Semiconductor manufacturing apparatus and method for manufacturing semiconductor device

Abstract

To provide technique enabling suppression of scratching damage occurring in a semiconductor wafer in a constitution that the semiconductor wafer is carried in / out to / from a cassette with a cooperation of an upper arm and a lower arm.SOLUTION: A manufacturing device for a semiconductor comprises: a cassette stage 2 in which a cassette 1 housing a plurality of semiconductor wafers 15 arranged from a first main surface to a second main surface in a standing state; a slide portion 3 that slits the cassette stage 2 from the direction of the first main surface to the second main surface; an upper arm 6 that is provided in an upper direction of the cassette stage 2; a lower arm 5 that is provided in a lower direction of the cassette stage 2, and carries out / in each semiconductor wafer 15 from / to the cassette 1 while holding each semiconductor wafer 15 in cooperation with the upper arm 6; a lower arm fixing portion 42 that fixes a lower portion of the lower arm 5 in a guide portion 4 that moves the lower arm 5 to a vertical direction; and a detection portion that detects an abnormal oscillation of the lower arm 5 when carrying out / in each semiconductor wafer 15 from / to the cassette 1.SELECTED DRAWING: Figure 5

Description

Technical Field

[0001] The present disclosure relates to a semiconductor manufacturing apparatus and a method for manufacturing a semiconductor device.

Background Art

[0002] In the manufacture of semiconductor devices, it is necessary to take out a semiconductor wafer from a cassette using a transfer unit such as a robot arm and transfer it.

[0003] However, when abnormal vibration occurs during the operation of the transfer unit, there is a concern that when taking out a semiconductor wafer from a cassette that stores a plurality of semiconductor wafers, the transfer unit may collide with the semiconductor wafer, causing scratches and resulting in product defects.

[0004] For example, Patent Document 1 discloses a technique for detecting the vibration of a cassette itself when taking out a semiconductor wafer from a cassette in which a plurality of semiconductor wafers are vertically arranged and stored in order to suppress scratches generated on the semiconductor wafer.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] However, Patent Document 1 does not disclose a technique for suppressing scratches generated on a semiconductor wafer in a configuration in which an upper arm and a lower arm cooperate to take in and out a semiconductor wafer from a cassette.

[0007] Therefore, an object of the present disclosure is to provide a technique capable of suppressing scratches generated on a semiconductor wafer in a configuration in which an upper arm and a lower arm cooperate to take in and out a semiconductor wafer from a cassette.

Means for Solving the Problem

[0008] The semiconductor manufacturing apparatus according to the present disclosure includes a cassette stage on which a cassette for storing a plurality of semiconductor wafers arranged side by side in the direction from the first main surface to the second main surface is placed in a state where the semiconductor wafer having a first main surface and a second main surface facing the first main surface is placed upright, a slide portion for sliding the cassette stage in the direction from the first main surface to the second main surface, an upper arm provided above the cassette stage, a lower arm provided below the cassette stage and cooperating with the upper arm to hold the semiconductor wafer and take the semiconductor wafer in and out of the cassette, a lower arm fixing portion for fixing a lower portion of the lower arm in a guide portion for moving the lower arm in the vertical direction, and a detection portion for detecting abnormal vibration of the lower arm when the semiconductor wafer is taken in and out. 、 and comprises , the detection unit is provided around the lower arm and includes a displacement meter that detects the displacement of the operating path of the lower arm such a structure.

Advantages of the Invention

[0009] According to the present disclosure, when abnormal vibration of the lower arm is detected, the operation of the lower arm can be stopped, so that it is possible to prevent the lower arm from colliding with the semiconductor wafer. Thereby, in a configuration in which the upper arm and the lower arm cooperate to take the semiconductor wafer in and out of the cassette, it is possible to suppress scratches generated on the semiconductor wafer.

Brief Description of the Drawings

[0010]

Figure 1

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Figure 9

Mode for Carrying Out the Invention

[0011] <Embodiment 1> <Configuration of the vertical transfer mechanism> Embodiment 1 will be described below with reference to the drawings. FIG. 1 is a schematic diagram of a vertical transfer mechanism 100 included in the semiconductor manufacturing apparatus according to Embodiment 1. FIG. 2 is a schematic diagram showing a state in which a semiconductor wafer 15 stored in a cassette 1 that forms part of the vertical transfer mechanism 100 is held by an upper arm 6 and a lower arm 5. FIG. 3(a) is a side view of the upper arm 6 that forms part of the vertical transfer mechanism 100, and FIG. 3(b) is a front view of the upper arm 6. FIG. 4(a) is a side view of the lower arm 5 that forms part of the vertical transfer mechanism 100, and FIG. 4(b) is a front view of the lower arm 5. FIG. 5 is a cross-sectional view of a guide part 4 that forms part of the vertical transfer mechanism 100.

