Opening detection sheet, packaging material, and method for manufacturing the opening detection sheet

Abstract

To simplify a structure of an opening detection sheet and realize an inexpensive packaging material having an opening detection function.SOLUTION: An opening detection sheet includes a metal foil layer (12), a first resin layer (13) having insulation properties, and a second resin layer (15) laminated on at least part of the first resin layer. A circuit pattern (14) is printed in the first resin layer (13) using a conductive ink including a carbon nano-tube.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to an unsealing detection sheet, an unsealing detection device including the unsealing detection sheet, a control program, and a method for manufacturing the unsealing detection sheet.

Background Art

[0002] Conventionally, in a packaging material for accommodating tablets, foods, etc. in a storage portion (for example, blister packaging), a technique for detecting the unsealing of the storage portion is known. For example, the unsealing detection sheet disclosed in Patent Document 1 has a circuit layer including a plurality of conductive wires, and the plurality of conductive wires are each formed so as to be disconnected along with the unsealing of the corresponding target portion among the plurality of target portions that are the objects of unsealing detection.

[0003] When contents such as tablets and foods are taken out from the storage portion, the sheet constituting the storage portion is broken. In the case of blister packaging to which the unsealing detection sheet described in Patent Document 1 is applied to the storage portion, the conductive wires of the circuit layer included in the unsealing detection sheet are configured to be disconnected when unsealed. When the conductive wire is disconnected, the electrical signal generated in the circuit layer changes. The unsealing detection sheet can detect that tablets, foods, etc. have been taken out from the storage portion based on the disconnection of the conductive wires included in the circuit layer. Note that examples of the change in the electrical signal generated in the circuit layer include a change in the current value detected when a voltage is applied.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] FIG. 9 is a diagram showing an example of a cross-section of a general unsealing detection sheet 90. (a) of FIG. 9 shows a cross-section of a portion where the accommodating portion 96 is not arranged, and (b) shows a cross-section of a portion where the accommodating portion 96 is arranged. Note that FIG. 9 shows the unsealing detection sheet 90 attached to the accommodating sheet 95 that forms the accommodating portion 96.

[0006] The unsealing detection sheet 90 has a structure in which an aluminum foil layer 94, an insulating layer 93, a circuit layer 92, and a polyethylene terephthalate (PET) sheet 91 are laminated. In the unsealing detection sheet 90, the aluminum foil layer 94 is attached to the surface of the accommodating sheet 95 that forms the accommodating portion 96 on the side where the accommodated object 97 is extruded. Note that an aluminum alloy foil may be used for the aluminum foil layer 94.

[0007] The circuit layer 92 includes conductive wires having a circuit pattern according to the arrangement of the accommodating portion 96. When the accommodated object 97 accommodated in the accommodating portion 96 is taken out, the unsealing detection sheet 90 of the portion that constitutes the accommodating portion 96 is broken, and a part of the conductive wires included in the circuit layer 92 is disconnected. The unsealing detection sheet 90 is configured to detect the presence or absence of unsealing of the accommodating portion 96 based on the presence or absence of disconnection of the conductive wires included in the circuit layer 92.

[0008] Conventionally, the conductive wires included in the circuit layer 92 are formed by performing an etching process on an aluminum foil. A general etching process is performed in the following steps (1) to (4).

[0009] (1) A step of laminating an aluminum foil on a base material such as a polyester film (2) A step of printing and patterning a resist ink according to the circuit pattern (3) A step of etching with an acid or the like (4) A step of peeling off the resist ink with an alkali or the like.

[0010] Etching is a complex and large-scale processing method. Since processes such as heating, drying, and UV irradiation are required in each step of the etching process, energy consumption is inevitable. Furthermore, since acid waste liquid is generated in the step (3) above and alkaline waste liquid is generated in the step (4), energy must be consumed for the treatment of these waste liquids. Thus, compared with a packaging material not having an opening detection function, a packaging material to which an opening detection sheet produced using etching is applied inevitably incurs a significant cost increase.

[0011] On the other hand, it is also possible to form the circuit layer 92 by a method of printing a circuit pattern adapted to the arrangement of the housing portion 96 on the aluminum foil using a metal paste such as a silver paste. According to this method, an opening detection sheet can be produced without using etching. However, since the metal paste is expensive, an increase in the cost of the packaging material to which the opening detection sheet is applied is inevitable.

[0012] One aspect of the present invention aims to provide an opening detection sheet that simplifies the configuration of the opening detection sheet and reduces the steps for manufacturing the opening detection sheet, thereby realizing an inexpensive packaging material.

Means for Solving the Problems

[0013] In order to solve the above problems, an opening detection sheet according to one aspect of the present invention includes a metal foil layer made of a metal containing aluminum, a first resin layer having insulation properties, a circuit pattern printed using an ink containing a conductive substance, and a second resin layer covering at least a part of the circuit pattern, which are laminated in this order.

[0014] According to the above configuration, the circuit pattern is formed by printing using an ink containing a conductive substance. Thereby, it is possible to form the circuit pattern without using etching, which involves a large number of steps and an inevitable significant cost increase, and without using a metal paste such as a silver paste. Therefore, the steps for manufacturing the opening detection sheet can be reduced.

