Electronic device for capturing or releasing physical quantity and method for manufacturing the same

Abstract

The electronic device (10) for capturing or emitting a physical quantity includes a lower support (11), lower conductive elements (12), active elements (13) including active portions, each active element (13) including a lower portion (13a) and an upper portion (13b) electrically connected to at least one of the lower conductive elements (12), and upper conductive elements (14). The upper portion (13b) of each active element (13) is electrically connected to one of the upper conductive elements (14). At least one first electrically insulating element (16) is disposed between the sidewalls (13c) of at least two adjacent active elements (13) arranged side by side on the support surface of the lower support (11). The first electrically insulating element (16) is disposed between one of the upper conductive elements (14) and one of the lower conductive elements (12).

Description

Technical Field

[0001] The present invention relates to an electronic device for capturing or emitting a physical quantity.

[0002] The present invention also relates to a method for manufacturing an electronic device for capturing or emitting a physical quantity.

Background Art

[0003] In the field of optical display screens, the optical elements constituting the screen must be arranged in a matrix. The accuracy required for forming such a matrix increases as the resolution required for the screen increases.

[0004] It is known to fabricate light-emitting diodes constituting a light-emitting element on a first support, for example, a silicon or sapphire wafer, and transfer them onto a second support on which integration of the screen is intended. An electrical connection enabling power supply to the light-emitting diodes transferred in this way is formed at the height of the second support.

[0005] When the light-emitting diode is a three-dimensional wiring diode, since the distance separating the upper electrical connection and the lower electrical connection of the light-emitting diode is as short as about several tens of micrometers, it is difficult to achieve without an unintentional short circuit.

[0006] In order to form an electrical connection between the optical element and the second support, a thermocompression bonding method is often used. However, such a solution has room for improvement because it uses a high temperature that is not suitable for the light conversion element that can cover the light-emitting diodes of the optical element.

[0007] In the field of imaging using high-resolution sensors, it is necessary to arrange sensors and light emitters for parameters or physical quantities in a matrix. The accuracy required for forming such a matrix increases as the resolution expected on the screen becomes higher, causing the same problems as described above. Furthermore, the large unevenness of these sensors or emitters makes it difficult to integrate them on a large-sized surface.

Summary of the Invention

Problems to be Solved by the Invention

[0008] An object of the present invention is to provide an electronic device and a method for manufacturing the same that can solve all or part of the problems shown above.

[0009] Specifically, an object is to provide a solution that satisfies at least one of the following objectives. That is, - To be able to provide an electronic device for capturing or releasing a physical quantity that suppresses the risk of short circuit, - To be able to provide an electronic device for capturing or releasing a physical quantity at low cost, - To suppress the risk of damaging the light conversion element, - To be able to provide an electronic device for capturing or releasing a large-scale physical quantity, - To be able to provide an electronic device for capturing or releasing a physical quantity with high performance.

Means for Solving the Problems

[0010] This object can be achieved by an electronic device for capturing or releasing a physical quantity. This electronic device includes - A lower support, and - Lower conductive elements that are electrically insulated from each other and at least a part of which is formed on the support surface of the lower support. - A plurality of active elements, having a thickness in a direction across the lower support, each including a lower part electrically connected to at least one of the lower conductive elements, an upper part disposed on the opposite side of the lower support in a direction across the lower part, and an active part capable of changing its state when an external parameter is applied from the outside, the active element; - An upper conductive element electrically insulated from each other, and; The upper part of each active element is electrically connected to at least one of the upper conductive elements, and each active element defines, with respect to the outside, at least one side wall extending laterally around the active element along the thickness; At least one first electrical insulating element is disposed between at least a part of at least one side wall of at least two adjacent active elements arranged side by side on the support surface of the lower support, whereby the side walls are separated by the first electrical insulating element and electrically insulated from each other; The first electrical insulating element is disposed between at least one of the upper conductive elements and at least one of the lower conductive elements, and this arrangement is made such that at least one upper conductive element and at least one lower conductive element separated by the first electrical insulating element are electrically insulated from each other.

[0011] Some preferred but non-limiting aspects of this electronic device are as follows.

[0012] In one embodiment of this device, at least one of the active elements includes a control device, and the control device can affect at least one parameter related to the active part of the active element.

[0013] In one embodiment of the device, the active part of at least one active element includes a light emitting part, and the light emitting part can emit at least one light emission when the external parameter applied to the active part is an electrical quantity generated from at least one of the upper conductive element and the lower conductive element.

[0014] In one embodiment of the device, the control device can modulate at least one emission parameter regarding the light emission that can be emitted by the light emitting part.

[0015] In one embodiment of the device, the control device includes at least one transistor.

[0016] In one embodiment of the device, at least one of the upper conductive elements is formed, on the one hand, of a transparent conductor having the property of being in electrical contact with the light emitting part of the active element and being transparent to the light emission that can be emitted by the light emitting part, and on the other hand, of a metal conductor in electrical contact with the transparent conductor.

