Sheet for encapsulating a display body and an optical semiconductor device

Abstract

To provide a display body which is less likely to cause a color shift and has high brightness.SOLUTION: A display body 1 includes a sealing resin layer 4 sealing a plurality of optical semiconductor elements 3a-3f disposed on a substrate 2. The sealing resin layer 4 includes a coloring layer 42 and a non-coloring layer 43 in the order from an optical semiconductor element side. When, in a cross section perpendicular to a substrate 2 surface and passing through a center of gravity GC of the optical semiconductor element 3c in a pixel 3 and a center of gravity GD of the optical semiconductor element 3d in a pixel 3', a line 1L1 represents a straight line at an angle of 90 degrees in a front direction with respect to a base line B and passing through the gravity GC, and a line 2L2 represents a straight line at an angle of 45 degrees in the front direction with respect to the base line B and passing through an end portion TA at an end face on an optical semiconductor element 3c front side, a distance D1 where the line 1L1 overlaps the coloring layer 42, a distance D2 where the line 1L1 overlaps the non-coloring layer 43, a distance D3 where the line 2L2 overlaps the coloring layer 4, and a distance D4 where the line 2L2 overlaps the non-coloring layer 43 satisfy the relationship of D1 / D2<D3 / D4.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to a display body and a sheet for encapsulating an optoelectronic semiconductor element. More specifically, the present invention relates to, for example, a display body obtained by encapsulating an optoelectronic semiconductor element of a self-luminous display device, and a sheet suitable for use in encapsulating an optoelectronic semiconductor element.

Background Art

[0002] In recent years, as a next-generation display device, a self-luminous display device typified by a mini / micro LED display device (Mini / Micro Light Emitting Diode Display) has been devised. In a mini / micro LED display device, as a basic configuration, a substrate on which a large number of minute optoelectronic semiconductor elements (LED chips) are arranged at high density is used as a display panel, and the optoelectronic semiconductor elements are encapsulated with a sealing material, and a cover member such as a resin film or a glass plate is laminated on the outermost layer.

[0003] In a display body including a self-luminous display device such as a mini / micro LED display device, wirings of metal oxides such as metal and ITO (metal wirings) are arranged on the substrate of the display panel. Such a display device has a problem that, for example, at the time of turning off the light, light is reflected by the above metal wirings and the like, resulting in poor appearance of the screen and inferior design. For this reason, as a sealing material for encapsulating an optoelectronic semiconductor element, a technique using an antireflection layer for preventing reflection by metal wirings has been adopted.

[0004] Further, in a display using a self-luminous display device, there has been a problem that unevenness in brightness (luminance unevenness) occurs due to the light source of the optoelectronic semiconductor element. When luminance unevenness occurs, a phenomenon called "color shift" occurs in which the color tone changes between when viewed from the front of the display and when viewed from an oblique viewing angle.

[0005] Patent Document 1 discloses an adhesive sheet capable of suppressing luminance unevenness, which is a laminate of a colored adhesive layer and a colorless adhesive layer, and the colorless adhesive layer is positioned to contact a photoelectric semiconductor element. According to the above adhesive sheet, when it is brought into contact with and follows the uneven shape formed by a substrate and a photoelectric semiconductor element installed on the substrate, the colorless adhesive layer comes into contact with the unevenness, and the unevenness is absorbed to some extent by the colorless adhesive layer. Therefore, it is described that the compression and deformation of the colored adhesive layer are suppressed, thereby suppressing the unevenness of the transmittance in the adhesive layer and suppressing the luminance unevenness.

Prior Art Documents

Patent Documents

[0006]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0007] However, although an adhesive sheet provided with a colored adhesive layer is expected to prevent reflection by metal wiring and suppress the effect of luminance unevenness when sealing a photoelectric semiconductor element, the transmittance of the light emitted by the photoelectric semiconductor element decreases, and as a result, there is a problem that the front luminance of the display body decreases. When the front luminance decreases, the power consumption increases to increase the luminance. In addition, the adhesive sheet of Patent Document 1 has a problem that the colored adhesive layer cannot sufficiently absorb the light emitted from the side surface of the photoelectric semiconductor element, the interference between the lights emitted from adjacent photoelectric semiconductor elements is strong, and a color shift is likely to occur. For this reason, a display body with a low likelihood of color shift and high luminance is required.

[0008] The present invention has been conceived under such circumstances, and its object is to provide a display body that is less likely to cause color shift and has high brightness. Another object of the present invention is to provide a sheet for encapsulating an optical semiconductor element that can produce a display body that is less likely to cause color shift and has high brightness by encapsulating the optical semiconductor element.

Means for Solving the Problems

[0009] As a result of intensive studies to achieve the above object, the inventors of the present invention found that in a state where a plurality of optical semiconductor elements arranged on a substrate are encapsulated by a sealing resin layer including a colored layer and a non-colored layer from the optical semiconductor element side, the distances of the colored layer and the non-colored layer of the optical semiconductor element at the end of the pixel at a specific angle on the side of other adjacent pixels and the distances of the colored layer and the non-colored layer on the front side of the optical semiconductor element have a specific relationship, the display body is less likely to cause color shift and has high brightness. The present invention has been completed based on these findings.

[0010] That is, the present invention is a display body including a substrate, a plurality of optical semiconductor elements arranged on the substrate, and a sealing resin layer for sealing the plurality of optical semiconductor elements, the plurality of optical semiconductor elements are arranged in plurality for each pixel including a plurality of optical semiconductor elements, the sealing resin layer has a colored layer and a non-colored layer in this order from the optical semiconductor element side, In a vertical cross-section with respect to the substrate surface passing through the center of gravity of the first optical semiconductor element located at the end of the first pixel and the center of gravity of the second optical semiconductor element located at the end on the first optical semiconductor element side in the second pixel adjacent to the first pixel, using the substrate surface as a baseline, a straight line passing through the center of gravity of the first optical semiconductor element and in the front direction at an angle of 90° with respect to the baseline is line 1, In the first optical semiconductor device, a straight line passing through the end of the parallel line on the side of the second optical semiconductor device that has the longest length of the parallel line with respect to the baseline and at an angle of 45° in the front direction with respect to the baseline is defined as Line 2. When the distance where Line 1 overlaps with the colored layer is D1, the distance where Line 1 overlaps with the non-colored layer is D2, the distance where Line 2 overlaps with the colored layer is D3, and the distance where Line 2 overlaps with the non-colored layer is D4, A display body is provided, where D1, D2, D3, and D4 satisfy the following formula (1). D1 / D2 < D3 / D4 (1)

[0011] In the display body, since the encapsulation resin layer that encapsulates the optical semiconductor device contains the colored layer, it is possible to prevent light reflection by metal wiring or the like provided on the substrate. D1 / D2 corresponds to the ratio of the thickness of the colored layer to the thickness of the non-colored layer located in the front direction of the optical semiconductor device. A small D1 / D2 indicates that the light emitted by the optical semiconductor device in the front direction is less likely to be absorbed by the colored layer. Also, D3 / D4 corresponds to the ratio of the thickness of the colored layer to the thickness of the non-colored layer in a direction 45° oblique to the front direction of the optical semiconductor device, with reference to the end of the end face on the front side of the optical semiconductor device. A large D3 / D4 indicates that the light emitted by the optical semiconductor device in the 45° oblique direction is likely to be absorbed by the colored layer. Therefore, the fact that D3 / D4 is larger than D1 / D2 means that the transmittance of the light in the front direction of the optical semiconductor device is higher than the transmittance of the light in the 45° oblique direction on the side of the adjacent pixel. Thereby, a display body that satisfies D1 / D2 < D3 / D4 has light emitted by the optical semiconductor device being highly transmissive in a wide field of view in the front direction while having low transmittance in the side direction, the display body is less likely to cause color shift, and has high front luminance.

[0012] It is preferable that the encapsulation resin layer includes a diffusion functional layer on the side of the optical semiconductor device of the colored layer. By having such a configuration, the light emitted by the optical semiconductor device in the side direction can be diffused in the diffusion functional layer, and the front luminance can be made higher.

[0013] The display body preferably includes a self-luminous display device.

[0014] The display body is preferably an image display device.

