Multilayer ceramic electronic component

Abstract

To provide a multilayer ceramic electronic component.SOLUTION: A multilayer ceramic electronic component includes a ceramic main body containing dielectric layers, and first and second internal electrodes which are arranged so as to be alternately laminated with each of the dielectric layers interposed therebetween, a first external electrode connected to the first internal electrode of the ceramic main body, and a second external electrode connected to the second internal electrode. The first external electrode includes a first base electrode layer arranged in contact with the ceramic main body, and a first resin electrode layer arranged on the first base electrode layer. The second external electrode includes a second base electrode layer arranged in contact with the ceramic main body, and a second resin electrode layer arranged on the second base electrode layer. The first resin electrode layer and the second resin electrode layer can contain a thermosetting shape memory polymer.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a multilayer ceramic electronic component.

Background Art

[0002] Recently, as the application fields of electronic products expand, the technical fields in which multilayer ceramic electronic components are used are also expanding. In particular, with the electrification of automobiles, structures are used in which an ECU (Electronic Control Unit) or TCU (Transmission Control Unit) of an automobile is arranged in an engine room or directly attached to a transmission or the like.

[0003] However, when existing multilayer ceramic electronic components are exposed to harsh environments such as high temperature and high vibration, expansion and contraction due to high temperature / low temperature cycles are repeated, and continuous mechanical stress is generated. And the application of continuous mechanical stress is the main cause of generating cracks in terminal electrodes and solder.

[0004] To solve this, a method of applying a soft term such as an epoxy resin to an external electrode to absorb external impact and internal stress is used. When applying such a soft term, since the base resin has a higher elastic modulus than metal, cracks due to mechanical stress can be alleviated.

[0005] However, as multilayer ceramic electronic components are miniaturized and have increased capacity, the thickness of the external electrode is gradually becoming thinner. And even when a soft term is applied to an external electrode with a thin thickness, mechanical deformations such as peeling of the soft term may occur due to external impact or vibration. Also, once a deformation occurs in the soft term, it becomes a cause of potential failure and is the main cause of a decrease in product quality due to a decrease in mechanical strength.

Summary of the Invention

Problems to be Solved by the Invention

[0006] One of the objects of the present invention is to provide a multilayer ceramic electronic component capable of preventing defects such as floating or delamination of external electrodes even under high temperature and / or high vibration conditions. One of the objects of the present invention is to provide a multilayer ceramic electronic component with improved long-term reliability.

Means for Solving the Problems

[0007] A multilayer ceramic electronic component according to an embodiment of the present invention includes a ceramic body including a dielectric layer and first and second internal electrodes arranged to be alternately laminated with the dielectric layer interposed therebetween, a first external electrode connected to the first internal electrode of the ceramic body, and a second external electrode connected to the second internal electrode, wherein the first external electrode includes a first base electrode layer disposed in contact with the ceramic body and a first resin electrode layer disposed on the first base electrode layer, the second external electrode includes a second base electrode layer disposed in contact with the ceramic body and a second resin electrode layer disposed on the second base electrode layer, and the first resin electrode layer and the second resin electrode layer can include a thermosetting shape memory polymer.

Effects of the Invention

[0008] One of the effects of the present invention is that it can prevent defects such as floating or delamination of the external electrodes of the multilayer ceramic electronic component even under high temperature and / or high vibration conditions.

[0009] One of the effects of the present invention is that it can improve the long-term reliability of the multilayer ceramic electronic component.

[0010] However, the various and significant advantages and effects of the present invention are not limited to the above-described content and can be more easily understood in the process of describing specific embodiments of the present invention.

Brief Description of the Drawings

[0011]

Figure 1

Figure 2

Figure 3

Figure 4

DETAILED DESCRIPTION OF THE INVENTION

[0012] Hereinafter, embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. This is not intended to limit the technology described in this specification to specific embodiments, but should be understood to include various modifications, equivalents, and / or alternatives of the embodiments of the present invention. Regarding the description of the drawings, similar reference numerals are used for similar components.

[0013] In addition, parts not related to the description are omitted in the drawings for the purpose of clearly explaining the present invention, the thickness is enlarged to clearly show multiple layers and regions, and components having the same function within the scope of the same concept are described using the same reference numerals.

[0014] In this specification, expressions such as "have", "can have", "include", or "can include" refer to the presence of the feature (for example, components such as numerical values, functions, operations, or parts), and do not exclude the presence of additional features.

