Electronic device

Abstract

Provided is an electronic device that can prevent disconnection of a cable while achieving space saving. 【Solution means】The electronic device includes a substrate on which a heating element, a connector, and a stud component are mounted, a thermal module that cools the heating element, a flat cable having a connection portion connected to the connector, and a bracket that is provided so as to straddle the cable in the width direction and holds the cable from above the connector and the connection portion. The bracket has a first end portion on one side and a second end portion on the other side in the direction straddling the cable. The first end portion is screwed to the stud component, and the second end portion is pressed by a part of the thermal module.

Description

Technical Field

[0001] The present invention relates to an electronic device including a substrate.

Background Art

[0002] In an electronic device such as a notebook PC, various connectors are mounted on a substrate housed in a casing. For example, Patent Document 1 discloses a configuration in which a flexible substrate connected to a display is connected to a connector mounted on the substrate.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The connection between the connector and the cable as described above needs to be not easily disconnected. Therefore, for example, stud components are mounted on both sides of the connector, and the cable is pressed from above the connector by screwing both ends of the bracket. However, in this configuration, it is necessary to mount two stud components on the substrate for one bracket. Therefore, in this configuration, it may be difficult to secure the space for the stud components on the substrate, and there is a concern that it may affect the electrical / electronic (E / E) design of the electronic device.

[0005] The present invention has been made in consideration of the above problems of the prior art, and an object thereof is to provide an electronic device that can prevent the cable connection from being disconnected while achieving space saving.

Means for Solving the Problems

[0006] An electronic device according to an aspect of the present invention includes a substrate on which a heating element, a connector, and a stud component are mounted, a thermal module that cools the heating element, a flat cable having a connection portion connected to the connector, and a bracket provided so as to straddle the cable in the width direction and holding the cable from above the connector and the connection portion. The bracket has a first end portion on one side and a second end portion on the other side in the direction straddling the cable. The first end portion is screwed to the stud component, and the second end portion is pressed by a part of the thermal module.

Advantages of the Invention

[0007] According to the above aspect of the present invention, it is possible to prevent the cable connection from coming off while saving space.

Brief Description of the Drawings

[0008]

Figure 1

Figure 2

Figure 3A

Figure 3B

Figure 4

Figure 5

Embodiments for Carrying Out the Invention

[0009] Hereinafter, preferred embodiments of the electronic device according to the present invention will be given and described in detail with reference to the accompanying drawings.

[0010] FIG. 1 is a schematic plan view of an electronic device 10 according to an embodiment as viewed from above. As shown in FIG. 1, the electronic device 10 of this embodiment is a clamshell-type notebook PC. The electronic device 10 has a configuration in which a lid body 11 and a housing 12 are relatively rotatably connected by a hinge 14. In this embodiment, the electronic device 10 of the notebook PC is exemplified, but the electronic device may be other than a notebook PC, for example, a tablet PC, a smartphone, or a portable game machine.

[0011] The lid body 11 is a thin and flat box-shaped housing. The lid body 11 is equipped with a display 16. The display 16 is, for example, an organic EL display or a liquid crystal display.

[0012] The housing 12 is a thin and flat box. A keyboard device 18 and a touch pad 19 face the upper surface (surface 12a) of the housing 12. Hereinafter, regarding the housing 12 and each component mounted thereon, with the posture of the operator operating the keyboard device 18 as a reference, the width direction (left and right) of the housing 12 is referred to as the X1 and X2 directions, the depth direction (front and back) of the housing 12 is referred to as the Y1 and Y2 directions, and the thickness direction (up and down) of the housing 12 is referred to as the Z1 and Z2 directions for explanation. The X1 and X2 directions may also be collectively referred to as the X direction, and the Y1, Y2 directions and the Z1, Z2 directions may also be similarly referred to as the Y direction and the Z direction. Also, for convenience of explanation, in the thickness direction of the housing 12, the Z1 direction may be referred to as down and the reverse (Z2 direction) may be referred to as up (see FIGS. 3A to 5). These directions are directions defined for convenience of explanation and may naturally change depending on the usage state or installation posture of the electronic device 10.

