Reactive hot melt adhesive composition based on an alpha-silane terminated organic polymer

Abstract

The present invention relates to reactive hot melt adhesive compositions comprising, based on the total weight of the composition, a) 3 wt% to 49 wt% of at least one alpha-silane terminated organic polymer; b) 1 wt% to less than 20 wt%, preferably 1 wt% to 10 wt%, of at least one acrylate resin-based polymer; c) 1 wt% to 20 wt%, preferably 1 wt% to 10 wt%, of at least one compound that is liquid at least at 100°C and in which the at least one acrylate resin-based polymer dissolves at least at 150°C; and d) 0.001 wt% to 5 wt%, preferably 0.001 wt% to 1 wt%, of at least one low molecular weight silane containing a primary or secondary amino group or a blocked amino group that hydrolyzes to a primary or secondary amino group. The present invention also relates to methods for their preparation and to methods of surface lamination using said compositions.

Description

Technical Field

[0001] The present invention relates to reactive hot melt adhesive compositions. The present invention further relates to methods for manufacturing them, and also to methods of surface lamination using these compositions.

Background Art

[0002] Reactive hot melt adhesives have occupied a large market share and have been widely adopted due to advantages such as, for example, short curing times, high initial strength, and stability, and have replaced solvent-based adhesives in many applications (see, for example, Bodo Muller, Walter Rath, Formulierung von Kleb- und Dichtstoffen [Formulation of Adhesives and Sealants], Vincentz Network; 1st edition, December 2004).

[0003] Among reactive hot melt adhesives, a major representative is moisture-crosslinkable polyurethane based on methylene diphenyl diisocyanate (MDI). Processing using monomeric MDI has recently been restricted under REACH, as is evident from EU Regulation 2020 / 1149, due to its sensitizing effect.

[0004] Methods for producing MDI-based reactive polyurethane hot melt adhesives with low monomer content are described in the patent literature (see, for example, International Publication No. 03 / 055929, International Publication No. 01 / 40342, International Publication No. 03 / 033562, International Publication No. 03 / 006521).

[0005] A method for silanizing a polyurethane hot melt adhesive is also described, which represents an alternative without isocyanate. This method generally requires the introduction of moisture-crosslinkable di- and / or trialkoxysilane units. One possibility for production is shown by the reaction of the isocyanate groups of a reactive polyurethane hot melt adhesive with a secondary aminosilane (for example, International Publication No. WO 2004 / 005420 A1). The crosslinking reaction is generally promoted using an aminosilane, a tin accelerator, and / or a strong nitrogen base (for example, 1,8-diazabicyclo[5.4.0]undec-7-ene). The disadvantage of this method is that these accelerators can simultaneously promote the hydrolysis of the ester units usually present in the reactive polyurethane hot melt adhesive. The resulting formulation generally no longer has sufficient stability to be processed in a roll coater. Reactive hot melt adhesives are often processed using a roll coater and are often exposed to ambient humidity. Therefore, the formulation must be sufficiently stable and should not react with ambient moisture to the extent that it causes a significant increase in coating amount and stringing, even during a short plant shutdown, and the latter has an adverse effect on the coating appearance.

[0006] Stable hot melt adhesive formulations based on silane-terminated polymers constitute an interesting type of adhesive. Furthermore, such silane-functional adhesives have a wide range of adhesiveness, which can be an advantage compared to, for example, isocyanate crosslinking systems. In the case of silane-terminated polymers, since the silane groups can generally participate in 2 to 3 condensation reactions, a higher crosslinking density is also possible compared to structurally equivalent isocyanate-based binders. In this context, among other factors, it is advantageous that these adhesives can be processed in part by an applicator roll with reliable operation at high temperatures, have a high initial adhesiveness typical of this application, and also exhibit acceptable chemical through-curing in industrial applications.

[0007] As part of this development, two routes are hypothesized for the production of silane-based formulations. Not only the silane treatment of existing reactive PU hot melt adhesives as described in more detail above, which chemically reacts the isocyanate groups of the adhesive with a secondary aminosilane, but on the other hand, commercially available silane binders are formulated with crystalline or amorphous resins for the purpose of achieving high initial adhesion.

[0008] For example, International Publication No. WO 2007 / 074143 A1 describes a moisture-curing hot melt adhesive composition based on a silane-functionalized polyurethane prepolymer.

[0009] International Publication No. WO 2013 / 026654 A1 describes a crosslinkable composition based on an organilyoxysilane-terminated polymer. In this context, blends of alpha-silanes such as Geniosil® STP-E10 and silicone resins are described, as in German Patent Application Publication No. DE 10 2013 213 835.

[0010] International Publication No. WO 2011 / 087741 A2 describes an adhesive for binding books and related articles, and the production of such an adhesive having a silane-modified liquid polymer. The adhesive is said to have a reduced monomeric diisocyanate content or to be free of monomeric diisocyanate.

[0011] In both cases, the results were not initially satisfactory. The resulting formulations had either too low initial adhesion, poor roll stability, or too slow through-cure. SUMMARY OF THE INVENTION PROBLEM TO BE SOLVED BY THE INVENTION

[0012] Candidates for improving the initial adhesion include polyesters and polyacrylate resins. For polyester resins, there is a risk of degradation by hydrolysis, which is catalyzed by typical silane adhesion promoters such as aminosilanes. On the other hand, suitable crystalline polyacrylate resins must be melted at very high temperatures (approximately 150 °C). However, at these temperatures, commercially available polyether-based silane binders lack stability.

[0013] Accordingly, an object of the present invention was to provide a reactive hot melt adhesive composition that does not exhibit the above disadvantages at all or exhibits them to a lesser extent at least.

Means for Solving the Problems

[0014] The above object is based on the total weight of the composition, a) 3 wt% to 49 wt% of at least one alpha-silane-terminated organic polymer, b) from 1 wt% to less than 20 wt%, preferably 1 wt% to 10 wt% of at least one acrylate resin-based polymer, c) 1 wt% to 20 wt%, preferably 1 wt% to 10 wt% of at least one compound that is liquid at at least 100 °C and in which at least one acrylate resin-based polymer dissolves at at least 150 °C, d) 0.001 wt% to 5 wt%, preferably 0.001 wt% to 1 wt% of at least one low molecular weight silane containing a primary or secondary amino group or a blocked amino group that hydrolyzes to a primary or secondary amino group is achieved by a reactive hot melt adhesive composition containing.