[0015] Further, the present invention provides a sheet for encapsulating a plurality of optical semiconductor elements arranged for each pixel including a plurality of optical semiconductor elements on a substrate, the sheet includes an encapsulating resin layer including a colored layer and an uncolored layer, when forming an encapsulating resin layer by encapsulating the plurality of optical semiconductor elements such that the colored layer side faces the optical semiconductor element side with the encapsulating resin layer, in a vertical cross-section with respect to the substrate surface passing through the center of gravity of the first optical semiconductor element located at the end of the first pixel and the center of gravity of the second optical semiconductor element located at the end on the first optical semiconductor element side of the second pixel adjacent to the first pixel, using the substrate surface as a baseline, a straight line passing through the center of gravity of the first optical semiconductor element and in the front direction at an angle of 90° with respect to the baseline is line 1, a straight line passing through the end on the second optical semiconductor element side of the parallel line having the longest length with respect to the baseline in the first optical semiconductor element and in the front direction at an angle of 45° with respect to the baseline is line 2, when the distance where line 1 overlaps with the colored layer is D1, the distance where line 1 overlaps with the uncolored layer is D2, the distance where line 2 overlaps with the colored layer is D3, and the distance where line 2 overlaps with the uncolored layer is D4, there is provided a sheet for encapsulating an optical semiconductor element, where D1, D2, D3, and D4 can satisfy the following formula (1). D1 / D2 < D3 / D4 (1)

[0016] The encapsulating resin layer preferably includes a diffusion functional layer on the side opposite to the uncolored layer of the colored layer.

Advantages of the Invention

[0017] According to the display body of the present invention, color shift due to the light emitted by the optical semiconductor element is less likely to occur, and the brightness is high. Therefore, the above display body can be visually recognized with the same color tone from a wide viewing angle. In addition, the above display body looks bright and has a good appearance without increasing the power consumption. Further, according to the sheet for sealing an optical semiconductor element of the present invention, by sealing the optical semiconductor element, a display body with less likely color shift and high brightness can be provided.

Brief Description of Drawings

[0018]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Embodiments for Carrying Out the Invention

[0019] [Display body] The display body of the present invention includes at least a substrate, a plurality of optical semiconductor elements arranged on the substrate, and a sealing resin layer for sealing the plurality of optical semiconductor elements. The display body is a device for displaying information by the light emitted by the optical semiconductor element.

[0020] Examples of the above-mentioned optical semiconductor elements include light-emitting diodes (LEDs) such as blue light-emitting diodes, green light-emitting diodes, red light-emitting diodes, and ultraviolet light-emitting diodes.

[0021] On the above-mentioned substrate, the plurality of optical semiconductor elements are arranged within one pixel, and a plurality of the pixels are arranged. That is, the plurality of optical semiconductor elements are arranged for each pixel including the plurality of optical semiconductor elements. FIG. 1 shows a partial top view of an optical member in which a plurality of optical semiconductor elements are arranged for each pixel on a substrate. In the optical member 11 shown in FIG. 1, three optical semiconductor elements 3a to 3c are arranged on the substrate 2 so as to be close to each other, and one pixel (pixel 3) is formed by the three optical semiconductor elements 3a to 3c. Further, three optical semiconductor elements 3d to 3f are arranged on the substrate 2 so as to be close to each other, and one pixel (pixel 3') is formed by the three optical semiconductor elements 3d to 3f. And a plurality of pixels such as pixel 3 and pixel 3' are arranged on the substrate 2.

[0022] The display body of the present invention has an uneven shape formed by a substrate and optical semiconductor elements, in which the surface of the substrate in the region where no optical semiconductor element is arranged between two optical semiconductor elements is a concave portion, and the optical semiconductor elements are convex portions.

[0023] The height of the optical semiconductor element on the above-mentioned substrate (the height from the substrate surface to the end on the front side of the optical semiconductor element) is preferably 500 μm or less. When the height is 500 μm or less, the followability of the sealing resin layer with respect to the uneven shape is excellent.

[0024] The sealing resin layer preferably contacts the plurality of optical semiconductor elements and follows the uneven shape. Further, the sealing resin layer preferably seals the plurality of optical semiconductor elements together. In this specification, "sealing an optical semiconductor element" means embedding at least a part of the optical semiconductor element in the sealing resin layer or following and covering it with the sealing resin layer.

[0025] The above-mentioned sealing resin layer includes at least a colored layer and an uncolored layer, and has the colored layer and the uncolored layer in this order from the side of the optical semiconductor element. In the above-mentioned sealing resin layer, the colored layer and the uncolored layer may be directly laminated, or may be laminated via other layers.

[0026] In a vertical cross-section of the substrate surface passing through the center of gravity of the first optical semiconductor element located at the end of the first pixel installed on the substrate and the center of gravity of the second optical semiconductor element located at the end on the first optical semiconductor element side of the second pixel adjacent to the first pixel, the substrate surface is used as a baseline. A straight line at a 90° front direction angle with respect to the baseline passing through the center of gravity of the first optical semiconductor element is defined as line 1. A straight line at a 45° front direction angle with respect to the baseline passing through the end of the parallel line having the longest length among the parallel lines to the baseline in the first optical semiconductor element is defined as line 2. When the distance where line 1 overlaps with the colored layer is D1, the distance where line 1 overlaps with the uncolored layer is D2, the distance where line 2 overlaps with the colored layer is D3, and the distance where line 2 overlaps with the uncolored layer is D4, D1, D2, D3, and D4 satisfy the following formula (1). D1 / D2 < D3 / D4 (1)

[0027] In the first optical semiconductor element, the parallel line having the longest length among the parallel lines to the baseline is the parallel line having the longest overlapping length with the parallel line to the substrate surface in the cross-section of the first optical semiconductor element in the vertical cross-section. When there are a plurality of parallel lines with the longest length, among the plurality of parallel lines, the parallel line located on the most front side is adopted. The end of the parallel line is the end on the second optical semiconductor element side of the parallel line. For example, when the cross-sectional shape of the first optical semiconductor element in the vertical cross-section is rectangular, the end is the end on the second optical semiconductor element side of the upper side of the rectangle.

[0028] In the above display body, since the encapsulation resin layer that encapsulates the above optical semiconductor element contains the above coloring layer, it is possible to prevent reflection of light by metal wiring or the like provided on the substrate. D1 / D2 corresponds to the ratio of the thickness of the coloring layer to the thickness of the non-coloring layer, which is located in the front direction of the optical semiconductor element. When D1 / D2 is small, it indicates that the light emitted by the optical semiconductor element in the front direction is less likely to be absorbed by the coloring layer. Also, D3 / D4 corresponds to the ratio of the thickness of the coloring layer to the thickness of the non-coloring layer in a direction 45° oblique to the front direction of the optical semiconductor element, with reference to the end of the end face on the front side of the optical semiconductor element. When D3 / D4 is large, it indicates that the light emitted by the optical semiconductor element in the 45° oblique direction is likely to be absorbed by the coloring layer. Therefore, the fact that D3 / D4 is larger than D1 / D2 means that the transmittance of the light in the front direction of the optical semiconductor element is higher than the transmittance of the light in the 45° oblique direction on the adjacent pixel side. As a result, a display body that satisfies D1 / D2 < D3 / D4 has light emitted by the optical semiconductor element being highly transmissive in a wide viewing angle in the front direction, while the transmittance in the side direction is kept low, the display body is less likely to cause color shift, and the front luminance is high.

[0029] In this specification, "front" refers to the side on which the display body is viewed, and for example, it is the upward direction in FIG. 2 described later.

[0030] The display body of the present invention will be described using the display body shown in FIG. 2, which is one embodiment thereof. The display body 1 shown in FIG. 2 includes a substrate 2, a plurality of optical semiconductor elements 3b, 3c, 3d, and 3e disposed on the substrate 2, an encapsulation resin layer 4 that encapsulates these optical semiconductor elements 3b to 3e together, and a base material portion 5 bonded to the surface of the encapsulation resin layer 4 on the side opposite to the side of the optical semiconductor elements 3b to 3e. FIG. 2 is an enlarged cross-sectional view of a vertical plane with respect to the substrate 2 passing through the centers of gravity of the optical semiconductor elements 3b to 3e.

[0031] The optical semiconductor elements 3b to 3e are each fixed on a single substrate 2 by a support 31. The display body 1 has an uneven shape formed by the substrate 2 and the optical semiconductor elements 3b to 3e, with the surface of the substrate 2 in the region between the optical semiconductor elements 3b to 3e where no optical semiconductor element is arranged being a concave portion N, and the optical semiconductor elements 3b to 3e being convex portions P.

[0032] The optical semiconductor elements 3b and 3c in FIG. 2 are the optical semiconductor elements 3b and 3c shown in FIG. 1, and the optical semiconductor elements 3a to 3c are located within the same pixel 3. Also, the optical semiconductor elements 3d and 3e in FIG. 2 are the optical semiconductor elements 3d and 3e shown in FIG. 1, and the optical semiconductor elements 3d to 3f are located within the same pixel 3'. The pixel 3 and the pixel 3' are adjacent pixels. When the pixel 3 is the first pixel, the pixel 3' is the second pixel. And the optical semiconductor element 3c is the first optical semiconductor element located at the end within the pixel 3, and the optical semiconductor element 3d is located at the end within the pixel 3' and is the second optical semiconductor element adjacent to the optical semiconductor element 3c.

[0033] As shown in FIG. 2, the encapsulation resin layer 4 contacts the plurality of optical semiconductor elements 3b to 3e and follows the uneven shape to encapsulate the plurality of optical semiconductor elements 3b to 3e collectively.

