Epoxy resin for semiconductor adhesives, method for producing the same, and composition containing the same

Abstract

To provide an epoxy resin which exhibits improved thermal expansion characteristic by control of compatibility between an epoxy resin and an acrylic resin by a modified epoxy resin, is used for a semiconductor adhesive and is modified, a method for producing the same, a composition containing the same, and a use of the same.SOLUTION: There are provided an epoxy resin which has a weight average molecular weight of 5,000 to 25,000 and a polydispersity index of 5.0 to 20.0, contains (1) an epoxy-derived unit and (2) a modifier-derived unit and is modified, a method for producing the same, a composition containing the same, and a use of the same. As for the epoxy composition containing the modified epoxy resin, a low coefficient of thermal expansion (CTE), in other words, thermal expansion characteristic is improved by a phase separation phenomenon (morphology characteristic) for an epoxy region and an acrylic region in curing. The modified epoxy and the epoxy composition containing the same are suitable as an adhesive for semiconductor packaging.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to an epoxy resin for a semiconductor adhesive, a method for producing the same, a composition containing the same, and uses thereof. More specifically, the present invention relates to a modified epoxy resin for a semiconductor adhesive that exhibits improved thermal expansion characteristics by controlling the compatibility between an epoxy resin and an acrylic resin with a modified epoxy resin, a method for producing the same, a composition containing the same, and uses thereof.

Background Art

[0002] Epoxy materials are widely used in paints, printed wiring boards, IC encapsulants, electrical components, electronic components, adhesives, etc. due to their physical properties such as excellent mechanical properties, electrical insulation, heat resistance, water resistance, and adhesiveness.

[0003] However, when applied to semiconductor packaging, compared with silicon wafers, the epoxy material has a high coefficient of thermal expansion (CTE), and the reliability and processability of components are significantly limited. Therefore, research to reduce the thermal expansion coefficient of epoxy materials has been continuously advanced. On the other hand, semiconductor packaging tends to be highly integrated, thin-film, and large-area. Along with such a trend of semiconductor packaging, in semiconductor packaging due to the high CTE of epoxy materials, the occurrence of warpage and cracks has become more serious, which not only makes the semiconductor packaging process impossible in some cases, but also poses a problem in ensuring the reliability of the manufactured semiconductor packaging components.

[0004] Therefore, in the industry, there is a continuous demand for epoxy materials with more improved thermal expansion characteristics that can solve the problems of warping and / or cracking in semiconductor packaging due to the high CTE of epoxy materials and enable ensuring processability and component reliability in the semiconductor packaging process. In this regard, the inventor has developed and filed a patent application for an epoxy resin having an alkoxysilyl group with improved thermal expansion characteristics (i.e., a decrease in CTE) by introducing an alkoxysilyl group into the epoxy resin (such as Korean Patent Applications 10-2013-0111473 and 10-2014-0021884).

[0005] In the semiconductor packaging process, an epoxy material is used as an adhesive material for laminating semiconductor chips or attaching semiconductor chips to a substrate. At this time, in order to improve the stress relaxation characteristics of the brittle epoxy material and impart adhesive characteristics, an acrylic resin is blended with the epoxy resin during the production of the adhesive. As a result, during the curing reaction of the epoxy adhesive, a curing-induced phase separation phenomenon occurs in the epoxy region and the acrylic region.

[0006] The inventor has found that the phase separation characteristics (morphology characteristics) between a novolac epoxy resin and an acrylic resin of a specific structure affect the thermal expansion characteristics of a composition containing the epoxy resin and the acrylic resin. That is, by modifying the novolac epoxy resin to have an average molecular weight, a polydispersity index (PDI), and an epoxy equivalent weight (EEW) value within a specific range, and using the modified novolac epoxy resin to control the phase separation characteristics between the epoxy resin and the acrylic resin, it has been found that the thermal expansion characteristics of the composition containing the epoxy resin and the acrylic resin are more improved.

Prior Art Documents

Patent Documents

[0007]

Patent Document 1

[0008] The present invention is based on the finding that an epoxy composition having improved thermal expansion properties (i.e., low CTE), such as an epoxy adhesive, can be produced by using a novolac epoxy resin modified to have a weight average molecular weight within a specific range and a polydispersity index. The present invention provides a modified novolac epoxy resin, a method for producing the same, a composition containing the same, and uses thereof. The modified epoxy resin of the present invention is particularly usefully applicable to an adhesive film for semiconductors. [Means for Solving the Problems]

[0009] According to a first aspect, there is provided a modified epoxy resin having a weight average molecular weight in the range of 5,000 to 25,000 and a polydispersity index in the range of 5.0 to 20.0, (1) one epoxy-derived unit selected from the group consisting of the following chemical formulas (AF), (BF), and (CF); and (2) at least one modifier-derived unit selected from the group consisting of the following chemical formulas (1F), (2F), (3F), (4F), (5F), and (6F), wherein the epoxy-derived unit and the modifier-derived unit are linked through the following chemical formula (L): [Chemical Formula] (In the above chemical formula (CF), S is [Chemical Formula] and (In chemical formulas (AF) to (CF), n is an integer of 1 to 50, The above epoxy resin may or may not have the structure of the following chemical formula (7F). When the above epoxy resin has the structure of the following chemical formula (7F), at least one of the plurality of Ms is a linkage by a single bond to the following chemical formula (L), at least one is the following chemical formula (7F), at least one is a glycidyl group of the following chemical formula (E), and the remaining Ms are each independently a single bond to the following chemical formula (L), the following chemical formula (7F), or a glycidyl group of the following chemical formula (E). When the above epoxy resin does not have the following chemical formula (7F), at least one of the plurality of Ms is a linkage by a single bond to the following chemical formula (L), at least one is a glycidyl group of the following chemical formula (E), and the remaining Ms are each independently a linkage by a single bond to the following chemical formula (L) or a glycidyl group of the following chemical formula (E).

Chemical formula

Chemical formula

Chemical formula

[0010] According to a second aspect, there is provided a modified epoxy resin according to the first aspect, having an epoxy equivalent weight (EEW, Epoxy Equivalent Weight) of 150 g / Eq to 500 g / Eq.

[0011] According to a third aspect, there is provided a method for producing a modified epoxy resin, including the step of mixing one epoxy resin selected from the group consisting of the following chemical formulas (AS) to (CS) and at least one modifier selected from the group consisting of the following chemical formulas (1) to (6) in the presence of 1 to 10 parts by weight of a phosphorus-based catalyst per 100 parts by weight of the modifier, and then heating the mixture.