[0017] In one embodiment of the device, the metal conductor of the upper conductive element is arranged so as not to cover at least laterally the light emitting part of the active element.

[0018] In one embodiment of the device, the light emitting part of at least one active element includes at least one light emitting diode.

[0019] In one embodiment of the device, the light emitting diode is wire-shaped with dimensions in micrometers, and its main axis of extension is generally parallel to the lateral direction.

[0020] In one embodiment of the device, at least two of the light emitting diodes of the light emitting part of at least one active element are capable of emitting at least two light emissions having different wavelengths.

[0021] In one embodiment of the device, at least one of the light emitting diodes of the light emitting part of at least one active element is at least partially surrounded by a phosphorescent material capable of converting the light emission emitted by the corresponding light emitting diode.

[0022] In one embodiment of the device, the active part of at least one active element includes a device for measuring an external parameter configured such that its state changes when an external parameter is applied to the active part.

[0023] In one embodiment of the device, the control device determines a change in the state of the measuring device of the active part and sends an output signal representing this determination between at least one of the upper conductive elements and one of the lower conductive elements.

[0024] In one embodiment of the device, at least one of the measuring devices is an electrical component selected from a sensor and a transducer.

[0025] In one embodiment of the device, the active element is obtained on an external support different from the lower support before being transferred to the lower support.

[0026] In one embodiment of the device, the first electrical insulating element includes a set of metal particles coated with an electrical insulating material, and the set of metal particles is between a first electrically insulating state, i.e., a state where the first electrical insulating element is not subjected to a compressive pressure and most of the metal particles are not in contact with each other, and a second anisotropic conductive state, i.e., a state where most of the metal particles are in electrical contact under the influence of a compressive pressure applied in the lateral direction, so that the first electrical insulating element can change.

[0027] In one embodiment of the device, the first electrical insulating element is disposed at a contact portion disposed between at least one lower part of the active element and at least one of the lower conductive elements connected to the lower part of the active element. When the first electrical insulating element transitions from its first electrically insulating state to its second anisotropic conductive state, the lower part of the active element is brought into electrical contact with the lower conductive element, and the conduction is due to applying a compressive pressure to the contact portion by the active element and / or the lower support. This is, in particular, the result of the action of the electrical coupling device on at least one element obtained from the group including the active element and the lower support. Thereby, all or part of the metal particles of the first electrical insulating element located at the contact portion provide an electrical connection between the lower part of the active element and the lower conductive element.

[0028] In one embodiment of the device, a second electrical insulation element different from the first electrical insulation element is arranged between at least two adjacent active elements arranged side by side on the support surface of the lower support and between the upper conductive element and the lower conductive element. Thereby, at least one member of the following two groups is electrically insulated from each other. These groups are - A first group consisting of adjacent active elements separated from each other by the second electrical insulation element, - A second group consisting of an upper conductive element and a lower conductive element separated from each other by the second electrical insulation element.

[0029] In one embodiment of the device, the metal conductor of at least one upper conductive element is arranged between the second electrical insulation element and the transparent conductor.

[0030] In one embodiment of the device, at least one of the upper conductive elements defines a local portion arranged at the height of the upper part of the active element to which the upper conductive element is connected, and the local portion of the upper conductive element is at least partially formed by an adapted lithography.

[0031] In one embodiment of the device, the external parameters are included in the group formed by sound waves, light radiation, electromagnetic radiation, current, potential difference, and pressure waves.

[0032] Furthermore, the present invention relates to the implementation of a method for manufacturing an electronic device for capturing or emitting a physical quantity. This method is E1) Providing a lower support provided with a lower conductive element, wherein the lower conductive elements are electrically insulated from each other and at least a part thereof is formed on the support surface of the lower support, Step E2) of providing a plurality of active elements having a predetermined thickness in a direction across the lower support, each of the active elements including a lower part that can be electrically connected to at least one of the lower conductive elements, an upper part disposed on a side opposite to the lower support with respect to the lower part, and an active part whose state changes when an external parameter is applied from the outside, and each active element provided in step E2) defining at least one sidewall that extends laterally at least around the lower and upper parts along the thickness to the outside; Step E3) of forming at least one first electrical insulating element by disposing it between at least a part of at least one sidewall of at least two adjacent active elements arranged side by side on the support surface of the lower support, whereby the sidewalls separated by the first electrical insulating element are electrically insulated from each other; A manufacturing method in which, at the end of one of steps E2) and E3), the lower part of at least one active element is electrically connected to at least one of the lower conductive elements, and the method further includes: Step E4) of forming upper conductive elements that are electrically insulated from each other, including the step of electrically connecting the upper part of each active element to at least one of the formed upper conductive elements, and at the end of step E4), the first electrical insulating element is further disposed between at least one of the upper conductive elements and at least one of the lower conductive elements, whereby at least one upper conductive element and at least one lower conductive element separated by the first electrical insulating element are electrically insulated from each other.

[0033] Some preferred but non-limiting aspects of this manufacturing method are as follows.

