Multilayer ceramic electronic component

Abstract

To provide a multilayer ceramic electronic component having excellent reliability.SOLUTION: The present invention provides a multilayer ceramic electronic component including: a ceramic body including a dielectric layer, and a first internal electrode and a second internal electrode disposed to face each other with the dielectric layer interposed therebetween; and a first external electrode electrically connected to the first internal electrode, and a second external electrode electrically connected to the second internal electrode, the first and second external electrodes being disposed outside the ceramic body. Each of the first and second external electrodes includes a first electrode layer including a conductive metal and a plating layer disposed on the first electrode layer. The first electrode layer includes a first area where the plating layer is disposed on the upper part and a second area disposed to extend from the first area. An insulating layer is disposed to cover the second area of the first electrode layer. The ratio L / BW of a distance L of the insulating layer between both edges of the ceramic body in a width direction to a distance BW from one edge of the first electrode layer to the other edge on first and second surfaces of the ceramic body satisfies 0.40≤L / BW≤4.00.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The present invention relates to a multilayer ceramic electronic component, and more specifically, to a multilayer ceramic electronic component with excellent reliability.

Background Art

[0002] Recently, as the mounting density of substrates has increased, the need to reduce the mounting area of multilayer ceramic capacitors has been increasing. Therefore, there is an increasing demand for products that embed the multilayer ceramic capacitor by reducing its thickness into the substrate or mount it in the LSC type at the lower end of the AP.

[0003] In the above method, not only the mounting area is reduced, but also the effect on reducing the ESL generated in the substrate is significant. Therefore, the fact is that the demand for multilayer ceramic capacitor products with a thin thickness is increasing.

[0004] Since the thickness of the thin multilayer ceramic capacitor is limited, the thickness of the external electrode cannot be increased beyond a certain thickness.

[0005] As a result, there is a problem that the thickness of the external electrode decreases and the moisture resistance reliability inevitably weakens.

[0006] In particular, in the case of LICC (Low Inductance Chip Capacitor) products, since the distance between the external electrodes decreases, the problem of deterioration of moisture resistance reliability becomes more prominent.

[0007] Therefore, in the case of thin film multilayer ceramic capacitors and LICC (Low Inductance Chip Capacitor) products with a thickness of 110 μm or less, there is a need for research on a structure that can improve moisture resistance reliability.

Prior Art Documents

Patent Documents

[0008] Patent Document 1 Republic of Korea Patent Publication No. 2014-0085097 SUMMARY OF THE INVENTION PROBLEMS TO BE SOLVED BY THE INVENTION

[0009] The present invention relates to a multilayer ceramic electronic component, and more specifically, to a multilayer ceramic electronic component with excellent reliability. MEANS FOR SOLVING THE PROBLEMS

[0010] One embodiment of the present invention includes a dielectric layer, a first internal electrode and a second internal electrode which are arranged to face each other with the dielectric layer interposed therebetween, a first surface and a second surface facing each other, a third surface and a fourth surface connected to the first surface and the second surface and facing each other, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and facing each other, a ceramic body having the surfaces, a first external electrode arranged outside the ceramic body and electrically connected to the first internal electrode, and a second external electrode electrically connected to the second internal electrode, wherein the first and second external electrodes each include a first electrode layer containing a conductive metal and a plating layer arranged on the first electrode layer, the first electrode layer is composed of a first region where the plating layer is arranged on the upper part and a second region extending from the first region, an insulating layer is arranged to cover the second region of the first electrode layer, and a laminated ceramic electronic component is provided in which the ratio L / BW of the distance L of the insulating layer between both end portions in the width direction of the ceramic body to the distance BW from one end portion of the first electrode layer to the other end portion arranged on the first surface and the second surface of the ceramic body satisfies 0.40 ≦ L / BW ≦ 4.00.

[0011] Another embodiment of the present invention includes a dielectric layer, a first internal electrode and a second internal electrode which are arranged to face each other with the dielectric layer interposed therebetween, a first surface and a second surface facing each other, a third surface and a fourth surface connected to the first surface and the second surface and facing each other, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and facing each other of a ceramic body, a first external electrode arranged outside the ceramic body and electrically connected to the first internal electrode, and a second external electrode electrically connected to the second internal electrode, wherein the first external electrode is arranged on the first surface and the second surface of the ceramic body, the first external electrode arranged on the first surface and the first external electrode arranged on the second surface are connected to each other through a first via penetrating through the inside of the ceramic body, the second external electrode is arranged on the first surface and the second surface of the ceramic body, the second external electrode arranged on the first surface and the second external electrode arranged on the second surface are connected to each other through a second via penetrating through the inside of the ceramic body, the first and second external electrodes each include a first electrode layer containing a conductive metal, and a plating layer arranged on the first electrode layer, the first electrode layer is composed of a first region where the plating layer is arranged on the upper part, and a second region extending from the first region, an insulating layer is arranged to cover the second region of the first electrode layer, and a laminated ceramic electronic component is provided in which a ratio L / BW of the distance L of the insulating layer between both end portions in the width direction of the ceramic body to the distance BW from one end portion of the first electrode layer to the other end portion arranged on the first surface and the second surface of the ceramic body satisfies 0.40 ≦ L / BW ≦ 4.00.

