Method for manufacturing an electronic component and an electronic component

Abstract

To suppress generation of resin burrs by resin leakage.SOLUTION: In a manufacturing method for an electronic component having a housing whose terminal is insert molded, a terminal 42 is provided with a tapered part 46 whose width is tapered and an extension part 47 extended from an end on a narrow side of the tapered part 46. A mold configuring a cavity 57 includes an upper mold 51 and a slide mold 53, relatively slides the slide mold 53 to the extension part 47 after positioning the extension part 47 in a groove 55 formed on one surface of the slide mold 53, abuts end edges of both side surfaces 55a, 55b of the groove 55 facing the cavity 57 against both side surfaces 46a, 46b of the tapered part 46, brings the upper mold 51 and the one surface into close contact with each other, grips a part of the tapered part 46 positioned in the groove 55 and the extension part 47 with a bottom surface of the groove 55 and the upper mold 51, and is molded with a residual part of the tapered part 46 positioned at the cavity 57, so that a connection part 45 protruding from the housing 41 is formed by a part of the tapered part 46 and the extension part 47.SELECTED DRAWING: Figure 5

Description

Technical Field

[0001] This invention relates to an electronic component having a housing in which terminals are insert-molded and a method for manufacturing the same.

Background Art

[0002] FIG. 9A shows a connector 10 described in Patent Document 1 as a conventional example of this type of electronic component, and FIG. 9B shows an enlarged cross-section thereof. The connector 10 is configured by insert-molding contacts 11 into a housing (referred to as an insulator in Patent Document 1) 12. In FIGS. 9A and 9B, 11a indicates the lead portion of the contact 11, and 11b indicates the fitting portion of the contact 11.

[0003] FIG. 10 shows a contact member 15 to be inserted into a mold, and a plurality of contacts 11 are provided in a slat-like manner via slits between a lead-side bar 16 and a fitting-side bar 17.

[0004] FIGS. 11A and 11B show the state at the time of mold clamping of an insert mold structure. In the figures, 21 is an intermediate plate, 22 is a base integrally protruding from the intermediate plate 21, and 23 indicates a pair of slide mold plates that can move on the base 22 in a manner that can be separated from and contacted with both side surfaces of the intermediate plate 21. Also, 24 indicates a movable mold plate, and 25 indicates a cavity.

[0005] The slide mold plate 23 is provided with a first protrusion group 26 that fits into the slit of the fitting portion 11b of the contact member 15 and a second protrusion group 27 that fits into the slit of the lead portion 11a of the contact member 15 as shown in FIG. 12. The contact member 15 is positioned by these first protrusion group 26 and second protrusion group 27, and at the time of mold clamping, the lead-side bar 16 is pressed and fixed by the movable mold plate 24, and the fitting-side bar 17 is pressed and fixed by the slide mold plate 23, respectively. In FIGS. 11A and 11B, the contact member 15 is shown by a thick line.

[0006] After injecting resin into the cavity 25 and molding, the mold is opened to remove the connector, and the lead portion 11a and the fitting portion 11b are cut and folded at a predetermined length to obtain the connector 10 shown in FIGS. 9A and 9B.

Prior Art Documents

Patent Documents

[0007]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0008] In an electronic component in which terminals are insert-molded in a housing as in the above-described connector 10, it is necessary to position the terminals during molding in order to position the terminals at predetermined positions. In Patent Document 1, a first protrusion group 26 and a second protrusion group 27 are provided on the slide template 23, and the contacts 11 are inserted into the grooves between these protrusion groups for positioning.

[0009] However, when the groove is provided in the mold and the terminal is inserted and positioned in this way, if the clearance (gap) between the terminal and the groove in the groove width direction is set too narrow, the insertability of the terminal into the groove deteriorates, and for example, the mold and the terminal interfere with each other and the terminal is damaged. Therefore, it is necessary to make the clearance between the terminal and the groove relatively large. In this case, a situation may occur where the resin leaks out from the clearance between the terminal and the groove during molding.

