Substrate mounting structure

Abstract

To provide a substrate mounting structure having a simple structure and excellent heat resistance performance.SOLUTION: A substrate mounting structure includes a first substrate 26a and a second substrate 26b on which electronic components are mounted, and a spacer substrate 26c provided between the first substrate 26a and the second substrate 26b, and the spacer substrate 26c includes a plurality of regions A provided via a partition 33 such that the relative distance changes on the basis of external force acting along the planar direction of the spacer substrate 26c. In each of a plurality of regions A, bar-shaped relay terminals 30 for electrically connecting a soldered portion of the first substrate 26a and a soldered portion of the second substrate 26b are distributed in a penetrating state.SELECTED DRAWING: Figure 7

Description

Technical Field

[0001] The present invention relates to a substrate mounting structure in which a first substrate and a second substrate on which electronic components are mounted are connected using a plurality of rod-shaped relay terminals, and a spacer substrate having these plurality of relay terminals is installed between the first substrate and the second substrate.

Background Art

[0002] Conventionally, as such a substrate mounting structure, for example, there is one shown in Patent Document 1 (see

[0010] ,

[0014] ,

[0022] and FIGS. 2 and 7).

[0003] In this substrate mounting structure, for example, it has a structure in which a control substrate 11 and a power substrate 12 are stacked, and a connector case 13 is interposed between these substrates. Insert-molded terminal groups 131, 132, 133 are mounted on the peripheral edge of the connector case 13, and these terminals electrically connect, for example, the mounted components of the control substrate 11 and the mounted components of the power substrate 12.

[0004] With this configuration, the mounted components of the control substrate 11 and the mounted components of the power substrate 12 can be connected via the terminal groups, and the routing of wiring to a connector located far away from the constraints of the mounting positions that were necessary when arranging these in a plane is eliminated. Therefore, it is said that the wiring layout is simplified and the degree of freedom in wiring design is increased.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] In the above-described conventional substrate mounting structure, the terminal group is insert-molded on the wall portion of the connector case, and in the insert-molded portion, each terminal cannot be displaced relative to each other. Therefore, for example, even when the power substrate 12 overheats and the relative positions of the soldered portions on the power substrate 12 change due to thermal expansion or the like, the positions of the terminals are fixed by insert molding. For this reason, there remains a possibility that damage may occur in the soldered portions on the power substrate 12.

[0007] Further, the terminals in this known document protrude toward the center side along the planar direction of the connector case from the middle of the wall portion of the connector case and are bent in the immediate vicinity and directed toward the other substrate. With this configuration, it is easy to change the tip position of the terminal, and even if the soldering position on the target substrate is displaced, soldering is easy. Also, when the target substrate thermally expands, it is presumed that the terminals themselves can deform to absorb the influence of thermal expansion.

[0008] However, in order to configure the terminal group of this configuration, it is necessary to insert-mold each terminal in a state where the terminals are aligned so as to embed the portions bent in a "く" shape for a large number of terminals, and the manufacturing operation is extremely complicated.

[0009] Furthermore, when a step of bending all the terminals toward the target substrate side is required after the insert molding is completed, it becomes even more laborious.

[0010] As described above, the conventional substrate mounting structure has various problems to be solved, and there has been a demand for providing a substrate mounting structure that is simple in structure and excellent in heat resistance performance.

Means for Solving the Problems

[0011] (Characteristic Configuration) The characteristic configuration of the substrate mounting structure according to the present invention is having a first substrate and a second substrate on which electronic components are mounted, and a spacer substrate provided between the first substrate and the second substrate, The spacer substrate includes a plurality of regions provided via partition portions such that a relative distance changes based on an external force acting along the planar direction of the spacer substrate. In each of the plurality of regions, bar-shaped relay terminals that electrically connect the soldering portions of the first substrate and the soldering portions of the second substrate are dispersedly arranged in a state of passing therethrough. and a ground terminal related to the first substrate or the second substrate is provided on at least one of the first fixing portion fixed to the housing of the first substrate and the second fixing portion fixed to the housing of the second substrate. a frame member that is attached to the housing in a state where the first substrate, the second substrate, and the spacer substrate are integrally held in advance, and a pressing portion that presses a part of the first substrate or the second substrate toward the housing side is provided on a part of the frame member, and a heat radiating portion is formed on the opposite surface of the pressing portion at a portion of the first substrate or the second substrate that faces the pressing portion, and on the housing side, a heat radiating sheet that contacts the heat radiating portion is disposed in a state where the frame member is attached. is in the point.