[0012] [Chemical formula] (In the above chemical formula (CS), S is [Chemical formula] and (In the above chemical formulas AS to CS, n is an integer of 1 to 50, and K is a glycidyl group of the following chemical formula (E).) [Chemical formula] (In the above chemical formula (1), R is a methyl group; in the chemical formula (3), X is -CH2-, -C(CH3)2-, -C(CF3)2-, -S- or -SO2-; in the chemical formula (5), Y is independently selected from the group consisting of H and a methyl group.)

[0013] According to a fourth aspect, when at least one trifunctional modifier selected from the group consisting of the above chemical formulas (1) and (2) is used as the modifier, there is provided a method for producing a modified epoxy resin according to the third aspect, wherein the trifunctional modifier is used in an amount such that the hydroxyl group of the trifunctional modifier is 5 to 20 moles with respect to 100 moles of the epoxy group of the epoxy resin as the starting material.

[0014] ​According to the fifth aspect, when at least one bifunctional modifier selected from the group consisting of the above chemical formulas (3) to (6) is used as the above modifier, the bifunctional modifier is used in an amount such that the hydroxyl group of the bifunctional modifier is 10 to 30 moles with respect to 100 moles of the epoxy groups of the epoxy resin as the starting material, and a method for producing a modified epoxy resin according to the third or fourth aspect is provided.

[0015] According to the sixth aspect, when at least one trifunctional modifier selected from the group consisting of the above chemical formulas (1) and (2) and at least one bifunctional modifier selected from the group consisting of the above chemical formulas (3) to (6) are used together as the above modifier, the above modifier is used in an amount such that the total hydroxyl group of the bifunctional modifier and the trifunctional modifier is 5 to 30 moles with respect to 100 moles of the epoxy groups of the epoxy resin as the starting material, and a method for producing a modified epoxy resin according to any one of the third to fifth aspects is provided.

[0016] According to the seventh aspect, a method for producing an epoxy resin according to any one of the third to sixth aspects is provided, in which a monofunctional modifier of the following chemical formula (7) is used together with at least one modifier selected from the group consisting of the above chemical formulas (1) to (6).

[0017]

Chemical formula

[0018] According to the eighth aspect, a method for producing an epoxy resin according to any one of the third to seventh aspects is provided, in which the monofunctional modifier is used in an amount such that the hydroxyl group of the monofunctional modifier is 30 moles or less with respect to 100 moles of the epoxy groups of the epoxy resin as the starting material.

[0019] According to the ninth aspect, there is provided a method for producing an epoxy resin according to any one of the third to eighth aspects, wherein the heating step is carried out at a temperature of 80°C to 140°C.

[0020] According to the tenth aspect, there is provided a method for producing an epoxy resin according to any one of the third to ninth aspects, wherein the heating step is carried out for 30 minutes to 10 hours.

[0021] According to the eleventh aspect, there is provided an epoxy composition comprising an epoxy resin, an acrylic resin, a curing agent, and a curing catalyst, wherein the epoxy resin contains 10% to 90% by weight of the modified epoxy resin according to the first or second aspect and 90% to 10% by weight of the unmodified epoxy resin based on the total weight of the epoxy resin.

[0022] According to the twelfth aspect, there is provided an epoxy composition according to the eleventh aspect, wherein the content of the acrylic resin is 20 to 1000 parts by weight with respect to 100 parts by weight of the epoxy resin.

[0023] According to the thirteenth aspect, there is provided an epoxy composition according to the eleventh or twelfth aspect, wherein the composition further contains an inorganic filler.

[0024] According to the fourteenth aspect, there is provided an epoxy composition according to any one of the eleventh to thirteenth aspects, which is used as an adhesive.

[0025] According to the fifteenth aspect, there is provided a semiconductor adhesive film containing an epoxy composition according to any one of the eleventh to fourteenth aspects.

[0026] According to the sixteenth aspect, there is provided a cured product of the epoxy composition according to the eleventh aspect.

[0027] According to the seventeenth aspect, there is provided an article containing the cured product according to the sixteenth aspect.

Advantages of the Invention

[0028] The modified epoxy resin of the present invention has a weight average molecular weight (Mw) of 5,000 to 25,000 and a polydispersity index (PDI) of 5.0 to 20.0. By using the modified novolac epoxy resin of the present invention (hereinafter referred to as "modified epoxy resin") having such a controlled weight average molecular weight distribution and polydispersity index, the physical properties of a composition containing the modified epoxy resin and acrylic resin, such as thermal expansion properties, are improved (i.e., lower coefficient of thermal expansion (CTE)).

[0029] Specifically, when an epoxy composition containing an epoxy resin and an acrylic resin is cured, the epoxy A curing-induced phase separation phenomenon into a silane domain and an acrylic domain (morphological characteristics) occurs. Due to the morphological characteristics of the epoxy composition when cured, which are exhibited by using the modified epoxy resin of the present invention in an epoxy composition, the epoxy composition containing the modified epoxy resin and the acrylic resin has a low coefficient of thermal expansion (CTE), i.e., improved thermal expansion characteristics. That is, by using the modified epoxy resin of the present invention having Mw of 5,000 to 25,000 and PDI of 5.0 to 20.0, and preferably the modified epoxy resin having Mw of 5,000 to 25,000, PDI of 5.0 to 20.0, and EEW of 150 to 500 g / Eq in an epoxy composition containing an epoxy resin and an acrylic resin, the epoxy composition containing the epoxy resin and the acrylic resin exhibits improved thermal expansion characteristics due to the morphological characteristics.

[0030] Therefore, the composition containing the modified epoxy resin of the present invention (hereinafter referred to as "epoxy composition") is suitable for use in epoxy application fields requiring a low CTE, such as adhesive films for semiconductors, such as DAF (Die Attach Film) and DDAF (Dicing Die Attach Film).

[0031] In addition, in the method for producing the modified epoxy resin of the present invention, by adjusting the use of specific modifiers and / or their use ratios, etc., a modified epoxy resin having a weight average molecular weight and polydispersity index within a specific range, and further an EEW within a specific range, which is incorporated into the epoxy composition so that the epoxy composition exhibits excellent thermal expansion characteristics, is effectively produced.

