Processing device and vibration detection method

Abstract

To provide a processing apparatus and a vibration detection method which can detect the vibration of the apparatus in the height direction of a workpiece being a processing object.SOLUTION: In a processing apparatus, a vibration detection unit 30 comprises: a light source 33; an interference unit 40 which irradiates a measurement object member with light 51 from the light source 33 and generates an interference pattern image including an interference pattern of the measurement object member; and an imaging unit 50 which captures the interference pattern image of the measurement object member generated by the interference unit 40, a control unit comprises: a storage unit which stores a first interference pattern image captured at prescribed timing by the imaging unit 50 and a second interference pattern image captured at different timing from the first interference pattern image; a comparing unit which compares the first interference pattern image with the second interference pattern image stored in the storage unit; and a vibration detection unit which detects vibration on the basis of the first interference pattern image and the second interference pattern image compared by the comparison unit.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a processing apparatus and a vibration detection method.

Background Art

[0002] A semiconductor wafer having a device formed on its surface is divided along a street set on the surface and diced by a processing apparatus such as a dicing apparatus or a laser processing apparatus (see Patent Documents 1 and 2).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0004] By the way, when a wafer is processed using the above-described processing apparatus, if the processing depth is insufficient, defective division may occur and the yield may decrease. Therefore, suppressing vibration in the depth direction of the wafer, that is, in the Z-axis direction, is a very important issue. Conventionally, however, there has been a problem that it is difficult to identify the cause of vibration in the Z-axis direction in the processing apparatus and the location of the cause.

[0005]

Means for Solving the Problems

[0006] ​In order to solve the above-described problems and achieve the object, the processing apparatus of the present invention includes a holding unit that holds a workpiece, a processing unit that processes the workpiece held by the holding unit, a moving unit that relatively moves the holding unit and the processing unit, a vibration detection unit, and a control unit that controls each component. The vibration detection unit includes a light source, an interference unit that irradiates light from the light source onto a member to be measured and generates an interference pattern image including an interference pattern of the member to be measured, and an imaging unit that images the interference pattern image of the member to be measured generated by the interference unit. The control unit includes a storage unit that stores a first interference pattern image imaged at a predetermined timing by the imaging unit and a second interference pattern image imaged at a timing different from that of the first interference pattern image, a comparison unit that compares the first interference pattern image and the second interference pattern image stored in the storage unit, and a vibration detection unit that detects vibration based on the first interference pattern image and the second interference pattern image compared by the comparison unit.

[0007] In the processing apparatus of the present invention, the control unit may further include a three-dimensional image generation unit that generates a three-dimensional image of the member to be measured based on a plurality of interference pattern images imaged by changing the position of the imaging unit in a direction parallel to the imaging direction.

[0008] In the processing apparatus of the present invention, the member to be measured may be a holding unit that holds a workpiece.

[0009] Further, the vibration detection method of the present invention is a vibration detection method for detecting vibration, including a light irradiation step of irradiating light onto a member to be measured, an imaging step of imaging an interference pattern image including an interference pattern generated by interference between reflected light reflected by the member to be measured and reference light generated from the other branched light after bifurcating the light, and a storage step of storing the interference pattern image imaged in the imaging step. The method further includes a comparison step of comparing a first interference pattern image imaged at a predetermined timing with a second interference pattern image imaged at a timing different from that of the first interference pattern image, and a vibration detection step of detecting vibration based on the first interference pattern image and the second interference pattern image compared in the comparison step.

[0010] In the vibration detection method of the present invention, the member to be measured has a target pattern. In the imaging step, an interference pattern image including the target pattern is imaged. In the comparison step, the position of a first target pattern in a first interference pattern image imaged at a predetermined timing may be further compared with the position of a second target pattern in a second interference pattern image imaged at a timing different from that of the first interference pattern image.

Advantages of the Invention

[0011] The present invention can detect the vibration of a device in the height direction of a workpiece to be processed.

Brief Description of the Drawings

[0012]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

DETAILED DESCRIPTION OF THE INVENTION

[0013] Embodiments for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. Further, the constituent elements described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Furthermore, the configurations described below can be combined as appropriate. Also, various omissions, substitutions, or changes in the configuration can be made without departing from the gist of the present invention.

