Multilayer ceramic electronic component and method for manufacturing the same

Abstract

To provide a multilayer ceramic electronic component with high reliability and moisture resistance. [Solution] The multilayer ceramic electronic component includes a capacitor body including a plurality of dielectric layers 111 and a plurality of internal electrodes 121, 122, and external electrodes 131, 132 disposed on the capacitor body and electrically connected to the internal electrodes. In the capacitor body, a region where internal electrodes of opposite polarities are overlapped to form capacitance is defined as an active region 150, and a region excluding the active region is defined as a margin region 160. The margin region has a higher concentration of additive elements than the active region, and there is a concentration gradient of the additive elements from the surface of the capacitor body toward the active region.

Description

Technical Field

[0001] The present invention relates to a multilayer ceramic electronic component and a method for manufacturing the same.

Background Art

[0002] Electronic components using a ceramic material such as a capacitor, an inductor, a piezoelectric element, a varistor or a thermistor include a capacitor body made of a ceramic material, an internal electrode formed inside the body, and an external electrode installed on the surface of the capacitor body so as to be connected to the internal electrode.

[0003] As many functions in fields requiring high reliability are being electrified and the demand for them is increasing, multilayer ceramic electronic components are also required to have high reliability accordingly.

[0004] Elements that pose problems with such high reliability include moisture resistance characteristics and withstand voltage characteristics, etc. Pores existing in the margin part of the capacitor body of the multilayer ceramic electronic component and the density of the capacitor body may affect the reliability of the multilayer ceramic electronic component.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] An object of an embodiment of the present invention is to provide a multilayer ceramic electronic component and a method for manufacturing the same.

Means for Solving the Problems

[0007] One embodiment of the present invention includes a capacitor body including a plurality of dielectric layers and a plurality of internal electrodes, and an external electrode disposed on the capacitor body and electrically connected to the internal electrodes. In the margin portion of the capacitor body, the concentration of the additive element is higher than that in the active portion of the capacitor body, and there is a concentration gradient of the additive element from the surface of the capacitor body toward the active portion, providing a multilayer ceramic electronic component excellent in reliability and moisture resistance and a method for manufacturing the same.

Advantages of the Invention

[0008] According to one embodiment of the present invention, it is possible to provide a multilayer ceramic electronic component having high reliability and moisture resistance and a method for manufacturing the same.

Brief Description of the Drawings

[0009] [Figure 1] It is a perspective view schematically showing a part of a multilayer ceramic electronic component according to one embodiment of the present invention after being cut open. [Figure 2] It is a cross-sectional view taken along the line A-A' of FIG. 1. [Figure 3] It is a cross-sectional view showing the active portion and the margin portion in the capacitor body of the multilayer ceramic electronic component according to one embodiment of the present invention as regions. [Figure 4] It is a virtual graph for explaining the concentration of the additive element along the line L1-L2 of FIG. 3. [Figure 5] It is a flowchart showing a method for manufacturing a multilayer ceramic electronic component according to another embodiment of the present invention. [Figure 6a] It is a photograph of a scanning electron microscope showing a cross-section of a capacitor body according to an experimental example of the present invention. [Figure 6b] It is a photograph of a scanning electron microscope showing a cross-section of a capacitor body according to an experimental example of the present invention. [Figure 6c] It is a photograph of a scanning electron microscope showing a cross-section of a capacitor body according to an experimental example of the present invention.

Modes for Carrying Out the Invention

[0010] Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Also, the embodiments of the present invention are provided to more fully explain the present invention to those with average knowledge in the relevant technical field. Therefore, the shapes and sizes of elements in the drawings may be exaggerated for clearer explanation.

[0011] Note that, within the scope of the same concept shown in the drawings of each embodiment, components with the same function will be described using the same reference numerals.

[0012] Furthermore, throughout the specification, when a component is described as "including", it means that other components can be further included, rather than excluding other components, unless otherwise stated to the contrary.

[0013] Multilayer ceramic electronic component FIG. 1 is a perspective view schematically showing a multilayer ceramic electronic component according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view taken along line A-A' of FIG. 1.

