Winding device

Abstract

To provide a winding device capable of applying an adhesive to the entire circumference of a copper wire and preventing the coating film from being scraped off by a guide roller. 【Solution means】An adhesive is supplied to the applicator 20, and the copper wire 11 passes through the through-hole of the applicator 20. In the process of passing, the adhesive is evenly applied to the entire circumference of the copper wire 11. The applicator 20 is arranged on the downstream side of the guide roller 45. The coating film is not scraped off by the guide roller 45.

Description

Technical Field

[0001] The present invention relates to a winding device that applies an adhesive to a copper wire and winds the copper wire around a winding frame.

Background Art

[0002] A motor winding is one of the components that make up a motor. In a motor winding, a copper wire is densely wound around a winding frame. If the winding shape of the copper wire collapses, it will have an adverse effect on the performance of the motor. Therefore, it has been conventionally practiced to fix the copper wire with an adhesive.

[0003] For example, varnish is stored in a tank, and the copper wire wound with this varnish is immersed. When the varnish has impregnated even into the details, it is pulled up and dried. When pulled up, excess varnish drips. Also, drying takes about 24 hours. Therefore, the varnish dipping method results in wasteful use of varnish and low productivity, and there is room for improvement.

[0004] Therefore, as an improvement proposal, it has been proposed to apply the adhesive with a brush (see, for example, Patent Document 1 (FIG. 1)).

[0005] Patent Document 1 will be described based on the following figure. FIG. 11 is a diagram for explaining the basic configuration of a conventional winding device. In FIG. 11, when the winding frame 101 is rotated in a predetermined direction by the main shaft motor 102, the copper wire 103 is wound around the winding frame 101 while being guided by the drum 104, the first relay roller 105, the second relay roller 106, and the final relay roller 107.

[0006] A cylinder 108 and a brush 109 are arranged between the second relay roller 106 and the final relay roller 107, an appropriate amount of adhesive is discharged from the cylinder 108 onto the copper wire 103, and the discharged adhesive is spread by the brush 109.

[0007] Since it is guided by the second relay roller 106 and the final relay roller 107, the copper wire 103 does not sway left and right in the drawing between these rollers. Since the cylinder 108 and the brush 109 are arranged at this non-swaying position, the action of the brush 109, that is, its behavior, becomes constant. As a result, according to the technique of Patent Document 1, an effect that the coating thickness of the adhesive can be made constant is obtained.

[0008] However, it has been found that the technique of Patent Document 1 does not obtain sufficient effects under specific conditions. The specific condition is to apply the adhesive to the entire circumference in the cross-section of the copper wire 103. In the part of the winding frame 101, in order to strengthen the adhesion performance (fixing performance) between adjacent copper wires 103, it may be required to apply the adhesive to the entire circumference of the copper wire 103.

[0009] In the technique of Patent Document 1, since the adhesive is applied to only approximately half of the circumference of the copper wire 103, improvement is required. Therefore, the inventors considered adding a cylinder 108B and a brush 109B shown by imaginary lines in FIG. 11. This is because the adhesive can be applied to the entire circumference of the copper wire 103 in this way.

[0010] However, a problem occurs in that a part of the coating film discharged by the cylinder 108B and leveled by the brush 109B is scraped off by the final relay roller 107. Therefore, it has been found that this improvement plan is insufficient.

[0011] Therefore, as a technique alternative to the above improvement plan, a winding device that can apply the adhesive to the entire circumference of the copper wire 103 and the coating film is not scraped off by the final relay roller 107 is desired.

Prior Art Documents

Patent Documents

[0012]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0013] An object of the present invention is to provide a winding device capable of applying an adhesive to the entire circumference of a copper wire and preventing the coating film from being scraped off by a guide roller corresponding to the final relay roller.

