Multilayer electronic component

Abstract

To solve a problem in which dielectric sheets and internal electrodes are elongated in the process of stacking and compressing multilayer electronic components, which adversely affects withstand voltage characteristics and high temperature reliability, and also to solve a problem in which withstand voltage characteristics and high temperature reliability are aggravated more when internal ceramic electrodes and dielectric layers are thinned to achieve high integration, miniaturization, and high capacitance.SOLUTION: A multilayer electronic component according to an embodiment of the present invention may include a body including a dielectric layer and first and second internal electrodes disposed to oppose each other with the dielectric layer interposed therebetween and also including first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction.SELECTED DRAWING: Figure 6

Description

Technical Field

[0001] The present invention relates to a multilayer electronic component. [Background Art] A multilayer ceramic capacitor (MLCC), which is one of multilayer electronic components, is a chip-type capacitor that is mounted on a printed circuit board of various electronic products such as video devices like liquid crystal display (LCD) and plasma display panel (PDP), computers, smartphones, and mobile phones, and serves to charge or discharge electricity.

[0002] Such a multilayer ceramic capacitor can be used as a component of various electronic devices due to its advantages of being small in size while ensuring high capacitance and easy to mount. Recently, with the miniaturization and multifunctionalization of electronic products, the requirements for high integration and high capacitance of multilayer ceramic capacitors have increased, and the space between multilayer ceramic capacitors has been minimized.

[0003] In addition, as multilayer ceramic capacitors are also used in automobiles or infotainment systems, the requirements for high reliability, high strength characteristics, and miniaturization have been increasing. In order to achieve such high integration, miniaturization, and high capacitance, it is necessary to reduce the thickness of the dielectric layer and the internal electrodes and increase the number of layers. Currently, the thickness of the dielectric layer has reached a level of about 0.4 μm, and further thinning is continuing.

[0004] However, when the dielectric layer is formed to have a thickness of less than 0.4 μm, there is a problem that it is difficult to ensure the breakdown voltage characteristics, and there is a problem that the temperature stability at high temperatures cannot be ensured due to the thinning of the dielectric layer. In a conventional multilayer ceramic capacitor, the dielectric sheet and the internal electrodes are stretched during the lamination and pressure bonding processes in the manufacturing process, which may cause problems such as poor breakdown voltage characteristics and high-temperature reliability. Such problems can be exacerbated by thinning the internal electrodes and the dielectric layer in order to achieve high integration, miniaturization, and high capacitance.

Summary of the Invention

Problems to be Solved by the Invention

[0005] One of several objects of the present invention is to solve the problem that the dielectric sheet and the internal electrodes are stretched during the process of laminating and pressure bonding a multilayer electronic component, which has an adverse effect on the breakdown voltage characteristics and high-temperature reliability. One of several objects of the present invention is to solve the problem that when the internal ceramic electrodes and the dielectric layer are thinned in order to achieve high integration, miniaturization, and high capacitance, the breakdown voltage characteristics and high-temperature reliability become even weaker.

[0006] However, the object of the present invention is not limited to the above content, and can be more easily understood in the process of describing specific embodiments of the present invention.

Means for Solving the Problems

[0007] A multilayer electronic component according to an embodiment of the present invention includes a first internal electrode and a second internal electrode that are arranged to face each other with a dielectric layer interposed therebetween, a first surface and a second surface that face each other in a first direction, a third surface and a fourth surface that are connected to the first surface and the second surface and face each other in a second direction, a fifth surface and a sixth surface that are connected from the first surface to the fourth surface and face each other in a third direction, a main body, a first external electrode and a second external electrode that are arranged outside the main body and are respectively connected to the first internal electrode and the second internal electrode. The main body includes a capacitance forming portion in which a capacitance is formed including the first internal electrode and the second internal electrode that are arranged to face each other with the dielectric layer interposed therebetween, a cover portion formed on the upper and lower portions of the capacitance forming portion, and a first margin portion arranged on one surface and the other surface of the capacitance forming portion in the second direction. When the average hardness of the cover portion is Hc and the average hardness of the first margin portion is H1, -3.0 < {1 - (Hc / H1)} × 100 ≤ 0.4 can be satisfied.

