Lead supply system and control method thereof

Abstract

A lead supply system according to an embodiment of the present invention may supply leads for connection to electrode tabs, the lead supply system including a placement unit on which the leads are placed, a vision sensor for photographing the leads from above the placement unit, an alignment mechanism for adjusting the placement unit to align the leads based on vision data photographed by the vision sensor, and a supply device for picking up the leads from the placement unit and supplying them to a position to be connected to the electrode tabs.

Description

Technical Field

[0001] This application claims the benefit of priority based on Korean Patent Application No. 10-2021-0117116, filed on September 2, 2021, and all the contents disclosed in the literature of the Korean Patent Application are incorporated herein by reference in their entirety.

[0002] The present invention relates to a lead supply system and a control method thereof, and more particularly, to a lead supply system for supplying a lead for connection to an electrode tab provided in a battery cell and a control method thereof.

Background Art

[0003] Generally, a secondary battery means a battery that can be charged and discharged, unlike a primary battery that cannot be charged, and is widely used in electronic devices such as mobile phones, notebook computers, camcorders, or electric vehicles. In particular, lithium secondary batteries have a larger capacity than nickel-cadmium batteries or nickel-metal hydride batteries and a high energy density per unit weight, so their utilization degree is rapidly increasing.

[0004] On the other hand, lithium secondary batteries may be classified according to the structure of the electrode assembly having a positive electrode / separator / negative electrode structure. Typically, a jelly-roll electrode assembly having a structure in which a long sheet-shaped positive electrode and a negative electrode are wound with a separator interposed therebetween, a stack-type electrode assembly in which a large number of positive electrodes and negative electrodes cut out in units of a predetermined size are sequentially stacked with a separator interposed therebetween, a bi-cell or a full-cell in which a positive electrode and a negative electrode of a predetermined unit are stacked with a separator interposed therebetween, and a stack / folding-type electrode assembly having a structure in which the bi-cell or the full-cell is wound, and the like can be mentioned.

[0005] Recently, pouch-type batteries with a structure in which a stack-type or stack / folding-type electrode assembly is built into a pouch-type battery case made of an aluminum laminate sheet have attracted much attention due to their low manufacturing cost, light weight, and easy form deformation, and their usage is gradually increasing.

[0006] Such lithium secondary batteries mainly use a lithium-based oxide and a carbon material as a positive electrode active material and a negative electrode active material, respectively. A lithium secondary battery includes an electrode assembly in which a plurality of electrodes coated with such electrode active materials are arranged with a separator interposed therebetween, and an exterior material that hermetically stores the electrode assembly together with an electrolytic solution.

[0007] FIG. 1 is a perspective view of a general electrode assembly.

[0008] The electrode assembly 10 is provided with a plurality of electrode tabs 20 extending from a plurality of electrodes, and such a plurality of electrode tabs 20 are each welded to a lead 30. Here, the plurality of electrode tabs 20 can include a plurality of positive electrode tabs extending from a plurality of positive electrodes and a plurality of negative electrode tabs extending from a plurality of negative electrodes. And the lead 30 connected to the plurality of positive electrode tabs can be a positive electrode lead, and the lead 30 connected to the plurality of negative electrode tabs can be a negative electrode lead. FIG. 1 shows an electrode assembly 10 in which the positive electrode tab and the negative electrode tab protrude in opposite directions. However, it goes without saying that the present invention is not limited thereto, and a configuration in which the positive electrode tab and the negative electrode tab protrude in the same direction is also possible.

[0009] The joining process of the electrode tab 20 and the lead 30 includes a supply step of supplying the lead 30 to a position connected to the electrode tab 20, and a welding step of welding the electrode tab 20 and the lead 30 at the position.

[0010] Regarding this, conventionally, when the dimensions or types of the leads 30 were changed, in order to supply the leads 30 to a fixed position in the supply step, an operator manually adjusted the settings of the equipment and the like. However, such adjustments were of poor accuracy and had the limitation that they had to be performed with the equipment stopped. Summary of the Invention Problems to be Solved by the Invention

[0011] One problem to be solved by the present invention is to provide a lead supply system and its control method that automatically and accurately aligns the leads to be connected to the electrode tabs. Means for Solving the Problems

[0012] A lead supply system according to an embodiment of the present invention can supply leads for connection to electrode tabs. The lead supply system includes a placement part on which the leads are placed, a vision sensor that photographs the leads from above the placement part, an alignment mechanism that adjusts the placement part based on vision data photographed by the vision sensor to align the leads, and a supply device that picks up the leads from the placement part and supplies them to a position where they are connected to the electrode tabs.

