Electronic control device and method for manufacturing the same

Abstract

To provide a technique which can suppress the occurrence of a malfunction due to heat from an electronic component and a substrate by increasing the heat dissipation property from the electronic component and the substrate arranged in a housing.SOLUTION: An electronic control device 1 includes a first substrate 33 and a second substrate 35 facing each other, and electronic components 31 are mounted on the first substrate 33 and the second substrate 35. A heat release part 21 integrally molded with a cover 11 of a housing 3 is provided in a space between the first substrate 33 and the second substrate 35. Since the heat can be efficiently released to the heat release part 21 from each of the substrates 33, 35 and the electronic component 31 arranged in the housing 3, the heat dissipation property to the outside of the housing 3 from the electronic component 31 can be increased. Consequently, it is possible to prevent the electronic component 31 and each of the substrates 33, 35 from being adversely affected by the heat.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present disclosure relates to an electronic control device in which electronic components are housed inside a housing and a method for manufacturing the same.

Background Art

[0002] In recent years, for the purpose of reducing the volume and cost of in-vehicle computers, the integration of electronic control devices has been progressing. In addition, there is a demand for the development of an integrated electronic control device that has more functions than before integration while having the same size as one of the electronic control devices.

[0003] Along with this, there are problems of increased density and increased heat generation of the electronic components housed in the housing of the electronic control device. That is, there are problems such as how to arrange many electronic components in the housing and the problem that the amount of heat generation increases due to the arrangement of many electronic components. In particular, when a large number of electronic components are arranged at high density, there is a problem that the temperature of the electronic components tends to rise and adversely affects the operation of the electronic components.

[0004] As a means for solving this increase in density and heat generation of electronic components, a technique is disclosed in which a drive circuit that easily generates a lot of heat and a control circuit that is easily affected by heat are mounted on different separate substrates, and the substrates are arranged substantially parallel to face each other (see, for example, Patent Document 1 below).

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] However, as a result of the inventors' detailed examination, the following problems were found in the conventional technology. An electronic component (i.e., an element) with a large amount of heat generation needs to dissipate heat to the outside air of the housing by dissipating heat from both the upper surface of the electronic component and the opposite surface of the substrate on which the electronic component is mounted to the housing.

[0007] However, in the above-described conventional technology, as shown in FIG. 13, the substrates (P1, P2) are arranged to face each other. When the electronic components (P3) on each substrate dissipate heat to the inner side of the housing (P4), the substrates and electronic components facing each other will be heated. That is, there is a possibility that the heat dissipation on the inner side of the housing such as the substrate is not sufficient. In addition, in FIG. 13B, the heat dissipation path to the inner side of the housing is shown by an arrow.

[0008] Therefore, when the temperature of the electronic component mounted on the substrate rises excessively, there is a risk of problems such as unstable operation of the electronic component. Also, when the temperature of the substrate itself rises excessively (for example, when the temperature rises above the glass transition point), there is a risk of problems such as changes in characteristics. That is, there is a risk that the electronic component and the substrate will be adversely affected by heat.

[0009] One aspect of the present disclosure is to provide a technology that can enhance the heat dissipation from electronic components and substrates arranged inside the housing and suppress the occurrence of problems due to heat of the electronic components and substrates.

Means for Solving the Problem

[0010] (1) One aspect of the present disclosure relates to an electronic control device (1) including a housing (3). This electronic control device has a configuration in which a plurality of substrates (33, 35) on which electronic components (31) are arranged are accommodated inside the housing, and a heat dissipation part (21) that is integrally formed with the housing and can dissipate heat to the housing side is provided in the space between the substrates facing each other.

[0011] With such a configuration, in the present disclosure, it is possible to enhance the heat dissipation from electronic components and substrates arranged inside the housing and suppress the occurrence of problems due to heat of the electronic components and substrates. Specifically, in the present disclosure, since the heat dissipation part is arranged between the substrates facing each other, when the temperature of the electronic components mounted on each substrate or each substrate rises, the heat of the electronic components and the substrate can be released to the heat dissipation part. Further, since the heat dissipation part is integrally formed with the housing, the heat of the electronic components and the substrate can be efficiently released to the housing side (i.e., dissipated) through the heat dissipation part. Therefore, heat can also be dissipated from the housing to the surrounding atmosphere side.

[0012] Also, even if heat cannot be dissipated from the housing to the surrounding atmosphere side, since the heat of the electronic components and the substrate can be absorbed (i.e., heat absorption) by the heat dissipation part, it is possible to suppress the temperature rise of the electronic components and the substrate.