Advantages of the Invention

[0012] According to an embodiment of the present invention, by adjusting the ratio of the distance L of the insulating layer between both end portions in the width direction of the ceramic body to the width BW of the first electrode layer (fired electrode) region arranged on the first surface and the second surface of the ceramic body, the moisture resistance reliability of a laminated ceramic capacitor with a thin thickness can be improved, and a short circuit between external electrodes during mounting can be prevented.

Brief Description of the Drawings

[0013]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Mode for Carrying Out the Invention

[0014] Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Also, the embodiments of the present invention are provided to more fully explain the present invention to those having average knowledge in the technical field. Therefore, the shape and size of elements in the drawings may be enlarged or reduced (or emphasized or simplified) for clearer explanation, and elements denoted by the same reference numerals in the drawings are the same elements.

[0015] Also, throughout the specification, stating that a certain component "includes" means that, unless otherwise stated to the contrary, it does not exclude other components but can further include other components.

[0016] Note that, to clearly explain the present invention, parts not related to the explanation in the drawings are omitted, the thickness is enlarged to clearly show various layers and regions, and components having the same function within the scope of the same concept are explained using the same reference numerals.

[0017] Hereinafter, preferred embodiments of the present invention will be described with reference to FIGS. 1 to 4.

[0018] FIG. 1 is a perspective view showing a multilayer ceramic capacitor according to an embodiment of the present invention, FIG. 2 is a schematic view showing a ceramic body according to an embodiment of the present invention, FIG. 3 is an exploded perspective view of FIG. 2, and FIG. 4 is a cross-sectional view taken along line I-I' of FIG. 1.

[0019] Referring to FIGS. 1 to 4, a multilayer ceramic electronic component 100 according to an embodiment of the present invention has a dielectric layer 111 and includes a first internal electrode 121 and a second internal electrode 122 that are disposed to face each other with the dielectric layer 111 interposed therebetween. The multilayer ceramic electronic component 100 has a first surface S1 and a second surface S2 that face each other, a third surface S3 and a fourth surface S4 that are connected to the first surface S1 and the second surface S2 and face each other, and a fifth surface S5 and a sixth surface S6 that are connected to the first surface S1 to the fourth surface S4 and face each other. The multilayer ceramic electronic component 100 includes a ceramic body 110 and first and second external electrodes 131 and 132 that are disposed outside the ceramic body 110 and are electrically connected to the first internal electrode 121 and the second internal electrode 122, respectively. The first and second external electrodes 131 and 132 each include a first electrode layer 131a and 132a containing a conductive metal and plating layers 131b, 132b, 131c, and 132c disposed on the first electrode layers 131a and 132a. The first electrode layers 131a and 132a are composed of first regions 131a1 and 132a1 on which the plating layers 131b, 132b, 131c, and 132c are disposed and second regions 131a2 and 132a2 that extend from the first regions 131a1 and 132a1. An insulating layer 150 is disposed so as to cover the second regions 131a2 and 132a2 of the first electrode layers 131a and 132a.

[0020] Hereinafter, when describing a multilayer ceramic electronic component according to an embodiment of the present invention, a multilayer ceramic capacitor will be described as an example, but the present invention is not limited thereto.

[0021] In the multilayer ceramic capacitor 100 according to an embodiment of the present invention, the "length direction" can be defined as the "L" direction in FIG. 1, the "width direction" can be defined as the "W" direction, and the "thickness direction" can be defined as the "T" direction. Here, the "thickness direction" can be used in the same concept as the direction in which the dielectric layers are stacked, that is, the "stacking direction".

[0022] The shape of the ceramic body 110 is not particularly limited, but as shown in the drawings, it can be a hexahedron shape.

[0023] The ceramic body 110 can have a first surface S1 and a second surface S2 facing each other, a third surface S3 and a fourth surface S4 connecting the first surface S1 and the second surface S2, and a fifth surface S5 and a sixth surface S6 connected to the first surface S1 to the fourth surface S4 and facing each other.

[0024] The first surface S1 and the second surface S2 can be defined as the surfaces facing each other in the thickness direction of the ceramic body 110, the third surface S3 and the fourth surface S4 can be defined as the surfaces facing each other in the length direction, and the fifth surface S5 and the sixth surface S6 can be defined as the surfaces facing each other in the width direction.

[0025] The shape of the ceramic body 110 is not particularly limited, but as shown in the drawings, it can have a rectangular parallelepiped shape.

[0026] One ends of the plurality of internal electrodes 121 and 122 formed inside the ceramic body 110 are exposed on the fifth surface S5 or the sixth surface S6 of the ceramic body.

[0027] The internal electrodes 121 and 122 can be a pair of a first internal electrode 121 and a second internal electrode 122 having different polarities from each other.

[0028] One end of the first internal electrode 121 can be exposed on the fifth surface S5, and one end of the second internal electrode 122 can be exposed on the sixth surface S6.

[0029] The other ends of the above-described first internal electrode 121 and second internal electrode 122 are formed at a certain interval from the sixth surface S6 or the fifth surface S5. More specific matters regarding this will be described later.

[0030] On the fifth surface S5 and the sixth surface S6 of the ceramic body, first and second external electrodes 131 and 132 are formed and can be electrically connected to the internal electrodes.

[0031] According to an embodiment of the present invention, the material for forming the dielectric layer 111 is not particularly limited as long as sufficient capacitance can be obtained. For example, it can be barium titanate (BaTiO3) powder.

