Lighting module and lighting assembly including the same

Abstract

To provide a lighting module improved in light extraction efficiency and light distribution characteristics, and a lighting assembly having the same.SOLUTION: A lighting assembly 100 includes: a lighting module including a first resin layer 130 covering a plurality of light emitting elements disposed on a substrate 110 and at least one second resin layer 140 disposed on the first resin layer; and a first cover disposed on an outer edge portion of the substrate along an outer periphery of the substrate of the lighting module. The second resin layer is disposed on a top face and a side face of the first resin layer, and the second resin layer includes at least one of a fluorescent material and ink particles. The first cover includes an opening portion 215 from which the second resin layer projects, a substrate cover portion 211 disposed on a top face of the substrate around the opening portion 215, and a side face cover portion 213 extending to be lower than the side face of the substrate, from the substrate cover portion. The top face of the substrate cover portion may be lower than the top face of the first resin layer.SELECTED DRAWING: Figure 9

Description

[Technical field]

[0001] SUMMARY The present disclosure relates to lighting modules and lighting assemblies having light emitting elements. The present disclosure relates to lighting modules and lighting assemblies that provide an area light source. The present disclosure relates to a light unit or vehicle lamp having a lighting module or lighting assembly. This is about the pool. [Background technology]

[0002] Typical lighting applications include vehicle lighting as well as display and signboard lighting. Light-emitting elements, such as light-emitting diodes (LEDs), are used in place of existing fluorescent lamps, incandescent lamps, etc. Compared to conventional light sources, LEDs have low power consumption, semi-permanent lifespan, fast response speed, safety, and environmental friendliness. Such LEDs are useful in various display devices, indoor and outdoor lighting, etc. They are applied to various lighting devices. Recently, light-emitting diodes have been adopted as vehicle light sources. Compared to incandescent lamps, light-emitting diodes consume less power. However, the angle of emission of light from the light-emitting diode is small. When using light-emitting diodes as vehicle lamps, The light-emitting area of the lamp needs to be increased. This allows for greater freedom in design, and its semi-permanent lifespan makes it economical. Summary of the Invention [Problem to be solved by the invention]

[0003] The present disclosure provides a lighting module that includes a resin layer disposed on a plurality of light-emitting elements and emits surface light. can be provided. The present disclosure provides a number of resin layers on a light-emitting element having a number of light-emitting surfaces and can provide an illumination module in which the resin layers are arranged. The present disclosure provides an illumination module in which wavelength conversion means is added to at least one of a number of resin layers on a substrate and a light-emitting element can be provided. The present disclosure can provide an illumination module having ink particles in at least one of a number of resin layers arranged on a substrate and a light-emitting element. The present disclosure can provide an illumination module having wavelength conversion means in a resin layer separated from a substrate and a light-emitting element. The present disclosure can provide an illumination module having ink particles in a resin layer separated from a substrate and a light-emitting element. The present disclosure can provide an illumination module having a phosphor and ink particles added to at least one of a number of resin layers arranged on a substrate. The present disclosure can provide an illumination module having ink particles added to the uppermost layer of a number of resin layers arranged on a substrate and a light-emitting element. The present disclosure can provide a flexible illumination module having a plurality of light-emitting elements and a number of resin layers. The present disclosure provides an illumination assembly that can couple a cover through an outer edge portion outside a light-emitting region can provide an illumination assembly including a first cover having an opening in which a resin layer protrudes, and a second cover under the substrate and the first cover can provide an illumination assembly having a coupling structure for coupling between a first cover and a second cover. The present disclosure provides an illumination module with improved light extraction efficiency and light distribution characteristics, and an illumination assembly having the same can provide an illumination module having ink particles added to the uppermost layer of a number of resin layers arranged on a substrate and a light-emitting element. The present disclosure provides a flexible illumination module having a plurality of light-emitting elements and a number of resin layers. The present disclosure provides an illumination assembly that can couple a cover through an outer edge portion outside a light-emitting region and can provide an illumination assembly including a first cover having an opening in which a resin layer protrudes, and a second cover under the substrate and the first cover and can provide an illumination assembly having a coupling structure for coupling between a first cover and a second cover. The present disclosure provides an illumination module with improved light extraction efficiency and light distribution characteristics, and an illumination assembly having the same and can provide an illumination assembly including a first cover having an opening in which a resin layer protrudes, and a second cover under the substrate and the first cover and can provide an illumination assembly having a coupling structure for coupling between a first cover and a second cover. The present disclosure provides an illumination module with improved light extraction efficiency and light distribution characteristics, and an illumination assembly having the same and can provide an illumination assembly having a coupling structure for coupling between a first cover and a second cover. The present disclosure provides an illumination module with improved light extraction efficiency and light distribution characteristics, and an illumination assembly having the same and can provide an illumination module with improved light extraction efficiency and light distribution characteristics, and an illumination assembly having the same

Means for Solving the Problems

[0004] The lighting assembly according to the present disclosure includes a substrate, a plurality of light-emitting elements disposed on the substrate, and a first resin layer covering the plurality of light-emitting elements, and at least one second resin layer disposed on the first resin layer. The lighting module includes a first cover disposed along the outer periphery of the substrate of the lighting module on the outer edge of the substrate. The second resin layer is disposed on the upper surface and the side surface of the first resin layer. The second resin layer includes at least one of a phosphor and ink particles. The first cover includes an opening in which the second resin layer protrudes, a substrate cover portion disposed on the upper surface of the substrate around the opening, and a side cover portion extending lower than the side surface of the substrate from the substrate cover portion. The upper surface of the substrate cover portion may be disposed lower than the upper surface of the first resin layer. According to the present disclosure, a second cover having a substrate support portion under the substrate of the lighting module and a stepped coupling portion around the outer edge of the substrate support portion is included. The stepped coupling portion of the second cover is coupled to the side cover portion of the first cover. The first cover and the second cover may include a cable lead-out portion from which a power cable connected to the substrate protrudes. The second cover includes a terminal groove in which terminals on the lower surface of the substrate are exposed. The terminal groove may be inclined in a surface direction of any one side of the lighting module. The distance between the side surface of the substrate and the side surface of the second resin layer may be 0.1 times or more the thickness of the lighting module. The upper surface of the substrate and the upper surface of the second resin layer may include a protruding curved surface. The first cover may include a locking protrusion protruding in the direction of the substrate. A plurality of openings are disposed in the first cover. The lighting module includes a first cover disposed along the outer periphery of the substrate of the lighting module on the outer edge of the substrate. The second resin layer is disposed on the upper surface and the side surface of the first resin layer. The second resin layer includes at least one of a phosphor and ink particles. The first cover includes an opening in which the second resin layer protrudes, a substrate cover portion disposed on the upper surface of the substrate around the opening, and a side cover portion extending lower than the side surface of the substrate from the substrate cover portion. The upper surface of the substrate cover portion may be disposed lower than the upper surface of the first resin layer. The lighting module includes a first cover disposed along the outer periphery of the substrate of the lighting module on the outer edge of the substrate. The second resin layer is disposed on the upper surface and the side surface of the first resin layer. The second resin layer includes at least one of a phosphor and ink particles. The first cover includes an opening in which the second resin layer protrudes, a substrate cover portion disposed on the upper surface of the substrate around the opening, and a side cover portion extending lower than the side surface of the substrate from the substrate cover portion. The upper surface of the substrate cover portion may be disposed lower than the upper surface of the first resin layer. The lighting module includes a first cover disposed along the outer periphery of the substrate of the lighting module on the outer edge of the substrate. The second resin layer is disposed on the upper surface and the side surface of the first resin layer. The second resin layer includes at least one of a phosphor and ink particles. The first cover includes an opening in which the second resin layer protrudes, a substrate cover portion disposed on the upper surface of the substrate around the opening, and a side cover portion extending lower than the side surface of the substrate from the substrate cover portion. The upper surface of the substrate cover portion may be disposed lower than the upper surface of the first resin layer. The lighting module includes a first cover disposed along the outer periphery of the substrate of the lighting module on the outer edge of the substrate. The second resin layer is disposed on the upper surface and the side surface of the first resin layer. The second resin layer includes at least one of a phosphor and ink particles. The first cover includes an opening in which the second resin layer protrudes, a substrate cover portion disposed on the upper surface of the substrate around the opening, and a side cover portion extending lower than the side surface of the substrate from the substrate cover portion. The upper surface of the substrate cover portion may be disposed lower than the upper surface of the first resin layer. The lighting module includes a first cover disposed along the outer periphery of the substrate of the lighting module on the outer edge of the substrate. The second resin layer is disposed on the upper surface and the side surface of the first resin layer. The second resin layer includes at least one of a phosphor and ink particles. The first cover includes an opening in which the second resin layer protrudes, a substrate cover portion disposed on the upper surface of the substrate around the opening, and a side cover portion extending lower than the side surface of the substrate from the substrate cover portion. The upper surface of the substrate cover portion may be disposed lower than the upper surface of the first resin layer. The lighting module includes a first cover disposed along the outer periphery of the substrate of the lighting module on the outer edge of the substrate. The second resin layer is disposed on the upper surface and the side surface of the first resin layer. The second resin layer includes at least one of a phosphor and ink particles. The first cover includes an opening in which the second resin layer protrudes, a substrate cover portion disposed on the upper surface of the substrate around the opening, and a side cover portion extending lower than the side surface of the substrate from the substrate cover portion. The upper surface of the substrate cover portion may be disposed lower than the upper surface of the first resin layer. The lighting module includes a first cover disposed along the outer periphery of the substrate of the lighting module on the outer edge of the substrate. The second resin layer is disposed on the upper surface and the side surface of the first resin layer. The second resin layer includes at least one of a phosphor and ink particles. The first cover includes an opening in which the second resin layer protrudes, a substrate cover portion disposed on the upper surface of the substrate around the opening, and a side cover portion extending lower than the side surface of the substrate from the substrate cover portion. The upper surface of the substrate cover portion may be disposed lower than the upper surface of the first resin layer.