[0034] The encapsulation resin layer 4 is composed of a non-coloring layer 41, a coloring layer 42, and a non-coloring layer 43 laminated directly in this order, and encapsulates the optical semiconductor elements 3b to 3e such that the non-coloring layer 41 side faces the optical semiconductor elements 3b to 3e side. The non-coloring layer 41 in contact with the optical semiconductor elements 3b to 3e follows the uneven shape, and the non-coloring layer 41 and the coloring layer 42 also have an uneven shape in the display body 1. On the other hand, the non-coloring layer 43 has an uneven shape opposite to that of the coloring layer 42 by one surface following the uneven shape of the coloring layer 42, and the other surface is flat. Note that the non-coloring layer 41 and the non-coloring layer 43 may each independently be a diffusion functional layer described later or a non-diffusion functional layer.

[0035] 3 shows an enlarged view of the area between the optical semiconductor elements 3c and 3d of the display 1 shown in FIG. 2. In the display 1 shown in FIG. 3, the surface of the substrate 2 is taken as a baseline B, and the center of gravity G of the optical semiconductor element 3c is taken as a baseline G. C The straight line passing through the line 1L1 and in the front direction at an angle of 90° to the baseline B is the line 1L1. The end of the parallel line on the optical semiconductor element 3c, which is the longest parallel line to the baseline B, on the optical semiconductor element 3d side is T A End T A is located at the right end (optical semiconductor element 3d side) of the upper side of the rectangular cross section of optical semiconductor element 3c in FIG. A The straight line passing through and in the front direction at an angle of 45° to the baseline B is line 2L2. That is, θ1 shown in FIG. 3 is 90°, and θ2 is 45°. The distance at which line 1L1 overlaps with colored layer 42 is D1, the distance at which line 1L1 overlaps with non-colored layer 43 is D2, the distance at which line 2L2 overlaps with colored layer 42 is D3, and the distance at which line 2L2 overlaps with non-colored layer 43 is D4. In this case, D1, D2, D3, and D4 in the display body 1 are expressed as D1 / D2 <D3 / D4を満たす。

[0036] In the display 1, the sealing resin layer 4 includes the colored layer 42, so that it is possible to prevent light reflection due to metal wiring and the like provided on the substrate 2. D1 / D2 corresponds to the ratio of the thickness of the colored layer 42 to the thickness of the non-colored layer 43 located in the front direction of the optical semiconductor element 3c. A small D1 / D2 indicates that the light emitted in the front direction by the optical semiconductor element 3c is less likely to be absorbed by the colored layer 42. Also, D3 / D4 is the ratio of the thickness of the end T of the front end face of the optical semiconductor element 3c. AThis corresponds to the ratio of the thickness of the colored layer 42 to the thickness of the non-colored layer 43 in a direction obliquely 45° with respect to the front direction of the optical semiconductor element 3c, with reference to . A large D3 / D4 indicates that the light emitted by the optical semiconductor element 3c in the obliquely 45° direction is likely to be absorbed by the colored layer 42. Therefore, the fact that D3 / D4 is larger than D1 / D2 means that the transmittance of the light in the front direction of the optical semiconductor element 3c is higher than the transmittance of the light in the obliquely 45° direction on the side of the adjacent pixel, i.e., the side of the optical semiconductor element 3d. As a result, the display body 1 that satisfies D1 / D2 < D3 / D4 has light emitted by the optical semiconductor element 3c transmitted with excellent transparency in a wide field of view in the front direction, while the transmittance in the side direction is kept low. The display body 1 is less likely to cause color shift and has high front luminance.

[0037] In FIG. 3, the case where the optical semiconductor element 3c at the end of the pixel satisfies the above formula (1) has been described. However, the optical semiconductor element 3d located at the end of the adjacent pixel may satisfy the above formula (1) together with or instead of the optical semiconductor element 3c.

[0038] Specifically, as shown in FIG. 4, the light F emitted by the optical semiconductor element 3c in the front direction A and the light F emitted by the optical semiconductor element 3d in the front direction B have excellent transmittance and high front luminance. On the other hand, the light R A emitted by the optical semiconductor element 3c in the right direction and the light L A emitted by the optical semiconductor element 3c in the left direction, as well as the light R B emitted by the optical semiconductor element 3d in the right direction and the light L B emitted by the optical semiconductor element 3d in the left direction are blocked by the colored layer 42, making it difficult for the light emitted by the optical semiconductor elements 3c and 3d in adjacent pixels to interfere with each other, and suppressing color shift.

[0039] On the other hand, FIG. 5 shows an embodiment of a conventional display body. In the display body shown in FIG. 5, since the colored layer 42 and the non-colored layer 43 between the optical semiconductor elements 3c and 3d are located on the front side of the front end surfaces of the optical semiconductor elements 3c and 3d, D1 / D2 = D3 / D4. The light R A emitted by the optical semiconductor element 3c in the right direction and the light LA and the rightward light R emitted by the optical semiconductor element 3d B and the leftward light L B are less likely to be blocked by the colored layer 42, and since the light emitted by the optical semiconductor elements 3c and 3d in adjacent pixels interfere with each other, color shift is likely to occur. In the embodiment shown in FIG. 5, when the thickness of the colored layer 42 is increased, the light F A and F B emitted by the optical semiconductor elements 3c and 3d decreases in light amount. Also, when the thickness of the colored layer 42 is decreased, the transmittance of light in the front diagonal direction increases, and color shift is more likely to occur. On the other hand, in the display body of the present invention, it is possible to make all of high front luminance, prevention of color shift, and antireflection ability excellent.

[0040] Thus, in the display body of the present invention, when D1, D2, D3, and D4 satisfy D1 / D2 < D3 / D4, the light emitted by the optical semiconductor element has excellent transmittance in the front direction, while the transmittance in the side direction is kept low, color shift is unlikely to occur, and the front luminance is high.

[0041] The center of gravity of the optical semiconductor element is determined by the three-dimensional shape of the optical semiconductor element. The three-dimensional shape of the optical semiconductor element is not particularly limited, and examples include prisms such as cubes and rectangular parallelepipeds, frustums of pyramids, cylinders, frustums of cones, and shapes in which the upper part thereof is dome-shaped. When the three-dimensional shape of the optical semiconductor element is a regular prismatic shape, the center of gravity is the center of the optical semiconductor element.

[0042] Note that in the display body 1, the base material portion 5 may not be provided. Also, the number of optical semiconductor elements within one pixel is not limited to three and is not particularly limited.

[0043] Another embodiment of the display body of the present invention is shown in FIG. 6. The display body 1 shown in FIG. 6 is the same as the display body 1 shown in FIG. 2 except that it does not include the non-coloring layer 41, and satisfies the above formula (1). Specifically, in the display body 1 shown in FIG. 6, the sealing resin layer 4 is directly laminated with the coloring layer 42 and the non-coloring layer 43 in this order from the side of the optical semiconductor elements 3b to 3e, and the optical semiconductor elements 3b to 3e are sealed so that the coloring layer 42 side faces the optical semiconductor elements 3b to 3e side. The coloring layer 42 in contact with the optical semiconductor elements 3b to 3e follows the uneven shape, and the non-coloring layer 43 has an uneven shape opposite to that of the coloring layer 42 by following the uneven shape of the coloring layer 42 on one surface, and the other surface is flat. Note that the non-coloring layer 43 may be a diffusion functional layer described later or a non-diffusion functional layer. Thus, the display body of the present invention may not include a non-coloring layer on the optical semiconductor element side rather than the coloring layer.

[0044] Still another embodiment of the display body of the present invention is shown in FIG. 7. The display body 1 shown in FIG. 7 is the same as the display body 1 shown in FIG. 2 except that the front interface of the coloring layer 42 is flat, and satisfies the above formula (1). Specifically, in the display body 1 shown in FIG. 7, the sealing resin layer 4 is directly laminated with the non-coloring layer 41, the coloring layer 42, and the non-coloring layer 43 in this order from the side of the optical semiconductor elements 3b to 3e, and the optical semiconductor elements 3b to 3e are sealed so that the non-coloring layer 41 side faces the optical semiconductor elements 3b to 3e side. The non-coloring layer 41 in contact with the optical semiconductor elements 3b to 3e follows the uneven shape, and the coloring layer 42 in the display body 1 also has an uneven shape. On the other hand, the coloring layer 42 has an uneven shape opposite to that of the non-coloring layer 41 by following the uneven shape of the non-coloring layer 41 on one surface, and the other surface is flat. Both surfaces of the non-coloring layer 43 are flat. Note that the non-coloring layer 41 and the non-coloring layer 43 may each independently be a diffusion functional layer described later or a non-diffusion functional layer.