[0012] As shown in FIG. 1, the vertical transfer mechanism 100 forms part of a semiconductor manufacturing apparatus (not shown) and includes a cassette 1, a cassette stage 2, a slide part 3, and a transfer part 7. The vertical transfer mechanism 100 further includes a vibration meter 8 (see FIG. 5) described later.

[0013] As shown in FIGS. 1 and 2, the cassette 1 is a container for storing a plurality of semiconductor wafers 15 standing upright, each having a first main surface and a second main surface facing the first main surface, arranged side by side in the direction from the first main surface toward the second main surface. The cassette 1 is placed on the cassette stage 2.

[0014] Here, the first main surface is the surface of the semiconductor wafer 15 (the left - hand side surface in FIG. 2), and the second main surface is the back surface of the semiconductor wafer 15 (the right - hand side surface in FIG. 2). Note that the semiconductor wafer 15 may be stored such that its surface faces the right - hand side and its back surface faces the left - hand side in FIG. 2. Also, the direction from the first main surface toward the second main surface is the left - right direction in FIGS. 1 and 2.

[0015] The slide portion 3 is provided below the cassette stage 2. The slide portion 3 slides the cassette stage 2 in the direction from the first main surface of the semiconductor wafer 15 toward the second main surface. As a mechanism for sliding the cassette stage 2, a well - known technique such as a hydraulic cylinder or a motor is adopted.

[0016] FIG. 1 shows an example in which a hydraulic cylinder 32 is adopted as a mechanism for sliding the cassette stage 2. The slide portion 3 includes two columns 31 erected on the base 30 with a space therebetween, a hydraulic cylinder 32 provided between the two columns 31, and a cassette - stage fixing portion 33 attached to the hydraulic cylinder 32. The cassette - stage fixing portion 33 moves in the direction from the first main surface toward the second main surface by the drive of the hydraulic cylinder 32, thereby sliding the cassette stage 2 in the direction from the first main surface toward the second main surface.

[0017] As shown in FIGS. 1 and 2, the transfer unit 7 includes an upper arm 6, a lower arm 5, a guide unit (not shown) for driving the upper arm 6, and a guide unit 4 for driving the lower arm 5. The upper arm 6 is provided above the cassette stage 2. The upper arm 6 is movable in the vertical direction by a guide unit (not shown) connected to the upper part of the upper arm 6. As shown in FIG. 2, an upper arm wafer guide 6a that contacts the side surface of the semiconductor wafer 15 from above is provided at the lower end of the upper arm 6.

[0018] The lower arm 5 is provided below the cassette stage 2, and a lower arm wafer guide 5a that contacts the side surface of the semiconductor wafer 15 from below is provided at the upper end of the lower arm 5. The lower arm 5 cooperates with the upper arm 6 to hold the side surface of the semiconductor wafer 15 and take in and out the semiconductor wafer 15 from the cassette 1.

[0019] As shown in FIGS. 3(a), (b) and FIGS. 4(a), (b), the tip surfaces of the upper arm wafer guide 6a and the lower arm wafer guide 5a are formed in a U shape in side view and may be in surface contact with the side surface of the semiconductor wafer 15. Also, although not shown, the tip surfaces of the upper arm wafer guide 6a and the lower arm wafer guide 5a may be formed in a flat shape and contact the side surface of the semiconductor wafer 15 so as to sandwich it from both sides. In particular, by adopting a structure in which the tip surfaces of the upper arm wafer guide 6a and the lower arm wafer guide 5a contact the semiconductor wafer 15 so as to sandwich it, the contact position with the semiconductor wafer 15 can be easily changed according to the diameter of the semiconductor wafer 15.

[0020] As shown in FIGS. 1 and 5, the guide unit 4 is provided below the opening 30a formed in the base 30, supports the lower arm 5 in a state of protruding from the opening 30a, and moves the lower arm 5 in the vertical direction.

[0021] As shown in Fig. 5, the guide part 4 is constituted by a hydraulic cylinder. The guide part 4 includes a cylinder tube 40 which is the main part of the hydraulic cylinder, a guide shaft 41, and a lower arm fixing part 42. The guide shaft 41 extends in the vertical direction within the cylinder tube 40. The lower arm fixing part 42 is attached so as to be movable in the vertical direction along the guide shaft 41. The lower part of the lower arm 5 is fixed to the lower arm fixing part 42 within the cylinder tube 40. By moving the lower arm fixing part 42 in the vertical direction along the guide shaft 41 by hydraulic pressure, the lower arm 5 can move in the vertical direction.