[0032] The material for forming the dielectric layer 111 can be added with various ceramic additives, organic solvents, plasticizers, binders, dispersants, etc. to powders such as barium titanate (BaTiO3) according to the object of the present invention.

[0033] Such a ceramic body 110 can be composed of an active part A as a part contributing to the formation of the capacitance of the capacitor and upper and lower cover parts C formed at the upper and lower parts of the active part A as upper and lower margin parts.

[0034] The above-described active part A can be formed by repeatedly laminating a plurality of first and second internal electrodes 121 and 122 with the dielectric layer 111 interposed therebetween.

[0035] The above-described upper and lower cover parts C can have the same material and configuration as the dielectric layer 111 except that they do not contain internal electrodes.

[0036] That is, the above-described upper and lower cover parts C can contain a ceramic material. For example, they can contain a barium titanate (BaTiO3)-based ceramic material.

[0037] The upper and lower cover portions C can be formed by laminating a single dielectric layer or two or more dielectric layers in the vertical direction on the upper and lower surfaces of the active portion A, and basically can play a role in preventing damage to the internal electrodes due to physical or chemical stress.

[0038] The materials for forming the first and second internal electrodes 121 and 122 are not particularly limited, and for example, can be formed using a conductive paste containing one or more substances among silver (Ag), lead (Pb), platinum (Pt), nickel (Ni), and copper (Cu).

[0039] The multilayer ceramic capacitor according to an embodiment of the present invention can include a first external electrode 131 electrically connected to the first internal electrode 121 and a second external electrode 132 electrically connected to the second internal electrode 122.

[0040] The first and second external electrodes 131 and 132 can be electrically connected to the first and second internal electrodes 121 and 122 to form a capacitance, and the second external electrode 132 can be connected to a potential different from that of the first external electrode 131.

[0041] The first internal electrode and the second internal electrodes 121 and 122 are arranged to face each other with the dielectric layer 111 interposed therebetween, and can be alternately exposed on the fifth surface S5 or the sixth surface S6 in the width direction of the ceramic body 110.

[0042] Since the first internal electrode and the second internal electrodes 121 and 122 are alternately exposed on the fifth surface S5 or the sixth surface S6 in the width direction of the ceramic body 110, as will be described later, an RGC (Reverse Geometry Capacitor) or an LICC (Low Inductance Chip Capacitor) can be realized.

[0043] In general multilayer ceramic electronic components, external electrodes can be arranged on end faces facing each other in the length direction of the ceramic body.

[0044] In this case, when an alternating current is applied to the external electrodes, since the current path is long, a large current loop may be formed, and the magnitude of the induced magnetic field may increase, potentially increasing the inductance.

[0045] According to an embodiment of the present invention, in order to shorten the current path, the first and second external electrodes 131 and 132 can be disposed on the fifth surface S5 and the sixth surface S6 facing each other in the width direction of the ceramic body 110.

[0046] In this case, since the distance between the first and second external electrodes 131 and 132 is small, the current path becomes short, thereby reducing the current loop and decreasing the inductance.

[0047] The first and second external electrodes 131 and 132 are respectively disposed on the fifth surface S5 and the sixth surface S6 in the width direction of the ceramic body 110, and can be extended and disposed on the first surface S1 and the second surface S2 in the thickness direction of the ceramic body 110.

[0048] According to an embodiment of the present invention, the areas of the first and second external electrodes 131 and 132 disposed on the first surface S1 and the second surface S2 in the thickness direction of the ceramic body 110 can each occupy 50% or more of the areas of the first surface S1 and the second surface S2 of the ceramic body 110.

[0049] The first and second external electrodes 131 and 132 each include a first electrode layer 131a and 132a containing a conductive metal, and plating layers 131b, 132b, 131c, and 132c disposed on the first electrode layers 131a and 132a. The first electrode layers 131a and 132a are composed of a first region 131a1 and 132a1 where the plating layers 131b, 132b, 131c, and 132c are disposed on the upper part, and a second region 131a2 and 132a2 extending from the first regions 131a1 and 132a1. An insulating layer 150 is disposed to cover the second regions 131a2 and 132a2 of the first electrode layers 131a and 132a.

[0050] Referring to FIG. 4, the plating layer can have a two-layer structure, and includes a first plating layer 131b, 132b containing nickel (Ni), and a second plating layer 131c, 132c disposed on the first plating layer 131b, 132b and containing tin (Sn), but is not necessarily limited thereto.

[0051] The first electrode layers 131a, 132a can include a conductive metal and glass.

[0052] To form a capacitance, the first and second external electrodes 131, 132 can be formed on the fifth surface S5 and the sixth surface S6 in the width direction of the ceramic body 110, respectively, and the first electrode layers 131a, 132a included in the first and second external electrodes 131, 132 can be electrically connected to the first and second internal electrodes 121, 122.

[0053] The first electrode layers 131a, 132a can be formed of a conductive material having the same material as the first and second internal electrodes 121, 122, but is not limited thereto. For example, it can include one or more conductive metals selected from the group consisting of copper (Cu), silver (Ag), nickel (Ni), and alloys thereof.

[0054] The first electrode layers 131a, 132a can be formed by applying a conductive paste provided by adding glass frit to the conductive metal powder and then firing.

