Image processing apparatus
By tapering the battery's cross-sectional area to increase the gap with heat-generating components in an image processing apparatus, the heat dissipation is improved, addressing the challenge of temperature rises and ensuring stable, continuous operation.
Patent Information
- Application Number
- JP2020197292
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2020-11-27
- Publication Date
- 2025-06-18
- Estimated Expiration
- 2040-11-27
AI Technical Summary
In image processing apparatuses equipped with a battery for portable operation, the arrangement of components in a small housing can lead to decreased heat dissipation performance, causing temperature rises during continuous operation, which necessitates cooling times and leaves room for technical improvement.
The image processing apparatus is designed with a battery that tapers in cross-sectional area as it approaches the substrates housing the light receiving element, light emitting element, and power supply circuit, allowing for improved heat dissipation by increasing the gap between the battery and these heat-generating components.
This configuration enhances heat dissipation performance, reducing the risk of malfunctions due to heat buildup and allowing the apparatus to operate continuously with improved stability and accuracy.
Smart Images

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Abstract
Description
Technical Field
[0001] The present invention relates to an image processing apparatus.
Background Art
[0002] In recent years, image processing apparatuses that are equipped with a battery and can be carried around and operated independently have become widespread. For example, Patent Document 1 discloses a calibration data setting unit that sets, as calibration data, color chart image data at a temperature closer to the temperature at the time of photographing a subject, from among the temperatures from the temperature of the imaging apparatus at the time of photographing a color chart before photographing the subject to the temperature of the imaging apparatus at the time of photographing a color chart after photographing the subject, based on the temperature of the imaging apparatus at the time of photographing the subject, the temperature of the imaging apparatus at the time of photographing a color chart before and after photographing the subject, and color chart image data obtained by photographing the color chart before and after photographing the subject; and an image correction unit that corrects the image data of the subject obtained by photographing the subject, using the calibration data set by the calibration data setting unit. According to the image processing apparatus described in Patent Document 1, even when shooting conditions or the like change during shooting, the image data of the subject can be accurately corrected.
Prior Art Documents
Patent Documents
[0003]
Patent Document 1
Summary of the Invention
Problems to be Solved by the Invention
[0004] However, in an image processing apparatus that is equipped with a battery and can be carried around and operated independently, due to the arrangement of various components in a small housing, depending on the shape and arrangement of the battery, the heat dissipation performance may decrease, and when a temperature rise due to continuous operation occurs, a cooling time must be set, and there is still room for technical improvement.
Means for Solving the Problem
[0005] One aspect of the image processing apparatus according to the present invention is a light receiving element, a light emitting element, a battery, a power supply circuit electrically connected to the battery, a first substrate provided with the light receiving element, a second substrate provided with the light emitting element, a third substrate provided with the power supply circuit, a housing for storing the first substrate, the second substrate, and the third substrate, and has The portions of the battery facing the first substrate, the second substrate, and the third substrate have a smaller cross-sectional area as they are closer to the first substrate, the second substrate, and the third substrate.
Brief Description of the Drawings
[0006]
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Embodiments for Carrying Out the Invention
[0007] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. The drawings used are for convenience of explanation. Note that the embodiments described below do not unduly limit the content of the present invention described in the claims. Also, not all of the configurations described below are essential constituent elements of the present invention.
[0008] Hereinafter, in this embodiment, as an example of the image processing apparatus according to the present invention, a color measuring apparatus will be described as an example.
[0009] 1. Outline of the Image Processing Apparatus FIG. 1 is a perspective view of the image processing apparatus 1 of the present embodiment. As shown in FIG. 1, the image processing apparatus 1 of the present embodiment performs color measurement processing for measuring the color of the image IMG as image processing. Specifically, when the user moves the image processing apparatus 1 onto the image IMG formed on the medium M and presses the operation unit 32 disposed on the upper surface of the image processing apparatus 1, the image processing apparatus 1 emits light from a part of the bottom surface facing the image IMG, and measures the color of the image IMG based on the wavelength of the light reflected by the image IMG. That is, the operation unit 32 functions as a measurement start button. For example, the medium M is paper, cloth, or the like, and the image IMG is a single-color image. As shown in FIG. 1, a color chart including a plurality of images of different colors is formed on the medium M, and the image processing apparatus 1 may measure the color of each image by the user moving the image processing apparatus 1 onto each image and pressing the operation unit 32. Further, the image processing apparatus 1 can also measure the color of the medium M.
[0010] The image processing apparatus 1 may calculate a color difference, which is the difference between the color measurement value and the target color value. The image processing apparatus 1 displays the calculated color measurement value and color difference on the display module 50 that can be visually recognized by the user from the outside of the housing 100. In the example of FIG. 1, the display module 50 is provided at a position where it can be visually recognized by the user from the surface on which the operation unit 32 of the image processing apparatus 1 is disposed. FIG. 2 is a diagram showing an example of the color measurement value and color difference displayed on the display module 50. In the example of FIG. 2, the color measurement values L, a, b and the color difference ΔE displayed on the display module 50 are values in the L*a*b* color space. Note that the color measurement value and color difference may be values in various color spaces other than the L*a*b* color space, such as the RGB color space, the YCC color space, the CMYK color space, and the L*C*h color space.
[0011] As shown in FIGS. 1 and 2, the image processing apparatus 1 may have a light emitting module 33 that can be visually recognized by the user from outside the housing 100. In the examples of FIGS. 1 and 2, the light emitting module 33 is arranged so as to surround the operation unit 32. For example, the light emitting module 33 has a tubular light guide and an LED attached to the tip of the light guide, and the light emitted by the LED is guided to the light guide. LED is the abbreviation of Light Emitting Diode. In the examples of FIGS. 1 and 2, the user can visually recognize the light guide of the light emitting module 33. The light emitting module 33 is a module for status display, and its light emitting state varies according to the operation of the user on the operation unit 32. For example, when the image processing apparatus 1 recognizes that the operation unit 32 has been pressed by the user, the light emitting module 33 may be caused to emit light.
[0012] Since the image processing apparatus 1 has a shape close to a rectangular parallelepiped that can be held and operated by the user with one hand, it can be carried around. Further, since the image processing apparatus 1 incorporates a battery 70 described later and operates when the user presses the operation unit 32, it can operate independently without receiving instructions from other devices. Therefore, the image processing apparatus 1 is highly convenient for the user.
[0013] As shown in FIGS. 1 and 2, the directions along the three intersecting sides of the housing 100 of the image processing apparatus 1 are defined as the X-axis, Y-axis, and Z-axis. Hereinafter, except for FIG. 3, the relationship between the orientation of the image processing apparatus 1 and the X-axis, Y-axis, and Z-axis is assumed to be the same as that in FIGS. 1 and 2.