[0008] A multilayer electronic component according to an embodiment of the present invention includes a dielectric layer, a first internal electrode and a second internal electrode that are arranged to face each other with the dielectric layer interposed therebetween, a first surface and a second surface that face each other in a first direction, a third surface and a fourth surface that are connected to the first surface and the second surface and face each other in a second direction, a fifth surface and a sixth surface that are connected from the first surface to the fourth surface and face each other in a third direction, a main body, a first external electrode and a second external electrode that are arranged outside the main body and are respectively connected to the first internal electrode and the second internal electrode. The main body includes a capacitance forming portion in which a capacitance is formed including the first internal electrode and the second internal electrode that are arranged to face each other with the dielectric layer interposed therebetween, a cover portion formed on one surface and the other surface of the capacitance forming portion in the first direction, and a second margin portion arranged on one surface and the other surface of the capacitance forming portion in the third direction. When the average hardness of the cover portion is Hc and the average hardness of the second margin portion is H2, -3.0 < {1 - (Hc / H2)} × 100 ≤ 0.4 can be satisfied.

Advantages of the Invention

[0009] One of the effects of the present invention is to minimize the phenomenon of the dielectric layer and the internal electrodes stretching during the lamination and pressing processes of the multilayer electronic component, thereby improving the breakdown voltage characteristics and high-temperature reliability. One of the effects of the present invention is to ensure excellent breakdown voltage characteristics and high-temperature reliability even in a multilayer electronic component in which the internal electrodes and the dielectric layer are made thin.

[0010] However, the various and beneficial advantages and effects of the present invention are not limited to the above-described content, and can be more easily understood in the process of explaining the specific embodiments of the present invention.

Brief Description of the Drawings

[0011]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Modes for Carrying Out the Invention

[0012] Hereinafter, embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Also, the embodiments of the present invention are provided to more fully explain the present invention to ordinary technicians. Therefore, for the sake of a clearer explanation, elements such as the shape and size in the drawings may be enlarged or reduced (or emphasized or simplified), and elements denoted by the same reference numerals in the drawings are the same elements.

[0013] And, in order to clearly explain the present invention in the drawings, parts not related to the explanation are omitted, and the size and thickness of each configuration shown in the drawings are arbitrarily shown for the convenience of explanation, so the present invention is not necessarily limited to what is shown in the drawings. For components having the same function within the scope of the same concept, the same reference numerals are used for explanation. Furthermore, throughout the specification, when a certain part "includes" a certain component, this means that other components can be further included, unless there is a particularly contrary description, and it does not exclude other components.

[0014] In the drawings, the first direction can be defined as the stacking direction or the thickness T direction, the second direction as the length L direction, and the third direction as the width W direction.

[0015] Stacked electronic component Hereinafter, with reference to FIGS. 1 to 6, a stacked electronic component according to an embodiment of the present invention will be described in detail.

[0016] A stacked electronic component 100 according to an embodiment of the present invention includes a dielectric layer and a first internal electrode and a second internal electrode arranged to face each other with the dielectric layer interposed therebetween, and includes a main body including a first surface and a second surface facing each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and facing each other in the second direction, and a fifth surface and a sixth surface connected from the first surface to the fourth surface and facing each other in the third direction.

[0017] The main body 110 has a dielectric layer 111, a first internal electrode, and a second internal electrode 121 and 122 laminated alternately. There is no particular limitation on the specific shape of the main body 110. As shown in the figure, the main body 110 can be in a hexahedron shape or a shape similar thereto. Due to the shrinkage of the ceramic powder contained in the main body 110 during the firing process, the main body 110 does not have a hexahedron shape with perfect straight lines, but can have a substantially hexahedron shape.

[0018] The main body 110 can have a first surface 1 and a second surface 2 facing each other in a first direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and facing each other in a second direction, and a fifth surface 5 and a sixth surface 6 connected to the first surface 1 and the second surface 2, connected to the third surface 3 and the fourth surface 4, and facing each other in a third direction.

[0019] The plurality of dielectric layers 111 forming the main body 110 are in a fired state, and the boundary between adjacent dielectric layers 111 can be integrated to the extent that it is difficult to confirm without using a scanning electron microscope (SEM).

[0020] The raw material for forming the dielectric layer 111 is not particularly limited as long as sufficient capacitance can be obtained. For example, a barium titanate-based material, a lead composite perovskite-based material, or a strontium titanate-based material can be used. The barium titanate-based material can include BaTiO3-based ceramic powder. Examples of the ceramic powder include BaTiO3, (Ba 1‐x Ca x )TiO3, Ba(Ti 1‐y Ca y )O3, (Ba 1‐x Ca x )(Ti 1‐y Zr y )O3, or Ba(Ti 1‐y Zr y )O3, etc.

[0021] The material for forming the dielectric layer 111 can be powder such as barium titanate (BaTiO3), and various ceramic additives, organic solvents, binders, dispersants, etc. can be added according to the purpose of the present invention.