[0045] In the above vertical plane cross-section, the distance from the substrate surface at line 1 to the front-side interface of the colored layer is preferably longer than the distance from the substrate surface to the front-side interface of the colored layer on the perpendicular line to the substrate surface passing through the midpoint of the first optical semiconductor element and the second optical semiconductor element. In this case, the light in the side direction emitted by the optical semiconductor element is absorbed by the colored layer, the transmittance is suppressed to be low, and color shift is less likely to occur.

[0046] In the above vertical plane cross-section, the distance from the substrate surface at line 1 to the end on the front side of the first optical semiconductor element (corresponding to the height of the first optical semiconductor element) is preferably longer than the distance from the substrate surface to the substrate-side interface of the colored layer on the perpendicular line to the substrate surface passing through the midpoint of the first optical semiconductor element and the second optical semiconductor element. In this case, the light in the side direction emitted by the optical semiconductor element is absorbed by the colored layer, the transmittance is suppressed to be low, and color shift is less likely to occur.

[0047] The cross-sectional views of the display body shown in FIGS. 2 to 7 can be obtained, for example, by cutting perpendicularly to the substrate surface so as to pass through the centers of gravity of a plurality of optical semiconductor elements in a state where the display body is cooled, thereby exposing the cross-section. By cooling the display body, it is possible to suppress melting and deformation of the sealing resin layer due to the heat generated during cutting. The cutting can be performed using a known or conventional cutting device such as laser beam irradiation or ion beam irradiation. Further, after cutting, the exposed cross-section may be milled to expose a cross-section with a lower degree of deformation. The temperature during cooling is appropriately set within a range that suppresses the degree of deformation of the sealing resin layer and cracking of the display body.

[0048] <Sealing resin layer> The above-mentioned encapsulation resin layer comprises at least the above-mentioned colored layer and the above-mentioned non-colored layer. Each layer constituting the above-mentioned encapsulation resin layer (the above-mentioned colored layer and the above-mentioned non-colored layer) may be a single layer within the above-mentioned encapsulation resin layer, or may be a multi-layer having the same or different compositions. When the colored layer or the non-colored layer includes multiple layers, the above-mentioned multi-layers may be laminated in contact with each other, or may be laminated separately (for example, two colored layers are laminated via one non-colored layer). When the above-mentioned encapsulation resin layer includes multiple layers of one or more of the colored layer and the non-colored layer, for at least one combination of the colored layer and the non-colored layer, it is sufficient to have the colored layer and the non-colored layer in this order from the side of the optical semiconductor element, and for these colored layer and non-colored layer to satisfy the above formula (1). Further, the total number of layers constituting the above-mentioned encapsulation resin layer is 2 or more including the above-mentioned colored layer and the above-mentioned non-colored layer, and may be 3 or more. From the viewpoint of reducing the thickness of the display body, the total number of the above-mentioned layers is, for example, 10 or less, and may be 5 or less or 4 or less.

[0049] It is preferable that the above-mentioned encapsulation resin layer includes a diffusion functional layer. By having such a configuration, the light emitted from the optical semiconductor element can be diffused in the above-mentioned diffusion functional layer, and the front luminance can be made higher. It is preferable that the above-mentioned diffusion functional layer is a layer corresponding to the non-colored layer in this specification. In FIGS. 2 and 7, the non-colored layer 41 is preferably a diffusion functional layer. In FIGS. 2, 6, and 7, the non-colored layer 43 may be a diffusion functional layer or a non-diffusion functional layer.

[0050] When the above-mentioned encapsulation resin layer includes the above-mentioned diffusion functional layer, it is preferable that the above-mentioned encapsulation resin layer includes the above-mentioned diffusion functional layer, the above-mentioned colored layer, and the above-mentioned non-colored layer in this order from the side of the optical semiconductor element. The above-mentioned non-colored layer may be either a diffusion functional layer or a non-diffusion functional layer. By having such a configuration, while making the front luminance higher, the appearance of the display body can be further improved both when turned off and when emitting light. In FIGS. 2 and 7, the encapsulation resin layer 4 includes, in this order from the side of the optical semiconductor element, the non-colored layer 41 which is a diffusion functional layer, the colored layer 42, and the non-colored layer 43. The non-colored layer 43 may be a diffusion functional layer or a non-diffusion functional layer.

[0051] In the display body of the present invention, it is preferable that at least one surface (particularly, the surface on the side of the optical semiconductor element) of the coloring layer has an uneven shape following the above uneven shape. In this case, the display body of the present invention is likely to satisfy the above formula (1). Further, the front surface of the coloring layer may have an uneven shape following the above uneven shape. In the display body 1 shown in FIGS. 2 and 6, both the front surface side and the optical semiconductor element side of the coloring layer 42 have an uneven shape. In the display body 1 shown in FIG. 7, the front surface of the coloring layer 42 has an uneven shape.

[0052] In the display body of the present invention, it is preferable that the non-coloring layer on the front side of the coloring layer has a flat front surface. In this case, it is difficult to cause irregular reflection of external light on the surface of the sealing resin layer, and the appearance of the display body is improved both when the light is turned off and when it is emitting light. In the display body 1 shown in FIGS. 2, 6, and 7, the front surface of the non-coloring layer 43 is flat.

[0053] In the display body of the present invention, the non-coloring layer may be provided on the side of the optical semiconductor element with respect to the coloring layer. That is, the sealing resin layer may include the non-coloring layer and the coloring layer in this order from the side of the optical semiconductor element. Further, when the non-coloring layer is provided on the side of the optical semiconductor element with respect to the coloring layer, it is preferable that both surfaces of the non-coloring layer have an uneven shape following the above uneven shape. Having such a configuration makes it easy for the coloring layer to have an uneven shape. In the display body 1 shown in FIGS. 2 and 7, the sealing resin layer 4 includes the non-coloring layer 41 and the coloring layer 42 in this order from the side of the optical semiconductor elements 3b to 3e, and both surfaces of the non-coloring layer 41 have an uneven shape following the above uneven shape.

[0054] The non-coloring layer provided on the side of the optical semiconductor element with respect to the coloring layer is preferably a diffusion functional layer. By having such a configuration, the light emitted by the optical semiconductor element in the side direction can be diffused in the diffusion functional layer, and the front luminance can be made higher.

[0055] Each layer (the colored layer and the non-colored layer) constituting the encapsulating resin layer may or may not have adhesiveness independently. Among them, it is preferable to have adhesiveness. By having such a configuration, the encapsulating resin layer can easily encapsulate the optical semiconductor element, and has excellent adhesion between the layers and even more excellent encapsulation properties of the optical semiconductor element. In particular, it is preferable that at least the layer in contact with the optical semiconductor element has adhesiveness. By having such a configuration, the followability and embedability of the optical semiconductor element by the encapsulating resin layer are excellent. As a result, even when the step due to the optical semiconductor element is high, the design property is excellent. Note that the layer other than the layer in contact with the optical semiconductor element may not have adhesiveness. In this case, the adhesion between adjacent encapsulating resin layers in the tiling state is low, and when separating adjacent small-sized laminates (laminates in which the optical semiconductor element disposed on the substrate is encapsulated by the encapsulating resin layer), the defect of the encapsulating resin layer and the adhesion of the adjacent encapsulating resin layer hardly occur.

[0056] (Colored layer) The colored layer in the display body of the present invention is a layer for the purpose of preventing reflection of light by metal wiring or the like provided on the substrate in the display body. The colored layer contains at least a colorant. The colored layer is preferably a resin layer composed of a resin. The colorant may be a dye or a pigment as long as it can be dissolved or dispersed in the colored layer. Since low haze can be achieved even with a small amount of addition and it is easy to be uniformly distributed without sedimentation like a pigment, a dye is preferable. Also, since high color expressibility can be achieved even with a small amount of addition, a pigment is also preferable. When a pigment is used as the colorant, it is preferably one having low conductivity or no conductivity. The colorant may be used alone or in combination of two or more.

[0057] As the above coloring agent, a black coloring agent is preferred. As the above black coloring agent, known or commonly used coloring agents (pigments, dyes, etc.) for exhibiting black can be used. For example, carbon black (furnace black, channel black, acetylene black, thermal black, lamp black, pine soot, etc.), graphite, copper oxide, manganese dioxide, aniline black, perylene black, titanium black, cyanine black, activated carbon, ferrite (non-magnetic ferrite, magnetic ferrite, etc.), magnetite, chromium oxide, iron oxide, molybdenum disulfide, chromium complex, anthraquinone-based coloring agent, zirconium nitride, etc. can be mentioned. Further, a coloring agent that functions as a black coloring agent by combining coloring agents that exhibit colors other than black may be used.