[0014] Referring to FIG. 1, a multilayer ceramic electronic component 100 according to an embodiment of the present invention includes a capacitor body 110 and external electrodes 131 and 132.

[0015] According to an embodiment of the present invention, the (T) direction shown in FIGS. 1 and 2 is the thickness direction, the (L) direction is the length direction, and the (W) direction is the width direction.

[0016] The above thickness (T) direction means the stacking direction of the internal electrodes and the dielectric layers.

[0017] Referring to FIGS. 1 and 2, the capacitor body 110 can have an upper surface and a lower surface that face each other in the thickness direction, a first side surface and a second side surface that face each other in the width direction, and a third side surface and a fourth side surface that face each other in the length direction. Also, the shape of the capacitor body 110 is not particularly limited. For example, the capacitor body 110 can be substantially hexahedral although it is not a perfect hexahedron.

[0018] The capacitor body 110 includes a plurality of dielectric layers 111 and internal electrodes 121, 122.

[0019] The dielectric layer 111 includes a ceramic composition having a high dielectric constant, and can include, for example, a barium titanate (BaTiO3)-based dielectric.

[0020] The barium titanate (BaTiO3)-based dielectric can be understood to include pure barium titanate or a compound in which the Ba site (A site) and Ti site (B site) of barium titanate are doped with other additive elements.

[0021] The capacitor body includes internal electrodes 121, 122 formed on the dielectric layer 111.

[0022] The internal electrodes 121, 122 include a conductive metal, and the conductive metal can be nickel (Ni) although not limited thereto.

[0023] FIG. 3 is a cross-sectional view showing an active portion 150 and a margin portion 160 as regions in the capacitor body of the multilayer ceramic electronic component 100 according to an embodiment of the present invention.

[0024] As shown in FIG. 3, the capacitor body 110 can include an active portion 150 that is a region where internal electrodes are stacked to form capacitance, and a margin portion 160 disposed above, below, on both sides in the width direction, and on both sides in the length direction of the active portion. The margin portion can be a region in the capacitor body excluding the active portion.

[0025] On the other hand, the margin portion 160 includes a first region 161 adjacent to the active portion and a second region 162 adjacent to the surface of the capacitor body, based on half of the length measured in the direction from the outside of the active portion toward the capacitor body.

[0026] Unless otherwise specified, the upper and lower sides, the upper and lower surfaces are not separately distinguished in the capacitor body, and can be understood to have the same meaning as one side and the other side in the thickness direction, and one surface and the other surface facing each other in the thickness direction, respectively. The upper and lower surfaces can be understood to mean the first main surface and the second main surface facing each other in the thickness direction of the capacitor body.

[0027] The internal electrodes can include a first internal electrode 121 and a second internal electrode 122. The first and second internal electrodes 121 and 122 can be alternately arranged on the dielectric layer with the dielectric layer 111 interposed therebetween.

[0028] The first internal electrode 121 can be exposed on the third side surface of the capacitor body, and the second internal electrode 122 can be exposed on the fourth side surface of the capacitor body.

[0029] The external electrodes 131 and 132 can be arranged on the third side surface and the fourth side surface of the capacitor body and connected to the first internal electrode 121 and the second internal electrode 122. The external electrodes 131 and 132 can include a first external electrode 131 and a second external electrode 132. The first external electrode 131 can be connected to the first internal electrode 121, and the second external electrode 132 can be connected to the second internal electrode 122.

[0030] The external electrodes can be formed by applying a conductive paste to the third side surface and the fourth side surface of the capacitor body and firing it. The shape and formation method of the external electrodes are not particularly limited.

[0031] The capacitor body 110 can be formed by firing a green sheet laminate in which a first ceramic green sheet printed with an internal electrode paste and a second ceramic green sheet not printed with an internal electrode paste are laminated.

[0032] At this time, the second ceramic green sheet can constitute margin portions disposed on the upper side and the lower side of the active portion after firing, and the margin portions disposed on the upper side and the lower side of the active portion can define an upper cover layer and a lower cover layer.