[0022] Referring to FIG. 2, the main body 110 includes a capacitance forming portion A that is disposed inside the main body 110 and includes a first internal electrode 121 and a second internal electrode 122 that are disposed to face each other with the dielectric layer 111 interposed therebetween, and capacitances are formed, and cover portions 112 and 113 formed on the upper and lower portions of the capacitance forming portion A.

[0023] Also, the capacitance forming portion A is a portion that contributes to the capacitance formation of the multilayer electronic component 100, and can be formed by repeatedly laminating a plurality of first internal electrodes 121 and second internal electrodes 122 with the dielectric layer 111 interposed therebetween.

[0024] The upper cover portion 112 and the lower cover portion 113 can be formed by laminating a single dielectric layer or two or more dielectric layers in the thickness direction on the upper and lower surfaces of the capacitance forming portion A, respectively, and can basically play a role of preventing damage to the internal electrodes due to physical or chemical stress.

[0025] The upper cover portion 112 and the lower cover portion 113 do not include internal electrodes and can include the same material as the dielectric layer 111. That is, the upper cover portion 112 and the lower cover portion 113 can include a ceramic material, for example, a barium titanate (BaTiO3)-based ceramic material.

[0026] The main body 110 of the multilayer electronic component 100 according to an embodiment of the present invention can include first margin portions 114 and 115 disposed on one surface and the other surface in the second direction of the capacitance forming portion A.

[0027] Referring to FIG. 2, the margin portions 114 and 115 in the second direction can include a first margin portion 114 disposed on the third surface 3 of the main body 110 and a first margin portion 115 disposed on the fourth surface 4. That is, the first margin portions 114 and 115 may be disposed on both side surfaces in the length direction of the main body 110.

[0028] As shown in FIG. 2, the first margin portions 114 and 115 can mean the region occupied by the dielectric layer in the region between the end in the second direction of the capacitance forming portion and the third and fourth surfaces in the cross section obtained by cutting the main body 110 in the first and second directions.

[0029] The first margin portions 114 and 115 can basically serve to prevent the first internal electrode and the second external electrode from being electrically connected, or to prevent the second internal electrode and the first external electrode from being electrically connected, and can serve to prevent damage to the internal electrode due to physical or chemical stress.

[0030] The main body 110 of the multilayer electronic component 100 according to an embodiment of the present invention can include second margin portions 116 and 117 disposed on one surface and the other surface in the third direction of the capacitance forming portion A. Referring to FIG. 3, the margin portions 116 and 117 in the third direction can include a second margin portion 116 disposed on the fifth surface 5 of the main body 110 and a second margin portion 117 disposed on the sixth surface 6. That is, the second margin portions 116 and 117 can be disposed on both side surfaces in the width direction of the main body 110.

[0031] As shown in FIG. 3, the second margin portion can mean the region occupied by the dielectric layer in the region between the end in the second direction of the capacitance forming portion and the fifth and sixth surfaces in the cross section obtained by cutting the main body 110 in the first and third directions. The second margin portions 116 and 117 can basically serve to prevent damage to the internal electrode due to physical or chemical stress.

[0032] The second margin portions 116 and 117 may be formed by applying a conductive paste to form internal electrodes except for the locations where the margin portions are formed on the ceramic green sheet. Further, in order to suppress the step difference caused by the internal electrodes 121 and 122, after cutting so that the internal electrodes are exposed on the fifth surface 5 and the sixth surface 6 of the main body after lamination, a single dielectric layer or two or more dielectric layers may be laminated in the width direction on both side surfaces of the capacitance forming portion A to form the second margin portions 116 and 117.

[0033] The internal electrodes 121 and 122 can be alternately arranged with the dielectric layer 111. The internal electrodes 121 and 122 can include a first internal electrode 121 and a second internal electrode 122. The first internal electrode 121 and the second internal electrode 122 are alternately arranged so as to face each other with the dielectric layer 111 constituting the main body 110 interposed therebetween, and can be in contact with the first external electrode and the second external electrode at the third surface 3 and the fourth surface 4 of the main body 110, respectively.

[0034] Referring to FIG. 2, the first internal electrode 121 can be separated from the fourth surface 4 and be in contact with the first external electrode at the third surface 3, and the second internal electrode 122 can be separated from the third surface 3 and be in contact with the second external electrode at the fourth surface 4. At this time, the twelfth internal electrode 121 and the second internal electrode 122 may be separated from each other by the dielectric layer 111 disposed in the middle.

[0035] Referring to FIG. 4, the main body 110 can be formed by alternately laminating a ceramic green sheet printed with the first internal electrode 121 and a ceramic green sheet printed with the second internal electrode 122 and then firing them.