Brief Description of Drawings

[0032]

Figure 1

Embodiments for Carrying Out the Invention

[0033] As described above, the epoxy composition containing the modified epoxy resin having a weight average molecular weight within a specific range, a polydispersity index within a specific range, and further an EEW within a specific range according to the present invention has more improved thermal expansion characteristics, that is, a low CTE, and is therefore suitable for ensuring an adhesive technology having excellent processability and reliability during semiconductor packaging.

[0034] Hereinafter, the modified epoxy resin of the present invention, its production method, the epoxy composition containing the same, and its uses will be described in detail respectively.

[0035] I. Modified Epoxy Resin According to one embodiment of the present invention, the weight average molecular weight ranges from 5,000 to 25,000, and the polydispersity index ranges from 5.0 to 20.0, (1) one epoxy-derived unit selected from the group consisting of the following chemical formula (AF), chemical formula (BF), and chemical formula (CF); and (2) at least one modifier-derived unit selected from the group consisting of the following chemical formula (1F), chemical formula (2F), chemical formula (3F), chemical formula (4F), chemical formula (5F), and formula (6F), The modified epoxy resin in which the epoxy-derived unit and the modifier-derived unit are linked through the following chemical formula (L): [Chemical formula] In the above chemical formula (CF), S is [Chemical formula] and In chemical formulas (AF) to (CF), n is an integer from 1 to 50, more preferably an integer from 1 to 30; The above epoxy resin may or may not have the structure of the following chemical formula (7F); When the above epoxy resin has the structure of the following chemical formula (7F), at least one of the plurality of Ms is a linkage by a single bond to the following chemical formula (L), and at least one is the following chemical formula (7F), at least one is a glycidyl group of the following chemical formula (E), and the remaining Ms are each independently a single bond to the following chemical formula (L), the following chemical formula (7F) or a glycidyl group of the following chemical formula (E); When the above epoxy resin does not have the following chemical formula (7F), at least one of the plurality of Ms is a linkage by a single bond to the following chemical formula (L), at least one is a glycidyl group of the following chemical formula (E), and the remaining Ms are each independently a linkage by a single bond to the following chemical formula (L) or a glycidyl group of the following chemical formula (E); [Chemical formula] In the above chemical formula (1F), R is a methyl group, in chemical formula (3F), X is -CH2-, -C(CH3)2-, -C(CF3)2-, -S- or -SO2-, in chemical formula (5F), Y is independently selected from H and a methyl group, and in chemical formulas (1F) to (6F), * is a linkage by a single bond to * of the following chemical formula (L); [Chemical formula] In Chemical Formula (7F), G is independently selected from the group consisting of an alkyl group having 1 to 10 carbon atoms, an allyl group, and an aryl group having 6 or 10 carbon atoms, and n' is an integer from 0 to 5; [Chemical Formula] In the above Chemical Formula (L), the above ** is a connection by a single bond to M of the above Chemical Formula (AF), (BF), or (CF), and the above * is a connection by a single bond to * of the following Chemical Formula (1F), (2F), (3F), (4F), (5F), or (6F).

[0036] Further, since the above-modified epoxy resin is a resin, it has at least two epoxy groups as a whole. On the other hand, for example, when the above epoxy-derived unit (for example, Chemical Formula (AF)) and the modifier-derived unit (for example, Chemical Formula (1F)) are linked by Formula (L), the M part of the epoxy-derived unit linked to the three * parts of the modifier-derived unit through Chemical Formula (L) may be another M part of the same epoxy-derived unit, or may be an M part of another epoxy-derived unit (that is, another Chemical Formula (AF)).

[0037] The weight average molecular weight of the modified epoxy resin of the present invention is 5,000 to 25,000, preferably 7,000 to 20,000. When the weight average molecular weight is within the above range, the composition containing the modified epoxy resin described below preferably has improved thermal expansion characteristics and processability. When the weight average molecular weight is less than 5,000, it is not preferable in that the thermal expansion characteristics of the epoxy composition are insufficient, and when it exceeds 25,000, it is not preferable in that the processability of the epoxy composition is reduced. The above weight average molecular weight is the molecular weight measured by gel permeation chromatography using tetrahydrofuran.

[0038] Further, the modified epoxy resin of the present invention has a polydispersity index in the range of 5.0 to 20.0, preferably 7.0 to 20.0. When the polydispersity index is 5.0 or more, it is preferable in terms of simultaneously improving the processability and thermal expansion characteristics of the epoxy composition. When the polydispersity index is less than 5.0, it is not preferable in that the thermal expansion characteristics of the epoxy composition are insufficient. When the polydispersity index exceeds 20.0, it is not preferable from the viewpoint of physical properties such as processability due to excessive high molecular weight.

[0039] Furthermore, the modified epoxy resin of the present invention preferably has an epoxy equivalent weight (EEW) of 150 g / Eq to 500 g / Eq, more preferably 200 g / Eq to 350 g / Eq. The EEW of the above-mentioned modified epoxy resin is determined by the concentration (or number) of glycidyl groups in the above chemical formula (E). When the EEW is less than 150 g / Eq, it is difficult to ensure a sufficiently modified epoxy resin. When the EEW exceeds 500 g / Eq, the concentration of epoxide groups required for the epoxy resin is insufficient.

[0040] The modified epoxy resin of the present invention described above exhibits improved thermal expansion characteristics due to the phase separation characteristics (morphology characteristics) during the curing of the composition containing the modified epoxy resin and the acrylic resin when mixed with the acrylic resin and used. Such a composition containing a modified epoxy resin is suitable for use, for example, in semiconductor packaging, for example, in adhesive films for semiconductor packaging, for example, in DAF and DDAF films.

[0041] B. Method for Producing Epoxy Resin According to another embodiment of the present invention, there is provided a method for producing the modified epoxy resin according to the present invention described above. The above-mentioned modified epoxy resin is produced by a modification reaction of an epoxy resin as a starting material. In the method for producing the modified epoxy resin of the present invention, a modified epoxy resin having the above specific Mw, PDI, and further EEW ranges is obtained by reacting the hydroxyl groups of the epoxy resin as a starting material and the modifier in the presence of a phosphorus-based catalyst.

[0042] The schematic concept of the method for producing the modified epoxy resin of the present invention is shown in the reaction scheme of FIG. 1. The reaction scheme of FIG. 1 shows, for example, the case where a cresol novolak epoxy resin is modified using a trifunctional modifier.

