Multilayer coil component

The laminated coil component addresses the trade-off between stress relaxation and strength by using an inorganic material layer with a metal material to enhance thermal stability and structural integrity.

JP7708208B2Active Publication Date: 2025-07-15MURATA MFG CO LTD
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Patent Information

Application Number
JP2023561520
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Priority Date
2021-11-19
Filing Date
2022-11-02
Publication Date
2025-07-15
Estimated Expiration
2042-11-02

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Abstract

A stacked coil component 1 comprises: a laminate 10 in which a plurality of insulation layers 41-45 have been laminated; a coil 20 formed by electrically connecting a plurality of coil conductors 51-54 laminated together with the insulation layers 41-45 and embedded in the laminate 10; and an external electrode 30 provided on an outer surface of the laminate 10 and electrically connected to the coil 20. An inorganic material layer 70 is provided to at least a portion of an interface between the insulation layers 41-45 and the coil conductors 51-54, and the inorganic material layer 70 comprises an inorganic material 71 and a metal material 72 differing from the inorganic material 71. In the inorganic material layer 70, the metal material 72 is interposed between particles of the inorganic material 71 or between porous bodies formed from the inorganic material 71.
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Description

Technical Field

[0001] The present invention relates to a multilayer coil component.

Background Art

[0002] Patent Document 1 discloses an electronic component including a base body and a coil provided inside the base body, wherein the base body has a sintered first portion and a second portion located within the first portion and made of unsintered powder, and the coil is disposed within the second portion and covered with the powder constituting the second portion.

[0003] Patent Document 2 discloses a multilayer coil component including a base body containing a magnetic material, a coil including a plurality of internal conductors spaced apart from each other in a first direction and electrically connected to each other within the base body, and a plurality of stress relaxation spaces in contact with the surfaces of the internal conductors and in which powder exists. The base body has a base body region located between adjacent internal conductors in the first direction, each stress relaxation space has a first boundary surface with each internal conductor and a second boundary surface with the base body region, the first boundary surface and the second boundary surface face each other in the first direction, and the distance from the first boundary surface to the second boundary surface is smaller than the thickness of the base body region in the first direction.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0005] According to Patent Document 1, since the coil is disposed in the second portion made of unsintered powder, the internal stress generated in the element body can be relaxed by the powder constituting the second portion, and it is said that the occurrence of cracks can be suppressed. However, since the second portion is composed of powder, there arises a problem that the strength of the element body decreases.

[0006] According to Patent Document 2, since each stress relaxation space where the powder exists is in contact with the surface of each internal conductor and each stress relaxation space is interposed between each internal conductor and the element body region, the internal stress generated in the element body can be relaxed, and it is said that the occurrence of cracks can be suppressed. However, since the stress relaxation space is composed of powder, there arises a problem that the strength of the element body decreases as in Patent Document 1.

[0007] The present invention has been made to solve the above problems, and an object thereof is to provide a laminated coil component having a stress relaxation effect and high strength.

Means for Solving the Problems

[0008] The laminated coil component of the present invention includes a laminate in which a plurality of insulating layers are laminated, a coil formed by electrically connecting a plurality of coil conductors laminated together with the insulating layers and embedded in the laminate, and an external electrode provided on an outer surface of the laminate and electrically connected to the coil. An inorganic material layer is provided on at least a part of an interface between the insulating layer and the coil conductor, and the inorganic material layer includes an inorganic material and a metal material different from the inorganic material. In the inorganic material layer, the metal material is interposed between particles of the inorganic material or between porous bodies made of the inorganic material.

Effects of the Invention

[0009] According to the present invention, it is possible to obtain a stress relaxation effect and provide a laminated coil component having high strength.

Brief Description of the Drawings

[0010]

Figure 1

Figure 2

Figure 3

Figure 4

[0011] Hereinafter, the laminated coil component of the present invention will be described. However, the present invention is not limited to the following configuration, and can be appropriately modified and applied without departing from the gist of the present invention. In addition, a combination of two or more of the individual desirable configurations of the present invention described below is also the present invention.