[0012] (Effect) This configuration forms the first substrate and the second substrate in two stages and connects both substrates with a spacer substrate provided with a plurality of bar-shaped relay terminals. The spacer substrate has several regions set via partition portions, and the bar-shaped relay terminals are dispersedly arranged in these regions.

[0013] The relative distance between these plurality of regions can change based on an external force acting along the planar direction of the spacer substrate. For example, when the first substrate and the second substrate are heated, when the soldering portions on the first substrate and the soldering portions on the second substrate are in different heating states, the soldering portions on both sides may be relatively displaced when viewed in a direction perpendicular to the substrate. At this time, since the regions of the spacer substrate are relatively displaced along the planar direction, the relative displacement between the relay terminals is allowed, and the stress generated in the soldering portions on the first substrate or the second substrate can be reduced.

[0014] Thereby, breakage of the soldering portion and damage to the substrate are prevented, and heat resistance and durability are improved. That is, by configuring the substrate in multiple stages, the area required for installing the substrate can be reduced, the mountability to various control objects is improved, and a substrate mounting structure excellent in heat resistance and durability can be obtained.

[0015] Furthermore, the relay terminal of this configuration is bar-shaped. For example, when providing a linear relay terminal on the spacer substrate, it only needs to be inserted into a hole portion provided in the spacer substrate in advance, and the spacer substrate can be manufactured extremely easily. Also, as in this configuration, by providing a ground terminal on the first substrate or the second substrate, the influence of noise from devices around the control substrate can be reduced. With this configuration, when attaching the first substrate or the second substrate to various devices, the grounding operation can be performed simultaneously, so that an excellent mounting workability and a highly reliable substrate mounting structure can be obtained. In addition to the above effects, with this configuration, by simply attaching a frame member that holds the first substrate or the like in advance to the housing, the heat radiating portion provided on the substrate contacts the heat radiating sheet on the housing side. At that time, the pressing portion of the frame member contacts the substrate to generate a reaction force, and the heat radiating portion of the substrate and the heat radiating sheet of the housing can be surely brought into contact. Further, in this configuration, by simply pressing the heat radiating portion against the heat radiating sheet side, the thermal expansion of the substrate along the plane direction of the substrate is configured to be allowable. Therefore, unexpected stress does not occur in the substrate, and damage to the soldering portion or the like can be effectively prevented.

[0016] In the substrate mounting structure according to the present invention, the partition portion can be configured by slits.

[0017] (Effect) If the partition portion is a slit, the transmission of stress across each region can be substantially eliminated. Moreover, although the spacer substrate is often made of a synthetic resin or the like, providing slits does not require complicated processing. Therefore, the partition portion between each region can be configured extremely rationally.

[0018] In the substrate mounting structure according to the present invention, a first fitting portion for positioning each other can be provided across the spacer substrate and the first substrate, and a second fitting portion for positioning each other can be provided across the spacer substrate and the second substrate.

[0019] (Effect) By providing such a fitting portion, the connection work of the relay terminals to the first substrate or the second substrate becomes easy, and the assembly work of the plurality of stages of substrates is made efficient. Therefore, a substrate mounting structure with low cost can be obtained.

[0020]

[0021]

[0022]

[0023]

[0024] In the substrate mounting structure according to the present invention, the first substrate can be used as a control substrate, the second substrate can be used as a power supply system substrate, and the heat radiating portion can be provided on the second substrate.

[0025] (Effect) With the present configuration, by differentiating the necessary substrates into a control system substrate and a power supply system substrate and providing a heat dissipation part on the power supply system substrate, heat generation can be effectively removed. Further, since the substrates are divided according to the degree of heat generation, it is possible to more effectively prevent damage to the soldering part caused by heat generation, particularly in the control substrate.