[0013] The housing 12 is composed of a housing member 20 that forms the upper surface and the four peripheral side surfaces, and a cover material 21 that forms the lower surface. The housing member 20 can be composed of a plate-shaped member that forms the surface 12a of the housing 12. The cover material 21 can be composed of a plate portion 21A that forms the bottom surface 12b of the housing 12 and a standing wall 21B that forms the side surface of the housing 12 (see FIG. 4). The standing wall 21B stands up in the Z1 direction from the edge of the plate portion 21A. The housing member 20 and the cover material 21 are overlapped in the thickness direction and are detachably connected to each other. The standing wall 21B may be formed on the housing member 20. In this case, the cover material 21 may be composed of only the plate portion 21A.

[0014] The hinge 14 is installed in a concave hinge placement groove 12c formed at the rear edge of the housing 12, and connects the housing 12 and the lid 11. The hinge 14 has, for example, a structure in which a hinge shaft 14a serving as a rotation axis is supported at both ends in the longitudinal direction of the hinge housing. One end of the hinge shaft 14a is pivotally supported by a bracket fixed to the housing member 20. The other end of the hinge shaft 14a is supported within a hinge housing 14b inserted into the hinge placement groove 12c. The lid 11 has a jaw-shaped edge 11a that protrudes toward the display surface 16a side of the display 16. The hinge housing 14b is fixed to the edge 11a and supports the other end of the hinge shaft 14a (see FIGS. 1 and 4). The reference numeral 22 in FIG. 4 is a bezel member that surrounds the peripheral edge of the display surface 16a of the display 16.

[0015] FIG. 2 is a plan view schematically showing the internal structure of the housing 12. FIG. 2 is a view of the inside of the housing member 20 seen from the bottom side with the cover material 21 removed.

[0016] As shown in FIG. 2, a thermal module 24, a motherboard 25, and a battery device 26 are accommodated inside the housing 12. Various electronic components, mechanical components, etc. are further provided inside the housing 12.

[0017] The motherboard (substrate) 25 is a circuit board that serves as the main board of the electronic device 10. The motherboard 25 is disposed closer to the Y2 side of the housing 12 and extends in the X direction. The battery device 26 is a rechargeable battery that serves as the power source of the electronic device 10. The battery device 26 is disposed closer to the Y1 side of the motherboard 25 and extends in the X direction.

[0018] The motherboard 25 of the present embodiment mounts a CPU (Central Processing Unit) 25a. In addition to the CPU 25a, the motherboard 25 can mount various electronic components, such as a GPU (Graphics Processing Unit), a memory, a communication module, etc. For the motherboard 25, for example, the first surface 25A on the Z1 side serves as the mounting surface for the housing member 20, and the second surface 25B on the Z2 side serves as the mounting surface for the CPU 25a, etc.

[0019] Next, the configuration of the thermal module 24 will be described.

[0020] The CPU 25a is a heat generating body with the largest heat generation amount among the electronic components mounted in the housing 12. The thermal module 24 can absorb and diffuse the heat generated by the CPU 25a and discharge it outside the housing 12. The thermal module 24 may be configured to cool heat generating bodies other than the CPU 25a, such as a GPU.

[0021] As shown in FIG. 2, the thermal module 24 can include a heat diffusion member 32 including a metal plate 30, a pressing component 34, and a pair of left and right fans 36, 36. In the thermal module 24 of the present embodiment, the heat diffusion member 32 and the pressing component 34 are integrally assembled, and the fans 36 are separate from these. The thermal module 24 may have a configuration in which the heat diffusion member 32, the pressing component 34, and the fans 36 are integrally assembled.

[0022] The heat dissipation member 32 can absorb and dissipate the heat of the CPU 25a. The heat dissipation member 32 is provided so as to cover a part of the second surface 25B of the motherboard 25 together with the CPU 25a. The heat dissipation member 32 has, for example, a rectangular outer shape that is long in the X direction and narrow in the Y direction. Fans 36 are respectively arranged on both the left and right sides of the heat dissipation member 32.

[0023] The metal plate 30 is a thin metal plate-like member formed of a material with high thermal conductivity such as copper or aluminum. The metal plate 30 of the present embodiment is a copper plate. The metal plate 30 is arranged to extend in the X direction between the left and right fans 36, 36. A heat transport device such as a heat pipe or a vapor chamber can be laminated on the Z1 side surface of the heat dissipation member 32. The heat pipe is formed by flattening a metal pipe thinly into an elliptical cross-section and enclosing a working fluid in the inner sealed space. The vapor chamber is formed by enclosing a working fluid in a sealed space formed between two metal plates.