[0015] In this specification, expressions such as "A and / or B", "at least one of A and / or B", or "any one or more of A and / or B" can include all possible combinations of the listed items. For example, "A and / or B" and "at least one of A and / or B" can refer to any of the following cases: (1) including at least one A, (2) including at least one B, or (3) including both at least one A and at least one B.

[0016] In the drawings, the X direction can be defined as the first direction, the L direction or the length direction, the Y direction as the second direction, the W direction or the width direction, and the Z direction as the third direction, the T direction or the thickness direction.

[0017] Hereinafter, with reference to FIGS. 1 to 4, a multilayer ceramic electronic component according to an embodiment of the present invention will be described in detail. Referring to FIGS. 1 to 4, a multilayer ceramic electronic component 100 according to an embodiment of the present invention includes a dielectric layer 111, and first and second internal electrodes 121 and 122 arranged to be alternately laminated with the dielectric layer 111 interposed therebetween, a ceramic body 110, a first external electrode 131 connected to the first internal electrode 121 of the ceramic body 110, and a second external electrode 132 connected to the second internal electrode 122 of the ceramic body 110.

[0018] The first external electrode 131 can include a first base electrode layer 131a disposed in contact with the ceramic body 110, and a first resin electrode layer 131b disposed on the first base electrode layer 131a. Also, the second external electrode 132 can include a second base electrode layer 132a disposed in contact with the ceramic body 110, and a second resin electrode layer 132b disposed on the second base electrode layer 132a. At this time, the first resin electrode layer 131b and the second resin electrode layer 132b can include a thermosetting shape memory polymer.

[0019] As used herein, the "Shape Memory Polymer (SMP)" can refer to a polymer that exhibits a Shape Memory Effect (SME). The "Shape Memory Effect" means that in a state where the shape memorized at a certain temperature is retained, after applying a force to deform it into a completely different shape, when heat, a magnetic field, an electric field, light, etc. are applied, it returns to its original shape. The above-mentioned shape memory polymer can have a three-dimensional network structure. The above-mentioned network structure can include physical and / or chemical cross-linkages formed by a plurality of polymer chains. The laminated ceramic electronic component according to the present invention, even if the first resin electrode layer 131b and the second resin electrode layer 132b contain a thermosetting shape memory polymer and deformation due to an external force occurs, can recover mechanical deformation through self-healing.

[0020] A laminated ceramic electronic component 100 according to an embodiment of the present invention can include a ceramic body 110 including a dielectric layer 111 and first and second internal electrodes 121 and 122 alternately laminated with the dielectric layer 111 interposed therebetween.

[0021] The above-mentioned ceramic body 110 can include first and second surfaces S1 and S2 facing each other in a first direction (X direction), third and fourth surfaces S3 and S4 facing each other in a second direction (Y direction), and fifth and sixth surfaces S5 and S6 facing each other in a third direction (Z direction).

[0022] There is no particular limitation on the specific shape of the above-mentioned ceramic body 110. As shown in the drawings, the ceramic body 110 can have a hexahedral shape or a shape similar thereto. The above-mentioned ceramic body 110, due to the shrinkage of the ceramic powder contained in the ceramic body 110 during the firing process, does not have a hexahedral shape with completely straight lines, but can substantially have a hexahedral shape. The above-mentioned ceramic body 110 can be subjected to a rounding process of rounding the corners as needed. The above-mentioned rounding process can use, for example, barrel polishing, etc., but is not limited thereto.

[0023] The ceramic body 110 can have a dielectric layer 111, a first internal electrode 121, and a second internal electrode 122 alternately laminated thereon. The dielectric layer 111, the first internal electrode 121, and the second internal electrode 122 can be laminated in a third direction (Z direction). In a fired state, the boundaries between adjacent dielectric layers 111 among the plurality of dielectric layers 111 can be integrated to such an extent that they are difficult to confirm without using a scanning electron microscope (SEM).

[0024] According to an embodiment of the present invention, the raw material for forming the dielectric layer 111 is not particularly limited as long as sufficient capacitance can be obtained. For example, a barium titanate-based material, a lead composite perovskite-based material, a strontium titanate-based material, etc. can be used, or a component represented by (Ba 1-x Ca x )(Ti 1-y (Zr, Sn, Hf) y )O3 (where 0 ≤ x ≤ 1, 0 ≤ y ≤ 0.5) can be used. Further, various ceramic additives, organic solvents, plasticizers, binders, dispersants, etc. can be added to a powder such as barium titanate (BaTiO3) for the material forming the dielectric layer 111 according to the object of the present invention.