[0036] The conductive metal contained in the internal electrodes 121 and 122 may be one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof, and the present invention is not limited thereto.

[0037] In addition, the internal electrodes 121 and 122 can be formed by printing a conductive paste on a ceramic green sheet, and a printing method of the conductive paste for the internal electrodes can use a screen printing method, a gravure printing method, or the like.

[0038] Referring to FIGS. 1 to 2, a multilayer electronic component 100 according to an embodiment of the present invention is disposed outside the main body 100 and the main body 110, and includes a first external electrode 131 connected to the first internal electrode 121 and a second external electrode 132 connected to the second internal electrode 122.

[0039] On the other hand, the external electrodes 131 and 132 may be formed of any material as long as it has electrical conductivity such as metal, and a specific material may be determined in consideration of electrical characteristics, structural stability, etc., and may further have a multilayer structure.

[0040] For example, the external electrodes 131 and 132 can include electrode layers 131a and 132a disposed on the main body 110 and plating layers 131b and 132b formed on the electrode layers 131a and 132a. More specific examples of the electrode layers 131a and 132a may be fired electrodes including a conductive metal and glass, or resin-based electrodes including a conductive metal and a resin.

[0041] In addition, the electrode layers 131a and 132a may be in a form in which a fired electrode and a resin-based electrode are sequentially formed on the main body. Further, the electrode layers 131a and 132a may be formed by a method of transferring a sheet containing a conductive metal onto the main body, or may be formed in a form of transferring a sheet containing a conductive metal onto a fired electrode.

[0042] As the conductive metal included in the electrode layers 131a and 132a, a material having excellent electrical conductivity can be used, but it is not particularly limited. For example, the conductive metal may be one or more of nickel (Ni), copper (Cu), and alloys thereof.

[0043] The plating layers 131b and 132b serve to improve the mounting characteristics. The types of the plating layers 131b and 132b are not particularly limited, and may be plating layers containing one or more of Ni, Sn, Pd, and alloys thereof, and may be formed of a plurality of layers.

[0044] More specific examples of the plating layers 131b and 132b are as follows. The plating layers 131b and 132b may be Ni plating layers or Sn plating layers, and may be in a form in which a Ni plating layer and a Sn plating layer are sequentially formed on the electrode layers 131a and 132a, or may be in a form in which a Sn plating layer, a Ni plating layer, and a Sn plating layer are sequentially formed. Further, the plating layers 131b and 132b may include a plurality of Ni plating layers and / or a plurality of Sn plating layers.

[0045] In the case of a conventional multilayer electronic component, there may occur a phenomenon in which an internal electrode adjacent to a margin portion becomes thinner than that at the central portion due to the manufacturing process. This phenomenon may occur while pressure is applied to the multilayer electronic component by a lamination and pressing process during the manufacturing process of the capacitor, and the dielectric layer and the internal electrode are stretched. In particular, in the case of a multilayer electronic component manufactured in this way, there may be a problem of poor withstand voltage characteristics and poor high-temperature reliability in a high-temperature and high-pressure environment. Therefore, in order to improve the high-temperature reliability and high-temperature accelerated life of the multilayer electronic component, it is necessary to minimize the stretching of the internal electrode and the dielectric layer.

[0046] For the multilayer electronic component 100 according to an embodiment of the present invention, when the average hardness of the cover portions 112 and 113 is Hc and the average hardness of the first margin portions 114 and 115 is H1, -3.0 < {1 - (Hc / H1)} × 100 ≤ 0.4 can be satisfied.

[0047] When the value of {1-(Hc / H1)}x100 is -3.0 or less, the degree of elongation of the dielectric layer and the internal electrodes cannot be reduced, and the effect of improving the high-temperature reliability and breakdown voltage characteristics is insufficient. When the value of {1-(Hc / H1)}x100 exceeds -3.0 and is 0.4 or less, the degree of elongation of the dielectric layer and the internal electrodes is small, and the high-temperature reliability and breakdown voltage characteristics can be improved. When the value of {1-(Hc / H1)}x100 exceeds 0.4, excessive costs may be consumed to achieve the hardness difference, or the difficulty of the process may increase, making it difficult to improve the reliability and breakdown voltage characteristics.

[0048] Therefore, in the multilayer electronic component 100 according to an embodiment of the present invention, when the value of {1-(Hc / H1)}x100 exceeds -3.0 and satisfies 0.4 or less, the high-temperature reliability and breakdown voltage characteristics can be improved by reducing the degree of elongation of the dielectric layer and the internal electrodes.

