Electronic device

Abstract

To provide an electronic apparatus excellent in portability; or to provide an electronic apparatus excellent in at-a-glance visibility; or to provide an electronic apparatus including new input means.SOLUTION: An electronic apparatus comprises: a display panel having flexibility; and two supports supporting the display panel. The two supports are connected by a connection. The display panel is fixed to one support and is provided to the other support slidably in one direction without being fixed thereto. The electronic apparatus is further provided with detection means that, when the display panel slides, can detect the amount of its displacement.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] One aspect of the present invention relates to a display device. Or, it relates to an electronic device including a display device. In particular, it relates to a flexible display device. Or, it relates to an electronic device including a flexible display device.

[0002] Note that one aspect of the present invention is not limited to the above technical field. One aspect of the invention disclosed in this specification etc. relates to an article, a method, or a manufacturing method. One aspect of the present invention relates to a process, a machine , a manufacture, or a composition of matter. Therefore, more specifically, as the technical field of one aspect of the present invention disclosed in this specification, semiconductor devices, display devices, light-emitting devices, power storage devices, storage devices, electronic devices, lighting devices, input devices, input / output devices , their driving methods, or their manufacturing methods can be cited as an example.

[0003] Note that in this specification etc., the semiconductor device refers to all devices that can function by utilizing semiconductor characteristics. Semiconductor elements such as transistors, semiconductor circuits, arithmetic units, and storage devices are one aspect of semiconductor devices. Imaging devices, display devices, liquid crystal display devices, light-emitting devices, electro- optical devices, power generation devices (including thin-film solar cells, organic thin-film solar cells, etc.), and electronic devices may have a semiconductor device.

Background Art

[0004] In recent years, display devices are expected to be applied to various uses and are becoming more diversified. For example, display devices used in electronic devices for portable use etc. are required to be thin, lightweight, or difficult to break. Also, new uses that have not existed conventionally are required is present.

[0005] In addition, Patent Document 1 discloses a flexible active matrix type light-emitting device including a transistor, which is a switching element, and an organic EL (Electro Luminescence) element on a film substrate. is provided. is disclosed.

Prior Art Documents

Patent Documents

[0006]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0007] In recent years, it has been studied to increase the display amount by enlarging the display area of a display device and improve the comprehensibility of the display. On the other hand, in applications such as portable devices, if the display area is enlarged, the portability (also referred to as mobility) will decrease. Therefore, it has been difficult to achieve both an improvement in the comprehensibility of the display and high portability.

[0008]

[0008] In addition, a configuration in which an input means as a user interface is provided on a display panel is desired. For example, there is a display device (touch panel) having a function of inputting by touching the screen with a finger, a stylus, or the like.

[0009]

[0009] One aspect of the present invention is to provide an electronic device having excellent portability as one of the problems. Or, to provide an electronic device having excellent comprehensibility as one of the problems. Or, to provide an electronic device that is difficult to break as one of the problems. Or, to provide an electronic device provided with a new input means as one of the problems. is one of the problems.

[0010] Alternatively, one aspect of the present invention aims to make an electronic device thinner. Alternatively, one aspect of the present invention aims to make an electronic device lighter. Alternatively, one aspect of the present invention aims to provide a novel electronic device.

[0011] Note that the description of these problems does not preclude the existence of other problems. One aspect of the present invention does not necessarily need to solve all of these problems. Also, problems other than the above will become apparent from the description in the specification etc., and it is possible to extract problems other than the above from the description in the specification etc.

[0012] One aspect of the present invention is an electronic device including a first support, a second support, a connection part, and a display panel. The display panel has a function of being able to be bent and displayed. The first support and the second support are connected by the connection part, and the first support and the second support have a function of rotating relative to each other via the connection part. The display panel has a part fixed to the first support and is supported by the second support so as to be able to move

[0013] in one direction with respect to the second support. Alternatively, another aspect of the present invention is an electronic device including a first support, a second support, a connection part, a display panel, and a detection means. The display panel has a function of being able to be bent and displayed. The first support It has a part and is supported by the second support so that it can move in one direction with respect to the second support. When the first support and the second support are rotated relative to each other, it has a function of changing the relative position with the second support. Further, the detection means is characterized by having a function of detecting the relative position between the display panel and the second support. When the first support and the second support are rotated relative to each other, it has a function of changing the relative position with the second support. Further, the detection means is characterized by having a function of detecting the relative position between the display panel and the second support.

[0014] Also, in the above, the detection means has a light-emitting element and a light-receiving element. One of the light-emitting element and the light-receiving element is fixedly provided on the display panel, and the other of the light-emitting element and the light-receiving element is fixedly provided on the second support. The light-receiving element preferably has a function of detecting the light emission from the light-emitting element. One of the light-emitting element and the light-receiving element is fixedly provided on the display panel, and the other of the light-emitting element and the light-receiving element is fixedly provided on the second support. The light-receiving element preferably has a function of detecting the light emission from the light-emitting element. The light-receiving element preferably has a function of detecting the light emission from the light-emitting element.

[0015] Or, in the above, the detection means has a light-emitting element and a light-receiving element. The light-emitting element and the light-receiving element are each fixedly provided on the second support. The light-emitting element has a function of irradiating light to a part of the display panel, and the light-receiving element preferably has a function of detecting the reflected light from the display panel. The light-emitting element and the light-receiving element are each fixedly provided on the second support. The light-emitting element has a function of irradiating light to a part of the display panel, and the light-receiving element preferably has a function of detecting the reflected light from the display panel. The light-emitting element has a function of irradiating light to a part of the display panel, and the light-receiving element preferably has a function of detecting the reflected light from the display panel.

[0016] Or, in the above, the display panel has a display part and a non-display part. The display part has a first light-emitting element. The detection means has a second light-emitting element and a light-receiving element. The second light-emitting element is provided in the non-display part. The light-receiving element is fixedly provided on the second support. The light-receiving element preferably has a function of detecting the light emission from the second light-emitting element. The display part has a first light-emitting element. The detection means has a second light-emitting element and a light-receiving element. The second light-emitting element is provided in the non-display part. The light-receiving element is fixedly provided on the second support. The light-receiving element preferably has a function of detecting the light emission from the second light-emitting element. The second light-emitting element is provided in the non-display part. The light-receiving element is fixedly provided on the second support. The light-receiving element preferably has a function of detecting the light emission from the second light-emitting element.

[0017] Also, in the above, it is preferable that the display panel is positioned so as not to overlap with the respective central positions in the thickness directions of the first support, the connection part, and the second support. It is preferable that the display panel is positioned so as not to overlap with the respective central positions in the thickness directions of the first support, the connection part, and the second support.

[0018] ​​​​In addition, it is preferable that the connection part has an elastic body.

[0019] In addition, it is preferable that the display panel has a function as a touch sensor. Or it is preferable that a touch sensor is provided on the display panel.

Advantages of the Invention

[0020] According to the present invention, an electronic device with excellent portability can be provided. Or, an electronic device with excellent listability can be provided. Or, an electronic device that is difficult to break can be provided. Or, an electronic device having a new input step can be provided. Or, a new electronic device can be provided.

[0021] Note that the description of these effects does not prevent the existence of other effects. Note that one aspect of the present invention does not necessarily have to have all of these effects. Note that other effects will be obvious from the description in the specification, drawings, claims, etc., and it is possible to extract these other effects from the description in the specification, drawings, claims, etc.

Brief Description of the Drawings

[0022]

Figure 1

Figure 2

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Figure 10

Figure 11

Figure 12

Figure 13

Figure 14

Figure 15

Figure 16

Figure 17

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Figure 19

Figure 20

Mode for Carrying Out the Invention

[0023] The embodiments will be described in detail with reference to the drawings. However, the present invention is not limited to the following description, and those skilled in the art can easily understand that the form and details can be variously changed without departing from the spirit and scope of the present invention. Therefore, the present invention is not construed as being limited to the description of the embodiments shown below.

[0024] In the configuration of the invention described below, the same parts or parts having the same functions are commonly used with the same reference numerals among different drawings, and the repeated description thereof is omitted. Also, similarly When referring to the function of , the hatching pattern may be the same and may not be particularly labeled.

[0025] In addition, in each figure described in this specification, the size of each component, the thickness of the layer, or the area may be exaggerated for clarity. Therefore, it is not necessarily limited to that scale. not.

[0026] In addition, ordinal numbers such as "first" and "second" in this specification and the like are attached to avoid confusion of components and are not numerically limiting.

[0027] (Embodiment 1) In this embodiment, a configuration example of an electronic device according to an aspect of the present invention will be described with reference to the drawings.

[0028] An electronic device according to an aspect of the present invention has a configuration including a flexible display panel and two supports that support it. The two supports are connected by a connecting portion. The two housings can be relatively rotated via the connecting portion, and the electronic device can be folded. Therefore, an electronic device according to an aspect of the present invention can hold the display surface of the display panel in a flat state, bend it so that the display surface of the display panel faces inward (inward bending), bend it so that the display surface of the display panel faces outward, etc. An electronic device according to an aspect of the present invention, when the display panel is in an unfolded state, has an excellent overview due to a wide display area without seams. Also, when the display panel is in a folded state, it has excellent portability.

[0029] Here, in an electronic device according to an aspect of the present invention, the display panel is fixed to one support.

[0030] ​​​​​​​​​, the other support is preferably supported without being fixed so as to slide in one direction. When the angle between the two supports is changed, the display panel slides with respect to the unfixed support, and the relative position between the two is changed. It is preferable to configure it in this way. By adopting such a configuration, when the angle between the two supports is changed and a part of the display panel is bent, a force is applied only in the direction in which the display panel is bent, and a force applied in a direction perpendicular to this (that is, a direction perpendicular to the thickness direction of the display panel) is substantially eliminated. That is, when the display panel slides, no pulling or compressing force is applied to the display panel when bending the display panel, so damage to the display panel is suppressed, and a highly reliable electronic device can be realized. Furthermore, it is preferable to be provided with a detection stage capable of detecting the displacement amount when the display panel slides as described above. Since the displacement amount of the display panel changes depending on the angle between the two supports, it is possible to detect the angle between the two supports by detecting this displacement amount. For example, the displacement amount of the display panel can be detected by detecting the change in the relative position between the display panel and the support on the side where the display panel is not fixed. This change in relative position is preferably detected optically. It may also be configured to be detected mechanically or electrically. By configuring it in such a way that the angle between the two supports can be detected, the angle can be used as one input means in the electronic device. For example, it becomes possible to switch the display on the display panel according to the angle between the two supports. Also, the display of the display panel

[0031]

[0032] ​​​​​​​​​​​​​ In the folded state where the surface faces inward, operations such as stopping the display of the display panel can be performed.

[0033] More specifically, it can be configured as follows.

[0034] [Configuration Example] FIG. 1(A) shows a perspective schematic view of an electronic device 10 according to one aspect of the present invention.

[0035] The electronic device 10 includes a support 11a, a support 11b, a connection portion 12, a display panel 13, and , a detection means 14.

[0036] The support 11a and the support 11b are connected via the connection portion 12. The display panel 1 3 is disposed so as to overlap the support 11a, the support 11b, and the connection portion 12. Also, the display pa nel 13 is supported by at least the support 11a and the support 11b.

[0037] Specifically, the display panel 13 has a region fixed to the support 11a. Further, the display panel 13 is supported by the support 11b so as to be slidable in one direction without being fixed to the support 11b .

[0038] Also, the display panel 13 has flexibility. Further, the display panel 13 has a region having a plurality of pixels (also referred to as a display region), and an image can be displayed in the display region. The pixel includes a display element. In the following, the surface of the display panel 13 on the side where the image is displayed may be referred to as a display surface. The support 11a and the support 11b can be relatively rotated via the connection portion 12.

[0039] For example, the support 11a and the support 11b can be folded via the connecting portion 12, or deformed such as by screwing etc. Therefore, the electronic device 10 can be reversibly deformed from a state where the display surface of the display panel 13 is flat to a state where the display surface is bent.

[0040] The support 11a and the support 11b may have rigidity, or a member deformable with respect to a twisting or bending force of the support itself may be used. The support 11a and the support 11 b may be made of at least a material less flexible than the display panel 13 or the connecting portion 12, and an elastic body such as hard rubber may be used for its skeleton. In addition, as materials that can constitute each housing, plastics, metals such as aluminum, alloys such as stainless steel and titanium alloys, rubbers such as silicone rubber, etc. can be used.

[0041] For the connecting portion 12, a material that partially or entirely elastically deforms can be preferably used. For example, the entire connecting portion 12 can be an elastic body, or a configuration having an elastic body at least in the bent portion can be adopted. Or, as the connecting portion 12, a configuration having a hinge with one or more rotation axes can also be applied.

[0042] When a material that elastically deforms is used for the connecting portion 12, when a force for relatively rotating the support 11a and the support 11b is not applied, the flat state of the display surface shown in FIG. 1(A) can be maintained. In addition, in order to maintain the states of FIGS. 1(C) and 1(E), it is preferable to have a mechanism for fixing the support 11a and the support 11b. For example, a detachable tool that makes the support 11a and the support 11b mechanically detachable may be separately provided, or the support ​​​​​​​​​The support 11a and the support 11b may be provided with a detaching mechanism. Alternatively, the support 11a and the support 11b may be configured to be fixed by magnetic force.

[0043] In addition, when the connecting portion 12 is configured to have a hinge, a hinge having a mechanism for fixing the relative positions of the support 11a and the support 11b in the state of FIG. 1(C) or FIG. 1(E) is preferably used because the above-described detaching tool and detaching mechanism become unnecessary. Further, by using a hinge having stepped fixed positions, as shown in FIG. 1(B) or FIG. 1(D), the display panel 1 13 can also be used in a state where the display surface is curved. As the connecting portion 12, for example, a material having a lower Young's modulus than the supports 11a and 11b can be used. Further, even when a material having a higher Young's modulus than the supports 11a and 11b

[0044] or a material having an approximately equal Young's modulus is used, a material having a thickness thinner than that of the supports 11a and 11b can also be applied. As the material that can constitute the connecting portion 12, plastic, rubber, metal, alloy, etc. can be used. For example, a material such as silicone resin or a gel may be used.

[0045] FIG. 1(A) shows a state in which the display surface of the display panel 13 is held flat. By deforming the electronic device 10 so as to bend the display surface of the display panel 13 inward from this state, it can be reversibly deformed into the state of FIG. 1(B) through the state of FIG. 1(C). In FIG. 1(C), the display panel 13 is sandwiched between the supports 11a and 11b and stored. When the electronic device 10 is not in use or when it is stored in a bag or the like, such a state can be adopted. ​

[0046] Also, by deforming the electronic device 10 so that the display surface of the display panel 13 is bent outward from the state shown in FIG. 1(A), it can be reversibly deformed to the state of FIG. 1(E) through the state of FIG. 1(D). In FIG. 1(E), the display surface of the display panel 13 is in a state of being located along the upper surface, side surface, and lower surface of the electronic device 10. In the state shown in FIG. 1(E), since it is smaller than the state shown in FIG. 1(A), it is suitable for use in public places or when moving. to the state of FIG. 1(E) through the state of FIG. 1(D). In FIG. 1(E), the display surface of the display panel 13 is in a state of being located along the upper surface, side surface, and lower surface of the electronic device 10. In the state shown in FIG. 1(E), since it is smaller than the state shown in FIG. 1(A), it is suitable for use in public places or when moving. Also, by deforming the electronic device 10 so that the display surface of the display panel 13 is bent outward from the state shown in FIG. 1(A), it can be reversibly deformed to the state of FIG. 1(E) through the state of FIG. 1(D). In FIG. 1(E), the display surface of the display panel 13 is in a state of being located along the upper surface, side surface, and lower surface of the electronic device 10. In the state shown in FIG. 1(E), since it is smaller than the state shown in FIG. 1(A), it is suitable for use in public places or when moving. Also, by deforming the electronic device 10 so that the display surface of the display panel 13 is bent outward from the state shown in FIG. 1(A), it can be reversibly deformed to the state of FIG. 1(E) through the state of FIG. 1(D). In FIG. 1(E), the display surface of the display panel 13 is in a state of being located along the upper surface, side surface, and lower surface of the electronic device 10. In the state shown in FIG. 1(E), since it is smaller than the state shown in FIG. 1(A), it is suitable for use in public places or when moving. Also, by deforming the electronic device 10 so that the display surface of the display panel 13 is bent outward from the state shown in FIG. 1(A), it can be reversibly deformed to the state of FIG. 1(E) through the state of FIG. 1(D). In FIG. 1(E), the display surface of the display panel 13 is in a state of being located along the upper surface, side surface, and lower surface of the electronic device 10. In the state shown in FIG. 1(E), since it is smaller than the state shown in FIG. 1(A), it is suitable for use in public places or when moving. Also, by deforming the electronic device 10 so that the display surface of the display panel 13 is bent outward from the state shown in FIG. 1(A), it can be reversibly deformed to the state of FIG. 1(E) through the state of FIG. 1(D). In FIG. 1(E), the display surface of the display panel 13 is in a state of being located along the upper surface, side surface, and lower surface of the electronic device 10. In the state shown in FIG. 1(E), since it is smaller than the state shown in FIG. 1(A), it is suitable for use in public places or when moving.