[0055] That is, the first electrode layers 131a, 132a can be fired electrode layers including a conductive metal and glass.

[0056] The plating layer including the first plating layer 131b, 132b containing nickel (Ni) and the second plating layer 131c, 132c disposed on the first plating layer 131b, 132b and containing tin (Sn) is disposed so as to cover a part of the first electrode layers 131a, 132a.

[0057] That is, according to one embodiment of the present invention, the first electrode layers 131a and 132a are composed of a first region 131a1 and 132a1 in which plating layers 131b, 132b, 131c, and 132c are disposed on the upper portion, and a second region 131a2 and 132a2 that extends from the first regions 131a1 and 132a1 and is disposed.

[0058] No plating layer is disposed on the upper portion of the second regions 131a2 and 132a2 of the first electrode layers 131a and 132a.

[0059] Thus, when no plating layer is disposed on the upper portion of the second regions 131a2 and 132a2 of the first electrode layers 131a and 132a, a problem of poor moisture resistance reliability occurs. Therefore, in one embodiment of the present invention, an insulating layer 150 is disposed so as to cover the second regions 131a2 and 132a2 of the first electrode layers 131a and 132a.

[0060] In a general capacitor structure, the first and second external electrodes are disposed at positions close to both end faces in the length direction of the ceramic body, and a plating layer is formed so as to cover the entire upper portion thereof.

[0061] In such a conventional structure, since the distance between the first and second external electrodes is too large, there is a problem that a low ESL value required under high-frequency characteristics cannot be obtained.

[0062] According to one embodiment of the present invention, in order to obtain a low ESL value, as described above, the first and second external electrodes 131 and 132 are disposed on the fifth surface S5 and the sixth surface S6 facing each other in the width direction of the ceramic body 110. However, the distance between the first and second external electrodes 131 and 132 becomes small, and as a result, poor moisture resistance reliability occurs, and there is a possibility that a short-circuit failure occurs between the first and second external electrodes 131 and 132.

[0063] In order to solve the above problems, in one embodiment of the present invention, plating layers 131b, 132b, 131c, 132c are arranged so as to cover a part of the first electrode layers 131a, 132a, and an insulating layer 150 is arranged so as to cover second regions 131a2, 132a2 of the first electrode layers 131a, 132a where the plating layers are not arranged.

[0064] That is, the first electrode layers 131a, 132a are composed of first regions 131a1, 132a1 where plating layers 131b, 132b, 131c, 132c are arranged on the upper part, and regions where the plating layers 131b, 132b, 131c, 132c are not arranged, and second regions 131a2, 132a2 which extend from the first regions 131a1, 132a1 and are arranged.

[0065] Since the upper parts of the second regions 131a2, 132a2 are exposed to the outside, problems such as moisture resistance failure and electrical short circuit failure may occur, and thus the insulating layer 150 is arranged to cover the upper parts thereof.

[0066] On the other hand, according to one embodiment of the present invention, the multilayer ceramic capacitor may have a thickness T of 110 μm or less.

[0067] Further, the ratio L / BW of the distance L of the insulating layer 150 between both ends in the width direction of the ceramic body 110 to the distance BW from one end of the first electrode layers 131a, 132a to the other end arranged on the first surface S1 and the second surface S2 of the ceramic body satisfies 0.40 ≦ L / BW ≦ 4.00.

[0068] Recently, thin multilayer ceramic capacitors with a thickness of 110 μm or less have an increasing demand because the mounting density of substrates is increasing.

[0069] However, for thin multilayer ceramic capacitors with a limited thickness, the thickness of the external electrodes cannot be increased to a certain thickness or more.

[0070] As a result, there is a problem that the thickness of the external electrode decreases and the moisture resistance reliability inevitably weakens.

[0071] In particular, in the case of LICC (Low Inductance Chip Capacitor) products like in one embodiment of the present invention, since the distance between the external electrodes decreases, the problem of the decrease in moisture resistance reliability becomes more prominent.

[0072] Therefore, as described above, in order to improve the decrease in moisture resistance reliability and the decrease in reliability due to short - circuit between external electrodes in a thin LICC (Low Inductance Chip Capacitor) product with a thickness of 110 μm or less, according to one embodiment of the present invention, the ratio of the distance L of the insulating layer 150 between both ends in the width direction of the ceramic body 110 to the distance BW from one end of the first electrode layers 131a, 132a to the other ends arranged on the first surface S1 and the second surface S2 of the ceramic body is adjusted, thereby improving problems such as moisture - related reliability degradation and short - circuit failure in a laminated ceramic capacitor with a thin thickness.

[0073] According to one embodiment of the present invention, by adjusting the ratio L / BW of the distance L of the insulating layer 150 between both ends in the width direction of the ceramic body 110 to the distance BW from one end of the first electrode layers 131a, 132a to the other ends arranged on the first surface S1 and the second surface S2 of the ceramic body to satisfy 0.40 ≦ L / BW ≦ 4.00, the moisture resistance reliability of a laminated ceramic capacitor with a thin thickness of 110 μm or less can be improved, and the short - circuit failure between external electrodes can be reduced.

[0074] Also, by applying an insulating layer outside the ceramic body 110, the breaking strength of the laminated ceramic capacitor can also be improved.