[0015] A detection target area is set in the unsealing detection sheet, and the circuit pattern may be arranged so that the circuit pattern breaks when the unsealing detection sheet is broken in the detection target area.

[0016] According to the above configuration, when the unsealing detection sheet is broken, the circuit pattern breaks. That is, an electrical signal of the circuit pattern changes before and after the unsealing detection sheet is broken. For example, if such an unsealing detection sheet is applied to a packaging material, a packaging material having an unsealing detection function for detecting whether the unsealing detection sheet in the detection target area is broken based on a change in the current value detected when a predetermined voltage is applied to the circuit pattern can be realized.

[0017] The circuit pattern may have a connection portion in a portion not covered by the second resin layer, and a voltage may be applied to the circuit pattern through the connection portion.

[0018] If such an unsealing detection sheet is applied to a packaging material, a packaging material having an unsealing detection function for detecting an electrical signal of the circuit pattern through the connection portion can be realized. For example, it is possible to avoid the broken circuit pattern from being electrically conductive again by the resin used for the second resin layer covering the broken surface. Also, in the second region of the circuit pattern, since the circuit pattern is exposed, an electrical connection can be provided.

[0019] The first resin layer may be formed by applying an insulating resin to the metal foil layer.

[0020] The dry weight per unit area of the first resin layer is 1.48 g / m 2 or more and 3.70 g / m 2 or less.

[0021] The ink may contain carbon nanotubes as the conductive substance.

[0022] It is known that the conductivity of conductive ink is improved by including carbon nanotubes. By adjusting the amount of carbon nanotubes included in the ink used for printing the circuit pattern, it is possible to adjust the conductivity of the circuit pattern.

[0023] The second resin layer may be formed by applying resin to the first resin layer.

[0024] It may further include a third resin layer having heat fusibility, laminated on the surface opposite to the first resin layer.

[0025] According to the above configuration, the unsealing detection sheet can be easily attached to the detection target by heat fusion.

[0026] The packaging material according to one aspect of the present invention includes the above unsealing detection sheet and is a packaging material provided with a storage portion for storing the contents, and may be configured such that when the unsealing detection sheet is broken, the contents are taken out from the storage portion.

[0027] Thereby, a packaging material having a function of detecting that the contents have been taken out can be realized.

[0028] The packaging material may have one or more recesses constituting the storage portion, and the opening of each recess may be sealed by the unsealing detection sheet.

[0029] The circuit patterns of the unsealing detection sheet may be independent for each storage portion and not electrically connected to each other.

[0030] Thereby, a packaging material having a function of detecting from which storage portion of the packaging material the contents have been taken out can be realized.

[0031] An unsealing detection device according to one aspect of the present invention is an unsealing detection device that detects that the housing portion has been unsealed, and includes a terminal portion that can be electrically connected to the circuit pattern included in the unsealing detection sheet, and an unsealing detection processing portion that detects a break in the circuit pattern based on a change in an electrical signal generated in the circuit pattern.

[0032] When the unsealing detection sheet is torn, the circuit pattern is broken. According to the above configuration, the unsealing detection device detects a break in the circuit pattern based on a change in an electrical signal generated in the circuit pattern. Thereby, the unsealing detection device can detect that the housing portion that houses the contents of the packaging material has been unsealed.

[0033] The unsealing detection device may be configured to output, for each housing portion, information indicating that the housing portion in which the circuit pattern is disposed has been unsealed when the unsealing detection processing portion detects that the circuit pattern has been broken.

[0034] According to the above configuration, the unsealing detection device can output information indicating that the housing portion has been unsealed. Thereby, the user can be made to confirm the unsealing status of each housing portion.

[0035] The unsealing detection device may further include a communication portion that transmits, to an external device, information indicating that the housing portion on which the broken circuit pattern is printed has been unsealed.

[0036] According to the above configuration, the unsealing detection device can cause the external device to output information indicating that the housing portion has been unsealed. Here, the external device is preferably an electronic device including a display portion that displays information indicating that the housing portion has been unsealed. More specifically, examples of the external device include a smartphone, a mobile phone, and a tablet terminal. Note that the unsealing detection device and the external device may be connected by wire or wirelessly. In the case of wireless connection, for example, Bluetooth (registered trademark) may be used.

[0037] The unsealing detection device according to each aspect of the present invention may be realized by a computer. In this case, a control program for the unsealing detection device that realizes the unsealing detection device by operating the computer as each part (software element) included in the unsealing detection device, and a computer-readable recording medium on which the program is recorded also fall within the scope of the present invention.

[0038] A method for manufacturing an unsealing detection sheet according to one aspect of the present invention includes: a first resin coating step (step S1) of forming a first resin layer by applying a first resin having insulation properties to a metal foil layer made of a metal containing aluminum; a circuit pattern printing step (step S2) of printing a circuit pattern using ink containing a conductive substance on the first resin layer; and a second resin coating step (step S3) of forming a second resin layer by applying a second resin so as to cover at least a part of the circuit pattern.

[0039] According to the above configuration, the first resin layer, the circuit pattern, and the second resin layer are formed by the same method. The unsealing detection sheet manufactured by such a method can suppress the facility investment cost and energy consumption to be low compared with that manufactured using etching or the like, and can suppress the manufacturing cost to be low. Therefore, if the unsealing detection sheet manufactured by such a method is applied, a packaging material having an unsealing detection function can be provided at a lower cost.