[0047] [Cross-sectional configuration example] FIG. 2(A) shows a schematic cross-sectional view of the electronic device 10 at the cut surface X1 shown in FIG. 1(A). Also, FIG. 2(B) is a schematic cross-sectional view at the cut surface X2 shown in FIG. 1(B), and FIG. 2(C) is a schematic cross-sectional view at the cut surface X3 shown in FIG. 1(D). FIG. 2(A) shows a schematic cross-sectional view of the electronic device 10 at the cut surface X1 shown in FIG. 1(A). Also, FIG. 2(B) is a schematic cross-sectional view at the cut surface X2 shown in FIG. 1(B), and FIG. 2(C) is a schematic cross-sectional view at the cut surface X3 shown in FIG. 1(D). FIG. 2(A) shows a schematic cross-sectional view of the electronic device 10 at the cut surface X1 shown in FIG. 1(A). Also, FIG. 2(B) is a schematic cross-sectional view at the cut surface X2 shown in FIG. 1(B), and FIG. 2(C) is a schematic cross-sectional view at the cut surface X3 shown in FIG. 1(D).

[0048] In FIG. 2(A), the display panel 13 is arranged along the upper surfaces of the support 11a, the support 11b, and the connection part 12. Also, an FPC (Flexible Print Circuit) 15 is connected to the display panel 13, and is electrically connected to a circuit board 16 provided inside the support 11a via the FPC 15. Further, the circuit board 16 is electrically connected to a battery 17 provided inside the first support 11a. Also, as shown in FIG. 2(A), the battery 17 may also be provided inside the second support 11b. Although not shown here, the support 11b may have a circuit board on which an IC or the like for controlling the drive of the detection means 14 is mounted. For example, the IC is a detection means In FIG. 2(A), the display panel 13 is arranged along the upper surfaces of the support 11a, the support 11b, and the connection part 12. Also, an FPC (Flexible Print Circuit) 15 is connected to the display panel 13, and is electrically connected to a circuit board 16 provided inside the support 11a via the FPC 15. Further, the circuit board 16 is electrically connected to a battery 17 provided inside the first support 11a. Also, as shown in FIG. 2(A), the battery 17 may also be provided inside the second support 11b. Although not shown here, the support 11b may have a circuit board on which an IC or the like for controlling the drive of the detection means 14 is mounted. For example, the IC is a detection means In FIG. 2(A), the display panel 13 is arranged along the upper surfaces of the support 11a, the support 11b, and the connection part 12. Also, an FPC (Flexible Print Circuit) 15 is connected to the display panel 13, and is electrically connected to a circuit board 16 provided inside the support 11a via the FPC 15. Further, the circuit board 16 is electrically connected to a battery 17 provided inside the first support 11a. Also, as shown in FIG. 2(A), the battery 17 may also be provided inside the second support 11b. Although not shown here, the support 11b may have a circuit board on which an IC or the like for controlling the drive of the detection means 14 is mounted. For example, the IC is a detection means In FIG. 2(A), the display panel 13 is arranged along the upper surfaces of the support 11a, the support 11b, and the connection part 12. Also, an FPC (Flexible Print Circuit) 15 is connected to the display panel 13, and is electrically connected to a circuit board 16 provided inside the support 11a via the FPC 15. Further, the circuit board 16 is electrically connected to a battery 17 provided inside the first support 11a. Also, as shown in FIG. 2(A), the battery 17 may also be provided inside the second support 11b. Although not shown here, the support 11b may have a circuit board on which an IC or the like for controlling the drive of the detection means 14 is mounted. For example, the IC is a detection means In FIG. 2(A), the display panel 13 is arranged along the upper surfaces of the support 11a, the support 11b, and the connection part 12. Also, an FPC (Flexible Print Circuit) 15 is connected to the display panel 13, and is electrically connected to a circuit board 16 provided inside the support 11a via the FPC 15. Further, the circuit board 16 is electrically connected to a battery 17 provided inside the first support 11a. Also, as shown in FIG. 2(A), the battery 17 may also be provided inside the second support 11b. Although not shown here, the support 11b may have a circuit board on which an IC or the like for controlling the drive of the detection means 14 is mounted. For example, the IC is a detection means In FIG. 2(A), the display panel 13 is arranged along the upper surfaces of the support 11a, the support 11b, and the connection part 12. Also, an FPC (Flexible Print Circuit) 15 is connected to the display panel 13, and is electrically connected to a circuit board 16 provided inside the support 11a via the FPC 15. Further, the circuit board 16 is electrically connected to a battery 17 provided inside the first support 11a. Also, as shown in FIG. 2(A), the battery 17 may also be provided inside the second support 11b. Although not shown here, the support 11b may have a circuit board on which an IC or the like for controlling the drive of the detection means 14 is mounted. For example, the IC is a detection means In FIG. 2(A), the display panel 13 is arranged along the upper surfaces of the support 11a, the support 11b, and the connection part 12. Also, an FPC (Flexible Print Circuit) 15 is connected to the display panel 13, and is electrically connected to a circuit board 16 provided inside the support 11a via the FPC 15. Further, the circuit board 16 is electrically connected to a battery 17 provided inside the first support 11a. Also, as shown in FIG. 2(A), the battery 17 may also be provided inside the second support 11b. Although not shown here, the support 11b may have a circuit board on which an IC or the like for controlling the drive of the detection means 14 is mounted. For example, the IC is a detection means In FIG. 2(A), the display panel 13 is arranged along the upper surfaces of the support 11a, the support 11b, and the connection part 12. Also, an FPC (Flexible Print Circuit) 15 is connected to the display panel 13, and is electrically connected to a circuit board 16 provided inside the support 11a via the FPC 15. Further, the circuit board 16 is electrically connected to a battery 17 provided inside the first support 11a. Also, as shown in FIG. 2(A), the battery 17 may also be provided inside the second support 11b. Although not shown here, the support 11b may have a circuit board on which an IC or the like for controlling the drive of the detection means 14 is mounted. For example, the IC is a detection means It may also have a function of driving 14 and a function of extracting the signal output from the detection means 14. It is okay.

[0049] The display panel 13 is supported so as to be fixed to the support 11a. For example, a part of the display panel 13 may be adhered to the support 11a, or may be mechanically fixed by a fixing tool such as a screw. It may be fixed.

[0050] On the other hand, the display panel 13 is supported without being fixed to the support 11b. Specifically, In FIG. 2(A), the display panel 13 is supported so as to be slidable in the left-right direction with respect to the support 11b. It is supported like this.

[0051] Here, among the thickness direction of the display panel 13 (the vertical direction in FIG. 2(A)) and the direction perpendicular to the bending direction when the display panel 13 is bent (the direction perpendicular to the paper surface in FIG. 2(A)), it is preferable that the display panel 13 is supported so that the display panel 13 does not move (shift) in one or both of these directions. That is, it is preferable that the display panel 13 is supported by the support 11b so that the display panel 13 does not move (shift). It is preferably supported by the support 11b.

[0052] As described above, the display panel 13 is supported so as to be fixed to the support 11a and not to be fixed to the support 11b. Therefore, when the supports 11a and 11b are relatively rotated via the connection part 12, the display panel 13 is displaced with respect to the support 11b, so that the stress applied in the direction perpendicular to the thickness direction of the display panel 13 is relaxed, and problems such as breakage of the display panel 13 can be suppressed. Therefore, a highly reliable electronic device 10 can be realized. realized. realized. realized.

[0053] FIG. 2(A) shows an example in which the detection means 14 is arranged on the second support 11b. . The detection means 14 has a function of detecting the relative position between the support 11b and the display panel 13. . A specific configuration example of the detection means 14 will be described later. Here, in Fig. 2(A), a configuration is shown in which the detection means 14 is arranged on the support 11b, but the position of the detection means 14 can be appropriately set according to its configuration.

[0054] Fig. 2(B) and Fig. 2(C) also show enlarged views of a part of the support 11b.

[0055] As shown in Fig. 2(B), when the display surface of the display panel 13 is bent inward, the relative position between the display panel 13 and the support 11b is displaced so that the end portion of the display panel 13 on the support 11b side moves outward. On the other hand, as shown in Fig. 2(C), when the display surface of the display panel 13 is bent outward, the relative position between the display panel 13 and the support 11b is displaced so that the end portion of the display panel 13 on the support 11b side moves inward.

[0056] By detecting the relative displacement between the display panel 13 and the support 11b that occurs when the display panel 13 is bent in this way, the relative positional relationship between the support 11a and the support 11b can be calculated from this displacement value. As a result, it becomes possible to detect the shape of the electronic device 10.

[0057] The above is the description of the cross-sectional configuration example.

[0058] [Regarding the displacement amount of the display panel] Hereinafter, the amount of displacement (displacement amount) of the relative position between the display panel 13 and the support 11b that occurs when the electronic device 10 is deformed so as to bend the display panel 13 will be described.

[0059] Figure 3(A) is a diagram schematically showing an electronic device according to an aspect of the present invention. As shown in Figure 3(A), the electronic device has a configuration in which a support 11a and a support 11b are connected by an elastic connection part 12. Also, a display panel 13_1 is provided on one surface of the support 11a, the connection part 12, and the support 11b, and a display panel 13_2 is provided on the other surface. In Figure 3(A), hatching patterns are added to show that the display panel 13_1 and the display panel 13_2 are fixed to a part of the surface of the support 11a.

[0060] Here, in order to simultaneously explain both cases where the display surface of the display panel faces inward and outward when the connection part 12 is bent, an example having two display panels is used for explanation.

[0061] As shown in Figure 3(A), the thickness of each of the support 11a, the support 11b, and the connection part 12 is defined as thickness t. Also, the length of the connection part 12 is defined as length L0. It is assumed that the respective ends of the display panel 13_1 and the display panel 13_2 coincide with the end of the support 11b. In Figure 3(A), the neutral line (also referred to as the neautral line) 12a of the connection part 12 is shown by a dashed line. Here, in this specification and the like, the neutral line refers to a line connecting the center in the thickness direction in the cross-section of the object when no stress is applied to the object.

[0062] Here, as shown in Figure 3(B), consider the case where the neutral line 12a of the connection part 12 is curved by an angle θ with a radius of curvature r0. At this time, since the connection part 12 is an elastic body, due to the stress generated when the connection part 12 is curved, the portion inside the neutral line 12a of the connection part 12 shrinks. ​​​​​The portion outside the neutral line 12a of the connection part 12 will extend.

[0063] Here, for simplicity, when the connection part 12 is curved, the thickness of the connection part 12 does not change, and the neutral line 12a of the connection part 12 always passes through the center of the thickness of the connection part 12, and the neutral line 12a of the connection part 12 curves with a constant radius of curvature from one end to the other end of the connection part 12. Consider the case.

[0064] In FIG. 3(B), the length of the neutral line 12a of the connection part 12 is L0. Also, the radius of curvature r1 on the inner surface of the connection part 12 and the radius of curvature r2 on the outer surface of the connection part 12 are as follows, respectively.

[0065]

Equation

[0066] Therefore, in the cross-section shown in FIG. 3(B), the length L1 of the inner surface of the connection part 12 and the length L2 of the outer surface of the connection part 12 are as follows, respectively.

[0067]

Equation

[0068] Here, since the display panel 13_1 is provided in contact with the inner surface of the connection part 12, assuming that the display panel 13_1 does not expand or contract, a part of the display panel 13_1 moves relative to the support 11b so that the end of the display panel 13_1 shifts outside the end of the support 11b. Similarly, since the display panel 13_2 is provided in contact with the outer surface of the connection part 12, the display panel 13_2 moves relative to the support 11b so that the end of the display panel 13_2 shifts inside the end of the support 11b. ​​​​​A part of the display panel 13_2 moves relative to the support 11b. The amount of displacement d1 of the display panel 13_2 relative to the support 11b and the amount of displacement d2 of the display panel 13_2 relative to the support 11b are If the amount of displacement to is considered positive, then the result is as follows:

[0069]

number

[0070] From the formula (3), the displacement amount d1 of the display panel 13_1 and the displacement amount d It can be seen that both of these depend on the thickness t of the connection part 12 and the angle θ. If the length t is constant, the angle θ can be estimated.

[0071] In addition, the magnitude of the displacement amount d1 of the display panel 13_1 and the displacement amount d2 of the display panel 13_2 The greater the distance between the display panel 13_1 or 13_2 and the neutral line 12a, the Therefore, the display panel is located at least away from the neutral line 12a. That is, the display panel is preferably made up of a support 11a, a connection portion 12, and a second support. It is preferable that they are positioned so as not to overlap with the center positions of the respective supports 11b in the thickness direction.

[0072] In reality, there may be some portions where the thickness of the curved portion of the connection portion 12 is thin. Therefore, there are two cases: a display panel 13_1 in FIG. 3B, in which the display surface is bent inward; and a display panel In the case of bending the display surface outward as in 13_2, the absolute value of the displacement differs, and Therefore, the amount of displacement between the display panel 13 and the support 11b may differ from the value. When calculating the angle θ from the relative displacement amount, it is preferable to consider and correct the shape change when the connecting portion 12 is bent. Preferably, it is corrected in consideration of the shape change when the connecting portion 12 is bent.

[0073] Also, here, the case where the connecting portion 12 has a plate-like shape is shown, but it is not limited to this. For example, as shown in FIGS. 4(A) and 4(B), by making the connecting portion 12 have a cavity inside, wiring 18 can be provided in the cavity. With the wiring 18, circuit boards, batteries, etc. provided inside the support 11a and the support 11b can be electrically connected to each other. Further, as shown in FIGS. 4(C) and 4(D), by making the connecting portion 12 have a bellows structure, the stress applied to the connecting portion 12 when the connecting portion 12 is bent can be reduced. Also, as shown in FIGS. 4(E) and 4(F), the connecting portion 12 may have a bellows structure with a cavity provided inside, and the wiring 18 may be provided in the cavity.

[0074] Also, here, the case where an elastic body is used as the connecting portion 12 has been described. However, when a hinge is used as the connecting portion 12, the relative movement range between the support 11a and the support 11b can be restricted, so that it is preferable because the angle θ can be calculated more precisely from the relative displacement amount between the support 11b and the display panel 13. At this time, it is preferable that the hinge has a configuration having two or more rotation axes because a design with a higher degree of freedom is possible. The above is the description of the displacement amount of the display panel.

[0075] The above is the description of the displacement amount of the display panel.

[0076] [Configuration Example of Detection Means] As described above, the detection means 14 refers to a mechanism having a function of detecting a change in the relative position between the support 11b and the display panel 13. The detection means 14 refers to a mechanism having a function of detecting a change in the relative position between the support 11b and the display panel 13.

[0077] As the detection means 14, it is preferable to adopt a configuration that optically detects a change in position. For example, one of a light-emitting element and a light-receiving element may be provided on the support 11b, and the other may be provided on the display panel 13. Alternatively, both a light-emitting element and a light-receiving element may be provided on the support 11b, and the light from the light-emitting element reflected by the display panel 13 may be detected by the light-receiving element. Further, both the light-emitting element and the light-receiving element may be provided on the display panel 13, and the reflected light from the support 11b may be received. More specifically, the following configurations can be used.

[0078] Specifically, the following configurations can be used.

[0079] 〔Configuration Example 1〕 Fig. 5(A) shows a schematic cross-sectional view of a region including the detection means 14 of the support 11b.

[0080] The support 11b has a first portion 31 that supports the display panel 13, a second portion 32 located on the display surface side of the display panel 13, and a third portion located on the side opposite to the display surface side of the display panel 13. The second portion 32 and the third portion 33 may function as exterior members of the support 11b. The detection means 14 has a plurality of light-receiving elements 21 and a light-emitting element 22.

[0081]

[0082] In the configuration shown in Fig. 5(A), the plurality of light-receiving elements 21 are each fixedly arranged on the surface of the second portion 32 of the support 11b facing the display panel 13. The light-emitting element 22 is fixedly arranged on the display panel 13. The light-emitting element 22 can emit light toward the second portion 32 of the support 11b, more specifically, toward the light-receiving element 21 side.

[0083] ​​​​​​ As the light emitted by the light-emitting element 22, it may be visible light, infrared light, or ultraviolet light. For example, a light-emitting element that emits light having one or more peaks in the wavelength range of 300 nm to 3000 nm can be applied. In particular, when infrared light having a wavelength of 750 nm or more is used, considering light leakage from the support 11b, the necessity is lower than when visible light or ultraviolet light is used, so the design is easy, and furthermore, it is preferable because safety can be enhanced.

[0084] As the light-emitting element 22, for example, a light-emitting element such as an LED (Light Emitting Diode), an organic EL element, or an inorganic EL element can be applied. In particular, when the display panel 13 has a light-emitting element such as an organic EL element in a pixel, if a light-emitting element manufactured in the same process as the pixel is used as the light-emitting element 22, the number of components can be reduced. In that case, the light emitted from the light-emitting element 22 becomes light including visible light.

[0085] The light-receiving element 21 is an element that can receive the light emitted from the light-emitting element 22. As the light-receiving element 21, for example, a light-receiving element including a photoelectric conversion element such as a photodiode or a phototransistor can be applied. In addition, a solid-state imaging device such as a CCD image sensor or a CMOS image sensor can also be applied.