[0024] A plurality of fins 37 and a flow rectifying member 38 can be provided on the surface 30a on the Z2 side of the metal plate 30. The fins 37 can have, for example, a rod shape extending in the X direction. The fins 37 expand the surface area of the metal plate 30 and enhance the heat dissipation efficiency. The flow rectifying member 38 is provided at the central portion of the metal plate 30 in the longitudinal direction. The flow rectifying member 38 is a member for smoothly guiding the air discharged from the discharge ports 36b of the left and right fans 36 respectively and flowing along the surface 30a toward the exhaust port 48a of the housing 12. The flow rectifying member 38 can be constituted by, for example, a triangular copper block having a vertex facing the Y2 side.

[0025] The pressing component 34 is a component for pressing the heat dissipation member 32 against the CPU 25a. The pressing component 34 constantly biases the heat dissipation member 32 toward the second surface 25B of the motherboard 25. The pressing component 34 has a pair of leaf spring members 34a, 34a in the Y direction. The leaf spring member 34a is connected to, for example, a thin metal frame with its central part fixed to the Z1 side surface of the heat dissipation member 32, and presses the heat dissipation member 32 against the CPU 25a through this metal frame. This metal frame is provided so as to surround the CPU 25a inside the frame and is fixed to the surface 32b by soldering or the like. Both ends of each leaf spring member 34a are fastened and fixed to stud components 42 mounted on the second surface 25B of the motherboard 25 using screws 44 (see Fig. 5). The stud component 42 is a substantially columnar component mounted on the ground pattern 25b provided on the second surface 25B (see Fig. 5). The stud component 42 has a female screw hole into which the screw 44 can be fastened.

[0026] As shown in Fig. 2, the left and right fans 36 are arranged side by side in the X direction so as to straddle the heat dissipation member 32 between them and face each other. Each fan 36 has an air outlet 36b on the side surface 36a facing each other. The air outlets 36b of the left and right fans 36 face each other with the heat dissipation member 32 sandwiched therebetween. Thereby, each fan 36 can discharge air toward the thermal module 24. Each fan 36 has an air inlet 36c at least on the end surface on the Z2 side among the upper and lower end surfaces facing the Z direction. The air inlet 36c can also be provided on the end surface on the Z1 side. The air inlet 36c can suck in outside air (cool air) from, for example, a vent formed on the bottom surface of the housing 12. The fan 36 can be composed of a centrifugal fan that rotates an impeller housed inside the housing by a motor. The fan 36 can discharge the air sucked in from the air inlet 36c from the air outlet 36b.

[0027] The fan 36 is attached to the housing member 20 using, for example, two attachment portions 36d and 36e. The attachment portions 36d and 36e can be configured as plate pieces protruding from the side surface of the housing of the fan 36. One attachment portion 36d is provided on the side surface opposite to the heat dissipation member 32 side. The attachment portion 36d is fixed to the Z2 side surface (inner surface 20a) of the housing member 20 with a screw 46. The other attachment portion 36e is provided on the side surface on the heat dissipation member 32 side. The attachment portion 36e is fixed to the second surface 25B of the motherboard 25 with a screw 47 (see FIG. 3A). The screw 47 is fastened to, for example, the female screw hole of a predetermined stud component mounted on the second surface 25B.

[0028] As shown in FIG. 2, the housing 12 can include an exhaust port 48a formed in the vertical wall 21B (outer wall 48) at the rear edge portion (Y2 side edge portion) thereof. The exhaust port 48a is a vent that can discharge the air (warm air) discharged from the discharge port 36b of each fan 36 and flowing around the motherboard 25 and the thermal module 24 to the outside of the housing 12.

[0029] In the case of this embodiment, the vertical wall 21B on the Y2 side extends along its longitudinal direction and has a hinge arrangement groove 12c recessed toward the Y1 side. The outer wall 48 is the bottom wall (front wall) of the hinge arrangement groove 12c. The exhaust port 48a is provided near the center in the longitudinal direction of the outer wall 48. The exhaust port 48a is composed of, for example, a plurality of small windows arranged adjacent to each other in the X direction. The exhaust port 48a is located between the fans 36 and 36 when based on the arrangement direction (X direction) of the left and right fans 36 and 36. The exhaust port 48a is on the Y2 side of the flow rectifying member 38. The vertical wall 21B can also be configured not to have the hinge arrangement groove 12c. In this case, the exhaust port 48a can be formed in the vertical wall 21B itself which is the outer wall.