[0058] From the viewpoint of imparting an appropriate antireflection ability to the display body, the content ratio of the coloring agent in the above coloring layer is preferably 0.2% by mass or more, more preferably 0.4% by mass or more, based on 100% by mass of the total amount of the coloring layer. Further, the content ratio of the above coloring agent is, for example, 10% by mass or less, preferably 5% by mass or less, more preferably 3% by mass or less. The above content ratio may be appropriately set according to the type of the coloring agent, the color tone and light transmittance of the display body, etc. The coloring agent may be added to the composition as a solution or dispersion obtained by dissolving or dispersing it in an appropriate solvent.

[0059] The haze value (initial haze value) of the above coloring layer is not particularly limited, but from the viewpoints of ensuring the front luminance and the visibility of the display body, it is preferably 50% or less, more preferably 40% or less, still more preferably 30% or less, and particularly preferably 20% or less. Further, from the viewpoint of efficiently reducing the luminance unevenness of the display body, the haze value of the above coloring layer is preferably 1% or more, more preferably 3% or more, still more preferably 5% or more, and particularly preferably 8% or more, and may be 10% or more. The above haze value is the value of the portion where the coloring layer is thickest in the above display body.

[0060] The total light transmittance of the coloring layer is not particularly limited, but from the viewpoints of improving the antireflection function such as metal wiring in the display body and the contrast, it is preferably 40% or less, more preferably 30% or less, still more preferably 25% or less, and particularly preferably 20% or less. Also, from the viewpoint of ensuring the luminance of the display body, the total light transmittance of the coloring layer is preferably 0.5% or more, more preferably 1% or more, still more preferably 1.5% or more, and particularly preferably 2% or more, and it may be 2.5% or more, or 3% or more. The total light transmittance is the value at the thickest part of the coloring layer in the display body.

[0061] The haze value and the total light transmittance of the coloring layer are each a value of a single layer, which can be measured by the methods defined in JIS K7136 and JIS K7361-1, and can be controlled by factors such as the type, thickness, type of colorant, and blending amount.

[0062] (Non-coloring layer) The non-coloring layer is a layer different from the coloring layer and is not intended to prevent light reflection by metal wiring or the like provided on the substrate in the display body. The non-coloring layer may be a colorless layer or may be slightly colored. Also, the non-coloring layer may be, for example, a diffusion functional layer intended to exhibit a function of diffusing light, or a non-diffusion functional layer not intended to exhibit a function of diffusing light. The non-coloring layer may be transparent or non-transparent. The non-coloring layer is preferably a resin layer composed of a resin.

[0063] The content ratio of the colorant in the non-coloring layer is preferably less than 0.2% by mass, more preferably less than 0.1% by mass, still more preferably less than 0.05% by mass, and may be less than 0.01% by mass or less than 0.005% by mass, based on 100% by mass of the total amount of the non-coloring layer.

[0064] The total light transmittance of the non-coloring layer is not particularly limited. From the perspective of ensuring the luminance of the display body, it is preferably 40% or more, more preferably 60% or more, still more preferably 70% or more, and particularly preferably 80% or more. Also, the upper limit value of the total light transmittance of the non-coloring layer is not particularly limited, and it may be less than 100%, and may be 99.9% or less, or 99% or less. The total light transmittance is the value at the thickest part of the non-coloring layer in the display body.

[0065] The total light transmittance of the non-coloring layer is a value of a single layer, which can be measured by the methods defined in JIS K7136 and JIS K7361-1, and can be controlled by the type and thickness of the non-coloring layer, etc.

[0066] The diffusion function layer is a layer for the purpose of diffusing light. When the encapsulating resin layer has the diffusion function layer, the light emitted from the optical semiconductor element diffuses in the diffusion function layer. For example, the light emitted from the side surface of the optical semiconductor element is emitted in the front direction of the display body, and the front luminance of the display body is improved. The diffusion function layer is preferably a resin layer composed of resin. The diffusion function layer preferably contains, although not limited to, light-diffusing fine particles. That is, the diffusion function layer preferably contains light-diffusing fine particles dispersed in the resin layer. Only one type of the light-diffusing fine particles may be used, or two or more types may be used.

[0067] The light-diffusing fine particles have an appropriate refractive index difference from the resin constituting the diffusion function layer and impart diffusion performance to the diffusion function layer. Examples of the light-diffusing fine particles include inorganic fine particles and polymer fine particles. Examples of the material of the inorganic fine particles include silica, calcium carbonate, aluminum hydroxide, magnesium hydroxide, clay, talc, metal oxides, etc. Examples of the material of the polymer fine particles include silicone resin, acrylic resin (including polymethacrylate resins such as polymethyl methacrylate), polystyrene resin, polyurethane resin, melamine resin, polyethylene resin, epoxy resin, etc.

[0068] As the polymer microparticles, microparticles composed of a silicone resin are preferable. Further, as the inorganic microparticles, microparticles composed of a metal oxide are preferable. As the metal oxide, titanium oxide and barium titanate are preferable, and titanium oxide is more preferable. By having such a configuration, the light diffusibility of the diffusion functional layer is excellent, and luminance unevenness is more suppressed.

[0069] The shape of the light-diffusing microparticles is not particularly limited, and may be, for example, a true spherical shape, a flat shape, or an irregular shape.

[0070] From the viewpoint of imparting appropriate light diffusion performance, the average particle diameter of the light-diffusing microparticles is preferably 0.1 μm or more, more preferably 0.15 μm or more, still more preferably 0.2 μm or more, and particularly preferably 0.25 μm or more. Further, from the viewpoint of preventing the haze value from becoming too high and displaying a high-definition image, the average particle diameter of the light-diffusing microparticles is preferably 12 μm or less, more preferably 10 μm or less, and still more preferably 8 μm or less. The average particle diameter can be measured, for example, using a Coulter counter.

[0071] The refractive index of the light-diffusing microparticles is preferably 1.2 to 5, more preferably 1.25 to 4.5, still more preferably 1.3 to 4, and particularly preferably 1.35 to 3.

[0072] From the viewpoint of more efficiently reducing the luminance unevenness of the display body, the absolute value of the refractive index difference between the light-diffusing microparticles and the resin constituting the diffusion functional layer (the resin layer excluding the light-diffusing microparticles in the diffusion functional layer) is preferably 0.001 or more, more preferably 0.01 or more, still more preferably 0.02 or more, and particularly preferably 0.03 or more, and may be 0.04 or more, or 0.05 or more. Further, from the viewpoint of preventing the haze value from becoming too high and displaying a high-definition image, the absolute value of the refractive index difference between the light-diffusing microparticles and the resin is preferably 5 or less, more preferably 4 or less, and still more preferably 3 or less.

[0073] From the perspective of imparting appropriate light diffusion performance to the encapsulating resin layer, the content of the light-diffusing fine particles in the diffusion functional layer is preferably 0.01 part by mass or more, more preferably 0.05 part by mass or more, still more preferably 0.1 part by mass or more, and particularly preferably 0.15 part by mass or more, based on 100 parts by mass of the resin constituting the diffusion functional layer. Further, from the perspective of preventing the haze value from becoming too high and displaying a high-definition image, the content of the light-diffusing fine particles is preferably 80 parts by mass or less, more preferably 70 parts by mass or less, based on 100 parts by mass of the resin constituting the diffusion functional layer.

[0074] The haze value (initial haze value) of the diffusion functional layer is not particularly limited, but from the perspective of efficiently reducing luminance unevenness, it is preferably 30% or more, more preferably 40% or more, still more preferably 50% or more, and particularly preferably 60% or more, and it may be 70% or more, 80% or more, 90% or more, 95% or more, 97% or more, and those around 99.9% are particularly preferable due to the excellent luminance unevenness improvement effect. The upper limit of the haze value of the diffusion functional layer is not particularly limited, that is, it may be 100%. The haze value is the value at the thickest part of the diffusion functional layer in the display body.

[0075] The total light transmittance of the diffusion functional layer is not particularly limited, but from the perspective of ensuring luminance, it is preferably 40% or more, more preferably 60% or more, still more preferably 70% or more, and particularly preferably 80% or more. The upper limit value of the total light transmittance of the diffusion functional layer is not particularly limited, and it may be less than 100%, or may be 99.9% or less, or 99% or less. The total light transmittance is the value at the thickest part of the diffusion functional layer in the display body.

[0076] The haze value and total light transmittance of the diffusion functional layer are each the value of a single layer, which can be measured by the methods defined in JIS K7136 and JIS K7361-1, and can be controlled by the type and thickness of the diffusion functional layer, the type and blending amount of the light-diffusing fine particles, etc.

[0077] The haze value (initial haze value) of the non-diffusing functional layer is not particularly limited, but from the viewpoint of making the luminance of the display excellent, it is preferably less than 30%, more preferably 10% or less, still more preferably 5% or less, particularly preferably 1% or less, and may be 0.5% or less. Note that the lower limit of the haze value of the non-diffusing functional layer is not particularly limited. The haze value is the value at the thickest part of the non-diffusing functional layer in the display body.