Means for Solving the Problems

[0014] The inventors of the present invention have found that, if an applicator having a tapered hole is used, an appropriate amount of adhesive can be supplied to the tapered hole and the copper wire can be passed through the tapered hole, whereby the adhesive can be applied to the entire circumference of the copper wire. In addition, as shown in FIG. 11, the inventors have found that by arranging the applicator on the downstream side of the final relay roller 107, that is, between the final relay roller 107 and the winding frame 101, the coating film will not be scraped off by the final relay roller 107.

[0015] However, if the winding frame 101 has a rectangular cross section (square cross section or rectangular cross section), the copper wire 103 is largely displaced vertically in the drawing compared to a round cross section, and the copper wire 103 strongly contacts the tapered hole. If the degree of this contact exceeds the allowable range, it will hinder the running of the copper wire 103.

[0016] Therefore, a structure that allows the applicator to move up and down was considered. First, the vertical movement of the copper wire 103 was predicted or detected, and based on this prediction or detection information, it was considered to forcibly move the applicator up and down with an actuator. It is expected that the center of the copper wire 103 can be aligned with the center of the tapered hole, and a coating film with a constant film thickness can be formed on the entire circumference of the copper wire 103. However, it was found that the vertical movement of the copper wire 103 contains irregular elements, making prediction difficult and detection also difficult. In addition, there is also a problem that the procurement cost of the actuator and sensor increases.

[0017] In order to solve such problems, the inventors of the present invention conceived of using the copper wire 103 as a drive source when moving the applicator up and down. There is an advantage that an actuator and a sensor are not required. However, when the copper wire 103 moving upward lifts the applicator, the coating film on the upper side of the copper wire 103 becomes thin and the coating film on the lower side becomes thick. When the copper wire 103 moves downward, the coating film on the lower side becomes thin and the coating film on the upper side becomes thick. That is, in the new idea, the thickness of the coating film changes. It is necessary to examine whether this change is acceptable.

[0018] The form of the thickness of the coating film will be described again based on FIGS. 1(a) and (b). Note that the copper wire 103 is to be read as the copper wire 11. As shown in FIG. 1(a), at a certain part of the copper wire 11, the upper coating film 12 is thin and the lower coating film 12 is thick. As shown in FIG. 1(b), at another part of the copper wire 11, the lower coating film 12 is thin and the upper coating film 12 is thick.

[0019] However, as shown in FIG. 1(c), when winding around the winding frame 14, the adhesive 15 is pushed and moved by the adjacent copper wires 11. Apparently, fluidization occurs where a part of the thick coating film 12 flows into the thin coating film 12, and the space between the copper wires 11 is filled with the adhesive. Therefore, it was confirmed that the difference in the thickness of the coating film 12 shown in FIGS. 1(a) and (b) is acceptable.

[0020] Based on the above findings, an applicator having a tapered hole is adopted, and this applicator is arranged between the final relay roller and the winding frame, and a winding device is completed in which the applicator can move up and down using the copper wire as a drive source. Note that the up and down movement can also be the left and right movement (horizontal runout). The configuration of the completed winding device is as follows.

[0021] The invention according to claim 1 is a winding device for winding a copper wire guided by a cylindrical guide around a winding frame rotated by a main shaft motor, this winding device is provided with an applicator for applying an adhesive to the copper wire between the cylindrical guide and the winding frame, this applicator has a through-hole through which the copper wire passes, the diameter of the outlet of this through-hole corresponds to the outer diameter of the copper wire, and the diameter of the inlet is larger than that of the outlet without being constricted, Furthermore, the applicator is characterized in that it is movably supported when pushed by the copper wire that sways as the winding radius of the winding frame changes.

[0022] The invention according to claim 2 is a winding device according to claim 1, When adhesives with viscosities of 5 to 100 Pa·s are defined as medium-viscosity adhesives and those with lower fluidity than this medium-viscosity are defined as high-viscosity adhesives, the adhesive is a thermosetting adhesive that is medium-viscosity or high-viscosity and does not cure at normal temperature.

[0023] The invention according to claim 3 is a winding device according to claim 1, The through hole is a tapered hole.