[0014] 2. Functional Configuration of Image Processing Apparatus FIG. 3 is a block diagram showing the functional configuration of the image processing apparatus 1. As shown in FIG. 3, the image processing apparatus 1 includes a plurality of light emitting elements 10 and a light emitting element driving circuit 11. Further, the image processing apparatus 1 includes a wavelength variable filter 20, a light receiving element 21, a photoelectric conversion circuit 22, an amplifier circuit 23, a C / V conversion circuit 24, an amplifier circuit 25, and a boost conversion circuit 26. Further, the image processing apparatus 1 includes a first processor 30, a wireless communication module 31, an operation unit 32, a light emitting module 33, a buzzer 34, and a display module 50. Further, the image processing apparatus 1 includes a second processor 40, a power supply circuit 41, a switch circuit 42, a charging circuit 43, a connector 60, and a battery 70.
[0015] The plurality of light emitting elements 10 are respectively arranged on the bottom surface portion of the image processing apparatus 1 and turn on or off based on a drive signal output from the light emitting element driving circuit 11. When each light emitting element 10 turns on, light is emitted from the bottom surface of the image processing apparatus 1. Each light emitting element 10 is, for example, an LED. For example, among the plurality of light emitting elements 10, some light emitting elements may emit white light, and some other light emitting elements may emit ultraviolet light.
[0016] The light emitting element driving circuit 11 outputs a plurality of drive signals for driving the plurality of light emitting elements 10 respectively based on a control signal from the first processor 30.
[0017] The wavelength variable filter 20 transmits light having a wavelength within a predetermined range among the light incident from the bottom surface of the image processing apparatus 1. The wavelength variable filter 20 includes an electrostatic actuator (not shown), and a voltage output from the amplifier circuit 25 is applied to the electrostatic actuator. The capacitance value of the electrostatic actuator changes according to the applied voltage, and the wavelength of the light transmitted by the wavelength variable filter 20 changes according to the capacitance value of the electrostatic actuator. Therefore, the wavelength of the light transmitted by the wavelength variable filter 20 changes according to the voltage output from the amplifier circuit 25. For example, the wavelength variable filter 20 may be an etalon element.
[0018] The amplification circuit 25 outputs a voltage of several tens of volts for driving the wavelength-variable filter 20. The output voltage of the amplification circuit 25 changes based on the control signal from the first processor 30.
[0019] The boost conversion circuit 26 boosts the voltage V1 of several volts output from the power supply circuit 41 to a voltage V4 of several tens of volts and outputs it to the amplification circuit 25. The voltage V4 boosted by the boost conversion circuit 26 becomes the power supply voltage of the amplification circuit 25. The boost conversion circuit 26 may be, for example, a step-up DCDC converter.
[0020] The C / V conversion circuit 24 converts the charge accumulated in the electrostatic actuator into a voltage and outputs it to the first processor 30. The first processor 30 controls the output voltage of the amplification circuit 25 so that the wavelength-variable filter 20 transmits light of a desired wavelength based on the digital value obtained by A / D converting the output voltage of the C / V conversion circuit 24. That is, the wavelength of the light transmitted by the wavelength-variable filter 20 is controlled by the first processor 30.
[0021] The light receiving element 21 receives the light transmitted through the wavelength-variable filter 20 and outputs a charge of a magnitude corresponding to the amount of light. For example, the light receiving element 21 may be a photodiode.
[0022] The photoelectric conversion circuit 22 converts the amount of light received by the light receiving element 21 into an electrical signal and outputs it to the amplification circuit 23. For example, the photoelectric conversion circuit 22 may be a C / V conversion circuit that converts the charge output from the light receiving element 21 into a voltage.
[0023] The amplification circuit 23 amplifies the voltage output from the photoelectric conversion circuit 22 and outputs it to the first processor 30.
[0024] The first processor 30 is a processor that performs image processing. By A / D converting the output voltage of the photoelectric conversion circuit 22, it generates a digital value indicating the amount of light received by the light receiving element 21 and stores the amount of light in association with the wavelength of the light. The first processor 30 may be, for example, an MCU or an MPU. MCU is the abbreviation of Micro Control Unit, and MPU is the abbreviation of Micro-processing unit. The first processor 30 sweeps the wavelength of the light transmitted by the wavelength variable filter 20 and stores the amount of light received by the light receiving element 21 in association with each wavelength. Then, the first processor 30 calculates a colorimetric value based on the amount of light associated with each wavelength. When the target color value is known in advance, the first processor 30 calculates a color difference, which is the difference between the colorimetric value and the target color value.
[0025] The wireless communication module 31 has a wireless communication circuit and an antenna (not shown). The wireless communication circuit acquires the wireless signal received from an external device via the antenna, demodulates the data, and transmits it to the first processor 30. Also, the wireless communication circuit acquires data from the first processor 30, modulates a high-frequency signal, and transmits a wireless signal to an external device via the antenna. For example, the wireless communication module 31 may acquire the colorimetric value or color difference calculated by the first processor 30 and transmit it to an external device. The wireless communication circuit may have a temperature sensor (not shown) and may have a function of temperature compensating the colorimetric value based on the signal output from the temperature sensor. The wireless communication module 31 may be, for example, a module that transmits and receives wireless signals corresponding to wireless communication standards such as Bluetooth (registered trademark) and Wi-Fi.
[0026] The operation unit 32 outputs an operation signal based on the user's operation to the first processor 30. In this embodiment, the operation unit 32 functions as a measurement start button, and when the user presses the operation unit 32, it outputs an operation signal indicating that it has been pressed to the first processor 30. The first processor 30 starts the processing for colorimetry based on the operation signal from the operation unit 32.
[0027] The light-emitting module 33 is a module for status display and emits light based on a control signal from the first processor 30. For example, when the first processor 30 detects that the user has pressed the operation unit 32, it outputs a control signal for causing the light-emitting module 33 to emit light.
[0028] The buzzer 34 notifies the user of various information by generating a predetermined sound based on a control signal from the first processor 30. For example, when the user presses the operation unit 32 to start measurement and there is a large deviation or shake in the optical axis of the light-receiving element 21, there is a possibility that normal color measurement cannot be performed. Therefore, when an operation failure occurs with respect to the user's operation unit 32, the first processor 30 outputs a predetermined control signal to the buzzer 34, and the buzzer 34 emits a sound.
[0029] The display module 50 displays various information based on a display signal output from the first processor 30. In the present embodiment, the light-emitting module 33 includes a display panel shown in FIG. 2 and a display driver (not shown). The display panel may be, for example, a liquid crystal panel. The display driver generates a drive signal corresponding to the display signal output from the first processor 30 and outputs it to the display panel. For example, as shown in FIG. 2, color measurement values, color differences, etc. are displayed on the display panel.