[0078] The total light transmittance of the non-diffusing functional layer is not particularly limited, but from the viewpoint of ensuring the luminance of the display body, it is preferably 60% or more, more preferably 70% or more, still more preferably 80% or more, particularly preferably 90% or more. Also, the upper limit value of the total light transmittance of the non-diffusing functional layer is not particularly limited, and it may be less than 100%, may be 99.9% or less, or may be 99% or less. The total light transmittance is the value at the thickest part of the non-diffusing functional layer in the display body.

[0079] The haze value and the total light transmittance of the non-diffusing functional layer are each the value of a single layer, and can be measured by the methods defined in JIS K7136 and JIS K7361-1, and can be controlled by the type and thickness of the non-diffusing functional layer, etc.

[0080] From the viewpoint of making the luminance of the display excellent, the content of the colorant and / or light-diffusing fine particles in the non-diffusing functional layer is preferably less than 0.01 part by mass, more preferably less than 0.005 part by mass, based on 100 parts by mass of the resin constituting the non-diffusing functional layer.

[0081] (Resin layer) When the colored layer and the non-colored layer are the resin layer, examples of the resin constituting the resin layer include known or commonly used resins, such as acrylic resins, urethane acrylate resins, urethane resins, rubber resins, epoxy resins, epoxy acrylate resins, oxetane resins, silicone resins, silicone acrylic resins, polyester resins, polyether resins (such as polyvinyl ether), polyamide resins, fluorine resins, vinyl acetate / vinyl chloride copolymers, modified polyolefins, etc. Only one kind of the above resin may be used, or two or more kinds may be used. The resins constituting each layer of the encapsulating resin layer may be the same as or different from each other.

[0082] When the resin layer is an adhesive layer (adhesive layer) having adhesiveness, a known or commonly used pressure-sensitive adhesive can be used as the resin. Examples of the adhesive include acrylic adhesives, rubber adhesives (natural rubber-based, synthetic rubber-based, mixed systems thereof, etc.), silicone adhesives, polyester adhesives, urethane adhesives, polyether adhesives, polyamide adhesives, fluorine adhesives, etc. Only one kind of the adhesive may be used, or two or more kinds may be used.

[0083] The resin layer may contain other components other than the above-mentioned components within a range that does not impair the effects of the present invention in each layer. Examples of the other components include curing agents, crosslinking accelerators, tackifying resins (rosin derivatives, polyterpene resins, petroleum resins, oil-soluble phenols, etc.), oligomers, anti-aging agents, fillers (metal powders, organic fillers, inorganic fillers, etc.), antioxidants, plasticizers, softeners, surfactants, antistatic agents, surface lubricants, leveling agents, light stabilizers, ultraviolet absorbers, polymerization inhibitors, granular materials, foil materials, etc. Each of the other components may be used alone or in combination of two or more.

[0084] Examples of the laminated structure of the above encapsulation resin layer include [coloring layer / diffusion functional layer], [coloring layer / non-diffusion functional layer], [coloring layer / diffusion functional layer / non-diffusion functional layer], [coloring layer / non-diffusion functional layer / diffusion functional layer], [diffusion functional layer / coloring layer / non-diffusion functional layer], [non-diffusion functional layer / coloring layer / diffusion functional layer], [diffusion functional layer / coloring layer / diffusion functional layer], [non-diffusion functional layer / coloring layer / non-diffusion functional layer] (in the above order from the optical semiconductor element side).

[0085] <Base material part> The display body of the present invention may or may not include a base material part. When the above base material part is provided on the front side of the encapsulation resin layer in the above display body, the surface of the encapsulation resin layer can be made flat, thereby making it less likely to cause irregular reflection of light and improving the appearance of the display body both when turned off and when emitting light. In addition, by forming an anti-glare layer or an anti-reflection layer described later on the above base material part, the display body can be imparted with anti-glare properties and anti-reflection properties. Further, it serves as a support for the encapsulation resin layer in the optical semiconductor element encapsulation sheet described later, and having the above base material part provides excellent handleability of the optical semiconductor element encapsulation sheet.

[0086] The above base material part may be a single layer or a multi-layer in which the composition, thickness, etc. are the same or different. When the above base material part is a multi-layer, each layer may be bonded together by another layer such as an adhesive layer. Note that the base material layer used for the base material part is the part that is attached to the substrate provided with the optical semiconductor element together with the encapsulation resin layer, and a release liner that is peeled off when the optical semiconductor element encapsulation sheet is used (attached) or a surface protection film that only protects the surface of the base material part is not included in the "base material part".

[0087] Examples of the base material layer constituting the base material portion include glass and plastic base materials (particularly plastic films). Examples of the resin constituting the plastic base material include polyolefin resins such as low-density polyethylene, linear low-density polyethylene, medium-density polyethylene, high-density polyethylene, ultra-low-density polyethylene, random copolymer polypropylene, block copolymer polypropylene, homopolypropylene, polybutene, polymethylpentene, ionomer, ethylene-(meth)acrylic acid copolymer, ethylene-(meth)acrylate (random, alternating) copolymer, ethylene-vinyl acetate copolymer (EVA), ethylene-propylene copolymer, cyclic olefin polymer, ethylene-butene copolymer, ethylene-hexene copolymer; polyurethane; polyesters such as polyethylene terephthalate (PET), polyethylene naphthalate, polybutylene terephthalate (PBT); polycarbonate; polyimide resin; polyether ether ketone; polyether imide; polyamides such as aramid and wholly aromatic polyamide; polyphenyl sulfide; fluororesin; polyvinyl chloride; polyvinylidene chloride; cellulose resins such as triacetyl cellulose (TAC); silicone resin; acrylic resins such as polymethyl methacrylate (PMMA); polysulfone; polyarylate; polyvinyl acetate, etc. The above resins may be used alone or in combination of two or more. The base material layer may be various optical films such as an antireflection (AR) film, a polarizing plate, and a retardation plate.

[0088] The thickness of the plastic film is preferably 20 to 300 μm, more preferably 40 to 250 μm. When the thickness is 20 μm or more, the supportability and handleability of the sheet for encapsulating the optical semiconductor element are further improved. When the thickness is 300 μm or less, the display body can be made thinner.

[0089] The surface of the base material portion on the side provided with the encapsulating resin layer may be subjected to surface treatment such as physical treatment such as corona discharge treatment, plasma treatment, sand mat processing treatment, ozone exposure treatment, flame exposure treatment, high-voltage electric shock exposure treatment, ionization radiation treatment, etc.; chemical treatment such as chromic acid treatment; easy adhesion treatment with a coating agent (primer), etc. for the purpose of enhancing adhesion, retention, etc. with the encapsulating resin layer. The surface treatment for enhancing adhesion is preferably applied to the entire surface of the base material portion on the side of the encapsulating resin layer.

[0090] From the viewpoint of excellent function as a support and scratch resistance of the surface, the thickness of the base material portion is preferably 5 μm or more, more preferably 10 μm or more. From the viewpoint of more excellent transparency, the thickness of the base material portion is preferably 300 μm or less, more preferably 250 μm or less.

[0091] <Display body> The display body may be provided with a layer having antiglare property and / or antireflection property. By having such a configuration, the gloss and light reflection of the display body can be suppressed, and the appearance can be made better. Examples of the layer having antiglare property include an antiglare treatment layer. Examples of the layer having antireflection property include an antireflection treatment layer. The antiglare treatment and the antireflection treatment can be respectively carried out by known or conventional methods. The layer having antiglare property and the layer having antireflection property may be the same layer or different layers from each other. The layer having antiglare property and / or antireflection property may have only one layer or two or more layers.

[0092] The haze value (initial haze value) of the encapsulating resin layer or the laminate having the encapsulating resin layer and the base material portion at both end faces is not particularly limited, but from the viewpoint of more excellent suppression effect of luminance unevenness and design property, it is preferably 80% or more, more preferably 85% or more, further preferably 90% or more, and particularly preferably 95% or more. The upper limit of the haze value is not particularly limited.

[0093] The total light transmittance of the above-mentioned sealing resin layer or the laminate having the above-mentioned sealing resin layer and the above-mentioned base material part at both end faces is not particularly limited. However, from the viewpoint of improving the antireflection function such as metal wiring and contrast, it is preferably 40% or less, more preferably 30% or less, and still more preferably 20% or less. Further, from the viewpoint of ensuring luminance, the above-mentioned total light transmittance is preferably 0.5% or more.

[0094] The above-mentioned haze value and total light transmittance can be measured by the methods defined in JIS K7136 and JIS K7361-1, respectively, and can be controlled by the lamination order, type, thickness, etc. of each layer constituting the above-mentioned sealing resin layer and the above-mentioned base material part.

[0095] The thickness of the above-mentioned sealing resin layer or the laminate having the above-mentioned sealing resin layer and the above-mentioned base material part at both end faces is preferably 10 to 600 μm, more preferably 20 to 550 μm, still more preferably 30 to 500 μm, still more preferably 40 to 450 μm, and particularly preferably 50 to 400 μm, from the viewpoint of improving the antireflection function such as metal wiring and contrast and more efficiently reducing the color shift. Note that the release liner is not included in the above thickness.