[0015] The above object is also a method for producing a reactive hot melt adhesive composition according to the present invention, (a) At a temperature within the range of 130°C to 170°C, add at least one acrylate resin polymer to at least one compound that is liquid at at least 100°C and in which at least one acrylate resin polymer dissolves at at least 150°C, or add it to a mixture containing at least one compound; (b) Cooling the mixture to a temperature within the range of 80°C to 120°C; (c) Adding at least one alpha-silane-terminated organic polymer to the cooled mixture; (d) Adding at least one low molecular weight silane containing a primary or secondary amino group or a blocked amino group that hydrolyzes to a primary or secondary amino group to obtain the reactive hot melt adhesive composition described in the present invention. The above was achieved by a method including the steps described above.

[0016] The above object was also achieved by a method of surface lamination including the step of applying the reactive hot melt adhesive composition according to the present invention to a substrate by an applicator roll.

Embodiments for Carrying Out the Invention

[0017] The requirements for a roll-stable adhesive at a processing temperature of 100 to 120°C with an acceptable through-cure rate are surprisingly achieved by a binder based on a silane-terminated polymer (so-called alpha-silane). Here, a compound that is liquid up to at least 100°C is used, and also at least one low molecular weight silane containing a primary or secondary amino group or a blocked amino group that hydrolyzes to a primary or secondary amino group is used, and an acrylate resin polymer that can be dissolved up to at least 150°C is employed. In this way, it is possible to produce a hydrolysis-stable formulation having satisfactory initial adhesiveness. Furthermore, the reactive hot melt adhesive composition of the present invention has a high crosslink density, which can account for good plasticizer stability.

[0018] Accordingly, the reactive hot melt adhesive composition according to the present invention is a moisture-crosslinkable adhesive formulation that has a low viscosity at 100° C., high roll stability, is based on an alpha-silane terminated polymer, exhibits a sufficiently high initial adhesiveness for surface lamination at room temperature, and cures through penetration at a sufficient rate from a chemical viewpoint. The condensation reaction during the curing process results in the elimination of alcohol (more specifically methanol, and optionally ethanol as well), accompanied by the formation of siloxane groups.

[0019] Looking more specifically, with regard to alpha-silanes, it is known that due to the donor atom (e.g., a nitrogen atom) located at the alpha position with respect to the silicon atom (alpha effect), there is a mainly autocatalytic two-step condensation reaction of alkoxysilanes. The reactive hot melt adhesive composition according to the present invention is promoted by an aminosilane and functions without using additional co-catalysts such as tin organics (organotin compounds) or diazabicycloundecene. Surprisingly, as part of the present invention, it has been found that formulations containing alpha-silanes are roll stable at 100° C. for approximately 30 to 60 minutes without confinement under conventional ambient conditions (room temperature of approximately 20 to 23° C., ambient humidity of approximately 30 to 65% r.h.) and chemically cure through penetration at a sufficient rate despite the gentle promotion and without using additional co-catalysts.

[0020] The present invention accordingly relates to a reactive hot melt adhesive composition. The term "hot melt adhesive" as used herein describes in general terms an adhesive that is solid at room temperature or has a high shear modulus and is in liquid form at elevated temperatures, typically in the range of 100° C. to 120° C. The hot melt adhesive is applied in liquid form and re-solidifies, thus again becoming solid at room temperature or having a high shear modulus. A further characteristic of "reactive" hot melt adhesives is that they crosslink by means of a chemical reaction. In this case, there is usually a reaction with water, which contacts the hot melt adhesive, for example in the form of atmospheric humidity. It is thus referred to as moisture crosslinking. This also applies to the reactive high-temperature coating adhesive composition of the present invention.

[0021] The reactive high-temperature coating adhesive composition of the present invention is likewise liquid at a temperature of 100°C to 120°C. In this case, these adhesives customarily have a viscosity of 4000 mPas to 12000 mPas. The reactive high-temperature coating adhesive composition of the present invention preferably does not contain isocyanate.

[0022] The reactive hot melt adhesive composition according to the present invention contains components a) to d). The composition of the present invention may further contain additional constituents. Thus, one embodiment of the present invention relates to a reactive hot melt adhesive composition consisting of components a) to d). Another embodiment of the present invention relates to a reactive hot melt adhesive composition that further contains not only components a) to d) but also one or more components, such as two, three, four, five, six, seven, eight, nine, or ten components.

[0023] Component a) of the reactive hot melt adhesive composition of the present invention refers to at least one alpha-silane-terminated organic polymer. Thus, the reactive hot melt adhesive composition according to the present invention may contain one alpha-silane-terminated polymer, or two or more polymers, such as two, three, or four polymers. In this case, it is clear to a person skilled in the art that polymers are not pure compounds but instead exist as mixtures of compounds with characteristic compound distributions as a result of their manufacture, and thus "polymer" is a shorthand expression for this mixture of compounds.

[0024] Alpha-silane-terminated organic polymers are known to those skilled in the art and can be obtained commercially, for example. For example, Wacker Chemie AG, Munich (Germany) sells such alpha-silane-modified polymers under the name Geniosil® , for example under names such as Geniosil® STP-E10 or Geniosil® XB 502.

[0025] The characteristic of an alpha-silane is the so-called alpha effect. Due to this effect, the proximity of a donor having a negative charge, such as nitrogen or oxygen, which is at the alpha position relative to the silicon atom, that is, separated from the silicon atom by only one methylene bridge, has the effect of activating the alkoxy group on the silicon atom. These groups are therefore more reactive towards nucleophiles such as water. This in turn leads to accelerated hydrolysis, for example without the need for a tin-containing catalyst. The hydrolysis of the silane may involve crosslinking to form siloxanes. Therefore, the reactive hot melt adhesive composition of the present invention refers to an alpha-silane-terminated hot melt adhesive capable of undergoing a moisture crosslinking reaction to form siloxanes.

[0026] At least one alpha-silane-terminated organic polymer preferably has the formula * -X-C(=O)-N(R)-C(R 1 R 2 )-Si(R 3 ) a (OR 4 ) 3-a [wherein, X is O or N(R), each R is independently of any other, hydrogen, or a hydrocarbon radical having 1 to 20 carbon atoms, R 1 and R 2 are independently of each other, hydrogen, or a hydrocarbon radical having 1 to 20 carbon atoms, R 3 and R 4 are independently of each other, hydrocarbon radicals having 1 to 20 carbon atoms, a is 0, 1, or 2, 「 * 」 represents a bond for attachment to the polymer] and is a polymer containing various end groups.

[0027] More preferably, R is hydrogen or an alkyl radical containing 1 to 4 carbon atoms, and the alkyl radical may be linear or branched. Even more preferably, R is H, methyl, or ethyl, and even more preferably hydrogen or methyl.

