Probe device and method for manufacturing probe device
The probe device addresses miniaturization challenges by using insulating members and wider wire arrangements to prevent conductive wire contact, enhancing resistance and reducing costs.
Patent Information
- Application Number
- JP2021108594
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2021-06-30
- Publication Date
- 2025-07-23
- Estimated Expiration
- 2041-06-30
AI Technical Summary
Existing probe devices face challenges in miniaturization while maintaining resistance to external forces, with adjacent conductive wires potentially contacting due to environmental forces.
Incorporating insulating members to cover conductive wires closer to the tip and arranging them with wider distances at the tip end to prevent contact, and using thinner wires with automated manufacturing processes to reduce material costs and improve efficiency.
Enhances resistance to external forces while achieving miniaturization and reducing material costs through efficient manufacturing processes.
Smart Images

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Abstract
Description
Technical Field
[0001] The present invention relates to a probe device provided with a sensor including at least one element. The present invention also relates to a method for manufacturing the probe device.
Background Art
[0002] Patent Document 1 discloses a probe device for acquiring biological information. The probe device includes a sensor including a light-emitting element and a light-receiving element. The light emitted from the light-emitting element is detected by the light-receiving element after interacting with the living body. Biological information is acquired based on the received light intensity. The probe device includes a plurality of conductive pads electrically connected to the sensor, and a plurality of conductive lines through which signals used for the sensor flow. Each of the plurality of conductive lines is connected to a corresponding one of the plurality of conductive pads.
Prior Art Documents
Patent Documents
[0003]
Patent Document 1
Summary of the Invention
Problems to be Solved by the Invention
[0004] An object of the present invention is to respond to the demand for miniaturization of the probe device while enhancing the resistance to external forces applied from the environment.
Means for Solving the Problems
[0005] One aspect for achieving the above object is a probe device, a sensor including at least one element, each having a connection portion for making electrical connection with the sensor, and a plurality of conductive lines through which signals used for the sensor flow, An insulating member that covers the conductive wire at a position closer to the tip than the connection portion in at least one of the plurality of conductive wires and has electrical insulation properties. is provided.
[0006] In order to meet the demand for miniaturization of the probe device, the diameter of the conductive wire is thin, and the distance between adjacent conductive wires tends to be narrow. In such a situation, adjacent conductive wires may approach each other unexpectedly due to an external force applied to the probe device from the environment. According to the above configuration, since the contact between the conductive wires is blocked by the insulating member, it is possible to increase the resistance to external forces applied from the environment while meeting the demand for miniaturization of the probe device.
[0007] One aspect for achieving the above object is a probe device, a sensor including at least one element, a plurality of conductive wires each having a connection portion for making an electrical connection with the sensor, and through which a signal used for the sensor flows, is provided, The plurality of adjacent conductive wires are arranged such that the distance between them at a position closer to the tip than the connection portion is wider than the distance at a position farther from the tip than the connection portion.
[0008] In order to meet the demand for miniaturization of the probe device, a cable with a narrower distance between adjacent conductive wires tends to be used. According to the above configuration in which the distance between adjacent conductive wires is widened toward the tip of each conductive wire, contact between the conductive wires due to an external force applied from the environment can be suppressed while using such a cable. Therefore, it is possible to increase the resistance to external forces applied from the environment while meeting the demand for miniaturization of the probe device.
[0009] One aspect for achieving the above object is a method for manufacturing a probe device, Prepare a plurality of conductive wires each covered with a coating member having electrical insulation properties, By removing the second portion of the covering member that is farther from the tip while leaving the first portion of the covering member at a position closer to the tip of at least one of the plurality of conductive wires, an exposed portion where the at least one conductive wire is exposed is formed. Electrically connect the exposed portion to a sensor including at least one element.
[0010] When the probe device according to each of the above aspects is manufactured using a conductive wire covered with a covering member, a step of removing a part of the covering member to form an exposed portion where the conductive wire is exposed is required for electrical connection. Since another part of the covering member remaining through this step is used as an insulating member, waste materials can be reduced. In addition, since the step of preparing an insulating member as a separate member and attaching it to the conductive wire can be eliminated, not only can an increase in material cost be suppressed, but also the manufacturing work efficiency of the probe device can be improved.