[0030] The battery 70 is, for example, a secondary battery such as a lithium-ion battery or a lithium polymer battery. When the user presses a power button (not shown), a voltage VB corresponding to the remaining charge amount is output from the battery 70.
[0031] The power supply circuit 41 generates and outputs voltages V1 and V2 based on the output voltage VB of the battery 70. The power supply circuit 41 includes a boost DCDC converter and a buck DCDC converter (not shown). The boost DCDC converter may boost the output voltage VB of the battery 70 to generate voltage V1, and the buck DCDC converter may step down voltage V1 to generate voltage V2. Voltage V1 is supplied to the boost conversion circuit 26, and voltage V2 is supplied as the power supply voltage to the second processor 40. Also, voltage V2 is input to the switch circuit 42.
[0032] The switch circuit 42 becomes conductive or non-conductive according to the control signal from the second processor 40. When the switch circuit 42 is in the conductive state, it outputs a voltage V3 that is approximately equal to voltage V2. Voltage V3 is supplied as the power supply voltage to each circuit surrounded by the dashed line in FIG. 3. Also, when the switch circuit 42 is in the non-conductive state, voltage V3 is not supplied to each circuit. That is, the second processor 40 is a processor for power supply control.
[0033] The connector 60 is a connector to which a cable is connected and may be, for example, a USB connector. USB is the abbreviation of Universal Serial Bus. For example, the connector 60 is electrically connected to an external device such as a personal computer via a USB cable. The second processor 40 can perform data communication with the external device via the connector 60.
[0034] The charging circuit 43 charges the battery 70 with the power supply voltage VC supplied when the connector 60 is electrically connected to the external device.
[0035] Also, the second processor 40 performs data communication with the first processor 30. The second processor 40 may be activated by the supply of the voltage V2 from the power supply circuit 41 and notify the first processor 30 of its activation. Further, the first processor 30 may notify the second processor 40 that it has shifted to the sleep mode after finishing the color measurement process, and the second processor 40 may receive the notification and turn off the switch circuit 42 to stop the supply of the voltage V3 to the first processor 30.
[0036] 3. Structure of the Image Processing Apparatus Next, with reference to FIGS. 4 to 15, the internal structure of the image processing apparatus 1 will be described in detail. FIG. 4 is a view of the inside of the housing 100 of the image processing apparatus 1 as seen from the positive direction of the X axis. Further, FIG. 5 is a view of the inside of the housing 100 of the image processing apparatus 1 as seen from the positive direction of the Y axis. Further, FIG. 6 is a view of the inside of the housing 100 of the image processing apparatus 1 as seen from the positive direction of the Z axis.
[0037] As shown in FIGS. 4 and 5, the image processing apparatus 1 has a rectangular parallelepiped housing 100 and first, second, third, and fourth substrates 101, 102, 103, and 104, and the housing 100 stores the first substrate 101, the second substrate 102, the third substrate 103, and the fourth substrate 104. The first substrate 101, the second substrate 102, the third substrate 103, and the fourth substrate 104 are each fixed to the housing 100 by screwing or the like. Among the first substrate 101, the second substrate 102, the third substrate 103, and the fourth substrate 104, the second substrate 102 is provided at the position closest to the bottom surface of the housing 100. The first substrate 101 is located between the second substrate 102 and the third substrate 103, and the third substrate 103 is located between the first substrate 101 and the fourth substrate 104. The fourth substrate 104 is provided at the position closest to the upper surface of the housing 100.
[0038] The wavelength variable filter 20, light receiving element 21, photoelectric conversion circuit 22, amplification circuit 23, C / V conversion circuit 24, amplification circuit 25, boost conversion circuit 26, and first processor 30 shown in FIG. 3 are provided on the first substrate 101. Also, the plurality of light emitting elements 10 and the light emitting element drive circuit 11 shown in FIG. 3 are provided on the second substrate 102. Further, the second processor 40, power supply circuit 41, switch circuit 42, charging circuit 43, and connector 60 shown in FIG. 3 are provided on the third substrate 103. Also, the wireless communication module 31, operation unit 32, light emitting module 33, and buzzer 34 shown in FIG. 3 are provided on the fourth substrate 104.
[0039] As shown in FIGS. 4, 5, and 6, the display module 50 shown in FIG. 3 is located between the fourth substrate 104 and the upper surface of the housing 100 and is visible from the upper surface of the housing 100. One end of a cable 51 connected to a display driver (not shown) incorporated in the display module 50 is connected to a connector 86 provided on the fourth substrate 104.
[0040] As shown in FIGS. 4 and 5, both ends of the flexible flat cable 91 are respectively connected to a connector 81 provided on the first substrate 101 and a connector 87 provided on the fourth substrate 104. Signals input and output between the first processor 30 provided on the first substrate 101 and the wireless communication module 31, operation unit 32, light emitting module 33, and buzzer 34 provided on the fourth substrate 104 are propagated through the flexible flat cable 91.
[0041] Also, the display signal output from the first processor 30 provided on the first substrate 101 propagates through the flexible flat cable 91 to reach the fourth substrate 104, and further propagates through the cable 51 to reach the display module 50. Therefore, the fourth substrate 104 functions as a relay substrate that relays the display signal to the display module 50.
[0042] Both ends of the flexible flat cable 92 are respectively connected to the connector 84 provided on the first substrate 101 and the connector 85 provided on the third substrate 103. The first processor 30 provided on the first substrate 101 and the second processor 40 provided on the third substrate 103 perform data communication via the flexible flat cable 92. Further, the voltage V3 based on the voltage V2 generated by the power supply circuit 41 provided on the third substrate 103 propagates through the flexible flat cable 92 to reach the first substrate 101, and further propagates through the flexible flat cable 91 to reach the fourth substrate 104. That is, the wiring path from the third substrate 103 to the first substrate 101 is shorter than the wiring path from the third substrate 103 to the fourth substrate 104. Therefore, the voltage drop amount of the voltage V3 supplied from the power supply circuit 41 to the first substrate 101 becomes small, and a stable voltage is supplied to the light receiving element 21 arranged on the first substrate 101.
[0043] Both ends of the cable 93 are respectively connected to the connector 82 provided on the first substrate 101 and the connector 83 provided on the second substrate 102. The control signal output from the first processor 30 provided on the first substrate 101 propagates through the cable 93 to reach the second substrate 102 and is input to the light emitting element driving circuit 11 provided on the second substrate 102.