[0034] In one embodiment of the method, the active elements provided in step E2) are formed on an external support different from the lower support before the transfer of the active elements to the lower support, which is carried out during step E2).

[0035] In one embodiment of the method, the first electrical insulation element comprises a set of metal particles coated with an electrical insulation material, and the set of metal particles is adapted to be able to transition between a first electrically insulating state, i.e., a state in which the first electrical insulation element is not subjected to a compressive pressure and most of the metal particles are not in contact with each other, and a second anisotropic conductive state in which most of the metal particles are in electrical contact under the influence of a compressive pressure. Step E3) includes sub-step E31), and sub-step E31) consists of forming the first electrical insulation element at a contact portion disposed between the lower part of at least one active element and at least one of the lower conductive elements connectable to the lower part of this active element. The method includes step E21), and step E21) consists of applying a compressive pressure to the contact portion by relative movement between the active element and the lower support, and the relative movement is caused by the action of an electrical coupling device on at least one element obtained from the group including the active element and the lower support, whereby all or part of the metal particles of the first electrical insulation element located at the contact portion are in their second anisotropic conductive state, i.e., a state providing electrical connection between the lower part of the active element and the lower conductive element.

[0036] Other aspects, objects, advantages and features of the present invention will be better understood upon reading the following detailed description of the preferred embodiments of the present invention. These are given as non-limiting examples and are made with reference to the accompanying drawings.

Brief Description of the Drawings

[0037]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Embodiments for Carrying Out the Invention

[0038] In the accompanying FIGS. 1 to 7 and the following description, functionally identical or similar elements are identified by the same reference numerals. Also, different elements are not shown to scale so as to give priority to the clarity of the drawings for ease of understanding. Furthermore, different embodiments and variations are not mutually exclusive, and conversely, they can be combined with each other.

[0039] In the following description, unless otherwise specified, the terms "substantially", "about", "entirely", and "in the range of" mean "within 10%".

[0040] As shown in FIGS. 1 to 6, the present invention relates first to an electronic device 10 for light emission. However, this electronic device 10 can be applied without being limited to capturing or emitting physical quantities. The term "capturing" has the same meaning as "measuring". The physical quantity to be captured can be pressure, pressure wave, sound wave, humidity level, temperature, electromagnetic field, visible light radiation or non-visible light radiation, current, or potential difference. The physical quantity to be emitted may be of the same nature as the physical quantity to be captured or measured, or may be of a different nature.

[0041] The electronic device 10 first includes a lower support 11. The lower support 11 is, for example, electrically insulating and is formed by at least one glass plate. Also, the lower support 11 may be conductive and may be formed by at least one metal plate. Further, the lower support 11 can also include conductive tracks, which are insulated from each other and are formed on or inside the surface of the lower support 11. The lower support 11 can be formed of a crystalline or amorphous material and can also include active or passive elements, such as transistors or memories. The lower support 11 can constitute, for example, a support for an optical display screen.

[0042] Also, the electronic device 10 includes lower conductive elements 12. The lower conductive elements 12 are electrically insulated from each other, and at least a part of them is formed on the support surface of the lower support 11. The lower conductive elements 12 can be formed adaptively or non - adaptively by photolithography and / or by etching, and also by vacuum evaporation or wet methods of metals. The metal can be, for example, copper, aluminum, silver, gold, titanium, palladium, nickel, or an alloy formed from these metals, or a multilayer body formed by different layers of different metals selected from, for example, the above - mentioned metals.

[0043] The electronic device 10 further includes a plurality of active elements 13. The active elements 13 have a thickness H in the transverse direction across the lower support 11. The thickness H of the active elements can be configured to be from 0.5 μm to 200 μm. For example, the active elements 13 are formed on an external support different from the lower support 11 before transferring the active elements 13 to the lower support 11. This is advantageous because in many cases the active elements 13 require specific formation conditions (for example, a high temperature exceeding 500 °C that may damage the lower support 11).

[0044] The active element 13 includes a lower portion 13a electrically connected to at least one of the lower conductive elements 12. The term "electrically connected" means "connected by direct physical contact" or "connected by indirect contact via one or several conductive elements (such as an adhesive containing metal particles or carbon nanotubes, or a pressure-sensitive adhesive or a temperature-sensitive adhesive)".

[0045] Also, the active element 13 includes an upper portion 13b disposed on the side opposite to the lower support 11 with respect to the lower portion 13a in the longitudinal direction. The lower portion 13a and the upper portion 13b can include one or several conductive electrodes, which facilitate contact with the lower conductive element 12 and / or the upper conductive element 14 (described later). Therefore, the upper portion 13b of each active element 13 is electrically connected to at least one of the upper conductive elements 14. In one example, the upper portion 13b of the active element 13 includes two electrodes, each connected to a different upper conductive element 14.