[0013] Here, the heat dissipation part is integrally formed with the housing. The housing and the heat dissipation part are integral members, different from a configuration where separate members are merely in contact. Examples of integral members include those in which the housing and the heat dissipation part are integrally formed during manufacturing, and those in which separate housing and heat dissipation parts are joined to form an integral member, such as by welding. For example, an integral member in which the housing and the heat dissipation part are integrally molded, a member in which the housing and the heat dissipation part are integrally joined by welding or the like, and a member in which the housing and the heat dissipation part are mechanically integrally connected (i.e., fixedly integrated) by coupling members such as bolts and nuts.

[0014] Also, as the heat dissipation part, a member having higher thermal conductivity (i.e., thermal conductivity) than any of the substrates or air can be mentioned. By using this heat dissipation part, the heat dissipation performance from the electronic components and the substrate to the housing side is higher than when there is no heat dissipation part.

[0015] (2) Another aspect of the present disclosure relates to a manufacturing method of an electronic control device (1) including a housing (3). In this manufacturing method of the electronic control device, when providing a configuration in which a plurality of substrates (33, 35) on which electronic components (31) are arranged are accommodated in the housing, a heat dissipation part integrally formed with the housing and capable of dissipating heat to the housing side is arranged in the space between the substrates facing each other.

[0016] An electronic control device manufactured by such a manufacturing method can enhance the heat dissipation from electronic components and substrates disposed inside the housing as described above, and suppress the occurrence of problems due to the heat of the electronic components and substrates.

[0017] In addition, the reference numerals in parentheses described in this column and the claims indicate the correspondence with the specific means described in the embodiments to be described later as one aspect, and do not limit the technical scope of the present disclosure.

Brief Description of the Drawings

[0018]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Figure 12

Figure 13

[0019] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. [1. Embodiment] [1-1. Overall Configuration] First, the overall configuration of the electronic control device in this embodiment will be described.

[0020] Examples of this electronic control device include an electronic control device mounted on a vehicle and used for vehicle control and the like. Hereinafter, the configuration of the electronic control device will be described using a three-dimensional orthogonal coordinate system of XYZ.

[0021] As shown in Fig. 1, the electronic control device 1 of this embodiment is a substantially rectangular parallelepiped-shaped device, and includes a housing 3 which is a substantially rectangular parallelepiped-shaped container, and a substantially rectangular parallelepiped-shaped connector 5 fixed to the housing 3. The connector 5 is fitted and fixed in an opening 7 that opens on one side of the housing 3 (for example, the right side in Fig. 1A).

[0022] As shown in Fig. 2, the housing 3 is formed integrally by joining a cover (i.e., a heat dissipation side housing) 11 and a case (i.e., a separate housing) 13 with a sealing material 15 (for example, refer to Fig. 3) described later.

[0023] As shown in FIG. 2B, the cover 11 is a member made of a metal such as an aluminum alloy and integrally formed by casting (i.e., a member made of aluminum die-casting). This cover 11 is composed of a cover upper part 17, a cover side wall 19, and a heat dissipation part 21, and each part 17, 19, 21 is a plate-shaped member with a rectangular shape when viewed from the thickness direction.

[0024] Specifically, the cover upper part 17 is a flat plate-shaped member extending along the XY plane. The cover side wall 19 is a flat plate-shaped member extending downward in FIG. 2B along the ZX plane perpendicular to the cover upper part 17 from the end of the cover upper part 17 (i.e., the left end in FIG. 2B). The heat dissipation part 21 is a flat plate-shaped member extending parallel to the cover upper part 17 along the XY plane from the inner surface of the cover side wall 19 (i.e., the right side surface in FIG. 2B).

[0025] Note that the dimension of the cover upper part 17 in the Y-axis direction is longer than the dimension of the heat dissipation part 21 in the Y-axis direction. As shown in FIG. 2C, the case 13 is a member made of a metal such as an aluminum alloy and integrally formed by casting. This case 13 is composed of a case bottom part 23, a case side wall 25, and a case rear wall 27, and each part 23, 25, 27 is a plate-shaped member with a rectangular shape when viewed from the thickness direction.

[0026] Specifically, the case bottom part 23 is a flat plate-shaped member extending along the XY plane. The case side wall 25 is a flat plate-shaped member extending upward in FIG. 2C along the ZX plane perpendicular to the case bottom part 23 from the end of the case bottom part 23 (i.e., the right end in FIG. 2C). The case rear wall 27 is a flat plate-shaped member extending perpendicular to the case bottom part 23 and the case side wall 25 along the YZ plane so as to cover the rear side from the respective ends on the rear side (i.e., the left side in FIG. 1C) of the case bottom part 23 and the case side wall 25.

[0027] On the inner surface of the case side wall 25 (i.e., the left side surface in FIG. 2C), a housing pedestal 26 that protrudes to the left side in FIG. 2C and extends in the X-axis direction is provided integrally with the case side wall 25. This housing pedestal 26 is a triangular prism-shaped member, and its upper surface 26a (i.e., the upper side surface in FIG. 2C) is formed parallel to the XY plane. The housing pedestal 26 is a member that suppresses and supports the vibration of the heat dissipation part 21 by placing the tip of the heat dissipation part 21 thereon, as will be described later.