Brief Description of the Drawings
[0011]
Figure 1
Figure 2
Figure 3
Figure 4
Figure 5
Modes for Carrying Out the Invention
[0012] While referring to the accompanying drawings, examples of embodiments will be described in detail below.
[0013] FIG. 1 illustrates the appearance of a probe device 10 according to an embodiment. The probe device 10 includes an optical sensor 11, a cable 12, and a support 13. The optical sensor 11 and the cable 12 are electrically connected. The optical sensor 11 includes a light emitting part 111 and a light receiving part 112. The support 13 supports the light emitting part 111 and the light receiving part 112.
[0014] As illustrated in FIG. 2, the probe device 10 is configured to be attached to the fingertip 20 of a subject in order to acquire the biological information of the subject through the optical sensor 11. The fingertip 20 is an example of a living body. Specifically, the support 13 is wound around the fingertip 20 such that the light emitting part 111 and the light receiving part 112 are disposed at positions facing each other with the fingertip 20 therebetween. The other end of the cable 12 is connected to a biological information acquisition device (not shown). In this example, the biological information acquisition device acquires transcutaneous arterial oxygen saturation (SpO2) and pulse rate as biological information.
[0015] As illustrated in FIG. 3, the light emitting part 111 includes a first light emitting element 111a and a second light emitting element 111b. The first light emitting element 111a is a semiconductor light emitting element that emits red light. The second light emitting element 111b is a semiconductor light emitting element that emits infrared light. Examples of the semiconductor light emitting element include a light emitting diode (LED), a laser diode (LD), and an EL element.
[0016] The light receiving part 112 includes a light receiving element 112a. The light receiving element 112a outputs a light receiving signal according to the amount of light received on the light receiving surface. Examples of the light receiving element include a photodiode, a phototransistor, and a photore resistor.
[0017] As illustrated in FIGS. 1 and 3, the probe device 10 includes a circuit board 14. A circuit is formed on the circuit board 14 to provide an electrical connection between the optical sensor 11 and the cable 12. The circuit includes a first contact 141, a second contact 142, a third contact 143, a fourth contact 144, a fifth contact 145, and a sixth contact 146. Each of the first contact 141, the second contact 142, the third contact 143, the fourth contact 144, the fifth contact 145, and the sixth contact 146 is formed of a conductive material.
[0018] The first contact 141 is electrically connected to the first light-emitting element 111a. The second contact 142 is electrically connected to the second light-emitting element 111b. The third contact 143 is electrically connected to both the first light-emitting element 111a and the second light-emitting element 111b. The fourth contact 144 and the fifth contact 145 are electrically connected to the light-receiving element 112a.
[0019] The cable 12 includes a first conductive wire 121, a second conductive wire 122, a third conductive wire 123, a fourth conductive wire 124, a fifth conductive wire 125, and a sixth conductive wire 126. Each of the first conductive wire 121, the second conductive wire 122, the third conductive wire 123, the fourth conductive wire 124, the fifth conductive wire 125, and the sixth conductive wire 126 is formed of a conductive material.
[0020] The first conductive wire 121 has a first connection portion 121a. The first connection portion 121a is a portion where an electrical connection between the first conductive wire 121 and the first light-emitting element 111a is made. The electrical connection between the first conductive wire 121 and the first light-emitting element 111a is made by soldering the first connection portion 121a to the first contact 141.
[0021] The first conductive wire 121 has a portion covered by a first covering member 151. The first covering member 151 is formed of an electrically insulating material.
[0022] The second conductive wire 122 has a second connection portion 122a. The second connection portion 122a is a portion where an electrical connection between the second conductive wire 122 and the second light-emitting element 111b is made. The electrical connection between the second conductive wire 122 and the second light-emitting element 111b is made by soldering the second connection portion 122a to the second contact point 142.
[0023] The second conductive wire 122 has a portion covered by a second covering member 152. The second covering member 152 is formed of a material having electrical insulation.