[0005] According to the present disclosure, a second cover having a substrate support portion under the substrate of the lighting module and a stepped coupling portion around the outer edge of the substrate support portion is included. The stepped coupling portion of the second cover is coupled to the side cover portion of the first cover. The first cover and the second cover may include a cable lead-out portion from which a power cable connected to the substrate protrudes. The second cover includes a terminal groove in which terminals on the lower surface of the substrate are exposed. The terminal groove may be inclined in a surface direction of any one side of the lighting module. The distance between the side surface of the substrate and the side surface of the second resin layer may be 0.1 times or more the thickness of the lighting module. The upper surface of the substrate and the upper surface of the second resin layer may include a protruding curved surface. The first cover may include a locking protrusion protruding in the direction of the substrate. A plurality of openings are disposed in the first cover. According to the present disclosure, a second cover having a substrate support portion under the substrate of the lighting module and a stepped coupling portion around the outer edge of the substrate support portion is included. The stepped coupling portion of the second cover is coupled to the side cover portion of the first cover. The first cover and the second cover may include a cable lead-out portion from which a power cable connected to the substrate protrudes. The second cover includes a terminal groove in which terminals on the lower surface of the substrate are exposed. The terminal groove may be inclined in a surface direction of any one side of the lighting module. The distance between the side surface of the substrate and the side surface of the second resin layer may be 0.1 times or more the thickness of the lighting module. The upper surface of the substrate and the upper surface of the second resin layer may include a protruding curved surface. The first cover may include a locking protrusion protruding in the direction of the substrate. A plurality of openings are disposed in the first cover. According to the present disclosure, a second cover having a substrate support portion under the substrate of the lighting module and a stepped coupling portion around the outer edge of the substrate support portion is included. The stepped coupling portion of the second cover is coupled to the side cover portion of the first cover. The first cover and the second cover may include a cable lead-out portion from which a power cable connected to the substrate protrudes. The second cover includes a terminal groove in which terminals on the lower surface of the substrate are exposed. The terminal groove may be inclined in a surface direction of any one side of the lighting module. The distance between the side surface of the substrate and the side surface of the second resin layer may be 0.1 times or more the thickness of the lighting module. The upper surface of the substrate and the upper surface of the second resin layer may include a protruding curved surface. The first cover may include a locking protrusion protruding in the direction of the substrate. A plurality of openings are disposed in the first cover. According to the present disclosure, a second cover having a substrate support portion under the substrate of the lighting module and a stepped coupling portion around the outer edge of the substrate support portion is included. The stepped coupling portion of the second cover is coupled to the side cover portion of the first cover. The first cover and the second cover may include a cable lead-out portion from which a power cable connected to the substrate protrudes. The second cover includes a terminal groove in which terminals on the lower surface of the substrate are exposed. The terminal groove may be inclined in a surface direction of any one side of the lighting module. The distance between the side surface of the substrate and the side surface of the second resin layer may be 0.1 times or more the thickness of the lighting module. The upper surface of the substrate and the upper surface of the second resin layer may include a protruding curved surface. The first cover may include a locking protrusion protruding in the direction of the substrate. A plurality of openings are disposed in the first cover. According to the present disclosure, a second cover having a substrate support portion under the substrate of the lighting module and a stepped coupling portion around the outer edge of the substrate support portion is included. The stepped coupling portion of the second cover is coupled to the side cover portion of the first cover. The first cover and the second cover may include a cable lead-out portion from which a power cable connected to the substrate protrudes. The second cover includes a terminal groove in which terminals on the lower surface of the substrate are exposed. The terminal groove may be inclined in a surface direction of any one side of the lighting module. The distance between the side surface of the substrate and the side surface of the second resin layer may be 0.1 times or more the thickness of the lighting module. The upper surface of the substrate and the upper surface of the second resin layer may include a protruding curved surface. The first cover may include a locking protrusion protruding in the direction of the substrate. A plurality of openings are disposed in the first cover. According to the present disclosure, a second cover having a substrate support portion under the substrate of the lighting module and a stepped coupling portion around the outer edge of the substrate support portion is included. The stepped coupling portion of the second cover is coupled to the side cover portion of the first cover. The first cover and the second cover may include a cable lead-out portion from which a power cable connected to the substrate protrudes. The second cover includes a terminal groove in which terminals on the lower surface of the substrate are exposed. The terminal groove may be inclined in a surface direction of any one side of the lighting module. The distance between the side surface of the substrate and the side surface of the second resin layer may be 0.1 times or more the thickness of the lighting module. The upper surface of the substrate and the upper surface of the second resin layer may include a protruding curved surface. The first cover may include a locking protrusion protruding in the direction of the substrate. A plurality of openings are disposed in the first cover. According to the present disclosure, a second cover having a substrate support portion under the substrate of the lighting module and a stepped coupling portion around the outer edge of the substrate support portion is included. The stepped coupling portion of the second cover is coupled to the side cover portion of the first cover. The first cover and the second cover may include a cable lead-out portion from which a power cable connected to the substrate protrudes. The second cover includes a terminal groove in which terminals on the lower surface of the substrate are exposed. The terminal groove may be inclined in a surface direction of any one side of the lighting module. The distance between the side surface of the substrate and the side surface of the second resin layer may be 0.1 times or more the thickness of the lighting module. The upper surface of the substrate and the upper surface of the second resin layer may include a protruding curved surface. The first cover may include a locking protrusion protruding in the direction of the substrate. A plurality of openings are disposed in the first cover. According to the present disclosure, a second cover having a substrate support portion under the substrate of the lighting module and a stepped coupling portion around the outer edge of the substrate support portion is included. The stepped coupling portion of the second cover is coupled to the side cover portion of the first cover. The first cover and the second cover may include a cable lead-out portion from which a power cable connected to the substrate protrudes. The second cover includes a terminal groove in which terminals on the lower surface of the substrate are exposed. The terminal groove may be inclined in a surface direction of any one side of the lighting module. The distance between the side surface of the substrate and the side surface of the second resin layer may be 0.1 times or more the thickness of the lighting module. The upper surface of the substrate and the upper surface of the second resin layer may include a protruding curved surface. The first cover may include a locking protrusion protruding in the direction of the substrate. A plurality of openings are disposed in the first cover. According to the present disclosure, a second cover having a substrate support portion under the substrate of the lighting module and a stepped coupling portion around the outer edge of the substrate support portion is included. The stepped coupling portion of the second cover is coupled to the side cover portion of the first cover. The first cover and the second cover may include a cable lead-out portion from which a power cable connected to the substrate protrudes. The second cover includes a terminal groove in which terminals on the lower surface of the substrate are exposed. The terminal groove may be inclined in a surface direction of any one side of the lighting module. The distance between the side surface of the substrate and the side surface of the second resin layer may be 0.1 times or more the thickness of the lighting module. The upper surface of the substrate and the upper surface of the second resin layer may include a protruding curved surface. The first cover may include a locking protrusion protruding in the direction of the substrate. A plurality of openings are disposed in the first cover. According to the present disclosure, a second cover having a substrate support portion under the substrate of the lighting module and a stepped coupling portion around the outer edge of the substrate support portion is included. The stepped coupling portion of the second cover is coupled to the side cover portion of the first cover. The first cover and the second cover may include a cable lead-out portion from which a power cable connected to the substrate protrudes. The second cover includes a terminal groove in which terminals on the lower surface of the substrate are exposed. The terminal groove may be inclined in a surface direction of any one side of the lighting module. The distance between the side surface of the substrate and the side surface of the second resin layer may be 0.1 times or more the thickness of the lighting module. The upper surface of the substrate and the upper surface of the second resin layer may include a protruding curved surface. The first cover may include a locking protrusion protruding in the direction of the substrate. A plurality of openings are disposed in the first cover. A light module may protrude into each of the plurality of openings.

[0006] The lighting assembly according to the present disclosure includes a substrate, a plurality of light emitting elements disposed on the substrate, a first resin layer covering the plurality of light emitting elements; and at least one a lighting module including a second resin layer and a substrate of the lighting module, the second resin layer being disposed along an outer periphery of the substrate; a first cover disposed on the outer edge of the substrate and supporting a lower portion of the lighting module; and a second cover including a resin layer disposed on a surface of the first resin layer. the first cover is disposed on the ink cartridge and includes at least one of a wavelength conversion means and ink particles therein, the first resin layer and the second resin layer protrude from an opening, and the substrate is disposed around the opening. a substrate cover portion disposed on the upper surface of the substrate; and a substrate cover portion extending from the substrate cover portion to a side surface of the substrate. and a side cover portion, the cover being provided on both sides adjacent to one end of the lighting module. The insulating layer may include a first connecting member and a second connecting member recessed from the insulating layer toward the substrate.

[0007] According to the present disclosure, the side surface of the second resin layer may include a protruding curved surface. The edge of the plate may extend further outwardly than the lower end of the second resin layer. The thickness of the module may be 5.5 mm or less. The second resin layer may be disposed on the substrate in a flip chip type. The second resin layer contains phosphor and ink particles, and the content of the phosphor in the second resin layer is 23 % or less by weight, and the content of the ink particles may be 3 wt % to 13 wt %. Cut. Effect of the Invention

[0008] The present disclosure can reduce hot spots and evenly distribute light by including at least one of a phosphor and ink particles in a resin layer. The lighting module can be installed without using a complex mechanism. The lighting module can support and fix portions other than the light-emitting region. By coupling a cover to the lighting module, the assembly of the lighting module and the convenience for the user are improved.

Brief Description of the Drawings

[0009]

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Best Mode for Carrying Out the Invention

[0010] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However , the technical idea of the present invention is not limited to some of the described embodiments, but can be embodied in various forms and, within the scope of the technical idea of the present invention, the components between the embodiments can be selectively coupled or replaced and used. Also, the terms used in this disclosure (including technical and scientific terms) will be interpreted as having a meaning generally understood by those having ordinary knowledge in the technical field to which the present invention pertains, unless specifically defined and described, and terms generally used as in a dictionary will be interpreted in light of the meaning in the context of the relevant technology so that they can be understood. Also, the terms used in this disclosure are for the purpose of explaining the embodiments, and this disclosure is not intended to limit the scope of the present invention. The present invention is not intended to be limited to the above embodiments. Unless otherwise specified, it can include plural forms, and can be used to refer to "at least one (or more) of A, B, and C." When "Above)" is written, it means that one or more of all possible combinations of A, B, and C can be selected. In addition, in the description of the components of the present disclosure, first, second, A, B, Terms such as (a), (b), etc. may be used. Such terms are used to separate the components from other components. The term is used to distinguish the elements, and the essence or order of the components is not specified by the term. Without being limited thereto, it is understood that one component may be "connected," "coupled," or "connected" to another component. When a component is described as being "connected," it does not mean that the component is directly connected or attached to another component. When the components are connected to each other, or when other components are "connected," "coupled," or "joined" between each component, Also, it is described that each component is formed or placed "above or below" the other component. When mounted on a surface, "above or below" refers not only to when the two components are in direct contact, but also to when the This also includes cases where one or more other components are formed or disposed between the two components. Also, when it is expressed as "up or down," it is not just the upward direction based on one component. It can also mean a downward direction.

[0011] The lighting device according to the present invention can be used in a variety of lamp devices that require illumination, such as vehicle lamps, home lamps, etc. It can be applied to garden lighting devices or industrial lighting devices. For example, it can be applied to vehicle lamps. When driving, headlamps, width lamps, side mirror lamps, fog lamps, tail lamps, control lamps, etc. Moving lights, daytime running lights, vehicle interior lighting, door scuffs, rear combination lamps, back It is applicable to uplights and the like. The lighting device of the present invention is applicable to indoor and outdoor advertising devices, display devices, and various train fields, and is also applicable to all lighting-related fields and advertising-related fields that are currently developed and commercialized or can be realized with future technological developments. It is applicable to other fields such as indoor and outdoor advertising devices, display devices, and various train fields, and will also be applicable to all lighting-related fields and advertising-related fields that are currently developed and commercialized or can be realized with future technological developments. It will be applicable to all lighting-related fields and advertising-related fields that are currently developed and commercialized or can be realized with future technological developments. 。

[0012] FIG. 1 is a perspective view showing a lighting module according to a first embodiment, FIG. 2 is a cross-sectional view taken along line A-A of the lighting module of FIG. 1, and FIG. 3 is a drawing for explaining a curved surface portion of a second resin layer in FIG. 2. FIG. 2 is a cross-sectional view taken along line A-A of the lighting module of FIG. 1, and FIG. 3 is a drawing for explaining a curved surface portion of the second resin layer in FIG. 2. It is a drawing for explaining the curved surface portion of the second resin layer in FIG. 2.

[0013] Referring to FIGS. 1 to 3, the lighting module 100 can have a polyhedral shape, for example, a hexahedral shape. The lighting module 100 is formed in a structure capable of multi-faceted light emission. For example, light is emitted from the upper surface and a plurality of side surfaces of the lighting module 100. Although the lighting module 100 is illustrated as having light emitted from five sides, it may be a six-sided light-emitting module with light emitted through the lower surface. The lighting module 100 can include a substrate 110, a plurality of light-emitting elements 120 disposed on the substrate 110, a first resin layer 130 disposed on the light-emitting elements 120, and one or more second resin layers 140 disposed on the first resin layer 130. The lighting module 100 is applicable to various lamp devices that require lighting, such as vehicle lamps, household lighting devices, and industrial lighting devices. For example, in the case of a lighting module applied to a vehicle lamp, it can be a headlamp, a width lamp, a side mirror lamp, a fog lamp, a tail lamp, a turn signal lamp, a stop lamp. It can include a polyhedral shape, for example, a hexahedral shape. The lighting module 100 is formed in a structure capable of multi-faceted light emission. For example, light is emitted from the upper surface and a plurality of side surfaces of the lighting module 100. Although the lighting module 100 is illustrated as having light emitted from five sides, it may be a six-sided light-emitting module with light emitted through the lower surface. The lighting module 100 can include a substrate 110, a plurality of light-emitting elements 120 disposed on the substrate 110, a first resin layer 130 disposed on the light-emitting elements 120, and one or more second resin layers 140 disposed on the first resin layer 130. The lighting module 100 is applicable to various lamp devices that require lighting, such as vehicle lamps, household lighting devices, and industrial lighting devices. For example, in the case of a lighting module applied to a vehicle lamp, it can be a headlamp, a width lamp, a side mirror lamp, a fog lamp, a tail lamp, a turn signal lamp, a stop lamp. The lighting module 100 can include a substrate 110, a plurality of light-emitting elements 120 disposed on the substrate 110, a first resin layer 130 disposed on the light-emitting elements 120, and one or more second resin layers 140 disposed on the first resin layer 130. The lighting module 100 is applicable to various lamp devices that require lighting, such as vehicle lamps, household lighting devices, and industrial lighting devices. For example, in the case of a lighting module applied to a vehicle lamp, it can be a headlamp, a width lamp, a side mirror lamp, a fog lamp, a tail lamp, a turn signal lamp, a stop lamp. It can be a headlamp, a width lamp, a side mirror lamp, a fog lamp, a tail lamp, a turn signal lamp, a stop lamp. lamp), daytime running light, vehicle interior lighting, door scuff ) and can be applied to at least one of a rear combination lamp and a backup lamp. It can be done.

[0014] The substrate 110 can include an insulating or conductive material. The substrate 110 can be made of a rigid or flexible material. The substrate 110 can be transparent or opaque material. The substrate 110 is, for example, a resin-based printed circuit board (PCB), Metal Core PCB, Flexible PCB, ceramic It can include at least one of a PCB or an FR-4 substrate. The thickness of the substrate 110 can be 0.5 mm or less, for example, in the range of 0.3 mm to 0.5 mm. Since the thickness of the substrate 110 is provided to be thin, the thickness of the lighting module can be reduced . Since the thickness of the substrate 110 is provided to be 0.5 mm or less, a flexible module can be supported. The thickness of the substrate 110 is 0.1 times or less, or in the range of 0.1 times to 0.06 times, of the distance from the lower surface of the substrate 110 to the upper surface of the uppermost second resin layer 140. It can have.