[0014] 〔Embodiment〕 First, the configuration of the processing apparatus 1 according to the embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing a configuration example of the processing apparatus 1 according to the embodiment. In the following description, the X-axis direction is one direction in the horizontal plane. The Y-axis direction is a direction orthogonal to the X-axis direction in the horizontal plane. The Z-axis direction is a direction orthogonal to the X-axis direction and the Y-axis direction. In the processing apparatus 1 of the embodiment, the processing feed direction is the X-axis direction, and the indexing feed direction is the Y-axis direction.

[0015] The processing apparatus 1 according to the embodiment shown in FIG. 1 is a laser processing apparatus. The processing apparatus 1 includes a holding unit 10, a processing unit 20, a vibration detection unit 30, an alignment unit 60, a moving unit 70, a display unit 80, and a control unit 90. The processing apparatus 1 according to the embodiment is an apparatus that processes a workpiece 100 by irradiating the workpiece 100 held by the holding unit 10 with a laser beam 21 by the processing unit 20. The processing of the workpiece 100 by the processing apparatus 1 is, for example, a modification layer forming process for forming a modified layer inside the workpiece 100 by stealth dicing, a groove processing for forming a groove on the surface 101 of the workpiece 100, or a cutting process for cutting the workpiece 100 along a planned division line.

[0016] In the embodiment, the workpiece 100 is a wafer such as a disk-shaped semiconductor device wafer or an optical device wafer having a substrate such as silicon (Si), sapphire (Al 2 O 3 ), gallium arsenide (GaAs), silicon carbide (SiC), or lithium tantalate (LiTa 3 ). The member to be measured measured by the vibration detection unit 30 described later may be the workpiece 100. Note that the workpiece 100 is not limited to the embodiment, and in the present invention, it does not have to be disk-shaped. The workpiece 100 is, for example, supported in the opening of the frame 110 with an annular frame 110 attached thereto and a tape 111 having a diameter larger than the outer diameter of the workpiece 100 attached to the back surface of the workpiece 100.

[0017] The holding unit 10 holds the workpiece 100 on the holding surface 11. The holding surface 11 has a disk shape formed of porous ceramic or the like. In the embodiment, the holding surface 11 is a plane parallel to the horizontal direction. The holding surface 11 is connected to a vacuum suction source via a vacuum suction path, for example. The holding unit 10 suction-holds the workpiece 100 placed on the holding surface 11. The member to be measured measured by the vibration detection unit 30 described later may be the holding unit 10.

[0018] A plurality of clamp portions 12 for clamping a frame 110 that supports a workpiece 100 are arranged around the holding unit 10. The holding unit 10 is rotated about an axis parallel to the Z-axis direction by a rotation unit 13. The rotation unit 13 is supported by an X-axis direction moving plate 14. The rotation unit 13 and the holding unit 10 are moved in the X-axis direction by an X-axis direction moving unit 71 of the moving unit 70 via the X-axis direction moving plate 14. The rotation unit 13 and the holding unit 10 are moved in the Y-axis direction by a Y-axis direction moving unit 72 of the moving unit 70 via the X-axis direction moving plate 14, the X-axis direction moving unit 71, and a Y-axis direction moving plate 15.

[0019] The processing unit 20 is a unit that processes the workpiece 100 held by the holding unit 10. The processing unit 20 in the embodiment is a laser beam irradiation unit that irradiates the workpiece 100 held by the holding unit 10 with a pulsed laser beam 21 having a predetermined wavelength for processing the workpiece 100. The laser beam irradiation unit includes, for example, a laser oscillator that emits the laser beam 21, a condenser, and various optical components provided on the optical path of the laser beam 21 between the laser oscillator and the condenser. The condenser condenses the laser beam 21 emitted from the laser oscillator and propagated by various optical components onto the workpiece 100 held on the holding surface 11 of the holding unit 10 to irradiate the workpiece 100.

[0020] The vibration detection unit 30 is a unit that detects vibrations caused by motors, pumps, etc. of the processing apparatus 1. The vibration detection unit 30 detects at least the vibration in the Z-axis direction of the processing apparatus 1. The vibration detection unit 30 may detect the vibration in the X-Y plane direction of the processing apparatus 1. As shown in FIG. 2, the vibration detection unit 30 includes a housing 31 on which each component is mounted, a lens barrel 32 provided at the lower end of the housing 31, a light source 33, a half mirror 34, a condensing unit 35, an interference unit 40, and an imaging unit 50.