[0022] The vibration meter 8 is provided on the lower arm 5 around the lower arm fixing part 42 within the cylinder tube 40. Specifically, the vibration meter 8 is provided at a portion of the lower arm 5 directly above the lower arm fixing part 42. The vibration meter 8 corresponds to a detection part for detecting abnormal vibration of the lower arm 5 when the semiconductor wafer 15 is taken in and out, and is, for example, a piezoelectric sensor or the like. Here, the abnormal vibration means excessive vibration.

[0023] By providing the vibration meter 8 in the semiconductor manufacturing apparatus, it is possible to detect abnormal vibration of the lower arm 5 when the semiconductor wafer 15 is taken in and out, so that it is possible to suppress the lower arm 5 from colliding with the semiconductor wafer 15. Further, by providing the vibration meter 8 within the cylinder tube 40 around the lower arm fixing part 42 to which the lower arm 5 is fixed, vibration due to deflection of the lower arm 5 is not detected.

[0024] In addition, in order to notify the surroundings of the signal from the vibration meter 8, when the vibration meter 8 detects abnormal vibration of the lower arm 5, a notification part (not shown) for notifying the abnormal vibration may be provided. The notification part may issue an alarm during abnormal vibration or may provide a visually confirmable display.

[0025] <Method for manufacturing a semiconductor device> Next, a method for manufacturing a semiconductor device using the semiconductor manufacturing apparatus will be described. Fig. 6 is a flowchart showing the method for manufacturing a semiconductor device according to Embodiment 1.

[0026] As shown in FIG. 6, the method for manufacturing a semiconductor device includes a preparation step (step S1), a detection step (step S2), and a notification step (step S3).

[0027] First, in the preparation step (step S1), the cassette 1 is placed on the cassette stage 2. As the cassette 1, when taking out the semiconductor wafers 15, a cassette containing a plurality of semiconductor wafers 15 is placed, and when storing the semiconductor wafers 15, a cassette not containing the semiconductor wafers 15 is placed. Further, when storing the semiconductor wafers 15, the upper arm 6 and the lower arm 5 are used to move the semiconductor wafers 15 to a preparation chamber (not shown) provided in the semiconductor manufacturing apparatus. As the semiconductor wafers 15 to be stored, those after processes such as sputtering and ion implantation may be used, or those before the processes may be used.

[0028] Next, in the detection step (step S2), when the lower arm 5 cooperates with the upper arm 6 to hold the semiconductor wafers 15 and take the semiconductor wafers 15 in and out of the cassette 1 one by one, the vibrometer 8 detects abnormal vibrations of the lower arm 5. Specifically, the vibrometer 8 is connected to an output unit (not shown) such as a PC, and the detection result of the vibrometer 8 is output to the output unit. In the output unit, it is determined whether the detection result is an abnormal vibration, that is, an excessive vibration. When the detection result does not correspond to excessive vibration, it is determined that no abnormal vibration has occurred in the lower arm 5, and when the detection result corresponds to excessive vibration, it is determined that an abnormal vibration has occurred in the lower arm 5.

[0029] Next, in the notification step (step S3), when the vibration meter 8 detects abnormal vibration of the lower arm 5 in the detection step (step S2), that is, when it is determined that abnormal vibration has occurred in the lower arm 5, the notification unit notifies the abnormal vibration. In addition to the notification of the abnormal vibration, the vertical transfer mechanism 100 may stop the operation of the lower arm 5. However, when it is determined that no abnormal vibration has occurred, the notification unit does not notify the abnormal vibration. Then, the process returns to step S2 to perform the detection step. When the loading and unloading of all the semiconductor wafers 15 are completed, all the steps shown in the flowchart are completed.

[0030] <Effect> As described above, the semiconductor manufacturing apparatus according to Embodiment 1 has a cassette stage 2 on which a cassette 1 for storing a plurality of semiconductor wafers 15 arranged side by side in the direction from the first main surface to the second main surface is placed in a state where the semiconductor wafer 15 having the first main surface and the second main surface facing the first main surface is stood up, a slide portion 3 for sliding the cassette stage 2 in the direction from the first main surface to the second main surface, an upper arm 6 provided above the cassette stage 2, a lower arm 5 provided below the cassette stage 2 and cooperating with the upper arm 6 to hold the semiconductor wafer 15 and load and unload the semiconductor wafer 15 from the cassette 1, a lower arm fixing portion 42 for fixing the lower part of the lower arm 5 in a guide portion 4 for moving the lower arm 5 in the vertical direction, and a detection portion for detecting abnormal vibration of the lower arm 5 when the semiconductor wafer 15 is loaded and unloaded.