[0044] As shown in FIGS. 4 and 5, the battery 70 shown in FIG. 3 is located between the first substrate 101, the second substrate 102, and the third substrate 103 and the fourth substrate 104. More specifically, the battery 70 is provided between the third substrate 103 and the fourth substrate 104. Further, the third substrate 103 is provided between the battery 70 and the first substrate 101. And the battery 70 overlaps the third substrate 103 in the Z-axis direction orthogonal to the surface 101F of the first substrate 101. Therefore, in a plan view seen from the positive direction of the Z-axis, the first substrate 101, the second substrate 102, the third substrate 103, the fourth substrate 104, and the battery 70 overlap, and the space where the first substrate 101, the second substrate 102, and the third substrate 103 are arranged and the space where the fourth substrate 104 is arranged are separated by the battery 70.
[0045] Also, as shown in FIG. 4, in a plan view seen from the positive direction of the X-axis, the battery 70 has a rectangular shape. On the other hand, as shown in FIG. 5, in a plan view seen from the positive direction of the Y-axis, the portion of the battery 70 facing the fourth substrate 104 has a semi-circular shape, and the portions of the battery 70 facing the first substrate 101, the second substrate 102, and the third substrate 103 have a trapezoidal shape with an upper base longer than the lower base. Therefore, the portions of the battery 70 facing the first substrate 101, the second substrate 102, and the third substrate 103 have a smaller cross-sectional area the closer they are to the first substrate 101, the second substrate 102, and the third substrate 103. For this reason, a gap is formed in the X-axis direction between the battery 70 and the third substrate 103, and connectors 71, 72 are provided on the third substrate 103 by utilizing this gap. The connectors 71, 72 are connected to the battery 70 by wiring (not shown). The power supply circuit 41 and the charging circuit 43 shown in FIG. 3 are electrically connected to the battery 70 via the connectors 71, 72.
[0046] FIG. 7 is a view of the first substrate 101 seen from the positive direction of the Z-axis, and FIG. 8 is a cross-sectional view of the first substrate 101 cut along the line A-A in FIG. 7. As shown in FIG. 7, in a plan view seen from the positive direction of the Z-axis, the first substrate 101 has a rectangular shape having a side 101a, a side 101b longer than the side 101a, a side 101c facing the side 101a, and a side 101d facing the side 101b.
[0047] As shown in FIGS. 7 and 8, the first substrate 101 has a surface 101F facing the positive direction of the Z-axis and a surface 101R facing the negative direction of the Z-axis. And the first substrate 101 is provided between the third substrate 103 and the second substrate 102 in the Z-axis direction. The light receiving element 21 is provided on the surface 101R of the first substrate 101.
[0048] As shown in FIG. 7, the first substrate 101 is constituted by fixing a main substrate 111 and a sub-substrate 113 to a spacer substrate 112 with screws 131, 132.
[0049] FIG. 9 is a view of the sub-substrate 113 as seen from the positive direction of the Z-axis. FIG. 10 is a view of the spacer substrate 112 as seen from the positive direction of the Z-axis. FIG. 11 is a view of the main substrate 111 as seen from the positive direction of the Z-axis. In FIGS. 9, 10, and 11, the solid lines indicate the components provided on the surfaces facing the positive direction of the Z-axis of each substrate, and the broken lines indicate the components provided on the surfaces facing the negative direction of the Z-axis of each substrate.
[0050] As shown in FIGS. 7, 9, 10, and 11, a screw 131 is inserted into a screw hole 121 provided in the main substrate 111, a screw hole 123 provided in the spacer substrate 112, and a screw hole 124 provided in the sub-substrate 113, and a screw 132 is inserted into a screw hole 122 provided in the main substrate 111 and a screw hole 125 provided in the sub-substrate 113.
[0051] As shown in FIG. 9, the sub-substrate 113 has a surface 113F facing the positive direction of the Z-axis and a surface 113R facing the negative direction of the Z-axis. The surface 101F and the surface 101R of the first substrate 101 are the surface 113F and the surface 113R of the sub-substrate 113, respectively. As shown in FIGS. 8 and 9, a light receiving element 21 and an amplifier circuit 23 are provided on the surface 113R of the sub-substrate 113.
[0052] As shown in FIGS. 7 and 11, in a plan view as seen from the positive direction of the Z-axis, the outer shape of the first substrate 101 coincides with the outer shape of the main substrate 111, and the sides 101a, 101b, 101c, and 101d of the first substrate 101 are the sides 111a, 111b, 111c, and 111d of the main substrate 111, respectively.
[0053] As shown in FIG. 11, the main board 111 has a surface 111F facing the positive direction of the Z-axis and a surface 111R facing the negative direction of the Z-axis. On the surface 111F of the main board 111, a photoelectric conversion circuit 22, an amplification circuit 25, a boost conversion circuit 26, a first processor 30, and a connector 84 are provided. Also, on the surface 111R of the main board 111, a wavelength variable filter 20, a C / V conversion circuit 24, a connector 81, and a connector 82 are provided. As shown in FIGS. 8 and 11, the main board 111 has a rectangular opening 120, and in a plan view seen from the positive direction of the Z-axis, the wavelength variable filter 20 and the opening 120 overlap.
[0054] In this embodiment, the first substrate 101 is composed of three substrates, namely, a main board 111, a spacer board 112, and a sub-board 113, but it may be composed of one or two substrates.
[0055] FIG. 12 is a view of the second substrate 102 seen from the positive direction of the Z-axis. In FIG. 12, the solid line indicates the components provided on the surface 102F of the second substrate 102 facing the positive direction of the Z-axis, and the dashed line indicates the components provided on the surface 102R of the second substrate 102 facing the negative direction of the Z-axis.
[0056] As shown in FIG. 12, in a plan view seen from the positive direction of the Z-axis, the second substrate 102 has a rectangular shape with a side 102a, a side 102b longer than the side 102a, a side 102c opposite to the side 102a, and a side 102d opposite to the side 102b. A connector 83 is provided on the surface 102F of the second substrate 102. The surface 102F of the second substrate 102 faces the surface 101R of the first substrate 101.
[0057] On the surface 102R of the second substrate 102, a plurality of light-emitting elements 10 and a light-emitting element driving circuit 11 are provided. The second substrate 102 has a circular opening 140, and in a plan view seen from the positive direction of the Z-axis, the plurality of light-emitting elements 10 are provided on the surface 102R of the second substrate 102 so as to surround the opening 140. The surface 102R of the second substrate 102 faces the inner wall surface of the housing 100.
[0058] FIG. 13 is a view of the third substrate 103 as seen from the positive direction of the Z axis. In FIG. 13, the solid lines indicate the components provided on the surface 103F facing the positive direction of the Z axis of the third substrate 103, and the dashed lines indicate the components provided on the surface 103R facing the negative direction of the Z axis of the third substrate 103.