[0010] The leaked resin becomes resin burrs and covers the portion of the terminal protruding from the housing. Therefore, when the portion of the terminal protruding from the housing is, for example, a soldering portion with a land on a substrate, the presence of the resin burrs may cause insufficient soldering quality and strength. Further, when the portion of the terminal protruding from the housing is, for example, a contact portion with a terminal of a mating electronic component, the presence of the resin burrs may impair the contact quality, or the resin burrs may be scraped off during contact and dust may be generated.

[0011] In view of such circumstances, an object of the present invention is to provide a method for manufacturing an electronic component capable of suppressing the generation of resin burrs that adversely affect quality, and further to provide an electronic component to which such a manufacturing method can be applied.

Means for Solving the Problems

[0012] According to the present invention, in a method for manufacturing an electronic component having a housing in which terminals are insert-molded, the terminals include a tapered portion whose width tapers, and an extended portion extended from the tip of the narrower side of the width of the tapered portion. The mold constituting the cavity for molding the housing includes a first mold and a second mold. After positioning the extended portion in a groove formed on one surface of the second mold, the second mold is slid relative to the extended portion so that the edges of both side surfaces of the groove facing the cavity abut against both side surfaces constituting the taper of the tapered portion. The first mold is brought into close contact with the one surface, and a part of the tapered portion and the extended portion located in the groove are sandwiched between the bottom surface of the groove and the first mold, and the remaining portion of the tapered portion is molded in a state of being positioned in the cavity, whereby a connection portion protruding from the housing is formed by a part of the tapered portion and the extended portion.

[0013] According to the present invention, in an electronic component having a housing in which terminals are insert-molded, the terminals include a tapered portion whose width tapers, and an extended portion extended from the tip of the narrower side of the width of the tapered portion. A part of the tapered portion and the extended portion protrude from the housing to form a connection portion, and the remaining portion of the tapered portion is assumed to be embedded in the housing.

Effects of the Invention

[0014] According to the method for manufacturing an electronic component of the present invention, resin leakage during insert molding of the terminals into the housing can be prevented, and thus problems such as the generation of resin burrs due to resin leakage at the connection portion of the terminals protruding from the housing can be solved.

[0015] Further, according to the electronic component of the present invention, since it has a configuration to which the manufacturing method of the electronic component of the present invention can be applied, an electronic component without resin burrs can be obtained at the connection portion of the terminal protruding from the housing.

Brief Description of Drawings

[0016]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Figure 12

Embodiments for Carrying Out the Invention

[0017] Hereinafter, embodiments of the present invention will be described with reference to the drawings while comparing with the conventional configuration.

[0018] FIGS. 1 and 2 respectively show the schematic configurations of connectors as an example of the electronic components targeted by the present invention. FIG. 2 shows the connector 40 according to the present invention, and FIG. 1 shows the connector 30 having a conventional configuration shown in comparison with FIG. 2. These connectors 30 and 40 form one of the board-to-board connectors and are surface-mounted on the board.

[0019] The connector 30 includes a resin housing 31 and a total of six terminals 32 arranged in two rows. The housing 31 has a rectangular parallelepiped shape, and a recess 33 is formed in the upper surface 31a. One end side of each terminal 32 is embedded in the side wall 34 sandwiching the recess 33 so as to wrap around the side wall 34, and the other end side is located on the bottom surface 31b of the housing 31 and protrudes from the housing 31. The portion of the terminal 32 protruding from the housing 31 forms a connection portion 35. In the connector 30, including the connection portion 35, the shape of the portion of the terminal 32 located on the bottom surface 31b of the housing 31 is simply a rectangular shape.