[0075] According to an embodiment of the present invention, in order to improve the moisture resistance reliability of a multilayer ceramic capacitor having a thin thickness of 110 μm or less and reduce the short-circuit failure between external electrodes, within the limited width of the ceramic body, the distance BW from one end of the first electrode layers 131a and 132a to the other ends disposed on the first surface S1 and the second surface S2 of the ceramic body, and the distance L of the insulating layer 150 between both ends in the width direction of the ceramic body 110 were derived for a preferable ratio.

[0076] According to an embodiment of the present invention, in a thin multilayer ceramic capacitor having a thickness of 110 μm or less, it is characterized by determining the ratio L / BW of the distance L of the insulating layer 150 between both ends in the width direction of the ceramic body 110 to the distance BW from one end of the first electrode layers 131a and 132a to the other ends disposed on the first surface S1 and the second surface S2 of the ceramic body. On the other hand, in a multilayer ceramic capacitor having a conventional structure with a thickness exceeding 110 μm, there may be no problem of moisture resistance or short circuit occurrence, or the numerical values of the present invention may not be applicable.

[0077] When the ratio L / BW of the distance L of the insulating layer 150 between both ends in the width direction of the ceramic body 110 to the distance BW from one end of the first electrode layers 131a and 132a to the other ends disposed on the first surface S1 and the second surface S2 of the ceramic body is less than 0.40, the distance between the external electrodes is close and the distance L between both ends of the insulating layer is short, so there is a possibility of moisture resistance failure and short circuit between the external electrodes.

[0078] On the other hand, when the ratio L / BW of the distance L of the insulating layer 150 between both ends in the width direction of the ceramic body 110 to the distance BW from one end of the first electrode layers 131a and 132a to the other ends disposed on the first surface S1 and the second surface S2 of the ceramic body exceeds 4.0, there is a possibility of moisture resistance failure, and there is a risk of mounting failure because the area of the external electrode in contact with the electrode pad during substrate mounting is small.

[0079] FIG. 5 is a perspective view showing a multilayer ceramic capacitor according to another embodiment of the present invention, and FIG. 6 is a cross-sectional view taken along line II-II' of FIG. 5.

[0080] Referring to FIGS. 5 and 6, a multilayer ceramic electronic component 200 according to another embodiment of the present invention has a dielectric layer 211, and includes a first internal electrode 221 and a second internal electrode 222 that are disposed to face each other with the dielectric layer 211 interposed therebetween. The multilayer ceramic electronic component 200 has a first surface S1 and a second surface S2 that face each other, a third surface S3 and a fourth surface S4 that are connected to the first surface S1 and the second surface S2 and face each other, and a fifth surface S5 and a sixth surface S6 that are connected to the first surface S1 to the fourth surface S4 and face each other. The multilayer ceramic electronic component 200 includes a ceramic body 210 and a first external electrode 231 and a second external electrode 232 that are disposed outside the ceramic body 210 and are electrically connected to the first internal electrode 221 and the second internal electrode 222, respectively. The first external electrode 231 is disposed on the first surface S1 and the second surface S2 of the ceramic body 210. The first external electrode 231 disposed on the first surface and the first external electrode 231 disposed on the second surface are connected to each other through a first via 241 penetrating through the inside of the ceramic body 210. The second external electrode 232 is disposed on the first surface and the second surface of the ceramic body 210. The second external electrode 232 disposed on the first surface and the second external electrode 232 disposed on the second surface are connected to each other through a second via 242 penetrating through the inside of the ceramic body 210. The first and second external electrodes 231 and 232 each include a first electrode layer 231a and 232a containing a conductive metal, and plating layers 231b, 232b, 231c, and 232c disposed on the first electrode layers 231a and 232a. The first electrode layers 231a and 232a are composed of a first region 231a1 and 232a1 on which the plating layers 231b, 232b, 231c, and 232c are disposed, and a second region 231a2 and 232a2 extending from the first regions 231a1 and 232a1. An insulating layer 250 is disposed so as to cover the second regions 231a2 and 232a2 of the first electrode layers 231a and 232a.

[0081] When compared with the structure of the multilayer ceramic capacitor according to one embodiment of the present invention, in the multilayer ceramic capacitor according to another embodiment of the present invention, the first and second external electrodes 231 and 232 are respectively disposed apart from each other on the first surface S1 and the second surface S2 of the ceramic body 210. The first external electrode 231 disposed on the first surface and the first external electrode 231 disposed on the second surface are connected to each other via a first via 241 penetrating through the inside of the ceramic body 210. The second external electrode 232 is disposed on the first surface and the second surface of the ceramic body 210. The second external electrode 232 disposed on the first surface and the second external electrode 232 disposed on the second surface are connected to each other via a second via 242 penetrating through the inside of the ceramic body 210.

[0082] The first external electrode 231 can be disposed on the first surface S1 and the second surface S2 of the ceramic body 210.

[0083] The first external electrode 231 disposed on the first surface S1 of the ceramic body 210 and the first external electrode 231 disposed on the second surface S2 can be connected to each other via a first via 241 penetrating through the inside of the ceramic body 210.

[0084] On the other hand, the second external electrode 232 can be disposed on the first surface S1 and the second surface S2 of the ceramic body 210 and spaced apart from the first external electrode 231.