[0046] Each active element 13 includes an active part that can change its state when an external parameter is applied. The external parameter is, for example, pressure, pressure wave, sound wave, humidity, temperature, electromagnetic field, visible light or non-visible light, current, or potential difference. Each active element 13 defines at least one side wall 13c externally along the thickness H, and the side wall 13c extends around the active element 13.

[0047] Also, the electronic device 10 includes upper conductive elements 14 that are electrically insulated from each other. Each upper conductive element 14 is electrically connected to the upper portion 13b of at least one active element 13. The term "electrically connected" means "connected by direct physical contact" or "connected by indirect contact via one or several intermediate conductive elements".

[0048] The electronic device 10 further includes a first electrical insulation element 16, and the first electrical insulation element 16 is disposed between at least a part of side walls 13c in at least two adjacent active elements 13 arranged side by side on the support surface of the lower support 11. Therefore, the side walls 13c are separated by the first electrical insulation element 16, enabling the side walls 13c to be electrically insulated from each other. In the examples shown in FIGS. 1, 3, 5, and 7, the first electrical insulation element 16 is further disposed between at least one of the upper conductive elements 14 and at least one of the lower conductive elements 12, whereby at least one upper conductive element 14 and at least one lower conductive element 12 separated by the first electrical insulation element 16 are electrically insulated from each other.

[0049] To form an electrical contact between the lower part 13a of one active element 13 and one lower conductor 12, an optical adhesive or a conductive adhesive (sensitive to heat, pressure, light, or an electric field) can be used. In one example, the lower part 13a of the active element 13 includes at least one metal fastening element, and at least a part of this element can be fastened to the lower conductive element 12 by applying a fastening pressure. Thereby, an electrical connection between the lower part 13a of the active element 13 and the lower electrical conductor 12 is established. Examples of metal fasteners are chips, microtubes, or micropillars made of copper. In another example, the lower part 13a of the active element 13 is electrically connected to the lower conductive element 12 via an adhesive containing silver-containing particles.

[0050] In the examples shown in FIGS. 1, 3, and 5, the active element 13 is connected to the lower conductive element 12 before the formation of the first electrical insulation element 16.

[0051] In the examples shown in FIGS. 2, 4, and 6, the first electrical insulation element 16 includes a set of metal particles 16a. These particles are, for example, silver or nickel-gold alloy (Ni-Au) coated with an electrical insulation material 16b. This set of metal particles 16a is adapted to be able to change between a first state in which the first electrical insulation element 16 is not under compressive pressure and most of the metal particles 16a are not in contact with each other and the first electrical insulation element 16 is electrically insulated, and a second state in which most of the metal particles 16a are in electrical contact under the influence of a compressive pressure applied in the transverse direction and become anisotropically conductive. In the second anisotropically conductive state, the metal particles 16a are grouped in contact with each other to form electrical contacts, and the remaining portion of the first electrical insulation element 16 is formed by the electrical insulation material 16b in which the metal particles 16a are absent.

[0052] In the examples shown in FIGS. 2, 4, and 6, the first electrical insulation element 16 is also formed at the contact portion (disposed between the lower portion 13a of at least one active element 13 and at least one of the lower conductive elements 12 connected to the lower portion 13a of this active element 13). Accordingly, the lower portion 13a of the active element 13 is electrically contacted with the lower conductive element 12 when the first electrical insulation element 16 passes from its first electrically insulated state to its second anisotropically conductive state. This is made possible by applying a compressive pressure to the contact portion by the active element 13 and / or the lower support 11 (indicated by the bold arrows in the drawings). The application of the compressive pressure is due to the action of the electrical coupling device on the active element 13 and / or the lower support 11. Accordingly, all or part of the metal particles 16a of the first electrical insulation element 16 disposed at the contact portion provide an electrical connection between the lower portion 13a of the active element 13 and the lower conductive element 12. In addition, at the same time, the electrical insulation material 16b thus dissociated from the metal particles 16a surrounds the side wall 13c of the active element 13, enabling electrical insulation between the lower conductive element 12 and the upper conductive element 14 and at least lateral electrical insulation between the active elements 13.

[0053] The electrical insulation material 16b can be a resin, an oxide, or a polymer.

[0054] In the examples shown in FIGS. 1 to 6, after the electrical insulating element 16 is spin-coated or laminated, chemical mechanical polishing can be performed. This is to prevent the upper part 13b of the active element 13 from being finally covered by an insulator and to promote the recovery of electrical contact of the upper conductive element 14.

[0055] According to an embodiment of the electronic device 10, at least one of the active elements 13 includes a control device 19, and the control device 19 can affect at least one parameter related to the active part of the active element 13. Therefore, the control device 19 can include at least one transistor of CMOS and / or bipolar and / or thin film transistor (TFT) type technology, or any other technology, such as Gan (a mixture of gallium and nitrogen) or Gan on silicon. It is also possible to include a memory or passive components. This component is powered, for example, by a voltage or current from the lower conductive element 12 and / or the upper conductive element 14.