[0025] The dielectric layer 111 can be formed by adding an additive as necessary to a slurry containing the above-described materials, applying and drying this on a carrier film to provide a plurality of ceramic sheets. The ceramic sheet can be formed by producing the slurry into a sheet having a thickness of several μm by a doctor blade method, but is not limited thereto.

[0026] The first and second internal electrodes 121 and 122 can be laminated such that each cross-section is exposed at opposite ends of the ceramic body 110. Specifically, the first and second internal electrodes 121 and 122 can be exposed on both surfaces of the ceramic body 110 in the first direction (X direction). The first internal electrode 121 can be exposed in the direction of the first surface S1 of the ceramic body 110, and the second internal electrode 122 can be exposed in the direction of the second surface S2.

[0027] The materials for forming the first and second internal electrodes 121 and 122 are not particularly limited. For example, a conductive paste containing any one or more of conductive metals such as silver (Ag), palladium (Pd), gold (Au), platinum (Pt), nickel (Ni), copper (Cu), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof can be used for formation.

[0028] The ceramic body 110 can be formed by alternately laminating a ceramic green sheet with the first internal electrode 121 printed on the dielectric layer and a ceramic green sheet with the second internal electrode 122 printed on the dielectric layer in the third direction (Z direction). As the printing method for the first and second internal electrodes 121 and 122, a screen printing method, a gravure printing method, or the like can be used, but it is not limited thereto.

[0029] In the multilayer ceramic electronic component 100 according to the present invention, a first external electrode 131 and a second external electrode 132 can be disposed on both surfaces of the ceramic body 110 in the first direction (X direction). The first external electrode 131 can be connected to the first internal electrode 121, and the second external electrode 132 can be connected to the second internal electrode 122. The first external electrode 131 and the second external electrode 132 are respectively disposed on the first surface S1 and the second surface S2 of the ceramic body 110. The first external electrode 131 can include a first base electrode layer 131a and a first resin electrode layer 131b, and the second external electrode 132 can include a second base electrode layer 132a and a second resin electrode layer 132b.

[0030] In one embodiment of the present invention, the first and second base electrode layers 131a and 132a respectively connected to the first and second internal electrodes 121 and 122 of the multilayer ceramic electronic component 100 of the present invention can be fired electrodes containing a first conductive metal. The first conductive metal contained in the first base electrode layer 131a and the second base electrode layer 132a can be various metals with excellent contact properties with the internal electrodes. For example, copper (Cu), nickel (Ni), tin (Sn), palladium (Pd), platinum (Pt), iron (Fe), gold (Au), silver (Ag), tungsten (W), titanium (Ti), lead (Pb), and one or more metal components selected from the group consisting of these alloys can be used. When the first and second base electrode layers 131a and 132a are formed as fired electrodes containing a first conductive metal as in this embodiment, the connectivity with the internal electrodes can be enhanced, and the mechanical strength of the multilayer ceramic electronic component 100 can be enhanced.

[0031] The method for forming the first base electrode 131a and the second base electrode 132a is not particularly limited. For example, a conductive paste containing a first conductive metal can be printed or applied to the surface of the ceramic body 110 by a screen printing method or a gravure printing method, or the ceramic body 110 can be dipped into the conductive paste, or various methods such as transferring a dried film of the conductive paste onto the ceramic body 110 can be used, but it is not limited thereto.

[0032] The first and second resin electrode layers 131b and 132b of the multilayer ceramic electronic component 100 according to the present invention can contain a thermosetting shape memory polymer. In an example of the present invention, the thermosetting shape memory polymer can contain a cured product of an organic epoxy resin and a curing agent.

[0033] In one example, the organic epoxy resin can include one or more resins selected from the group consisting of bisphenol epoxy resins, biphenyl epoxy resins, naphthalene epoxy resins, fluorene epoxy resins, phenol novolac epoxy resins, cresol novolac epoxy resins, xylock epoxy resins, tris-hydroxyphenylmethane epoxy resins, tetraphenylmethane epoxy resins, dicyclopentadiene type epoxy resins, and dicyclopentadiene-modified phenol type epoxy resins. Examples of the bisphenol epoxy resin include, but are not limited to, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, hydrogenated bisphenol A type epoxy resin, bisphenol AF type epoxy resin, etc.