[0013] The lead supply system can further include a collection box in which the leads are collected by the supply device when it is determined based on the vision data that the leads are defective or non-conforming.

[0014] The alignment mechanism can include a rotation motor that is disposed below the placement part and rotates the placement part with respect to a vertical axis, and an orthogonal robot that horizontally moves the rotation motor with respect to a first direction and a second direction that are orthogonal to each other.

[0015] The alignment mechanism moves the placement part between a standby position located below the vision sensor and a supply position spaced apart from the standby position in a first direction, and the supply device can pick up the lead when the placement part is at the supply position.

[0016] The supply device can include a gripper for gripping the lead and an orthogonal robot for moving the gripper in a second direction orthogonal to the first direction and a vertical direction.

[0017] The lead supply system can further include a loading device for loading the lead onto the placement part when the placement part is at the standby position.

[0018] The loading device can include a suction part for sucking the lead from above, a lifting actuator for lifting and lowering the suction part, and a uniaxial actuator for horizontally moving the lifting actuator.

[0019] The lead supply system can further include at least one of epi-illumination for irradiating light onto the lead from above the placement part and back-illumination provided on the placement part or arranged below the placement part.

[0020] The lead supply system can further include condensing illumination for condensing light on a part of the area on the lead toward the placement part.

[0021] The control method of the lead supply system according to an embodiment of the present invention can include a loading step of loading the lead onto a placement part, a sensing step of photographing the lead on the placement part with a vision sensor, an alignment step of adjusting the placement part to align the lead based on vision data photographed by the vision sensor, and a supply step of picking up the lead from the placement part and moving it to a position where it is connected to the electrode tab.

[0022] The control method of the lead supply system may further include a recovery step of picking up and recovering the lead when it is determined that the lead is defective or non-conforming based on the vision data.

[0023] The control method of the lead supply system may be implemented between the alignment step and the supply step, and may further include a moving step of moving the placement part in a first direction.

[0024] The supply step may include a process of the gripper picking up the lead placed on the placement part and a process of the gripper horizontally moving in a second direction orthogonal to the first direction.

[0025] The sensing step may be implemented with light irradiated toward the lead.

Advantages of the Invention

[0026] According to a preferred embodiment of the present invention, based on the vision data obtained by photographing the lead with a vision sensor, the placement part can be adjusted to align the lead. Thereby, the lead can be supplied to a fixed position where it is connected to the electrode tab, and the quality of the electrode assembly can be improved.

[0027] Also, even if the specifications of the incoming leads change, etc., the leads can be automatically aligned without interrupting the equipment. Thereby, the productivity of the electrode assembly can be increased.

[0028] Also, when it is determined that the lead is defective or non-conforming based on the vision data obtained by photographing the lead with a vision sensor, the lead can be recovered without being supplied. Thereby, the quality of the electrode assembly can be further improved.

[0029] In addition, it can include effects that can be easily predicted by those skilled in the art from the configuration according to the preferred embodiment of the present invention.

Brief Description of the Drawings

[0030]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Embodiments for Carrying Out the Invention

[0031] Hereinafter, with reference to the accompanying drawings, preferred embodiments of the present invention will be described in detail so that those having ordinary knowledge in the technical field to which the present invention pertains can easily implement it. However, the present invention can be realized in various different forms and is not limited or restricted by the following embodiments.

[0032] To clearly explain the present invention, detailed descriptions of parts not related to the explanation or related known technologies that may obscure the gist of the present invention are omitted. When assigning reference numerals to the components of each drawing in this specification, the same or similar reference numerals are assigned to the same or similar components throughout the specification.

[0033] Also, the terms and words used in this specification and the claims should not be construed as being limited to their ordinary or dictionary meanings. The inventors should interpret them in accordance with the meaning and concept that conforms to the technical idea of the present invention in accordance with the principle that they can appropriately define the concept of the terms in order to explain their invention in the best way.