[0056] According to an embodiment of the electronic device 10, the active part in at least one of the active elements 13 includes a light emitting part. The light emitting part is configured to be able to emit at least one light emission or electromagnetic emission, which is the case where the external parameter applied to the active part is a current or voltage directly or indirectly generated from at least one of the upper conductive element 14 and the lower conductive element 12. Therefore, when the control device 19 is provided, for example, it may be possible to modulate at least one light emission parameter related to the light emission that can be emitted by the light emitting part. For example, the light emission parameter can be light intensity, emission angle, or emission color.

[0057] In one example, the control device 19 detects optically transmitted information. The control device 19 can incorporate a photodiode, whereby it is possible to adjust the intensity of the light emitted by the active element 13 linked to the control device 19 according to the information received by the incorporated photodiode.

[0058] In one example, the light-emitting part of at least one active element 13 includes at least one light-emitting diode. This light-emitting diode may be wire-shaped, have dimensions in micrometers or nanometers, and have a stretching main axis that is generally parallel to the above-described lateral direction. Further, this light-emitting diode may be of a two-dimensional type having a height in micrometers. In one example, the light-emitting diodes of at least two light-emitting parts of at least one active element 13 can emit light radiation having at least two different wavelengths. In another example, at least one of the light-emitting diodes of the light-emitting part of at least one active element 13 is at least partially surrounded by a phosphorescent material that can convert the light radiation emitted by the corresponding light-emitting diode.

[0059] According to the embodiment of the electronic device 10 shown in FIGS. 1 to 7, at least one of the upper conductive elements 14 is formed, on the one hand, by a transparent conductor 14a that is in direct physical electrical contact with the light-emitting part of the light-active element 13 or in indirect contact via a conductive element, and on the other hand, by a metal conductor 14b that is in electrical contact with the transparent conductor 14a. The transparent conductor 14a preferably has the property of being transparent to light or electromagnetic waves that can be emitted by the light-emitting part.

[0060] In the examples shown in FIGS. 5, 6, and 7, the metal conductive material 14b of the upper conductive element 14 is arranged so as not to cover in the direction that at least crosses the light-emitting part of the active element 13. In this way, the display screen is manufactured using light-emitting diodes related or not related to the control device 19, formed on an external substrate, and then transferred to the lower conductive element 12 and the upper conductive element 14 and electrically connected, and electrical insulation between different elements is provided by the first electrical insulation element 16.

[0061] In another embodiment, the active part of at least one active element 13 includes a device for measuring an external parameter, and this device is configured to change its state when the external parameter is applied to the active part. In one example, at least one of the measuring devices is an electrical component selected from sensors, transducers, photodiodes, ultrasonic sensors of the PMUT (Piezoelectric Micromachined Ultrasonic Transducers) or CMUT (Capacitive Micromachined Ultrasonic Transducers) type.

[0062] Accordingly, in the example of this embodiment, the control device 19 can determine the state change of the measuring device of the active part and distribute an output signal representing this determination between at least one of the upper conductive elements 14 and one of the lower conductive elements 12. When the external physical quantity corresponding to the external parameter is a sound wave, a pressure wave or a pressure, the active element 13 configured in this way can capture or measure this external parameter. In this way, a voltage and / or a current can be generated. And an ultrasonic imager can be manufactured having transducers and ultrasonic sensors formed on an external substrate, and then transferred to the lower conductive element 12 and the upper conductive element 14 for electrical connection. Electrical insulation between different elements is provided by the first electrical insulation element 16.

[0063] In another embodiment of the electronic device 10 shown in FIGS. 3, 4, 5 and 6, a second electrical insulation element 17 different from the first electrical insulation element 16 is arranged between at least two adjacent active elements 13 arranged side by side on the support surface of the lower support 11, and is arranged between the upper conductive element 14 and the lower conductive element 12 so as to electrically insulate the adjacent active elements 13 from each other. In this way, the active elements 13 are separated from each other by the second electrical insulation element 17, and / or the upper conductive element 14 and the lower conductive element 12 are separated from each other by the second electrical insulation element 17.

[0064] In the examples shown in FIGS. 5 and 6, the metal conductor 14b of at least one upper conductive element 14 is disposed between the second electrical insulating element 17 and the transparent conductor 14a.

[0065] In one example, at least one of the upper conductive elements 14 defines a local portion disposed at the height of the upper portion 13b of the active element 13 to which the upper conductive element 14 is connected, and the local portion of the upper electrical element 14 is at least partially formed by adapted lithography.

[0066] An advantage of such an electronic device 10 is that the lower electrode and the upper electrode are reliably and without waste electrically insulated even when the height difference corresponding to the height H of the active element 13 is about 10 micrometers.

[0067] Another advantage of such an electronic device 10 is that it is possible to supply power with a height difference between the lower electrode and the upper electrode, and it is less likely to cause a short circuit.

[0068] Another advantage of such an electronic device 10 is that the mounting of the electronic device 10 can be performed by a technique that does not require high temperature and high pressure. Also, these techniques are suitable for application to a large surface, such as larger than the surface of a commercially available silicon disk. This is advantageous for making physical quantity capture devices including many sensors such as large optical display devices and ultrasonic imaging devices using ultrasonic scans.