[0033] The dielectric layer disposed in the active portion 150 contributes to capacitance formation, and the margin portion 160 functions to protect the active portion. Therefore, different characteristics can be required for the dielectric layer disposed in the active portion and the margin portion.

[0034] At this time, the characteristics required for the dielectric layer and the margin portion can be realized by varying the types and concentrations of additive elements contained therein.

[0035] In the case of the margin portion disposed in the direction in which the dielectric layer and the internal electrode are laminated, the concentration of the additive can be varied by using a ceramic green sheet having a composition different from that of the ceramic green sheet for forming the dielectric layer.

[0036] However, in the case of the margin portion in the direction perpendicular to the direction in which the dielectric layer and the internal electrode are laminated, for example, the width direction and the length direction, it is generally not formed of a ceramic green sheet that is distinguished from the dielectric layer disposed in the active portion.

[0037] Generally, the margin portion in the direction perpendicular to the direction in which the dielectric layer and the internal electrode are laminated is formed of the same ceramic green sheet as the dielectric layer constituting the active portion. Therefore, it is not easy to vary the concentration of the active portion and the additive.

[0038] In addition, among the directions perpendicular to the direction in which the dielectric layer and the internal electrodes are stacked, the margin portion in the direction where the internal electrodes are not drawn out can be formed separately from the active portion and can have a concentration of an additive different from that of the active portion. However, in the case of the margin portion in the direction where the internal electrodes are drawn out, since it is difficult to form the margin portion separately from the active portion, the concentration of the additive is generally the same as that of the active portion.

[0039] On the other hand, according to an embodiment of the present invention, even for the margin portion in the direction perpendicular to the direction in which the dielectric layer and the internal electrodes are stacked, the concentration of the additive different from that of the active portion can be provided, so that the characteristics of the margin portion can be improved.

[0040] According to an embodiment of the present invention, in the margin portion 160, the additive element coated on the surface during the formation of the capacitor body can diffuse into the capacitor body and can have a higher additive concentration than the active portion 150.

[0041] For example, when the direction in which the internal electrodes 121 and 122 and the dielectric layer 111 are stacked is defined as the thickness direction, the direction perpendicular to the thickness direction and in which one end of the internal electrode is exposed on the surface of the capacitor body is defined as the length direction, and one direction perpendicular to the thickness direction and the length direction is defined as the width direction, the margin portion in the length direction and the margin portion in the thickness direction of the capacitor body have a higher concentration of the additive element than the active portion and can have a concentration gradient of the additive element from the surface of the capacitor body toward the active portion.

[0042] For example, the concentration of the additive element can gradually decrease from the surface of the capacitor body 110 toward the active portion 150.

[0043] The additive element can be one or more selected from Mg, Mn, Zr, Ti, Li, Mo, Nb, Cu, and rare earth elements. When the margin portion further contains one or more elements selected from Mg, Mn, Zr, Ti, Li, Mo, Nb, Cu, and rare earth elements as additives, sintering of the dielectric can be suppressed and the density of the margin portion can be improved.

[0044] On the one hand, the margin part includes a first region adjacent to the active part and a second region adjacent to the surface of the capacitor body, based on half of the length measured in the direction from the outside of the active part toward the capacitor body, and the first region and the second region can have different densities from each other.

[0045] According to an embodiment of the present invention, by making the density of the first region higher than the density of the second region, a multilayer ceramic electronic component excellent in moisture resistance characteristics can be provided. The density of the margin part can be adjusted according to the concentration of the additive element, and the concentration of the additive element must satisfy an appropriate range in order to have a high density.

[0046] At this time, the additive element can be diffused so that the density of the first region becomes higher than the density of the second region.

[0047] FIG. 4 is a virtual graph for explaining the concentration of the additive element along the line L1-L2 in FIG. 3.