[0028] Particularly more preferably, R is hydrogen. More preferably, R 1 and R 2 are the same. Further, more preferably, R 1 and R 2 is hydrogen or an alkyl radical containing 1 to 4 carbon atoms, and the alkyl radical may be linear or branched. Even more preferably, R 1 and R 2 are H, methyl, or ethyl, and even more preferably hydrogen or methyl.

[0029] Particularly more preferably, R 1 and R 2 is hydrogen. More preferably, R 3 and R 4 are the same. Further, more preferably, R 3 and R 4 is an alkyl radical containing 1 to 4 carbon atoms, and the alkyl radical may be linear or branched. Even more preferably, R 3 and R 4 are methyl or ethyl.

[0030] Particularly more preferably, R 3 and R 4 is methyl. Preferably, a is 1 or 2, and more preferably a is 1.

[0031] An exemplary at least one alpha-silane-terminated organic polymer is a polymer containing various end groups of the formula * -O-C(=O)-NH-CH2-Si(CH3)(OCH3)2.

[0032] The various end groups described in more detail above terminate the organic polymer. The organic polymer is preferably polyoxyalkylene, hydrocarbon polymer, polyurethane, polyester, polyamide, polyacrylate, polymethacrylate, or polycarbonate. Polyoxyalkylene is preferred. The organic polymer preferably does not contain additional silane groups other than the end groups listed above.

[0033] A preferred polyoxyalkylene is, for example, polypropylene having a number average molecular weight in the range of 5000 g / mol to 50000 g / mol, more preferably 7500 g / mol to 30000 g / mol, and even more preferably 10000 g / mol to 15000 g / mol.

[0034] Component a) has a proportion of 3 wt% to 49 wt% based on the total weight of the composition. The proportion is preferably 3 to 20 wt%, more preferably 5 to 20 wt%.

[0035] The reactive hot melt adhesive composition according to the present invention further comprises at least one acrylate resin-based polymer as component b). Thus, the composition of the present invention may contain one or more acrylate-based polymers, for example, 2, 3, or 4. In this case, it is clear to those skilled in the art that the polymers are not pure compounds, but instead exist as mixtures of compounds having characteristic compound distributions as a result of their manufacture, and thus "polymer" is a shorthand for this mixture of compounds. Component b) preferably contains only one acrylate resin-based polymer.

[0036] When component a) as the organic polymer is also an acrylate resin-based polymer, components a) and b) can be distinguished from each other in that component b) does not contain alpha-silane end groups.

[0037] The acrylate polymer is preferably a homoacrylate, a homomethacrylate, a copolymer of at least two different acrylates, a copolymer of at least two different methacrylates, or a copolymer of at least one acrylate and at least one methacrylate.

[0038] The proportion of component b) is 1 wt% to 20 wt% based on the total weight of the reactive hot melt adhesive composition of the present invention. The proportion is preferably 1 wt% to 10 wt%. More preferably, the proportion is 8 wt% to 9 wt%.

[0039] The purpose of component b) is to obtain sufficient initial adhesiveness. In this regard, a copolymer composed of methyl methacrylate and n-butyl methacrylate is particularly preferred.

[0040] The at least one acrylate resin-based polymer may be crystalline, semi-crystalline, or amorphous, and thus has a melting point, a melting temperature range (in this case, the temperature point on the low-temperature side is called the melting point), or a glass transition temperature. This temperature is preferably in the range of 30°C to 300°C, more preferably in the range of 30°C to 250°C, even more preferably in the range of 30°C to 150°C, even more preferably in the range of 30°C to 80°C, even more preferably in the range of 40°C to 75°C, even more preferably in the range of 50°C to 70°C, and more specifically, it is at 60°C. Since the at least one acrylate resin-based polymer is preferably amorphous, the temperature value specified in that case refers to its glass transition temperature.

[0041] At least one acrylate resin-based polymer preferably has an average weight-average molar weight in the range of 10,000 g / mol to 150,000 g / mol. More preferably, it is in the range of 25,000 g / mol to 125,000 g / mol, even more preferably in the range of 30,000 g / mol to 110,000 g / mol, even more preferably in the range of 35,000 g / mol to 100,000 g / mol, even more preferably in the range of 40,000 g / mol to 90,000 g / mol, even more preferably in the range of 45,000 g / mol to 80,000 g / mol, even more preferably in the range of 50,000 g / mol to 70,000 g / mol, and more specifically, the average weight-average molar weight is 60,000 g / mol.

[0042] As component c), the reactive hot melt adhesive composition contains at least one compound that is liquid at at least 100 °C and in which at least one acrylate resin-based polymer dissolves at at least 150 °C.

[0043] In the context of the present invention, "dissolves at at least 150 °C" refers to the dissolution of the solid acrylic resin-based polymer. However, dissolution may also occur at lower temperatures. When the melting point or melting temperature range or glass transition temperature is less than 150 °C, "dissolves" refers to the formation of a single-phase mixture with the compound.

[0044] Component c) may contain one compound, or two or more compounds, for example, two, three, or four compounds. Advantageously, this contains only one compound. Component c) is different from component a) or b). Therefore, a compound should be considered as component c) if it is in liquid form by itself up to at least 100 °C, is different from components a) and b), and is capable of dissolving component b) at at least 150 °C within the range of its possible proportion as a proportion of the whole composition.

[0045] The proportion of component c) is 1 wt% to 20 wt% based on the total weight of the reactive high-temperature coating adhesive composition of the present invention. The proportion is preferably 1 wt% to 10 wt%. More preferably, the proportion is 6 wt%.

[0046] The only important element for the compound is, apart from the dissolving power, to exist as a liquid at least at 100 °C. Many compounds can be used and those skilled in the art can find suitable compounds by simple dissolution tests. The following are exemplary compounds that can be used.

[0047] At least one compound that is liquid at least at 100 °C and in which at least one acrylate resin-based polymer dissolves at least at 150 °C may advantageously be a plasticizer.

[0048] Exemplary plasticizers are known in the prior art. In this connection, reference can be made to the examples listed in DIN EN ISO 1043-3 (2017-03).

[0049] Therefore, examples of plasticizers are as follows:

[0050]

Table 1-1

[0051]

Table 1-2

[0052] Such plasticizers are commercially available. An example is Hexamoll® DINCH from BASF SE, Ludwigshafen (Germany). Diisononyl 1,2-cyclohexanedicarboxylate or isodecyl benzoate is preferred.

[0053] It is also possible that the at least one compound which is liquid at at least 100°C and in which at least one acrylate resin-based polymer dissolves at at least 150°C is a polyalkylene glycol. Preferred polyalkylene glycols are polyethylene glycol and polypropylene glycol, more preferably polypropylene glycol. The polyalkylene glycol preferably has a number average molecular weight in the range of 500 g / mol to 5000 g / mol, more preferably in the range of 750 g / mol to 4000 g / mol, still more preferably in the range of 1000 g / mol to 3000 g / mol, and more specifically the number average molecular weight is 2000 g / mol.

