Diaphragm assembly and speaker

Abstract

A diaphragm assembly and a speaker are provided. [Solution] The diaphragm assembly includes a film body and a circuit pattern fixedly disposed on the film body. The film body is provided with several magnetized areas. The circuit pattern includes several copper sheets disposed to correspond to the magnetized areas, and an isolating gap is provided between two adjacent copper sheets. At least some of the copper sheets are provided with several balanced gaps arranged along the width direction, thereby dividing the copper sheets into several strips.

Description

Technical Field

[0001] Cross-reference of applications This application was filed with the China National Intellectual Property Administration on August 13, 2021, with the application number 202121893612.X and the title "Diaphragm Assembly and Speaker", and claims the priority of a Chinese patent application filed with the China National Intellectual Property Administration on August 13, 2021, with the application number 202110930373.9 and the title "Diaphragm Assembly and Speaker", and all of its contents are incorporated herein by reference.

[0002] This application relates to the technical field of acoustic diaphragms, and particularly to diaphragm assemblies and speakers.

Background Art

[0003] The diaphragm assembly is one of the main components of a speaker and is mainly used for vibration and sound generation. Traditional diaphragm assemblies are based on the average magnetic field strength, which limits the width size of the corresponding copper sheet, making the force received per unit width of each copper sheet equal, and having a certain positive role. However, there are still major defects in such a technical solution, that is, the distance between two adjacent non-copper-coated regions of the traditional diaphragm assembly is non-uniform, and the weight distribution of the copper foils on both sides is extremely non-uniform.

Summary of the Invention

Problems to be Solved by the Invention

[0004] According to various embodiments of the present application, a diaphragm assembly and a speaker are provided.

Means for Solving the Problems

[0005] A diaphragm assembly, comprising: a film body provided with several magnetization regions; A circuit pattern fixedly arranged on the film body, comprising several copper sheets arranged in one-to-one correspondence with each of the magnetization regions, and a circuit pattern provided with isolation gaps between two adjacent copper sheets. At least some of the copper sheets are provided with several balance gaps arranged along the width direction, thereby partitioning the copper sheets into several strips.

[0006] In one embodiment, the balance gap is not provided in the copper sheet with the smallest width size.

[0007] In one embodiment, the width size of each of the strips is equal to the width size of the copper sheet with the smallest width size.

[0008] In one embodiment, the width sizes of the isolation gap and the balance gap are equal.

[0009] In one embodiment, the width size of the strip is larger than the width size of the isolation gap.

[0010] In one embodiment, all the strips belonging to the same copper sheet are arranged to be connected in parallel.

[0011] In one embodiment, the several copper sheets are arranged to be connected in parallel.

[0012] In one embodiment, the circuit pattern is fixedly connected to the film body in an adhesion process.

[0013] In one embodiment, the film body is made of a deformable material.

[0014] Further provided is a speaker, comprising a magnetic body for providing a magnetic field, a circuit board for providing a current, and the diaphragm assembly according to any one of the above embodiments, wherein the end of the circuit pattern is electrically connected to the circuit board.

[0015] In one embodiment, the current provided by the circuit board to each of the copper sheets at the same time is equal.

[0016] In one embodiment, a through groove is provided in the middle part of the circuit board, and the film body is fixedly arranged in the through groove.

Advantages of the Invention

[0017] In the above diaphragm assembly and speaker, arranging balance gaps in at least some of the copper sheets and partitioning a wide copper sheet into several strips arranged at intervals, that is, adding several balance gaps between two adjacent isolation gaps, is equivalent to adding several new non - copper - coated regions between two adjacent original non - copper - coated regions. Thereby, the distance difference between two adjacent non - copper - coated regions is reduced, the uniformity of copper coating on the film body is improved, and as a result, the overall smoothness and stability when the diaphragm assembly vibrates are improved, and the sound distortion is reduced.