[0015] A reflective layer (not shown) may be disposed on the upper portion of the substrate 110. The reflective layer may be disposed between the substrate 110 and the first resin layer 130. The reflective layer serves to guide the light generated from the light emitting element 12 0 upward. The reflective layer can include a white material. The reflective layer can include a resin material. The reflective layer is PMMA, silicone It can include a resin or epoxy material and can contain at least one of, for example, TiO2, SiO2, and Al2O 3 inside. Here, the distance from the lower surface of the substrate 110 to the uppermost surface of the second resin layer 140 may be the module thickness. The thickness of the lighting module 100 is 5.5 mm or less or in the range of 4.5 mm to 5.5 mm or 4.5 mm to 5 mm from the bottom surface of the substrate 110. The thickness of the lighting module 100 can have a range of 4.5 mm to 5.5 mm or 4.5 mm to 5 mm. The thickness of the lighting module 100 may be the straight-line distance between the lower surface of the substrate 110 and the upper surface of the second resin layer 140. The thickness of the lighting module 100 can be 220% or less of the thickness of the first resin layer 130, for example, in the range of 180% to 220%. Since the lighting module 100 is provided with a thickness of 5.5 mm or less, it can be provided as a flexible and slim surface light source module. Also, the light emitted from the lighting module 100 having the above-described thickness can be provided with a uniform light distribution. That is, the hot spots of the surface light source can be reduced and the light distribution can be improved. The light-emitting element 120 is disposed on the substrate 110. N light-emitting elements 120 may be arranged in the first direction of the substrate 110, and M light-emitting elements may be arranged in the second direction orthogonal to the first direction. Here, N and M are 1 or more, or either N or M is 1 or more, and the other one

[0016] may be 2 or more. The light-emitting elements 120 may be arranged at the same interval in the first direction and the second direction, or at least one of them may be arranged at a different interval. For example, the separation distance between the light-emitting elements 120 may be arranged identically to effectively realize surface light. The light-emitting element 120 is provided by an LED chip and can be blue, green, red, white, infrared, or ultraviolet The light-emitting element 120 is provided by an LED chip and can be blue, green, red, white, infrared, or ultraviolet The light-emitting element 120 is provided by an LED chip and can be blue, green, red, white, infrared, or ultraviolet The light-emitting elements 120 may be arranged at the same interval or at least one of them may be arranged at a different interval. For example, the separation distance between the light-emitting elements 120 may be arranged identically to effectively realize surface light. The light-emitting element 120 is provided by an LED chip and can be blue, green, red, white, infrared, or ultraviolet The light-emitting element 120 is provided by an LED chip and can be blue, green, red, white, infrared, or ultraviolet It is possible to emit linear light. The light-emitting element 120 can emit blue light in the range of, for example, 420 nm to 470 nm. The light-emitting element 120 may be provided by a compound semiconductor. The light-emitting element 120 may be provided by, for example, a Group II-VI or Group III-V compound semiconductor. For example, the light-emitting element 120 may be provided containing at least two or more elements selected from aluminum (Al), gallium (Ga), indium (In), phosphorus (P), arsenic (As), and nitrogen (N).

[0017] The light-emitting element 120 may include a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer. The first conductivity type semiconductor layer and the second conductivity type semiconductor layer may be implemented by at least one of Group III-V or Group II-VI compound semiconductors. The first conductivity type semiconductor layer and the second conductivity type semiconductor layer may be, for example, In Al x Al y Ga 1‐x‐y N (0 ≤ x ≤ 1, 0 ≤ y ≤ 1, 0 ≤ x + y ≤ 1) and may be made of a semiconductor material having a composition formula. For example, the first conductivity type semiconductor layer and the second conductivity type semiconductor layer may be at least one selected from the group including GaN, AlN, AlGaN, InGaN, InN, InAlGaN, Al InN, AlGaAs, GaP, GaAs, GaAsP, AlGaInP, etc. The first conductivity type semiconductor layer may be an n-type semiconductor layer doped with an n-type dopant such as Si, Ge, Sn, Se, Te, etc. The second conductivity type semiconductor layer may be a p-type semiconductor layer doped with a p-type dopant such as Mg, Zn, Ca, Sr, Ba, etc. The active layer described above may be implemented by a compound semiconductor. The active layer may be, for example, a Group III-V ​​​​It can be implemented with at least one of group II-VI compound semiconductors. The above-mentioned act When the active layer is implemented in a multi-well structure, the active layer may include a plurality of well layers and a plurality of barrier layers, which can be arranged with a semiconductor material having a composition formula of In x Al y Ga 1‐x‐y N(0≦x≦1, 0≦y≦1, 0≦x + y≦1). For example, the active layer may include at least one selected from the group including InGaN / GaN, GaN / AlGaN, AlGaN / AlGaN, InGaN / AlGaN, InGaN / InGaN, AlGaAs / GaAs, InGaA s / GaAs, InGaP / GaP, AlInGaP / InGaP, InP / GaAs. The light-emitting element 120 can emit light through the upper surface and at least one side surface. For example, it can emit light through the upper surface and four side surfaces. The light-emitting element 120 includes a substrate made of a light-transmissive material, and the substrate made of the light-transmissive material is disposed on the uppermost semiconductor layer. The light-emitting element 120 may be of a flip-chip type and disposed on the substrate 110. The first resin layer 130 is disposed on the substrate 110 and the light-emitting element 120. The first resin layer 130 may be disposed on the upper surfaces and side surfaces of the plurality of light-emitting elements 120. The first resin layer 130 may include an upper surface and a number of side surfaces. The upper surface of the first resin layer 130 faces the upper surfaces of the plurality of light-emitting elements 120, and a part of the side surfaces can face the side surfaces of the plurality of light-emitting elements 120. The side surfaces of the first resin layer 130 can be perpendicular to or include a curved surface with respect to the upper surface of the substrate 110. When the side surfaces of the first resin layer 130 are the light-emitting elements

[0018] The first resin layer 130 is disposed on the substrate 110 and the light-emitting element 120. The first resin layer 130 may be disposed on the upper surfaces and side surfaces of the plurality of light-emitting elements 120. The first resin layer 130 can include an upper surface and a number of side surfaces. The upper surface of the first resin layer 130 faces the upper surfaces of the plurality of light-emitting elements 120, and a part of the side surfaces can face the side surfaces of the plurality of light-emitting elements 120. The side surfaces of the first resin layer 130 can face the side surfaces of the plurality of light-emitting elements 120. The side surfaces of the first resin layer 130 can be perpendicular to or include a curved surface with respect to the upper surface of the substrate 110. When the side surfaces of the first resin layer 130 are the light-emitting elements ​When facing 120, the light emitted through the side surface of the first resin layer 130 is lost without contributing to the light distribution. To reduce such light loss, the side surface of the first resin layer 130 can include a curved surface, for example, a protruding curved surface. When the side surface of the first resin layer 130 is formed into a curved surface, the incident light can be refracted in the upper surface direction. The first resin layer 130 may have a curved surface portion at the boundary between the upper surface and the side surface. The curved surface portion is continuously connected to the upper surface and the side surface of the first resin layer 130. The curved surface portion may be the edge portion of the upper surface or the edge portion of the side surface of the first resin layer 130.

[0019] The resin layer 130 may be made of a transparent resin material, such as a resin material like UV (Ultra Violet) resin, silicone or epoxy. The UV resin may use, for example, a resin (oligomer type) with urethane acrylate oligomer as the main material as the main raw material. For example, a urethane acrylate oligomer, which is a synthetic oligomer, can be used as the main raw material. The main material can further include a monomer mixed with low-boiling-point diluting reactive monomers such as IBOA (isobornyl acrylate), HBA (Hydroxybutyl Acrylate), HEMA (Hydroxy Metaethyl Acrylate), etc., and can further include a photoinitiator (for example, 1-hydroxycyclohexyl phenyl-ketone, Diphenyl), Diphenyl(2,4,6-trimethylbenzoyl phosphine oxide) etc. or an antioxidant etc. as an additive. The UV resin is composed of a composition containing 10 - 21% oligomer, 30 - 63% monomer, and 1.5 - 6% additive. ​​​ can be achieved. In this case, the monomer may be composed of a mixture of 10 to 21% IBOA (isobornyl Acrylate), 10 to 21% HBA (Hy droxybutyl Acrylate), and 10 to 21% HEMA (Hydroxy Metaethyl Acrylate). The additive may be made to have a function of starting a photoreaction by adding 1 to 5% of a photoinitiator, and may be composed of a mixture capable of improving the yellowing phenomenon by adding 0.5 to 1% of an antioxidant. The formation of the resin layer 130 using the above-described composition can form a layer with a resin such as a UV resin instead of a light guide plate, enabling adjustment of the refractive index and thickness, and can satisfy all of the adhesion characteristics, reliability, and mass production speed using the above-described composition. The resin layer 130 may further contain a diffusing agent (beads or dispersing agent in it. The diffusing agent can have a spherical shape, and its size can be in the range of 4 μm to 6 μm. The shape and size of the diffusing agent are not limited to this. The content of the diffusing agent is 5 wt% or less in the first resin layer 130, for example, in the range of 2 wt% to 5 w t%. When the content of the diffusing agent is less than the above range, there is a limit to reducing hot spots, and when it is greater than the above range, the light transmittance may decrease. Therefore, the diffusing agent can be arranged in the first resin layer 130 at the above content to diffuse light and reduce hot spots without reducing the light transmittance. When a diffusing substance or a light-shielding substance is arranged in the second resin layer 140, the diffusing agent in the first resin layer 13 0 may be removed. In the lighting module, the first resin layer 130 is one layer formed with a resin such as a UV resin instead of a light guide plate, enabling adjustment of the refractive index and thickness, and can satisfy all of the adhesion characteristics, reliability, and mass production speed using the above-described composition. The resin layer 130 may further contain a diffusing agent (beads or dispersing agent in it. The diffusing agent can have a spherical shape, and its size can be in the range of 4 μm to 6 μm. The shape and size of the diffusing agent are not limited to this. The content of the diffusing agent is 5 wt% or less in the first resin layer 130, for example, in the range of 2 wt% to 5 w t%. When the content of the diffusing agent is less than the above range, there is a limit to reducing hot spots, and when it is greater than the above range, the light transmittance may decrease. Therefore, the diffusing agent can be arranged in the first resin layer 130 at the above content to diffuse light and reduce hot spots without reducing the light transmittance. When a diffusing substance or a light-shielding substance is arranged in the second resin layer 140, the diffusing agent in the first resin layer 13 ) in it. The diffusing agent can have a spherical shape, and its size can be in the range of 4 μm to 6 μm. The shape and size of the diffusing agent are not limited to this. The content of the diffusing agent is 5 wt% or less in the first resin layer 130, for example, in the range of 2 wt% to 5 w t%. When the content of the diffusing agent is less than the above range, there is a limit to reducing hot spots, and when it is greater than the above range, the light transmittance may decrease. Therefore, the diffusing agent can be arranged in the first resin layer 130 at the above content to diffuse light and reduce hot spots without reducing the light transmittance. When a diffusing substance or a light-shielding substance is arranged in the second resin layer 140, the diffusing agent in the first resin layer 13 0 may be removed. In the lighting module, the first resin layer 130 is one layer formed with a resin such as a UV resin instead of a light guide plate, enabling adjustment of the refractive index and thickness, and can satisfy all of the adhesion characteristics, reliability, and mass production speed using the above-described composition. The resin layer 130 may further contain a diffusing agent (beads or dispersing agent t%. When the content of the diffusing agent is less than the above range, there is a limit to reducing hot spots, and when it is greater than the above range, the light transmittance may decrease. Therefore, the diffusing agent can be arranged in the first resin layer 130 at the above content to diffuse light and reduce hot spots without reducing the light transmittance. When a diffusing substance or a light-shielding substance is arranged in the second resin layer 140, the diffusing agent in the first resin layer 13 0 may be removed. In the lighting module, the first resin layer 130 is one layer formed with a resin such as a UV resin instead of a light guide plate, enabling adjustment of the refractive index and thickness, and can satisfy all of the adhesion characteristics, reliability, and mass production speed using the above-described composition. The resin layer 130 may further contain a diffusing agent (beads or dispersing agent in it. The diffusing agent can have a spherical shape, and its size can be in the range of 4 μm to 6 μm. The shape and size of the diffusing agent are not limited to this. The content of the diffusing agent is 5 wt% or less in the first resin layer 130, for example, in the range of 2 wt% to 5 w t%. When the content of the diffusing agent is less than the above range, there is a limit to reducing hot spots, and when it is greater than the above range, the light transmittance may decrease. Therefore, the diffusing agent can be arranged in the first resin layer 130 at the above content to diffuse light and reduce hot spots without reducing the light transmittance. When a diffusing substance or a light-shielding substance is arranged in the second resin layer 140, the diffusing agent in the first resin layer 13 0 may be removed. In the lighting module, the first resin layer 130 is one layer Although it is formed in this way, it is not limited thereto, and it may include two or more resin layers. The first resin layer 130 may include a light-transmitting layer that does not contain impurities and a diffusion layer containing a diffusing agent on the light-transmitting layer. Alternatively, the diffusion layer may be formed under the light-transmitting layer. It can be done.