[0026] In the substrate mounting structure according to the present invention, It has a first substrate and a second substrate on which electronic components are mounted, and a spacer substrate provided between the first substrate and the second substrate. The spacer substrate includes a plurality of regions provided via partition portions such that the relative distance changes based on an external force acting along the plane direction of the spacer substrate. In each of the plurality of regions, rod-shaped relay terminals that electrically connect the soldering portion of the first substrate and the soldering portion of the second substrate are dispersedly arranged in a penetrating state. A ground terminal related to the first substrate or the second substrate is provided on at least one of the first fixing portion fixed to the housing in the first substrate and the second fixing portion fixed to the housing in the second substrate. it includes a frame member that integrally attaches the first substrate, the second substrate, and the spacer substrate, and a cover member that covers one surface of the frame member. When attaching the frame member and the cover member to the housing, an annular seal member can be arranged between the peripheral edge of the one surface of the frame member and the peripheral edge of the cover member, and between the peripheral edge of the other surface of the frame member and the housing.

[0027] (Effect) With this configuration, the attachment work of the first substrate, the second substrate, and the spacer substrate to the housing is simplified. Further, since seal members are arranged on the front and back surfaces of the frame member, a substrate mounting structure excellent in dustproofness and waterproofness can be obtained.

Brief Description of the Drawings

[0028]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Figure 12

Mode for Carrying Out the Invention

[0029] (Overview) The displacement detection device S according to the present invention can be used, for example, in a linear motion mechanism provided in a rear wheel steering device of a vehicle. The linear motion mechanism is, for example, one in which a cylindrical nut 2 is rotationally driven by an electric motor 1 which is a drive unit M, and a rod 3 screwed and inserted into the nut 2 is reciprocated. A sliding surface that abuts against the inner surface of the housing 4 of the linear motion mechanism is formed on a part of the rod 3, and the rod 3 is configured to reciprocate without rotating.

[0030] FIGS. 1 and 2 show the configuration of the linear motion mechanism according to the present embodiment. The linear motion mechanism includes a control unit C provided on the left side in FIG. 1 and a drive unit M provided on the right side. The control unit C has a linear motion sensor 25 that measures the displacement state of the rod 3, and calculates the position of the rod 3 based on a signal from the linear motion sensor 25 or the like. Based on the calculation result, the control unit C supplies a drive signal to the drive unit M to move the rod 3 to a desired position.

[0031] (Drive unit) As shown in FIGS. 2 and 3, the drive unit M of the present embodiment includes a stator 5 having an axis X along the moving direction of the linear motion mechanism, and a cylindrical rotor 6 that rotates inside the stator 5. A rod 3 is inserted through the inside of the cylindrical rotor 6. The rotor 6 is supported on both sides of the housing 4 by rotor bearings 7 on both outer sides along the axis X with the opposing positions of the stator 5 interposed therebetween.

[0032] (Planetary gear mechanism) A planetary gear mechanism P is connected to one end of the rotor 6. Specifically, a sun gear P1 is formed on the outer surface of the end of the rotor 6. Three planetary gears P2 are engaged with the sun gear P1, and further, a ring gear P3 fixed to the housing 4 is engaged with the outside of the planetary gears P2.

[0033] The carrier K of the planetary gear P2 is screwed and fixed to the outer peripheral side of a nut 2 that is screwed with the rod 3. The carrier K has a first carrier K1 fixed to the outer surface of the nut 2 and a second carrier K2 that is fitted and fixed to the first carrier K1 outside the first carrier K1. Three shaft members 8 that respectively support the three planetary gears P2 are fixed to the second carrier K2.

[0034] The nut 2 is cylindrical, and an internal female trapezoidal thread 9a as an output gear 9 of the drive unit M is formed on the inner surface. An external male trapezoidal thread 10a as a thread portion 10 is formed on the outer surface of one rod 3. The nut 2 is made of brass to provide wear resistance. The rod 3 reciprocates relative to the housing 4 without rotating by bringing a later-described sliding contact member 21 into contact with the inner surface of the housing 4. A bearing portion 11 using a thrust bearing is externally fitted to the outer surface of the nut 2, and this bearing portion 11 is internally fitted to the inner surface of the housing 4.

[0035] One end of the nut 2 is screwed and fixed via the fixing screw portion 12 in a state where the first carrier K1 is externally inserted. At the other end of the nut 2, a bulging portion 2a protruding in the radial direction is formed, and the inner member 11a of the bearing portion 11 is clamped along the direction of the axis X by the bulging portion 2a and the end face of the first carrier K1. With this configuration, the fixing of the bearing portion 11 to the nut 2 and the fixing of the first carrier K1 are facilitated, and the assembly work thereof can be made efficient.