[0054] It is also possible that the at least one compound which is liquid at at least 100°C and in which at least one acrylate resin-based polymer dissolves at at least 150°C is an alkoxysilane. Alkoxysilanes are commercially available. Examples that can be cited are those having the trade name Tegopac (registered trademark) of Evonik Industries AG, Essen, Germany. This is a binder containing pendant crosslinking ethoxysilane.

[0055] The reactive hot melt adhesive composition of the present invention further comprises a component d) containing at least one low molecular weight silane containing a primary or secondary amino group, preferably a primary amino group, or a blocked amino group which hydrolyzes to a primary or secondary amino group. Thus, component d) may contain one or more such silanes, for example 2, 3, or 4, etc. Preferably, component d) consists of only one component. Component d) is different from components a) to c), and thus is simply considered as component d) if it cannot be construed as one of components a) to c).

[0056] At least one low molecular weight silane of component d) contains a primary amino group -NH2. This amino group may be part of a functional group such as an amide group -C(=O)NH2, or it may be a primary amine in the narrow sense. Advantageously, this is an amine. Low molecular weight silanes containing secondary amino groups may also be used. It is also possible to use blocked aminosilanes. In this case, the blocked amino group hydrolyzes to a primary or secondary amino group, preferably a primary amino group. An example is ((triethoxysilyl)propyl)methylisobutylimine, sold under the trademark VPS 1262 by Evonik (Germany). Here too, the amino group may be part of a functional group or it may be an amino group, with the amino group being preferred. It is of course possible for there to be two or more primary amino groups, and more particularly, two or more primary amino groups, two or more secondary amino groups, and at least one primary amino group and at least one secondary amino group may be present. It is also of course possible for their blocked forms to be present instead of the primary or secondary amino groups. However, primary or secondary, more preferably primary amino groups are preferred.

[0057] Advantageous low molecular weight silanes have a molecular weight in the range of 100 g / mol to 500 g / mol.

[0058] Preferred low molecular weight silanes are described in German Patent Application Publication No. 102012200790. Accordingly, preferred low molecular weight silanes have the formula DSi(OR 7’ ) g’ R 8’ (3-g’) (IX) [wherein, R 7’ may be the same or different and is a hydrogen atom or an optionally substituted hydrocarbon radical, D may be the same or different and is a monovalent SiC-bonded radical having a basic nitrogen of a primary, or secondary, or blocked amino group, R 8’may be the same or different and are monovalent, optionally substituted SiC-bonded organic radicals that do not contain basic nitrogen, g’ is 1, 2, or 3, preferably 2 or 3] and contain units of

[0059] Optionally substituted hydrocarbon radical R 7’ Examples of 3’ radical R are the examples shown below for radical R

[0060] Radical R 7’ is preferably a hydrogen atom and a hydrocarbon radical optionally substituted with halogen atoms having 1 to 18 carbon atoms, more preferably a hydrogen atom and a hydrocarbon radical having 1 to 10 carbon atoms, and more particularly methyl and ethyl radicals.

[0061] Radical R 8’ Examples of 3’ radical R are the examples shown below for R Radical R 8’ is preferably a hydrocarbon radical optionally substituted with halogen atoms having 1 to 18 carbon atoms, more preferably a hydrocarbon radical having 1 to 5 carbon atoms, and more particularly includes a methyl radical.

[0062] Examples of radical D are the formulas H2N(CH2)3-, H2N(CH2)2NH(CH2)3-, H2N(CH2)2NH(CH2)2NH(CH2)3-, H3CNH(CH2)3-, C2H5NH(CH2)3-, C3H7NH(CH2)3-, C4H9NH(CH2)3-, C5H 11 NH(CH2)3-, C6H 13 NH(CH2)3-, C7H 15 NH(CH2)3-, H2N(CH2)4-, H2N-CH2-CH(CH3)-CH2-, H2N(CH2)5-, cyclo-C5H9NH(CH2)3-, cyclo-C6H 11NH(CH2)3-, phenyl-NH(CH2)3-, (CH3)2N(CH2)3-, (C2H5)2N(CH2)3-, (C3H7)2NH(CH2)3-, (C4H9)2NH(CH2)3-, (C5R 11 )2NH(CH2)3-, (C6H 13 )2NH(CH2)3-, (C7H 15 )2NH(CH2)3-, H2N(CH2)-, H2N(CH2)2NH(CH2)-, H2N(CH2)2NH(CH2)2NH(CH2)-, H3CNH(CH2)-, C2H5NH(CH2)-, C3H7NH(CH2)-, C4H9NH(CH2)-, C5H 11 NH(CH2)-, C6H 13 NH(CH2)-, C7H 15 NH(CH2)-, cyclo-C5H9NH(CH2)-, cyclo-C6H 11 NH(CH2)-, phenyl-NH(CH2)-, (CH3)2N(CH2)-, (C2H5)2N(CH2)-, (C3H7)2NH(CH2)-, (C4H9)2NH(CH2)-, (C5H 11 )2NH(CH2)-, (C6H 13 )2NH(CH2)-, (C7H 15 )2NH(CH2)-, (CH3O)3Si(CH2)3NH(CH2)3-, (C2H5O)3Si(CH2)3NH(CH2)3-, (CH3O)2(CH3)Si(CH2)3NH(CH2)3-, and (C2H5O)2(CH3)Si(CH2)3NH(CH2)3- radicals, and also radicals of reaction products with compounds containing an epoxide group or a double bond that are reactive towards the above primary amino groups and primary amino groups (blocked amino groups).