[0012] FIG. 1 is a perspective view schematically showing an example of the laminated coil component of the present invention. FIG. 2 is a cross-sectional view taken along line II-II of the laminated coil component shown in FIG. 1. Note that the shapes and arrangements of the laminated coil component and each component are not limited to the illustrated examples.

[0013] The laminated coil component 1 shown in FIGS. 1 and 2 includes a laminate 10, a coil 20, and an external electrode 30.

[0014] The laminate 10 has, for example, a substantially rectangular parallelepiped shape having six faces. The laminate 10 preferably has rounded corners and ridgelines. A corner is a portion where three faces of the laminate 10 intersect, and a ridgeline is a portion where two faces of the laminate 10 intersect.

[0015] In FIGS. 1 and 2, the length direction, width direction, and height direction in the multilayer coil component 1 and the laminate 10 are shown as the L direction, W direction, and T direction, respectively. The length direction L, width direction W, and height direction T are orthogonal to each other. The mounting surface of the multilayer coil component 1 is, for example, a surface (LW surface) parallel to the length direction L and the width direction W.

[0016] The laminate 10 shown in FIGS. 1 and 2 has a first end face 11 and a second end face 12 facing each other in the length direction L, a first main face 13 and a second main face 14 facing each other in the height direction T orthogonal to the length direction L, and a first side face 15 and a second side face 16 facing each other in the width direction W orthogonal to the length direction L and the height direction T.

[0017] The laminate 10 is formed by laminating a plurality of insulating layers (in the example shown in FIG. 2, insulating layers 41, 42, 43, 44, and 45). In the example shown in FIG. 2, the insulating layers 41, 42, 43, 44, and 45 are laminated along the height direction T. The number of insulating layers to be laminated is not particularly limited as long as it is two or more.

[0018] The coil 20 is formed by electrically connecting a plurality of coil conductors (in the example shown in FIG. 2, coil conductors 51, 52, 53, and 54) embedded in the laminate 10. In the example shown in FIG. 2, the coil conductors 51, 52, 53, and 54 are laminated together with the insulating layers 41, 42, 43, 44, and 45. Therefore, the coil axis of the coil 20 is along the height direction T.

[0019] In the example shown in FIG. 2, the coil conductor 51 and the coil conductor 52 are connected via a via conductor 61, the coil conductor 52 and the coil conductor 53 are connected via a via conductor 62, and the coil conductor 53 and the coil conductor 54 are connected via a via conductor 63.

[0020] The external electrodes 30 are provided on the outer surface of the laminate 10 and are electrically connected to the coil 20. The external electrodes 30 include, for example, a first external electrode 31 and a second external electrode 32.

[0021] The first external electrode 31 covers, for example, as shown in FIG. 1, the first end face 11 of the laminate 10, extends from the first end face 11, and covers a part of the first main face 13, a part of the second main face 14, a part of the first side face 15, and a part of the second side face 16. Further, the second external electrode 32 covers, for example, as shown in FIG. 1, the second end face 12 of the laminate 10, extends from the second end face 12, and covers a part of the first main face 13, a part of the second main face 14, a part of the first side face 15, and a part of the second side face 16. In this case, the second main face 14 can be used as the mounting surface.

[0022] Although not shown in FIGS. 1 and 2, for example, the coil conductor 51 constituting the coil 20 is drawn out to the first end face 11 of the laminate 10, and the coil conductor 54 constituting the coil 20 is drawn out to the second end face 12 of the laminate 10. As a result, it is preferable that the first external electrode 31 is electrically connected to the coil conductor 51 at the first end face 11, and it is preferable that the second external electrode 32 is electrically connected to the coil conductor 54 at the second end face 12.

[0023] By changing the position where the coil conductor 51 or 54 is drawn out to the outside of the laminate 10, the connection position between the coil 20 and the external electrode 30 can be changed. That is, the coil 20 and the external electrode 30 may be electrically connected at the end face of the laminate 10, or may be electrically connected at the main face or side face of the laminate 10.