[0024] The third conductive wire 123 has a third connection portion 123a. The third connection portion 123a is a portion where an electrical connection between the third conductive wire 123 and the first light-emitting element 111a and the second light-emitting element 111b is made. The electrical connection between the third conductive wire 123 and the first light-emitting element 111a and the second light-emitting element 111b is made by soldering the third connection portion 123a to the third contact point 143.
[0025] The third conductive wire 123 has a portion covered by a third covering member 153. The third covering member 153 is formed of a material having electrical insulation.
[0026] The fourth conductive wire 124 has a fourth connection portion 124a. The fourth connection portion 124a is a portion where an electrical connection between the fourth conductive wire 124 and the light-receiving element 112a is made. The electrical connection between the fourth conductive wire 124 and the light-receiving element 112a is made by soldering the fourth connection portion 124a to the fourth contact point 144.
[0027] The fourth conductive wire 124 has a portion covered by a fourth covering member 154. The fourth covering member 154 is formed of a material having electrical insulation.
[0028] The fifth conductive wire 125 has a fifth connection part 125a. The fifth connection part 125a is the part where the electrical connection between the fifth conductive wire 125 and the light receiving element 112a is made. The electrical connection between the fifth conductive wire 125 and the light receiving element 112a is made by soldering the fifth connection part 125a to the fifth contact point 145.
[0029] The fifth conductive wire 125 has a part covered by a fifth covering member 155. The fifth covering member 155 is formed of a material having electrical insulation.
[0030] With the above configuration, the signals used in the optical sensor 11 flow through the first conductive wire 121, the second conductive wire 122, the third conductive wire 123, the fourth conductive wire 124, and the fifth conductive wire 125, respectively.
[0031] Specifically, the first light emitting element 111a emits red light by the signal flowing from the first conductive wire 121 to the third conductive wire 123. Similarly, the second light emitting element 111b emits infrared light by the signal flowing from the second conductive wire 122 to the third conductive wire 123. The emission of red light by the first light emitting element 111a and the emission of infrared light by the second light emitting element 111b are performed alternately.
[0032] Each of the red light and the infrared light reaches the light receiving surface of the light receiving element 112a after interacting with the tissue of the fingertip 20 of the subject. Signals corresponding to the intensity of the red light and the intensity of the infrared light on the light receiving surface flow through the fourth conductive wire 124 and the fifth conductive wire 125.
[0033] Based on the ratio of the intensity of the red light emitted from the first light emitting element 111a to the intensity of the red light incident on the light receiving surface of the light receiving element 112a, and the ratio of the intensity of the infrared light emitted from the second light emitting element 111b to the intensity of the infrared light incident on the light receiving surface of the light receiving element 112a, the transcutaneous arterial oxygen saturation of the subject can be calculated. Also, based on the change over time of at least one of the two ratios, the pulse rate of the subject can be calculated.
[0034] Cable 12 includes a shield layer 127. The shield layer 127 is formed of a conductive material. Each of the fourth covering member 154 and the fifth covering member 155 has a portion covered by the shield layer 127. The shield layer 127 is electrically connected to the sixth conductive wire 126.
[0035] The sixth conductive wire 126 has a sixth connection portion 126a. The sixth connection portion 126a is a portion where an electrical connection is made between the protection circuit that protects the fourth conductive wire 124 and the fifth conductive wire 125 from electrostatic noise and the sixth conductive wire 126. The electrical connection between the protection circuit and the sixth conductive wire 126 is made by soldering the sixth connection portion 126a to the sixth contact point 146.
[0036] The probe device 10 includes a first insulating member 161. The first insulating member 161 is formed of a material having electrical insulation properties. The first insulating member 161 covers the first conductive wire 121 at a position closer to the tip 121b of the first conductive wire 121 than the first connection portion 121a.
[0037] Thereby, even if the first conductive wire 121 unexpectedly approaches the second conductive wire 122 adjacent thereto during or after the connection operation between the first contact point 141 and the first connection portion 121a, the first insulating member 161 serves as a spacer, so that contact between the first conductive wire 121 and the second conductive wire 122 can be prevented.
[0038] The probe device 10 includes a second insulating member 162. The second insulating member 162 is formed of a material having electrical insulation properties. The second insulating member 162 covers the second conductive wire 122 at a position closer to the tip 122b of the second conductive wire 122 than the second connection portion 122a.