[0034] Figure 2 is a schematic diagram of a lead supply system according to an embodiment of the present invention.

[0035] Hereinafter, for convenience of explanation, the direction parallel to the x-axis in FIG. 2 is referred to as the first direction, and the direction parallel to the y-axis is referred to as the second direction. The z-axis is parallel to the vertical direction, and the first direction and the second direction can be horizontal directions perpendicular to each other.

[0036] A lead supply system 100 according to an embodiment of the present invention can include a placement unit 150 on which a lead 30 (see FIG. 6) is placed, a vision sensor 140 disposed above the placement unit 150, an alignment mechanism 151 that adjusts the placement unit 150 to align the lead 30, and a supply device 170 that picks up the lead 30 from the placement unit 150 and supplies it to a preset position.

[0037] Also, the lead supply system 100 can further include a loading device 120 that loads the lead 30 onto the placement unit 150 and a supply buffer 110 that supplies the lead 30 to the loading device 120.

[0038] Hereinafter, for convenience of explanation, each component of the lead supply system 100 will be described according to the transfer order of the lead 30.

[0039] The supply buffer 110 can sequentially supply the leads 30 manufactured in the previous process. Here, a part of the periphery of the lead 30 can be in a state where an insulating film for sealing with a pouch-type battery case (not shown) is attached hereinafter.

[0040] More specifically, the supply buffer 110 can include a table 111 on which the lead 30 is placed and a uniaxial actuator 112 that moves the table 111.

[0041] The table 111 is formed horizontally, and at least one lead 30 can be placed on the upper surface of the table 111.

[0042] The uniaxial actuator 112 can horizontally move the table 111 in the second direction. More specifically, the uniaxial actuator 112 can include a base 112a coupled to the lower side of the table 111 and a guide 112b extending in the second direction while guiding the movement of the base 112a. Therefore, the table 111 can move in the second direction together with the base 112a. The detailed configuration and operation of the uniaxial actuator 112 are well-known technologies, and a detailed description is omitted.

[0043] The table 111 can reciprocate between an initial position where the lead 30 is placed and a supply position spaced apart from the initial position in the second direction by the uniaxial actuator 112. And the supply position can be below a loading device 120 described later. FIG. 2 shows a state where the table 111 is in the supply position.

[0044] Therefore, when the table 111 is in the initial position, the lead 30 is placed on the table 111, and when the table 111 on which the lead 30 is placed is moved to the supply position by the uniaxial actuator 112, the loading device 120 can pick up the lead 30 placed on the table 111 and load it onto the placement portion 150.

[0045] The loading device 120 is supported by the support frame 130 and can be positioned above the supply buffer 110.

[0046] The loading device 120 can include a suction unit 121 that sucks the lead 30 from above, a lifting actuator 122 that raises and lowers the suction unit 121, and a uniaxial actuator 123 that moves the lifting actuator 122.

[0047] The suction unit 121 can vacuum-suck the lead 30 on the table 111 of the supply buffer 110. More specifically, the suction unit 121 can include a contact portion 121a that adheres to the upper surface of the lead 30, and a support plate 121b from which the contact portion 121a hangs and is supported. The contact portion 121a can communicate with a flexible tube connected to a pump (not shown) that generates negative pressure.

[0048] The lifting actuator 122 can raise and lower the suction unit 121 in the vertical direction. The lifting actuator 122 can be connected to the suction unit 121, more specifically, the support plate 121b.

[0049] The lifting actuator 122 can raise the suction unit 121 to pick up the lead 30 from the table 111, or lower the suction unit 121 to load the lead 30 onto the placement unit 150.

[0050] The uniaxial actuator 123 is connected to the lifting actuator 122 and can horizontally move the lifting actuator 122 in the first direction. More specifically, the uniaxial actuator 123 can include a connection body 123a connected to the lifting actuator 122, and a guide 123b that extends in the first direction while guiding the movement of the connection body 123a. The detailed configuration and operation of the uniaxial actuator 123 are well-known techniques and a detailed description is omitted.

[0051] Therefore, the suction unit 121 can horizontally move in the first direction together with the lifting actuator 122. The suction unit 121 can pick up the lead 30 from the table 111 of the supply buffer 110 and move in the first direction by the uniaxial actuator 123 to load the lead onto the placement unit 150.