[0030] The dashed-dotted arrow shown in FIG. 2 schematically shows the flow of air. As shown in FIG. 2, in the electronic device 10, the air discharged from the discharge ports 36b of the left and right fans 36 absorbs the heat of the CPU 25a etc. and cools the thermal module 24 and the motherboard 25 that dissipate the heat. The cooled air is discharged outside the housing 12 through the exhaust port 48a. At this time, on the second surface 25B side of the motherboard 25, an exhaust path 50 is formed between the left and right stud parts 42 (screws 44) that fix the leaf spring member 34a on the Y2 side.

[0031] FIG. 3A is a schematic perspective view enlarging the bracket 56 shown in FIG. 2 and its peripheral part. FIG. 3B is an exploded perspective view showing the operation of attaching the bracket 56 shown in FIG. 3A to the motherboard 25. FIG. 4 is a schematic side cross-sectional view of the electronic device 10 at the bracket 56 and its peripheral part. FIG. 4 is a view of the electronic device 10 cut along the YZ plane passing through the second end portion 56b of the bracket 56 described later. FIG. 5 is a schematic front cross-sectional view of the electronic device 10 at the bracket 56 and its peripheral part.

[0032] As shown in FIGS. 2 to 5, the electronic device 10 includes a cable 52, a connector 54, and a bracket 56. The cable 52, the connector 54, and the bracket 56 are provided near the edge 12d on the Y2 side of the housing 12. The edge 12d is an edge connected to the edge 11a of the lid 11 by the hinge 14.

[0033] A pair of left and right cables 52 are provided, for example. One cable 52 is a flat wiring for connecting the display 16 mounted on the lid 11 to the motherboard 25, for example. The other cable 52 is a flat wiring for connecting the camera 17 (see FIG. 1) mounted on the lid 11 to the motherboard 25, for example. Each cable 52 can be composed of, for example, a flexible printed circuit (FPC). Each cable 52 is drawn into the housing 12 through the edge 12d of the housing 12 from the edge 11a of the lid 11.

[0034] The cable 52 has a connection portion 52a on one surface of the end portion on the housing 12 side. The connection portion 52a is a terminal connected to the connector 54. As shown in FIGS. 3B to 5, the cable 52 can have a plate 52b that forms the back surface of the connection portion 52a on the back surface of the connection portion 52a. The plate 52b is a metal plate such as stainless steel (SUS), for example.

[0035] As shown in FIG. 4, the cable 52 loops in a substantially S shape inside the housing 12 from the connection portion 52a toward the display 16 (or the camera 17), and then passes from the edge portion 12d into the edge portion 11a of the lid body 11. The housing 12 can have a cable insertion hole 48b in the outer wall 48 (standing wall 21B) of the edge portion 12d.

[0036] The reference numeral 53 in FIGS. 3A to 4 is a support member for fixing the cable 52 and holding the S-shaped loop. The support member 53 is a strip plate provided so as to pass through the cable 52 in the width direction, and both ends are screwed to the inner surface 20a of the housing member 20. The S-shaped loop of the cable 52 is a portion that absorbs the extra length of the cable 52 when the lid body 11 rotates with respect to the housing 12.

[0037] As described above, in the present embodiment, a pair of left and right cables 52 are provided. For this reason, in the present embodiment, a pair of left and right connectors 54 and brackets 56 are also provided respectively. Only one cable 52 may be provided, or three or more cables 52 may be provided. In this case, the number of connectors 54 and brackets 56 may also be provided according to the number of cables 52.

[0038] The connector 54 is connected to the connection portion 52a of the cable 52. Each connector 54 is mounted on the second surface 25B of the motherboard 25. The connector 54 of the present embodiment is for connecting the cable 52, which is an FPC, to the motherboard 25, and is a so-called BtoB connector (connector for board-to-board).

[0039] The bracket 56 can be made of a metal plate such as stainless steel (SUS), for example. As shown in FIG. 2, the left and right brackets 56 can be used by arranging the same parts symmetrically left and right. The left and right brackets 56 may have different shapes. The bracket 56 is arranged so as to straddle the cable 52 in the width direction, and presses and holds the cable 52 from above the connection portion 52a and the connector 54. Thereby, the bracket 56 prevents the connection portion 52a from coming off the connector 54.