[0085] According to another embodiment of the present invention, the first and second external electrodes 231 and 232 are respectively disposed apart from each other on the first surface S1 and the second surface S2 of the ceramic body 210 and disposed in the longitudinal direction of the ceramic body 210. Although not limited thereto, for example, it can be formed up to the boundary between the first surface S1 or the second surface S2 and the third surface S3 and the fourth surface S4 of the ceramic body 210.

[0086] Further, the first external electrode 231 and the second external electrode 232 can be arranged separately from each other on the first surface S1 and the second surface S2 of the ceramic body 210, and can be arranged facing each other in the width direction.

[0087] The first via 241 is connected to the first internal electrode 221 and insulated from the second internal electrode 222. Further, the second via 242 is connected to the second internal electrode 222 and insulated from the first internal electrode 221.

[0088] The first external electrode 231 arranged on the first surface S1 of the ceramic body 210 and the first external electrode 231 arranged on the second surface S2 are connected to each other via the first via 241 penetrating through the inside of the ceramic body 210. Since the first via 241 is connected to the first internal electrode 221 and insulated from the second internal electrode 222, the first external electrode 231 can be electrically connected to the first internal electrode 221.

[0089] On the other hand, the second external electrode 232 arranged on the first surface S1 of the ceramic body 210 and the second external electrode 232 arranged on the second surface S2 are connected to each other via the second via 242 penetrating through the inside of the ceramic body 210. Since the second via 242 is connected to the second internal electrode 222 and insulated from the first internal electrode 221, the second external electrode 232 can be electrically connected to the second internal electrode 222.

[0090] According to another embodiment of the present invention, the first internal electrode 221 and the second internal electrode 222 are not exposed on the side surface of the ceramic body 210, and can be connected to the first and second external electrodes 231 and 232 via the first via 241 and the second via 242 penetrating through the ceramic body 210 in the thickness direction, respectively.

[0091] In the case of the multilayer ceramic capacitor according to another embodiment of the present invention, the first external electrode 231 and the second external electrode 232 are respectively arranged separately from each other on the first surface S1 and the second surface S2 of the ceramic body 210, and are arranged facing each other in the width direction. Therefore, an RGC (Reverse Geometry Capacitor) or an LICC (Low Inductance Chip Capacitor) can be realized.

[0092] The first via 241 and the second via 242 can be formed by forming holes in the ceramic body 210 so as to penetrate the first and second internal electrodes 221 and 222 and filling them with a conductive material. Here, as the conductive material, a conductive paste can be applied or a method such as plating can be used. In this case, the holes in the ceramic body 210 can be obtained by forming them in the ceramic green sheet by a laser method, punching, or the like, or by performing hole processing on the fired laminate.

[0093] In the multilayer ceramic capacitor 200 according to another embodiment of the present invention, since the first and second internal electrodes 221 and 222 are connected to the first and second external electrodes 231 and 232 via the first via 241 and the second via 242 respectively, the area where the first and second internal electrodes 221 and 222 overlap can be maximized.

[0094] Thereby, even without applying a method such as reducing the thickness of the conventional dielectric layer and internal electrodes and increasing the number of internal electrode layers, the capacitance of the capacitor can be increased. Further, since the same type of internal electrodes are electrically connected to each other via the first via 241 and the second via 242, the connectivity of the internal electrodes can be improved even in the case of an ultra-thin film product having a thickness of 110 μm or less of the multilayer ceramic capacitor.

[0095] According to another embodiment of the present invention, the first and second external electrodes 231 and 232 include first electrode layers 231a and 232a containing a conductive metal, and plating layers 231b, 232b, 231c, and 232c disposed on the first electrode layers 231a and 232a. The plating layers 231b, 232b, 231c, and 232c include first plating layers 231b and 232b containing nickel (Ni), and second plating layers 231c and 232c disposed on the first plating layers 231b and 232b and containing tin (Sn).

[0096] Further, by adjusting the ratio L / BW of the distance L of the insulating layer 250 between both ends in the width direction of the ceramic body 210 to the distance BW from one end of the first electrode layers 231a and 232a to the other end disposed on the first surface S1 and the second surface S2 of the ceramic body 210 so as to satisfy 0.40 ≦ L / BW ≦ 4.00, the moisture resistance reliability of the multilayer ceramic capacitor having a thickness of 110 μm or less can be improved, and the short-circuit failure between the external electrodes can be reduced.

[0097] In addition, by applying an insulating layer to the outside of the ceramic body 210, the breaking strength of the multilayer ceramic capacitor can also be improved.

[0098] Among the descriptions of the multilayer ceramic electronic component according to another embodiment of the present invention, the same parts as those in the description of the multilayer ceramic electronic component according to one embodiment of the present invention described above are omitted to avoid redundant description.

[0099] Hereinafter, a method for manufacturing a multilayer ceramic electronic component according to an embodiment of the present invention will be described, but it is not limited thereto.

[0100] A method for manufacturing a multilayer ceramic electronic component according to an embodiment of the present invention first forms a dielectric layer by applying and drying a slurry formed by including a powder such as barium titanate (BaTiO3) on a carrier film to provide a plurality of ceramic green sheets.

[0101] The above-mentioned ceramic green sheet can be manufactured by mixing ceramic powder, a binder, and a solvent to produce a slurry, and then producing the slurry into a sheet having a thickness of several micrometers by the doctor blade method.