[0096] In addition, the display body of the present invention preferably includes a self-emitting display device. Further, by combining the self-emitting display device and, if necessary, a display panel, a display body which is an image display device can be obtained. In this case, the optoelectronic semiconductor element is an LED element. Examples of the self-emitting display device include an LED display, a backlight, or an organic electroluminescence (organic EL) display device. The backlight is particularly preferably a full array direct-lit backlight. The backlight includes, for example, at least a part of a laminate including the substrate and a plurality of optoelectronic semiconductor elements arranged on the substrate as a constituent member. For example, in the self-emitting display device, a metal wiring layer for sending a light emission control signal to each LED element is laminated on the substrate. Each LED element that emits light of each color of red (R), green (G), and blue (B) is alternately arranged on the substrate via the metal wiring layer. The metal wiring layer is formed of a metal such as copper, and adjusts the emission intensity of each LED element to display each color.

[0097] The display body of the present invention may be a display body that is used in a folded state, for example, a foldable image display device (flexible display) (particularly, a foldable image display device (foldable display)). Specifically, examples include a display body including a foldable backlight and a display body including a foldable self-emitting display device.

[0098] In the display body of the present invention, since the encapsulation resin layer is excellent in followability and embeddability of the optoelectronic semiconductor element, the optoelectronic semiconductor element may be a mini-LED element or a micro-LED element.

[0099] According to the display body of the present invention, color shift due to the light emitted by the optoelectronic semiconductor element hardly occurs, and the brightness is high. Therefore, the display body can be visually recognized with the same color tone from a wide viewing angle. Further, the display body looks bright and has a good appearance without increasing power consumption. Furthermore, according to the display body of the present invention, reflection of light by the metal wiring or the like on the substrate is suppressed, and the appearance is good when the optoelectronic semiconductor element is not lit.

[0100] [Method for manufacturing a display body] The display body of the present invention can be manufactured by bonding a sheet for encapsulating an optical semiconductor element having an encapsulating resin layer to a substrate on which the optical semiconductor element is disposed and encapsulating the optical semiconductor element with the encapsulating resin layer.

[0101] (Sheet for encapsulating an optical semiconductor element) The sheet for encapsulating an optical semiconductor element is a sheet for encapsulating a plurality of optical semiconductor elements disposed on a substrate. The sheet for encapsulating an optical semiconductor element includes at least an encapsulating resin layer including a colored layer and an uncolored layer. The sheet for encapsulating an optical semiconductor element is a sheet that can satisfy the following formula (1) when the plurality of optical semiconductor elements are encapsulated with the encapsulating resin layer such that the colored layer side faces the optical semiconductor element side to form an encapsulating resin layer. According to the sheet for encapsulating an optical semiconductor element of the present invention, by encapsulating the optical semiconductor element, a display body with less color shift and high luminance can be provided.

[0102] The sheet for encapsulating an optical semiconductor element includes at least an encapsulating resin layer including a colored layer and an uncolored layer. The encapsulating resin layer is a layer that can form the encapsulating resin layer in the display body of the present invention. Specifically, the colored layer in the encapsulating resin layer is a layer that can form the colored layer in the display body of the present invention, and the uncolored layer in the encapsulating resin layer is a layer that can form the uncolored layer in the display body of the present invention. Specifically, the colored layer in the encapsulating resin layer may be a layer having the same composition (constituent components and their blending ratios) and physical properties (haze, total light transmittance, etc.) as the colored layer in the display body of the present invention, or may be a layer that becomes the colored layer in the display body of the present invention upon curing. Also, the uncolored layer in the encapsulating resin layer may be a layer having the same composition (constituent components and their blending ratios) and physical properties (haze, total light transmittance, etc.) as the uncolored layer in the display body of the present invention, or may be a layer that becomes the uncolored layer in the display body of the present invention upon curing.

[0103] The above-mentioned resin layer for sealing is appropriately designed according to the structure of the sealing resin layer in the display body of the present invention. For example, when the display body of the present invention includes the above-mentioned diffusion function layer, the above-mentioned resin layer for sealing in the above-mentioned sheet for sealing an optical semiconductor element includes the diffusion function layer. The diffusion function layer in the above-mentioned resin layer for sealing may be a layer having the same composition (constituent components and their blending ratios) and physical properties (haze, total light transmittance, etc.) as the diffusion function layer in the display body of the present invention, or may be a layer that becomes the diffusion function layer in the display body of the present invention by curing. Further, it is preferable that the above-mentioned resin layer for sealing includes the above-mentioned diffusion function layer, the above-mentioned coloring layer, and the above-mentioned non-coloring layer in this order. Note that the diffusion function layer is a layer corresponding to one of the above-mentioned coloring layer and the above-mentioned non-coloring layer.

[0104] Each layer (the above-mentioned coloring layer and the above-mentioned non-coloring layer) constituting the above-mentioned resin layer for sealing may or may not independently have adhesiveness and / or adhesivity. Among them, it is preferable to have adhesiveness and / or adhesivity. By having such a configuration, the above-mentioned resin layer for sealing can be easily bonded to the substrate and the optical semiconductor element, and has excellent adhesion between layers and excellent sealing properties of the optical semiconductor element. In particular, it is preferable that at least the layer in contact with the optical semiconductor element has adhesiveness and / or adhesivity. By having such a configuration, the followability and embedability of the optical semiconductor element by the resin layer for sealing are excellent. As a result, even when the step by the optical semiconductor element is high, the design property is excellent.

[0105] Each layer (the above-mentioned coloring layer and the above-mentioned non-coloring layer) constituting the above-mentioned resin layer for sealing may be a resin layer (radiation curable resin layer) having the property of being cured by radiation irradiation, or may be a resin layer (radiation non-curable resin layer) not having the property of being cured by radiation irradiation. Examples of the above-mentioned radiation include electron beam, ultraviolet ray, α-ray, β-ray, γ-ray, or X-ray. When the above-mentioned coloring layer is a radiation curable resin layer, the above-mentioned colorant that can be contained in the above-mentioned coloring layer preferably absorbs visible light and has permeability to light having a wavelength at which the above-mentioned radiation curable resin layer can be cured.

[0106] The sheet for encapsulating the optical semiconductor element may include the base material portion. When including the base material portion, the encapsulating resin layer may be provided on at least one surface of the base material portion. The surface of the encapsulating resin layer that contacts the base material portion is the surface on the side opposite to the side where the encapsulating resin layer contacts the optical semiconductor element. When the sheet for encapsulating the optical semiconductor element includes the base material portion, the sheet for encapsulating the optical semiconductor element is bonded to the optical semiconductor element and the substrate together with the base material portion, and the base material portion in the sheet for encapsulating the optical semiconductor element becomes the base material portion in the display body of the present invention.

[0107] Further, the encapsulating resin layer may be formed on the release-treated surface of the release liner. When the sheet for encapsulating the optical semiconductor element is formed on the release liner, the side of the release liner that contacts the optical semiconductor element of the encapsulating resin layer is the side that contacts the release liner. When not having the base material portion, both surfaces of the encapsulating resin layer may be the sides that contact the release liner. The release liner is used as a protective material for the sheet for encapsulating the optical semiconductor element and is peeled off when encapsulating the optical semiconductor element. Note that the base material portion and the release liner are not necessarily provided.

[0108] The release liner is an element for covering and protecting the surface of the sheet for encapsulating the optical semiconductor element, and is peeled off from the sheet when bonding the sheet for encapsulating the optical semiconductor element to the substrate on which the optical semiconductor element is disposed.

[0109] Examples of the release liner include a polyethylene terephthalate (PET) film, a polyethylene film, a polypropylene film, a plastic film or paper surface-coated with a release agent such as a fluorine-based release agent or a long-chain alkyl acrylate-based release agent.

[0110] The thickness of the above-mentioned release liner is, for example, 10 to 200 μm, preferably 15 to 150 μm, more preferably 20 to 100 μm. When the above thickness is 10 μm or more, it is difficult to break due to cutting during the processing of the release liner. When the above thickness is 200 μm or less, it is easier to peel the release liner from the above-mentioned sheet for sealing an optical semiconductor element during use.

[0111] An embodiment of the above-mentioned sheet for sealing an optical semiconductor element will be described with reference to FIG. 8. FIG. 8 is a cross-sectional view of the above-mentioned sheet for sealing an optical semiconductor element capable of forming the display body shown in FIG. 2. As shown in FIG. 8, the sheet 10 for sealing an optical semiconductor element can be used to seal one or more optical semiconductor elements arranged on a substrate, and includes a base material portion 5 and a resin layer 7 for sealing formed on the base material portion 5. The resin layer 7 for sealing is formed from a laminate of a non-coloring layer 71, a coloring layer 72, and a non-coloring layer 73. The non-coloring layer 71, the coloring layer 72, and the non-coloring layer 73 have adhesiveness and are directly laminated to each other. A release liner 6 is attached to the surface of the non-coloring layer 71 of the resin layer 7 for sealing, and the base material portion 5 is attached to the surface of the non-coloring layer 73.