[0086] Also, as will be described later, the light-receiving element 21 can be provided on the display panel 13. At this time, particularly in the case of an optical touch panel in which the display panel 13 has a photoelectric conversion element such as a photodiode in the display area, it is preferable to manufacture the light-receiving element 21 and the photoelectric conversion element in the same process.

[0087] Figures 5(B) and (C) are schematic perspective views showing the detection means 14 and its main peripheral parts.

[0088] The display panel 13 has a display portion 13a and a non-display portion 13b. The display portion 13a is a portion that has a plurality of pixels and can display an image or the like. Further, a light-emitting element 22 is disposed in a part of the non-display portion 13b. The second portion 32 of the support 11b is disposed so as to overlap with the non-display portion 13b of the display panel 13. As shown in FIG. 5(B), the light 23 emitted by the light-emitting element 22 is emitted toward the display surface side of the display panel 13. At this time, the light-receiving element 21 located in the traveling direction of the light 23 detects the light 23.

[0089]

[0090] Subsequently, assuming that the display panel 13 is displaced relative to the support 11b in the direction of the arrow shown in FIG. 5(C) from the state of FIG. 5(B). At this time, since the relative positions of the light-emitting element 22 and the plurality of light-receiving elements 21 change, a light-receiving element 21 different from that in the state of FIG. 5(B) is located in the traveling direction of the light 23 emitted by the light-emitting element 22.

[0091] Note that FIGS. 5(B) and the like show a case where the traveling direction of the light 23 is substantially perpendicular to the surface of the display panel 13, but the present invention is not limited thereto, and the light 23 may travel in an oblique direction. Further, as the light-emitting element 22, a light-emitting element having high directivity may be used, or a light-emitting element having an intensity distribution with respect to the traveling direction may be used.

[0092] Thus, by comparing the detection intensities of the light 23 received by the plurality of light-receiving elements 21, it becomes possible to detect the relative positional relationship between the display panel 13 and the support 11b. ​​​​​​​​​​​​

[0093] The accuracy of the position detected by the detection means 14 can be improved by arranging the plurality of light receiving elements 21 as closely as possible without gaps with respect to the relative displacement direction between the display panel 13 and the support 11b. For example, as shown in FIG. 6(A), by arranging the projections of two adjacent light receiving elements 21 so as to overlap each other with respect to the vector (arrow) parallel to the displacement direction, the accuracy of the detected position can be enhanced. For example, as shown in FIG. 6(A), by arranging the projections of two adjacent light receiving elements 21 so as to overlap each other with respect to the vector (arrow) parallel to the displacement direction, the accuracy of the detected position can be enhanced.

[0094] Also, as shown in FIG. 6(B), even when two adjacent light receiving elements 21 are arranged with a gap, if the angular dependence of the light 23 from the light emitting element 22 is known in advance, the position of the light emitting element 22 can be detected with high accuracy by calculating the peak position of the detection intensity from the values of the detection intensities by the plurality of light receiving elements 21. the position of the light emitting element 22 can be detected with high accuracy by calculating the peak position of the detection intensity from the values of the detection intensities by the plurality of light receiving elements 21.

[0095] Here, as the detection means 14, a configuration is adopted in which a plurality of light receiving elements 21 are provided on the second portion 32 of the support 11b and the light emitting element 22 is provided on the display panel 13, but the present invention is not limited to this. For example, as shown in FIG. 7(A), a configuration may be adopted in which a plurality of light receiving elements are provided on the display panel 13 and the light emitting element 22 is provided on the second portion 32 of the support 11b. For example, as shown in FIG. 7(A), a configuration may be adopted in which a plurality of light receiving elements are provided on the display panel 13 and the light emitting element 22 is provided on the second portion 32 of the support 11b. For example, as shown in FIG. 7(A), a configuration may be adopted in which a plurality of light receiving elements are provided on the display panel 13 and the light emitting element 22 is provided on the second portion 32 of the support 11b.

[0096] Also, as shown in FIG. 7(B), a configuration may be adopted in which the first portion 31 of the support 11b has an opening, a light emitting element 22 that emits light on the side opposite to the display surface of the display panel 13, and a plurality of light receiving elements 21 provided on the third portion 33 of the support 11b.

[0097] Also, as shown in FIG. 7(C), a plurality of light receiving elements are provided on the side opposite to the display surface of the display panel 13 It is also possible to adopt a configuration in which 21 is provided and the light-emitting element 22 is provided in the third portion of the support 11b.

[0098] Also, in FIGS. 7(B) and 7(C), the opening of the first portion 31 only needs to transmit the light emitted by the light-emitting element 22, and it may have a member having translucency. The above is the description of Configuration Example 1.

[0099] The above is the description of Configuration Example 1.

[0100] 〔Configuration Example 2〕 Hereinafter, a configuration example that is partially different from the above Configuration Example 1 will be described. Note that descriptions of overlapping parts may be omitted. The above is the description of Configuration Example 1.

[0101] FIG. 8(A) is a schematic perspective view showing the detection means 14 and its main peripheral part.

[0102] On the surface of the second portion 32 of the support 11b facing the display panel 13, the light-receiving element 21 and the light-emitting element 22 are arranged side by side. As shown in FIG. 8(A), the light 23 emitted by the light-emitting element 22 is reflected by a part of the non-display portion 13b of the display panel 13, and a part of the reflected light is received by the light-receiving element 21. As the display panel 13 is displaced with respect to the support 11b, the intensity of the light received by the light-receiving element 21 changes. Therefore, by detecting this change, the relative displacement amount between the display panel 13 and the support 11b can be detected.

[0103] As shown in FIG. 8(A), the light 23 emitted by the light-emitting element 22 is reflected by a part of the non-display portion 13b of the display panel 13, and a part of the reflected light is received by the light-receiving element 21. As the display panel 13 is displaced with respect to the support 11b, the intensity of the light received by the light-receiving element 21 changes. Therefore, by detecting this change, the relative displacement amount between the display panel 13 and the support 11b can be detected. In the non-display portion 13b of the display panel 13, the portion that reflects the light 23 emitted by the light-emitting element 22 preferably has portions with different reflectivities. More specifically, it may have portions with different reflectivities along the direction perpendicular to the displacement direction of the display panel 13. In the non-display portion 13b of the display panel 13, the portion that reflects the light 23 emitted by the light-emitting element 22 preferably has portions with different reflectivities. More specifically, it may have portions with different reflectivities along the direction perpendicular to the displacement direction of the display panel 13. In the non-display portion 13b of the display panel 13, the portion that reflects the light 23 emitted by the light-emitting element 22 preferably has portions with different reflectivities. More specifically, it may have portions with different reflectivities along the direction perpendicular to the displacement direction of the display panel 13. In the non-display portion 13b of the display panel 13, the portion that reflects the light 23 emitted by the light-emitting element 22 preferably has portions with different reflectivities. More specifically, it may have portions with different reflectivities along the direction perpendicular to the displacement direction of the display panel 13.

[0104] In the non-display portion 13b of the display panel 13, the portion that reflects the light 23 emitted by the light-emitting element 22 preferably has portions with different reflectivities. More specifically, it may have portions with different reflectivities along the direction perpendicular to the displacement direction of the display panel 13. In the non-display portion 13b of the display panel 13, the portion that reflects the light 23 emitted by the light-emitting element 22 preferably has portions with different reflectivities. More specifically, it may have portions with different reflectivities along the direction perpendicular to the displacement direction of the display panel 13. In the non-display portion 13b of the display panel 13, the portion that reflects the light 23 emitted by the light-emitting element 22 preferably has portions with different reflectivities. More specifically, it may have portions with different reflectivities along the direction perpendicular to the displacement direction of the display panel 13. For example, the pattern of wiring provided in the non-display portion 13b, the pattern of the drive circuit, etc. can also be used. It is also possible.

[0105] Also, a pattern for position detection may be separately formed on the surface or inside of the non-display portion 13b of the display panel 13. For example, when the display panel 13 is displaced, a pattern may be formed such that portions with high reflectance and portions with low reflectance appear alternately. Such a pattern may be formed by a printing method or the like, or a pattern in which an uneven shape is formed on the surface of the display panel 13 may be used. For example, a pattern may be formed such that portions with high reflectance and portions with low reflectance appear alternately. This pattern may be formed by a printing method or the like, or a pattern in which an uneven shape is formed on the surface of the display panel 13 may be used. It may also be used.

[0106] Figures 8(B) to (E) show an example of the pattern for position detection provided in the non-display portion 13b of the display panel 13. The arrows in each figure indicate the displacement direction of the display panel 13. Figures 8(B) to (E) show an example of the pattern for position detection provided in the non-display portion 13b of the display panel 13. The arrows in each figure indicate the displacement direction of the display panel 13. It shows.

[0107] In FIG. 8(A), there are a first region 24 having a first reflectance and a second region 25 having a second reflectance. It has a pattern in which a plurality of stripe-shaped second regions 25 are arranged in a direction substantially parallel to the displacement direction of the display panel 13. In FIG. 8(A), there are a first region 24 having a first reflectance and a second region 25 having a second reflectance. It has a pattern in which a plurality of stripe-shaped second regions 25 are arranged in a direction substantially parallel to the displacement direction of the display panel 13. It has a pattern in which a plurality of stripe-shaped second regions 25 are arranged in a direction substantially parallel to the displacement direction of the display panel 13.

[0108] Here, the difference in reflectance between the first reflectance and the second reflectance may be, for example, 5% or more, preferably 10% or more, more preferably 15% or more. Also, as long as there is a difference in reflectance between the first reflectance and the second reflectance, the first reflectance may be higher than the second reflectance, or lower. It may be lower.

[0109] Also, as shown in FIG. 8(C), the stripe-shaped second region 25 may be arranged obliquely with respect to the displacement direction. Also, as shown in FIG. 8(D), the second region 25 is in a lattice shape It may be arranged obliquely with respect to the displacement direction. Also, as shown in FIG. 8(D), the second region 25 is in a lattice shape It may have the shape. Also, as shown in FIG. 8(E), the second region 25 may be a pattern arranged in dots. It may be an array pattern.

[0110] Here, an example where two portions with different reflectivities are regularly arranged has been shown. However, two or more portions with different reflectivities may be regularly arranged. Also, a configuration in which two or more portions with different reflectivities are irregularly arranged may be adopted. It may be an array pattern. It may be a configuration in which two or more portions with different reflectivities are irregularly arranged.

[0111] Also, here, the case where the light receiving element 21 and the light emitting element 22 are arranged in the second portion 32 of the support 11b has been described. However, a configuration in which they are arranged in the third portion 33 may be adopted. In that case, as exemplified in Configuration Example 1, a first portion 31 having an opening through which the light emitted from the light emitting element 22 passes may be provided. It may be a configuration in which they are arranged in the third portion 33. In that case, as exemplified in Configuration Example 1, a first portion 31 having an opening through which the light emitted from the light emitting element 22 passes may be provided. It may be a configuration in which they are arranged in the third portion 33. In that case, as exemplified in Configuration Example 1, a first portion 31 having an opening through which the light emitted from the light emitting element 22 passes may be provided. It may be a configuration in which they are arranged in the third portion 33. In that case, as exemplified in Configuration Example 1, a first portion 31 having an opening through which the light emitted from the light emitting element 22 passes may be provided.

[0112] As described above, by providing both the light receiving element 21 and the light emitting element 22 on the support 11b and detecting the relative position between the display panel 13 and the support 11b using the reflected light, the number of components can be reduced. Also, as a pattern for one detection provided in the non-display portion 13b of the display panel 13, a pattern such as wiring included in the display panel 13 can be used, so that the degree of freedom in design can be increased. As described above, by providing both the light receiving element 21 and the light emitting element 22 on the support 11b and detecting the relative position between the display panel 13 and the support 11b using the reflected light, the number of components can be reduced. Also, as a pattern for one detection provided in the non-display portion 13b of the display panel 13, a pattern such as wiring included in the display panel 13 can be used, so that the degree of freedom in design can be increased. As described above, by providing both the light receiving element 21 and the light emitting element 22 on the support 11b and detecting the relative position between the display panel 13 and the support 11b using the reflected light, the number of components can be reduced. Also, as a pattern for one detection provided in the non-display portion 13b of the display panel 13, a pattern such as wiring included in the display panel 13 can be used, so that the degree of freedom in design can be increased. As described above, by providing both the light receiving element 21 and the light emitting element 22 on the support 11b and detecting the relative position between the display panel 13 and the support 11b using the reflected light, the number of components can be reduced. Also, as a pattern for one detection provided in the non-display portion 13b of the display panel 13, a pattern such as wiring included in the display panel 13 can be used, so that the degree of freedom in design can be increased. As described above, by providing both the light receiving element 21 and the light emitting element 22 on the support 11b and detecting the relative position between the display panel 13 and the support 11b using the reflected light, the number of components can be reduced. Also, as a pattern for one detection provided in the non-display portion 13b of the display panel 13, a pattern such as wiring included in the display panel 13 can be used, so that the degree of freedom in design can be increased.

[0113] The above is the description of Configuration Example 2.

[0114] In the present embodiment, a configuration including two supports has been adopted. However, a configuration including three or more supports can also be adopted. The larger the number of supports, the more possible it is to deform the electronic device into various shapes, and the wider the range of applications. FIGS. 9(A) to (C) show three supports (Support 1). The larger the number of supports, the more possible it is to deform the electronic device into various shapes, and the wider the range of applications. FIGS. 9(A) to (C) show three supports (Support 1). The larger the number of supports, the more possible it is to deform the electronic device into various shapes, and the wider the range of applications. FIGS. 9(A) to (C) show three supports (Support 1). 1c, 11d, 11e) shows a configuration example of an electronic device. The electronic device shown in Fig. 9(A) can be folded like Fig. 9(C) through the form shown in Fig. 9(B) by bending the display panel 13 at two locations.

[0115] Also, when configured to have three or more supports, the display panel 13 may be fixed to one of the supports and supported so as to be slidable without being fixed to the other supports. Among the supports that do not support the display panel 13, one or more supports may be configured to be provided with the above-described detection means. That is, if the number of supports included in the electronic device is n, it may be configured to provide the detection means on one or more supports among them and n - 1 or less. The larger the number of supports having the detection means, the more preferable it is because it becomes possible to detect the form of the electronic device in more detail. Preferably, the detection means may be provided on all supports that do not support the display panel 13.

[0116] In addition, the electronic device according to one aspect of the present invention can be configured to provide various input means, output means, or input / output means on the support. For example, in Fig. 20, an input button 41, a power button 42, an external connection terminal 43, a card slot 44, an optical sensor 45, a camera 46, a light source 47, a speaker 48, and a microphone 49 are provided on the support 11a or the support 11b. An example is shown. Also, in Fig. 20, a battery 17 is built in each of the supports 11a and 11b. An antenna 51 is mounted on a part of the support 11b.

[0117] This embodiment can be implemented in appropriate combination with at least a part of other embodiments described in this specification. ​​​​​​​​

[0118] (Embodiment 2) In this embodiment, a configuration example and a manufacturing method example of a light-emitting panel applicable to a display panel included in an electronic device according to an aspect of the present invention will be described. An example of a configuration of a light-emitting panel and an example of a manufacturing method will be described.

[0119] [Specific Example 1] FIG. 10(A) shows a plan view of the light-emitting panel, and FIG. 10(C) shows an example of a cross-sectional view between the dashed-dotted line A1-A2 in FIG. 10(A). The light-emitting panel shown in Specific Example 1 is a top-emission type light-emitting panel using a color filter method. In this embodiment, the light-emitting panel is configured, for example, to represent one color with three sub-pixels of R (red), G (green), and B (blue), or a configuration in which one color is represented by four sub-pixels of R (red), G (green), B (blue), W (white), or R (red), G (green), B (blue), Y (yellow) can be applied. There is no particular limitation on the color elements, and colors other than RGBW may be used. For example, it may be configured with yellow, cyan, magenta, etc.

[0120] The light-emitting panel shown in FIG. 10(A) includes a light-emitting portion 804, a drive circuit portion 806, and an FPC (Flexible Printed Circuit) 808. The light-emitting elements and transistors included in the light-emitting portion 804 and the drive circuit portion 806 are encapsulated by a substrate 801, a substrate 803, and a sealing layer 823.

[0121] The light-emitting panel shown in FIG. 10(C) includes a substrate 801, an adhesive layer 811, an insulating layer 813, a plurality of transistors, a conductive layer 857, an insulating layer 815, an insulating layer 817, a plurality of light-emitting elements, an insulating layer 8 21, a sealing layer 823, an overcoat 849, a coloring layer 845, a light-shielding layer 847, an insulating layer 84 ​​​​​​3. It has a bonding layer 841 and a substrate 803. The encapsulation layer 823, the overcoat 849, the insulating layer 843, the bonding layer 841, and the substrate 803 are transmissive to visible light.

[0122] The light-emitting part 804 has a transistor 820 and a light-emitting element 830 on the substrate 801 via a bonding layer 811 and an insulating layer 813. The light-emitting element 830 has a lower electrode 831 on the insulating layer 817, an EL layer 833 on the lower electrode 831, and an upper electrode 835 on the EL layer 833. The lower electrode 831 is electrically connected to the source electrode or the drain electrode of the transistor 820. The end of the lower electrode 831 is covered with the insulating layer 821. The lower electrode 831 preferably reflects visible light. The upper electrode 835 is transmissive to visible light.