[0024] As shown in FIG. 2, an inorganic material layer 70 is provided on at least a part of the interface between the insulating layer and the coil conductor. In the example shown in FIG. 2, the inorganic material layer 70 is provided at each of the interfaces between the insulating layer 41 and the coil conductor 51, between the insulating layer 42 and the coil conductor 52, between the insulating layer 43 and the coil conductor 53, and between the insulating layer 44 and the coil conductor 54. However, the inorganic material layer 70 may be provided on at least one interface. The inorganic material layer 70 may be provided over the entire interface, or may be provided on a part of each interface.

[0025] Although not shown in Fig. 2, an inorganic material layer 70 may be provided on at least a part of the interface between the insulating layer 42 and the coil conductor 51, the interface between the insulating layer 43 and the coil conductor 52, the interface between the insulating layer 44 and the coil conductor 53, and the interface between the insulating layer 45 and the coil conductor 54. In that case, the inorganic material layer 70 may be provided on at least one interface. The inorganic material layer 70 may be provided over the entire interface or on a part of each interface.

[0026] Fig. 3 is a cross-sectional view schematically showing an example of the inorganic material layer.

[0027] As shown in Fig. 3, the inorganic material layer 70 includes an inorganic material 71 and a metal material 72 different from the inorganic material 71. Therefore, the inorganic material layer 70 includes a first region 81 where the inorganic material 71 exists and a second region 82 where the metal material 72 exists. Although not shown in Fig. 3, the inorganic material layer 70 may further include a third region where neither the inorganic material 71 nor the metal material 72 exists. The third region where neither the inorganic material 71 nor the metal material 72 exists in the inorganic material layer 70 is preferably a cavity portion.

[0028] By providing the inorganic material layer 70 between the insulating layer and the coil conductor (for example, between the insulating layer 41 and the coil conductor 51), the stress generated in the laminate 10 due to the difference in the thermal shrinkage rate between the insulating layer and the coil conductor can be relieved.

[0029] Since the inorganic material layer 70 includes not only the inorganic material 71 but also the metal material 72, the difference in the coefficient of thermal expansion between the inorganic material layer 70 and the insulating layer or the coil conductor can be reduced. At this time, the coefficient of thermal expansion of the inorganic material layer 70 is preferably a value between the coefficient of thermal expansion of the insulating layer and the coefficient of thermal expansion of the coil conductor. More preferably, the coefficient of thermal expansion of the inorganic material layer 70 is a value between the coefficient of thermal expansion of the insulating layer and the coefficient of thermal expansion of the coil conductor and is about the average value of the coefficient of thermal expansion of the insulating layer and the coefficient of thermal expansion of the coil conductor ± 30%. More preferably, the coefficient of thermal expansion of the inorganic material layer 70 is a value between the coefficient of thermal expansion of the insulating layer and the coefficient of thermal expansion of the coil conductor, and is about the average value of the coefficient of thermal expansion of the insulating layer and the coefficient of thermal expansion of the coil conductor ± 10%. The coefficient of thermal expansion can be determined, for example, as the average coefficient of thermal expansion from room temperature (20 ° C) to 600 ° C using a thermomechanical analysis (TMA) apparatus.

[0030] Furthermore, in the inorganic material layer 70, as shown in FIG. 3, a metal material 72 is interposed between the particles of the inorganic material 71 or between the porous bodies made of the inorganic material 71. Therefore, the strength of the laminate 10 can be increased as compared with the case where a stress relaxation portion composed of powder as described in Patent Documents 1 and 2 is provided.

[0031] The thickness of the inorganic material layer 70 is preferably smaller than the thickness of the coil conductor such as the coil conductor 51. When the inorganic material layer 70 is provided at a plurality of interfaces, the thicknesses of the inorganic material layers 70 may be the same or different.