[0024] The invention according to claim 4 is a winding device according to claim 1, This winding device further includes a bracket that is arranged at a certain distance from the winding frame and swings around a support shaft that is arranged parallel to the rotation axis of the winding frame. The applicator and the cylindrical guide are supported on this bracket.

[0025] The invention according to claim 5 is a winding device according to claim 1, This winding device further includes a bracket that is arranged at a certain distance from the winding frame and swings around a support shaft that is arranged parallel to the rotation axis of the winding frame. The cylindrical guide is supported on this bracket, and the applicator is supported by this cylindrical guide.

[0026] The invention according to claim 6 is a winding device according to claim 1, This winding device further includes a bracket that is arranged at a certain distance from the winding frame and swings around a support shaft that is arranged parallel to the rotation axis of the winding frame. The applicator is supported on this bracket.

Advantages of the Invention

[0027] In the invention according to claim 1, the applicator has a through hole, and an adhesive is supplied to this through hole. Then, a copper wire is passed through the through hole. Since the adhesive accumulates at the outlet of the through hole, the adhesive is applied to the entire circumference of the copper wire. In addition, since the applicator is arranged closer to the winding frame than the guide roller, the coating film is not scraped off by the guide roller. Therefore, according to the present invention, there is provided a winding device capable of applying an adhesive to the entire circumference of a copper wire and preventing the coating film from being scraped off by a guide roller.

[0028] In the invention according to claim 2, the adhesive is a thermosetting adhesive having medium viscosity or high viscosity and not curing at normal temperature. Since it has medium viscosity or high viscosity, there is no concern about the adhesive leaking from the inlet of the applicator.

[0029] In the invention according to claim 3, the through hole is a tapered hole. The through hole may be a multi-stage hole, but in the case of a multi-stage hole, the adhesive does not smoothly move toward the outlet. In this regard, if it is a tapered hole, the adhesive smoothly moves toward the outlet.

[0030] In the invention according to claim 4, it is provided with a swinging bracket, and the applicator and the cylindrical guide are supported by this bracket. Although the bracket is large and heavy, the applicator and the cylindrical guide can be moved together.

[0031] In the invention according to claim 5, it is provided with a swinging bracket, and the cylindrical guide is supported by this bracket. The applicator is supported by the cylindrical guide. The bracket can be made smaller and lighter.

[0032] In the invention according to claim 6, it is provided with a swinging bracket, and the applicator is supported by this bracket. The bracket can be made even smaller and lighter.

Brief Description of the Drawings

[0033]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Mode for Carrying Out the Invention

[0034] Embodiments of the present invention will be described below based on the accompanying drawings.

Examples

[0035] [Coating tool] As shown in FIG. 2(a), the coating tool 20 has a through hole 21 through which the copper wire 11 passes. This through hole 21 is a tapered hole, with the outlet 22 having a small diameter and the inlet 23 having a large diameter. As shown in FIG. 2(b), the coating tool 20 has a through hole 21 through which the copper wire 11 passes. This through hole 21 is a multi-stage hole, with the outlet 22 having a small diameter and the inlet 23 having a large diameter.

[0036] As shown in Fig. 2(c), the applicator 20 has a through-hole 21 through which the copper wire 11 passes. This through-hole 21 is a hole in which one end of a straight hole is blocked by an end plate and an outlet 22 is provided in the end plate, and the outlet 22 has a small diameter and the inlet 23 has a large diameter. Note that the inlet 23 is not constricted in any of Figs. 2(a) to 2(c).

[0037] In addition, the inlet 23 may be a round hole as shown in Fig. 2(d), an oval hole as shown in Fig. 2(e), or an oblong hole as shown in Fig. 2(f). In Fig. 6 described later, the slide base 47 moves by the feed motor 53. When the copper wire 11 sways horizontally as this movement occurs, this sway can be more preferably absorbed by the oval hole or the oblong hole.