[0123] The light-emitting part 804 also has a coloring layer 845 overlapping the light-emitting element 830 and a light-shielding layer 847 overlapping the insulating layer 821. The coloring layer 845 and the light-shielding layer 847 are covered with the overcoat 849. The space between the light-emitting element 830 and the overcoat 849 is filled with the encapsulation layer 823.

[0124] The insulating layer 815 has the effect of suppressing the diffusion of impurities into the semiconductor constituting the transistor. Also, it is preferable to select an insulating layer having a planarization function for reducing surface irregularities caused by the transistor as the insulating layer 817.

[0125] The drive circuit part 806 has a plurality of transistors on the substrate 801 via a bonding layer 811 and an insulating layer 813. In FIG. 10(C), one of the transistors included in the drive circuit part 806 is shown.

[0126] ​The insulating layer 813 and the substrate 801 are bonded together by an adhesive layer 811. The insulating layer 813 and the substrate 803 are bonded together by the adhesive layer 841. If a film with low water permeability is used for 843, impurities such as water may be easily absorbed into the light emitting element 830 or the transistor 820. This is preferable because it is possible to prevent objects from entering the panel and the reliability of the panel is increased.

[0127] The conductive layer 857 transmits signals (video signals, clock signals, switch signals, etc.) from the outside to the driving circuit section 806. The external input terminal is electrically connected to an external input terminal that transmits a signal (such as a start signal or a reset signal) or a potential. Here, an example is shown in which an FPC808 is provided as an external input terminal. In order to prevent this, the conductive layer 857 is made of the same material and the same wiring as the electrodes and wiring used in the light-emitting section and the driving circuit section. In this embodiment, the conductive layer 857 is formed in the transistor 820. This shows an example in which the electrode is made of the same material and in the same process as the electrode to be used.

[0128] In the light-emitting panel shown in FIG. 10C, the connector 825 is located on the substrate 803. 825 includes the substrate 803, the adhesive layer 841, the insulating layer 843, the sealing layer 823, the insulating layer 817, and The connecting body 814 is connected to the conductive layer 857 through an opening provided in the insulating layer 815. 25 is connected to the FPC 808. The FPC 808 and the conductive layer 857 are connected to each other via the connector 825. When the conductive layer 857 and the substrate 803 overlap, the substrate 803 is opened. By using a substrate having an opening, the conductive layer 857, the connection 825, and the F The PC808 can be electrically connected.

[0129] In the specific example 1, the insulating layer 813, the transistor 820, the light-emitting element 820, and the like are formed on a highly heat-resistant substrate. The sub 830 is fabricated, the fabricated substrate is peeled off, and the insulating layer 8 is formed on the substrate 801 using the adhesive layer 811 shows a light-emitting panel that can be fabricated by inverting the 13 or the transistor 820 and the light-emitting element 830. Further, in Specific Example 1, the insulating layer 843, the coloring layer 845 and the light-shielding layer 847 are fabricated on a fabrication substrate having high heat resistance, the fabricated substrate is peeled off, and the insulating layer 843, the coloring layer 845, and the light-shielding layer 847 are inverted on the substrate 803 using the adhesive layer 841. shows a light-emitting panel that can be fabricated. is shown.

[0130] When a material with low heat resistance (such as resin) is used for the substrate, it is difficult to apply high temperature to the substrate during the fabrication process, so there are limitations on the conditions for fabricating transistors and insulating layers on the substrate. Also when a material with high water permeability (such as resin) is used for the substrate, it is preferable to apply high temperature to form a film with low water permeability. In the fabrication method of the present embodiment, since transistors and the like can be fabricated on a fabrication substrate with high heat resistance, high temperature can be applied to form highly reliable transistors and films with sufficiently low water permeability. Then, by inverting them onto the substrate 801 or the substrate 803 a highly reliable light-emitting panel can be fabricated. Thereby, in one aspect of the present invention, a lightweight or thin and highly reliable light-emitting panel can be realized. Details of the fabrication method will be described later A highly reliable transistor and a film with sufficiently low water permeability can be formed by applying high temperature. And by inverting them onto the substrate 801 or the substrate 803 a highly reliable light-emitting panel can be fabricated. Thereby, in one aspect of the present invention, a lightweight or thin and highly reliable light-emitting panel can be realized. Details of the fabrication method will be described later will be described later. will be described later.

[0131] In addition, by providing a light-emitting element fabricated in the same process as the above-described light-emitting element 830 in the non-display portion, it can be used as the light-emitting element 22 exemplified in Embodiment 1. can be used as the light-emitting element 22 exemplified in Embodiment 1.

[0132] [Specific Example 2] Fig. 10(B) shows a plan view of the light-emitting panel, and the dashed-dotted line A3 - A4 in Fig. 10(B) An example of a cross-sectional view between them is shown in Fig. 10(D). The light-emitting panel shown in Specific Example 2 is different from Specific Example 1 and is a top-emission type light-emitting panel using a color filter method. Here , only the points different from Specific Example 1 will be described in detail, and the points common to Specific Example 1 will be omitted from the description.

[0133] The light-emitting panel shown in Fig. 10(D) is different from the light-emitting panel shown in Fig. 10(C) in the following points .

[0134] The light-emitting panel shown in Fig. 10(D) has a spacer 827 on the insulating layer 821. By providing the spacer 827, the distance between the substrate 801 and the substrate 803 can be adjusted.

[0135] Also, the light-emitting panel shown in Fig. 10(D) has different sizes of the substrate 801 and the substrate 803. The connector 825 is located on the insulating layer 843 and does not overlap with the substrate 803. The connector 825 is connected to the conductive layer 857 through openings provided in the insulating layer 843, the sealing layer 823, the insulating layer 817, and the insulating layer 815 . Since it is not necessary to provide an opening in the substrate 803, the material of the substrate 803 is not limited.

[0136] Note that by providing a light-emitting element fabricated in the same process as the above-described light-emitting element 830 in the non-display portion, it can be used as the light-emitting element 22 exemplified in Embodiment 1.

[0137] [Specific Example 3] A plan view of the light-emitting panel is shown in Fig. 11(A), and an example of a cross-sectional view between the dashed-dotted line A5 - A6 in Fig. 11(A) is shown in Fig. 11(C). The light-emitting panel shown in Specific Example 3 is a top-emission type light-emitting panel using a painting method.

[0138] ​​​​​The light-emitting panel shown in Fig. 11(A) includes a light-emitting section 804, a drive circuit section 806, and an FPC 808. The light-emitting elements and transistors included in the light-emitting section 804 and the drive circuit section 806 are encapsulated by a substrate 8 01, a substrate 803, a frame-shaped encapsulation layer 824, and an encapsulation layer 823.

[0139] The light-emitting panel shown in Fig. 11(C) includes a substrate 801, an adhesive layer 811, an insulating layer 813, a plurality of transistors, a conductive layer 857, an insulating layer 815, an insulating layer 817, a plurality of light-emitting elements, an insulating layer 8 21, an encapsulation layer 823, a frame-shaped encapsulation layer 824, and a substrate 803. The encapsulation layer 823 and the substrate 803 transmit visible light.

[0140] The frame-shaped encapsulation layer 824 is preferably a layer having a higher gas barrier property than the encapsulation layer 823. Thereby, it is possible to suppress the intrusion of moisture and oxygen from the outside into the light-emitting panel. Therefore, a highly reliable light-emitting panel can be realized.

[0141] In Specific Example 3, the light emitted from the light-emitting element 830 is extracted from the light-emitting panel through the encapsulation layer 823. Therefore, the encapsulation layer 823 is preferably higher in light transmittance than the frame-shaped encapsulation layer 824. Further, the encapsulation layer 823 is preferably higher in refractive index than the frame-shaped encapsulation layer 824. Further, the encapsulation layer 823 preferably has a smaller volume shrinkage during curing than the frame-shaped encapsulation layer 824.

[0142] The light-emitting section 804 has transistors 820 and light-emitting elements 830 on the substrate 801 through the adhesive layer 811 and the insulating layer 813. The light-emitting element 830 has a lower electrode 83 1 on the insulating layer 817, an EL layer 833 on the lower electrode 831, and an upper electrode 835 on the EL layer 833. It is connected. The lower electrode 831 is electrically connected to the source electrode or the drain electrode of the transistor 820. It continues. The end of the lower electrode 831 is covered with the insulating layer 821. The lower electrode 831 preferably reflects visible light. The upper electrode 835 transmits visible light.

[0143] The drive circuit section 806 has a plurality of transistors on the substrate 801 via the adhesive layer 811 and the insulating layer 813. In FIG. 11(C), one of the transistors included in the drive circuit section 806 is shown.

[0144] The insulating layer 813 and the substrate 801 are bonded together by the adhesive layer 811. When a film with low water permeability is used for the insulating layer 813, it is possible to suppress the intrusion of impurities such as water into the light-emitting element 830 and the transistor 820, which is preferable because the reliability of the light-emitting panel is improved.

[0145] The conductive layer 857 is electrically connected to an external input terminal that transmits an external signal or potential to the drive circuit section 806. Here, an example in which the FPC 808 is provided as the external input terminal is shown. Also, here, an example in which the conductive layer 857 is made of the same material as the electrodes constituting the transistor 820 and is manufactured in the same process is shown.

[0146] In the light-emitting panel shown in FIG. 11(C), the connector 825 is located on the substrate 803. The connector 825 is connected to the conductive layer 857 through openings provided in the substrate 803, the sealing layer 823, the insulating layer 817, and the insulating layer 815. Also, the connector 825 is connected to the FPC 808. The FPC 808 and the conductive layer 857 are electrically connected through the connector 825.

[0147] In Specific Example 3, on a production substrate with high heat resistance, the insulating layer 813, the transistor 820, and the light-emitting element​​​​​​​​​​​ The sub 830 is fabricated, the fabricated substrate is peeled off, and the insulating layer 8 is formed on the substrate 801 using the adhesive layer 811 A light-emitting panel that can be fabricated by inverting the 13 or the transistor 820 and the light-emitting element 830 is shown Since fabrication of a transistor or the like can be performed on a fabrication substrate with high heat resistance, a high temperature can be applied to form a highly reliable transistor and a film with sufficiently low water permeability. Then, by inverting them onto the substrate 801, a highly reliable light-emitting panel can be fabricated. Accordingly in one aspect of the present invention, a lightweight or thin and highly reliable light-emitting panel can be realized .

[0148] Note that a light-emitting element fabricated in the same process as the above-described light-emitting element 830 can be provided in a non-display portion and used as the light-emitting element 22 exemplified in Embodiment 1.

[0149] [Specific Example 4] A plan view of the light-emitting panel is shown in FIG. 11(B), and an example of a cross-sectional view between the dashed-dotted line A7-A8 in FIG. 11(B) is shown in FIG. 11(D). The light-emitting panel shown in Specific Example 4 is a bottom emission type light-emitting panel using a color filter method.

[0150] The light-emitting panel shown in FIG. 11(D) includes a substrate 801, an adhesive layer 811, an insulating layer 813, a plurality of transistors, a conductive layer 857, an insulating layer 815, a colored layer 845, an insulating layer 817a, an insulating layer 8 17b, a conductive layer 816, a plurality of light-emitting elements, an insulating layer 821, a sealing layer 823, and a substrate 803 The substrate 801, the adhesive layer 811, the insulating layer 813, the insulating layer 815, the insulating layer 817a, and the insulating layer 817b transmit visible light.

[0151] The light-emitting portion 804 has transistors on the substrate 801 via the adhesive layer 811 and the insulating layer 813​ It has a transistor 820, a transistor 822, and a light-emitting element 830. The light-emitting element 830 has a lower electrode 831 on an insulating layer 817, an EL layer 833 on the lower electrode 831, and an upper electrode 835 on the EL layer 833. The lower electrode 831 is electrically connected to the source electrode or the drain electrode of the transistor 820. The end of the lower electrode 831 is covered with an insulating layer 821 . The upper electrode 835 preferably reflects visible light. The lower electrode 831 transmits visible light . The position where the coloring layer 845 overlapping the light-emitting element 830 is provided is not particularly limited. For example, it may be provided between the insulating layer 817a and the insulating layer 817b, between the insulating layer 815 and the insulating layer 817a, etc. is fine.

[0152] The drive circuit unit 806 has a plurality of transistors on the substrate 801 via an adhesive layer 811 and an insulating layer 813. In FIG. 11(C), among the transistors included in the drive circuit unit 806, two transistors are shown.

[0153] The insulating layer 813 and the substrate 801 are bonded together by an adhesive layer 811. If a film with low water permeability is used for the insulating layer 813, it is possible to suppress the intrusion of impurities such as water into the light-emitting element 830, the transistors 820, and 822, which is preferable because the reliability of the light-emitting panel is improved.

[0154] The conductive layer 857 is electrically connected to an external input terminal that transmits an external signal or potential to the drive circuit unit 806. Here, an example in which an FPC 808 is provided as the external input terminal is shown . Also, here, an example in which the conductive layer 857 is formed of the same material and in the same process as the conductive layer 816 is shown .

[0155] In Specific Example 4, an insulating layer 813, a transistor 820, a light-emitting element 830, etc. are fabricated on a highly heat-resistant fabrication substrate, the fabrication substrate is peeled off, and the insulating layer 813, the transistor 820, the light-emitting element 830, etc. are transferred onto the substrate 801 using the adhesive layer 811, thereby fabricating a light-emitting panel. Since transistors and the like can be fabricated on a highly heat-resistant fabrication substrate, high temperatures can be applied to form highly reliable transistors and films with sufficiently low water permeability. Then, by transferring them onto the substrate 801, a highly

[0156] reliable light-emitting panel can be fabricated. Thus, in one aspect of the present invention, a lightweight or thin and highly reliable light-emitting panel can be

[0157] realized. FIG. 11(E) shows an example of a light-emitting panel different from Specific Examples 1 to 4.

[0158] The light-emitting panel shown in FIG. 11(E) includes a substrate 801, an adhesive layer 811, an insulating layer 813, a conductive layer 814, a conductive layer

[0159] 857a, a conductive layer 857b, a light-emitting element 830, an insulating layer 821, a sealing layer 823, and a substrate 803.

[0160] The conductive layer 857a and the conductive layer 857b function as external connection electrodes of the light-emitting panel and can be electrically It is of the bottom emission type, top emission type, or dual emission type. The electrode, substrate, insulating layer, etc. on the light extraction side are each transmissive to visible light. The conductive layer 814 is electrically connected to the lower electrode 831.

[0161] The substrate on the light extraction side may have, as a light extraction structure, a hemispherical lens, a microlens array, a film with an uneven structure, a light diffusion film, etc. For example, by adhering the above-mentioned lens or film onto a resin plate using an adhesive or the like having the same refractive index as that of the substrate or the lens or film, a light extraction structure can be formed.

[0162] The conductive layer 814 does not necessarily have to be provided, but it is preferably provided because it can suppress the voltage drop due to the resistance of the lower electrode 831. Also, for the same purpose, a conductive layer that is electrically connected to the upper electrode 835 may be provided on the insulating layer 821, on the EL layer 833, or on the upper electrode 835, etc.

[0163] The conductive layer 814 can be formed as a single layer or by lamination using a material selected from copper, titanium, tantalum, tungsten, molybdenum, chromium, neodymium, scandium, nickel, aluminum, or an alloy material mainly composed of these. The film thickness of the conductive layer 814 can be, for example, 0.1 μm or more and 3 μm or less, and preferably 0.1 μm or more and 0 .5 μm or less.

[0164] When a paste (such as a silver paste) is used as the material of the conductive layer that is electrically connected to the upper electrode 835, the metal constituting the conductive layer becomes granular and aggregates. Therefore, the surface of the conductive layer becomes rough and has many gaps, making it difficult for the EL layer 833 to completely cover the conductive layer, and the upper electrode​​ It is preferable that electrical connection with the conductive layer can be easily achieved.

[0165] In Specific Example 5, an insulating layer 813, a light-emitting element 830, etc. are fabricated on a fabrication substrate with high heat resistance, the fabrication substrate is peeled off, and an insulating layer 813, a light-emitting element 83 0, etc. are transferred onto a substrate 801 using an adhesive layer 811 to show a light-emitting panel that can be fabricated. On a fabrication substrate with high heat resistance, a film with sufficiently low water permeability is formed by applying high temperature and then transferred onto the substrate 801, whereby a light-emitting panel with high reliability can be fabricated. Thus, in one aspect of the present invention, a lightweight or thin and high-reliability light-emitting panel can be realized.

[0166] Here, an example in the case where a light-emitting element is used as the display element has been shown, but one aspect of the present invention is not limited to this.