[0063] Examples of the silanes of formula (IX) are H2N(CH2)3-Si(OCH3)3, H2N(CH2)3-Si(OC2H5)3, H2N(CH2)3-Si(OCH3)2CH3, H2N(CH2)3-Si(OC2H5)2CH3, H2N(CH2)2NH(CH2)3-Si(OCH3)3, H2N(CH2)2NH(CH2)3-Si(OC2H5)3, H2N(CH2)2NH(CH2)3-Si(OCH3)2CH3, H2N(CH2)2NH(CH2)3-Si(OC2H5)2CH3, H2N(CH2)2NH(CH2)3-Si(OH)3, H2N(CH2)2NH(CH2)3-Si(OH)2CH3, H2N(CH2)2NH(CH2)2NH(CH2)3Si-(OCH3)3, H2N(CH2)2NH(CH2)2NH(CH2)3-Si(OC2H5)3, cyclo-C6H 11 NH(CH2)3Si-(OCH3)3, cyclo-C6H 11 NH(CH2)3-Si(OC2H5)3, cyclo-C6H 11 NH(CH2)3-Si(OCH3)2CH3, cyclo-C6H 11 NH(CH2)3-Si(OC2H5)2CH3, cyclo-C6H 11 NH(CH2)3-Si(OH)3, cyclo-C6H 11 NH(CH2)3-Si(OH)2CH3, phenyl-NH(CH2)3-Si(OCH3)3, phenyl-NH(CH2)3-Si(OC2H5)3, phenyl-NH(CH2)3-Si(OCH3)2CH3, phenyl-NH(CH2)3-Si(OC2H5)2CH3, phenyl-NH(CH2)3-Si(OH)3, phenyl-NH(CH2)3-Si(OH)2CH3, HN((CH2)3-Si(OCH3)3)2, HN((CH2)3-Si(OC2H5)3)2HN((CH2)3-Si(OCH3)2CH3)2, HN((CH2)3-Si(OC2H5)2CH3)2, cyclo-C6H 11 NH(CH2)-Si(OCH3)3, cyclo-C6H 11 NH(CH2)-Si(OC2H5)3, cyclo-C6H 11 NH(CH2)-Si(OCH3)2CH3, cyclo-C6H 11NH(CH2)-Si(OC2H5)2CH3, cyclo-C6H 11 NH(CH2)-Si(OH)3, cyclo-C6H 11 NH(CH2)-Si(OH)2CH3, phenyl-NH(CH2)-Si(OCH3)3, phenyl-NH(CH2)-Si(OC2H5)3, phenyl-NH(CH2)-Si(OCH3)2CH3, phenyl-NH(CH2)-Si(OC2H5)2CH3, phenyl-NH(CH2)-Si(OH)3, and phenyl-NH(CH2)-Si(OH)2CH3, and also their partial hydrolyzates, H2N(CH2)2NH(CH2)3-Si(OCH3)3, H2N(CH2)2NH(CH2)3-Si(OC2H5)3, H2N(CH2)2NH(CH2)3-Si(OCH3)2CH3, cyclo-C6H 11 NH(CH2)3-Si(OCH3)3, cyclo-C6H 11 NH(CH2)3-Si(OC2H5)3, and cyclo-C6H 11 NH(CH2)3-Si(OCH3)2CH3, and also their partial hydrolyzates in each case are preferred, H2N(CH2)2NH(CH2)3-Si(OCH3)3, H2N(CH2)2NH(CH2)3-Si(OCH3)2CH3, cyclo-C6H 11 NH(CH2)3-Si(OCH3)3, cyclo-C6H 11 NH(CH2)3-Si(OCH3)2CH3, and also their partial hydrolyzates in each case are particularly preferred.

[0064] N-(2-aminoethyl)-3-aminopropyltrimethoxysilane, 3-aminopropyltrimethoxysilane, 3-(2-aminoethylamino)propyltriethoxysilane, N-(2-aminoethyl)-3-aminopropyldimethoxysilane, or 3-ureidopropyltrimethoxysilane are also particularly preferred examples. Particularly preferred is 3-aminopropyltrimethoxysilane.

[0065] The proportion of component d) is 0.001 wt% to 5 wt% based on the total weight of the reactive hot melt adhesive composition of the present invention. The proportion is preferably 0.001 wt% to 1 wt%. More preferably, the proportion is 0.2 wt%.

[0066] In addition to components a) to d) listed above, the reactive high-temperature coating adhesive composition of the present invention may contain additional components.

[0067] Therefore, the reactive high-temperature coating adhesive composition of the present invention may contain at least one silicone resin such as a phenyl silicone resin. The silicone resin is described, for example, in German Patent Application Publication No. 102013213835. If the silicone resin is not yet one of the components specified above, it shall be considered an additional component in the context of the present invention.

[0068] The conceivable silicone resin according to German Patent Application Publication No. 102013213835 is therefore of the formula R 3’ c’ (R 4’ O) d’ R 5’ e’ SiO (4-c’-d’-e’) / 2 (II) [wherein, R 3’ may be the same or different and is a hydrogen atom, or a monovalent, SiC-bonded, optionally substituted aliphatic hydrocarbon radical, or a divalent, optionally substituted aliphatic hydrocarbon radical that crosslinks two units of formula (II), R 4’ may be the same or different and is a hydrogen atom, or a monovalent, optionally substituted hydrocarbon radical, R 5’ may be the same or different and is a monovalent, SiC-bonded, optionally substituted aromatic hydrocarbon radical, c’ is 0, 1, 2, or 3, d’ is 0, 1, 2, or 3, preferably 0, 1, or 2, more preferably 0 or 1, e’ is 0, 1, or 2, preferably 0 or 1, wherein the sum of c’ + d’ + e’ is 3 or less, e’ is non-zero in at least one unit, and the sum c’ + e’ is 0 or 1 in at least 40% of the units of formula (II). It contains units of

[0069] Suitable silicone resins preferably consist of at least about 90 wt% of the units of formula (II), more preferably consist only of the units of formula (II).

[0070] Radical R 3’ Examples of are alkyl radicals such as methyl, ethyl, n-propyl, isopropyl, 1-n-butyl, 2-n-butyl, isobutyl, tert-butyl, n-pentyl, isopentyl, neopentyl, tert-pentyl radicals, etc.; hexyl radicals such as n-hexyl radical, etc.; heptyl radicals such as n-heptyl radical, etc.; octyl radicals such as n-octyl radical, isooctyl radical, and 2,2,4-trimethylpentyl radical, etc.; nonyl radicals such as n-nonyl radical, etc.; decyl radicals such as n-decyl radical, etc.; dodecyl radicals such as n-dodecyl radical, etc.; octadecyl radicals such as n-octadecyl radical, etc.; cycloalkyl radicals such as cyclopentyl, cyclohexyl, cycloheptyl radical, and methylcyclohexyl radical, etc.; alkenyl radicals such as vinyl, 1-propenyl, and 2-propenyl radicals, etc.; aryl radicals such as phenyl, naphthyl, anthryl, and phenanthryl radicals, etc.; alkaryl radicals such as o-, m-, p-tolyl radicals, etc.; such as xylyl radicals and ethylphenyl radicals, etc.; and aralkyl radicals such as benzyl radical, o- and β-phenylethyl radicals, etc.

[0071] Substituted radical R 3’Examples are haloalkyl radicals such as 3,3,3-trifluoro-n-propyl radical, 2,2,2,2’,2’,2’-hexafluoroisopropyl radical, and heptafluoroisopropyl radical, and haloaryl radicals such as o-, m-, and p-chlorophenyl radicals, etc.