[0059] As shown in FIG. 13, in a plan view as seen from the positive direction of the Z axis, the third substrate 103 has a rectangular shape having a side 103a, a side 103b longer than the side 103a, a side 103c facing the side 103a, and a side 103d facing the side 103b. On the surface 103F of the third substrate 103, a second processor 40, a power circuit 41, a switch circuit 42, a charging circuit 43, a connector 60, a connector 71, and a connector 72 are provided. The surface 103F of the third substrate 103 faces the battery 70.
[0060] A connector 85 is provided on the surface 103R of the third substrate 103. The surface 103R of the third substrate 103 faces the surface 101F of the first substrate 101.
[0061] FIG. 14 is a view of the fourth substrate 104 as seen from the positive direction of the Z axis. In FIG. 14, the solid lines indicate the components provided on the surface 104F facing the positive direction of the Z axis of the fourth substrate 104, and the dashed lines indicate the components provided on the surface 104R facing the negative direction of the Z axis of the fourth substrate 104.
[0062] As shown in FIG. 14, in a plan view as seen from the positive direction of the Z axis, the fourth substrate 104 has a rectangular shape having a side 104a, a side 104b longer than the side 104a, a side 104c facing the side 104a, and a side 104d facing the side 104b.
[0063] On the surface 104F of the fourth substrate 104, an operation unit 32, a light-emitting module 33, a buzzer 34, and a connector 86 are provided. The operation unit 32 is provided at a position overlapping with a virtual line VL that is equidistant from the side 104b and the side 104d on the surface 104F of the fourth substrate 104. That is, the operation unit 32 is arranged at the central portion in the short-side direction of the fourth substrate 104. The operation unit 32 is, for example, a button that physically displaces when pressed by a user. Also, the operation unit 32 may be a capacitive button.
[0064] The surface 104F of the fourth substrate 104 faces the inner wall surface of the housing 100 and the display module 50.
[0065] On the surface 104R of the fourth substrate 104, a wireless communication module 31 and a connector 87 are provided. The wireless communication module 31 is provided in the end region of the surface 104R of the fourth substrate 104. The end region is the region closest to the side 104a when the entire region of the surface 104R of the fourth substrate 104 is divided into three regions of equal area by two line segments parallel to the side 104a. The surface 104R of the fourth substrate 104 faces the battery 70.
[0066] FIG. 15 is a view of a plurality of light-emitting elements 10, a wavelength-variable filter 20, a light-receiving element 21, an opening 140, a first processor 30, a wireless communication module 31, an operation unit 32, a power supply circuit 41, a display module 50, and the fourth substrate 104 as viewed from the positive direction of the Z axis.
[0067] As shown in Fig. 15, in the Z-axis direction, the opening 140 of the second substrate 102, the wavelength-variable filter 20, and the light-receiving element 21 overlap, and a plurality of light-emitting elements 10 are positioned so as to surround the opening 140. That is, the opening 140 and the wavelength-variable filter 20 overlap on the optical axis of the light-receiving element 21, and a plurality of light-emitting elements 10 are positioned so as to surround the optical axis of the light-receiving element 21. Therefore, the light emitted from the plurality of light-emitting elements 10 is reflected by the image IMG, and the reflected light passes through the opening 140 and enters the wavelength-variable filter 20. Then, light of a predetermined wavelength that has passed through the wavelength-variable filter 20 enters the light-receiving element 21. By arranging the components of the optical system to overlap in the Z-axis direction in this way, the space required for the optical system is reduced, and the housing 100 can be miniaturized.
[0068] Also, as shown in Fig. 15, the operation unit 32 and the region A1 where the plurality of light-emitting elements 10 are arranged are provided at positions that overlap on the optical axis of the light-receiving element 21. Therefore, when the user operates the operation unit 32, a force is applied straight with respect to the optical axis of the light-receiving element 21, so it is difficult for the image IMG to blur or shift with respect to the optical axis of the light-receiving element 21. In the present embodiment, since the plurality of light-emitting elements 10 are provided on the surface 102R of the second substrate 102 so as to surround the opening 140, the region A1 is the region of the smallest circle including the respective arrangement regions of the plurality of light-emitting elements 10.
[0069] Also, as shown in Fig. 15, in the Z-axis direction orthogonal to the surface 101R of the fourth substrate 104 on which the wireless communication module 31 is provided, the display module 50 and the wireless communication module 31 do not overlap. Therefore, the possibility that the reception sensitivity of the wireless communication module 31 is reduced by the display module 50 is reduced.
[0070] Also, as shown in Fig. 15, in the Z-axis direction, the first processor 30 and the light-receiving element 21 do not overlap with the power supply circuit 41. Therefore, the possibility that the characteristics of the light-receiving element 21 change due to the heat generated by the power supply circuit 41 is reduced, and the heat dissipation of the power supply circuit 41, the first processor 30, and the light-receiving element 21, which are heat generation sources respectively, is enhanced.
[0071] 4. Operational Effects The image processing apparatus 1 of the present embodiment includes a battery 70 and is portable and operable independently. To solve at least one of the various problems that may arise, various arrangements have been made for the placement of each component.
[0072] One of the problems is to reduce the risk of malfunctions caused by heat generated in the narrow space inside the small housing 100. In the image processing apparatus 1 of the present embodiment, the light receiving element 21 and the first processor 30 that can become heat sources during the image processing period are arranged on the first substrate 101. Also, a plurality of light emitting elements 10 and the light emitting element driving circuit 11 that can become heat sources during the image processing period are arranged on the second substrate 102. Further, the power supply circuit 41 and the second processor 40 that can become heat sources during the image processing period are arranged on the third substrate 103. Thus, in the image processing apparatus 1 of the present embodiment, since each component that can become a heat source is dispersedly provided on the first substrate 101, the second substrate 102, and the third substrate 103, the mutual thermal influence is reduced and the operation can be stabilized.
[0073] Furthermore, since the power supply circuit 41 does not overlap with the light receiving element 21 in the Z-axis direction, the risk that the characteristics of the light receiving element 21 change due to the heat generated by the power supply circuit 41 is reduced, and the heat dissipation of each of the power supply circuit 41 and the light receiving element 21 is enhanced. Therefore, according to the image processing apparatus 1, the risk that the accuracy of the image processing performed based on the light reception amount of the light receiving element 21 decreases is reduced, and it can operate continuously for a long time while ensuring a certain quality.
[0074] Also, according to the image processing apparatus 1, since the first processor 30 that can become a heat source does not overlap with the power supply circuit 41 in the Z-axis direction, the heat dissipation of each of the first processor 30 and the power supply circuit 41 is enhanced.
[0075] In the image processing apparatus 1, the wireless communication module 31 is provided on a fourth substrate 104 that is separate from the first substrate 101, the second substrate 102, and the third substrate 103 on which the light receiving element 21 that can be a heat source, the plurality of light emitting elements 10, and the power supply circuit 41 are respectively provided. Therefore, according to the image processing apparatus 1, the wireless communication module 31, for which stable operation is required, has a reduced risk of malfunctioning due to the influence of heat.