[0034] The organic epoxy resin can have an average epoxy equivalent of 80 g / eq. to 1,000 g / eq. The average epoxy equivalent is a value calculated based on the weight ratio and epoxy equivalent of each epoxy resin contained in the organic epoxy resin.

[0035] In one embodiment of the present invention, the organic epoxy resin contained in the thermosetting shape memory polymer can have a viscosity measured in accordance with ISO 12058-1 at 25°C in the range of 800 mPa·s or more and / or 2,000 mPa·s or less. If the viscosity is lower than the above range, there may be problems with moldability and it may be difficult to form electrodes. If the viscosity exceeds the above range, there may be appearance defects when forming the external electrodes.

[0036] In one embodiment of the present invention, the glass transition temperature (Tg) of the thermosetting shape memory polymer of the multilayer ceramic electronic component can be 50°C or higher and / or 200°C or lower. The above glass transition temperature can be a value obtained by using a Dynamic Mechanical Analyzer (DMA). When the glass transition temperature of the thermosetting shape memory polymer of the multilayer ceramic electronic component according to this embodiment is lower than the above range, the adhesion strength to the substrate may decrease. When it is higher than the above range, it may be difficult to exhibit the shape recovery ability under actual use conditions.

[0037] In another embodiment of the present invention, the thermosetting shape memory polymer of the multilayer ceramic electronic component can have a storage elastic modulus at 25°C within the range of 1.3 GPa or higher and / or 8.5 GPa or lower. The above storage elastic modulus can be a value obtained by using a Dynamic Mechanical Analyzer (DMA). When the storage elastic modulus of the thermosetting shape memory polymer of the multilayer ceramic electronic component according to this embodiment satisfies the above range, it can effectively absorb external shocks and improve the mechanical reliability of the multilayer ceramic electronic component.

[0038] Specific examples of the above organic epoxy resins include 3,4-epoxycyclohexylmethyl 3',4'-epoxycyclohexanecarboxylate (EEC) and derivatives, dicyclopentadiene dioxide and derivatives, 3-ethyl-3-oxetanemethanol and derivatives, diglycidyl tetrahydrophthalate and derivatives, diglycidyl hexahydrophthalate and derivatives, 1,2-ethanediyl diglycidyl ether and derivatives, 1,3-propanediyl diglycidyl ether and derivatives, 1,4-butanediol diglycidyl ether and derivatives, higher 1,n-alkanediyl diglycidyl ether and derivatives, bis[(3,4-epoxycyclohexyl)methyl] adipate and derivatives, vinylcyclohexyl dioxide and derivatives, 1,4-cyclohexanedimethanol bis(3,4-epoxycyclohexanecarboxylate) and derivatives, diglycidyl 4,5-epoxytetrahydrophthalate and derivatives, bis[1-ethyl(3-oxetanyl)methyl] ether and derivatives, pentaerythritol tetraglycidyl ether and derivatives, bisphenol A diglycidyl ether (DGEBA), hydrogenated bisphenol A diglycidyl ether, bisphenol F diglycidyl ether, hydrogenated bisphenol F diglycidyl ether, epoxy phenol novolac, hydrogenated epoxy phenol novolac, epoxy cresol novolac, hydrogenated epoxy cresol novolac, 2-(7-oxabicyclo spiro(1,3-dioxane-5,3'-(7-oxabicyclo[4.1.0]heptane))), or 1,4-bis((2,3-dipropoxy)-methyl)cyclohexane, etc., but are not limited thereto.

[0039] In one embodiment of the present invention, the curing agent contained in the thermosetting shape memory polymer can contain disulfide bonds. The above disulfide bonds can mean -S-S- bonds, and can include all dithiol compounds containing two disulfide bonds and polythiol compounds containing three or more disulfide bonds. The above disulfide bonds can play the role of secondary crosslinking between polymer segments in a thermosetting polymer that forms a chemical crosslinking bond. Thereby, the thermosetting shape memory polymer can form a deformed shape and can impart a kind of thermoplastic property to the thermosetting compound.