[0039] Thereby, even if the second conductive wire 122 unexpectedly approaches the first conductive wire 121 or the third conductive wire 123 adjacent thereto during or after the connection operation between the second contact point 142 and the second connection portion 122a, the second insulating member 162 serves as a spacer, so that contact between the second conductive wire 122 and the first conductive wire 121 or the third conductive wire 123 can be prevented.
[0040] The probe device 10 includes a third insulating member 163. The third insulating member 163 is formed of a material having electrical insulation properties. The third insulating member 163 covers the third conductive wire 123 at a position closer to the tip 123b of the third conductive wire 123 than the third connection portion 123a.
[0041] Thereby, even if the third conductive wire 123 approaches the second conductive wire 122 adjacent thereto unexpectedly during or after the connection operation between the third contact point 143 and the third connection portion 123a, the third insulating member 163 serves as a spacer, so that contact between the third conductive wire 123 and the second conductive wire 122 can be prevented.
[0042] The probe device 10 includes a fourth insulating member 164. The fourth insulating member 164 is formed of a material having electrical insulation properties. The fourth insulating member 164 covers the fourth conductive wire 124 at a position closer to the tip 124b of the fourth conductive wire 124 than the fourth connection portion 124a.
[0043] Thereby, even if the fourth conductive wire 124 approaches the fifth conductive wire 125 adjacent thereto unexpectedly during or after the connection operation between the fourth contact point 144 and the fourth connection portion 124a, the fourth insulating member 164 serves as a spacer, so that contact between the fourth conductive wire 124 and the fifth conductive wire 125 can be prevented.
[0044] The probe device 10 includes a fifth insulating member 165. The fifth insulating member 165 is formed of a material having electrical insulation properties. The fifth insulating member 165 covers the fifth conductive wire 125 at a position closer to the tip 125b of the fifth conductive wire 125 than the fifth connection portion 125a.
[0045] Thereby, even if the fifth conductive wire 125 approaches the fourth conductive wire 124 or the sixth conductive wire 126 adjacent thereto unexpectedly during or after the connection operation between the fifth contact point 145 and the fifth connection portion 125a, the fifth insulating member 165 serves as a spacer, so that contact between the fifth conductive wire 125 and the fourth conductive wire 124 or the sixth conductive wire 126 can be prevented.
[0046] In order to meet the demand for miniaturization of the probe device, the diameter of the conductive wire is thin, and the distance between adjacent conductive wires tends to be narrow. In such a situation, due to an external force applied to the probe device from the environment, adjacent conductive wires may approach each other unexpectedly. According to the above configuration, since the contact between the conductive wires is blocked by the insulating member, it is possible to enhance the resistance to external forces applied from the environment while meeting the demand for miniaturization of the probe device.
[0047] The first insulating member 161 can be fitted from the tip 121b side of the first conductive wire 121 before the connection operation between the first contact 141 and the first connection portion 121a. However, it is preferable that the first insulating member 161 is a part of the first covering member 151.
[0048] In this case, as illustrated from step ST1 to step ST2 in FIG. 4, the first insulating member 161 is formed by removing a part of the first covering member 151. In other words, the first insulating member 161 is another part of the first covering member 151. Specifically, while leaving the first portion 151a of the first covering member 151 at a position closer to the tip 121b of the first conductive wire 121, the second portion 151b of the first covering member 151 at a position farther from the tip 121b is removed. Thereby, an exposed portion where the first conductive wire 121 is exposed is formed.
[0049] In the case of a configuration in which the first conductive wire 121 is covered with the first covering member 151, a step of removing a part of the first covering member 151 to expose the first connection portion 121a for the connection operation with the first contact 141 is required. Since another part of the first covering member 151 remaining through this step is used as the first insulating member 161, waste materials can be reduced. In addition, the step of preparing the first insulating member 161 as a separate member and fitting it to the first conductive wire 121 can be made unnecessary, so that not only an increase in material cost can be suppressed, but also the manufacturing work efficiency of the probe device 10 can be enhanced.