[0048] For example, as shown in FIG. 4, when diffusing an appropriate concentration of the additive element into the first region so that the first region has a high density, the concentration of the additive element in the second region becomes higher than that in the first region. At this time, although the density of the second region may be slightly lower than that of the first region because the amount of the additive element is too large, by increasing the density of the first region adjacent to the active part, the moisture resistance characteristics of the multilayer ceramic electronic component can be improved.

[0049] According to an embodiment of the present invention, the concentration of the additive element in the active part 150 may be 2.0 mol% or less, and the concentration of the additive element in the first region 161 of the margin part may be 0.01 mol% or more and 4.0 mol% or less. When the concentration of the additive element in the first region 161 of the margin part is 0.01 mol% or more and 4.0 mol% or less, the moisture resistance characteristics of the multilayer ceramic electronic component can be effectively improved by improving the density of the first region.

[0050] On the other hand, the concentration of the additive element in the second region 162 of the margin portion may be 0.2 mol% or more and 8.0 mol% or less.

[0051] Method for manufacturing a multilayer ceramic electronic component Hereinafter, a method for manufacturing a multilayer ceramic electronic component according to an embodiment of the present invention will be described, but the method for manufacturing a multilayer ceramic electronic component of the present invention is not necessarily limited thereto.

[0052] FIG. 5 is a flowchart showing a method for manufacturing a multilayer ceramic electronic component according to another embodiment of the present invention.

[0053] The method for manufacturing a multilayer ceramic electronic component according to the present embodiment includes a step S1 of providing a plurality of first ceramic green sheets and a plurality of second ceramic green sheets, a step S2 of applying an internal electrode paste to the first ceramic green sheet, a step S3 of laminating the first ceramic green sheet and the second ceramic green sheet to which the internal electrode paste has been applied to provide a green sheet laminate, a step S4 of forming a coating layer containing an additive element on the surface of the green sheet laminate, and a step S5 of firing the green sheet laminate so that the additive element diffuses therein to form a capacitor body.

[0054] Among the descriptions of the method for manufacturing a multilayer ceramic electronic component according to the present embodiment, the content overlapping with the multilayer ceramic electronic component according to the above-described embodiment of the present invention is omitted, and the description will focus on the differences.

[0055] The first green sheet is a green sheet on which an internal electrode pattern is formed, and the second green sheet is a green sheet for forming an upper cover layer and a lower cover layer. The first and second green sheets can each be formed of a plurality of sheets.

[0056] The step S1 of providing the plurality of ceramic green sheets can be performed by applying and drying a slurry containing dielectric powder on a carrier film.

[0057] The step S2 of forming the internal electrode pattern can be performed by printing a paste for forming an internal electrode on the ceramic green sheet, but the method of forming the internal electrode pattern is not limited thereto.

[0058] The step S3 of providing the green sheet laminate can be performed by laminating a first green sheet on which the internal electrode pattern is formed and a second green sheet on which the internal electrode pattern is not formed.

[0059] The second green sheet can be laminated so as to be disposed above and below the region where the first green sheet is laminated.

[0060] Thereafter, the step S5 of forming a coating layer containing an additive element on the surface of the green sheet laminate can be performed by dipping the green sheet laminate into a solution for forming the coating layer, or by using a vapor deposition method such as physical vapor deposition (PVD) or chemical vapor deposition (CVD), but it is not particularly limited.

[0061] Next, the green sheet laminate can be fired so that the additive element diffuses therein to form a capacitor body.

[0062] The step S5 of providing the capacitor body can be performed by firing the green sheet laminate.

[0063] On the other hand, the amount of the additive diffusing into the margin portion can be controlled by adjusting the thickness and concentration of the coating layer of the additive element formed on the surface of the green sheet laminate and the firing temperature of the green sheet laminate.

[0064] On the other hand, before the firing process, the green sheet laminate can be further pressed and cut into individual chip forms such that one end of the internal electrode pattern is alternately exposed on the cut surface.

[0065] Thereafter, an external electrode can be formed by applying an external electrode paste to the outer surface of the capacitor body and firing it. The application of the external electrode paste can be performed by dipping the capacitor body into the external electrode paste, but is not limited thereto.