[0072] Radical R 3’ is preferably a monovalent hydrocarbon radical having 1 to 6 carbon atoms, optionally substituted with a halogen atom, more preferably an alkyl radical having 1 or 2 carbon atoms, and more particularly includes a methyl radical. Radical R 3’ may alternatively include a divalent aliphatic radical that bonds two silyl groups of formula (II) to each other, such as an alkylene radical having 1 to 10 carbon atoms, such as a methylene, ethylene, propylene, or butylene radical, etc.

[0073] However, preferably, radical R 3’ is a monovalent, SiC-bonded aliphatic hydrocarbon radical having 1 to 18 carbon atoms, optionally substituted with a halogen atom, more preferably an aliphatic hydrocarbon radical having 1 to 6 carbon atoms, and more particularly includes a methyl radical.

[0074] Radical R 4’ is an example of a hydrogen atom or radical R 3’ as specified for. Radical R 4’ is preferably a hydrogen atom or an alkyl radical having 1 to 10 carbon atoms, optionally substituted with a halogen atom, more preferably an alkyl radical having 1 to 4 carbon atoms, and more particularly includes methyl and ethyl radicals.

[0075] Radical R 5’ is an example of the aromatic radical specified above for R 3’ . Radical R 5’Preferably, it contains a SiC-bonded aromatic hydrocarbon radical having 1 to 18 carbon atoms, optionally substituted with a halogen atom, such as an ethylphenyl, tolyl, xylyl, chlorophenyl, naphthyl, or styryl radical, more preferably a phenyl radical.

[0076] All radicals R 3’ At least 90% of which are methyl radicals, and all radicals R 4’ At least 90% of which are methyl, ethyl, propyl, or isopropyl radicals, and all radicals R 5’ It is preferred to use a silicone resin in which at least 90% of the radicals are phenyl radicals.

[0077] Preferred silicone resins contain at least 40%, more preferably at least 60%, of the units of formula (II) in which c' is 0, based on the total number of units of formula (II) in each case.

[0078] The preferred silicone resins used contain at least 70%, more preferably at least 80%, of the units of formula (II) in which d' has a value of 0 or 1, based on the total number of units of formula (II) in each case.

[0079] The preferred silicone resins used contain at least 20%, more preferably at least 40%, of the units of formula (II) in which e' has a value of 1, based on the total number of units of formula (II) in each case. A silicone resin containing only the units of formula (II) in which e' is 1 may be used, but more preferably, a silicone resin containing at least 10%, more preferably at least 20%, and 60% or less, more preferably 80% or less, of the units of formula (II) in which e' is 0 may also be used.

[0080] The preferred silicone resins used contain, in each case, based on the total number of units of formula (II), at least 50%, more preferably at least 70%, more particularly at least 80% of the units of formula (II) in which c'+e' = 1.

[0081] One particularly preferred embodiment of the invention uses a silicone resin which, in each case, based on the total number of units of formula (II), contains at least 20%, more preferably at least 40% of the units of formula (II) in which e' has a value of 1 and c' has a value of 0. Preferably in this case, not more than 40%, more preferably not more than 70% of all the units of formula (II) have a d' other than 0.

[0082] A further particularly preferred embodiment of the invention uses a silicone resin which, in each case, based on the total number of units of formula (II), contains at least 20%, more preferably at least 40% of the units of formula (II) in which e' has a value of 1 and c' has a value of 0 and also contains at least 1%, preferably at least 10% of the units of formula (II) in which c' is 1 or 2, preferably 1 and e' is 0.

[0083] Examples of silicone resins are the (Q) units of formula SiO 4 / 2 , Si(OR 4’ )O 3 / 2 , Si(OR 4’ )2O 2 / 2 , and Si(OR 4’ )3O 1 / 2 , the (T) units of formula PhSiO 3 / 2 , PhSi(OR 4’ )O 2 / 2 , PhSi(OR 4’ )2O 1 / 2 , MeSiO 3 / 2 , MeSi(OR 4’ )O 2 / 2 , and MeSi(OR 4’ )2O 1 / 2 , the (T) units of formula Me2SiO 2 / 2 , Me2Si(OR 4’ )O 1 / 2 , Ph2SiO 2 / 2 and Ph2Si(OR4’ )O 1 / 2 , MePhSiO 2 / 2 and MePhSi(OR 4’ )O 1 / 2 units of (D), and units of Me3SiO 1 / 2 substantially consisting of units of (M), preferably consisting only of these, is an organopolysiloxane resin, wherein Me is a methyl radical, Ph is a phenyl radical, and R 4’ is a hydrogen atom, or an alkyl radical optionally substituted with a halogen atom when having 1 to 10 carbon atoms, more preferably a hydrogen atom, or an alkyl radical having 1 to 4 carbon atoms, and the resin contains 0 to 2 mol of (Q) units, 0 to 2 mol of (D) units, and 0 to 2 mol of (M) units per 1 mol of (T) units.

[0084] Examples of preferred silicone resins are units of PhSiO 3 / 2 , PhSi(OR 4’ )O 2 / 2 , and PhSi(OR 4’ )2O 1 / 2 of the T units, units of MeSiO 3 / 2 , MeSi(OR 4’ )O 2 / 2 , and MeSi(OR 4’ )2O 1 / 2 of the T units, and units of Me2SiO 2 / 2 and Me2Si(OR 4’ )O 1 / 2 of the D units, substantially consisting of, preferably consisting only of, an organopolysiloxane resin, wherein Me is a methyl radical, Ph is a phenyl radical, and R 4’ is a hydrogen atom, or an alkyl radical optionally substituted with a halogen atom when having 1 to 10 carbon atoms, more preferably a hydrogen atom, or an alkyl radical having 1 to 4 carbon atoms, and the molar ratio of (T) units to (D) units is 0.5 to 2.0.

[0085] Among these examples, a particularly preferred silicone resin is such that the units of formula (II) are at least 50%, preferably at least 70%, more particularly at least about 85% up to the units of PhSiO3 / 2 , PhSi(OR 4’ )O 2 / 2 , PhSi(OR 4’ )2O 1 / 2 , MeSiO 3 / 2 , MeSi(OR 4’ )O 2 / 2 , and MeSi(OR 4’ )2O 1 / 2 and are composed of T units of these, and these silicone resins contain at least 30%, preferably at least 40%, more particularly at least 50% of the T units of the formulas PhSiO 3 / 2 , PhSi(OR 4’ )O 2 / 2 , and PhSi(OR 4’ )2O 1 / 2 , and at least 10%, preferably at least 15%, more particularly at least 20% of the T units of MeSiO 3 / 2 , MeSi(OR 4’ )O 2 / 2 , and MeSi(OR 4’ )2O 1 / 2 .