[0036] Further outside the first carrier K1, a second carrier K2 for holding the planetary gear P2 is externally fitted and fixed. The external fitting and fixing are performed using two types of fitting portions. One is a cylindrical first fitting portion Ka formed on the back side in the fitting direction along the direction of the axis X when viewed from the side of the second carrier K2. This is formed by a cylindrical fitting outer surface formed on the outer surface of the first carrier K1 and a cylindrical fitting inner surface formed on the inner surface of the second carrier K2. The other is a spline-shaped second fitting portion Kb that meets the front side in the fitting direction and is adjacent to the first fitting portion Ka when viewed from the side of the second carrier K2.

[0037] The second fitting portion Kb is configured, for example, in a star shape as a cross-sectional shape perpendicular to the axis X. Thereby, the first carrier K1 and the second carrier K2 do not rotate relative to each other, and a durable carrier K can be configured. Further, when screwing the first carrier K1 into the nut 2, the second fitting portion Kb can be used as an engaging portion of a fastening tool. Incidentally, the first carrier K1 and the second carrier K2 are formed of steel instead of conventional brass to achieve weight reduction and cost reduction.

[0038] In the present embodiment, particularly, the housing 4 has a narrowed shape, and it is necessary to arrange the bearing portion 11 behind the carrier K. Therefore, as the mounting order, the bearing portion 11 is attached to the nut 2, the bearing portion 11 is clamped by the first carrier K1, and then these are fixed to the housing 4. The attachment of the second carrier K2 to the first carrier K1 comes later.

[0039] For fixing the bearing portion 11, an annular spacer 13 that abuts against the outer member 11b of the bearing portion 11 and a retaining ring 14 that abuts against the spacer 13 and holds the positions of the bearing portion 11 and the spacer 13 are used. The retaining ring 14 is, for example, a C-shaped snap ring that fits into a groove portion 15 formed on the inner surface of the housing 4.

[0040] With this configuration, the spacer 13 can be attached before the attachment of the second carrier K2, and the dimensions of the spacer 13 can be set regardless of the dimensions of the second carrier K2, which tend to have a relatively large diameter. Therefore, the degree of freedom in the design of the mounting portion of the bearing portion 11 is increased, and the mounting work of the bearing portion 11 is made more efficient. In addition, as a result of being able to individually set the size of the bearing portion 11 and the size of the second carrier K2, the degree of freedom in setting the components of the planetary gear mechanism P is increased.

[0041] In addition, by using the spacer 13, even if there is an error in the formation position of the groove portion 15, the outer member 11b can be fixed to the housing 4 without rattling by using a spacer 13 with an appropriate thickness. Further, by making the spacer 13 a complete annular member, the spacer 13 abuts against the entire circumference of the outer member 11b, and the retaining effect of the outer member 11b is improved.

[0042] After the fixing of the bearing portion 11 is completed, the second carrier K2 is fitted and fixed to the first carrier K1. The attachment order of the planetary gear P2 to the second carrier K2 may be either before or after the attachment of the second carrier K2 to the first carrier K1. Incidentally, the ring gear P3 is fitted to the inner surface of the housing 4 as shown in FIG. 2.

[0043] (Guide portion) When the rod 3 reciprocates by the driving portion M, the rotation of the rod 3 is blocked by the housing 4. For this purpose, as shown in FIGS. 4 to 6, a guide portion G extending between the rod 3 and the housing 4 is formed on the side of the rod 3 opposite to the threaded portion 10.

[0044] The guide part G is composed of a slider 20 provided on the rod 3, a sliding contact member 21 attached to the slider 20, and a guide surface 22 provided on the housing 4 so that the sliding contact member 21 slides over a predetermined distance.

[0045] As shown in FIGS. 5(a) and 5(b), the slider 20 is a member having a U-shaped cross-sectional shape perpendicular to the axis X. The slider 20 is fixed to the rod 3 by a mounting bolt, which is a fastening member 23, through a mounting hole 20b provided in the bottom 20a forming the U-shape. As a mounting procedure, the rod 3 is inserted into the housing 4, and the slider mounting position of the rod 3 is made to correspond to the positions of the guide surfaces 22 formed on the opening of the housing 4 and facing each other. In this state, the slider 20 with the sliding contact member 21 attached in advance is positioned and fastened by the fastening member 23.