Advantages of the Invention

[0040] According to one aspect of the present invention, there is provided an unsealing detection sheet in which the configuration of the unsealing detection sheet is simplified and the steps for manufacturing the unsealing detection sheet are reduced, and an inexpensive packaging material can be realized.

Brief Description of the Drawings

[0041]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Mode for Carrying Out the Invention

[0042] 〔Embodiment 1〕 Hereinafter, an embodiment of the present invention will be described in detail.

[0043] (Configuration of the unsealing detection sheet 10) First, the configuration of the unsealing detection sheet 10 according to the present invention will be described with reference to FIG. 1. FIG. 1 is a cross-sectional view showing the configuration of a packaging material 100 to which the unsealing detection sheet 10 according to an embodiment of the present invention is applied. As shown in FIG. 1, the unsealing detection sheet 10 forms an accommodation portion 32, which is a space for accommodating an accommodation object 33 such as medicine and food, by being bonded to an accommodation sheet 31 having one or a plurality of recesses.

[0044] The unsealing detection sheet 10 includes a metal foil layer 12, a first resin layer 13, a circuit pattern 14, and a second resin layer 15. In FIG. 1, the unsealing detection sheet 10 is shown which includes a third resin layer 11 having heat fusibility on the surface of the metal foil layer 12 opposite to the surface in contact with the first resin layer 13. The third resin layer 11 is a layer provided for heat-fusing the unsealing detection sheet 10 and the storage sheet 31.

[0045] The metal foil layer 12 is a layer made of metal. Examples of the metal used for the metal foil layer 12 include aluminum and aluminum alloys. Here, the aluminum contains aluminum (Al) and inevitable impurities. The aluminum alloy is intended to be an aluminum alloy containing iron (Fe): 0.10 to 0.60 mass% (hereinafter, mass% is simply denoted as %), silicon (Si): 0.01 to 0.50%, and copper (Cu): 0.01 to 0.20% in addition to aluminum (Al) and inevitable impurities. For example, as the metal foil layer 12, a hard aluminum foil of Japanese Industrial Standard (JIS) 1N30 can be used. The surface of this aluminum foil may be a bright surface or a matte surface. Hereinafter, as an example, the case where an aluminum foil having one side as a bright surface and the other side as a matte (so-called dull) surface (third surface) is used will be described as an example. Note that the thickness of the metal foil (that is, the thickness of the metal foil layer 12) may be any thickness as long as it can realize the unsealing detection sheet 10 that can stably contain the contained object 33 and can be easily broken when the contained object 33 is taken out. For example, it may be 15 to 20 μm.

[0046] The first resin layer 13 is an insulating layer laminated on the metal foil layer 12. The first resin layer 13 can be formed by applying an insulating resin (first resin) to the metal foil layer 12. The dry weight per unit area of the first resin layer 13 is 1.48 g / m 2 above, 3.70 g / m 2 below is desirable. For example, the dry weight per unit area of the first resin layer 13 is 1.48 g / m 2If it is less than this value, the first resin layer 13 becomes thin, and there is a risk that the first resin layer 13 cannot maintain a sufficient thickness as an insulating layer when heat (for example, 140 °C) and pressure (for example, 0.25 MPa) for thermally fusing the unsealing detection sheet 10 and the housing sheet 31 are applied. On the other hand, if the dry weight per unit area of the first resin layer 13 is increased to more than 3.70 g / m 2 to increase the thickness of the first resin layer, although the insulation performance is improved, making it thicker than necessary increases the amount of resin used, resulting in a cost increase. In the process of applying the insulating resin, up to 3.70 g / m 2 or less, it can be applied in two steps. Therefore, in order to make the dry weight per unit area of the first resin layer 13 larger than 3.7 g / m 2 and apply a thicker coating, it is necessary to repeat the process of applying the insulating resin, for example, three or more times. As a result, the number of steps for manufacturing the unsealing detection sheet 10 increases.

[0047] As the resin having insulating properties used for the first resin layer 13, resins mainly composed of vinyl chloride, vinyl acetate, etc. can be used. One surface (the first surface) of the first resin layer 13 is in contact with the bright surface of the metal foil layer 12. Note that a circuit pattern 14 is printed on the surface (the second surface) opposite to the first resin layer 13 using a conductive ink containing a conductive substance.

[0048] The circuit pattern 14 is formed by applying an ink containing a conductive substance to the first resin layer 13. The conductive ink used for forming the circuit pattern 14 is an ink containing a pigment, a resin, a conductive substance, a solvent, etc. As the pigment, although not limited thereto, for example, it may contain carbon particles (so-called carbon black). In this case, the circuit pattern 14 is shown as a black line printed on the unsealing detection sheet 10.

[0049] The conductive ink may contain carbon nanotubes as a conductive substance. It is known that the conductivity of the conductive ink is improved by adding and dispersing carbon nanotubes. By adjusting the concentration, coating amount of the conductive ink used to form the circuit pattern 14, and the addition amount of carbon nanotubes, etc., it is possible to adjust the conductivity of the circuit pattern 14.