[0050] In the present embodiment, the first conductive wire 121 is a stranded wire in which a plurality of fine conductive wires are twisted. In the case of a configuration in which the first insulating member 161 as a separate member is fitted, it is necessary to perform the work while paying attention so that the stranded wire does not become untwisted. On the other hand, when a part of the first covering member 151 that bundles the stranded wire from the beginning is used as the first insulating member 161, it is possible to prevent the stranded wire from becoming untwisted without taking special measures.
[0051] Similarly, the second insulating member 162 can be fitted from the tip 122b side of the second conductive wire 122 before the connection work between the second contact 142 and the second connection portion 122a. However, the second insulating member 162 is preferably a part of the second covering member 152.
[0052] Similarly, the third insulating member 163 can be fitted from the tip 123b side of the third conductive wire 123 before the connection work between the third contact 143 and the third connection portion 123a. However, the third insulating member 163 is preferably a part of the third covering member 153.
[0053] Similarly, the fourth insulating member 164 can be fitted from the tip 124b side of the fourth conductive wire 124 before the connection work between the fourth contact 144 and the fourth connection portion 124a. However, the fourth insulating member 164 is preferably a part of the fourth covering member 154.
[0054] Similarly, the fifth insulating member 165 can be fitted from the tip 125b side of the fifth conductive wire 125 before the connection work between the fifth contact 145 and the fifth connection portion 125a. However, the fifth insulating member 165 is preferably a part of the fifth covering member 155.
[0055] As illustrated in step ST3 of FIG. 4, soldering is performed on the first contact 141 of the exposed portion of the first conductive wire 121 by the automatic soldering apparatus 30.
[0056] As a result, as exemplified in step ST4, the first conductive wire 121 has a flat portion 121c and an inclined portion 121d when viewed from the direction crossing the plurality of conductive wires included in the cable 12. The flat portion 121c extends along the circuit board 14. The inclined portion 121d extends while being inclined at an angle α with respect to the flat portion 121c.
[0057] The distance between the first insulating member 161 and the first covering member 151, the outer diameter of the first insulating member 161, the outer diameter of the first covering member 151, etc. are predetermined so that the angle α is less than 60°. The angle α is preferably less than 30°, and more preferably less than 15°.
[0058] According to such a configuration, it is possible to suppress the stress for peeling the first connection portion 121a of the soldered first conductive wire 121 from the first contact point 141. Therefore, it is possible to suppress the first connection portion 121a from being unexpectedly peeled from the first contact point 141 due to an external force applied from the environment or the like.
[0059] The above description regarding the flat portion and the inclined portion is also applicable to each of the second conductive wire 122, the third conductive wire 123, the fourth conductive wire 124, and the fifth conductive wire 125.
[0060] The first insulating member 161 can be formed of a material having heat shrinkability. When the first insulating member 161 is a part of the first covering member 151, the first covering member 151 is formed of a material having heat shrinkability.
[0061] According to such a configuration, when soldering the first conductive wire 121 to the first contact point 141, at least the first insulating member 161 thermally shrinks in at least one of the radial direction and the axial direction of the first conductive wire 121. Therefore, an increase in the angle α of the inclined portion 121d with respect to the flat portion 121c can be suppressed.
[0062] Particularly when the first conductive wire 121 is a stranded wire, the occurrence of the phenomenon that the first conductive wire 121 untwists due to the heat and stress applied by soldering can be suppressed by the thermal shrinkage of the first insulating member 161.
[0063] As illustrated in FIG. 5, adjacent first conductive wire 121 and second conductive wire 122 are arranged such that the distance between them at a position closer to tips 121b and 122b than first connection portion 121a and second connection portion 122a is wider than the distance between them at a position farther from tips 121b and 122b than first connection portion 121a and second connection portion 122a.
[0064] Similarly, adjacent second conductive wire 122 and third conductive wire 123 are arranged such that the distance between them at a position closer to tips 122b and 123b than second connection portion 122a and third connection portion 123a is wider than the distance between them at a position farther from tips 122b and 123b than second connection portion 122a and third connection portion 123a.
[0065] Similarly, adjacent fourth conductive wire 124 and fifth conductive wire 125 are arranged such that the distance between them at a position closer to tips 124b and 125b than fourth connection portion 124a and fifth connection portion 125a is wider than the distance between them at a position farther from tips 124b and 125b than fourth connection portion 124a and fifth connection portion 125a.