[0046] The sliding contact member 21 is attached to the slider 20 by inserting a groove-shaped insertion portion 21a formed in the sliding contact member 21 into a pair of protruding portions 20c forming the U-shape of the slider 20. Claw portions are formed as engaging portions 21c on the inner wall 21b of the sliding contact member 21 that forms the insertion portion 21a, and the claw portions are engaged with hole portions provided as engaged portions 20d in the pair of protruding portions 20c. By performing the engagement by means of a so-called snap fit in this way, the attachment work of the sliding contact member 21 to the slider 20 is simplified, and the work cost can be suppressed.

[0047] Also, stepped portions 20e are formed at the leading edge portions of the respective protruding portions 20c with both ends cut along the direction of the axis X. Thereby, when the insertion portion 21a of the sliding contact member 21 is inserted into the protruding portion 20c, as shown in FIG. 5(a), the portion of the leading edge portion excluding the stepped portion 20e is exposed on the upper surface of the sliding contact member 21, and the sliding contact member 21 is prevented from rattling along the direction of the axis X with respect to the protruding portion 20c.

[0048] In each of the pair of sliding contact members 21, the outer-facing surface serves as the sliding contact surface 21d, which slidably contacts the guide surface 22 provided on the housing 4 to prevent the rotation of the rod 3. To ensure this rotation prevention, the outer-facing surfaces of the pair of protruding portions 20c of the slider 20 are formed as flat receiving surfaces 20f, which come into surface contact with the flat surface 21e formed inside the insertion portion 21a of the sliding contact member 21. By providing such a receiving surface 20f and flat surface 21e, the rotation restricting function of the rod 3 is reliably exerted, enabling the linear motion mechanism to have a higher torque.

[0049] The slider 20 is formed of a metal material such as steel or stainless steel, and can reliably receive the anti-rotation torque of the rod 3 received as a reaction force from the guide surface 22 when the rod 3 reciprocates. On the other hand, the sliding contact member 21 is made of a material having a low friction coefficient, such as fluororesin.

[0050] Also, by separating the slider 20 and the sliding contact member 21, the sliding contact member 21 can be attached to the slider 20 after the slider 20 is attached to the rod 3. Before attaching the sliding contact member 21, it becomes easy to fix the fastening member 23 between the pair of protruding portions 20c. With this configuration, when assembling the slider 20, it is not necessary to change the posture of the rod 3, such as inverting it, and an efficient assembly operation is possible.

[0051] (Control unit) The position of the rod 3 is detected by the control unit C. This detection is performed by a magnet 24 provided between the pair of sliding contact members 21 and a linear motion sensor 25 provided on the control board 26 in a state of being close to and opposing the magnet 24.

[0052] As shown in FIG. 5, the magnet 24 is formed by insert molding with a resin material using a long-shaped one, and is made into a magnet block 24a. This magnet block 24a is fixed to the rod 3, but is attached so that an external force that prevents the rotation of the rod 3 is not input from the sliding contact member 21 to the magnet 24.

[0053] Specifically, as shown in Fig. 5(b), the magnet block 24a is inserted between a pair of sliding contact members 21, and the back surface of the magnet block 24a is placed in a state of abutting against two first seats 20g formed at the bottom 20a of the slider 20. Thereby, the detection surface of the magnet 24 is installed at a predetermined height with respect to the surface of the rod 3.

[0054] In addition, overhang portions 24b are provided near both ends of the magnet block 24a, and second seats 24c formed on the overhang portions 24b sandwich the respective sliding contact members 21 in the direction along the axis X. At this time, if the second seats 24c are made to lightly contact the sliding contact members 21, the magnet block 24a will not rattle during the reciprocating movement of the rod 3, and the position measurement accuracy of the rod 3 will be further improved.

[0055] Furthermore, positioning in the direction intersecting the axis X in the width direction of the magnet 24, that is, in the direction perpendicular to the surface of the magnet 24, is performed by the housing 4. That is, a second guide surface 27 provided in parallel with the guide surface 22 abuts against the overhang portion 24b near the guide surface 22 in the housing 4, and positions and guides the movement of the magnet 24.

[0056] In this way, after fixing the slider 20 and the sliding contact members 21 to the rod 3 inserted through the housing 4, the magnet block 24a is positioned and arranged with respect to the sliding contact members 21 and the housing 4, so that the magnet 24 can be easily installed with respect to the rod 3.