[0050] The second resin layer 15 is laminated so as to cover at least a part of the circuit pattern 14. In other words, the second resin layer 15 is laminated on at least a part of the surface (second surface) opposite to the surface where the first resin layer 13 and the metal foil layer 12 are in contact. As a result, the first resin layer 13 has a first region having the circuit pattern 14 covered by the second resin layer 15 and a second region having the circuit pattern 14 not covered by the second resin layer 15. The second resin layer 15 is formed by applying a resin (second resin) so as to cover at least a part of the circuit pattern 14.

[0051] The second resin layer 15 may be, for example, a resin layer mainly composed of an epoxy resin. The dry weight per unit area of the second resin layer 15 is preferably 0.8 g / m 2 or more and 2.0 g / m 2 or less, and more preferably 1.0 g / m 2 or more and 1.8 g / m 2 or less. When the dry weight per unit area of the second resin layer 15 is less than 0.8 g / m 2 , the second resin layer 15 becomes thin, and for example, sufficient heat resistance to withstand heat when heat-sealing the unsealing detection sheet 10 to the packaging material 100 described later cannot be obtained. If sufficient heat resistance cannot be obtained, there is a risk that the conductive ink may flow outside the circuit pattern 14. On the other hand, when the dry weight per unit area of the second resin layer 15 is 2.0 g / m 2When it exceeds this value, the second resin layer 15 becomes thick, and the thermal conductivity of the heat applied for processing or molding the unsealing detection sheet 10 deteriorates. Making the second resin layer 15 thicker than necessary increases the cost because the amount of resin used increases. Also, if the thermal conductivity deteriorates, the energy required for processing and molding the unsealing detection sheet 10 also increases.

[0052] In addition to the above, the unsealing detection sheet 10 shown in FIG. 1 includes a third resin layer 11 laminated on the third surface of the metal foil layer 12 opposite to the first surface. The third resin layer 11 is a layer provided for thermally fusing the unsealing detection sheet 10 to other members (for example, the housing sheet 31) for use.

[0053] The third resin layer 11 can be formed by applying a resin having heat fusion properties to the metal foil layer 12. The conditions for thermally fusing the unsealing detection sheet 10 to the packaging material 100 are appropriately changed according to the resin used for the third resin layer 11, but typically, a temperature of 140°C and a pressure of 0.25 MPa may be used.

[0054] In addition, the unsealing detection sheet 10 may be adhered to other members by other methods (for example, glue, etc.). Since the unsealing detection sheet 10 can be suitably used in any scene where an unsealing detection function is desired to be introduced, it may be applied without being adhered to a member.

[0055] (Packaging material 100) Subsequently, the packaging material 100 will be described. As shown in FIG. 1, the packaging material 100 includes the unsealing detection sheet 10 and has a housing portion 32 for housing the contents 33. The packaging material 100 is configured such that when the unsealing detection sheet 10 is broken, the contents 33 are taken out from the housing portion 32.

[0056] In the accommodating portion 32 that accommodates the contents 33, the unsealing detection sheet 10 is arranged so as to seal the openings of the respective recesses of the accommodating sheet 31. The packaging material 100 having such a configuration has a function of detecting that the contents 33 have been taken out. Here, as the accommodating sheet 31, a polyvinyl chloride (PVC) film can be applied.

[0057] Note that, although FIG. 1 illustrates the packaging material 100 to which the accommodating sheet 31 is applied, it is not limited thereto. For example, a packaging material in which the accommodating portion 32 is configured to surround the contents 33 by a plate-shaped or sheet-shaped member and the unsealing detection sheet 10 may be used. Alternatively, a packaging material in which the accommodating portion 32 is formed only by the unsealing detection sheet 10 may be used. That is, the accommodating sheet 31 is not an essential component of the packaging material 100.

[0058] <Detection target area 5> Next, the detection target area 5 that is the target for which unsealing is detected by the unsealing detection sheet 10 will be described with reference to FIG. 2. FIG. 2 is a diagram showing an example of the appearance when the packaging material 100 is viewed from the side where the first resin layer 13 and the second resin layer 15 are provided.

[0059] A detection target area 5 is set in the unsealing detection sheet 10, and the circuit pattern 14 is arranged so that the circuit pattern 14 is broken when the unsealing detection sheet 10 is broken in the detection target area 5. FIG. 2 is a diagram showing a packaging material 100 having four detection target areas 5a to 5d. The packaging material 100 shown in FIG. 2 can package, for example, tablets to be taken one tablet per day for four days.

[0060] As shown in FIG. 1, in the packaging material 100, the circuit pattern 14 of the unsealing detection sheet 10 is independent for each accommodating portion 32 that accommodates the contents 33. That is, it is independent for each detection target area 5 and is not electrically connected to each other. For example, when the unsealing detection sheet 10 is broken in the detection target area 5a of the packaging material 100 shown in FIG. 2, the circuit pattern 14 arranged in the detection target area 5a is broken, but the circuit patterns 14 arranged in the other detection target areas 5b to 5d are not broken.

[0061] When the unsealing detection sheet 10 is torn in a detection target area 5, a change occurs in the electrical signal of the circuit pattern 14. For example, when a predetermined voltage is applied to the circuit pattern 14 arranged in each detection target area 5, a change in the current value is detected in the broken circuit pattern 14. By connecting the packaging material 100 having such a configuration to the unsealing detection device 20 described later, an unsealing detection function for detecting whether the unsealing detection sheet 10 in the detection target area 5 is torn can be realized.