[0032] For example, the thickness of the inorganic material layer 70 may be greater than 0 μm and 1.5 μm or less. When the thickness of the inorganic material layer 70 is 1.5 μm or less, the resistance is lowered and the volume of the laminate relatively increases, thereby improving the coil characteristics. When the inorganic material layer 70 is provided at a plurality of interfaces, if the thickness of any of the inorganic material layers 70 is greater than 0 μm and 1.5 μm or less, it can be said that the thickness of the inorganic material layer 70 is greater than 0 μm and 1.5 μm or less. More preferably, the thicknesses of all the inorganic material layers 70 are greater than 0 μm and 1.5 μm or less.

[0033] When the thickness of the inorganic material layer 70 is greater than 0 μm and 1.5 μm or less, the thickness of the inorganic material layer 70 is preferably 25% or more with respect to the thickness of the coil conductor. In this case, the thickness of the coil conductor is 6.0 μm or less. When the thickness of the coil conductor is relatively small in this way, if the thickness of the inorganic material layer 70 is 25% or more with respect to the thickness of the coil conductor, a more sufficient stress relaxation effect can be maintained. In addition, when the thicknesses of the plurality of coil conductors are not the same, the ratio of the thickness of the inorganic material layer 70 to the thickness of the coil conductor in contact with the interface where the inorganic material layer 70 is provided may be calculated.

[0034] Alternatively, the thickness of the inorganic material layer 70 may be greater than 2 μm. When the thickness of the inorganic material layer 70 is greater than 2 μm, the stress relaxation effect becomes greater. In addition, when the inorganic material layer 70 is provided at a plurality of interfaces, if the thickness of any one of the inorganic material layers 70 is greater than 2 μm, it can be said that the thickness of the inorganic material layer 70 is greater than 2 μm. It is more preferable that the thicknesses of all the inorganic material layers 70 are greater than 2 μm.

[0035] When the thickness of the inorganic material layer 70 is greater than 2 μm, the thickness of the inorganic material layer 70 is preferably 15% or less with respect to the thickness of the coil conductor. In this case, the thickness of the coil conductor is 50 / 3 μm or more. Thus, when the thickness of the coil conductor is relatively large, if the thickness of the inorganic material layer 70 is 15% or less with respect to the thickness of the coil conductor, the volume of the relative laminate can be increased, and the coil characteristics are improved. In addition, when the thicknesses of the plurality of coil conductors are not the same, the ratio of the thickness of the inorganic material layer 70 to the thickness of the coil conductor in contact with the interface where the inorganic material layer 70 is provided may be calculated.

[0036] The thickness of the inorganic material layer 70 and the thickness of the coil conductor refer to the thickness in a direction parallel to the lamination direction passing through the center of the width of the coil conductor when polishing is performed up to the substantially central portion in the width direction W of the laminate 10 and observing a cross section (also referred to as an LT cross section) including the length direction L and the height direction T.

[0037] When viewed from the direction in which the coil conductor such as the coil conductor 51 extends, the width of the inorganic material layer 70 may be the same as the width of the coil conductor or may be smaller than the width of the coil conductor. When the inorganic material layer 70 is provided at a plurality of interfaces, the widths of the inorganic material layers 70 may be the same or different from each other.

[0038] In the inorganic material layer 70, the ratio of the first region 81 where the inorganic material 71 is present to the total of the first region 81 and the second region 82 where the metal material 72 is present is preferably 20% or more and 80% or less, and more preferably 50% or more and 80% or less.

[0039] Note that the ratio of the first region 81 and the ratio of the second region 82 in the inorganic material layer 70 can be calculated by performing polishing up to the substantially central portion in the width direction W of the laminate 10 and observing a cross section (also referred to as an LT cross section) including the length direction L and the height direction T, and obtaining the area of the first region 81 where the inorganic material 71 is present and the area of the second region 82 where the metal material 72 is present.

[0040] As shown in FIG. 3, the inorganic material layer 70 is preferably joined to an insulating layer such as the insulating layer 41. Thereby, the strength of the laminate 10 is further increased.

[0041] As shown in FIG. 3, the inorganic material layer 70 is preferably joined to a coil conductor such as the coil conductor 51. Thereby, the strength of the laminate 10 is further increased.