[0167] For example, in this specification, etc., a display element, a display device or a display panel which is a device having the display element, a light-emitting element, and a light-emitting device which is a device having the light-emitting element can use various forms or can have various elements. As an example of the display element, the display device, the display panel, the light-emitting element or the light-emitting device, an EL (electroluminescence) element (an EL element including an organic substance and an inorganic substance, an organic EL element, an inorganic EL element), an LED (a white LED, a red LE D, a green LED, a blue LED, etc.), a transistor (a transistor that emits light according to current ), an electron-emitting element, a liquid crystal element, an electronic ink, an electrophoretic element, a grating light valve (GLV), a plasma display (PDP), a display element using a MEMS (micro-electro-mechanical system), a digital micromirror device (DMD), a D MS (Digital Micro Shutter), MIRASOL (registered trademark), IMOD (In Interference modulation elements, shutter-type MEMS display elements, optical Interferometric MEMS display element, electrowetting element, piezoelectric ceramic display Ray, carbon nanotubes, etc., electromagnetic effects, contrast, brightness, reflection Some display devices use electroluminescent (EL) elements that change their display properties, such as their reflectance and transmittance. An example of a display device using electron-emitting devices is an EL display. is a field emission display (FED) or SED type flat panel display (SED:Surface-conduction Electron-emitter An example of a display device using liquid crystal elements is a liquid crystal display. Ray (transmissive LCD, semi-transmissive LCD, reflective LCD, Direct-view LCD, projection LCD, etc. Electronic ink, electronic powder An example of a display device using an electrophoretic element is electronic paper. When realizing a semi-transmissive or reflective liquid crystal display, one of the pixel electrodes For example, the pixel electrode may be a reflective electrode. Some or all of the poles may be made of aluminum, silver, etc. In this case, it is possible to provide a memory circuit such as an SRAM under the reflective electrode. This further reduces power consumption.

[0168] In addition, a light emitting element manufactured in the same process as the light emitting element 830 described above may be provided in the non-display portion. Thus, it can be used as the light-emitting element 22 exemplified in the first embodiment.

[0169] [Example of material] Next, materials and the like that can be used for the light-emitting panel will be described. Note that descriptions of the configurations described earlier in this specification may be omitted.

[0170] For the substrate, materials such as glass, quartz, organic resin, metal, and alloy can be used. The substrate on the side where light is extracted from the light-emitting element uses a material having translucency with respect to the light.

[0171] In particular, it is preferable to use a flexible substrate. For example, an organic resin, glass, metal, or alloy having a thickness that provides flexibility can be used.

[0172] Since the specific gravity of the organic resin is smaller than that of glass, using the organic resin as the flexible substrate can reduce the weight of the light-emitting panel compared to using glass, which is preferable.

[0173] It is preferable to use a material with high toughness for the substrate. This can realize a light-emitting panel with excellent impact resistance and low breakage probability. For example, by using an organic resin substrate, a thin metal substrate, or an alloy substrate, a lighter and less breakable light-emitting panel can be realized compared to using a glass substrate.

[0174] Since metal materials and alloy materials have high thermal conductivity and can easily conduct heat throughout the substrate, they can suppress local temperature rise of the light-emitting panel, which is preferable. The thickness of the substrate using a metal material or an alloy material is preferably 10 μm or more and 200 μm or less, and more preferably 20 μm or more and 50 μm or less.

[0175] The material constituting the metal substrate or the alloy substrate is not particularly limited. For example, aluminum​​​​​​​​​​ Metals such as mu, copper, iron, titanium, nickel, or one or more metals selected from these metals can be used. As the alloy, for example, an aluminum alloy or stainless steel can be preferably used.

[0176] In addition, when a material with a high heat emissivity is used for the substrate, the surface temperature of the light-emitting panel can be suppressed from increasing, and the destruction and reliability degradation of the light-emitting panel can be suppressed. For example, the substrate may be a laminated structure of a metal substrate and a layer with a high heat emissivity (for example, a metal oxide or a ceramic material can be used).

[0177] Examples of the material having flexibility and translucency include polyester resins such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), polyacrylonitrile resin, polyimide resin, polymethyl methacrylate resin, polycarbonate (PC) resin, polyethersulfone (PES) resin, polyamide resin, cycloolefin resin, polystyrene resin, polyamideimide resin, polyvinyl chloride resin, etc. In particular, it is preferable to use a material with a low coefficient of thermal expansion. For example, polyamideimide resin, polyimide resin, PET, etc. can be preferably used. In addition, a substrate in which a fibrous body is impregnated with a resin (also called a prepreg) or a substrate in which an inorganic filler is mixed with an organic resin to reduce the coefficient of thermal expansion can also be used.

[0178] As the flexible substrate, a layer using the above material may be laminated with a hard coat layer (for example, a silicon nitride layer, etc.) that protects the surface of the device from scratches and a layer made of a material capable of dispersing pressure (for example, an aramid resin layer, etc.).

[0179] The flexible substrate can also be used by laminating a plurality of layers. In particular, a configuration having a glass layer can improve the barrier properties against water and oxygen and result in a highly reliable light-emitting panel. It is possible to do so.

[0180] For example, a flexible substrate in which a glass layer, an adhesive layer, and an organic resin layer are laminated from the side close to the light-emitting element can be used. The thickness of the glass layer is 20 μm or more and 200 μm or less, preferably 25 μm or more and 100 μm or less. A glass layer having such a thickness can simultaneously achieve high barrier properties against water and oxygen and flexibility. Also, the thickness of the organic resin layer is 1 0 μm or more and 200 μm or less, preferably 20 μm or more and 50 μm or less. By providing such an organic resin layer outside the glass layer, cracking and cracking of the glass layer can be suppressed and the mechanical strength can be improved. By applying such a composite material of a glass material and an organic resin to the substrate, a highly reliable flexible light-emitting panel can be obtained. It is possible to do so. For the adhesive layer and the sealing layer, various curable adhesives such as ultraviolet curable type photocurable adhesives, reaction curable adhesives, thermosetting adhesives, and anaerobic adhesives can be used. These adhesives include epoxy resins, acrylic resins, silicone resins, phenolic resins, polyimide resins, imide resins, PVC (polyvinyl chloride) resins, PVB (polyvinyl butyral) resins It is possible to do so.

[0181] For the adhesive layer and the sealing layer, various curable adhesives such as ultraviolet curable type photocurable adhesives, reaction curable adhesives, thermosetting adhesives, and anaerobic adhesives can be used. As these adhesives epoxy resins, acrylic resins, silicone resins, phenolic resins, polyimide resins, imide resins, PVC (polyvinyl chloride) resins, PVB (polyvinyl butyral) resins EVA (ethylene vinyl acetate) resins, etc. can be mentioned. In particular, materials with low moisture permeability such as epoxy resins are preferred. Also, a two-component mixed resin may be used. Also, an adhesive sheet etc. may be used. etc. may be used. It is possible to do so.

[0182] Further, the resin may contain a desiccant. For example, substances that adsorb moisture by chemical adsorption, such as oxides of alkaline earth metals (calcium oxide, barium oxide, etc.), can be used. Or substances that adsorb moisture by physical adsorption, such as zeolite and silica gel, may also be used. When a desiccant is included, it is possible to suppress the intrusion of impurities such as moisture into the functional elements, which is preferable because it improves the reliability of the light-emitting panel. For example, substances that adsorb moisture by chemical adsorption, such as oxides of alkaline earth metals (calcium oxide, barium oxide, etc.), can be used. Or substances that adsorb moisture by physical adsorption, such as zeolite and silica gel, may also be used. When a desiccant is included, it is possible to suppress the intrusion of impurities such as moisture into the functional elements, which is preferable because it improves the reliability of the light-emitting panel.

[0183] Moreover, by mixing a filler with a high refractive index or a light-scattering member into the resin, the light extraction efficiency from the light-emitting element can be improved. For example, titanium oxide, barium oxide, zeolite, zirconium, etc. can be used. For example, titanium oxide, barium oxide, zeolite, zirconium, etc. can be used.

[0184] The structure of the transistor included in the light-emitting panel is not particularly limited. For example, it may be a staggered transistor or an inverse staggered transistor. Also, it may be either a top-gate type or a bottom-gate type transistor structure. The semiconductor material used for the transistor is not particularly limited, and examples include silicon, germanium, silicon carbide, gallium nitride, etc. Or an oxide semiconductor containing at least one of indium, gallium, and zinc, such as an In-Ga-Zn-based metal oxide, may be used. For example, it may be a staggered transistor or an inverse staggered transistor. Also, it may be either a top-gate type or a bottom-gate type transistor structure. The semiconductor material used for the transistor is not particularly limited, and examples include silicon, germanium, silicon carbide, gallium nitride, etc. Or an oxide semiconductor containing at least one of indium, gallium, and zinc, such as an In-Ga-Zn-based metal oxide, may be used.

[0185] The crystallinity of the semiconductor material used for the transistor is not particularly limited either, and any of an amorphous semiconductor, a semiconductor having crystallinity (microcrystalline semiconductor, polycrystalline semiconductor, single-crystalline semiconductor, or a semiconductor having a crystalline region in part) may be used. Using a semiconductor having crystallinity is preferable because it can suppress the deterioration of transistor characteristics. The crystallinity of the semiconductor material used for the transistor is not particularly limited either, and any of an amorphous semiconductor, a semiconductor having crystallinity (microcrystalline semiconductor, polycrystalline semiconductor, single-crystalline semiconductor, or a semiconductor having a crystalline region in part) may be used. Using a semiconductor having crystallinity is preferable because it can suppress the deterioration of transistor characteristics.

[0186] Here, for transistors used in pixels, driving circuits, and touch sensors described later, etc., it is preferable to apply an oxide semiconductor to any semiconductor device. In particular, it is preferable to apply an oxide semiconductor having a larger bandgap than silicon. Using a semiconductor material with a wider bandgap and a lower carrier density than silicon is preferable because it can reduce the current in the off state of the transistor.

[0187] For example, as the above oxide semiconductor, it is preferable to contain at least indium (In) or zinc (Zn). More preferably, it contains an oxide represented by In-M-Zn-based oxide (M is a metal such as Al, Ti, Ga, Ge, Y, Zr, Sn, La, Ce, or Hf).

[0188] In particular, as the semiconductor layer, it is preferable to use an oxide semiconductor film having a plurality of crystal parts, where the c-axis of the crystal part is oriented perpendicular to the surface to be formed of the semiconductor layer or the upper surface of the semiconductor layer,

[0189] and having no grain boundaries between adjacent crystal parts. Since such an oxide semiconductor has no grain boundaries, the occurrence of cracks in the oxide semiconductor film due to stress when the display panel is curved is suppressed. Therefore, such an oxide semiconductor can be suitably used for a display panel having flexibility and used

[0190] while being curved. By using such a material as the semiconductor layer, fluctuations in electrical characteristics are suppressed, and a highly reliable transistor can be realized.

[0191] Also, due to its low off-current, the charge accumulated in the capacitor via the transistor can It is possible to hold continuously. By applying such a transistor to a pixel, it becomes possible to stop the driving circuit while maintaining the gradation of the image displayed in each display area. As a result, an electronic device with extremely low power consumption can be realized.

[0192] For stabilizing the characteristics of the transistor and the like, it is preferable to provide an underlying film. As the underlying film, an inorganic insulating film such as a silicon oxide film, a silicon nitride film, a silicon oxynitride film, or a silicon nitride oxide film can be used, and it can be formed as a single layer or by lamination. The underlying film can be formed by a sputtering method, a CVD (Chemical Vapor Deposition) method (such as a plasma CVD method, a thermal CVD method, an MOCVD (Metal Organic CVD) method, etc.), an ALD (Atomic Layer Deposition) method, a coating method, a printing method, or the like. Note that the underlying film may not be provided if not necessary. In each of the above configuration examples, the insulating layer 813 can also serve as the underlying film of the transistor.

[0193] As the light-emitting element, an element capable of self-emission can be used, and elements whose luminance is controlled by current or voltage are included in that category. For example, a light-emitting diode (LED), an organic EL element, an inorganic EL element, or the like can be used.

[0194] The light-emitting element may be any of a top emission type, a bottom emission type, and a dual emission type. For the electrode on the side where light is extracted, a conductive film that transmits visible light is used. Also, for the electrode on the side where light is not extracted, it is preferable to use a conductive film that reflects visible light.

[0195] A conductive film that transmits visible light can be formed, for example, using indium oxide, indium tin oxide (ITO: Indium Tin Oxide), indium zinc oxide, zinc oxide, zinc oxide doped with gallium, etc. Also, metals such as gold, silver, platinum, magnesium , nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, palladium, or titanium, alloys containing these metal materials, or nitrides of these metal materials (e.g ., titanium nitride) etc. can also be used by forming them thinly to have light transmissibility. Also, a laminated film of the above materials can be used as the conductive layer. For example, using a laminated film of an alloy of silver and magnesium and ITO is preferable because it can enhance conductivity. Also, graphene etc. may be used. A conductive film that reflects visible light can be formed, for example, using metal materials such as aluminum, gold, platinum, silver, nickel, tungsten , chromium, molybdenum, iron, cobalt, copper, or palladium, or alloys containing these metal materials. Also, lanthanum , neodymium, or germanium etc. may be added to the above metal materials or alloys. Also, alloys containing aluminum such as an alloy of aluminum and titanium , an alloy of aluminum and nickel, an alloy of aluminum and neodymium (aluminum alloy), alloys containing silver such as an alloy of silver and copper

[0196] , an alloy of silver and palladium and copper, an alloy of silver and magnesium etc. can be used to form it. An alloy containing silver and copper is preferable because it has high heat resistance. Further, by laminating a metal film or a metal oxide film in contact with the aluminum alloy film, oxidation of the aluminum alloy film can be suppressed. Examples of the materials for the metal film and the metal oxide film include titanium, titanium oxide, etc. Also, the above ​​​​​​​​ A conductive film that transmits visible light and a film made of a metal material may be laminated. For example, a laminated film of silver and ITO or a laminated film of a silver and magnesium alloy and ITO can be used.

[0197] The electrodes may be formed by using, for example, a vapor deposition method or a sputtering method. In addition, a discharge method such as an inkjet method, a printing method such as a screen printing method, or a plating method can be used for formation.

[0198] When a voltage higher than the threshold voltage of the light-emitting element is applied between the lower electrode 831 and the upper electrode 835, holes are injected into the EL layer 833 from the anode side and electrons are injected from the cathode side. The injected electrons and holes recombine in the EL layer 833, and the light-emitting substance contained in the EL layer 833 emits light.

[0199] The EL layer 833 has at least a light-emitting layer. As layers other than the light-emitting layer, the EL layer 833 may further have a layer containing a substance with high hole injection property, a substance with high hole transport property, a hole blocking material, a substance with high electron transport property, a substance with high electron injection property, or a bipolar substance (a substance with high electron transport property and high hole transport property), etc.

[0200] Either a low molecular compound or a high molecular compound can be used for the EL layer 833, and it may contain an inorganic compound. The layers constituting the EL layer 833 can be formed by methods such as a vapor deposition method (including a vacuum vapor deposition method), a transfer method, a printing method, an inkjet method, a coating method, etc.

[0201] When a white light-emitting element is applied as the light-emitting element 830, two types ​​​​​​It is preferable to adopt a configuration including a light-emitting substance of two or more types. For example, white light emission can be obtained by selecting light-emitting substances such that the light emissions of each of two or more light-emitting substances are in a complementary color relationship. For example, it is preferable to include two or more of light-emitting substances that emit light such as R (red), G (green), B (blue), Y (yellow), O (orange), etc., or light-emitting substances that emit light including spectral components of two or more colors among R, G, and B. Also, it is preferable to apply a light-emitting element whose emission spectrum has two or more peaks within the wavelength range of the visible light region (for example, 350 nm to 750 nm). Further, it is preferable that the emission spectrum of a material having a peak in the yellow wavelength region is a material that also has spectral components in the green and red wavelength regions. More preferably, the EL layer 833 preferably has a structure in which a light-emitting layer containing a light-emitting material that emits one color and a light-emitting layer containing a light-emitting material that emits another color are laminated. For example, the plurality of light-emitting layers in the EL layer 833 may be laminated in contact with each other, or may be laminated with a separation layer interposed therebetween. For example, a structure in which a separation layer is provided between a fluorescent light-emitting layer and a phosphorescent light-emitting layer may be adopted. The separation layer can be provided, for example, to prevent energy transfer (particularly triplet energy transfer) by the Dexter mechanism from a phosphorescent material or the like generated in the phosphorescent light-emitting layer to a fluorescent material or the like in the fluorescent light-emitting layer. The separation layer may have a thickness of about several nm. Specifically, it is 0.1 nm or more and 20 nm or less, or 1 nm or more and 10 nm or less, or 1 nm or more and 5 nm or less. The separation layer is a single material (preferably a bipolar substance) or a plurality of materials.

[0202]

[0203] ​​​​​​​​​​​​​​​​It includes (preferably a hole transporting material and an electron transporting material).

[0204] The separation layer may be formed using the material contained in the light-emitting layer in contact with the separation layer. As a result the production of the light-emitting element becomes easy, and the driving voltage is reduced. For example, when the phosphorescent light-emitting layer is composed of a host material, an assist material, and a phosphorescent material (guest material), the separation layer may be formed of the host material and the assist material. In other words, the separation layer has a region that does not contain the phosphorescent material, and the phosphorescent light-emitting layer has a region that contains the phosphorescent material. Thereby, it becomes possible to deposit the separation layer and the phosphorescent light-emitting layer depending on the presence or absence of the phosphorescent material. Also, with such a configuration, it becomes possible to form the separation layer and the phosphorescent light-emitting layer in the same chamber. Thereby, the manufacturing cost can be reduced.

[0205] Also, the light-emitting element 830 may be a single element having one EL layer, or may be a tandem element in which a plurality of EL layers are stacked via a charge generation layer.