[0102] Next, a conductive paste for an internal electrode with an average size of nickel particles being 0.1 to 0.2 μm and containing 40 to 50 parts by weight of nickel powder can be provided.

[0103] After applying the conductive paste for the internal electrode on the above-mentioned green sheet by the screen printing method to form an internal electrode, the green sheets with the internal electrode patterns arranged were laminated to manufacture the ceramic body 110.

[0104] Next, a first electrode layer containing a conductive metal and glass can be formed on the outside of the above-mentioned ceramic body.

[0105] The conductive metal is not particularly limited, and for example, it may be one or more selected from the group consisting of copper (Cu), silver (Ag), nickel (Ni), and alloys thereof.

[0106] In one embodiment of the present invention, the first electrode layer can be formed by using nickel (Ni) as the conductive metal.

[0107] The glass is not particularly limited, and a substance having the same composition as the glass used for manufacturing the external electrodes of general multilayer ceramic capacitors can be used.

[0108] Since the first electrode layer is formed on the upper and lower surfaces and the ends of the above-mentioned ceramic body, it can be electrically connected to the first and second internal electrodes respectively.

[0109] The first electrode layer can contain 5% by volume or more of glass compared to the first conductive metal.

[0110] Next, a first plating layer containing nickel (Ni) can be formed on a part of the upper portion of the first electrode layer.

[0111] Next, a second plating layer containing tin (Sn) can be formed on the first plating layer.

[0112] Finally, an insulating material is applied to the region of the upper portion of the first electrode layer where no plating layer is formed and to the upper portion of the ceramic body region between the first electrode layers to form an insulating layer.

[0113] The insulating material for forming the insulating layer is not particularly limited, and may be, for example, any one or more of epoxy-based, ceramic-based, and silicon-based materials.

[0114] Hereinafter, Table 1 below shows the moisture resistance reliability based on the ratio L / BW of the distance L between both ends in the width direction of the ceramic body 210 to the distance BW from one end of the first electrode layers 231a and 232a to the other end disposed on the first surface S1 and the second surface S2 of the ceramic body 210, and the reliability when mounting the multilayer ceramic capacitor on the printed circuit board.

[0115] When evaluating the moisture resistance reliability and the reliability when mounting the multilayer ceramic capacitor on the printed circuit board, when the result is poor, it is indicated by × as a comparative example, and when it is good, it is indicated by O as an example.

[0116]

Table 1

[0117] In Table 1 above, for Samples 1 to 4, the ratio L / BW of the distance L of the insulating layer 250 between both ends in the width direction of the ceramic body 210 to the distance BW from one end of the first electrode layers 231a and 232a to the other end disposed on the first surface S1 and the second surface S2 of the ceramic body 210 exceeds 4.00. It can be seen that moisture resistance failure occurred in Samples 1 to 4, and mounting failure occurred because the area of the external electrode that contacts the electrode pad during substrate mounting was small.

[0118] On the other hand, Samples 5 to 8 are examples of the present invention in which the ratio L / BW of the distance L of the insulating layer 250 between both ends in the width direction of the ceramic body 210 to the distance BW from one end of the first electrode layers 231a and 232a to the other end disposed on the first surface S1 and the second surface S2 of the ceramic body 210 satisfies 0.40 ≤ L / BW ≤ 4.00. According to the examples of the present invention, by increasing the breaking strength of the multilayer ceramic capacitor with a thickness of 110 μm or less, it is possible to prevent a decrease in reliability due to breakage or crack generation during the process.

[0119] Also, for Samples 9 and 10, the ratio L / BW of the distance L of the insulating layer 250 between both ends in the width direction of the ceramic body 210 to the distance BW from one end of the first electrode layers 231a and 232a to the other end disposed on the first surface S1 and the second surface S2 of the ceramic body 210 is less than 0.40. It can be seen that moisture resistance failure and short - circuit between external electrodes occurred in Samples 9 and 10 because the distance between the external electrodes was close and the distance L between both ends of the insulating layer was short.

[0120] As described above, the embodiments of the present invention have been described in detail. However, the scope of the present invention is not limited thereto, and it is obvious to those having ordinary knowledge in the technical field that various modifications and variations are possible within the scope not departing from the technical idea of the present invention described in the claims.

Explanation of Reference Numerals

[0121] 100 Multilayer ceramic electronic component 110 Ceramic body 111 Dielectric layer 121, 122 First and second internal electrodes 131, 132 First and second external electrodes 131a, 132a First electrode layer 131b, 132b, 131c, 132c Plating layers 150 Insulating layer