[0040] The bracket 56 can have a substantially bottle shape that is long in the X direction and narrow in the Y direction in plan view. The bracket 56 has a first end portion 56a on one side and a second end portion 56b on the other side in the direction (X direction) straddling the cable 52.

[0041] The first end portion 56a is a portion fastened to the second surface 25B of the motherboard 25 with a screw 58. A fastening hole 56a1 through which the screw 58 is inserted is formed through the first end portion 56a.

[0042] A stud component 60 for fastening the screw 58 is mounted on the second surface 25B. The stud component 60 is, for example, a columnar component soldered to the ground pattern 25b of the second surface 25B (see FIG. 5). The stud component 60 stands up from the second surface 25B in the Z2 direction. The stud component 60 has an upward female screw hole 60a that opens at the top surface and can fasten the screw 58.

[0043] As shown in FIGS. 2 to 3B and FIG. 5, the stud component 60 is arranged so as to be aligned in the X direction with respect to the stud component 42 that screws the leaf spring member 34a. The stud component 60 is arranged so as to sandwich the connector 54 (cable 52) between the stud component 60 and the stud component 42. The stud component 60 is located on the side opposite to the exhaust path 50 side in the X direction when viewed from the stud component 42. Thereby, the stud component 60 does not block the exhaust path 50 formed between the left and right stud components 42, 42.

[0044] The second end portion 56b is a portion pressed by a part of the thermal module 24 of the motherboard 25 (the leaf spring member 34a in this embodiment). That is, for the bracket 56, the first end portion 56a is screwed to the stud component 60, and the second end portion 56b is supported by the thermal module 24. Thereby, the bracket 56 is attached to the motherboard 25 and can press the cable 52 against the connector 54 from above (the Z2 side).

[0045] The second end portion 56b can be formed to be narrower in width in the Y direction than the first end portion 56a. For the bracket 56, the first end portion 56a can be on the side farther from the exhaust path 50 than the second end portion 56b. That is, the second end portion 56b is arranged on the side opposite to the exhaust path 50 side in the X direction when viewed from the stud component 42 for the leaf spring member 34a, and does not block the exhaust path 50.

[0046] As shown in FIGS. 2 to 3B and FIG. 5, screw fastening portions 62, protruding pieces 64, and stepped portions 66 can be provided at both end portions of the leaf spring member 34a on the Y2 side.

[0047] The screw fastening portion 62 is a portion for fixing the leaf spring member 34a to the motherboard 25. The screw fastening portion 62 has a through hole through which a screw 44 can be inserted and can be fastened to the stud component 42.

[0048] The protruding piece 64 is a plate piece provided so as to protrude from the screw fastening portion 62 toward the bracket 56 side. The protruding piece 64 protrudes from the screw fastening portion 62 on the side opposite to the exhaust path 50 side in the X direction. The protruding piece 64 can press the second end portion 56b of the bracket 56 from above (the Z2 side). Specifically, the second end portion 56b is inserted between the protruding piece 64 and the second surface 25B and is supported by the protruding piece 64.

[0049] The step portion 66 is a crank-shaped portion in the Z direction provided between the screwing portion 62 and the protruding piece 64. The step portion 66 arranges the height position of the protruding piece 64 from the second surface 25B of the motherboard 25 above the screwing portion 62. Thereby, the step portion 66 can eliminate the height difference between the second end portion 56b of the bracket 56 and the leaf spring member 34a (see Fig. 5).

[0050] As shown in Fig. 5, for example, the top surfaces of the stud parts 42 and 60 are at substantially the same height position from the second surface 25B. The protruding piece 64 would be at the same height as the top surface of the stud part 42 if there were no step portion 66. The first end portion 56a of the bracket 56 is also at the same height as the top surface of the stud part 60. Therefore, if the heights of the stud parts 42 and 60 are substantially the same, the second end portion 56b would be flush with the protruding piece 64 and abut against the protruding piece 64 if there were no step portion 66. In particular, the bracket 56 sandwiches the connector 54, the connecting portion 52a, the cable 52, the plate 52b, and a cushioning material 68 (described later) between itself and the second surface 25B. For this reason, it is also assumed that the second end portion 56b side inclines upward (Z2 side) from the first end portion 56a side (see Fig. 5). Thus, the leaf spring member 34a can surely press down the second end portion 56b from above by providing the step portion 66 in front of the protruding piece 64. The step portion 66 can be omitted depending on the height relationship of the stud parts 42 and 60, etc.