[0043] Specifically, the method for producing the modified epoxy resin includes mixing one epoxy resin selected from the group consisting of the following chemical formulas (AS) to (CS) and at least one modifier selected from the following chemical formulas (1) to (6) in the presence of 1 to 10 parts by weight of a phosphorus-based catalyst per 100 parts by weight of the modifier, and then heating (hereinafter, also referred to as "modification reaction").

[0044] The modification reaction of the epoxy resin as the starting material is carried out by the reaction of the epoxy resin as the starting material and the modifier (i.e., the modification reaction) in the presence of a mild phosphorus-based catalyst, where the reaction is carried out by mixing and heating the epoxy resin as the starting material and the modifier.

[0045] As the starting material, one epoxy resin selected from the group consisting of the chemical formulas (AS) to (CS) can be used.

[0046]

Chemical formula

Chemical formula

[0047]

Chemical formula

[0048] ​The modifier is an aromatic alcohol compound, and is classified into a trifunctional modifier, a bifunctional modifier, or a monofunctional modifier according to the number of hydroxy groups in the modifier. In the modification reaction of the epoxy resin, at least one selected from the group consisting of a trifunctional modifier and a bifunctional modifier can be used as the modifier. Further, if necessary, a monofunctional modifier can be further used together with at least one modifier selected from the group consisting of a trifunctional modifier and a bifunctional modifier. For example, the modifier can be freely used as a mixture of a trifunctional modifier, a bifunctional modifier, a trifunctional modifier + bifunctional modifier, a trifunctional modifier + monofunctional modifier, a bifunctional modifier + monofunctional modifier, or a trifunctional modifier + bifunctional modifier + monofunctional modifier.

[0049] As the above trifunctional modifier, trifunctional aromatic alcohols represented by the following chemical formulas (1) and (2) can be used.

[0050] [Chemical formula] (In the above chemical formula (1), R is a methyl group)

[0051] As the above bifunctional modifier, bifunctional aromatic alcohols represented by the following chemical formulas (3) to (6) can be used.

[0052] [Chemical formula] (In chemical formula (3), X is -CH2-, -C(CH3)2-, -C(CF3)2-, -S- or -SO2-; in chemical formula (5), Y is independently selected from the group consisting of H and a methyl group.)

[0053] As the above monofunctional modifier, a monofunctional aromatic alcohol represented by the following chemical formula (7) can be used.

[0054] [Chemical] (In Chemical Formula (7), G is independently selected from the group consisting of an alkyl group having 1 to 10 carbon atoms, an allyl group, and an aryl group having 6 or 10 carbon atoms, and n' is an integer from 0 to 5.)

[0055] The trifunctional modifier can be used in an amount such that the hydroxyl group of the trifunctional modifier is 5 to 20 moles, preferably 5 to 15 moles, per 100 moles of the epoxy group of the epoxy resin as the starting material.

[0056] When the trifunctional modifier is used in an amount such that the hydroxyl group concentration of the trifunctional modifier is less than 5 moles per 100 moles concentration of the epoxy group of the epoxy resin as the starting material, it is not preferable in that the thermal expansion characteristics of the modified epoxy resin are not sufficiently improved. When it is used in an amount exceeding 20 moles concentration, it is not preferable in that the processability of the composition is reduced by the modified epoxy resin.

[0057] The bifunctional modifier can be used in an amount such that the hydroxyl group of the bifunctional modifier is 10 to 30 moles, preferably 10 to 20 moles, per 100 moles of the epoxy group of the epoxy resin as the starting material. When the bifunctional modifier is used in an amount such that the hydroxyl group concentration of the bifunctional modifier is less than 10 moles per 100 moles concentration of the epoxy group of the epoxy resin as the starting material, it is not preferable in that the thermal expansion characteristics of the modified epoxy resin are not sufficiently improved. When it is used in an amount exceeding 30 moles concentration, it is not preferable in that the processability of the composition is reduced by the modified epoxy resin.

[0058] When both a trifunctional modifier and a bifunctional modifier are used as the above-mentioned modifier (a mixed modifier of a trifunctional modifier and a bifunctional modifier, hereinafter referred to as "mixed modifier"), the above-mentioned mixed modifier can be used in an amount such that the total hydroxyl groups of the mixed modifier are 5 to 30 moles, preferably 5 to 20 moles, per 100 moles of epoxy groups of the epoxy resin as the starting material. If the amount of the total hydroxyl groups of the mixed modifier is less than 5 moles per 100 moles concentration of epoxy groups of the epoxy resin as the starting material, it is not preferable in that the thermal expansion characteristics of the modified epoxy resin are not sufficiently improved. If it exceeds 30 moles concentration, it is not preferable in that the processability of the composition is reduced by the modified epoxy resin.

[0059] The monofunctional modifier is optionally additionally used together with the trifunctional modifier and / or the bifunctional modifier and is not used as a single modifier. The monofunctional modifier can be used in an amount such that the hydroxyl groups of the monofunctional modifier are 30 moles or less per 100 moles of epoxy groups of the epoxy resin as the starting material. If the amount of the monofunctional modifier used exceeds 30 moles concentration per 100 moles concentration of epoxy groups of the epoxy resin as the starting material, it is difficult to obtain a modified epoxy resin having a polydispersity index of 5 or more. The monofunctional modifier is an optional component that can be added as needed, and the lower limit is not limited.

[0060] The above-mentioned modification reaction is carried out in the presence of a phosphorus-based catalyst which is a mild catalyst. As the phosphorus-based catalyst, for example, one or more selected from the group consisting of triphenylphosphine (TPP), diphenylpropylphosphine, and tricyclohexylphosphine can be used.

[0061] The above phosphorus-based catalyst can be used in an amount of 1 to 10 parts by weight, preferably 2 to 5 parts by weight, per 100 parts by weight of the modifier. If the amount of the phosphorus-based catalyst used per 100 parts by weight of the modifier is less than 1 part by weight, the reforming reaction rate due to the action of the catalyst is slow, and no further improvement in the reaction rate is observed even if it exceeds 10 parts by weight. Therefore, it is not preferable to use it in excess of 10 parts by weight.

[0062] When all of the modifier used in the reforming reaction is consumed, the above phosphorus-based catalyst oxidizes and loses its catalytic activity. Therefore, (1) not only is the reaction control easy, but also (2) there is no need to remove the residual phosphorus-based catalyst, simplifying the manufacturing process.

[0063] In the above reforming reaction, bases such as NaOH, KOH, K2HCO3, or K2CO3 are not used as catalysts. When such a base is used, it is difficult to obtain an Mw in the range of 5,000 to 25,000, and a purification process such as workup is required after the reforming reaction.