Brief Description of the Drawings

[0018] To more clearly illustrate the embodiments of the present application or the technical solutions of the prior art, the following briefly introduces the necessary drawings for describing the embodiments or the prior art. Obviously, the following - described drawings are only some embodiments of the present application. On the premise that those skilled in the art do not perform labor worthy of inventive step, other drawings can be obtained based on these drawings.

Figure 1

Figure 2

Figure 3

Figure 4

Modes for Carrying Out the Invention

[0019] For the purpose of making the objectives, features, and advantages of the present application clearer and easier to understand, the following will combine the drawings of the embodiments of the present application to clearly and completely describe the technical solutions of the embodiments of the present application. Obviously, the embodiments described below are not all embodiments, but only some embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without making inventive efforts shall fall within the protection scope of the present application.

[0020] Here, when an element is described as being "fixed" to another element, it is directly located on another element, or there may be intermediate elements. When one element is considered to be "connected" to another element, it is directly connected to another element, or there may be intermediate elements at the same time. The terms "inside", "outside", "left", "right" and similar expressions used in this specification do not mean the only embodiment, but are for illustrative purposes only.

[0021] Also, the orientation or positional relationship indicated by terms such as "long", "short", "inside", "outside", etc. is the orientation or positional relationship according to the drawings, and it does not indicate or imply that the shown device or element must have the specific orientation and operate in the specific orientation structure. It is only for the convenience of describing the present application and should not be understood as a limitation to the present application.

[0022] Referring to FIGS. 1 and 2, the diaphragm assembly provided by the prior art includes a film body 2 and a circuit pattern 3 fixedly arranged on the film body 2. The circuit pattern 3 is manufactured from copper foil or aluminum foil by a developing and etching process. Taking the copper foil as an example, it includes several copper sheets 301 arranged at intervals. When the diaphragm assembly is placed in a magnetic field and the circuit pattern 3 is energized, the circuit pattern 3 vibrates the film body 2 up and down under the action of the Ampere force, and as a result, sound is produced.

[0023] The magnetic field strength corresponding to each position in the film body 2 is different. If the force received by each part of the film body 2 is non-uniform, the difference in the frequency and amplitude of the vibration of each part of the film body 2 will become too large, resulting in a problem of severe sound distortion.

[0024] Region M in Fig. 1 is the main region that vibrates under the Ampere force. Taking region M as an example, it will be introduced. Referring to Fig. 2, generally, the magnetic field strength curve H shows the magnitude situation of the magnetic field strength in region M. In order to make the force received by each part of the film body more uniform, the conventional diaphragm assembly adopts the following technical solutions: (1) Based on the magnetic field strength, divide the film body in region M into several magnetization regions, for example, magnetization region A1, magnetization region A2, magnetization region A3, magnetization region A4, and magnetization region A5, etc. In some embodiments, the film body in region M may be divided into 3, 6, or 7 magnetization regions, and the principle is the same. The following mainly introduces the case of being divided into 5 magnetization regions; (2) Calculate the average magnetic field strength of each magnetization region. For example, the average magnetic field strength of magnetization region A1 is 1H, the average magnetic field strength of magnetization region A2 is 2H, the average magnetic field strength of magnetization region A3 is 5H, the average magnetic field strength of magnetization region A4 is 2H, and the average magnetic field strength of magnetization region A5 is 1H; (3) Based on the average magnetic field strength of each magnetization region, calculate the width size of the corresponding copper sheet. The width size of the copper sheet is directly proportional to the average magnetic field strength of the corresponding magnetization region. For example, the width size of the copper sheet corresponding to magnetization region A1 is 1L, the width size of the copper sheet corresponding to magnetization region A2 is 2L, the width size of the copper sheet corresponding to magnetization region A3 is 5L, the width size of the copper sheet corresponding to magnetization region A4 is 2L, and the width size of the copper sheet corresponding to magnetization region A5 is 1L; (4) Based on the width sizes of the respective copper sheets, when developing and etching the copper foil, a circuit pattern including several copper sheets arranged at intervals can be obtained. For example, the circuit pattern sequentially includes a copper sheet B1 located in the magnetization region A1, a copper sheet B2 located in the magnetization region A2, a copper sheet B3 located in the magnetization region A3, a copper sheet B4 located in the magnetization region A4, and a copper sheet B5 located in the magnetization region A5. An isolation gap 302 is provided between two adjacent copper sheets; (5) Introduce equal currents into each copper sheet. The magnitude of the current corresponding to the size per unit width of each copper sheet is inversely proportional to the width size of the copper sheet. That is, the current per unit width of the copper sheet B1 is 1I, the current per unit width of the copper sheet B2 is 1 / 2I, the current per unit width of the copper sheet B3 is 1 / 5I, the current per unit width of the copper sheet B4 is 1 / 2I, and the current per unit width of the copper sheet B5 is 1I; (6) Generally, the length sizes of the respective copper sheets are equal. Since the magnitude of the Ampere force is directly proportional to the magnetic field strength and inversely proportional to the magnitude of the current, in this case, the forces received corresponding to the size per unit width of each copper sheet are equal. That is, the force received per unit width of the copper sheet B1 is 1L * 1I = 1F, the force received per unit width of the copper sheet B2 is 2L * 1 / 2I = 1F, the force received per unit width of the copper sheet B3 is 5L * 1 / 5I = 1, the force received per unit width of the copper sheet B4 is 2L * 1 / 2I = 1F, and the force received per unit width of the copper sheet B5 is 1L * 1I = 1F.