[0049] Further, in the multilayer electronic component 100 according to an embodiment of the present invention, when the average hardness of the cover portions 112 and 113 is Hc and the average hardness of the second margin portions 116 and 117 is H2, -3.0 < {1-(Hc / H2)}x100 ≤ 0.4 can be satisfied.

[0050] When the value of {1-(Hc / H2)}x100 is -3.0 or less, the degree of elongation of the dielectric layer and the internal electrodes cannot be reduced, and the effect of improving the high-temperature reliability and breakdown voltage characteristics is insufficient. When the value of {1-(Hc / H2)}x100 exceeds -3.0 and is 0.4 or less, the degree of elongation of the dielectric layer and the internal electrodes is small, and the high-temperature reliability and breakdown voltage characteristics can be improved. When the value of {1-(Hc / H2)}x100 exceeds 0.4, excessive costs may be consumed to achieve the hardness difference, or the difficulty of the process may increase, making it difficult to improve the reliability and breakdown voltage characteristics.

[0051] Therefore, in the multilayer electronic component 100 according to one embodiment of the present invention, by reducing the degree to which the dielectric layer and the internal electrodes extend such that the value of {1-(Hc / H2)}x100 exceeds -3.0 and satisfies 0.4 or less, the high-temperature reliability and the withstand voltage characteristics can be improved.

[0052] The method for measuring the average hardness of the first margin portions 114 and 115, the second margin portions 116 and 117, and the cover portions 112 and 113 is as follows. The method for measuring the average hardness of the first margin portions 114 and 115 and the cover portions 112 and 113 is, first, cutting an L-T cross section at the central portion in the width direction of the multilayer electronic component 100 and molding it. Then, it can be the average value of the hardness measured at any 20 points P1 and P2 of the first margin portions 114 and 115 and the cover portions 112 and 113 in the L-T cross section using a nanoindenter (KLA Corporation, product name G200).

[0053] The method for measuring the average hardness of the second margin portions 116 and 117 is, first, cutting a W-T cross section at the central portion in the length direction of the multilayer electronic component 100 and molding it. Then, it can be the average value of the hardness measured at any 20 points P3 of the second margin portions 116 and 117 in the W-T cross section using a nanoindenter.

[0054] On the other hand, the method for controlling the average hardness of the first margin portions 114 and 115, the second margin portions 116 and 117, and the cover portions 112 and 113 is not particularly limited. For example, mineral spirits can be added to the sheet forming the first margin portions 114 and 115, the second margin portions 116 and 117, and the cover portions 112 and 113, and the amount thereof can be adjusted to control the average hardness.

[0055] Mineral spirits is a type of petroleum solvent that contains specific liquid hydrocarbon components of petroleum. Using kerosene [boiling point: 150 - 320°C] or naphtha [boiling point: 35 - 220°C] produced by an essential oil company as raw materials, after impurity removal and desulfurization processes, a product with a desired boiling point distribution is obtained through a distillation separation process. Subsequently, mineral spirits with a desired composition can be obtained through adjustment of the aromatic content. Due to such differences in boiling points, air permeability and fluidity are imparted to the ceramic sheet.

[0056] Specifically, as the content of mineral spirits in the ceramic green sheet forming the first margin portions 114, 115, the second margin portions 116, 117, and the cover portions 112, 113 increases, the fluidity of the organic matter in the margin portions improves, resulting in a higher average hardness. Conversely, as the content of mineral spirits decreases, the average hardness decreases.

[0057] The content of mineral spirits in the ceramic green sheet may be 2.5 wt% or less based on the total weight of the ceramic green sheet. However, mineral spirits may evaporate during the sintering process and may not be detected in the final product.

[0058] In one embodiment, the average hardness of the first margin portions 114, 115 may be substantially the same as the average hardness of the dielectric layer 111 included in the capacitance forming portion A. By reducing the step differences that may occur during the lamination and crimping processes of the multilayer electronic component 100, the breakdown voltage characteristics and high-temperature reliability of the multilayer electronic component 100 can be further improved.

[0059] In one embodiment, the average hardness of the second margin portions 116, 117 may be substantially the same as the average hardness of the dielectric layer 111 included in the capacitance forming portion A. By reducing the step differences that may occur during the lamination and crimping processes of the multilayer electronic component 100, the breakdown voltage characteristics and high-temperature reliability of the multilayer electronic component 100 can be further improved.

[0060] When the average hardness is substantially the same, it does not necessarily mean that the values of the average hardness measured by the method for measuring the average hardness numerically coincide, and it can mean that there is a difference within 0.1% or within 0.05% or within 0.01% of the value of the average hardness.