[0066] Experimental Example FIGS. 6a and 6b are photographs of a scanning electron microscope (SEM) showing the microstructure according to the presence or absence and diffusion concentration of additive elements. In this experimental example, magnesium (Mg) was used as the additive element.

[0067] The multilayer ceramic electronic component used in this experimental example was fabricated as follows.

[0068] A slurry formed containing barium titanate (BaTiO3) powder was applied and dried on a carrier film to provide a plurality of ceramic green sheets.

[0069] Thereafter, a conductive paste for an internal electrode containing nickel was applied onto some of the ceramic green sheets to form an internal electrode pattern.

[0070] Next, the ceramic green sheet printed with the internal electrode and the ceramic green sheet not printed with the internal electrode pattern (for upper and lower cover layers) were laminated and isostatically compression molded. The ceramic laminate after pressure bonding was cut into individual chip forms such that one end of the internal electrode pattern was alternately exposed on the cut surface to provide a plurality of green sheet laminated chips.

[0071] On the one hand, MgCO3 powder, a dispersant, and ethanol were stirred and added to produce an additive solution.

[0072] Next, the green sheet laminated chip was dipped into the magnesium additive solution that had been produced, and the magnesium additive solution was coated on the green sheet laminated chip.

[0073] On the other hand, for comparison, one green sheet laminated chip was not coated with the magnesium additive solution.

[0074] Subsequently, debinding was performed.

[0075] Next, the capacitor body was formed by firing in a reducing atmosphere under an oxygen partial pressure lower than the Ni / NiO equilibrium oxygen partial pressure so that the internal electrode would not oxidize.

[0076] Subsequently, a paste containing copper powder and glass frit was applied to the outer surface of the capacitor body where the internal electrode was exposed and fired to form an external electrode.

[0077] Figure 6a is a scanning electron microscope photograph showing the cross-section after firing of a green sheet laminated chip on which no coating layer is formed, Figure 6b is a scanning electron microscope photograph of a region where the magnesium element has diffused at a concentration of about 0.1 mol%, and Figure 6c is a scanning electron microscope photograph of a region where the magnesium element has diffused at a concentration of about 0.3 mol%.

[0078] Referring to Figure 6a, Figure 6b, and Figure 6c, it can be confirmed that in the case of Figure 6b where the magnesium element has diffused at a concentration of 0.1 mol%, the density is the highest, and in the case of Figure 6c where an excessive amount of the magnesium element is contained, the density is lower than that of Figure 6a where the magnesium element does not diffuse.

[0079] Thus, it can be confirmed that the density can be controlled through the diffusion after the surface coating of the additive element, and the density of the region adjacent to the active part can be increased to improve the reliability and moisture resistance of the multilayer ceramic electronic component.