[0025] Such a diaphragm assembly provided by the prior art limits the width sizes of the corresponding copper sheets based on the average magnetic field strength, so that the forces received per unit width of each copper sheet are equal, and it plays a certain positive role. However, the copper foil weight distribution on both sides of the isolation gap 302 of the film body in such a diaphragm assembly is extremely uneven.

[0026] For example, taking the isolation gap C2-3 between the magnetization region A2 and the magnetization region A3 as an example, on the left side of the isolation gap C2-3, a copper foil is provided within a width of 2L, and on the right side of the isolation gap C2-3, a copper foil is provided within a width of 5L. Clearly, the copper foil weight distribution situation is not symmetric.

[0027] The region not shielded by the circuit pattern is called a non-copper-coated region, and the distance between two adjacent non-copper-coated regions of the diaphragm assembly of the prior art is clearly non-uniform.

[0028] The following further describes the technical solution of this application by combining the drawings and using specific embodiments.

[0029] This application provides a diaphragm assembly and a speaker having the diaphragm assembly. Here, the speaker described in this application can function as an automotive horn, a smart speaker, earphones, or other acoustic devices.

[0030] As shown in FIGS. 3 and 4, in this embodiment, an example is taken of applying the diaphragm assembly to a speaker. The speaker includes a circuit board 1 located in the middle and provided with a through groove, a diaphragm assembly fixedly arranged in the through groove, and a magnetic body arranged opposite to the diaphragm assembly for providing a magnetic field. The diaphragm assembly includes a film body 2 manufactured from a base material having a certain deformability, such as a PET (polyethylene terephthalate) polymer material, and a circuit pattern 3 spread in a planar configuration and fixedly connected to the film body 2.

[0031] The circuit pattern 3 in the diaphragm assembly is electrically connected to the circuit board 1. When the energized circuit pattern 3 is under the magnetic field action of the magnetic body, the film body 2 is reciprocally deformed along the thickness direction of the diaphragm assembly, thereby generating vibration and sound.

[0032] In some embodiments, the diaphragm assembly includes a film body 2 and a circuit pattern 3 fixedly connected to the film body 2 in an adhesion process.

[0033] In this embodiment, region N is the main vibration region of the diaphragm assembly. Taking region N as an example, several magnetization regions are provided on the film body 2. The circuit pattern 3 includes several copper sheets 301 arranged to correspond one by one to each magnetization region, and an isolation gap 302 is provided between two adjacent copper sheets 301.

[0034] At least some of the copper sheets 301 are provided with several balance gaps 3011 arranged along the width direction, which partition the copper sheet 301 into several strips 3012.