[0061] In order to simultaneously achieve miniaturization and high capacitance of the multilayer electronic component 100, it is necessary to reduce the thicknesses of the dielectric layer and the internal electrodes and increase the number of layers. However, when the dielectric layer is formed as a thin layer, there are problems such as difficulty in ensuring the withstand voltage characteristics and the possibility of problems such as inability to ensure the high-temperature reliability of the dielectric layer.

[0062] Also, the thickness of the dielectric layer does not particularly need to be limited. However, when the average thickness of the dielectric layer is formed to be 0.4 μm or less, there are problems that it is difficult to control process defects that may occur in the margin portion, it is difficult to ensure the withstand voltage characteristics, and it is also difficult to ensure the high-temperature reliability.

[0063] Based on one embodiment of the present invention, when -3.0 < {1 - (Hc / H1)} × 100 ≤ 0.4 is satisfied or -3.0 < {1 - (Hc / H2)} × 100 ≤ 0.4 is satisfied, even when the average thickness of the dielectric layer 111 is 0.4 μm or less, excellent withstand voltage characteristics can be ensured, and at the same time, excellent high-temperature reliability can be ensured. Therefore, when the average thickness of the dielectric layer 111 is 0.4 μm or less, the effects of improving the withstand voltage characteristics and the high-temperature reliability according to the present invention can be made more remarkable.

[0064] On the other hand, the average thickness of the dielectric layer 111 being 0.4 μm or less does not necessarily mean that it should have a numerical value of 0.4 μm or less, and it can mean that it has a dielectric layer with a thickness thinner than the thickness of the dielectric layer of the conventional multilayer electronic component 100.

[0065] The average thickness of the dielectric layer 111 can mean the average thickness of the dielectric layer 111 disposed between the first internal electrode 121 and the second internal electrode 122. The average thickness of the dielectric layer 111 can be measured by scanning an image of a cross-section (L-T cross-section) in the length and thickness directions of the main body 110 with a scanning electron microscope (SEM).

[0066] For example, for any dielectric layer extracted from an image scanned with a scanning electron microscope (SEM) of a cross-section (L-T cross-section) in the length and thickness directions cut at the central portion in the width direction of the main body 110, the thickness can be measured at 30 equally spaced points in the length direction and the average value can be measured. The 30 equally spaced points can be measured in the capacitance forming portion meaning the region where the first internal electrode 121 and the second internal electrode 122 overlap each other.

[0067] The thicknesses of the first margin portions 114, 115, the second margin portions 116, 117, and the cover portions 112, 113 do not need to be particularly limited. However, when the average thickness of at least any one of the first margin portions 114, 115, the second margin portions 116, 117, and the cover portions 112, 113 is formed to be 20 μm or less, it may be difficult to prevent damage to the internal electrode due to physical or chemical stress.

[0068] Based on an embodiment of the present invention, when -3.0 < {1 - (Hc / H1)} x 100 ≦ 0.4 is satisfied or -3.0 < {1 - (Hc / H2)} x 100 ≦ 0.4 is satisfied, the thicknesses of the second margin portions 116, 117, and the cover portions 112, 113 do not need to be particularly limited. However, even when the average thickness of at least any one of the first margin portions 114, 115, the second margin portions 116, 117, and the cover portions 112, 113 is 20 μm or less, it is possible to prevent damage to the internal electrode, ensure excellent withstand voltage characteristics, and at the same time ensure excellent high-temperature reliability.

[0069] Therefore, in one embodiment, the average thickness of the first margin portions 114, 115 or the second margin portions 116, 117 may be 20 μm or less. Also, in one embodiment, the average thickness of the cover portions 112, 114 may be 20 μm or less.

[0070] The average thickness of the first margin portions 114, 115 can be measured by scanning an image of a cross-section (L-T cross-section) in the length and thickness directions of the main body 110 with a scanning electron microscope (SEM).

[0071] For example, for any first margin portions 114, 115 extracted from an image scanned with a scanning electron microscope (SEM) of a cross-section (L-T cross-section) in the length and thickness directions cut at the central portion in the width W direction of the main body 110, the thickness can be measured at 10 equally spaced points in the thickness direction and the average value can be measured.

[0072] The average thickness of the second margin portions 116, 117 can be measured by scanning an image of a cross-section (W-T cross-section) in the width and thickness directions of the main body 110 with a scanning electron microscope (SEM).

[0073] For example, for any second margin portions 116, 117 extracted from an image scanned with a scanning electron microscope (SEM) of a cross-section (W-T cross-section) in the width and thickness directions cut at the central portion in the length L direction of the main body 110, the thickness can be measured at 10 equally spaced points in the thickness direction and the average value can be measured.