[0069] A further advantage of such an electronic device 10 is that the restoration of electrical contact with the upper electrode is promoted.

[0070] Another advantage of such an electronic device 10 is that the voltage loss is reduced, so that the electrical efficiency of contact restoration at an upper position is improved.

[0071] The present invention also relates to a method of manufacturing an electronic device 10 for capturing or emitting a physical quantity.

[0072] As shown in FIGS. 1 to 6, this method includes the following steps. That is, E1) Provide a lower support 11 having a lower conductive element 12. The lower conductive elements 12 are electrically insulated from each other, and at least a part thereof is formed on the support surface of the lower support 11; E2) Provide a plurality of active elements 13 having a transverse thickness H across the lower support 11. Each of the active elements 13 may include a lower part 13a electrically connected to at least one of the lower conductive elements 12, an upper part 13b disposed on the side opposite to the lower support 11 with respect to the lower part 13a, and an active part whose state changes when an external parameter is applied to the active part from the outside. Each active element 13 provided in step E2) defines at least one side wall 13c with respect to the outside along the thickness H, and the side wall 13c extends laterally at least around the lower part 13a and the upper part 13b. E3) Form at least one first electrical insulating element 16 between at least a part of at least one side wall 13c of at least two adjacent active elements 13 arranged side by side on the support surface of the lower support 11. Thereby, the side walls 13c separated by the first electrical insulating element 16 are electrically insulated from each other; E4) Form upper conductive elements 14 that are electrically insulated from each other. This is done such that the upper part 13b of each active element 13 is electrically connected to at least one of the formed upper conductive elements 14.

[0073] In this manufacturing method, at the end of one of steps E2) and E3), the lower part 13a of at least one active element 13 is electrically connected to at least one of the lower conductive elements 12. Therefore, in the case shown in FIG. 1, the active element 13 is formed before all or part of the side wall 13c of the active element 13 is surrounded by the first electrical insulating element 16 and is connected to the lower conductive element 12. In another case shown in FIG. 2, the first electrical insulating element 16 is first deposited, particularly on the lower conductive element 12. Next, the active element 13 is formed and connected to the lower conductive element 12. This connection is made, for example, through the first electrical insulating element 16 or through the recess of the first insulating element 16 before connecting the active element 13 to the lower conductive element, as will be described below.

[0074] In this manufacturing method, at the end of step E4), the first electrical insulation element 16 is further arranged between at least one of the upper conductive elements 14 and at least one of the lower conductive elements 12, whereby at least one of the upper conductive elements 14 and at least one of the lower conductive elements 12 separated by the first electrical insulation element 16 are electrically insulated from each other. This makes it possible to limit a short circuit between conductive elements of different heights, for example during the formation of the conductive element 14.

[0075] In a particular non-limiting implementation of the manufacturing method, in order to improve the contact at the height of the upper part 13b of the active element 13, a planarization step can be carried out after step E3). The planarization step can be carried out, for example, by the action of a chemical mechanical polishing device or by reactive ion-based dry etching.

[0076] According to another particular non-limiting implementation, the active element 13 provided in step E2) is obtained on an external support different from the lower support 11, which is done before transferring the active element 13 to the lower support 11 during step E2). This makes it possible to form the active elements 13 on an external substrate (for example, being less breakable and having high heat resistance) and then transfer them to the lower support. This lower support 11 may not be, for example, heat resistant or may not be suitable for a substrate that is too wide to allow the formation of the active element 13.

[0077] According to the particular non-limiting implementation shown in FIGS. 2, 4 and 6, the first electrical insulation element 16 formed in step E3) includes a set of metal particles 16a coated with an electrical insulation material 16b, which is adapted so that the first electrical insulation element 16 can vary between: - a first electrically insulating state in which the first electrical insulation element 16 is not subjected to a compressive pressure and most of the metal particles 16a are not in contact with each other, and - a second anisotropic conductive state in which most of the metal particles 16a are in electrical contact under the influence of a compressive pressure.

[0078] And step E3) includes step E31), which consists of forming a first electrical insulating element 16 at a contact portion disposed between a lower portion 13a of at least one active element 13 and at least one lower conductive element 12 connectable to the lower portion 13a of this active element 13. And step E2) also includes step E21), which consists of applying a compressive pressure to the contact portion by relative movement between the active element 13 and the lower support 11.

[0079] This relative movement results from the action of an electrical connection device on at least one element obtained from the group including the active element 13 and the lower support 11. Thus, all or part of the metal particles 16a of the first electrical insulating element 16 located at the contact portion are in their second anisotropic conductive state, thus ensuring the electrical connection between the lower portion 13a of the active element 13 and the lower conductive element 12.

[0080] The advantage of this method is that the contact is formed only under the active element 13. This prevents parasitic welding from contacting the side wall of the active element 13 and causing a short circuit.