[0035] Specifically, at least some of the copper sheets 301 are provided with balance gaps 3011, which partition the wide copper sheet 301 into several strips 3012 arranged at intervals. That is, adding several balance gaps 3011 between two adjacent isolation gaps 302 is equivalent to adding several new non - copper - coated regions between two adjacent original non - copper - coated regions. Thereby, the distance difference between two adjacent non - copper - coated regions is reduced, the uniformity of copper coating on the film body 2 is improved, and as a result, the overall smoothness and stability of the diaphragm assembly during vibration are improved, and the sound distortion is reduced.

[0036] In some embodiments, based on the copper sheet 301 with the minimum width size, the width size of each strip 3012 is specified. That is, no balance gap 3011 is arranged on the copper sheet 301 with the minimum width size, and the width size of each strip 3012 is made equal to the width size of the copper sheet 301 with the minimum width size. In this way, it can be ensured that the distance between two adjacent non - copper - coated regions is consistent, and the uniformity of the distribution of the strips 3012 is improved to a certain extent.

[0037] In some other embodiments, the width sizes of the isolation gap 302 and the balance gap 3011 are made equal, that is, the distances between two adjacent strips 3012 are also made the same, further improving the uniformity of the distribution of the strips 3012, significantly enhancing the uniformity of the force received by the film body 2, and significantly reducing the sound distortion.

[0038] In some other embodiments, the width size of the strip 3012 may be made larger than the width size of the isolation gap 302, avoiding the occurrence of insufficient vibration force due to excessive blank space.

[0039] In this embodiment, each of the copper sheets 301 is arranged to be connected in parallel, that is, the current provided by the circuit board to each of the copper sheets 301 at the same time is equal. Further, the same ends of all the strips 3012 belonging to the same copper sheet 301 are electrically connected to each other, that is, all the strips 3012 belonging to the same copper sheet 301 are also arranged to be connected in parallel. The number of the partitioned strips 3012 of each copper sheet 301 is directly proportional to the average magnetic field strength of the corresponding magnetization region, whereby the current passing through each strip 3012 belonging to the same copper sheet 301 is made the same, and further, the weight and the received Ampere force of each of the strips 3012 are also made the same.

[0040] The following is an example for the case where the number of magnetization regions is 5: (1) As shown in FIG. 4, the film body is partitioned into a magnetization region A1, a magnetization region A2, a magnetization region A3, a magnetization region A4, and a magnetization region A5, and the corresponding copper sheets are denoted as a copper sheet B1, a copper sheet B2, a copper sheet B3, a copper sheet B4, and a copper sheet B5 in sequence. An isolation gap 302 is provided between any two adjacent copper sheets 301; (2) Assume that the average magnetic field strength of the magnetization region A1 is 1H, the average magnetic field strength of the magnetization region A2 is 2H, the average magnetic field strength of the magnetization region A3 is 5H, the average magnetic field strength of the magnetization region A4 is 2H, and the average magnetic field strength of the magnetization region A5 is 1H. Then, the copper sheets B1 and B5 remain unchanged, and one balance gap 3011 is opened in each of the copper sheets B2 and B4. As a result, both the copper sheets B2 and B4 are partitioned into two strips 3012. Four balance gaps 3011 are opened in the copper sheet B3, so that the copper sheet B3 is uniformly partitioned into five strips 3012. The width sizes of the copper sheet B1, each strip 3012, and the copper sheet B5 are all the same, and the width sizes of each balance gap 3011 and each isolation gap 302 are also equal; (3) After introducing equal currents into each copper sheet 301 of the circuit board 1, the magnitude of the corresponding current of each strip 3012 is inversely proportional to the number of partitions of the copper sheet 301. That is, the current of the copper sheet B1 is 1I, the current of the copper sheet B2 is 1 / 2I, the current of the copper sheet B3 is 1 / 5I, the current of the copper sheet B4 is 1 / 2I, and the current of the copper sheet B5 is 1I; (4) Generally, the length sizes of each strip 3012 are equal. Since the magnitude of the Ampere force is directly proportional to the magnetic field strength and inversely proportional to the magnitude of the current, in this case, the forces received by each strip 3012 are equal. That is, the force received by the copper sheet B1 is 1L * 1I = 1F, the force received by each strip of the copper sheet B2 is 2L * 1 / 2I = 1F, the force received by each strip of the copper sheet B3 is 5L * 1 / 5I = 1F, the force received by each strip of the copper sheet B4 is 2L * 1 / 2I = 1F, and the force received by each strip of the copper sheet B5 is 1L * 1I = 1F. Furthermore, since the widths of each strip 3012 are the same, the weights are also the same.