[0020] On the other hand, the connector 40 according to the present invention, like the connector 30, includes a resin housing 41 and a total of six terminals 42 arranged in two rows. One end side of each terminal 42 is embedded in the side wall 44 sandwiching the recess 43 formed in the upper surface 41a of the rectangular parallelepiped-shaped housing 41, and the other end side is located on the bottom surface 41b of the housing 41 and protrudes from the housing 41. However, the shape of the portion of this terminal 42 located on the bottom surface 41b of the housing 41 is different from that of the connector 30.

[0021] That is, the other end side of each terminal 42 located on the bottom surface 41b of the housing 41 is, in this example, composed of a tapered portion 46 whose width tapers, an extension portion 47 extending from the tip on the narrower side of the tapered portion 46, and a base portion 48 following the base end on the wider side of the tapered portion 46. A part of the tapered portion 46 and the extension portion 47 protrude from the housing 41, and the remaining part of the tapered portion 46 and the base portion 48 are embedded in the housing 41. In this example, the connection portion 45 protruding from the housing 41 is composed of a part of the tapered portion 46 and the extension portion 47.

[0022] In the above-described connector 30, the terminal 32 is insert-molded into the housing 31, and in the connector 40 as well, the terminal 42 is insert-molded into the housing 41. FIG. 3 shows, by taking the manufacturing of the connector 30 as an example, such a manufacturing method by insert molding.

[0023] In this example, the molding die is composed of an upper die (first die) 51, a lower die 52, and two slide dies (second dies) 53. The lower die 52 is housed and supported in a base 54 and protrudes from the base 54, and the two slide dies 53 are slidable on the base 54. (1) to (3) in FIG. 3 sequentially show the states in the insert molding process, and FIG. 3B shows the state seen from the direction where the upper die 51 is located with the illustration of the upper die 51 omitted. Grooves 55 for accommodating and positioning the connection portion 35 of the terminal 32 are formed on one surface (upper surface) of each of the two slide dies 53, and a stepped portion 56 on which the end portion of the terminal 32 opposite to the connection portion 35 is placed is formed on the upper surface of the lower die 52. Hereinafter, the insert molding process will be described in order.

[0024] (1) In this state, the slide dies 53 respectively located on the left and right of the lower die 52 are separated from the lower die 52, and the upper die 51 located above the slide dies 53 is also separated from the slide dies 53. In this state, the terminal 32 is inserted, and a part (tip side) of the connection portion 35 is accommodated and positioned in the groove 55 of the slide die 53. Although the three terminals 32 on each of the left and right are respectively supported and integrated by a carrier, the illustration of the carrier is omitted in this example.

[0025] (2) Slide the slide type 53 and make it adhere closely to the lower mold 52, and lower the upper mold 51 to make it adhere closely to the slide type 53, and perform mold clamping to form the cavity 57. Note that the sliding operation of the slide type 53 and the lowering operation of the upper mold 51 are performed in conjunction with each other.

[0026] (3) Inject and pour resin into the cavity 57 to form the housing 31 by injection molding.

[0027] Thus, the insert molding is completed. After that, the mold is opened, and the carrier (not shown in the figure) is cut and removed, thereby completing the connector 30.

[0028] Here, before explaining the manufacturing method of the connector 40 according to the present invention, in the manufacturing of the connector 30 having a conventional configuration formed by insert molding as described above, the state in which resin leakage occurs and resin burrs are generated at the connection portion 35 of the terminal 32 will be described with reference to FIG. 4.

[0029] (1) to (3) in FIG. 4B show the relationship between the connection portion 35 of one terminal 32 of the connector 30 and the slide type 53 and the state in which resin leakage occurs in the portion where the connection portion 35 of the terminal 32 is located, which is shown enlarged in FIG. 4A. (1) to (3) in FIG. 4B correspond to (1) to (3) in the insert molding process shown in FIG. 3. Note that in FIG. 4B(3), 60 indicates the resin for forming the housing 31.