[0206] The light-emitting element is preferably provided between a pair of insulating films with low water permeability. Thereby it is possible to suppress the intrusion of impurities such as water into the light-emitting element and suppress a decrease in the reliability of the light-emitting device.

[0207] Examples of the insulating film with low water permeability include films containing nitrogen and silicon such as a silicon nitride film and a silicon oxynitride film, and films containing nitrogen and aluminum such as an aluminum nitride film. Also, a silicon oxide film, a silicon oxynitride film, an aluminum oxide film, etc. may be used.

[0208] For example, the water vapor transmission rate of the insulating film with low water permeability is 1×10 -5 [g / m​​2 ·day] or less, preferably 1×10 [g / m -6 ·day] or less, more preferably 1×10 2 -7 g / m 2 ·day] or less, even more preferably 1×10 -8 [g / m 2 ·day] or less. It is preferable to use an insulating film with low water permeability for the insulating layer 813 and the insulating layer 843.

[0209] For the insulating layer 815, for example, an inorganic insulating film such as a silicon oxide film, a silicon oxynitride film, or an aluminum oxide film can be used. For the insulating layers 817, 817a,

[0210] and 817b, for example, organic materials such as polyimide, acrylic, polyamide, polyimide amide, and benzocyclobutene-based resins can be used respectively. Also, a low dielectric constant material (low-k material) or the like can be used. Further, each insulating layer may be formed by laminating a plurality of insulating films.

[0211] The insulating layer 821 is formed using an organic insulating material or an inorganic insulating material. As the resin, for example, a polyimide resin, a polyamide resin, an acrylic resin, a siloxane resin, an epoxy resin, or a phenol resin can be used. In particular, it is preferable to use a photosensitive resin material and form it so that the side wall of the opening portion becomes an inclined surface formed with a continuous curvature.

[0212] The method for forming the insulating layer 821 is not particularly limited, but a photolithography method, a sputtering method, a vapor deposition method, a droplet ejection method (such as an inkjet method), a printing method (screen printing, offset printing ​​It is advisable to use a printing method, etc.

[0213] The spacer 827 may be formed using an inorganic insulating material, an organic insulating material, a metal material, or the like. For example, inorganic insulating materials and organic insulating materials can be used for the insulating layer. Examples of metal materials that can be used include titanium and aluminum. The spacer 827 containing a conductive material and the upper electrode 835 are electrically connected to each other. This makes it possible to suppress a potential drop caused by the resistance of the upper electrode 835. The shape of the 27 may be either a forward taper shape or a reverse taper shape.

[0214] For light-emitting panels that function as electrodes or wiring of transistors or auxiliary electrodes of light-emitting elements The conductive layer used may be, for example, molybdenum, titanium, chromium, tantalum, tungsten, or aluminum. Metal materials such as aluminum, copper, neodymium, scandium, etc., or alloy materials containing these elements The conductive layer can be formed as a single layer or a laminated layer using a conductive metal oxide. The conductive metal oxide may be indium oxide (In2O3, etc.). ), tin oxide (SnO2, etc.), zinc oxide (ZnO), ITO, indium zinc oxide (I n2O3-ZnO, etc.) or these metal oxide materials containing silicon oxide It is possible.

[0215] The colored layer is a colored layer that transmits light of a specific wavelength band. For example, A red (R) color filter transmits light in the green wavelength range, and a green (G) color filter transmits light in the green wavelength range. A blue (B) color filter that transmits light in the blue wavelength band is used. Each color layer can be formed by using various materials and by printing, inkjet printing, photolithography, etc. They are formed at desired positions respectively by an etching method using a graphic method or the like.

[0216] The light-shielding layer is provided between adjacent color layers. The light-shielding layer blocks light from adjacent light-emitting elements and suppresses color mixing between adjacent light-emitting elements. Here, by providing the end portion of the color layer so as to overlap with the light-shielding layer, light leakage can be suppressed. As the light-shielding layer, a material that blocks light emission from the light-emitting element can be used. For example, a black matrix may be formed using a resin material containing a metal material, pigment, or dye. Note that if the light-shielding layer is provided in an area other than the light-emitting portion such as the drive circuit portion, unintentional light leakage due to guided light or the like can be suppressed, which is preferable.

[0217] An overcoat covering the color layer and the light-shielding layer may also be provided. By providing the overcoat, diffusion of impurities contained in the color layer or the like into the light-emitting element can be prevented. The overcoat is composed of a material that transmits light emission from the light-emitting element. For example, an inorganic insulating film such as a silicon nitride film or a silicon oxide film, or an organic insulating film such as an acrylic film or a polyimide film can be used, and a laminated structure of an organic insulating film and an inorganic insulating film may also be used.

[0218] When applying the material of the sealing layer onto the color layer and the light-shielding layer, it is preferable to use a material with high wettability with respect to the material of the sealing layer as the material of the overcoat. For example, as the overcoat, it is preferable to use an oxide conductive film such as an ITO film or a metal film such as a thin Ag film having a certain degree of light transmittance.

[0219] As the connector, a paste-like or sheet-like material obtained by mixing metal particles into a thermosetting resin , a material exhibiting anisotropic conductivity can be used. As the metal particles, for example, particles in which two or more metals are layered, such as nickel particles coated with gold, are preferably used. Alternatively, it is preferable to use a material in which the surface of granular resin is coated with metal.

[0220] [Example of manufacturing method] Next, the manufacturing method of the light-emitting panel will be exemplified with reference to FIGS. 12 and 13. Here, a light-emitting panel having the configuration of Specific Example 1 (FIG. 11(C)) will be described as an example.

[0221] First, a release layer 203 is formed on a manufacturing substrate 201, and an insulating layer 813 is formed on the release layer 203. Next, a plurality of transistors, a conductive layer 857, an insulating layer 815, an insulating layer 817, a plurality of light-emitting elements, and an insulating layer 821 are formed on the insulating layer 813. Note that the insulating layer 821, the insulating layer 817, and the insulating layer 815 have openings so that the conductive layer 857 is exposed (FIG. 12(A) ). )

[0222] Also, a release layer 207 is formed on a manufacturing substrate 205, and an insulating layer 843 is formed on the release layer 207. Next, a light-shielding layer 847, a coloring layer 845, and an overcoat 84 9 are formed on the insulating layer 843 (FIG. 12(B)).

[0223] As the manufacturing substrate 201 and the manufacturing substrate 205, a glass substrate, a quartz substrate, a sapphire substrate, a ceramic substrate, a metal substrate, etc. can be used respectively.

[0224] Also, for the glass substrate, for example, glass materials such as aluminosilicate glass, aluminoborosilicate glass, barium borosilicate glass, etc. can be used. For the temperature of the subsequent heat treatment, ​​​​If the degree of hardness is high, it is advisable to use one with a strain point of 730°C or higher. By adding more BaO, a more practical heat-resistant glass can be obtained. Russ etc. can be used.

[0225] When a glass substrate is used as the substrate, a silicon oxide film, an acid film, etc. are interposed between the substrate and the peeling layer. When an insulating film such as a silicon oxynitride film, a silicon nitride film, or a silicon oxynitride film is formed, the glass This is preferable because it can prevent contamination from the substrate.

[0226] The peeling layers 203 and 207 are made of tungsten, molybdenum, and titanium, respectively. Tantalum, Niobium, Nickel, Cobalt, Zirconium, Zinc, Ruthenium, Rhodium An element selected from the group consisting of ruthenium, palladium, osmium, iridium, and silicon, It is made of an alloy material or a compound material containing the element, and is a single layer or a laminated layer. The crystal structure of the layer containing silicon may be any of amorphous, microcrystalline, and polycrystalline.

[0227] The release layer can be formed by a sputtering method, a plasma CVD method, a coating method, a printing method, etc. The coating method includes a spin coating method, a droplet ejection method, and a dispense method.

[0228] When the peeling layer has a single layer structure, it is preferably a tungsten layer, a molybdenum layer, or a combination of tungsten and molybdenum. It is preferable to form a layer containing a mixture of tungsten and tungsten oxide. A layer containing an oxynitride, a layer containing an oxide or oxynitride of molybdenum, or a layer containing a tungsten oxide or nitride. Alternatively, a layer containing an oxide or oxynitride of a mixture of fluorine and molybdenum may be formed. A mixture of tungsten and molybdenum is, for example, a mixture of tungsten and molybdenum. Correct.

[0229] In addition, a layer including tungsten and a layer including a tungsten oxide may be used as the peeling layer. When forming a structure, a layer containing tungsten is formed, and an insulating layer formed of oxide is formed on the layer. By forming a film, a tungsten oxide-containing film is formed at the interface between the tungsten layer and the insulating film. Alternatively, the surface of the layer containing tungsten may be subjected to a thermal oxidation treatment. Treatment with oxygen plasma, nitrous oxide (N2O) plasma, ozone water, and other highly oxidizing agents A layer containing tungsten oxide may be formed by treating with a solution or the like. Treatment and heating may be carried out using oxygen, nitrogen, or nitrous oxide, either alone or in combination with other gases. The above plasma treatment or heat treatment may be performed under a mixed gas atmosphere. By changing the temperature, it is possible to control the adhesion between the release layer and the insulating film that will be formed later. be.

[0230] Each insulating layer is formed by using a sputtering method, a plasma CVD method, a coating method, a printing method, etc. For example, it is possible to form a thin film at a temperature of 250°C or higher and 400°C or higher by plasma CVD. By forming the membrane at a temperature of 0.4 °C or lower, it is possible to obtain a dense membrane with extremely low water permeability.

[0231] Thereafter, the surface of the production substrate 205 on which the colored layer 845 and the like are provided or the light-emitting element of the production substrate 201 is A material that will become a sealing layer 823 is applied to the surface on which the chip 230 and the like are provided, and the The fabrication substrate 201 and the fabrication substrate 205 are bonded together so that their surfaces face each other (FIG. 12( C).

[0232] Then, the fabrication substrate 201 is peeled off, and the exposed insulating layer 813 and substrate 801 are bonded to the adhesive layer 81 Bond using 1. Also, peel off the production substrate 205, and bond the exposed insulating layer 843 and the substrate 803 using the adhesive layer 841. In FIG. 13(A), the substrate 803 is configured not to overlap with the conductive layer 857, but the conductive layer 857 and the substrate 803 may overlap.

[0233] Note that various methods can be appropriately used for the peeling process. For example, when a layer containing a metal oxide film is formed as the peeling layer on the side in contact with the layer to be peeled, the metal oxide film can be made fragile by crystallization, and the layer to be peeled can be peeled from the production substrate. Also, when an amorphous silicon film containing hydrogen is formed as the peeling layer between a production substrate with high heat resistance and the layer to be peeled, the amorphous silicon film can be removed by irradiation with laser light or etching, and the layer to be peeled can be peeled from the production substrate. Also, a layer containing a metal oxide film is formed as the peeling layer on the side in contact with the layer to be peeled, the metal oxide film is made fragile by crystallization, and then a part of the peeling layer is removed by etching using a solution or a fluorinated gas such as NF3, BrF3, or ClF3. After that, peeling can be performed on the fragile metal oxide film. Furthermore, a film containing nitrogen, oxygen, hydrogen, etc. (for example, an amorphous silicon film containing hydrogen, a hydrogen-containing alloy film, an oxygen-containing alloy film, etc.) can be used as the peeling layer, and a method of irradiating the peeling layer with laser light to release nitrogen, oxygen, or hydrogen contained in the peeling layer as a gas to promote the peeling between the layer to be peeled and the substrate may be used. Also, methods such as mechanically removing the production substrate on which the layer to be peeled is formed or etching with a solution or a fluorinated gas such as NF3, BrF3, or ClF3 can be used. In this case, the peeling layer may not be provided. When a layer containing a metal oxide film is formed on the side in contact with the layer to be peeled as the peeling layer, the metal oxide film can be made fragile by crystallization, and the layer to be peeled can be peeled from the production substrate. Also, when an amorphous silicon film containing hydrogen is formed as the peeling layer between a production substrate with high heat resistance and the layer to be peeled, the amorphous silicon film can be removed by irradiation with laser light or etching, and the layer to be peeled can be peeled from the production substrate. When an amorphous silicon film containing hydrogen is formed as the peeling layer between a production substrate with high heat resistance and the layer to be peeled, the amorphous silicon film can be removed by irradiation with laser light or etching, and the layer to be peeled can be peeled from the production substrate. By removing the amorphous silicon film by irradiation with laser light or etching, the layer to be peeled can be peeled from the production substrate. Also, a layer containing a metal oxide film is formed as the peeling layer on the side in contact with the layer to be peeled, the metal oxide film is made fragile by crystallization, and then a part of the peeling layer is removed by etching using a solution or a fluorinated gas such as NF3, BrF3, or ClF3. After that, peeling can be performed on the fragile metal oxide film. Furthermore, a film containing nitrogen, oxygen, hydrogen, etc. (for example, an amorphous silicon film containing hydrogen, a hydrogen-containing alloy film, an oxygen-containing alloy film, etc.) can be used as the peeling layer, and a method of irradiating the peeling layer with laser light to release nitrogen, oxygen, or hydrogen contained in the peeling layer as a gas to promote the peeling between the layer to be peeled and the substrate may be used. Also, methods such as mechanically removing the production substrate on which the layer to be peeled is formed or etching with a solution or a fluorinated gas such as NF3, BrF3, or ClF3 can be used. In this case, the peeling layer may not be provided. When a layer containing a metal oxide film is formed on the side in contact with the layer to be peeled as the peeling layer, the metal oxide film can be made fragile by crystallization, and the layer to be peeled can be peeled from the production substrate. Also, when an amorphous silicon film containing hydrogen is formed as the peeling layer between a production substrate with high heat resistance and the layer to be peeled, the amorphous silicon film can be removed by irradiation with laser light or etching, and the layer to be peeled can be peeled from the production substrate. Furthermore, a film containing nitrogen, oxygen, hydrogen, etc. (for example, an amorphous silicon film containing hydrogen, a hydrogen-containing alloy film, an oxygen-containing alloy film, etc.) can be used as the peeling layer, and a method of irradiating the peeling layer with laser light to release nitrogen, oxygen, or hydrogen contained in the peeling layer as a gas to promote the peeling between the layer to be peeled and the substrate may be used. Also, methods such as mechanically removing the production substrate on which the layer to be peeled is formed or etching with a solution or a fluorinated gas such as NF3, BrF3, or ClF3 can be used. In this case, the peeling layer may not be provided.

[0234] Moreover, by combining a plurality of the above peeling methods, the peeling process can be performed more easily. . That is, irradiation with a laser beam, etching of the peeling layer with a gas or a solution, mechanical removal with a sharp knife or a scalpel, etc. are performed to make the peeling layer and the layer to be peeled in a state where they can be easily peeled, and then , peeling can also be performed by a physical force (by a machine or the like).

[0235] Moreover, it is also possible to peel the layer to be peeled from the production substrate by infiltrating a liquid into the interface between the peeling layer and the layer to be peeled. Moreover, peeling may be performed while applying a liquid such as water during peeling.

[0236] As another peeling method, when the peeling layer is formed of tungsten, it is preferable to perform peeling while etching the peeling layer with a mixed solution of aqueous ammonia and hydrogen peroxide solution.

[0237] Note that when peeling is possible at the interface between the production substrate and the layer to be peeled, the peeling layer may not be provided. . For example, glass is used as the production substrate, and an organic resin such as polyimide, polyester, polyolefin, polyamide, polycarbonate, or acrylic is formed in contact with the glass, and an insulating film, a transistor, etc. are formed on the organic resin. In this case, by heating the organic resin, peeling can be performed at the interface between the production substrate and the organic resin. Or, a metal layer is provided between the production substrate and the organic resin, and the metal layer is heated by passing an electric current through the metal layer, and peeling may be performed at the interface between the metal layer and the organic resin. Finally, by opening the insulating layer 843 and the sealing layer 823, the conductive layer 857 is exposed (FIG. 13(B)). Note that when the substrate 803 overlaps the conductive layer 857, in order to expose the conductive layer 85 7, the substrate 803 and the adhesive layer 841 are also opened (FIG. 13(C)). Opening

[0238] (FIG. 13(C)). 7, the substrate 803 and the adhesive layer 841 are also opened (FIG. 13(C)). Opening The means is not particularly limited, and for example, a laser ablation method, an etching method, an ion beam sputtering method, etc. may be used. Further, a sharp blade or the like may be used on the film on the conductive layer 857 to make a cut, and a part of the film may be peeled off by physical force.

[0239] As described above, a light-emitting panel can be manufactured.

[0240] This embodiment can be implemented in appropriate combination with at least a part of other embodiments described in this specification.

[0241] (Embodiment 3) In this embodiment, a configuration example of a foldable and bendable touch panel applicable to a display panel included in an electronic device according to an aspect of the present invention will be described with reference to FIGS. 14 to 17. Note that, regarding the materials that can be used for each layer, reference can be made to Embodiment 2.

[0242] [Configuration Example 1] FIG. 14(A) is a top view of the touch panel. FIG. 14(B) is a cross-sectional view taken along the dashed-dotted line A-B and the dashed-dotted line C-D in FIG. 14(A). FIG. 14(C) is a cross-sectional view taken along the dashed-dotted line E-F in FIG. 14(A).

[0243] As shown in FIG. 14(A), the touch panel 390 has a display portion 301.