[0021] The light source 33 is provided on the inner side surface of the housing 31. The light source 33 is, for example, an LED or the like, but an LD with a predetermined wavelength may also be used. The light source 33 irradiates the member to be measured (for example, the holding unit 10 or the workpiece 100, and in the embodiment, the workpiece 100) with the light 51. The light 51 generated by the light source 33 in the embodiment is mainly radiated toward the lateral half mirror 34.

[0022] The half mirror 34 is inside the housing 31 and is provided on the side of the light source 33. The half mirror 34 reflects the light 51 generated by the light source 33 toward the member to be measured below. The half mirror 34 allows the reflected light 53 reflected by the surface 101 of the member to be measured (workpiece 100) and the reference light 52 generated by the interference unit 40 described later to pass through from below toward the imaging unit 50 described later above.

[0023] The condensing unit 35 condenses the light 51 from the light source 33 onto the surface 101 of the member to be measured (workpiece 100). The condensing unit 35 in the embodiment is provided below the half mirror 34 and is fixed inside the lens barrel 32. The condensing unit 35 condenses the light 51 reflected by the half mirror 34 onto the surface 101 of the member to be measured (workpiece 100) in the embodiment. The condensing unit 35 is, for example, a convex lens.

[0024] The interference unit 40 is provided below the condensing unit 35. The interference unit 40 generates a reference reference light 52. The interference unit 40 causes the reference light 52 to interfere with the reflected light 53 of the light 51 reflected by the surface 101 of the member to be measured (workpiece 100). The interference unit 40 includes a Mirau-type interference optical system in the embodiment, but may include a Michelson-type interference optical system in the present invention. As shown in FIG. 3, the interference unit 40 in the embodiment has a plate 41, a half mirror 42, and a reference mirror 43.

[0025] The plate 41 is formed of a material such as glass that transmits the light 51, the reference light 52, and the reflected light 53. The half mirror 42 is provided below the plate 41. The half mirror 42 branches the light 51 from the light source 33 into two light beams. The half mirror 34 guides one of the branched light beams to the side of the member to be measured (for example, the workpiece 100), and the other light beam to the side of the reference mirror 43. The reference mirror 43 is a minute mirror disposed at the center of the plate 41. The reference mirror 43 constitutes a reference surface on the plate 41.

[0026] The light 51 generated by the light source 33 and reflected downward by the half mirror 34 passes through the condenser unit 35 and the plate 41, and a part of it is reflected upward by the half mirror 42. A part of the light 51 reflected upward by the half mirror 42 is reflected downward by the reference mirror 43 and then reflected upward again by the half mirror 42. The light that is reflected downward by the reference mirror 43 and then reflected upward again by the half mirror 42 is called the reference light 52.

[0027] On the other hand, another part of the light 51 that has passed through the half mirror 42 is reflected upward as the reflected light 53 by the inspection surface (surface 101) of the member to be measured (workpiece 100). The reflected light 53 passes through the half mirror 42, and together with the reference light 52 reflected upward by the half mirror 42, passes through the plate 41, the condenser unit 35, and the half mirror 34, and reaches the imaging unit 50 disposed above.

[0028] That is, the interference unit 40 generates an interference image based on the difference between the optical path of the reference light 52, which is the reflected light from the reference mirror 43, and the optical path of the reflected light 53, which is the reflected light from the member to be measured (workpiece 100). The reference light 52 and the reflected light 53 that reach the imaging unit 50 interfere under predetermined conditions according to the distance from the inspection surface (surface 101 of the workpiece 100) to the interference unit 40 and the like.

[0029] The imaging unit 50 captures interference pattern images 120, 130 (see FIGS. 4, 5, 6, and 7) that include an interference pattern generated by the interference between the reference light 52 and the reflected light 53 reflected by the member to be measured (workpiece 100). The imaging unit 50 includes an imaging element such as a CCD (Charge Coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor) in which a plurality of pixels are two-dimensionally arranged (in the X-axis direction and the Y-axis direction). The imaging unit 50 can capture the interference pattern images 120, 130 having a luminance distribution by the imaging element capturing the two-dimensional light intensity of the interference light between the reference light 52 and the reflected light 53. The imaging direction by the imaging unit 50 is in the Z-axis direction, that is, the vertical direction, and downward.