[0066] Similarly, adjacent fifth conductive wire 125 and sixth conductive wire 126 are arranged such that the distance between them at a position closer to tips 125b and 126b than fifth connection portion 125a and sixth connection portion 126a is wider than the distance between them at a position farther from tips 125b and 126b than fifth connection portion 125a and sixth connection portion 126a.
[0067] The above-described configuration can be obtained by displacing at least one tip of two adjacent conductive wires to a plastic deformation region in a direction intersecting the axial direction of the conductive wire with an appropriate jig.
[0068] In order to meet the demand for miniaturization of the probe device, cables with a smaller distance between adjacent conductive wires tend to be used. According to the above configuration in which the distance between adjacent conductive wires is widened toward the tip of each conductive wire, contact between the conductive wires due to external force applied from the environment can be suppressed while using such a cable.
[0069] If the distance between the tip sides of adjacent conductive wires is appropriately widened so that contact between adjacent conductive wires can be suppressed, the insulating member that serves as a spacer may be omitted.
[0070] In the present embodiment, the first contact point 141, the second contact point 142, the third contact point 143, the fourth contact point 144, the fifth contact point 145, and the sixth contact point 146 are arranged at equal intervals in the direction crossing a plurality of conductive wires provided in the cable 12. The distance D1 between two adjacent contact points is determined to be larger than the diameter D2 of each conductive wire. In this example, the diameter D2 is 0.3 mm, and the distance D1 is 0.7 mm. Therefore, the distance in the same direction between the connection portions of two adjacent conductive wires is also larger than the diameter D2 of each conductive wire.
[0071] In order to meet the demand for miniaturization of the probe device, conductive wires having a smaller diameter tend to be used. By defining the dimensions as described above, contact between the conductive wires due to external force applied from the environment can be suppressed while using such conductive wires.
[0072] The first contact point 141, the second contact point 142, the third contact point 143, the fourth contact point 144, the fifth contact point 145, and the sixth contact point 146 do not necessarily have to be arranged at equal intervals. If the distance between two adjacent conductive wires in the direction crossing a plurality of conductive wires is larger than the diameter D2 of each conductive wire, the distance between any two adjacent contact points in the same direction can be determined as appropriate.
[0073] By using the automatic soldering device 30 described with reference to FIG. 4, as illustrated in FIG. 5, the first solder mark 31 remains on the first conductive wire 121 and the first contact point 141. That is, the first solder mark 31 defines the range of the first connection portion 121a. Each of both end portions of the first connection portion 121a in the direction in which the first conductive wire 121 extends has a shape along a straight line L extending in a direction crossing a plurality of conductive wires included in the cable 12.
[0074] Similarly, the second solder mark 32 remains on the second conductive wire 122 and the second contact point 142. That is, the second solder mark 32 defines the range of the second connection portion 122a. Each of both end portions of the second connection portion 122a in the direction in which the second conductive wire 122 extends has a shape along a straight line L extending in a direction crossing a plurality of conductive wires included in the cable 12.
[0075] Similarly, the third solder mark 33 remains on the third conductive wire 123 and the third contact point 143. That is, the third solder mark 33 defines the range of the third connection portion 123a. Each of both end portions of the third connection portion 123a in the direction in which the third conductive wire 123 extends has a shape along a straight line L extending in a direction crossing a plurality of conductive wires included in the cable 12.
[0076] Similarly, the fourth solder mark 34 remains on the fourth conductive wire 124 and the fourth contact point 144. That is, the fourth solder mark 34 defines the range of the fourth connection portion 124a. Each of both end portions of the fourth connection portion 124a in the direction in which the fourth conductive wire 124 extends has a shape along a straight line L extending in a direction crossing a plurality of conductive wires included in the cable 12.
[0077] Similarly, the fifth solder mark 35 remains on the fifth conductive wire 125 and the fifth contact point 145. That is, the fifth solder mark 35 defines the range of the fifth connection portion 125a. Each of both end portions of the fifth connection portion 125a in the direction in which the fifth conductive wire 125 extends has a shape along a straight line L extending in a direction crossing a plurality of conductive wires included in the cable 12.