[0030] Even in the state where the slide type 53 is slid and mold clamped, there is a clearance c between the groove 55 of the slide type 53 and the connection portion 35 of the terminal 32. Therefore, resin leakage occurs due to this clearance c, and the leaked resin becomes a resin burr 61 and adheres to and remains on the connection portion 35. Note that FIG. 4B(3) shows the state when the connection portion 35 is offset (eccentric) with respect to the groove 55.

[0031] In contrast, FIG. 5 shows, in comparison with FIG. 4, the state in which resin leakage can be prevented, that is, the generation of resin burrs can be suppressed, in the method for manufacturing the connector 40 according to the present invention. Hereinafter, the molding steps shown in FIGS. 5B(1) to (3) will be described in order.

[0032] (1) Insert the terminal 42 into the molding die, and position the extending portion 47 of the terminal 42 in the groove 55 of the slide die 53.

[0033] (2) Slide the slide die 53, that is, slide the slide die 53 relative to the extending portion 47, and abut the edges of both side surfaces 55a and 55b of the groove 55 facing the cavity 57 against both side surfaces 46a and 46b that form the taper of the tapered portion 46 of the terminal 42. As the slide die 53 slides, the upper die 51 also descends to a mold-clamped state (see FIG. 3(2)).

[0034] In the mold-clamped state, the upper die 51 is in close contact with the upper surface of the slide die 53, and the connecting portion 45 formed by a part of the tapered portion 46 of the terminal 42 located in the groove 55 of the slide die 53 and the extending portion 47 is sandwiched between the bottom surface of the groove 55 and the upper die 51. The remaining portion and the base portion 48 of the tapered portion 46 are located in the cavity 57.

[0035] (3) Inject resin 60 into the cavity 57 and mold it. Since the edges of both side surfaces 55a and 55b of the groove 55 facing the cavity 57 abut against both side surfaces 46a and 46b of the tapered portion 46 of the terminal 42, the resin 60 is blocked and resin leakage does not occur, that is, resin burrs do not occur in the connecting portion 45.

[0036] Although the present invention has been described by taking the connector 40 as an example, FIGS. 6 to 8 will be further referred to for a more detailed description of an embodiment in which the connecting portion of the terminal protruding from the housing is configured by a part of the tapered portion and the extending portion in this way to prevent resin leakage during insert molding and suppress the generation of resin burrs.

[0037] FIG. 6 shows a connector 70 that is surface-mounted on a substrate, similar to the connector 40 shown in FIG. 2. In this connector 70, signal terminals 72 and power supply terminals 73 are insert-molded in a housing 71, and a reinforcing metal fitting 74 is also insert-molded. The terminals 72, 73, and the reinforcing metal fitting 74 all have connection portions 72a, 73a, 74a that protrude from the housing 71, and these connection portions 72a, 73a, 74a are to be soldered to the lands of the substrate. In this example, these connection portions 72a, 73a, 74a all have the same form as the connection portion 45 of the connector 40. In FIGS. 6C and 6D, 72b, 73b, and 74b respectively indicate tapered portions.

[0038] FIG. 7 shows a portion of an end of a connector 80 where a reinforcing metal fitting 82 is insert-molded in a housing 81. The reinforcing metal fitting 82 has connection portions 83 to 86 that protrude from the housing 81, and these connection portions 83 to 86 are to be soldered to the lands of the substrate. The connection portions 83 to 86 all have the same form as the connection portion 45 of the connector 40. In FIGS. 7B and 7C, 83a and 85a respectively indicate tapered portions.

[0039] FIG. 8 shows a connector 90 in which both ends of a terminal 92 insert-molded in a housing 91 protrude from the housing 91 respectively. A connection portion 93 protruding vertically from the housing 91 forms a fitting and contact portion with the terminal of the mating connector, and a connection portion 94 protruding horizontally from the housing 91 forms a soldering portion with the land of the substrate. These connection portions 93, 94 all have the same form as the connection portion 45 of the connector 40. In FIG. 8, 93a and 94a respectively indicate tapered portions.