[0020] The second resin layer 140 is formed on the first resin layer 130. The second resin layer 140 may include a transparent substance or a transparent insulating substance. The second resin layer 140 may be molded on the surface of the first resin layer 130. The second resin layer 140 may be made of a resin material such as epoxy or silicon. For example, the second resin layer 140 may be made of a silicon material, or a silicon material having different chemical bonds. Silicon is a polymer in which silicon, an inorganic substance, and carbon, an organic substance, are bonded, and has physical properties such as the thermal stability, chemical stability, wear resistance, and glossiness of the inorganic substance, and the reactivity, solubility, elasticity, and processability of the organic substance. Silicon may include general silicon and fluorosilicon with an increased fluorine ratio. Increasing the fluorine ratio of fluorosilicon has the effect of improving moisture resistance. The second resin layer 140 may include wavelength conversion means for allowing the light emitted from the light-emitting element 120 to enter and providing wavelength-converted light. For example, the second resin layer 140 may include at least one selected from the group including phosphors, quantum dots, etc. The phosphor or quantum dot can emit blue, green, or red light. It can be included. The second resin layer 140 may be molded on the surface of the first resin layer 130. The second resin layer 140 may be made of a resin material such as epoxy or silicon. For example, the second resin layer 140 may be made of a silicon material, or a silicon material having different chemical bonds. Silicon is a polymer in which silicon, an inorganic substance, and carbon, an organic substance, are bonded, and has physical properties such as the thermal stability, chemical stability, wear resistance, and glossiness of the inorganic substance, and the reactivity, solubility, elasticity, and processability of the organic substance. Silicon may include general silicon and fluorosilicon with an increased fluorine ratio. Increasing the fluorine ratio of fluorosilicon has the effect of improving moisture resistance. The second resin layer 140 may include wavelength conversion means for allowing the light emitted from the light-emitting element 120 to enter and providing wavelength-converted light. For example, the second resin layer 140 may include at least one selected from the group including phosphors, quantum dots, etc. The phosphor or quantum dot can emit blue, green, or red light. It can be molded on the surface of the first resin layer 130. The second resin layer 140 may be made of a resin material such as epoxy or silicon. For example, the second resin layer 140 may be made of a silicon material, or a silicon material having different chemical bonds. Silicon is a polymer in which silicon, an inorganic substance, and carbon, an organic substance, are bonded, and has physical properties such as the thermal stability, chemical stability, wear resistance, and glossiness of the inorganic substance, and the reactivity, solubility, elasticity, and processability of the organic substance. Silicon may include general silicon and fluorosilicon with an increased fluorine ratio. Increasing the fluorine ratio of fluorosilicon has the effect of improving moisture resistance. The second resin layer 140 may include wavelength conversion means for allowing the light emitted from the light-emitting element 120 to enter and providing wavelength-converted light. For example, the second resin layer 140 may include at least one selected from the group including phosphors, quantum dots, etc. The phosphor or quantum dot can emit blue, green, or red light. It may be made of a resin material such as epoxy or silicon. For example, the second resin layer 140 may be made of a silicon material, or a silicon material having different chemical bonds. Silicon is a polymer in which silicon, an inorganic substance, and carbon, an organic substance, are bonded, and has physical properties such as the thermal stability, chemical stability, wear resistance, and glossiness of the inorganic substance, and the reactivity, solubility, elasticity, and processability of the organic substance. Silicon may include general silicon and fluorosilicon with an increased fluorine ratio. Increasing the fluorine ratio of fluorosilicon has the effect of improving moisture resistance. The second resin layer 140 may include wavelength conversion means for allowing the light emitted from the light-emitting element 120 to enter and providing wavelength-converted light. For example, the second resin layer 140 may include at least one selected from the group including phosphors, quantum dots, etc. The phosphor or quantum dot can emit blue, green, or red light. It may be made of a silicon material, or a silicon material having different chemical bonds. Silicon is a polymer in which silicon, an inorganic substance, and carbon, an organic substance, are bonded, and has physical properties such as the thermal stability, chemical stability, wear resistance, and glossiness of the inorganic substance, and the reactivity, solubility, elasticity, and processability of the organic substance. Silicon may include general silicon and fluorosilicon with an increased fluorine ratio. Increasing the fluorine ratio of fluorosilicon has the effect of improving moisture resistance. The second resin layer 140 may include wavelength conversion means for allowing the light emitted from the light-emitting element 120 to enter and providing wavelength-converted light. For example, the second resin layer 140 may include at least one selected from the group including phosphors, quantum dots, etc. The phosphor or quantum dot can emit blue, green, or red light. Silicon is a polymer in which silicon, an inorganic substance, and carbon, an organic substance, are bonded, and has physical properties such as the thermal stability, chemical stability, wear resistance, and glossiness of the inorganic substance, and the reactivity, solubility, elasticity, and processability of the organic substance. Silicon may include general silicon and fluorosilicon with an increased fluorine ratio. Increasing the fluorine ratio of fluorosilicon has the effect of improving moisture resistance. The second resin layer 140 may include wavelength conversion means for allowing the light emitted from the light-emitting element 120 to enter and providing wavelength-converted light. For example, the second resin layer 140 may include at least one selected from the group including phosphors, quantum dots, etc. The phosphor or quantum dot can emit blue, green, or red light. Stability, chemical stability, wear resistance, glossiness, etc. and the physical properties of the organic substance such as reactivity, solubility, elasticity, and processability. Silicon may include general silicon and fluorosilicon with an increased fluorine ratio. Increasing the fluorine ratio of fluorosilicon has the effect of improving moisture resistance. The second resin layer 140 may include wavelength conversion means for allowing the light emitted from the light-emitting element 120 to enter and providing wavelength-converted light. For example, the second resin layer 140 may include at least one selected from the group including phosphors, quantum dots, etc. The phosphor or quantum dot can emit blue, green, or red light. Silicon may include general silicon and fluorosilicon with an increased fluorine ratio. Increasing the fluorine ratio of fluorosilicon has the effect of improving moisture resistance. The second resin layer 140 may include wavelength conversion means for allowing the light emitted from the light-emitting element 120 to enter and providing wavelength-converted light. For example, the second resin layer 140 may include at least one selected from the group including phosphors, quantum dots, etc. The phosphor or quantum dot can emit blue, green, or red light. Increasing the fluorine ratio of fluorosilicon has the effect of improving moisture resistance. The second resin layer 140 may include wavelength conversion means for allowing the light emitted from the light-emitting element 120 to enter and providing wavelength-converted light. For example, the second resin layer 140 may include at least one selected from the group including phosphors, quantum dots, etc. The phosphor or quantum dot can emit blue, green, or red light. The second resin layer 140 may include wavelength conversion means for allowing the light emitted from the light-emitting element 120 to enter and providing wavelength-converted light. For example, the second resin layer 140 may include at least one selected from the group including phosphors, quantum dots, etc. The phosphor or quantum dot can emit blue, green, or red light. It can include wavelength conversion means for allowing the light emitted from the light-emitting element 120 to enter and providing wavelength-converted light. For example, the second resin layer 140 may include at least one selected from the group including phosphors, quantum dots, etc. The phosphor or quantum dot can emit blue, green, or red light. For example, the second resin layer 140 may include at least one selected from the group including phosphors, quantum dots, etc. The phosphor or quantum dot can emit blue, green, or red light. It can include at least one selected from the group including phosphors, quantum dots, etc. The phosphor or quantum dot can emit blue, green, or red light. The phosphor or quantum dot can emit blue, green, or red light.

[0021] The phosphor is uniformly arranged inside the second resin layer 140. The phosphor is a fluoride. It can contain a phosphor of a (fluoride) compound, for example, it can contain at least one of an MGF-based phosphor, a KSF-based phosphor, or a KTF-based phosphor. The phosphor can emit light with different peak wavelengths, and can emit light with different yellow and red colors or different red peak wavelengths for the light emitted from the light emitting element 120. When the phosphor is a red phosphor, the red phosphor can have a wavelength range from 610 nm to 650 nm, and the wavelength can have a width of less than 10 nm. The red phosphor can contain a fluoride-based phosphor. The fluoride-based red phosphor can be coated with a fluoride that does not contain Mn respectively to improve the reliability under high temperature and high humidity, or can further contain an organic coating on the phosphor surface or the fluoride coating surface that does not contain Mn. In the case of the fluoride-based red phosphor as described above, different from other phosphors, it can achieve a width of 10 nm or less, so it can be used in a high-resolution device. The phosphor composition according to the example must basically conform to stoichiometry, and each element can be substituted with other elements within each group in the periodic table. For example, Sr can be substituted with Ba, Ca, Mg, etc. in Group II (II) of alkaline earth metals, and Y can be substituted with Tb, Lu, Sc, Gd, etc. in the lanthanoid series. Also, activators such as Eu can be substituted with Ce, Tb, Pr, Er, Yb, etc. according to the desired energy level, and an activator alone or an inert agent, etc. can be further applied for property modification. The quantum dot can contain a II-VI compound or a III-V group compound semiconductor and can emit red light. The quantum dot is, for example, ZnS, ZnSe, ZnTe, CdS, CdSe, or the like. The light emitted from the light emitting element 120 can be emitted with different yellow and red colors or different red peak wavelengths. When the phosphor is a red phosphor, the red phosphor can have a wavelength range from 610 nm to 650 nm, and the wavelength can have a width of less than 10 nm. The red phosphor can contain a fluoride (fluorid e)-based phosphor. The fluoride-based red phosphor can be coated with a fluoride that does not contain Mn respectively to improve the reliability under high temperature and high humidity, or can further contain an organic coating on the phosphor surface or the fluoride coating surface that does not contain Mn. In the case of the fluoride-based red phosphor as described above, different from other phosphors, it can achieve a width of 10 nm or less, so it can be used in a high-resolution device. The phosphor composition according to the example must basically conform to stoichiometry, and each element can be substituted with other elements within each group in the periodic table. For example, Sr can be substituted with Ba, Ca, Mg, etc. in Group II (II) of alkaline earth metals, and Y can be substituted with Tb, Lu, Sc, Gd, etc. in the lanthanoid series. Also, activators such as Eu can be substituted with Ce, Tb, Pr, Er, Yb, etc. according to the desired energy level, and an activator alone or an inert agent, etc. can be further applied for property modification. The phosphor composition according to the example must basically conform to stoichiometry, and each element can be substituted with other elements within each group in the periodic table. For example, Sr can be substituted with Ba, Ca, Mg, etc. in Group II (II) of alkaline earth metals, and Y can be substituted with Tb, Lu, Sc, Gd, etc. in the lanthanoid series. Also, activators such as Eu can be substituted with Ce, Tb, Pr, Er, Yb, etc. according to the desired energy level, and an activator alone or an inert agent, etc. can be further applied for property modification. The quantum dot can contain a II-VI compound or a III-V group compound semiconductor and can emit red light. The quantum dot is, for example, ZnS, ZnSe, ZnTe, CdS, CdSe, The quantum dot can contain a II-VI compound or a III-V group compound semiconductor and can emit red light. The quantum dot is, for example, ZnS, ZnSe, ZnTe, CdS, CdSe, CdTe, GaN, GaP, GaAs, GaSb, InP, InAs, In, Sb, AlS, AlP, AlAs, PbS, PbSe, Ge, Si and combinations thereof such as CuInS2, CuInSe2, etc.

[0022] The second resin layer 140 can contain ink particles therein. The ink particles can contain at least one of metal ink, UV ink or curable ink. The size of the ink particles may be smaller than the size of the phosphor. The surface color of the ink particles may be any one of green, red, yellow, and blue. The type of the ink can be selectively applied from PVC (Poly Vinyl chloride) ink, PC (Polycarbonate) ink, ABS (acrylonitrile butadiene styrene copolymer) ink, UV resin ink, epoxy ink, silicon ink, PP (polypropylene) ink, aqueous ink, plastic ink, PM MA (poly methyl methacrylate) ink, PS (Polystyrene) ink. Here, the width or diameter of the ink particles can be 5 μm or less, for example, in the range of 0.0 5 μm to 1 μm. At least one of the ink particles can have a size smaller than the wavelength of light. The color of the ink particles can contain at least one of red, green color, yellow, and blue. For example, the phosphor emits a red wavelength, and the ink particles can contain red. For example, the red color tone of the ink particles may have a color tone darker than the color tone of the phosphor The color may be different from the color of the light emitted from the light-emitting element. The ink particles can provide an effect of blocking or shielding incident light.