[0042] Examples of the inorganic material 71 include oxides, carbides, nitrides, etc. The inorganic material 71 may be a metal material. Examples of the inorganic material 71 include magnetic ferrite materials, metal magnetic materials, non-magnetic ferrite materials, glass materials, zirconia, forsterite, steatite, yttria, mullite, cordierite, silicon carbide, silicon nitride, etc. These inorganic materials may be of one kind or two or more kinds. Note that the "inorganic material" in this specification includes both particulate inorganic materials and porous inorganic materials.

[0043] Examples of the metal material 72 include Ag, Cu, Pd, etc. These metal materials may be of one kind or two or more kinds.

[0044] The insulating layer such as the insulating layer 41 is preferably composed of a magnetic ferrite material containing at least Fe, Ni, Zn, and Cu. For example, a magnetic ferrite material in which Fe is 40 mol% or more and 49.5 mol% or less in terms of Fe2O3, Zn is 5 mol% or more and 35 mol% or less in terms of ZnO, Cu is 4 mol% or more and 12 mol% or less in terms of CuO, and the balance is NiO can be preferably used. Trace additives (including unavoidable impurities) such as Mn, Co, Sn, Bi, and Si may be contained in the above magnetic ferrite material.

[0045] Hereinafter, an example of a method for manufacturing the laminated coil component of the present invention will be described.

[0046] For example, a ferrite sheet, a ferrite paste, an inorganic material paste, and a conductor paste are prepared as materials.

[0047] As the material of the ferrite sheet, it is preferable to use a magnetic ferrite material containing at least Fe, Ni, Zn, and Cu. As the magnetic ferrite material, a magnetic ferrite material in which Fe is 40 mol% or more and 49.5 mol% or less in terms of Fe2O3, Zn is 5 mol% or more and 35 mol% or less in terms of ZnO, Cu is 4 mol% or more and 12 mol% or less in terms of CuO, and the balance is NiO can be preferably used. Trace additives (including unavoidable impurities) such as Mn, Co, Sn, Bi, and Si may be contained in the above magnetic ferrite material.

[0048] Examples of the method for producing the ferrite sheet include the following methods. Weigh Fe2O3, ZnO, CuO, NiO, and additives as necessary so as to have a predetermined composition. Put the weighed substances into a ball mill together with pure water, a dispersant, and PSZ (partially stabilized zirconia) media, and mix and grind them. After drying the obtained slurry, it is calcined under the conditions of a temperature of 700°C or higher and 800°C or lower for 2 hours or more and 3 hours or less. The calcined powder of the obtained ferrite material, an organic binder such as polyvinyl butyral, and an organic solvent such as ethanol and toluene are put into a ball mill together with PSZ media and mixed and pulverized. The obtained mixture is formed into a sheet with a predetermined thickness by the doctor blade method and then punched into a predetermined size to produce a ferrite sheet.

[0049] As the material of the ferrite paste, it is preferable to use a magnetic ferrite material containing at least Fe, Ni, Zn and Cu. As the magnetic ferrite material, a magnetic ferrite material in which Fe is 40 mol% or more and 49.5 mol% or less in terms of Fe2O3, Zn is 5 mol% or more and 35 mol% or less in terms of ZnO, Cu is 4 mol% or more and 12 mol% or less in terms of CuO, and the balance is NiO can be preferably used. Trace additives (including inevitable impurities) such as Mn, Co, Sn, Bi, and Si may be contained in the above magnetic ferrite material.

[0050] Examples of the method for producing the ferrite paste include the following method. A predetermined amount of a solvent (such as a ketone solvent), a resin (such as polyvinyl acetal), and a plasticizer (such as an alkyd plasticizer) are added to the calcined powder of the ferrite material obtained by the above method for producing the ferrite sheet, kneaded with a planetary mixer, and then dispersed with a three-roll mill to produce a ferrite paste.