[0074] The average thickness of the cover portions 112, 113 can be measured by scanning an image of a cross-section (L-T cross-section) in the length and thickness directions of the main body 110 with a scanning electron microscope (SEM).

[0075] For example, for any cover portions 112 and 113 extracted from an image obtained by scanning a cross-section in the length and thickness directions (L-T cross-section) cut at the central portion in the width W direction of the main body 110 with a scanning electron microscope (SEM), the thickness can be measured at 10 equally spaced points in the length direction and the average value can be measured.

[0076] Also, the thicknesses of the first internal electrode 121 and the second internal electrode 122 do not need to be particularly limited. However, in order to more easily achieve miniaturization and high capacitance of the multilayer electronic component 100, the average thicknesses of the first internal electrode 121 and the second internal electrode 122 may be 0.4 μm or less.

[0077] However, when the average thicknesses of the first internal electrode 121 and the second internal electrode 122 are formed to be 0.4 μm or less, there are problems that the internal electrodes are likely to expand in the lamination and pressure bonding processes, it is difficult to ensure the withstand voltage characteristics, and it is also difficult to ensure the high-temperature reliability.

[0078] Based on one embodiment of the present invention, when -3.0 < {1 - (Hc / H1)} × 100 ≤ 0.4 is satisfied or -3.0 < {1 - (Hc / H2)} × 100 ≤ 0.4 is satisfied, even when the average thicknesses of the internal electrodes 121 and 122 are 0.4 μm or less, excellent withstand voltage characteristics can be ensured, and at the same time, excellent high-temperature reliability can be ensured. Therefore, even when the average thicknesses of the first internal electrode 121 and the second internal electrode 122 are 0.4 μm or less, the effects of improving the withstand voltage characteristics and high-temperature reliability according to the present invention can be made more remarkable.

[0079] The average thicknesses of the first internal electrode 121 and the second internal electrode 122 can be measured by scanning an image of a cross-section in the length and thickness directions (L-T cross-section) of the main body 110 with a scanning electron microscope (SEM).

[0080] For example, for any first internal electrode 121 and second internal electrode 122 extracted from an image obtained by scanning a cross-section in the length and thickness directions (L-T cross-section) cut at the central portion in the width W direction of the main body 110 with a scanning electron microscope (SEM), the thickness can be measured at 30 equally spaced points in the length direction and the average value can be measured. The 30 equally spaced points can be measured in a capacitance forming portion that means a region where the first internal electrode 121 and the second internal electrode 122 overlap each other.

[0081] The size of the multilayer electronic component 100 does not particularly need to be limited. However, in order to simultaneously achieve miniaturization and high capacitance, since it is necessary to reduce the thickness of the dielectric layer and the internal electrodes and increase the number of layers, in the multilayer electronic component 100 having a size of 0402 (length × width, 0.4 mm × 0.2 mm) or less, the effects of improving the reliability and insulation resistance according to the present invention can be made more remarkable.

[0082] Therefore, when defining the distance between the third surface and the fourth surface of the main body as L and the distance between the fifth surface and the sixth surface as W, the L may be 0.4 mm or less, and the W may be 0.2 mm or less. That is, it may be a multilayer electronic component 100 having a size of 0402 (length × width, 0.4 mm × 0.2 mm) or less.

[0083] (Example 1) Table 1 below shows the changes in the average hardness H2 of the second margin portions 116 and 117 and the average hardness Hc of the cover portions 112 and 113 according to the content of mineral spirits contained in the ceramic green sheets forming the second margin portions 116 and 117 and the cover portions 112 and 113.

[0084]

Table 1

[0085] When adjusting the content of mineral spirits in the ceramic green sheet for Test Nos. 1 to 5, it can be seen that the average hardness of the second margin portions 116 and 117 and the cover portions 112 and 113 can be adjusted. However, in the case of Test Nos. 4 and 5 where the content of mineral spirits exceeds 2.5 wt%, it can be seen that the efficiency of improving the average hardness is not significant.

[0086] Therefore, in one embodiment, the second margin portions 116 and 117 or the cover portions 112 and 113 may be formed by firing a dielectric green sheet containing mineral spirits, and the content of the mineral spirits may be 2.5 wt%. On the other hand, the method of adjusting the average hardness by making the mineral spirits satisfy 2.5 wt% or less can be similarly applied to the case of the first margin portions 114 and 115.

[0087] (Example 2) Table 2 below describes the measurement of the influence of the ratio of the average hardness of the second margin portion and the average hardness of the cover portion on the withstand voltage characteristics and high-temperature reliability. First, prepare samples of multilayer electronic components with a size of 3225 (length × width, 3.2 mm × 2.5 mm), a nominal capacitance of 10 μF, and a rated voltage of 50V.