[0040] The type of the above curing agent is not particularly limited as long as it contains disulfide bonds. Examples of compounds containing disulfide bonds include 1,4-butanedithiol, 1,5-pentanedithiol, 1,6-hexanedithiol, 1,8-octanedithiol, 1,9-nonanedithiol, 1,10-decanedithiol, p-xylene-α,α'-dithiol, 2,4,6-trimercapto-s-triazole, 2,5-dimercapto-1,3,4-thiadiazole, diethyldisulfide, di-sec-butyldisulfide, diphenyldisulfide, p,p'-ditolyldisulfide, dihexyldisulfide, dioctyldisulfide, dibenzyldisulfide, dibenzoyldisulfide, dithiobenzoyldisulfide, bis(2,6-difluorophenyl)disulfide, bis(2,6-dimethyl-4-t-butylphenyl)disulfide, tetramethylthiuram disulfide, tetraethylthiuram disulfide, tetrabutylthiuram disulfide, tetrabenzylthiuram disulfide, diaminodiphenyldisulfide, 4,4'-dihydroxydiphenyldisulfide, 2,2'-dicarboxydiphenyldisulfide, and 4,4'-diaminodiphenyldisulfide, etc., but are not limited thereto.

[0041] In an example of the present invention, the first resin electrode layer 131b and the second resin electrode layer 132b of the multilayer ceramic electronic component can contain a conductivity-imparting agent. The above-mentioned conductivity-imparting agent enables the resin electrode layer containing the shape memory polymer described above to have electrical conductivity, and can contain a conductive metal and / or a conductive polymer. The above-mentioned conductive metal can be, for example, one or more selected from the group consisting of calcium (Ca), titanium (Ti), molybdenum (Mo), tungsten (W), iron (Fe), cobalt (Co), nickel (Ni), palladium (Pd), platinum (Pt), copper (Cu), silver (Ag), gold (Au), zinc (Zn), aluminum (Al), tin (Sn), lead (Pb), and alloys thereof, but is not limited thereto.

[0042] Also, as non-limiting examples of the above-mentioned conductive polymer, sulfur (S) and / or nitrogen (N)-containing compounds such as PT (poly(thiophene)), PEDOT (poly(ethylenedioxy)thiophene), PPS (poly(p-phenylene sulfide)), PANI (polyanilines), P3HT (poly(3-hexylthiophene-2,5-diyl)), PolyTPD (poly(4-butylphenyldiphenylamine)), PSS (poly(4-butylphenyldiphenylamine)), PVK (poly(9-vinylcarbazole)), PDBT (poly(4,4'-dimethoxy bithophene)), polyaniline or polypyrrole can be mentioned, but compounds containing no heteroatoms such as poly(fluorine), polyphenylene, polypyrene, polyazulene, polynaphthalene, PAC (poly(acetylene)), PPV (poly(p-phenylene vinylene)) can be mentioned as examples, but are not limited thereto.

[0043] In one example, the first and second resin electrode layers 131b and 132b of the multilayer ceramic electronic component according to the present invention can further contain fillers such as carbon nanotubes, graphene, and fullerenes. The above fillers are for improving strength and / or shape recovery force and can function as a kind of reinforcing material. When the above fillers are further included, the shape recovery ability of the first and second resin electrode layers of the multilayer ceramic electronic component according to the present invention can be maximized.

[0044] In one embodiment of the present invention, the first and second resin electrode layers 131b and 132b of the multilayer ceramic electronic component 100 of the present invention can be respectively arranged to cover the first and second base electrode layers 131a and 132a. In this specification, when a layer is arranged "so as to cover" another layer, it can mean a structure in which the layer located inside is not exposed to the outside, and the layer located inside is arranged inside the layer arranged outside, and only the layer arranged outside can be seen from the outside. As described above, when the first and second metal layers 131c and 132c are respectively arranged to cover the first and second conductive layers 131b and 132b, the first and second conductive layers 131b and 132b can be prevented from being exposed to the outside, and the first and second resin electrode layers 131b and 132b can minimize the penetration of contaminants such as external impact and moisture.

[0045] The method for forming the first and second resin electrode layers 131b and 132b is not particularly limited. For example, it can be formed by dipping the ceramic body 110 into a paste containing a thermosetting shape memory polymer and a conductivity-imparting agent, printing the paste on the surface of the ceramic body 110 by a screen printing method or a gravure printing method, applying the paste to the surface of the ceramic body 110, or transferring a dried dry film of the paste onto the ceramic body 110. Although various methods such as these can be used, it is not limited thereto.