[0064] When mixing the reactants for the modification reaction, the solvent can be selectively used as needed. For example, in the modification reaction, if the viscosity of the reactants at the reaction temperature is suitable for the progress of the reaction even without a separate solvent, the solvent may not be used. That is, if the viscosity of the reactants is low enough that the mixing and stirring of the reactants can proceed smoothly without a solvent, a separate solvent is not required, which can be easily judged by those skilled in the art. When using a solvent, as possible solvents, any organic solvent (aprotic solvent) can be used as long as it can dissolve the reactants well and can be easily removed after the reaction without having any adverse effects on the reaction. Such solvents include, but are not particularly limited to, for example, acetonitrile, THF (tetrahydrofuran), MEK (methyl ethyl ketone), DMF (dimethylformamide), DMSO (dimethyl sulfoxide), toluene, or xylene, etc., which can be used alone or two or more of them can be used together. The amount of the solvent used is not particularly limited and can be used in an appropriate amount as long as the reactants are sufficiently dissolved and no unfavorable effects on the reaction are caused, and those skilled in the art of this technology can appropriately select it considering this.

[0065] The reaction temperature and reaction time in the above heating stage vary depending on the type of reactants, but the heating stage can be carried out, for example, at 80°C to 140°C, preferably 100°C to 120°C. When the temperature is lower than 80°C, the rate of the modification reaction is slow, and when it exceeds 140°C, side reactions may proceed. The reaction time of the modification reaction may be 30 minutes to 10 hours, preferably 1 hour to 8 hours. The optimal reaction time is determined by factors such as the structure of the epoxy group, the degree of ring opening, the solvent, the amount of the catalyst, etc. However, if it is less than 30 minutes, the reaction may not be completed, and if it exceeds 10 hours, no favorable further reaction will proceed, so a reaction of more than 10 hours is unnecessary.

[0066] By the above modification reaction, a modified epoxy resin is produced, having a weight average molecular weight of 5,000 to 25,000, preferably 7,000 to 20,000, a polydispersity index of 5.0 to 20.0, preferably 7.0 to 20.0, and preferably an EEW value of 150 to 500 g / Eq, preferably 200 to 350 g / Eq. On the other hand, in the modification reaction, various epoxy resins having various molecular weights and / or structures can be formed together according to variables such as the position of the substituent to react and the degree of the reaction, and these can be produced in a mixed state, which is well known to those skilled in the art as being common in the production reaction of polymer resins. Also, the modified epoxy resin produced with various epoxy resins having various molecular weights and / or structures mixed therein can be used as it is in the mixed state.

[0067] C. Epoxy composition The modified epoxy resin of the present invention described above can be used in any field, application destination, and use where epoxy resins are conventionally used in this technology. In particular, preferably, the modified epoxy resin of the present invention is used as a semiconductor adhesive. Specifically, the modified epoxy resin of the present invention can be used as a material for an adhesive film (for example, DAF, DDAF, etc.) for the lamination and thinning of semiconductor packages. More specifically, the modified epoxy resin of the present invention can be used as one component in a composition used for semiconductor packaging.

[0068] ​In still another embodiment of the present invention, there is provided a composition containing an epoxy resin, an acrylic resin, a curing agent, and a curing catalyst (i.e., an epoxy resin composition, also referred to as an "epoxy composition"), wherein the epoxy composition contains 10% to 90% by weight of the modified epoxy resin of the present invention and 90% to 10% by weight of a general epoxy resin based on the total weight of the epoxy resin. In the above epoxy composition, it is preferable from the viewpoints of improving the thermal expansion characteristics of the epoxy composition due to the curing-induced phase separation (morphology characteristics) into the epoxy region and the acrylic region during curing of the epoxy composition, processability, etc. that it contains 10% to 90% by weight of the modified epoxy resin and 90% to 10% by weight of the general epoxy resin. That is, the epoxy composition according to the above embodiment of the present invention contains the modified epoxy resin of the present invention and a general epoxy resin. In order to adjust the processability and physical properties of the epoxy composition according to the present invention, a general epoxy resin (i.e., an unmodified epoxy resin) can be used together.

[0069] The above "modified epoxy resin of the present invention" is a "modified epoxy resin" according to an embodiment of the present invention, and all the contents described in the above item of "i. Modified epoxy resin" are equally applicable.

[0070] The above general epoxy resin refers to any epoxy resin that is conventionally generally known in this technical field and is not the modified epoxy resin according to the present invention. For convenience, and in contrast to the modified epoxy resin of the present invention, it is also referred to as an "unmodified epoxy resin" as something that has not been modified.

[0071] The type and / or physical properties of the general epoxy resin are not particularly limited, which are matters generally known in this technical field and will not be described in detail here.

[0072] Examples of general epoxy resins include, but are not limited to, glycidyl ether-based epoxy resins, glycidyl amine-based epoxy resins, and glycidyl ester-based epoxy resins selected from the group consisting of bisphenol, biphenyl, naphthalene, benzene, thiodiphenol, fluorene, anthracene, isocyanurate, triphenylmethane, 1,1,2,2-tetraphenylethane, tetraphenylmethane, 4,4'-diaminodiphenylmethane, aminophenol, alicyclic, aliphatic, or novolak units; and alicyclic epoxy resins. For example, one or more selected from such epoxy resins can be used. The above general epoxy resins include both liquid and solid epoxy resins.

[0073] From the perspective of film processability, a liquid epoxy resin or a mixture of a liquid epoxy resin and a solid epoxy resin can be used as the above general epoxy resin. Using a liquid epoxy resin or a mixture of a liquid epoxy resin and a solid epoxy resin as the epoxy resin is adjusted and used to suit the engineer in this technical field in consideration of physical properties such as processability, drying property, and viscosity in the subsequent process of processing the epoxy composition, which pertains to the common general knowledge in this technical field and will not be described in detail herein.

[0074] The acrylic resin is compounded from the viewpoints of improving the stress relaxation ability and processability of the epoxy composition. In the above epoxy composition, the acrylic resin is compounded in an amount of 20 to 1000 parts by weight, preferably 20 to 500 parts by weight, more preferably 20 to 200 parts by weight based on 100 parts by weight of the epoxy resin. If the content of the acrylic resin is less than 20 parts by weight, it is difficult to sufficiently ensure the stress relaxation ability and processability. If it exceeds 1000 parts by weight, it is difficult to ensure sufficient thermal expansion characteristics. As the acrylic resin, any acrylic resin generally known in the art can be used, and the physical properties of the acrylic resin are not particularly limited.