[0062] Note that the number of detection target areas 5 provided in the packaging material 100 can be appropriately changed according to the number of tablets taken by the user, and is not limited to four. For example, if the packaging material 100 (not shown) has seven detection target areas 5, it is possible to package tablets taken one per day for one week.

[0063] <Connection portion 16> As shown in FIG. 2, the circuit pattern 14 of the unsealing detection sheet 10 applied to the packaging material 100 is provided with a connection portion 16 that is not covered by the second resin layer 15. The terminal portions 29 of the unsealing detection devices 20 and 20a described later and the unsealing detection sheet 10 of the packaging material 100 are connected in contact with each other at the connection portion 16 so as to be electrically conductive. Note that the position where the connection portion 16 is provided can be appropriately changed according to the shape and position of the terminal portions 29 of the unsealing detection devices 20 and 20a.

[0064] (Manufacturing method of the unsealing detection sheet 10) Subsequently, a manufacturing method of the unsealing detection sheet 10 including the metal foil layer 12, the first resin layer 13, the circuit pattern 14, and the second resin layer 15 will be described with reference to FIG. 3. FIG. 3 is a flowchart showing an example of the manufacturing method of the unsealing detection sheet 10.

[0065] First, an insulating resin is applied to the entire surface of one side of the aluminum foil or aluminum alloy foil used for the metal foil layer 12 to form the first resin layer 13 (step S1: first resin coating step). For step S1, methods such as gravure printing can be applied.

[0066] Next, a circuit pattern 14 is printed using conductive ink on the first resin layer 13 formed in step S1 (step S2: circuit pattern printing step). Gravure printing can also be applied to the method of printing the circuit pattern 14.

[0067] Next, a second resin is applied so as to cover at least a part of the circuit pattern 14 printed in step S2 to form a second resin layer 15 (step S3: second resin application step). Methods such as gravure printing can also be applied to step S3.

[0068] In addition, when a third resin layer 11 is further provided on the unsealing detection sheet 10, methods such as gravure printing can also be applied in the same manner as steps S1 to S3 (third resin application step).

[0069] Here, gravure printing is a type of intaglio printing used for printing on metal foils, films, etc. For example, the application of the resin in steps S1 and S3 is mainly performed through the processes shown in the following (1) to (5).

[0070] (1) A part of the gravure printing cylinder provided with recesses on the printing surface is immersed in a resin reservoir for applying to the metal foil used as the metal foil layer 12 to fill the recesses on the printing surface with resin. By adjusting the depth of the recesses provided on the printing surface of the gravure printing cylinder, the thickness and dry weight of the applied resin can be adjusted.

[0071] (2) While rotating the gravure printing cylinder, it is pulled up from the resin reservoir.

[0072] (3) The resin adhering to the parts other than the recesses on the printing surface of the gravure printing cylinder is removed by a doctor blade.

[0073] (4) The metal foil is passed between a pressure roller and the gravure printing cylinder to transfer the resin in the recesses on the printing surface of the gravure printing cylinder to the metal foil.

[0074] After drying, proceed to the next step.

[0075] In step S2, conductive ink may be used instead of the resin. That is, each resin layer included in the unsealing detection sheet 10 and the circuit pattern 14 can all be formed using the same equipment (for example, gravure printing equipment).

[0076] As described above, in the manufacturing method of the unsealing detection sheet 10 according to the present invention, the circuit pattern 14 is also formed by the same method as the formation of the first resin layer 13 and the second resin layer 15. The unsealing detection sheet 10 manufactured by such a method can keep the manufacturing cost lower compared with the conventional one manufactured using etching or the like. By applying the unsealing detection sheet 10, a packaging material or the like having a cheaper unsealing detection function can be realized.

[0077] 〔Embodiment 2〕 Regarding the unsealing detection device 20 that detects that the storage part 32 for storing the stored item 33 has been unsealed in the packaging material 100 to which the unsealing detection sheet 10 of the present invention is applied, it will be described with reference to FIGS. 4 to 6. For the sake of convenience of explanation, members having the same functions as the members described in the above embodiment are denoted by the same reference numerals, and the description thereof will not be repeated.

[0078] (Appearance of the unsealing detection device 20) FIG. 4(a) is an external view showing a state in which the packaging material 100 shown in FIG. 2 is attached to the unsealing detection device 20. FIG. 4(b) is a view showing the appearance when the unsealing detection device 20 is viewed from the side where the terminal part 29 is provided.

[0079] As shown in FIG. 4, the terminal part 29 of the unsealing detection device 20 and the unsealing detection sheet 10 of the packaging material 100 are in contact with each other at the connection part 16 shown in FIG. 2 and are connected so as to be electrically conductive.

[0080] (Configuration of the unsealing detection device 20) Next, the configuration of the unsealing detection device 20 will be described with reference to FIG. 5. FIG. 5 is a block diagram showing a configuration example of the unsealing detection device 20.

[0081] The unsealing detection device 20 includes a terminal unit 29, a power supply unit 21, an unsealing detection processing unit 22a, a storage unit 23, a display control unit 24, and a display unit 25.