[0028] As shown in FIG. 3, on the opening 7 side of the cover upper part 17 and the case bottom part 23, it is slightly bent toward the connector 5 side in accordance with the outer shape of the connector 5. Also, as shown in FIG. 3, in the gap at the portion where the cover 11 and the case 13 are joined to form the housing 3, that is, the portion where the cover 11 and the case 13 are close to each other, a sealing material 15 having both well-known sealing properties and joining properties is arranged in a band shape.

[0029] The sealing material 15 joins the cover 11 and the case 13 together. The sealing material 15 is formed by applying and curing a paste 15a that becomes the sealing material 15 (see, for example, FIG. 6), as will be described later.

[0030] Specifically, the paste 15a that becomes the sealing material 15 contains a material having airtightness and an adhesive. By applying and curing this paste 15a, the cover 11 and the case 13 can be joined together while ensuring sealing properties. That is, since the paste 15a has elasticity even when cured after application (i.e., the sealing material 15 has elasticity), the sealing material 15 can seal (i.e., make airtight) the space between the cover 11 and the case 13.

[0031] As the material of the housing 3 constituted by the cover 11 and the case 13, a material such as a metal having high thermal conductivity (i.e., a high thermal conductivity coefficient) is used. For example, in the present embodiment, a material having a higher thermal conductivity than the first substrate 33 or the second substrate 35 to be described later is used.

[0032] [1-2. Configuration inside the housing] Next, the internal configuration of the housing 3 will be described. As shown in FIGS. 3 to 5, inside the housing 3 of the electronic control device 1, electronic components (i.e., elements) 31, a first substrate 33, a second substrate 35, a flexible substrate 37, etc. are arranged. Hereinafter, each configuration will be described in detail.

[0033] <First substrate> As shown in FIGS. 3 to 5, in the upper part inside the housing 3, that is, on the cover upper part 17 side, a first substrate 33 having a rectangular shape as viewed from, for example, the thickness direction is arranged in parallel with the cover upper part 17.

[0034] Examples of the first substrate 33 (for example, the main substrate) include a resin substrate (for example, a substrate using glass cloth as a base material and impregnated with epoxy resin). On the inner surface (i.e., the surface on the inside of the housing 3) and the outer surface (i.e., the surface on the cover upper part 17 side) of the first substrate 33, electronic components 31, which are various elements, are mounted (i.e., surface-mounted), and a wiring pattern (not shown) is formed so as to be connected to the electronic components 31.

[0035] Specifically, on the first substrate 33, as an electronic component 31 constituting the control circuit 39, for example, a control processing element 31a such as a microcomputer including a CPU is mounted. This control processing element 31a generally generates less heat than the drive element 31b, which is an electronic component 31 constituting the drive circuit 41 described later. Therefore, the control circuit 39 generates less heat than the drive circuit 41.

[0036] Note that the control processing element 31a captures a sensor signal from a sensor that detects the operating state of the vehicle engine, performs arithmetic processing based on the sensor signal, and outputs a control signal according to the result of the arithmetic processing to the drive element 31b, etc. In addition, it performs processing such as communication with various electronic devices (not shown) mounted on the vehicle.

[0037] The first substrate 33 is fixed to the upper cover 17 by a fixing member 43, and a gap is provided between the first substrate 33 and the upper cover 17. Among the inner surfaces of the upper cover 17, at the position closest to the control processing element 31a mounted on the inner surface of the first substrate 33, that is, at the position where the control processing element 31a is projected in the Z-axis direction, a heat dissipation pedestal 45 (i.e., a cover-side pedestal 45a) protruding toward the first substrate 33 side is provided. The cover-side pedestal 45a is formed by integral molding with the cover 11.

[0038] The shape of the cover-side pedestal 45a is, for example, a frustum of a cone or a frustum of a pyramid with a flat tip and a base larger than the tip. Note that the shapes of the other heat dissipation pedestals 45 are the same. Furthermore, between the tip of the cover-side pedestal 45a and the first substrate 33, a well-known heat dissipation gel 47 having higher thermal conductivity than the first substrate 33, for example, is disposed so as to contact the cover-side pedestal 45a and the first substrate 33. Examples of the heat dissipation gel 47 include those obtained by adding a ceramic having high thermal conductivity and electrical insulation to a gel-like material such as silicone.

[0039] Although not shown, a heat dissipation pedestal 45 may also be provided so as to protrude from the first substrate 33 side toward the control processing element 31a mounted on the outer surface of the first substrate 33 (i.e., the surface on the upper cover 17 side), and the heat dissipation gel 47 may be disposed between this heat dissipation pedestal 45 and the control processing element 31a.