[0030] The light intensity captured by the imaging element depends on the distance from the surface to be inspected (surface 101 of the workpiece 100) to the interference unit 40 and the like. That is, the luminance of the captured interference pattern images 120, 130 changes according to the position in the Z-axis direction of the vibration detection unit 30. By utilizing this phenomenon, for example, when the high-luminance regions and the low-luminance regions are different in a plurality of interference pattern images 120, 130 captured at different timings with the X, Y, and Z axis directions fixed, the imaging unit 50 can determine that it is vibrating in the Z-axis direction.

[0031] Further, the imaging unit 50 can form a three-dimensional image 150 (see FIG. 9 and the like) corresponding to the shape of the surface to be inspected (surface 101 of the workpiece 100) by extracting, for example, the coordinates (X-Y coordinates) at which the luminance or the luminance change is maximum from a plurality of interference pattern images captured by changing the position in the Z-axis direction. That is, the imaging unit 50 of the embodiment includes a 3D profiler mounted on a laser processing apparatus or the like.

[0032] The alignment unit 60 includes an imaging unit that images the workpiece 100 held by the holding unit 10 in order to perform alignment for aligning the workpiece 100 and the processing unit 20. The imaging unit includes, for example, a CCD camera or an infrared camera. The alignment unit 60 is fixed, for example, so as to be adjacent to the condenser of the processing unit 20. The alignment unit 60 images the workpiece 100, obtains an image for performing alignment to align the workpiece 100 and the processing unit 20, and outputs the obtained image to the control unit 90.

[0033] The moving unit 70 relatively moves the holding unit 10 and the processing unit 20. More specifically, the moving unit 70 relatively moves the holding unit 10 and the processing point of the processing unit 20 (the condensing point of the laser beam 21 in the embodiment). The moving unit 70 further relatively moves the holding unit 10 and the vibration detection unit 30. The moving unit 70 includes an X-axis direction moving unit 71, a Y-axis direction moving unit 72, and a Z-axis direction moving unit 73.

[0034] The X-axis direction moving unit 71 is a unit that relatively moves the holding unit 10 and the processing unit 20 in the X-axis direction, which is the processing feed direction. In the embodiment, the X-axis direction moving unit 71 moves the holding unit 10 in the X-axis direction. In the embodiment, the X-axis direction moving unit 71 is installed on the apparatus main body 2 of the processing apparatus 1. The X-axis direction moving unit 71 supports the X-axis direction moving plate 14 so as to be movable in the X-axis direction.

[0035] The Y-axis direction moving unit 72 is a unit that relatively moves the holding unit 10 and the processing unit 20 in the Y-axis direction, which is the indexing feed direction. In the embodiment, the Y-axis direction moving unit 72 moves the holding unit 10 in the Y-axis direction. In the embodiment, the Y-axis direction moving unit 72 is installed on the apparatus main body 2 of the processing apparatus 1. The Y-axis direction moving unit 72 supports the Y-axis direction moving plate 15 so as to be movable in the Y-axis direction.

[0036] The Z-axis direction moving unit 73 is a unit that relatively moves the holding unit 10 and the processing unit 20 in the Z-axis direction, which is the focal position adjustment direction. In the embodiment, the Z-axis direction moving unit 73 moves at least the condenser of the processing unit 20 in the Z-axis direction. Also, in the embodiment, the Z-axis direction moving unit 73 moves the vibration detection unit 30 in the Z-axis direction. The Z-axis direction moving unit 73 is installed on a column 3 erected from the apparatus main body 2 of the processing apparatus 1 in the embodiment. The Z-axis direction moving unit 73 supports at least the condenser of the processing unit 20 so as to be movable in the Z-axis direction.

[0037] The X-axis direction moving unit 71, the Y-axis direction moving unit 72, and the Z-axis direction moving unit 73 each include a well-known ball screw, a well-known pulse motor, and a well-known guide rail. The ball screw is provided so as to be rotatable around its axis. The pulse motor rotates the ball screw around its axis. The guide rail of the X-axis direction moving unit 71 supports the X-axis direction moving plate 14 so as to be movable in the X-axis direction. The guide rail of the X-axis direction moving unit 71 is fixedly provided on the Y-axis direction moving plate 15. The guide rail of the Y-axis direction moving unit 72 supports the Y-axis direction moving plate 15 so as to be movable in the Y-axis direction. The guide rail of the Y-axis direction moving unit 72 is fixedly provided on the apparatus main body 2. The guide rail of the Z-axis direction moving unit 73 supports the processing unit 20 and the vibration detection unit 30 so as to be movable in the Z-axis direction. The guide rail of the Z-axis direction moving unit 73 is fixedly provided on the column 3.