[0082] The terminal unit 29 is a terminal for contacting a connection portion 16 of a circuit pattern 14 printed on the unsealing detection sheet 10 of the packaging material 100 and electrically connecting the unsealing detection device 20 and the circuit pattern 14 of the packaging material 100.

[0083] The power supply unit 21 is a battery, a cell, etc., and supplies the power required to execute each function of the unsealing detection device 20 to each part of the unsealing detection device 20. Also, a part of the power supplied from the power supply unit 21 is used as the voltage applied by the unsealing detection processing unit 22a to the circuit pattern 14 of the unsealing detection sheet 10 connected to the terminal unit 29.

[0084] The unsealing detection processing unit 22a detects a break in the circuit pattern 14 based on a change in the electrical signal generated in the circuit pattern 14. More specifically, the unsealing detection processing unit 22a applies a predetermined voltage to the circuit pattern 14 arranged in each detection target area 5 of the packaging material 100 connected to the terminal unit 29, and measures the current value detected at that time. The unsealing detection processing unit 22a detects a break in each individual circuit pattern 14 arranged in the detection target area 5 based on whether the measured current value is equal to or greater than a preset current value.

[0085] Also, the unsealing detection processing unit 22a collects information such as which storage unit 32 of the packaging material 100 has been unsealed and the date and time when each storage unit 32 was first detected as being unsealed, for each storage unit 32. Note that the information collected by the unsealing detection processing unit 22a may be held in the storage unit 23 until the unsealing detection sheet 10 connected to the unsealing detection device 20 is replaced.

[0086] Furthermore, the unsealing detection processing unit 22a reads the unsealing detection application 231 from the storage unit 23, and generates a screen or the like to be displayed on the display unit 25 based on the collected information. Here, the unsealing detection application 231 is an application program for the unsealing detection processing unit 22a to execute a process for generating display content for notifying the user of the unsealing status of each storage unit 32.

[0087] The display control unit 24 controls the display unit 25 so that the display content generated by the unsealing detection processing unit 22a is displayed on the display unit 25. Note that the display control unit 24 may be configured to read information collected in the past by the unsealing detection processing unit 22a from the storage unit 23 and display it on the display unit 25.

[0088] The display unit 25 may be a thin flat panel display such as an LCD (Liquid Crystal Display), a PDP (Plasma Display Panel), or an organic EL (Organic LED) that displays a string indicated by an image or text data. Further, a touch panel (not shown) may be superimposed on the display unit 25, and the configuration may be such that the position where a touch operation by the user is performed and the type of gesture are detected.

[0089] Here, the configuration in which the unsealing detection device 20 includes the display unit 25 is described as an example, but it is not limited thereto. For example, the configuration may be such that the display content is transmitted to a display device (not shown) such as an external display having a larger screen and is displayed on the display. Thereby, since the unsealing status of the storage unit 32 (see FIG. 1) can be largely displayed, the convenience for the user is improved.

[0090] According to the above configuration, the unsealing detection device 20 detects the breakage of the circuit pattern 14 based on the change in the electrical signal generated in the circuit pattern 14, and detects that the storage portion 32 of the packaging material 100 has been unsealed. Further, when it is detected by the unsealing detection processing unit 22a that the circuit pattern 14 has been broken, the unsealing detection device 20 outputs, for each storage portion 32, information indicating that the detection target area 5 (corresponding to the storage portion 32) where the broken circuit pattern 14 is disposed has been unsealed.

[0091] (Output example of detection result) FIG. 6 is a diagram showing an example of the unsealing status displayed on the unsealing detection device 20. In FIG. 6, the packaging material 100 shown in FIG. 2 is connected to the unsealing detection device 20. Note that in FIG. 6, an example is shown in which the unsealing detection results in a state where the unsealing detection sheets 10 disposed in the detection target areas 5a to 5c (each corresponding to the storage portion 32) of the packaging material 100 are torn and the circuit patterns 14 of the detection target areas 5a to 5c are broken are displayed.

[0092] As shown in FIG. 6, on the display unit 25 of the unsealing detection device 20, information indicating the unsealing status for each storage portion 32 and information indicating when the unsealing was detected are displayed. "Unsealed" and "Sealed" in the figure are information indicating the unsealing status. Also, in the figure, "2018 / 03 / 20", "(the day before yesterday)", "7:04 am", etc. are information indicating when the unsealing occurred.

[0093] Note that the output of the unsealing status is not limited to displaying content including a character string on the display unit 25. For example, a configuration may be adopted in which light of different colors is lit for the unsealed and sealed states, or a configuration may be adopted in which a voice indicating the storage portion 32 to be unsealed is output from a speaker or the like.

[0094] By displaying such information, the opening detection device 20 can allow the user to appropriately confirm the opening status of each storage unit 32. By using the opening detection device 20 and the packaging material 100, for example, the user can appropriately prevent forgetting to take medicine that should be taken at a fixed timing every day or taking medicine that should be taken at a predetermined interval at an inappropriate short interval.