[0038] [Correlation between the applicator and the adhesive dispenser] As shown in Fig. 3(a), the adhesive dispenser 30 has a needle 31 that can be bent and deformed at the tip. And in addition to the through-hole 21, the applicator 20 has a needle insertion hole 24 that communicates from the outside to the through-hole 21, and a fixing bolt 25 that fixes the needle 31 inserted into the needle insertion hole 24. By fixing with the fixing bolt 25, the applicator 20 is mechanically connected to the adhesive dispenser 30.

[0039] [Adhesive] The adhesive 15 is a thermosetting adhesive that does not cure at room temperature. In addition, the viscosity of the adhesive 15 is medium viscosity (5 to 100 Pa·s) or high viscosity (100 Pa·s or more).

[0040] In Fig. 3(a), if the adhesive 15 supplied to the through-hole 21 through the needle 31 is hypothetically of low viscosity, there is a possibility of leakage from the inlet 23. If it is medium or high viscosity, since the fluidity is low, it is carried by the copper wire 11 and heads toward the outlet 22. As a result, there is no leakage from the inlet 23. The adhesive 15 is blocked by the outlet 22 and adheres to the outer surface of the copper wire 11. As a result, a copper wire 11 coated with the adhesive 15 evenly all around is obtained.

[0041] [Hole diameter of the outlet of the through hole] The through hole 21 is set to have a hole diameter such that the outlet 22 has a gap t for applying an adhesive added to the outer diameter D of the copper wire 11. That is, the outlet 22 is set to have a hole diameter corresponding to the outer diameter of the copper wire 11.

[0042] As shown in Fig. 3(b), a sufficiently long flexible tube 32 may be interposed between the applicator 20 and the adhesive dispenser 30. According to this structure, it is not necessary to move the adhesive dispenser 30 together with the applicator 20, and the adhesive dispenser 30 can be fixed.

[0043] Also, as shown in Fig. 3(c), the needle 31 may be arranged outside the inlet 23 without being attached to the applicator 20. Therefore, the adhesive dispenser 30 can be arbitrarily arranged with respect to the applicator 20.

[0044] However, in the case of Fig. 3(a), there is an advantage that the procurement cost of the flexible tube 32 can be reduced and the compactness in the left - right direction of the drawing can be achieved. Also, in the case of Fig. 3(c), there is an advantage that the applicator 20 can be made smaller.

[0045] [Reasons for moving the applicator] As shown in Fig. 4(a), when the winding frame 14 has a square (or rectangular) cross - section, the winding radius of the winding frame 14 changes like R1 and R2. Along with this change, the copper wire 11 sways. If the applicator 20 cannot move up and down, the copper wire 11 strongly presses the applicator 20, and the outlet 22 of the applicator 20 wears out, causing a problem that the applicator 20 is damaged.

[0046] As shown in Fig. 4(b), prepare a bracket 36 that is arranged at a certain distance from the winding frame 14 and swings (rotates) about a support shaft 35 arranged parallel to the rotation shaft 34 of the winding frame 14, and attach the coating tool 20 to this bracket 36. Then, when the copper wire 11 rises, the copper wire 11 pushes up the outlet 22, the bracket 36 rotates clockwise in the drawing, and the rise of the coating tool 20 is allowed. When the copper wire 11 descends, the copper wire 11 pushes down the outlet 22, the bracket 36 rotates counterclockwise in the drawing, and the descent of the coating tool 20 is allowed. Then, the forms shown in Figs. 1(a) and (b) are realized.

[0047] As shown in Fig. 4(c), the coating tool 20 may be movably supported by a guide 37.

[0048] [Reasons for making the inlet of the coating tool have a large diameter] Fig. 5(a) shows a comparative example. In this coating tool 110, the inlet 112 of the tapered hole 111 is also constricted. Then, it becomes difficult for the adhesive 113 to leak from the inlet 112, and the tapered hole 111 is filled. By adopting this structure, there is an advantage that the adhesive 113 can be evenly applied to the copper wire 114. In addition, since the inlet 112 is constricted, there is also an advantage that it becomes difficult for the adhesive 113 to leak, and a low-viscosity adhesive can be used.