[0081] The advantage of this manufacturing method is that it can be implemented with technologies that do not require high temperature and high pressure. Also, these technologies are suitable for application to large surfaces and are advantageous for manufacturing, for example, an optical display device or an imaging device having dimensions larger than those of a commercially available silicon disk.

Description of the reference numerals

[0082] 10 Electronic device 11 Lower support 12 Lower conductive element 13 Active element 13a Lower portion of the active element 13b Upper portion of the active element 13c Side wall 14 Upper conductive element 16 First electrical insulating element 17 Second electrical insulating element

Claims

1. An electronic device (10) for capturing or releasing a physical quantity, comprising: A lower support (11); A plurality of lower conductive elements (12) that are electrically insulated from each other and at least a part of which is formed on the support surface of the lower support (11); Having a thickness (H) in a direction across the lower support (11), each including a lower part (13a) electrically connected to at least one of the lower conductive elements (12), and an upper part (13b) disposed on the opposite side of the lower support (11) in the direction with respect to the lower part (13a), and a plurality of active elements (13) each including an active part capable of changing its state when an external parameter is applied from the outside; A plurality of upper conductive elements (14) that are electrically insulated from each other; The upper part (13b) of each active element (13) is electrically connected to at least one of the upper conductive elements (14), and each active element (13) defines at least one side wall (13c) extending laterally around the active element (13) along the thickness (H) with respect to the outside; At least one first electrical insulating element (16) is arranged between at least a part of at least one side wall (13c) of at least two adjacent active elements (13) arranged side by side on the support surface of the lower support (11) such that the side walls (13c) are separated by the first electrical insulating element (16) and electrically insulated from each other; The first electrical insulating element (16) is arranged between at least one of the upper conductive elements (14) and at least one of the lower conductive elements (12) such that at least one of the upper conductive elements (14) separated by the first electrical insulating element (16) and at least one of the lower conductive elements (12) are electrically insulated from each other. Electronic device (10).

2. The electronic device (10) according to claim 1, wherein at least one of the active elements (13) includes a control device (19) capable of affecting at least one parameter related to the active part of the active element (13).

3. The active part of at least one of the active elements (13) includes a light-emitting part that can emit at least one light emission when the external parameter applied to the active part is an amount of electricity generated from at least one of the upper conductive element (14) and the lower conductive element (12). The electronic device (10) according to any one of claims 1 or 2.

4. At least one of the upper conductive elements (14) is formed, on the one hand, by a transparent conductor (14a) having a property of being in electrical contact with the light-emitting part of the active element (13) and being transparent to the light emission that can be emitted by the light-emitting part, and on the other hand, by a metal conductor (14b) in electrical contact with the transparent conductor (14a). The electronic device (10) according to claim 3.

5. The metal conductor (14b) of the upper conductive element (14) is arranged so as not to cover the light-emitting part of the active element (13) in a direction at least crossing the light-emitting part. The electronic device (10) according to claim 4.

6. The active part of at least one of the active elements (13) includes a measuring device for measuring the external parameter configured to change its state when the external parameter is applied to the active part. The measuring device includes an electronic component selected from a sensor and a transducer. The electronic device (10) according to any one of claims 1 to 5.

7. The active part of at least one of the active elements (13) includes a measuring device for measuring the external parameter configured to change its state when the external parameter is applied to the active part. The control device (19) determines a change in the state of the measuring device of the active part and sends an output signal representing this determination between at least one of the upper conductive elements (14) and one of the lower conductive elements (12). The electronic device (10) according to claim 2.

8. The active element (13) is formed on an external support different from the lower support (11) before being transferred to the lower support (11). The electronic device (10) according to any one of claims 1 to 7.

9. The first electrical insulating element (16) includes metal particles (16a) coated with an electrical insulating material (16b), and the metal particles (16a) are such that the first electrical insulating element (16) is not subjected to a compressive pressure, and most of the metal particles (16a) are not in contact with each other. The electronic device (10) according to any one of claims 1 to 8, which is adapted to be able to change between a first electrically insulating state and a second anisotropic conductive state in which most of the metal particles (16a) are in electrical contact under the influence of the compressive pressure applied in the said direction.

10. The first electrical insulating element (16) is disposed at a contact portion disposed between the lower portion (13a) of at least one of the active elements (13) and at least one of the lower conductive elements (12) connected to the lower portion (13a) of this active element (13). As a result of the action of an electrical coupling device on at least one element obtained from the group including the active element (13) and the lower support (11), the lower portion (13a) of the active element (13) causes the first electrical insulating element (16) to be compressed at the contact portion by applying a compressive pressure to the active element (13) and / or the lower support (11). Shifting from the first electrically insulating state to the second anisotropic conductive state to establish an electrical contact state with the lower conductive element (12), all or part of the metal particles (16a) of the first electrical insulating element (16) located at the contact portion are connected to the lower portion (13a) of the active element (13) and the lower conductive element (12). The electronic device (10) according to claim 9, which provides electrical connection.