[0075] The epoxy composition according to the realization example of the present invention contains a curing agent and a curing catalyst for curing the epoxy composition, which is common in this technical field.

[0076] As the above curing agent, any curing agent generally known as a curing agent for epoxy resins can be used, and without particularly limiting thereto, for example, polyphenol-based, acid anhydride-based, amine-based, etc. can be used. Matters regarding such curing agents are matters generally known in this technical field and will not be described in detail here.

[0077] According to the range of the desired degree of curing, the content of the curing agent can be adjusted based on the concentration of the epoxide groups of the epoxy resin. Without limiting thereto, for example, from the viewpoints of the degree of curing, efficiency, etc., the curing agent is preferably used with the content adjusted so that the ratio of the epoxide group equivalent: the equivalent of the reactive functional group of the curing agent with respect to the epoxide group is 1:0.5 to 2.0, preferably 1:0.8 to 1.5. The reactive functional group of the above curing agent with respect to the epoxide group is, for example, an amine group in the case of an amine-based curing agent and a phenolic hydroxyl group in the case of a polyphenol-based curing agent, which are generally known in this technical field.

[0078] As the curing catalyst, any curing catalyst known as generally used for curing epoxy compositions in this technical field can be used. Without being limited thereto, for example, curing catalysts such as imidazole-based, phosphorus-based compounds, tertiary amine-based, quaternary ammonium-based, and organic acid salt-based can be used. Matters regarding such curing catalysts are matters generally known in this technical field and will not be described in detail here.

[0079] The curing catalyst can be used by being blended in an amount generally used in this technical field. Although not limited thereto, for example, it can be used in an amount of 0.1 to 10 parts by weight, for example, 0.2 to 5 parts by weight based on 100 parts by weight of the above epoxy resin. From the viewpoints of the promoting effect of the curing reaction and the control of the curing reaction rate, it is preferable to use the curing catalyst in the above content. By using the curing catalyst in the blending amount within the above range, curing is effectively promoted, and an improvement in the working throughput can be expected.

[0080] According to another embodiment of the present invention, the epoxy resin composition of the present invention can further contain an inorganic filler as necessary. The inorganic filler is a component generally used in this technical field in order to reinforce the physical properties of the epoxy composition.

[0081] Although not limited thereto, for example, as the inorganic filler, any inorganic filler known as being conventionally used for reinforcing the physical properties of epoxy resins can be used. Although not limited thereto, for example, the inorganic filler can be at least one selected from the group consisting of metal oxides such as silica (including, for example, fused silica and crystalline silica), zirconia, titania, alumina, silicon nitride and aluminum nitride, and silsesquioxane. The above inorganic filler can be used alone or as a mixture of two or more. The inorganic filler is a matter generally known in this technical field and will not be described in detail here.

[0082] The inorganic filler can be blended in a range generally used in this technical field, for example, 60 wt% or less, and preferably 50 wt% or less based on the total weight of the solid content of the epoxy composition, taking into account the physical properties and / or processability, but is not limited thereto. If it exceeds 60 wt%, the process may become difficult, and the inorganic filler is a selectively blended component and the lower limit is not limited.

[0083] ​In the present invention, the "total weight of the solid content of the epoxy composition" means, in the epoxy composition, when liquid components and / or solvents that may accidentally exist are used, the total weight of the solid content of the epoxy composition from which any liquid components such as the used solvent are removed and cured. For example, based on the total weight of the solid content of the epoxy composition of the present invention, the remaining content excluding the content of the inorganic filler (for example, if the inorganic filler is 60 wt% based on the total weight of the solid content of the epoxy composition, the remaining content is 40 wt%) is the content of all organic components such as epoxy resin, acrylic resin, curing agent, curing catalyst, and other additives described below.

[0084] The epoxy composition according to any implementation example of the present invention may further be blended with other additives such as flame retardants, plasticizers, antibacterial agents, leveling agents, defoaming agents, colorants, stabilizers, coupling agents, viscosity regulators, diluents, molding preparations, etc., which are usually blended in epoxy compositions in this technical field, as needed, within the range that does not impair the physical properties of the epoxy composition. Also, a solvent may be used as needed to disperse the epoxy composition so that the blending can be easily dispersed before curing. The types, blending, content, etc. of such other additives and / or solvents are matters generally known to those skilled in this technical field and will not be described in detail herein.

[0085] The above epoxy composition according to one implementation example of the present invention can be used for adhesives, for example, for semiconductor adhesives, and is suitable for use in the production of, for example, semiconductor adhesive films (for example, DAF, DDAF, etc.).

[0086] According to another embodiment of the present invention, there is provided a cured product of the epoxy composition according to any of the above embodiments. The cured product can be obtained by curing the epoxy composition, for example, by thermal curing. Those skilled in the art can appropriately select any curing method and curing conditions generally known in the art to cure the above epoxy composition, and the curing method and / or curing conditions are not particularly limited. Further, the curing method, curing conditions, etc. of the epoxy composition are well-known in this technical field and will not be described in detail herein. The above cured product is used in the sense of including a composite.

[0087] According to still another embodiment of the present invention, there is provided an article containing any of the above epoxy compositions and / or cured products of the present invention. The above article may be an adhesive for semiconductors, an adhesive film, DAF, DDAF, etc.; and may also be a semiconductor component including an adhesive for semiconductors, an adhesive film, DAF, DDAF, etc.

[0088] As described above, the epoxy composition containing the modified epoxy resin of the present invention has improved thermal expansion characteristics. By applying the epoxy composition to an adhesive for semiconductors, specifically, an adhesive film such as DAF or DDAF, problems of warping and cracking in semiconductor packaging can be prevented. Thereby, the processability of semiconductor packaging and the reliability of the product are improved.

Examples

[0089] Hereinafter, the present invention will be described in more detail with reference to examples. However, the present invention is not limited by the following examples.