[0052] The support frame 130 can include a frame body 131 that supports the uniaxial actuator 123 of the loading device 120, and columns 132 that support the horizontal frame 131. The frame body 131 can be formed long in a direction parallel to the uniaxial actuator 123 of the loading device 120, that is, in the first direction. A plurality of columns 132 can be provided to stably support the frame body 131.

[0053] The supply buffer 110 can be arranged to pass under the frame body 131. Then, the suction unit 121 and the lifting actuator 122 of the loading device 120 can be located on one side in the width direction of the frame body 131.

[0054] On the other hand, the lead 30 transferred by the loading device 120 can be placed on the placement unit 150. The placement unit 150 can be arranged horizontally.

[0055] The alignment mechanism 151 can adjust the placement unit 150 to align the lead 30. The alignment mechanism 151 can move the placement unit 150 horizontally and rotate it with respect to the vertical axis.

[0056] More specifically, the alignment mechanism 151 can include a rotation motor 152 that rotates the placement unit 150 with respect to the vertical axis, and an orthogonal robot 153 that horizontally moves the rotation motor 151 in the first direction and the second direction.

[0057] The rotation motor 152 is located below the placement part 150 and can be connected to the placement part 150. The rotation motor 152 can precisely adjust the angle of the placement part 150. As an example, the rotation motor 152 can be a servo motor.

[0058] The orthogonal robot 153 includes a mounting part 153a on which the rotation motor 152 is mounted, a first guide 153b that is formed long in either the first direction or the second direction while guiding the movement of the mounting part 153a, and a second guide 153c that is formed long in the other one of the first direction and the second direction while guiding the movement of the first guide 153b. Therefore, the placement part 150 can move in the first direction and the second direction together with the rotation motor 152.

[0059] The placement part 150 can move between a standby position (see FIG. 6) located below the vision sensor 140 and a supply position (see FIG. 7) spaced apart from the standby position in the first direction by the alignment mechanism 151. That is, the alignment mechanism 151, more specifically, the orthogonal robot 153, can reciprocate the placement part 150 between the standby position and the supply position. FIG. 2 shows the state of the placement part 150 in the standby position.

[0060] More specifically, when the placement part 150 is in the standby position, the vision sensor 140 captures an image of the lead 30 on the placement part 150, and the alignment mechanism 151 can adjust the placement part 150 based on the vision data captured by the vision sensor 140 to align the lead 30.

[0061] When the alignment of the lead 30 is completed, the alignment mechanism 151 can move the placement unit 150 by a preset distance in the first direction, and the placement unit 150 can reach the supply position. That is, the supply position is not a fixed position and can be variably adjusted little by little according to the alignment of the lead 30. Further, when the placement unit 150 moves to the supply position, the supply device 170 can pick up the lead 30 on the placement unit 150 and supply it to a position where it is connected to the electrode tab 20 of the electrode assembly 10 (see FIG. 9).

[0062] The vision sensor 140 can photograph the lead 30 from above the placement unit 150. The vision sensor 140 can be located above the placement unit 150 at the standby position. For example, the vision sensor 140 can include a camera.

[0063] The vision sensor 140 can be supported by the frame body 131 of the support frame 130 described above. More specifically, the connecting portion 142 connected to the vision sensor 140 can be fastened to the frame body 131.

[0064] The supply device 170 can be arranged at a distance from the loading device 120 in the first direction. That is, the supply device 170 can be located on the opposite side of the loading device 120 with the placement unit 150 interposed therebetween.

[0065] The supply device 170 can include a gripper 171 for gripping the lead 30 and an orthogonal robot 172 for moving the gripper 171.

[0066] The gripper 171 can grip the lead 30 placed on the placement unit 150. More specifically, the gripper 171 can grip the lead 30 on the placement unit 150 when the placement unit 150 is at the above-described supply position (see FIG. 7).

[0067] For example, the gripper 171 can include a pair of gripping portions spaced apart vertically and an actuator for varying the distance between the pair of gripping portions. In this case, the lead 30 can be gripped between the pair of gripping portions.

[0068] The orthogonal robot 172 can include a first guide 172a formed long in the second direction while guiding the movement of the gripper 171, and a second guide 172b formed long in the vertical direction while guiding the movement of the first guide 172a. The orthogonal robot 172 can further include a third guide 172c formed long in the second direction while guiding the movement of the second guide 172b. Therefore, the orthogonal robot 172 can move the gripper 171 in the second direction and the vertical direction.