[0057] With this configuration, when the rod 3 reciprocates, the force that prevents the rotation of the rod 3 does not act on the magnet 24 from the sliding contact member 21. Therefore, the risk of damage to the magnet 24 is eliminated, and a displacement detection device S with a reasonable structure and enhanced durability can be obtained.

[0058] Figures 4 and 7 show the configuration of the control unit C. The magnet 24 that constitutes the control unit C is fixed to the side of the rod 3 and is arranged with its detection surface facing upward. A linear motion sensor 25 is arranged to face this magnet in a state of being close to it. The linear motion sensor 25 is mounted on a first substrate 26a, which will be described later, and detects the position information of the rod 3. Based on the signal obtained by the linear motion sensor 25, the control unit C calculates the position of the rod 3 and transmits a drive signal for moving the rod 3 to the desired position to the drive unit M.

[0059] As shown in FIGS. 7(a) and 7(b), the control unit C includes, for example, a first substrate 26a and a second substrate 26b as control substrates 26. The first substrate 26a is a substrate on the side facing the magnet 24 and is a so-called control system substrate provided with a linear motion sensor 25 and the like. The second substrate 26b is a so-called power supply system substrate provided with a power supply circuit and the like.

[0060] In the present embodiment, between the first substrate 26a and the second substrate 26b, for example, a spacer substrate 26c having an overall rectangular and annular shape is provided, and the first substrate 26a and the second substrate 26b are electrically connected. These three, the first substrate 26a, the second substrate 26b, and the spacer substrate 26c, are attached to the frame member 38 in advance before being fixed to the housing 4. Incidentally, the frame member 38 includes a connector 38a that connects the first substrate 26a and the like to the vehicle ECU. By arranging a plurality of substrates in this way, the overall planar area of the control unit C can be reduced, and for example, the mountability to target devices such as a linear motion mechanism can be improved.

[0061] As shown in FIG. 8, the spacer substrate 26c is provided with a plurality of relay terminals 30 that connect the soldering portion of the first substrate 26a and the soldering portion of the second substrate 26b. Here, the relay terminal 30 is configured in a linear rod shape. The relay terminal 30 is made of a material excellent in mechanical strength, electrical conductivity, thermal conductivity, and corrosion resistance, such as a Cu alloy-based material or an Fe alloy-based material.

[0062] Each relay terminal 30 is disposed so as to penetrate the spacer substrate 26c. For example, a plurality of holes are formed in the spacer substrate 26c in advance, and the relay terminal 30 is fitted and inserted. Alternatively, the spacer substrate 26c can be insert-molded with the relay terminal 30 embedded in a predetermined position.

[0063] In order to connect the first substrate 26a and the second substrate 26b to each relay terminal 30, it is necessary to accurately position the first substrate 26a and the second substrate 26b with respect to all the relay terminals 30. Therefore, as shown in FIG. 9, a first positioning portion 31 for positioning each other is provided between the spacer substrate 26c and the first substrate 26a.

[0064] This is, for example, to provide a first convex member 31a protruding toward the first substrate 26a on the spacer substrate 26c and to fit it into a first fitting hole 31b provided in the first substrate 26a. On the other hand, for the spacer substrate 26c and the second substrate 26b, it is preferable to provide a second convex member 32a provided on the spacer substrate 26c as the second positioning portion 32 and a second fitting hole 32b provided in the second substrate 26b.

[0065] By providing such a first positioning portion 31 and a second positioning portion 32, the connection operation of the spacer substrate 26c to the first substrate 26a and the second substrate 26b becomes easy, and the assembly operation of the plurality of stages of substrates is made efficient. Therefore, a low-cost substrate mounting structure can be obtained.

[0066] (Heat-resistant structure) A large number of electronic components are mounted on the first substrate 26a and the second substrate 26b, and during normal use, various amounts of heat are generated. Due to this heat generation, the dimensions of each substrate change, and the mechanical properties of the heated solder portion may change. As a result, the relative position between the soldering portion of the first substrate 26a and the soldering portion of the second substrate 26b is displaced along the plane direction of the substrate, and problems such as cracking of the soldering portion occur.

[0067] Therefore, in the spacer substrate 26c of the present embodiment, a slit 33a is provided as a partition portion 33 that divides regions A in which a predetermined number of relay terminals 30 are arranged. Specifically, as shown in FIG. 8, a plurality of slits 33a extending in a direction perpendicular to the peripheral edge of the spacer substrate 26c are formed for each region A having a predetermined area. For this purpose, only the portion of the slit 33a is protruded toward the center side of the spacer substrate 26c, and the slit 33a is formed inside the protruding portion 34. Thereby, the connection rigidity between the regions A on both sides sandwiching the slit 33a is ensured.