[0095] 〔Embodiment 3〕 In the packaging material 100 to which the opening detection sheet 10 of the present invention is applied, an opening detection device 20a having a function of detecting that the storage unit 32 has been opened and transmitting the detection result to an external device 50 will be described with reference to FIGS. 7 and 8. For the sake of convenience of explanation, members having the same functions as those described in the above embodiment are denoted by the same reference numerals, and the description thereof will not be repeated.

[0096] (Configuration of the opening detection device 20a) FIG. 7 is a block diagram showing a configuration example of the opening detection device 20a. Note that FIG. 7 also shows a main configuration of an external device 50 communicably connected to the opening detection device 20a. The opening detection device 20a further includes a communication unit 27 that transmits a detection result (for example, information indicating the opening status of the storage unit 32 corresponding to the detection target area 5) by the opening detection processing unit 22 to the external device 50. The external device 50 includes a control unit 51 that causes the display unit 54 to display information indicating that the storage unit 32 corresponding to the detection target area 5 where the circuit pattern 14 is arranged has been opened. Note that the opening detection device 20a shown in FIG. 7 does not include a display unit 25 or the like, but is not limited thereto, and may have a configuration including a display unit 25 similar to the opening detection device 20 shown in FIG. 5.

[0097] (Configuration of the external device 50) The external device 50 is an electronic device including a display unit 54 that displays information indicating that the storage unit 32 has been unsealed. Examples of the external device 50 include a smartphone, a mobile phone, a tablet terminal, etc. As shown in FIG. 7, the external device 50 includes a communication unit 52, a control unit 51, a display unit 54, and a storage unit 53. The external device 50 performs data transmission and reception with the unsealing detection device 20a via the communication unit 52. Note that the unsealing detection device 20a and the external device 50 may be connected by wire or wirelessly. In the case of wireless connection, for example, Bluetooth (registered trademark) can be used.

[0098] The control unit 51 is a CPU. The control unit 51 reads out the unsealing detection application 531 from the storage unit 53 and generates a screen or the like to be displayed on the display unit 54 based on the information received from the unsealing detection device 20a. Here, the unsealing detection application 531 is an application program for the control unit 51 to execute processing for generating a display for notifying the user of the unsealing status of each storage unit 32.

[0099] The display unit 54 may be a thin-film flat panel display (Flat Panel Display) such as an LCD (Liquid Crystal Display), a PDP (Plasma Display Panel), or an organic EL (Organic LED) that displays a string indicated by image or text data. Further, a touch panel (not shown) may be superimposed on the display unit 54, and a configuration for detecting the position where a touch operation is performed by the user, the type of gesture, etc. may be provided.

[0100] (Output example of detection result) FIG. 8 is a diagram showing an example of a case where an external device 50 that has received a detection result from an unsealing detection device 20a connected to a packaging material 100 to which the unsealing detection sheet 10 shown in FIG. 2 is applied displays the unsealing status. In FIG. 8, similar to FIG. 6, an example is shown in which the unsealing detection sheets 10 arranged in the detection target areas 5a to 5c (each corresponding to the storage unit 32) of the packaging material 100 are torn, and the circuit patterns 14 in the detection target areas 5a to 5c are broken, and the unsealing detection results are displayed.

[0101] The control unit 51 acquires, via the communication unit 52, information such as which storage unit 32 of the packaging material 100 has been unsealed and the date and time when each storage unit 32 was unsealed from the unsealing detection device 20a. Then, the control unit 51 causes the display unit 54 of the external device 50 to display information indicating the unsealing status (that is, whether it has been "unsealed" or "not unsealed") for each storage unit 32, and information indicating when the unsealing was detected.

[0102] According to this configuration, since the unsealing detection device 20a transmits information indicating the unsealing status to the external device 50 and causes the external device 50 to display it, the unsealing detection device 20a only needs to have the minimum necessary functions. Therefore, the cost for manufacturing the unsealing detection device 20a can be kept low.

[0103] 〔Example of Realization by Software〕 The control blocks of the unsealing detection devices 20 and 20a (particularly the unsealing detection processing units 22a and 22), and the control unit 51 of the external device 50 may be realized by a logic circuit (hardware) formed in an integrated circuit (IC chip) or the like, or may be realized by software.

[0104] In the latter case, the unsealing detection devices 20, 20a, and the external device 50 include a computer that executes instructions of a program which is software for realizing each function. This computer includes, for example, one or more processors and a computer-readable recording medium storing the above program. Then, in the above computer, when the above processor reads and executes the above program from the above recording medium, the object of the present invention is achieved. As the above processor, for example, a CPU (Central Processing Unit) can be used. As the above recording medium, "non-transitory tangible media" such as, for example, a ROM (Read Only Memory), a tape, a disk, a card, a semiconductor memory, a programmable logic circuit, etc. can be used. Further, it may further include a RAM (Random Access Memory) for expanding the above program. Further, the above program may be supplied to the above computer via any transmission medium (communication network, broadcast wave, etc.) capable of transmitting the program. Note that one aspect of the present invention can also be realized in the form of a data signal embedded in a carrier wave, in which the above program is embodied by electronic transmission.

[0105] The present invention is not limited to the above-described embodiments, and various modifications are possible within the scope shown in the claims. Embodiments obtained by appropriately combining the technical means disclosed in different embodiments are also included in the technical scope of the present invention.

Example

[0106] An example embodiment of the present invention will be described below.