[0049] Fig. 5(b) is an operation diagram of Fig. 5(a). However, the adhesive 113 is omitted for clarity of the drawing. When the copper wire 114 swings upward, the copper wire 114 hits the inlet 112 and the outlet 115 and becomes curved. When the degree of curvature increases, it hinders the running of the copper wire 114. That is, since it contacts at two places, the inlet 112 and the outlet 115, the frictional resistance due to the contact increases.

[0050] It is known that the coefficient of friction on a dry surface is large and the coefficient of friction on a wet surface is small. It is said that the coefficient of friction on a dry surface is about 10 times that on a wet surface. As shown in Fig. 5(a), at the outlet 115, since the copper wire 114 is wetted by the adhesive 113, the friction coefficient is small. On the contrary, at the inlet 112, since the copper wire 114 is not wetted by the adhesive 113, the friction coefficient is large. As a result, when the copper wire 114 vibrates, it hinders the running of the copper wire 114.

[0051] In the embodiment shown in Fig. 5(c), since the inlet 23 of the through hole 21 is not constricted, the adhesive cannot be stored. There is a risk that the low-viscosity adhesive will leak from the inlet 23. However, as shown in Fig. 5(d), the curved copper wire 11 hits the outlet 22 but does not hit the inlet 23. Since it only contacts the outlet 22, the frictional resistance due to the contact becomes small.

[0052] In addition, at the outlet 22, the friction coefficient on the wet surface is applied, and since this friction coefficient is small, the frictional resistance at the outlet 22 is significantly reduced. As a result, although the copper wire 11 vibrates up and down and contacts the applicator 20, smooth running is maintained. As described above, by making the diameter large without constricting the inlet 23, special effects are exhibited.

[0053] The winding device 40 including the winding frame 14, the applicator 20, the adhesive dispenser 30, and the bracket 36 described above will be described with reference to Figs. 6 and 7. As shown in Fig. 6, the winding device 40 includes a winding frame 14, a spindle motor 41 that rotates the winding frame 14 in a predetermined direction, a support shaft 35 arranged parallel to the rotation shaft 34 of the winding frame 14, a bracket 36 supported by this support shaft 35 and extending toward the winding frame 14, and an applicator 20, a cylindrical guide 43, a guide roller 45, and an adhesive dispenser 30 supported by this bracket 36.

[0054] Fig. 7 is a cross-sectional view taken along line 7-7 of Fig. 6. As shown in Fig. 7, a slide base 48 is placed on the side guide 47, a stay 49 is erected from this slide base 48, and the support shaft 35 is rotatably supported by this stay 49. A nut 51 is attached to the slide base 48, and a feed screw 52 is screwed into this nut 51.

[0055] In FIG. 6, when the feed screw 52 is rotated by the feed motor 53, the slide base 48 reciprocates while being guided by the side guide 47. By this movement, a plurality of copper wires 11 are wound around the winding frame 14. When this reciprocating movement occurs, the cylindrical guide 43 holds the copper wire 11 so that the copper wire 11 does not come off from the guide roller 45.

[0056] Also, after a predetermined number of turns of the copper wire 11 are wound around the winding frame 14, the adhesive dispenser 30 stops discharging the adhesive. That is, the adhesive dispenser 30 is controlled for intermittent operation of discharging and stopping the adhesive. The rotation of the winding frame and the discharge (supply) of the adhesive are synchronized, and by intermittent operation, a predetermined winding can be performed without excess adhesive accumulating.

[0057] In FIG. 7, since the winding frame 14 has a square cross section, the winding radius changes as it rotates. Due to this change, the copper wire 11 sways. Following this sway, the applicator 20 swings (rotates) about the support shaft 35 together with the cylindrical guide 43, the guide roller 45, and the bracket 36.