[0038] The display unit 80 is a display unit configured by a liquid crystal display device or the like. The display unit 80 displays, for example, the interference pattern images 120, 130 (see FIGS. 4, 5, 6, and 7) captured by the imaging unit 50 of the vibration detection unit 30, the setting screen of the processing conditions, the state of the workpiece 100 captured by the alignment unit 60, the state of the processing operation, etc. on the display surface. When the display surface of the display unit 80 includes a touch panel, the display unit 80 may include an input unit. The input unit can receive various operations such as an operator registering processing content information. The input unit may be an external input device such as a keyboard. The information and images displayed on the display surface of the display unit 80 are switched by operations from the input unit or the like. The display unit 80 may include a notification device. The notification device emits at least one of sound and light to notify the operator of the processing device 1 of predetermined notification information. The notification device may be an external notification device such as a speaker or a light emitting device.

[0039] The control unit 90 controls each of the above-described components of the processing device 1 to cause the processing device 1 to execute a processing operation on the workpiece 100. Further, the control unit 90 causes the processing device 1 to execute a detection operation for detecting the vibration of the processing device 1. The control unit 90 controls the processing unit 20, the vibration detection unit 30, the alignment unit 60, the X-axis direction moving unit 71, the Y-axis direction moving unit 72, the Z-axis direction moving unit 73, and the display unit 80.

[0040] The control unit 90 is a computer including an arithmetic processing unit as arithmetic means, a storage device as storage means, and an input / output interface device as communication means. The arithmetic processing unit includes, for example, a microprocessor such as a CPU (Central Processing Unit). The storage device has a memory such as a ROM (Read Only Memory) or a RAM (Random Access Memory). The arithmetic processing unit performs various operations based on a predetermined program stored in the storage device. The arithmetic processing unit outputs various control signals to the above-described respective components via the input / output interface device according to the operation results, and controls the processing device 1.

[0041] The control unit 90 causes, for example, the light source 33 of the vibration detection unit 30 to be irradiated with the light 51. The control unit 90 causes, for example, the imaging unit 50 of the vibration detection unit 30 to image an interference pattern image 120 (see FIGS. 4 and 5) including an interference pattern of the member to be measured (for example, the workpiece 100). When the member to be measured (workpiece 100) has the target pattern 140 on the inspection surface (surface 101), the control unit 90 may cause, for example, the imaging unit 50 to image an interference pattern image 130 (see FIGS. 6 and 7) including the target pattern 140. The control unit 90 shown in FIG. 1 includes a storage unit 91, a comparison unit 92, a vibration detection unit 93, and a three-dimensional image generation unit 94.

[0042] The storage unit 91 stores the interference pattern image 120 imaged by the imaging unit 50. The storage unit 91 stores, for example, a first interference pattern image 121 shown in FIG. 4 imaged by the imaging unit 50 at a predetermined timing, and a second interference pattern image 122 shown in FIG. 5 imaged at a timing different from that of the first interference pattern image 121.

[0043] FIG. 4 is a diagram showing an example of a first interference pattern image 121 captured at a predetermined timing. FIG. 5 is a diagram showing an example of a second interference pattern image 122 captured at a timing different from that of FIG. 4. The first interference pattern image 121 and the second interference pattern image 122 are images captured by the imaging unit 50 with the X, Y, and Z axes fixed.

[0044] The interference pattern image 120 includes an interference pattern generated by the interference between the reference light 52 and the reflected light 53 reflected by the member to be measured (workpiece 100). The interference pattern image 120 captured by the imaging unit 50 has a luminance distribution based on the two-dimensional light intensity distribution of the interference light between the reference light 52 and the reflected light 53 captured by the imaging element. In the interference pattern image 120, a region with high luminance is represented in white. In the interference pattern image 120, a region with low luminance is represented in black.