[0107] Unsealing detection sheets 10 with different dry weights per unit area of the first resin layer 13 were created, and the amount of insulating resin necessary for the first resin layer 13 to function as an insulating layer was examined. Table 1 shows the results of evaluating the insulation performance of the unsealing detection sheets 10 with different dry weights per unit area of the first resin layer 13.

[0108] For the metal foil layer 12, aluminum foil was used. The third resin layer 11 was formed on the matte surface side of the aluminum foil, and the first resin layer 13 was formed on the bright surface side of the aluminum foil. For the formation of the first resin layer 13, No. 8800NL manufactured by Tanaka Chemical was used.

[0109] Also, for the created unsealing detection sheet 10, using an M2 machine manufactured by CKD, a temperature of 140°C and a pressure of 0.25 MPa were applied to thermally fuse the unsealing detection sheet 10 and the housing sheet 31. This thermal fusion process is referred to as heat sealing, and the temperature and pressure applied in the heat sealing process were assumed.

[0110] Regarding the insulation determination of the first resin layer 13, if the resistance value of the unsealing detection sheet 10 measured by a tester (maximum measurement resistance value 40 MΩ) (measuring points 10 mm apart on the first resin layer) is greater than the maximum measurement resistance value, it is considered OK, and if the resistance value is less than the maximum measurement resistance value, it is considered NG. The insulation performance determination was performed before and after heat sealing.

[0111]

Table 1

[0112] According to the results shown in Table 1, the dry weight per unit area of the first resin layer 13 is 1.48 g / m 2 If it is above this, it functioned as an insulating layer even after the heat sealing process.

[0113] When the process of applying an insulating resin to form the first resin layer 13 is performed by a device, the amount of resin that can be applied in one process depends on the device used. Therefore, in order to thickly apply an insulating resin using a device, it is necessary to use a device with a large amount of resin that can be applied in one process, or to apply (overcoat) it in multiple processes. The dry weight per unit area of the first resin layer 13 is 3.70 g / m 2In order to make it larger, it may be necessary to perform the process of applying an insulating resin three or more times. Therefore, the dry weight per unit area of the first resin layer 13 is preferably 3.70 g / m 2 or less.

Explanation of Symbols

[0114] 5 Detection target area 10 Opening detection sheet 11 Third resin layer 12 Metal foil layer 13 First resin layer 14 Circuit pattern 15 Second resin layer 16 Connection part 20, 20a Opening detection device 22, 22a Opening detection processing unit 25 Display unit 29 Terminal part 31 Storage sheet 32 Storage part 33 Stored item 50 External device 51 Control unit 54 Display unit 100 Packaging material S1 First resin coating process S2 Circuit pattern printing process S3 Second resin coating process

Claims

1. A metal foil layer made of a metal containing aluminum, A first resin layer having insulating properties, A circuit pattern printed using ink containing a conductive substance, A second resin layer covering at least a part of the circuit pattern, are laminated in this order, The first resin layer is formed by applying an insulating first resin to the metal foil layer, Further provided with a third resin layer having heat fusibility, laminated on the surface of the metal foil layer opposite to the first resin layer, The dry weight per unit area of the first resin layer is 1.48 g / m ２ or more and 3.70 g / m ２ or less, and The first resin is a resin mainly composed of at least one of vinyl chloride and vinyl acetate, An unsealing detection sheet characterized by this.

2. A detection target area is set in the unsealing detection sheet, The circuit pattern is arranged so that the circuit pattern breaks when the unsealing detection sheet is broken in the detection target area The unsealing detection sheet according to claim 1, characterized by this.

3. The circuit pattern has a connection part in a part not covered by the second resin layer, A voltage is applied to the circuit pattern through the connection part The unsealing detection sheet according to claim 1 or 2, characterized by this.

4. The ink contains carbon nanotubes as the conductive substance The unsealing detection sheet according to any one of claims 1 to 3, characterized by this.

5. The second resin layer is formed by applying resin to the first resin layer The unsealing detection sheet according to any one of claims 1 to 4, characterized by this.

6. A packaging material including the unsealing detection sheet according to any one of claims 1 to 5 and having a storage part for storing the contents, When the unsealing detection sheet is broken, the contents are taken out from the storage part A packaging material characterized by this.

7. The packaging material has one or more recesses constituting the storage part, and the opening of each recess is sealed by the unsealing detection sheet The packaging material according to claim 6, characterized by this.

8. The circuit patterns of the unsealing detection sheet are independent for each storage part and are not electrically connected to each other The packaging material according to claim 6 or 7, characterized by this.

9. A first resin coating step of forming a first resin layer by applying an insulating first resin to a metal foil layer made of a metal containing aluminum, A circuit pattern printing step of printing a circuit pattern using ink containing a conductive substance on the first resin layer, A second resin coating step of applying a second resin so as to cover at least a part of the circuit pattern to form a second resin layer; Further including a step of laminating a third resin layer having heat fusibility on a surface of the metal foil layer opposite to the first resin layer; The dry weight per unit area of the first resin layer is 1.48 g / m ２ or more and 3.70 g / m ２ or less, and The first resin is a resin mainly composed of at least one of vinyl chloride and vinyl acetate. A method for manufacturing an unsealing detection sheet, characterized by the above.

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