11. The second electrical insulation element (17), which is different from the first electrical insulation element (16), is arranged side by side on the support surface of the lower support body (11) so as to electrically insulate at least one member of two groups from each other, between at least two adjacent active elements (13) and between the upper conductive element (14) and the lower conductive element (12). The two groups are a first group consisting of the adjacent active elements (13) separated from each other by the second electrical insulation element (17), and a second group consisting of the upper conductive element (14) and the lower conductive element (12) separated from each other by the second electrical insulation element (17). The electronic device (10) according to claim 1 or 2 includes the above.

12. The active part of at least one of the active elements (13) includes a light-emitting part that can emit at least one light emission when the external parameter applied to the active part is an electric quantity generated from at least one of the upper conductive element (14) and the lower conductive element (12). At least one of the upper conductive elements (14) is formed by a transparent conductor (14a) having a property of being in electrical contact with the light-emitting part of the active element (13) on the one hand and being transparent to the light emission that can be emitted by the light-emitting part, and on the other hand, is formed by a metal conductor (14b) in electrical contact with the transparent conductor (14a). The metal conductor (14b) of at least one of the upper conductive elements (14) is arranged between the second electrical insulation element (17) and the transparent conductor (14a). The electronic device (10) according to claim 11.

13. At least one of the upper conductive elements (14) defines a local part arranged at the height of the upper part (13b) of the active element (13) to which the upper conductive element (14) is connected. The local part of the upper conductive element (14) is at least partially formed by adapted lithography. The electronic device (10) according to any one of claims 1 to 12.

14. The electronic device (10) according to any one of claims 1 to 13, wherein the external parameter is included in the group formed by sound waves, light radiation, electromagnetic radiation, current, potential difference, and pressure waves.

15. A method for manufacturing an electronic device (10) for capturing or emitting a physical quantity, comprising: Step E1 of providing a lower support (11) having a plurality of lower conductive elements (12), wherein the lower conductive elements (12) are electrically insulated from each other and at least a part thereof is formed on the support surface of the lower support (11); Step E2 of providing a plurality of active elements (13) having a thickness H in a direction crossing the lower support (11), each of the active elements (13) including a lower part (13a) that can be electrically connected to at least one of the lower conductive elements (12), an upper part (13b) (arranged on the opposite side of the lower support (11) in the lateral direction with respect to the lower part (13a)), and an active part (the state of which can change when an external parameter outside the active part is applied to the active part), and each active element (13) provided in step E2 defining at least one side wall (13c) that extends laterally at least around the lower part (13a) and the upper part (13b) along the thickness (H); Step E3 of arranging and forming at least one first electrical insulating element (16) between at least a part of at least one side wall (13c) of at least two adjacent active elements (13) arranged side by side on the support surface of the lower support (11), thereby electrically insulating the side walls (13c) separated by the first electrical insulating element (16) from each other; A manufacturing method in which, at the end of one of steps E2 and E3, the lower part (13a) of at least one of the active elements (13) is electrically connected to at least one of the lower conductive elements (12); Step E4 of forming a plurality of upper conductive elements (14) that are electrically insulated from each other, including step E4 of electrically connecting the upper part (13b) of each active element (13) to at least one of the formed upper conductive elements (14). At the end of step E4, the first electrical insulating element (16) is further arranged between at least one of the upper conductive elements (14) and at least one of the lower conductive elements (12), whereby at least one of the upper conductive elements (14) and at least one of the lower conductive elements (12) separated by the first electrical insulating element (16) are electrically insulated from each other. Manufacturing method.

16. The active element (13) provided in step E2 is formed on an external support different from the lower support (11) before transferring the active element (13) to the lower support (11), which is carried out during step E2. The manufacturing method according to claim 15.

17. The first electrical insulating element (16) includes metal particles (16a) coated with an electrical insulating material (16b), and the metal particles (16a) are such that the first electrical insulating element (16) is not subjected to a compressive pressure and most of the metal particles (16a) are not in contact with each other. The first electrical insulating element (16) is adapted to be able to change between a first electrical insulating state and a second directional conductive state in which most of the metal particles (16a) are in electrical contact under the influence of a compressive pressure. Step E3 includes step E31, and step E31 consists of forming the first electrical insulating element (16) at a contact portion arranged between the lower part (13a) of at least one of the active elements (13) and at least one of the lower conductive elements (12) connectable to the lower part (13a) of the active element (16a). The method of manufacturing according to claim 16, wherein step E2 includes step E21, step E21 consists of applying a compressive pressure to the contact portion by relative movement between the active element (13) and the lower support (11), the relative movement is caused by the action of an electrical coupling device on at least one element obtained from the group including the active element (13) and the lower support (11), and all or part of the metal particles (16a) of the first electrical insulating element (16) located at the contact portion are in a state of providing electrical connection between the lower portion (13a) of the active element (13) and the lower conductive element (12), and is a second anisotropic conductive state.

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