[0112] (Sealing step) In the method for manufacturing the display body of the present invention using the sheet for encapsulating the optical semiconductor element, the method includes an encapsulation step of bonding the sheet for encapsulating the optical semiconductor element to a substrate on which the optical semiconductor element is disposed and encapsulating the optical semiconductor element with an encapsulating resin layer. In the encapsulation step, specifically, first, the release liner is peeled off from the sheet for encapsulating the optical semiconductor element to expose the encapsulating resin layer. Then, the resin layer surface for encapsulation, which is the exposed surface of the sheet for encapsulating the optical semiconductor element, is bonded to the substrate surface of the laminate (such as an optical member) including the substrate and the optical semiconductor element (preferably a plurality of optical semiconductor elements) disposed on the substrate. When the laminate includes a plurality of optical semiconductor elements, the encapsulating resin layer is further arranged to fill the gaps between the plurality of optical semiconductor elements, and the plurality of optical semiconductor elements are encapsulated together. Specifically, as shown in FIG. 9, the non-coloring layer 71 of the sheet 10 for encapsulating the optical semiconductor element from which the release liner 6 has been peeled is arranged to face the surface of the substrate 2 on which the optical semiconductor elements 3a to 3f are disposed, and the sheet 10 for encapsulating the optical semiconductor element is bonded to the surface of the substrate 2 on which the optical semiconductor elements 3a to 3f are disposed, and the optical semiconductor elements 3a to 3f are embedded in the encapsulating resin layer 7.

[0113] The temperature during the bonding is, for example, in the range from room temperature to 110°C. Also, during the bonding, it may be under reduced pressure or pressurized. By reducing or increasing the pressure, it is possible to suppress the formation of voids between the encapsulating resin layer and the substrate or the optical semiconductor element. Further, in the encapsulation step, it is preferable to bond the sheet for encapsulating the optical semiconductor element under reduced pressure and then apply pressure. The pressure during decompression is, for example, 1 to 100 Pa, and the decompression time is, for example, 5 to 600 seconds. The pressure during pressurization is, for example, 0.05 to 0.5 MPa, and the pressurization time is, for example, 5 to 600 seconds.

[0114] By appropriately setting the thicknesses of the colored layer and the non-colored layer in the above-mentioned resin layer for sealing, the temperature and pressure during lamination, etc., it is possible to adjust the followability of the colored layer and the non-colored layer in the obtained display body to the optical semiconductor element and the thicknesses of the colored layer and the non-colored layer in each region of the concave and convex portions in the above-mentioned uneven shape. As a result, the obtained display body can be in a form that satisfies the above formula (1).

[0115] (Radiation irradiation step) When the above-mentioned resin layer for sealing includes a radiation-curable resin layer, the above manufacturing method may further include a radiation irradiation step of irradiating a laminate including the above substrate, the optical semiconductor element disposed on the above substrate, and the sheet for sealing the optical semiconductor element with radiation to cure the above radiation-curable resin layer and form a cured product layer. Examples of the above radiation include electron beams, ultraviolet rays, α-rays, β-rays, γ-rays, X-rays, etc. Among them, ultraviolet rays are preferable. The temperature during radiation irradiation is, for example, within the range of room temperature to 100°C, and the irradiation time is, for example, 1 minute to 1 hour.

[0116] (Dicing step) The above manufacturing method may further include a dicing step of dicing a laminate including the above substrate, the optical semiconductor element disposed on the above substrate, and the sheet for sealing the optical semiconductor element. The above laminate may be processed for the laminate that has undergone the above radiation irradiation step. When the above laminate includes a cured product layer in which the radiation-curable resin layer is cured by the above radiation irradiation, in the above dicing step, the cured product layer of the sheet for sealing the optical semiconductor element and the side end portions of the substrate are diced and removed. As a result, the surface of the cured product layer that is sufficiently cured and has low adhesiveness can be exposed on the side surface. The above dicing can be performed by a known or conventional method, for example, a method using a dicing blade or a method using laser irradiation.

[0117] (Tiling step) The above manufacturing method may further include a tiling step of arranging a plurality of display bodies obtained in the dicing step so as to be in contact with each other in a planar direction. In the tiling step, a plurality of laminated bodies obtained in the dicing step are arranged and tiled so as to be in contact with each other in a planar direction. In this way, a single large display body can be manufactured.

[0118] As described above, the display body of the present invention can be manufactured. When the sealing resin layer 7 in the optical semiconductor element sealing sheet 10 does not have a radiation-curable resin layer, the sealing resin layer 7 becomes the sealing resin layer 4 in the display body 1. On the other hand, when the sealing resin layer 7 in the optical semiconductor element sealing sheet 10 has a radiation-curable resin layer, for example, when the colored layer 72 and the non-colored layer 73 are radiation-curable resin layers, the colored layer 42 and the non-colored layer 43 are formed by curing the colored layer 72 and the non-colored layer 73, and become the sealing resin layer 4.

Explanation of Reference Numerals

[0119] 1 Display body 2 Substrate 3a~3f Optical semiconductor element 31 Support 3,3’ Pixel 4 Sealing resin layer 41 Non-colored layer 42 Colored layer 43 Non-colored layer 5 Base material part 6 Release liner 7 Sealing resin layer 71 Non-colored layer 72 Colored layer 73 Non-colored layer 10 Optical semiconductor element sealing sheet 11 Optical member

Claims

1. A display body comprising a substrate, a plurality of optical semiconductor elements disposed on the substrate, and a sealing resin layer for sealing the plurality of optical semiconductor elements, wherein the plurality of optical semiconductor elements are arranged in plurality for each pixel including the plurality of optical semiconductor elements, the sealing resin layer has a colored layer and a non-colored layer in this order from the optical semiconductor element side, in a vertical cross-section with respect to the substrate surface passing through the center of gravity of the first optical semiconductor element located at the end in the first pixel and the center of gravity of the second optical semiconductor element located at the end on the first optical semiconductor element side in the second pixel adjacent to the first pixel, with the substrate surface as a baseline, a straight line passing through the center of gravity of the first optical semiconductor element and in the front direction at an angle of 90° with respect to the baseline is line 1, a straight line passing through the end on the second optical semiconductor element side of the parallel line having the longest length with respect to the baseline in the first optical semiconductor element and in the front direction at an angle of 45° with respect to the baseline is line 2, when the distance where line 1 overlaps with the colored layer is D1, the distance where line 1 overlaps with the non-colored layer is D2, the distance where line 2 overlaps with the colored layer is D3, and the distance where line 2 overlaps with the non-colored layer is D4, a display body in which D1, D2, D3, and D4 satisfy the following formula (1). D1 / D2 < D3 / D4 (1)

2. The display body according to claim 1, wherein the sealing resin layer includes a diffusion functional layer on the optical semiconductor element side of the colored layer.

3. The display body according to any one of claims 1 or 2, comprising a self-luminous display device.

4. The display body according to any one of claims 1 to 3, which is an image display device.

5. A sheet for sealing a plurality of optical semiconductor elements arranged for each pixel including the plurality of optical semiconductor elements on a substrate, the sheet includes a sealing resin layer including a colored layer and a non-colored layer, when the plurality of optical semiconductor elements are sealed by the sealing resin layer such that the colored layer side becomes the optical semiconductor element side to form a sealing resin layer, in a vertical cross-section with respect to the substrate surface passing through the center of gravity of the first optical semiconductor element located at the end in the first pixel and the center of gravity of the second optical semiconductor element located at the end on the first optical semiconductor element side in the second pixel adjacent to the first pixel, with the substrate surface as a baseline, A straight line passing through the center of gravity of the first optical semiconductor element and in the 90° front direction with respect to the baseline is defined as Line 1. A straight line passing through the end of the parallel line with respect to the baseline in the first optical semiconductor element that can take the longest length and in the 45° front direction with respect to the baseline is defined as Line 2. When the distance where Line 1 overlaps with the colored layer is D1, the distance where Line 1 overlaps with the non-colored layer is D2, the distance where Line 2 overlaps with the colored layer is D3, and the distance where Line 2 overlaps with the non-colored layer is D4. A sheet for encapsulating an optical semiconductor element, wherein D1, D2, D3, and D4 can satisfy the following formula (1). D1 / D2 < D3 / D4 (1)

6. The sheet for encapsulating an optical semiconductor element according to claim 5, wherein the encapsulating resin layer is provided with a diffusion functional layer on the side opposite to the non-colored layer of the colored layer.

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