[0076] Also, in the image processing apparatus 1, the battery 70 positioned between the first substrate 101, the second substrate 102, and the third substrate 103 and the fourth substrate 104 serves as a heat barrier, and the heat generated by the first substrate 101, the second substrate 102, and the third substrate 103 is less likely to be transmitted to the fourth substrate 104. Therefore, according to the image processing apparatus 1, the wireless communication module 31 provided on the fourth substrate 104 is less likely to be affected by the rapid temperature rise of the first substrate 101, the second substrate 102, and the third substrate 103 accompanying image processing, and stable communication quality can be ensured.
[0077] Also, as shown in FIG. 5, in the image processing apparatus 1, since the cross-sectional area of the portion of the battery 70 facing the first substrate 101, the second substrate 102, and the third substrate 103 is small, the gap between the battery 70 and the first substrate 101, the second substrate 102, and the third substrate 103 is larger than when a rectangular parallelepiped-shaped battery is arranged. Therefore, according to the image processing apparatus 1, the heat from the first substrate 101, the second substrate 102, and the third substrate 103 on which the light receiving element 21 that can be a heat source, the plurality of light emitting elements 10, and the power supply circuit 41 are respectively provided is likely to diffuse, and the heat dissipation performance is improved.
[0078] Further, on the fourth substrate 104, a wireless communication module 31 with a small heat generation amount because it operates only for a short period when necessary, a light emitting module 33, an operation unit 32 and a buzzer 34 that hardly generate heat are arranged. Therefore, although the fourth substrate 104 generates heat to relay a display signal to the display module 50 during the image processing period, at least one of the first substrate 101, the second substrate 102, and the third substrate 103 generates more heat than the fourth substrate 104. In fact, if no special situation such as frequent wireless communication occurs, all of the first substrate 101, the second substrate 102, and the third substrate 103 generate more heat than the fourth substrate 104. Thus, in the image processing apparatus 1, each component with a relatively large heat generation amount is arranged on the first substrate 101, the second substrate 102, and the third substrate 103 with high heat dissipation, and each component with a relatively small heat generation amount is arranged on the fourth substrate 104 that is less affected by heat. Therefore, according to the image processing apparatus 1, it is possible to improve the heat dissipation while securing the capacity of the battery 70, so that it can operate continuously for a long time while ensuring a certain quality.
[0079] Further, according to the image processing apparatus 1, since the first processor 30 that can be a heat source is provided on the first substrate 101 with good heat dissipation, it can operate continuously for a long time while ensuring a certain quality.
[0080] Further, according to the image processing apparatus 1, since the second processor 40 that can be a heat source is provided on the third substrate 103 with good heat dissipation, it can operate continuously for a long time while ensuring a certain quality.
[0081] Realizing good noise resistance and responsiveness is also one of the problems. In the image processing apparatus 1 of the present embodiment, since the first processor 30 that performs image processing is provided on the first substrate 101 where the light receiving element 21 is provided, the signal output from the light receiving element 21 propagates to the first processor 30 without passing through the second substrate 102, the third substrate 103, and the fourth substrate 104. Therefore, according to the image processing apparatus 1, good noise resistance and responsiveness can be realized.
[0082] In the image processing apparatus 1, since the second processor 40 that performs power control is provided on the third substrate 103 where the power supply circuit 41 is provided, the signal output from the second processor 40 propagates to the power supply circuit 41 without passing through other substrates. Therefore, according to the image processing apparatus 1, good noise resistance and responsiveness can be realized.
[0083] Also, according to the image processing apparatus 1, since the wireless communication module 31 is arranged in the end region in the long side direction where the distance from the inner wall surface of the housing 100 is small on the fourth substrate 104, it is hardly affected by noise and the communication sensitivity can be enhanced.
[0084] Also, according to the image processing apparatus 1, since the light receiving element 21, the plurality of light emitting elements 10, the power supply circuit 41, the wireless communication module 31, and the operation unit 32 are provided on different substrates respectively, the mutual interference such as heat, vibration, and signals is reduced, and the operation can be stabilized. Therefore, according to the image processing apparatus 1, the possibility that the accuracy of image processing is reduced due to the mutual interference of heat, vibration, signals, etc. among the plurality of components is reduced, and it can operate while ensuring a certain quality continuously for a long time.
[0085] Also, in the image processing apparatus 1, since the wiring path from the third substrate 103 to the first substrate 101 is short, the amount of voltage drop of the voltage V3 supplied from the power supply circuit 41 arranged on the third substrate 103 to the first substrate 101 becomes small. Therefore, according to the image processing apparatus 1, since a stable voltage is supplied to the light receiving element 21 arranged on the first substrate 101, the possibility that the accuracy of image processing is reduced is reduced.
[0086] Also, according to the image processing apparatus 1, the wiring path between the light receiving element 21 and the photoelectric conversion circuit 22 becomes short, and the influence of noise on a minute signal becomes small, so the possibility that the accuracy of image processing is reduced is reduced.
[0087] Further, according to the image processing apparatus 1, since the wireless communication module 31 does not overlap with the display module 50 in the direction orthogonal to the fourth substrate 104, the possibility that the reception sensitivity is reduced by the display module 50 is reduced.
[0088] Improving the operability and convenience for the user is also one of the issues. In the image processing apparatus 1 of the present embodiment, in the Z-axis direction, the first substrate 101 is provided between the third substrate 103 and the second substrate 102, the third substrate 103 is provided between the battery 70 and the first substrate 101, the battery 70 is positioned between the third substrate 103 and the fourth substrate 104, and the battery 70 overlaps with the third substrate 103. Therefore, according to the image processing apparatus 1, since the second substrate 102, the first substrate 101, the third substrate 103, the battery 70, and the fourth substrate 104 are arranged to overlap in this order, the widths of the housing 100 in the X-axis direction and the Y-axis direction can be made smaller than the height in the Z-axis direction. Therefore, it becomes easier for the user to recognize the position of the light receiving element 21, and the operability of the image processing apparatus 1 is improved.
[0089] Further, according to the image processing apparatus 1, in the Z-axis direction, the opening 140 of the second substrate 102, the wavelength variable filter 20, and the light receiving element 21 overlap, and by positioning the plurality of light emitting elements 10 so as to surround the opening 140, the space required for the arrangement of the optical system becomes smaller, so that the housing 100 can be miniaturized.