[0041] Therefore, in the diaphragm assembly provided by this embodiment, the weights of the strips 3012 between two adjacent non - copper - coated regions are the same, and the force - receiving situations are also the same. Thus, the smoothness and stability of the vibration of the film body 2 are greatly improved.

[0042] Furthermore, in the diaphragm assembly provided by the embodiments of the present application, the same mass of copper sheet can arrange a film body with a larger area, saving materials. The intervals between two adjacent non-copper-coated regions are the same, reducing the distance difference between two adjacent non-copper-coated regions, improving the uniformity of copper coating on the film body, and as a result, improving the overall smoothness and stability when the diaphragm assembly vibrates and reducing sound distortion. The shape of the film body is not limited and may be, for example, rectangular, circular, elliptical, or an irregular polygon, etc. Through reasonable region partitioning, corresponding magnetization regions can be obtained, and through wiring design, the adaptability of the diaphragm assembly is strong.

[0043] Any combination may be made for each technical feature of the embodiments described above. For the sake of brevity of description, all possible combinations of each technical feature of the above embodiments are not described. However, as long as there is no contradiction in the combination of these technical features, any of them may be regarded as within the scope of the description in this specification.

[0044] The embodiments described above only show some embodiments of the present application, and the description is specific and detailed. However, it should not be understood as a limitation to the scope of the patent application. Here, for those skilled in the art, on the premise of not departing from the concept of the present application, some modifications and improvements can be made, and all of these modifications and improvements fall within the protection scope of the present application. Therefore, the protection scope of the patent of the present application should be based on the appended claims.

Claims

1. A diaphragm assembly, comprising: A film body provided with several magnetization regions; A circuit pattern fixedly arranged on the film body, comprising several copper sheets arranged in one-to-one correspondence with each of the magnetization regions, and a circuit pattern provided with isolation gaps between two adjacent copper sheets; At least some of the copper sheets are provided with several balance gaps arranged along the width direction, thereby partitioning the copper sheets into several strips, A diaphragm assembly in which the balance gap is not provided in the copper sheet with the smallest width size.

2. The diaphragm assembly according to claim 1, wherein the width size of each of the strips is equal to the width size of the copper sheet with the smallest width size.

3. The diaphragm assembly according to claim 2, wherein the width sizes of the isolation gap and the balance gap are equal.

4. The diaphragm assembly according to claim 1, wherein the width size of the strip is larger than the width size of the isolation gap.

5. The diaphragm assembly according to claim 1, wherein all the strips belonging to the same copper sheet are arranged to be connected in parallel.

6. The diaphragm assembly according to claim 1, wherein the several copper sheets are arranged to be connected in parallel.

7. The diaphragm assembly according to claim 1, wherein the circuit pattern is fixedly connected to the film body in an adhesion process.

8. The diaphragm assembly according to claim 1, wherein the film body is made of a deformable material.

9. A speaker comprising a magnetic body for providing a magnetic field, a circuit board for providing a current, and the diaphragm assembly according to any one of claims 1 to 8, wherein an end portion of the circuit pattern is electrically connected to the circuit board.

10. The speaker according to claim 9, wherein the circuit board provides equal currents to each of the copper sheets at the same time.

11. The speaker according to claim 9, wherein a through groove is provided in an intermediate portion of the circuit board, and the film body is fixedly disposed in the through groove.

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