[0068] With this configuration, relative displacement between predetermined regions A of the spacer substrate 26c becomes possible, and changes in the posture of the relay terminals 30 can be absorbed as the temperature of the first substrate 26a and the second substrate 26b increases. Therefore, an excessive bending force or the like does not act on the soldering portions of the first substrate 26a and the second substrate 26b, and the soldering portions can be effectively protected.

[0069] (Grounding structure) In the substrate mounting structure of the present embodiment, the first substrate 26a and the second substrate 26b are provided with the following grounding structure in order to suppress the generation of noise. That is, a ground terminal 36 is provided for at least one of the first fixing portion 35a used for fixing to the housing 4 in the first substrate 26a and the second fixing portion 35b used for fixing to the housing 4 in the second substrate 26b.

[0070] This ground terminal 36 is grounded to the frame member 38 when the second substrate 26b or the like is attached to the frame member 38. Further, when the frame member 38 is fixed to the housing 4 using a screw member 39 or the like, the second substrate 26b or the like is grounded to the housing 4.

[0071] Specifically, as shown in FIGS. 10(a) and 10(b), a ground terminal 36 formed by bending a metal plate is attached to, for example, a fixing screw 37 that fixes the second substrate 26b to the frame member 38. This ground terminal 36 is in contact with the ground circuit of the second substrate 26b. Further, an elastic portion 36a that protrudes away from the fixing screw 37 is provided on one side of the ground terminal 36. This elastic portion 36a protrudes outward of the second substrate 26b, and the second substrate 26b and the housing 4 are configured to be electrically connected simply by attaching the frame member 38 provided with the second substrate 26b to the housing 4.

[0072] With this configuration, the influence of noise received from peripheral devices by the first substrate 26a and the second substrate 26b can be reduced. Further, when attaching the first substrate 26a and the second substrate 26b to various devices, grounding work can be performed simultaneously, so that a highly reliable substrate mounting structure with excellent attachment workability can be obtained.

[0073] (Heat dissipation structure) The first substrate 26a and the second substrate 26b of this configuration generate heat during use. In particular, the amount of heat generated by the second substrate 26b, which is a power supply system substrate, is larger than that of the first substrate 26a. If the amount of heat generated becomes excessive, there is a possibility that the mounted components and soldered portions of the second substrate 26b may be damaged. Therefore, the substrate mounting structure of this configuration has the following heat dissipation structure.

[0074] As shown in FIG. 11, a pressing portion 40 that presses a part of the second substrate 26b toward the housing 4 side is formed on a part of the frame member 38. A heat dissipation portion 41 is formed on the back surface of the portion of the second substrate 26b that faces the pressing portion 40. In a state where the second substrate 26b and the like are attached to the housing 4, this heat dissipation portion 41 abuts against a heat dissipation sheet 42 provided on the housing 4. That is, at this time, the pressing portion 40 is configured to press the back surface of the second substrate 26b so that the heat dissipation portion 41 reliably abuts against the heat dissipation sheet 42.

[0075] With this configuration, by simply attaching the frame member 38 that pre - holds the second substrate 26b etc. to the housing 4, the heat radiating portion 41 provided on the second substrate 26b is surely pressed against the heat radiating sheet 42 of the housing 4, and a good heat radiating effect can be obtained.

[0076] As in this configuration, by distinguishing the necessary control substrate 26 into the first substrate 26a of the control system and the second substrate 26b of the power supply system, and providing the heat radiating portion 41 on the second substrate 26b, the effect of removing heat generation can be enhanced. Also, since the control substrate 26 is divided according to the degree of heat generation, it is possible to more effectively prevent damage to the soldered portions caused by heat generation, particularly in the second substrate 26b of the power supply system.

[0077] Furthermore, the pressing portion 40 of this configuration only presses the heat radiating portion 41 against the heat radiating sheet 42, and does not restrict the second substrate 26b etc. from thermally expanding along its own plane direction. Therefore, unexpected stress does not occur in the second substrate 26b, and damage to the soldered portions etc. can be effectively prevented.