[0090] A. Synthesis Example Synthesis Example 1: At room temperature (20 - 25 °C, hereinafter the same), 65 g of bisphenol A novolac epoxy resin (EEW 210 g / Eq), 3.95 g of 1,1,1-tris(4-hydroxyphenyl)ethane, and 16.3 g of methyl ethyl ketone (MEK) were added to a two-necked flask and stirred for 30 minutes to produce a homogeneous solution. Then, 0.12 g of triphenylphosphine (TPP) was added to the above flask, followed by heating and stirring at 100 °C for 5 hours to obtain a modified epoxy resin. After completion of the reaction, a modified epoxy resin with EEW = 261 g / Eq, weight average molecular weight (Mw) = 22,000, and polydispersity index = 13.5 was obtained. The weight average molecular weight (Mw) was measured by gel permeation chromatography using tetrahydrofuran. The polydispersity index (PDI, Mw / Mn) was obtained by measuring the weight average molecular weight (Mw) and number average molecular weight (Mn) by gel permeation chromatography using tetrahydrofuran and calculating from these values. The method for obtaining the Mw and PDI values is the same in Synthesis Examples 2 - 7.

[0091] Synthesis Example 2: At room temperature, 65 g of bisphenol A novolac epoxy resin (EEW 210 g / Eq), 2.64 g of 1,1,1-tris(4-hydroxyphenyl)ethane, 2.15 g of 1,3-benzenediol, and 16 g of methyl ethyl ketone (MEK) were added to a two-necked flask and stirred for 30 minutes to produce a homogeneous solution. Then, 0.14 g of triphenylphosphine (TPP) was added to the above flask, followed by heating and stirring at 100 °C for 6 hours to obtain a modified epoxy resin. After completion of the reaction, a modified epoxy resin with EEW = 286 g / Eq, weight average molecular weight (Mw) = 24,000, and polydispersity index = 12.0 was synthesized.

[0092] Synthesis Example 3: At room temperature, 65 g of bisphenol A novolac epoxy resin (EEW 210 g / Eq), 1.32 g of 1,1,1-tris(4-hydroxyphenyl)ethane, 2.95 g of bisphenol A, 2.43 g of phenol, and 16 g of methyl ethyl ketone (MEK) were added to a two-necked flask and stirred for 30 minutes to produce a homogeneous solution. Then, 0.13 g of triphenylphosphine (TPP) was added to the flask, followed by heating and stirring at 110 °C for 3 hours to obtain a modified epoxy resin. After completion of the reaction, a modified epoxy resin with EEW = 295 g / Eq, weight average molecular weight (Mw) = 15,000, and polydispersity index = 7.0 was synthesized.

[0093] Synthesis Example 4: At room temperature, 65 g of bisphenol A novolac epoxy resin (EEW 210 g / Eq), 1.32 g of 1,1,1-tris(4-hydroxyphenyl)ethane, 4.13 g of 1,6-dihydroxynaphthalene, and 16 g of methyl ethyl ketone (MEK) were added to a two-necked flask and stirred for 30 minutes to produce a homogeneous solution. Then, 0.11 g of triphenylphosphine (TPP) was added to the flask, followed by heating and stirring at 120 °C for 4 hours to obtain a modified epoxy resin. After completion of the reaction, a modified epoxy resin with EEW = 289 g / Eq, weight average molecular weight (Mw) = 19,000, and polydispersity index = 10.8 was synthesized.

[0094] Synthesis Example 5: At room temperature, 65 g of phenol novolac epoxy resin (EEW 180 g / Eq), 1.27 g of 1,3,5-trihydroxybenzene, 3.44 g of bisphenol A, and 16 g of methyl ethyl ketone (MEK) were added to a two-necked flask and stirred for 30 minutes to produce a homogeneous solution. Then, 0.14 g of triphenylphosphine (TPP) was added to the flask, followed by heating and stirring at 110 °C for 4 hours to obtain a modified epoxy resin. After completion of the reaction, a modified epoxy resin with EEW = 235 g / Eq, weight average molecular weight (Mw) = 18,000, and polydispersity index = 9.8 was synthesized.

[0095] Synthesis Example 6: At room temperature, 65 g of ortho-cresol novolac epoxy resin (EEW 200 g / Eq), 1.14 g of 1,3,5-trihydroxybenzene, 3.83 g of phenol, and 16 g of methyl ethyl ketone (MEK) were added to a two-necked flask and stirred for 30 minutes to produce a uniform solution. Then, 0.10 g of triphenylphosphine (TPP) was added to the above flask, and then heated and stirred at 110 °C for 3.5 hours to obtain a modified epoxy resin. After the reaction was completed, a modified epoxy resin with EEW = 271 g / Eq, weight average molecular weight (Mw) = 13,000, and polydispersity index = 7.1 was synthesized.

[0096] Synthesis Example 7: At room temperature, 65 g of ortho-cresol novolac epoxy resin (EEW 200 g / Eq), 3.79 g of 4,4'-biphenol, and 16 g of methyl ethyl ketone (MEK) were added to a two-necked flask and stirred for 30 minutes to produce a uniform solution. Then, 0.11 g of triphenylphosphine (TPP) was added to the above flask, and then heated and stirred at 120 °C for 5 hours to obtain a modified epoxy resin. After the reaction was completed, a modified epoxy resin with EEW = 247 g / Eq, weight average molecular weight (Mw) = 13,500, and polydispersity index = 8.0 was synthesized.

[0097] II. Production of Composite and Evaluation of Thermal Expansion Characteristics (1) Production of Epoxy Filler Composite With the composition shown in Table 1 below, a phenolic curing agent and silica are dissolved in methyl ethyl ketone so that the solid content is 80 wt%. After mixing this mixture for 10 minutes, an acrylic resin and an epoxy resin are added, and after further mixing for an additional 30 minutes, then a curing catalyst is added and further mixed for 10 minutes to obtain a uniform solution. The above mixture is cast onto release paper and then dried in an oven at 80 °C for 30 minutes. The dried sample is cured at 120 °C for 1 hour and then at 180 °C for 2 hours. Test pieces for physical property measurement are produced in a size of 4 mm × 40 mm × 0.1 mm (mm 3 ) and the physical properties are evaluated.

[0098] (2) Evaluation of Thermal Expansion Characteristics The dimensional changes due to temperature of the cured products obtained in the examples and comparative examples shown in Table 1 below were evaluated using a Thermo-mechanical Analysizer and are shown in Table 1 below.

[0099]

Table 1

[0100] As shown in Table 1 above, the epoxy compositions of the present invention containing the modified epoxy resins of Examples 1 to 7 showed significantly lower CTEs (α1 and α2) compared to the epoxy compositions of Comparative Examples 1 and 2 that did not contain the modified epoxy resins of the present invention. Furthermore, the compositions of Examples 1 to 7 showed a higher glass transition temperature (Tg) compared to the compositions of Comparative Examples 1 and 2. Thus, the epoxy compositions containing the modified epoxy resin and acrylic resin of the present invention had improved thermal expansion characteristics.