[0040] <The second substrate> As shown in FIGS. 3 to 5, in the lower part inside the housing 3, that is, on the case bottom 23 side, a second substrate 35 having a rectangular shape when viewed from, for example, the thickness direction is disposed in parallel with the case bottom 23.

[0041] Examples of the second substrate (for example, a sub-substrate) 35 include substrates made of the same material as the first substrate 33. Note that a substrate made of ceramic or the like having higher heat dissipation than resin may also be used. On the inner surface of the second substrate 35 (i.e., the surface on the inner side of the housing 3) and the outer surface (i.e., the surface on the side of the case bottom 23), various electronic components 31 are mounted (i.e., surface-mounted), and a wiring pattern (not shown) is formed so as to connect to the electronic components 31.

[0042] Specifically, on the second substrate 35, as an electronic component 31 constituting the drive circuit 41, for example, a drive element 31b used to energize and drive an actuator of an engine is mounted.

[0043] The drive element 31b is, for example, a switching element such as a power transistor or a power IC, and is provided in the energization path from the in-vehicle battery to each actuator, and can perform operations such as interrupting this energization path based on a control signal from the control processing element 31a.

[0044] The second substrate 35 is fixed to the case bottom 23 by a fixing member 43, and a gap is provided between the second substrate 35 and the case bottom 23. Among the inner surfaces of the case bottom 23, at the positions closest to the drive elements 31b respectively mounted on the outer surface and the inner surface of the second substrate 35, that is, at the positions where each drive element 31b is projected in the Z-axis direction, heat dissipation pedestals 45 (i.e., case-side pedestals 45b) protruding toward the second substrate 35 are respectively provided. The case-side pedestal 45b is formed by integral molding with the case 13.

[0045] Furthermore, between one case-side pedestal 45b and the drive element 31b, a heat dissipation gel 47 is disposed so as to be in contact with the one case-side pedestal 45b and the drive element 31b. Similarly, between the other case-side pedestal 45b and the second substrate 35, a heat dissipation gel 47 is disposed so as to be in contact with the other case-side pedestal 45b and the second substrate 35.

[0046] In addition, on the inner surface of the second substrate 35, well-known inserted and mounted components 51 are attached in addition to the drive elements 31b. As shown in FIG. 3, the back side of the first substrate 33 (i.e., the side opposite to the connector 5) and the back side of the second substrate 35 are connected by a well-known flexible substrate 37. That is, the wiring pattern of the first substrate 33 and the wiring pattern of the second substrate 35 are electrically connected by lead wires (not shown) of the flexible substrate 37.

[0047] <Heat dissipation part> As shown in FIGS. 3 to 5, a heat dissipation part 21 is arranged from the inner surface of the cover side wall 19 toward the case side wall 25.

[0048] The heat dissipation part 21 is integrally formed with the cover 11, and the cover 11 and the heat dissipation part 21 are an integral (i.e., single) member. Therefore, the material of the heat dissipation part 21 is the same as the material of the cover 11.

[0049] When viewed from the Z-axis direction, it is desirable for the heat dissipation part 21 to cover the first substrate 33 and the second substrate 35 with the largest possible area respectively. Here, for example, it covers more than half of the area of each substrate 33, 35. Further, when viewed from the Z-axis direction, it is desirable for the heat dissipation part 21 to cover as many as possible the electronic components 31 mounted on each substrate 33, 35. Here, for example, it covers all the electronic components 31. ru As much as possible is preferably covered. Here, for example, it covers all the electronic components 31.

[0050] The tip of the heat dissipation part 21 is placed on the upper surface 26a of the housing pedestal 26. Note that the tip of the heat dissipation part 21 may be fixed to the housing pedestal 26 with an adhesive or the like. On the surface of the heat dissipation part 21 on the side of the second substrate 35, at the position closest to the drive elements 31b respectively mounted on the outer surface and the inner surface of the second substrate 35, that is, at the position where each drive element 31b is projected in the Z-axis direction, heat dissipation pedestals 45 (i.e., heat dissipation side pedestals 45c) protruding toward the second substrate 35 are respectively provided. The heat dissipation side pedestals 45c are formed by integral molding with the heat dissipation part 21 and the cover 11.

[0051] Furthermore, a heat dissipation gel 47 is disposed between one heat dissipation side pedestal 45c and the second substrate 35 so as to be in contact with the one heat dissipation side pedestal 45c and the second substrate 35. Similarly, a heat dissipation gel 47 is disposed between the other heat dissipation side pedestal 45c and the drive element 31b so as to be in contact with the other heat dissipation side pedestal 45c and the drive element 31b.