[0045] The comparison unit 92 compares the first interference pattern image 121 and the second interference pattern image 122 stored in the storage unit 91. For example, the first interference pattern image 121 shown in FIG. 4 and the second interference pattern image 122 shown in FIG. 5 both have a vertical stripe pattern in the luminance distribution, but the positions of the regions with high and low luminance are shifted in the horizontal direction. That is, the comparison unit 92 compares the first interference pattern image 121 and the second interference pattern image 122 based on the luminance distribution of the interference pattern image 120.

[0046] The vibration detection unit 93 detects vibration based on the first interference pattern image 121 and the second interference pattern image 122 compared by the comparison unit 92. That is, the luminance distribution of the interference pattern image 120 captured by the imaging unit 50 changes according to the relative position between the vibration detection unit 30 and the holding unit 10. Therefore, the vibration detection unit 93 detects the vibration in the Z-axis direction based on the difference between the luminance distribution of the first interference pattern image 121 and the luminance distribution of the second interference pattern image 122 compared by the comparison unit 92.

[0047] Next, a case where the member to be measured (workpiece 100) has a target pattern 140 on the inspection surface (surface 101) will be described. FIG. 6 is a diagram showing an example of a first interference pattern image 131 captured at a predetermined timing. FIG. 7 is a diagram showing an example of a second interference pattern image 132 captured at a timing different from that of FIG. 6. The first interference pattern image 131 and the second interference pattern image 132 are images captured by the imaging unit 50 with the X, Y, and Z axes fixed.

[0048] The storage unit 91 stores the interference pattern image 130 including the target pattern 140 captured by the imaging unit 50. The storage unit 91 stores, for example, the first interference pattern image 131 shown in FIG. 6 captured by the imaging unit 50 at a predetermined timing and the second interference pattern image 132 shown in FIG. 7 captured at a timing different from that of the first interference pattern image 131.

[0049] The comparison unit 92 compares the first interference pattern image 131 and the second interference pattern image 132 stored in the storage unit 91. For example, in the first interference pattern image 131 shown in FIG. 6 and the second interference pattern image 132 shown in FIG. 7, the positions of the target pattern 140 are shifted. That is, the comparison unit 92 compares the first interference pattern image 131 and the second interference pattern image 132 based on the positions of the target pattern 140 in the interference pattern image 130.

[0050] The positions of the target pattern 140 in the interference pattern images 120 and 130 captured by the imaging unit 50 change according to the position in the X-Y plane direction of the vibration detection unit 30. Therefore, the vibration detection unit 93 detects the vibration in the X-Y plane direction based on the difference in the positions between the target pattern 140 of the first interference pattern image 131 and the target pattern 140 of the second interference pattern image 132 compared by the comparison unit 92.

[0051] The three-dimensional image generation unit 94 of the control unit 90 shown in FIG. 1 generates a three-dimensional image 150 of the member to be measured (for example, the workpiece 100). FIG. 8 is a schematic diagram showing a state in which an interference pattern image for acquiring the three-dimensional image 150 is being imaged. FIG. 9 is a diagram showing an example of the three-dimensional image 150 generated according to FIG. 8.

[0052] To generate the three-dimensional image 150, first, as shown in FIG. 8, while changing the position of the imaging unit 50 in a direction parallel to the imaging direction, that is, the Z-axis direction, the imaging unit 50 captures a plurality of interference pattern images. At this time, the imaging unit 50 captures a plurality of interference pattern images with the X and Y axes fixed. The three-dimensional image generation unit 94 generates a three-dimensional image 150 of the member to be measured (for example, the workpiece 100) based on the plurality of interference pattern images captured by changing the position of the imaging unit 50 in a plurality of directions parallel to the imaging direction, that is, the Z-axis direction.

[0053] In the embodiment, for example, a plurality of three-dimensional images 150 created based on different interference pattern images may be compared with each other, and vibration may be detected based on differences in the depth, shape, etc. of the three-dimensional images 150.

[0054] Next, a vibration detection method according to the embodiment will be described. FIG. 10 is a flowchart showing the flow of the vibration detection method according to the embodiment. As shown in FIG. 10, the vibration detection method includes a light irradiation step 201, an imaging step 202, a storage step 203, a comparison step 204, and a vibration detection step 205.

