claims 1 to 4.

9. The resin area is made of an epoxy resin, The multilayer ceramic capacitor according to any one of Claims 1 to 4.

10. For each of the bumps, in the length direction, an end face side portion of the bump that is close to the end face on the side where the bump is disposed protrudes outward in the stacking direction more than the central portion of the bump. The multilayer ceramic capacitor according to any one of Claims 1 to 4.

11. Tin, Copper coated with silver, or a metal containing copper coated with silver, A resin made of an epoxy resin, And a solvent, Not containing a curing agent, A paste for manufacturing bumps used for manufacturing bumps of a multilayer ceramic capacitor.

12. The volume ratio of the tin to the total volume of the metal is 70% or more and 90% or less. The paste for manufacturing bumps according to Claim 11.

13. The volume ratio of the metal to the resin is 70% or more and 90% or less. The paste for manufacturing bumps according to Claim 11.

14. The volume ratio of the metal to the resin is 70% or more and 90% or less. The paste for manufacturing bumps according to Claim 12.

15. The epoxy resin is a bisphenol A type epoxy resin. The paste for manufacturing bumps according to any one of Claims 11 to 14.

16. The solvent is diethylene glycol monobutyl ether, diethylene glycol monoethyl ether, or diethylene glycol monomethyl ether. The paste for manufacturing bumps according to any one of Claims 11 to 14.

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