[0088] For the withstand voltage characteristics, a voltage was applied to 400 samples at room temperature from 0V until breakdown occurred, and the minimum voltage (BDV, Break Down Voltage) at which conduction started was measured and the average value was taken. For the high-temperature reliability experiment, when a voltage of 60V was applied to 400 samples in a high-temperature atmosphere of 150°C for 24 hours, the number of samples in which insulation resistance degradation or short circuit occurred was measured.

[0089]

Table 2

[0090] Test numbers 1 to 3 are cases where the value of {1 - (Hc / H2)} x 100 is -3.0 or less, and dielectric breakdown is likely to occur, so the withstand voltage characteristics are poor, and it can be confirmed that the effect of improving high-temperature reliability is insufficient. Test numbers 4 to 6 are cases where the value of {1 - (Hc / H2)} x 100 exceeds -3.0 and is 0.4 or less, and it can be confirmed that they have excellent withstand voltage characteristics and high-temperature reliability.

[0091] According to one embodiment of the present invention, by satisfying that the value of {1 - (Hc / H2)} x 100 exceeds -3.0 and is 0.4 or less, the phenomenon that the dielectric layer and the internal electrode extend during the lamination and crimping processes of the multilayer electronic component can be minimized, and the withstand voltage characteristics and high-temperature reliability can be improved.

[0092] As described above, the embodiments of the present invention have been described in detail. However, the present invention is not limited by the above-described embodiments and the attached drawings, but is limited by the attached claims. Therefore, within the scope not departing from the technical idea of the present invention described in the claims, various forms of substitution, modification, and change are possible by those having ordinary knowledge in the technical field, and it can be said that this also belongs to the scope of the present invention.

Explanation of Reference Numerals

[0093] 100: Multilayer electronic component 110: Body 111: Dielectric layer 112, 113: Cover part 114, 115: First margin part 116, 117: Second margin part 121: First internal electrode 122: Second internal electrode 131: First external electrode 132: Second external electrode 131a, 132a: Electrode layer 131b, 132b: Plated layer

Claims

1. A main body including a dielectric layer, a first internal electrode and a second internal electrode disposed to face each other with the dielectric layer therebetween, a first surface and a second surface facing each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and facing each other in a second direction perpendicular to the first direction, a fifth surface and a sixth surface connected from the first surface to the fourth surface and facing each other in a third direction perpendicular to each of the first direction and the second direction, wherein the first internal electrode and the second internal electrode are each exposed on the third surface and the fourth surface; A first external electrode and a second external electrode each disposed on the third surface and the fourth surface of the main body and connected to the first internal electrode and the second internal electrode respectively; The main body includes a capacitance forming portion in which a capacitance is formed including the first internal electrode and the second internal electrode disposed to face each other with the dielectric layer therebetween, a cover portion formed on one surface and the other surface of the capacitance forming portion in the first direction, and a first margin portion disposed on one surface and the other surface of the capacitance forming portion in the second direction; When the average hardness of the cover portion is Hc and the average hardness of the first margin portion is H1, -3.0 < {1 - (Hc / H1)} × 100 ≦ 0.4 is satisfied; The average thickness of the dielectric layer is 0.4 μm or less, and the average thickness of the first internal electrode and the second internal electrode is 0.4 μm or less; The main body further includes a second margin portion disposed on one surface and the other surface of the capacitance forming portion in the third direction; A multilayer electronic component that satisfies -3.0 < {1 - (Hc / H2)} × 100 ≦ 0.4 when the average hardness of the cover portion is Hc and the average hardness of the second margin portion is H2.

2. The multilayer electronic component according to claim 1, wherein the average hardness of the first margin portion is substantially the same as the average hardness of the dielectric layer included in the capacitance forming portion.

3. The multilayer electronic component according to claim 1 or 2, wherein the average thickness of the first margin portion is 20 μm or less.

4. The multilayer electronic component according to claim 1, wherein the average hardness of the second margin portion is substantially the same as the average hardness of the dielectric layer included in the capacitance forming portion.

5. The multilayer electronic component according to any one of claims 1 to 4, wherein the average thickness of the second margin portion is 20 μm or less.

6. The multilayer electronic component according to any one of claims 1 to 5, wherein the average thickness of the cover portion is 20 μm or less.

7. When the distance between the third surface and the fourth surface is L and the distance between the fifth surface and the sixth surface is W, the laminated electronic component according to any one of claims 1 to 6, wherein L is 0.4 mm or less and W is 0.2 mm or less.

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