[0031] Therefore, when abnormal vibration of the lower arm 5 is detected, the operation of the lower arm 5 can be stopped, so that it is possible to prevent the lower arm 5 from colliding with the semiconductor wafer 15. As a result, in a configuration in which the upper arm 6 and the lower arm 5 cooperate to load and unload the semiconductor wafer 15 from the cassette 1, it is possible to suppress scratches generated on the semiconductor wafer 15. From the above, the yield of the semiconductor device manufactured by the semiconductor manufacturing apparatus can be improved.

[0032] Further, the detection unit includes a vibration meter 8 provided on the lower arm 5 around the lower arm fixing portion 42 in the guide portion 4. Therefore, by suppressing the detection of vibration due to the deflection of the lower arm 5, false detection of abnormal vibration in the lower arm 5 can be suppressed.

[0033] In addition, since the semiconductor manufacturing apparatus further includes a notification unit that notifies of abnormal vibration when the detection unit detects abnormal vibration of the lower arm 5, the operator can easily grasp the abnormal vibration of the lower arm 5.

[0034] <Embodiment 2> Next, a semiconductor manufacturing apparatus according to Embodiment 2 will be described. FIG. 7 is a cross-sectional view of a guide portion 4 that constitutes a part of a vertical transfer mechanism 100 provided in the semiconductor manufacturing apparatus according to Embodiment 2. FIG. 8 is a diagram showing vibration waveforms in the case of no abnormal vibration and in the case of abnormal vibration. In Embodiment 2, the same components as those described in Embodiment 1 are denoted by the same reference numerals and the description thereof is omitted.

[0035] As shown in FIG. 7, in Embodiment 2, the vertical transfer mechanism 100 includes a displacement meter 9 that detects the displacement of the operation path of the lower arm 5 instead of the vibration meter 8. Here, the displacement meter 9 corresponds to the detection unit.

[0036] The displacement meter 9 is provided around the lower arm 5 so as to be able to detect the displacement of the operation path of the lower arm 5. Specifically, the displacement meter 9 is provided at a position facing the upper end portion of the lower arm 5 in a state where the lower arm 5 is at the lowest descending position. For example, the displacement meter 9 is attached to the base 30 via a fixing member (not shown) provided on the base 30 (see FIG. 1).

[0037] The displacement meter 9 is connected to an output unit (not shown) such as a PC, and the detection result of the displacement meter 9 is output to the output unit. In the output unit, waveform analysis is performed based on the detection result of the displacement meter 9. Specifically, as shown in FIG. 8, the vibration waveform in the case of no abnormal vibration is compared with the vibration waveform detected in the detection process, and it is determined whether or not it corresponds to abnormal vibration.

[0038] As described above, in the semiconductor manufacturing apparatus according to the second embodiment, the detection unit is provided around the lower arm 5 and includes a displacement meter 9 that detects the displacement of the operation path of the lower arm 5. Therefore, in the configuration where the upper arm 6 and the lower arm 5 cooperate to take in and out the semiconductor wafer 15 from the cassette 1, in addition to being able to suppress scratches generated on the semiconductor wafer 15, based on the fluctuation range of the vibration waveform, it is possible to easily grasp the replacement timing of the components related to the lower arm 5.

[0039] <Embodiment 3> Next, a semiconductor manufacturing apparatus according to the third embodiment will be described. FIG. 9 is a cross-sectional view of a guide portion 4 that constitutes a part of a vertical transfer mechanism 100 provided in the semiconductor manufacturing apparatus according to the third embodiment. In the third embodiment, the same components as those described in the first and second embodiments are denoted by the same reference numerals and the description thereof is omitted.

[0040] As shown in FIG. 9, in the third embodiment, the vertical transfer mechanism 100 includes an acceleration sensor 10 that detects the operation of the lower arm 5 instead of the vibration meter 8. Here, the acceleration sensor 10 corresponds to the detection unit.

[0041] The acceleration sensor 10 is provided at an intermediate portion of the lower arm 5. By providing the acceleration sensor 10 at the intermediate portion of the lower arm 5, it is possible to confirm the perpendicularity and horizontality of the lower arm 5, like a level, and it is easier to detect the operation of the lower arm 5.