[0069] The orthogonal robot 172 can move the gripper 171 in the second direction so that the lead 30 on the placement portion 150 is sandwiched between the pair of gripping portions of the gripper 171. In this regard, a groove for preventing interference with the gripper 171 can be formed in the placement portion 150.

[0070] The orthogonal robot 172 can lift the gripper 171 holding the lead 30 to pick up the lead 30 from the placement portion 150. Further, the orthogonal robot 172 can move and lower the gripper 171 in the second direction with the gripper 171 picking up the lead 30 to supply the lead 30 to a position where it is connected to the electrode tab 20 (see FIG. 9).

[0071] On the other hand, the lead supply system 100 can further include a collection box 160 for collecting defective or non-conforming leads 30.

[0072] More specifically, when the placement unit 150 is in the standby position and the vision sensor 140 detects a defect or non - conformity of the lead 30, when the placement unit 150 is in the supply position, the supply device 170 can pick up the lead 30 and drop it into the collection box 160. Therefore, it is possible to prevent the defective or non - conforming lead 30 from being supplied to the position where it is connected to the electrode tab 20 (see FIG. 9).

[0073] The collection box 160 can have an open top surface. The collection box 160 can be located on the side of the supply device 170. More specifically, the collection box 160 can be located below a point on the movement path of the gripper 171. Therefore, when the gripper 171 releases the lead 30 from above the collection box 160, the lead 30 can fall into the collection box 160.

[0074] The collection box 160 can be supported by the support frame 161 at a height slightly lower than that of the placement unit 150 because it is similar to the placement unit 150. Therefore, the lead 30 released from the gripper 171 can stably enter the collection box 160.

[0075] FIG. 3 is a control block diagram of a lead supply system according to an embodiment of the present invention.

[0076] A lead supply system 100 according to an embodiment of the present invention can further include a controller 190. The controller 190 can include at least one processor.

[0077] The controller 190 can control the overall operation of the lead supply system 100.

[0078] The controller 190 can control the supply buffer 110, the loading device 120, and the supply device 170.

[0079] In addition, the controller 190 can communicate with the vision sensor 140 to receive the transmission of vision data captured by the vision sensor 140, and can control the alignment mechanism 151 based on the vision data to align the lead 30. More specifically, the controller 190 can analyze the vision data to extract the outline of the lead 130, generate a control command for adjusting the outline to a fixed position, and transmit it to the alignment mechanism 151.

[0080] In addition, the controller 190 can determine the defect and / or non-conformity of the lead 30 based on the vision data captured by the vision sensor 140.

[0081] As an example, when a predetermined specification of the lead 30 is insufficient or a breakage or the like is detected, the lead 30 can receive a defect determination.

[0082] As another example, when the material of the lead 30 does not match the polarity of the electrode tab 20 (see FIG. 9), the lead 30 can receive a non-conformity determination. More specifically, the controller 190 can analyze the vision data to determine the material of the lead 30 from the hue characteristics (e.g., chroma) of the lead 130, and can determine whether the material of the lead 30 matches the polarity information of the electrode tab 20. In this regard, the negative electrode tab 20 can match a lead 30 having a nickel or copper material, and the positive electrode tab 20 can match a lead 30 including an aluminum material.

[0083] When the lead 30 receives a defect or non-conformity determination, the controller 190 can control the supply device 170 to collect the lead 30 in the collection box 160. Conversely, when the lead 30 receives a normal determination, the controller 190 can control the supply device 170 to supply the lead 30 to a position where it is connected to the electrode tab 20.

[0084] FIG. 4 is a flowchart of a control method for a lead supply system according to an embodiment of the present invention, and FIGS. 5 to 9 are diagrams for explaining the operation of the lead supply system according to an embodiment of the present invention.

[0085] The control method (hereinafter, "control method") for a lead supply system according to an embodiment of the present invention may include a loading step (S10), a sensing step (S20), an alignment step (S40), and a supply step (S60). The control method may further include a moving step (S50 or S70) and a recovery step (S80).