[0055] The light irradiation step 201 is a step of irradiating the member to be measured (for example, the holding unit 10 or the workpiece 100, etc.) with light 51. In the light irradiation step 201 of the embodiment, the control unit 90 shown in FIG. 1 causes the light source 33 of the vibration detection unit 30 to be irradiated with the light 51. The light 51 irradiated from the light source 33 is reflected by the half mirror 34 toward the member to be measured below (see FIG. 2). After passing through the condensing unit 35 and the plate 41, the light 51 is branched into two light beams by the half mirror 42.

[0056] One of the branched lights 51 passes through the half mirror 42, is reflected by the member to be measured (for example, the holding unit 10 or the workpiece 100, etc.), and as the reflected light 53, passes through the half mirror 42, the plate 41, the condensing unit 35, and the half mirror 34 and enters the imaging unit 50. The other branched light 51 is reflected upward by the half mirror 42 and then reflected downward by the reference mirror 43. As the reference light 52, after being reflected upward again by the half mirror 42, it passes through the plate 41, the condensing unit 35, and the half mirror 34 and enters the imaging unit 50.

[0057] The imaging step 202 is a step of imaging interference pattern images 120 and 130 including an interference pattern generated by the interference between the reflected light 53 in which one of the branched lights 51 is reflected by the member to be measured (for example, the holding unit 10 or the workpiece 100, etc.) and the reference light 52 generated from the other branched light 51.

[0058] In the imaging step 202 of the embodiment, the control unit 90 shown in FIG. 1 causes the imaging unit 50 to image the interference pattern images 120 and 130 including the interference pattern of the member to be measured (for example, the workpiece 100). When the member to be measured (workpiece 100) has the target pattern 140 on the inspection surface (surface 101), in the imaging step 202, the interference pattern image 130 including the target pattern 140 is imaged.

[0059] The storage step 203 is a step of storing the interference pattern images 120 and 130 imaged in the imaging step 202. In the storage step 203 of the embodiment, the storage unit 91 of the control unit 90 shown in FIG. 1 stores the first interference pattern images 121 and 131 and the second interference pattern images 122 and 132 imaged by the imaging unit 50.

[0060] The comparison step 204 is a step of comparing a first interference pattern image 121, 131 captured at a predetermined timing with a second interference pattern image 122, 132 captured at a timing different from that of the first interference pattern image 121, 131. In the comparison step 204 of the embodiment, the comparison unit 92 of the control unit 90 shown in FIG. 1 compares the luminance distribution of the first interference pattern images 121, 131 with the luminance distribution of the second interference pattern images 122, 132.

[0061] When the member to be measured (workpiece 100) has a target pattern 140 on the inspection surface (surface 101) and the interference pattern image 130 including the target pattern 140 is captured in the imaging step 202, in the comparison step 204 of the embodiment, the positions of the target patterns 140 in the interference pattern image 130 are compared. More specifically, the comparison unit 92 further compares the position of the first target pattern 140 in the first interference pattern image 131 captured at a predetermined timing with the position of the second target pattern 140 in the second interference pattern image 132 captured at a timing different from that of the first interference pattern image 131.

[0062] The vibration detection step 205 is a step of detecting vibration based on the first interference pattern images 121, 131 and the second interference pattern images 122, 132 compared in the comparison step 204. In the vibration detection step 205 of the embodiment, the vibration detection unit 93 of the control unit 90 shown in FIG. 1 detects vibration based on the first interference pattern images 121, 131 and the second interference pattern images 122, 132 compared by the comparison unit 92.

[0063] That is, the luminance distribution of the interference pattern images 120, 130 captured in the imaging step 202 changes according to the relative position between the vibration detection unit 30 and the holding unit 10. Therefore, in the vibration detection step 205, vibration in the Z-axis direction is detected based on the difference between the luminance distribution of the first interference pattern image 121 and the luminance distribution of the second interference pattern image 122 compared by the comparison unit 92.

[0064] In addition, the position of the target pattern 140 in the interference pattern image 130 captured in the imaging step 202 changes according to the position in the X-Y plane direction of the vibration detection unit 30. Therefore, in the vibration detection step 205, based on the difference in the positions of the target pattern 140 in the first interference pattern image 131 and the target pattern 140 in the second interference pattern image 132 compared in the comparison step 204, vibration in the X-Y plane direction is detected.