[0046] In one embodiment of the present invention, the multilayer ceramic electronic component 100 according to the present invention can include a first plating layer 131c disposed on the first resin electrode layer 131b and a second plating layer 132c disposed on the second resin electrode layer 132b. The first and second plating layers 131c and 132c can be formed by sputtering or electroplating (Electric Deposition), but are not limited thereto. The materials for forming the first and second plating layers 131c and 132c are not particularly limited and can include nickel (Ni), copper (Cu), tin (Sn), palladium (Pd), platinum (Pt), gold (Au), silver (Ag), tungsten (W), titanium (Ti), lead (Pb), etc., alone or alloys thereof.

[0047] As described above in detail with respect to the embodiments of the present invention, the present invention is not limited by the above-described embodiments and the accompanying drawings, but is limited by the appended claims. Therefore, within the scope not departing from the technical idea of the present invention described in the appended claims, various forms of substitution, modification, and change are possible by those having ordinary knowledge in the art, and it can be said that these also belong to the scope of the present invention.

Explanation of Reference Numerals

[0048] 100: Multilayer ceramic electronic component 110: Ceramic body 111: Dielectric layer 121: First internal electrode 122: Second internal electrode 131: First external electrode 132: Second external electrode 131a: First base electrode layer 132a: Second base electrode layer 131b: First resin electrode layer 131b: Second resin electrode layer 131c, 132c: Plating layer

Claims

1. A ceramic body including a dielectric layer and first and second internal electrodes arranged to be alternately laminated with the dielectric layer interposed therebetween; A first external electrode connected to the first internal electrode of the ceramic body; A second external electrode connected to the second internal electrode, including: The first external electrode includes a first base electrode layer disposed in contact with the ceramic body and a first resin electrode layer disposed on the first base electrode layer; The second external electrode includes a second base electrode layer disposed in contact with the ceramic body and a second resin electrode layer disposed on the second base electrode layer; The first resin electrode layer and the second resin electrode layer include a thermosetting shape memory polymer; The thermosetting shape memory polymer includes a cured product of an organic epoxy resin and a curing agent; The curing agent includes a disulfide bond, a multilayer ceramic electronic component.

2. The multilayer ceramic electronic component according to claim 1, wherein the thermosetting shape memory polymer has a glass transition temperature (Tg) of 50° C. or higher and / or 200° C. or lower.

3. The multilayer ceramic electronic component according to claim 1 or 2, wherein the thermosetting shape memory polymer has a modulus of elasticity at 25° C. in the range of 1.3 GPa or higher and / or 8.5 GPa or lower.

4. The organic epoxy resin includes one or more resins selected from the group consisting of bisphenol-based epoxy resins, biphenyl-based epoxy resins, naphthalene-based epoxy resins, fluorene-based epoxy resins, phenol novolak-based epoxy resins, cresol novolak-based epoxy resins, xylock-based epoxy resins, trishydroxyphenylmethane-based epoxy resins, tetraphenylmethane-based epoxy resins, dicyclopentadiene-type epoxy resins, and dicyclopentadiene-modified phenol-type epoxy resins. The multilayer ceramic electronic component according to any one of claims 1 to 3.

5. The multilayer ceramic electronic component according to any one of claims 1 to 4, wherein the organic epoxy resin has a viscosity measured in accordance with ISO 12058-1 at 25° C. in the range of 800 mPa·s or higher and / or 2,000 mPa·s or lower.

6. The multilayer ceramic electronic component according to any one of claims 1 to 5, wherein the first resin electrode layer and the second resin electrode layer include a conductivity-imparting agent.

7. The laminated ceramic electronic component according to any one of claims 1 to 6, wherein the first resin electrode layer and the second resin electrode layer further contain one or more fillers selected from the group consisting of carbon nanotubes, graphene, and fullerenes.

8. The laminated ceramic electronic component according to any one of claims 1 to 7, wherein the first base electrode layer and the second base electrode layer are fired electrodes containing a conductive metal.

9. The laminated ceramic electronic component according to any one of claims 1 to 8, wherein the first resin electrode layer and the second resin electrode layer are arranged so as to cover the first base electrode layer and the second base electrode layer.

10. The laminated ceramic electronic component according to any one of claims 1 to 9, further comprising a first plating layer and a second plating layer disposed on the first resin electrode layer and the second resin electrode layer.

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