Claims

1. It has a dielectric layer and includes a first internal electrode and a second internal electrode that are arranged to face each other with the dielectric layer interposed therebetween, a first surface and a second surface facing each other, a third surface and a fourth surface that are connected to the first surface and the second surface and face each other, and a fifth surface and a sixth surface that are connected to the first surface to the fourth surface and face each other, a ceramic body; A first external electrode disposed outside the ceramic body and electrically connected to the first internal electrode, and a second external electrode electrically connected to the second internal electrode; The first internal electrode and the second internal electrode are alternately exposed on the fifth surface and the sixth surface of the ceramic body; The first and second external electrodes are respectively disposed on the fifth surface and the sixth surface of the ceramic body and extend and are disposed on the first surface and the second surface; The first and second external electrodes each include a first electrode layer containing a conductive metal and a plating layer disposed on the first electrode layer; The first electrode layer is composed of a first region on which a plating layer is disposed and a second region extending from the first region; An insulating layer is disposed so as to cover the second region of the first electrode layer and the ceramic body between the second regions; The ratio L / BW of the distance L of the insulating layer between both end portions in the width direction of the ceramic body to the distance BW from one end portion of the first electrode layer to the other end portion disposed on the first surface and the second surface of the ceramic body satisfies 0.40 ≦ L / BW ≦ 2.67; The third and fourth surfaces are arranged to face each other in the length direction of the ceramic body, the fifth and sixth surfaces are arranged to face each other in the width direction of the ceramic body, and the size in the length direction of the ceramic body is larger than the size in the width direction; The first internal electrode and the second internal electrode are not exposed on the third surface and the fourth surface of the ceramic body; A multilayer ceramic electronic component.

2. The plating layer includes a first plating layer disposed on the first electrode layer and containing nickel (Ni), and a second plating layer disposed on the first plating layer and containing tin (Sn). The multilayer ceramic electronic component according to claim 1.

3. The first electrode layer is a fired electrode layer containing a plurality of conductive metals selected from the group consisting of copper (Cu), silver (Ag), nickel (Ni), and alloys thereof, and glass. The multilayer ceramic electronic component according to claim 1 or 2.

4. The multilayer ceramic electronic component has a thickness of 110 μm or less. The multilayer ceramic electronic component according to any one of claims 1 to 3.

5. The length of the ceramic body is the distance between the third surface and the fourth surface, and the width of the ceramic body is the distance between the fifth surface and the sixth surface. The multilayer ceramic electronic component according to any one of claims 1 to 4.

6. The areas of the first external electrode and the second external electrode disposed on the first surface and the second surface of the ceramic body occupy 50% or more of the respective areas of the first surface and the second surface of the ceramic body. The multilayer ceramic electronic component according to claim 1.

7. It has a dielectric layer and includes a first internal electrode and a second internal electrode disposed to face each other with the dielectric layer interposed therebetween. It has a first surface and a second surface facing each other, a third surface and a fourth surface connected to the first surface and the second surface and facing each other, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and facing each other. A ceramic body, A first external electrode disposed outside the ceramic body and electrically connected to the first internal electrode, and a second external electrode electrically connected to the second internal electrode. The first external electrode is disposed on the first surface and the second surface of the ceramic body. The first external electrode disposed on the first surface and the first external electrode disposed on the second surface are connected to each other via a first via penetrating through the inside of the ceramic body. The second external electrode is disposed on the first surface and the second surface of the ceramic body. The second external electrode disposed on the first surface and the second external electrode disposed on the second surface are connected to each other via a second via penetrating through the inside of the ceramic body. The first via is connected to the first internal electrode and insulated from the second internal electrode. The second via is connected to the second internal electrode and insulated from the first internal electrode. Each of the first and second external electrodes includes a first electrode layer containing a conductive metal and a plating layer disposed on the first electrode layer. The first electrode layer is composed of a first region on which a plating layer is disposed and a second region extending from the first region. An insulating layer is disposed so as to cover the second region of the first electrode layer and the ceramic body between the second regions. The ratio L / BW of the distance L of the insulating layer between both ends in the width direction of the ceramic body to the distance BW from one end of the first electrode layer to the other end disposed on the first surface and the second surface of the ceramic body satisfies 0.40 ≤ L / BW ≤ 2.

67. The third and fourth surfaces are disposed to face each other in the length direction of the ceramic body. The fifth and sixth surfaces are disposed to face each other in the width direction of the ceramic body. The size in the length direction of the ceramic body is larger than the size in the width direction. The first and second external electrodes are respectively disposed spaced apart from each other in the width direction of the ceramic body. The first internal electrode and the second internal electrode are not exposed on the third surface and the fourth surface of the ceramic body. Multilayer ceramic electronic component.

8. The stacked ceramic electronic component according to claim 7, wherein the first electrode layer is a fired electrode layer containing a plurality of conductive metals selected from the group consisting of copper (Cu), silver (Ag), nickel (Ni), and alloys thereof, and glass.

9. The stacked ceramic electronic component according to claim 8, wherein the stacked ceramic electronic component has a thickness of 110 μm or less.

10. The stacked ceramic electronic component according to any one of claims 7 to 9, wherein the length of the ceramic body is the distance between the third surface and the fourth surface, the width of the ceramic body is the distance between the fifth surface and the sixth surface, and the first internal electrode and the second internal electrode are not exposed on the fifth surface and the sixth surface.

11. The stacked ceramic electronic component according to any one of claims 7 to 10, wherein the plating layer includes a first plating layer disposed on the first electrode layer and containing nickel (Ni), and a second plating layer disposed on the first plating layer and containing tin (Sn).

12. The stacked ceramic electronic component according to any one of claims 7 to 11, wherein the first and second external electrodes are disposed separately from each other on the first surface and the second surface of the ceramic body.

13. The stacked ceramic electronic component according to any one of claims 7 to 12, wherein the areas of the first external electrode and the second external electrode disposed on the first surface and the second surface of the ceramic body each account for 50% or more of the respective areas of the first surface and the second surface of the ceramic body.

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