[0023] The second resin layer 140 may contain at least two or more of a diffusing agent, ink particles, and a phosphor. The second resin layer 140 may contain ink particles and a phosphor without a diffusing agent. The content of the phosphor may be added in the same amount as the resin material constituting the second resin layer 140. The phosphor may be added at a ratio of 40% to 60%: 40% to 60% with respect to the resin material of the second resin layer 140. For example, the phosphor and the resin material of the second resin layer 140 may be added in the same ratio and mixed, for example, at 50%: 50%. The content of the phosphor may have a difference of 20% or less or 1 0% or less with respect to the resin material of the second resin layer 140. In the examples, within the second resin layer 140, by adding the phosphor in an amount of 40 wt% or more or in the range of 40 wt% to 60 wt%, the color on the surface of the second resin layer 140 is provided with the color tone of the phosphor, and the light diffusion and wavelength conversion efficiency can be improved. Also, the wavelength of the light emitted from the light-emitting element 120 through the second resin layer 140, for example, blue light, can be reduced from passing through. Also, the light extracted through the second resin layer 140 is provided as a surface light source according to the wavelength of the phosphor. The second resin layer 140 described above may be provided with a thickness thinner than the thickness of the first resin layer 130. If the thickness of the second resin layer 140 is thick, the light transmittance decreases, and if it is thin, the wavelength conversion efficiency may decrease.

[0024] The thickness of the second resin layer 140 can be, for example, in the range of 0.3 mm to 0.5 mm. The thickness of the second resin layer 140 can be 25% or less of the thickness of the first resin layer 130, for example, in the range of 16% to 25%. When the thickness of the second resin layer 140 is greater than the above range, the light extraction efficiency may decrease or the module thickness may increase. When it is smaller than the above range, it may be difficult to suppress hot spots or the wavelength conversion efficiency may decrease. Also, when the second resin layer 140 is thicker than the above range as a layer for wavelength conversion and external protection, the flexible characteristics and design freedom of the module may decrease. The phosphor or quantum dot added to the second resin layer 140 can include at least one or two or more of Amber light, yellow light, green light, red light, or blue light. By providing the second resin layer 140 with a phosphor, the appearance color can be made to look like the color of the phosphor. When the light-emitting element 120 is turned off, the surface of the second resin layer 140 or the surface of the lighting module is provided in a red image. When the light-emitting element 120 is turned on, red light having a predetermined luminous intensity is diffused and provided in a red image of a surface light source. Depending on whether the light-emitting element 120 is turned on or off, the color coordinates of the surface color can have different values within the color hue of the phosphor. The second resin layer 140 can include a phosphor and ink particles. The emission wavelength of the phosphor and the ink particles can include the same color or the same colored color. The colored color can be one of the colors of the phosphor.

[0025] The content of the phosphor in the second resin layer 140 is 23 wt% or less. When the light-emitting element 120 is turned on, red light having a predetermined luminous intensity is diffused and provided in a red image of a surface light source. Depending on whether the light-emitting element 120 is turned on or off, the color coordinates of the surface color can have different values within the color hue of the phosphor. When the light-emitting element 120 is turned off, the surface of the second resin layer 140 or the surface of the lighting module is provided in a red image. When the light-emitting element 120 is turned on, red light having a predetermined luminous intensity is diffused and provided in a red image of a surface light source. When the light-emitting element 120 is turned on, red light having a predetermined luminous intensity is diffused and provided in a red image of a surface light source. Depending on whether the light-emitting element 120 is turned on or off, the color coordinates of the surface color can have different values within the color hue of the phosphor. When the light-emitting element 120 is turned on or off, the color coordinates of the surface color can have different values within the color hue of the phosphor. The second resin layer 140 can include a phosphor and ink particles. The emission wavelength of the phosphor and the ink particles can include the same color or the same colored color. The emission wavelength of the phosphor and the ink particles can include the same color or the same colored color. The colored color can be one of the colors of the phosphor. The content of the phosphor in the second resin layer 140 is 23 wt% or less. For example, it is in the range of 12 wt% to 23 wt%, and the content of the ink particles is 3 wt% or more. For example, it can include the range of 3 wt% to 13 wt%. Since the weight of the ink particles is smaller than the weight of the phosphor body, the ink particles can be distributed in the region adjacent to the surface of the second resin layer 140 relative to the phosphor. As a result, the color sensation of the surface of the second resin layer 140 is provided by the color sensation of the ink particles. Since such ink particles can suppress the transmission of light , the hot spot can be reduced. When the ink particles are red, the outer surface of the lighting module 100 appears red when the light emitting element 120 is not lit. That is, the lighting module 100 appears red whether the light is on or off, so the heterogeneity due to color difference can be prevented. The second resin layer 140 can include a first layer to which a phosphor is added and a second layer to which the ink particles are added. The first layer is disposed between the first resin layer 130 and the second layer. By separately laminating the second layer having the ink particles , the phosphor content of the first layer can be reduced.

[0026] As shown in FIG. 2, the second resin layer 140 can include a first region 141 formed on the first resin layer 130 and a second region 143 disposed on the side surface of the first resin layer 130. The first region 141 of the second resin layer 140 can overlap a part of N light emitting elements 12 0 in a direction perpendicular to the substrate 110. The first region 141 of the second resin layer 140 may be formed so as not to overlap a part of at least one light emitting element 120 disposed at the outermost edge on the substrate 110. The first region 141 of the second resin layer 140 is on the substrate 110 It may be arranged to be parallel to the upper surface of 110. The width of the first region 141 of the second resin layer 140 may be formed to be smaller than the width of the substrate 110 in the first and second directions. The edge of the first region 141 of the second resin layer 14 0 may be arranged inside the side surface of the substrate 110. The first region 141 of the second resin layer 140 can include a flat surface.

[0027] The second region 143 of the second resin layer 140 extends from the edge of the first region 141 of the second resin layer 140 in the direction of the substrate 110. The second region 143 of the second resin layer 140 can include a curved surface. The second region 143 of the second resin layer 140 can include a curved surface with an outwardly bulging shape. The second region 143 of the second resin layer 140 may be formed to overlap with the light-emitting element 120 arranged at the outermost edge of the upper part of the substrate 110 in the vertical direction of the substrate 110. The first region 141 can be defined as a flat part or an upper surface part. The second region 1 43 can be defined as a side surface part or a curved surface part. In the embodiment, the thickness of the first region 141 of the second resin layer 140 and the thickness of the second region 143 of the second resin layer 140 are formed to correspond, but it is not limited thereto. Here, the thickness of the first region 141 may be a thickness or a vertical distance in the vertical direction, and the thickness of the second region 143 may be a horizontal distance from the outer surface of the first resin layer 140 to the outer surface of the second region 43.

[0028] As described above, by forming the second resin layer 140 so that its side surface has a curved surface, the distance between the corner region of the second resin layer 140 and the light-emitting element 120 arranged at the outermost edge of the substrate 100 can be reduced. Thereby, the second resin layer 140 has a first region 141 and a second region ​​​​​​It is possible to prevent the occurrence of dark lines at the interface between 143. In the above, the arrangement structure of the light-emitting element , the resin layer, and the layer having phosphor or ink particles has been mainly described. However, in order to remove dark lines and improve the uniformity of light, the relationship with the distance between the light-emitting element and the phosphor layer, the radius of curvature of the second region of the phosphor layer, and the thicknesses of the resin layer and the phosphor layer plays an important role.

[0029] Therefore, in the following, the detailed specifications of each component of the lighting module will be described in more detail . As shown in FIG. 3, the second region 143 of the second resin layer 140 can include a curved surface. The second region 143 of the second resin layer 140 can include a first point P1, a second point P2 and a third point P3. The first point P1, the second point P2, and the third point P 3 may be points on the outer surface of the second region 143 of the second resin layer 140. Here, a plurality of light-emitting elements 120 include a first light-emitting element 121, and the first light-emitting element 121 is a plurality of light-emitting elements arranged around the outer edge of the first resin layer 120 or adjacent to the side surface of the first resin layer 120. The first point P1 may be a region in the horizontal direction from the center C1 of the first light-emitting element 121 closest to the side surface of the first resin layer 130 and in contact with the outer surface of the second region 143 of the second resin layer 140. The third point P3 may be a region in contact with the outer surface of the second region 143 of the second resin layer 140 and on a straight line perpendicular to the center C1 of the first light-emitting element 121. The horizontal direction may be a direction parallel or horizontal to the upper surface of the substrate 110, and the vertical direction may be a direction perpendicular to the upper surface of the substrate 110. The second point P2 may be any region between the first point P1 and the third point P3 of the second region 143 of the second resin layer 140. The vertical direction may be a direction perpendicular to the upper surface of the substrate 110. P2 may be any region between the first point P1 and the third point P3 of the second region 143 of the second resin layer 140. It may be any one region.

[0030] The first distance L1 between the center C1 of the first light-emitting element 121 and the first point P1, the first light-emitting element 121 from the center C1 to the second distance L2 of the second point P2, and the first light-emitting element 121 from the center C1 to the third distance L3 of the third point P3 may be formed differently. The third distance L3 from the center C1 of the first light-emitting element 121 to the third point P3 is the first distance L1 between the center C1 of the light-emitting element 121 and the first point P1, and the first light-emitting element 121 from the center C1 to the second distance L2 of the second point P2 may be formed larger. The second distance L2 between the center C1 of the first light-emitting element 121 and the second point P2 is the first light-emitting element 121 from the center C1 to the first distance L1 of the first point P1 may be formed larger. Conventionally, the second distance L2 between the center C1 of the first light-emitting element 121 and the second point P2 is the first light-emitting element 121 from the center C1 to the third distance L3 of the third point P3 and the center of the first light-emitting element 121 A problem of generating a dark line at the second point P2 has occurred because it is formed significantly farther than the first distance L2 between C1 and the first point P1. The embodiment is to curve the second region 143 of the second resin layer 140 so as to reduce the second distance L2 between the center C1 of the first light-emitting element 121 and the second point P2 By forming it to have a curved surface, it is possible to prevent a dark line from occurring on the second resin layer 140. Further, the embodiment is to form a curved surface so that there is almost no difference in the values of the first distance L1, the second distance L2, and the third distance L3, thereby improving the light uniformity of the side surface of the second resin layer 140 It is possible to improve the light uniformity between the upper surface and the side surface of the second resin layer 140. Substantially, although there is a difference in the distance values of the first distance L1, the second distance L2, and the third distance L3, the second resin layer 140 There is an effect that can prevent a dark line from occurring on the second resin layer 140 by forming the second region 143 of the second resin layer 140 to have a curved surface so as to reduce the second distance L2 between the center C1 of the first light-emitting element 121 and the second point P2. Further, the embodiment is to form a curved surface so that there is almost no difference in the values of the first distance L1, the second distance L2, and the third distance L3, thereby improving the light uniformity of the side surface of the second resin layer 140 And the light uniformity between the upper surface and the side surface of the second resin layer 140 can be improved. Substantially, although there is a difference in the distance values of the first distance L1, the second distance L2, and the third distance L3, the second resin layer 140 There is an effect that can prevent a dark line from occurring on the second resin layer 140 by forming the second region 143 of the second resin layer 140 to have a curved surface so as to reduce the second distance L2 between the center C1 of the first light-emitting element 121 and the second point P2. Further, the embodiment is to form a curved surface so that there is almost no difference in the values of the first distance L1, the second distance L2, and the third distance L3, thereby improving the light uniformity of the side surface of the second resin layer 140 And the light uniformity between the upper surface and the side surface of the second resin layer 140 can be improved. Substantially, although there is a difference in the distance values of the first distance L1, the second distance L2, and the third distance L3, the second resin layer 140 There is an effect that can prevent a dark line from occurring on the second resin layer 140 by forming the second region 143 of the second resin layer 140 to have a curved surface so as to reduce the second distance L2 between the center C1 of the first light-emitting element 121 and the second point P2. Further, the embodiment is to form a curved surface so that there is almost no difference in the values of the first distance L1, the second distance L2, and the third distance L3, thereby improving the light uniformity of the side surface of the second resin layer 140 Since the distance difference becomes extremely small as it goes to the upper surface and the side surface of the lipid layer 140, it is difficult to recognize the brightness difference when viewed from the outside. Degree difference is difficult to recognize.

[0031] The first distance L1 between the center C1 of the first light-emitting element 121 and the first point P1 may be determined by the distance between the light-emitting elements 12 0. The distance L4 between the first light-emitting element 121 and the adjacent light-emitting element may be arranged so that the distance L4 between the light-emitting elements 120 is 5.5 mm to 6.5 mm. If the distance L4 between the first light-emitting element 121 and the adjacent light-emitting element exceeds 6.5 m m, hot spots may occur in the area where the light-emitting elements 120 are arranged when viewed from the outside. The first distance L1 between the center C1 of the first light-emitting element 121 and the first point P1 is such that the first light-emitting element 121 is 44% to 55% of the fourth distance L4 between the light-emitting elements 120. For example, the first distance L1 between the center C1 of the first light-emitting element 121 and the first point P1 is determined to be around 3 mm. The first distance L1 between the center C1 of the first light-emitting element 121 and the first point P1 is less than 44% or exceeds 55% of the fourth distance L4 between the light-emitting elements 120. If it exceeds, the light emitted through the second region 143 of the second resin layer 140 will appear overly bright or dark, and there may be a problem of a decrease in light uniformity. When viewed, there may be a problem of a decrease in light uniformity.