[0090] In the image processing apparatus 1, the operation unit 32, the buzzer 34 that hardly generates heat, and the light emitting module 33 that generates little heat hardly affect the communication quality. Therefore, by arranging the operation unit 32, the buzzer 34, and the light emitting module 33 on the fourth substrate 104 where the wireless communication module 31 is arranged, the area of the fourth substrate 104 is effectively utilized. In addition, since the display module 50 that generates less heat compared to the first substrate 101, the second substrate 102, and the third substrate 103 has little influence on the communication quality, the fourth substrate 104 where the wireless communication module 31 is arranged is also utilized as a relay substrate that relays the display signal to the display module 50. Therefore, according to the image processing apparatus 1, the housing 100 can be miniaturized, and the operability of the user can be improved.
[0091] In the image processing apparatus 1, the operation unit 32 provided on the fourth substrate 104, the area A1 of the second substrate 102 where a plurality of light emitting elements 10 are arranged, and the light receiving element 21 overlap on the optical axis of the light receiving element 21. Therefore, when the user operates the operation unit 32, a force is directly applied to the optical axis of the light receiving element 21. Therefore, according to the image processing apparatus 1, when the user operates the operation unit 32, it is difficult for the image IMG to be processed to be blurred or displaced with respect to the optical axis of the light receiving element 21, and the probability of obtaining normal data is improved.
[0092] For example, if the operation unit 32 is a button that physically displaces, the operation unit 32 physically displaces by the user's operation. Therefore, the user can surely recognize that the operation has been performed. On the other hand, a large force is applied by the user's operation, but it is difficult for the optical axis of the light receiving element 21 to be blurred or displaced.
[0093] In addition, for example, if the operation unit 32 is a capacitive button, the operation is detected when the user touches the operation unit 32. Therefore, the force applied by the user's operation is small, and it is even more difficult for the optical axis of the light receiving element 21 to be blurred or displaced.
[0094] Further, according to the image processing apparatus 1, since the operation unit 32 is arranged at the central portion in the short side direction of the fourth substrate 104, it is easy for the user to perform operations, and the operability is improved. Further, since the operability is improved, when the user operates the operation unit 32, it is less likely that blurring or deviation occurs with respect to the optical axis of the light receiving element 21 for the image IMG to be processed.
[0095] Also, according to the image processing apparatus 1, the user can recognize that the operation unit 32 has been operated according to the light emission state of the light emitting module 33 without applying an unnecessarily large force, so that the amount of blur or deviation of the optical axis of the light receiving element 21 is reduced, and the probability of obtaining normal data is improved.
[0096] Also, according to the image processing apparatus 1, the user can recognize that an operation failure has occurred by the buzzer sound and can immediately re-operate the operation unit 32, so that the convenience for the user is improved.
[0097] Also, according to the image processing apparatus 1, it can operate independently without receiving an instruction from another device and can be carried around, so the convenience for the user is high.
[0098] Improving maintainability is also one of the issues. In the image processing apparatus 1 of the present embodiment, the light receiving element 21, the plurality of light emitting elements 10, the power supply circuit 41, the wireless communication module 31, and the operation unit 32 are provided on different substrates, respectively. Therefore, according to the image processing apparatus 1 of the present embodiment, when any one of the light receiving element 21, the plurality of light emitting elements 10, the power supply circuit 41, the wireless communication module 31, and the operation unit 32 fails, only one substrate needs to be replaced, and there is no need to replace the other three substrates, so the maintainability is good.
[0099] Also, according to the image processing apparatus 1, since the light emitting element driving circuit 11 and the plurality of light emitting elements 10 are provided on the second substrate 102, when at least one of these fails, the second substrate 102 may be replaced with a substrate whose characteristics have been inspected by combining another light emitting element driving circuit and another light emitting element, so the maintainability is good.
[0100] Further, according to the image processing apparatus 1, since the light receiving element 21 and the photoelectric conversion circuit 22 are provided on the sub-board 113 of the first board 101, when at least one of these fails, the sub-board 113 of the first board 101 may be replaced with a board whose characteristics have been inspected by combining other light receiving elements and other photoelectric circuit light emitting elements, so the maintainability is good.
[0101] As described above, according to the image processing apparatus 1 of the present embodiment, since it includes the battery 70 and can be carried and operated alone, at least one of various problems that are likely to occur can be solved.
[0102] The present invention is not limited to this embodiment, and various modifications can be made within the scope of the gist of the present invention.
[0103] For example, as the image processing apparatus according to the present invention, in the above embodiment, a color measuring device was taken as an example, but the present invention is applicable to various image processing apparatuses having a function of processing images other than color measuring devices. Examples of the image processing apparatus to which the present invention can be applied include, for example, mobile terminals such as smartphones, portable printers, portable scanners, portable display devices, digital cameras, and the like.
[0104] Although the present embodiment or the modification example has been described above, the present invention is not limited to these present embodiments or modification examples, and can be implemented in various modes without departing from the gist thereof. For example, it is also possible to appropriately combine the above-described embodiments and modification examples.
[0105] The present invention includes configurations that are substantially the same as the configurations described in the embodiments, for example, configurations having the same functions, methods, and results, or configurations having the same objectives and effects. The present invention also includes configurations in which non-essential portions of the configurations described in the embodiments are replaced. The present invention further includes configurations that exhibit the same operational effects as the configurations described in the embodiments or configurations that can achieve the same objectives. The present invention also includes configurations in which known technologies are added to the configurations described in the embodiments.
[0106] The following content is derived from the above-described embodiments and variations.
[0107] One aspect of the image processing apparatus is a light receiving element, a light emitting element, a battery, a power supply circuit electrically connected to the battery, a first substrate on which the light receiving element is provided, a second substrate on which the light emitting element is provided, a third substrate on which the power supply circuit is provided, a housing that houses the first substrate, the second substrate, and the third substrate, and has a portion of the battery facing the first substrate, the second substrate, and the third substrate has a smaller cross-sectional area as it is closer to the first substrate, the second substrate, and the third substrate.
[0108] In this image processing apparatus, since the portion of the battery facing the first substrate, the second substrate, and the third substrate has a small cross-sectional area, the gap between the battery and the first substrate, the second substrate, and the third substrate is larger compared to the case where a rectangular parallelepiped-shaped battery is arranged. Therefore, according to this image processing apparatus, heat from the first substrate, the second substrate, and the third substrate on which the light receiving element, the light emitting element, and the power supply circuit, which can be heat sources, are respectively provided, easily diffuses, and the heat dissipation performance is improved.
[0109] One aspect of the image processing apparatus is having a fourth substrate, The battery may be positioned between the first substrate, the second substrate, the third substrate, and the fourth substrate.
[0110] According to this image processing apparatus, a battery positioned between the first substrate, the second substrate, the third substrate, and the fourth substrate serves as a heat barrier, and heat generated by the first substrate, the second substrate, and the third substrate is less likely to be transmitted to the fourth substrate.
[0111] In one aspect of the image processing apparatus, At least one of the first substrate, the second substrate, and the third substrate may have a larger amount of heat generation than the fourth substrate.