[0040] As described above, various embodiments have been explained. However, the electronic components targeted by this invention are not limited to connectors, and any component is acceptable as long as the terminal has a connection portion that is insert-molded in the housing and protrudes from the housing.

[0041] According to the manufacturing method of the electronic component of this invention, the following effects can be obtained.

[0042] 1) It is possible to prevent resin leakage when insert - molding the terminal into the housing, thus eliminating problems such as resin burrs occurring due to resin leakage at the connection part of the terminal protruding from the housing.

[0043] 2) By having a tapered portion, when the slide - type mold slides (closes), the connection part of the terminal is centered in the groove of the slide - type mold as shown in Fig. 5. Therefore, the positional accuracy of the connection part can be improved, which is also advantageous for narrow - pitch formation.

[0044] 3) When inserting the terminal into the molding die and positioning the connection part of the terminal in the groove of the slide - type mold, since the extended part with a large clearance from the groove is positioned, there is no hindrance to the insertability.

Explanation of reference numerals

[0045] 10 Connector 11 Contact 11a Lead part 11b Fitting part 12 Housing 15 Contact member 16 Lead - side bar 17 Fitting - side bar 21 Medium - sized plate 22 Base 23 Slide - type plate 24 Movable - type plate 25 Cavity 26 First protrusion group 27 Second protrusion group 30 Connector 31 Housing 31a Upper surface 31b Bottom surface 32 Terminal 33 Recess 34 Side wall 35 Connection part 40 Connector 41 Housing 41a Upper surface 41b Bottom surface 42 Terminal 43 Recess 44 Side wall 45 Connection part 46 Tapered portion 46a, 46b Side surfaces 47 Extended part 48 Base 51 Upper mold 52 Lower mold 53 Slide - type mold 54 Base 55 Groove 55a, 55b side, 56 stepped portion 57 cavity, 60 resin 61 resin burr, 70 connector 71 housing, 72 terminal 73 terminal, 74 reinforcing metal fitting 72a, 73a, 74a connection portion, 72b, 73b, 74b tapered portion 80 connector, 81 housing 82 reinforcing metal fitting, 83 - 86 connection portions 83a, 85a tapered portions, 90 connector 91 housing, 92 terminal 93, 94 connection portions, 93a, 94a tapered portions

Claims

1. A method for manufacturing an electronic component having a housing in which terminals are insert-molded, comprising: The terminals include a tapered portion whose width tapers and an extended portion extended from the tip on the narrower-width side of the tapered portion, The mold forming the cavity for molding the housing includes a first mold and a second mold, After positioning the extended portion in a groove formed on one surface of the second mold, the second mold is slid relative to the extended portion so that the edges of both side surfaces of the groove facing the cavity abut against both side surfaces constituting the taper of the tapered portion, The first mold is brought into close contact with the one surface, and a part of the tapered portion and the extended portion located in the groove are sandwiched between the bottom surface of the groove and the first mold, and the remaining portion of the tapered portion is molded in a state of being positioned in the cavity, whereby a connection portion protruding from the housing is formed by a part of the tapered portion and the extended portion. A method for manufacturing an electronic component, characterized in that.

2. In the method for manufacturing an electronic component according to Claim 1, The connection portion is a soldering portion with a land of a substrate or a contact portion with a terminal of a mating electronic component. A method for manufacturing an electronic component, characterized in that.

3. An electronic component having a housing in which terminals are insert-molded, comprising: The terminals include a tapered portion whose width tapers and an extended portion extended from the tip on the narrower-width side of the tapered portion, A part of the tapered portion and the extended portion protrude from the housing to form a connection portion, The remaining portion of the tapered portion is embedded in the housing. An electronic component, characterized in that.

4. In the electronic component according to Claim 3, The connection portion is a soldering portion with a land of a substrate or a contact portion with a terminal of a mating electronic component. An electronic component, characterized in that.

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