[0058] [Modification example of the winding device] Next, a modification example of the winding device 40 will be described. FIG. 8(a) is a plan view similar to FIG. 6, FIG. 8(b) is a cross-sectional view similar to FIG. 7, and FIG. 8(c) is an enlarged view of part c of FIG. 8(b). As shown in FIG. 8(c), one end of the cylindrical guide 43 was extended and screwed to the applicator 20. By this connection, the cylindrical guide 43 can support the applicator 20. As a result, as shown in FIGS. 8(a) and 8(b), the bracket 36 can be made smaller. Since the other components are the same as those in FIGS. 6 and 7, the reference numerals in FIGS. 6 and 7 are used, and detailed description is omitted.

[0059] [Further modification example of the winding device] Next, a further modification example of the winding device 40 will be described. FIG. 9(a) is a plan view similar to FIG. 6, and FIG. 9(b) is a cross-sectional view similar to FIG. 7. As shown in FIG. 9(b), extend the slide base 48, and support the cylindrical guide 43 and the guide roller 45 with this slide base 48. As shown in FIG. 9(a), the applicator 20 and the adhesive dispenser 30 are placed on the swinging bracket 36. Although the slide base 48 becomes larger, the bracket 36 can be made smaller and lighter.

[0060] Also, as shown in FIG. 10, by interposing a flexible tube 32 between the applicator 20 and the adhesive dispenser 30, the adhesive dispenser 30 is placed on the slide base 48. Thereby, only the applicator 20 may be supported by the bracket 36. Further reduction in size and weight of the swinging bracket 36 can be achieved.

[0061] In the present invention, the bracket 36 is swung as a drive source for the copper wire 11. The force that pushes the outlet of the applicator 20 by the copper wire 11 is proportional to the mass of the bracket 36. The lighter the bracket 36, the smaller the frictional force due to contact, the smaller the wear amount, and the longer the life of the applicator 20. Therefore, by reducing the weight of the bracket 36, a certain effect can be obtained.

[0062] Summarizing the invention described above, it is as follows. As shown in FIG. 6, the present invention relates to a winding device 40 that winds a copper wire 11 guided by a cylindrical guide 43 around a winding frame 14 rotated by a main shaft motor 41. This winding device 40 includes an applicator 20 that applies an adhesive 15 to the copper wire 11 between the cylindrical guide 43 and the winding frame 14.

[0063] Then, as shown in FIGS. 2(a) to 2(c), the applicator 20 has a through hole 21 through which the copper wire 11 passes. The through hole 21 has an outlet 22 with a hole diameter corresponding to the outer diameter D of the copper wire 11, and an inlet 23 that is not constricted and has a larger diameter than the outlet 22. Then, as shown in FIGS. 4(a) to 4(c), the applicator 20 is movably supported when pushed by the copper wire 11 that sways as the winding radii R1 and R2 of the winding frame 14 change.

[0064] Then, as shown in FIGS. 3(a) to 3(c), the adhesive 15 supplied to the through hole 21 is blocked at the outlet 22 of the through hole 21. As a result, the adhesive 15 contacts the entire circumference of the copper wire 11 evenly. Furthermore, the applicator 20 is disposed on the downstream side of the cylindrical guide 43. Since a guide roller is disposed on the upstream side of the cylindrical guide 43, the coating film is not scraped off by this guide roller.

[0065] Preferably, when an adhesive having a viscosity of 5 to 100 Pa·s is defined as a medium viscosity adhesive and an adhesive having a lower fluidity than this medium viscosity is defined as a high viscosity adhesive, the adhesive 15 is a thermosetting adhesive 15 that has a medium viscosity or a high viscosity and does not cure at room temperature.

[0066] If it has a medium viscosity or a high viscosity, the adhesive 15 goes toward the outlet 22 together with the copper wire 11. As a result, even if the inlet 23 of the through hole 21 is a large-diameter hole, the adhesive 11 does not leak from this large-diameter hole.

[0067] Preferably, the through hole 21 is a tapered hole. If it is a tapered hole as compared with a stepped hole, the adhesive 11 can be made to go toward the outlet 22 more smoothly together with the copper wire 11, and in addition, the adhesive 11 is applied while being gradually pushed toward the copper wire 11. As a result, a more preferable coating film is obtained.