[0052] Although not shown, one or a plurality of heat dissipation pedestals 45 protruding toward the first substrate 33 side may be provided on the surface of the heat dissipation part 21 on the first substrate 33 side. Then, the heat dissipation pedestal 45 and the control processing element 31a on the inner surface of the first substrate 33 may be connected by the heat dissipation gel 47, or the heat dissipation pedestal 45 and the inner surface of the first substrate 33 may be connected by the heat dissipation gel 47.

[0053] <Connector> As shown in FIG. 3, the connector 5 is a member that electrically connects the outside of the electronic control device 1 and the second substrate 35, and a plurality of lead terminals 53 are arranged so as to penetrate the resin-made base 5a. The tip of the lead terminal 53 extends into the housing 3 and is electrically connected to the wiring pattern of the second substrate 35 through the conductive connection part 54.

[0054] [1-3. Manufacturing method] Next, a method for manufacturing the electronic control device 1 will be described with reference to FIGS. 6 to 11. (1) First, as shown in FIG. 6, a paste 15a serving as a sealing material 15 is applied to the case 13. The position where the paste 15a is applied is the position where the case 13 and the cover 11 are closely joined when the cover 11 is assembled to the case 13 (that is, the position where the case 13 and the sealing material 15 would be in contact if there were no sealing material 15). Also, the paste 15a is applied to the position where the case 13 and the connector 5 are joined when the connector 5 is assembled to the opening 7 of the housing 3.

[0055] Also, a heat dissipation gel 47 is applied to the tip of each case-side pedestal 45b. (2) Next, as shown in FIG. 7, the second substrate 35 and the case 13 (that is, the case bottom 23) are fixed by a fixing member 43.

[0056] At the same time, the heat dissipation gel 47 on each case side pedestal 45b at the bottom of the case 23 is respectively pressed and fixed by the drive element 31b on the outer surface of the second substrate 35 and the outer surface of the second substrate 35. The first substrate 33 and the second substrate 35 are previously connected by a flexible substrate 37. Further, a control processing element 31a is mounted on the first substrate 33, and a drive element 31b and an insertion-mounted component 51 are mounted on the second substrate 35.

[0057] Furthermore, since a connector 5 is previously connected to the second substrate 35, when the second substrate 35 is fixed to the case 13, the connector 5 is also fixed to the case 13. At this time, the case 13 and the connector 5 are joined by the paste 15a applied to the opening 7.

[0058] (3) Next, as shown in FIG. 8, heat dissipation gel 47 is applied to the tip of each heat dissipation side pedestal 45c of the heat dissipation part 21 of the cover 11. (4) Next, as shown in FIG. 9, heat dissipation gel 47 is applied to the outer surface of the first substrate 33. That is, heat dissipation gel 47 is applied to a position opposite to the inner surface where the control processing element 31a is arranged.

[0059] (5) Next, as shown in FIG. 10, the first substrate 33 and the cover 11 are fixed with a fixing member 43. At the same time, the heat dissipation gel 47 on the first substrate 33 is fixed with the cover side pedestal 45a. (6) Next, as shown in FIG. 11, the flexible substrate 37 is bent into a U shape, and the case 13 and the cover 11 are assembled and joined with the paste 15a. That is, they are fixed with a sealing material 15 formed by curing the paste 15a. Since the paste 15a is applied to the portion where the connector 5 of the cover 11 is joined, when the case 13 and the cover 11 are assembled to form the housing 3, the connector 5 is also integrally fixed to the housing 3 by the sealing material 15.

[0060] At the same time, the heat dissipation gel 47 on each heat dissipation side pedestal 45c is fixed by the second substrate 33 and the drive element 31b on the inner surface of the second substrate 33, respectively. In this way, the electronic control device 1 is manufactured.

[0061] [1-4. Effects] In the present embodiment, the following operational effects can be obtained. (1a) In the present embodiment, the electronic control device 1 includes a heat dissipation portion 21 integrally formed with the cover 11 of the housing 3 in the space between the first substrate 33 and the second substrate 35 facing each other.

[0062] With such a configuration, in the present embodiment, the heat dissipation performance of the electronic components 31 and the respective substrates 33 and 35 disposed inside the housing 3 can be enhanced, and the occurrence of problems due to the heat of the electronic components 31 and the respective substrates 33 and 35 can be suppressed.

[0063] Specifically, in the present embodiment, since the heat dissipation portion 21 is disposed between the first substrate 33 and the second substrate 35 facing each other, when the temperature of the electronic components 31 mounted on the respective substrates 33 and 35 and the respective substrates 33 and 35 rises, the heat of the electronic components 31 and the respective substrates 33 and 35 can be released to the heat dissipation portion 21.

[0064] Furthermore, since the heat dissipation portion 21 is integrally formed with the cover 11 of the housing 3, the heat of the electronic components 31 and the respective substrates 33 and 35 can be efficiently released to the cover 11 side (i.e., dissipated) through the heat dissipation portion 21, and can also be dissipated from the cover 11 (i.e., the housing 3) to the surrounding atmosphere side.