[0078] Similarly, a sixth solder mark 36 remains on the sixth conductive line 126 and the sixth contact point 146. That is, the sixth solder mark 36 defines the range of the sixth connection portion 126a. Each of both ends of the sixth connection portion 126a in the direction in which the sixth conductive line 126 extends has a shape along a straight line L extending in a direction crossing a plurality of conductive lines included in the cable 12.
[0079] The straight line L is an example of a geometric shape. The fact that the shape of the solder mark follows such a geometric shape indicates the fact that the automatic soldering apparatus 30 was used instead of manual soldering. The geometric shape can take a form other than a straight line according to the shape of the automatic soldering apparatus 30 pressed against the conductive line. Examples of such forms include two straight lines forming a bending point, a curve having one inflection point, and the like.
[0080] In the example shown in FIG. 5, the end portion closer to the tip 121b and the end portion farther from the tip 121b in the first connection portion 121a are configured to follow the same geometric shape. However, the geometric shape followed by the end portion closer to the tip 121b and the geometric shape followed by the end portion farther from the tip 121b may be different. The same applies to the second connection portion 122a, the third connection portion 123a, the fourth connection portion 124a, the fifth connection portion 125a, and the sixth connection portion 126a.
[0081] The above embodiments are merely examples for facilitating the understanding of the present invention. The configurations according to the above embodiments can be appropriately changed and improved without departing from the gist of the present invention.
[0082] In the above embodiment, the optical sensor 11 includes a first light emitting element 111a that emits red light and a second light emitting element 111b that emits infrared light. However, as long as it is possible to acquire the transcutaneous arterial oxygen saturation (SpO2), the wavelengths of the light emitted from the first light emitting element 111a and the light emitted from the second light emitting element 111b can be appropriately determined. Specifically, a plurality of wavelengths with substantially different absorbances by oxygenated hemoglobin in arterial blood corresponding to SpO2 are selected.
[0083] The blood absorbent substances related to the concentration information obtained using the optical sensor 11 are not limited to oxygenated hemoglobin. Other blood absorbent substances include deoxygenated hemoglobin, carboxyhemoglobin, methemoglobin, dyes, and the like. The number and wavelength of the light emitting elements can be appropriately selected according to the obtained blood absorbent substance concentration.
[0084] In the above embodiment, the circuit board 14 is built in the support 13 that supports the optical sensor 11. However, a configuration in which the cable 12 is connected to a connector configured to be detachable from the support 13 and the circuit board 14 is installed in the connector may also be adopted.
[0085] The electrical connection between each of the plurality of conductive wires included in the cable 12 and the optical sensor 11 may be made by a method other than soldering to the contacts on the circuit board 14. For example, methods such as welding, brazing, adhesion, and screwing may be adopted.
[0086] The sensor included in the probe device 10 is not limited to the optical sensor 11. The probe device 10 may include various sensors that detect information using signals flowing through the plurality of conductive wires included in the cable 12. The number of elements included in the sensor can be appropriately determined according to the detected information. The number of the plurality of conductive wires can be appropriately determined according to the use of the sensor. A portion in which all of the plurality of conductive wires are covered by a covering member may be provided, or all of the plurality of conductive wires may not be covered by a covering member.
[0087] The probe device 10 does not necessarily have to be attached to the fingertip 20 of the subject. It can be attached to an appropriate body part of the subject according to the biological information obtained by the sensor.
[0088] The probe device 10 does not necessarily have to be attached to a living body depending on the information obtained by the sensor.