[0086] Regarding this, FIG. 5 is a diagram for explaining the loading step (S10), FIG. 6 is a diagram for explaining the sensing step (S20) and the alignment step (S40), FIG. 7 is a diagram for explaining the moving step (S50 or S80), FIG. 8 is a diagram for explaining the process in which the lead 30 is picked up in the supply step (S60), and FIG. 9 is a diagram for explaining the process in which the lead 30 is moved to a position where it is connected to the electrode tab 20 in the supply step (S60).

[0087] Hereinafter, each step will be described in more detail.

[0088] The loading step (S10) can be a step of loading the lead 30 onto the placement portion (50).

[0089] Referring to FIGS. 2 and 5, the suction portion 121 of the loading device 120 can rise in a state of sucking the lead 30 on the table 111 of the supply buffer 110, move and descend in the first direction, and load the lead 30 onto the placement portion 150.

[0090] Here, the placement portion 150 can be a standby position located below the vision sensor 140. That is, the suction portion 121 can move between the placement portion 150 and the vision sensor 140 and load the lead 30 onto the placement portion 150.

[0091] The sensing step (S20) can be a step of photographing the lead 30 on the placement unit 150 with the vision sensor 140.

[0092] Referring to FIGS. 2 and 6, the suction unit 121 of the loading device 120 can return in the first direction in order to pick up the lead 30 on the supply buffer 110. Accordingly, the suction unit 121 is no longer located between the placement unit 150 and the vision sensor 140, and the vision sensor 140 can easily photograph the lead 30 on the placement unit 150.

[0093] Also, as described above, the controller 190 can determine defects and / or non-conformities of the lead 30 based on the vision data photographed by the vision sensor 140 (S30). In this regard, when the lead 30 passes the normal determination, the alignment step (S40) can be performed, and when the lead 30 is determined to be defective or non-conforming, the recovery step (S80) described later can be performed.

[0094] The alignment step (S40) can be a step of adjusting the placement unit 150 based on the vision data photographed by the vision sensor 140 to align the lead 30.

[0095] The controller 190 (see FIG. 3) can analyze the vision data photographed in the sensing step (S20) earlier to generate a control command for aligning the lead 30 to a fixed position, and transmit the control command to the alignment mechanism 151. The alignment mechanism 151 can move the placement unit 150 in the horizontal direction and rotate it at a predetermined angle with respect to the vertical axis according to the control command. More specifically, the placement unit 150 can be rotated at a predetermined angle by the rotation motor 152 and moved in the first direction and the second direction by the orthogonal robot 153.

[0096] The moving step (S50 or S70) can be a step of moving the placement unit 150 from the standby position to the supply position. More specifically, referring to FIGS. 2 and 7, the placement unit 150 can be moved in the first direction by the alignment mechanism 151, more specifically, the orthogonal robot 153.

[0097] The moving step (S50 or S70) can be performed between the alignment step (S40) and the supply step (S60) (S50), or can be performed before the recovery step (S80) (S70). That is, the supply step (S60) and the recovery step (S80) can be performed with the placement unit 150 in the supply position state.

[0098] The supply step (S60) can be a step of picking up the lead 30 from the placement unit 150 and moving it to a position where it is connected to the electrode tab 20.

[0099] Referring to FIGS. 2, 8, and 9, the supply step (S60) can include a process in which the gripper 171 of the supply device 170 picks up the lead 30 placed on the placement unit 150, and a process in which the gripper 171 moves horizontally in the second direction.

[0100] The gripper 171 of the supply device 170 can hold the lead 30 on the placement unit 150, rise, move and descend in the second direction, and transfer the lead 30 to a position where it is connected to the electrode tab 20.

[0101] Regarding this, the electrode assembly 10 provided with the electrode tabs 20 can be sequentially supplied to preset bonding positions by the transfer system 200. More specifically, the transfer system 200 can include a table 230 on which the electrode assembly 10 is placed and moves horizontally (for example, in the first direction), a bonding unit 210 that bonds the electrode tabs 20 and the leads 30, and a support unit 220 that supports the electrode tabs 20 and the leads 30 from below.

[0102] When the table 230 is in the joining position, the electrode tab 20 can be located above the support portion 220, and the gripper 171 can supply the lead 30 in contact with or adjacent to the electrode tab 20. In such a state, the joining unit 210 descends, and the electrode tab 20 and the lead 30 can be crimped between the joining unit 210 and the support portion 220 and joined to each other.