[0032] The radius of curvature R of the second region 143 of the second resin layer 140 is determined by the thicknesses of the second resin layer 140 and the first resin layer 130. The radius of curvature R of the second region 143 of the second resin layer 140 is greater than or equal to the sum of the thickness t1 of the first resin layer 130 and the thickness t2 of the first region 141 of the second resin layer 140 in the direction perpendicular to the substrate 110. For example, the second resin layer 14 The radius of curvature R of the second region 143 of the second resin layer 140 may be formed to be greater than or equal to the sum of the thickness t1 of the first resin layer 130 and the thickness t2 of the first region 141 of the second resin layer 140 in the direction perpendicular to the substrate 110. For example, the second resin layer 14 The radius of curvature R of the second region 143 of 0 is 100% to 110% of the sum of the thickness t1 of the first resin layer 130 in the direction perpendicular to the substrate 110 and the thickness t2 of the first region 141 of the second resin layer 140. It may be formed in such a manner. Here, the thickness t1 of the first resin layer 130 may be 3.5 mm to 5 mm. The thickness t2 of the first region 141 of the second resin layer 140 may be 0.5 mm or less, for example, it may have a range of 0.3 mm to 0.5 mm. Thereby, the radius of curvature R of the second region 143 of the second resin layer 140 can have 5.5 mm to 6.0 mm. Here, when the thickness t2 of the first region 141 of the second resin layer 140 is less than 0.5 mm, the light efficiency can be increased. Further, the second resin layer 140 can include a fourth point P4 between the first region 141 and the second region 14 3. The fourth point P4 is disposed in a region on the outer surface of the second resin layer 140. Further, a fifth point P 5 can be included on the substrate 110 at the shortest distance from the fourth point P4. The distance L5 between the fourth point P4 of the second resin layer 140 and the fifth point P5 of the substrate 110 may be larger than the first distance L1 from the first point P1 of the second region 143 of the second resin layer 140 to the first light emitting element 1 21. Also, the distance L5 between the fourth point P4 of the second resin layer 140 and the fifth point P5 of the substrate 110 may be formed to be smaller than or the same as the radius of curvature R of the second region 143 of the second resin layer 140. The second resin layer 140 can include a seventh point P7 where the second region 143 of the second resin layer 140 and the substrate 110 are in contact. The seventh point P7 may be the inner surface of the second resin layer 140 where the second region 143 of the second resin layer 140 and the first resin layer 130 are in contact.

[0033] The second resin layer 140 can include a seventh point P7 where the second region 143 of the second resin layer 140 and the substrate 110 are in contact. The seventh point P7 may be the inner surface of the second resin layer 140 where the second region 143 of the second resin layer 140 and the first resin layer 130 are in contact. The second resin layer 140 The distance L7 between the seventh point P7 of the second region 143 and the side surface of the light-emitting element 120 may be formed to be smaller than the distance L4 between the light-emitting elements 120. The fifth point P5 formed on the substrate 110 may be larger than the distance from the seventh point P7 to the first light-emitting element 121 and may be arranged in a region smaller than or the same as the radius of curvature R. As described above, the radius of curvature R of the second region 143 of the second resin layer 140 is determined through various conditions of the lighting module 100. The second resin layer 140 may be formed to have a smaller distance L7 between the seventh point P7 of the second region 143 and the side surface of the light-emitting element 120 than the distance L4 between the light-emitting elements 120. The fifth point P5 formed on the substrate 110 may be larger than the distance from the seventh point P7 to the first light-emitting element 121 and may be arranged in a region smaller than or the same as the radius of curvature R. As described above, the radius of curvature R of the second region 143 of the second resin layer 140 is determined through various conditions of the lighting module 100. The distance L7 between the seventh point P7 of the second region 143 and the side surface of the light-emitting element 120 may be formed to be smaller than the distance L4 between the light-emitting elements 120. The fifth point P5 formed on the substrate 110 may be larger than the distance from the seventh point P7 to the first light-emitting element 121 and may be arranged in a region smaller than or the same as the radius of curvature R. As described above, the radius of curvature R of the second region 143 of the second resin layer 140 is determined through various conditions of the lighting module 100. The distance L7 between the seventh point P7 of the second region 143 and the side surface of the light-emitting element 120 may be formed to be smaller than the distance L4 between the light-emitting elements 120. The fifth point P5 formed on the substrate 110 may be larger than the distance from the seventh point P7 to the first light-emitting element 121 and may be arranged in a region smaller than or the same as the radius of curvature R. As described above, the radius of curvature R of the second region 143 of the second resin layer 140 is determined through various conditions of the lighting module 100. The distance L7 between the seventh point P7 of the second region 143 and the side surface of the light-emitting element 120 may be formed to be smaller than the distance L4 between the light-emitting elements 120. The fifth point P5 formed on the substrate 110 may be larger than the distance from the seventh point P7 to the first light-emitting element 121 and may be arranged in a region smaller than or the same as the radius of curvature R. As described above, the radius of curvature R of the second region 143 of the second resin layer 140 is determined through various conditions of the lighting module 100. The distance L7 between the seventh point P7 of the second region 143 and the side surface of the light-emitting element 120 may be formed to be smaller than the distance L4 between the light-emitting elements 120. The fifth point P5 formed on the substrate 110 may be larger than the distance from the seventh point P7 to the first light-emitting element 121 and may be arranged in a region smaller than or the same as the radius of curvature R. As described above, the radius of curvature R of the second region 143 of the second resin layer 140 is determined through various conditions of the lighting module 100.

[0034] FIG. 4 is a perspective view showing the first resin layer in the lighting module of FIG. 2, FIG. 5 is a plan view for explaining the relationship based on the distance between the light-emitting element and the first resin layer, and FIG. 6 is a cross-sectional view taken along line B-B of FIG. 4. As shown in FIG. 4, the first resin layer 130 includes a flat upper surface 131, a first side surface 133 bent from the upper surface 131 toward the substrate 110, a second side surface 135 arranged adjacent to the first side surface 133, and a corner region 137 arranged between the first side surface 133 and the second side surface 135. The first side surface 133, the second side surface 135, and the corner region 137 may include curved surfaces. FIG. 4 is a perspective view showing the first resin layer in the lighting module of FIG. 2, FIG. 5 is a plan view for explaining the relationship based on the distance between the light-emitting element and the first resin layer, and FIG. 6 is a cross-sectional view taken along line B-B of FIG. 4. As shown in FIG. 4, the first resin layer 130 includes a flat upper surface 131, a first side surface 133 bent from the upper surface 131 toward the substrate 110, a second side surface 135 arranged adjacent to the first side surface 133, and a corner region 137 arranged between the first side surface 133 and the second side surface 135. The first side surface 133, the second side surface 135, and the corner region 137 may include curved surfaces. FIG. 4 is a perspective view showing the first resin layer in the lighting module of FIG. 2, FIG. 5 is a plan view for explaining the relationship based on the distance between the light-emitting element and the first resin layer, and FIG. 6 is a cross-sectional view taken along line B-B of FIG. 4. As shown in FIG. 4, the first resin layer 130 includes a flat upper surface 131, a first side surface 133 bent from the upper surface 131 toward the substrate 110, a second side surface 135 arranged adjacent to the first side surface 133, and a corner region 137 arranged between the first side surface 133 and the second side surface 135. The first side surface 133, the second side surface 135, and the corner region 137 may include curved surfaces. FIG. 4 is a perspective view showing the first resin layer in the lighting module of FIG. 2, FIG. 5 is a plan view for explaining the relationship based on the distance between the light-emitting element and the first resin layer, and FIG. 6 is a cross-sectional view taken along line B-B of FIG. 4. As shown in FIG. 4, the first resin layer 130 includes a flat upper surface 131, a first side surface 133 bent from the upper surface 131 toward the substrate 110, a second side surface 135 arranged adjacent to the first side surface 133, and a corner region 137 arranged between the first side surface 133 and the second side surface 135. The first side surface 133, the second side surface 135, and the corner region 137 may include curved surfaces. FIG. 4 is a perspective view showing the first resin layer in the lighting module of FIG. 2, FIG. 5 is a plan view for explaining the relationship based on the distance between the light-emitting element and the first resin layer, and FIG. 6 is a cross-sectional view taken along line B-B of FIG. 4. As shown in FIG. 4, the first resin layer 130 includes a flat upper surface 131, a first side surface 133 bent from the upper surface 131 toward the substrate 110, a second side surface 135 arranged adjacent to the first side surface 133, and a corner region 137 arranged between the first side surface 133 and the second side surface 135. The first side surface 133, the second side surface 135, and the corner region 137 may include curved surfaces. FIG. 4 is a perspective view showing the first resin layer in the lighting module of FIG. 2, FIG. 5 is a plan view for explaining the relationship based on the distance between the light-emitting element and the first resin layer, and FIG. 6 is a cross-sectional view taken along line B-B of FIG. 4. As shown in FIG. 4, the first resin layer 130 includes a flat upper surface 131, a first side surface 133 bent from the upper surface 131 toward the substrate 110, a second side surface 135 arranged adjacent to the first side surface 133, and a corner region 137 arranged between the first side surface 133 and the second side surface 135. The first side surface 133, the second side surface 135, and the corner region 137 may include curved surfaces. FIG. 4 is a perspective view showing the first resin layer in the lighting module of FIG. 2, FIG. 5 is a plan view for explaining the relationship based on the distance between the light-emitting element and the first resin layer, and FIG. 6 is a cross-sectional view taken along line B-B of FIG. 4. As shown in FIG. 4, the first resin layer 130 includes a flat upper surface 131, a first side surface 133 bent from the upper surface 131 toward the substrate 110, a second side surface 135 arranged adjacent to the first side surface 133, and a corner region 137 arranged between the first side surface 133 and the second side surface 135. The first side surface 133, the second side surface 135, and the corner region 137 may include curved surfaces.

[0035] The upper surface 131 of the first resin layer 130 may contact the lower part of the first region of the second resin layer. The side surfaces 133, 135, and the corner region 137 of the first resin layer 130 may contact the second region of the second resin layer. That is, the upper surface 131, the side surfaces 133, 135, and the corner region 137 of the first resin layer 130 may be formed in a shape corresponding to the inner surface of the second resin layer. The first resin layer 130 is in contact with the upper surface of the substrate 110 in the region where the first side surface 133 of the first resin layer 130... The upper surface 131 of the first resin layer 130 may contact the lower part of the first region of the second resin layer. The side surfaces 133, 135, and the corner region 137 of the first resin layer 130 may contact the second region of the second resin layer. That is, the upper surface 131, the side surfaces 133, 135, and the corner region 137 of the first resin layer 130 may be formed in a shape corresponding to the inner surface of the second resin layer. The first resin layer 130 is in contact with the upper surface of the substrate 110 in the region where the first side surface 133 of the first resin layer 130... The upper surface 131 of the first resin layer 130 may contact the lower part of the first region of the second resin layer. The side surfaces 133, 135, and the corner region 137 of the first resin layer 130 may contact the second region of the second resin layer. That is, the upper surface 131, the side surfaces 133, 135, and the corner region 137 of the first resin layer 130 may be formed in a shape corresponding to the inner surface of the second resin layer. The first resin layer 130 is in contact with the upper surface of the substrate 110 in the region where the first side surface 133 of the first resin layer 130... The upper surface 131 of the first resin layer 130 may contact the lower part of the first region of the second resin layer. The side surfaces 133, 135, and the corner region 137 of the first resin layer 130 may contact the second region of the second resin layer. That is, the upper surface 131, the side surfaces 133, 135, and the corner region 137 of the first resin layer 130 may be formed in a shape corresponding to the inner surface of the second resin layer. The first resin layer 130 is in contact with the upper surface of the substrate 110 in the region where the first side surface 133 of the first resin layer 130... The upper surface 131 of the first resin layer 130 may contact the lower part of the first region of the second resin layer. The side surfaces 133, 135, and the corner region 137 of the first resin layer 130 may contact the second region of the second resin layer. That is, the upper surface 131, the side surfaces 133, 135, and the corner region 137 of the first resin layer 130 may be formed in a shape corresponding to the inner surface of the second resin layer. The first resin layer 130 is in contact with the upper surface of the substrate 110 in the region where the first side surface 133 of the first resin layer 130... It can include the eighth point P8 that contacts the corner region 137. The first resin layer 130 is on the substrate 1 It can include the ninth point P9 where the second side surface 135 and the corner region 137 contact in the region contacting the upper surface of 10 It can be such that. The first resin layer 130 is outside the corner region 137 in the region contacting the upper surface of the substrate 110 It can include the tenth point P10 which is the outer surface. Here, the region where the upper surface of the first resin layer 130 and the substrate 110 contact can include the straight line 133a.