[0051] As the material of the inorganic material paste, an inorganic material and a metal material different from the above inorganic material are used. As the inorganic material, it is preferable to use a magnetic ferrite material, a metal magnetic material, a non-magnetic ferrite material, a glass material, zirconia, forsterite, steatite, yttria, mullite, cordierite, silicon carbide, silicon nitride, etc. These inorganic materials may be one kind or two or more kinds. As the metal material, it is preferable to use Ag, Cu, Pd, etc. These metal materials may be one kind or two or more kinds.

[0052] Examples of methods for producing an inorganic material paste include the following methods. A predetermined amount of a solvent (such as a ketone-based solvent), a resin (such as polyvinyl acetal), etc. are added to powders of an inorganic material and a metal material, kneaded with a planetary mixer, and then further dispersed with a three-roll mill to produce an inorganic material paste.

[0053] As the conductor paste, it is preferable to use a paste containing silver as the conductive material.

[0054] Examples of methods for producing a conductor paste include the following methods. Silver powder is prepared, a predetermined amount of a solvent (such as eugenol), a resin (such as ethyl cellulose), and a dispersant are added, kneaded with a planetary mixer, and then further dispersed with a three-roll mill to produce a conductor paste.

[0055] Next, using the above materials, a laminate 10 incorporating a coil 20 is produced.

[0056] Figs. 4A1 to 4A4, Figs. 4B1 to 4B4, Figs. 4C1 to 4C4, and Figs. 4D1 to 4D4 are exploded views schematically showing an example of a method for producing a laminate incorporating a coil.

[0057] First, a ferrite sheet 141 is prepared (Fig. 4A1).

[0058] An inorganic material paste layer 170 is formed by printing an inorganic material paste at a location on the ferrite sheet 141 where an inorganic material layer 70 (see Fig. 2) is to be formed (Fig. 4A2).

[0059] A conductor paste layer 151 is formed by printing a conductor paste at a location where a coil conductor 51 (see Fig. 2) is to be formed (Fig. 4A3). As shown in Fig. 4A3, it is preferable to draw out one end of the conductor paste layer 151 to the end face of the ferrite sheet 141.

[0060] The ferrite paste layer 140 is formed by printing ferrite paste in a region where the conductor paste layer 151 is not formed (Fig. 4A4).

[0061] By the above process, a sheet S1 is formed in which the inorganic material paste layer 170, the conductor paste layer 151, and the ferrite paste layer 140 are printed on the ferrite sheet 141.

[0062] A ferrite sheet 142 is separately prepared, and a via hole 161 is formed by irradiating a laser at a location where it is connected to the conductor paste layer 151 formed on the sheet S1 (Fig. 4B1).

[0063] The inorganic material paste layer 170 is formed by printing inorganic material paste at a location where the inorganic material layer 70 is to be formed on the ferrite sheet 142 (Fig. 4B2).

[0064] The conductor paste layer 152 is formed by printing conductor paste at a location where the coil conductor 52 (see Fig. 2) is to be formed, and the via hole 161 is filled with conductor paste (Fig. 4B3).

[0065] The ferrite paste layer 140 is formed by printing ferrite paste in a region where the conductor paste layer 152 is not formed (Fig. 4B4).

[0066] By the above process, a sheet S2 is formed in which the inorganic material paste layer 170, the conductor paste layer 152, and the ferrite paste layer 140 are printed on the ferrite sheet 142 having the via hole 161.

[0067] In the same procedure as the sheet S2, a sheet S3 (Figs. 4C1 to C4) in which an inorganic material paste layer 170, a conductor paste layer 153, and a ferrite paste layer 140 are printed on a ferrite sheet 143 having via holes 162, and a sheet S4 (Figs. 4D1 to D4) in which an inorganic material paste layer 170, a conductor paste layer 154, and a ferrite paste layer 140 are printed on a ferrite sheet 144 having via holes 163 are produced. As shown in Fig. 4D3, it is preferable to draw out one end of the conductor paste layer 154 to the end face of the ferrite sheet 144.