[0065] Also, even if heat cannot be dissipated from the housing 3 to the surrounding atmosphere side, the heat of the electronic components 31 and the respective substrates 33 and 35 can be absorbed (i.e., heat absorption) by the heat dissipation portion 21, so it is possible to suppress the temperature rise of the electronic components 31 and the respective substrates 33 and 35.

[0066] Therefore, in the present embodiment, it is possible to suppress the excessive temperature rise of the electronic components 31 mounted on the respective substrates 33 and 35, and thus it is possible to suppress the occurrence of problems such as the operation of the electronic components 31 (for example, the control processing element 31a) becoming unstable.

[0067] Moreover, in the present embodiment, since the temperature of each of the substrates 33 and 35 themselves can be suppressed from rising excessively (for example, rising above the glass transition point), it is possible to suppress the occurrence of problems such as changes in the characteristics of each of the substrates 33 and 35.

[0068] Thus, in the present embodiment, there is a remarkable effect that the electronic component 31 and each of the substrates 33 and 35 can be suppressed from being adversely affected by heat (that is, by excessive temperature rise). (1b) In the present embodiment, the first substrate 33 on which the control processing element 31a, which is the electronic component 31, is mounted is in contact with the cover 11 via the heat dissipation gel 47. Further, the drive element 31b, which is the electronic component 31, is in contact with the case 13 and the heat dissipation part 21 via the heat dissipation gel 47. Furthermore, the second substrate 35 on which the drive element 31b is mounted is in contact with the case 13 and the heat dissipation part 21 via the heat dissipation gel 47.

[0069] Therefore, compared with the case where the heat dissipation gel 47 is not used, the heat dissipation performance of the electronic component 31, the first substrate 33, and the second substrate 35 can be enhanced. Thus, it is possible to suppress the temperature rise of the control processing element 31a, which is liable to be adversely affected by heat, and accordingly, it is possible to suppress a decrease in function or the like of the control processing element 31a due to heat. Also, it is possible to suppress changes in characteristics or the like of each of the substrates 33 and 35 due to excessive temperature rise.

[0070] Note that the drive element 31b generally generates more heat than the control processing element 31a, and the control processing element 31a generally has a characteristic that it is more liable to be adversely affected by heat, such as a decrease in function, than the drive element 31b. However, according to the present embodiment, problems of the control processing element 31a due to heat can be effectively suppressed.

[0071] (1c) In the present embodiment, as described above (for example, refer to FIG. 12), the heat dissipation part 21 is integrally formed with the cover 11. Further, a control circuit 39 having the control processing element 31a with a small heat generation amount is provided on the first substrate 33 fixed to the cover 11, and a drive circuit 41 having the drive element 31b with a large heat generation amount is provided on the second substrate 35 fixed to the case 13.

[0072] Moreover, the second substrate 35 provided with the drive circuit 41 is connected to the heat dissipation side pedestal 45c of the heat dissipation part 21 integrally formed with the cover 11 and the case side pedestal 45b of the case 13 via a heat dissipation gel 47, respectively. In FIG. 12, the heat flow is indicated by an arrow.

[0073] That is, since the control processing element 31a generates less heat than the drive element 31b, the cover 11 to which the first substrate 33 on which the control processing element 31a is mounted is fixed has a lower temperature rise than the case 13 to which the second substrate 35 on which the drive element 31b is mounted is fixed. Therefore, the heat dissipated from the drive element 31b through the heat dissipation part 21 is efficiently released to the outside through the cover 11 whose temperature hardly rises.

[0074] In addition, since the drive elements 31b with a large amount of heat generation are collectively arranged on the second substrate 35, there is an effect that heat can be effectively dissipated by the case 13 and the heat dissipation part 21. That is, there is an advantage of high heat dissipation efficiency.

[0075] (1d) In the present embodiment, since the tip of the heat dissipation part 21 having a cantilever beam configuration is supported by the housing pedestal 26, the vibration of the heat dissipation part 21 can be suppressed. (1e) In the present embodiment, since the housing pedestal 26 is integrally formed with the case 13, the housing pedestal 26 has high strength and, moreover, has an advantage that it can be easily manufactured (that is, the manufacturing process can be reduced).

[0076] [1-5. Correspondence of Phrases] In the relationship between the present embodiment and the present disclosure, the electronic control device 1 corresponds to the electronic control device, the housing 3 corresponds to the housing, the cover 11 corresponds to the heat dissipation side housing, the case 13 corresponds to the separate housing, the heat dissipation part 21 corresponds to the heat dissipation part, the housing pedestal 26 corresponds to the pedestal provided on the separate housing, the electronic component 31 corresponds to the electronic component, the first substrate 33 and the second substrate 35 correspond to the plurality of substrates, the flexible substrate 37 corresponds to the flexible substrate, the control circuit 39 corresponds to the control circuit, the drive circuit 41 corresponds to the drive circuit, and the heat dissipation gel 47 corresponds to the heat dissipation gel.