[0086] Such silicone resins preferably have an average molar mass (number average) Mn of at least 500 g / mol, more preferably at least 600 g / mol. The average molar mass Mn is preferably 400000 g / mol or less, more preferably 100000 g / mol or less, more particularly 50000 g / mol or less.

[0087] Such silicone resins at 23 °C and 1000 hPa may be either solid or liquid, and the silicone resins are preferably liquid.

[0088] The silicone resins are commercially conventional products (e.g., Silres® IC 368 from Wacker Chemie (Germany)), or they may be produced by methods common in silicon chemistry.

[0089] Furthermore, the reactive hot melt adhesive composition according to the present invention may further contain at least one tackifier polymer (tackifier). The proportion is preferably 10 wt% to 40 wt% based on the total weight of the composition.

[0090] Furthermore, the reactive hot melt adhesive composition according to the present invention may further contain at least one filler. Advantageously, their proportion is 10 wt% to 40 wt% based on the total weight of the composition. Exemplary fillers are calcium carbonate such as chalk, or α-alumina such as high-grade α-alumina. By using fillers, it is possible to prevent or reduce stringing when the adhesive composition is processed.

[0091] A high level of filling can be achieved using the reactive hot melt adhesive composition of the present invention, which may be advantageous in various applications. Examples that can be mentioned here include applications that require high thermal conductivity or applications that have specific requirements regarding combustion behavior.

[0092] A further aspect of the present invention is a method for producing the reactive hot melt adhesive composition according to the present invention, the method comprising steps a) to d).

[0093] Here, in the first step (a), at least one acrylate resin-based polymer is added to at least one compound that is liquid at at least 100°C and in which at least one acrylate resin-based polymer dissolves at at least 150°C.

[0094] The at least one acrylic resin-based polymer may also be added to a mixture containing at least one compound.

[0095] The addition is carried out at a temperature in the range of 130°C to 170°C, preferably in the range of 140°C to 160°C, and more specifically at 150°C.

[0096] It is further possible to add a tackifier polymer in step (a). In the following step (b), the mixture is cooled to a temperature within the range of 80°C to 120°C.

[0097] Subsequently, as step (c), at least one alpha-silane-terminated organic polymer is added to the cooled mixture.

[0098] Finally, in step (d), at least one low molecular weight silane containing at least one primary or secondary amino group, preferably a primary amino group, or a blocked amino group that hydrolyzes to a primary or secondary amino group is added to obtain the reactive hot melt adhesive composition according to the present invention.

[0099] In step (c), further, at least one filler may be added. Steps (c) and (d) are preferably carried out sequentially so that degassing can be performed between steps.

[0100] The reactive hot melt adhesive composition of the present invention has roll stability and is therefore suitable for coating by a roll. Accordingly, the reactive hot melt adhesive composition of the present invention is particularly suitable for a method of surface lamination in which the reactive hot melt adhesive composition according to the present invention is applied to a substrate by an applicator roll.

[0101] Surprisingly, it has been found that even when exceeding the roll stability time, i.e., when the binder during processing shows significant stringing that determines the impression after coating, the coating can be done cleanly by a roll coater.

[0102] Accordingly, a further subject of the present invention is the use of the reactive hot melt composition of the present invention in roll coating.

[0103] The advantageous application of the reactive hot melt adhesive composition of the present invention results from their good adhesion, including initial adhesion. Even in the absence of roll coating, as in the case of using it for the exterior of window profiles, the advantageous properties described below are evident. Other applications are those that can achieve improved thermal conductivity. Applications related to improved combustion behavior can also be mentioned.

[0104] The obvious advantages include, in particular, the following: - The absence of isocyanate, - A good adhesion range, especially on metals, glass, and other materials - The absence of foaming due to CO2 generation.

Examples

[0105] The present invention will be described in more detail using the following examples, and the present invention is not limited to these examples.

[0106] Examples Example 1 60 g of DINCH, 344 g of DERTOPHENE T, 7 g of MODAREZ MFP L, and 7 g of IRGANOX 1135 were mixed in a planetary mixer with a butterfly stirrer under reduced pressure (50 mbar) at 150 °C. Then 80 g of ELVACITE 2016 was added in small portions, and the mixture was stirred until homogeneous. The solution was cooled to 100 °C, 200 g of GENIOSIL XB 502 was added, 300 g of CALCIT MX 30 was dispersed, and the mixture was degassed under a reduced pressure of 50 mbar for 10 minutes. Finally, 2 g of GENIOSIL GF 96 was added and stirred, and the mixture was stirred for a further 2 minutes (see Table 1).

[0107]

Table 2

[0108] The physicochemical properties of the resulting formulation can be summarized as follows: Viscosity (100 °C, 3.4 s-1 In (): 10 Pa·s.

[0109] Example 2 60 g of Desmophen 2061 BD (polypropylene glycol 2000), 344 g of DERTOPHENE T, 7 g of MODAREZ MFP L, and 7 g of IRGANOX 1135 were mixed in a planetary mixer with a butterfly stirrer under reduced pressure (50 mbar) at 150 °C. Then 80 g of ELVACITE 2016 was added in small portions and the mixture was stirred until homogeneous. The solution was cooled to 100 °C, 200 g of GENIOSIL XB 502 was added, 300 g of CALCIT MX 30 was dispersed, and the mixture was degassed under a reduced pressure of 50 mbar for 10 minutes. Finally, 2 g of GENIOSIL GF 96 was added and stirred, and the mixture was stirred for an additional 2 minutes (see Table 2a).

[0110] [Table 3]

[0111] The physicochemical properties of the resulting formulation can be summarized as follows: Viscosity (at 100 °C, 3.4 s -1 In (): 10 Pa·s. The build-up of lap shear strength by the resulting formulation is summarized in Table 2b.

[0112] [Table 4]

[0113] Example 3 60 g of Jayflex MB10 (isodecyl benzoate), 344 g of DERTOPHENE T, 7 g of MODAREZ MFP L, and 7 g of IRGANOX 1135 were mixed in a planetary mixer with a butterfly stirrer under reduced pressure (50 mbar) at 150 °C. Then 80 g of ELVACITE 2016 was added in small portions and the mixture was stirred until homogeneous. The solution was cooled to 100 °C, 200 g of GENIOSIL XB 502 was added, 300 g of CALCIT MX 30 was dispersed, and the mixture was degassed under a reduced pressure of 50 mbar for 10 minutes. Finally, 2 g of GENIOSIL GF 96 was added and stirred, and the mixture was stirred for an additional 2 minutes (see Table 3).