[0042] The acceleration sensor 10 is connected to an output unit (not shown) such as a PC, and the detection result of the acceleration sensor 10 is output to the output unit. In the output unit, waveform analysis is performed based on the detection result of the acceleration sensor 10. Specifically, as in the case of the second embodiment, the vibration waveform in the case of no abnormal vibration is compared with the vibration waveform detected in the detection process, and it is determined whether or not it corresponds to abnormal vibration.

[0043] As described above, in the semiconductor manufacturing apparatus according to the third embodiment, the detection unit is provided in the middle part of the lower arm 5 and includes an acceleration sensor 10 that detects the operation of the lower arm 5. Therefore, in the configuration in which the upper arm 6 and the lower arm 5 cooperate to take in and out the semiconductor wafer 15 from the cassette 1, in addition to being able to suppress scratches generated on the semiconductor wafer 15, based on the fluctuation range of the vibration waveform, it is possible to easily grasp the replacement timing of the parts related to the lower arm 5.

[0044] It should be noted that the respective embodiments can be freely combined, or each embodiment can be appropriately modified or omitted.

Explanation of Reference Numerals

[0045] 1 Cassette, 2 Cassette stage, 3 Slide part, 4 Guide part, 5 Lower arm, 6 Upper arm, 8 Vibration meter, 9 Displacement meter, 10 Acceleration sensor, 15 Semiconductor wafer, 42 Lower arm fixing part.

Claims

1. A cassette stage on which a cassette for storing a plurality of semiconductor wafers arranged side by side in a direction from a first main surface toward a second main surface is placed, with the semiconductor wafer having the first main surface and the second main surface facing the first main surface standing upright; A slide unit that slides the cassette stage in a direction from the first main surface toward the second main surface; An upper arm provided above the cassette stage; A lower arm provided below the cassette stage, which cooperates with the upper arm to hold the semiconductor wafer and take the semiconductor wafer in and out of the cassette; A lower arm fixing unit that fixes a lower portion of the lower arm within a guide unit that moves the lower arm in a vertical direction; A detection unit that detects abnormal vibration of the lower arm when the semiconductor wafer is taken in and out; Comprising: The detection unit is provided around the lower arm and includes a displacement meter that detects displacement of an operation path of the lower arm, a semiconductor manufacturing apparatus.

2. A cassette stage on which a cassette for storing a plurality of semiconductor wafers arranged side by side in a direction from a first main surface toward a second main surface is placed, with the semiconductor wafer having the first main surface and the second main surface facing the first main surface standing upright; A slide unit that slides the cassette stage in a direction from the first main surface toward the second main surface; An upper arm provided above the cassette stage; A lower arm provided below the cassette stage, which cooperates with the upper arm to hold the semiconductor wafer and take the semiconductor wafer in and out of the cassette; A lower arm fixing unit that fixes a lower portion of the lower arm within a guide unit that moves the lower arm in a vertical direction; A detection unit that detects abnormal vibration of the lower arm when the semiconductor wafer is taken in and out; Comprising: The detection unit is provided at an intermediate portion of the lower arm and includes an acceleration sensor that detects an operation of the lower arm, a semiconductor manufacturing apparatus.

3. The semiconductor manufacturing apparatus according to claim 1 or claim 2, further comprising a notification unit that notifies the abnormal vibration when the detection unit detects the abnormal vibration of the lower arm.

4. A preparation step of placing a cassette for storing a plurality of semiconductor wafers arranged side by side in a direction from a first main surface toward a second main surface on a cassette stage, with the semiconductor wafer having the first main surface and the second main surface facing the first main surface standing upright; A detection step of detecting abnormal vibration of the lower arm when the lower arm cooperates with the upper arm to hold the semiconductor wafer and take the semiconductor wafer in and out of the cassette; In the detection step, when the abnormal vibration of the lower arm is detected, a notification step of notifying the abnormal vibration; Comprising; The detection step includes a step of detecting displacement of an operation path of the lower arm by a displacement meter provided around the lower arm, a method for manufacturing a semiconductor device.

5. A preparation step of placing a cassette in which a plurality of semiconductor wafers having a first main surface and a second main surface facing the first main surface are arranged side by side in a direction from the first main surface to the second main surface in a standing state on a cassette stage; A detection step of detecting abnormal vibration of the lower arm when the lower arm cooperates with the upper arm to hold the semiconductor wafer and take the semiconductor wafer in and out of the cassette; In the detection step, when the abnormal vibration of the lower arm is detected, a notification step of notifying the abnormal vibration; Comprising; The detection step includes a step of detecting the operation of the lower arm by an acceleration sensor provided at an intermediate portion of the lower arm, a method for manufacturing a semiconductor device.

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