[0077] [2. Other Embodiments] As described above, the embodiments of the present disclosure have been described. However, the present disclosure is not limited to the above-described embodiments and can be implemented in various modifications.

[0078] (2a) As the material constituting the housing, metals such as aluminum or aluminum alloys with excellent heat dissipation properties (i.e., high thermal conductivity) can be adopted, but other materials with excellent heat dissipation properties can also be adopted. For example, a composite material in which a resin contains a ceramic or the like with a high thermal conductivity may be adopted. Note that the thermal conductivity of the material constituting the housing is at least greater than that of air, and preferably greater than that of each substrate.

[0079] (2b) The housing can be composed of a plurality of members like the cover or case of the above-described embodiment. Note that the plurality can be two or more, but the housing may be composed of a single member.

[0080] (2c) When the housing is integrally composed of a plurality of members, it can be joined using a sealing material having jointing properties and sealing properties as in the above-described embodiment, but it may be integrally formed by other methods. For example, a plurality of members may be integrally joined using an adhesive. Also, a plurality of members may be integrally joined using well-known coupling members such as bolts and nuts.

[0081] (2d) As in the above-described embodiment, for example, the housing and the heat dissipation part may be integrally molded by casting, but the housing and the heat dissipation part manufactured separately may also be integrally configured. For example, the heat dissipation part may be integrally joined to the housing by welding or the like. Also, the housing and the heat dissipation part may be joined by an adhesive having a high thermal conductivity. Further, the housing and the heat dissipation part may be connected using well-known coupling members such as bolts and nuts.

[0082] (2e) As the material of the heat radiating part, the same material as that of the housing is preferable, but even if it is a different material, a material having a high thermoelectric power factor can be adopted in the same manner as the housing. That is, any material can be used as long as it can absorb heat from the substrate and electronic components and radiate the heat to the housing side.

[0083] (2f) The heat radiating part is integrally formed with the housing. However, when the housing is composed of a plurality of members, it may be integrally formed with at least one member (for example, a cover or a case).

[0084] (2g) The number of heat radiating parts is not limited to one as in the above embodiment, and a plurality of heat radiating parts can be adopted. For example, two or more heat radiating parts may be arranged in parallel between the first substrate and the second substrate.

[0085] (2h) As the shape of the heat radiating part, various shapes such as a columnar shape or a block shape can be adopted in addition to a plate shape. (2i) A plurality of functions of one component in the above embodiment may be realized by a plurality of components, or one function of one component may be realized by a plurality of components. Also, a plurality of functions of a plurality of components may be realized by one component, or one function realized by a plurality of components may be realized by one component. Further, a part of the configuration of the above embodiment may be omitted. Also, at least a part of the configuration of the above embodiment may be added to or replaced with the configuration of another above embodiment.

Explanation of Reference Numerals

[0086] 1: Electronic control device 1, 3: Housing, 11: Cover, 13: Case, 21: Heat radiating part, 26: Housing pedestal, 31: Electronic component, 31a: Control processing element, 31b: Driving element, 33: First substrate, 35: Second substrate, 37: Flexible substrate, 39: Control circuit, 41: Driving circuit, 47: Heat radiating gel

Claims

1. An electronic control device (1) comprising a housing (3), having a configuration in which a plurality of substrates (33, 35) on which electronic components (31) are arranged are accommodated in the housing, and a heat radiating portion (21) integrally formed with the housing and capable of radiating heat to the housing side is provided in a space between the substrates facing each other, with respect to one of the substrates facing each other, at least one of the substrate and the electronic components arranged on the substrate is in contact with the heat radiating portion via a heat radiating gel (47), with respect to the other of the substrates facing each other, the substrate, the electronic components arranged on the substrate, and the heat radiating portion are configured not to be in contact with each other with a space therebetween in the housing, An electronic control device.

2. The electronic control device according to claim 1, the other of the substrates facing each other is a first substrate (33) on which a control circuit (39) is mounted, and one of the substrates facing each other is a second substrate (35) on which a drive circuit (41) having a larger heat generation amount than the control circuit is mounted. An electronic control device.

3. An electronic control device (1) comprising a housing (3), having a configuration in which a plurality of substrates (33, 35) on which electronic components (31) are arranged are accommodated in the housing, and a heat radiating portion (21) integrally formed with the housing and capable of radiating heat to the housing side is provided in a space between the substrates facing each other, the housing includes a heat radiating side housing (11) in which the heat radiating portion is integrally formed, and a separate housing (13) different from the heat radiating side housing, when the substrates facing each other are a first substrate (33) on which a control circuit (39) is mounted and a second substrate (35) on which a drive circuit (41) having a larger heat generation amount than the control circuit is mounted, the first substrate is attached to the heat radiating side housing, and the second substrate is attached to the separate housing, Electronic control device.