[0080] Here, examples of the invention according to the present embodiment will be described as items. [Item 1] A capacitor body including a plurality of dielectric layers and a plurality of internal electrodes, and an external electrode disposed on the capacitor body and electrically connected to the internal electrode, In the capacitor body, when a region where internal electrodes of different polarities are superimposed to form capacitance is defined as an active portion, and a region excluding the active portion is defined as a margin portion, The margin portion has a higher concentration of additive elements than the active portion, and the concentration of the additive elements gradually decreases from the surface of the capacitor body toward the active portion. A multilayer ceramic electronic component. [Item 2] When the direction in which the internal electrode and the dielectric layer are laminated is defined as the thickness direction, a direction perpendicular to the thickness direction and in which one end of the internal electrode is exposed on the surface of the capacitor body is defined as the length direction, and a direction perpendicular to the thickness direction and the length direction is defined as the width direction, The margin portion in the length direction of the capacitor body has a higher concentration of additive elements than the active portion, and has a concentration gradient of the additive elements from the surface of the capacitor body toward the active portion. The multilayer ceramic electronic component according to Item 1. [Item 3] When the direction in which the internal electrode and the dielectric layer are laminated is defined as the thickness direction, a direction perpendicular to the thickness direction and in which one end of the internal electrode is exposed on the surface of the capacitor body is defined as the length direction, and a direction perpendicular to the thickness direction and the length direction is defined as the width direction, The margin portion in the width direction of the capacitor body has a higher concentration of additive elements than the active portion, and has a concentration gradient of the additive elements from the surface of the capacitor body toward the active portion. The multilayer ceramic electronic component according to Item 1 or 2. [Item 4] Based on half of the length measured in the direction from the outside of the active portion toward the capacitor body, the margin portion includes a first region adjacent to the active portion and a second region adjacent to the surface of the capacitor body, The first region and the second region have different densities. The multilayer ceramic electronic component according to any one of Items 1 to 3. [Item 5] The laminated ceramic electronic component according to Item 4, wherein the first region has a higher density than the second region. [Item 6] The laminated ceramic electronic component according to Item 4 or 5, wherein the second region has a higher concentration of additive elements than the first region. [Item 7] The laminated ceramic electronic component according to any one of Items 1 to 6, wherein the concentration of the additive element gradually decreases from the surface of the capacitor body toward the active part. [Item 8] The laminated ceramic electronic component according to any one of Items 1 to 7, wherein the additive element is one or more selected from Mg, Mn, Zr, Ti, Li, Mo, Nb, Cu, and rare earth elements. [Item 9] The laminated ceramic electronic component according to Item 4, wherein the concentration of the additive element in the first region is 0.01 mol% or more and 4.0 mol% or less. [Item 10] The laminated ceramic electronic component according to Item 4 or 9, wherein the concentration of the additive element in the second region is 0.2 mol% or more and 8.0 mol% or less. [Item 11] The laminated ceramic electronic component according to any one of Items 1 to 10, wherein the concentration of the additive element in the active part is 2.0 mol% or less. [Item 12] Providing a plurality of first ceramic green sheets and a plurality of second ceramic green sheets; Applying an internal electrode paste to the first ceramic green sheet; Stacking the first ceramic green sheet and the second ceramic green sheet to which the internal electrode paste has been applied to provide a green sheet laminate; Forming a coating layer containing an additive element on the surface of the green sheet laminate; Firing the green sheet laminate so that the additive element diffuses therein to form a capacitor body including an active part where internal electrodes of different polarities are stacked to form a capacitance, and a margin part which is a region excluding the active part. The margin part has a higher concentration of additive elements than the active part and has a concentration gradient of additive elements from the surface of the capacitor body toward the active part, which is a method for manufacturing a multilayer ceramic electronic component. [Item 13] Based on half of the length measured in the direction from the outside of the active part toward the capacitor body, the margin part includes a first region adjacent to the active part and a second region adjacent to the surface of the capacitor body, and the first region and the second region have different densities, which is a method for manufacturing a multilayer ceramic electronic component according to Item 12. [Item 14] The first region has a higher density than the second region, which is a method for manufacturing a multilayer ceramic electronic component according to Item 13. [Item 15] The second region has a higher concentration of additive elements than the first region, which is a method for manufacturing a multilayer ceramic electronic component according to Item 13 or 14. [Item 16] The additive element is one or more selected from Mg, Mn, Zr, Ti, Li, Mo, Nb, Cu, and rare earth elements, which is a method for manufacturing a multilayer ceramic electronic component according to any one of Items 12 to 15. [Item 17] The margin part has a concentration gradient of additive elements due to the diffusion of additive elements coated on the surface of the capacitor body, which is a method for manufacturing a multilayer ceramic electronic component according to Item 16. [Item 18] A capacitor body including a plurality of dielectric layers and a plurality of internal electrodes, and an external electrode disposed on the capacitor body and electrically connected to the internal electrode, wherein the capacitor body includes an active part defined as a region where internal electrodes of different polarities are stacked to form capacitance, and a margin part defined as a region excluding the active part, the margin part includes a first region adjacent to the active part and a second region adjacent to the surface of the capacitor body, the concentration of additive elements in the second region is higher than the concentration of additive elements in the first region, and the concentration of additive elements in the first region is higher than the concentration of additive elements in the active part, which is a multilayer ceramic electronic component. [Item 19] The laminated ceramic electronic component according to Item 18, wherein the concentration of the additive element in the first region is 0.01 mol% or more and 4.0 mol% or less. [Item 20] The laminated ceramic electronic component according to Item 18 or 19, wherein the concentration of the additive element in the second region is 0.2 mol% or more and 8.0 mol% or less. [Item 21] The laminated ceramic electronic component according to any one of Items 18 to 20, wherein the concentration of the additive element in the active part is 2.0 mol% or less.