[0112] In this image processing apparatus, each component with a relatively large amount of heat generation is arranged on the first substrate, the second substrate, and the third substrate with high heat dissipation, and each component with a relatively small amount of heat generation is arranged on the fourth substrate that is less affected by heat. Therefore, according to this image processing apparatus, it is possible to improve heat dissipation while ensuring the battery capacity, so that it can operate while continuously guaranteeing a certain quality for a long time.
[0113] One aspect of the image processing apparatus has a wireless communication module, The wireless communication module may be provided on the fourth substrate.
[0114] In this image processing apparatus, the wireless communication module is provided on the fourth substrate from which heat from the first substrate, the second substrate, and the third substrate, on which a light receiving element, a light emitting element, and a power supply circuit that can be heat generation sources are respectively provided, is less likely to be transmitted. Therefore, according to this image processing apparatus, the wireless communication module provided on the fourth substrate is less likely to be affected by a rapid temperature rise of the first substrate, the second substrate, and the third substrate accompanying image processing, and the risk of malfunction is reduced, so that stable communication quality can be guaranteed.
[0115] One aspect of the image processing apparatus has an operation unit, The operation unit may be provided on the fourth substrate.
[0116] In this image processing apparatus, an operation unit that hardly generates heat is arranged on a fourth substrate on which components that may malfunction due to the influence of heat are arranged, so that the area of the fourth substrate is effectively utilized. Therefore, according to this image processing apparatus, the housing can be miniaturized, and the operability of the user can be improved.
[0117] One aspect of the image processing apparatus is having a buzzer, The buzzer may be provided on the fourth substrate.
[0118] In this image processing apparatus, a buzzer that hardly generates heat is arranged on a fourth substrate on which components that may malfunction due to the influence of heat are arranged, so that the area of the fourth substrate is effectively utilized. Therefore, according to this image processing apparatus, the housing can be miniaturized, and the operability of the user can be improved.
[0119] One aspect of the image processing apparatus is having a first processor, The first processor may be provided on the first substrate.
[0120] According to this image processing apparatus, since the first processor that can be a heat source is provided on the first substrate with good heat dissipation properties, it can operate continuously for a long time while ensuring a certain quality. Further, in this image processing apparatus, since the first processor is provided on the first substrate on which the light receiving element is provided, the signal output from the light receiving element propagates to the processor without passing through other substrates. Therefore, according to this image processing apparatus, good noise resistance and responsiveness can be realized.
[0121] One aspect of the image processing apparatus is having a second processor, The second processor may be provided on the third substrate.
[0122] According to this image processing apparatus, since the second processor that can be a heat source is provided on the third substrate with good heat dissipation properties, it can operate while continuously ensuring a certain quality for a long time. Further, in this image processing apparatus, since the second processor is provided on the third substrate where the power supply circuit is provided, the signal output from the second processor propagates to the power supply circuit without passing through other substrates. Therefore, according to this image processing apparatus, good noise resistance and responsiveness can be realized.
Explanation of Reference Numerals
[0123] 1... Image processing apparatus, 10... Light emitting element, 11... Light emitting element driving circuit, 20... Wavelength variable filter, 21... Light receiving element, 22... Photoelectric conversion circuit, 23... Amplification circuit, 24... C / V conversion circuit, 25... Amplification circuit, 26... Boost conversion circuit, 30... First processor, 31... Wireless communication module, 32... Operation unit, 33... Light emitting module, 34... Buzzer, 40... Second processor, 41... Power supply circuit, 42... Switch circuit, 43... Charging circuit, 50... Display module, 51... Cable, 60... Connector, 70... Battery, 71, 72... Connector, 81, 82, 83, 84, 85, 86, 87... Connector, 91, 92... Flexible flat cable, 93... Cable, 100... Housing, 101... First substrate, 101a, 101b, 101c, 101d... Sides of the first substrate, 101F, 101R... Surfaces of the first substrate, 102... Second substrate, 102a, 102b, 102c, 102d... Sides of the second substrate, 102F, 102R... Surfaces of the second substrate, 103... Third substrate, 103a, 103b, 103c, 103d... Sides of the third substrate, 103F, 103R... Surfaces of the third substrate, 104... Fourth substrate, 104a, 104b, 104c, 104d... Sides of the fourth substrate, 104F, 104R... Surfaces of the fourth substrate, 111... Main substrate, 111a, 111b, 111c, 111d... Sides of the main substrate, 111F, 111R... Surfaces of the main substrate, 112... Spacer substrate, 113... Substrate, 113F, 113R... Surfaces of the substrate, 120... Opening, 121, 122, 123, 124, 125... Screw holes, 133, 132... Screws, 140... Opening
Claims
1. A light receiving element, A light emitting element, A battery, A power supply circuit electrically connected to the battery, A first substrate on which the light receiving element is provided, A second substrate on which the light emitting element is provided, A third substrate on which the power supply circuit is provided, A rectangular parallelepiped housing that houses the first substrate, the second substrate, and the third substrate, having, The first substrate, the second substrate, and the third substrate are positioned parallel to each other, A surface of the housing facing the second substrate is defined as a first surface, A direction in which the long side of the first surface extends is defined as a first direction, and a direction in which the short side of the first surface extends is defined as a second direction and, The battery includes a first side along the first direction and a second side along the second direction, The first side is longer than the second side, A portion of the battery facing the first substrate, the second substrate, and the third substrate has a smaller cross-sectional area as it is closer to the first substrate, the second substrate, and the third substrate, and the cross-sectional shape of the cross-sectional area is a quadrilateral, which is characterized by an image processing apparatus.
2. having a fourth substrate, The battery is positioned between the first substrate, the second substrate, and the third substrate and the fourth substrate, which is characterized by the image processing apparatus according to Claim 1.
3. During a period when wireless communication is not performed and during an image processing operation, at least one of the first substrate, the second substrate, and the third substrate generates more heat than the fourth substrate, which is characterized by the image processing apparatus according to Claim 2.
4. having a wireless communication module, the wireless communication module is provided on the fourth substrate, which is characterized by the claim 2 or 3 of the image processing apparatus described.
5. having an operation unit, the operation unit is provided on the fourth substrate, which is characterized by any one of claims 2 to 4 of the image processing apparatus described in any one of the above.
6. having a buzzer, the buzzer is provided on the fourth substrate, which is characterized by any one of claims 2 to 5 of the image processing apparatus described in any one of the above.
7. having a first processor, the first processor is provided on the first substrate, which is characterized by claim 1 to any one of 6 of the image processing apparatus described.
8. having a second processor, the second processor is provided on the third substrate, which is characterized by claim 1 to any one of 7 of the image processing apparatus described.
Citation Information
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