[0068] The sheets S1, S2, S3, and S4 produced as described above are laminated in a predetermined order, and a predetermined number of ferrite sheets on which no paste layer is printed are stacked above and below them. By performing warm isostatic pressing (WIP) treatment on the stacked sheets under the conditions of a temperature of 70°C or higher and 90°C or lower and a pressure of 60 MPa or higher and 100 MPa or lower, a laminate block that is an assembly of elements is obtained.

[0069] The laminate block is cut into individual pieces with a dicing machine or the like to obtain elements. The obtained elements are placed in a firing furnace and fired under the conditions of a temperature of 900°C or higher and 920°C or lower for 2 hours or more and 4 hours or less.

[0070] After firing, the ferrite sheet 141 and the ferrite sheet laminated thereunder become an insulating layer 41. The ferrite paste layer 140 printed on the ferrite sheet 141 and the ferrite sheet 142 become an insulating layer 42. The ferrite paste layer 140 printed on the ferrite sheet 142 and the ferrite sheet 143 become an insulating layer 43. The ferrite paste layer 140 printed on the ferrite sheet 143 and the ferrite sheet 144 become an insulating layer 44. The ferrite paste layer 140 printed on the ferrite sheet 144 and the ferrite sheet laminated on the ferrite sheet 144 become an insulating layer 45.

[0071] After firing, the inorganic material paste layer 170 becomes the inorganic material layer 70, the conductor paste layers 151 to 154 become the coil conductors 51 to 54, and the conductor paste filled in the via holes 161 to 163 becomes the via conductors 61 to 63. The coil 20 is formed by the coil conductors 51 to 54 and the via conductors 61 to 63.

[0072] It is preferable to form roundness on the ridge lines and corners of the element by putting the fired element together with a medium into a rotary barrel machine and rotating it. Through the above steps, the laminate 10 incorporating the coil 20 is obtained.

[0073] A conductive paste containing silver and glass is applied to the end face where the coil 20 is drawn out on the side surface of the laminate 10. By baking the conductive paste under the conditions of a temperature of 800 °C or higher and 820 °C or lower, the base electrode of the external electrode 30 is formed. The thickness of the base electrode is, for example, about 5 μm.

[0074] The external electrode 30 is formed by sequentially forming a Ni film and a Sn film on the base electrode by electrolytic plating.

[0075] As described above, the multilayer coil component 1 as shown in FIG. 1 is obtained. The size of the multilayer coil component 1 is, for example, 0.6 mm in the dimension in the length direction L, 0.3 mm in the dimension in the width direction W, and 0.3 mm in the dimension in the height direction T.

Example

[0076] Hereinafter, examples more specifically disclosing the multilayer coil component of the present invention are shown. Note that the present invention is not limited only to these examples.

[0077] (Example 1) Fe2O3, ZnO, NiO and CuO were blended at a predetermined ratio, mixed and pulverized wet, and then dried to remove moisture. The obtained dried product was calcined at a temperature of 800 °C for 2 hours to produce a ferrite material which is a magnetic material. A ferrite sheet and a ferrite paste were produced from the obtained magnetic material.

[0078] Zirconia powder was prepared as the inorganic material for forming the inorganic material layer, and Ag powder was prepared as the metal material. An inorganic material paste was prepared using a mixed powder obtained by mixing zirconia powder and Ag powder at a volume ratio of 75:25.

[0079] Using the prepared ferrite sheet, ferrite paste, inorganic material paste, and Ag paste, a laminated coil component was manufactured according to the procedure described in [Mode for Carrying Out the Invention], and used as the sample of Example 1.

[0080] The prepared sample was stood vertically so that the LT plane was exposed, and the periphery of the sample was solidified with resin. The sample was polished using a polishing machine up to approximately the center in the W direction of the sample. A photograph of the obtained cross section was taken at a magnification of 10,000 times with a scanning electron microscope (SEM). Using image processing software, the area of the first region where zirconia exists and the area of the second region where Ag exists in the inorganic material layer were determined. The area measurement was performed at five locations, and the average value was obtained. As a result, the ratio of the first region to the total of the first region and the second region was 75%.