[0081] Examples of the invention according to other embodiments of the present invention are described as items. [Item 1] A capacitor body including a plurality of dielectric layers and a plurality of internal electrodes, An external electrode disposed on the capacitor body and electrically connected to the internal electrode, including In the capacitor body, when the direction in which the internal electrode and the dielectric layer are laminated is defined as the thickness direction, the direction perpendicular to the thickness direction and in which one end of the internal electrode is exposed on the surface of the capacitor body is defined as the length direction, and the one direction perpendicular to the thickness direction and the length direction is defined as the width direction, The capacitor body includes an active part in which internal electrodes of different polarities are superimposed to form capacitance, and margin parts disposed on both sides in the width direction of the active part. The margin parts disposed on both sides in the width direction are based on half of the length measured along the width direction, include a first region in the width direction adjacent to the active part and a second region in the width direction adjacent to the surface of the capacitor body, The first region in the width direction and the second region in the width direction have different Mg element concentrations from each other Laminated ceramic electronic component. [Item 2] The second region in the width direction has a higher Mg element concentration than the first region in the width direction, The laminated ceramic electronic component according to Item 1. [Item 3] When the margin parts disposed above and below the active part are defined as cover parts, The cover part is based on half of the length measured along the thickness direction, including a first region of the cover part adjacent to the active part and a second region of the cover part adjacent to the surface of the capacitor body, the first region and the second region of the cover part have different Mg element concentrations from each other The multilayer ceramic electronic component according to item 1 or 2. [Item 4] The concentration of Mg element in the first region in the width direction is 0.01 mol% or more and 4.0 mol% or less. The multilayer ceramic electronic component according to any one of items 1 to 3. [Item 5] The concentration of Mg element in the second region in the width direction is 0.2 mol% or more and 8.0 mol% or less. The multilayer ceramic electronic component according to any one of items 1 to 4. [Item 6] The margin part in the width direction of the capacitor body has a higher Mg element concentration than the active part. The multilayer ceramic electronic component according to any one of items 1 to 5. [Item 7] The concentration of Mg element in the active part is 2.0 mol% or less. The multilayer ceramic electronic component according to any one of items 1 to 6. [Item 8] The first region and the second region in the width direction of the margin part in the width direction have different densities from each other. The multilayer ceramic electronic component according to any one of items 1 to 7. [Item 9] The first region in the width direction has a higher density than the second region in the width direction. The multilayer ceramic electronic component according to item 8. Examples of the invention according to still other embodiments will be described as items. [Item 1] A capacitor body including a plurality of dielectric layers and a plurality of internal electrodes, An external electrode disposed on the capacitor body and electrically connected to the internal electrode, Including, In the capacitor body, when the direction in which the internal electrode and the dielectric layer are stacked is defined as the thickness direction, the direction perpendicular to the thickness direction and in which one end of the internal electrode is exposed on the surface of the capacitor body is defined as the length direction, and the direction perpendicular to the thickness direction and the length direction is defined as the width direction, The capacitor body includes an active portion in which internal electrodes of different polarities are superimposed to form capacitance, and margin portions disposed above and below the active portion, When the margin portions disposed above and below the active portion are defined as cover portions, The cover portion is based on half of the length measured along the thickness direction, Including a first region of the cover portion adjacent to the active portion and a second region of the cover portion adjacent to the surface of the capacitor body, The first region of the cover portion and the second region of the cover portion are multilayer ceramic electronic components having different Mg element concentrations from each other. [Item 2] The second region of the cover portion has a higher Mg element concentration than the first region of the cover portion. The multilayer ceramic electronic component according to Item 1. [Item 3] Including margin portions disposed on both sides in the width direction of the active portion, The margin portions disposed on both sides in the width direction are based on half of the length measured along the width direction, Including a first region in the width direction adjacent to the active portion and a second region in the width direction adjacent to the surface of the capacitor body, The first region in the width direction and the second region in the width direction are multilayer ceramic electronic components having different Mg element concentrations from each other according to Item 1. [Item 4] The Mg element concentration in the first region of the cover portion is 0.01 mol% or more and 4.0 mol% or less. The multilayer ceramic electronic component according to Item 1. [Item 5] The Mg element concentration in the second region of the cover portion is 0.2 mol% or more and 8.0 mol% or less. The multilayer ceramic electronic component according to Item 1. [Item 6] The cover portion of the capacitor body has a higher Mg element concentration than the active portion. The multilayer ceramic electronic component according to Item 1. [Item 7] The Mg element concentration in the active portion is 2.0 mol% or less. The multilayer ceramic electronic component according to Item 1. [Item 8] The first region of the cover portion and the second region of the cover portion have different densities from each other. The multilayer ceramic electronic component according to Item 1. [Item 9] The laminated ceramic electronic component according to item 8, wherein a first region of the cover portion has a higher density than a second region of the cover portion.