[0103] For example, the joining unit 210 can include a mask jig and a laser unit, and the electrode tab 20 and the lead 30 can be laser welded. The configuration for performing laser welding and its operation are well-known techniques, and a detailed description is omitted.

[0104] When the joining of the electrode tab 20 and the lead 30 is completed, the gripper 171 can release the lead 30 and return in the second direction.

[0105] After the alignment step (S40) is performed, the placement portion 150 on which the lead 30 is placed in the moving step (S50) moves in the first direction by a preset distance, and the gripper 171 that grips the lead 30 in the supply step (S60) moves in the second direction by a preset distance. Therefore, the aligned lead 30 can be supplied to a fixed position where it is connected to the electrode tab 20.

[0106] Thereby, the manufacturing quality of the electrode assembly 10 can be improved. In addition, even if the specifications of the leads 30 stored in the supply buffer 110 change, there is an advantage that alignment can be automatically performed without interrupting the equipment.

[0107] On the other hand, when the lead 30 is determined to be defective or non-conforming in the sensing step (S20), the recovery step (S80) can be performed. That is, the recovery step (S80) can be a step of picking up and recovering the lead 30 based on the vision data captured by the vision sensor 40 when the lead 30 is determined to be defective or non-conforming.

[0108] More specifically, instead of picking up the lead 30 on the placement unit 150, which is the supply position, and supplying it to the position where it is connected to the electrode tab 20, the gripper 171 can collect it in the collection box 160. Thereby, it is possible to prevent defective or non-conforming leads 30 from being provided in the electrode assembly 10, and the quality of the electrode assembly 10 can be further improved.

[0109] Also, even if the lead 30 is determined to be defective or non-conforming, it is also possible to perform the recovery step (S80) after unconditionally performing the alignment step (S40).

[0110] FIG. 10 is a diagram for explaining a lead supply system according to another embodiment of the present invention.

[0111] In the case of the lead supply system according to the present embodiment, it is the same as the above-described one embodiment except that it further includes a plurality of illuminations 181, 182, 183. Hereinafter, overlapping contents are omitted, and the differences will be mainly described.

[0112] Referring to both FIG. 2 and FIG. 10, the lead supply system according to the present embodiment can further include at least one of an epi-illumination 181 that emits light onto the upper surface of the lead 30 on the placement unit 150 and a back-illumination 182 that emits light onto the bottom surface of the lead 30 on the placement unit 150. The lead supply system can further include a condenser illumination 183.

[0113] The epi-illumination 181, the back-illumination 182, and the condenser illumination 183 can emit light toward the lead 30 when the vision sensor 140 captures an image of the lead 30 on the placement unit 150. That is, the above-described sensing step (S20) (see FIG. 4) can be performed in a state where light is irradiated toward the lead 30.

[0114] The epi-illumination 181 can be coaxial illumination. The epi-illumination 181 can be located above the placement unit 150, particularly the placement unit 150 in the standby position. That is, the epi-illumination 181 can be provided in the vision sensor 140 or arranged adjacent to the vision sensor 140. The epi-illumination 181 can be connected to the connection part 142 together with the vision sensor 140 and supported by the frame body 131.

[0115] The back-illumination 182 can be located below the placement unit 150, particularly the placement unit 150 in the standby position. Or the back-illumination 182 can be provided in the placement unit 150.

[0116] The epi-illumination 181 can prevent a shadow from being generated on the lead 30 by peripheral equipment or the like and prevent excessive light reflection from occurring on the lead 30. Also, the back-illumination 182 can make the outline of the lead 30 clearer.

[0117] Therefore, with the epi-illumination 181 and the back-illumination 182, the exact outline of the lead 30 can be detected from the vision data captured by the vision sensor 140, and the lead 30 can be aligned more precisely.

[0118] The condensing illumination 183 can condense light on a partial area on the lead 30 toward the placement unit 150. That is, the condensing illumination 183 can concentrate light in a narrower range than the epi-illumination 181 on the upper surface of the lead 30. In order not to interfere with the outline detection of the lead 30, the area where the light of the condensing illumination 183 is concentrated can be located inside the outline of the lead 30.