[0244] The display portion 301 includes a plurality of pixels 302 and a plurality of imaging pixels 308. The imaging pixel 308 can detect a finger or the like that touches the display portion 301. Thus, a touch sensor can be configured using the imaging pixel 308.

[0245] The pixel 302 includes a plurality of sub-pixels (for example, sub-pixel 302R), and the sub-pixel includes a light-emitting element and​​​ It includes a pixel circuit that can supply power to drive a light-emitting element.

[0246] The pixel circuit is electrically connected to a wiring that can supply a selection signal and a wiring that can supply an image signal. Therewith.

[0247] Also, the touch panel 390 includes a scanning line driving circuit 303g(1) that can supply a selection signal to the pixel 302 and an image signal line driving circuit 303s(1) that can supply an image signal to the pixel 302. Therewith. Therewith.

[0248] The imaging pixel 308 includes a photoelectric conversion element and an imaging pixel circuit that drives the photoelectric conversion element.

[0249] The imaging pixel circuit is electrically connected to a wiring that can supply a control signal and a wiring that can supply a power supply potential. Therewith.

[0250] Examples of the control signal include a signal that can select an imaging pixel circuit for reading a recorded imaging signal, a signal that can initialize the imaging pixel circuit, and a signal that can determine the time for the imaging pixel circuit to detect light. Therewith. Therewith.

[0251] The touch panel 390 includes an imaging pixel driving circuit 303g(2) that can supply a control signal to the imaging pixel 308 and an imaging signal line driving circuit 303s(2) that can read out an imaging signal. Therewith. Therewith.

[0252] As shown in FIG. 14(B), the touch panel 390 has a substrate 510 and a substrate 570 facing the substrate 510. Therewith.

[0253] A material having flexibility can be preferably used for the substrate 510 and the substrate 570.

[0254] Materials with suppressed transmission of unintended impurities can be suitably used for the substrate 510 and the substrate 570. For example, a material with a water vapor transmission rate of 10 -5 g / m 2 ·day or less, preferably 1 0 -6 g / m 2 ·day or less can be suitably used.

[0255] Materials with approximately equal coefficient of linear expansion can be suitably used for the substrate 510 and the substrate 570. For example, a material with a coefficient of linear expansion of 1×10 -3 / K or less, preferably 5×10 -5 / K or less, more preferably 1×10 -5 / K or less can be suitably used.

[0256] The substrate 510 is a laminate in which a flexible substrate 510b, an insulating layer 510a that prevents diffusion of unintended impurities into the light-emitting element, and an adhesive layer 510c that bonds the flexible substrate 510b and the insulating layer 510a are laminated.

[0257] The substrate 570 is a laminate in which a flexible substrate 570b, an insulating layer 570a that prevents diffusion of unintended impurities into the light-emitting element, and an adhesive layer 570c that bonds the flexible substrate 570b and the insulating layer 570a are laminated.

[0258] For example, materials containing resins having polyester, polyolefin, polyamide (nylon, aramid, etc.), poly imide, polycarbonate or acrylic, urethane, epoxy or siloxane bonds can be used for the adhesive layer.

[0259] The sealing layer 560 bonds the substrate 570 and the substrate 510. The sealing layer 560 is more In addition, when light is extracted to the sealing layer 560 side, the sealing layer 560 has a large refractive index. The pixel circuit and the light emitting element (for example, the first light emitting element 350R) are mounted on the substrate 51. 0 and substrate 570.

[0260] The pixel 302 includes a subpixel 302R, a subpixel 302G, and a subpixel 302B (FIG. 14). In addition, the subpixel 302R includes a light-emitting module 380R, and the subpixel 302G includes a light-emitting The subpixel 302B comprises a light emitting module 380G, and the subpixel 302B comprises a light emitting module 380B.

[0261] For example, the subpixel 302R supplies power to the first light emitting element 350R and the second light emitting element 350R. (FIG. 14B) The light emitting module 380R includes a first light emitting element 350R and an optical element (e.g., a color layer 367R).

[0262] The light emitting element 350R includes a first lower electrode 351R, an upper electrode 352, and a lower electrode 351R. It has an EL layer 353 between upper electrodes 352 (FIG. 14(C)).

[0263] The EL layer 353 includes a first EL layer 353a, a second EL layer 353b, and a first EL layer 353c. There is an intermediate layer 354 between 53a and the second EL layer 353b.

[0264] The light emitting module 380R has a first colored layer 367R on a substrate 570. Any material that transmits light having a certain wavelength may be used, for example, red, green, or blue. A material that selectively transmits light can be used. Alternatively, the light emitted by the light-emitting element can be directly transmitted through the material. Alternatively, a transparent region may be provided.

[0265] For example, the light-emitting module 380R has a first light-emitting element 350R and a first colored layer 367R. It has a sealing layer 360 in contact with it.

[0266] The first colored layer 367R is located at a position overlapping the first light-emitting element 350R. As a result, a part of the light emitted by the light-emitting element 350R passes through the sealing layer 360 that also serves as an optical bonding layer and the first colored layer 367R and is emitted to the outside of the light-emitting module 380R as shown by the arrow in the figure.

[0267] The touch panel 390 has a light-shielding layer 367BM on the substrate 570. The light-shielding layer 367BM is provided so as to surround the colored layer (for example, the first colored layer 367R).

[0268] The touch panel 390 includes an antireflection layer 367p at a position overlapping the display unit 301. As the antireflection layer 367p, for example, a circularly polarized plate can be used.

[0269] The touch panel 390 includes an insulating layer 321. The insulating layer 321 covers the transistor 302t. Note that the insulating layer 321 can be used as a layer for flattening the unevenness caused by the pixel circuit. Also, an insulating layer in which a layer capable of suppressing the diffusion of impurities into the transistor 302t and the like is laminated can be applied to the insulating layer 321.

[0270] The touch panel 390 has a light-emitting element (for example, the first light-emitting element 350R) on the insulating layer 321.

[0271] The touch panel 390 has a partition wall 328 overlapping the end of the first lower electrode 351R on the insulating layer 3 21. Also, it has a spacer 329 for controlling the distance between the substrate 510 and the substrate 570 on the partition wall 328. ​​​​

[0272] The image signal line driving circuit 303s(1) includes a transistor 303t and a capacitor 303c. . Note that the driving circuit can be formed on the same substrate in the same process as the pixel circuit. Fig. 14 (B) shows that the transistor 303t may have a second gate 304 on the insulating layer 321. The second gate 304 may be electrically connected to the gate of the transistor 303t. It may be, or different potentials may be applied to them. Also, if necessary, the second gate 304 may be provided for the transistors 308t, 302t, etc.

[0273] The imaging pixel 308 includes a photoelectric conversion element 308p and an imaging pixel circuit for detecting the light irradiated on the photoelectric conversion element 308p. Also, the imaging pixel circuit includes a transistor 308t. Including.

[0274] For example, a pin-type photodiode can be used as the photoelectric conversion element 308p.

[0275] The touch panel 390 includes a wiring 311 capable of supplying signals, and a terminal 319 is provided on the wiring 311. Note that an FPC309(1) capable of supplying signals such as an image signal and a synchronization signal is electrically connected to the terminal 319. Note that a printed wiring board (PWB) may be attached to the FPC309( 1).

[0276] The transistors formed in the same process can be applied to transistors such as the transistor 302t, the transistor 303 t, and the transistor 308t. Regarding the configuration of the transistor, see Embodiment 2.

[0277] In addition to the gate, source, and drain of the transistor, each wiring and electrode constituting the touch panel The materials that can be used for the wiring and electrodes include aluminum, titanium, chromium, nickel, copper, yttrium, zirconium, molybdenum, silver, tantalum, or tungsten, a single metal composed of these, or an alloy having these as the main component is used in a single-layer structure or a laminated structure. For example, a single-layer structure of an aluminum film containing silicon, a two-layer structure in which an aluminum film is laminated on a titanium film, a two-layer structure in which an aluminum film is laminated on a tungsten film, a two-layer structure in which a copper film is laminated on a copper-magnesium-aluminum alloy film, a two-layer structure in which a copper film is laminated on a titanium film, a two-layer structure in which a copper film is laminated on a tungsten film, a titanium film or a titanium nitride film, and an aluminum film or a copper film is laminated on the titanium film or the titanium nitride film, and further a titanium film or a titanium nitride film is formed thereon, a three-layer structure, a molybdenum film or a molybdenum nitride film, and an aluminum film or a copper film is laminated on the molybdenum film or the molybdenum nitride film, and further a molybdenum film or a molybdenum nitride film is formed thereon, and there are three-layer structures and the like. In addition, a transparent conductive material containing indium oxide, tin oxide, or zinc oxide may be used. Further, using copper containing manganese is preferable because the controllability

[0278] of the shape by etching is enhanced. By providing a light-emitting element manufactured in the same process as the above-described light-emitting element (for example, the first light-emitting element 350R, etc.) in the non-display portion, it can be used as the light-emitting element 22 exemplified in Embodiment 1. Further, by providing an imaging pixel manufactured in the same process as the above-described imaging pixel 308 including the photoelectric conversion element 308p and the imaging pixel circuit in the non-display portion, it can be used as the light-receiving element 21

[0279] [Configuration Example 2] Figs. 15(A) and (B) are perspective views of the touch panel 505. For clarity, representative components are shown. Fig. 16 is a cross-sectional view between the dashed-dotted line X1-X2 shown in Fig. 15(A).

[0280] The touch panel 505 includes a display unit 501 and a touch sensor 595 (Fig. 15(B)). The touch panel 505 also has a substrate 510, a substrate 570, and a substrate 590. Note that the substrate 510, the substrate 570, and the substrate 590 all have flexibility.

[0281] The display unit 501 includes a substrate 510, a plurality of pixels on the substrate 510, and a plurality of wirings 511 that can supply signals to the pixels. The plurality of wirings 511 are routed to the outer peripheral portion of the substrate 510, and a part of them constitutes a terminal 519. The terminal 519 is electrically connected to the FPC 509(1).

[0282] The substrate 590 includes a touch sensor 595 and a plurality of wirings 598 that are electrically connected to the touch sensor 595. The plurality of wirings 598 are routed to the outer peripheral portion of the substrate 590, and a part of them constitutes a terminal. And the terminal is electrically connected to the FPC 509(2). Note that in Fig. 15(B), for clarity, the electrodes, wirings, etc. of the touch sensor 595 provided on the back side (the back side of the paper surface) of the substrate 590 are shown by solid lines.

[0283] As the touch sensor 595, for example, a capacitance type touch sensor can be applied. As the capacitance method, there are a surface capacitance method, a projected capacitance method, etc.

[0284] ​​​​​​​​​As the projection-type capacitance method, there are mainly a self-capacitance method and a mutual-capacitance method due to the difference in the driving method. Using the mutual-capacitance method enables simultaneous multi-point detection, which is preferable.

[0285] Hereinafter, the case of applying a touch sensor of the projection-type capacitance method will be described with reference to FIG. 15(B). It will be described using FIG. 15(B).

[0286] Note that various sensors capable of detecting the proximity or contact of a detection target such as a finger can be applied. It can be applied.

[0287] The touch sensor 595 of the projection-type capacitance method has an electrode 591 and an electrode 592. The electrode 591 is electrically connected to any one of a plurality of wirings 598, and the electrode 592 is electrically connected to any other one of the plurality of wirings 598. It is electrically connected.

[0288] As shown in FIGS. 15(A) and (B), the electrode 592 has a shape in which a plurality of quadrilaterals repeatedly arranged in one direction are connected at the corners. It has a shape in which a plurality of quadrilaterals repeatedly arranged in one direction are connected at the corners.

[0289] The electrode 591 is quadrilateral and is repeatedly arranged in a direction intersecting the direction in which the electrode 592 extends. It is repeatedly arranged.

[0290] The wiring 594 electrically connects two electrodes 591 sandwiching the electrode 592. At this time, a shape in which the area of the intersection portion of the electrode 592 and the wiring 594 is as small as possible is preferable. As a result, the area of the region where no electrode is provided can be reduced, and the unevenness of the transmittance can be reduced. As a result, the unevenness of the luminance of the light transmitted through the touch sensor 595 can be reduced. As a result, the unevenness of the luminance of the light transmitted through the touch sensor 595 can be reduced.

[0291] Note that the shapes of the electrodes 591 and 592 are not limited to this, and various shapes can be adopted. For example, Then, a plurality of electrodes 591 are arranged so that there is as little gap as possible, and the electrode 592 is provided in a plurality of spaced-apart regions through an insulating layer so as not to overlap with the electrode 591. This may be a configuration. At this time, it is preferable to provide a dummy electrode that is electrically insulated from these two adjacent electrodes 592 because it can reduce the area of regions with different transmittance. The touch sensor 595 includes a substrate 590, electrodes 591 arranged in a staggered pattern on the substrate 590, electrodes 592, an insulating layer 593 covering the electrodes 591 and the electrodes 592, and wiring 594 that electrically connects adjacent electrodes 591.

[0292] The adhesive layer 597 attaches the substrate 590 to the substrate 570 so that the touch sensor 595 overlaps the display unit 501. The electrodes 591 and 592 are formed using a conductive material having translucency. As the conductive material having translucency, conductive oxides such as indium oxide, indium tin oxide, indium zinc oxide, zinc oxide, and zinc oxide added with gallium can be used. In addition, a film containing graphene can also be used. The film containing graphene can be formed, for example, by reducing a film containing graphene oxide formed in a film shape. Examples of the reduction method include a method of applying heat.

[0293] After forming a film of a conductive material having translucency on the substrate 590 by a sputtering method, unnecessary portions are removed by various patterning techniques such as a photolithography method to form the electrodes 591 and 592.

[0294]

[0295]

[0296] ​​​​​​​​​​In addition, as the material used for the insulating layer 593, for example, resins such as acrylic and epoxy, in addition to resins having a siloxane bond, silicon oxide, silicon oxynitride, aluminum oxide and other inorganic insulating materials can also be used.

[0297] In addition, an opening reaching the electrode 591 is provided in the insulating layer 593, and the wiring 594 electrically connects the adjacent electrodes 591. The light-transmissive conductive material can increase the aperture ratio of the touch panel, so it can be suitably used for the wiring 594. Also, a material with higher conductivity than the electrodes 591 and 59 2 can reduce the electrical resistance, so it can be suitably used for the wiring 594.

[0298] One electrode 592 extends in one direction, and a plurality of electrodes 592 are provided in a stripe shape.

[0299] The wiring 594 is provided so as to intersect the electrode 592.

[0300] A pair of electrodes 591 are provided with one electrode 592 interposed therebetween, and the wiring 594 electrically connects the pair of electrodes 591

[0301] Note that the plurality of electrodes 591 do not necessarily need to be arranged in a direction orthogonal to one electrode 592, and may be arranged at an angle less than 90 degrees.

[0302] One wiring 598 is electrically connected to the electrode 591 or the electrode 592. One part of the wiring 598 functions as a terminal. As the wiring 598, for example, metal materials such as aluminum, gold, platinum, silver nickel, titanium, tungsten, chromium, molybdenum, iron, cobalt, copper, or palladium and alloy materials containing the metal materials can be used.

[0303] Note that an insulating layer covering the insulating layer 593 and the wiring 594 can be provided to protect the touch sensor 595. This can be done.

[0304] Also, the connection layer 599 electrically connects the wiring 598 and the FPC 509(2).

[0305] As the connection layer 599, various anisotropic conductive films (ACF: Anisotropic Conductive Film) or anisotropic conductive pastes (ACP: Anisotro pic Conductive Paste) can be used.

[0306] The adhesive layer 597 has light transmittance. For example, thermosetting resins or ultraviolet curable resins can be used. Specifically, resins such as acrylic, urethane, epoxy, or resins having a siloxane bond can be used. This can be done. Specifically, resins such as acrylic, urethane, epoxy, or resins having a siloxane bond can be used. This can be done.

[0307] The display unit 501 includes a plurality of pixels arranged in a matrix. Each pixel includes a display element and a pixel circuit for driving the display element. This can be done.

[0308] In this embodiment, the case where an organic EL element that emits white light is applied as the display element will be described, but the display element is not limited to this. This can be done.

[0309] For example, organic EL elements having different emission colors may be applied to each sub-pixel so that the color of the light emitted from each sub-pixel is different. This can be done.

[0310] The substrate 510, the substrate 570, and the sealing layer 560 can have the same configuration as that of Configuration Example 1 applied thereto.

[0311] Each pixel includes a sub-pixel 502R, and the sub-pixel 502R includes a light emitting module 580R.

[0312] The subpixel 502R supplies power to the first light-emitting element 550R and the second light-emitting element 550R. The pixel circuit includes a transistor 502t that can emit light. 580R includes a first light emitting element 550R and an optical element (eg, a color layer 567R).

[0313] The light-emitting element 550R has a lower electrode, an upper electrode, and an EL layer between the lower electrode and the upper electrode. .

[0314] The light emitting module 580R has a first colored layer 567R in the direction in which the light is extracted.

[0315] In addition, when the sealing layer 560 is provided on the side from which light is extracted, the sealing layer 560 is It contacts the light emitting element 550R and the first colored layer 567R.

