Organosilicon compound, method for producing the same, and curable composition

An organosilicon compound with a hydrolyzable silyl group, alkenyl ether, and acryloyl group addresses the adhesion issues of conventional silane coupling agents, providing enhanced adhesion in curable compositions for coating and adhesive applications.

JP7711382B2Active Publication Date: 2025-07-23SHIN ETSU CHEMICAL CO LTD +1
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Patent Information

Application Number
JP2021006795
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2021-01-20
Publication Date
2025-07-23
Estimated Expiration
2041-01-20

AI Technical Summary

Technical Problem

Conventional silane coupling agents with polymerizable groups exhibit insufficient adhesion to various substrates, limiting their effectiveness as resin modifiers and adhesion aids in inorganic-organic composite materials.

Method used

Development of an organosilicon compound with a hydrolyzable silyl group, an alkenyl ether moiety, and an acryloyl group in one molecule, which is produced by reacting a halogen group-containing organosilicon compound with a metal salt compound, enhancing adhesion properties in curable compositions.

Benefits of technology

The organosilicon compound improves the adhesion of cured products to various substrates, making them suitable for applications as coating agents and adhesives.

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Abstract

To provide an organosilicon compound which gives a cured product excellent in adhesion to a substrate by being added to a curable composition.SOLUTION: The organosilicon compound is represented by the following formula (1) (R1 represents an alkyl group, an alkenyl group, an aryl group or an acyl group; R2 represents an alkyl group or an aryl group; R3 represents a hydrogen atom or a methyl group; A1 represents a single bond or an alkylene group; A2, A3 and A4 each represent a methylene group or an oxygen atom, provided that one or more of A2, A3 and A4 represent oxygen atoms; and n represents an integer of 1-3).SELECTED DRAWING: None
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Citation Information

Patent Citations

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  • Reactive diluent

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  • Curable resin composition

    JP2018154720A

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