[0036] As shown in FIG. 5, the center of the first light-emitting element 121 adjacent to the corner region 137 of the first resin layer 130 The distance L10 from C1 to the tenth point P10 of the corner region 137 is the same as the distance L8 from the center C1 of the first light-emitting element 121 to the eighth point P8 of the first resin layer 130 and may be formed. From the center C1 of the first light-emitting element 121 adjacent to the corner region 137 of the first resin layer 130 to the tenth point P10 of the corner region 137, the distance L10 is the same as the distance L9 from the center C 1 of the first light-emitting element 121 to the ninth point P9 of the first resin layer 130 and may be formed. Thus, the light emitted from the corner region 137 of the first resin layer 130 is the first of the first resin layer 130 It is emitted so as to have the same luminance as the light emitted from the side surface 133 and the second side surface 135. .

[0037] As shown in FIG. 6, the outer surface of the corner region 137 of the first resin layer 130 can include the eleventh point P11 which is the shortest distance perpendicular to the substrate 110 from the center C1 of the first light-emitting element 121. Thus, the straight-line distance L11 from the center C1 of the first light-emitting element 121 to the eleventh point P11 is the first It can be formed larger than the distance L10 from the center C1 of the light-emitting element 121 to the tenth point P10. That is, the corner region 137 of the first resin layer 130 is the same as the side surface of the first resin layer 130 ​ 、The distance from the first light-emitting element 121 increases as it approaches the upper surface of the first resin layer 130. This can be achieved. The lighting module of the first embodiment forms a boundary region between surfaces into a curved surface, and it can be seen that the generation of dark lines can be prevented. Also, by forming the side surface of the lighting module to have a curved surface, it can be seen that the luminance of the lighting module is uniform overall.

[0038] As shown in FIG. 7, the third region 145 of the second resin layer 140 may be vertically disposed between the second region 143 of the second resin layer 140 and the substrate 110. One end of the third region 145 of the second resin layer 140 contacts the second region 143 of the second resin layer 140, and the other end of the third region 145 of the second resin layer 140 can contact the upper surface of the substrate 110. The height h1 of the third region 145 of the second resin layer 140 may be formed smaller than the height h2 of the light-emitting element 120. In an embodiment, the thickness of the first region 141 of the second resin layer 140, the thickness of the second region 143 of the second resin layer 143, and the thickness of the third region 145 of the second resin layer 140 may be formed to correspond to each other. The second region 143 of the second resin layer 140 may include a first point P1, a second point P2, and a third point P3. The first point P1, the second point P2, and the third point P3 may be the outer surfaces of the second region 143 of the second resin layer 140. The first point P1 may be a region that is in contact with the outer surface of the second region 143 of the second resin layer 140 in the horizontal direction from the center C1 of the light-emitting element 120 disposed closest to the side surface of the first resin layer 130 to the substrate 110. The first point P1 may be a region where the second region 143 and the third region 145 of the second resin layer 140 are in contact. The second point P2 may be one of the outer surfaces of the second region 143 of the second resin layer 140. ​ It may be any one of the regions. The third point P3 is from the center C1 of the first light-emitting element 121 a region in contact with the outer surface of the second region 143 of the second resin layer 140 and a straight line perpendicular to the substrate 110 may be.

[0039] The first distance L1 between the center C1 of the first light-emitting element 121 and the first point P1, and the first light-emitting the second distance L2 from the center C1 of the element 121 to the second point P2, and the first light-emitting element 121 The third distance L3 from the center C1 to the third point P3 may be formed to be different. The third distance L3 from the center C1 of the first light-emitting element 121 to the third point P3 is the first light-emitting the first distance L1 between the center C1 of the element 121 and the first point P1, and the first light-emitting element 121 It may be formed larger than the second distance L2 from the center C1 to the second point P2. The second distance L2 between the center C1 of the first light-emitting element 121 and the second point P2 may be formed larger than the first distance L1 from the center C1 of the first light-emitting element 121 to the first point P1. The second resin layer 140 may include a fourth point P4 between the first region 141 and the second region 143. The fourth point P4 may be disposed on the outer surface of the second resin layer 140. Also, the substrate 110 at the shortest distance from the fourth point P4 may include a fifth point P5. The distance L5 between the fourth point P4 of the second resin layer 140 and the fifth point P5 of the substrate 110 is the second region of the second resin layer 140 It may be larger than the distance from the first point P1 of 143 to the first light-emitting element 121. Also, the distance L5 between the fourth point P4 of the second resin layer 140 and the fifth point P5 of the substrate 110 is the second resin It may be formed smaller than or the same as the radius of curvature R of the second region 143 of the layer 140. The third region 145 of the second resin layer 140 may include a sixth point P6. The sixth point P6 is a region in contact with the outer surface of the second region 143 of the second resin layer 140 and a straight line perpendicular to the substrate 110 It may be larger than the distance from the first point P1 of 143 to the first light-emitting element 121. Also, the distance L5 between the fourth point P4 of the second resin layer 140 and the fifth point P5 of the substrate 110 is the second resin It may be formed smaller than or the same as the radius of curvature R of the second region 143 of the layer 140. The third region 145 of the second resin layer 140 may include a sixth point P6. The sixth point P6 is It may be formed smaller than or the same as the radius of curvature R of the second region 143 of the second resin layer 140. The third region 145 of the second resin layer 140 may include a sixth point P6. The sixth point P6 is The third region 145 of the resin layer 140 may include a sixth point P6. The sixth point P6 is It may be a region where the outer surface of the third region 145 of the second resin layer 140 contacts the upper surface of the substrate 110. The distance L6 from the center C1 of the first light-emitting element 121 to the sixth point P6 may be greater than the distance L1 from the center C1 of the first light-emitting element 121 to the first point P1.

[0040] The lighting module according to the embodiment includes a second resin layer 140 having a straight line perpendicular to the upper surface of the substrate 110 on the side surface of the first resin layer 130, so that the luminance of the light emitted from the side surface can be made more uniform.

[0041] FIG. 8 is a perspective view of a lighting assembly having the lighting module according to the second embodiment, and FIG. 9 is a cross-sectional view taken along line C-C of the lighting assembly of FIG. 8. Referring to FIGS. 8 and 9, the lighting assembly includes the lighting module 100 disclosed above, a first cover 210 having an opening 215 in which the first resin layer and the second resin layers 130 and 140 of the lighting module 100 protrude, and a second cover 220 that supports the first cover 210 and the lighting module 100. The first cover 210 may be a sub-bezel, an upper or top cover, and the second cover 220 may be a lower bezel, a lower or bottom cover.

[0042] The lighting module 100 is coupled to the first cover and the second covers 210 and 220 with a predetermined curvature by the substrate 110, the first resin layer, and the second resin layers 130 and 140. The first cover and the second covers 210 and 220 can support and fix regions other than the light-emitting region of the lighting module 100. The light-emitting region is the first resin on the light-emitting element 120. It may also be a region of the lipid layer and the second resin layers 130 and 140. The The upper surface area of the substrate 110 may be larger than the lower surface area of the first resin layer 130. The outer edge of the substrate 110 may extend further outward from each edge of the first resin layer 130. The length D2 of the outer edge of the upper surface of the substrate 110 may be 0.1 times or more of the thickness of the illumination module as the distance from the side surface of the second resin layer 130 to the substrate edge. For example, the length D2 of the outer edge may have a range of 1 mm or less, for example, 0.3 mm to 1 mm. When it is smaller than the range, there is no supporting effect, and when it is larger than the range, material loss and module size increase. The outer edge of the substrate 110 may be a non-light-emitting region without a resin layer, and the first cover 210 and the second cover 220 may be coupled on the outer edge to provide assembly and convenience of the illumination module 100. The first cover 210 may include a substrate cover portion 211 having an opening 215 and a side cover portion 213 outside the substrate cover portion 211. The dimension of the upper surface of the opening 215 is arranged to be larger than the dimension of the lower surface of the first resin layer 130, and the second resin layer 140 can protrude through the opening 215. The upper surface S1 and the side surface S2 of the second resin layer 140 may be a curved surface or a flat surface, and the corner portion S3 between the upper surface S1 and the side surface S2 may be a curved surface. The second resin layer 140 may be arranged on the upper surface and the side surface of the first resin layer 130. The substrate cover portion 211 can be spaced from the second resin layer 140 to prevent the first resin layer 130 from being exposed. That is, the first resin layer 130 can be protected.

[0043] The first cover 210 may include a substrate cover portion 211 having an opening 215 and a side cover portion 213 outside the substrate cover portion 211. The dimension of the upper surface of the opening 215 is arranged to be larger than the dimension of the lower surface of the first resin layer 130, and the second resin layer 140 can protrude through the opening 215. The upper surface S1 and the side surface S2 of the second resin layer 140 may be a curved surface or a flat surface, and the corner portion S3 between the upper surface S1 and the side surface S2 may be a curved surface. The second resin layer 140 may be arranged on the upper surface and the side surface of the first resin layer 130. The substrate cover portion 211 can be spaced from the second resin layer 140 to prevent the first resin layer 130 from being exposed. That is, the first resin layer 130 can be protected. The upper surface S1 and the side surface S2 may be a curved surface or a flat surface, and the corner portion S3 between the upper surface S1 and the side surface S2 may be a curved surface. The second resin layer 140 may be arranged on the upper surface and the side surface of the first resin layer 130. The substrate cover portion 211 can be spaced from the second resin layer 140 to prevent the first resin layer 130 from being exposed. That is, the first resin layer 130 can be protected. layer 130 can be protected. The second resin layer 140 disposed on the side surface S2 of the lipid layer 140 can prevent the first resin layer 130 from being exposed from the substrate cover portion 211.

[0044] The substrate cover portion 211 can protect the upper surface of the substrate 110. The substrate cover portion 211 covers the outer edge upper surface of the substrate 110 and faces the side surface S2 of the second resin layer 140. The upper surface of the substrate cover portion 211 may be disposed lower than the upper surface S1 of the second resin layer 140. For example, it may be disposed below the midpoint of the height of the upper surface of the second resin layer 140. The upper surface of the substrate cover portion 211 may be disposed lower than the upper surface of the first resin layer 130. This can minimize the light blocking by the substrate cover portion 211 against the side light emitted from the lighting module 100.

[0045] The side cover portion 213 may be bent or extended in the direction of the second cover 220 through the substrate cover portion 211. The side cover portion 213 can cover the side surface of the substrate 110 and protect the side surface of the substrate 110. The side cover portion 213 can protrude lower than the lower surface of the substrate 110. At least one or both of the substrate cover portion 211 and the side cover portion 213 may include a coupling member (not shown) coupled to the substrate 110 and the second cover 220. The coupling member may include a hook or a locking rib structure. The thickness of the second cover 220 is greater than the thickness of the first cover 210 and will support the lighting module 100.

[0046] The second cover 220 may include a substrate support portion 221 under the substrate 110 and a coupling portion 223 under the substrate support portion 221. The substrate support portion 221 may be disposed under the substrate 11 0 and may be adhered to the substrate 110. The substrate support portion 221 has an upper surface width or upper surface area wider than the lower surface width D1 or lower surface area of the substrate 110 and will support the substrate 110. The coupling portion 223 is provided in a stepped structure from the substrate support portion 221 and the side cover portion 213 is coupled thereto. The coupling portion 223 has a hook or a locking groove structure and is coupled to the side cover portion 213. Support protrusions 235 may be disposed, but are not limited thereto, under the lower portion of the first cover 210 . One or more of the support protrusions may be disposed. The materials of the first cover and the second covers 210, 2 20 may include a plastic material or a resin material with good moisture resistance. As another example, at least one of the first cover and the second covers 210, 220 may include a metal material . The first cover and the second covers 210, 220 are provided as covers 210, 220 that support the outer edge and the lower portion of the lighting module 100 having a thickness of 5.5 mm or less, so that assembly or installation using the lighting assembly having the lighting module 100 becomes easy. Also, when using the lighting assembly, durability and reliability can be improved even after long-term use. The first cover and the second covers 210, 220 may include a curved shape or a linear shape according to the outer edge shape of the lighting module 100. The first cover and the second covers 21 0, 220 are for a cable where a power cable drawn from the lighting module 100 is disposed . Since the first cover and the second covers 210, 220 are provided as covers that support the outer edge and the lower portion of the lighting module 100, assembly or installation using the lighting assembly having the lighting module 100 becomes easy. Also, when using the lighting assembly, durability and reliability can be improved even after long-term use. The first cover and the second covers 210, 220 may be curved or linear according to the outer edge shape of the lighting module 100. The first cover and the second covers 21

[0047] 0, 220 may be curved or linear according to the outer edge shape of the lighting module 100. The first cover and the second covers 21 0, 220 are for a cable where a power cable drawn from the lighting module 100 is disposed ​ It may include a cable extraction part 226. The cable extraction part 226 can project from the region between the first cover and the second covers 210 and 220. The power cable is connected to the substrate 110 of the lighting module 100.

[0048] FIG. 10 is a perspective view showing a lighting assembly having a lighting module according to a third embodiment, FIG. 11 is a rear view of the lighting assembly of FIG. 11, FIG. 12 is an exemplary view before the lighting assembly of FIG. 10 is coupled to the main frame, FIG. 13 is a perspective view showing an example of the coupling of the lighting assembly of FIG. 12 to the main frame, FIG. 14 is a side cross-sectional view showing the electrical contact structure of the lighting assembly in the coupling structure of FIG. 13, and FIG. 15 is a partial enlarged view of the coupling structure of FIG. 14.