[0051] The second end portion 56b can have a pair of standing pieces 56b1 that stand up from both side portions in the width direction (Y direction). The standing pieces 56b1 stand up on the upper side (Z2 side) supported by the protruding piece 64. Thereby, the second end portion 56b has a groove shape with a substantially U-shaped cross section. The pair of standing pieces 56b1, 56b1 are arranged to sandwich the protruding piece 64 therebetween and are locked to the end faces on both sides in the width direction (Y direction) of the protruding piece 64. Thereby, the standing piece 56b1 serves as a rotation prevention to prevent the bracket 56 from rotating with the first end portion 56a as a fulcrum when the screw 58 is tightened. The standing piece 56b1 can also prevent the second end portion 56b, which is simply pressed by the protruding piece 64 from above, from being displaced in the Y direction and coming off the protruding piece 64.

[0052] As shown in FIGS. 3B and 5, the bracket 56 can have a conductive cushioning material 68 on the surface that presses against the cable 52. The cushioning material 68 can be formed of a sponge or the like having conductivity. The cushioning material 68 of the present embodiment is a conductive gasket. The cushioning material 68 is fixed to the surface of the bracket 56 with a double-sided adhesive tape or the like. The cushioning material 68 is pressed against the cable 52 (plate 52b) to electrically connect the bracket 56 and the cable 52. Thereby, the bracket 56 can ground the cable 52 to the ground pattern 25b via the screw 57 and the stud component 60.

[0053] As shown in FIG. 4, a conductive cushioning material 70 can also be fixed to the inner surface of the cover material 21. The cushioning material 70 can be formed of a sponge or the like having conductivity like the cushioning material 68, and is, for example, a conductive gasket. The cushioning material 70 is pressed against the surface of the bracket 56 on the Z2 side. Thereby, the bracket 56 can also ground the cable 52 to the housing member 20 via the cushioning materials 68 and 70 (frame ground).

[0054] As described above, the electronic device 10 of the present embodiment includes a substrate (motherboard 25) on which a heating element (for example, CPU 25a), a connector 54, and a stud component 60 are mounted, a thermal module 24 that cools the heating element, and a flat cable 52 having a connection portion 52a connected to the connector 54. Further, the electronic device 10 includes a bracket 56 that is provided so as to straddle the cable 52 in the width direction and holds the cable 52 from above the connector 54 and the connection portion 52a. The bracket 56 has a first end portion 56a on one side and a second end portion 56b on the other side in the direction straddling the cable 52. The first end portion 56a is screwed to the stud component 60. The second end portion 56b is pressed by a part of the thermal module 24.

[0055] Therefore, by supporting the cable 52 with the bracket 56, the electronic device 10 can prevent the connection of the cable 52 to the connector 54 from coming loose. Moreover, for the bracket 56, the first end 56a is screwed to the stud component 60, and the second end 56b is pressed by the thermal module 24. For this reason, for the attachment of one bracket 56, the electronic device 10 only needs to mount one stud component 60 on the motherboard 25. That is, the electronic device 10 does not need to use two stud components 60 for the attachment of one bracket 56. Therefore, the electronic device 10 can reduce the number of parts of the stud component 60 and can reduce the component cost. Also, since the number of stud components 60 mounted on the motherboard 25 of the electronic device 10 is halved, the space of the motherboard 25 can be saved. As a result, the electronic device 10 can be downsized in the housing 12 by saving space on the motherboard 25, and the influence on the E / E design can also be suppressed.

[0056] In this way, the second end 56b of the bracket 56 is supported from above by a part of the thermal module 24. For this reason, when removing the thermal module 24, for example, when replacing the CPU 25a, memory, etc. mounted on the motherboard 25, the electronic device 10 can easily remove the thermal module 24 without removing the bracket 56.