[0065] As described above, the processing apparatus 1 and the vibration detection method according to the embodiment observe the change in the interference pattern of the reflected light 53 that is bifurcated from the light 51 irradiated from the light source 33 and reflected by the member to be measured (for example, the holding unit 10 or the workpiece 100, etc.) by the reference light 52 generated by the interference unit 40. The processing apparatus 1 and the vibration detection method capture interference pattern images 120, 130 including the interference pattern, and can detect vibration in the Z-axis direction from the differences between the first interference pattern images 121, 131 and the second interference pattern images 122, 132 captured at different timings.

[0066] Therefore, it becomes possible to detect the vibration of the processing apparatus 1 in the height direction of the workpiece 100 to be processed on the processing apparatus 1, and it has the effect that it becomes easy to investigate the cause of the vibration, identify the cause location, and improve it. That is, since it is possible to confirm changes in the vibration state before and after the relocation (shipment) of the processing apparatus 1, it is possible to distinguish whether the vibration is due to environmental factors such as a building or the vibration of the processing apparatus 1 itself.

[0067] Furthermore, due to the movement of the interference pattern images 120, 130 in the X-Y plane direction, it becomes possible to detect vibration not only in the Z-axis direction but also in the X-Y plane direction, so it is possible to detect vibration in three axial directions simultaneously.

[0068] Note that the present invention is not limited to the above-described embodiment. That is, various modifications can be made and implemented without departing from the gist of the present invention.

Description of Reference Numerals

[0069] 1 Processing device 10 Holding unit (member to be measured) 20 Processing unit 30 Vibration detection unit 31 Housing 32 Lens barrel 33 Light source 34 Half mirror 35 Condensing unit 40 Interference unit 41 Plate 42 Half mirror 43 Reference mirror 50 Imaging unit 51 Light 52 Reference light 53 Reflected light 70 Moving unit 90 Control unit 91 Memory unit 92 Comparison unit 93 Vibration detection section 94 Three-dimensional image generation section 100 Workpiece (member to be measured) 120, 130 Interference pattern images 121, 131 First interference pattern images 122, 132 Second interference pattern images 140 Target pattern 150, 151, 152 Three-dimensional images

Claims

1. A processing apparatus, comprising: a holding unit for holding a workpiece; a processing unit for processing the workpiece held by the holding unit; a moving unit for relatively moving the holding unit and the processing unit; a vibration detection unit; a control unit for controlling each component; wherein the vibration detection unit includes a light source; an interference unit that irradiates light from the light source onto a member to be measured and generates an interference pattern image including an interference pattern of the member to be measured; an imaging unit that images the interference pattern image of the member to be measured generated by the interference unit; and the control unit includes a storage unit that stores a first interference pattern image imaged by the imaging unit at a predetermined timing and a second interference pattern image imaged at a timing different from that of the first interference pattern image; a comparison unit that compares the first interference pattern image and the second interference pattern image stored in the storage unit; a vibration detection unit that detects vibration based on the first interference pattern image and the second interference pattern image compared by the comparison unit; The processing apparatus is characterized by having the above components.

2. The control unit further includes a three-dimensional image generation unit that generates a three-dimensional image of the member to be measured based on a plurality of interference pattern images obtained by changing the position of the imaging unit in a direction parallel to the imaging direction and imaging. The processing apparatus according to Claim 1.

3. The member to be measured is a holding unit for holding a workpiece. The processing apparatus according to Claim 1 or 2.

4. A vibration detection method for detecting vibration, comprising: a light irradiation step of irradiating light onto a member to be measured; an imaging step of bifurcating the light and imaging an interference pattern image including an interference pattern generated by interference between reflected light reflected by the member to be measured and reference light generated from the other bifurcated light; a storage step of storing the interference pattern image imaged in the imaging step; wherein the method further includes a comparison step of comparing a first interference pattern image imaged at a predetermined timing and a second interference pattern image imaged at a timing different from that of the first interference pattern image; a vibration detection step of detecting vibration based on the first interference pattern image and the second interference pattern image compared in the comparison step; The vibration detection method is characterized by having the above steps.

5. The member to be measured has a target pattern, In the imaging step, an interference pattern image including the target pattern is imaged, In the comparison step, the position of the first target pattern in the first interference pattern image imaged at a predetermined timing and the position of the second target pattern in the second interference pattern image imaged at a timing different from that of the first interference pattern image are further compared. The vibration detection method according to claim 4.

Images