[0119] The condensing illumination 183 can be arranged adjacent to the vision sensor 140. The condensing illumination 183 can be connected to the connection part 142 together with the vision sensor 140 and supported by the frame body 131. The condensing illumination 183 can be arranged obliquely.

[0120] By means of the light-collecting illumination 183, it is possible to accurately determine the hue characteristics (e.g., saturation) of the lead 30 from the vision data captured by the vision sensor 140 and thereby the material. Therefore, it is possible to more accurately determine whether the material of the lead 30 matches the polarity information of the electrode tab 20.

[0121] The above description merely exemplarily explains the technical idea of the present invention. Those with ordinary knowledge in the technical field to which the present invention pertains can make various modifications and variations without departing from the essential characteristics of the present invention.

[0122] Therefore, the embodiments disclosed in the present invention are not for limiting the technical idea of the present invention, but for explanatory purposes, and the scope of the technical idea of the present invention is not limited by such embodiments.

[0123] The protection scope of the present invention shall be interpreted according to the following claims, and all technical ideas within the equivalent scope should be construed as being included in the scope of rights of the present invention.

Explanation of Reference Numerals

[0124] 10 Electrode assembly 20 Electrode tab 30 Lead 100 Lead supply system 110 Supply buffer 120 Loading device 130 Support frame 140 Vision sensor 150 Mounting part 151 Alignment mechanism 152 Rotation motor 153 Orthogonal robot 160 Collection box 170 Feeding device 171 Gripper 172 Orthogonal robot 181 Episcopic illumination 182 Back illumination 183 Light collection and illumination 190 Controller

Claims

1. A lead supply system for supplying a lead for connection to an electrode tab, a placement portion on which the lead is placed, a vision sensor that photographs the lead from above the placement portion, an alignment mechanism that adjusts the placement portion to align the lead based on vision data photographed by the vision sensor, and a supply device that picks up the lead from the placement portion and supplies it to a position where it is connected to the electrode tab.

2. The lead supply system according to claim 1, further comprising a collection box in which the lead is collected by the supply device when it is determined that the lead is defective or non-conforming based on the vision data.

3. The alignment mechanism includes a rotation motor disposed below the placement portion and rotating the placement portion with respect to a vertical axis, and an orthogonal robot that horizontally moves the rotation motor in a first direction and a second direction orthogonal to each other.

4. The alignment mechanism moves the placement portion between a standby position located below the vision sensor and a supply position spaced apart from the standby position in a first direction, and the supply device picks up the lead when the placement portion is at the supply position.

5. The supply device includes a gripper that grips the lead, and an orthogonal robot that moves the gripper in a second direction orthogonal to the first direction and a vertical direction.

6. The lead supply system according to claim 4, further comprising a loading device for loading the lead onto the placement part when the placement part is in the standby position.

7. The loading device includes a suction part for sucking the lead from above, a lifting actuator for lifting and lowering the suction part, and a uniaxial actuator for horizontally moving the lifting actuator, the lead supply system according to claim 6.

8. episcopic illumination for irradiating light onto the lead from above the placement part, The lead supply system according to claim 1, further comprising at least one of backlighting provided in the placement part or arranged below the placement part.

9. The lead supply system according to claim 8, further comprising condensing illumination for condensing light onto a partial area on the lead toward the placement part.

10. A control method for a lead supply system for supplying a lead for connection to an electrode tab, comprising: a loading step of loading the lead onto a placement part; a sensing step of photographing the lead on the placement part with a vision sensor; an alignment step of adjusting the placement part to align the lead based on vision data photographed by the vision sensor; and a supply step of picking up the lead from the placement part and moving it to a position where it is connected to the electrode tab, the control method for a lead supply system.

11. The control method for a lead supply system according to claim 10, further comprising a recovery step of picking up and recovering the lead when it is determined that the lead is defective or non-conforming based on the vision data.

12. The control method of the lead supply system according to claim 10, further including a moving step that is performed between the alignment step and the supply step and moves the placement part in the first direction.

13. The supply step includes a process in which the gripper picks up the lead placed on the placement part, and a process in which the gripper horizontally moves in a second direction orthogonal to the first direction, the control method of the lead supply system according to claim 12.

14. The sensing step is performed in a state where light is irradiated toward the lead, the control method of the lead supply system according to claim 10.

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