Claims

1. The weight average molecular weight ranges from 5,000 to 25,000, the polydispersity index ranges from 5.0 to 20.0, and the epoxy equivalent (EEW, Epoxy Equivalent Weight) is from 150 g / Equivalent to 500 g / Equivalent, (1) one kind of epoxy-derived unit selected from the group consisting of the following chemical formula (AF), chemical formula (BF), and chemical formula (CF); and (2) containing at least one modifier-derived unit selected from the group consisting of the following chemical formula (1F), chemical formula (2F), chemical formula (3F), chemical formula (4F), chemical formula (5F), and chemical formula (6F), The modified epoxy resin in which the epoxy-derived unit and the modifier-derived unit are linked through the following chemical formula (L). 【Chemical 1】 (In the chemical formula (CF), S is [Chemical 2] as follows, (In the chemical formulas (AF) to (CF), n is an integer from 1 to 50, The epoxy resin may or may not have the structure of the following chemical formula (7F), When the epoxy resin has the structure of the following chemical formula (7F), at least one of the plurality of Ms is a linkage by a single bond to ** of the following chemical formula (L), at least one is the following chemical formula (7F), at least one is a glycidyl group of the following chemical formula (E), and the remaining Ms are each independently a single bond to ** of the following chemical formula (L), the following chemical formula (7F), or a glycidyl group of the following chemical formula (E), When the epoxy resin does not have the following chemical formula (7F), at least one of the plurality of Ms is a linkage by a single bond to ** of the following chemical formula (L), at least one is a glycidyl group of the following chemical formula (E), and the remaining Ms are each independently a linkage by a single bond to ** of the following chemical formula (L) or a glycidyl group of the following chemical formula (E).) [Chemical Formula 3] (In the chemical formula (1F), R is a methyl group, and in the chemical formula (3F), X is -CH ２ -, -C(CH ３ ), ２ -, -C(CF ３ ), ２ -, -S- or -SO ２ -, and in the chemical formula (5F), Y is independently selected from H and a methyl group, and in the chemical formulas (1F) to (6F), * is a linkage by a single bond to * of the following chemical formula (L)) [Chemical Formula 4] (In the chemical formula (7F), G is independently selected from the group consisting of a C1 to C10 alkyl group, an allyl group, and a C6 or C10 aryl group, and n' is an integer from 0 to 5.) 【Chemical Formula 5】 (In the chemical formula (L), the ** is a linkage by a single bond to M of the chemical formula (AF), (BF), or (CF), and the * is a linkage by a single bond to * of the following chemical formula (1F), (2F), (3F), (4F), (5F), or (6F).)

2. One epoxy resin selected from the group consisting of the following chemical formulas (AS) to (CS) and at least one modifier selected from the group consisting of the following chemical formulas (1) to (6) are mixed in the presence of 1 to 10 parts by weight of a phosphorus-based catalyst per 100 parts by weight of the modifier, and then heated, When at least one trifunctional modifier selected from the group consisting of chemical formulas (1) and (2) is used as the modifier, the trifunctional modifier has 5 to 20 moles of hydroxy groups of the trifunctional modifier per 100 moles of epoxy groups of the epoxy resin as the starting material, and is used in such an amount, When at least one bifunctional modifier selected from the group consisting of chemical formulas (3) to (6) is used as the modifier, the bifunctional modifier has 10 to 30 moles of hydroxy groups of the bifunctional modifier per 100 moles of epoxy groups of the epoxy resin as the starting material, and is used in such an amount, When at least one trifunctional modifier selected from the group consisting of chemical formulas (1) and (2) and at least one bifunctional modifier selected from the group consisting of chemical formulas (3) to (6) are used together as the modifier, the modifier has 5 to 30 moles of the total hydroxy groups of the bifunctional modifier and the trifunctional modifier per 100 moles of epoxy groups of the epoxy resin as the starting material, and is used in such an amount. The method for producing a modified epoxy resin according to claim 1. [Chemical Formula 6] (In the above chemical formula (CS), S is 【Chemical Formula 7】 and (In the above chemical formulas (AS) to (CS), n is an integer of 1 to 50, and K is a glycidyl group of the following chemical formula (E).) 【Chemical 8】 (In the chemical formula (1), R is a methyl group, and in the chemical formula (3), X is -CH ２ -, -C(CH ３ ), ２ -, -C(CF ３ ), ２ -, -S- or -SO ２ -. In the chemical formula (5), Y is independently selected from the group consisting of H and a methyl group.)

3. The method for producing an epoxy resin according to claim 2, wherein a monofunctional modifier of the following chemical formula (7) is used together with at least one modifier selected from the group consisting of the above chemical formulas (1) to (6). 【Chemical Formula 9】 (However, in the above chemical formula (7), G is independently selected from the group consisting of a C1 to C10 alkyl group, an allyl group, and a C6 or C10 aryl group, and n' is an integer of 0 to 5.)

4. The method for producing an epoxy resin according to claim 3, wherein the monofunctional modifier is used in an amount such that the hydroxy group of the monofunctional modifier is 30 moles or less per 100 moles of the epoxy group of the epoxy resin as the starting material.

5. The method for producing an epoxy resin according to claim 2, wherein the heating step is performed at a temperature of 80°C to 140°C.

6. The method for producing an epoxy resin according to claim 2, wherein the heating step is performed for 30 minutes to 10 hours.

7. An epoxy composition comprising an epoxy resin, an acrylic resin, a curing agent, and a curing catalyst, wherein the epoxy resin contains 10% to 90% by weight of the modified epoxy resin according to claim 1 and 90% to 10% by weight of an unmodified epoxy resin based on the total weight of the epoxy resin.

8. The epoxy composition according to claim 7, wherein the content of the acrylic resin is 20 to 1000 parts by weight with respect to 100 parts by weight of the epoxy resin.

9. The epoxy composition according to claim 7, wherein the composition further contains an inorganic filler.

10. The epoxy composition according to claim 7, wherein the composition is used as an adhesive.

11. A semiconductor adhesive film comprising the epoxy composition according to claim 7.

12. A cured product of the epoxy composition according to claim 7.

13. An article comprising the cured product according to claim 12.

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