[0081] (Comparative Example 1) A laminated coil component was manufactured in the same manner as the sample of Example 1, except that an inorganic material paste prepared using only zirconia powder without containing Ag powder was used instead of the inorganic material paste prepared in Example 1, and used as the sample of Comparative Example 1.

[0082] In Comparative Example 1, when the sample was polished in the same manner as in Example 1, the dropout of zirconia powder from the sample was confirmed. From this result, it is considered that in the sample of Comparative Example 1, the zirconia particles as the inorganic material exist in a powder state.

[0083] In addition, a deflection strength test was performed on the samples of Example 1 and Comparative Example 1. As a result, it was confirmed that the deflection strength of the sample of Example 1 was higher than that of the sample of Comparative Example 1. Further, 100 samples of Example 1 were prepared, polished to approximately the center of the width direction W of the laminate 10, and the LT cross-section was observed. As a result, it was confirmed that no cracks occurred and the internal stress was relaxed.

Explanation of Signs

[0084] 1 Stacked coil component 10 Laminate 11 First end face 12 Second end face 13 First main surface 14 Second main surface 15 First side surface 16 Second side surface 20 Coil 30 External electrode 31 First external electrode 32 Second external electrode 41, 42, 43, 44, 45 Insulation layer 51, 52, 53, 54 Coil conductor 61, 62, 63 Via conductor 70 Inorganic material layer 71 Inorganic material 72 Metal material 81 First region where inorganic material exists 82 Second region where metal material exists 140 Ferrite paste layer 141, 142, 143, 144 Ferrite sheet 151, 152, 153, 154 Conductor paste layer 161, 162, 163 Via hole 170 Inorganic material paste layer S1, S2, S3, S4 Sheet L Length direction T Height direction W Width direction

Claims

1. A laminate in which a plurality of insulating layers are laminated, A coil formed by electrically connecting a plurality of coil conductors laminated together with the insulating layer and embedded in the laminate, An external electrode provided on the outer surface of the laminate and electrically connected to the coil, An inorganic material layer is provided on at least a part of the interface between the insulating layer and the coil conductor, The inorganic material layer contains an inorganic material and a metal material different from the inorganic material, In the inorganic material layer, the metal material is interposed between particles of the inorganic material or between porous bodies made of the inorganic material, a laminated coil component.

2. The laminated coil component according to claim 1, wherein the thickness of the inorganic material layer is greater than 0 μm and 1.5 μm or less.

3. The laminated coil component according to claim 2, wherein the thickness of the inorganic material layer is 25% or more with respect to the thickness of the coil conductor.

4. The laminated coil component according to claim 1, wherein the thickness of the inorganic material layer is greater than 2 μm.

5. The laminated coil component according to claim 4, wherein the thickness of the inorganic material layer is 15% or less with respect to the thickness of the coil conductor.

6. The inorganic material contains at least one selected from the group consisting of magnetic ferrite materials, metal magnetic materials, non-magnetic ferrite materials, glass materials, zirconia, forsterite, steatite, yttria, mullite, cordierite, silicon carbide, and silicon nitride. The laminated coil component according to any one of claims 1 to 5.

7. The laminated coil component according to claim 6, wherein the metal material contains at least one selected from the group consisting of Ag, Cu, and Pd.

8. In the inorganic material layer, the ratio of the first region where the inorganic material exists to the total of the first region where the inorganic material exists and the second region where the metal material exists is 20% or more and 80% or less. The laminated coil component according to any one of claims 1 to 5.

9. The laminated coil component according to any one of claims 1 to 5, wherein the inorganic material layer is joined to the insulating layer.

10. The laminated coil component according to any one of claims 1 to 5, wherein the inorganic material layer is joined to the coil conductor.

11. The laminated coil component according to any one of claims 1 to 5, wherein the insulating layer is made of a magnetic ferrite material containing at least Fe, Ni, Zn, and Cu.

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