[0057] The thermal module 24 can have a heat dissipation member 32 capable of dissipating the heat of the heat generating body and a leaf spring member 34a for pressing the heat dissipation member 32 against the heat generating body. In this case, it is preferable that the second end 56b of the bracket 56 is pressed by the leaf spring member 34a. That is, due to the structure in which the leaf spring member 34a presses the heat dissipation member 32 against the heat generating body mounted on the motherboard 25, it is necessary to be fixed to the motherboard 25. In other words, at least the leaf spring member 34a among the components of the thermal module 24 is fixed to the motherboard 25. Therefore, by configuring the thermal module 24 to press the second end 56b with the leaf spring member 34a, the bracket 56 can be supported more stably and firmly.

[0058] When the electronic device 10 is based on the arrangement direction (X direction) of the pair of fans 36, 36, the left and right stud components 60 and brackets 56 can be arranged with a space serving as an exhaust path 50 from the air outlet 36b of each fan 36 toward the exhaust port 48a of the housing 12 therebetween. In this case, it is preferable that, for each bracket 56, the first end 56a is on the side farther from the exhaust path 50 than the second end 56b. Then, the electronic device 10 can avoid the stud component 60 that fastens the first end 56a of the bracket 56 from intervening in the exhaust path 50. Thereby, the air blowing efficiency of the fan 36 of the electronic device 10 is improved and the cooling capacity of the thermal module 24 is improved. That is, the electronic device 10 can also suppress the stud component 60 from affecting the thermal design by making it possible to attach one bracket 56 with one stud component 60.

[0059] Note that the present invention is not limited to the above-described embodiments, and it goes without saying that the present invention can be freely changed without departing from the gist of the present invention.

Explanation of Reference Numerals

[0060] 10 Electronic device 11 Cover 12 Housing 24 Thermal module 25 Motherboard 25a CPU 32 Heat dissipation member 34a Leaf spring member 36 Fan 42, 60 Stud components 48a Exhaust port 50 Exhaust path 52 Cable 52a Connection part 54 Connector 56 Bracket 56a First end 56b Second end 56b1 Upright piece 62 Screwing part 64 Protruding piece 66 Step part 68, 70 Cushioning materials

Claims

1. An electronic device, a substrate on which a heating element, a connector, and a stud component are mounted; a thermal module for cooling the heat generating element; a flat cable having a connection portion to be connected to the connector; a bracket that is provided across the cable in a width direction and holds the cable from above the connector and the connection portion; Equipped with The bracket has a first end portion on one side and a second end portion on the other side in a direction spanning the cable, the first end is threadedly fastened to the stud component; The second end is pressed by a portion of the thermal module.

1. An electronic device comprising:

2. 2. The electronic device according to claim 1, The thermal module comprises: A heat diffusion member capable of diffusing heat from the heat generating body; a leaf spring member for pressing the heat diffusion member against the heat generating body; having The second end of the bracket is pressed by the leaf spring member.

1. An electronic device comprising:

3. 3. The electronic device according to claim 2, The leaf spring member is A screw fastening portion that is screwed to the substrate; A protruding piece provided to protrude from the screw fastening portion; a step portion provided between the screw fastening portion and the protruding piece, the step portion causing the protruding piece to be positioned at a height position from the surface of the substrate higher than the screw fastening portion; having The second end of the bracket is inserted between the protruding piece and the surface of the board and is held down by the protruding piece.

1. An electronic device comprising:

4. 4. The electronic device according to claim 3, The second end of the bracket has a pair of upright pieces that are engaged with the end surfaces on both sides of the protruding piece.

1. An electronic device comprising:

5. The electronic device according to any one of claims 1 to 4, a housing that houses the substrate and the thermal module; a pair of fans mounted in the housing and arranged to straddle the thermal module between them, the pair of fans having outlets on opposing sides capable of discharging air toward the thermal module; Equipped with the housing has an exhaust port located between the pair of fans when taken along an arrangement direction of the pair of fans, The stud components and the brackets are provided in pairs, when a direction in which the pair of fans are arranged is taken as a reference, the pair of stud components and the bracket are arranged with a space therebetween that defines an exhaust path from the outlets of the pair of fans to the exhaust port, The pair of brackets have the first end portion farther from the exhaust path than the second end portion.

1. An electronic device comprising:

6. The electronic device according to any one of claims 1 to 4, The bracket is made of metal. The bracket has a conductive cushioning material on the surface that holds the cable.

1. An electronic device comprising:

Images