[0316] The first colored layer 567R is located so as to overlap the first light emitting element 550R. A part of the light emitted by the optical element 550R is transmitted through the first colored layer 567R and is reflected by the arrows in the figure. The light is emitted to the outside of the light emitting module 580R in the direction of the arrow.

[0317] The display unit 501 has a light-shielding layer 567BM in the light-emitting direction. , and is provided so as to surround a colored layer (for example, the first colored layer 567R).

[0318] The display unit 501 includes an anti-reflection layer 567p at a position overlapping the pixel. For example, a circular polarizing plate can be used as p.

[0319] The display unit 501 includes an insulating film 521. The insulating film 521 covers the transistor 502t. The insulating film 521 is used as a layer for flattening unevenness caused by the pixel circuit. It is also possible to apply a laminated film including a layer capable of suppressing the diffusion of impurities to the insulating film 521. By doing so, it is possible to suppress a decrease in the reliability of the transistor 502t or the like due to unexpected diffusion of impurities. The display unit 501 has a light-emitting element (for example, the first light-emitting element 550R) on the insulating film 521. The display unit 501 has a partition wall 528 overlapping the end of the first lower electrode on the insulating film 521. Further, a spacer for controlling the distance between the substrate 510 and the substrate 570 is provided on the partition wall 528.

[0320] The display unit 501 has a partition wall 528 overlapping the end of the first lower electrode on the insulating film 521. Further, a spacer for controlling the distance between the substrate 510 and the substrate 570 is provided on the partition wall 528. The display unit 501 has a partition wall 528 overlapping the end of the first lower electrode on the insulating film 521. Further, a spacer for controlling the distance between the substrate 510 and the substrate 570 is provided on the partition wall 528.

[0321] The display unit 501 has a partition wall 528 overlapping the end of the first lower electrode on the insulating film 521. Further, a spacer for controlling the distance between the substrate 510 and the substrate 570 is provided on the partition wall 528. The scanning line driving circuit 503g(1) includes a transistor 503t and a capacitor 503c. In addition, the driving circuit can be formed on the same substrate in the same process as the pixel circuit.

[0322] The scanning line driving circuit 503g(1) includes a transistor 503t and a capacitor 503c. In addition, the driving circuit can be formed on the same substrate in the same process as the pixel circuit. The display unit 501 includes a wiring 511 capable of supplying a signal, and a terminal 519 is provided on the wiring 511. An FPC509(1) capable of supplying signals such as an image signal and a synchronization signal is electrically connected to the terminal 519.

[0323] The display unit 501 includes a wiring 511 capable of supplying a signal, and a terminal 519 is provided on the wiring 511. An FPC509(1) capable of supplying signals such as an image signal and a synchronization signal is electrically connected to the terminal 519. The display unit 501 includes a wiring 511 capable of supplying a signal, and a terminal 519 is provided on the wiring 511. An FPC509(1) capable of supplying signals such as an image signal and a synchronization signal is electrically connected to the terminal 519. The display unit 501 includes a wiring 511 capable of supplying a signal, and a terminal 519 is provided on the wiring 511. An FPC509(1) capable of supplying signals such as an image signal and a synchronization signal is electrically connected to the terminal 519.

[0324] Note that a printed wiring board (PWB) may be attached to the FPC509(1). Note that a printed wiring board (PWB) may be attached to the FPC509(1).

[0325] The display unit 501 has wirings such as a scanning line, a signal line, and a power supply line. Various conductive films described above can be used for the wirings. The display unit 501 has wirings such as a scanning line, a signal line, and a power supply line. Various conductive films described above can be used for the wirings.

[0326] Note that various transistors can be applied to the display unit 501. The configuration in the case of applying a bottom-gate type transistor to the display unit 501 is illustrated in FIGS. 16(A) and (B). The configuration in the case of applying a bottom-gate type transistor to the display unit 501 is illustrated in FIGS. 16(A) and (B).

[0327] For example, a semiconductor layer containing an oxide semiconductor, amorphous silicon, etc. can be applied to the transistors 502t and 503t shown in Fig. 16(A).

[0328] For example, a semiconductor layer containing polycrystalline silicon crystallized by a process such as laser annealing can be applied to the transistors 502t and 503t shown in Fig. 16(B).

[0329] Further, the configuration when applying a top-gate type transistor to the display unit 501 is shown in Fig. 16(C).

[0330] For example, a semiconductor layer containing a single crystal silicon film transferred from a polycrystalline silicon or single crystal silicon substrate, etc. can be applied to the transistors 502t and 503t shown in Fig. 16(C).

[0331] Note that by providing a light-emitting element fabricated in the same process as the above-described light-emitting element (e.g., the first light-emitting element 550R, etc.) in the non-display portion, it can be used as the light-emitting element 22 exemplified in Embodiment 1.

[0332] [Configuration Example 3] Fig. 17 is a cross-sectional view of the touch panel 505B. The touch panel 505B described in this embodiment is different from the touch panel 505 in Configuration Example 2 in that it includes a display unit 501 that displays the supplied image information on the side where the transistors are provided, and that the touch sensor is provided on the substrate 510 side of the display unit. Here, different configurations will be described in detail, and parts where the same configurations can be used will be referred to the above description.

[0333] ​​​​​​​​​​​The first color layer 567R is located at a position overlapping with the first light-emitting element 550R. Also, as shown in FIG. 17( A), the light-emitting element 550R emits light toward the side where the transistor 502t is provided. As a result, a part of the light emitted by the light-emitting element 550R passes through the first color layer 567R and is emitted to the outside of the light-emitting module 580R in the direction of the arrow shown in the figure.

[0334] The display unit 501 has a light-shielding layer 567BM in the direction of light emission. The light-shielding layer 567BM is provided so as to surround the color layer (for example, the first color layer 567R).

[0335] The touch sensor 595 is provided on the substrate 510 side of the display unit 501 (FIG. 17(A) ).

[0336] The adhesive layer 597 is between the substrate 510 and the substrate 590, and bonds the display unit 501 and the touch sensor 5 95 together.

[0337] Note that various transistors can be applied to the display unit 501. The configurations when applying a bottom-gate type transistor to the display unit 501 are illustrated in FIGS. 17(A) and (B).

[0338] For example, a semiconductor layer including an oxide semiconductor, amorphous silicon, etc. can be applied to the transistors 502t and 503t shown in FIG. 17(A). For example, a semiconductor layer including polycrystalline silicon, etc. can be applied to the transistors 5

[0339] 02t and 503t shown in FIG. 17(B). The configurations when applying a top-gate type transistor to the display unit 501 are illustrated in FIG. 17

[0340] (C). (C).

[0341] For example, a semiconductor layer including a polycrystalline silicon or a transferred single-crystalline silicon film or the like can be applied to the transistors 502t and 503t illustrated in FIG. 17 (C).

[0342] Note that a light-emitting element manufactured in the same process as the above-described light-emitting element (for example, the first light-emitting element 550R or the like) can be provided in a non-display portion and used as the light-emitting element 22 exemplified in Embodiment 1.

[0343] This embodiment can be implemented in appropriate combination with at least a part thereof and other embodiments described in this specification.

[0344] (Embodiment 4) In this embodiment, an example of a method for driving a touch panel applicable to a display panel included in an electronic device according to an aspect of the present invention will be described with reference to the drawings.

[0345] [Example of Sensor Detection Method] FIG. 18(A) is a block diagram showing a configuration of a mutual capacitance type touch sensor. In FIG. 18 (A), a pulse voltage output circuit 601 and a current detection circuit 602 are shown. In FIG. 18 (A), electrodes 621 to which a pulse voltage is applied and electrodes 622 for detecting a change in current are shown as six wirings of X1-X6 and Y1-Y6, respectively. Further, FIG. 18( A) shows a capacitance 603 formed by overlapping an electrode 121 and an electrode 122. Note that the functions of the electrode 121 and the electrode 122 may be replaced with each other.

[0346] The pulse voltage output circuit 601 is a circuit for sequentially applying pulses to the wirings of X1-X6 ​​​​​​​There is. By applying a pulse voltage to the wirings of X1 - X6, electrode 1 that forms capacitor 603 21 and electrode 122 generate an electric field. Utilizing the fact that the electric field generated between these electrodes causes a change in the mutual capacitance of capacitor 60 3, the proximity or contact of the object to be detected can be detected .

[0347] The current detection circuit 602 is a circuit for detecting the change in current in the wirings of Y1~Y6 due to the change in mutual capacitance in capacitor 603. In the wirings of Y1 - Y6, there is no change in the detected current value when there is no proximity or contact of the object to be detected, but when the proximity or contact of the object to be detected causes a decrease in the mutual capacitance, a change in the decrease of the current value is detected. The detection of the current can be performed using an integration circuit or the like . Next, Fig. 18(B) shows the timing chart of the input / output waveforms in the mutual capacitance type touch sensor shown in Fig. 18(A). In Fig. 18(B), it is assumed that the object to be detected is detected in each matrix during one frame period. Also, Fig. 18(B) shows two cases: when the object to be detected is not detected ( non - touch) and when the object to be detected is detected (touch). For the wirings of Y1 - Y6, waveforms corresponding to the detected current values are shown

[0348] . A pulse voltage is sequentially applied to the wirings of X1 - X6, and the waveforms in the wirings of Y1 - Y6 change according to the pulse voltage. When there is no proximity or contact of the object to be detected, the waveforms of Y1 - Y6 change uniformly in response to the change in the voltage of the wirings of X1 - X6. On the other hand, at the location where the object to be detected is in proximity or contact, since the current value decreases, the waveform of the corresponding voltage value also changes . . For the wirings of Y1 - Y6, waveforms corresponding to the voltage values corresponding to the detected current values are shown .

[0349] A pulse voltage is given to the wirings of X1 - X6 in order, and the waveforms in the wirings of Y1 - Y6 change according to the pulse voltage. When there is no proximity or contact of the object to be detected, the waveforms of Y1 - Y6 change uniformly in response to the change in the voltage of the wirings of X1 - X6. On the other hand, at the location where the object to be detected is in proximity or contact, since the current value decreases, the waveform of the corresponding voltage value also changes . ​

[0350] Thus, by detecting the change in mutual capacitance, proximity or contact of the detected object can be detected. This can be done.

[0351] Also, in Fig. 18(A), a passive type touch sensor configuration with only capacitance 603 provided at the intersection of wirings is shown as the touch sensor, but it may also be an active type touch sensor having a transistor and a capacitance. An example of one sensor circuit included in the active type touch sensor is shown in Fig. 19. The sensor circuit has a capacitance 603, a transistor 611, a transistor 612, and a transistor 613. The transistor 613 has a signal G2 applied to its gate, a voltage VRES applied to one of its source or drain, and the other is electrically connected to one electrode of the capacitance 603 and the gate of the transistor 611. One of the source or drain of the transistor 611 is electrically connected to one of the source or drain of the transistor 612, and a voltage VSS is applied to the other. The transistor 612 has a signal G2 applied to its gate, and the other of its source or drain is electrically connected to the wiring ML. A voltage VSS is applied to the other electrode of the capacitance 603. Next, the operation of the sensor circuit will be described. First, by applying a potential that turns on the transistor 613 as the signal G2, a potential corresponding to the voltage VRES is applied to the node n to which the gate of the transistor 611 is connected. Then, by applying a potential that turns off the transistor 613 as the signal G2, the potential of the node n is held.

[0352]

[0353]

[0354] ​​​​​​​​​​​​​Subsequently, as the mutual capacitance of capacitor 603 changes due to the proximity or contact of a detection object such as a finger, the potential of node n changes from VRES.

[0355] For the read operation, a potential that turns on transistor 612 is applied to signal G1. The current flowing through transistor 611 according to the potential of node n, that is, the current flowing through wiring ML, changes. By detecting this current, the proximity or contact of the detection object can be detected.

[0356] As transistors 611, 612, and 613, it is preferable to use transistors in which an oxide semiconductor is applied to a semiconductor layer in which a channel is formed. In particular, by applying such a transistor to transistor 613, the potential of node n can be held over a long period of time, and the frequency of the operation of supplying VRES to node n ( refresh operation) can be reduced.

[0357] This embodiment can be implemented in appropriate combination with at least some of the other embodiments described in this specification.

Explanation of Reference Numerals

[0358] 10 Electronic device 11a Support 11b Support 11c Support 11d Support 11e Support 12 Connection part 12a Neutral line 13 Display panel 13_1 Display panel 13_2 Display panel 13a Display part 13b Non-display part 14 Detection means 15 FPC 16 Circuit board 17 Battery 18 Wiring 21 Light-receiving element 22 Light-emitting element 23 Light 24 Region 25 Region 31 Portion 32 Portion 33 Portion 41 Input button 42 Power button 43 External connection terminal 44 Card slot 45 Optical sensor 46 Camera 47 Light source 48 Speaker 49 Microphone 51 Antenna 121 Electrode 122 Electrode 201 Fabrication substrate 203 Release layer 205 Fabrication substrate 207 Release layer 230 Light-emitting element 301 Display unit 302 Pixel 302B Sub-pixel 302G Sub-pixel 302R Sub-pixel 302t Transistor 303c Capacitance 303g(1) Scanning line drive circuit 303g(2) Imaging pixel drive circuit 303s(1) Image signal line drive circuit 303s(2) Imaging signal line drive circuit 303t Transistor 304 Gate 308 Imaging pixel 308p Photoelectric conversion element 308t Transistor 309 FPC 311 Wiring 319 Terminal 321 Insulating layer 328 Partition wall 329 Spacer 350R Light-emitting element 351R Lower electrode 352 Upper electrode 353 EL layer 353a EL layer 353b EL layer 354 Intermediate layer 360 Encapsulation layer 367BM Light-shielding layer 367p Anti-reflection layer 367R Coloring layer 380B Light-emitting module 380G Light-emitting module 380R Light-emitting module 390 Touch panel 501 Display unit 502R Sub-pixel 502t Transistor 503c Capacitor 503g Scanning line driving circuit 503t Transistor 505 Touch panel 505B Touch panel 509 FPC 510 Substrate 510a Insulating layer 510b Flexible substrate 510c Adhesive layer 511 Wiring 519 Terminal 521 Insulating film 528 Partition wall 550R Light-emitting element 560 Encapsulation layer 567BM Light-shielding layer 567p Anti-reflection layer 567R Coloring layer 570 Substrate 570a Insulating layer 570b Flexible substrate 570c Adhesive layer 580R Light-emitting module 590 Substrate 591 Electrode 592 Electrode 593 Insulating layer 594 Wiring 595 Touch sensor 597 Adhesive layer 598 Wiring 599 Connection layer 601 Pulse voltage output circuit 602 Current detection circuit 603 Capacitance 611 Transistor 612 Transistor 613 Transistor 621 Electrode 622 Electrode 801 Substrate 803 Substrate 804 Light emitting part 806 Driving circuit part 808 FPC 811 Adhesive layer 813 Insulating layer 814 Conductive layer 815 Insulating layer 816 Conductive layer 817 Insulating layer 817a Insulating layer 817b Insulating layer 820 Transistor 821 Insulating layer 822 Transistor 823 Encapsulation layer 824 Encapsulation layer 825 Connector 827 Spacer 830 Light emitting element 831 Lower electrode 833 EL layer 835 Upper electrode 841 Adhesive layer 843 Insulating layer 845 Coloring layer 847 Light shielding layer 849 Overcoat 857 Conductive layer 857a Conductive layer 857b Conductive layer

Claims

1. A display panel having a display unit; a support disposed on a rear side of a display surface of the display panel and overlapping with the display unit; A light receiving element, the support has an opening overlapping the display panel, the light receiving element is disposed on a rear side of the display surface of the display panel and at a position overlapping with the opening, the light receiving element has a function of detecting light transmitted through the opening from the display panel side, the display panel has a function of controlling a display in response to the light detected by the light receiving element, The electronic device, wherein the support has an antenna mounted thereon.

2. A display panel having a display unit; a support disposed on a rear side of a display surface of the display panel and overlapping with the display unit; A light receiving element, the support has an opening overlapping the display panel, the light receiving element is disposed on a rear side of the display surface of the display panel and at a position overlapping with the opening, the display panel has a function of controlling a display in response to light detected by the light receiving element, The light passes through the opening from the display panel side and enters the light receiving element, The electronic device, wherein the support has an antenna mounted thereon.

3. A display panel having a display unit; a support disposed on a rear side of a display surface of the display panel and overlapping with the display unit; A light receiving element, the support has an opening overlapping the display panel, the light receiving element is disposed on a rear side of the display surface of the display panel and at a position overlapping with the opening, In a cross-sectional view, the opening does not have a region that includes the light receiving element, the light receiving element has a function of detecting light transmitted through the opening from the display panel side, the display panel has a function of controlling a display in response to the light detected by the light receiving element, The electronic device, wherein the support has an antenna mounted thereon.

4. A display panel having a display unit; a support disposed on a rear side of a display surface of the display panel and overlapping with the display unit; A light receiving element, the support has an opening overlapping the display panel, the light receiving element is disposed on a rear side of the display surface of the display panel and at a position overlapping with the opening, In a cross-sectional view, the opening does not have a region that includes the light receiving element, the display panel has a function of controlling a display in response to light detected by the light receiving element, The light passes through the opening from the display panel side and enters the light receiving element, The electronic device, wherein the support has an antenna mounted thereon.

5. In any one of claims 1 to 4, The support has only one of the openings.

Images