[0049] Referring to FIGS. 10 to 12, the lighting assembly 200 may include the lighting module 100 disclosed above, a first cover 210 having an opening 215 from which the second resin layer 140 of the lighting module 100 projects, and a second cover 220 that supports the first cover 210 and the lighting module 100. The first cover 210 may be a sub-bezel, an upper or top cover, and the second cover 220 may be a lower bezel, a lower or bottom cover. The first cover and the second covers 210 and 220 may be coupled through a coupling member or an adhesive member, but are not limited thereto. The first cover and the second covers 210 and 220 can be defined as a cover 201.

[0050] The cover 201 (210, 220) has a first coupling member spaced apart from the coupling front end 245 and and may include second coupling members 241 and 243, and the first coupling member and the second coupling members 2 41 and 243 are respectively disposed at positions corresponding to both side surfaces of the lighting module 100 The first coupling member and the second coupling members 241 and 243 can be separated from the coupling front end 245 by the same distance D3 The first coupling member and the second coupling members 241 and 243 can include locking grooves recessed from the side surfaces of the first cover and the second covers 210 and 220 in the direction of the lighting module 100 In another example, the first coupling member and the second coupling members may be provided as locking protrusions. The coupling front end 245 may be one end of the cover or one side surface disposed in the coupling direction The locking grooves of the first coupling member and the second coupling members 241 and 243 are disposed at a depth D4 at which the substrate 110 of the lighting module 100 is not exposed The depth D4 of the locking groove is disposed at 1 / 2 or less of the width of the first cover 210. If the depth is exceeded, the substrate 110 is exposed and the rigidity of the first cover 210 is reduced The locking groove may be provided with a structure having a narrow entrance and a wide interior or a structure inclined in the direction of the coupling front end 245. On the back surface of the second cover 220 or the substrate support portion 221, a plurality of terminal grooves 225 are disposed, and the terminal grooves 225 expose the back surface of the substrate 110 The terminals 251 of the substrate 110 are respectively exposed in the terminal grooves 225. The terminal grooves 225 may be disposed adjacent to the coupling front end 245. The side surface of the terminal groove 225 can be inclined in any one side surface direction, for example, including a surface inclined in the direction of the coupling front end before the contact terminal is inserted The terminal groove 225 may be disposed adjacent to the coupling front end The side surface of the terminal groove 225 can be inclined in any one side surface direction, for example, including a surface inclined in the direction of the coupling front end before the contact terminal is inserted The terminal groove 225 may be disposed adjacent to the coupling front end The side surface of the terminal groove 225 can be inclined in any one side surface direction, for example, including a surface inclined in the direction of the coupling front end before the contact terminal is inserted The side surface of the terminal groove 225 can be inclined in any one side surface direction, for example, including a surface inclined in the direction of the coupling front end before the contact terminal is inserted The side surface of the terminal groove 225 can be inclined in any one side surface direction, for example, including a surface inclined in the direction of the coupling front end before the contact terminal is inserted The side surface of the terminal groove 225 can be inclined in any one side surface direction, for example, including a surface inclined in the direction of the coupling front end before the contact terminal is inserted The side surface of the terminal groove 225 can be inclined in any one side surface direction, for example, including a surface inclined in the direction of the coupling front end before the contact terminal is inserted The side surface of the terminal groove 225 can be inclined in any one side surface direction, for example, including a surface inclined in the direction of the coupling front end before the contact terminal is inserted It may be arranged closer to the first coupling member and the second coupling members 241 and 243 with reference to 245 and also may be arranged adjacent to one end of the lighting module.

[0051] As shown in FIG. 12, the lighting assembly 200 is coupled to the main case 300. The main case 300 has an insertion port 310 and coupling protrusions 341 disposed outside the insertion port 310 and contact terminals 301 are disposed on the bottom surface of the insertion port 310. Guide portions 342 and 343 for guiding around the entrance may be disposed in the insertion port 301. The coupling portion 223 disposed at the front end of the lighting module 100 is inserted into and coupled to the insertion port 301. The insertion port 301 provides an area with an open upper portion so that the upper portion of the second resin layer 140 of the lighting module 100 can protrude. The lighting assembly 200 in FIG. 12 corresponds to the coupling front end portion 245 of the insertion port 310 of the main case 300 and is coupled as shown in FIG. 13. At this time, around the outer edge of the lighting assembly 200, it is inserted into the insertion port 210 and inserted along the guide portions 342 and 343, and the terminal grooves 225 of the first and second coupling members 241 and 243 of the lighting module 100 are locked to the locking protrusions 341 and coupled. The locking protrusions 341 can protrude in a direction facing each other from both side walls of the insertion port 210. As another example, locking protrusions may be formed on the lighting module and locking grooves may be disposed on the assembly.

[0052] As shown in FIGS. 14 and 15, contact terminals 301 disposed on the bottom surface of the insertion port 310 of the main case 300 are inserted into the terminal grooves 225 of the second cover 220, and the contact terminals 301 can contact the terminals 251 of the substrate 110 of the lighting module 100. ​​​​​​​​​​​​​ At this time, the contact terminal 301 has a leaf spring shape and can provide a predetermined elasticity. Therefore, it can be in close contact with the terminal 251 of the substrate 110. Here, the lighting assembly 200 is supported by the main case 300 through the coupling front end portion 245, and is electrically connected to the contact terminal 301 through the terminal groove 225, thereby completing the coupling of the main case 300 and the lighting assembly 200. A part of the contact terminal 301 can protrude toward the insertion port 301 and have a spring shape with an elastic reaction force. Such a lighting assembly 200 can be coupled to or separated from the main case 300. The lighting assembly 200 is described by taking the example where the terminal 251 of the substrate 110 is exposed below the second cover 220, but the terminal may be disposed on the upper surface or the lower surface of the substrate 110 located at the coupling front end portion 245. The above-described lighting assembly 200 can couple the assembly 200 having the lighting module 100 to the main case 300 without using a separate mechanism by providing a connection structure for

[0053] FIG. 16 is a plan view of a lighting assembly according to a fourth embodiment, FIG. 17 is an example of a side cross-sectional view of the lighting assembly of FIG. 16, FIG. 19 is a side connection view of the lighting assembly of FIG. 18 and the main frame, and FIG.

[0054] 20 is a side cross-sectional view taken along line D-D of FIG. 19. Referring to FIGS. 16 and 17, the lighting assembly 400 includes a plurality of lighting modules 100A, 100B, 100C and the plurality of lighting modules 100A, 100B, 100Ccan include a cover 410 coupled thereto. The substrate cover portion 411 of the cover 410 is disposed on the substrates 110 of the respective lighting modules 100A, 100B, 100C, and the side cover portion 413 extends downward from the outer side of the side surface of the substrate 110 toward the lower part of the substrate 110. The locking protrusions 430 of the cover 410 protrude one or more under the substrates 110 of the lighting modules 100A, 100B, 100 C, and locking ribs are formed at the lower ends. The locking protrusions 430 can be locked and coupled through the side surface of the substrate 110 or protrude through the holes of the substrate 110. At this time, the cover 410 fixes and supports the substrates 110 of the lighting modules 100A, 100B, 100C by the locking protrusions 430, and the locking protrusions 430 protrude downward to be coupled to other main cases. The light emitting regions of the plurality of lighting modules 100A, 100B, 100C have the same shape, different sizes, or different shapes from each other and are coupled to the cover 410. The second resin layers 140 of the lighting modules 100A, 10 0B, 100C can protrude through the openings 415 of the cover 410. At this time, the substrate 110 of the lighting module 100 may be coupled to the cover 410 by heat fusion or fixed with an adhesive. At this time, the substrate 110 of the lighting module 100 may be coupled to the cover 410 by heat fusion or fixed with an adhesive. As shown in FIGS. 18 and 19, the lighting assemblies 400, 400A are inserted into a main case 4

[0055] 50 and coupled to the main case 450. In the opening portion 451 of the main case 450, the light emitting regions of the lighting assemblies 400, 400A are respectively inserted and protrude out. As shown in FIGS. 19 and 20, the main case 450 has a rear opening ​The first lighting assembly 400 and the second lighting assembly 400A described above are coupled through the mouth portion 470. The first lighting assembly and the second lighting assemblies 400, 400A are supported and fixed by covers 451, 452, 461, 462, 463 so that the light emitting regions are exposed. The first lighting assembly and the second lighting assemblies 400, 400A may be the second resin layers 140A, 140B to which different phosphors are added. The first lighting assembly and the second lighting assemblies 140, 140B may include second resin layers 140A, 140B having ink particles of different colors. At least one or both of the second resin layers 140A, 140B may include phosphors and ink particles. As shown in FIGS. 18 and 19, since each substrate 110 of the lighting modules 100A, 100B, 100C is exposed under the cover, it is easy to supply power to the substrate 110. The lighting assemblies 400, 400A described above are coupled with a plurality of lighting modules 100A, 100B, 100C so that an assembly having the lighting modules 100A, 100B, 100C can be coupled to the main case without using a separate mechanism. Such a lighting assembly improves the assemblability or detachability to the main case. The lighting modules of the lighting assemblies disclosed in the above embodiments may each include the lighting modules disclosed in the first embodiment. The lighting assemblies according to the above embodiments can be coupled to vehicle lamps, for example, can be applied to vehicle tail lamps, brake lamps, and turn signal lamps.

[0056] The features, structures, effects, etc. described in the above embodiments are included in at least one embodiment of the present invention and are not necessarily limited to one embodiment. Further, the features , structures, effects, etc. exemplified in each embodiment can be combined or modified by those with ordinary knowledge in the field to which the embodiment belongs and implemented in other embodiments. Therefore, the content related to such combinations and modifications should be construed as being included in the scope of the present invention.

Claims

1. A lighting module including a substrate, a plurality of light-emitting elements disposed on the substrate, a first resin layer covering the plurality of light-emitting elements, and at least one second resin layer on the first resin layer; A first cover disposed on an outer peripheral portion of the substrate; Comprising; The second resin layer is disposed on an upper surface and a side surface of the first resin layer; The outer peripheral portion of the substrate extends outward from an edge of the second resin layer; An area of an upper surface of the substrate is larger than an area of a lower surface of the first resin layer; The plurality of light-emitting elements are arranged on the substrate in a first direction and a second direction orthogonal to the first direction; The second resin layer includes at least one of a red phosphor and red ink particles; The first cover includes an opening through which the first and second resin layers protrude, a substrate cover portion disposed around the outer peripheral portion of the substrate and the opening, and a side cover portion extending lower than a side surface of the substrate from the substrate cover portion; An upper surface of the substrate cover portion is disposed lower than an upper surface of the first resin layer; Including a substrate support portion disposed below the substrate of the lighting module and a second cover including a stepped coupling portion on an outer peripheral surface of the substrate support portion; The side cover portion of the first cover is coupled to the stepped coupling portion of the second cover, a lighting assembly.

2. The lighting assembly according to claim 1, wherein an area of an upper surface of the opening is larger than an area of a lower surface of the first resin layer.

3. The second resin layer includes the red phosphor and the red ink particles; The lighting assembly according to claim 1, wherein the ink particles block incident light.

4. The lighting assembly according to claim 1, wherein the ink particles have a color different from a color of light emitted from the plurality of light-emitting elements.

5. The lighting assembly according to claim 1, wherein a surface color of the second resin layer is red.

6. The lighting assembly according to claim 1, wherein when the plurality of light-emitting elements are turned off, a surface of the second resin layer or a surface of the lighting module provides a red image.

7. The lighting assembly according to claim 6, wherein when the plurality of light-emitting elements are turned on, a surface of the second resin layer or a surface of the lighting module provides a red image of a surface light source.

8. A thickness of the lighting module is 5.5 mm or less; The lighting assembly according to any one of claims 1 to 7, wherein the thickness of the lighting module is 180% to 220% of a thickness of the first resin layer.

9. The lighting assembly according to any one of claims 1 to 7, wherein the lighting module is flexible.

10. The phosphor content of the second resin layer is 23 wt% or less, The lighting assembly according to claim 8, wherein the content of the ink particles added to the second resin layer is 3 wt% to 13 wt%.

11. The lighting assembly according to any one of claims 1 to 7, wherein the substrate cover portion is spaced apart from the second resin layer.

12. The lighting assembly according to any one of claims 1 to 7, wherein the second cover includes a terminal groove through which the terminals on the lower surface of the substrate are exposed.

13. A plurality of openings are provided in the first cover, A plurality of the lighting modules are provided, The lighting assembly according to any one of claims 1 to 7, wherein the first and second resin layers of each of the lighting modules protrude from the respective openings of the first cover.

14. The lighting assembly according to any one of claims 1 to 7, wherein the lighting assembly is coupled to a tail lamp, a brake lamp, or a turn signal lamp of a vehicle.

Images