Explanation of reference numerals
[0089] 10: Probe device, 11: Optical sensor, 111a: First light-emitting element, 111b: Second light-emitting element, 112a: Light-receiving element, 121: First conductive wire, 121a: First connection portion, 121b: Tip, 121c: Flat portion, 121d: Inclined portion, 122: Second conductive wire, 122a: Second connection portion, 122b: Tip, 123: Third conductive wire, 123a: Third connection portion, 123b: Tip, 124: Fourth conductive wire, 124a: Fourth connection portion, 124b: Tip, 125: Fifth conductive wire, 125a: Fifth connection portion, 125b: Tip, 126: Sixth conductive wire, 126a: Sixth connection portion, 126b: Tip, 151: First covering member, 151a: First part, 151b: Second part, 152: Second covering member, 153: Third covering member, 154: Fourth covering member, 155: Fifth covering member, 161: First insulating member, 162: Second insulating member, 163: Third insulating member, 164: Fourth insulating member, 165: Fifth insulating member, 20: Finger tip, D1: Distance between adjacent contacts, D2: Diameter of the conductive wire, L: Straight line, α: Angle
Claims
1. A sensor including at least one element, A plurality of conductive wires through which signals used for the sensor flow, An insulating member that is electrically insulating and forms a first exposed portion where at least one of the plurality of conductive wires is exposed on the side closer to the tip of the conductive wire and a second exposed portion where the conductive wire is exposed on the side farther from the tip by covering a part of at least one of the plurality of conductive wires, Comprising, The tip is a free end, and the second exposed portion is electrically connected to the sensor, A probe device.
2. The at least one conductive wire has a portion covered by a covering member that is electrically insulating, The insulating member is a part of the covering member, The probe device according to claim 1.
3. The at least one conductive wire is a stranded wire in which a plurality of conductive fine wires are twisted, The probe device according to claim 1 or 2.
4. When viewed in the direction along a straight line crossing the plurality of conductive wires, each of the plurality of conductive wires has a flat portion extending along a substrate on which the second exposed portion is disposed and an inclined portion extending at an angle of less than 60 degrees with respect to the flat portion, The probe device according to any one of claims 1 to 3.
5. The insulating member is formed of a material having heat shrinkability, The probe device according to any one of claims 1 to 4.
6. A sensor including at least one element, Each having a connection portion that is electrically connected to the sensor, and a plurality of conductive wires through which signals used for the sensor flow, An insulating member that covers the at least one conductive wire at a position closer to the tip than the connection portion in the at least one conductive wire among the plurality of conductive wires and is electrically insulating, Comprising, The plurality of adjacent conductive wires are arranged such that the distance at a position closer to the tip than the connection portion is wider than the distance at a position farther from the tip than the connection portion, A probe device.
7. A sensor including at least one element, Each having a connection portion that is electrically connected to the sensor, and a plurality of conductive wires through which signals used for the sensor flow, An insulating member that covers the at least one conductive wire at a position closer to the tip than the connection portion in the at least one conductive wire among the plurality of conductive wires and is electrically insulating, Comprising, The distance between the connection portions of the plurality of adjacent conductive wires is greater than the diameter of the conductive wires. Probe device.
8. The diameter is 0.3 mm or less, and the distance is 0.7 mm or less. The probe device according to claim 7.
9. A sensor including at least one element, A plurality of conductive wires each having a connection portion for making an electrical connection with the sensor, and through which a signal used for the sensor flows, An insulating member that covers the conductive wire at a position closer to the tip than the connection portion in at least one of the plurality of conductive wires and has electrical insulation properties, Comprising, Each of both ends of the connection portion in the direction in which each of the plurality of conductive wires extends has a shape along a geometric shape that crosses the plurality of conductive wires, The geometric shape is a single straight line or a curve with one inflection point. Probe device.
10. The sensor includes a light-emitting element and a light-receiving element. The probe device according to any one of claims 1 to 9.
11. Configured to be worn on a living body. The probe device according to any one of claims 1 to 10.
12. Prepare a plurality of conductive wires each covered with a covering member having electrical insulation properties, By removing the second portion of the covering member located farther from the tip while leaving the first portion of the covering member at a position closer to the tip of at least one of the plurality of conductive wires, a first exposed portion where the at least one conductive wire is exposed on the tip side of the first portion and a second exposed portion where the at least one conductive wire is exposed on the side farther from the tip than the first portion are formed, While using the tip as a free end, electrically connect the second exposed portion to a sensor including at least one element. Method for manufacturing a probe device.
13. The covering member is formed of a material having heat shrinkability. The second exposed portion is electrically connected to the sensor by soldering. Method for manufacturing the probe device according to claim 12.
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