[0068] Then, as shown in FIG. 7, the winding device 40 further includes a bracket 36 that is disposed at a certain distance from the winding frame 14 and swings about a support shaft 35 that is disposed parallel to the rotation shaft 34 of the winding frame 14. The coating tool 20 and the cylindrical guide 43 are supported by the bracket 36.

[0069] The moving forms of the coating tool 20 and the cylindrical guide 43 can be preferably adjusted according to the swing of the copper wire 11.

[0070] Also, as shown in FIGS. 8(a) and 8(b), the winding device 40 further includes a bracket 36 that is disposed at a certain distance from the winding frame 14 and swings about a support shaft 35 that is disposed parallel to the rotation shaft 34 of the winding frame 14. The cylindrical guide 43 is supported by the bracket 36, and the coating tool 20 is supported by the cylindrical guide 43.

[0071] Since the cylindrical guide 43 is supported by the bracket 36 and the coating tool 20 is supported by the cylindrical guide 43, the bracket 36 can be downsized and lightened.

[0072] Also, as shown in FIGS. 9(a), 9(b) or FIG. 10, the winding device 40 further includes a bracket 36 that is disposed at a certain distance from the winding frame 14 and swings about a support shaft 35 that is disposed parallel to the rotation shaft 34 of the winding frame 14. The coating tool 20 is supported by the bracket 36.

[0073] Since only the coating tool 20 is supported by the bracket 36, the bracket 36 can be further downsized and lightened.

[0074] Note that FIG. 6 is shown as a plan view, but it may be a front view. That is, in addition to the device in which the rotation shaft 34 of the winding frame 14 is a horizontal axis, the device may have a vertical axis or an inclined axis.

Industrial Applicability

[0075] The present invention is suitable for a winding device that winds an adhesive-coated copper wire around a winding frame.

Explanation of Signs

[0076] 11…Copper wire, 12…Coating film, 14…Winding frame, 15…Adhesive, 20…Coating tool, 21…Through hole, 22…Outlet, 23…Inlet, 34…Rotating shaft, 35…Support shaft, 36…Bracket, 40…Winding device, 41…Spindle motor, 43…Cylindrical guide, 45…Guide roller, D…Outer diameter of copper wire, R1, R2…Winding radius.

Claims

1. A winding device for winding a copper wire guided by a cylindrical guide around a winding frame rotated by a spindle motor, wherein the winding device includes an applicator for applying an adhesive to the copper wire between the cylindrical guide and the winding frame, the applicator has a through hole through which the copper wire passes, the through hole has an outlet with a hole diameter corresponding to the outer diameter of the copper wire, and an inlet with a larger diameter than the outlet without being constricted, and further, the applicator is movably supported when pushed by the copper wire that sways as the winding radius of the winding frame changes. The winding device is characterized by this.

2. The winding device according to claim 1, when an adhesive with a viscosity of 5 to 100 Pa·s is defined as a medium viscosity and an adhesive with lower fluidity than this medium viscosity is defined as a high viscosity, the adhesive is a thermosetting adhesive that is of medium viscosity or high viscosity and does not cure at normal temperature. The winding device is characterized by this.

3. The winding device according to claim 1, wherein the through hole is a tapered hole. The winding device is characterized by this.

4. The winding device according to claim 1, wherein the winding device further includes a bracket that is arranged at a certain distance from the winding frame and swings around a support shaft arranged parallel to the rotation axis of the winding frame, and the applicator and the cylindrical guide are supported on this bracket. The winding device is characterized by this.

5. The winding device according to claim 1, wherein the winding device further includes a bracket that is arranged at a certain distance from the winding frame and swings around a support shaft arranged parallel to the rotation axis of the winding frame, the cylindrical guide is supported on this bracket, and the applicator is supported by this cylindrical guide. The winding device is characterized by this.

6. The winding device according to claim 1, wherein the winding device further includes a bracket that is arranged at a certain distance from the winding frame and swings around a support shaft arranged parallel to the rotation axis of the winding frame, and the applicator is supported on this bracket. The winding device is characterized by this.

Images