[0114]

Table 5

[0115] The physicochemical properties of the resulting formulation can be summarized as follows: Viscosity (at 100 °C, 3.4 s -1 ): 10 Pa·s.

[0116] Example 4 60 g of TEGOPAC BOND 251, 344 g of DERTOPHENE T, 7 g of MODAREZ MFP L, and 7 g of IRGANOX 1135 were mixed in a planetary mixer with a butterfly stirrer under reduced pressure (50 mbar) at 150 °C. Then 80 g of ELVACITE 2016 was added in small portions and the mixture was stirred until homogeneous. The solution was cooled to 100 °C, 200 g of GENIOSIL XB 502 was added, 300 g of CALCIT MX 30 was dispersed, and the mixture was degassed under a reduced pressure of 50 mbar for 10 minutes. Finally, 2 g of GENIOSIL GF 96 was added and stirred, and the mixture was stirred for an additional 2 minutes (see Table 4).

[0117]

Table 6

[0118] The physicochemical properties of the resulting formulation can be summarized as follows: viscosity (at 100 °C, 3.4 s -1 ): 10 Pa·s.

[0119] Example 5 60 g of TEGOPAC BOND 251, 144 g of SYLVARES 525 7 g of MODAREZ MFP L, and 7 g of IRGANOX 1135 were mixed in a planetary mixer with a butterfly stirrer under reduced pressure (50 mbar) at 150 °C. Then 80 g of ELVACITE 2016 was added in small portions and the mixture was stirred until homogeneous. The solution was cooled to 100 °C and 200 g of GENIOSIL XB 502 was added. 250 g of Edelkorund F 1200 and 250 g of Edelkorund Fepa Nr. F 220 were each dispersed in this mixture and the mixture was degassed under a reduced pressure of 50 mbar for 10 minutes. Finally, 2 g of GENIOSIL GF 96 was added and stirred, and the mixture was stirred for a further 2 minutes (see Table 5).

[0120]

Table 7

[0121] Example 6 An adhesive film approximately 3 mm thick was produced from the formulation of Example 5 and cured at room temperature for 4 weeks (approx. 20 °C and 50% relative humidity). For this adhesive film, the thermal conductivity (transient hot bridge) was determined to be approximately 0.6 W / m·K.

Claims

1. Based on the total weight of the composition, a) 3 wt% to 49 wt% of at least one alpha-silane-terminated organic polymer, b) from 1 wt% to less than 20 wt% of at least one acrylate resin-based polymer, c) 1 wt% to 20 wt% of at least one compound that is liquid at at least 100 °C and in which the at least one acrylate resin-based polymer dissolves at at least 150 °C, d) 0.001 wt% to 5 wt% of at least one low molecular weight silane containing a primary or secondary amino group or a blocked amino group that hydrolyzes to the primary or secondary amino group A reactive hot melt adhesive composition comprising.

2. The at least one alpha-silane-terminated organic polymer has the formula ＊ -X-C(=O)-N(R)-C(R １ R ２ )-Si(R ３ ) ａ (OR ４ ) ３－ａ [wherein, X is O or N(R), each R is independently of any other, hydrogen, or a hydrocarbon radical having from 1 to 20 carbon atoms, R １ and R ２ are each independently hydrogen or a hydrocarbon radical having 1 to 20 carbon atoms, R ３ and R ４ are, independently of one another, hydrocarbon radicals having from 1 to 20 carbon atoms, and a is 0, 1 or 2, 「 ＊ 」 indicates a bond for attachment to a polymer. The reactive hot melt adhesive composition according to claim 1, characterized in that it contains various end groups of.

3. The at least one alpha-silane-terminated organic polymer is polyoxyalkylene, hydrocarbon polymer, polyurethane, polyester, polyamide, polyacrylate, polymethacrylate, or polycarbonate, The reactive hot melt adhesive composition according to claim 1 or 2, characterized in that it is.

4. The acrylate resin-based polymer is a homopolymer of acrylate, a homopolymer of methacrylate, a copolymer of at least two different acrylates, a copolymer of at least two different methacrylates, or a copolymer of at least one acrylate and at least one methacrylate, The reactive hot melt adhesive composition according to any one of claims 1 to 3, characterized in that it is.

5. The at least one compound that is liquid at at least 100 °C and in which the at least one acrylate resin-based polymer dissolves at at least 150 °C is a plasticizer, The reactive hot melt adhesive composition according to any one of claims 1 to 4, characterized in that it is.

6. The reactive hot melt adhesive composition according to any one of claims 1 to 4, wherein the at least one compound that is liquid at at least 100°C and in which the at least one acrylate resin-based polymer dissolves at at least 150°C is a polyalkylene glycol.

7. The reactive hot melt adhesive composition according to any one of claims 1 to 4, wherein the at least one compound that is liquid at at least 100°C and in which the at least one acrylate resin-based polymer dissolves at at least 150°C is an alkoxysilane.

8. The reactive hot melt adhesive composition according to any one of claims 1 to 7, wherein the at least one low molecular weight silane containing a primary or secondary amino group or a blocked amino group that hydrolyzes to the primary or secondary amino group has a molecular weight in the range of 100 to 500 g / mol.

9. The reactive hot melt adhesive composition according to any one of claims 1 to 8, further comprising at least one tackifier polymer (tackifier) in an amount of 10 wt% to 40 wt% based on the total weight of the composition.

10. The reactive hot melt adhesive composition according to any one of claims 1 to 9, further comprising at least one filler in an amount of 10 wt% to 40 wt% based on the total weight of the composition.

11. A method for producing the reactive hot melt adhesive composition according to any one of claims 1 to 10, (a) adding at least one acrylate resin-based polymer to at least one compound that is liquid at at least 100°C and in which the at least one acrylate resin-based polymer dissolves at at least 150°C, or adding to a mixture containing the at least one compound, at a temperature in the range of 130°C to 170°C; (b) cooling the mixture to a temperature in the range of 80°C to 120°C; (c) adding at least one alpha-silane-terminated organic polymer to the cooled mixture; (d) adding at least one low molecular weight silane containing a primary or secondary amino group or a blocked amino group that hydrolyzes to the primary or secondary amino group to obtain the reactive hot melt adhesive composition according to any one of claims 1 to 10 A method comprising **Claim 12** The method according to claim 11, wherein an adhesion - imparting polymer is further added in step (a). **Claim 13** The method according to claim 11 or 12, wherein at least one filler is further added in step (c). **Claim 14** The method according to any one of claims 11 to 13, wherein steps (c) and (d) are performed sequentially and degassing is performed between said steps. **Claim 15** A method of surface lamination, comprising: - a step of applying the reactive hot - melt adhesive composition according to any one of claims 1 to 10 to a substrate by an applicator roll A method comprising

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