[0078] (Sealing structure) The first substrate 26a, the second substrate 26b, and the spacer substrate 26c are fixed to the housing 4 in a state of being attached to one surface of the frame member 38. Further, the opposite surface of the frame member 38 is covered with the cover member 43. When attaching these frame member 38 and cover member 43 to the housing 4, an annular seal member 44 is disposed between the peripheral edge of one surface of the frame member 38 and the housing 4, and between the peripheral edge of the other surface of the frame member 38 and the peripheral edge of the cover member 43.

[0079] This seal member 44 is composed of, for example, various rubber members etc. having a circular cross - sectional shape, and has a planar shape corresponding to the peripheral shape of the frame member 38. A fixing groove 45 into which the seal member 44 fits is formed in at least one of the members that are disposed opposite to each other among the frame member 38, the cover member 43, and the housing 4.

[0080] This makes it difficult for the seal member 44 to be displaced when the frame member 38 and the cover member 43 are attached, facilitating the attachment work. Also, displacement of the seal member 44 after attachment is prevented, and a substrate mounting structure with excellent dustproof and waterproof properties over a long period can be obtained.

Industrial Applicability

[0081] The substrate mounting structure of the present invention connects a first substrate and a second substrate on which electronic components are mounted using a plurality of rod-shaped relay terminals, and can be widely used for installing a spacer substrate having these plurality of relay terminals between the first substrate and the second substrate.

Explanation of Reference Numerals

[0082] 26a First substrate 26b Second substrate 26c Spacer substrate 30 Relay terminal 31 First fitting portion 32 Second fitting portion 33 Partition portion 33a Slit 35a First fixing portion 35b Second fixing portion 36 Grounding terminal 38 Frame member 40 Pressing portion 41 Heat dissipation portion 42 Heat dissipation sheet 43 Cover member 44 Seal member A Region

Claims

1. A first substrate and a second substrate on which electronic components are mounted, and a spacer substrate provided between the first substrate and the second substrate, wherein the spacer substrate includes a plurality of regions provided via partition portions such that a relative distance changes based on an external force acting along a planar direction of the spacer substrate, and in each of the plurality of regions, bar-shaped relay terminals that electrically connect a soldering portion of the first substrate and a soldering portion of the second substrate are dispersedly arranged in a state of penetrating therethrough, at least one of a first fixing portion fixed to a housing on the first substrate and a second fixing portion fixed to the housing on the second substrate is provided with a grounding terminal related to the first substrate or the second substrate, and includes a frame member that is attached to the housing in a state where the first substrate, the second substrate, and the spacer substrate are integrally held in advance, wherein a pressing portion that presses a part of the first substrate or the second substrate toward the housing side is provided on a part of the frame member, a heat dissipation portion is formed on a surface opposite to the pressing portion at a portion of the first substrate or the second substrate that faces the pressing portion, A substrate mounting structure in which a heat dissipation sheet that abuts against the heat dissipation portion is arranged on the housing side in a state where the frame member is attached.

2. A first substrate and a second substrate on which electronic components are mounted, and a spacer substrate provided between the first substrate and the second substrate, wherein the spacer substrate includes a plurality of regions provided via partition portions such that a relative distance changes based on an external force acting along a planar direction of the spacer substrate, and in each of the plurality of regions, bar-shaped relay terminals that electrically connect a soldering portion of the first substrate and a soldering portion of the second substrate are dispersedly arranged in a state of penetrating therethrough, at least one of a first fixing portion fixed to a housing on the first substrate and a second fixing portion fixed to the housing on the second substrate is provided with a grounding terminal related to the first substrate or the second substrate, A substrate mounting structure comprising the first substrate, the second substrate, a frame member for integrally attaching the spacer substrate, and a cover member for covering one surface of the frame member, wherein an annular seal member is disposed between a peripheral edge of the one surface of the frame member and a peripheral edge of the cover member, and between a peripheral edge of the other surface of the frame member and the housing when the frame member and the cover member are attached to the housing.

3. The substrate mounting structure according to claim 1 or 2, wherein the partition portion is a slit.

4. The substrate mounting structure according to any one of claims 1 to 3, wherein a first fitting portion for positioning each other is provided across the spacer substrate and the first substrate, and a second fitting portion for positioning each other is provided across the spacer substrate and the second substrate.

5. The first substrate is a control substrate, the second substrate is a power supply system substrate, The substrate mounting structure according to claim 1, wherein the heat radiating portion is provided on the second substrate.

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