4. An electronic control device (1) including a housing (3), having a configuration in which a plurality of substrates (33, 35) on which electronic components (31) are arranged are accommodated in the housing, and a heat radiating portion (21) that is integrally formed with the housing and is capable of radiating heat to the housing side is provided in a space between the substrates facing each other, the housing includes a heat radiating side housing (11) in which the heat radiating portion is integrally formed, and a different housing (13) from the heat radiating side housing, an end portion different from a portion of the heat radiating portion that is integrated with the heat radiating side housing is configured to be supported by a pedestal (26) provided on the different housing, Electronic control device.

5. The electronic control device according to claim 4, when the substrates facing each other are a first substrate (33) on which a control circuit (39) is mounted and a second substrate (35) on which a drive circuit (41) having a larger heat generation amount than the control circuit is mounted, the first substrate is attached to the heat radiating side housing, and the second substrate is attached to the different housing, Electronic control device.

6. The electronic control device according to claim 4 or claim 5, the pedestal is integrally formed with the different housing, Electronic control device.

7. The electronic control device according to any one of claims 3 to 6, at least one of the electronic component and the substrate is brought into contact with the heat radiating portion via a heat radiating gel (47), Electronic control device.

8. The electronic control device according to any one of claims 3 to 7, when the substrate is attached to the different housing, The electronic component mounted on the heat dissipation part side of the substrate and at least one of the substrates, and the heat dissipation part are brought into contact via a heat dissipation gel. Electronic control device.

9. An electronic control device according to any one of claims 1 to 8, The mutually facing substrates are connected by a flexible substrate (37). Electronic control device.

10. In a method for manufacturing an electronic control device (1) provided with a housing (3), When providing a configuration in which a plurality of substrates (33, 35) on which electronic components (31) are arranged are accommodated in the housing, A method for manufacturing an electronic control device, wherein a heat dissipation part (21) integrally formed with the housing and capable of dissipating heat to the housing side is arranged in a space between the mutually facing substrates. For one of the mutually facing substrates, at least one of the substrate and the electronic component arranged on the substrate and the heat dissipation part are brought into contact via a heat dissipation gel (47), For the other of the mutually facing substrates, the substrate, the electronic component arranged on the substrate, and the heat dissipation part are arranged in the housing so as not to be in contact with a space therebetween. Method for manufacturing an electronic control device.

11. When manufacturing an electronic control device (1) provided with a housing (3), a configuration is provided in which a plurality of substrates (33, 35) on which electronic components (31) are arranged are accommodated in the housing, and a heat dissipation part (21) integrally formed with the housing and capable of dissipating heat to the housing side is arranged in a space between the mutually facing substrates. A method for manufacturing an electronic control device, As the housing, a heat dissipation side housing (11) in which the heat dissipation part is integrally formed and a different housing (13) from the heat dissipation side housing are used. As the mutually facing substrates, a first substrate (33) on which a control circuit (39) is mounted and a second substrate (35) on which a drive circuit (41) having a larger heat generation amount than the control circuit are used. Attach the first substrate to the heat dissipation side housing and attach the second substrate to the separate housing. A method for manufacturing an electronic control device.

12. When manufacturing an electronic control device (1) provided with a housing (3), a configuration is adopted in which a plurality of substrates (33, 35) on which electronic components (31) are arranged are accommodated in the housing, and a heat dissipation part (21) that is integrally formed with the housing and can dissipate heat to the housing side is arranged in the space between the substrates facing each other. A method for manufacturing an electronic control device, As the housing, a housing is used that includes a heat dissipation side housing (11) in which the heat dissipation part is integrally formed and a separate housing (13) different from the heat dissipation side housing. Configure so that an end portion different from the portion of the heat dissipation part that is integrated with the heat dissipation side housing is supported by a pedestal (26) provided on the separate housing. A method for manufacturing an electronic control device.

13. A method for manufacturing an electronic control device according to claim 11 or claim 12, Connect one of the substrates facing each other and the other substrate by a flexible substrate, With the flexible substrate bent and the one substrate and the other substrate arranged in parallel, arrange the flexible substrate, the one substrate, and the other substrate in the housing, and arrange the heat dissipation part between the one substrate and the other substrate. A method for manufacturing an electronic control device.

14. A method for manufacturing an electronic control device according to claim 13, Bring at least one of the one substrate, the electronic components mounted on the one substrate, the other substrate, and the electronic components mounted on the other substrate into contact with the heat dissipation part via a heat dissipation gel. A method for manufacturing an electronic control device.

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