Description of Symbols

[0082] 100 Multilayer Ceramic Electronic Component 110 Capacitor Body 121, 122 Internal Electrodes 131, 132 External Electrodes

Claims

1. A capacitor body including a plurality of dielectric layers and a plurality of internal electrodes, an external electrode disposed on the capacitor body and electrically connected to the internal electrode, wherein, in the capacitor body, when the direction in which the internal electrode and the dielectric layer are stacked is defined as the thickness direction, the direction perpendicular to the thickness direction and in which one end of the internal electrode is exposed on the surface of the capacitor body is defined as the length direction, and one direction perpendicular to the thickness direction and the length direction is defined as the width direction, the capacitor body includes an active portion in which internal electrodes of different polarities are stacked to form capacitance, margin portions disposed on both sides in the width direction of the active portion, and cover portions which are margin portions disposed on the upper side and the lower side of the active portion, the margin portions disposed on both sides in the width direction of the active portion are based on half of the length measured along the width direction, include a first region adjacent to the active portion and a second region adjacent to the surface of the capacitor body, the concentration of Mg element in the first region of the margin portions disposed on both sides in the width direction of the active portion is 0.01 mol% or more and 0.1 mol% or less, the second region of the margin portions disposed on both sides in the width direction of the active portion has a higher concentration of Mg element than the first region, a multilayer ceramic electronic component.

2. the cover portions are based on half of the length measured along the thickness direction, include a first region of the cover portions adjacent to the active portion and a second region of the cover portions adjacent to the surface of the capacitor body, the first region of the cover portions and the second region in the width direction have different concentrations of Mg element, the multilayer ceramic electronic component according to Claim 1.

3. the concentration of Mg element in the second region of the margin portions disposed on both sides in the width direction of the active portion is 0.2 mol% or more and 8.0 mol% or less, the multilayer ceramic electronic component according to Claim 1 or 2.

4. the margin portions disposed on both sides in the width direction of the active portion have a higher concentration of Mg element than the active portion, the multilayer ceramic electronic component according to any one of Claims 1 to 3.

5. the concentration of Mg element in the active portion is 2.0 mol% or less, the multilayer ceramic electronic component according to any one of Claims 1 to 4.

6. the first region of the margin portions disposed on both sides in the width direction of the active portion and the second region of the margin portions disposed on both sides in the width direction of the active portion have different densities, the multilayer ceramic electronic component according to any one of Claims 1 to 5.

7. The first region of the margin portion disposed on both sides in the width direction of the active portion has a higher density than the second region of the margin portion disposed on both sides in the width direction of the active portion, The multilayer ceramic electronic component according to claim 6.

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